Huawei g630 Repair Manual

G630-U10
Simplified
Maintenance Manual
Issue
01
Date
HUAWEI TECHNOLOGIES CO., LTD.
Copyright Huawei Technologies Co., Ltd. 2014. All rights reserved.

No part of this document may be reproduced or transmitted in any form or by any means without prior
written consent of Huawei Technologies Co., Ltd.
Trademarks and Permissions

and other Huawei trademarks are trademarks of Huawei Technologies Co., Ltd.
All other trademarks and trade names mentioned in this document are the property of their respective
holders.
Notice
The purchased products, services and features are stipulated by the contract made between Huawei and
the customer. All or part of the products, services and features described in this document may not be
within the purchase scope or the usage scope. Unless otherwise specified in the contract, all statements,
information, and recommendations in this document are provided "AS IS" without warranties, guarantees or
representations of any kind, either express or implied.
The information in this document is subject to change without notice. Every effort has been made in the
preparation of this document to ensure accuracy of the contents, but all statements, information, and
recommendations in this document do not constitute a warranty of any kind, express or implied.
Huawei Technologies Co., Ltd.

Address:
Huawei Industrial Base

Bantian, Longgang
Shenzhen 518129
People's Republic of China
Website:
http://www.huawei.com
Email:
support@huawei.com
Issue 01 (2014-04-01)
Huawei Proprietary and Confidential

Copyright Huawei Technologies Co., Ltd.
G630-U20 Simplified Maintenance Manual
About This Document
About This Document

Author
Prepared by
Date
2014-02-28
Reviewed by
Date
2014-02-28
Approved by
Date
2014-02-28
Change History
Date
Version
Description
2014-02-28
V1.0
Released the first

issue.
Issue 01 (2014-04-01)

Copyright Huawei Technologies Co., Ltd..
Author
ii
Contents
Contents
About This Document .................................................................................................................... ii
1 Overview......................................................................................................................................... 1
1.1 Applicable Scope .............................................................................................................................................. 1
1.2 Brief Introduction ............................................................................................................................................. 1
1.3 How to Obtain Product and Maintenance Information .................................................................................... 1
2 Product Overview ......................................................................................................................... 2

2.1 Appearance ....................................................................................................................................................... 2
2.2 Specifications ................................................................................................................................................... 2
3 Exploded View and Components on the PCBA ...................................................................... 4

3.1 Exploded View ................................................................................................................................................. 4
3.2 Components on the PCBA and BOM ............................................................................................................... 6
4 Software Upgrade ......................................................................................................................... 9

4.1 Selecting the Operation Type and the BIN File to Load................................................................................... 9
4.2 Home Screen .................................................................................................................................................. 11
4.3 Screen Element Description ........................................................................................................................... 11
4.3.1 Title Bar ................................................................................................................................................ 11
4.3.2 Scan && Download Button .................................................................................................................. 11
4.3.3 Remove Devices Button........................................................................................................................ 13
4.4 Procedure ....................................................................................................................................................... 14
4.5 (Important) Be Cautious to Allow a Second-time Upgrade............................................................................ 14
4.6 Software Downloading Types ........................................................................................................................ 14
4.7 Using the microSD Card for an Upgrade ....................................................................................................... 15
4.8 Troubleshooting Upgrade Failures ................................................................................................................. 19
5 Maintenance Tools ...................................................................................................................... 20

6 Disassembly Procedure .............................................................................................................. 22
7 Assembly Procedure ................................................................................................................... 27
8 Troubleshooting Common Faults ............................................................................................ 31
8.1 Startup Failure ................................................................................................................................................ 31
8.2 Charging Failure ............................................................................................................................................. 36
8.3 Camera Failure ............................................................................................................................................... 37
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Contents
8.4 Connection Failure Between the Phone and Computer .................................................................................. 38

8.5 Call Receiving Failure .................................................................................................................................... 39
8.6 Call Sending Failure ....................................................................................................................................... 40
8.7 Vibration Failure ............................................................................................................................................ 41
8.8 Ringtone Failure ............................................................................................................................................. 42
8.9 LCD Display Failure ...................................................................................................................................... 43
8.10 Key Failure ................................................................................................................................................... 44
8.11 No Sound Coming from the Headset During a Call ..................................................................................... 45
8.12 T-Flash Card Detection Failure .................................................................................................................... 46
8.13 GPS Signal Reception Failure ...................................................................................................................... 47
9 Functional Tests........................................................................................................................... 49
9.1 MMI Test ........................................................................................................................................................ 49
9.2 Wi-Fi Test ....................................................................................................................................................... 59
9.3 Voice Call Test................................................................................................................................................ 60
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iv
1 Overview
Overview
1.1 Applicable Scope

The G630-U10 Maintenance Manual (Template) is available in the simplified and advanced
versions. The two versions are respectively applicable to common service centers and
advanced service centers authorized by Huawei. The simplified version (this document)
provides maintenance and repair instructions for technicians at common service centers to
conduct services of level 1 and level 2. Being Huawei proprietary, this document is accessible
only for authorized service centers. Although every effort was made to ensure the accuracy of
the document, errors may still exist. If you find any errors or have any suggestions, please
report them through Huawei service platform ComPartner.
1.2 Brief Introduction

This document introduces the product features, mechanical parts, assembly and disassembly
procedures, and common troubleshooting methods. You will be able to clear common faults of
the product with this document.
1.3 How to Obtain Product and Maintenance Information

To obtain product and maintenance information, visit Huawei service website. You are
recommended to install the ComPartner to download maintenance required software tools and
the phone version software.
To obtain the ComPartner installation package, log in to
http://support.huaweidevice.com/service/, search for ComPartner. You will find the
installation package.
Issue 01 (2014-04-01)

2 Product Overview
Product Overview
2.1 Appearance
Error! Reference source not found. shows the appearance of the HUAWEI G630-U10 mobile
phone (G630-U10 for short).
Figure 2-1 G630-U10
2.2 Specifications
Table 2-1 lists the G630-U10 specifications.
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2 Product Overview
Table 2-1 G630-U10 specifications

No.
Description
Mobile phone model
Touchscreen smartphone
Dimensions (H x W x D)
143 mm x 71.8 mm x 8 mm
Weight
About 155 g (including the battery)
Working band
GSM: 850/900/1800/1900M
UMTS: 900/2100M
External ports
Standard micro USB port, microSD card slot, 3.5 mm headset jack
UIM card interface
Two standard 6-pin UIM card slots
microSD card
32 GB
USB interface
USB 2.0, high speeds of up to 480 Mbit/s
Battery
Capacity: 2000 mAh
Display
5-inch HD display, 720x1280 resolution
Antenna
Built-in antenna
Camera
Rear camera: 8 MP pixels; Front camera: 1 MP
Sensors
Accelerator, proximity sensor, and ambient light sensor
Test the Bluetooth.
Bluetooth v2.1 + EDR
Wi-Fi
802.11b/g/n, Wi-Fi routing
GPS
GPSone
Power supply
100240 V, 50/60 Hz, 1 A
Temperature
Humidity
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Operating temperature: 0C to +40C

Storage temperature: 40C to +70C
Working humidity: 5% to 95% RH

3 Exploded View and Components on the PCBA
Exploded View and Components on the

PCBA
3.1 Exploded View

Figure 3-1 shows the exploded view of the G630-U10.
Figure 3-1 Exploded view
Table 3-1 lists components in the exploded view.

Table 3-1 Components in the exploded view
No.
Name
Receiver decoration
TP
LCD
Proximity sensor rubber
Front cover assembly
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No.
Name
Proximity sensor FPC
Proximity sensor support
Speaker FPC
Receiver
10
Front camera
11
Rear camera
12
PCBA assembly
13
CPU shielding cover
14
RF shielding cover
15
Side key FPC
16
Motor
17
Battery
18
Speaker
19
Battery support assembly
20
Back cover assembly
21
Main antenna
22
GPS antenna
23
Wi-Fi antenna
24
Phone label
25
NFC antenna
26
Battery cover assembly
27
Two screws for fastening the battery steel plate
28
15 screws for fastening the phone
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3.2 Components on the PCBA and BOM

Figure 3-2 Layout of components and relevant failures (top)
HD1G630P proximity
sensor FPC
Fault symptom:
Proximity/Ambient
light sensor fault
LED2201 tri-color
indicator
Fault symptom:
Indicator fault
J1901 headset jack
Fault symptom:
J2404 6-pin connector
Headset fault
Fault symptom:
Volume key fault, key
startup failure, motor
fault
U2202 gravity sensor
Fault symptom:
Gravity sensor fault
J2102 front camera

slot
Fault symptom:
Front camera fault
X201 19.2M oscillator
Fault symptom:
Startup failure
U201 power
management chip
Fault symptom:
Startup failure
U701 CPU chip
Fault symptom:
Startup failure
J2101 rear camera

slot
Fault symptom:
Rear camera fault
U1500 EMM+DDR chip
Fault symptom:
Startup failure
U2002 backlight IC
Fault symptom:
LCD fault
U3801 WTR2605-RF
chip
U2003 LCD
positive/negative
voltage IC
Fault symptom:
RF fault
Fault symptom:
LCD fault
U3301 RF PA
Fault symptom:
U3201 RF IC
Fault symptom:
RF fault
RF fault
J1701 speaker spring
Fault symptom:
Speaker fault
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MIC1801 main
microphone
Fault symptom:
No voice transmitted
or noice transmitted
Figure 3-3 Layout of components and relevant failures (bottom)

J5003 5004
WLAN/BT antenna
spring
Fault symptom:
WLAN/BT fault
J5001 J5002 GPS

antenna spring
Fault symptom:
GPS fault
U4701
WLAN/BT/FM IC
J2501 TP
connector
Fault symptom:
Fault symptom:
TP failure
WLAN/BT/FM fault
MIC1802 secondary
microphone
J1601 battery
connector
Fault symptom:
Fault symptom:
No voice transmitted,
or noise transmitted
Startup failure
J2401 motor
J2302 TF card slot
Fault symptom:
Fault symptom:
No or weak
vibration
TF card detection
failure
LED2101 flashlight
J2303 SIM card slot
Fault symptom:
Fault symptom:
Flashlight fault
SIM card detection

failure
U2801 NFC
module
J2301 SIM card slot
Fault symptom:
Fault symptom:
SIM card detection

failure
NFC malfunctional
J5005 J5006 main

antenna spring
J2001 LCD
connector to the
peer board
Fault symptom:
No or weak signal
Fault symptom:
LCD display fault
J3201 RF connector
J1602 USB
connector
Fault symptom:
Fault symptom:
RF fault
No charging or USB
communication fault
Table 3-2 is provided for your reference only. It is subject to changes without notice. Obtain
the latest BOM information from Huawei TCS system. For details about how to query a BOM
code, see the simplified version.
Table 3-2 lists the BOM information about key components on the PCBA.
Table 3-2 BOM code list
Position
BOM
Description
X201
1202021
5
Crystal Unit,19.2MHz,7pF,+/-10ppm,70ohm,2.5*2.0*0.9mm,NTC internal,Terminal

Dedicated
U201
3920057
2
Power Management IC(PM8110),3.0~4.4V,118WLNSP(pb-free),Terminal Dedicated
U701
3920057
4
Terminal Baseband process IC,WCDMA/GSM dualmode baseband

processor,1.2V/1.8V/2.85V,488NSP,Terminal Dedicated
U1500
4006054
3
MCP,4GB(x8) eMMC,52MHz,1024KB,3.3V/1.8V,FBGA162,8Gb(x32)
LPDDR2,Terminal Dedicated
Issue 01 (2014-04-01)

Position
BOM
Description
U3801
3920043
9
Terminal Baseband process IC,RF Transceiver

WTR2605 -2.2V/1.8V/1.3V-62-WLNSP-Terminal Dedicated
J1601
1424057
6
Card Block Connector,BTF Connector,3*2,Female,1.3mm,Terminal Dedicated
J1701
5162102
3
108-5785,Ground Spring,U1250
MIC1801
2205009
9
Microphone,-42dB.,3.76*2.95*1.1mm,silicon
J2102
1424049
6
BTB Connector,Female,24Pin,0.4mm,SMT,Mating Height 0.8mm,Terminal Dedicated
J2404
1424078
0
Card Socket,Spring Contact,6PIN,Horizontal,Center Line Spacing 1.6mm,Pin Tail

Length 0.4mm,SMT,Terminal Dedicated
U2101
3911080
0
Switching Regulators,1.5A LED Flash Driver

IC,2.5V~5.5V,1.5A,4MHz,CSP-9,Terminal Dedicated
U2201
3814009
8
Semiconductor Sensor,Accelerometer,LGA,3axis,Terminal Dedicated
J2101
1424057
9
BTB Connector,BTBconnector,34PIN,0.4mm,0.8mm,SMT,female,Terminal Dedicated
J2501
1424083
1
FPC Connector,8,0.5mm,0.5mm,Back Lock&Double Touch,0.8mm,Terminal

Dedicated
J1901
1424083
0
Earphone Connector,12.66*6.7*4.2,6Pin,Arc,SMT,Reverse plate (pin inside plate

distance to the flat top surface 1.65mm),Terminal Dedicated
J5004
5162498
9
Edge mini Groung Spring
U4701
3921016
0
Connectivity IC,Wireless Connectivity WCN3620,2.05V~2.17V,62-WLNSP,Terminal

Dedicated
J2302
1424070
8
Card Connector,MicroSD card Connector,8PIN,Horizon,1.1mm,hinge type,without

post,Terminal Dedicated
J2301
1424077
2
Card Socket,Micro SIM Socket,8Pin,Horizontal,2.54mm,Without Hold

Peg,PUSH-PULL,height 1.3mm,Terminal Dedicated
J2001
1424057
9
BTB Connector,BTBconnector,34PIN,0.4mm,0.8mm,SMT,female,Terminal Dedicated
J3201
1424000
4
Coaxial Connector,RF Switch,Straight,Female,SMT,Terminal Dedicated
J5001
5162498
9
Edge mini Groung Spring
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4 Software Upgrade
Software Upgrade
4.1 Selecting the Operation Type and the BIN File to Load
After WH62406270ML01Ver1006 is run, the following dialog box is displayed.
Figure 4-1 Entering the login password
Enter the password (initial password: Huawei) and click OK.
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4 Software Upgrade
Figure 4-2 Selecting the BIN file and configuration file
In this dialog box, you can select whether to allow a second-time upgrade and select the BIN
(Firmware) file and the configuration file to be loaded.
1.
Select the operation type.

Under Be cautious to select, select or deselect Allow upgrade for the Second time to
allow or prohibit a second phone board upgrade.
If the board software is burned and then mounted, do not select this option, and ensure that the board has
just loaded with the BOOT file with the JTAG tool and does not have APP.
In a normal upgrade after printing rear labels, select this option; otherwise, file loading will fail.
Selection or deselection of this option may affect the NV data status of the phone. Be cautious to confirm
the operation in the displayed dialog box.
2.
Select the file to load.

Under Please Select File, the browse button is unavailable and the file path is cleared if
the check boxes are deselected.
3.
Once selecting a check box, an Open dialog box is displayed, asking you to select a BIN
file. After you select a file, its path information will be displayed in the text box and the
browse button will be available. When the check box is selected and the browse button is
available, you can click the button to change the file path.
4.
The default configuration file PhoneMultiUpgradeDefaultCfg.xml (Windows phones

and some other products possibly cannot use the default configuration file, and therefore
a customized configuration file needs to be provided) and the software executable file
WH62406270ML01Ver1003(SmartPhone).xml are in the same directory level.
5.
Select Next to navigate to the Home screen.
6.
To cancel or exit the software, select Cancel.
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4 Software Upgrade
4.2 Home Screen

After you click Next, the screen shown in Figure 4-3 is displayed.
Figure 4-3 Home screen
4.3 Screen Element Description

4.3.1 Title Bar
The title bar displays the software name, version, feature code, and compilation date from left
to right.
The feature code is automatically generated by the software based on the configuration file, and is
intended only for check by R&D personnel.
4.3.2 Scan && Download Button

After clicking the Scan && Download button (before loading a file, ensure that ports have
been correctly mapped; otherwise, loading will fail), the application scans for the mapped
ports (the names of ports to search for are specified in the configuration file) in Device
Manager and start loading software. The port numbers of the found ports are displayed on the
list. You can click Scan && Download several times until the ports of all the UEs are found.
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4 Software Upgrade
Figure 4-4 During an upgrade process
During the software upgrade, do not close the application; otherwise the dialog box shown in
Figure 4-5 will be displayed.
Figure 4-5 Closing the application during an upgrade
Do not terminate the application forcibly during an upgrade through measures such as the
Windows Task Manager. Otherwise, the tested boards may get damaged.
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4 Software Upgrade
Figure 4-6 Restoring NV after loading (not required for some products)
Figure 4-7 Successful downloading
4.3.3 Remove Devices Button

You can click Remove Devices to remove phones only after all phones are upgraded.
The Remove Devices button will clear all current screen display, preparing for the next
upgrade.
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4 Software Upgrade
4.4 Procedure
Prepare the required environment and ensure that ports for all phones have been correctly
mapped in Device Manager. Then, click the Scan && Download button. If not all ports are
found after a click, perform several more clicks. During an upgrade, the upgrade progresses of
different phones may be different. When stable phone hot swapping is supported, especially if
several phones need to be hot swapped (unstable hot swapping may cause problems such as
computer down), first remove phones that have been upgraded successfully without affecting
phone being upgraded. This process releases ports for accessing new phones to be upgraded.
After the ports of the new phones are correctly mapped, click the Scan && Download button
again to upgrade the new phones, without affecting other phones being upgraded.
4.5 (Important) Be Cautious to Allow a Second-time

Upgrade
Under Be cautious to select, select or deselect Allow upgrade for the Second time to allow
or prohibit a second phone board upgrade. That is, once is selected, a phone to which phone
software has been downloaded can be upgraded for a second time.
If this downloading tool needs to be used for software loading for a phone that is loaded with a BOOT file
with a JTAG tool and with applications with a USB flash driver, do not select the Allow upgrade for the
Second time option. In addition, before using this tool, ensure that the board has just loaded with the
BOOT file with the JTAG tool and does not have APP; otherwise, downloading will fail and a message
Refuse Download In AMSS Fail will be displayed. If this operation is incorrectly selected in this case, it
may result in faulty phones in subsequent work stations.
In a normal upgrade after printing rear labels, select this option; otherwise, the software upgrade will fail
and a message Refuse Download In AMSS Fail is displayed. Before a software upgrade, the phone
software automatically backs up the NV data in the current phone. After the software upgrade, the phone
software will automatically restore the NV data from the backup data. After a later USG upgrade or SD
upgrade, the NV data will also be restored from the backup. The backup data is restored in the NV backup
backup area of the phone. Pay attention to the message in the dialog box that is displayed after you
selecting or deselecting this option, and be cautious to confirm your operation.
4.6 Software Downloading Types

Two software upgrade types are available: software is burned (not supported for smart
phones), and software upgrade. The screens for the two types are similar except for the
messages displayed during interchanges with phones. Differentiate the phones for which
software needs to be burned and the phones for which software needs to be upgraded;
production line stoppage or even accidents may result if the phones are not correctly
differentiated. (The software should be initially started by a PE. Operators must not start it
without permission. If no exception occurs during software downloading, this software does
not need to be shut down.)
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4 Software Upgrade
4.7 Using the microSD Card for an Upgrade

To upgrade the phone using a microSD card:
Step 1 Format the microSD card using FAT32.
Step 2 Create a dload folder in the microSD card's root directory.
Figure 4-8 shows the dload folder under the root directory.
Figure 4-8 dload folder under the microSD card's root directory
Step 3 Copy the upgrade file UPDATE.APP to the dload folder.

Step 4 Insert the microSD card into the phone, power on the phone, and enter *#*#2846579#*#* on
the dialing screen. Touch ProjectMenu > Upgrade > SD card upgrade > Confirm.
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4 Software Upgrade
Figure 4-9 Operation procedure
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4 Software Upgrade
The upgrade progress is displayed on the phone screen, as shown in Figure 4-10.
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4 Software Upgrade
Figure 4-10 Upgrade process
After the upgrade is complete, restore the phone to its factory settings and check whether the
software version is correct.
If the phone cannot be powered on, use either of the following methods to perform a forcible
upgrade:
Install the battery to the phone (if the phone screen flashes, remove the battery from the phone
and install it again after 5 minutes). Press and hold the volume up and down keys, and then
press the power key. The phone automatically starts a forcible upgrade. The upgrade process
displayed on the phone screen is the same as that shown in Figure 4-9.
Remove the battery from the phone. Press and hold the volume up and down keys, and
connect the charger to the phone. The phone automatically starts a forcible upgrade. The
upgrade process displayed on the phone screen is the same as that shown in Figure 4-9.
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4 Software Upgrade
4.8 Troubleshooting Upgrade Failures

Table 4-1 Upgrade failures and solutions
Failure
Solution
(Computer) Failed to
detect the phone's
presence
Check whether there is any other driver conflicting with the USB
upgrade driver.
Check whether the USB upgrade driver has been installed
properly.
Check whether the USB cable has been properly connected.
Check whether the serial port settings are correct.
Failed to upgrade the

phone using the USB
cable.
Check whether the USB cable has been properly connected.

Check whether the target firmware version is higher than the
original one.
Perform the upgrade again.
Fail to upgrade the

phone using the
microSD card.
Check whether the upgrade file is correct.

Check whether the upgrade method is correct.
Check whether the microSD card functions properly.
Perform the upgrade again.
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5 Maintenance Tools
Maintenance Tools
Name: soldering iron

Usage: solders components
Name: DC power supply

Usage: supplies power
Name: soldering fixture

Usage: secures PCBAs
Name: lead-free tin solder wire

Usage: solders components
Name: digital multimeter

Usage: measures parameters during maintenance
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20
5 Maintenance Tools
Name: toolkit
Usage: assembles and disassembles terminals
Name: electric screwdriver

Usage: fastens and removes screws
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21
6 Disassembly Procedure
1. Ensure that the ESD wrist strap is properly

grounded.
Disassembly Procedure
2. Hold the phone with your right hand, lever up the

hand hole on the battery cover with your left thumb to
open the battery cover.
3. Check the quantity and positions of screws on 4. Place the mobile phone on a flat panel, press
the phone with your left hand, hold the electric
the rear cover. There are 15 Phillips screws.
screwdriver with your right hand, and remove all
the 15 screws one after another.
Issue 01 (2014-04-01)

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5. Check the position of the headset jack. Insert a

finger or a spudger from the upper right corner
into the headset jack, and slide your finger or the
6. Use your hands to hold both sides of the rear
spudger clockwise to release all clips from the
cover and remove the rear cover.
rear cover.
7. After the rear cover assembly is removed.
9. Lever up the battery BTB connector with a

crowbar and remove the battery BTB connector.
Issue 01 (2014-04-01)
8. Check the positions of the two screws that are

used to connect the battery and the front cover,
place the phone on a flat panel, press the phone with
your left hand, hold the electric screwdriver with
your right hand, and remove the two screws.
10. Lever up the battery steel plate with a crowbar

and remove the battery assembly.

23
11. Lever up the LCD BTB connector with a

crowbar.
12. Remove the TP FPC ZIF. First, turn on the ZIF

connector switch, use a plastic tweezers to clasp the
FPC two ears, pull the FPC upwards, and remove
the FPC.
13. Remove the rear camera. Use a finger or plastic 14. Hold the phone with your left hand, push
tweezers to lever up the rear camera and finally to leftwards the PCBA with your right hand to release
clip 1 at the bottom.
separate the camera from the front cover.
Issue 01 (2014-04-01)

24
15. Hold the phone with your left hand, push

16. Shake the PCBA to release clip 3 on the right
rightwards the PCBA neck position with your right side and finally to separate the PCBA and the front
hand to release clip 2 on the left side.
cover.
17. Use a finger or a crowbar to remove the rear

camera. Firstly, unfasten the rear camera BTB and
then remove the camera.
Issue 01 (2014-04-01)
18. Use a finger or a crowbar to remove the front

camera. Firstly, unfasten the front camera BTB and
then remove the camera.

25
19. End.
Issue 01 (2014-04-01)

26
7 Assembly Procedure
Assembly Procedure
1. Ensure that the ESD wrist strap is properly

grounded.
2. Connect the rear camera BTB male and female. Make

sure the connectors are properly fastened and do not bump
the surrounding components.
Issue 01 (2014-04-01)

27
3. Connect the front camera BTB male and female.

Make sure the connectors are properly fastened and
do not bump the surrounding components.
4. Gently move the PCBA, aligning the positioning hole at

the PCBA bottom with the positioning rod in the lower left
corner of the front cover. Press the positioning hole area in
the lower left corner of the PCBA with your left thumb to
fit the positioning rod in the positioning hole. Press the
board at the clip position to fit the board into the clip with
your right thumb.
Issue 01 (2014-04-01)

28
5. Fasten the LCD BTB and TP BTB to the PCBA,

without touching other components. Install the
battery and engage it into the BTB connector.
6. Use an electric screwdriver to install screws for fastening

the front cover and the battery.
7. Install the15 screws clockwise, starting from the

headset jack.
Issue 01 (2014-04-01)
8. Use the tweezers to take the anti-dismantle label

and attach it to its specified position on the rear
cover. Use a cotton swab to gently press the
anti-dismantle label, ensuring that the label is
securely attached.

29
9. Assemble the battery cover.
Issue 01 (2014-04-01)

30
8 Troubleshooting Common Faults
Troubleshooting Common Faults
Before you repair a G630-U10, back up the user data and restore the phone to its factory settings.
8.1 Startup Failure

Most power-on failures are caused by power supply exceptions. Therefore, you can rectify
power-on failures by troubleshooting power supply circuit faults. Power-on failures are
divided into the following types:
No current: After you connect the phone to the DC power supply and power on the
phone, the reading on the power supply ranges from 0 mA to 5 mA.
Weak current: After you connect the phone to the DC power supply and power on the
phone, the reading on the power supply ranges from 5 mA to 100 mA.
Excessive current: After you connect the phone to the DC power supply and power on
the phone, the reading on the power supply exceeds 300 mA.
If the G630-U10 fails to be powered on, observe the power-on current reading on the DC
power supply to identify the fault.
Issue 01 (2014-04-01)
No current

31
Figure 8-1 Troubleshooting startup failures with no current
Startup failure
Connect the phone to a

fake battery and
maintenance power supply,
press the power key, and
observe the current
No current
Y
Is the key copper foil
oxidized?
Clean the key
N
N
Is the VPH_PWR voltage between
the range from 3.4 V to 4.2 V, and
equal to the maintenance power
voltage?
Check the U201
Check the clock

X201
This situation occurs when the main power circuit is short-circuited. Check whether VBUS and
VPH_PWR circuits are short-circuited.
Issue 01 (2014-04-01)
Weak current

32
Figure 8-2 Troubleshooting startup failures with weak current
Startup failure
Connect the phone

to a
fake battery and

observe the current
Weak current
N
Check whether
U201
haspartialDC-DC
Check the U201
voltage output
N
Check whether U201
has partial L6/L17
voltage output
Resolder theU201
N
Check whether EMMC
(U1500) is properly
soldered
Replace the
U1500
Check whether other U201 outputs
are short-circuited
Replace the U201
Replace theU701
If the VPH_PWR voltage is normal, but the U201 output is not, the other output of U201 is probably
short-circuited, which results in the power output exception of the PMU. Check every output of the U201
to see whether they are short-circuited.
Issue 01 (2014-04-01)
Excessive current
33
Excessive current is usually caused by short-circuited power supply circuits (DC power
supply) which may result in 500 mA or greater current leakage. Mostly this fault occurs when
VBAT is short-circuited to ground.
Figure 8-3 Troubleshooting startup failures with excessive current
Startup failure
Connect the phone to a

fake battery and
observe the current
Excessive current
(>500 mA)
Check whether pin 1

of J1601 is shortcircuited to the
ground
Replace the J1601
Check whether the U201 voltage is

normal
N
Y
Check whether the
capacitor connected
to the Vbat is shortcircuited
Repair the capacitor
Resolder or replace
the U201
Startup failure summary:

1. Current leakage in case of excessive current:
When the phone is connected to a regulated power supply, excessive power such as hundreds
of mA current is generated upon a power-on. This problem usually occurs because the VBAT
is generally short-circuited to the ground. It also may be because the VPH_PWR is
short-circuited to the ground. It is earlier to troubleshoot VBAT short-circuit to the ground,
Issue 01 (2014-04-01)

34
since fewer components (PA, antenna switch, and capacitor) are connected to the VBAT. You
can locate the fault by removing the components separately.
If the voltage on the VPH_PWR circuit is short-circuited, the component removal method is
not applicable. Instead, adjust the DC power output voltage to about 3 V, connect the negative
end of the power supply to the PCB negative end, connect the positive end of the power
supply to the detected short-circuit point, touch the PCB with your hand to locate the hot
position after about 20s, and then remove the hot component.
2.
Current leakage in case of weak current:
If the power-on current is weak (generally less than 30 mA), usually the power management
chip, PA, or an ESD protection tube is damaged. It may also be because the EMMC fails to
start up and the program fails to run.
3.
No or weak current when you press the power key:
If no current is generated, first check whether the power key fails to work. Then, check the
power supply line to the VBAT. If weak current is gated, measure each output voltage of the
power supply IC. If all IC output voltage is 0, this fault is most possibly related to the PM.
4.
After you press the power key, the current sharply changes within a range or remains
unchanged at a fixed value:
This problem is usually due to a CPU or PM communication fault.
Issue 01 (2014-04-01)

35
8.2 Charging Failure

Figure 8-4 Troubleshooting charging failures
Chargingfailure
N
Is the charger
functional?
Replace the
charger
Y
Is J1602poorly
soldered?
Resolder the
J1602
N
Are the battery connector
and the battery are in good
contact
Repair theJ1601
Y
Is the battery damaged?
Change the
battery
N
Check the U201
Issue 01 (2014-04-01)

36
8.3 Camera Failure

Figure 8-5 Troubleshooting camera failures
Camera f ailure
Is the problem
solved af ter you reload the phone
sof tware?
Y
End
N
Y
Is the J2101 poorly
soldered?
Re-solder or
replace the J2101
N
Is the problem
solved af ter you
replace the
camera?
End
Replace the
U201
End
N
Replace the
U701
Issue 01 (2014-04-01)

37
8.4 Connection Failure Between the Phone and Computer

Figure 8-6 Troubleshooting connection failures between the phone and computer
Connection failure between
the phone and computer
Y
Is the problem solved after
you replace the USB cable?
End
Is the 5-pin mini USB connector

poorly soldered?
Resolder the
USB connector
Y
Is the problem solved
after you reload the
phone software?
End
Y
Is there voltage at
VCHG?
Replace the U201
Replace the
Issue 01 (2014-04-01)
USB

38
8.5 Call Receiving Failure

Figure 8-7 Troubleshooting call receiving failures
No voice can be heard
af ter a call is set up
N
Is the receiver
volume properly set?
End
Y
Y
Is the insertion of the
headset misjudged?
Replace the
headset connector
N
Is the problem
solved af ter you
replace the
receiver?
End
N
Replace the
U701
Issue 01 (2014-04-01)

39
8.6 Call Sending Failure

Figure 8-8 Troubleshooting call sending failures
No voice can be sent
af ter a call is set up
Is the problem
sof tware?
Y
End
N
N
Is the MICBIAS voltage
1.8 V?
Check the
U201
Y
Is the problem
solved af ter you
replace the
microphone?
End
N
Replace the
U701
Issue 01 (2014-04-01)

40
8.7 Vibration Failure

Figure 8-9 Troubleshooting vibration failures
No vibration
Is the problem
sof tware?
Y
End
N
Y

af ter you replace the
motor?
End
N
Y
Is the VIB_DRV_N
voltage equal to
the battery voltage?
Check the U201
N
Check whether the voltage
dif f erence meets the
requirement f or the motor
operating voltage
Issue 01 (2014-04-01)

41
8.8 Ringtone Failure

Figure 8-10 Troubleshooting ringtone failures
No ringtone f or
incoming calls
N
Is the ringtone
End
Y
Is the problem
sof tware?
End
N
speaker?
Y
End
Is the FPC in good contact?
Re-crimp or
replace the
FPC
Is the problem solved af ter

you replace the volume key
sub-board?
End
N
Replace the
U701
Issue 01 (2014-04-01)

42
8.9 LCD Display Failure

Figure 8-11 Troubleshooting LCD display failures
No display on the LCD

af ter you re-load the
phone sof tware?
End
N
Y

af ter you disassemble the
phone can re-f asten the
LCD BTB connector?
End
N
LCD?
End
N
Is the to-ground-resistance
of T2001/T2002/T2003 is not 0 ohm?
Replace the
U201
N
Replace the
U301
Issue 01 (2014-04-01)

43
8.10 Key Failure

Figure 8-12 Troubleshooting key failures
Key failure
N
Clean or
replace the
key dome
sheets
Are the key dome

sheets in good
contact?
Y
Y
Is the problem
solved after you
replace the key
FPC?
End
N
Re-load the
phone
software
Issue 01 (2014-04-01)

44
8.11 No Sound Coming from the Headset During a Call

Figure 8-13 Troubleshooting procedure for no sound coming from the headset during a call
No voice can be heard f rom the

headset af ter a call is set up
N
Is the receiver
End
Y
Y

headset?
End
N
N
Is the headset
icon displayed
on the status bar?
Replace the
headset
connector
Y
Replace the
U701
Issue 01 (2014-04-01)

45
8.12 T-Flash Card Detection Failure

Figure 8-14 Troubleshooting T-Flash card detection failures
T-Flash card detection failure
Y
End

after you replace the
T-Flash card?
N
Y
Check whether any T-Flash
card slot pins are tilted
Replace the slot
N
Y
Replace the Z2302
End
Replace the U701
Issue 01 (2014-04-01)

46
8.13 GPS Signal Reception Failure

Figure 8-15 Troubleshooting GPS signal reception failures
GPS signal reception
failure
Is the GPS
antenna in good
contact with the
spring?
Replace the GPS

antenna or spring
Y
Y
Is the GPS channel
poorly soldered?
Re-solder or
replace the faulty
component
N
Re-load the
phone software
Issue 01 (2014-04-01)

47
Issue 01 (2014-04-01)

48
9 Functional Tests
Functional Tests
9.1 MMI Test

To enter the MMI test mode:
1. Insert the TF card and SIM card (no SIM card insertion is required if the SIM card is
integrated in the phone), install the battery, and power on the phone to enter the Home screen.
2. Enter *#*#2846579#*#* to drive the phone into MMI test mode. Press the volume down
key to start the test. You can touch the menu key to skip the current test or touch the back key
to return to the previous test.
No.
Item
Step
Content
Test Method
Insert the SD card and start a power-on test. If the SD card can
be detected, this item passes the test.
Testing the
SD card
Issue 01 (2014-04-01)
Test whether
the SD card
functions
properly.

49
No.
Item
Step
Content
9 Functional Tests
Test Method
If the battery is in-position, this item passes the test.
Checking
for the
battery
Check
whether the
battery is
in-position.
Press or touch all the keys. When a key is pressed or touched,

the color of the corresponding key displayed on the screen will
change. After all keys are tested, press the Volume down key to
start the next test.
Key test
Issue 01 (2014-04-01)
Test the keys.

50
No.
Item
Step
Content
9 Functional Tests
Test Method
Press the volume down key to display the white screen.
Press the volume down key to display the black screen.
White screen
4
LCD test
Blank screen.
Color screen
Press the volume down key to display triple color bars (red,
green, and blue).
Issue 01 (2014-04-01)

51
9 Functional Tests
No.
Item
Step
Content
Test Method
LCD
backlight
test
Test the LCD

backlight.
If the LCD backlight repeatedly turns on and off, the LCD

backlight is normal. Press the Volume down key to start the
next test.
Slide your figure along the touchscreen edges in a circle. The
route that your finger passes should turn red. Press the volume
down key to proceed.
Testing the
touchscreen
Test the
touchscreen.
Tri-color
indicator
test
Test the
tri-color
indicator.
The red, blue, and green indicator is lighted cyclically.
Testing the
rear camera
Test the rear

camera.
Touch the white frame until the white frame turns green. The
preview focus test is successful.
Issue 01 (2014-04-01)

52
No.
Item
Step
Content
Testing the
front camera
Test the front

camera.
9 Functional Tests
Test Method
Touch the red text position. If the flashlight turns on, this item
passes the test.
10
Flashlight
test
Issue 01 (2014-04-01)
10
Test the rear

camera
flashlight
function.

53
No.
Item
Step
Content
9 Functional Tests
Test Method
Place the light shielding plate approximately 4 mm above the
light hole. If the portrait icon changes to an in-call icon, the
function is normal.
11
Testing the
proximity
sensor
Issue 01 (2014-04-01)
11
Test the
proximity and
light sensor's
proximity
detection
function.

54
No.
Item
Step
Content
9 Functional Tests
Test Method
Check whether data of environmental light is detected. If yes,
the test is passed. When the test screen is displayed, orient the
phone front side to the light and block the light sensor using
your hand, the phone automatically detects the light changes
and determines whether the test item passes. If the test item
passes, the phone automatically proceeds to the next test item.
If the phone fails to detect the light changes after you tried
changing the light environment for the phone several times,
touch the menu key to confirm the light sensor failure.
12
Ambient
light test
12
Test whether
the ambient
light sensor is
functional.
The motor will vibrate intermittently. Press the Volume down

key to start the next test.
13
Testing the
motor
14
Testing the
speaker
Issue 01 (2014-04-01)
13
Test the
vibration
motor.
14
Test the
speakers.
Automatically test the speaker. (Do not insert the headset.) If

the speaker emits pleasant sound during the test, the test passes.
Press the volume down key to start the next test.

55
No.
Item
Step
Content
9 Functional Tests
Test Method
If the receiver plays the pre-stored audio file repeatedly, the test
item passes. Press the volume down key to proceed.
15
Testing the
receiver
15
Test the
receiver.
Touch Record. Speak to the microphone, and then touch Play.

If the microphone functions properly, you can hear the voice
recording from the receiver.
16
Main
microphone
test
Issue 01 (2014-04-01)
16
Test the main

microphone

56
No.
Item
Step
Content
9 Functional Tests
Test Method
Touch Record. Speak to the microphone, and then touch Play.
If the microphone functions properly, you can hear the voice
recording from the receiver. Test the secondary microphone and
headset in the same way. Press the Volume down key to start
the next test.
17
Microphone
loopback
test
17
Test the
microphone.
After a headset is inserted, the phone will search for and play an
FM channel. If you hear the program from the headset, the test
passes.
Press the Volume down key to start the next test.
18
FM test
19
Testing the
headset wire
control
function
Issue 01 (2014-04-01)
18
Test the FM
module
19
Test the
control-by-wi
re function of
the headset.
When the headset is inserted into the phone, the in icon on the
test screen turns green; when the headset is removed, the out
icon turns green. In this case, the test item passes. Press the
Volume down key to start the next test.

57
No.
Item
Step
Content
9 Functional Tests
Test Method
Automatically test the Bluetooth functions. During the test, the

phone will search for Bluetooth devices, and display the devices
that have been found. Press the Volume down key to start the
next test. (Note: This test requires another device with
Bluetooth enabled.)
20
Bluetooth
test
20
Test the
Bluetooth.
The LCD displays the current acceleration in the X, Y and Z

axes. If the phone can be placed in a position where the angles
between the phone and the X, Y and Z axes are 45 degrees, the
phone passes this test.
21
Tilt sensor
test
Issue 01 (2014-04-01)
21
Test the
gravity
sensing
function.

58
No.
Item
Step
Content
9 Functional Tests
Test Method
Automatically test the Wi-Fi functions. If the phone receives
Wi-Fi signals properly, it passes the test. Ensure that the phone
under test is within the coverage of a Wi-Fi hotspot.
22
Wi-Fi test
22
Test the
Wi-Fi
function.
If a SIM is inserted into the phone and functions properly, the

test item passes. Press the volume down key to view the test
results.
23
Testing the
SIM card
23
Test the SIM

card.
The MMI test is complete, and the test results are displayed on the LCD.
9.2 Wi-Fi Test

To ensure a normal network, place the mobile phone within 15 meters away from the AP, and
there must be no obstacle between the mobile phone and AP.
Issue 01 (2014-04-01)

59
9 Functional Tests
Step 1 Configure the AP properly. Power on the phone and place it within the AP's transmission
range.
Step 2 Tap Settings > WIRELESS&SETTINGS > WLAN > turn WLAN on, and enable network
notifications.
Step 3 After the phone automatically finds the AP's SSID, touch the SSID and enter the password to
establish a connection.
Step 4 Change the distance between the phone and AP and check the change of the Wi-Fi signal
strength.
Step 5 In the normal network, launch a browser and access a website to test the network quality.
Step 6 If no problems are found, finish the Wi-Fi test. If any problems are found, troubleshoot the
phone or send it to an advanced service site for repair.
----End
9.3 Voice Call Test

Step 1 Install a USIM card and battery on the mobile phone.
Step 2 Press the power key to power on the phone.
Step 3 Check whether the signal strength displayed on the LCD is normal.
Step 4 Make a call to a fixed-line phone, and check the voice quality during the call.
Step 5 If no problems are found during the test, finish the voice call test. If any problems are found,
troubleshoot the phone or send it to an advanced service site for repair.
----End
Issue 01 (2014-04-01)

60

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G630-U10

HUAWEI TECHNOLOGIES CO., LTD.

Copyright Huawei Technologies Co., Ltd. 2014. All rights reserved.

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Huawei Technologies Co., Ltd.

Huawei Industrial Base

Huawei Proprietary and Confidential

G630-U20 Simplified Maintenance Manual

About This Document

About This Document

Released the first

Huawei Proprietary and Confidential

G630-U20 Simplified Maintenance Manual

2 Product Overview ......................................................................................................................... 2

3 Exploded View and Components on the PCBA ...................................................................... 4

4 Software Upgrade ......................................................................................................................... 9

5 Maintenance Tools ...................................................................................................................... 20

Huawei Proprietary and Confidential

G630-U20 Simplified Maintenance Manual

8.4 Connection Failure Between the Phone and Computer .................................................................................. 38

Huawei Proprietary and Confidential

G630-U20 Simplified Maintenance Manual

1.1 Applicable Scope

1.2 Brief Introduction

1.3 How to Obtain Product and Maintenance Information

Huawei Proprietary and Confidential

G630-U20 Simplified Maintenance Manual

Huawei Proprietary and Confidential

G630-U20 Simplified Maintenance Manual

Table 2-1 G630-U10 specifications

Mobile phone model

About 155 g (including the battery)

UIM card interface

Two standard 6-pin UIM card slots

USB 2.0, high speeds of up to 480 Mbit/s

Capacity: 2000 mAh

5-inch HD display, 720x1280 resolution

Rear camera: 8 MP pixels; Front camera: 1 MP

Accelerator, proximity sensor, and ambient light sensor

Test the Bluetooth.

Bluetooth v2.1 + EDR

802.11b/g/n, Wi-Fi routing

100240 V, 50/60 Hz, 1 A

Operating temperature: 0C to +40C

Huawei Proprietary and Confidential

G630-U20 Simplified Maintenance Manual

3 Exploded View and Components on the PCBA

Exploded View and Components on the

3.1 Exploded View

Table 3-1 lists components in the exploded view.

Proximity sensor rubber

Front cover assembly

Huawei Proprietary and Confidential

G630-U20 Simplified Maintenance Manual

3 Exploded View and Components on the PCBA

Proximity sensor FPC

Proximity sensor support

CPU shielding cover

Side key FPC

Battery support assembly

Back cover assembly

Battery cover assembly

Two screws for fastening the battery steel plate

15 screws for fastening the phone

Crystal Unit,19.2MHz,7pF,+/-10ppm,70ohm,2.52.00.9mm,NTC internal,Terminal

Earphone Connector,12.666.74.2,6Pin,Arc,SMT,Reverse plate (pin inside plate