BONAFIDE CERTIFICATE

This is to certify that this summer training report from ITI,Mankapur submitted to United Institute of Technology Allahabad, is a bonafide record of work done by Brijesh Kumar Maurya under my supervision from 15.06.2012 to 14.07.2012

S.S.BISHT
MANAGER(HREDC) ITI Ltd. MANKAPUR GONDA

Place - MANKAPUR Date- 14.07.2012

CONTENT

CMPANY PROFILE

GSM(GLOBAL SERVICE FOR MOBILE COMMUNICATION)

BTS(BASE TRANSCEIVER STATION)

SMT(SURFACE MOUNT TECHNOLOGY) PCB(PRINTED CIRCUIT BOARD)

SIX SIGMA

COMPANY PROFILE

I.T.I Ltd is the first public sector under taking of government to provide telecom services. I.T.I Ltd was established in 1948 ever since as pioneering venture in the field of telecommunication, it has contributed to 50% of the present national telecom network. The company offers a complete range telecom products and total solution

covering the whole spectrum of switching, transmission, access and subscriber premises equipments.

I.T.I joined the league of world class vendors of global spectrum for mobile communication(GSM) technology with the inauguration of mobile equipment manufacturing facilities at its Mankapur and Raebareli Plants in 2005-06. This ushered new era of indigenous mobile equipments production in the country.

The company is consolidating its diversification into information and communication technology(ICT) to have its competitive edge in the convergence market by developing its rich telecom expertise and vast infrastructure.

Network management system, encryption and networking solution for internal connectivity are some of the major initiatives taken by the company.

It have six manufacturing unitsBANGALORE UNIT-

Bangalore unit is the first plant of I.T.I setup in1948 and got acceleration of ISO 9001. The telecom products manufactured here are digital switches, digital microwave equipment, optical fibre equipment, satellite communication equipment, access products and terminal equipments.

NAINI ALLAHABAD UNIT-

This plant was setup in 1971 for the manufacture of transmission equipment. The major products are optical fibre system of both PDH and SDH and telephone equipment of various types. It has a R and D centre and modern facility for assembly and testing with surface mount technology, area

Environmental lab, metal parts manufacturing facilities and PCB plant are parts of modern infrastructure.

RAE-BARELI UNIT-

Rae-bareli manufacturing unit was setup in 1973 and boast a world class infrastructure. Presently this unit manufactures GSM network equipments and CDMA handsets. It has taken a leap to enter broad band equipments G-PON and WIMAX.

MANKAPUR UNIT-

Mankapur unit was established in 1983. The plant manufactures large digital switches and digital trunk exchange in technical collaboration with M/S ALCATEL. This unit also produces BTS. It has the most modern facility for PCB manufacturing assembly and automatic testing facility with SMT line and environmental test lab.

PALAKKAD UNIT-

Palakkad unit was established in 1976 as the national first electronics switching system manufacturing unit to manufacture large digital switches and digital trunk exchanges in collaboration with ALCATEL. The plant was awarded with ISO 9001 and ISO 14000. With world class manufacturing facilities and international quality standards enjoying self certification. I.T.I Palakkad is ranked the best among the telecom field industries in india.

SRINAGAR UNIT-

Srinagar plant was setup in 1969 for the supply of components to main plant. In the year 1981, the status of plant was upgraded to that of a manufacturing plant for the manufacture of telephone instruments. Its main products are handset, telephone set, and perform assembling of telephone set.

MISSIONThe mission of ITI is to be a leader in domestic market. To retain leadership in manufacturing and supplying of new technology telecom products and also to regain status of top turn key solution provider.

ITI CUSTOMER Bharat Sanchar Nigam Limited(BSNL) Defence Railway Power sector Steel sector

ABOUT ITI Ltd MANKAPUR It is known as digital city of india. Its construction started from 31st may 1983. Start of production in 1985. Total land ITI Mankapur is 352 acres. Factory covers area 77500 m square. AC space 44300 m square.

 Township of ITI Mankapur consists of 3000 residence, 3 intermediate schools,two banks(SBI and PNB),shopping complex, swimming pool, auditorium, two clubs. It has SEA Plant(Switching Exchange Assembly Plant) which is the largest single root air condition area in Asia. At starting there were 7088 trees but now there are approximately 35000 trees. Now ITI Mankapur has entered into non-communication field with his note counting machine. Note counting machine, inverter etc are being manufactured. It is the first unit in India which got apparatus to manufacture the BTS in year 2005.

PRODUCTION OF ITI MANKAPUR E-10B Exchange. CSN-MM Business Exchange. GSM. SEA Division.

GSM
Short for Global System for Mobile Communications, one of the leading digital cellular systems. GSM uses narrowband TDMA, which allows eight simultaneous calls on the same radio frequency. GSM was first introduced in 1991. As of the end of 1997, GSM service was available in more than 100 countries and has become the de facto standard in Europe and Asia. GSM (Global System for Mobile Communications, originally Groupe Spcial Mobile), is a standard set developed by the European

Telecommunications Standards Institute (ETSI) to describe protocols for second generation (2G) digital cellular networks used by mobile phones. The GSM standard was developed as a replacement for first generation (1G) analog cellular networks, and originally described a digital, circuit switched network optimized for full duplex voice telephony. This was expanded over time to include data communications, first by circuit switched transport, then packet data transport via GPRS (General Packet Radio Services) and EDGE (Enhanced Data rates for GSM Evolution or EGPRS). Further improvements were made when the 3GPP developed third generation (3G) UMTS standards followed by fourth generation (4G) LTE Advanced standards.

GSM carrier frequencies

Main article: GSM frequency bands GSM networks operate in a number of different carrier frequency ranges (separated into GSM frequency ranges for 2G and UMTS frequency bands for 3G), with most 2G GSM networks operating in the 900 MHz or 1800 MHz bands. Where these bands were already allocated, the 850 MHz and 1900 MHz bands were used instead (for example in Canada and the United States). In rare cases the 400 and 450 MHz frequency bands are assigned in some countries because they were previously used for first-generation systems.

GSM service security See also: UMTS security GSM was designed with a moderate level of service security. The system was designed to authenticate the subscriber using a pre-shared key and challengeresponse. Communications between the subscriber and the base station can be encrypted. The development of UMTS introduces an optional Universal Subscriber Identity Module (USIM), that uses a longer authentication key to give greater security, as well as mutually authenticating the network and the user whereas GSM only authenticates the user to the network (and not vice versa). The security model therefore offers confidentiality and authentication, but limited authorization capabilities, and no non-repudiation.

GSM uses several cryptographic algorithms for security. The A5/1, A5/2 and A5/3 stream ciphers are used for ensuring over-the-air voice privacy. A5/1 was developed first and is a stronger algorithm used within Europe and the United States; A5/2 is weaker and used in other countries. Serious weaknesses have been found in both algorithms: it is possible to break A5/2 in real-time with a ciphertext-only attack, and in January 2007, The Hacker's Choice started the A5/1 cracking project with plans to use FPGAs that allow A5/1 to be broken with a rainbow table attack. The system supports multiple algorithms so operators may replace that cipher with a stronger one. GSM open-source software Several open-source software projects exist that provide certain GSM features:

gsmd daemon by Openmoko OpenBTS develops a Base transceiver station The GSM Software Project aims to build a GSM analyzer for less than $1000

OsmocomBB developers intend to replace the proprietary baseband GSM stack with a free software implementation

EVOLUTION OF GSM STANDARD

1982 : Group special mobile developed GSM 1989 : GSM responsibility transferred to ETSI(European

Telecommunication Instandards 1991 : Commercial service started

Institute)

1990 : Phase 1 of GSM specification published

1997 : Commercial services available in 110 countries

OBJECTIVE OF GSM Good speech quality. Low terminal and service cost. Support for international roaming. Ability to support hand held terminals. Support for range of new services and facilities. ISDN compability. Spectral efficiency. ISDN caused the decline of E10B.

BTS(BASE TRANSCEIVER STATION) Base transceiver station(BTS) is the main part of mobile communication. BTS consists of mainly three cards. Whole system of BTS consists Fan unit( it have 9 fans) Rack unit FACB( Fan Control Board)

A typical BTS tower which holds the antenna. The tower is quite widely misinterpreted as the BTS itself. The shelter which houses the actual BTS can also be seen.

A mobile BTS

A BTS mounted on a building

A base transceiver station (BTS) is a piece of equipment that facilitates wireless communication between user equipment (UE) and a network. UEs are devices like mobile phones (handsets), WLL phones, computers with wireless internet connectivity, WiFi and WiMAX devices and others. The network can be that of any of the wireless communication technologies like GSM, CDMA, Wireless local loop, WAN, WiFi, WiMAX, etc. BTS is also referred to as the radio base station (RBS), node B (in 3G Networks) or, simply, the base station (BS). For discussion of the LTE standard the abbreviation eNB for evolved node B is widely used. Though the term BTS can be applicable to any of the wireless communication standards, it is generally associated with mobile communication technologies like GSM and CDMA. In this regard, a BTS forms part of the base station subsystem (BSS) developments for system management. It may also have equipment for encrypting and decrypting communications, spectrum filtering tools (band pass filters), etc. antennas may also be considered as components of BTS in general sense as they facilitate the functioning of BTS. Typically a BTS will have several transceivers (TRXs) which allow it to serve several different frequencies and different sectors of the cell (in the case of sectorised base stations). A BTS is controlled by a parent base station controller via the base station control function (BCF). The BCF is implemented as a discrete unit or even incorporated in a TRX in compact base stations.

General architecture A BTS in general has the following parts: Transceiver (TRX) Quite widely referred to as the driver receiver (DRX), DRX are either in the form of single (sTRU), double(dTRU) or a composite double radio unit (DRU). It basically does transmission and reception of signals. It also does sending and reception of signals to and from higher network entities (like the base station controller in mobile telephony). Power amplifier (PA) Amplifies the signal from DRX for transmission through antenna; may be integrated with DRX. Combiner Combines feeds from several DRXs so that they could be sent out through a single antenna. Allows for a reduction in the number of antenna used. Duplexer For separating sending and receiving signals to/from antenna. Does sending and receiving signals through the same antenna ports (cables to antenna).

Antenna This is the structure that lies underneath the BTS; it can be installed as it is or disguised in some way (Concealed cell sites). Alarm extension system Collects working status alarms of various units in the BTS and extends them to operations and maintenance (O&M) monitoring stations. Control function Controls and manages the various units of BTS, including any software. On-the-spot configurations, status changes, software upgrades, etc. are done through the control function.

SURFACE-MOUNT TECHNOLOGY

Surface-mount technology (SMT) is a method for constructing electronic circuits in which the components are mounted directly onto the surface of printed circuit boards (PCBs). An electronic device so made is called a surface-mount device (SMD). In the industry it has largely replaced the through-hole technology construction method of fitting components with wire leads into holes in the circuit board. Both technologies can be used on the same board for components not suited to surface mounting such as transformers and heat-sinked power semiconductors. An SMT component is usually smaller than its through-hole counterpart because it has either smaller leads or no leads at all. It may have short pins or leads of various styles, flat contacts, a matrix of solder balls (BGAs), or terminations on the body of the component.

Assembly techniques

Assembly line with SMT placement machines,Where components are to be placed, the printed circuit board normally has flat, usually tin-lead, silver, or gold plated copper pads without holes, called solder pads. Solder paste, a sticky mixture of flux and tiny solder particles, is first applied to all the solder pads with a stainless steel or nickel stencil using a screen printing process. It can also be applied by a jet-printing mechanism, similar to an inkjet printer. After pasting, the boards then proceed to the pick-and-place machines, where they are placed on a conveyor belt. The components to be placed on the boards are usually delivered to the production line in either paper/plastic tapes wound on reels or plastic tubes. Some large integrated circuits are delivered in static-free trays. Numerical control pick-and-place machines remove the parts from the tapes, tubes or trays and place them on the PCB.

Advantages
The main advantages of SMT over the older through-hole technique are:

Smaller components. As of 2012 smallest was 0.2 0.1 mm (0.01 in 0.005 in: 01005).

Much higher component density (components per unit area) and many more connections per component.

Lower initial cost and time of setting up for production. Fewer holes need to be drilled. Simpler and faster automated assembly. Some placement machines are capable of placing more than 136,000 components per hour.* Small errors in component placement are corrected automatically as the surface tension of molten solder pulls components into alignment with solder pads.

Components can be placed on both sides of the circuit board.

DISADVANTAGE OF SMT
More heat generation. Small clearance makes cleaning difficult. Visual inspection difficult. Air conditioned required.

PRINTED CIRCUIT BOARD

A printed circuit board or PCB, is used to mechanically support and electrically connect electronic components using conductive pathways, tracks or signal traces etched from copper sheets laminated onto a non-conductive substrate. It is also referred to as printed wiring board (PWB) or etched wiring board. Printed circuit boards are used in virtually all but the simplest commercially produced electronic devices. A PCB populated with electronic components is called a printed circuit assembly (PCA), printed circuit board assembly or PCB Assembly (PCBA). In informal use the term "PCB" is used both for bare and assembled boards, the context clarifying the meaning. Alternatives to PCBs include wire wrap and point-to-point construction. PCBs must initially be designed and laid out, but become cheaper, faster to make, and potentially more reliable for high-volume production since production and soldering of PCBs can be automated. Much of the electronics industry's PCB design, assembly, and quality control needs are set by standards published by the IPC organization.

Manufacturing Materials

A PCB as a design on a computer (left) and realized as a board assembly populated with components (right). The board is double sided, with through-hole plating, green solder resist, and white silkscreen printing. Both surface mount and through-hole components have been used.

A PCB in a computer mouse. The Component Side (left) and the printed side (right).

The Component Side of a PCB in a computer mouse; some examples for common components and their reference designations on the silk screen.

Component and solderside Conducting layers are typically made of thin copper foil. Insulating layers dielectric are typically laminated together with epoxy resin prepreg. The board is typically coated with a solder mask that is green in color. Other colors that are normally available are blue, black, white and red.

There are quite a few different dielectrics that can be chosen to provide different insulating values depending on the requirements of the circuit. Some of these dielectrics are polytetrafluoroethylene (Teflon), FR-4, FR-1, CEM-1 or CEM-3. Well known prepreg materials used in the PCB industry are FR-2 (Phenolic cotton paper), FR-3 (Cotton paper and epoxy), FR-4 (Woven glass and epoxy), FR-5 (Woven glass and epoxy), FR-6 (Matte glass and polyester), G-10 (Woven glass and epoxy), CEM-1 (Cotton paper and epoxy), CEM-2 (Cotton paper and epoxy), CEM-3 (Non-woven glass and epoxy), CEM-4 (Woven glass and epoxy), CEM-5 (Woven glass and polyester). Thermal expansion is an important consideration especially with ball grid array (BGA) and naked die technologies, and glass fiber offers the best dimensional stability. FR-4 is by far the most common material used today. The board with copper on it is called "copper-clad laminate".

SIX SIGMA

Six Sigma is a business management strategy, originally developed by Motorola in 1986.Six Sigma became well known after Jack Welch made it a central focus of his business strategy at General Electric in 1995, and today it is widely used in many sectors of industry. Six Sigma seeks to improve the quality of process outputs by identifying and removing the causes of defects (errors) and minimizing variability in manufacturing and business processes. It uses a set of quality management methods, including statistical methods, and creates a special infrastructure of people within the organization ("Black Belts", "Green Belts", etc.) who are experts in these methods. Each Six Sigma project carried out within an organization follows a defined sequence of steps and has quantified financial targets (cost reduction and/or profit increase).

Methods Six Sigma projects follow two project methodologies inspired by Deming's Plan-Do-Check-Act Cycle. These methodologies, composed of five phases each, bear the acronyms DMAIC and DMADV. AIC is used for projects aimed at improving an existing business process.

DMADV is used for projects aimed at creating new product or process designs.[15] DMADV is pronounced as "duh-mad-vee" (<d md vi>).

DMAIC The DMAIC project methodology has five phases:

Define the problem, the voice of the customer, and the project goals, specifically.

Measure key aspects of the current process and collect relevant data. Analyze the data to investigate and verify cause-and-effect relationships. Determine what the relationships are, and attempt to ensure that all factors have been considered. Seek out root cause of the defect under investigation.

Improve or optimize the current process based upon data analysis using techniques such as design of experiments, poka yoke or mistake proofing, and standard work to create a new, future state process. Set up pilot runs to establish process capability.

Origin and meaning of the term "six sigma process" The term "six sigma process" comes from the notion that if one has six standard deviations between the process mean and the nearest specification limit, as shown in the graph, practically no items will fail to meet specifications.This is based on the calculation method employed in process capability studies.

Capability studies measure the number of standard deviations between the process mean and the nearest specification limit in sigma units. As process standard deviation goes up, or the mean of the process moves away from the center of the tolerance, fewer standard deviations will fit between the mean and the nearest specification limit, decreasing the sigma number and increasing the likelihood of items outside specification.

OBJECTIVE OF SIX SIGMA Six sigma as agoal. Six sigma as a bench mark. Six sigma as a vision. Six sigma as a philosophy. Six sigma as a business policy. Six sigma as a tool. Six sigma as a method. Six sigma as a strategy. Six sigma as a metric.

PRINCIPLE OF SIX SIGMA

Elinghtment. Acceptance. Tool. Development. Result. renewable.

PROCESS ELEMENTS
Analysis of variation. Disciplined approach. Quantitative measures. Statistical methods. Process improvement.