Xeon 7500 Xeon E7 8800 4800 2800 Families Guide

Intel Xeon Processor7500 Series Intel Xeon Processor E78800/4800/2800 Product Families
Thermal and Mechanical Design Guide

April 2011
Reference Number: 323342-002
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Thermal Mechanical Design Guide
Contents
1 Introduction .............................................................................................................. 9 1.1 References ....................................................................................................... 10 1.2 Definition of Terms ............................................................................................ 10 LGA1567 Socket ...................................................................................................... 13 2.1 Mechanical Requirements ................................................................................... 13 2.1.1 Attachment to Printed Circuit Board (PCB) ................................................. 13 2.1.2 Pad Dimensions ..................................................................................... 14 2.1.3 LGA1567 Socket NCTF Solder Joints.......................................................... 14 2.1.4 Socket Loading and Deflection Specifications.............................................. 15 2.1.5 Clarification of Static Compressive Load Values .......................................... 16 2.1.6 Critical-to-Function Interfaces .................................................................. 16 2.1.7 Pick-and-Place and Handling Cover ........................................................... 17 2.1.8 Socket Housing Material .......................................................................... 18 2.1.9 Socket Markings..................................................................................... 18 2.1.10 Solder Ball Characteristics ....................................................................... 18 2.2 Maximum Socket Temperature ............................................................................ 19 2.3 Electrical Requirements ...................................................................................... 19 Independent Loading Mechanism (ILM)................................................................... 21 3.1 Allowable Board Thickness.................................................................................. 21 3.2 Description of ILM Versions................................................................................. 21 3.3 ILM Assembly ................................................................................................... 22 3.4 ILM Back Plate Assembly .................................................................................... 23 3.5 ILM Load Specifications ...................................................................................... 24 3.6 ILM Cover ........................................................................................................ 24 3.6.1 HL-ILM Cover ........................................................................................ 25 3.6.2 LP-ILM Cover ......................................................................................... 25 3.7 Components Assembly ....................................................................................... 26 Processor Thermal Solutions ................................................................................... 29 4.1 Processor Thermal Targets ................................................................................. 29 4.2 Mechanical Targets ............................................................................................ 29 4.2.1 Package/Socket Stackup Height ............................................................... 30 4.2.2 Mechanical Parameters ........................................................................... 30 4.3 Intel Reference Design Heat Sink ........................................................................ 31 4.3.1 Allowable Board Thickness....................................................................... 31 4.3.2 Tower Heatsink Performance.................................................................... 31 4.3.3 Tower Heatsink Load Range ..................................................................... 31 4.3.4 Thermal Interface Material (TIM) .............................................................. 31 4.4 Heatsink Design Considerations........................................................................... 32 4.5 Thermal Interface Material (TIM) Considerations.................................................... 33 4.6 Mechanical Considerations .................................................................................. 33 4.7 Structural Considerations ................................................................................... 34 4.8 Thermal Design Guidelines ................................................................................. 34 4.8.1 Intel Turbo Boost Technology ................................................................ 34 4.8.2 Absolute Processor Temperature .............................................................. 35 4.8.3 Thermal Characterization Parameter ......................................................... 35 4.8.4 Fan Speed Control .................................................................................. 36 Quality, Reliability and Ecological Requirements...................................................... 39 5.1 Intel Reference Component Validation .................................................................. 39 5.1.1 Board Functional Test Sequence ............................................................... 39
5.2 5.3 5.4 5.5 A B C D E F
5.1.2 Post-Test Pass Criteria.............................................................................39 5.1.3 Recommended BIOS/Processor/Memory Test Procedures .............................39 Heatsink Test Conditions.....................................................................................40 LGA1567 Socket Reliability Testing and Results......................................................42 Socket Durability Test ........................................................................................42 Ecological Requirement.......................................................................................42
Supplier Information................................................................................................43 A.1 Intel Enabling Component Suppliers .....................................................................43 LGA 1567 Socket Mechanical Drawings ....................................................................45 Independent Loading Assembly (ILM) Drawings and Backplate Assembly Drawings ...........................................................51 Tower Heatsink Drawings ........................................................................................73 Enabled Component Board Keepout Drawings ..........................................................89 Electrical Methodology .............................................................................................97 F.1 Measuring Electrical Resistance of the Jumper .......................................................97 F.2 Determining Maximum Electrical Resistance ..........................................................97 F.3 Inductance .......................................................................................................98 F.3.1 Design Procedure for Inductance Measurements .........................................99 F.3.2 Correlation of Measurement and Model Data Inductance ............................ 100 F.4 Dielectric Withstand Voltage.............................................................................. 101 F.5 Insulation Resistance ....................................................................................... 101 F.6 Contact Current Rating ..................................................................................... 101
Figures
1-1 2-1 2-2 2-3 2-4 2-5 3-1 3-2 3-3 3-4 3-5 3-6 3-7 4-1 4-2 4-3 5-1 B-1 B-2 B-3 B-4 C-1 C-2 C-3 C-4 C-5 Socket Stack for the Intel Xeon Processor 7500 Series Platform .................................. 9 LGA1567 Socket with Pick and Place Cover Removed ....................................................13 Corner Pad Definition on board corresponding to nTCF Solder Balls .................................14 LGA1567 Socket Contact Numbering and NCTF Solder Joints (Shown in Gray) ..................15 Pick-and-Place Cover (PnP Cap)..................................................................................17 Recommended vias for Socket temperature measurement (shown in red) ........................19 High Load ILM (HL-ILM) Assembly (shown with PCB and Processor).................................23 Low Profile ILM (LP-ILM) Assembly (shown with PCB and Processor)................................23 Back Plate Assembly .................................................................................................24 HL-ILM Cover assembly onto HL-ILM ...........................................................................25 LP-ILM Cover Assembly onto LP-ILM ...........................................................................26 Socket and Backer Plate Assembly ..............................................................................27 ILM and Processor Assembly ......................................................................................27 Tower Heatsink Performance Curves for 130W..............................................................31 Processor Thermal Characterization Parameter Relationships ..........................................36 TCONTROL and Fan Speed Control .............................................................................37 Example Thermal Cycle - Actual Profile Will Vary...........................................................41 LGA 1567 Socket Mechanical Drawing Sheet 1 of 4.....................................................46 LGA 1567 Socket Mechanical Drawing Sheet 2 of 4.....................................................47 LGA 1567 Socket Mechanical Drawing Sheet 3 of 4.....................................................48 LGA 1567 Socket Mechanical Drawing Sheet 4 of 4.....................................................49 High-Load Independent Loading Assembly (HL-ILM) Mechanical Drawing Sheet 1 of 7.....52 High-Load Independent Loading Assembly (HL-ILM) Mechanical Drawing Sheet 2 of 7.....53 High-Load Independent Loading Assembly (HL-ILM) Mechanical Drawing Sheet 3 of 7.....54 High-Load Independent Loading Assembly (HL-ILM) Mechanical Drawing Sheet 4 of 7.....55 High-Load Independent Loading Assembly (HL-ILM) Mechanical Drawing Sheet 5 of 7.....56
C-6 High-Load Independent Loading Assembly (HL-ILM) Mechanical Drawing Sheet 6 of 7 .... 57 C-7 High-Load Independent Loading Assembly (HL-ILM) Mechanical Drawing Sheet 7 of 7 .... 58 C-8 Low-Profile Independent Loading Assembly (LP-ILM) Mechanical Drawing Sheet 1 of 8 ... 59 C-9 Low-Profile Independent Loading Assembly (LP-ILM) Mechanical Drawing Sheet 2 of 8 ... 60 C-10Low-Profile Independent Loading Assembly (LP-ILM) Mechanical Drawing Sheet 3 of 8 ... 61 C-11Low-Profile Independent Loading Assembly (LP-ILM) Mechanical Drawing Sheet 4 of 8 ... 62 C-12Low-Profile Independent Loading Assembly (LP-ILM) Mechanical Drawing Sheet 5 of 8 ... 63 C-13Low-Profile Independent Loading Assembly (LP-ILM) Mechanical Drawing Sheet 6 of 8 ... 64 C-14Low-Profile Independent Loading Assembly (LP-ILM) Mechanical Drawing Sheet 7 of 8 ... 65 C-15Low-Profile Independent Loading Assembly (LP-ILM) Mechanical Drawing Sheet 8 of 8 ... 66 C-16Backplate Assembly Drawing Sheet 1 of 5 ................................................................ 67 C-17Backplate Assembly Drawing Sheet 2 of 5 ................................................................ 68 C-18Backplate Assembly Drawing Sheet 3 of 5 ................................................................ 69 C-19Backplate Assembly Drawing Sheet 4 of 5 ................................................................ 70 C-20Backplate Assembly Drawing Sheet 5 of 5 ................................................................ 71 D-1 Tower Heatsink Drawing Sheet 1 of 14 ..................................................................... 74 D-2 Tower Heatsink Drawing Sheet 2 of 14 ..................................................................... 75 D-3 Tower Heatsink Drawing Sheet 3 of 14 ..................................................................... 76 D-4 Tower Heatsink Drawing Sheet 4 of 14 ..................................................................... 77 D-5 Tower Heatsink Drawing Sheet 5 of 14 ..................................................................... 78 D-6 Tower Heatsink Drawing Sheet 6 of 14 ..................................................................... 79 D-7 Tower Heatsink Drawing Sheet 7 of 14 ..................................................................... 80 D-8 Tower Heatsink Drawing Sheet 8 of 14 ..................................................................... 81 D-9 Tower Heatsink Drawing Sheet 9 of 14 ..................................................................... 82 D-10Tower Heatsink Drawing Sheet 10 of 14................................................................... 83 D-11Tower Heatsink Drawing Sheet 11 of 14................................................................... 84 D-12Tower Heatsink Drawing Sheet 12 of 14................................................................... 85 D-13Tower Heatsink Drawing Sheet 13 of 14................................................................... 86 D-14Tower Heatsink Drawing Sheet 14 of 14................................................................... 87 E-1 Enabled Component Board Keepout Mechanical Drawing Sheet 1 of 7 ............................................................................................................ 90 E-2 Enabled Component Board Keepout Mechanical Drawing Sheet 2 of 7 ............................................................................................................ 91 E-3 Enabled Component Board Keepout Mechanical Drawing Sheet 3 of 7 ............................................................................................................ 92 E-4 Enabled Component Board Keepout Mechanical Drawing Sheet 4 of 7 ............................................................................................................ 93 E-5 Enabled Component Board Keepout Mechanical Drawing Sheet 5 of 7 ............................................................................................................ 94 E-6 Enabled Component Board Keepout Mechanical Drawing Sheet 6 of 7 ............................................................................................................ 95 E-7 Enabled Component Board Keepout Mechanical Drawing Sheet 7of 7 ............................................................................................................. 96 F-1 Methodology for Measuring Total Electrical Resistance................................................... 97 F-2 Methodology for Measuring Electrical Resistance of the Jumper ...................................... 97 F-3 Inductance Measurement Fixture Cross-Section ........................................................... 99 F-4 Measurement Fixture Cross-Section.......................................................................... 100
Tables
1-1 1-2 2-1 2-2 2-3 Reference Documents ............................................................................................... 10 Terms and Descriptions ............................................................................................ 10 Socket Loading and Deflection Specifications ............................................................... 15 Critical-to-Function Interface Dimensions .................................................................... 17 LGA1567 Electrical Requirements ............................................................................... 19
3-1 3-2 4-1 4-2 4-3 4-4 4-5 5-1 A-1 A-2 A-3 B-1 C-1 D-1 E-1
ILM Comparison Summary.........................................................................................21 ILM Load Specifications .............................................................................................24 Processor Boundary Conditions and Performance Targets ...............................................29 Processor and LGA1567 Socket Stackup Height ............................................................30 Mechanical Parameters..............................................................................................30 TIM Specification ......................................................................................................32 Fan Speed Control, TCONTROL and DTS Relationship ...................................................37 Tower Heatsink Test Conditions and Qualification Criteria...............................................40 Suppliers for the Processor Heatsink ...........................................................................43 LGA1567 Socket and ILM Part Number and Supplier Contact Information .........................43 Alternate Suppliers with Thermal Solutions Designed for the Intel Xeon Processor 7500 Series................................................................................44 Mechanical Drawing List ............................................................................................45 Mechanical Drawing List ............................................................................................51 Mechanical Drawing List ............................................................................................73 Mechanical Drawing List ............................................................................................89
Revision History
Document Number 323342 323342 Revision Number 001 002 Public release Update Intel Xeon processor E7-8800/4800/2800 product families Description Revision Date March 2010 April 2011
Introduction
Introduction
This document provides guidelines for the design of thermal and mechanical solutions for the Intel Xeon processor 7500 series and the Intel Xeon processor E7-8800/ 4800/2800 product families. Both processors are compatible with the LGA1567 Socket (Chapter 2) and the ILM (Chapter 3). Both processors adhere to the same thermal specifications found in the Intel Xeon Processor E7-8800/4800/2800 Product Families Datasheet, Volume 1 and Intel Xeon Processor 7500 Series Datasheet, Volume 1 (see Table 1-1, Reference Documents). Thermal solutions designed for the Intel Xeon processor 7500 series will also be compatible with Intel Xeon processor E78800/4800/2800 product families (Chapter 4). The components described in this document include: The processor thermal solution (heatsink) and associated retention hardware The LGA1567 socket, Independent Loading Mechanism (ILM) and back plate Socket Stack for the Intel Xeon Processor 7500 Series Platform
Figure 1-1.
The goals of this document are: To assist board and system thermal mechanical designers
Introduction
To assist designers and suppliers of processor heatsinks Thermal profiles and other processor specifications are provided in Intel Xeon Processor E7-8800/4800/2800 Product Families Datasheet, Volume 1 and Intel Xeon Processor 7500 Series Datasheet, Volume 1.
1.1
References
Material and concepts available in the following documents may be beneficial when reading this document.
Table 1-1.
Reference Documents
Document Intel Xeon Processor 7500 Series Datasheet, Volume 1 Intel Xeon Processor 7500 Series Mechanical Model Intel Xeon Processor 7500 Series Thermal Model Intel Xeon Processor E7-8800/4800/2800 Product Families Datasheet, Volume 1 of 2 Intel Xeon Processor E7-8800/4800/2800 Product Families Datasheet, Volume 2 of 2 Intel 7500, 7510, and 7512 Scalable Memory Buffer Thermal/Mechanical Design Guidelines Doc# 323340-001 323530-001 323531-001 325119-001 325120-001 322828-002 Notes 1 1 1 1 1 1
Notes: 1. Document numbers indicated in Location column are subject to change. See IBP [http://tigris.intel.com/ scripts-edk/viewer/UI_UpdateDesignKits.asp?edkID=7281&ProdID=21201&CatID=0] for the most up-todate collateral list.
1.2
Table 1-2.
Definition of Terms
Terms and Descriptions (Sheet 1 of 2)
Term Bypass Description Bypass is the area between a passive heatsink and any object that can act to form a duct. For this example, it can be expressed as a dimension away from the outside dimension of the fins to the nearest surface. Digital Thermal Sensor reports a relative die temperature as an offset from TCC activation temperature. Fan Speed Control Integrated Heat Spreader: a component of the processor package used to enhance the thermal performance of the package. Component thermal solutions interface with the processor at the IHS surface. Independent Loading Mechanism provides the force needed to seat the 1567-LGA land package onto the socket contacts. The processor mates with the system board through this surface mount, 1567-land socket. The Platform Environment Control Interface (PECI) is a one-wire interface that provides a communication channel between Intel processor and chipset components to external monitoring devices. Case-to-ambient thermal resistance parameter (psi). A measure of thermal solution performance using total package power. Defined as (TCASE TLA) / Total Package Power. Heat source should always be specified for measurements. Case-to-sink thermal characterization parameter. A measure of thermal interface material performance using total package power. Defined as (TCASE TS) / Total Package Power.
DTS FSC IHS
ILM LGA1567 socket PECI
CA
CS
10
Introduction
Table 1-2.
Terms and Descriptions (Sheet 2 of 2)

Term SA TCASE TCASE_MAX TCC Description Sink-to-ambient thermal characterization parameter. A measure of heatsink thermal performance using total package power. Defined as (TS TLA) / Total Package Power. The case temperature of the processor, measured at the geometric center of the package substrate (not the IHS). The maximum case temperature as specified in a component specification. Thermal Control Circuit: Thermal monitor uses the TCC to reduce the die temperature by using clock modulation and/or operating frequency and input voltage adjustment when the die temperature is very near its operating limits. Tcontrol is a static value below TCC activation used as a trigger point for fan speed control. Thermal Design Power: Thermal solution should be designed to dissipate this target power level. TDP is not the maximum power that the processor can dissipate. A power reduction feature designed to decrease temperature after the processor has reached its maximum operating temperature. Line that defines case temperature specification of a processor at a given power level. Thermal Interface Material: The thermally conductive compound between the heatsink and the processor case. This material fills the air gaps and voids, and enhances the transfer of the heat from the processor case to the heatsink. The measured ambient temperature locally surrounding the processor. The ambient temperature should be measured just upstream of a passive heatsink or at the fan inlet for an active heatsink. The system ambient air temperature external to a system chassis. This temperature is usually measured at the chassis air inlets. A unit of measure used to define server rack spacing height. 1U is equal to 1.75 in, 2U equals 3.50 in, and so forth.
TCONTROL TDP Thermal Monitor Thermal Profile TIM
TLA
TSA U
11
Introduction
12
LGA1567 Socket
LGA1567 Socket
This section describes a surface mount, LGA (Land Grid Array) socket intended for Intel Xeon Processor 7500 Series and Intel Xeon processor E7-8800/4800/2800 product families. The socket provides I/O, power and ground contacts. The socket contains 1567contacts arrayed about a cavity in the center of the socket with lead-free solder balls for surface mounting on the motherboard. The socket has 1567 contacts with 1.016 mm X 1.016 mm pitch (X by Y) in a 52x46 grid with 32x24 grid depopulation in the center of the array and selective depopulation elsewhere. The socket must be compatible with the package (processor) and the Independent Loading Mechanism (ILM). The design includes a back plate which is integral to having a uniform load on the socket solder joints. Socket loading specifications are listed in Section 2-1. See Appendix A for LGA1567 Socket supplier information and part numbers.
Figure 2-1.
LGA1567 Socket with Pick and Place Cover Removed
2.1
2.1.1
Mechanical Requirements
Attachment to Printed Circuit Board (PCB)
The socket will be attached to the motherboard via its 1567 contact solder balls. There are no additional external methods (that is, screw, extra solder, adhesive, and so on) to attach the socket to the motherboard.
13
LGA1567 Socket
In installed condition, the socket is sandwiched between the processor package and the system board. An independent loading mechanism (ILM) will apply a static compression load, as described in this chapter.
2.1.2
Pad Dimensions
The system board must have a solder pad array matching socket BGA. Recommended solder pads are circular with a diameter of 0.45 mm (18 mils). They can be a combination of metal defined (MD) and solder mask defined (SMD). Intel recommends that pads under the nCTF joints be solder mask defined (SMD). These are shown as the 8 corner pads at each of the 4 corners (marked in green in Figure 2-2) and should have a 26 mil Cu pad size.
Figure 2-2.
Corner Pad Definition on board corresponding to nTCF Solder Balls
Also see Section 2.1.3.
2.1.3
LGA1567 Socket NCTF Solder Joints

Intel has defined selected solder joints of the socket as non-critical to function (NCTF) when evaluating package solder joints post environmental testing. The signals at NCTF locations are typically redundant ground or non-critical reserved, so the loss of the solder joint continuity at end of life conditions will not affect the overall product functionality. Figure 2-3 identifies the NCTF solder joints.
14
LGA1567 Socket
Figure 2-3.
LGA1567 Socket Contact Numbering and NCTF Solder Joints (Shown in Gray)
BM BL BK BJ BH BG BF BE BD BC BB BA AY AW AV AU AT AR AP AN AM AL AK AJ AH AG AF AE AD AC AB AA Y W V U T R P N M L K J H G F E D C B A 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46
2.1.4
Socket Loading and Deflection Specifications

Table 2-1 provides load and board deflection specifications for the LGA1567 Socket. These mechanical limits should not be exceeded during component assembly, mechanical stress testing, or standard drop and shipping conditions. All dynamic requirements are under room temperature conditions while all static requirements are under 100 C conditions.
Table 2-1.
Socket Loading and Deflection Specifications (Sheet 1 of 2)

SI Units Parameter Min Static Compressive per Contact Static Pre-Load Compressive Static Total Compressive Dynamic Compressive 15 289 578 Max 38 623 934 588 Unit gf N N N Min 0.53 60 110 Max 1.34 140 210 132 Unit ozf lbf lbf lbf 1 2 3 4 English Units Notes
15
LGA1567 Socket
Table 2-1.
Socket Loading and Deflection Specifications (Sheet 2 of 2)

SI Units Parameter Min Board Transient Strain Board Deflection under socket solder ball array under Maximum Static Compressive Load 62 mil boards 70 mil to 120 mil boards 0.30 0.25 mm mm 0.012 0.010 in. in. Max Unit Min Max Unit 5 6 English Units Notes
Notes: 1. The compressive load applied by the package on the LGA contacts to meet electrical performance. This condition must be satisfied throughout the life of the product. 2. The load applied by the ILM onto the socket through the processor package. 3. The total load applied by both the ILM and the heatsink onto the socket through the processor package. 4. Quasi-static equivalent compressive load applied during the mechanical shock from heatsink, calculated using a reference 600g heatsink with a 25G shock input and an amplification factor of 3 (600g x 25G x 3 = 99 lbf). This specification can have flexibility in specific values, but the ultimate product of mass times acceleration should not exceed this value. Intel reference system shock requirement for this product family is 25G input as measured at the chassis mounting location. 5. Maximum allowable strain below socket BGA corners during transient loading events (i.e., slow displacement events) which might occur during board manufacturing, assembly or testing. See the LGA1567 BFI Strain Guidance Sheet. Contact your CQE for this datasheet. 6. See Section 2.3 for more details. Reference Table 4-3, Mechanical Parameters.
2.1.5
Clarification of Static Compressive Load Values

The minimum Static Pre-Load Compressive value listed in Table 2-1, Socket Loading and Deflection Specifications is the force provided by the ILM and should be sufficient for rudimentary continuity testing of the socket and/or board. This load value will not ensure normal operation throughout the life of the product. Please see Table 3-2, ILM Load Specifications. The minimum Static Total Compressive value listed in Table 2-1, Socket Loading and Deflection Specifications will ensure socket reliability over the life of the product and that the contact resistance between the processor and the socket contacts meets the values outlined in Table 2-3, LGA1567 Electrical Requirements. Please refer to Section 4.2 for a more thorough description of load distribution for the various ILMs and heatsinks.
2.1.6
Critical-to-Function Interfaces
Critical-to-function (CTF) dimensions for motherboard layout and assembled components interface to the socket are identified in Table 2-2. The CTF values are detailed on the socket drawing, which is provided in Appendix B. All sockets manufactured must meet the specified CTF dimensions. These dimensions will be verified as part of the validation process.
Note:
Unless otherwise specified, interpret dimensions and tolerances in accordance with ASME Y14.5M-1994. Dimensions are in millimeters.
16
LGA1567 Socket
Table 2-2.
Critical-to-Function Interface Dimensions

Description Socket Package Alignment Cavity Length * Socket Package Alignment Cavity Width * Socket Height (from Package Seating Plane to MB after Reflow) * Seating Plane Co-planarity * Through Cavity Length Through Cavity Width Through Cavity X-Position Through Cavity Y-Position Stand-Off Gap (Solder Ball to Stand-Off) Solder Ball Feature Relating True Position Solder Ball Co-planarity Contact Height Above Seating Plane * Contact True Position * Contact Co-Planarity* Note: *Dimensions are to be measured post SMT. Sheet/Zone D91065 rev 2, Sheet 2, Zone G6 and G7 D91065 rev 2, Sheet 2, Zone F5 D91065 rev 2, Sheet 2, Zone A3 D91065 rev 2, Sheet 2, Zone C4 D91065 rev 2, Sheet 2, Zone D6 and D7 D91065 rev 2, Sheet 2, Zone E8 D91065 rev 2, Sheet 2, Zone D6 and D7 D91065 rev 2, Sheet 2, Zone E8 D91065 rev 2, Sheet 2, Zone C4 D91065 rev 2, Sheet 2, Zone C1 D91065 rev 2, Sheet 2, Zone B3 D91065 rev 2, Sheet 2, Zone A4 and A5 D91065 rev 2, Sheet 2, Zone C5 D91065 rev 2, Sheet 2, Zone B4 and B5
2.1.7
Pick-and-Place and Handling Cover

To facilitate high-volume manufacturing, the socket shall have a detachable cover to support the vacuum type Pick and Place system. The cover could also be used as a protective device to prevent damage to the contact field during motherboard assembly and handling. The cover design shall meet or exceed the applicable requirements of SEMI S8-0999, Safety Guidelines for Ergonomics/Human Factors Engineering of Semiconductor Manufacturing Equipment. The removal and replacement of the cover shall not cause any possible damage to the socket body, contact pins or the cover itself.
Figure 2-4.
Pick-and-Place Cover (PnP Cap)
17
LGA1567 Socket
2.1.8
Socket Housing Material

The socket housing material should be of thermoplastic or equivalent, UL 94 V-0 flame rating, temperature rating, and design capable of maintaining structural integrity following a temperature of 260C for 40 seconds, which is typical of a reflow/rework profile for solder material used on the socket. The material must have a thermal coefficient of expansion in the XY plane capable of passing reliability tests rated for an expected high-operating temperature, mounted on HTg FR4-type motherboard material. The creep properties of the material must be such that the mechanical integrity of the socket is maintained for the use condition outlined in Chapter 5.
2.1.9
Socket Markings
All markings required in this section must withstand a temperature of 260C for 40 seconds, which is typical of a reflow/rework profile for solder material used on the socket, as well as any environmental test procedure outlined in Chapter 5, without degrading.
2.1.9.1
Name
LF-LGA1567
Note:
(Font type is Helvetica Bold minimum 6 point (or 2.125 mm)).
This mark shall be stamped or laser marked into the sidewall of the stiffener plate on the actuation lever side.
Manufacturers insignia (font size at suppliers discretion).

This mark will be molded or laser marked into the top side of the socket housing. Both socket name and manufacturers insignia will be visible when first seated on the motherboard.
2.1.9.2
Lot Traceability
Each socket will be marked with a lot identification code to allow traceability of all components, date of manufacture (year and week), and assembly location. The mark must be placed on a surface that is visible after the socket is mounted on the motherboard. In addition, this identification code must be marked on the exterior of the box in which the unit is shipped.
2.1.9.3
Pin 1 Identification
The socket will have markings identifying Pin 1. This marking will be represented by a clearly visible triangular symbol in the location specified.
2.1.10
2.1.10.1
Solder Ball Characteristics

Number of Solder Balls
Total number of solder balls: 1567.
2.1.10.2
Material
Lead free solder alloy having a melting point temperature of 217C maximum (for example, SnAgCu) and be compatible with Immersions silver surface finish with SnAg/ SnAgCu solder paste.
18
LGA1567 Socket
2.2
Maximum Socket Temperature

The power dissipated within the socket is a function of the current at the pin level and the effective pin resistance. To ensure socket long term reliability, Intel defines socket maximum temperature using a via on the underside of the motherboard. Exceeding the temperature guidance may result in socket body deformation, or increases in thermal and electrical resistance which can cause a thermal runaway and eventual electrical failure. The guidance for socket maximum temperature is listed below: Via temperature under socket < 96 C The recommend via used for temperature measurement is defined by K22 - H25. See Figure 2-5.
Figure 2-5.
Recommended vias for Socket temperature measurement (shown in red)
The socket maximum temperature is defined at Thermal Design Current (TDC). In addition, the heatsink performance targets and boundary conditions of Table 4-1 and Table 4-2 must be met to limit power dissipation through the socket. To measure via temperature: 1. Drill a hole through the back plate at the specific via defined above. 2. Thread a T-type thermocouple (36 - 40 gauge) through the hole and glue it into the specific via on the underside of the motherboard. 3. Once the glue dries, reinstall the back plate and measure the temperature.
2.3
Electrical Requirements
LGA1567 electrical requirements (see Table 2-3) are measured from the socket-seating plane of the processor (end of the contacts) to the socket solder ball attach at the motherboard. All specifications are maximum values (unless otherwise stated) for a single socket contact, but includes effects of adjacent contacts where indicated. Socket inductance includes exposed metal from mated contact to the PCB land array. Reference Appendix F for the methodology used to determine these values.
Table 2-3.
LGA1567 Electrical Requirements (Sheet 1 of 2)

Parameter Maximum Mutual Capacitance, C Dielectric Withstand Voltage Insulation Resistance Value <0.33 pF > 360 Volts RMS > 800 m Notes The capacitance between two contacts
19
LGA1567 Socket
Table 2-3.
LGA1567 Electrical Requirements (Sheet 2 of 2)

Parameter Contact Resistance, total at End of Life (EOL), 26 C. Value 15.2 m Notes The socket contact resistance target is derived from the resistance of each chain minus resistance of shorting bars divided by number contacts within the daisy chain. The bulk resistance of the contact metal body, and interface resistance to the package LGA lands are included. This LLCR target applies with 1% failure rate at 60% confidence interval among all measured chains of the whole population being tested. Resistance of each contact as measured from tip to tip. Interface resistances are excluded. FEA model using minimum conductivity value can be used in lieu of measurement. The bulk resistance increase per contact from 24C to 100C The inductance calculated or measured for a pair of two adjacent contacts, considering one forward conductor and one return conductor. These values must be satisfied at the worstcase socket contact height (that is, minimum deflection) in assembled configuration The inductance on a contact due to any single neighboring contact. Measurements/simulations conditions: 1. Termination impedance: 90 Ohm, differential 2. Test structure overview will be provided later 3. All details of Frequency domain S parameters specs will be provided in later revision Linear region (usually found at higher frequency ranges) Capacitively dominated region (usually the lowest measurable frequency)
Contact Bulk Resistance, at 26 C
9.5 m
Contact Bulk Resistance Increase Total Loop Inductance, Loop
3 m <3.9 nH
Mated partial mutual inductance, L Differential return loss Differential Insertion loss Cross-talk
< 0.95 nH < -13 dB < |-0.6 dB| < -25 dB
Measurement frequency(s) for Contact-to-Contact inductance. Measurement frequency(s) for Contact-to-Contact capacitance.
1 GHz 400 MHz
20
Independent Loading Mechanism (ILM)

The Independent Loading Mechanism (ILM) provides the force needed to seat the 1567-Land LGA package (i.e., processor) onto the socket contacts. The ILM is physically separate from the socket body. The ILM consists of two major components, the ILM cover and the back plate, that will be procured as a set from the enabled vendors. The assembly of the ILM is expected to occur after the socket is surface mounted. The exact assembly location is dependent on manufacturing preference and test flow. See the Manufacturing Advantage Service collateral for this platform for additional guidance. The ILM has two critical functions: Deliver the force to seat the processor onto the socket contacts Distribute the resulting load evenly through the socket solder balls
3.1
Allowable Board Thickness

The components described in this document (namely ILM, back plate and heatsink) will support board thickness in the range of 1.8 - 3.0 mm (0.072" - 0.118"). Boards (PCBs) not within this range may require modifications to the back plate and heatsink retention. Please contact the component suppliers for modifications (see Appendix A, Intel Enabling Component Suppliers).
3.2
Description of ILM Versions

There are two versions (SKUs) of ILM for the Nehalem-EX processor. The first version (as described in Rev 1.0 and previous) has been renamed to High-Load ILM (HLILM). The second version of the ILM, called the Low Profile ILM (LP-ILM), has important differences. The Low Profile ILM was developed to eliminate the need for a pedestal on the processor heatsink. An unavoidable trade-off is a reduction in the applied load by the Low Profile ILM. This requires that heatsink solutions implementing the LP-ILM will need to increase the load applied to the top of the IHS. Another requirement for heatsinks implementing the LP-ILM will be two small pockets in the heatsink bottom to clear the fingers which touch the top of the IHS. A summary of these differences is articulated in the following table.
Table 3-1.
ILM Comparison Summary (Sheet 1 of 2)

High Load ILM (HL-ILM) ILM Applied Load FILM Heatsink Applied Load 1 FHEATSINK Min. Max Min. Max 80 lbf / 400 N 140 lbf / 623 N 30 lbf / 178 N 70 lbf / 311 N Low Profile ILM (LP-ILM) 60 lbf / 289 N 105 lbf / 467 N 50 lbf / 289 N 105 lbf / 467 N
Therrmal Mechanical Design Guide
21
Table 3-1.
ILM Comparison Summary (Sheet 2 of 2)

High Load ILM (HL-ILM) Socket Static Total Compressive Load 2 FSOCKET Min. Max 0.022 2.5mm pedestal Low Profile ILM (LP-ILM)
110 lbf / 578 N 210 lbf / 934 N 0 (baseline) 2 pockets (~14x12x2.5mm)
Thermal resistance impact (C/W) Heatsink required features
Notes: 1. See Table 4-3, Mechanical Parameters, for more information on heatsink applied loads for each ILM implementation. 2. See Table 2-1, Socket Loading and Deflection Specifications, for Static Total Compressive Load values. Socket load is the addition of the ILM and Heatsink applied load according to the equation: FILM + FHEATSINK = FSOCKET
A picture of each ILM version is shown in Figure 3-1 and Figure 3-2. Both ILM versions will be build to print from Intel controlled drawings. See Appendix C for drawings. See Appendix A, Intel Enabling Component Suppliers for ILM supplier information and part numbers.
3.3
ILM Assembly
The ILM is an assembly of a load plate, a frame, and a lever. Four fasteners secure the ILM frame to the backer plate. All pieces in the ILM assembly, except the frame and fasteners, are fabricated from stainless steel and plated where appropriate. The frame is made from high-strength steel. The fasteners are fabricated from a high-carbon steel. The frame provides the hinge locations for the load lever and load plate. The ILM design ensures that once installed onto the baseboard and secured to the backer plate, the only features touching the board are the captive fasteners. The nominal gap of the frame to the board is ~1 mm. When the load plate is closed, compressive load is applied onto the processor package from the top of the IHS at two points. See load plate dimpled features shown in Figure 3-1. The reaction force from closing the load plate is transmitted to the frame and through the captive fasteners to the backer plate. Some of the load is passed through the socket body to the board, inducing a slight compression on the solder joints.
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Figure 3-1.
High Load ILM (HL-ILM) Assembly (shown with PCB and Processor)
Figure 3-2.
Low Profile ILM (LP-ILM) Assembly (shown with PCB and Processor)
3.4
ILM Back Plate Assembly

The back plate consists of a flat steel back plate with four internally threaded inserts for ILM attach, and two inserts for heatsink attach. The inserts are press fit into the back plate. A cavity is located at the center of the plate to allow access to the baseboard test points and backside capacitors. An insulator is pre-applied to prevent shorting the board.
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Both versions of the ILM (the LP-ILM and the HL-ILM) are compatible with this back plate. Figure 3-3. Back Plate Assembly Heatsink attach points (x2)
Cavity
Insulator ILM attach points (x4)
3.5
ILM Load Specifications

The HL-ILM is designed to achieve the minimum Socket Static Pre-Load Compressive load specification. The thermal solution (heatsink) should apply additional load to achieve the Socket Static Total Compressive load (see Table 2-1, Socket Loading and Deflection Specifications). The heatsink load will be applied to the IHS (Integrated Heat Spreader). The dual-loading approach is represented by the following equation:
FILM + FHEATSINK = FSOCKET

The ILM static load targets are given in Table 3-2. Table 3-2. ILM Load Specifications
SI Units (N) Parameter Min HL-ILM Static Compressive Load LP-ILM Static Compressive Load 356 267 Max 623 467 Min 80 60 Max 140 105 Nominal load = 467 N / 105 lbf Nominal load = 334 N / 75 lbf English Units (lbf) Notes
3.6
ILM Cover
To provide additional protection to during manufacturing and handling, an ILM Cover is available to help mitigate damaging socket contacts. The ILM cover provides protection until a processor is installed.
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There are several versions developed that snap into the ILM. Please see Table A-2, LGA1567 Socket and ILM Part Number and Supplier Contact Information for ordering information. There is an ILM Cover for each version of ILM.
3.6.1
HL-ILM Cover
The HL-ILM Cover cannot coexist with the LGA1567 Pick and Place Cover as shown in Figure 3-4. Meaning that the operator will need to remove the Socket Cap in order to install the ILM Cover. Please see Table A-2, LGA1567 Socket and ILM Part Number and Supplier Contact Information.
Figure 3-4.
HL-ILM Cover assembly onto HL-ILM
3.6.2
LP-ILM Cover
The LP-ILM Cover cannot coexist with the LGA1567 Pick and Place Cover as shown in Figure 3-5. In fact, the LGA1567 Pick and Place Cover (Socket Cover) will not physically fit under the LP-ILM load plate once closed. Please see Table A-2, LGA1567 Socket and ILM Part Number and Supplier Contact Information.
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Figure 3-5.
LP-ILM Cover Assembly onto LP-ILM
3.7
Components Assembly
The Intel Xeon processor 7500 series thermal mechanical solution assembly begins with surface mounting the LGA1567 socket onto the baseboard. The remaining steps assume the socket is already surface-mounted: 1. Back Plate and ILM Installation: The standoff pattern on the backer plate also acts as a key-in feature. Align the backer plate standoff pattern to the baseboards hole pattern before mating the backer plate to the baseboard. Before installing the ILM, be sure that it is already assembled with the lever and the fasteners. The ILM fastener pattern also acts as a key-in feature. Align the ILM fastener pattern to the baseboard hole pattern. Tighten the fasteners with the matching torque driver set to ~8 in-lbf [0.9 N.m]. Verify that the ILM and the backer plate are properly installed. There should be a uniform gap between the ILM and the base board, and virtually no gap between the backer plate and the baseboard. 2. Processor Installation: Release the ILM lever to access the LGA1567 socket. Carefully remove the socket cover to avoid damaging the socket contacts. Inspect the socket for contact damage or foreign materials. Orient the processor such that the processor pin1 faces the same direction as the socket pin1. Carefully place the processor on the socket and verify that it is seated properly. Two side protrusions on the socket will prevent the package from resting flat on the socket if the processor is not properly aligned to the socket. Close the ILM cover and secure the lever. For more detailed installation instructions as well as recommendations on board manufacturing, please download the Intel Xeon Processor 7500 Series-based Platform Manufacturing Advantage Service document found on http://learn.intel.com (please input code: ME709).
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Figure 3-6.
Socket and Backer Plate Assembly
Figure 3-7.
ILM and Processor Assembly
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28
Processor Thermal Solutions

This section describes the design guidelines for Intel Xeon processor 7500 Series thermal solutions. Also included are the Intel reference heatsink design specifications. Intels reference thermal solutions which were designed for the Intel Xeon Processor 7500 series will also be compatible with Intel Xeon processor E7-8800/ 4800/2800 product families thermal specifications.
4.1
Processor Thermal Targets

Table 4-1 provides thermal boundary conditions and performance targets for both the Intel Xeon Processor 7500 series and the Intel Xeon processor E7-8800/4800/2800 product families. These values should guide thermal solution design.
Table 4-1.
Processor Boundary Conditions and Performance Targets

Parameter Altitude, system ambient temp TDP TLA1 95W 42oC
2
Value Sea level, 35oC 105W 42oC

oC/W
130W 45oC
oC/W
CA
0.255
0.206
0.185 oC/W 0.185 oC/W 36 CFM @ 0.20 P 4U 100 x 70 x 102.5mm Cu/Al base / Al fins / heatpipes
CA_MAX3
Airflow4 System height (form factor)5 Heatsink volumetric6 Heatsink technology7
0.295 oC/W 12.6 CFM @ 0.34 P 1U 90 x 90 x 26.5mm Cu base, Al fins
0.210 oC/W 28 CFM @ 0.25 P 2U 90 x 90 x 51mm Cu base, Al fins
Notes: 1. Local ambient temperature of the air entering the heatsink. 2. Estimated performance for each heatsink based on the form factor, technology, material, and boundary conditions. These estimates are not necessarily the thermal performance targets needed to meet processor thermal specifications. Please see Intel Xeon Processor 7500 Series Datasheet, Volume 1 and Intel Xeon Processor E7-8800/4800/2800 Product Families Datasheet, Volume 1 for processor thermal specifications. 3. Defined as (TCASE_MAX - TLA) / TDP 4. Airflow through the heatsink fins with zero bypass. Max target for pressure drop (P) measured in inches H2O. 5. Reference system configuration. 1U = 1.75. 6. Dimensions of heatsink do not include socket or processor. 7. Passive heatsinks with Honeywell* PCM45F
4.2
Mechanical Targets
Thermal solutions should be designed to meet the mechanical requirements described in this section. Keep in mind that the heatsink retention will need to apply additional load in order to achieve the minimum Socket Static Total Compressive load (see Table 2-1, Socket Loading and Deflection Specifications). This load should be distributed over the IHS (Integrated Heat Spreader). The dual-loading approach is represented by the following equation.
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FILM + FHEATSINK = FSOCKET

Values for the Heatsink applied loads are given in Table 4-3.
4.2.1
Package/Socket Stackup Height

Table 4-2 provides the stackup height of a processor and LGA1567 socket with processor fully seated on the socket seating plane.
Table 4-2.
Processor and LGA1567 Socket Stackup Height

Integrated Stackup Height (mm) From Top of Board to Top of IHS 7.599 0.50 mm
Notes: 1. This data is provided for information only, and should be derived from: (a) the height of the socket seating plane above the motherboard after reflow, given in Appendix B, LGA 1567 Socket Mechanical Drawings, (b) the height of the package, from the package seating plane to the top of the IHS, and accounting for its nominal variation and tolerances that are given in Intel Xeon Processor 7500 Series Datasheet, Volume 1 and Intel Xeon Processor E7-8800/4800/2800 Product Families Datasheet, Volume 1.
4.2.2
Table 4-3.
Mechanical Parameters
Mechanical Parameters
SI Units Parameter Min Max Unit g 133 222 311 467 445 N N N N 155 7.9 356 N N-m N 30 50 Min Max 1.32 70 105 100 210 35 70 80 Unit lbm lbf lbf lbf lbf lbf lbf-in lbf 4 2,3 2,3 2,5,6 1 1 1 1 English Units Notes
Thermal Solution Mass (includes retention) Heatsink Applied Static Compressive Load (High Load ILM implementation) Heatsink Applied Static Compressive Load (Low Profile ILM implementation) Heatsink Applied Dynamic only Compressive load Processor Static Compressive Load Processor Tensile Load Processor Torque Load Processor Shear Load
Notes: 1. In the case of a discrepancy, the most recent datasheets supersede targets listed in the above table. 2. These specifications apply to uniform compressive loading in a direction perpendicular to the IHS top surface. 3. This is the minimum and maximum static force that can be applied by the heatsink and retention solution to maintain the heatsink and processor interface. 4. This specification applies for either thermal retention solutions that prevent baseboard deflection or for the Intel reference thermal solution. 5. Dynamic loading is defined as an 11 ms duration average load superimposed on the static load requirement. 6. An experimentally validated test condition used a heatsink mass of acceleration measured on a shock table with a dynamic amplification factor of 3. This specification can have flexibility in specific values, but the ultimate product of mass times acceleration should not exceed this validated dynamic load.
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4.3
4.3.1
Intel Reference Design Heat Sink

Allowable Board Thickness
The Tower heat sink described in Section 4.3 will support board thickness in the range of 1.8 - 3.0 mm (0.072" - 0.118"). Boards (PCBs) not within this range may require modifications to the back plate and heatsink retention. Please contact suppliers for modifications (see Appendix A, Intel Enabling Component Suppliers).
4.3.2
Tower Heatsink Performance

See Appendix D for detailed drawings of the Tower (4U) reference heatsink. Figure 4-1 shows thermal resistance (CA) and pressure drop (P) for the 4U heatsink versus the airflow provided. Best-fit equations are provided to prevent errors associated with reading the graph. They are: P = (2.407 x 10-05) * CFM2 + (4.526 x 10-03) * CFM CA NU = 0.1431 + 1.9451*CFM-1.0719
Figure 4-1.
Tower Heatsink Performance Curves for 130W
4.3.3
Tower Heatsink Load Range

The Tower Heatsink was thermally validated for the load range of 40 lbf to 70 lbf. This is different than the Heatsink Applied Static Compressive Load range listed in Table 4-3, Mechanical Parameters (that is, 30 lbf to 70 lbf) and may have a small effect on the heatsink performance.
4.3.4
Thermal Interface Material (TIM)

Honeywell PCM45F material was chosen for the Intel reference design. This material will be pre-applied onto the Tower heatsink pedestal.
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The recommended size ensures adequate coverage at the interface between the processor IHS and heatsink pedestal. Table 4-4. TIM Specification
SI Units Parameter Min TIM Size 24 x 33 by 0.43 thick Max Unit mm Min 0.94 x 1.30 by 0.017 thick 28 Max Unit in. Dimensions applies to Honeywell* PCM45F p/n: 95367 Load required to meet min. TIM pressure (15 psi) English Units Notes
PCM45F Activation Load
lbf
Refer to the TIM manufacturers guidelines for specifications and handling instructions.
4.4
Heatsink Design Considerations

To remove the heat from the processor, three basic parameters should be considered: The area of the surface on which the heat transfer takes place Without any enhancements, this is the surface of the processor package IHS. One method used to improve thermal performance is to attach a heatsink to the IHS. A heatsink can increase the effective heat transfer surface area by conducting heat out of the IHS and into the surrounding air through fins attached to the heatsink base. The conduction path from the heat source to the heatsink fins Providing a direct conduction path from the heat source to the heatsink fins and selecting materials with higher thermal conductivity typically improves heatsink performance. The length, thickness, and conductivity of the conduction path from the heat source to the fins directly impact the thermal performance of the heatsink. In particular, the quality of the contact between the package IHS and the heatsink base has a higher impact on the overall thermal solution performance as processor cooling requirements become strict. Thermal interface material (TIM) is used to fill in the gap between the IHS and the bottom surface of the heatsink, and thereby improves the overall performance of the thermal stackup (IHS-TIM-Heatsink). With extremely poor heatsink interface flatness or roughness, TIM may not adequately fill the gap. The TIM thermal performance depends on its thermal conductivity as well as the pressure load applied to it. Refer to Section 4.5 for further information on the TIM between the IHS and the heatsink base. The heat transfer conditions on the surface upon which heat transfer takes place Convective heat transfer occurs between the airflow and the surface exposed to the flow. It is characterized by the local ambient temperature of the air, TLA, and the local air velocity over the surface. The higher the air velocity over the surface, the more efficient the resulting cooling. The nature of the airflow can also enhance heat transfer via convection. Turbulent flow can provide improvement over laminar flow. In the case of a heatsink, the surface exposed to the flow includes the fin faces and the heatsink base. An active heatsink typically incorporates a fan that helps manage the airflow through the heatsink. Passive heatsink solutions require in-depth knowledge of the airflow in the chassis. Typically, passive heatsinks see slower air speed. Therefore, these heatsinks are typically larger (and heavier) than active heatsinks due to the increase in fin surface necessary to meet a required performance. As the heatsink fin density (the number of fins in a given cross-section) increases, the resistance to the airflow increases; it is
32
more likely that the air will travel around the heatsink instead of through it, unless air bypass is carefully managed. Using air-ducting techniques to manage bypass area is an effective method for maximizing airflow through the heatsink fins.
4.5
Thermal Interface Material (TIM) Considerations

Thermal Interface Material between the processor IHS and the heatsink base is necessary to improve thermal conduction from the IHS to the heatsink. Many thermal interface materials can be pre-applied to the heatsink base prior to shipment from the heatsink supplier without the need for a separate TIM dispense or attachment process in the final assembly factory. All thermal interface materials should be sized and positioned on the heatsink base in a way that ensures that the entire area is covered. It is important to compensate for heatsink-to-processor positional alignment when selecting the proper TIM size. When pre-applied material is used, it is recommended to have a protective cover. Protective tape is not recommended as the TIM could be damaged during its removal step. Thermal performance usually degrades over the life of the assembly and this degradation needs to be accounted for in the thermal performance. Degradation can be caused by shipping and handling, environmental temperature, humidity conditions, load relaxation over time, temperature cycling or material changes (most notably in the TIM) over time. For this reason, the measured TCASE value of a given processor may increase over time, depending on the type of TIM material.
4.6
Note:
Mechanical Considerations
Determining the performance for any thermal/mechanical solution is the responsibility of the customer. An attachment mechanism must be designed to support the heatsink because there are no features on the LGA1567 socket on which to directly attach a heatsink. In addition to holding the heatsink in place on top of the IHS, this mechanism plays a significant role in the performance of the system, in particular: Ensuring thermal performance of the TIM applied between the IHS and the heatsink. TIMs, especially those based on phase change materials, are very sensitive to applied pressure: the higher the pressure, the better the initial performance. TIMs such as thermal greases are not as sensitive to applied pressure. Refer to Section 4.2.2 for information on trade-offs made with TIM selection. Designs should consider the possible decrease in applied pressure over time due to potential structural relaxation in enabled components. Ensuring system electrical, thermal, and structural integrity under shock and vibration events. The mechanical requirements of the attachment mechanism depend on the weight of the heatsink and the level of shock and vibration that the system must support. The overall structural design of the baseboard and system must be considered when designing the heatsink attachment mechanism. Their design should provide a means for protecting LGA1567 socket solder joints, as well as preventing package pullout from the socket.
Note:
The load applied by the attachment mechanism must comply with the package specifications, along with the dynamic load added by the mechanical shock and vibration requirements, as identified in Table 4-3.
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A potential mechanical solution for heavy heatsinks is the use of a supporting mechanism such as a backer plate or the utilization of a direct attachment of the heatsink to the chassis pan. In these cases, the strength of the supporting component can be utilized rather than solely relying on the baseboard strength. In addition to the general guidelines given above, contact with the baseboard surfaces should be minimized during installation in order to avoid any damage to the baseboard. The Intel reference design for the Intel Xeon processor 7500 series uses such a heatsink attachment scheme. Refer to Section 4.4 for further information regarding the Intel reference mechanical solution.
4.7
Structural Considerations
The mass of the tower heatsinks should not exceed 600 g. From Table 4-3, the Dynamic Compressive Load of 100 lbf max allows for designs that exceed 600 g as long as the mathematical product does not exceed 100 lbf. Example: A heatsink of 1.5 lbm (680 g) x 35G (acceleration) x 1.9 Dynamic Amplification Factor = 100 lbf. The heatsink limit of 600g and the use of a back plate have eliminated the need for Direct Chassis Attach retention (as used with the previous Intel Xeon Processor 5000 Sequence). Direct contact between back plate and chassis pan will help minimize board deflection during shock. Placement of board-to-chassis mounting holes also impacts board deflection and resultant socket solder ball stress. Customers need to assess the shock for their designs as heatsink retention (back plate), heatsink mass and chassis mounting holes may vary.
4.8
4.8.1
Thermal Design Guidelines

Intel Turbo Boost Technology
Intel Turbo Boost Technology is a new feature available on certain processor SKUs that opportunistically, and automatically allow the processor to run faster than the marked frequency if all of the following conditions are met: 1. Processor operating at Base Frequency (that is, P1 P-state) 2. Power management not active (i.e., not throttling) 3. Processor operating below its temperature limit (that is, DTS < 0) 4. Processor operating below its power and current limits (that is, < TDP and <ICC_MAX). Heatsink performance (lower CA as described in Section 4.8) is one of several factors that can impact the amount of Turbo Mode benefit. Other factors are operating environment, workload and system design. With Turbo Mode enabled, the processor may run more consistently at higher power levels (but still within TDP), and be more likely to operate above TCONTROL, as compared to when Turbo Mode is disabled. This may result in higher acoustics.
34
Increased IMON accuracy may provide more Turbo Boost benefit on TDP limited applications, as compared to lower CA, as temperature is not typically the limiter for these workloads. See Voltage Regulator Module (VRM) and Enterprise Voltage Regulator-Down (EVRD) 11.1 Design Guidelines (DocID: 397898) for more information regarding IMON accuracy.
4.8.2
Absolute Processor Temperature

Intel does not test any third party software that reports absolute processor temperature. As such, Intel cannot recommend the use of software that claims this capability. Since there is part-to-part variation in the TCC (thermal control circuit) activation temperature, use of software that reports absolute temperature can be misleading.
4.8.3
Thermal Characterization Parameter

The case-to-local ambient Thermal Characterization Parameter (CA) is defined by:
Equation 4-1.CA = (TCASE - TLA) / TDP Where: TCASE TLA TDP = Processor case temperature (C). For TCASE specification see Intel Xeon Processor E7- 8800/4800/2800 Product Families Datasheet Volume 1of 2. Local ambient temperature in chassis at processor (C). TDP (W) assumes all power dissipates through the integrated heat spreader. This inexact assumption is convenient for heatsink design. TTVs are often used to dissipate TDP. Correction offsets account for differences in temperature distribution between processor and TTV.
= =
Equation 4-2.CA = CS + SA Where: CS SA = = Thermal characterization parameter of the TIM (C/W) is dependent on the thermal conductivity and thickness of the TIM. Thermal characterization parameter from heatsink-to-local ambient (C/W) is dependent on the thermal conductivity and geometry of the heatsink and dependent on the air velocity through the heatsink fins.
Figure 4-2 illustrates the thermal characterization parameters.
35
Figure 4-2.
Processor Thermal Characterization Parameter Relationships
4.8.4
Fan Speed Control

Fan speed control (FSC) techniques to reduce system-level acoustic noise are a common practice in server designs. The fan speed is one of the parameters that determines the amount of airflow provided to the thermal solution. Additionally, airflow is proportional to a thermal solutions performance, which consequently determines the TCASE of the processor at a given power level. Because the TCASE of a processor is an important parameter in determining the long-term reliability of a processor, the FSC implemented in a system directly correlates to the processors ability to meet the Thermal Profile. For this purpose, the parameter called TCONTROL, as explained in the applicable datasheet, is to be used in FSC designs to ensure that the long-term reliability of the processor is met while keeping the system-level acoustic noise down. Figure 4-3 depicts the relationship between TCONTROL and FSC methodology.
36
Figure 4-3.
TCONTROL and Fan Speed Control

Tcase_Max
Tcase
Thermal Profile
Tcase @ Tcontrol
Pcontrol
TDP
Power
The PECI temperature reading from the processor can be compared to this TCONTROL value. A fan speed control scheme can be implemented as described in Table 4-5 without compromising the long-term reliability of the processor. Table 4-5. Fan Speed Control, TCONTROL and DTS Relationship
Condition DTS TCONTROL DTS >TCONTROL FSC Scheme FSC can adjust fan speed to maintain DTS TCONTROL (low acoustic region). FSC should adjust fan speed to keep TCASE at or below the Thermal Profile specification (increased acoustic region).
There are many different ways of implementing fan speed control, including FSC-based on processor ambient temperature, FSC based on processor Digital Thermal Sensor (DTS) temperature, or a combination of the two. If FSC is based only on the processor ambient temperature, low acoustic targets can be achieved under low ambient temperature conditions. However, the acoustics cannot be optimized based on the behavior of the processor temperature. If FSC is based only on the Digital Thermal Sensor, sustained temperatures above TCONTROL drive fans to maximum RPM. If FSC is based both on the ambient and Digital Thermal Sensor, ambient temperature can be used to scale the fan RPM controlled by the Digital Thermal Sensor. This would result in an optimal acoustic performance. Regardless of which scheme is employed, system designers must ensure that the Thermal Profile specification is met when the processor Digital Thermal Sensor temperature exceeds the TCONTOL value for a given processor.
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38
Quality, Reliability and Ecological Requirements
5
5.1

Intel Reference Component Validation
Intel tests reference components both individually and as an assembly on mechanical test boards, and assesses performance to the envelopes specified in previous sections by varying boundary conditions. While component validation shows that a reference design is tenable for a limited range of conditions, customers need to assess their specific boundary conditions and perform reliability testing based on their use conditions. Intel reference components are also used in board functional tests to assess performance for specific conditions.
5.1.1
Board Functional Test Sequence

Each test sequence should start with components (baseboard, heatsink assembly, and so on) that have not been previously submitted to any reliability testing. The test sequence should always start with a visual inspection after assembly and BIOS/Processor/memory test. The stress test should then be followed by a visual inspection and then by a BIOS/processor/memory test.
5.1.2
Post-Test Pass Criteria

The post-test pass criteria are: 1. No significant physical damage to the heatsink and retention hardware. 2. Heatsink remains seated and its bottom remains mated flat against the IHS surface. No visible gap between the heatsink base and processor IHS. No visible tilt of the heatsink with respect to the retention hardware. 3. No signs of physical damage on baseboard surface due to impact of heatsink. 4. No visible physical damage to the processor package. 5. Successful BIOS/processor/memory test. 6. Thermal compliance testing to demonstrate that the case temperature specification can be met.
5.1.3
Recommended BIOS/Processor/Memory Test Procedures

This test is to ensure proper operation of the product before and after environmental stresses, with the thermal mechanical enabling components assembled. The test shall be conducted on a fully operational baseboard that has not been exposed to any battery of tests prior to the test being considered. The testing setup should include the following components, properly assembled and/or connected: Appropriate system baseboard Processor and memory
39
All enabling components, including socket and thermal solution parts The pass criterion is that the system under test shall successfully complete the checking of BIOS, basic processor functions and memory, without any errors.
5.2
Heatsink Test Conditions

The Test Conditions provided in Table 5-1 address processor heatsink failure mechanisms only. Test Conditions, Qualification and Visual Criteria vary by customer; Table 5-1 reflects Intel requirements.
Table 5-1.
Assessment 1) Humidity
Tower Heatsink Test Conditions and Qualification Criteria (Sheet 1 of 2)

Test Condition Non-operating, 500 hours, +85C and 85% R.H. 168 hours. 50% to 85% non-condensing at temperatures of 25C to 70C. Ramp rate Humidity 18% per hour; Temp. 23C per hour. Qualification Criteria No visual defects. As verified in wind tunnel: Mean CA + 3 + offset not to exceed value in Table 4-1 Pressure drop not to exceed value in Table 4-1. No damage to heatsink base or pipe. No visual defects. As verified in wind tunnel: Mean CA + 3 + offset not to exceed value in Table 4-1. Pressure drop not to exceed value in Table 4-1. No damage to heatsink base or pipe. No visual defects. As verified in wind tunnel: Mean CA + 3 + offset not to exceed value in Table 4-1 Pressure drop not to exceed value in Table 4-1 Meet all dimensions on 5 samples. Meet all CTF dimensions on 32 additional samples with 1.33 Cpk (mean + 4). If samples are soft-tooled, a hard tool plan must be defined. No visual defects Min Sample Size 12
2) Board-Level UnPackaged Shock
50G10%; 17010% in/sec; 3 drops per face, 6 faces.
12
3) Board-Level UnPackaged Vibration
5 Hz @ 0.01 g2/Hz to 20 Hz @ 0.02 g2/Hz (slope up). 20 Hz to 500 Hz @ 0.02 g2/Hz (flat). Input acceleration is 3.13 g RMS. 10 minutes/axis for all 3 axes on all samples. Random control limit tolerance is 3 dB. Not Applicable
12
4) First Article Inspection
37
5) Shipping Media: Packaged Shock 6) Shipping Media: Packaged Vibration 7) Thermal Performance
Drop height determined by weight and may vary by customer; Intel requirement in General Supplier Packaging Spec. 10 drops (6 sides, 3 edges, 1 corner) 0.015 g2/Hz @ 10-40 Hz, sloping to 0.0015 g2/ Hz @ 500 Hz, 1.03 gRMS, 1 hour/axis for 3 axes Using Tower heatsink and Tower airflow from Table 4-1 with Thermal Test Vehicle (TTV) set to 130-W output
1 box
No visual defects
1 box
As verified in wind tunnel: Mean CA + 3 + offset not to exceed value in Table 4-1 Pressure drop not to exceed value in Table 4-1
30 heatsinks
40
Table 5-1.
Assessment 8) Bake
Tower Heatsink Test Conditions and Qualification Criteria (Sheet 2 of 2)

Test Condition Non-Operating, 110C, 1000 hours Note: Increased duration recommended if using alternative, unqualified TIM. Qualification Criteria No visual defects. As verified in wind tunnel: Mean CA + 3 + offset not to exceed value in Table 4-1 Pressure drop not to exceed value in Table 4-1. No visual defects. As verified in wind tunnel: Mean CA + 3 + offset not to exceed value in Table 4-1 Pressure drop not to exceed value in Table 4-1. Min Sample Size 12
9) Thermal Cycling
Required for heatpipe designs. Temperature range at pipe in heatsink assembly: -25C to +100C for 500 cycles. Cycle time is 30 minutes per full cycle, divided into half cycle in hot zone and half in cold zone, with minimum 1-min soak at each temperature extreme for each cycle. See Figure 5-1 for example profile. Continuously raise heat pipe temperature and record the burst/leak temperatures of final formed/shaped/flattened heatpipe, 12 heatpipes minimum. Design Target < 500 g Design Targets: 0.080" board = 54.3 3.2lbf (Fmin = 51.1 lbf) 0.118" board = 61.5 4.1 lbf (Fmax = 65.6lbf)
15
10) Heat Pipe Burst
No failures at minimum of 300C @ 20 minutes
12 pipes
11) Heatsink Mass 12) Heatsink Load
Avg + 3 sigma heatsink mass < 600 g Heatsink Load Design Targets: 1.8mm (0.072") board > 40 lbf 3.0mm (0.118") board < 70 lbf
12 12
Figure 5-1.
Example Thermal Cycle - Actual Profile Will Vary
41
5.3
LGA1567 Socket Reliability Testing and Results

Intel has conducted extensive reliability tests on the LGA1567 socket. Test conditions and results are provided in the LGA1567 Socket Validation Report. Contact Intels enabled socket suppliers, listed in Table A.1, Intel Enabling Component Suppliers on page 43, for a copy of these reports.
5.4
Socket Durability Test

The socket must withstand 30 mating cycles. Test per EIA-364, test procedure 09. Measure contact resistance when mated in 1st and 30th cycles. The package must be removed at the end of each de-actuation cycle and reinserted into the socket.
5.5
Ecological Requirement
General requirements: Materials used in this product must comply with customers Environmental Product Content Specification. The Intel specification is available at: http://supplier2.intel.com/EHS/Environmental_Product_Content_Specification_9-1603.doc Material shall be resistant to fungal growth. Examples of non-resistant materials include cellulose materials, animal and vegetable based adhesives, grease, oils, and many hydrocarbons. Synthetic materials such as PVC formulations, certain polyurethane compositions (for example, polyester and some polyethers), plastics which contain organic fillers of laminating materials, paints, and varnishes also are susceptible to fungal growth. If materials are not fungal growth resistant, then MILSTD-810E, Method 508.4 must be performed to determine material performance. Any plastic component exceeding 25 grams must be recyclable per the European Blue Angel recycling standards. Particular requirements: Cadmium shall not be used in painting or plating. No Quaternary salt electrolytic capacitors shall be used. Examples of prohibited caps are United Chemi-Con type: LXF, LXY, LXZ. No brominated plastics shall be used. Also, plastics heavier then 25 g must be labeled per ISO 10469 and may not contain halogenated flame retardant compounds. Chemical Restrictions: All components (for example: socket, TIM, heatsink) must be 'halogen-free'; that is, they are assembled without the intentional use of halogen in the raw materials and these elements are not intentionally present in the end product. IEC 61249-2-21 900 ppm maximum chlorine 900 ppm maximum bromine 1500 ppm maximum total halogens IPC-4101B 900 ppm maximum chlorine 900 ppm maximum bromine 1500 ppm maximum total halogens
42 Therrmal Mechanical Design Guide
Supplier Information
A
A.1
Intel Enabling Component Suppliers
Customers can purchase Intel reference thermal solution components from the suppliers listed in Table A-1. See Appendix D for drawings.
Table A-1.
Component
Suppliers for the Processor Heatsink

Description/ Part Number PCM45F / 95367 Development Suppliers Honeywell Supplier Contact Info Judy Oles (Customer Service) Judy.Oles@Honeywell.com 509-252-8605 Andrew S.K. Ho (APAC) andrew.ho@honeywell.com (852) 9095-4593 Andy Delano (Technical) Andrew.Delano@Honeywell.com 509-252-2224 Monica Chih 12F, No.123-1, Hsing-De Rd., Sanchung, Taipei, Taiwan, R.O.C. Tel. +886 (2) 2995-2666 x1131 Fax: +886 (2) 2995-8258 monica_chih@ccic.com.tw Sean Wu sean_wu@ccic.com.tw (408) 768-7629
Thermal Interface Material
Processor Heatsink HL-ILM implementation
Tower Heatsink (with PCM45F) Intel P/N: E45309-007 CCI P/N: 0008053206
Chaun-Choung Technology Corp. (CCI)
The Intel reference thermal solution has been validated per the criteria outlined in Chapter 5. Customers can purchase the LGA1567 Socket and ILM components from suppliers listed in Table A-2. See Appendix B for LGA1567 Socket drawings. See Appendix C for ILM drawings. Table A-2.
Item
High Load ILM (HLILM) High Load ILM Cover (HL-ILM) only High Load ILM Assembly (HL-ILM) (includes E42426-001 and G12449-001)
LGA1567 Socket and ILM Part Number and Supplier Contact Information (Sheet 1 of 2)
Intel
E42426-001 G12449-001 G14941-001
Foxconn
PT44L11-4301 012-1000-5838 PT44L21-4311
Lotes
ACA-ZIF-084-K01 ACA-ZIF-103-P01 ACA-ZIF-126-Y01
Tyco
43
Table A-2.
Item
LGA1567 Socket and ILM Part Number and Supplier Contact Information (Sheet 2 of 2)
Intel
E56700-001 E42477-001 E34291-001
Foxconn
PT44L12-4301 PT44P11-4301 PE156727-5241-01F Julia Jiang juliaj@usa.foxconn.com Tel. (408) 919-6178 1688 Richard Ave. Santa Clara, CA 95050 USA
Lotes
Tyco
Low Profile ILM Assembly (LP-ILM) Back Plate LGA1567 Socket
DCA-HSK-149-K01 2040636-1 Cathy Yang cathy@lotes.com.cn Tel. 86-20-84686519 No.15, Wusyun Street Anle District Keelung City, 20446 Taiwan Gretchen Troutman gltroutm@tycoelectronics.com Tel. 717-986-5241 PO Box 3608 Harrisburg, PA 17105-3608 USA
Contact Info
Table A-3.
Alternate Suppliers with Thermal Solutions Designed for the Intel Xeon Processor 7500 Series
Description/ Part Number 1.5U Aluminum embedded heatpipe Part number: 321879 (Verified to meet load targets in Table 4-1) Development Suppliers Aavid Thermalloy Supplier Contact Info Chris Chapman (USA) 70 Commercial St. Suite 200 Concord, NH 03301 603 223-1728 chapman@aavid.com George Lee (Taiwan) 14F-4, No 79, Hsin Tai Wu Rd., Sec, 1 Hsichin, Taipei Hsien, Taiwan ROC +886 (2) 2698-9888 ext. 603 George.lee@aavid.com.tw
Component Processor Heatsink LP-ILM implementation
1U Copper skived Part number Q129 (Verified to meet load targets in Table 4-1 and thermal targets in Table 4-3)
Dynatron Corporation (Top Motor/Dynaeon)
Ian Lee 41458 Christy Street Fremont, CA 94538 510-498-8888 x137 ian@dynatron-corp.com Lang Pai 510-498-8888 x138 Lang@dynatron-corp.com
Tower Heatsink 050234 Rev05 (Verified to meet load targets in Table 4-1 and thermal targets in Table 4-3)
Aavid Thermalloy
Chris Chapman (USA) 70 Commercial St. Suite 200 Concord, NH 03301 603 223-1728 chapman@aavid.com George Lee (Taiwan) 14F-4, No 79, Hsin Tai Wu Rd., Sec, 1 Hsichin, Taipei Hsien, Taiwan ROC +886 (2) 2698-9888 ext. 603 George.lee@aavid.com.tw
The Alternate Processor Heatsink Solutions listed in Table A-3 have been verified to meet Intels requirements except as noted. Customers must evaluate performance against their own product requirements.
44
LGA 1567 Socket Mechanical Drawings

Table B-1 lists the mechanical drawings included in this appendix.
Table B-1.
Mechanical Drawing List

Drawing Description LGA 1567 Socket Mechanical Drawing Sheet 1 of 4 LGA 1567 Socket Mechanical Drawing Sheet 2 of 4 LGA 1567 Socket Mechanical Drawing Sheet 3 of 4 LGA 1567 Socket Mechanical Drawing Sheet 4 of 4 Figure B-1 Figure B-2 Figure B-3 Figure B-4 Figure Number
45
Figure B-1.
LGA 1567 Socket Mechanical Drawing Sheet 1 of 4
46
Figure B-2.
47
Figure B-3.
48
Figure B-4.
49
50
Independent Loading Assembly (ILM) Drawings and Backplate Assembly Drawings

Table C-1 lists the mechanical drawings included in this appendix.
Table C-1.

Drawing Description High-Load Independent Loading Assembly (HL-ILM) Mechanical Drawing Sheet 1 of 7 High-Load Independent Loading Assembly (HL-ILM) Mechanical Drawing Sheet 2 of 7 High-Load Independent Loading Assembly (HL-ILM) Mechanical Drawing Sheet 3 of 7 High-Load Independent Loading Assembly (HL-ILM) Mechanical Drawing Sheet 4 of 7 High-Load Independent Loading Assembly (HL-ILM) Mechanical Drawing Sheet 5 of 7 High-Load Independent Loading Assembly (HL-ILM) Mechanical Drawing Sheet 6 of 7 High-Load Independent Loading Assembly (HL-ILM) Mechanical Drawing Sheet 7 of 7 Low-Profile Independent Loading Assembly (LP-ILM) Mechanical Drawing Sheet 1 of 8 Low-Profile Independent Loading Assembly (LP-ILM) Mechanical Drawing Sheet 2 of 8 Low-Profile Independent Loading Assembly (LP-ILM) Mechanical Drawing Sheet 3 of 8 Low-Profile Independent Loading Assembly (LP-ILM) Mechanical Drawing Sheet 4 of 8 Low-Profile Independent Loading Assembly (LP-ILM) Mechanical Drawing Sheet 5 of 8 Low-Profile Independent Loading Assembly (LP-ILM) Mechanical Drawing Sheet 6 of 8 Low-Profile Independent Loading Assembly (LP-ILM) Mechanical Drawing Sheet 7 of 8 Low-Profile Independent Loading Assembly (LP-ILM) Mechanical Drawing Sheet 8 of 8 Backplate Assembly Drawing Sheet 1 of 5 Backplate Assembly Drawing Sheet 2 of 5 Backplate Assembly Drawing Sheet 3 of 5 Backplate Assembly Drawing Sheet 4 of 5 Backplate Assembly Drawing Sheet 5 of 5 Figure C-1 Figure C-2 Figure C-3 Figure C-4 Figure C-5 Figure C-6 Figure C-7 Figure C-8 Figure C-9 Figure C-10 Figure C-11 Figure C-12 Figure C-13 Figure C-14 Figure C-15 Figure C-16 Figure C-17 Figure C-18 Figure C-19 Figure C-20 Figure Number
51
52
7
DWG. NO
8
E42426
DATE APPROVED SHT.
6
1
REV
5
05
REVISION HISTORY
ZONE REV DESCRIPTION
4
01 E6
UPDATED CAD MODELS, ADDED NUT HEIGHT DIMENSION
3
A PRELIMINARY RELEASE
INITIAL RELEASE 07/28/09 12/22/09 12/22/09 01/05/10 JK JK JK DL 04/21/08 DL
2
07/18/07 DL
THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS MAY NOT BE DISCLOSED, REPRODUCED, DI SPLAYED OR MODIFIED, WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION.
H H
02 03 CHANGED PART NUMBER TO E42426-002 04 ADDED INTEL PART MARKING LOCATION
Figure C-1.
NOTES; UNLESS OTHERWISE SPECIFIED:
1. C
05
ADDED 6 TO FASTENER HEIGHT DIMENSION
REFERENCE DOCUMENTS ASME Y14.5M-1994 - STANDARD DIMENSION AND TOLERANCES 164997 - INTEL MARKING STANDARD 99-0007-001 - INTEL WORKMANSHIP STANDARD 18-1201 - INTEL ENVIRONMENTAL PRODUCT CONTENT SPECIFICATION FOR SUPPLIERS & OUTSOURCED MANUFACTURERS (FOUND ON EHS WEBSITE - https://supplier.intel.com/static/EHS/) C
2.
FEATURES NOT SPECIFIED ON DRAWING SHALL BE CONTROLLED BY 3D CAD DATABASE.
3.
MATERIAL: MAY USE INTEL ENGINEERING APPROVED EQUIVALENTS. ALL SUBSTANCES IN THIS PART MUST CONFORM TO INTEL ENVIRONMENTAL PRODUCT SPECIFICATION (BS-MTN-0001).
4.
ASSEMBLY MUST COMPLY WITH INTEL WORKMANSHIP STANDARD (99-0007-001). ASSEMBLY SHALL BE FREE OF OIL AND DEBRIS.
MARK INTEL ASSEMBLY PART NUMBER APPROXIMATELY WHERE SHOWN PER INTEL MARKING STANDARD (164997) WITH THE FOLLOWING INFORMATION. A) PART NUMBER E42426-002
INDICATES CRITICAL TO FUNCTIOIN DIMENSION (CTF)
MARK VENDOR ASSEMBLY INFORMATION APPROXIMATELY WHERE SHOWN PER INTEL MARKING STANDARD (164997) WITH THE FOLLOWING INFORMATION. A) ASSEMBLY VENDOR ID B) DATE CODE SCALE 2 DETAIL A SCALE 4
E
4X 7.6 0 -0.1 6 PRESS COLLAR NUT FLUSH TO ILM FASTENER SECTION C-C
SEE DETAIL A HINGE ATTACHMENT
4 3
C
5
C
SCALE 2
4 2 1 2 1 4
QTY
5 4 3 2 1 TOP
ITEM NO
E42424-002 E42423-001 E42422-001 E42420-002 D80118-004 E42426-002

PART NUMBER
NEHALEM EX ILM FASTENER NEHALEM EX ILM LOAD LEVER NEHALEM EX ILM LOAD PLATE NEHALEM EX ILM FRAME SOCKET-B,FASTENER,COLLAR ILM TOP ASSEMBLY
DESCRIPTION
B
1
B
PARTS LIST
DEPARTMENT DESIGNED BY DATE
R
7 D. LLAPITAN
DRAWN BY
07/18/07
DATE
PTMI D. LLAPITAN
CHECKED BY
2200 MISSION COLLEGE BLVD. P.O. BOX 58119 SANTA CLARA, CA 95052-8119
07/18/07
DATE
UNLESS OTHERWISE SPECIFIED INTERPRET DIMENSIONS AND TOLERANCES IN ACCORDANCE WITH ASME Y14.5M-1994 DIMENSIONS ARE IN MILLIMETERS ALL UNTOLERANCED LINEAR DIMENSIONS .25 ANGLES 0.5
TITLE
THIRD ANGLE PROJECTION
J KALISZEWSKI07/18/07
APPROVED BY DATE SIZE MATERIAL FINISH
NEHALEM EX ILM FRAME ASSEMBLY

DRAWING NUMBER REV
A A1
SEE NOTES SEE NOTES
SCALE:
E42426
2
DO NOT SCALE DRAWING
SHEET
05
1
OF
High-Load Independent Loading Assembly (HL-ILM) Mechanical Drawing Sheet 1 of 7

7 6 5
8
DWG. NO
7
E42422
DATE APPROVED SHT.
6
1
REV
5
06
REVISION HISTORY
4
B
INCREASED BEND REDIUS FOR VERTICAL WALLS.
3
09/13/07 04/21/08 07/01/09 08/04/09 09/23/09 12/08/09 12/17/09 JK JK
6
2
07/18/07
DL DL DL DL DL
THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS MAY NOT BE DISCLOSED, REPRODUCED, DI SPLAYED OR MODIFIED, WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION. DL
Figure C-2.
H H
PG2, 01 C3 02 03 04 ADDED PAGE 3. REVISED INSPECTION DIMENSIONING
5.29 # 0.2 WAS 5.29 # 0.25, ADDED 3 PLACES MODIFIED DATUM PLANES, ADDED DATUM POINTS WIDENED HINGE FEATURES

INITIAL RELEASE- REDUCED FORM DEPTH TO 2.0MM
1.
MOVED DATUM A
05 SEE DETAIL 06 C
REFERENCE DOCUMENTS ASME Y14.5M-1994 - STANDARD DIMENSION AND TOLERANCES UL1439 - UL SHARP EDGE TESTING 164997 - INTEL MARKING STANDARD A29419 - INTEL TOLERANCE STANDARD FOR SHEETMETAL C25432 - INTEL COSMETIC SPEC FOR SHEETMETAL. 18-1201 - INTEL ENVIRONMENTAL PRODUCT CONTENT SPECIFICATION FOR SUPPLIERS & OUTSOURCED MANUFACTURERS (FOUND ON EHS WEBSITE - https://supplier.intel.com/static/EHS/) A 31.83 31.83
2 # 0
G
2X 1.70
2. FEATURES NOT SPECIFIED ON DRAWING AND FEATURES WITHOUT SPECIFIED TOLERANCE SHALL BE CONTROLLED BY 3D CAD DATABASE, AND SHALL CONFORM TO SHEETMETAL TOLERANCE STANDARD (A29419). A2 A2 A1 B A 2X85 $ A1

9 75.68 # 0.01
3.
MATERIAL: MAY USE INTEL ENGINEERING APPROVED EQUIVALENT. ALL SUBSTANCES IN THIS PART MUST CONFORM TO INTEL ENVIRONMENTAL PRODUCT SPECIFICATION (BS-MTN-0001). A) TYPE:301 STAINLESS STEEL 1.5MM # .08 6 B) CRITICAL MECHANICAL PROPERTIES: TENSILE YIELD STRENGTH (ASTM D638) >= 758 MPa MODULUS OF ELASTICITY (ASTM D638) >= 193 GPa C) PLATING: NONE.
4. A A
THIS PART HAS CLASS U COSMETIC REQUIREMENTS UNLESS OTHERWISE NOTED. SPECIFIED SURFACES MUST COMPLY WITH COSMETIC REQUIREMENTS PER INTEL INTEL COSMETIC SPEC FOR SHEETMETAL (C25432). PART SHALL BE FREE OF OIL AND DEBRIS.
5.
BAG AND TAG WITH THE FOLLOWING INFORMATION. (NOTE PRIORITY IN ORDER LISTED) A) SUPPLIER PART NUMBER B) INTEL PART NUMBER E42422-001 c) DATE CODE
CRITICAL TO FUNCTION DIMENSION (CTF). 71.67 SEE DETAIL A
7.
BURR HEIGHTS SHALL NOT EXCEED 10% OF MATERIAL THICKNESS PER UL1439 AND 99-0007-001 - INTEL WORKMANSHIP STANDARD.
8.
SHARP CORNERS MUST BE CHAMFERED, OR ROUNDED TO 0.25MM (.010") RADIUS.
9 PUNCH DIRECTION.
10
COINING REQUIRED ON SPECIFIED EDGES.
D
B C1 A3 B A A3 SECTION B-B
C
A SEE DETAIL B
10 B
2X 11.95 # 0.25 63.2 # 0.25 6 SECTION A-A

DESIGNED BY DATE
2X 5.29 # 0.2 6
DEPARTMENT
D. LLAPITAN
DRAWN BY
07/18/08
DATE
TMI D. LLAPITAN
CHECKED BY
CORP.
UNLESS OTHERWISE SPECIFIED INTERPRET DIMENSIONS AND TOLERANCES IN ACCORDANCE WITH ASME Y14.5M-1994 DIMENSIONS ARE IN MILLIMETERS TOLERANCES AS SPECIFIED
07/18/07
DATE
TITLE
J KALISZEWSKI
07/18/07
APPROVED BY DATE
NEHALEM EX ILM LOAD PLATE

SIZE MATERIAL FINISH DRAWING NUMBER REV
A A1
SEE NOTES SEE NOTES
SCALE:
E42422
2.5
SHEET
06
1
OF
53
54
7
DWG. NO
8
E42422
SHT.
6
2
REV
5
06
Figure C-3.
H H
6 1.21 # 0.1
A2 A1
E
5 $
DETAIL C SCALE 12
1.515
0.1 A B C C1 A A3 0.71 # 0.1 6 DETAIL A SCALE 20 0.59
DETAIL B SCALE 15
0.75 MIN X 45 $
B
2.32 A
DEPARTMENT
R
SIZE
DRAWING NUMBER
REV
A
A1
SCALE:
E42422
6
SHEET
06
2
OF

7 6 5
8
DWG. NO
7
E42422
SHT.
6
3
REV
5
06
Figure C-4.
H H

G F
A
DEPARTMENT
R
SIZE
DRAWING NUMBER
REV
A
A1
SCALE:
E42422
5
SHEET
06
3
OF
55
56
7
DWG. NO
8
E42420
DATE APPROVED SHT.
6
1
REV
5
06
REVISION HISTORY
4
A 09/13/07 D.L. 07/18/07 D.L.
H H
C4,E4
Figure C-5.
NOTES; UNLESS OTHERWISE SPECIFIED: 04/21/08

06/06/08 08/19/08 D.L. D.L.
1. DL
G5 E4 F4 03
MODIFIED LEVER OPENING WIDTH AND STOP TAB. MODIFIED LEVER HOLE OPENING AND LEVER CATCH TAB.
PRELIMINARY RELEASE INCREASED BEND RADIUS FOR MAJOR B VERTICAL WALLS. REMOVED SEMI SHERICAL FORMS. INITIAL RELEASE- THRU HOLE FOR 01 LEVER DECREASED. LOADPLATE CATCH TAB RADIUS DECREASED. 02 CHANGED HOLE DIAMETER TO 5.5MM.
G
6
REFERENCE DOCUMENTS ASME Y14.5M-1994 - STANDARD DIMENSION AND TOLERANCES UL1439 - UL SHARP EDGE TESTING 164997 - INTEL MARKING STANDARD A29419 - INTEL TOLERANCE STANDARD FOR SHEETMETAL C25432 - INTEL COSMETIC SPEC FOR SHEETMETAL 18-1201 - INTEL ENVIRONMENTAL PRODUCT CONTENT SPECIFICATION FOR SUPPLIERS & OUTSOURCED MANUFACTURERS (FOUND ON EHS WEBSITE - https://supplier.intel.com/static/EHS/)
E4,F1 E2 04 D8 B4
MODIFIED DATUMN SCHEME, NOTE 8, AND 16, 66.8 TOLERANCES.MODIFIED HINGE HOLE LOCATION. ADDED COSMETIC MARKING 10 . ADDED CHAMFERS TO TOP EDGES. ADDED LEVER RETENTION CUTOUT
04/13/09
D.L.
G
12/08/09 12/22/09 JK JK
2. FEATURES NOT SPECIFIED ON DRAWING AND FEATURES WITHOUT SPECIFIED TOLERANCE SHALL BE CONTROLLED BY 3D CAD DATABASE, AND SHALL CONFORM TO SHEETMETAL TOLERANCE STANDARD (A29419).
C3 C3
CREATED -002 PART, SHORTENED LEVER CATCH TAB.
05 MOVED BOTTOM TAB 06
3. C 82 # 0.25
2X 6.25 6
4X 5.5 # 0.1 0.15 A B C
MATERIAL: MAY USE INTEL ENGINEERING APPROVED EQUIVALENT. ALL SUBSTANCES IN THIS PART MUST CONFORM TO INTEL ENVIRONMENTAL PRODUCT SPECIFICATION (BS-MTN-0001). A) TYPE: SK7, 1065, S50C, OR CHSP60PC 1.2MM+/- 0.05 THK. B) CRITICAL MECHANICAL PROPERTIES: TENSILE YIELD STRENGTH (ASTM D638) >= 489 MPa MODULUS OF ELASTICITY (ASTM D638) >= 190 GPa C) PLATING: ELECTROLYTIC NICKEL PLATED. D) HEAT TREATING: NONE
4.
6
5.
BAG AND TAG WITH THE FOLLOWING INFORMATION. (NOTE PRIORITY IN ORDER LISTED) A) SUPPLIER PART NUMBER B) INTEL PART NUMBER ( E42420-002 ) c) DATE CODE
6 16 # 0.12
66.8 # 0.25
E
48 26 # 0.12
CRITICAL TO FUNCTION DIMENSION (CTF).
7.
42
8.
SHARP CORNERS AND EDGESMUST BE ROUNDED OR CHAMFERED TO 0.25MM MAX,
PUNCH DIRECTION.
10
APPLY PIN 1 INDICATOR IN THIS AREA.
10 SCALE
0.842 # 0.25
C
A
1.15 # 0.25
3 B 2X 70
6.6 # 0.12
B
TOP
QTY ITEM NO
E42420-002
PART NUMBER
LS ILM FRAME
DESCRIPTION
DESIGNED BY
DATE
PARTS LIST
DEPARTMENT
D. LLAPITAN
DRAWN BY
07/18/07
DATE
TMI D. LLAPITAN
CHECKED BY
CORP.
07/18/07
DATE
TITLE
SCALE
J KALISZEWSKI
07/18/07
APPROVED BY DATE SIZE MATERIAL FINISH
NEHALEM EX ILM FRAME

DRAWING NUMBER REV
A A1
SEE NOTES SEE NOTES
SCALE:
E42420
2.5
SHEET
06
1
OF

7 6 5
Figure C-6.
8
DWG. NO SHT. REV
7
E42424 1 03
6
REVISION HISTORY
ZONE 01 INITIAL RELEASE REV DESCRIPTION DATE 04/21/08
4 3 1
APPR D.L.
THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS MAY NOT BE DISCLOSED, REPRODUCED, DI SPLAYED OR MODIFIED, WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION. C3 02 CHANGED HUT HEIGHT TO 7.6MM. 03 CHANGED PART NUMBER TO E42424-002
07/28/09 12/22/09
D.L.
JK

7
1.
REFERENCE DOCUMENTS ASME Y14.5M-1994 - STANDARD DIMENSION AND TOLERANCES UL1439 - UL SHARP EDGE TESTING 164997 - INTEL MARKING STANDARD 99-0007-001 - INTEL WORKMANSHIP STANDARD 18-1201 - INTEL ENVIRONMENTAL PRODUCT CONTENT SPECIFICATION FOR SUPPLIERS & OUTSOURCED MANUFACTURERS (FOUND ON EHS WEBSITE - https://supplier.intel.com/static/EHS/) 1.5
6 POINT T-20 DRIVE HEAD DEPTH 2MM MIN PARTIAL THREAD TAP IN TOOL RECESS OK
2.
INTERPRET DIMENSIONS PER ASME Y14.5M-1994. FEATURES NOT SPECIFIED ON DRAWING SHALL BE CONTROLLED BY 3D CAD DATABASE, AND SHALL CONFORM TO A TOLERANCE OF +/- 0.375MM (.015"). IF PROVIDED, MEASUREMENTS SHOULD REFERENCE DATUM -A- PRIMARY, -CTERTIARY.
DATUM
-B-
SECONDARY, AND
3.
C
R 0.25 MAX
7.6 0 -0.1
MATERIAL: MAY USE INTEL ENGINEERING APPROVED EQUIVALENT. ALL SUBSTANCES IN THIS PART MUST CONFORM TO INTEL ENVIRONMENTAL PRODUCT SPECIFICATION (BS-MTN-0001). A) TYPE: LOW CARBON STEEL B) CRITICAL MECHANICAL PROPERTIES HARDEN AND TEMPER IF USING INTERFERENCE FIT ASSEMBLY DESIGN. FINISH: ZINC PLUS CLEAR CHROMATE PER (ASTM B633) COLORLESS. 6
4.
PART MUST COMPLY WITH INTEL WORKMANSHIP STANDARD (99-0007-001). PART SHALL BE FREE OF OIL AND DEBRIS.
5.
BAG AND TAG WITH THE FOLLOWING INFORMATION. (NOTE PRIORITY IN ORDER LISTED) A) PART NUMBER E42424-002 B) DATE CODE C) MATERIAL TYPE
5
1.5 MAX 6
7.
SHARP CORNERS MAY BE CHAMFERED, OR ROUNDED TO 0.25MM (.010") RADIUS.
8. MATES WITH COLLAR (P/N D80118)
DEBURR ALL SHARP EDGES.
ASSEMBLY FEATURES DEFINED BY VENDOR.
INTERNAL THREAD NO. 6-32 UNC 6MM DEEP MIN
DESIGNED BY
DATE
DEPARTMENT
R
A
9
D. LLAPITAN
DRAWN BY
04/21/08
DATE
D. LLAPITAN
CHECKED BY
A
04/21/08
DATE TITLE
J. KALISZEWSKI
04/21/08
APPROVED BY
DATE
NEHALEM EX ILM FASTENER

MATERIAL
FINISH
SIZE DRAWING NUMBER
REV
D
SEE NOTES SEE NOTES
E42424
SCALE: 12:1 DO NOT SCALE DRAWING SHEET 1 OF 1
03
57
58
7
DWG. NO
8
E42423
DATE APPROVED SHT.
6
1
REV
5
02
REVISION HISTORY
4
G5,G2
3
01 G8 C5 02 04/13/09 D.L. MODIFIED NOTE 2 REMOVED DATUMN REFERENCES CHANGED CAM DIMENSION TO 10.56
INITIAL RELEASE -WIRE DIAMETER AND CAM ANGLE FINALIZED.
2
07/18/07
04/21/08 D.L.
Figure C-7.
THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS MAY NOT BE DISCLOSED, REPRODUCED, DI SPLAYED OR MODIFIED, WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION. DL
H H
1.
REFERENCE DOCUMENTS ASME Y14.5M-1994 - STANDARD DIMENSION AND TOLERANCES UL1439 - UL SHARP EDGE TESTING 164997 - INTEL MARKING STANDARD 18-1201 - INTEL ENVIRONMENTAL PRODUCT CONTENT SPECIFICATION FOR SUPPLIERS & OUTSOURCED MANUFACTURERS (FOUND ON EHS WEBSITE - https://supplier.intel.com/static/EHS/) 6 4.46 # 0.1 (31.5 ) $ 6 ( 2.5) 0.1
2. FEATURES NOT SPECIFIED ON DRAWING SHALL BE CONTROLLED BY 3D CAD DATABASE, AND SHALL CONFORM TO A TOLERANCE OF +/- 0.375MM (.015").
3.
MATERIAL: MAY USE INTEL ENGINEERING APPROVED EQUIVALENT. ALL SUBSTANCES IN THIS PART MUST CONFORM TO INTEL ENVIRONMENTAL PRODUCT SPECIFICATION (BS-MTN-0001). A) TYPE: 2.5 SUS 304 B) CRITICAL MECHANICAL PROPERTIES TENSILE YIELD STRENGTH (ASTM D638) >= 1.3 GPa ULTIMATE YIELD STRENGTH (ASTM D638) >= 1.6 GPa MODULUS OF ELASTICITY (ASTM d638) = 193 GPa FINISH: NONE
4.
THIS PART HAS CLASS U COSMETIC REQUIREMENTS UNLESS OTHERWISE NOTED. PART SHALL BE FREE OF OIL AND DEBRIS.
5.
6 4.1 # 0.35
7. $BENDS OR FULL RADIUS.
SHARP CORNERS MUST BE CHAMFERED, OR ROUNDED TO 0.25MM (.010") RADIUS.
15.5 # 0.5
FEATURE TO BE DEFINED BY MANUFACTURER AS EITHER TWO 90
D
5.2 # 0.2
75.35 # 0.25
C
10.56 # 0.2 R1.29 # 0.2 TYP
C
6 3.75 # 0.05 +1 $ 90 $ -3 $
29.98 # 0.2
14.44 # 0.2
B
72.8 # 0.25 6
DESIGNED BY DATE DEPARTMENT
R
D. LLAPITAN
DRAWN BY
07/18/07
DATE
UNLESS OTHERWISE SPECIFIED INTERPRET DIMENSIONS AND TOLERANCES IN ACCORDANCE WITH ASME Y14.5M-1994 DIMENSIONS ARE IN MILLIMETERS
TMI D. LLAPITAN
CHECKED BY
CORP.
07/18/07
DATE
TITLE
J KALISZEWSKI07/18/07
APPROVED BY DATE
NEHALEM EX ILM LOAD LEVER

SIZE MATERIAL FINISH DRAWING NUMBER REV
A A1
SEE NOTES SEE NOTES
SCALE:
E42423
3
SHEET
02
1
OF

7 6 5
8
DWG. NO SHT. REV
7
E56700 1 04
6
REVISION HISTORY
ZONE 02 03 04 ADDED -002 DUST COVER 08/25/09 RELEASE FOR TOOLING 02/13/09 C HANES PRELIMINARY RELEASE FOR TOOLING 01/16/09 01 PROTOTYPE RELEASE 11/17/08 C HANES REV DESCRIPTION DATE APPR
4 3 1
Figure C-8.
1.
REFERENCE DOCUMENTS ASME Y14.5M-1994 - STANDARD DIMENSION AND TOLERANCES 164997 - INTEL MARKING STANDARD 99-0007-001 - INTEL WORKMANSHIP STANDARD 18-1201 - INTEL ENVIRONMENTAL PRODUCT CONTENT SPECIFICATION FOR SUPPLIERS & OUTSOURCED MANUFACTURERS (FOUND ON EHS WEBSITE - https://supplier.intel.com/static/EHS/)
2.
INTERPRET DIMENSIONS PER ASME Y14.5M-1994. FEATURES NOT SPECIFIED ON DRAWING SHALL BE CONTROLLED BY 3D CAD DATABASE.
3.
MATERIAL: MAY USE INTEL ENGINEERING APPROVED EQUIVALENTS. ALL SUBSTANCES IN THIS PART MUST CONFORM TO INTEL ENVIRONMENTAL PRODUCT SPECIFICATION (BS-MTN-0001).
4.
ASSEMBLY MUST COMPLY WITH INTEL WORKMANSHIP STANDARD (99-0007-001). ASSEMBLY SHALL BE FREE OF OIL AND DEBRIS.

6 4X ASSEMBLE COLLAR NUT FLUSH TO ILM FASTENER FINISHED HEIGHT OF 5.755mm TO BOTTOM OF FASTENER HEAD
MARK ASSEMBLY PART APPROXIMATELY WHERE SHOWN PER INTEL MARKING STANDARD (164997) WITH THE FOLLOWING INFORMATION. A) PART NUMBER E56700-001 B) ASSEMBLY VENDOR ID C) DATE CODE
C
SEE DETAIL HINGE ATTACHMENT SCALE 2
4X
SCALE DETAIL HINGE ATTACHMENT SCALE 4
4 1 1
3
6 5 4 1 1 4
QTY
E60232-001 E58504-001 E56700-002 3 2 1

ITEM NO
LGA1567 LOW PROFILE ILM FASTENER LGA1567 LOW PROFILE ILM LOAD PLATE LGA1567 LOW PROFILE ILM DUST COVER E56145-001 E56107-001 D80118-004 TOP E56700-001
PART NUMBER
LGA1567 LOW PROFILE ILM LOAD LEVER LGA1567 LOW PROFILE ILM FRAME SOCKET-B,FASTENER,COLLAR ILM TOP ASSEMBLY
DESCRIPTION
1 4X SCALE 2
PARTS LIST
DESIGNED BY J KALISZEWSKI DRAWN BY J KALISZEWSKI CHECKED BY NEAL ULEN DATE DEPARTMENT
R
11/17/08
DATE
11/17
DATE TITLE
UNLESS OTHERWISE SPECIFIED INTERPRET DIMENSIONS AND TOLERANCES IN ACCORDANCE WITH ASME Y14.5M-1994 DIMENSIONS ARE IN MILLIMETERS .X # 0.5 .XX # 0.25 .XXX # 0.125 ANGLES 1.0
A
11/17/08
LGA1567 LOW PROFILE ILM ASSY

DAVID LLAPITAN APPROVED BY
DATE
CHRIS HANES
MATERIAL
11/17/08
FINISH
SIZE DRAWING NUMBER
REV
D
SEE NOTES SEE NOTES
E56700
SCALE: 1 DO NOT SCALE DRAWING SHEET 1 OF 1
04
Low-Profile Independent Loading Assembly (LP-ILM) Mechanical Drawing Sheet 1 of 8
59
60
6
DWG. NO
8
E56107 04
DATE 11/14/08 01/15/09 01/27/09 06/29/09 C HANES C HANES APPR
SHT.
7
1
REV
5
REVISION HISTORY
ZONE 02 03 CLEANED UP DRAWING FOR TOOLING RELEASE. ADDED VIEW A-A ADDED PIN 1 INDICATOR 04 REMOVED PLATING REQUIREMENT, PRELIMINARY TOOLING RELEASE 01 PROTOTYPE RELEASE REV DESCRIPTION
Figure C-9.
THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION.
H H
9
1. REFERENCE DOCUMENTS ASME Y14.5M-1994 - STANDARD DIMENSION AND TOLERANCES UL1439 - UL SHARP EDGE TESTING 164997 - INTEL MARKING STANDARD A29419 - INTEL TOLERANCE STANDARD FOR SHEETMETAL C25432 - INTEL COSMETIC SPEC FOR SHEETMETAL 18-1201 - INTEL ENVIRONMENTAL PRODUCT CONTENT SPECIFICATION FOR SUPPLIERS & OUTSOURCED MANUFACTURERS (FOUND ON EHS WEBSITE - https://supplier.intel.com/static/EHS/) A
G
C 820.25 4.60.05 6
0.01 REQUIRED BOW IN 0.03 INDICATED DIRECTION 11 A 70
3. MATERIAL: MAY USE INTEL ENGINEERING APPROVED EQUIVALENT. ALL SUBSTANCES IN THIS PART MUST CONFORM TO INTEL ENVIRONMENTAL PRODUCT SPECIFICATION (BS-MTN-0001). A) TYPE: SK7, 1065, S50C, OR CHSP60PC 1.2MM+/- 0.05 THK. 6 B) CRITICAL MECHANICAL PROPERTIES: TENSILE YIELD STRENGTH (ASTM D638) >= 489 MPa MODULUS OF ELASTICITY (ASTM D638) >= 190 GPa C) HEAT TREATING: NONE D) PLATING: ELECTROLYTIC NICKEL
F
5.5 0.1 0.15 A B C
4. THIS PART HAS CLASS U COSMETIC REQUIREMENTS UNLESS OTHERWISE NOTED. SPECIFIED SURFACES MUST COMPLY WITH COSMETIC REQUIREMENTS PER INTEL INTEL COSMETIC SPEC FOR SHEETMETAL (C25432). PART SHALL BE FREE OF OIL AND DEBRIS. 6
5. BAG AND TAG WITH THE FOLLOWING INFORMATION. (NOTE PRIORITY IN ORDER LISTED) A) SUPPLIER PART NUMBER B) INTEL PART NUMBER (E56107-001 ) c) DATE CODE
7. BURR HEIGHTS SHALL NOT EXCEED 10% OF MATERIAL THICKNESS PER UL1439 AND 99-0007-001 - INTEL WORKMANSHIP STANDARD.
8. BREAK ALL SHARP CORNERS, EDGES, AND BURRS TO 0.25mm MAX. 66.80.25
9 PUNCH DIRECTION.
E
48
10. UNSPECIFIED SURFACES TO BE FLAT WITHIN 0.125MM PER 25.4MM (.005"/INCH).
11 APPLY PIN 1 INDICATOR THIS AREA.
42
B 2x 25 3
A C SECTION A-A 6.25
B A
2.860.2
C
1.180.25 73.730.1 SCALE 3.000 A
DEPARTMENT DESIGNED BY DATE

R
J KALISZEWSKI
DRAWN BY
11/17/08
DATE
PTMI
J KALISZEWSKI
CHECKED BY
11/17/08
DATE
UNLESS OTHERWISE SPECIFIED INTERPRET DIMENSIONS AND TOLERANCES IN ACCORDANCE WITH ASME Y14.5M-1994 DIMENSIONS ARE IN MILLIMETERS .X 0.5 .XX 0.25 .XXX 0.125 ANGLES 1.0
TITLE
11 SCALE 2.000
NEAL ULEN D LLAPITAN

APPROVED BY
11/17/08 11/17/08
DATE
LGA1567 LOW PROFILE ILM FRAME

CHRIS HANES 11/17/08
MATERIAL FINISH SIZE DRAWING NUMBER REV
A A1
SEE NOTES SEE NOTES
SCALE:
E56107
1.000
DO NOT SCALE DRAWING SHEET 1 OF
04
1
Low-Profile Independent Loading Assembly (LP-ILM) Mechanical Drawing Sheet 2 of 8

6 5 4 3 2 1
8
DWG. NO
7
E58504
DATE 11/14/08 11/26/08 01/16/09 01/19/09 02/27/09 C HANES C HANES C HANES APPR
SHT.
6
1
REV
5
05
REVISION HISTORY
ZONE 4F/2 03 SEVERAL CHANGES TO CTFs - PRELIMINARY TOOLING RELEASE ADDED 3.14 DIM AND CTF - PRELIMINARY TOOLING RELEASE TOOLING RELEASE 02 ADDED ROUND TO BOTTOM OF REACTION FLANGE 01 PROTOTYPE RELEASE REV DESCRIPTION
H H
31.58
F7/2 05 04
NOTES; UNLESS OTHERWISE SPECIFIED: 31.58
1.
E A2 D 0 80 $ -5 $ F A3 SEE DETAIL SHT 3 B
REFERENCE DOCUMENTS ASME Y14.5M-1994 - STANDARD DIMENSION AND TOLERANCES UL1439 - UL SHARP EDGE TESTING 164997 - INTEL MARKING STANDARD A29419 - INTEL TOLERANCE STANDARD FOR SHEETMETAL C25432 - INTEL COSMETIC SPEC FOR SHEETMETAL. 18-1201 - INTEL ENVIRONMENTAL PRODUCT CONTENT SPECIFICATION FOR SUPPLIERS & OUTSOURCED MANUFACTURERS (FOUND ON EHS WEBSITE - https://supplier.intel.com/static/EHS/) A
2. H H
FEATURES NOT SPECIFIED ON DRAWING AND FEATURES WITHOUT SPECIFIED TOLERANCE SHALL BE CONTROLLED BY 3D CAD DATABASE, AND SHALL CONFORM TO SHEETMETAL TOLERANCE STANDARD (A29419).

9 A A
3.
MATERIAL: MAY USE INTEL ENGINEERING APPROVED EQUIVALENT. ALL SUBSTANCES IN THIS PART MUST CONFORM TO INTEL ENVIRONMENTAL PRODUCT SPECIFICATION (BS-MTN-0001). A) TYPE:301 STAINLESS STEEL 1.5MM # .08 6 B) CRITICAL MECHANICAL PROPERTIES: TENSILE YIELD STRENGTH (ASTM D638) >= 758 MPa MODULUS OF ELASTICITY (ASTM D638) >= 193 GPa C) PLATING: NONE.
4.
F
11.33 # 0.25 69.97
5.
BAG AND TAG WITH THE FOLLOWING INFORMATION. (NOTE PRIORITY IN ORDER LISTED) A) SUPPLIER PART NUMBER B) INTEL PART NUMBER E58504-001 c) DATE CODE
7.
8.
BREAK ALL SHARP CORNERS, EDGES AND BURRS TO 0.1mm MAX.
PUNCH DIRECTION.
E
C1 C G C
10. UNSPECIFIED SURFACES TO BE FLAT WITHIN 0.125MM PER 25.4MM (.005"/INCH).
E
G C
11
COINING REQUIRED ON ENTIRE INSIDE EDGE.
E D SEE DETAIL SHT 3 A1 F SCALE 3.000 A C SECTION F-F SEE DETAIL SHT 3 A
D
A
C
11 6 B 63.6 # 0.1
2X 6 # 0.3
SECTION
A-A
DESIGNED BY
DATE
DEPARTMENT
R
J KALISZEWSKI
DRAWN BY
11/17/08
DATE
PTMI
J KALISZEWSKI
CHECKED BY
11/17/08
DATE
TITLE

APPROVED BY
11/17/08 11/17/08
DATE
LGA1567 LOW PROFILE LOAD PLATE

SIZE DRAWING NUMBER REV
A
CHRIS HANES
MATERIAL
11/17/08
FINISH
A1
SEE NOTES SEE NOTES
SCALE:
E58504
2.000
SHEET
05
1
OF
Figure C-10. Low-Profile Independent Loading Assembly (LP-ILM) Mechanical Drawing Sheet 3 of 8
61
62
7
DWG. NO
8
E58504
SHT.
6
2
REV
5
05
H H
6 C 64.53
G
24.36 # 0.1
0.13 A B C
1.05
1.25 $
SECTION D-D SCALE 8.000
6 0.1 A
20.58 1.05
C
A
C SECTION E-E SCALE 8.000
DEPARTMENT
R
SIZE
DRAWING NUMBER
REV
A
PTMI
A1
SCALE:
E58504
2.000
SHEET
05
2
OF

7 6 5
8
DWG. NO
7
E58504
SHT.
6
3
REV
5
05

G
33.3 0.5 # 0.1 2.4 $
A C 2.58
E
4.16 A
C1
0.5 # 0.1
6 0.13 A B
A1
11.33 # 0.13
D
0.41
13.58 # 0.05
0.82
DETAIL A SCALE 12.000
DETAIL C SCALE 12.000 2X
B
DETAIL B SCALE 12.000
DEPARTMENT
R
SIZE
DRAWING NUMBER
REV
A
PTMI
A1
SCALE:
E58504
2.000
SHEET
05
3
OF
63
64
7
DWG. NO
8
E58504
SHT.
6
4
REV
5
05
H H
F
0.3 0.1 REQUIRED BOW IN INDICATED DIRECTION
SECTION H-H SCALE 8.000
0.2 REQUIRED BOW IN INDICATED DIRECTION 0.0
C
SECTION G-G SCALE 8.000
DEPARTMENT
R
SIZE
DRAWING NUMBER
REV
A
PTMI
A1
SCALE:
E58504
2.000
SHEET
05
4
OF

7 6 5
8
DWG. NO
7
E56145
DATE 11/14/08 01/15/09 01/27/09 C HANES C HANES APPR
SHT.
6
1
REV
5
03
REVISION HISTORY
ZONE 02 03 CLEANED UP DIMENSIONS - RELEASE FOR TOOLING 20 $WAS 6 $- PRELIMINARY TOOLING RELEASE 01 PROTOTYPE RELEASE REV DESCRIPTION
1.
REFERENCE DOCUMENTS ASME Y14.5M-1994 - STANDARD DIMENSION AND TOLERANCES UL1439 - UL SHARP EDGE TESTING 164997 - INTEL MARKING STANDARD 18-1201 - INTEL ENVIRONMENTAL PRODUCT CONTENT SPECIFICATION FOR SUPPLIERS & OUTSOURCED MANUFACTURERS (FOUND ON EHS WEBSITE - https://supplier.intel.com/static/EHS/)
2.
INTERPRET DIMENSIONS PER ASME Y14.5M-1994. FEATURES NOT SPECIFIED ON DRAWING SHALL BE CONTROLLED BY 3D CAD DATABASE, AND SHALL CONFORM TO A TOLERANCE OF +/- 0.375MM (.015"). IF PROVIDED, MEASUREMENTS SHOULD REFERENCE DATUM -A- PRIMARY,

G
6 (2.5 ) 0.1 10.03 # 0.5
DATUM
-B-
SECONDARY, AND
-C-
TERTIARY.
3.
MATERIAL: MAY USE INTEL ENGINEERING APPROVED EQUIVALENT. ALL SUBSTANCES IN THIS PART MUST CONFORM TO INTEL ENVIRONMENTAL PRODUCT SPECIFICATION (BS-MTN-0001). A) TYPE: 2.5 # 0.08 SUS 304 6 B) CRITICAL MECHANICAL PROPERTIES TENSILE YIELD STRENGTH (ASTM D638) >= 1.3 GPa ULTIMATE YIELD STRENGTH (ASTM D638) >= 1.6 GPa MODULUS OF ELASTICITY (ASTM d638) = 193 GPa FINISH: NONE
4.
THIS PART HAS CLASS U COSMETIC REQUIREMENTS UNLESS OTHERWISE NOTED. PART SHALL BE FREE OF OIL AND DEBRIS.
5.
BAG AND TAG WITH THE FOLLOWING INFORMATION. (NOTE PRIORITY IN ORDER LISTED) A) PART NUMBER E56145-001 B) DATE CODE C) MATERIAL TYPE 10.4 # 0.5 (20 ) $
7.
8. $BENDS OR FULL RADIUS.
FEATURE TO BE DEFINED BY MANUFACTURER AS EITHER TWO 90
15.01 R1.29 MAX TYP 6
6.5 # 0.05 65.92 # 0.5
+0.5 0
D
6 4.72 # 0.1 30.26 # 0.5 13.87 # 0.5
72.8 # 0.5
C
SCALE 2.000
B
SCALE 2.000
DESIGNED BY
DATE
DEPARTMENT
R
J KALISZEWSKI
DRAWN BY
11/17/08
DATE
PTMI
J KALISZEWSKI
CHECKED BY
11/17/08
DATE
UNLESS OTHERWISE SPECIFIED INTERPRET DIMENSIONS AND TOLERANCES IN ACCORDANCE WITH ASME Y14.5M-1994 DIMENSIONS ARE IN MILLIMETERS .X # 0.5 .XX # 0.25 .XXX # 0.125 ANGLES 1.0
TITLE

APPROVED BY
11/17/08 11/17/08
DATE
LGA1567 LOW PROFILE LOAD LEVER

SIZE DRAWING NUMBER REV
A
CHRIS HANES
MATERIAL
11/17/08
FINISH
A1
SEE NOTES SEE NOTES
SCALE:
E56145
1.000
SHEET
03
1
OF
65
66
4 2
REVISION HISTORY
ION CONFIDENTIAL INFORMATION. IT IS SPLAYED OR MODIFIED, WITHOUT THE PRI ZONE 02 03 C HANES REDIMSIONED FOR RELEASE FOR TOOLING 02/13/09 PRELIMINARY RELEASE FOR TOOLING 01/16/09 01 PROTOTYPE RELEASE 11/17/08 C HANES REV DESCRIPTION DATE APPR DISCLOSED IN CONFIDENCE AND ITS CONT OR WRITTEN CONSENT OF INTEL CORPORAT ENTS ION.
3 1
THIS DRAWING CONTAINS INTEL CORPORAT MAY NOT BE DISCLOSED, REPRODUCED, DI
1.
REFERENCE DOCUMENTS ASME Y14.5M-1994 - STANDARD DIMENSION AND TOLERANCES UL1439 - UL SHARP EDGE TESTING 164997 - INTEL MARKING STANDARD 99-0007-001 - INTEL WORKMANSHIP STANDARD 18-1201 - INTEL ENVIRONMENTAL PRODUCT CONTENT SPECIFICATION FOR SUPPLIERS & OUTSOURCED MANUFACTURERS (FOUND ON EHS WEBSITE - https://supplier.intel.com/static/EHS/)
2. 6 POINT T-20 DRIVE HEAD DEPTH 2MM MIN PARTIAL THREAD TAP IN TOOL RECESS OK
FEATURES NOT SPECIFIED ON DRAWING SHALL BE CONTROLLED BY 3D CAD DATABASE, AND SHALL CONFORM TO A TOLERANCE OF +/- 0.375MM (.015").
3.
6 7 # 0.1 1 # 0.1
MATERIAL: MAY USE INTEL ENGINEERING APPROVED EQUIVALENT. ALL SUBSTANCES IN THIS PART MUST CONFORM TO INTEL ENVIRONMENTAL PRODUCT SPECIFICATION (BS-MTN-0001). A) TYPE: LOW CARBON STEEL B) CRITICAL MECHANICAL PROPERTIES HARDEN AND TEMPER IF USING INTERFERENCE FIT ASSEMBLY DESIGN. FINISH: ZINC PLUS CLEAR CHROMATE PER (ASTM B633) COLORLESS.
4.
PART MUST COMPLY WITH INTEL WORKMANSHIP STANDARD (99-0007-001). PART SHALL BE FREE OF OIL AND DEBRIS.
5.
C
5.755 # 0.05
7. 9 MATES WITH COLLAR (P/N D80118-004) 1.5 MIN 5 # 0.1
8.
ASSEMBLY FEATURES DEFINED BY VENDOR.
DWG. NO
B
E60232
SHT.
INTERNAL THREAD NO. 6-32 UNC 4 MM DEEP MIN
1
REV
03
DESIGNED BY
DATE J KALISZEWSKI DRAWN BY J KALISZEWSKI CHECKED BY
DEPARTMENT
R
09/09/08
DATE
PTMI 09/09/08
DATE TITLE
A
A
APPROVED BY
11/17/08 11/17/08
DATE
LGA1567 LOW PROFILE ILM FASTENER

CHRIS HANES
MATERIAL
11/17/08
FINISH
SIZE DRAWING NUMBER
REV
C
SEE NOTES SEE NOTES
E60232
SCALE: 10.000 DO NOT SCALE DRAWING SHEET 1 OF 1
03
8
DWG. NO
7
E42477
SHT.
6
1
DATE 04/21/08 APPR DL
REV
5
06
4 3
REVISION HISTORY
ZONE 01 INITIAL RELEASE- 4X STUDS ADDED (ITEM 3) REV DESCRIPTION
2X (O.D. 4.2MM) 0.25 0.5 0.19 A A D A D 6 4X (6-32) MAJOR DIAMETER
02 03 B2
A3 B4 D8
05 06
UPDATED ITEM 4 IN TABLE
08/09/08
DL

04
08/19/08
04/13/09
D.L. D.L.
06/15/09
D
B8
UPATED ITEM 3, CORRESPONDING HOLES IN ITEM 1, AND NOTES. ADDED NOTE 8 CALLOUTS TO STUDS, MOVED DATUMN PLANE REFERENCE POINTS. REPLACED SO4-M3-6 WITH E74664-001 (4X) ADDED BOTTOM VIEW FOR CLARITY REWORDED NOTE 2
ADDED STUD THREAD SUCCESS CRITERIA IN NOTE 10.
J.K.
10/20/09
D
T.A.

C 2
C
B
1. REFERENCE DOCUMENTS ASME Y14.5M-1994 - STANDARD DIMENSION AND TOLERANCES 164997 - INTEL MARKING STANDARD 99-0007-001 - INTEL WORKMANSHIP STANDARD 18-1201 - INTEL ENVIRONMENTAL PRODUCT CONTENT SPECIFICATION FOR SUPPLIERS & OUTSOURCED MANUFACTURERS (FOUND ON EHS WEBSITE - https://supplier.intel.com/static/EHS/) 2. FEATURES NOT SPECIFIED ON DRAWING AND FEATURES WITHOUT SPECIFIED TOLERANCE SHALL BE CONTROLLED BY 3D CAD DATABASE, AND SHALL CONFORM TO SHEETMETAL TOLERANCE STANDARD (A29419). 3. MATERIAL: MAY USE INTEL ENGINEERING APPROVED EQUIVALENTS. ALL SUBSTANCES IN THIS PART MUST CONFORM TO INTEL ENVIRONMENTAL PRODUCT SPECIFICATION (BS-MTN-0001). 4. ASSEMBLY MUST COMPLY WITH INTEL WORKMANSHIP STANDARD (99-0007-001). ASSEMBLY SHALL BE FREE OF OIL AND DEBRIS. 5 MARK ASSEMBLY PART APPROXIMATELY WHERE SHOWN PER INTEL MARKING STANDARD (164997) WITH THE FOLLOWING INFORMATION. A) PART NUMBER E42477-001 AND REVISION. B) ASSEMBLY VENDOR ID C) DATE CODE 6 CRITICAL TO FUNCTION DIMENSION (CTF). FOR PRODUCTION QUALIFICATION, INDICATED DIMENSION REQUIRES CP/CPK STUDY BASED ON A RANDOM 30 PART SAMPLE OF A 300 PART MINIMUM LOT PER CQC. 7 FLATNESS ZONE AS DEFINED BY THE CENTER OF THE ILM STUDS. LOCAL DEFORMATION AROUND THE STUDS IS ACCEPTABLE. 8 INSTALL ALL STUDS FLUSH TO THIS SURFACE, +0.00 / -0.25 6
9 ILM ATTACH STUDS:

A
- PUSHOUT FORCE > 250LBf 6
- TORQUE OUT > 12.5 IN-LBF
10 HEAT SINK ATTACH STUDS:

B
Figure C-16. Backplate Assembly Drawing Sheet 1 of 5
- PUSHOUT FORCE > 100LBF
2X
10
B
4X 9 8
3
- TORQUE TO FAILURE > 20 IN-LBF 6 - FAILURE MODES: STUDS MUST NOT SHEAR, DEFORM, STRIP, CRACK, OR TORQUE OUT BELOW TORQUE LIMIT. - THREAD SUCCESS CRITERIA: AFTER THE STUD PRESSFITTING OPERATION INTO THE PLATE, STUD THREADS SHOULD PASS THE M3x.5 GO/NO-GO GAUGE ALL THE WAY THROUGH. BOTTOM 3 THREADS CAN BE REMOVED BY THE SUPPLIER, IF NEEDED TO ACHIEVE THE GO/NO-GO REQUIREMENT. 6 - LIMITS BASED ON 3 SIGMA DISTRIBUTION. 11 NO METAL OF THE FLAT PLATE CAN BE EXPOSED. OVERHANG OF
INSULATION ON INNER AND OUTER EDGES OF THE PLATE IS ACCEPTABLE. 6 12. CLEAN AND DEGREASE BACKPLATE ASSEMBLY BEFORE ATTACHING INSULATION. 13. AFTER APPLICATION THE INSULATOR MUST BE FREE OF BUBBLES, POCKETS, GREASES, AND ANY OTHER DEFORMATIONS.
SEE DETAIL 4X ( 0.25 0.1 6 A 4X ( 7.82 ) A A B C 3.51) A
2 4 1
4 3 2
E74664-001 D80110-004 E42486-001
M3 INTERNAL THREAD, SELF CLINCHING STANDOFF OR EQUIVALENT
SOCKET-B,STUD,SELF-CLINCHING
11
POLYPROPYLENE SHEET (ITW FORMEX GK-5BK)
1
QTY ITEM NO
E42482-001 TOP E42477-001

PART NUMBER
NEHALEM EX BACKPLATE
TOP ASSEMBLY
DESCRIPTION
PARTS LIST
R
A
2X (6 ) 0.2 6 7 LOCAL DEFORMATION AROUND STUDS OK 8
2.4
D. LLAPITAN
07/18/07
UNLESS OTHERWISE SPECIFIED INTERPRET DIMENSIONS AND TOLERANCES IN ACCORDANCE WITH ASME Y14.5M-1994 DIMENSIONS ARE IN MM TOLERANCES AS SPECIFIED
DRAWN BY
DATE
A
PLATE PLUS INSTALLED INSULATOR
D. LLAPITAN
CHECKED BY
07/18/07
DATE
TITLE
J. KALISZEWSKI
APPROVED BY
07/18/07DATE
NEHALEM EX BACKPLATE ASSEMBLY

SIZE DRAWING NUMBER MATERIAL FINISH REV
DETAIL A SCALE 4:1
D
SEE NOTES SEE NOTES
E42477
06
67
68
7
DWG. NO
8
E42482
SHT.
6
1
DATE 05/15/07 APPROVED
REV
5
04
4 3
REVISION HISTORY
ZONE A PRELIMINARY RELEASE REV DESCRIPTION
CHANGED THICKNESS FROM 2.3 TO 2.2MM

D3, C2
B3 C4
MOVED DIMS (8, 44.72) TO REFERENCE DATUM B, MODIFIED NOTE 2. MOVED DATUM C TO MIDPLANE
B 01 02 03 INITIAL RELEASE ADDED 21.8 AND 30.8 DIMENSIONS

CHANGED PLATING REQUIREMENTS IN NOTE 3. REMOVED ZINC PLATING.
09/13/07 04/21/08 04/13/09 06/30/09 10/20/09 T.A.
D.L. D.L. D.L. D.L. D.L.
C8
04
D
860.1
70
21.80.1
1. REFERENCE DOCUMENTS ASME Y14.5M-1994 - STANDARD DIMENSION AND TOLERANCES UL1439 - UL SHARP EDGE TESTING 164997 - INTEL MARKING STANDARD A29419 - INTEL TOLERANCE STANDARD FOR SHEETMETAL C25432 - INTEL COSMETIC SPEC FOR SHEETMETAL 18-1201 - INTEL ENVIRONMENTAL PRODUCT CONTENT SPECIFICATION FOR SUPPLIERS & OUTSOURCED MANUFACTURERS (FOUND ON EHS WEBSITE - https://supplier.intel.com/static/EHS/)
B
80
48
30.80.1
C
660.1
C
42
3. MATERIAL: MAY USE INTEL ENGINEERING APPROVED EQUIVALENT. ALL SUBSTANCES IN THIS PART MUST CONFORM TO INTEL ENVIRONMENTAL PRODUCT SPECIFICATION (BS-MTN-0001). A) TYPE:SHEET STEEL, SK7, 1065, S50C, OR CHSP60PC- 2.2MM .05 THK B) CRITICAL MECHANICAL PROPERTIES: HEAT TREATED TO 250 MPa MINIMUM YIELD TENSILE YIELD STRENGTH (ASTM D638) >= 250 MPa ULTIMATE TENSILE STRENGTH (ASTM D638) >= 300 MPa C) PLATING: ELECTROLYTIC NICKEL PLATING PLUS CLEAR CHROMATE PER (ASTM B633) COLORLESS.
4. THIS PART HAS CLASS U COSMETIC REQUIREMENTS UNLESS OTHERWISE NOTED. SPECIFIED SURFACES MUST COMPLY WITH COSMETIC REQUIREMENTS PER INTEL INTEL COSMETIC SPEC FOR SHEETMETAL (C25432). PART SHALL BE FREE OF OIL AND DEBRIS.
C
5. BAG AND TAG WITH THE FOLLOWING INFORMATION. (NOTE PRIORITY IN ORDER LISTED) A) SUPPLIER PART NUMBER B) INTEL PART NUMBER E42482-001 c) DATE CODE
44.72

B
6X HOLE DIAMETERS TO BE DRIVEN BY STANDOFF PER NEHALEM EX BACKING PLATE ASSEMBLY DRAWING # E42477
7. BURR HEIGHTS SHALL NOT EXCEED 10% OF MATERIAL THICKNESS PER UL1439 AND 99-0007-001 - INTEL WORKMANSHIP STANDARD.
A
8. SHARP CORNERS MAY BE CHAMFERED, OR ROUNDED TO 0.25MM (.010") RADIUS.

B
9. PART TO BE FLAT WITHIN 0.125MM PER 25.4MM (.005"/INCH).
(2.2 ) THK
DESIGNED BY
DATE
DEPARTMENT
D. LLAPITAN
DRAWN BY
09/15/05
DATE
UNLESS OTHERWISE SPECIFIED INTERPRET DIMENSIONS AND TOLERANCES IN ACCORDANCE WITH ASME Y14.5-1994 DIMENSIONS IN MM TOLERANCES AS SPECIFIED
D. LLAPITAN 09/15/05
TITLE
R 2200 MISSION COLLEGE BLVD. P.O. BOX 58119 CORP. SANTA CLARA, CA 95052-8119
A
CHECKED BY DATE
J. KALISZEWSKI
06/30/09
APPROVED BY DATE
SIZE DRAWING NUMBER MATERIAL FINISH
NEHALEM EX BACKING PLATE

D
SEE NOTES SEE NOTES
REV
E42482
04

7 6 5
8
DWG. NO
7
E42486
SHT.
6
1
DATE 04/21/08 APPROVED
REV
5
03
4 3
REVISION HISTORY
ZONE D3, C2 01 INITIAL RELEASE REV DESCRIPTION
THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION. 02
04/13/09
ADDED 20.8 AND 29.8 DIMENSIONS.

MOVED DATUM C TO CENTER, ADDED BASIC DIMS MODIFIED NOTE 2
D.L. D.L.
C3 D8
03
06/28/09
D.L.
D
70 20.80.13
1. REFERENCE DOCUMENTS ASME Y14.5M-1994 - STANDARD DIMENSION AND TOLERANCES UL 94 - UL FLAMABILITY TESTING 18-1201 - INTEL ENVIRONMENTAL PRODUCT CONTENT SPECIFICATION FOR SUPPLIERS & OUTSOURCED MANUFACTURERS (FOUND ON EHS WEBSITE - https://supplier.intel.com/static/EHS/)

B C
3. MATERIAL: MAY USE INTEL ENGINEERING APPROVED EQUIVALENTS. ALL SUBSTANCES IN THIS PART MUST CONFORM TO INTEL ENVIRONMENTAL PRODUCT SPECIFICATION (BS-MTN-0001). CRITICAL MECHANICAL PROPERTIES: A) POLYPROPYLENE SHEET ( ITW FORMEX GK-5BK) .127MM NOMINAL THICKNESS, ONE SIDE ADHESIVE APPLIED; TOTAL THICKNESS= .178MM. B) FLAMMABILITY: UL 94-V0 OR VTM-0 RATING.
29.80.13 670.13 48 42
80
4. BAG AND TAG ASSEMBLY WITH THE FOLLOWING INFORMATION. A) PART NUMBER E42486-001 B) ASSEMBLY VENDOR ID C) DATE CODE
5. ALL DIMENSIONS SHOWN ARE CRITICAL TO FUNCTION DIMENSIONS (CTF).
4X
4.25 0.25 A B C
8.5 2X 45.22 870.13 4.5 0.25 A B C

B
A B
(0.178 ) THK
ADHESIVE SIDE
DESIGNED BY
DATE
DEPARTMENT
D. LLAPITAN
DRAWN BY
09/10/07
DATE
UNLESS OTHERWISE SPECIFIED INTERPRET DIMENSIONS AND TOLERANCES IN ACCORDANCE WITH ASME Y14.5-1994 DIMENSIONS IN MM TOLERANCES AS SPECIFIED
D. LLAPITAN 09/10/07
TITLE
R 2200 MISSION COLLEGE BLVD. P.O. BOX 58119 CORP. SANTA CLARA, CA 95052-8119
A
CHECKED BY DATE
J. KALISZEWSKI
09/10/2007
APPROVED BY DATE
NEHALEM EX BACKPLATE INSULATOR

D
SEE NOTES SEE NOTES
E42486
03
69
70
6
DWG. NO
8
D80110
04
DATE APPROVED SHT.
7
1
REV
5
REVISION HISTORY
4
C6
PST081901-03
3
01 PRODUCTION RELEASE (NPI REV E)
02
REVISED NOTE 4 TO CLARIFY PLATING 11/14/2008 10/15/2009
CCB # cMTE084502-02
2
05/18/08
05/28/08
THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION. T.BYQUIST
REPLACED KNURL WITH SOLID CYLINDER 3.59 MM.
H H
D4 QAN 7197203 03 THICKNESS AND PROCESS TEST CHANGED PLATING REQUIREMENTS IN 04 NOTE 4
F
6-32 UNC-2B THREAD
3.51)
5 7.82 0.4
C
3.59 0.05 5
5 3.6 ( 4)
0 -0.2
NOTES: 1. USE PEM PART NUMBER YQ-19185-ZI OR INTEL APPROVED ALTERNATE 2. DIMENSIONS ARE IN MILLIMETERS 3. MATERIAL: - LOW CARBON STEEL, HARDEN AND TEMPER 4. FINISH: - MIN 2 MICROMETER ELECTROLYTIC NICKEL PLATING (ZINC PLUS CLEAR CHROMATE MAY BE USED WITH CUSTOMER APPROVAL) - PROCESS TEST: 168 HRS 85 C / 85% HUMIDITY WITH NO VISIBLE CORROSION 5 . CRITICAL TO FUNCTION 6. DELTED NOTE 7 . FEATURE DETAIL PER VENDOR SPECIFICATION - FLUSH MOUNT HEAD - PUSHOUT FORCE > 250LBS - TORQUE OUT FORCE > 12.5 IN-LBS - SHEET METAL HOLE SIZE = 4 +0.08 -0MM - SHEET METAL THICKNESS = 2.2 0.05MM 8. REFERENCE AND NON-DIMENSIONED FEATURES MAY BE MODIFIED PER INTEL APPROVAL
2.2 MAX
B
( 7 4.8)
TOP
QTY ITEM NO
D80110-004
PART NUMBER
SOCKET-B,STUD,SELF-CLINCHING
DESCRIPTION
B
PARTS LIST
DEPARTMENT DATE
R
DESIGNED BY UNLESS OTHERWISE SPECIFIED INTERPRET DIMENSIONS AND TOLERANCES B. DALE IN ACCORDANCE WITH ASME Y14.5M-1994 DRAWN BY
01/25/07
DATE
PST-TMI B. DALE
CHECKED BY
1/24/07
DATE
TITLE
T. BYQUIST A. VALPIANI
APPROVED BY
1/26/07 1/26/07
DATE
SOCKET-B,STUD,SELF-CLINCING
MATERIAL
FINISH
SIZE
DRAWING NUMBER
REV
A A1
SEE NOTES SEE NOTES
SCALE:
D80110
20
DO NOT SCALE DRAWING SHEET 1 OF
04 1

6 5 4 3 2 1
8
DWG. NO
7
E74664
SHT.
6
1
DATE 06/15/09 10/20/09 T.A. J.K. APPR
REV
5
02
4 3
REVISION HISTORY
ZONE C3 02 CHANGED PLATING REQUIRMENTS IN NOTE 4. REMOVED ZINC FINISH. 01 PRELIMINARY RELEASE REV DESCRIPTION
NOTES:
6 A

1. THIS DRAWING TO BE USED IN CONJUNCTION WITH SUPPLIED 3D DATABASE. ALL DIMENSIONS AND TOLERANCES ON THIS DRAWING TAKE PRECEDENCE OVER SUPPLIED DATABASE. 2. PRIMARY DIMENSIONS STATED IN MILLIMETERS. 3. MATERIAL: STEEL, MUST MEET LOAD, TORQUE, AND FAILURE REQUIREMENTS LISTED ON ASSEMBLY DRAWING E59144. 4. FINISH: ELECTROLYTIC NICKEL PLATING PLUS CLEAR CHROMATE PER ASTM B 633 COLORLESS. 5. MATERIAL PROPERTIES: YIELD 235 MPA MIN ULTIMATE STRENGTH 395 MPA MIN 6 FEATURE DETAIL PER MANUFACTURER SPECS FOR TYPICAL PRESS FIT FLUSH MOUNT FOR >100 LBF PULL OUT, AND >20 IN-LBF TORQUE TO FAILURE. 7 CRITICAL TO FUNCTION DIMENSION. 8. PLATING CORROSION REQUIREMENTS: 48 HRS 85 C / 85% HUMIDITY WITH NO VISIBLE CORROSION
7 4.20.05
7 60.13

B
6 M3 X .5 INTERNAL THREAD THROUGH NO BURRS ON THREADING 7 SECTION A-A
DESIGNED BY
DATE
DEPARTMENT
R
J, KALISZEWSKI
DRAWN BY
06/15/09
DATE
UNLESS OTHERWISE SPECIFIED INTERPRET DIMENSIONS AND TOLERANCES IN ACCORDANCE WITH ASME Y14.5M-1994 DIMENSIONS ARE IN MM TOLERANCES AS SPECIFIED
PTMI KALISZEWSKI
CHECKED BY
A
06/15/09
DATE TITLE
D. LLAPITAN
07/06/09
APPROVED BY
DATE
LGA 1567 STUD, FEMALE

D
SEE NOTES SEE NOTES
E74664
02
71
72
Tower Heatsink Drawings

Table D-1 lists the mechanical drawings included in this appendix.
Table D-1.

Drawing Description Tower Heatsink Drawing Sheet 1 of 14 Tower Heatsink Drawing Sheet 2 of 14 Tower Heatsink Drawing Sheet 3 of 14 Tower Heatsink Drawing Sheet 4 of 14 Tower Heatsink Drawing Sheet 5 of 14 Tower Heatsink Drawing Sheet 6 of 14 Tower Heatsink Drawing Sheet 7 of 14 Tower Heatsink Drawing Sheet 8 of 14 Tower Heatsink Drawing Sheet 9 of 14 Tower Heatsink Drawing Sheet 10 of 14 Tower Heatsink Drawing Sheet 11 of 14 Tower Heatsink Drawing Sheet 12 of 14 Tower Heatsink Drawing Sheet 13 of 14 Tower Heatsink Drawing Sheet 14 of 14 Figure D-1 Figure D-2 Figure D-3 Figure D-4 Figure D-5 Figure D-6 Figure D-7 Figure D-8 Figure D-9 Figure D-10 Figure D-11 Figure D-12 Figure D-13 Figure D-14 Figure Number
73
74
4
REVISION HISTORY
ZONE 02 03 04 05 03/25/09 08/04/09 JK 06 OBSOLETE -003, ADDED -004. CHANGED TIM2 THICKNESS TO .43mm OBSOLETE -002, ADDED -003. REPLACED E42891-002 WITH E42891-003. OBSOLETE -001, CHANGED E-RING ON E42891, ADDED -002 09/10/08 JK CHANGED SHAPE OF ITEM 2 (EX-TIM2) AND ADDED PART MARKING 07/10/08 JK REMOVED "OR EQUIV" FROM DESCRIPTION OF ITEM 2 05/29/08 JK 01 RELEASE FOR PRODUCTION 05/22/08 JK REV DESCRIPTION DATE APPR
NOTES UNLESS OTHERWISE SPECIFIED:
D
07 11/03/09 E45309-004 HS ASSY W/TIM ROLLED TO -005 (UPPER RETENTION AREA USES NI ERING & NEW SHOULDER WASHER, LOWER RETENTION AREA USES DELRIN WASHER & BLACK DIE/OIL DIP O-RING). E42891-003 (HS ASSY) ROLLS TO -004. E53884-001 (ERING) ROLLS TO -002 (CALL OUT ONLY NI PLATING). E41616-001 (HS SCREW) ROLLS TO -002 (ORING GROOVE DIMENSION CHANGE). NEW E85129-001 (BLACK DIE/OIL DIP O-RING). NEW E85133-001 (DELRIN WASHER). NEW E85130-001 (ERING RETAINER). GPG
1. REFERENCE DOCUMENTS ASME Y14.5M-1994 - STANDARD DIMENSION AND TOLERANCES UL 94 - UL FLAMABILITY TESTING 99-0007-001 - INTEL WORKMANSHIP STANDARD - SYSTEMS MANUFACTURING 18-1201 - INTEL ENVIRONMENTAL PRODUCT CONTENT SPECIFICATION FOR SUPPLIERS & OUTSOURCED MANUFACTURERS (FOUND ON EHS WEBSITE - https://supplier.intel.com/static/EHS/) 07-070-SHS - ADDENDUM FOR SOLDER ON HEATSINKS
2. 3D PART MODEL IS PER ENGINEERING BILL OF MATERIAL. DIMENSIONS CALLED OUT ON THE DRAWING SHALL CONFORM TO THE DEFAULT TOLERANCE BLOCK UNLESS OTHERISE SPECIFIED. THE 3D MODEL SHALL CONTROL ALL FEATURES OF THIS PART NOT DEFINED ON THE DRAWING. MODEL TO BE INTERPRETED USING DATUM A (PRIMARY), DATUM B (SECONDARY), AND DATUM C (TERTIARY) PER THE DRAWING CALLOUT. 6
08
3. TOTAL MASS OF SOLUTION SHOULD BE UNDER 600 GRAMS REQUIRED. 500 GRAMS OR LESS IS PREFERRED. DEVIATIONS MUST BE APPROVED BY INTEL PTMI ENGINEER.
4. COIN ALL SHARP EDGES AND REMOVE ALL BURRS.
5. RETENTION MECHANISM DEVELOPED BY INTEL PTMI ENGINEER. LOADS SHOULD FALL WITHIN THE FOLLOWING RANGE AS PART OF QUALIFICATION AND QUALITY TESTING: WHEN INSTALLED, HEAT SINK SHOULD PROVIDE MIN FORCE OF 40 LB WHEN INSTALLED, HEAT SINK SHOULD PROVIDE MAX FORDE OF 68 LB
09
E45309-005 HS ASSY W/TIM ROLLED TO -006 (LOWER RETENTION AREA USES NI ERING & NEW DELRIN ERING RETAINER, UPDATE LABEL AND UPDATE MATERIAL FOR DIE CAST BASE ). E42891-004 (HS ASSY) ROLLS TO -005. E41616-002 (HS SCREW) ROLLS TO -003 (LOWER GROOVE TO MATE WITH ERING). NEW E85612-001 (DELRIN ERING RETAINER) REPLACED DELRIN FLAT WASHER E85133-001 . E53884-002 NI PLATED ERING QTY INCREASED FROM 2 TO 4. E42881-002 AL BASE DRAWING REV FROM 4 TO 5 TO CALL OUT DIE CAST MATERIAL ADC10.
12/01/09
GPG
E45309-006 ROLLS TO -007. E42891-005 ROLLS TO -006. E85612-001 ROLLS TO -002. CHANGED COLOR FROM WHITE TO BLACK.
1-28-10
GPG
C
1
PART MARK AND DATE CODE IN INDICATED AREA. BELOW PART MARK, LABEL "RECOMMENDED SCREW TORQUE: 8 IN-LBF (90 N-cm) Engage (disengage) both screws 2 full turns, then fully tighten (loosen)" MARK MUST BE PERMANENT AND READABLE AT 1.0X MAGNIFICATION.
Figure D-1. Tower Heatsink Drawing Sheet 1 of 14
DWG. NO
B
E45309
SHT.
2 33.0 2.0 [ 1.3 0.0 ]
1
REV
1 1
2 1
EX_TIM2 E42891-006
HONEYWELL P/N 95367 PCM45F 24MM X 33MM X 0.43 MM THK NEHALEM-EX TOWER HS OPTION 1
09
TOP E45309-007
QTY ITEM NO PART NUMBER DESCRIPTION
24.0 2.0 [ 0.9 0.0 ]

DESIGNED BY DATE
PARTS LIST
DEPARTMENT
R
KALISZEWSKI
DRAWN BY
05/22/08
DATE
PTMI KALISZEWSKI
CHECKED BY
A
0.430 [0.017 ]
UNLESS OTHERWISE SPECIFIED INTERPRET DIMENSIONS AND TOLERANCES IN ACCORDANCE WITH ASME Y14.5M-1994 DIMENSIONS ARE IN MM TOLERANCES: .X .5 Angles 0.5 .XX .25 .XXX .05
05/22/08
DATE
TITLE
A
C. BEALL 05/22/08
APPROVED BY DATE
NEHALEM TWR HS W/TIM2

05/22/08
MATERIAL FINISH SIZE DRAWING NUMBER REV
TIM2 3
C
SEE NOTES SEE NOTES
E45309
09
8
DWG. NO
7
E42891
SHT.
6
1
DATE 3/25/09 APPR
REV
5
7
4 3
REVISION HISTORY
ZONE 4 ADDED WASHER BETWEEN LOWER E_RING AND HEAT SINK BASE (2X) REPLACED E42881-001 WITH E42881-002 REV DESCRIPTION
5 11-3-09 GPG
E42891-003 (HS ASSY) ROLLS TO -004. (UPPER RETENTION AREA USES NI ERING & NEW SHOULDER WASHER, LOWER RETENTION AREA USES DELRIN WASHER & BLACK DIE/OIL DIP O-RING). E53884-001 (ERING) ROLLS TO -002 (CALL OUT ONLY NI PLATING). E41616-001 (HS SCREW) ROLLS TO -002 (ORING GROOVE DIMENSION CHANGE). NEW E85129-001 (BLACK DIE/OIL DIP O-RING). NEW E85133-001 (DELRIN WASHER). NEW E85130-001 (ERING RETAINER).
D
A A
6 12-1-09
1. REFERENCE DOCUMENTS ASME Y14.5M-1994 - STANDARD DIMENSION AND TOLERANCES UL 94 - UL FLAMABILITY TESTING 99-0007-001 - INTEL WORKMANSHIP STANDARD - SYSTEMS MANUFACTURING 18-1201 - INTEL ENVIRONMENTAL PRODUCT CONTENT SPECIFICATION FOR SUPPLIERS & OUTSOURCED MANUFACTURERS (FOUND ON EHS WEBSITE - https://supplier.intel.com/static/EHS/) 07-070-SHS - ADDENDUM FOR SOLDER ON HEATSINKS
10 50.000 [1.969 ] MAX

GPG
2. 3D PART MODEL IS PER ENGINEERING BILL OF MATERIAL. DIMENSIONS CALLED OUT ON THE DRAWING SHALL CONFORM TO THE DEFAULT TOLERANCE BLOCK UNLESS OTHERISE SPECIFIED. THE 3D MODEL SHALL CONTROL ALL FEATURES OF THIS PART NOT DEFINED ON THE DRAWING. MODEL TO BE INTERPRETED USING DATUM A (PRIMARY), DATUM B (SECONDARY), AND DATUM C (TERTIARY) PER THE DRAWING CALLOUT.
3. TOTAL MASS OF SOLUTION SHOULD BE UNDER 600 GRAMS REQUIRED. 500 GRAMS OR LESS IS PREFERRED. DEVIATIONS MUST BE APPROVED BY INTEL PTMI ENGINEER.
10 16.000 [.630 ] MINIMUM 10 50.000 [1.969 ] MAX

7 E42891-005 ROLLS TO -006. E85612-001 ROLLS TO -002. CHANGED COLOR FROM WHITE TO BLACK.
E42891-004 (HS ASSY) ROLLS TO -005. (LOWER RETENTION AREA USES NI ERING & NEW DELRIN ERING RETAINER, UPDATE LABEL AND UPDATE MATERIAL FOR DIE CAST BASE ). E41616-002 (HS SCREW) ROLLS TO -003 (LOWER GROOVE TO MATE WITH ERING). NEW E85612-001 (DELRIN ERING RETAINER) REPLACED DELRIN FLAT WASHER E85133-001 . E53884-002 NI PLATED ERING QTY INCREASED FROM 2 TO 4. E42881-002 AL BASE DRAWING REV FROM 4 TO 5 TO CALL OUT DIE CAST MATERIAL ADC10. ADDED ORIENTATION OF LOWER E-RING. 1-28-10
4. COIN ALL SHARP EDGES AND REMOVE ALL BURRS.
GPG
CRITICAL TO FUNCTION (CTF) DIMENSIONS:
MEASURED

.76 [.02] 100.000 .125 [ 3.937 .004 ] B .76 [.02] 70.000 .125 [ 2.756 .004 ] C A B A C
6 COMPONENT ASSOCIATED WITH HEAT SINK RETENTION. DEVELOPED BY INTEL PTMI ENGINEER. DEVIATION FROM SPECIFIED RETENTION FEATURES NOT ALLOWED.
7. RETENTION MECHANISM DEVELOPED BY INTEL PTMI ENGINEER. LOADS SHOULD FALL WITHIN THE FOLLOWING RANGE AS PART OF QUALIFICATION AND QUALITY TESTING: WHEN INSTALLED, HEAT SINK SHOULD PROVIDE MIN FORCE OF 40 LB WHEN INSTALLED, HEAT SINK SHOULD PROVIDE MAX FORDE OF 68 LB
8. HEATSINK MUST OPERATE IN BOTH VERTICAL AND HORIZONTAL POSITIONS. SUPPLIER TO CHOOSE BEST HEAT PIPE WICK STRUCTURE (SINTERED, GROOVED, ETC.) TO SUPPORT BOTH ORIENTATIONS. AIRFLOW ALWAYS PARALLEL TO FIN LENGTH.
C
1.263 .125 [ .050 .004 ] FIN TO FIN PITCH
9. INTERFACE BETWEEN FINS AND HEATPIPES IS CRITICAL TO THERMAL FUNCTION. 9A SUPPLIER TO MAXIMIZE NUMBER OF STANDARD AND POCKETED FINS (WITH FULL THERMAL INTERFACE TO HEAT PIPE PROVIDING BEST HEAT TRANSFER) 9B SUPPLIER TO MINIMIZE NUMBER OF SLOTTED FINS (WITH SLOTTED THERMAL INTERFACE TO HEAT PIPE PROVIDING POORER HEAT TRANSFER)
10 HEAT PIPES SHOULD ONLY PROTRUDE ABOVE TOP FINS IN SPECIFIED AREAS.
11 ATTACHMENT PINS MUST NOT PROTRUDE AFTER ASSEMBLY.
12. REMOVED.
13 PLEASE INSTALL E-RING SO BURR/PUNCH DIRECTION/SHARP EDGE IS AWAY FROM THE DELRIN E-RING RETAINER/HEATSINK BASE.
11
10 102.500 MAX [4.035 ] 92.475 1.000 [ 3.641 .039 ]
9A 43 STANDARD FINS
9A 12 POCKET FINS A 11 6 9B 9 SLOTTED FINS
.100 [.003] 5
B
11
6 2X 6.500 [.256 ]
B
2 12 2 2 2 4 1 43 12 9 1 11 10 9 8 7 6 5 4 3 2 4 2 1 E41830-001 E41616-003 E85130-001 E85612-002 E42883-001 E42882-001 E42889-001 E42888-001 E42887-001 E42881-002 E41829-001 E53884-002 TOP E42891-006 SPACER SCREW RTNR, E-RING, NEHALEM EX RTNR, E-RING, DELRIN, NHLM EX NEHALEM-EX HEAT SINK: CU HEAT PIPE NEHALEM-EX HEAT SINK: CU BASE NEHALEM-EX HEAT SINK: AL FIN (TOP) NEHALEM-EX HEAT SINK: AL FIN (MID) NEHALEM-EX HEAT SINK: AL FIN (BOTTOM) NEHALEM-EX HEAT SINK: AL BASE LOAD SPRING E-RING NEHALEM-EX TOWER HS OPTION 1
6 SECTION A-A
2
2X 2.500 [.098 ] 5
10
12
1 10 6
6 MUST BE LEFT HAND WOUND
(19.416 ) [.764 ]
QTY ITEM NO
PART NUMBER
DESCRIPTION
PARTS LIST
A
12 6
KALISZEWSKI
DRAWN BY
3/3/09
DATE
PTMI C. BEALL
CHECKED BY
A
3/3/08
DATE TITLE
UNLESS OTHERWISE SPECIFIED INTERPRET DIMENSIONS AND TOLERANCES IN ACCORDANCE WITH ASME Y14.5M-1994 DIMENSIONS ARE IN INCHES TOLERANCES: .X 0.5 Angles 0.5 .XX 0.25 .XXX 0.125
KALISZEWSKI
3/3/08
13 9 6
N6 SURFACE FINISH ON ENTIRE INDICATED SURFACE (26.805 ) [1.055 ]
APPROVED BY DATE
NEHALEM-EX TOWER HS
SCALE 1:1
1 6 13
D
SEE NOTES SEE NOTES
E42891
75
76
7
DWG. NO SHT. REV
8
E42889 1 3
6
REVISION HISTORY
ZONE C3 C3 03 .963 was 1.00 (OTHER SIDE OF FIN) 05/21/08 JK 02 .963 was 1.00 05/16/08 JK 01 RELEASE FOR TOOLING 4/24/08 JK REV DESCRIPTION DATE APPROVED
4 3 1
NOTES:
UNLESS OTHERWISE SPECIFIED:
1.
REFERENCE DOCUMENTS ASME Y14.5M-1994 - STANDARD DIMENSION AND TOLERANCES UL 94 - UL FLAMABILITY TESTING 99-0007-001 - INTEL WORKMANSHIP STANDARD - SYSTEMS MANUFACTURING 18-1201 - INTEL ENVIRONMENTAL PRODUCT CONTENT SPECIFICATION FOR SUPPLIERS & OUTSOURCED MANUFACTURERS (FOUND ON EHS WEBSITE - https://supplier.intel.com/static/EHS/) 6X .963 [.038 ] .300 [.012 ]
2.
3D PART MODEL IS PER ENGINEERING BILL OF MATERIAL. DIMENSIONS CALLED OUT ON THE DRAWING SHALL CONFORM TO THE DEFAULT TOLERANCE BLOCK UNLESS OTHERISE SPECIFIED. THE 3D MODEL SHALL CONTROL ALL FEATURES OF THIS PART NOT DEFINED ON THE DRAWING. MODEL TO BE INTERPRETED USING DATUM A (PRIMARY), DATUM B (SECONDARY), AND DATUM C (TERTIARY) PER THE DRAWING CALLOUT.
3.
MATERIAL: MAY USE INTEL ENGINEERING APPROVED EQUIVALENT A) TYPE: ALUMINUM ALLOY (REPORT ALLOY IN FAI STUDY) B) THICKNESS: 0.3MM (.012") THICK C) MINIMUM THERMAL CONDUCTIVITY: 205 W/mK A
4. 4X .963 [.038 ]
BURR HEIGHTS SHALL NOT EXCEED 10% OF MATERIAL THICKNESS.
5.
THIS DRAWING TO BE USED IN CORRELATION WITH SUPPLIED 3D DATABASE FILE. ALL DIMENSIONS AND TOLERANCES ON THIS DRAWING TAKE PRECEDENCE OVER SUPPLIED FILE.
6.
PART TO BE FLAT WITHIN 0.15mm.
12
100.000 [3.937 ]
7.
BEND RADII 0.125mm (.005") MINIMUM.
8.
CRITICAL TO FUNCTION DIMENSION (CTF)
MEASURED
80.000 [3.150 ]
9. BREAK ALL SHARP EDGES
10. ALL SUBSTANCES IN THIS PART MUST CONFORM TO INTEL ENVIRONMENTAL PRODUCT SPECIFICATION BS-MTN-0001. 11 10.000 [.394 ] 2X 50.000 [1.969 ] MAX
11
HEAT PIPE INTERFACE FEATURES TO BE CONTROLLED BY SUPPLIER, AND SHOULD FIT IN SPECIFIED REGION.
12
INDICATED DIMENSION DESCRIBES MAXIMUM SIZE. SUPPLIER MAY REDUCE FIN WEIGHT BY REMOVING MATERIAL FROM CORNERS OF THE FIN. A
2
11 B C 16.000 [.630 ] MINIMUM
12
70.000 [2.756 ]
B
11 50.000 [1.969 ] MAX
35.000 [1.378 ]
2X 8.00 TYP [.32 ] 12.00 TYP [.47 ]
5.200 [.205 ]
TOP
QTY ITEM NO
E42889-001
PART NUMBER
NEHALEM-EX HEAT SINK: AL FIN (TOP)

DESCRIPTION
PARTS LIST
R
C. BEALL
DRAWN BY
8/21/07
DATE
PTMI C. BEALL
CHECKED BY
A
05/17/07
DATE TITLE
UNLESS OTHERWISE SPECIFIED INTERPRET DIMENSIONS AND TOLERANCES IN ACCORDANCE WITH ASME Y14.5-1994 DIMENSIONS ARE IN MM TOLERANCES: .X 0.5 Angles 0.5 .XX 0.25 .XXX 0.125
X X
APPROVED BY
mm/dd/yy mm/dd/yy
DATE
NEHALEM-EX HEAT SINK: AL FIN (TOP)

X
MATERIAL
mm/dd/yy
FINISH
SIZE DRAWING NUMBER
REV
D
SEE NOTES SEE NOTES
E42889

7 6 5
8
DWG. NO SHT. REV
7
E42888 1 2
6
REVISION HISTORY
ZONE 2 .963 WAS 1.00 (2X) 05/20/08 JK 1 RELEASE FOR TOOLING 4/23/08 JK REV DESCRIPTION DATE APPROVED
4 3 1
NOTES:
1. 4X .963 [.038 ] .300 [.012 ]
D
A RIGHT
REFERENCE DOCUMENTS ASME Y14.5M-1994 - STANDARD DIMENSION AND TOLERANCES UL 94 - UL FLAMABILITY TESTING 99-0007-001 - INTEL WORKMANSHIP STANDARD - SYSTEMS MANUFACTURING 18-1201 - INTEL ENVIRONMENTAL PRODUCT CONTENT SPECIFICATION FOR SUPPLIERS & OUTSOURCED MANUFACTURERS (FOUND ON EHS WEBSITE - https://supplier.intel.com/static/EHS/) TOP
2.
3D PART MODEL IS PER ENGINEERING BILL OF MATERIAL. DIMENSIONS CALLED OUT ON THE DRAWING SHALL CONFORM TO THE DEFAULT TOLERANCE BLOCK UNLESS OTHERISE SPECIFIED. THE 3D MODEL SHALL CONTROL ALL FEATURES OF THIS PART NOT DEFINED ON THE DRAWING. MODEL TO BE INTERPRETED USING DATUM A (PRIMARY), DATUM B (SECONDARY), AND DATUM C (TERTIARY) PER THE DRAWING CALLOUT. 4X .963 [.038 ]
3.
MATERIAL: MAY USE INTEL ENGINEERING APPROVED EQUIVALENT A) TYPE: ALUMINUM ALLOY (REPORT ALLOY IN FAI STUDY) B) THICKNESS: 0.3MM (.012") THICK C) MINIMUM THERMAL CONDUCTIVITY: 205 W/mK
4.

1
12 100.000 [3.937 ]
5.
6.
7.
8.
1 3
10.000 [.394 ]
MEASURED
80.000 [3.150 ]
10. ALL SUBSTANCES IN THIS PART MUST CONFORM TO INTEL ENVIRONMENTAL PRODUCT SPECIFICATION BS-MTN-0001. 11
11 2X 50.000 MAX [1.969 ]
12
INDICATED DIMENSION DESCRIBES MAXIMUM SIZE. SUPPLIER MAY REDUCE FIN WEIGHT BY REMOVING MATERIAL FROM CORNERS OF THE FIN. TOP
12
2
11 11 50.000 MAX [1.969 ] FRONT B C 16.000 [.630 ] MINIMUM
70.000 [2.756 ]
FRONT

B
35.000 [1.378 ]
RIGHT
8.00 TYP [.32 ] 12.00 TYP [.47 ]
TOP
QTY ITEM NO
E42888-001
PART NUMBER
NEHALEM-EX HEAT SINK: AL FIN (MID)

DESCRIPTION
PARTS LIST
R
C. BEALL
DRAWN BY
8/21/07
DATE
PTMI C. BEALL
CHECKED BY
A
05/17/07
DATE TITLE
X X
APPROVED BY
mm/dd/yy mm/dd/yy
DATE
NEHALEM-EX HEAT SINK: AL FIN (MID)

X
MATERIAL
mm/dd/yy
FINISH
SIZE DRAWING NUMBER
REV
D
SEE NOTES SEE NOTES
E42888
77
78
7
DWG. NO SHT. REV
8
E42887 1 2
6
REVISION HISTORY
ZONE 2 .963 WAS 1.00 (2X) 05/20/08 JK 1 RELEASE FOR TOOLING 4/23/08 JK REV DESCRIPTION DATE APPROVED
4 3 1
NOTES:
1.
D
A TOP .300 THICK [.012 ] RIGHT
REFERENCE DOCUMENTS ASME Y14.5M-1994 - STANDARD DIMENSION AND TOLERANCES UL 94 - UL FLAMABILITY TESTING 99-0007-001 - INTEL WORKMANSHIP STANDARD - SYSTEMS MANUFACTURING 18-1201 - INTEL ENVIRONMENTAL PRODUCT CONTENT SPECIFICATION FOR SUPPLIERS & OUTSOURCED MANUFACTURERS (FOUND ON EHS WEBSITE - https://supplier.intel.com/static/EHS/)
D
3
4X .963 [.038 ]
2.
3D PART MODEL IS PER ENGINEERING BILL OF MATERIAL. DIMENSIONS CALLED OUT ON THE DRAWING SHALL CONFORM TO THE DEFAULT TOLERANCE BLOCK UNLESS OTHERISE SPECIFIED. THE 3D MODEL SHALL CONTROL ALL FEATURES OF THIS PART NOT DEFINED ON THE DRAWING. MODEL TO BE INTERPRETED USING DATUM A (PRIMARY), DATUM B (SECONDARY), AND DATUM C (TERTIARY) PER THE DRAWING CALLOUT.
3.
MATERIAL: MAY USE INTEL ENGINEERING APPROVED EQUIVALENT A) TYPE: ALUMINUM ALLOY (REPORT ALLOY IN FAI STUDY) B) THICKNESS: 0.3MM (.012") THICK C) MINIMUM THERMAL CONDUCTIVITY: 205 W/mK
4X .963 [.038 ]
4.
5.
6.
7.
8.
12
100.000 [3.937 ]
C
80.000 [3.150 ]
MEASURED
10. ALL SUBSTANCES IN THIS PART MUST CONFORM TO INTEL ENVIRONMENTAL PRODUCT SPECIFICATION BS-MTN-0001. 10.000 [.394 ] 11 50.000 [1.969 ] TOP
11
12
INDICATED DIMENSION DESCRIBES MAXIMUM SIZE. SUPPLIER MAY REDUCE FIN WEIGHT BY REMOVING MATERIAL FROM CORNERS OF THE FIN.
11 FRONT B 13.000 [.512 ] C
50.000 [1.969 ] FRONT
B
12
70.000 [2.756 ]
35.000 [1.378 ]
RIGHT
A 8.00 TYP [.32 ] 12.00 TYP [.47 ]
TOP
QTY ITEM NO
E42887-001
PART NUMBER
NEHALEM-EX HEAT SINK: AL FIN (BASE)

DESCRIPTION
PARTS LIST
R
C. BEALL
DRAWN BY
8/22/07
DATE
PTMI C. BEALL
CHECKED BY
A
8/20/07
DATE TITLE
X X
APPROVED BY
mm/dd/yy mm/dd/yy
DATE
NEHALEM-EX HS: AL FIN (BOTTOM)

X
MATERIAL
mm/dd/yy
FINISH
SIZE DRAWING NUMBER
REV
D
SEE NOTES SEE NOTES
E42887

7 6 5
8
DWG. NO SHT. REV
7
E42883 1 1
6
REVISION HISTORY
ZONE 1 RELEASED FOR TOOLING 4/23/08 JK REV DESCRIPTION DATE APPROVED
4 3 1

REQUIREMENTS.
1. 2. 3.
HEAT PIPE INTERFACE FEATURES TO BE CONTROLLED BY SUPPLIER. HEAT PIPE GEOMETRY TO BE CONTROLLED BY SUPPLIER TO MEET ASSEMBLY PRINT HEAT PIPE BASE MATERIAL: MAY USE INTEL ENGINEERING APPROVED EQUIVALENT A) TYPE: COPPER ALLOY (REPORT ALLOY IN FAI STUDY) B) MINIMUM THERMAL CONDUCTIVITY: 390 W/mK C) WICK: SINTERED POWDER
SECTION
A-A

C
TOP
QTY ITEM NO
E42883-001
PART NUMBER
NEHALEM-EX HEAT SINK: CU HEAT PIPE

DESCRIPTION
PARTS LIST
R
C. BEALL
DRAWN BY
8/21/07
DATE
PTMI C. BEALL
CHECKED BY
A
05/17/07
DATE TITLE
X X
APPROVED BY
mm/dd/yy mm/dd/yy
DATE
NEHALEM-EX HEAT SINK: CU HEAT PIPE

X
MATERIAL
mm/dd/yy
FINISH
SIZE DRAWING NUMBER
REV
D
SEE NOTES SEE NOTES
E42883
79
80
7
DWG. NO SHT. REV
8
E42882 1 2
6
REVISION HISTORY
ZONE 2 PEDESTAL CORNER RADIUS IS 0.5MM WAS 4MM 6/13/08 JK 1 RELEASE FOR TOOLING 4/23/08 JK REV DESCRIPTION DATE APPROVED
4 3 1
1.
D
7
REFERENCE DOCUMENTS ASME Y14.5M-1994 - STANDARD DIMENSION AND TOLERANCES UL 94 - UL FLAMABILITY TESTING 99-0007-001 - INTEL WORKMANSHIP STANDARD - SYSTEMS MANUFACTURING 18-1201 - INTEL ENVIRONMENTAL PRODUCT CONTENT SPECIFICATION FOR SUPPLIERS & OUTSOURCED MANUFACTURERS (FOUND ON EHS WEBSITE - https://supplier.intel.com/static/EHS/) 07-070-SHS - ADDENDUM FOR SOLDER ON HEATSINKS
D
3
2.500 [.098 ] C
2.
3D PART MODEL IS PER ENGINEERING BILL OF MATERIAL. DIMENSIONS CALLED OUT ON THE DRAWING SHALL CONFORM TO THE DEFAULT TOLERANCE BLOCK UNLESS OTHERISE SPECIFIED. THE 3D MODEL SHALL CONTROL ALL FEATURES OF THIS PART NOT DEFINED ON THE DRAWING. MODEL TO BE INTERPRETED USING DATUM A (PRIMARY), DATUM B (SECONDARY), AND DATUM C (TERTIARY) PER THE DRAWING CALLOUT. 7
3.
MATERIAL: MAY USE INTEL ENGINEERING APPROVED EQUIVALENT A) TYPE: COPPER ALLOY (REPORT ALLOY IN FAI STUDY) B) MINIMUM THERMAL CONDUCTIVITY: 390 W/mK
4.
PART TO BE CAST, EXTRUDED, MACHINED, OR A COMBINATION. IF PART IS CAST, REFER TO THE FOLLOWING REQUIREMENTS: A) DEGATE: .13 MM [.005 IN] MAXIMUM B) FLASH & MISMATCH .13 MM [.005 IN] MAXIMUM C) SINK .13 MM [.005 IN] MAXIMUM D) EJECTOR MARKS: FLUSH TO MINUS .00 MM/-.25 MM [.000 IN/-.010 IN] B B
5.
MEASURED
FINISH: MAY USE ENGINEERING APPROVED EQUIVALENT. A) INDICATED SURFACES PER INTEL 99-0007-001, CLASS A. B) INDICATED SURFACES PER INTEL 99-0007-001, CLASS B. C) UNSPECIFIED SURFACES PER INTEL 99-0007-001, CLASS C. D) TEXTURE INDICATED SURFACES PER MT-11020. E) FINISH INDICATED SURFACES PER SPI D-2. F) SURFACES WITH NO TEXTURE TO BE IN THE RANGE OF SPI B-2 TO SPI C-2. G) NO TEXTURE.
7 C A
HEAT PIPE AND ALUMINUM BASE INTERFACE FEATURES TO BE CONTROLLED BY SUPPLIER.
N6 SURFACE FINISH ON ENTIRE INDICATED SURFACE
.100 [.003] (2.500 ) [.098 ]
B
2
C 26.000 [1.024 ]

B
35.000 [1.378 ]
TOP
QTY ITEM NO
E42882-001
PART NUMBER
NEHALEM-EX HEAT SINK: CU BASE

DESCRIPTION
PARTS LIST
R
A
R.50 [.02 ]
C. BEALL
DRAWN BY
8/21/07
DATE
PTMI C. BEALL
CHECKED BY
A
05/17/07
DATE TITLE
X X
APPROVED BY
mm/dd/yy mm/dd/yy
DATE
NEHALEM-EX HEAT SINK: CU BASE

X
MATERIAL
mm/dd/yy
FINISH
SIZE DRAWING NUMBER
REV
D
SEE NOTES SEE NOTES
E42882

7 6 5
8
DWG. NO SHT. REV
7
E42881 1 5
6
REVISION HISTORY
ZONE 2 ADDED 11.5 WAS 10.5, ADD SURFACE FINISH TO BOTTOM OF C'BORE N7 FINISH WAS N6 ON NOTE 3 ADDED "ADC10". MINIMUM THERMAL CONDUCTIVITY WAS 205 W/mK MINIMUM THERMAL CONDUCTIVITY IS 100W/mK 12/1/9 GPG 08/10/09 04/22/09 10.5MM X 0.5MM DEEP C'BORE ON BOTTOM OF PART 3/25/09 1 RELEASE FOR TOOLING 04/23/08 JK REV DESCRIPTION DATE APPROVED
4 3 1
9
B4 4
NOTES UNLESS OTHERWISE SPECIFIED: 90.500 [3.563]

3
1.
5
57.000 [2.244] 8
REFERENCE DOCUMENTS ASME Y14.5M-1994 - STANDARD DIMENSION AND TOLERANCES UL 94 - UL FLAMABILITY TESTING 99-0007-001 - INTEL WORKMANSHIP STANDARD - SYSTEMS MANUFACTURING 18-1201 - INTEL ENVIRONMENTAL PRODUCT CONTENT SPECIFICATION FOR SUPPLIERS & OUTSOURCED MANUFACTURERS (FOUND ON EHS WEBSITE - https://supplier.intel.com/static/EHS/)
2.
3D PART MODEL IS PER ENGINEERING BILL OF MATERIAL. DIMENSIONS CALLED OUT ON THE DRAWING SHALL CONFORM TO THE DEFAULT TOLERANCE BLOCK UNLESS OTHERISE SPECIFIED. THE 3D MODEL SHALL CONTROL ALL FEATURES OF THIS PART NOT DEFINED ON THE DRAWING. MODEL TO BE INTERPRETED USING DATUM A (PRIMARY), DATUM B (SECONDARY), AND DATUM C (TERTIARY) PER THE DRAWING CALLOUT. 4.500 [.177 ] B 4.500 [.177 ] C
3.
MATERIAL: MAY USE INTEL ENGINEERING APPROVED EQUIVALENT A) TYPE: ALUMINUM ALLOY: ADC10 (REPORT ALLOY IN FAI STUDY) B) MINIMUM THERMAL CONDUCTIVITY: 100 W/mK

9 70.000 [2.756]
4.
PART TO BE CAST, EXTRUDED, MACHINED, OR A COMBINATION. IF PART IS CAST, REFER TO THE FOLLOWING REQUIREMENTS: A) DEGATE: .13 MM [.005 IN] MAXIMUM B) FLASH & MISMATCH .13 MM [.005 IN] MAXIMUM C) SINK .13 MM [.005 IN] MAXIMUM D) EJECTOR MARKS: FLUSH TO MINUS .00 MM/-.25 MM [.000 IN/-.010 IN]
5.
MEASURED
C
10
FINISH: MAY USE ENGINEERING APPROVED EQUIVALENT. A) INDICATED SURFACES PER INTEL 99-0007-001, CLASS A. B) INDICATED SURFACES PER INTEL 99-0007-001, CLASS B. C) UNSPECIFIED SURFACES PER INTEL 99-0007-001, CLASS C. D) TEXTURE INDICATED SURFACES PER MT-11020. E) FINISH INDICATED SURFACES PER SPI D-2. F) SURFACES WITH NO TEXTURE TO BE IN THE RANGE OF SPI B-2 TO SPI C-2. G) NO TEXTURE.
7.
ROUNDS REQUIRED FOR FINAL PRODUCTION CAST PART. NOT REQUIRED FOR PROTOTYPE ORDER
8 SUPPLIER MAY
HEAT PIPE AND CU CORE INTERFACE FEATURES TO BE CONTROLLED BY SUPPLIER.
INDICATED DIMENSION DESCRIBES MAXIMUM VOLUME. REMOVE MATERIAL FROM BASE TO REDUCE WEIGHT
80.000 [3.150]
10
INDICATED POCKET FEATURE IS FOR WEIGHT REDUCTION. THESE FEATURES ARE A SUGGESTION ONLY. SUPPLIER MAY CHANGE POCKETS WITH INTEL PTMI APPROVAL.
10.100 [.398]

B
B
3
4.000 [.157]
2X (
11.50 X 0.500 DEEP) [.45 ] N7 SURFACE FINISH ON BOTTOM OF RECESS
TOP
QTY ITEM NO
E42881-002
PART NUMBER
NEHALEM-EX HEAT SINK: AL BASE

DESCRIPTION
PARTS LIST
R
C. BEALL
DRAWN BY
8/20/07
DATE
PTMI C. BEALL
CHECKED BY
A
8/20/07
DATE TITLE
UNLESS OTHERWISE SPECIFIED INTERPRET DIMENSIONS AND TOLERANCES IN ACCORDANCE WITH ASME Y14.5-1994 DIMENSIONS ARE IN MM TOLERANCES: .X # 0.5 Angles # 0.5 $ .XX # 0.25 .XXX # 0.125
KALISZEWSKI X
APPROVED BY
08/20/07 mm/dd/yy
DATE
NEHALEM-EX HEAT SINK: AL BASE

X
MATERIAL
mm/dd/yy
FINISH
SIZE DRAWING NUMBER
REV
D
SEE NOTES SEE NOTES
E42881
81
82
4 2
REVISION HISTORY
ION CONFIDENTIAL INFORMATION. IT IS SPLAYED OR MODIFIED, WITHOUT THE PRI ZONE 2 CHANGED SPRING ID AND OD TO AGREE WITH LEE SPRING 05/21/08 JK 1 RELEASE FOR TOOLING 04/23/08 JK REV DESCRIPTION DATE APPR DISCLOSED IN CONFIDENCE AND ITS CONT OR WRITTEN CONSENT OF INTEL CORPORAT ENTS ION.
3 1
NOTES:
1.
D
4
2.
3.
THIS DRAWING TO BE USED IN CONJUNCTION WITH SUPPLIED 3D DATABASE. ALL DIMENSIONS AND TOLERANCES ON THIS DRAWING TAKE PRECEDENCE OVER SUPPLIED DATABASE. PRIMARY DIMENSIONS STATED IN MILLIMETERS. [BRACKETED] DIMENSIONS STATED IN INCHES. LEE SPRING P/N: LHL 375b-01 OR EQUIVALENT SPRING RATE: K=15.8 +/- 0.87 N/MM [K = 90.0 +/- 5.0 LBF/IN] SOLID HEIGHT: 14.98 MM [0.59 IN] WIRE DIAMETER: 1.473 MM [0.058 IN] TOTAL COILS: 10 ACTIVE COILS: 8.1 ENDS: GROUND & CLOSED TURN: LEFT HAND (AS SHOWN IN VIEWS) MATERIAL: MUSIC WIRE, ASTM A228 OR JIS-G-3522 FINISH: ZINC PLATED OTHER GEOMETRY: PER THIS DRAWING CRITICAL TO FUNCTION DIMENSION
8.563 0.200 4 [0.3371 0.0078 ]

DWG. NO
5.777 4 [0.2274 ]
B
E41829
25.400 4 [1.0000 ]
SHT.
1
REV
PITCH2.503 [0.0985 ]
QTY
TOP E41829-001
ITEM NO PART NUMBER
MUST BE LEFT HAND WOUND

DESCRIPTION
4
DESIGNED BY DATE
PARTS LIST
DEPARTMENT
R
1.473 [0.0580 ]
DRAWN BY DATE
PTMI JK
CHECKED BY
UNLESS OTHERWISE SPECIFIED INTERPRET DIMENSIONS AND TOLERANCES IN ACCORDANCE WITH ASME Y14.5M-1994 DIMENSIONS ARE IN MILLIMETERS TOLERANCES: .X 0.3 Angles 0.5 .XX 0.20 .XXX 0.127
04/11/08
DATE
TITLE
A
APPROVED BY
DATE
NEHALEM EX LOAD SPRING

JK
MATERIAL
04/11/08
FINISH
SIZE DRAWING NUMBER
REV
C
SEE NOTES SEE NOTES
E41829
83
84
7
DWG. NO SHT. REV
8
E41616 1 5
6
REVISION HISTORY
ZONE 1 2 3 REVISED SLOT DIMENSIONS (2X) CHANGED LOWER SLOT FORM 3.23mm TO 3.30mm. KEPT UPPER SLOT 3.23mm. 10-30-09 12-1-09 GPG GPG CHANGED LOWER SLOT FROM 3.30mm TO 3.226mm 09/04/08 JK ADDED CALLOUT FOR #2 PHILLIPS RECESS 05/29/08 JK RELEASE FOR TOOLING 04/23/08 JK REV DESCRIPTION DATE APPR
4 3 1
7.00 [0.276] 6.00 [0.236]
4
5
1. 2.00 [0.079] 3.50 [0.138]
REFERENCE DOCUMENTS 99-0007-001 - INTEL WORKMANSHIP STANDARD - SYSTEMS MANUFACTURING 18-1201 - INTEL ENVIRONMENTAL PRODUCT CONTENT SPECIFICATION FOR SUPPLIERS & OUTSOURCED MANUFACTURERS (FOUND ON EHS WEBSITE - https://supplier.intel.com/static/EHS/)
2.
INTERPRET DIMENSIONS PER ASME Y14.5M-1994. FEATURES NOT SPECIFIED ON DRAWING SHALL BE CONTROLLED BY 3D CAD DATABASE, AND SHALL CONFORM TO A TOLERANCE OF +/- 0.375MM (.015"). IF PROVIDED, MEASUREMENTS SHOULD REFERENCE DATUM -A- PRIMARY,
DATUM R0.20 [0.008 ]
-B-
SECONDARY, AND
-C-
TERTIARY.
3. DETAIL B SCALE 4.000
MATERIAL: MAY USE INTEL ENGINEERING APPROVED EQUIVALENT. ALL SUBSTANCES IN THIS PART MUST CONFORM TO INTEL ENVIRONMENTAL PRODUCT SPECIFICATION (BS-MTN-0001). A) TYPE:18-8 STAINLESS STEEL; AISI 303, 304, 305; JIS SUS304; B) PLATING: NONE C) HEAT TREATING: MINIMUM TENSILE STRENGTH 60,000 PSI; TORQUE TO FAILURE SHALL BE NO LESS THAN 20 IN-LBF.
4. #2 PHILLIPS RECESS
PART MUST COMPLY WITH INTEL WORKMANSHIP STANDARD (99-0007-001). PART SHALL BE FREE OF OIL AND DEBRIS. FINISH: UNSPECIFIED SURFACES MUST CONFORM WITH CLASS C REQUIREMENTS.
6.
7. SEE DETAIL B
5 4.20 [0.165]
2X 3.226 5 [0.1270]
SCALE
2.000
102.00 [4.016]

B
5 33.700 [1.3268]
SCALE 2X 0.740 5 [0.0291]
2.000
SECTION
A-A
5 6.797 [0.2676]
TOP E41616-003
QTY ITEM NO PART NUMBER
SCREW
DESCRIPTION
SEE DETAIL
A
DESIGNED BY DATE
PARTS LIST
DEPARTMENT
R
A
M3 x 0.5 THREAD
5.50 [0.217]
C. BEALL
DRAWN BY
04/08/08
DATE
KALISZEWSKI
CHECKED BY
A
04/08/08
DATE TITLE
UNLESS OTHERWISE SPECIFIED INTERPRET DIMENSIONS AND TOLERANCES IN ACCORDANCE WITH ASME Y14.5M-1994 DIMENSIONS ARE IN MILLIMETERS TOLERANCES: .X # 0.5 Angles # 1.0 $ .XX # 0.25 .XXX # 0.127
C. BEALL
04/08/08
DETAIL A SCALE 4.000
APPROVED BY
DATE
NEHALEM EX HS SCREW
D
SEE NOTES SEE NOTES
E41616

7 6 5
4
REVISION HISTORY
ZONE 2 12-1-09 1-28-10 GPG GPG 3 RELEASED FOR TOOL BUILD OF REMAINING TOOL CAVITIES. ADDED MATERIAL GRADE. CHANGED COLOR FROM WHITE TO BLACK. SEE NOTE 3. 1 RELEASE FOR RFQ AND DESIGN REVIEW. RELEASE FOR 2 CAVITIES ONLY. 11-4-09 GPG REV DESCRIPTION DATE APPR
1. REFERENCE DOCUMENTS 99-0007-001 - INTEL WORKMANSHIP STANDARD - SYSTEMS MANUFACTURING 18-1201 - INTEL ENVIRONMENTAL PRODUCT CONTENT SPECIFICATION FOR SUPPLIERS & OUTSOURCED MANUFACTURERS (FOUND ON EHS WEBSITE - https://supplier.intel.com/static/EHS/)
2. INTERPRET DIMENSIONS PER ASME Y14.5M-1994. FEATURES NOT SPECIFIED ON DRAWING SHALL BE CONTROLLED BY 3D CAD DATABASE. IF PROVIDED, MEASUREMENTS SHOULD REFERENCE DATUM -A- PRIMARY, DATUM -B- SECONDARY, AND -C- TERTIARY.
3. MATERIAL: MAY USE INTEL ENGINEERING APPROVED EQUIVALENT. ALL SUBSTANCES IN THIS PART MUST CONFORM TO INTEL ENVIRONMENTAL PRODUCT SPECIFICATION (BS-MTN-0001). A) DELRIN ACETAL RESIN. 500P NC010. B) PIGMENT: EAGLE 7058 (1%) C) COLOR: BLACK.
4. PART MUST COMPLY WITH INTEL WORKMANSHIP STANDARD (99-0007-001). PART SHALL BE FREE OF OIL AND DEBRIS. FINISH: UNSPECIFIED SURFACES MUST CONFORM WITH CLASS C REQUIREMENTS.
5 CRITICAL TO FUNCTION DIMENSION (CTF).
C
A 8.25 4.53 1.00
6. DEBURR ALL SHARP EDGES.
1.00
.500 X 45
DWG. NO
10.25
B
E85612
SHT.
SECTION A-A A
REV
TOP E85612-002
RTNR, E-RING, DELRIN, NHLM EX

DESCRIPTION
PARTS LIST
R
G.GORDON
DRAWN BY
11-4-09
DATE
G.GORDON
CHECKED BY
UNLESS OTHERWISE SPECIFIED INTERPRET DIMENSIONS AND TOLERANCES IN ACCORDANCE WITH ASME Y14.5M-1994 DIMENSIONS ARE IN MM TOLERANCES: .X .25 Angles .5 .XX .20 .XXX .125
11-4-09
DATE
TITLE
A
APPROVED BY DATE SIZE DRAWING NUMBER MATERIAL FINISH REV
RTNR, E-RING, DELRIN, NHLM EX C

SEE NOTES SEE NOTES
E85612
85
86
4
REVISION HISTORY
THIS DRAWING CONTAINS INTEL CORPORAT MAY NOT BE DISCLOSED, REPRODUCED, DI ZONE 1 RELEASE FOR SILVER PRODUCTION BUILD. REV DESCRIPTION ION CONFIDENTIAL INFORMATION. IT IS SPLAYED OR MODIFIED, WITHOUT THE PRI DISCLOSED IN CONFIDENCE AND ITS CONT OR WRITTEN CONSENT OF INTEL CORPORAT ENTS ION.
1
DATE 10-30-09 APPR GPG
NOTES; UNLESS OTHERWISE SPECIFIED: 1. REFERENCE DOCUMENTS 99-0007-001 - INTEL WORKMANSHIP STANDARD - SYSTEMS MANUFACTURING 18-1201 - INTEL ENVIRONMENTAL PRODUCT CONTENT SPECIFICATION FOR SUPPLIERS & OUTSOURCED MANUFACTURERS (FOUND ON EHS WEBSITE - https://supplier.intel.com/static/EHS/) INTERPRET DIMENSIONS PER ASME Y14.5M-1994. FEATURES NOT SPECIFIED ON DRAWING SHALL BE CONTROLLED BY 3D CAD DATABASE. IF PROVIDED, MEASUREMENTS SHOULD REFERENCE DATUM -A- PRIMARY, DATUM -B- SECONDARY, AND -C- TERTIARY. MATERIAL: MAY USE INTEL ENGINEERING APPROVED EQUIVALENT. ALL SUBSTANCES IN THIS PART MUST CONFORM TO INTEL ENVIRONMENTAL PRODUCT SPECIFICATION (BS-MTN-0001). A) TYPE 303S OR 303Se STAINLESS STEEL (CONDITION B) B) PLATING: NONE PART MUST COMPLY WITH INTEL WORKMANSHIP STANDARD (99-0007-001). PART SHALL BE FREE OF OIL AND DEBRIS. FINISH: UNSPECIFIED SURFACES MUST CONFORM WITH CLASS C REQUIREMENTS. CRITICAL TO FUNCTION DIMENSION (CTF). DEBURR ALL SHARP EDGES.
D
2.
3.
4.
5 6.
C
A 5 8.25 4.53 5 1.00 1.00 5

C
.500 X 45 $
DWG. NO
10.25
B
E85130
SHT.
SECTION
A-A
REV
TOP E85130-001
RTNR, E-RING, NEHALEM EX

DESCRIPTION
PARTS LIST
R
G.GORDON
DRAWN BY
10-30-09
DATE
G.GORDON
CHECKED BY
UNLESS OTHERWISE SPECIFIED INTERPRET DIMENSIONS AND TOLERANCES IN ACCORDANCE WITH ASME Y14.5M-1994 DIMENSIONS ARE IN MM TOLERANCES: .X # .25 Angles # .5 $ .XX # .20 .XXX # .125
10-30-09
DATE
TITLE
A
APPROVED BY
DATE
RTNR, E-RING, NEHALEM EX

C
SEE NOTES SEE NOTES
E85130
SCALE 8 000 DO NOT SCALE DRAWING SHEET 1 OF 1
4 2
REVISION HISTORY
ION CONFIDENTIAL INFORMATION. IT IS SPLAYED OR MODIFIED, WITHOUT THE PRI ZONE 02 03 11-3-09 GPG REMOVED OIL DIP AS AN OPTION. NICKEL PLATING ONLY. REMOVED NOTE 4. ADDED SK7 IN MATERIAL CALLOUT. ADDED OPTIONAL NICKEL PLATING FINISH 07/27/09 01 INITIAL RELEASE 09/04/08 JK REV DESCRIPTION DATE APPR DISCLOSED IN CONFIDENCE AND ITS CONT OR WRITTEN CONSENT OF INTEL CORPORAT ENTS ION.
3 1
NOTES:
1.
THIS DRAWING TO BE USED IN CONJUNCTION WITH SUPPLIED
3D DATABASE.
ALL DIMENSIONS AND TOLERANCES ON THIS
DRAWING TAKE PRECEDENCE OVER SUPPLIED DATABASE.
2.
PRIMARY DIMENSIONS STATED IN MILLIMETERS.
[BRACKETED] DIMENSIONS STATED IN INCHES. STRENGTH.
3.
MATERIAL:
SK7 COLD ROLED HIGH CARBON STEEL. MUST MEET 84 KSI MIN TENSILE
FINISH - NICKEL PLATED.
4.
REMOVED.
CRITICAL TO FUNCTION DIMENSION
C
3.175
7.92 [.312 ]
[
.1250
+0.026 5 -0.077 +.0010 -.0030
DWG. NO
B
E53884
SHT.
5 0.635 # 0.051 [.0250 # .0020 ]
REV
TOP E53884-002
E-RING
DESCRIPTION
PARTS LIST
R
C. BEALL
DRAWN BY
09/04/08
DATE
PTMI JK
CHECKED BY
UNLESS OTHERWISE SPECIFIED INTERPRET DIMENSIONS AND TOLERANCES IN ACCORDANCE WITH ASME Y14.5M-1994 DIMENSIONS ARE IN INCHES TOLERANCES: .X # 0.50 Angles # 0.5 $ .XX # 0.25 .XXX # 0.10
09/04/08
DATE
TITLE
A
C. BEALL 09/04/08
APPROVED BY
DATE SIZE DRAWING NUMBER MATERIAL FINISH
E-RING
REV
C
SEE NOTES SEE NOTES
E53884
87
88
Enabled Component Board Keepout Drawings

Table E-1 lists the mechanical drawings included in this appendix.
Table E-1.

Drawing Description Enabled Component Board Keepout Mechanical Drawing Sheet 1 of 7 Enabled Component Board Keepout Mechanical Drawing Sheet 2 of 7 Enabled Component Board Keepout Mechanical Drawing Sheet 3 of 7 Enabled Component Board Keepout Mechanical Drawing Sheet 4 of 7 Enabled Component Board Keepout Mechanical Drawing Sheet 5 of 7 Enabled Component Board Keepout Mechanical Drawing Sheet 6 of 7 Enabled Component Board Keepout Mechanical Drawing Sheet 7of 7 Figure E-1 Figure E-2 Figure E-3 Figure E-4 Figure E-5 Figure E-6 Figure E-7 Figure Number
89
Figure E-1.
90
7
DWG. NO
8
E36581
SHT.
6
1
DATE 02/07/2008 05/13/09 09/02/09 JK JK APPROVED
REV
5
01
4 3
REVISION HISTORY
ZONE 0.6 01 REMOVED "SUBJECT TO CHANGE" FOR SOCKET CAVITY COMPONENT HEIGHT ADDED PG 7. 0.5 PRE-RELEASE FOR NEHALEM EX PDR. REV DESCRIPTION
1. THIS DRAWING TO BE USED IN CORRELATION WITH SUPPLIED 3D DATABASE FILE. ALL DIMENSIONS AND TOLERANCES ON THIS DRAWING TAKE PRECEDENCE OVER SUPPLIED FILE.
2. PRIMARY DIMENSIONS STATED IN MM.
3. SOCKET KEEP OUT DIMENSIONS SHOWN FOR REFERENCE ONLY. REFER TO THE SOCKET LS KEEPOUT/KEEPIN DRAWING FOR EXACT DIMENSIONS.
BALL 1 LOCATION WITH RESPECT TO SOCKET BALL ARRAY IS FORMED BY INTERSECTION OF ROW A & COLUMN 1. MAXIMUM OUTLINE OF SOCKET SOLDERBALL ARRAY MUST BE PLACED SYMMETRIC TO THE ILM HOLE PATTERN (INNER PATTERN) FOR PROPER ILM & SOCKET FUNCTION.
5. A HEIGHT RESTRICTION ZONE IS DEFINED AS ONE WHERE ALL COMPONENTS PLACED ON THE SURFACE OF THE MOTHERBOARD MUST HAVEA MAXIMUM HEIGHT NO GREATER THAN THE HEIGHT DEFINED BY THAT ZONE.
ALL ZONES DEFINED BY THE OUTLINES REPRESENT THE SPACE THAT RESIDES BENEATH THE ILM, BACKPLATE, AND HEAT SINK FOOTPRINT ONLY.
THIS SPEC DOES NOT SPECIFY KEEPOUTS AND PINOUTS FOR THE SOCKET, PACKAGE, LAI, MPI, ETC.
UNLESS OTHERWISE NOTED, ALL VIEW DIMENSIONS ARE ABSOLUTE. ALL HEIGHT RESTRICTIONS ARE MAXIMUMS, NEITHER ARE DRIVEN BY IMPLIED TOLERANCES.
COMBINED PRIMARY SIDE 3D HEIGHT RESTRICTIONS NEHALEM-EX ENABLED COMPONENTS (HOLE PATTERN, ILM AND BACKPLATE AND HEAT SINK)
A HEIGHT RESTRICTION OF 0.0 MM REPRESENTS THE TOP (OR BOTTOM) SURFACE OF THE MOTHERBOARD AS THE MAXIMUM HEIGHT.
SCALE 1:1
REFER TO SUPPLIED EMN FILE FOR MORE INFORMATION ABOUT HOLE KEEPOUT INFORMATION.
Enabled Component Board Keepout Mechanical Drawing Sheet 1 of 7
7. 3D KEEPOUT MODELS CAN BE FOUND IN INTRALINK (ROOT FOLDER/SPG/EASD /MTE/STOUTLAND EC/STOUTLAND EC PUBLIC). THEY CAN BE USED AS MCAD/ECAD COMPONENTS, OR KEEPOUTS CAN BE "COPIED FROM DIFF MODEL" FROM THE WINDCHILL PART TO ANOTHER BOARD.
DESIGNED BY
DATE
DEPARTMENT
R
C. BEALL
DRAWN BY
06/06/07
DATE
UNLESS OTHERWISE SPECIFIED INTERPRET DIMENSIONS AND TOLERANCES IN ACCORDANCE WITH ASME Y14.5-1994 DIMENSIONS ARE IN MM. TOLERANCES DO NOT APPLY TO KEEPOUT ZONE DRAWINGS.
PTMI C. BEALL 06/06/07

TITLE
A
CHECKED BY DATE
X X X
MATERIAL
mm/dd/yy mm/dd/yy
APPROVED BY DATE
NEHALEM EX EC KEEPOUTS DRAWING

mm/dd/yy
FINISH SIZE DRAWING NUMBER REV
COMBINED SECONDARY SIDE 3D HEIGHT RESTRICTIONS NEHALEM-EX ENABLED COMPONENTS (HOLE PATTERN, ILM AND BACKPLATE AND HEAT SINK)
D
SEE NOTES SEE NOTES
E36581
01

7 6 5
8
DWG. NO
7
E36581
SHT.
6
2
REV
5
01
4 3 1
Figure E-2.
66.924 [ 2.635 ]
47.924 [ 1.887 ]
26.924 [ 1.060 ] SOCKET CENTER
5.924 [ .233 ]
.000 [ .000 ]
42.424 [ 1.670 ]
11.424 [ .450 ]
13.076 [ .515 ]
2X
4.650 [ .183 ] NON-PLATED THROUGH HOLE.
2X 10.928 [ .430 ] 5.410 6 2X [ .213 ] ROUTE KEEPOUT THROUGH ALL LAYERS
50.924 [ 2.005 ]
2.924 [ .115 ]

2X 8.000 [ .315 ] PLACE WEAR PAD, AND BRING AS CLOSE TO HOLE EDGE AS POSSIBLE. 0.0MM HEIGHT RESTRICTION 8.500 6 2X [ .335 ] ROUTE KEEPOUT AROUND WEARPAD
.000 [ .000 ]
10.852 [ .427 ]
22.352 [ .880 ] SOCKET CENTER
SOCKET OUTLINE SHOWN FOR REFERENCE ONLY!!! SOCKET GEOMETRY, PINOUT, ETC. DESCRIBED IN INTEL DOCUMENT D91065 OR E24510
33.852 [ 1.333 ] 4X 3.800 [ .150 ] NON-PLATED THROUGH HOLE.
1.5 MAX HEIGHT SOCKET CAVITY KEEPOUT. X AND Y LOCATIONS CONTROLLED BY SOCKET SPEC (D91065 OR E24510). THIS KEEPOUT IS SHOWN FOR REFERENCE ONLY! 5.100 6 4X [ .201 ] ROUTE KEEPOUT THROUGH ALL LAYERS
B
4X 7.000 [ .276 ] PLACE WEAR PAD, AND BRING AS CLOSE TO HOLE EDGE AS POSSIBLE. 0.0MM HEIGHT RESTRICTION
2X 59.072 [ 2.326 ]
SCALE 4:1
7.500 6 4X [ .295 ] ROUTE KEEPOUT AROUND WEARPAD

A
DEPARTMENT
R
SIZE DRAWING NUMBER
REV
XBGA1567_3_40MA_NHM NEHALEM-EX ENABLED HOLE PATTERN TOP SIDE KEEPOUTS (AS VIEWED FROM PRIMARY SIDE OF THE MOTHERBOARD)
6 5
PTMI
D
SCALE: 2:1
E36581
DO NOT SCALE DRAWING SHEET 2 OF 7
01
91
Figure E-3.
.000 [ .000 ]
62.524 [ 2.462 ] 58.349 [ 2.297 ]
40.924 [ 1.611 ]
12.924 [ .509 ]
4.501 [ .177 ]
2X 8.676 [ .342 ]
14.426 [ .568 ]
75.924 [ 2.989 ]
66.924 [ 2.635 ]
2X 60.924 [ 2.399 ]
.000 [ .000 ]
2X 7.076 [ .279 ]
13.076 [ .515 ]
4X ILM CAVITY: 3.5MM HEIGHT RESTRICTION

4
22.076 [ .869 ]
41.824 [ 1.647 ]
12.024 [ .473 ]
40.424 [ 1.592 ]
13.424 [ .529 ]
23.576 [ .928 ]
92
7
DWG. NO
8
E36581
SHT.
6
3
REV
5
01
4 3 1
4 19.908 [ .784 ]
19.378 [ .763 ] 17.648 [ .695 ]
2X 12.148 [ .478 ]
C
.000 [ .000 ]
5.348 [ .211 ] .000 [ .000 ]
ILM KEEPOUT: 0.0MM HEIGHT RESTRICTION

11.952 [ .471 ] 22.352 [ .880 ] SOCKET CENTER
13.352 [ .526 ]
31.352 [ 1.234 ]
37.352 [ 1.471 ] 32.752 [ 1.289 ]
50.052 [ 1.971 ]
2X 63.621 [ 2.505 ] 62.352 [ 2.455 ] 68.092 [ 2.681 ]
BACKPLATE KEEPOUT: 0.0MM HEIGHT RESTRICTION B
66.821 [ 2.631 ]
6X HOLES SHOWN FOR REFERENCE ONLY!!!
BACKPLATE CAVITY: 1.5MM HEIGHT RESTRICTION
SCALE 2:1
SCALE 2:1

A
NHM_EX_EC_ILMBKP NEHALEM-EX ENABLED ILM AND BACKPLATE TOP SIDE KEEPOUTS (AS VIEWED FROM PRIMARY SIDE OF THE MOTHERBOARD)
7 6 5 4
NHM_EX_EC_ILMBKP NEHALEM-EX ENABLED ILM AND BACKPLATE BOTTOM SIDE KEEPOUTS (AS VIEWED FROM PRIMARY SIDE OF THE MOTHERBOARD)
DEPARTMENT
R
SIZE DRAWING NUMBER
REV
PTMI
D
SCALE: 1:1
E36581
01
8
DWG. NO
7
E36581
SHT.
6
4
REV
5
01
4 3 1
Figure E-4.
D
77.424 [ 3.048 ] 58.349 [ 2.297 ] 4.501 [ .177 ] 26.924 [ 1.060 ] SOCKET CENTER .000 [ .000 ] 23.576 [ .928 ]

4 13.148 [ .518 ] 5.348 [ .211 ] .000 [ .000 ]
HEAT SINK: 9.0MM HEIGHT RESTRICTION C
50.052 [ 1.971 ] 57.852 [ 2.278 ]
SCALE 2:1

A
NHM_EX_EC_HS NEHALEM-EX ENABLED HEAT SINK TOP SIDE KEEPOUTS (AS VIEWED FROM PRIMARY SIDE OF THE MOTHERBOARD)
7 6 5 4
DEPARTMENT
R
SIZE DRAWING NUMBER
REV
PTMI
D
SCALE: 2:1
E36581
01
93
Figure E-5.
94
7
DWG. NO
8
E36581
SHT.
6
5
REV
5
01
4 3 1
C
B
NEHALEM-EX ENABLED COMPONENT TOP ASSEMBLY DXF 1:1 AS VIEWED FROM TOP SIDE OF THE MOTHERBOARD
SCALE 1:1
NEHALEM-EX ENABLED COMPONENT BOTTOM ASSEMBLY DXF 1:1 AS VIEWED FROM TOP SIDE OF THE MOTHERBOARD
SCALE 1:1

A
DEPARTMENT
R
SIZE DRAWING NUMBER
REV
PTMI
D
SCALE: 2:1
E36581
01

7 6 5
8
DWG. NO
7
E36581
SHT.
6
6
REV
5
01
4 3 1
Figure E-6.

D C
(93.475 [3.680 ] MAX) A B
(102.500 MAX) [4.035 ]
HEAT SINK PEDISTAL TO PROCESSOR IHS INTERFACE
( 7.599 .500 ) [ .299 .019 ] ( 2.478 .125 ) [ .098 .004 ]
DETAILS FOR NEHALEM-EX ENABLED COMPONENT MAX HEIGHT CALCULATIONS FOR REFERENCE ONLY
DEPARTMENT
R
SIZE DRAWING NUMBER
REV
PTMI
D
SCALE: 2:1
E36581
01
95
Figure E-7.
96
6
DWG. NO
8
E36581
SHT.
7
7
REV
5
01
4 3 1
DETAILS FOR NEHALEM-EX ENABLED COMPONENT ILM LOADPLATE AND LEVER SWEEPS MAX HEIGHT CALCULATIONS FOR REFERENCE ONLY
45.33 [1.78 ] 33.70 [1.33 ]
80.10 [3.15 ]
80.55 [3.17 ]
Enabled Component Board Keepout Mechanical Drawing Sheet 7of 7

A OF SOCKET
DEPARTMENT
R
SIZE DRAWING NUMBER
REV
26.24 [1.03 ] 6 5
OF ILM ATTACH HOLE IN MOTHERBOARD 103.91 [4.09 ] 4
PTMI 3
D
SCALE: 2:1
E36581
01
Electrical Methodology
F
F.1
Measuring Electrical Resistance of the Jumper
Figure F-1 and Figure F-2 show the proposed methodology for measuring the final electrical resistance. The methodology requires measuring LGA TV flush-mounted directly to the motherboard fixtures, so that the Land shoulder is flush with the motherboard to get the averaged jumper resistance, Rjumper. The Rjumper should come from a good statistical average of 30 package fixtures flush mounted to a motherboard fixture. The same measurements are then made with a package fixture mounted on a suppliers socket, and both are mounted on a motherboard fixture; this provides the RTotal. The resistance requirement, RReq, can be calculated for each chain, as explained later.
Figure F-1.
Methodology for Measuring Total Electrical Resistance

Shorting bar on internal routing layer Package dielectric LGA pad Solder resist Socket contact Socket housing
LGA Package
LGA Socket
+V +I
Shorting bar on test board
LGA Testboard -V -I
Figure F-2.
Methodology for Measuring Electrical Resistance of the Jumper

LGA TV
+V +I -I -V
LGA Testboard
Figure F-3 shows the resistance test fixtures separately and superimposed. The upper figures show the daisy chain pattern of the package and the baseboard. The bottom figure shows the two parts superimposed. There are TBD daisy chain configurations on the resistance test board. Figure F-3 shows these configurations with the number of lands per each chain and netlist. All figures are shown with the view from the top of the package.
F.2
Note:
Determining Maximum Electrical Resistance

This section provides a guideline for the instruments used to take the measurements. The instrument selection should consider the guidelines in EIA 364-23A.
97
These measurements use a 4-wire technique, where the instruments provide two separate circuits. One is a precision current source to deliver the test current. The other is a precision voltmeter circuit to measure the voltage drop between the desired points. These separate circuits can be contained within one instrument, such as a highquality micro-ohmmeter, a stand-alone current source and voltmeter, or the circuits of a data acquisition system. Measurement accuracy in is specified as 0.1% of reading, or 0.1 m, whichever is greater. The vendor is responsible for demonstrating that their instrument(s) can meet this accuracy. Automation of the measurements can be implemented by scanning the chains through the edge or cable test socket using a switch matrix. The matrix can be operated by hand, or through software. Measure RTotal for each daisy chain of package + socket + motherboard unit. Measure Rjumper for each daisy chain of 30 package + socket + motherboard units. Calculate Rjumper for each daisy change (there are 303 data for each daisy chain). For each socket unit, calculate:
R Req =
R Total R jumper N
RReq is the average contact resistance for socket pin.
F.3
Inductance
The inductance measurement is completed in two steps. First, the socket is measured in an assembled configuration. A second measurement is made to subtract the fixture contribution. Figure F-3 shows a cross-section of the retention, LGA Adapter, socket, test board, and backing plate assembly. A circuit board, referred to as the LGA adapter, is used to compress the LGA socket leads during test. During test in the assembled configuration, the probes contact the surface of the LGA adapter. The test board contains a ground plane under the shorting bar. The second figure shows the measurement of the unassembled adapter. The measurement of the adapter alone is used to calibrate out the fixture contribution.
98
Figure F-3.
Inductance Measurement Fixture Cross-Section
Socket
Probe Probe
Retention Socket contact
Retention LGA Adapter LGA Socket
Solder resist Backing Plate Shorting bar on test board
LGA Testboard
Sandwich (Fixture Contribution)

Probe Probe
LGA Adapter
F.3.1
Design Procedure for Inductance Measurements

The measurement equipment required to perform the validation is: HP8753D Vector Network Analyzer* or equivalent. Robust Probe Station (GTL4040)* or equivalent. Probes: GS1250 and GSG1250 Air-Co-Planar* or equivalent. Calibration: Cascade Calibration Substrates* or equivalent. Measurement objects: Sockets, motherboards.
F.3.1.1
Measurement Steps
1. Equipment setup: a. Cables should be connected to the network analyzer and to the probes using the appropriate torque wrench to ensure consistent data collection every time the measurement is performed. Bandwidth = 300 KHz 3 GHz with 801 points. Averaging Factor = 16. Calibration should be performed at the start of any measurement session. Create Calibration Kit if necessary for 1st time. Do not perform port extension after calibration.
2. Set VNA: a. b. a. b. c.
3. Perform Open/Short/Load calibration:
99
4. Check to ensure calibration successfully performed. 5. Measure the inductance of the socket mounted to the motherboard fixture by probing the locations on the LGA Adapter and socket assembly. a. b. Call this Lsocket assembly Export data into MDS/ADS or (capture data at frequency specified in item 6 of Table 4-1). Call this Lsandwich Measure 30 units. The test board for 30 units must be chosen from different lots. Use five different lots, six units from each lot. Export data into MDS/ADS or (capture data at frequency specified in item 6 of Table 4-1). Calculate Lsandwich For each socket unit, calculate: Lsocket = Lsocket assembly - Lsandwich It means Lsandwich will be subtracted from each Lsocket assembly and the result will be compared with spec value for each individual socket unit.
6. Measure the inductance of the motherboard fixture by probing on the pads. a. b. c. d. e. f.
F.3.2
Correlation of Measurement and Model Data Inductance

To correlate the measurement and model data for loop inductance, one unit of measured socket assembly (socket and shorted test fixture) and one unit of measured sandwich (shorted test fixture) will be chosen for cross-sectioning. Both units will be modeled based on data from cross sectioning using Ansoft 3D*. The sandwich inductance will be subtracted from socket assembly inductance for both measured and modeled data. This procedure results in loop inductance for socket contact. This final result can be compared with the loop inductance from the supplier model for the socket. If there is any difference between them, it will be called the de-embedded correction factor. Adding the test board to the socket and then eliminating the contribution of the fixture creates this correction factor because inductance is not linear.
Figure F-4.
Measurement Fixture Cross-Section
Probe Socket contact Plastic Housing
100
F.4
Dielectric Withstand Voltage

No disruptive discharge or leakage greater than 0.5 mA is allowed when subjected to 360 V RMS. The sockets shall be tested according to EIA-364, Test Procedure 20A, Method 1. The sockets shall be tested in fully mated condition. Barometric pressure shall be equivalent to Sea Level. The sample size is 25 contact-to-contact pairs on each of four sockets. The contacts shall be randomly chosen.
F.5
Insulation Resistance
The Insulation Resistance shall be greater than 800 M when subjected to 500 V DC. The sockets shall be tested according to EIA-364, Test Procedure 21. The sockets shall be tested in fully mated condition. The sample size is 25 contact-to-contact pairs on each of 4 sockets. The contacts shall be randomly chosen.
F.6
Contact Current Rating

Measure and record the temperature rise when the socket is subjected to rate current of 0.8 A. The sockets shall be tested according to EIA-364, Test Procedure 70 A, Test Method 1.
101
102

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Intel Xeon Processor7500 Series Intel Xeon Processor E78800/4800/2800 Product Families

Thermal and Mechanical Design Guide

Reference Number: 323342-002

Thermal Mechanical Design Guide

Thermal Mechanical Design Guide

5.2 5.3 5.4 5.5 A B C D E F

Thermal Mechanical Design Guide

Thermal Mechanical Design Guide

Thermal Mechanical Design Guide

Thermal Mechanical Design Guide

Thermal Mechanical Design Guide

Thermal Mechanical Design Guide

DTS FSC IHS

ILM LGA1567 socket PECI

Thermal Mechanical Design Guide

Terms and Descriptions (Sheet 2 of 2)

TCONTROL TDP Thermal Monitor Thermal Profile TIM

Thermal Mechanical Design Guide

Thermal Mechanical Design Guide

LGA1567 Socket with Pick and Place Cover Removed

Thermal Mechanical Design Guide

Corner Pad Definition on board corresponding to nTCF Solder Balls

Also see Section 2.1.3.

LGA1567 Socket NCTF Solder Joints

Thermal Mechanical Design Guide

Socket Loading and Deflection Specifications

Socket Loading and Deflection Specifications (Sheet 1 of 2)

Thermal Mechanical Design Guide

Socket Loading and Deflection Specifications (Sheet 2 of 2)

Clarification of Static Compressive Load Values

Thermal Mechanical Design Guide

Critical-to-Function Interface Dimensions

Pick-and-Place and Handling Cover

Pick-and-Place Cover (PnP Cap)

Thermal Mechanical Design Guide

Socket Housing Material

(Font type is Helvetica Bold minimum 6 point (or 2.125 mm)).

Manufacturers insignia (font size at suppliers discretion).

Solder Ball Characteristics

Thermal Mechanical Design Guide

Maximum Socket Temperature

Recommended vias for Socket temperature measurement (shown in red)

LGA1567 Electrical Requirements (Sheet 1 of 2)

Thermal Mechanical Design Guide

LGA1567 Electrical Requirements (Sheet 2 of 2)

Contact Bulk Resistance, at 26 C

Contact Bulk Resistance Increase Total Loop Inductance, Loop

< 0.95 nH < -13 dB < |-0.6 dB| < -25 dB

1 GHz 400 MHz

Thermal Mechanical Design Guide

Independent Loading Mechanism (ILM)

Independent Loading Mechanism (ILM)

Allowable Board Thickness

Description of ILM Versions

ILM Comparison Summary (Sheet 1 of 2)

Therrmal Mechanical Design Guide

Independent Loading Mechanism (ILM)

ILM Comparison Summary (Sheet 2 of 2)

110 lbf / 578 N 210 lbf / 934 N 0 (baseline) 2 pockets (~14x12x2.5mm)

Thermal resistance impact (C/W) Heatsink required features

Therrmal Mechanical Design Guide

Independent Loading Mechanism (ILM)

ILM Back Plate Assembly