Hola1

A
H

Heatsinks for DIL-IC, PLCC and SMD

Heatsinks for SMD

particularly suitable for SMD components low profile reduced weight effective heat dissipation can be glued directly onto the component soudable versions customer specific versions on request special packaging like tape and real, bar magazin, tary etc. on request

G
art. no. Rth [K/W] 123 87 75 63 51 34 [mm] 5 8 10 13 17 22

ICK ICK ICK ICK ICK ICK

SMD SMD SMD SMD SMD SMD

A A A A A A

5 ... 8 ... 10 ... 13 ... 17 ... 22 ...

K
ICK ICK ICK ICK ICK

art. no. SMD SMD SMD SMD SMD B B B B B 5 ... 7 ... 10 ... 13 ... 19 ...

Rth [K/W] 56 47 35 29 22
... surface treatment SA=black anodised MI=solderable surface

[mm] 5 7 10 13 19

please indicate:

M
H

N
H

B 25

H Aluminium oxide wafers Mica wafers Kapton insulator washers Insulting clamping parts

E E E E

9 10 11 8 35

Profiles for PCB components Heatsinks for PCB SMD-heatsinks Profiles for PCB mounting

H A 89 A 87 B 25 27 A 87 108