1.1 Phm vi Ti liu ny miu t nhng iu kin u tin, c chp nhn v khng ph hp m c th quan st bn trong v bn ngoai board mch.

N i din cho s din gii trc quan ca nhng yu cu ti thiu c t theo c tnh board mch khc nhau. Nh l: IPC6010 series, ANSI/J-STD-003. 1.2 Mc ch Cc minh ho trong ti liu ny miu t nhng tiu chun c th m lin quan ti tiu d v mc nh ca mi trang, vi nhng miu t ngn gn v nhng iu kin c chp nhn v khng ph hp cho mi loi sn phm(xem mc 1.4-phn loi). Ch tiu cht lng nhm cung cp nhng cng c thch hp cho nhng nh gi bt thng c nhn thy. nh minh ho trong mi trng hp th lin quan ti nhng yu cu c th. Nhng c im c xc nh c th c nh gi qua vic quan st bng mt hay o t. c h tr bi nhng i hi thch hp ca ngi dng. Ti liu ny cung cp nhng tiu ch trc quan hiu qu m bo cht lng v sx .Ti liu ny khng th cha ng tt c nhng lin quan gp phi trong cng ngh mch in, v th, nhng thuc tnh khng c xc inh trong vn ny nn c s ng gia ngi dng v nh cung cp. Gi tr ca ti liu ny nm trong vic s dng n nh l 1 ti liu c s m c th c sa i , m rng theo nhng ng dng c th. y l ti liu dnh cho nhng yu cu nh nht chp nhn c m khng c dng nh mt quy trnh vn hnh trong vic sx board hay cung ng. Trong trng hp xung t xy gia nhng yu cu v quy trnh vn hnh. Nhng u tin sau c s dng: a. Chp nhn ti liu Cung ng board mch b. Quy trnh vn hnh thch hp c. c th chung d. Chp nhn board mch (IPC-A-600) Khi chp nhn hay t chi nhng quyt nh, nh rng vic duy tr nhng ti liu u tin Ti liu ny l 1 cng c gim st xem lm th no m 1 sn phm b lch do thay i trong qu trnh. Tham kho IPC-PC-90 1.3 Tip cn ti liu: Nhng c im c phn chia thnh 2 nhm: . Quan st bn ngoi ( vng 2.0 ) . Quan st bn trong ( vng 3.0 ) Tnh trng Quan st bn ngoi l nhng c th hay nhng h hng m c nhn thy trn b mt board. Chng hn nh l l r hay rp board, thc trng l 1 hin tng bn trong v c th c pht hin t bn ngoi. Tnh trng quan st bn trong l nhng c th hay nhng h hng m i hi phi c tit din ca mu vt hay nhng dng ca tnh trng pht hin v c lng.

Chng hn nh, nhng c th ny c th c nhn thy t bn ngoi v cn c tit din ca n thng qua nhng yu cu c chp nhn. Vt mu nn c chiu sng trong qu trnh nh gi cho hiu qu kim tra. S chiu sng khng nn c bng ph ln vng kim tra ngoi tr nhng bng c gy ra bi chnh mu vt. Tt nht nn chiu sng phn cc (quang) hay trng ti ngn cn s lo sng t vt liu phn quang cao 1.4 Phn loi Ti liu ny nhn ra rng,mc khng hon ho nhng chp nhn c ca nhng c th board c th c pht hin bi ln dng cui. V th, 3 loi chung c thnh lp da trn yu cu ch tiu ng tin, thit thc. Loi 1:sn phm in t chung : gm ngi tiu dng sn phm, 1 s my tnh v thit b ngoai vi ph hp vi nhng ng dng m v ngoi khng hon ho th khng quan trng, yu cu chnh l chc nng ca board mch. Loi 2: sn phm in t chuyn dng: gm thit b truyn thng, my mc tinh vi, cc trang thit bi, ni m i sng tinh thn ngy cng cao, v cho nhng dch v khng gin on c to ra, nhng khng phi tiu ch. Mt s sn phm c v ngoi khng hon ho c cho php Loai3: sn phm in t c tin cy cao: gm thit b v sn phm m thc hin tun t hay thc hin theo yu cu l rt quan trng. Thit b ngng hot ng khng th c dung th, v thit b phi hot ng khi yu cu, nh h tr i sng hay h thng iu khin bay. Board loi ny ph hp ng dng bo m mc cao v dch v th cn thit. Ch tiu trong ti liu ny c phn loi v th m sn phm board mch c th c xc nh theo 1 trong 3 loi. Vic dng 1 loi cho 1 c th, khng c ngha l tt c nhng c im khc phi p ng cng loi . S la chn nn da trn nhu cu ti thiu. Khch hng c trch nhim sau cng cho vic xc nh loi m sn phm c nh gi. V th, quyt nh chp nhn hay t chi phi da trn ti liu c p dng nh hp ng, ti liu cung ng, c im k thut, ti liu tiu chun v tham kho. 1.5 Nguyn tc chp nhn: Hu ht nhng hnh minh ho trong ti liu i din cho 3 mc cht lng cho mi c dim c th.nh, iu kin mc tiu, chp nhn v khng thch ng. Vn bn gm mi mc thit lp nguyn tc chp nhn cho mi loi sn phm iu kin mc tiu trong nhiu trng hp th gn nh l hon ho. Trong khi iu kin mong mun khng phi lc no cng t c, v c th khng cn thit m bo tin cy ca board trong mi trng dch v ca n Vic chp nhn c ch ra rng tnh trng c miu t, khng nht thit phi hon ho, vn s duy tr tnh ton vn v tin cy ca board trong mi trng dch v ca n. iu kin chp nhn c, c xem nh l chp nhn c cho t nht 1 hay nhiu loi

nhng khng cn thit cho tt c cc loi, theo quy nh lin quan n nguyn tc chp nhn. Vic khng ph hp ch ra rng, iu kin c miu t c th khng m bo tin cy ca board trong mi trng dch v ca n. iu kin khng ph hp c xem nh khng th chp nhn cho t nht 1 hay nhiu loi sn phm, nhng c th chp nhn cho nhng loi khc theo quy nh lin quan n tiu chun chp nhn. iu kin mc tiu, chp nhn c, v khng ph hp c miu t y v nguyn tc chp nhn lin quan ch nh i din cho nhng hot ng cng nghip in hnh. Yu cu nhng thit k sn phm c nhn c th i lch khi nhng tiu ch ny. Nhng v d th hin trong hnh minh ho i khi c cng iu ho to thm v khim khuyt r hn.. Mi quan h gia vn bn v v d th khng hon ton song hnh, tht kh thy nhng trng hp c th m lun gn lin nguyn tc chp nhn. Khi 1 bc nh hay ti liu cung ng khng ph hp vi tiu ch trong vn bn, th hy lm theo vn bn. Cng nn lu rng, vi hnh nh c dng c th c hn 1 loi tnh trng trn cng 1 mu. Ngi dng ti liu cn ch ti ch ca mi phn trnh nhm ln. Nn hiu rng, lp lun khng ph hp c a ra hm rng, tt c nhng tnh trng t nghim trng hn c th c chp nhn. V th, 1 tiu chun m nu ln tnh trng khng ph hp khi 50% b mt b n mn, v d, c nghi bt c th g t hn 50% b mt b n mn th c th c chp nhn cho c im trong loi . R rng s khng ph hp trong loi 1 hm khng ph hp trong loi 2,3, v tng t, s khng ph hp trong loi 2 hm ko ph hp 3. Mt kim sot vin khng nn chn loi no theo s kim sot. Khi chp nhn hay quyt nh khng ph hp, nhn thc v ti liu u tin phi c duy tr, v d, hp ng tiu biu, ti liu cung ng, ti liu tham kho. Trong mi trng hp, ti liu nn sn sng kim sot vin xc nh loi no chu s kim tra. Phng php v yu cu cho vic tin hnh kim tra trc quan m lin quan n ti liu ny nn ph hp vi nhng yu cu ca quy trnh vn hnh c th p dng Trong trng hp xung t, th t u tin sau nn c p dng: 1. 2. 3. 4. 5. Ti liu cung ng Ti liu cung ng phn nh yu cu chi tit ca khch hng Ti liu khc trong phm vi quy nh ca khch hng Quy trinh vn hnh hng mc cui nh dng IPC-6010 khi c dn ra bi KH Ti liu c th chp nhn ny

Board mch nn ng b cht lng v ph hp vi dng IPC-6010

Dng IPC-6010 thit lp nhng yu cu ti thiu cho board mch. Ti liu IPC-A-600 ny, nh 1 ti liu ng hnh v b sung, cung cp s din t bng hnh nh ca nhng ca nhng yu cu ny. IPC-A-600 c th c dng nh 1 ti liu h tr cho vic gim st. N khng xc nh tn s gim st trong tin trnh, hay tn s gim st sn phm cui. Cng khng phi l s lng nhng ch th khng ph hp trong tin trnh c th cho php, hay s lng cho php sa hoc lm li nhng h hng c xc nh S kim tra bng mt nhng tnh cht bn ngoi nn c tin hnh 1.75X(3 ip), nhng khim khuyt m khng r rng nn c xc inh bng cch phng i ln 40X. Nhng yu cu o c v khong cch hay rng ng mch i hi s phng i v thit b khc bao gm dng c chia hay li m cho php chnh xc theo kch thc xc nh. Giao c hay c im k thut cng i hi nhng phng i khc. Giam st bng mt nn ti thiu 1.75X v ti a 10X. M xuyn l nn c kim tra bn trong cho tnh ton vn lp m mc phng i 100X. Kt qu k thut gim st t ng(AIT) nn mc 200X .AIT c th c p dung c lng nhiu im kch thc c minh ho trong ti liu ny. Tham kho IPC-AI-642, Users Guidelines for Automated Inspection of Artwork,Innerlayers and Unpopulated PWBs 1.6 Tham kho Ti liu sau y l 1 phn ca ti liu ny v phm vi quy nh y. S sa i ti liu c hiu lc ti thi im cng b nn c u tin J-STD-003 Solderability Tests for Printed Boards IPC-T-50 Terms and Definitions for Interconnecting and Packaging Electronic Circuits IPC-9191 General Requirements for Implementation of Statistical Process Control. IPC-D-325 Documentation Requirements for Printed Boards. IPC-QE/CD-605 Printed Board Quality Evaluation Handbook IPC-AI-642 Users Guidelines for Automated Inspection of Artwork, Innerlayers, andUnpopulated PWBs IPC-SM-782 Surface Mount Design and Land Pattern Standard IPC-TM-650 Test Methods Manual 2.1.1 Microsectioning, Manual Method 2.2.2 Optical Dimensional Verification 2.2.7 Hole Size Measurement, Plated 2.2.11 Registration, Terminal Pads (Layer to Layer) 2.5.4 Current Carrying Capacity, Multilayer Printed Wiring 2.5.7 Dielectric Withstanding Voltage, PWB 2.5.16 Shorts, Internal on Multilayer Printed Wiring 2.6.10 X-Ray (Radiography), Multilayer Printed Wiring IPC-SM-840 Qualification and Performance of Permanent Polymer Coating (SolderMask) for Printed Boards IPC-2220 Series of Design Standards for Printed Boards IPC-6010 Series of Performance Specifications for Printed Boards

1.7 Kch thc v dung sai Tt c kch thc v dung sai c quy nh y ch c p dng cho sn phm cui. Kch thc c th hin bng mm. Thng tin tham kho biu th trong du ngoc n(). 1.8 iu khon v nh ngha iu khon v nh ngha ph hp vi IPC-T50 1.9 Tay ngh Mch in sx theo yu cu ca ti liu ny nn c thc hin ng nh vy, thng nht v cht lng, v ngn nga s xm nhp ca bi, tp cht, du, du tay, cn b, nhng cht gy hi khc m c th nh hng n i sng hay cht lng sn phm. Mch in c ni lng nhng khim khuyt vt qu nhng cho php bi ti liu ny. S chp nhn khim khuyt ca ti liu ny da trn s ng gia ngi dng v nh cung cp sn phm.

2.0 c im c th quan st bn ngoi Gii thiu Phn ny cp n nhng c im m c th quan st trn b mt. Nhng c im bn trong v bn ngoi mch in nhng c th thy t b mt nh: . Khim khuyt b mt nh: g, kha, xc, ct si, kiu an, l r . Khim khuyt bn di b mt nh tp cht, si/vn rn, phn lp, vnh hng, r lp . Khim khuyt pad hn nh: mt kt dnh, gim chiu rng hay dy pad bi kha, l nh, xc, khuyt ph v m b mt . c im l nh ng knh, lch l, vt liu ngoi, khuyt ph v m . Ghi k t bt thng gm v tr, kch c, d c v chnh xc . Khuyt vic ph ko ch nh lch, rp, ni bong bng, phn lp, kt dnh, b dy v hu hoi vt l. . c im kch thc gm kch thc v b dy board mch, kch thc l v pad., khong cch v rng mch, vnh ai ng 2.1 Cnh board Khim khuyt nh g, kha, qung dc theo cnh board th c chp nhn min l chng khng vt qu gii hn bn di. 2.1.1 G G c nhn thy bi nhng nt hay khi nh vi hnh dng khng u, li ln b mt, l kt qu ca qu trnh lm trn my nh khoan hay khot.

2.1 CNH BOARD

2.1.1.1 G phi kim:

iu kin t lp 1,2,3 . Phng - khng g

C th chp nhn lp 1,2,3 . G g nhng khng sn

Khng ph hp lp 1,2,3 . Sn vi cc g xp . Cc g nh hng n s va vn v chc nng

2.1 CNH BOARD

2.1.1.2 G kim loi:

iu kin t lp 1,2,3 . Phng, khng g

C th chp nhn lp 1,2,3 . G g nhng khng sn

Khng ph hp lp 1,2,3 . Sn vi cc g xp

2.1 CNH BOARD

2.1.2 Kha (nc)

iu kin t lp 1,2,3 . Phng, khng kha

C th chp nhn lp 1,2,3 . Cnh g g nhng khng sn . Nhng kha khng xm nhp hn 50% khong cch n vng dn in hoc l thp hn 2.5mm(0.0984 in)

Khng ph hp lp 1,2,3 . Nhng kha vt qu 50% cho php t cnh board n vng dn in hoc l thp hn 2.5mm (0.0984 in) . Cnh sn

2.1 CNH BOARD

2.1.3 Qung

iu kin t - lp 1,2,3 . Khng qung sng

C th chp nhn - lp 1,2,3 . S xm nhp ca qung sng t hn 50% khong cch t cnh board n vng dn in gn nht, hoc l thp hn 2.5mm (0.0984 in)

Khng ph hp - lp 1,2,3 . S xm nhp ca qung sng t hn 50% khong cch t cnh board n vng dn in gn nht, hoc l thp hn 2.5mm (0.0984 in)

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2.2 Vt liu c bn Gii thiu Vic xc nh nhng khim khuyt: Phn ln nhng rc ri tn ti trong cng ngh lin quan n vic xc nh nhng khim khuyt m tn ti trong phn lp nh. gip xc nh nhng tnh trng , tham kho nhng hnh nh minh ho c nh ngha 1 cch chnh xc sau y: B mt 2.2 . Kiu dt l sng 2.2.1 . Kiu dt kt cu 2.2.2 . Kiu si tip xc/b ph v 2.2.3 . Nhng ch lm v rng 2.2.4 Di b mt 2.3 . Dng si 2.3.1 . Dng vn 2.3.2 . Dng phn lp/rp 2.3.3 . Tp cht 2.3.4 Cn lu rng tnh trng khim khuyt phn lp c th tn ti khi nh ch to tip nhn vt liu t my p, hoc c th tr nn r rng trong qu trnh ch to board. Mt vi khim khuyt c th c nhn thy trong sut qu trnh. The Use of Acceptability Criteria Mi ngi khng th l 1 chuyn gia xc nh khim khuyt. Mt vi tiu ch trc quan c nh phi c thit lp h tr vic quyt nh theo mc chp nhn c

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2.2 B MT VT LIU C BN

2.2.1 Weave Exposure

Mt tnh trng ca b mt cht liu m nhng si lin tc theo kiu dt vi th khng hon ton c ph bi nha thng

C th chp nhn - lp 1,2,3 . Gm nhng khu vc l sng, m khong cch duy tr gia nhng vng dn in phi p ng yu cu ti thiu ca chng Khng ph hp - lp 1,2,3 . Gm nhng khu vc l sng, m khong cch duy tr gia nhng vng dn in t hn khong cch c yu cu

12

2.2 B MT VT LIU C BN

2.2.2 Weave Texture

Mt tnh trng trn b mt cht liu m thy r dng dt vi, mc d nhng si dt lin tc th b bao ph bi nha thng C th chp nhn - lp 1,2,3 . Kiu dt kt cu l mt tnh trng c th chp nhn trong mi loi nhng i khi b nhm ln vi kiu l sng ( weave esposure) bi s xut hin ca n.

Th d ny c th l weave exposure hoc weave texture. S khc nhau khng th c pht hin t quan im ny. S khc nhau c th c phn bit bng vic dng nhng kim nghim vng vng (s chiu sng xin vi knh hin vi) hoc vi mu.

13

2.2 B MT VT LIU C BN

2.2.3 Si l sng/t on
C th chp nhn - lp 1,2,3 . Nhng si l sng hay t on khng bt ngang cht dn in, v khng lm gim khong cch gia vng dn in xung di mc cho php Khng ph hp . Nhng si l sng hay t on bt ngang cht dn in, v lm gim khong cch gia vng dn in xung di mc cho php

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2.2 B MT VT LIU C BN

2.2.4 L r

iu kin t - lp 1,2,3 . Khng l r

C th chp nhn - lp 1,2,3 . Nhng l r khng vt qu 0.8mm (0.031 in) . Khu vc board b nh hng th t hn 5% c 2 bn . L r khng bt ngang vng dn in

Khng ph hp - lp 1,2,3 . Nhng l r vt qu 0.8mm (0.031 in) . Khu vc board b nh hng th vt qu 5% c 2 bn . L r bt ngang vng dn in

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2.3 Bn di b mt vt liu c bn Gii thiu Phn ny tp trung vo tnh trng bn di b mt ca vt liu p lp m c th quan st bn ngoi thng qua chnh cht liu v vic ph sn. Phn ln tnh trng ny l ni si, vn, tch lp, rp, v tp cht. Nhng tnh trng ny c th c quan st trong sut qu trnh sx v gim st nh: . Trong qu trnh nh gi cht liu trng kim sau khi c sx bi my p . Bi nh sx sau khi n mn chun b chi tit innerlayer cho board nhiu lp . Sau khi n mn nhng lp ngoi board thnh nhng dng dn in v du hiu c yu cu . Sau khi sy (nh ph sn hay in ch) . Sau khi shock nhit, nh ph/ ln ch, hay qu trnh kim tra hn ch Nhng tnh trng ny va l ch tho lun ln trong cng ngh mch in vi thp k qua. Mt vi tnh trng nh si, vn tip tc gy ra nhiu lo ngi nht . V n cng l ch chnh ca IPC Blue Ribbon Committees. Sau y l nhng tm tt ngn gn v bnh lun t IPCs Blue Ribbon Committee. . V tnh trng ni si: U ban tin hnh kho st rng ri v tnh trng trn v di b mt vt liu mch in vi vic tp trung chnh v ni si. IPCs Measles in Printed Wiring Boards,Information Document c thnh lp 1973 nh l kt qu ca nh hng ny. U ban va thu thp nhiu d liu c sn v tnh trng ni si v nhng tnh trng trn/ di b mt khc, cng nh vic chun ho nhng iu khon, nh ngha (miu t), hnh nh minh ho tnh trng. Cm thy rng nhng nghin cu y bng cng ngh v measles c th c chun b. Khuyn ngh ca U ban th nh sau: xem xt li ton din vn bn, nghin cu, d liu kim tra sn c, trong khi m s ni si b phn i v tnh thm m, m t nh hng n nhng c im ca chc nng sn phm , th khng ng k Li bnh: Mc d d liu v khuyn ngh ca U ban vn cn s min cng ca a s chnh ph v doanh nghip chp nhn rng s ni si l 1 tnh trng mang tinh thm m m khng nh hng n chc nng trong vic ng dng. Hu ht cng ty tip tc duy tr yu cunomeasling trong thng s k thut ca h. Nhng khi nhng nt si hay tnh trng khng ph hp nh hng nghim trng n k hoch sx ca h, khch hng hay c quan c chp nhn s xut bn 1 ti liu m thit lp nhng phng hng c th chp nhn v si ( v nhng tnh trng thng xuyn khc). ng hng mi ny da trn kch c, xc sut gim khong cch gia vng dn in, v s khu vc b nh hng. Chng thay i theo tng khch hng. Khi k thut pht trin, nh hng ca si v nhng tnh trng khc mt ln na tr thnh vn nghim trng. Kt qu l, IPC Blue Ribbon Committee on Measles th hai c hnh thnh. Tm tt: U ban c hnh thnh cui nhng nm 1978. U ban ny xem xt kt qu ca ln u, trng cu cng nghip cho d liu b sung, v xem xt tiu chun c quyn c cung cp bi thnh vin IPC. The Second Blue Ribbon Committee i n cng 1 kt lun. Measles ch mang tnh thm m, v hu nh khng c bo co no v nh hng ca n n chc nng sn phm trong phn ln ng dng. Ngoi tr

16

ng dng p cao. Vn cn s min cng chp nhn measles cua vi t chc v cong ty cong nghip. V th, 1 b nhng yu cu v si/ rn c thit lp m c s ng thun t tt c thnh vin IPC. Kt qu l xut hin 1 ma trn nhng gii hn c th chp nhn trong 3 giai on chnh ca qu trnh lp rp board: vt liu nhiu lp, kim tra cui board mch, v sau khi lp rp board. Nhng yu cu ny bao gm t l gim khong cch vng dn in (khng vt qu khong cch ti thiu), v s vng ni si trn mi mt ca board mch da trn Class of product. Nhng yu cu ny c thm vo nh 1 s b sung ti IPC-A-600 Bnh lun: nhng lo ngi chnh c ni ti bi nhng c nhn min cng chp nhn th c tm tt sau: . in tr, c v lng v b mt- vi bo co v d liu kim tra c sn ch ra rng in tr khng b nh hng bi si hay rn. . S nhim l vt liu ion ho c th b khuych tn hoc b pumped ( bi chnh lch p sut kh quyn) vao si hay rn v s cho kt qu l in tr thp hn, hoc s pht trin thnh nhng tm catod-anod, ngn. Th nghim phun mui ch ra rng, y khng phi l gi thuyt ng, v hu nh nhng vt liu ion ho (nh mui) s khng khuychs tn v vt liu . in p ng dng - ng dng p cao th lin quan n bn in mi th suy gim 2050% so vi nhng vng nonmeasled/crazed (ni m c th pht h quang measling or crazing), c bit cao ln hn 20km (12.43 dm) so vi mc nc bin. . Mi trng phn ln measling/crazing khng xut hin gia tng kch c hay xy ra do th nghim mi trng. IPC-A-600, sa i E, l sa i u tin phn nh b mt k thut thit b nh v. Nh vy, cc yu cu c chp nhn v measling/crazing thi tch ri nhau. For measles, nhng yu cu chp nhn cho php chuyn tip bn di b mt vng dn. iu ny c thc hin da trn nhng nh ngha, d liu th nghim, v kinh nghim m cha tng c ghi chp gy ra nhng sai lch v chc nng. Rn l s tch ri t b kim sot hn trong vt liu, hnh thnh mi lin kt gia si v v vng dn gn k, cc yu cu chp nhn v rn th c t cng tnh trng phn lp v rp. Trong 1 khong thi gian, vic qun l thng s k thut tr nn qu kh trong vic bo v s hin din ca measles. Thm vo , tnh thm m li tr thnh tiu chun chnh. Trn thc t, khng c li no m tng c gn vi si, da trn tt c nhng th nghim cng nghip v qun s ti nay. IPC, c quan cng nghip v qun s khc nhau tin hnh th nghim di iu kin mi trng khc nghit trong thi gian di m khng c bng chng ca s tin trin , ly lan, hay gy thit hi n chc nng. Measles khng nn l nguyn nhn t chi.

17

18

2.3 BN DI B MT VT LIU C BN

2.3.1 Ni si
Measling: Measling biu hin di dng nhng hnh vung trng ri rc hay vt ngang bn di b mt vt liu, v n thng lin quan ti nhit. Measles la hin tng bn di b mt m c tm thy trong vt liu mi p v trong mi loi board lm t si dt lc ny hay lc khc.

C th chp nhn - lp 1,2,3 . Measles th c chp nhn cho tt c sn phm, ngoi tr ng dng cao p

Ghi ch: Measles c quan st t b mt, nh trn ch c tnh minh ho

19

2.3 BN DI B MT VT LIU C BN

2.3.2 Nt
Mt tnh trng ni ti xy ra trong vt liu p lp m trong cc si trong b si th tch ri nhau. iu ny c th xy ra nhng nt dt hay dc theo chiu di b si. Tnh trng ny biu hin r di dng kt ni nhng im trng hay du gch bn di b mt vt liu, v n thng lin quan ti c hc. Khi nhng du gch c kt ni, tnh trng c nh gi nh sau:

iu kin t - lp 1,2,3 . Khng c du hiu nt

C th chp nhn - lp 2,3 . Khim khuyt khng suy gim khong cch gia nhng vng dn in xung di mc cho php. . Vng rn khng lan ra hn 50% khong cch gia nhng vng dn in lin k. . Khng c s lan rng no l kt qu ca th nghim nhit thay th qu trnh sn xut . Rn cnh board khng suy gim khong cch nh nht gia cnh v vng dn in, hoc 2.5mm (0.0984 in) nu khng quy nh C th chp nhn - lp 1 . Khim khuyt khng suy gim khong cch gia nhng vng dn in xung di mc cho php. . Vng rn lan ra hn 50% khong cch gia nhng vng dn in, nhng khng ni gia nhng vng dn . Khng c s lan rng no l kt qu ca th nghim nhit thay th qu trnh sn xut . Rn cnh board khng suy gim khong cch nh nht gia cnh v vng dn in, hoc 2.5mm (0.0984 in) nu khng quy nh 20

2.3 BN DI B MT VT LIU C BN

2.3.3 Phn lp/ phng rp

S phn lp: l s tch ri gia nhng lp trong vt liu, gia nn vt liu v nn dn in, hay bt c s tch ri theo mt phng trong board. Rp: l s phn lp di dng phng rp cc b v tch ri gia bt k lp no ca vt liu p, hay gia nn vt liu v nn dn in, hay ph bo v. iu kin t - lp 1,2,3 . Khng phn lp hay phng rp

C th chp nhn - lp 2,3 . Khu vc b nh hng khng vt qu 1% trn mi mt board . Khim khuyt khng suy gim khong cch gia nhng vng dn in xung di mc cho php. . Vng rp hay phn lp khng lan ra hn 25% khong cch gia nhng vng dn in lin k . Khng c s lan rng no l kt qu ca th nghim nhit thay th qu trnh sn xut . Khng st mp board hn khong cch nh nht c quy nh gia mp board v vng dn in, Ghi ch: din tch b nh hng bng tng din tch hoc 2.5mm (0.0984in) nu khng quy nh. khim khuyt chia cho tng din tch board. Xc nh trn mi mt board C th chp nhn - lp 1 . Khu vc b nh hng khng vt qu 1% trn mi mt board . Vng rp hay phn lp lan ra hn 25% khong cch gia nhng vng dn in, v khng suy gim khong cch gia nhng vng dn in xung di mc cho php . Khng c s lan rng no l kt qu ca th nghim nhit thay th qu trnh sn xut . Khng st mp board hn khong cch nh nht c quy nh gia mp board v vng dn in, hoc 2.5mm (0.0984in) nu khng quy nh.

21

2.3 BN DI B MT VT LIU C BN

2.3.4 Tp cht
Ngoi vt: kim loi hay phi kim, m c th b dnh hay nhng vo vt liu cch in. Ngoi vt c th c tm thy trong lp th, giai on B, hoc quy trnh board nhiu lp. Chng c th dn in hay khng dn in, c 2 loi c th khng ph hp tu thuc kch c v v tr. iu kin t - lp 1,2,3 . Khng c tp cht

C th chp nhn - lp 1,2,3 . Ht m b kt trong board . Ht m c b kt trong board a/ kch c 0.125mm (0.004921) hoc hn t vng dn in gn nht b/ Ht khng suy gim khong cch gia nhng vng dn in lin k xung di mc cho php theo ti liu cung ng, hoc 0.125mm (0.004921in) nu khng quy nh. . Thng s v in ca board th khng b nh hng

Khng ph hp - lp 1,2,3 . Thng s v in ca board b nh hng . Cc ht m c b kt trong board khng ph hp nu: a/ Ht gn hn 0.125mm (0.004921 in) ti vng dn in gn nht b/ Ht lm suy gim khong cch vng dn in xung di mc cho php.

22

2.4 PH CH

2.4.1 Khng thm t

iu kin t - lp 1,2,3 . Khng c hin tng khng thm t

Khng ph hp - lp 1,2,3 .Hin tng khng thm t trn bt k b mt dn in ni m ch hn khng vo c bi s ngn cn hoc s hon thnh ca cc lp m khc.

23

2.4 PH CH

2.4.2 Mt thm t
iu kin t - lp 1,2,3 . Khng c hin tng mt thm t

C th chp nhn - lp 2,3 (A) . Trn cht dn in v t hoc cc mt in p. . 5% hoc t hn mi vng nn cho cc kt ni hn. C th chp nhn - lp 1 (B) . Trn cht dn in v t hoc cc mt in p. . 15% hoc t hn mi vng nn cho cc kt ni hn.

Khng ph hp - lp 1,2,3 . Li vt qu cc tiu chun trn

24

2.5 M XUYN L - TNG QUT

2.5.1 Nt/g
iu kin t - lp 1,2,3 . Khng c nt hay g

C th chp nhn - lp 1,2,3 . ng knh l ti thiu c p ng.

Khng ph hp - lp 1,2,3 . ng knh l ti thiu khng c p ng.

25

2.5 M XUYN L - TNG QUT

2.5.2 Vnh hng

C th chp nhn - lp 1,2,3 . Khng c du hiu no cho thy vnh hng nh hng n chc nng. S xut hin ca chng c th xem nh l 1 ch th quy trnh.Tp trung quan tm nn l cht lng ca s lin kt tch lp, quy trnh lm sch v iu ho

26

2.5 M XUYN L - TNG QUT

2.5.3 M ng l r
iu kin t - lp 1,2,3 . Khng l r C th chp nhn - lp 3 . Khng c du hiu ca l r

C th chp nhn - lp 2 . Khng nhiu hn 1 l r trong bt k l khoan no . Khng nhiu hn 5% nhng l khoan b l r . L r khng hn 5% chiu di l khoan . L r t hn 90o ca chu vi l khoan

C th chp nhn - lp 1 . Khng nhiu hn 3 l r trong bt k l khoan no . Khng nhiu hn 10% nhng l khoan b l r . L r khng hn 10% chiu di l khoan . L r t hn 90o ca chu vi l khoan

Khng ph hp - lp 1,2,3 . Vt qu nhng tiu chun trn

27

2.5 M XUYN L - TNG QUT

2.5.4 M l r - ph sn
iu kin t - lp 1,2,3 . Khng l r

C th chp nhn - lp 3 . Khng nhiu hn 1 l r trong bt k l khoan no . Khng nhiu hn 5% nhng l khoan b l r . L r khng hn 5% chiu di l khoan . L r t hn 90o ca chu vi l khoan C th chp nhn - lp 2 . Khng nhiu hn 3 l r trong bt k l khoan no . Khng nhiu hn 5% nhng l khoan b l r . L r khng hn 5% chiu di l khoan . L r t hn 90o ca chu vi l khoan C th chp nhn - lp 1 . Khng nhiu hn 5 l r trong bt k l khoan no . Khng nhiu hn 15% nhng l khoan b l r . L r khng hn 10% chiu di l khoan . L r t hn 90o ca chu vi l khoan

28

2.6 NHNG L KHNG PH HP

2.6.1 QUNG
QUNG: c hc gy ra nt hay phn lp trn hoc di b mt vt liu, 1 vng sng xung quanh l, nhng vng gia cng khc hoc c hai, thng l du hiu ca qung. Xem mc 2.1.3

iu kin t - lp 1,2,3 . Khng c qung hay phn lp ngay mp

C th chp nhn - lp 1,2,3 . S xm nhp ca qung hay mp phn lp khng lm suy gim t mp l ti vng dn in gn nht vi hn 50% m c quy nh, hoc hn 2.5mm (0.0984 in) nu khng c quy nh

Khng ph hp - lp 1,2,3 . S xm nhp ca qung hay mp phn lp lm suy gim t mp l ti vng dn in gn nht vi hn 50% m c quy nh, hoc hn 2.5mm (0.0984 in) nu khng c quy nh

29

2.7 CHN CM

2.7.1 M b mt tng qut

iu kin t - lp 1,2,3 . Cc tip xc khng b so, r v khng to ht b mt. - Phn ng/phn m l ra khng vi phm gia vng kt thc mi hn hoc solder mask vi u mt. - Yu cu gc cnh: trn tru, khng g, khng gy gp, khng b bung lp m cc vng tip xc, khng tch lp ra khi cht liu pcb. Khng c hin tng trc si cc gc vt. Cho php l ng u cui vng tip xc. C th chp nhn - lp 1,2,3 . B mt c li nhng khng l phn kim loi vng tip xc c ch nh. - Vng tip xc khng c cc m hn hoc m thit-ch ln vo. - Cc nt g kim loi trong vng tip xc khng nh ra khi b mt. - Cc vt so, vt m hoc ch lm khng vt qu 0.15 mm i vi kch thc di nht ca chng. Khng tn ti qu 3 li trn mt tip xc v khng c xut hin qu 30% trn tng s cc tip xc. C th chp nhn - lp 3 . Khong ln ca phn m/phn ng l ra nh hn hoc bng 0.8mm. C th chp nhn - lp 2 . Khong ln ca phn m/phn ng l ra khng vt qu 1.25mm C th chp nhn - lp 1 . Khong ln ca phn m/phn ng l ra khng vt qu 2.25mm. Khng ph hp - lp 1,2,3 . Cc li vi phm cc tiu chun trn.

30

2.7 CHN CM

2.7.2 G trn cnh chn cm

C th chp nhn - lp 1,2,3 . Tnh trng ng vin b mt in mi hi khng phng. Khng c s tch ri lp m hay im tip xc mch in khi vt liu.

Khng ph hp - lp 1,2,3 . Tnh trng cnh khng u, g gh, g, im tip xc nh ln

31

2.7 CHN CM

2.7.3 dnh m
C th chp nhn - lp 1,2,3 . bm dnh tt. Khng bong m

Khng ph hp - lp 1,2,3 . bm dnh km.

Ghi ch: bm dnh nn c kim tra da theo IPC-TM-650, pp 2.4.1, dng 1 bng keo dn trc din ln b mt tip xc pad hn, ri g ra. Nu kim loi t v dnh ln bng keo, l bng chng cho vic nh ln hay trc ra,

32

2.8 GHI DU

GII THIU
Phn ny cha tiu chun c chp nhn v vic ghi du mch in. Vic ghi du cung cp phng tin xc nh v h tr lp rp. Du hiu trn kim loi ni chung s suy bin trong qu trnh hn hay mi trng lm sch nghim ngt. Vi th khng nn in trn kim loai. Nhng khi c yu cu, du hiu c khc l tt nht. Nhng yu cu ti thiu c quy nh trong ti liu cung ng. Nhng th d ghi du c xc nh phn ny l:

33

2.8 GHI DU

2.8.1 Tng qut

Tiu chun c bn cho tt c nhng du hiu th ging nhau. Sau y l nhng tiu chun c chp nhn. iu kin t - lp 1,2,3 . R rng tng k t . Cc biu tng phn cc v nh thi d c . K t sc nt v ng b . Vng rng trong nt ch khng b ph y (0,6,8,9,A,B,D,O,P,Q,R).

C th chp nhn - lp 1,2,3 . ng nt ca 1 s hay k t b t nhng vn c c . Vng rng trong nt ch b ph y nhng vn c c v khng th nhm ln vi k t hay s khc.

Khng ph hp - lp 1,2,3 . Nt ch b mt hay khng th c. . Vng rng trong nt ch b ph y v khng th c c, hoc b mt . Nt ch m, t, hay mt ti mc khng th c.

Khng ph hp - lp 1,2,3 . Mc d c th chp nhn dn nhn trn nhng phn panels b, chng khng c cho php trn board mch hon thin. Vic khc du, dn nhn, bt k du hiu m ct vo g th c x l trong cng 1 cch thc l b.

34

2.8 GHI DU

2.8.2 Khc du
Vic khc du c lm tng t nh nhng vng dn in trn board mch in. V th , nhng tiu ch sau nn c p ng. iu kin t - lp 1,2,3 . p ng tiu chun chung (phn 2.8.1) . Yu cu khong cch dn in ti thiu cng c p dng gia k t c khc v vng dn in

C th chp nhn - lp 3 .Khim khuyt c th c chp nhn bt k gy ra kt qu no nh hn bc cu, n mn qu l)min l p ng tiu chun chung (phn 2.8.1) . Khng vi phm gii hn khong cch v in. . Nt ch n mn c th hi bt thng. C th chp nhn - lp 2 .Khim khuyt c th c chp nhn bt k gy ra kt qu no nh hn bc cu, n mn qu l)min l p ng tiu chun chung (phn 2.8.1) . Khng vi phm gii hn khong cch v in. . rng nt ch c th suy gim 50%, min l c c

C th chp nhn - lp 1 .Khim khuyt c th c chp nhn bt k gy ra kt qu no nh hn bc cu, n mn qu l)min l p ng tiu chun chung (phn 2.8.1) . Khng vi phm gii hn khong cch v in. . K t bin dng nhng nhn chung, ni dung vn c th thy r.

Khng ph hp - lp 1,2,3 . Khng p ng nhng yu cu bn trn.

35

2.8 GHI DU

2.8.3 In mc hay dn nhn

Ni n bt k loi du hiu no m c in ln mt trn ca board. Khng bao gm vic khc hay n mn. iu kin t - lp 1,2,3 . p ng tiu chun chung. (phn 2.8.1) . Phn b mc ng b, khng nho, hay chng nh . Mc in tin st mp ng

C th chp nhn - lp 3 . p ng tiu chun chung. . Mc c th nho ra nt ch nhng vn c c.

C th chp nhn - lp 2 . p ng tiu chun chung. . Mc c th nho ra nt ch nhng vn c c. . ng nt biu tng nh thi c th mt 1 phn nhng vn r rng . Mc ghi du khng xm phm vo chn cm linh kin hay lm gim vnh khuyn

C th chp nhn - lp 1 . p ng tiu chun chung. . Mc c th nho ra nt ch nhng vn c c. . ng nt biu tng nh thi c th mt 1 phn nhng vn r rng . Mc ghi du khng xm phm vo chn cm linh kin hay lm gim vnh khuyn . Du hiu c th m, khng r nt, nhng vn c c . Chng nh m vn c th c c

36

2.9 SOLDER RESIST (Solder Mask)

Gii thiu
Thut ng Solder Resist v Solder Mask thng dng khi ni ti bt k loi vt liu ph polyme vnh cu hay tm thi. Thut ng c dng trong ti liu ny nh l thut ng chung khi ni n bt k vt liu ph polyme vnh cu no trn board mch. Solder resists c dng gii hn v kim sot khu vc c hn ch trn board. N cng dng gii hn v kim sot b mt nhim bn(x) trn board trong qu trnh hn hay nhng hot ng sau ny, v i khi c dng lm gim s pht trin si hnh gai gia nhng vng dn in trn b mt vt liu. Thng tin chi tit i vi yu cu solder resists cha trong IPC-6012 and IPC-SM-840.

37

2.9 SOLDER RESIST (Solder Mask)

2.9.1 Ph trn vng dn

iu kin t - lp 1,2,3 . Khng b st, r, rp, lch, l ra.

C th chp nhn - lp 1,2,3 . Dy dn kim loi khng l ra hay ni tip do rp ni ph solder . Vng cha nhng dy dn song song, lin k khng c l ra, ngoi tr khong trng gia nhng vng d nh khng ph . ????

Khng ph hp - lp 1,2,3 . Dy dn l ra . Dy dn bt ngang do rp . Nhng dy dn lin k, song song b l ra

38

2.9 SOLDER RESIST (Solder Mask)

2.9.2 Trung tm l

iu kin t - lp 1,2,3 . Khng b lch. Ph ngay trung tm, xung quanh pad

C th chp nhn - lp 1,2,3 . Lch pad, nhng khng vi phm yu cu vnh trn . Khng ph vo l m, ngoi tr khng nh hn . Vng dn in lin k c cch li th khng b l ra

Khng ph hp - lp 1,2,3 . Lch m vi phm yu cu . Ph vo l lp linh kin . Vng dn in cch li b l ra

39

2.9 SOLDER RESIST (Solder Mask)

2.9.3 cc vng mch c khai bo solder mask

iu kin t - lp 1,2,3 . Ch c solder mask vng c khai bo.

C th chp nhn - lp 1,2,3 . Solder mask lch v tr xc nh, nhng khng l ra nhng vng dn in lin k . Khng tn ti solder mask ln ra cnh board hay im test. . Trn mt ng mch rng hn 1.25mm, lch solder mask ch xut hin trn mt mt nhng khng vt qa 0.05mm. . Trn mt ng mch rng di 1.25mm, lch solder mask ch xut hin trn mt mt nhng khng vt qu 0.025mm Khng ph hp - lp 1,2,3 . Tn ti solder mask ln ra cnh board hay im test. . Trn mt ng mch rng hn 1.25mm, lch solder mask xut hin trn hai mt hoc vt qa 0.05mm. . Trn mt ng mch rng di 1.25mm, lch solder mask xut hin trn hai mt hoc vt qu 0.025mm

40

2.9 SOLDER RESIST (Solder Mask)

2.9.3.1 M

iu kin t - lp 1,2,3 Ph ln trung tm xung quanh pad C th chp nhn - lp 1,2,3 ????

41

2.9 SOLDER RESIST (Solder Mask)

2.9.3.2
iu kin t - lp 1,2,3 Ph ln trung tm xung quanh pad c khong cch C th chp nhn - lp 1,2,3 ????

42

2.9 SOLDER RESIST (Solder Mask)

2.9.3.3 Ball Grid Array (Solder Dam)

iu kin t - lp 1,2,3 Ph ln trung tm xung quanh pad v via c khong cch C th chp nhn - lp 1,2,3 ????

43

2.9 SOLDER RESIST (Solder Mask)

2.9.4 Phng / phn lp

iu kin t - lp 1,2,3 . Khng rp, ni bong bng, phn lp gia ni ph solder, vt liu, vng dn

C th chp nhn - lp 2,3 . Mi mt khng vt qu 0.25mm (0.00984in) theo kch thc ln nht . Suy gim khong cch v in khng vt qu 25% C th chp nhn - lp 1 . Rp, ni bong bng, phn lp khng ni gia nhng vng dn in

Khng ph hp - lp 2,3 . Hn 2 mi mt, vt qu 0.25mm (0.00984in) theo kch thc ln nht . Suy gim khong cch v in vt qu 25% Khng ph hp - lp 1,2,3 . Rp, ni bong bng, phn lp ni gia nhng vng dn in

44

2.9 SOLDER RESIST (Solder Mask)

2.9.5 dnh
iu kin t - lp 1,2,3 . B mt ph th ng b v m bo chc chn trn b mt board. C th chp nhn - lp 2,3 . Lp ph khng nh khi board trc khi kim tra . Sau khi kim tra theo IPC-TM-650, pp 2.4.28.1, s lp ph nh ln khng vt qu gii hn cho php theo dng 6010

C th chp nhn - lp 1 . Trc khi kim tra, lp ph bong khi board, v duy tr bm chc. Lp ph b mt khng l vng dn in lin k hay vt qu s cho php. . Sau khi kim tra theo IPC-TM-650, pp 2.4.28.1, s lp ph nh ln khng vt qu gii hn cho php

Khng ph hp - lp 1,2,3 . Lp ph trc qu gii hn

45

2.9 SOLDER RESIST (Solder Mask)

2.9.6 Ph ngt qung

iu kin t - lp 1,2,3 . Lp ph th hin s ng b trn b mt. N c m bo chc chn ln mch in m khng thy nhng l r, ngt qung hay khim khuyt khc. C th chp nhn - lp 2,3 . Khng c du hiu ph ngt qung

C th chp nhn - lp 1 . Vng ph ngt khng lm suy gim khong cch gia nhng vng dn in xung di mc cho php . C s ngt qung dc theo cnh vng dn in

Khng ph hp - lp 1,2,3 . C s ngt qung gia cnh vng dn in

46

2.9 SOLDER RESIST (Solder Mask)

2.9.7 Sng/np/gn sng

iu kin t - lp 1,2,3 . Khng c li no

C th chp nhn - lp 1,2,3 . Np ny khng lm suy gim b dy lp ph xung di mc cho php . Np nhn nh c thy khu vc m khng ni vng dn, v thng qua IPC-TM-640, pp 2.4.28.1 (bng keo)

Khng ph hp - lp 1,2,3 . Np bt ngang nhng vng dn in hoc lm gim khong cch vng dn in xung di mc cho php

47

2.9 SOLDER RESIST (Solder Mask)

2.9.8 Ph via
iu kin t - lp 1,2,3 . Nhng l cn c che th c ph ht

C th chp nhn - lp 1,2,3 . Nhng l cn c che th c ph ht

Khng ph hp - lp 1,2,3 . Nhng l cn c che th khng c ph

48

2.9 SOLDER RESIST (Solder Mask)

2.9.9 ng kh
ng kh: 1 ng di ging nh khong trng dc theo cnh dy dn in ni m lp ph th khng dnh ln. Ch hn, du, cht ty ra, vt liu d bay hi c th b mc kt trong ng ny. iu kin t - lp 1,2,3 . Khng c ng kh

C th chp nhn - lp 3 . Khng c ng kh C th chp nhn - lp 1,2 . Khng lm gim khong cch vng dn in xung di mc cho php, cng nh khng m rng ht dy dn Khng c ng kh

Khng ph hp - lp 1,2,3 . Khim khuyt vt qu tiu chun trn

49

2.9 SOLDER RESIST (Solder Mask)

2.9.10 dy
iu kin t - lp 1,2,3 . dy khng quy nh: bao ph phi thy r . dy quy nh trn ti liu: day phi p ng, hoc khng vt qu quy nh

C th chp nhn - lp 1,2,3 . Khng quy nh: bao ph phi thy r . Quy nh: dy phi p ng yu cu (khng th xc nh r)

Khng ph hp - lp 1,2,3 . Khng quy nh: bao ph khng u . Quy nh: dy t hn yu cu (khng th xc nh r)

50

2.10 Kch thc dy dn - pad

Gii thiu Nhng board mch phi p ng kch thc yu cu quy nh trn cc ti liu cung ng chng hn nh nh chu vi board, dy, rnh, khe, bc v tip xc cnh board. chnh xc, lp li v kh nng ti ca cc thit b c s dng kim tra cc c im ca board nn c 10% hoc t hn khong dung sai ca cc kch thc c xc nhn. 2.10.1 rng v khong cch dy dn Phn ny bao gm nhng yu cu v tiu chun v rng v khong cch dy dn rng v khong cch dy dn c chp nhn l thc o quy cch sx mch in tt c ti to tng th hnh nh, m v c bn xc nh nhng yu cu v chiu rng v khong cch dy dn. Tr khi nhng c tnh ny b vi phm, khng th cnh nh ngha ring l khng nht thit phi l mt c tnh chp nhn hoc khng ph hp, tuy nhin, n c th c coi nh l 1 ch s qu trnh, i hi phi xem xt cc th tc sx. Ngoi ra, n c th l 1 s xem xt quan trng cho mch tr khng c iu khin. Ti liu cung ng nn xut bn thm nhng i hi ring cho nhng ng dng ca loi ny. Khi cn thit, cc php o nh ngha cnh dn c thc hin theo quy nh ca IPCTM-650, Phng php 2.2.2.

51

2.10 PATTERN DEFINITION DIMENSIONAL

2.10.1.1 rng dy dn
iu kin t - lp 1,2,3 . rng v khong cch dy dn p ng yu cu

C th chp nhn - lp 2,3 . Bt k s kt hp ca nhm cnh cch li, nc, l nh, v vt xc tip xc vt liu m gim 20% rng dy dn ca gi tr nh nht hay t hn. . Khng xy ra ( nhm cnh, nc,) hn 10% chiu di dy dn hoc 13mm, tu theo ci no t hn.

C th chp nhn - lp 1 . Bt k s kt hp ca nhm cnh cch li, nc, l nh, v vt xc tip xc vt liu m gim 30% rng dy dn ca gi tr nh nht hay t hn. . Khng xy ra ( nhm cnh, nc,) hn 10% chiu di dy dn hoc 25mm, tu theo ci no t hn.

52

2.10 PATTERN DEFINITION DIMENSIONAL

2.10.1.2 Khong cch dy dn

iu kin t - lp 1,2,3 . p ng yu cu

C th chp nhn - lp 3 . Bt k g gh cnh, gai ng,vv.. m khng lm gim khong cch dy dn quy inh ti thiu hn 20% trong vng cch li

C th chp nhn - lp 1,2 . Bt k g gh cnh, gai ng,vv.. m khng lm gim khong cch dy dn quy inh ti thiu hn 30% trong vng cch li

53

2.10 PATTERN DEFINITION DIMENSIONAL

2.10.2 Kch thc vnh ngoi

Vnh khuyn: phn nh cht dn din xung quanh 1 l. N l phn cn li gia cnh ca l khoan A v cnh ca vng B

54

2.10 PATTERN DEFINITION DIMENSIONAL

2.10.3 Vnh khuyn ngoi - l c h tr

iu kin t - lp 1,2,3 . Nhng l trung tm pad

C th chp nhn - lp 3 . Nhng l khng trung tm pad, nhng kch thc vnh khuyn l 0.050mm (0.0020in) hoc hn. . Vnh ngoi c th gim 20% ca yu cu ti thiu trong khu vc cch li do nhng khim khuyt nh: h, lm, nc, l nh, hay bt

C th chp nhn - lp 2 . 90o vt ngoi pad hay t hn khong cch ti thiu gia cc bn c duy tr.(A) . 90o vt ngoi pad mi ni gia pad v dy dn th khng suy gim hn 20% ca rng dy dn ti thiu c quy nh trn bn v. Mi ni dy dn khng nn b hn 0.050mm (0.0020in) hoc rng dy dn nh nht, tu theo ci no nh hn.(C) C th chp nhn - lp 1 . 180o vt ngoi pad hay t hn khong cch ti thiu gia cc bn c duy tr.(B) . 180o vt ngoi pad mi ni gia pad v dy dn th khng suy gim hn 30% ca rng dy dn ti thiu c quy nh trn bn v. . Hnh dng, ph hp v chc nng khng b nh hng

55

2.10 PATTERN DEFINITION DIMENSIONAL

2.10.4 Vnh ngoi-l khng h tr

iu kin t - lp 1,2,3 . L trung tm pad

C th chp nhn - lp 3 . Kch thc vnh khuyn 0.15mm (0.00591) hoc hn theo bt k hng no (A). Vnh ngoi c th gim 20% ca vnh ti thiu trong vung cch li do khim khuyt nh h, lm, nc, l nh hay bt. C th chp nhn - lp 2 . Vnh c duy tr, khng vt ra ngoi (B) C th chp nhn - lp 1 . Cho php vt ngoi, ngoi tr mi ni gia dy dn v pad

Khng ph hp - lp 1,2,3 . Khim khuyt vt qu tiu chun trn

56

2.11 phng

Gii thiu phng ca board c xc nh bi 2 c im sn phm, chng c gi l cong v xon.Tnh trng Cong c dc trng bi mt cong gn hnh tr hoc cu, trong khi 4 gc ca n nm trn cng mt phng. Xon l s bin dng song song ng cho board, trong khi 1 gc khng nm cng mt phng vi 3 gc khc. Board trn hay elip phi c c lng im cao nht ca s dch chuyn theo chiu dc. Bow and Twist c th b nh hng bi thit k board nh l cu to mch khc nhau hay cu trc lp ca board nhiu lp, c th gy ng sut khc nhau hay tnh trng gim ng sut. dy v thuc tnh vt liu l nhng yu t khc nh hng n phng ca board. Bow and twist nn c xc nh bng vic dng bt k phng thc no c miu t trong IPC-TM-650, pp 2.4.22. i vi board mch

57

3.0 INTERNALLY OBSERVABLE CHARACTERISTICS

Gii thiu Mc ch ca phn ny l cung cp cc yu cu c th chp nhn c i vi nhng c bn trong mch in. Bao gm: cht liu nn, m xuyn l, phn ng dn in bn trong, x l phn ng bn trong v cc mch tn nhit/ngun/t, nh c m t sau: . Cc khim khuyt di b mt cht liu board nh s phn lp, phng rp, tp cht. . Cc khim khuyt di b mt ca board nhiu lp nh cc l trng, phn lp, , phng rp, vt nt, khong trng cch mass, khong cch lp-lp. . Cc bt thng trong m xuyn l, gm kch c, vnh khuyn, im chm gia ng mch v l xuyn, dy lp m, l trng trn lp m, sn bm, vt nt, bi nha thng, n mn khng hay qu nhiu, cc gai (dng si) ng ca thnh l khoan, s phn tch cc lp bn trong, v dy lp ch hn. . Quan st bng mt ch c thc hin trn mt ct ngang.

58

3.1 CHT IN MI

GII THIU Phn ny bao gm nhng cn chp nhn ca cc cht in mi. Cc cht in mi c xc nh sau khi cng nhit. Cc yu cu xc nh trong iu kin thu c nn c bt u trong cc ti liu c cung cp.

3.1.1 L trng-bn ngoi vng nhit

1. Vng nhit vt qu 0.08mm 2. Cc khim khuyt trong cc vng zone A khng c nh ga trn cc mu c l ra lm cng nhit hoc thc hin li vic m phng

59

3.1 DIELECTRIC MATERIAL

3.1.1 L trng-bn ngoi vng nhit (cont.)

iu kin t - lp 1,2,3 . G ng dng, ng tnh

C th chp nhn - lp 2,3 . L trng nh hn hoc bng 0.08mm (0.0031 in) v khng xm phm khong in mi ti thiu . B khuyt, nh cc l trng hoc ch nha thng lm vo, cc vng zone A tip xc vi vng cng nhit v thc hin li vng m phng C th chp nhn - lp 1 . L trng nh hn hoc bng 0.15mm (0.00591 in) v khng xm phm khong in mi ti thiu. Cc khim khuyt nh l l trng hoc ch nha thng lm vo, trong vng zone A tip xc vi vng to nhit v c thc hin li vic m phng Khng ph hp - lp 1,2,3 . Khim khuyt vt qu tiu chun trn

60

3.1 DIELECTRIC MATERIAL

3.1.2 Registration/Conductors to Holes

S hin din cc cht dn in thng c xc nh vi s lin quan ti cc l xuyn. Cc yu cu c thit lp thng qua vnh khuyn nh nht bn trong. (xem 3.3.1)

61

3.1 DIELECTRIC MATERIAL

3.1.3 Cc l trng, khng c h tr, cc mt ngun/mass

iu kin t - lp 1,2,3 . Khong cch chm power/ground thch hp vi ti liu yu cu

C th chp nhn - lp 1,2,3 . A) Khong cch chm power/ground ln hn khong cch dn in ti thiu c ch nh trong ti liu . B) Ground c th vt qua cnh ca l nh c ch nh trong ti liu

Khng ph hp - lp 1,2,3 . Khong cch chm power/ground nh hn khong khng gian dn in ti thiu c ch nh trong ti liu

62

3.1 DIELECTRIC MATERIAL

3.1.4 Tch lp/phng rp

iu kin t - lp 1,2,3 . Khng tch lp hay phng rp C th chp nhn - lp 2,3 . Phn lp/phng rp khng r rng

C th chp nhn - lp 1 . Nu phn lp/phng rp c pht hin, nh gi ton b board vi yu cu trong 2.3.2

63

3.1 DIELECTRIC MATERIAL

3.1.5 n mn
n mn hoc n mn th ng chp nhn c th hin du hiu cc m nha thng c gii phng khi b mt l khoan/l ng ca lp bn trong. C cc d liu thun chiu v tri chiu, n mn ng tin cy hn n mn th ng v ngc li. iu ny ph thuc vo chng loi ca tm ng, l ng v trng lng ca l ng c dng. n mn qu mc cng nh n mn th ng qu mc khng phi l mc ch cn thit. n mn qu mc, c hai trng hp, c mt kt qu bt li n tin cy ca tui th l xuyn Etchback: qu trnh n mn cng nh n mn ch ng c s dng ty cc cht in mi. Biu hin ca nha thng b n mn l lun rng, tt c m/vt nha thng u c ty v hn na, Negative Etchback: ?

Phn ny khng c d nh gia tng hay hn ch i tng c x l n mn. C nhiu nh sx bo mch rt thnh cng trong vic p dng c hai qu trnh n mn v n mn th ng, iu ph thuc vo c tnh/s thch ca nh thit k/ ngi tiu dng, tu thuc vo cht liu, vo vic m ng, cc l ng v cc ng dng cho thy nhng qu trnh n mn no nn c p dng. ?

64

3.1 DIELECTRIC MATERIAL

3.1.5.1 n mn

65

3.1 DIELECTRIC MATERIAL

3.1.5.2 Negative Etchback

66

3.1 DIELECTRIC MATERIAL

3.1.6 Cht in mi, khong cch, cc mt kim loi

iu kin t - lp 1,2,3 . Khong cch chm ln hn cc yu cu ca ti liu

C th chp nhn - lp 1,2,3 . Khong cch chm gia cc tm kim loi phi bng hoc ln hn 0.1mm (0.0040 in) ( gi tr khng c ch nh bi ti liu)

Khng ph hp - lp 1,2,3 . Khong cch chm gia cc tm kim loi nh hn 0.1mm (0.0040 in) ( gi tr khng c ch nh bi ti liu)

67

3.1 DIELECTRIC MATERIAL

3.1.7 Khong cch lp-lp

dy in mi ti thiu l iu kin vt cht ti a c s dng cho cc yu cu v cng in p.

iu kin t - lp 1,2,3 . dy in mi ti thiu p ng cc yu cu trong ti liu i km C th chp nhn - lp 1,2,3 . dy in mi ti thiu t c cc yu cu ti thiu trong ti liu i km. Nu khng c ch nh, dy ti thiu phi l 0.09mm (0.0035 in) hoc ln Khng ph hp - lp 1,2,3 . dy in mi ti thiu nh hn cc yu cu ti thiu ca ti liu i km, hoc bng 0.09mm (0.0035 in) khi khng c ch nh. Ch : cc sn phm c thit k cho cc ng dng tr khng ng dy truyn ti c th c cc yu cu c bit v phng php o c c ch nh trong ti liu i km

68

3.1 DIELECTRIC MATERIAL

3.1.8 Bin cht nha thng

S bin cht nha thng trong 1 l xuyn m c nh ngha nh l s tch bit gia nng ca l m v cht in mi trn thnh l. N c chp nhn cho tt c cc class sau khi kim tra cng nhit, tr trng hp c quy nh trn ti liu cung ng.

69

3.2 CONDUCTIVE PATTERNS GENERAL

3.2.1 Cc c tnh n mn
im rng dn in hp nht A: y khng phi l rng dn in c ch thch trn ti liu hoc c tnh k thut i km. im rng nn dn in B: rng c o khi rng cht dn in ti thiu khng c ch thch trn ti liu hoc c tnh k thut i km im rng chnh ca sn phm C: rng ny thng quyt nh rng chng li kim loi hoc hu c trn cht dn in b n mn. Vic thit k rng cht dn in c ch nh trn ti liu i km v thng c o nht nn dn in B c cc yu cu rng dn in ti thiu nh mun. Hai cu hnh sau y ch ra rng rng dn in c th ln hn ti b mt hn l nn.

Chng m ch thic

Chng kh phim

Lp bn trong sau khi n mn

Cc lp m bn trong c dng cho cc l via b lp

70

3.2 CONDUCTIVE PATTERNS GENERAL

3.2.1 Etching Characteristics (cont.)

M mu (chng kh phim) vi s gia tng rng b mt cht dn in

M mu (ngn cht lng) vi s gia tng rng b mt cht dn in

Ghi ch: vic nng cao s gia tng rng b mt cht dn in, nu c, s nh hng n dy chng kh phim. S gia tng rng cht dn in khi dy m vt qu dy c tc dng ngn cn. Ghi ch: cc cu hnh n mn khc nhau c th khng t c cc yu cu thit k mong mun

M mu v ph mng (chng n mn)

rng hiu qu ca mt cht dn in c th thay i t rng cht dn in n gii hn ca b mt

71

3.2 CONDUCTIVE PATTERNS GENERAL

3.2.2 In v n mn
Cht dn in ng c th bao gm cc s kt hp ca l ng, m ng v ng khng mang in. Ngn kim loi, ph solder, v m ch thic m thng c thy trong cc hnh minh ho ny iu kin t - lp 1,2,3 . rng cht dn in vt yu cu ti thiu

C th chp nhn - lp 1,2,3 . rng cht dn in t yu cu ti thiu

Khng ph hp - lp 1,2,3 . rng cht dn in nh hn yu cu ti thiu

72

3.2 CONDUCTIVE PATTERNS GENERAL

3.2.3 dy cht dn in b mt
Tr khi c ch nh trn ti liu i km, tng (l ng m thm ng) dy cht dn in ti thiu s nh bng sau: L ng nn nh nht Miu t Trng lng dy ban u dy cht dn hon chnh

i vi mi oz ca l ng thnh cng trn 4oz, tng dy cht dn in ti thiu thm 30um

3.2.4 dy l ng-cc lp bn trong

dy l ng ti thiu (hay rng cht dn in) l dy lin tc, ng phng ti a dn dng in. Cc vt xc c trng c bao hm, nhng b mt hnh cy c dng rng ca lm tng kh nng kt dnh kim loi th b loi tr khi s xc dnh dy l ng ti thiu. iu kin t - lp 1,2,3 . dy l ng t n dy c ch nh trn ti liu i km C th chp nhn - lp 1,2,3 . dy l ng t n yu cu ti thiu

Khng ph hp - lp 1,2,3 . dy l ng nh hn dy ti thiu c ch nh trong ti liu i km hoc cc c im k thut c tham chiu khc . dy l ng ti thiu lp trong sau khi x l s nh bng sau i vi tt c class

73

 dy l ng ti thiu lp trong L ng nn nh nht Miu t Trng lng dy ban u dy cht dn nh nht sau khi hon chnh

Ch : Vic m thm c th c yu cu cho cc cht dn in lp trong s c ch nh ring

74

3.3 PLATED-THROUGH HOLES GENERAL

Gii thiu Phng php kim tra: . Kch thc l (tu chn-IPC650, pp 2.2.7) A. Quang hc B. ?? C. Cm bin cm Ch : cm bin l phi sch s v du bn trong phi c ly ra ht trc khi s dng. . Cht lng thnh l nhn bng mt thng A. Cc l trng, m, xc nh vi mt thng, dng knh phng i 10x xc minh B. Cc si i mu, cc vt , s dng mt thng v/hoc cc th nghim hn Phn tinh vi: . S o c dy m: A. Vic kim tra tinh vi c ng gi (IPC-TM-650, pp2.1.1). dy ng trung bnh phi c xc nh t 3 phng php o, c phn chia gn bng nhau, trn mi mt ca l xuyn c m. Khng o c nhng ni c cc khim khuyt b c lp nh khong trng, nt hoc cc m. S bin i cc vt nt c th c xc nh thng qua hnh minh ho bn di. Nhng vng nh c lp vi dy m nh hn yu cu ti thiu c xem nh l cc khong trng. B. Phng php khng hu: o micro-ohm IPC-TM-650, pp 2.2.13.1). cng ngh ny c th c s dng o dy ng trung bnh trn cc l xuyn c mkhi tiu chun ho ng.. Phng php ny ng dng o dy ng ti thiu. Do ph thuc vo s thng nht dng hnh hc cc l , phng php ny c th khng thch hp cho vic o c cc l xuyn c m c to di hnh thc c. Tnh nng khng hu, tc , v d dng ca s o c khin cho phng php ny hu dng trong vic cung cp cc d liu bin cho s kim sot qu trnh thng k C. dy lp m: cc yu cu ti thiu c thit lp trong tp IPC-6010 . Hn Nhiu v d hoc mu i din nn c test hn s dng cc phng php B,C, hoc D ca ANSI/ J-STD-003. Yu cu bn lp ph nn c thnh lp trc. Cc l xuyn c m nn c bo qun c c tnh mao dn v m tt..

75

Nt loi A: nt bn ngoi m ng Nt loi B: vt nt khng hon ton lm gy lp m (lp m ti thiu cn li: xem bng 3.2 Nt loi C: nt bn trong lp m Nt loi D: gy hon ton Nt loi E: ch nt lp m Nt loi F: ch nt gc trong lp m

76

3.3 PLATED-THROUGH HOLES GENERAL

3.3.1 Vnh khuyn-cc lp bn trong

Cc vnh khuyn c nh gi trc quan bng phng php kim tra ca F coupon.(IPC-2221) i vi board nhiu lp, vic o c vt l ca cc b mt board v cc mu dng kim loi, vnh khuyn c th c thit lp bng mt trong hai phng php khng hu b sung sau: (a) Kim tra X quang bo tun theo IPC-TM-650, pp 2.6.10. Nhng vng c chn kim tra phi nh gim thiu sai s cho b kim tra. (b) Kim tra in t ca coupon c bit tun theo IPC-TM-650, pp 2.5.16 Nu vnh khuyn bn trong b gy c tm thy mt ct thng ng nhng gc gy khng th xc nh c, n s o bng microsection ngang. Vic test coupon hoc bo thnh phm c dng cho mt ngang s c ly t khu vc b nh hng v phn tch trn cc lp nghi ng

77

3.3 PLATED-THROUGH HOLES GENERAL

3.3.1 Vnh khuyn cc lp bn trong

iu kin t - lp 1,2,3 . Tt c l c khoan chnh xc theo trc thng ng

C th chp nhn - lp 3 . Vng khuyn c kch thc nh l 0.025mm (0.000984 in) hoc hn

C th chp nhn - lp 2 . Vng khuyn cong 90o hoc t hn C th chp nhn - lp 1 . Vng khuyn cong 180o hoc t hn

78

3.3 PLATED-THROUGH HOLES GENERAL

3.3.2 Cc chn pad b nhc ln - mt ct ngang

iu kin t - lp 1,2,3 . Khng c pad no b nh ln

C th chp nhn - lp 1,2,3 Sau khi kim tra ng nhit hoc lm li m phng: . Chp nhn cc chn pad b nhc ln nhn (ngha l sau khi nung chy, nhng trc khi th nghim ng sut nhit hoc lm li m phng) . Khng c chn pad b nhc ln

Khng ph hp - lp 1,2,3 Khng c php nhc ln t b mt g n mt di ca u pad ng, d c hay khng c nha thng xut hin trn pad ng nh khi mt board

79

3.3 PLATED-THROUGH HOLES GENERAL

3.3.3 Nt lp m - (l ng bn trong)
iu kin t - lp 1,2,3 . Khng c vt nt trong l ng C th chp nhn - lp 2,3 . Cc vt nt khng hin r trong l ng

C th chp nhn - lp 1 . Cho php trn mt mt ca l khoan v khng ko di qua khi dy ca l ng

Khng ph hp - lp 1,2,3 . Vt nt vt qua khi dy ca l ng

80

3.3 PLATED-THROUGH HOLES GENERAL

3.3.4 Nt lp m
iu kin t - lp 1,2,3 . Khng c vt nt trong l ng

C th chp nhn - lp 2,3 . Vt nt A C th chp nhn - lp 1 . Vt nt A v B . Vt nt C ch trn mt mt ca l lm cho n khng vt khi dy ca l ng

Khng ph hp - lp 1,2,3 . Vt nt C v D

Ghi ch: Vt A l b nt l bn ngoi Vt B l b nt khng hon ton lm gy lp m (lp m ti thiu c duy tr) Vt D l lm gy hon ton xuyn c l ng bn ngoi v c lp m

81

3.3 PLATED-THROUGH HOLES GENERAL

3.3.5 Nt lp m - trc via

iu kin t - lp 1,2,3 . Lp m trc via khng b nt C th chp nhn - lp 1,2,3 . Khng b nt lp m

Khng ph hp - lp 1,2,3 . Cc khim khuyt vt qu tiu chun trn

Khng ph hp - lp 1,2,3 . Cc khim khuyt vt qu tiu chun trn

82

3.3 PLATED-THROUGH HOLES GENERAL

3.3.6 Nt lp m - (gc)
iu kin t - lp 1,2,3 . Khng nt lp m C th chp nhn - lp 1,2,3 . Khng nt lp m

Khng ph hp - lp 1,2,3 . Cc khim khuyt vt qu tiu chun trn

Khng ph hp - lp 1,2,3 . Cc khim khuyt vt qu tiu chun trn

83

3.3 PLATED-THROUGH HOLES GENERAL

3.3.7 Cc nt trn lp m
iu kin t - lp 1,2,3 . Lp m phng v ng nht xuyn sut l khoan. Khng c du hiu ca nhm hay nt

C th chp nhn - lp 1,2,3 . nhm hoc nt khng lm gim dy lp m xung di mc yu cu ti thiu, hoc ng knh l khoan b gim xung di yu cu ti thiu.

Khng ph hp - lp 1,2,3 . nhm hoc nt lm gim dy lp m xung di mc yu cu ti thiu, hoc ng knh l khoan b gim xung di yu cu ti thiu.

84

3.3 PLATED-THROUGH HOLES GENERAL

3.3.8 dy lp m ng thnh l
iu kin t - lp 1,2,3 . Lp m phng v ng nht xuyn sut l. dy lp m p ng c yu cu

C th chp nhn - lp 1,2,3 . dy lp m thay i nhng vn t c cc yu cu trung bnh ti thiu v yu cu ca cc vng c mng ti thiu

Khng ph hp - lp 1,2,3 . dy lp m hoc l xung di mc yu cu vng mng ti thiu hoc di mc yu cu trung bnh ti thiu

Ghi ch: xem phng php o trong ti liu IPC-TM-650, pp 2.1.1

85

3.3 PLATED-THROUGH HOLES GENERAL

3.3.9 Cc l trng trn lp m

iu kin t - lp 1,2,3 . Khng c l trng trn lp m

C th chp nhn - lp 1,2,3 . Khng c l trng no trn lp m vt qu 5% tng dy board mch . Khng c l trng lp m no hin r trn b mt ca lp dn in bn trong v thnh l m . Khng cho php l trng lp m c dng hnh trn C th chp nhn - lp 2,3 . Khng c hn mt l trng trn test coupon hoc bo thnh phm, bt k chiu di hay kch c C th chp nhn - lp 1 . Khng c hn 3 l trng trn test coupon hoc bo thnh phm, bt k chiu di hay kch c Khng ph hp - lp 1,2,3 . L trng trn lp m vt qu 5% tng dy board mch . Cc l trng lp m hin r trn b mt ca lp dn in bn trong v thnh l m . L trng lp m c dng hnh trn Khng ph hp - lp 2,3 . Nhiu hn 1 l trng lp m trn test coupon hoc bo thnh phm, bt k chiu di hay kch c Khng ph hp - lp 1 . Nhiu hn 3 l trng lp m trn test coupon hoc bo thnh phm, bt k chiu di hay kch c

86

3.3 PLATED-THROUGH HOLES GENERAL

3.3.10 dy ph ch khi c quy nh

iu kin t - lp 1,2,3 . dy ph ch phi ng nht, v ph cnh phn b n mn. Khng c du hiu ng b h

C th chp nhn - lp 1,2,3 . dy ph ng ng nht,. Nhng vng thng ng c th khng c ph. Khng c du hiu ng b h

Khng ph hp - lp 1,2,3 . Lp ng b h c pht hin

Ghi ch: i vi cc yu cu v hn , xem 5.1

87

3.3 PLATED-THROUGH HOLES GENERAL

3.3.11 Gai
iu kin t - lp 1,2,3 . Khng c gai

C th chp nhn - lp 3 . Gai khng vt qu 0.08mm (0.0031 in) C th chp nhn - lp 2 . Gai khng di qu 0.1mm (0.00394 in) C th chp nhn - lp 1 . Gai khng di qu 0.125mm (0.004921 in)

Khng ph hp - lp 1,2,3 . Chiu di vt qu cc tiu chun trn

88

3.3 PLATED-THROUGH HOLES GENERAL

3.3.11.1 Gai, cc clearance l

iu kin t - lp 1,2,3 . Khng c gai dn in trong cht liu c s hoc dc theo cht liu tng cng

C th chp nhn - lp 3 . Gai A =<0.08mm . Gai B khng lm gim khng gian dn in xung di mc ti thiu c ch nh trn ti liu i km C th chp nhn - lp 2 . Gai A =<0.1mm . Gai B khng lm gim khng gian dn in xung di mc ti thiu c ch nh trn ti liu i km C th chp nhn - lp 1 . Gai A =<0.125mm . Gai B khng lm gim khng gian dn in xung di mc ti thiu c ch nh trn ti liu i km Khng ph hp - lp 1,2,3 . Chiu di gai vt qu tiu chun trn

89

3.3 PLATED-THROUGH HOLES GENERAL

3.3.12 Phn lp bn trong cc phn t dc (trc)

iu kin t - lp 1,2,3 .Lin kt trc tip ca ng m ln l ng. Khng c du hiu no ca s tch lp bn trong (tch lp gia cc lp nn bn trong v phn m ca tng l), hoc vi lp bn trong C th chp nhn - lp 2,3 . Khng c hiu tch lp

C th chp nhn - lp 1 . S phn tch ca cc lp bn trong hoc vi lp bn trong ch trn mt mt ca thnh l mi v tr lp nn khng ln hn 20% cc lp nn lin quan

Khng ph hp - lp 1,2,3 . Cc khim khuyt vt qu tiu chun trn

90

3.3 PLATED-THROUGH HOLES GENERAL

3.3.13 Phn lp bn trong (cc phn t nm ngang)

iu kin t - lp 1,2,3 . Khng c s phn lp gia lp bn trong v lp m trong l. Lin kt trc tip ca ng m ln lp l ng C th chp nhn - lp 2,3 . Khng c du hiu tch lp

C th chp nhn - lp 1 . ng ranh gii mng v s phn tch lp ph bn trong khng vt qu cc yu cu quy nh

Khng ph hp - lp 1,2,3 . Khim khuyt vt qua tiu chun trn

91

3.3 PLATED-THROUGH HOLES GENERAL

3.3.14 Ph nha thng

Cc l via khng r rng nn c lp hoc bt li bng 1 cht cn bng ch hoc polyme ngn ch xm nhp vo chng , nh ch hn trong cc l nh c xu hng lm gim tin cy Vic lp via khng y c th l kt qu ca s phn lp do s m rng nhanh chng ca cc ti khng kh dng bt hoc tro cht bn trong qu trnh chy ngc ch Cc via b vi phi c lp y it nht 60% nha thng mng i vi lp 2,3. Chng c th b trng ch hon to i vi lp 1

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3.4 PLATED-THROUGH HOLES DRILLED

Gii thiu

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3.4 PLATED-THROUGH HOLES DRILLED

3.4.1 G
iu kin t - lp 1,2,3 . Khng c du hiu ca cc g. Ch : Cc g c th chp nhn i vi tt c cc lp min l chng khng lm gim ng knh l hay dy lp m xung di mc ti thiu cn thit.

C th chp nhn - lp 1,2,3 . C cc g, nhng l vn t c ng knh ti thiu.Khng c du hiu ca cc g.

Khng ph hp - lp 1,2,3 . Cc g lm gim ng knh l xung di gi tr ti thiu

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3.4 PLATED-THROUGH HOLES DRILLED

3.4.2 Nailheading
iu kin t - lp 1,2,3 . Khng c du hiu ca nailheading

C th chp nhn - lp 1,2,3 . Du hiu Nailheading rt nh

C th chp nhn - lp 1,2,3 . Du hiu tng i ca nailheading gy ra khng lm xut hin du hiu ca s phn lp.

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3.5 PLATED-THROUGH HOLES PUNCHED

3.5.1 nhm v cc nt sn
iu kin t - lp 1,2,3 . Lp m phng v ng nht xuyn sut l. Khng c u hiu b nhm hoc c cc nt sn.

C th chp nhn - lp 1,2,3 . nhm hoc cc nt sn khng lm gim dy m hoc ng knh l xung di cc yu cu ti thiu.

Khng ph hp - lp 1,2,3 . nhm v cc nt sn lm gim dy lp m hoc ng knh l xung di cc yu cu ti thiu.

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3.5 PLATED-THROUGH HOLES PUNCHED

3.5.2 Loe, di ra
iu kin t - lp 1,2,3 . L c biu hin b di ra mc mng v khng vi phm cc yu cu ti thiu ca vng khuyn.

C th chp nhn - lp 1,2,3 . L c biu hin b di ra nhng khng vi phm cc yu cu ti thiu ca vng khuyn.

Khng ph hp - lp 1,2,3 . L c biu hin di ra v vi phm cc yu cu ti thiu ca vng khuyn.

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4.1 FLEXIBLE AND RIGID-FLEX PRINTED WIRING

4.1.1 S tch lp phim ph

Phim ph phi ng nht v khng b tch lp. Tuy nhin, cc thiu st nh l np nhn, np gp, v khng cn kim loi c chp nhn min l chng khng vt qu cc gii hn bn di iu kin t - lp 1,2,3 . L c biu hin b di ra nhng khng vi phm cc yu cu ti thiu ca vng khuyn.

C th chp nhn - lp 1,2,3 . S phn lp khng lm gim vng c cn g gia cc cht dn in lin k xung di 25%. . Mi vng phn lp khng vt qu khng vt qu 6.25 mm2 . . Phn lp khng xy ra dc theo cc cnh bn ngoi.

Khng ph hp - lp 1,2,3 . Li vt qu cc tiu chun trn.

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4.1 FLEXIBLE AND RIGID-FLEX PRINTED WIRING

4.1.2 Ph lp che
Ph lp che c cc yu cu tng t nh vic ph cn ch (solder mask) nhng phn mch cng trong ti liu ny. Ph lp che bao gm c vic p vo mt cht kt dnh ln din tch nn c th hn c. iu kin t - lp 1,2,3 . Khng xut hin cht liu khng mong mun trn vng nn C th chp nhn - lp 3 . Chu vi vng khuyn c th hn c ti thiu l 0.13mm

C th chp nhn - lp 2 Chu vi vng khuyn c th hn c ti thiu 270o.

C th chp nhn - lp 1 . Chu vi vng khuyn c th hn c ti thiu 180o.

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4.1 FLEXIBLE AND RIGID-FLEX PRINTED WIRING

4.1.3 m bo l khoan i vi lp ph v cc lp tng cng

m bo cc lp ph v/hoc lp tng cng cho php mt vng khuyn c th hn c xung quanh l, v cht kt dnh hoc p khng lm gim vng khuyn c th hn c xung di gii hn c th chp nhn c iu kin t - lp 1,2,3 . p ng c s m bo trn l thuyt.

C th chp nhn - lp 3 . Lp ph hoc gia cng khng c vi phm vo l. . Chu vi vng khuyn c th hn c l 0.13mm hoc hn. . i vi cc l khng cn quan tm, vng khuyn c th hn c l 0.25mm. C th chp nhn - lp 2 . Lp ph hoc gia cng khng c vi phm vo l. . Chu vi vng khuyn c th hn c l 270o hoc hn. C th chp nhn - lp 1 . Lp ph hoc gia cng khng c vi phm vo l. . Chu vi vng khuyn c th hn c l 180o hoc hn.

Khng ph hp - lp 1,2,3 . Li vt qu cc tiu chun trn

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4.1 FLEXIBLE AND RIGID-FLEX PRINTED WIRING

4.1.4 Tiu chun l m

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