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Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Telecom Tip and Ring, X7R Dielectric, 250VDC (Commercial Grade)


Overview
KEMETs 250V DC Tip and Ring MLCCs in X7R dielectric are designed and rated for telecommunication ringer circuits where the capacitor is used to block -48V to -52V DC of line voltage and pass a 16-25 Hz AC signal pulse of 70 VRMs to 90 VRMs. Serving as an excellent replacement for high voltage leaded film devices, these smaller surface mount technology footprints save valuable board space which is critical when creating new designs. KEMET Tip and Ring capacitors feature a 125C maximum operating temperature and are considered temperature stable. The Electronics Components, Assemblies & Materials Association (EIA) characterizes X7R dielectric as a Class II material. Components of this classification are fixed, ceramic dielectric capacitors suited for bypass and decoupling applications or for frequency discriminating circuits where Q and stability of capacitance characteristics are not critical. X7R exhibits a predictable change in capacitance with respect to time and voltage and boasts a minimal change in capacitance with reference to ambient temperature. Capacitance change is limited to 15% from -55C to +125C. These devices are able to withstand todays higher lead-free reflow processing temperatures while maintaining superior high frequency filtering characteristics and low ESR.

Benefits

-55C to +125C operating temperature range Pb-Free and RoHS compliant (excluding SnPb end metallization option) EIA 0805, 1206, 1210, 1812, 1825, 2220 & 2225 case sizes DC voltage rating of 16V, 25V, 50V, 100V & 200V Capacitance offerings ranging from 180pF to 1.2F Available capacitance tolerances of 5%, 10% and 20% Non-polar device, minimizing installation concerns 100% pure matte tin-plated end metallization that allows for excellent solderability SnPb end metallization option available upon request (5% min) Flexible termination option available upon request

Applications

Typical applications include telecommunication ringing circuits, switch mode power supply snubber circuits, high voltage DC blocking and high voltage coupling. Markets include telephone lines, analog and digital modems, facsimile machines, wireless base stations, cable and digital video recording set-top boxes, satellite dishes, high voltage power supply, DC/DC converters, and Ethernet, POS and ATM hardware.

Ordering Information
C
Ceramic

1825
Case Size (L" x W") 0805 1206 1210 1812 1825 2220 2225

C
Specification/ Series

105
Capacitance Code (pF)

K
Capacitance Tolerance J = 5% K = 10% M = 20%

A
Voltage A = 250V

R
Dielectric R = X7R

TU

Failure Rate/ Packaging/Grade End Metallization 1 Design (C-Spec)2 A = N/A C = 100% Matte Sn L = SnPb (5% min) Blank = Bulk TU = 7" Reel Unmarked TM = 7" Reel Marked

C = Standard 2 Sig. Digits + X = Flexible Number of Zeros Termination

1 2

Additional termination options may be available. Contact KEMET for details. Additional reeling or packaging options may be available. Contact KEMET for details.

One WORLD

One Brand

One Strategy

One Focus

One Team

One KEMET
C1011-1 10/12/2010 1

KEMET Electronics Corporation P.O. Box 5928 Greenville, SC 29606 (864) 963-6300 www.kemet.com

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Telecom "Tip and Ring, X7R Dielectric, 250VDC, (Commercial Grade)

Dimensions Millimeters (Inches) Standard Termination


T

L B

100% Tin or SnPb Plate

Nickel Plate Electrodes Conductive Metalization

EIA Size Code


0805 1206 1210 1812 1825 2220 2225

Metric Size Code


2012 3216 3225 4532 4564 5650 5664

L Length
2.00 (.079) 0.20 (.008) 3.20 (.126) 0.20 (.008) 3.20 (.126) 0.20 (.008) 4.50 (.177) 0.30 (.012) 4.50 (.177) 0.30 (.012) 5.70 (.224) 0.40 (.016) 5.60 (.220) 0.40 (.016)

W Width
1.25 (.049) 0.20 (.008) 1.60 (.063) 0.20 (.008) 2.50 (.098) 0.20 (.008) 3.20 (.126) 0.30 (.012) 6.40 (.252) 0.40 (.016) 5.00 (.197) 0.40 (.016) 6.40 (.248) 0.40 (.016)

B Bandwidth
0.50 (0.02) 0.25 (.010) 0.50 (0.02) 0.25 (.010) 0.50 (0.02) 0.25 (.010) 0.60 (.024) 0.35 (.014) 0.60 (.024) 0.35 (.014) 0.60 (.024) 0.35 (.014) 0.60 (.024) 0.35 (.014)
W

T Thickness

Mounting Technique
Solder Wave or Solder Reflow

See Table 2 for Thickness

Solder Reflow Only

L B

Dimensions Millimeters (Inches) Flexible Termination option


EIA Size Code
0805 1206 1210 1812 1825 2220 2225

T S

Metric Size Code


2012 3216 3225 4532 4564 5650 5664

L Length
2.1 (.083) 0.30 (.012) 3.3 (.130) 0.40 (.016) 3.3 (.130) 0.40 (.016) 4.5 (.178) 0.40 (.016) 4.6 (.181) 0.40 (.016) 5.9 (.232) 0.75 (.030) 5.9 (.232) 0.75 (.030)

W Width
1.25 (.049) 0.20 (.008) 1.60 (.063) 0.20 (.008) 2.50 (.098) 0.20 (.008) 3.20 (.126) 0.30 (.012) 6.40 (.252) 0.40 (.016) 5.00 (.197) 0.40 (.016) 6.40 (.248) 0.40 (.016)

B Bandwidth
0.50 (0.02) 0.25 (.010) 0.60 (.024) 0.25 (.010) 0.60 (.024) 0.25 (.010) 0.70 (.028) 0.35 (.014) 0.70 (.028) 0.35 (.014) 0.70 (.028) 0.35 (.014) 0.70 (.028) 0.35 (.014)

T Thickness

Mounting Technique
Solder Wave or Solder Reflow

See Table 2 for Thickness

Solder Reflow Only

Qualification/Certification

Commercial grade products are subject to internal qualification. Details regarding test methods and conditions are referenced in Table 4, Performance and Reliability.

Environmental Compliance

Devices with C end metallization option are RoHS PRC ( Peoples Republic of China) compliant. Devices with L end metallization option do no meet RoHS criteria.

KEMET Electronics Corporation P.O. Box 5928 Greenville, SC 29606 (864) 963-6300 www.kemet.com

C1011-1 10/12/2010

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Telecom "Tip and Ring, X7R Dielectric, 250VDC, (Commercial Grade)

Electrical Parameters/Characteristics
Item
Operating Temperature Range: Capacitance Change with Reference to +25C and 0 Vdc Applied (TCC): Aging Rate (Max % Cap Loss/Decade Hour): Dielectric Withstanding Voltage: Dissipation Factor (DF) Maximum Limits @ 25C: Insulation Resistance (IR) Limit @ 25C: -55C to +125C 15% 3.5% 250% of rated voltage (5 1 seconds and charge/discharge not exceeding 50mA) 5%(10V), 3.5%(16V & 25V) and 2.5%(50V to 200V) See Insulation Resistance Limit Table

Parameters/Characteristics

To obtain IR limit, divide M-F value by the capacitance and compare to G limit. Select the lower of the two limits. Capacitance and Dissipation Factor (DF) measured under the following conditions: 1kHz 50Hz and 1.0 0.2 Vrms if capacitance 10F 120Hz 10Hz and 0.5 0.1 Vrms if capacitance >10F

Insulation Resistance Limit Table


EIA Case Size
0201 0402 0603 0805 1206 1210 1808 1812 1825 2220 2225

1000 megohm microfarads or 100G


N/A < .012F < .047F < .047F < 0.22F < 0.39F ALL < 2.2F ALL < 10F ALL

500 megohm microfarads or 10G


ALL .012F .047F .047F 0.22F 0.39F N/A 2.2F N/A 10F N/A

KEMET Electronics Corporation P.O. Box 5928 Greenville, SC 29606 (864) 963-6300 www.kemet.com

C1011-1 10/12/2010

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Telecom "Tip and Ring, X7R Dielectric, 250VDC, (Commercial Grade)

Table 1 (0805 - 2225 Case Sizes)


Cap Cap Tol.
151 J 181 J 221 J 271 J 331 J 391 J 471 J 561 J 681 J 821 J 102 J 122 J 152 J 182 J 222 J 272 J 332 J 392 J 472 J 562 J 682 J 822 J 103 J 123 J 153 J 183 J 223 J 273 J 333 J 393 J 473 J 563 J 683 J 823 J 104 J 124 J 154 J 184 J 224 J 274 J 334 J 394 J 474 J 564 J 684 J 824 J 105 J 125 J 155 J 1825 185 J 225 J Case Size 275 J (L" x W") 335 J 395 0805 J 475 1206 J

Series
Voltage Code Voltage DC Cap Tolerance K M K M K M K M K M K M K M K M K M K M K M K M K M K M K M K M K M K M K M K M K M K M K M K M K M K M K M K M K M K M K M K M K M K M K M K M K M K M K M K M K M K M K M K M K M K M K M K M K M C K M K M Specifi cation/ K M SeriesM K M C =K Standard X =K FlexibleM

C0805C
A 250

C1206C
A 250

C1210C
A 250

C1812C
A 250

C1825C
A 250

C2220C
A 250

C2225C
A 250

Product Availability and Chip Thickness Codes - See Table 2 for Chip Thickness Dimensions
DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC

150 pF 180 pF 220 pF 270 pF 330 pF 390 pF 470 pF 560 pF 680 pF 820 pF 1,000 pF 1,200 pF 1,500 pF 1,800 pF 2,200 pF 2,700 pF 3,300 pF 3,900 pF 4,700 pF 5,600 pF 6,800 pF 8,200 pF 10,000 pF 12,000 pF 15,000 pF 18,000 pF 22,000 pF 27,000 pF 33,000 pF 39,000 pF 47,000 pF 56,000 pF 68,000 pF 82,000 pF 0.10 uF 0.12 uF 0.15 uF 0.18 uF 0.22 uF 0.27 uF 0.33 uF 0.39 uF 0.47 uF 0.56 uF 0.68 uF 0.82 uF 1.0 uF 1.2 uF 1.5 uF 1.8 uF C 2.2 uF 2.7 uF Ceramic 3.3 uF 3.9 uF 4.7 uF

EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB ED ED ED ED EM

FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FC FC FC FF FG

GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GE GG GG GG GG GG GJ

HB HB HB HB HB HB HB HB HB HB HB HB HB HB HB HD HD HD HD HF HF

JC JC JC JC JC JC JC JC JC JC JD JD JF JF

KC KC KC KC KC KC KC KC KC KC KC KC KD KD KD KE KE KE

105
Capacitance Code (pF) 2 Sig. Digits + Number of Zeros
250 A

K
Capacitance Tolerance J = 5% K = 10% 250 M = 20%
A

A
Voltage A = 250V
250 A

R
Dielectric R = X7R
250 A

TU

Failure Rate/ Packaging/Grade End Metallization 1 Design (C-Spec)2 A = N/A C = 100% Matte Sn L = SnPb (5% min)
250 A

Cap

1210 Cap1812 Tol.1825 2220 2225

Voltage DC Termination Voltage Code

Series

C0805C

C1206C

C1210C

C1812C

C1825C

Blank = Bulk TU = 7" Reel 250 Unmarked250 TM = 7" Reel A A Marked C2220C C2225C

KEMET Electronics Corporation P.O. Box 5928 Greenville, SC 29606 (864) 963-6300 www.kemet.com

C1011-1 10/12/2010

Roll Over for Order Info.

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Telecom "Tip and Ring, X7R Dielectric, 250VDC, (Commercial Grade)

Table 2 Chip Thickness / Packaging Quantities


Thickness Code
AA AB BB CB CC CD DC DD DL DE DF DG DH EB EK EC EN ED EE EF EM EG EH EJ FB FC FD FE FF FG FL FO FH FP FM FJ FN FT FK FR FS PA MA NA NA LD LA LB LC GB GC GD GE GH GF GG GK GJ GN GL GM GO HB HC HD HE HF HG JB JC JD JE JF JP JG JH JO KB KC KD KE KF

Chip Size
01005 0201 0402 0603 0603 0603 0805 0805 0805 0805 0805 0805 0805 1206 1206 1206 1206 1206 1206 1206 1206 1206 1206 1206 1210 1210 1210 1210 1210 1210 1210 1210 1210 1210 1210 1210 1210 1210 1210 1210 1210 1220 1632 1706 1706 1808 1808 1808 1808 1812 1812 1812 1812 1812 1812 1812 1812 1812 1812 1812 1812 1812 1825 1825 1825 1825 1825 1825 2220 2220 2220 2220 2220 2220 2220 2220 2220 2225 2225 2225 2225 2225

Thickness Range (mm)


0.20 0.02 0.30 0.03 0.50 0.05 0.80 0.07 0.80 0.10 0.80 0.15 0.78 0.10 0.90 0.10 0.95 0.10 1.00 0.10 1.10 0.10 1.25 0.15 1.25 0.20 0.78 0.10 0.80 0.10 0.90 0.10 0.95 0.10 1.00 0.10 1.10 0.10 1.20 0.15 1.25 0.15 1.60 0.15 1.60 0.20 1.70 0.20 0.78 0.10 0.90 0.10 0.95 0.10 1.00 0.10 1.10 0.10 1.25 0.15 1.40 0.15 1.50 0.20 1.55 0.15 1.60 0.20 1.70 0.20 1.85 0.20 1.85 0.20 1.90 0.20 2.10 0.20 2.25 0.20 2.50 0.20 0.80 0.10 0.80 0.10 0.90 0.10 0.90 0.10 0.90 0.10 1.40 0.15 1.60 0.15 2.00 0.15 1.00 0.10 1.10 0.10 1.25 0.15 1.30 0.10 1.40 0.15 1.50 0.10 1.55 0.10 1.60 0.20 1.70 0.15 1.70 0.20 1.90 0.20 2.00 0.20 2.50 0.20 1.10 0.15 1.15 0.15 1.30 0.15 1.40 0.15 1.50 0.15 1.60 0.20 1.00 0.15 1.10 0.15 1.30 0.15 1.40 0.15 1.50 0.15 1.60 0.20 1.70 0.15 1.80 0.15 2.40 0.15 1.00 0.15 1.10 0.15 1.30 0.15 1.40 0.15 1.60 0.20

Qty per Reel 7" Plastic

Qty per Reel 13" Plastic

Qty per Reel 7" Paper


15000 15000 10000 4000 4000 4000 4000 4000

Qty per Reel 13" Paper


50000 10000 10000 10000 10000 10000

Qty per Bulk Cassette


50000 15000

4000 2500 2500 2500 2500 4000 2000 4000 4000 2500 2500 2500 2500 2000 2000 2000 4000 4000 4000 2500 2500 2500 2000 2000 2000 2000 2000 2000 2000 1500 2000 2000 1000 4000 4000 4000 4000 2500 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 500 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 500 1000 1000 1000 1000 1000

10000 10000 10000 10000 10000 10000 8000 10000 10000 10000 10000 10000 10000 8000 8000 8000 10000 10000 10000 10000 10000 10000 8000 8000 8000 8000 8000 8000 8000 4000 8000 8000 4000 10000 10000 10000 10000 10000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 2000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 2000 4000 4000 4000 4000 4000

4000

10000

Package Quantity Based on Finished Chip Thickness Specifications

KEMET Electronics Corporation P.O. Box 5928 Greenville, SC 29606 (864) 963-6300 www.kemet.com

C1011-1 10/12/2010

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Telecom "Tip and Ring, X7R Dielectric, 250VDC, (Commercial Grade)

Soldering Process

Recommended Soldering Technique: Solder wave or solder reflow for EIA case sizes 0603, 0805 and 1206 All other EIA case sizes are limited to solder reflow only Recommended Soldering Profile: KEMET recommends following the guidelines outlined in IPC/JEDEC J-STD-020

Table 3 Chip Capacitor Land Pattern Design Recommendations per IPC-7351


EIA Size Code
0603 0805 1206 1210 1808 1812 1825 2220 2225

Metric Size Code


1608 2012 3216 3225 4520 4532 4564 5650 5664

Density Level A: Maximum (Most) Land Protrusion (mm)


C 0.85 1.05 1.60 1.60 2.25 2.10 2.15 2.85 2.85 Y 1.25 1.45 1.65 1.65 1.85 1.80 1.80 2.10 2.10 X 1.10 1.55 1.90 2.80 2.30 3.60 6.90 5.50 6.90 V1 4.00 4.60 5.90 5.90 7.40 7.00 7.10 8.80 8.80 V2 2.10 2.60 2.90 3.80 3.30 4.60 7.90 6.50 7.90 C 0.75 0.95 1.50 1.50 2.15 2.00 2.05 2.75 2.75

Density Level B: Median (Nominal) Land Protrusion (mm)


Y 1.05 1.25 1.45 1.45 1.65 1.60 1.60 1.90 1.90 X 1.00 1.45 1.80 2.70 2.20 3.50 6.80 5.40 6.80 V1 3.10 3.70 5.00 5.00 6.50 6.10 6.20 7.90 7.90 V2 1.50 2.00 2.30 3.20 2.70 4.00 7.30 5.90 7.30 C 0.65 0.85 1.40 1.40 2.05 1.90 1.95 2.65 2.65

Density Level C: Minimum (Least) Land Protrusion (mm)


Y 0.85 1.05 1.25 1.25 1.45 1.40 1.40 1.70 1.70 X 0.90 1.35 1.70 2.60 2.10 3.40 6.70 5.30 6.70 V1 2.40 3.00 4.30 4.30 5.80 5.40 5.50 7.20 7.20 V2 1.20 1.70 2.00 2.90 2.40 3.70 7.00 5.60 7.00

Density Level A: For low-density Product applications. Recommended for wave solder applications and provides a wider process window for reflow solder processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes. Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes. Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualification testing based on the conditions outlined in IPC standard 7351 (IPC-7351).

KEMET Electronics Corporation P.O. Box 5928 Greenville, SC 29606 (864) 963-6300 www.kemet.com

C1011-1 10/12/2010

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Telecom "Tip and Ring, X7R Dielectric, 250VDC, (Commercial Grade)

Table 4 Performance & Reliability: Test Methods and Conditions


Stress
Ripple Current Terminal Strength Board Flex

Reference
Heat Generation T : 20C max. JIS-C-6429 JIS-C-6429

Test or Inspection Method


Reflow solder the capacitor onto a PC board and apply voltage with 10kHz~1Mhz sine curve. (Ripple voltage must be < rated voltage) Appendix 1, Note: Force of 1.8kg for 60 seconds. Appendix 2, Note: 2mm (min) for all except 3mm for C0G. Magnification 50X. Conditions:

Solderability

J-STD-002

a) Method B, 4 hrs @ 155C, dry heat @ 235C b) Method B @ 215C category 3 c) Method D, category 3 @ 260C

Temperature Cycling Biased Humidity Moisture Resistance Thermal Shock High Temperature Life Storage Life Mechanical Shock Resistance to Solvents

JESD22 Method JA-104 MIL-STD-202 Method 103 MIL-STD-202 Method 106 MIL-STD-202 Method 107 MIL-STD-202 Method 108 MIL-STD-202 Method 108 MIL-STD-202 Method 213 MIL-STD-202 Method 215

1000 Cycles (-55C to +125C), Measurement at 24 hrs. +/- 2 hrs after test conclusion. Load Humidity: 1000 hours 85C/85%RH and Rated Voltage.Add 100K ohm resistor. Measurement at 24 hrs. +/- 2 hrs after test conclusion. Low Volt Humidity: 1000 hours 85C/85%RH and 1.5V.Add 100K ohm resistor. Measurement at 24 hrs. +/- 2 hrs after test conclusion. t = 24 hours/cycle. Steps 7a & 7b not required. Unpowered. Measurement at 24 hrs. +/- 2 hrs after test conclusion. -55C/+125C. Note: Number of cycles required-300, Maximum transfer time-20 seconds, Dwell time-15 minutes. Air-Air. 1000 hours at 125C (85C for X5R, Z5U and Y5V) with 1.5X rated voltage applied. 150C, 0VDC, for 1000 Hours. Figure 1 of Method 213, Condition F. Add aqueous wash chemical - OKEM Clean or equivalent.

KEMET Electronics Corporation P.O. Box 5928 Greenville, SC 29606 (864) 963-6300 www.kemet.com

C1011-1 10/12/2010

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Telecom "Tip and Ring, X7R Dielectric, 250VDC, (Commercial Grade)

Tape & Reel Packaging Information

KEMET offers Multilayer Ceramic Chip Capacitors packaged in 8mm, 12mm and 16mm tape on 7" and 13" reels in accordance with EIA standard 481. This packaging system is compatible with all tape fed automatic pick and place systems. See Table 2 for details on reeling quantities for commercial chips.

Bar Code Label

Anti-Static Reel

KE

ME

Embossed Plastic* or Punched Paper Carrier.

Chip and KPS Orientation in Pocket (except 1825 Commercial, and 1825 & 2225 Military)

Sprocket Holes
Embossment or Punched Cavity 8mm, 12mm or 16mm Carrier Tape

178mm (7.00") or 330mm (13.00")

Anti-Static Cover Tape (.10mm (.004") Max Thickness)

*EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only.

Table 5 Carrier Tape Configuration (mm)


EIA Case Size
01005 - 0402 0603 - 1210 1805 - 1808 1812 KPS 1210 KPS 1812 & 2220 Array 0508 & 0612

Tape size (W)*


8 8 12 12 12 16 8

Pitch (P1)*
2 4 4 8 8 12 4

*Refer to Figure 1 for W and P1 carrier tape reference locations. *Refer to Table 6 for tolerance specifications. KEMET Electronics Corporation P.O. Box 5928 Greenville, SC 29606 (864) 963-6300 www.kemet.com C1011-1 10/12/2010 8

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Telecom "Tip and Ring, X7R Dielectric, 250VDC, (Commercial Grade)

Figure 1 Embossed (Plastic) Carrier Tape Dimensions


T T2 P2 Do Po
[10 pitches cumulative tolerance on tape 0.2 mm]

E1

Ao F Ko B1 Bo E2 W

S1 T1
Cover Tape B 1 is for tape feeder reference only, including draft concentric about B o. Center Lines of Cavity

P1 D 1
Embossment For cavity size, see Note 1 Table 5

User Direction of Unreeling

Table 6 Embossed (Plastic) Carrier Tape Dimensions


Metric will govern Constant Dimensions Millimeters (Inches)
Tape Size 8mm 12mm 16mm 1.5 +0.10/-0.0 (0.059 +0.004/-0.0) D0 D1 Min. Note 1 1.0 (0.039) 1.5 (0.059) E1 P0 P2 R Ref. Note 2 25.0 (0.984) 30 (1.181) S1 Min. Note 3 0.600 (0.024) T Max. T1 Max.

1.75 0.10 (0.069 0.004)

4.0 0.10 (0.157 0.004)

2.0 0.05 (0.079 0.002)

0.600 (0.024)

0.100 (0.004)

Variable Dimensions Millimeters (Inches)


Tape Size 8mm 12mm 16mm Pitch Single (4mm) Single (4mm) & Double (8mm) Triple (12mm) B1 Max. Note 4 4.35 (0.171) 8.2 (0.323) 12.1 (0.476) E2 Min. 6.25 (0.246) 10.25 (0.404) 14.25 (0.561) F 3.5 0.05 (0.138 0.002) 5.5 0.05 (0.217 0.002) 5.5 0.05 (0.217 0.002) P1 4.0 0.10 (0.157 0.004) 8.0 0.10 (0.315 0.004) 8.0 0.10 (0.315 0.004) T2 Max 2.5 (0.098) 4.6 (0.181) 4.6 (0.181) W Max 8.3 (0.327) 12.3 (0.484) 16.3 (0.642) A0,B0 & K0

Note 5

1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment location and hole location shall be applied independent of each other. 2. The tape with or without components shall pass around R without damage (see Figure 5). 3. If S1<1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Document 481 paragraph 4.3 (b)). 4. B1 dimension is a reference dimension for tape feeder clearance only. 5. The cavity defined by A0, B0 and K0 shall surround the component with sufficient clearance that: (a) the component does not protrude above the top surface of the carrier tape. (b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed. (c) rotation of the component is limited to 20 maximum for 8 and 12mm tapes and 10 maximum for 16mm tapes (see Figure 3). (d) lateral movement of the component is restricted to 0.5 mm maximum for 8mm and 12mm wide tape and to 1.0mm maximum for 16mm tape (see Figure 4). (e) for KPS Series product A0 and B0 are measured on a plane 0.3mm above the bottom of the pocket. (f) see Addendum in EIA Document 481 for standards relating to more precise taping requirements.

KEMET Electronics Corporation P.O. Box 5928 Greenville, SC 29606 (864) 963-6300 www.kemet.com

C1011-1 10/12/2010

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Telecom "Tip and Ring, X7R Dielectric, 250VDC, (Commercial Grade)

Figure 2 Punched (Paper) Carrier Tape Dimensions


T Do P2 Po
[10 pitches cumulative tolerance on tape 0.2 mm]

E1

A0

F E2 W

Bottom Cover Tape

B0

T1

P1
Top Cover Tape

T1

Center Lines of Cavity

Cavity Size, See Note 1, Table 7 Bottom Cover Tape

User Direction of Unreeling

Table 7 Punched (Paper) Carrier Tape Dimensions


Metric will govern Constant Dimensions Millimeters (Inches)
Tape Size 8mm D0 1.5 +0.10-0.0 (0.059 +0.004, -0.0) E1 1.75 0.10 (0.069 0.004) P0 4.0 0.10 (0.157 0.004) P2 2.0 0.05 (0.079 0.002) T1Max 0.10 (.004) Max. G Min 0.75 (.030) R Ref. Note 2 25 (.984)

Variable Dimensions Millimeters (Inches)


Tape Size 8mm 8mm Pitch Half (2mm) Single (4mm) E2 Min 6.25 (0.246) F 3.5 0.05 (0.138 0.002) 2.0 0.05 (0.079 0.002) 4.0 0.10 (0.157 0.004) P1 T Max 1.1 (0.098) W Max 8.3 (0.327) 8.3 (0.327) A0 B 0 Note 5

1. The cavity defined by A0, B0 and T shall surround the component with sufficient clearance that: a) the component does not protrude beyond either surface of the carrier tape. b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed. d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4). e) see Addendum in EIA Document 481 for standards relating to more precise taping requirements. 2. The tape with or without components shall pass around R without damage (see Figure 5).

KEMET Electronics Corporation P.O. Box 5928 Greenville, SC 29606 (864) 963-6300 www.kemet.com

C1011-1 10/12/2010

10

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Telecom "Tip and Ring, X7R Dielectric, 250VDC, (Commercial Grade)

Packaging Information Performance Notes


Tape Width
8mm 12mm & 16mm

1. Cover Tape Break Force: 1.0 Kg Minimum. 2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:

Peel Strength
0.1 Newton to 1.0 Newton (10gf to 100gf) 0.1 Newton to 1.3 Newton (10gf to 130gf)

The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be 165 to 180 from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of 30010 mm/minute. 3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA-556 and EIA-624.

Figure 3 Maximum Component Rotation


T

Maximum Component Rotation Top View


Typical Pocket Centerline

Maximum Component Rotation Side View


s

Bo

Tape Width (mm) 8,12 16-200

Maximum Rotation ( 20 10

T)

Typical Component Centerline

Ao

Tape Width (mm) 8,12 16-56 72-200

Maximum Rotation ( 20 10 5

S)

Figure 4 Maximum Lateral Movement


8mm & 12mm Tape
0.5 mm maximum 0.5 mm maximum

16mm Tape
1.0 mm maximum 1.0 mm maximum

Figure 5 Bending Radius


Embossed Carrier Punched Carrier

Bending Radius

KEMET Electronics Corporation P.O. Box 5928 Greenville, SC 29606 (864) 963-6300 www.kemet.com

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Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Telecom "Tip and Ring, X7R Dielectric, 250VDC, (Commercial Grade)

Figure 6 Reel Dimensions


Full Radius, See Note Access Hole at Slot Location ( 40 mm min.)

W3 (Includes

flange distortion at outer edge)

W2 (Measured at hub) A D
(See Note)

C
(Arbor hole diameter) If present, tape slot in core for tape start: 2.5 mm min. width x 10.0 mm min. depth

N W1 (Measured at hub)

(see Note)

Note: Drive spokes optional; if used, dimensions B and D shall apply.

Table 8 Reel Dimensions


Metric will govern Constant Dimensions Millimeters (Inches)
Tape Size 8mm 12mm 16mm A 178 0.20 (7.008 0.008) or 330 0.20 (13.000 0.008) B Min 1.5 (0.059) C 13.0 +0.5/-0.2 (0.521 +0.02/-0.008) D Min 20.2 (0.795)

Variable Dimensions Millimeters (Inches)


Tape Size 8mm 12mm 16mm 50 (1.969) N Min 8.4 +1.5/-0.0 (0.331 +0.059/-0.0) 12.4 +2.0/-0.0 (0.488 +0.078/-0.0) 16.4 +2.0/-0.0 (0.646 +0.078/-0.0) W1 W2 Max 14.4 (0.567) 18.4 (0.724) 22.4 (0.882) W3 Shall accommodate tape width without interference

KEMET Electronics Corporation P.O. Box 5928 Greenville, SC 29606 (864) 963-6300 www.kemet.com

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Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Telecom "Tip and Ring, X7R Dielectric, 250VDC, (Commercial Grade)

Figure 7 Tape Leader & Trailer Dimensions


Embossed Carrier Punched Carrier 8 mm & 12 mm only Carrier Tape Round Sprocket Holes

END

START
Top Cover Tape

Elongated Sprocket Holes (32 mm tape and wider)

Trailer 160 mm minimum,


Top Cover Tape

Components

100 mm Min. Leader 400 mm Minimum,

Figure 8 Maximum Camber


Elongated sprocket holes (32 mm & wider tapes) Carrier Tape Round Sprocket Holes

1 mm maximum, either direction

Straight Edge
250 mm

KEMET Electronics Corporation P.O. Box 5928 Greenville, SC 29606 (864) 963-6300 www.kemet.com

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Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Telecom "Tip and Ring, X7R Dielectric, 250VDC, (Commercial Grade)

Figure 9 Bulk Cassette Packaging (Ceramic Chips Only)


Meets Dimensional Requirements IEC-286 and EIAJ 7201
Unit mm *Reference
6 8 0.1 8 8 0.1 12.0 0.1
1.5 2.0 3.0
0.1 0 0 0.1 0.2 0

53 3* 31.5 0.2 0 36 0 0.2 19.0*

10*

110 0.7

5 0*

Table 9 Capacitor Dimensions for Bulk Cassette


Cassette Packaging Millimeters EIA Size Metric Size L Length Code Code
0402 0603 1005 1608 1.0 0.05 1.6 0.07

W Width
0.5 0.05 0.8 0.07

B Bandwidth
0.2 to 0.4 0.2 to 0.5

S Separation minimum
0.3 0.7

T Thickness
0.5 .05 0.8 .07

Number of Pcs/Cassette
50,000 15,000

Table 10 Capacitor Marking

Laser marking is available as an extra-cost option for most KEMET ceramic chips. Such marking is two sided, and includes a K to identify KEMET, followed by two characters (per EIA-198) to identify the capacitance value. Note that marking is not available for any Y5V chip. ln addition, the 0603 marking option is limited to the K only. (Marking Optional Not Available for 0402 Size)
Numeral Alpha Character
A B C D E F G H J K L M N P Q R S T U V W X Y Z a b d e f m n t y

Capacitance (pF) For Various Numeral Identifiers


9 0.1 0.11 0.12 0.13 0.15 0.16 0.18 0.2 0.22 0.24 0.27 0.3 0.33 0.36 0.39 0.43 0.47 0.51 0.56 0.62 0.68 0.75 0.82 0.91 0.25 0.35 0.4 0.45 0.5 0.6 0.7 0.8 0.9 0 1 1.1 1.2 1.3 1.5 1.6 1.8 2 2.2 2.4 2.7 3 3.3 3.6 3.9 4.3 4.7 5.1 5.6 6.2 6.8 7.5 8.2 9.1 2.5 3.5 4 4.5 5 6 7 8 9 1 10 11 12 13 15 16 18 20 22 24 27 30 33 36 39 43 47 51 56 62 68 75 82 91 25 35 40 45 50 60 70 80 90 2 100 110 120 130 150 160 180 200 220 240 270 300 330 360 390 430 470 510 560 620 680 750 820 910 250 350 400 450 500 600 700 800 900 3 1000 1100 1200 1300 1500 1600 1800 2000 2200 2400 2700 3000 3300 3600 3900 4300 4700 5100 5600 6200 6800 7500 8200 9100 2500 3500 4000 4500 5000 6000 7000 8000 9000 4 10000 11000 12000 13000 15000 16000 18000 20000 22000 24000 27000 30000 33000 36000 39000 43000 47000 51000 56000 62000 68000 75000 82000 91000 25000 35000 40000 45000 50000 60000 70000 80000 90000 5 100000 110000 120000 130000 150000 160000 180000 200000 220000 240000 270000 300000 330000 360000 390000 430000 470000 510000 560000 620000 680000 750000 820000 910000 250000 350000 400000 450000 500000 600000 700000 800000 900000 6 1000000 1100000 1200000 1300000 1500000 1600000 1800000 2000000 2200000 2400000 2700000 3000000 3300000 3600000 3900000 4300000 4700000 5100000 5600000 6200000 6800000 7500000 8200000 9100000 2500000 3500000 4000000 4500000 5000000 6000000 7000000 8000000 9000000 7 10000000 11000000 12000000 13000000 15000000 16000000 18000000 20000000 22000000 24000000 27000000 30000000 33000000 36000000 39000000 43000000 47000000 51000000 56000000 62000000 68000000 75000000 82000000 91000000 25000000 35000000 40000000 45000000 50000000 60000000 70000000 80000000 90000000

Example shown is 1,000 pF capacitor

KEMET Electronics Corporation P.O. Box 5928 Greenville, SC 29606 (864) 963-6300 www.kemet.com

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Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Telecom "Tip and Ring, X7R Dielectric, 250VDC, (Commercial Grade)

Other KEMET Resources


Tools
Resource Configure A Part: CapEdge SPICE & FIT Software Search Our FAQs: KnowledgeEdge http://capacitoredge.kemet.com http://www.kemet.com/spice http://www.kemet.com/keask Location

Product Information
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Contact
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Disclaimer

All product specifications, statements, information and data (collectively, the Information) are subject to change without notice. All Information given herein is believed to be accurate and reliable, but is presented without guarantee, warranty, or responsibility of any kind, expressed or implied. Statements of suitability for certain applications are based on our knowledge of typical operating conditions for such applications, but are not intended to constitute and we specifically disclaim any warranty concerning suitability for a specific customer application or use. This Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any technical advice inferred from this Information or otherwise provided by us with reference to the use of our products is given gratis, and we assume no obligation or liability for the advice given or results obtained. Although we design and manufacture our products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage. Although all product-related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicated or that other measures may not be required.

KEMET Electronics Corporation P.O. Box 5928 Greenville, SC 29606 (864) 963-6300 www.kemet.com

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Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) Telecom "Tip and Ring, X7R Dielectric, 250VDC, (Commercial Grade)

KEMET Corporation World Headquarters


2835 KEMET Way Simpsonville, SC 29681 Mailing Address: P.O. Box 5928 Greenville, SC 29606 www.kemet.com Tel: 864-963-6300 Fax: 864-963-6521

Europe
Southern Europe
Geneva, Switzerland Tel: 41-22-715-0100 Paris, France Tel: 33-1-4646-1009 Sasso Marconi, Italy Tel: 39-051-939111 Milan, Italy Tel: 39-02-57518176 Rome, Italy Tel: 39-06-23231718 Madrid, Spain Tel: 34-91-804-4303

Asia
Northeast Asia
Hong Kong Tel: 852-2305-1168 Shenzhen, China Tel: 86-755-2518-1306 Beijing, China Tel: 86-10-5829-1711 Shanghai, China Tel: 86-21-6447-0707 Taipei, Taiwan Tel: 886-2-27528585

Corporate Offices
Fort Lauderdale, FL Tel: 954-766-2800

North America
Southeast
Lake Mary, FL Tel: 407-855-8886

Southeast Asia

Central Europe

Singapore Tel: 65-6586-1900 Penang, Malaysia Tel: 60-4-6430200 Bangalore, India Tel: 91-806-53-76817

Northeast

Landsberg, Germany Tel: 49-8191-3350800 Dortmund, Germany Tel: 49-2307-3619672 Kwidzyn, Poland Tel: 48-55-279-7025

Wilmington, MA Tel: 978-658-1663 West Chester, PA Tel: 610-692-4642

Central

Schaumburg, IL Tel: 847-882-3590 Carmel, IN Tel: 317-706-6742

Northern Europe

Bishops Stortford, United Kingdom Tel: 44-1279-757201 Weymouth, United Kingdom Tel: 44-1305-830747 Coatbridge, Scotland Tel: 44-1236-434455 Frjestaden, Sweden Tel: 46-485-563934 Espoo, Finland Tel: 358-9-5406-5000

West

Milpitas, CA Tel: 408-433-9950

Mexico

Zapopan, Jalisco Tel: 52-33-3123-2141

Note: KEMET reserves the right to modify minor details of internal and external construction at any time in the interest of product improvement. KEMET does not assume any responsibility for infringement that might result from the use of KEMET Capacitors in potential circuit designs. KEMET is a registered trademark of KEMET Electronics Corporation. KEMET Electronics Corporation P.O. Box 5928 Greenville, SC 29606 (864) 963-6300 www.kemet.com C1011-1 10/12/2010 16

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