Chng 5 : NHA EPOXY

5.1 Tong quan: 5.2 Cac loai nha Epoxy thong dung. 5.3 Cac he tao mang Epoxy: + He 2 thanh phan - ong ran T0 thng. + He 1 thanh phan - ong ran T0 thng. + He 1 thanh phan - ong ran T0 cao. + He tao mang dang bot (powder coating) + He nhu tng. 5.3.1 He 2 phan - ong ran T0 thng. +Cau tao. + Loai Epoxy hay dung. + Cac loai ong ran :

Nha epoxy c th c nh ngha l bt k h thng polymer, trong cc oxirane hoc vng epoxide tham gia trong tng hp Binder, hoc hay lnh vc bin i (ng rn).

Epoxy resins tr thnh loi thng mi c sn c t nm 1950s, v t thi im c s dng trong nhiu ngnh cng nghip. Trong thc t, phn ln cc epoxies (khong 85 % vo cui nm 1970) c da trn nhng sn phm condensation ca bisphenol A (diphenylol propan) v epichlorohydrin, v c sn trong mt lot cc trng lng phn t khc nhau. Resins trng lng phn t thp l cht lng; cao l rn.
Trong ngnh cng nghip nha, epoxy resins c phn loi nh thermosetting resins, v chng c s dng trong ngnh cng nghip sn nh cht to mng c kh nng bin i. Epoxy resins c chuyn thnh trng thi thermoset bng phn ng ha hc gia cc resin v cht ng rn (curing agent). Ty thuc vo cht ng rn phn ng c th din ra nhit cao hoc nhit phng. Resins ng rn khng tan trong solvents v khng th chy khi gia nhit.

5.2 Cac loai nha Epoxy thong dung BISPHENOL A EPOXY RESINS

Synthesis of low molecular weight bisphenol A epoxy resins by the "Taffy" process

Synthesis of medium and high molecular weight bisphenol A epoxy resins by the "fusion" process

Cc tnh cht chnh ca epoxy resin da trn s la chn ca epoxy resins t mt lot cc cht do v resins sn c hin nay? Cc tnh cht quan trng c lit k di y. Cu trc ha hc ca epoxy resins cho chng c tnh khng ha cht cao chng li mt s iu kin n mn. tnh cht ny c c t tnh cht vng thm ca cc backbone v bn ha hc tt ca cc lin kt ether phenolic. Epoxy resins c tnh bm dnh tt cho mt lot cc nguyn vt liu, bao gm cc kim loi, g, b tng, thu tinh, gm v nhiu cht do. iu ny l do s hin din ca polar hydroxyl v nhm ether trong resin.

co rt thp trong qu trnh ng rn cho kt qu tt trong tnh chnh xc kch thc trong kt cu sn phm v cho php sn xut keo dn tnh nng cao.
Tnh cht c l tt nh toughness, mm do v khng mi mn c th c c. Mc d c s hn ch v nhit s dng, epoxy resins thng tt hn so vi hu ht cc nha nhit do nhit cao.

5.2 Cac loai nha Epoxy thong dung

BISPHENOL A EPOXY RESINS

Molecular Weight Epoxy Hydroxyl Equivalent Equivalent Weight1 Weight 2 Hydroxyl Functionality3 Melting Viscosity cps Point (C) (25 C) Shell Epon Commercial Resin Ciba Dow Geigy Reichhol d D.E.R. Araldite Epotuf

Resin Type

Usage

Standard liquid

<1

380

185-192

85

Type 2 resin Type 4 resin Type 7 resin

900

450-525

130

3.7

1,400

905-985

175

7+

8.8

2,900

1,6001,900

190

13

Type 9 resin

12

3.800+

2,4004,000

200

17+

High solids, ambient-cured 8-12 11-14 two-pack systems Conventional solids, ambient64-76 0.8-1.74 cured two-pack systems Epoxy ester resin 4 95-105 4.3-6.3 intermediate; powder coatings Epoxy/phenolic and epoxy/ 125-132 17.5-274 amino baking systems Epoxy/phenolic and epoxy/ 140-155 36.2-98.54 amino baking systems

828

331

6010 37-140

1001

661

7071

37-01

1004

664

6084

37-04

1007

667

7091 27-006

1009

668

7099 37-007

1 2

Grams of resin containing 1 equivalent of epoxy Grams of resin to esterify 1 mole of monobasic acid 3 Figure includes hydroxyl functionality from hydroxyl groups formed from oxirane ring opening. 4 Forty percent solution in diethylene glycol rrcr.obutyl ether

Epoxy Hydroxyl Molecular Equivalent Equivalent 1 Weight Weight Weight 2

Commercial Resin Ciba Epoxy Hydroxyl Hydroxyl Melting Molecular cps Viscosity Equivalent Equivalent Shell Dow Melting Reichho cps Geigy Viscosity Hydroxyl 3 Functionality Point (C) (25 C) Weight1 Usage 2 ld Epon D.E.R. Point (C) Epotuf Resin Type n Weight Weight Functionality3 Araldit (25 C) e High solids,

Usage

Shell Epon

380

185-192

85

Standard 8-12 2 <1 liquid

900

450-525

130

Type 2 6 resin

1,400

905-985

175

Type 7+ 4 resin

2,900

1,6001,900

190

Type 13 7 resin

3.800+

2,4004,000

200

Type 9 17+ resin

ambient-cured 11-14 185-192 380 two-pack 85 systems Conventional 4 solids, ambient64-76 900 0.8-1.7450-525 2 130 cured two-pack systems Epoxy ester resin 95-105 1,400 4 intermediate; 4.3-6.3905-985 3.7 175 powder coatings Epoxy/phenoli 125c and 41,600- epoxy/ 17.5-27 8.8 2,900 190 132 amino 1,900 baking systems Epoxy/phenoli 140c and 2,400- epoxy/ 12 3.800+ 200 36.2-98.54 4,000 baking 155 amino systems

828 2 331

1,001 6 661

1,004 7+664

1007 13667

1009 17+ 668

High solids, ambient-cured two-pack systems Conventional 7,071 37-01 4 solids, ambient64-76 0.8-1.7 cured two-pack systems Epoxy ester resin 6,084 4.3-6.3 95-105 37-04 4 intermediate; powder coatings Epoxy/phenoli 1254 c and epoxy/ 7,09/ 27-006 17.5-27 132 amino baking systems Epoxy/phenoli 140c and epoxy/ 36.2-98.54 7,099 37-007 155 amino baking systems

6010 8-12

3711-14 140

828

1,001

1,004

1,007

1,009

Epoxy novolac resins

High functionality epoxy phenolic novolac and epoxy cresol novolac resins

Flexibilizing epoxy resins ( polyglycol epoxy resin)

Cardanolbased epoxy resin

Typical structure of a brominated epoxy resin

5.3 Cac he tao mang Epoxy: + He 2 thanh phan - ong ran T0 thng. + He 1 thanh phan - ong ran T0 thng. + He 1 thanh phan - ong ran T0 cao. + He tao mang dang bot (powder coating)

+ He nhu tng.

Lnh vc cht to mng tiu th 45-50 % epoxy resin c sn xut trn ton th gii. Epoxy resins phn ng c vi mt s loi ng rn khc nhau v sinh ra nhiu loi sn phm khc nhau vi cc yu cu ng rn khc nhau v hiu qu s dng sau cng. H cht to mng ny c th c phn loi nh sau: (a) Cht to mng hai thnh phn ng rn nhit phng; (b) epoxy esters acid bo c s dng nh cht to mng mt thnh phn ng rn nhit phng hoc c lp lt hoc lp men ng rn nng; (c), H to mng ng rn nhit cao;

Nhm oxirane c kh nng phn ng vi hydrogens amine, thiols, nhm methylol, carboxylic acids, v c hai cyanate v isocyanate esters. V vy, n c th phn ng vi aliphatic v aromatic amines, amides, polysulfides v phenolics, amino resins, carboxylated acrylics v polyesters, anhydrides, isocyanates, v cyanate esters. Tt c cc phn ng ni trn l phn ng cng hp m trong nguyn liu khng b mt. Phn ng cn hp dn n co rt thp trn polymerization v, do tnh bm dnh c ti u ha. Ngoi nhng phn ng trn, cc nhm hydroxyl ca epoxy s phn ng vi methylols, carboxylic acids, v isocyanates. iu ny cung cp h to mng hu ch cho phn ng nhit cao vi h phenolics, aminoformaldehyde, v acrylics. Urethanes (ng rn nhit phng) c to ra vi cc isocyanates, v vi cyanate esters. Cc epoxy resins cng c th ng trng hp qua nhm oxirane trong s hin din ca xc tc mnh nh tertiary aliphatic v amines thm. Phn ng Etherification ny thng xy ra ng thi vi cc phn ng khc.

5.3 Cac he tao mang Epoxy

EPOXY REACTIONS WITH OTHER RESIN SPECIES

Resin Class Amines SubClassifications Aliphatic Cycloaliphatic Aromatic Reactive Group on Epoxy Resin Oxirane Oxirane Oxirane Reactive Group on Cross Linker Amine Amine Amine Reaction System Temperature Type Ambient Ambient High (unless modified) Ambient High
Two-pack liquid Two-pack liquid One-pack liquid or powder bake (twopack liquid when modified) Two-pack liquid i One-pack powder bake

Polyamide Dicyandiamide

Oxirane Amine/amide Oxirane/hydroxyl; Amine complex reactions, including homopolymerization Oxirane/hydroxyl Oxirane/hydroxyl Carboxyl Carboxyl

Anhydrides Fatty acids

Oils

High High

One-pack liquid or powder bake One-pack oxidizing (epoxy ester) One-pack liquid bake One-pack liquid bake One-pack liquid bake

Acrylics

Hydroxylated Carboxylated Methylolated acrylamide

Oxirane/hydroxyl Oxirane/hydroxyl Oxirane/hydroxyl

Hydroxyl Carboxyl Alkoxy

High High High

EPOXY REACTIONS WITH OTHER RESIN SPECIES

Resin Class Polyester SubClassifications Hydroxylated Carboxylated Reactive Group on Epoxy Resin Oxirane/hydroxyl Oxirane/hydroxyl Reactive Group on Cross Linker Hydroxyl Carboxyl Reaction System Temperature Type High High ambient" Ambient High Ambient High
One-pack liquid bake One-pack liquid or powder boke; two-pack liquid Two-pack liquid Two-pack liquid Two-pack liquid One-pack liquid One-pack liquid

Polyisocyanates Cyanate esters Polymercaptan Amino resins -

Oxirane/hydroxyl Oxirane Oxirane Oxirane/hydroxyl

Isocyanate Cyanate Sulfurhydril Methylol/aikoxy/ amine Methylol/alkoxyl

Oxirane/hydroxyl High Phenolformaldehde resins Oxirane/hydroxyl Oxirane/hydroxyl Ambient Homopolymeriz ation (etherifkation) *Oxirane-modified oil/carboxylic acid-terminated polyester system

Two-pack liquid

5.3.1 He 2 phan - ong ran T0 thng AMINE CURING AGENTS FOR EPOXIES - GENERALIZED TYPE AND EFFECT ON FILM PROPERTIES Tolerance
Curing Agent Classification Sub-Classification Cross Link Cure Density* Rate* Pot Life at Room Temp.* Viscosity (cps) for Wet/Low Equivalent Temperature Application Weight

Aliphatic amines

Polyalkylene amine Polyoxyalkylene Amines Mannich bases

High Low

Very fast Very short 5-10 Slow Long 10-250

20-40 60-500

Fair/Fair Fair/Poor Good/Very good Good/Good Very good/ Fair Very good/ Poor Poor/Poor

Moderate Very fast Very short 100-1,500 50-150 Moderate Fast Low Short 50-500 80-1 15

Cycloaliphatic . Modified amines Fatty acidPolyamides modified amines Amido-amines Aromatic amines Unmodified

Moderate Long / Slow Very long

4,000-Solid 100-200 500-1,000 50-100 2,000-Solid 30-50

Very low Slow High

Heat Indefinite required

Aliphatic amines

Basic reaction of amine curing agents with epoxy resin

n 0 1 2 3

Amine Ethylene diamine Diethylene triamine Triethylene tetramine Tetraethylene pentamine

Primary Amine Hydrogens 2 2 2 2

Secondary Amine Hydrogens 2 3 4 5

Total Amine Functionality 4 5 6 7

Functionality of alkylene amines

H ng rn Aliphatic Polyamine khng bin tnh. Nhng amines sm nht c s dng nh cht ng rn l Aliphatic Polyamine khng

bin tnh.
Phn ng xy ra nhanh chng v ta nhit cao. Nhng phn ng ny cho mng phim c mng lin kt rt cht ch v, do , khng ha cht cao. Tuy nhin, mm do th thp, v khng va p, bc tch thp. ng lng rt thp ca cc amines ny, lm cho t l s dng n/nha Epoxy thp iu ny lm do rt d b sai s trong thnh phn s lng dng. Chng c p sut hi cao, v ch tng thch c mt phn vi epoxy ban u,

v kh nng bay hi cao. N sn sng phn ng vi carbon dioxide ca khng kh

v m to thnh mt carbamate, t lm cho b mt b ni phn. Cc aliphatic amines cng nhy cm vi da v kch thch h hp ( c vi ngi). Chng cho mng mu sc tt hn v n nh hn vi cc h ng rn polyamide v amine thm.

Aliphatic Amine Adducts

Mt trong nhng hiu chnh ph bin nht l chun b amine adducts bng cch tin phn ng mi lng amine tha vi mt s loi epoxy resin. Nhng sn phm thuc loi ny t lu tr thnh thng mi c sn, Ngy nay n cn c nhng nh sn xut sn nh t tng hp ly.

Chng cho nhng amines c trng lng phn t cao vi p sut hi thp hn, t l pha trn tt hn, v xu hng tri phn t hn. Sau khi pha trn vi epoxy trong ng dng, h ng rn cui cng tng t nh trong cu trc c ng rn bng unmodified amine.

10

Amine adduct formation

Cycloaliphatic Amines Cc cycloaliphatics vn i hi nhit cao ng rn hon ton vi epoxies. Cc cycloaliphatic amines,ngc li vi aromatics, cho mng c mu rt nh (sng mu). Chng c tnh cht chung l khng ha cht tt hn so vi polyamides v nhit thy tinh ha cao hn (Tg).

Cycloaliphatic amines

11

Polyoxyalkylene Amines Khng ging nh cc alkylene amines, hu ht cc sn phm ny c trng lng phn t tng i cao (230-6000) Cc lin kt ether tng thm s mm do thng c s dng nh l cht hiu chnh mm do cho cc loi ng rn khc.

Polyoxyalkylene amines

Mannich base curing agents Mannich Bases Mannich Bases c gi tr nh cht ng rn cho h epoxy khng blush, ng rn nhit t 30 n 35oF (-1 n 20C). Cc h thng ny c th ng dng v ng rn iu kin lnh hay m. Mannich Bases cho tnh khng ha cht t tt n tuyt vi v bm dnh th tuyt vi. Khng ha cht ca n tt hn l so vi cc polyamides nhng khng tt nh cc amines thm. Chng c s dng trong h to mng hm lng rn cao t dung mi, bao gm cc h to mng p dng di nc, v b tng. Cc sn phm cho mng phim dn.

12

Polyamide curing agents

ng rn h Polyamide . Trong sn xut ng rn polyamide cho nha epoxies, dimers acid bo mch di i t du thc vt c phn ng vi mt multifunctional amines (DETA v TETA) to thnh cht ng rn h polyamide. Cu trc c th, trng lng phn t, v nhm chc s ty thuc vo thnh phn c s dng v mc polyme ha c tin hnh. Cc phn ng lin kt vi epoxy resins xy ra thng qua cc hydrogens bc 1 v bc 2 ca amine cui mch hn l thng qua cc hydrogens ca amide. Trng lng phn t ln hn nhiu so vi cc amine ban u, vi phn t ln lm cho khong cch gia cc terminal amines ln hn. Cu trc ny lm gim p sut hi ca cht ng rn, v lm sn phm t mi v an ton khi s dng hn.

13

cho mng phim mm do hn v khng va p hn mng phim c ng rn vi amines mch thng. Mc d tnh khng ho cht v dung mi b gim (c bit l khng vi dung mi mnh nh ketones, chlorinated hydrocarbons, v esters), tnh cht tng qut nhn chung vn cn rt cao. bm dnh tt hn nh cc mi lin kt amide, cung cp thm t tt hn, cng nh gim mt lin kt ca h to mng, cng lm cho tnh bc tch tt hn. Trng lng phn t cao hn nhiu, gip cho t l pha trn t b sai s (kh khn) hn so vi ng rn amines. Pot life, thng thng l 6 n 12 gi Mu sc ca cc amide-epoxies th khng tt nh l cc h thng epoxy amine Khng nhit cao khng tt nh cc amines thm. Tuy nhin, di 3000 F (1490 C), trong iu kin kh chu c thi gian di. Loi sn phm ny l loi ng rn ch lc cho epoxy coating trong vic bo v v cc trang tr ni tht v cc thit b trong nhiu ngnh cng nghip.

Table 15-6:

POLYAMIDE GRADES
phr* with 188 EEW Epoxy Resin phr with 520 EEW Epoxy Resin Relative Relative Corrosion Relative Percent Resistance Flexibility Solids

Henkel Reichold Versamid Epotuf

Amine Air Hydrogen Products Ciba Equivalent Amine Ancamide Hardener Weight Values

Viscosity Poise

Relative VOC

Standard 100 Grades 115 125 140 Solid Grade 253

37-600 37-615 37-625 37-640 37-650

100 220 26OA 350A 2050

HY815 HY825 HY840 HY283

535 185 120 100 150

85-95

90-110 45-65 35-60

Solid 3300 450 160-190

High

High

Low

High

220-245 60-100 330-370 45-70 370-400 35-60 210-235 70-100

45-55

30-65

Moderate Low

High

Low

* Phr is parts per 100 parts of epoxy resin having an epoxy equivalent weight of 188 or 520

14

15

Amido-Amines

Nu mt polyamine phn ng vi mt acid bo n chc thay v s dng mt dimer acid bo, sn phm ca phn ng trng ngng l mt amido-amine thay v mt polyamide. nht ca amido-amines thng dao ng t 200 n 600 cps, trong khi polyamides c nht 1600 cps hoc cao hn nhiu.
Cc tnh cht ca sn phm ng rn gn ging vi tnh cht ca polyamide hn l polyamine. Trong thc t, v h polyamide c mt lin kt cao hn h amido-amine,nn h polyamide chu nc v khng n mn tt hn h amidoamine. Tnh mm do, bm dnh, v bc tch ca h polyamide cng c tt hn so vi cc h amido-amine (cured epoxy). Cng ging nh cc polyamides, amido-amines c tnh thm t tuyt vi v (chim ch) thay th nc t b mt m t.

Tuy nhin, tnh nng hp dn nht ca amido-amines l ng lng vn cn kh cao. ng lng cao cho h epoxy/ng rn c nht thp, y l tnh nng mong mun cho h to mng c VOC thp. Cc amidoamines c s dng thng xuyn nht vi epoxy lng cho nhng h to mng 100% rn hoc hm lng rn rt cao.

Chng c dng cho h to mng : hng hi, ph trn btng, ph sn, v c bit cho trng hp m t .

16

Amido-amine curing agents

5.3.1 He 2 phan - ong ran T0 thng

Cross Curing Agent Link Cure Classification Sub-Classification Density* Rate*

AMINE CURING AGENTS FOR EPOXIES - GENERALIZED TYPE AND EFFECT ON FILM PROPERTIES Tolerance
Pot Life at Room Temp.* Viscosity (cps) for Wet/Low Equivalent Temperature Application Weight

Aliphatic amines

Polyalkylene amine High Polyoxyalkylene Amines Mannich bases Low

Very fast Very short 5-10 Slow Long 10-250

20-40 60-500

Fair/Fair Fair/Poor Good/Very good Good/Good Very good/ Fair Very good/ Poor Poor/Poor

Moderate Very fast Very short 100-1,500 50-150 Moderate Fast Low Short 50-500 80-1 15

Cycloaliphatic . Modified amines Fatty acidPolyamides modified amines Amido-amines Aromatic amines Unmodified

Moderate Long / Slow Very long

4,000-Solid 100-200 500-1,000 50-100 2,000-Solid 30-50

Very low Slow Hgh

Heat Indefinite required

17

Effect of Film Properties*

Curing Agent Classification Chemical Sub-Classification Resistance Polyalkylene amine Good Polyoxyalkylene Amines Mannich bases Solvent Resistance Water Resistance Heat Resistance Color and Aesthetics

Aliphatic amines

Very good Fair Very good Very good Fair/Good Poor Good

Good Fair/Good Very good Very good Excellent Excellent Very good

Good Fair Good Very good Fair Fair Excellent

Moderate Good Fair Good Poor Poor Very poor

Fair/Good Very good Very good Fair Fair Excellent

Cycloaliphatic amines Fatty acidmodified amines

Modified

Polyamides Amido-amines

Aromatic amines

Unmodified

Epoxy polymercaptan reaction

18

Epoxy resin as a polyol in the formation of urethanes with isocyanates

ng rn Isocyanate cho Epoxies C hai loi Isocyanates ca aliphatic v thm cng c th c s dng lm cht ng rn cho h epoxy hai thnh phn. Trong trng hp ny, epoxy c th c coi l polyether polyol bin tnh. Trng hp khc, phc tp hn l cc h thng c ba thnh phn c th c lin quan n vic amine ng thi phn ng c hai isocyanate v epoxy resins. Hn hp Graft polymeric thuc loi ny cung cp c hi phong ph cho cc nh pha ch (formulator) sng to. Tnh thng mi ca cng ngh ny hin nay cha c ph bin. Tuy nhin, ty thuc vo cng thc, mng phim khng mi mn v ha cht, v chng th hinnhng tnh cht tt nht ca c hai h thng. H urethane s ci thin ng k tnh mm do ca cc epoxy cng nh tnh khng mi mn v va p. Cc epoxy s ng gp khng Alkali v tng cng bm dnh.

V kh nng phn ng ca h ny, c bit l khi c xc tc, aliphatic epoxies v Epoxy bisphenol A v bisphenol F c th c s dng nh l cc polyols. Tnh cht ng rn nhit thp ca h ny tt hn so nhng h ng rn khc cho epoxies.

19

He 1 thanh phan - ong ran T0 thng : +Epoxy Ester

+ Epoxy Ester

20

EPOXY ESTERS BPA epoxy resins c th phn ng vi axit bo cho mt sn phm thng c gi l epoxy esters. Fatty acid du kh hoc bn kh c s dng cho cc sn phm c th to lin kt bng phn ng autoxidation. Cc fatty acid c cho vo nha nng chy, v phn ng esterification tip tc cho n khi ch s axit thp, thng l t hn 7 mg KOH cho mi gram ca resin. Phn ng c thc hin nhit cao (220 n 2400C). Tc phn ng chm khi nng nhm hyhroxy gim, v cc phn ng ph, c bit l dimer ha ca fatty acid du kh (hoc esters ca n). Thc t phn ng ester ha khng vt qu 90% nhm hydroxyl, bao gm c c t m vng epoxy. Epoxy esters c s dng lm h to mng trong bm dnh ln kim loi l quan trng. Mc d l do cha hon ton hiu r, epoxy esters cho bm dnh tt ln kim loi v duy tr tnh bm dnh ny sau khi cc kim loi c ph tip xc vi m cao, mt yu t quan trng trong bo v n mn. Mt li th ca epoxy esters trn alkyd resins l tnh khng thy phn v x phng ha tt hn.

Backbone ca nha alkyds l nhng nhm esters t PA v polyol, trong khi epoxy esters, cc backbone l C-C v ni ether. Tt nhin, fatty acid phn ng to nhm ester gn vo backbone trong c hai trng hp, nhng t l lin kt ny trong mng phim kh (b thy phn) l thp hn ng k trong trng hp ca epoxy esters. Mt khc, bn thi tit ngoi tri ca epoxy ester th km hn, nh l trng hp vi tt c mng phim c i t BPA epoxy resins. Vi nhng thun li & khng thun li, ng dng chnh cho epoxy resins lm lp primers cho cc kim loi v hp, chng hn nh np chai, trong yu cu quan trng l bm dnh v khng b thy phn. Trong lp primers sy nhit, thnh thong c dng tng cng lin kt mng bng oxidation hay c th dng mt lng nh nha melamine formal to lin kt vi nhm hydroxy t do trn epoxy ester

21

He 1 phan - ong ran T0 cao

Amines Thm Amines thm, chng hn nh metaphenylene diamine (MPDA), 4,4-methylene dianiline (MDA), diaminodiphenyl sulfone (DADPS), v 2,4-Bis (para-aminobenzoaniline). V c vng benzen, cu trc ny cung cp cho tnh cht mng cng hn, khng ha cht, nhit cao hn khi so vi aliphatic amines. HDT (nhit bin dng) th cao hn 40 n 600C (72 to 1080 F) so vi gi tr c th c ngay c vi aliphatics (ng rn y ). Khng acid hu c v v c cao. Tt c cc amines thm cho mng phim mu ti. Cc amines thm thng l dng rn v i hi nhit ln n 3920 F (2000 C) ng rn, tr khi c bin tnh bng adducting.

22

Anhydride curing of epoxy resins Cc h epoxy ng rn da trn Anhydride c s dng rng ri trong cc ng dng c v dt (laminating), cng nh trong powder coatings.

Phn ng to lin kt ngang bng axit quan trng nht c dng vi epoxies l bin i anhydride nhit cao. Trc khi phn ng c th xy ra gia cc terminal oxiranes v axt anhydride, anhydride phi c m vng. Trong trng hp khng c mt ca xc tc axit hoc baz, vic m vng ny c khi mo bng nhm hydroxyl.

Nhng nhm ny thng l nhm hydroxyls trn mch (ph) ca cc bisphenol-A epoxy trng lng phn t cao. Phn ng u tin cho ra haft acid ester t anhydride. Nhm carboxylic ca bn acid ester sau phn ng esterification vi cc oxirane cui mch, to thnh Hydroxy diester.

23

Cc Hydroxy diester, ln lt, c th phn ng vi cc nhm anhydride khc thng qua mt phn ng tng t nh phn ng esterification hoc nhm epoxy khc to thnh mt lin kt ether. Homopolymerization ca epoxy cng c th xy ra nhit ng rn 392 0 F (2000 C).

Epoxy / Acrylic v Epoxy / Polyester Thermosets Epoxy resins s phn ng vi c hai hydroxylated v carboxylated acrylics, cng nh vi acrylics bin tnh (acrylamide). Chng cng s phn ng vi cc h thng c cha glycidyl (meth) acrylate. Trong thc t, cc h carboxylated chim u th hn.

Thng thng, cc sn phm s dng 10 n 40 phn trm epoxy trn tng s cht rn v yu cu nhit baking tng i cao, 350-400 0F (177 n 2040 C).
Tertiary amines hoc quaternary ammonium compounds c s dng nh l xc tc.Cc h Acrylic, c th c nh mong i, kt hp cng v khng ha cht ca epoxy vi tnh n nh nh sng v thm m ca acrylic, cho mng phim c bng xut sc v khng try cao. Trong hydroxylated acrylic, cc epoxy resin c s dng mc thp hn (10 n 20 %) v thch hp cho mng nng cao cht lng khng cht ty ra. Mt ln na, nhit cao l cn thit ng rn, nhng y xc tc acid c s dng.

Nhng h cht nn ny thng c s dng trong ph dng c, h thng xe t, trang tr kim loi. Trong mi trng hp, epoxy b hn ch bi bn mu, bn ngoi tri ca n, v xu hng b vng khi sy nhit cao.

24

+ Reactions of epoxy resins with acrylics

Trigiycidyl isocyanurate and its reaction with carboxylated polyesters

25

+ Etherification reaction between epoxy resin and phenolic novolac

Etherification reaction between epoxy resin and phenolic resole

26

Reaction of urea formaldehyde resins with epoxy

27