Quick-teck EN-00413

Ten Rules for Components Placement on PCB Design

Termsofusingthisarticle ThisarticleisprimarilyforinternaluseinQuickteck.Nowwedecidedtoopenituppublicly. Wetrytoensuretheinformationinthisareasaccurateaspossible,butpleasebeawarewe donttakeanyreasonabilityforanythingthatresultsfromthisarticle.Youreusingthisat yourownrisk. Details 1. Startplacementofbig/main/criticalcomponents(thiscouldbeMCU,DSP,FPGA,DDR, clockdevices)andthenplacesupportcomponentlikeresistors,capacitorsaround them. 2. Use50or100milascomponentgridtoplacethesebigcomponents(QFP,BGA,SOP, SOIC,orthroughholeconnectors).Use25milascomponentgirdfortheseSMT resistors/capacitorsorothersmallpassivecomponents. 3. Isolatetheanalog,digitalandpowersupplysection. 4. Clockdriver/synchronizershouldbelocatedclosetoclockoscillator. 5. Arrangecomponentsinrowsandcolumns,andorienteduniformlyforeaseof installation,inspectionandrework.Whenpossible,allpolarizedcomponentssuchas tantrumcapacitoranddiodesinthesamedirection.Polarityofthesecomponents shouldbeindicatedonthesilkscreen. 6. Keepatleast40milspacebetweencomponentsand100milspacefromcomponent toboardedge.Locateconnectorsononeedgeoronecorneroftheboard. 7. Trytoplaceallcomponentsonthetopsideonly.Ifnotpossible,onlytheselow profile,smallsizeandlowthermaldissipationcomponent(likeSMDpassiveparts) canbeonbottomside. 8. PlacedecouplingcapacitorscloseasmuchaspossibletoVCCpinonactive components. 9. Keepatleast200milclearancefromtransformertoelectrolyticcapacitor. 10. LocateindicationLEDs,testpoints,switches,jumpersandadjustablecomponents foreasyaccess. Onemorerule, itsalwaysgoodtodoublecheckanalog,highfrequency,RF,highvoltage, highprofile,heavyorhighheatcomponentsbeforestartingtracerouting.

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