ECE 438/538 Introduction to Integrated Circuit (IC) Fabrication Principles Fall Semester 2011

Instructor: Class Time: Office Hours: Pre-requisites: Text: Dr. S. Burkett, Houser 330, 348-4378, sburkett@eng.ua.edu 9:00-9:50 am MWF, Houser 304 TBD Basic Knowledge of Electronic Materials Stephen Campbell, Fabrication Engineering at the Micro- and Nanoscale, 3rd edition, Oxford Press, 2008.

Topics to Be Covered:

Overview of IC Processing (Ch. 1) Crystal Growth and Silicon Wafer Production (Ch. 2) Diffusion Processes & Thermal Oxidation (Ch. 3, 4) Ion Implantation (Ch. 5) Rapid Thermal Processing (Ch. 6) Optical Lithography and Photoresists (Ch. 7, 8) Advanced Lithography (Ch. 9) Vacuum Science and Plasmas (Ch. 10) Etching (Ch.11) Thin Film Deposition: Evaporation and Sputtering (Ch. 12) Thin Film Deposition: Chemical Vapor Deposition (Ch. 13) Epitaxy CVD (Ch. 14)

Web Site: The Web-site URL for this course is http://burkett.eng.ua.edu. Students are expected to access this Web site frequently to obtain important information about the course. The contents include the syllabus, schedule, assignments, and lecture notes. The site contents will be updated periodically. Homework: Homework will be assigned and collected. Students should make their best effort in these assignments. No credit will be given for homework turned in after the due date/time. You may discuss your homework with fellow classmates, however the responsibility for the material is up to each individual student and each student will generate his or her own solution to the assignment. Reading Assignments: Textbook readings will be assigned and students will be chosen randomly at the beginning of a lecture to provide a brief overview of the topic. A general format will be provided for this

overview. If students are absent (without prior notification to the instructor) when their name is chosen or do not provide satisfactory overviews, deductions from the final percentage will occur (see Attendance section). A students name can be chosen more than once although not more than twice. Exams: All exams are open book and closed notes. Three full period in-class examinations will be given during the semester. Please attend all exams. Make-up exams will not be given. A written, university-authorized excuse will be necessary to be excused from an exam. If this happens, a student will receive a grade for the missed exam that is composed of their average grade from the remaining two exams. Processing Projects Students will work in teams to acquire experience in some of the processes important in the fabrication of integrated circuits. It is not feasible to gain experience in all fabrication processes but a project involving self assembled three dimensional (3-D) structures will provide interesting hands-on experience in lithography, film deposition, and film etching. This project will require good team skills to complete the process and report the findings. Each team is required to give an oral presentation in class (week of 11/28) and a written report documenting all stages of the project including project management (e.g., individual team member responsibilities). The written report is due at the Final Exam Time: Monday, Dec. 12, 8-10:30 am. Basis for Final Grade: Percentage 5% 75% 10% 10% 100%

Homework Exams Processing Project Oral Presentation Processing Project Written Report TOTAL

Class Attendance: Attendance is encouraged for all classes. It is the responsibility of the student to make up any missed work for any absences. When a student knows they will not be able to attend class, they are asked to notify the instructor before class begins. This is especially important in the case the students name is chosen to provide the lecture overview. There are no points given for attending class or for providing the overview of a reading assignment. If a student is chosen to provide the overview and has not notified the instructor before class that they will not be attending, 2 percentage points will be deducted from the final percentage. If an overview is not satisfactory, 1 percentage point will be deducted from the final percentage. Academic Conduct:

All students in attendance at the University of Alabama are expected to be honorable and to observe standards of conduct appropriate to a community of scholars. The University expects from its students a higher standard of conduct than the minimum required to avoid discipline. Academic misconduct includes all acts of dishonesty in any academically related matter and any knowing or intentional help or attempt to help, or conspiracy to help, another student. All cases of academic misconduct will be handled promptly following the Universitys Academic Misconduct Disciplinary Policy. Disruptive Behavior: The Code of Student Conduct requires that students behave in a manner that is conducive to a teaching/learning environment. Students who engage in behavior that is disruptive or obstructive to the teaching/learning environment will be subject to disciplinary sanctions outlined by the Code of Student Conduct. Disruptive behavior is not limited to but may include the following: talking or using cell phones, reading the newspaper, physical abuse, verbal abuse, threats, stalking, intimidation, and harassment. Disability Statement: It is the policy of The University of Alabama to make reasonable accommodations for qualified individuals with disabilities. Students with disabilities are encouraged to register with the Office of Disability Services, 348-4285. Thereafter, you are invited to schedule an appointment to discuss accommodations and other special needs.