Philips Semiconductors

Product specification

Silicon Diffused Power Transistor

BU2508AX

GENERAL DESCRIPTION
Enhanced performance, new generation, high-voltage, high-speed switching npn transistor in a plastic full-pack envelope intended for use in horizontal deflection circuits of colour television receivers. Features exceptional tolerance to base drive and collector current load variations resulting in a very low worst case dissipation.

QUICK REFERENCE DATA

SYMBOL VCESM VCEO IC ICM Ptot VCEsat ICsat tf PARAMETER Collector-emitter voltage peak value Collector-emitter voltage (open base) Collector current (DC) Collector current peak value Total power dissipation Collector-emitter saturation voltage Collector saturation current Fall time CONDITIONS VBE = 0 V TYP. 4.5 0.4 MAX. 1500 700 8 15 45 1.0 0.6 UNIT V V A A W V A s

Ths 25 C IC = 4.5 A; IB = 1.12 A ICsat = 4.5 A; IB(end) = 1.1 A

PINNING - SOT399
PIN 1 2 3 base collector emitter DESCRIPTION

PIN CONFIGURATION
case

SYMBOL

c b
1 2 3

case isolated

LIMITING VALUES
Limiting values in accordance with the Absolute Maximum Rating System (IEC 134) SYMBOL VCESM VCEO IC ICM IB IBM -IB(AV) -IBM Ptot Tstg Tj PARAMETER Collector-emitter voltage peak value Collector-emitter voltage (open base) Collector current (DC) Collector current peak value Base current (DC) Base current peak value Reverse base current Reverse base current peak value 1 Total power dissipation Storage temperature Junction temperature CONDITIONS VBE = 0 V MIN. -55 MAX. 1500 700 8 15 4 6 100 5 45 150 150 UNIT V V A A A A mA A W C C

average over any 20 ms period Ths 25 C

THERMAL RESISTANCES
SYMBOL Rth j-hs Rth j-hs Rth j-a PARAMETER Junction to heatsink Junction to heatsink Junction to ambient CONDITIONS without heatsink compound with heatsink compound in free air TYP. 35 MAX. 3.7 2.8 UNIT K/W K/W K/W

1 Turn-off current.

November 1997

Rev 2.300

Philips Semiconductors

Product specification

Silicon Diffused Power Transistor

BU2508AX

ISOLATION LIMITING VALUE & CHARACTERISTIC

Ths = 25 C unless otherwise specified SYMBOL Visol PARAMETER Repetitive peak voltage from all three terminals to external heatsink CONDITIONS R.H. 65 % ; clean and dustfree MIN. TYP. MAX. 2500 UNIT V

Cisol

Capacitance from T2 to external f = 1 MHz heatsink

22

pF

STATIC CHARACTERISTICS
Ths = 25 C unless otherwise specified SYMBOL ICES ICES IEBO BVEBO VCEOsust VCEsat VBEsat hFE hFE PARAMETER Collector cut-off current
2

CONDITIONS VBE = 0 V; VCE = VCESMmax VBE = 0 V; VCE = VCESMmax; Tj = 125 C VEB = 7.5 V; IC = 0 A IB = 1 mA IB = 0 A; IC = 100 mA; L = 25 mH IC = 4.5 A; IB = 1.12 A IC = 4.5 A; IB = 1.7 A IC = 100 mA;VCE = 5 V IC = 4.5 A;VCE = 1 V

MIN. 7.5 700 4

TYP. 13.5 13 5.5

MAX. 1.0 2.0 1.0 1.0 1.1 7.0

UNIT mA mA mA V V V V

Emitter cut-off current Emitter-base breakdown voltage Collector-emitter sustaining voltage Collector-emitter saturation voltage Base-emitter saturation voltage DC current gain

DYNAMIC CHARACTERISTICS
Ths = 25 C unless otherwise specified SYMBOL Cc PARAMETER Collector capacitance Switching times (16 kHz line deflection circuit) Turn-off storage time Turn-off fall time Switching times (38 kHz line deflection circuit) ts tf Turn-off storage time Turn-off fall time CONDITIONS IE = 0 A; VCB = 10 V; f = 1 MHz ICsat = 4.5 A; IB(end) = 1.1 A; LB = 6 H; -VBB = 4 V; (-dIB/dt = 0.6 A/s) ICsat = 4.0 A; IB(end) = 0.9 A; LB = 6 H; -VBB = 4 V; (-dIB/dt = 0.6 A/s) 4.7 0.25 5.7 0.35 s s TYP. 80 MAX. UNIT pF s s

ts tf

5.0 0.4

6.0 0.6

2 Measured with half sine-wave voltage (curve tracer).

November 1997

Rev 2.300

Philips Semiconductors

Product specification

Silicon Diffused Power Transistor

BU2508AX

ICsat

+ 50v 100-200R
IC

90 %

Horizontal
tf

10 %

Oscilloscope
IB

ts IBend

Vertical 100R 6V 30-60 Hz 1R

- IBM

Fig.1. Test circuit for VCEOsust.

Fig.4. Switching times definitions.

IC / mA

+ 150 v nominal adjust for ICsat

1mH
250 200

100

IBend

LB

D.U.T. 12nF

BY228

0 VCE / V

-VBB
min VCEOsust

Fig.2. Oscilloscope display for VCEOsust.

Fig.5. Switching times test circuit.

TRANSISTOR IC DIODE

ICsat

100

h FE

5V

IB

IBend

10
t 20us 26us 64us VCE
Tj = 25 C Tj = 125 C

1V

1 0.01
t

0.1 IC / A

10

Fig.3. Switching times waveforms.

Fig.6. Typical DC current gain. hFE = f (IC) parameter VCE

November 1997

Rev 2.300

Philips Semiconductors

Product specification

Silicon Diffused Power Transistor

BU2508AX

1.2 1.1 1 0.9 0.8 0.7 0.6 0.5 0.4

VBESAT / V
Tj = 25 C Tj = 125 C

10

VCESAT / V
Tj = 25 C Tj = 125 C

6A 4.5A

IC/IB= 3 4 5

1 3A IC=2A 0.1

0.1

1 IC / A

10

0.1

1 IB / A

10

Fig.7. Typical base-emitter saturation voltage. VBEsat = f (IC); parameter IC/IB

VCESAT / V IC/IB= 5 4 3

Fig.10. Typical collector-emitter saturation voltage. VCEsat = f (IB); parameter IC

Eoff / uJ

1 0.9 0.8 0.7 0.6 0.5

1000

IC = 4.5A 3.5A

100
Tj = 25 C Tj = 125 C

0.4 0.3 0.2 0.1 0

10
0.1 1 IC / A 10

0.1

1 IB / A

10

Fig.8. Typical collector-emitter saturation voltage. VCEsat = f (IC); parameter IC/IB

VBESAT / V
Tj = 25 C

Fig.11. Typical turn-off losses. Tj = 85C Eoff = f (IB); parameter IC; f = 16 kHz
ts, tf / us ts

1.2 1.1 1 0.9 0.8 0.7 0.6

Tj = 125 C

IC= 6A 4.5A 3A 2A

12 11 10 9 8 7 6 5 4 3 2 1 0 4

IC = 4.5A 3.5A tf 0.1 1 IB / A 10

2 IB / A

Fig.9. Typical base-emitter saturation voltage. VBEsat = f (IB); parameter IC

Fig.12. Typical collector storage and fall time. ts = f (IB); tf = f (IB); parameter IC; Tj = 85C; f = 16 kHz

November 1997

Rev 2.300

Philips Semiconductors

Product specification

Silicon Diffused Power Transistor

BU2508AX

100

IC / A

100

IC / A

= 0.01

= 0.01
tp =

ICM max 10 IC max

II

ICM max 10 IC max

II

tp =

10 us

10 us

Ptot max

Ptot max

100 us

100 us

1 ms

1 ms

0.1
10 ms DC

0.1
10 ms DC

0.01 1 10 100 VCE / V 1000

0.01 1 10 100 VCE / V 1000

Fig.13. Forward bias safe operating area. Ths = 25C I Region of permissible DC operation. II Extension for repetitive pulse operation.
NB: Mounted with heatsink compound and 30 5 newton force on the centre of the envelope.
Normalised Power Derating
with heatsink compound

Fig.15. Forward bias safe operating area. Ths = 25C I Region of permissible DC operation. II Extension for repetitive pulse operation.
NB: Mounted without heatsink compound and 30 5 newton force on the centre of the envelope.

120 110 100 90 80 70 60 50 40 30 20 10 0

PD%

20

40

60

80 Ths / C

100

120

140

Fig.14. Normalised power dissipation. PD% = 100PD/PD 25C = f (Ths)

November 1997

Rev 2.300

Philips Semiconductors

Product specification

Silicon Diffused Power Transistor

BU2508AX

MECHANICAL DATA
Dimensions in mm Net Mass: 5.88 g

16.0 max 0.7 4.5 10.0 27 max 25.1 25.7 22.5 max 5.1 2.2 max 18.1 min 4.5 1.1 0.4 M 2 3.3

5.8 max 3.0

25

0.95 max 5.45 5.45 3.3

Fig.16. SOT399; The seating plane is electrically isolated from all terminals.
Notes 1. Refer to mounting instructions for F-pack envelopes. 2. Epoxy meets UL94 V0 at 1/8".

November 1997

Rev 2.300

Philips Semiconductors

Product specification

Silicon Diffused Power Transistor

BU2508AX

DEFINITIONS
Data sheet status Objective specification Product specification Limiting values Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of this specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. Philips Electronics N.V. 1998 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, it is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent or other industrial or intellectual property rights. This data sheet contains target or goal specifications for product development. This data sheet contains final product specifications. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices or systems where malfunction of these products can be reasonably expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.

November 1997

Rev 2.300

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