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Flexible Termination System (FT-CAP) X7R Dielectric, 6.3VDC-250VDC (Commercial Grade & Automotive Grade)
Overview
KEMETs Flexible Termination (FT-CAP) multilayer ceramic capacitor in X7R dielectric incorporates a unique, flexible termination system that is integrated with KEMETs standard termination materials. A conductive silver epoxy is utilized between the base metal and nickel barrier layers of KEMETs standard termination system in order to establish pliability while maintaining terminal strength, solderability and electrical performance. This technology was developed in order to address the primary failure mode of MLCCsflex cracks, which are typically the result of excessive shear stresses produced during board flexure or thermal cycling. Flexible termination technology directs board flex stress away from the ceramic body and into the termination area, therefore mitigating flex cracks which can result in low IR or short circuit failures. Although this technology does not eliminate the potential for mechanical damage that may propagate during extreme environmental and handling conditions, it does provide superior flex performance over standard termination systems. The FTCAP complements KEMETs Open Mode, Floating Electrode (FE-CAP), Floating Electrode with Flexible Termination (FF-CAP) and KEMET Power Solutions (KPS) product lines by providing a complete portfolio of flex mitigation solutions. Combined with the stability of an X7R dielectric and designed to accommodate all capacitance requirements, these flex-robust devices are RoHS-compliant, offer up to 5mm of flex-bend capability and exhibit a predictable change in capacitance with respect to time and voltage. Capacitance change with reference to ambient temperature is limited to 15% from -55C to +125C.
Benefits
-55C to +125C operating temperature range Superior flex performance (up to 5mm) High capacitance flex mitigation Pb-Free and RoHS compliant (excluding SnPb end metallization option) EIA 0603, 0805, 1206, 1210, 1808, 1812, 2220 & 2225 case sizes DC voltage ratings of 6.3V, 10V, 16V, 25V, 50V, 100V, 200V & 250V Capacitance offerings ranging from 180pF to 22F Available capacitance tolerances of 5%, 10% and 20%
Non-polar device, minimizing installation concerns 100% pure matte tin-plated end metallization allowing for excellent solderability SnPb end metallization option available upon request (5% min) Commercial and Automotive (AEC-Q200) grades available
Ordering Information
C
Ceramic
1206
106
Capacitance Code (pF) 2 Sig. Digits + Number of Zeros
K
Capacitance Tolerance J = 5% K = 10% M = 20%
4
Voltage 9 = 6.3V 8 = 10V 4 = 16V 3 = 25V 5 = 50V 1 = 100V 2 = 200V A = 250V
R
Dielectric R = X7R
A
Failure Rate/ Design A = N/A
AUTO
Case Size Specification/ (L" x W") Series 0603 0805 1206 1210 1808 1812 1825 2220 2225 X = Flexible Termination
End Metallization Packaging/Grade (C-Spec)2 (Plated)1 C = 100% Matte Sn Blank = Bulk L = SnPb (5% min) TU = 7" Reel Unmarked TM = 7" Reel Marked AUTO = Automotive Grade 7" Reel Unmarked
1 2
Additional termination options may be available. Contact KEMET for details. Additional reeling or packaging options may be available. Contact KEMET for details.
One WORLD
One Brand
One Strategy
One Focus
One Team
One KEMET
C1013-1 10/13/2010 1
KEMET Electronics Corporation P.O. Box 5928 Greenville, SC 29606 (864) 963-6300 www.kemet.com
SMD MLCCs Flexible Termination System (FT-CAP), X7R Dielectric, 6.3VDC-250VDC (Commercial Grade & Automotive Grade)
L B
L Length
1.6 (.063) 0.20 (.008) 2.1 (.083) 0.30 (.012) 3.3 (.130) 0.40 (.016) 3.3 (.130) 0.40 (.016) 4.7 (.185) 0.50 (.020) 4.5 (.178) 0.40 (.016) 4.6 (.181) 0.40 (.016) 5.9 (.232) 0.75 (.030) 5.9 (.232) 0.75 (.030)
W Width
0.80 (.032) 0.15 (.006) 1.25 (.049) 0.20 (.008) 1.60 (.063) 0.20 (.008) 2.50 (.098) 0.20 (.008) 2.00 (.079) 0.20 (.008) 3.20 (.126) 0.30 (.012) 6.40 (.252) 0.40 (.016) 5.00 (.197) 0.40 (.016) 6.40 (.248) 0.40 (.016)
B Bandwidth
0.45 (.018) 0.15 (.006) 0.50 (0.02) 0.25 (.010) 0.60 (.024) 0.25 (.010) 0.60 (.024) 0.25 (.010) 0.70 (.028) 0.35 (.014) 0.70 (.028) 0.35 (.014) 0.70 (.028) 0.35 (.014) 0.70 (.028) 0.35 (.014) 0.70 (.028) 0.35 (.014)
T Thickness
Mounting Technique
Solder Wave or Solder Reflow
Applications
Typical applications include circuits with a direct battery or power source connection, critical and safety relevant circuits without (integrated) current limitation and any application that is subject to high levels of board flexure or temperature cycling. Examples include raw power input side filtering (power plane/bus), high current applications (automobile battery line) and circuits that cannot be fused to open. Markets include consumer, medical, industrial (power supply), automotive, aerospace and telecom.
Qualification/Certification
Commercial grade products are subject to internal qualification. Details regarding test methods and conditions are referenced in Table 4, Performance and Reliability. Automotive grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details regarding test methods and conditions are referenced in document AEC-Q200, Stress Test Qualification for Passive Components. For additional information regarding the Automotive Electronics Council and AEC-Q200, please visit their website @www.aecouncil.com.
Environmental Compliance
Devices with C end metallization option are RoHS PRC ( Peoples Republic of China) compliant. Devices with L end metallization option do no meet RoHS criteria.
KEMET Electronics Corporation P.O. Box 5928 Greenville, SC 29606 (864) 963-6300 www.kemet.com
C1013-1 10/13/2010
SMD MLCCs Flexible Termination System (FT-CAP), X7R Dielectric, 6.3VDC-250VDC (Commercial Grade & Automotive Grade)
Electrical Parameters/Characteristics
Item
Operating Temperature Range: Capacitance Change with Reference to +25C and 0 Vdc Applied (TCC): Aging Rate (Max % Cap Loss/Decade Hour): Dielectric Withstanding Voltage: Dissipation Factor (DF) Maximum Limits @ 25C: Insulation Resistance (IR) Limit @ 25C: -55C to +125C 15% 3.5% 250% of rated voltage (5 1 seconds and charge/discharge not exceeding 50mA) 5%(10V), 3.5%(16V & 25V) and 2.5%(50V to 200V) See Insulation Resistance Limit Table
Parameters/Characteristics
To obtain IR limit, divide M-F value by the capacitance and compare to G limit. Select the lower of the two limits. Capacitance and Dissipation Factor (DF) measured under the following conditions: 1kHz 50Hz and 1.0 0.2 Vrms if capacitance 10F 120Hz 10Hz and 0.5 0.1 Vrms if capacitance >10F
KEMET Electronics Corporation P.O. Box 5928 Greenville, SC 29606 (864) 963-6300 www.kemet.com
C1013-1 10/13/2010
SMD MLCCs Flexible Termination System (FT-CAP), X7R Dielectric, 6.3VDC-250VDC (Commercial Grade & Automotive Grade)
C0603X
4 16 3 25 5 50 1 100 2 200 9 6.3 8 10 4
C0805X
3 25 5 50 1 100 2 200 A 250 9 6.3 8 10 4 16 16
C1206X
3 25 5 50 1 100 2 200 A 250 9 6.3 8 10 4 16
C1210X
3 25 5 50 1 100 2 200 FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FC FC FC FF FG 200 2 A 250 FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FC FC FC FF FG 250 A
Product Availability and Chip Thickness Codes - See Table 2 for Chip Thickness Dimensions
CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CD CD CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CD CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DD DD DD DD DD DD DD DD DD DD DD DD DC DC DC DC DC DC DC DC DC DC DC DC DD DD DD DD DD DD DG DG DG DD DD DD DD DD DD DD DD DD DD DD DD DD DD DD DE DE DE DGKDG DG DG DG DG Capacitance DG DG DG DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DD DD DD DD DC DC DC DC DD DD DG DD DG DG DG DG DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DD DD DD DD DD DD DD DD DD DD DE DE DH DH DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DD DD DD DD DD DD DE DE DE DE DE DG DG DG DG DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DE DE DE DG DG DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC
106
Capacitance Code (pF) 2 Sig. Digits + Number of Zeros
4
Voltage
Tolerance
J = 5% K = 10% M = 20%
Cap
Cap Code
C0603X
9 = 6.3V 8 = 10V 4 = 16V 3 = 25V 5 = 50V 1 = 100V 2 = 200V 4 5 1 A3= 250V C0805X
50 25
FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FC FB FB FB FB FB FD FB FB FB FB FB FD FC FC FC FC FC FD FC FC FC FC FC FD FC FC FC FC FC FD FC FC FC FC FC FD FD FD FD FD FD FD FD FD FD FD FD FD FD FD FD FD FD FD FD FD FD FD FD FF FD FD FD FD FD FG FF FF FF FF FF FL FH FH FH FH FH FM FH FH FH FH FG FH FH AUTO FH FH FG FH FH FH FH FG FJ FJ FJ FJ FG Packaging/Grade (C-Spec)2 FE FE FE FG FH FF FF FF FM FM Blank = Bulk FG FG FG FG FK TU 7 Reel FC = FC FC Unmarked FG FS TM 7 Reel FF =FF FF Marked FH AUTO = Automotive FG FG FG FM Grade Reel Unmarked FH FH 7FH FK 9 8 4 3 5 100 1 6.3 50 25 10 16
200
200 2
C1206X
250 A
100
100
100
6.3
6.3
50
50
25
25
10
10
16
16
C1210X
KEMET Electronics Corporation P.O. Box 5928 Greenville, SC 29606 (864) 963-6300 www.kemet.com
C1013-1 10/13/2010
SMD MLCCs Flexible Termination System (FT-CAP), X7R Dielectric, 6.3VDC-250VDC (Commercial Grade & Automotive Grade)
Cap Code
106 126 156 186 226
Series
Voltage Code Voltage DC Cap Tolerance J J J J J K K K K K M M M M M 9 6.3 8 10
C0603X
4 16 3 25 5 50 1 100 2 200 9 6.3 8 10 4
C0805X
3 25 5 50 1 100 2 200 A 250 9 6.3 8 10 4 16 16
C1206X
3 25 5 50 1 100 2 200 A 250 9 6.3 8 10 4 16
C1210X
3 25 5 50 1 100 2 200 200 2 A 250 A 250 KC KC KC KC KC KC KC KC KC KC KC KC KD KD KD KE KE KE 250 A 250 A
Product Availability and Chip Thickness Codes - See Table 2 for Chip Thickness Dimensions
EH EH EH FH FH FH FS
FS FS 200 200 200 250 250 100 100 100 9 8 4 3 5 1 2 9 8 4 3 5 1 2 A 9 8 4 3 5 1 2 A 9 8 4 3 5 100 1 2 200 200 2 6.3 6.3 6.3 6.3 50 50 50 50 1 100 100 1 25 25 25 25 5 50 50 5 10 10 10 10 16 16 16 16
Cap
Cap Code
Series
C0603X
C0805X
C1206X
C1210X
C1808X
1 100 2 200 A 250 3 25 5
C1812X
1 100 2 200 A 250 5 50 50
C1825X
1 100 2 200 A 250 3 25 5
C2220X
1 100 2 200 A 250 50
C2225X
Product Availability and Chip Thickness Codes - See Table 2 for Chip Thickness Dimensions
LD LD LD LD LD LD LD LD LD LD LD LD LD LD
GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB 106 K GB GB GG GB GG Capacitance GB Capacitance GBTolerance GB GG Code (pF) GB GB GG 2 Sig. Digits + GCJ = 5% GC GG Number of Zeros GCK = GC 10% GG 20%GG GEM =GE GE GE GG 200 250 100 50 25
LD LD LD LD LD LD LD LD
Cap
Cap Code
C1808X
GB GB GB GB GB GB GB GB GB GB GB GB GB GB HB HB HB HB GB GB HB HB HB HB GB GB HB HB HB HB GB GB HB HB HB HB GB GB HB HB HB HB GB GB HB HB HB HB GB GB HB HB HB HB GB GB HB HB HB HB JC JC JC GB GB HB HB HB HB JC JC JC GB GB HB HB HB HB JC JC JC GE GE HB HB HB HB JC JC JC GF GG HB HB HB HB JC JC JC GG GG HB HB HB HB JC JC JC 4 R A C GG GG HB HB HB HB JC JC JC GG GG HB HBFailure HB Rate/ HB End JC Metallization JC JC Voltage Dielectric GG GG HB HB Design HD HD JC (Plated) JC 1 JC GJ GJ HB HB HD HD JC JC JC 9 = 6.3V R HB = X7R HD AHD = N/AHD C JC = 100% JCMatte JCSn 8 = 10V = SnPb min) HB HD HD HD L JC JC(5% JD 4 = 16V HB HF HF HF JC JC JF HB HF HF HF JC JC JF 3 = 25V HB JC JC 5 = 50V 200 250 250 100 5 1 2 A 3 5 100 50 50 25 1
KC KC KC KC KC KC KC KC KC JC JC KC KC KC JC JC KC KC KC JC JC KC KC KC JC JC KC KC KC JC JC KC KC KC JC JC KC KC KC AUTO JC JC KB KC KC JC JC KB KC KC 2 Packaging/Grade (C-Spec) JC JC KB KC KC JC JC KB KC KD Blank = Bulk KB KC KD JD JD TU = 7 ReelKB Unmarked JD JD KC KD TM = 7 Marked JF JFReelKB KC KE JF KB KD KE AUTO JF = Automotive Grade KB Unmarked KE KE 7 Reel 200 2 250 A
100
50
C1825X
C2220X
C2225X
KEMET Electronics Corporation P.O. Box 5928 Greenville, SC 29606 (864) 963-6300 www.kemet.com
C1013-1 10/13/2010
SMD MLCCs Flexible Termination System (FT-CAP), X7R Dielectric, 6.3VDC-250VDC (Commercial Grade & Automotive Grade)
Cap Code
155 185 225 275 335 395 475 565 685 825 106 126 156 186 226
Series
Voltage Code Voltage DC Cap Tolerance J J J J J J J J J J J J J J J K K K K K K K K K K K K K K K M M M M M M M M M M M M M M M 5 50
C1808X
1 100 2 200 A 250 3 25 5
C1812X
1 100 2 200 A 250 5 50 50
C1825X
1 100 2 200 A 250 3 25 5
C2220X
1 100 2 200 A 250 5 50 50
C2225X
1 100 2 200 200 2 A 250 250 A
Product Availability and Chip Thickness Codes - See Table 2 for Chip Thickness Dimensions
HC HD HF JC JD JF JC JD JF KC KD KD
GK
GK
GK
JF JO JO
JO
200
200
200
200
250
250
250
250
100
100
100
100
Cap
Cap Code
Voltage Code
Series
C1808X
C1812X
C1825X
C2220X
C
Ceramic
1206
106
Capacitance Code (pF) 2 Sig. Digits + Number of Zeros
K
Capacitance Tolerance J = 5% K = 10% M = 20%
4
Voltage 9 = 6.3V 8 = 10V 4 = 16V 3 = 25V 5 = 50V 1 = 100V 2 = 200V A = 250V
R
Dielectric R = X7R
A
Failure Rate/ Design A = N/A
AUTO
Case Size Specification/ (L" x W") Series 0603 0805 1206 1210 1808 1812 1825 2220 2225 X = Flexible Termination
End Metallization Packaging/Grade (C-Spec)2 (Plated)1 C = 100% Matte Sn Blank = Bulk L = SnPb (5% min) TU = 7 Reel Unmarked TM = 7 Reel Marked AUTO = Automotive Grade 7 Reel Unmarked
KEMET Electronics Corporation P.O. Box 5928 Greenville, SC 29606 (864) 963-6300 www.kemet.com
C1013-1 10/13/2010
100 1
Voltage DC
50
50
50
50
50
25
25
C2225X
SMD MLCCs Flexible Termination System (FT-CAP), X7R Dielectric, 6.3VDC-250VDC (Commercial Grade & Automotive Grade)
Chip Size
01005 0201 0402 0603 0603 0603 0805 0805 0805 0805 0805 0805 0805 1206 1206 1206 1206 1206 1206 1206 1206 1206 1206 1206 1210 1210 1210 1210 1210 1210 1210 1210 1210 1210 1210 1210 1210 1210 1210 1210 1210 1220 1632 1706 1706 1808 1808 1808 1808 1812 1812 1812 1812 1812 1812 1812 1812 1812 1812 1812 1812 1812 1825 1825 1825 1825 1825 1825 2220 2220 2220 2220 2220 2220 2220 2220 2220 2225 2225 2225 2225 2225
4000 2500 2500 2500 2500 4000 2000 4000 4000 2500 2500 2500 2500 2000 2000 2000 4000 4000 4000 2500 2500 2500 2000 2000 2000 2000 2000 2000 2000 1500 2000 2000 1000 4000 4000 4000 4000 2500 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 500 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 500 1000 1000 1000 1000 1000
10000 10000 10000 10000 10000 10000 8000 10000 10000 10000 10000 10000 10000 8000 8000 8000 10000 10000 10000 10000 10000 10000 8000 8000 8000 8000 8000 8000 8000 4000 8000 8000 4000 10000 10000 10000 10000 10000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 2000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 2000 4000 4000 4000 4000 4000
4000
10000
KEMET Electronics Corporation P.O. Box 5928 Greenville, SC 29606 (864) 963-6300 www.kemet.com
C1013-1 10/13/2010
SMD MLCCs Flexible Termination System (FT-CAP), X7R Dielectric, 6.3VDC-250VDC (Commercial Grade & Automotive Grade)
Soldering Process
Recommended Soldering Technique: Solder wave or solder reflow for EIA case sizes 0603, 0805 and 1206 All other EIA case sizes are limited to solder reflow only Recommended Soldering Profile: KEMET recommends following the guidelines outlined in IPC/JEDEC J-STD-020
Density Level A: For low-density Product applications. Recommended for wave solder applications and provides a wider process window for reflow solder processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes. Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes. Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualification testing based on the conditions outlined in IPC standard 7351 (IPC-7351).
KEMET Electronics Corporation P.O. Box 5928 Greenville, SC 29606 (864) 963-6300 www.kemet.com
C1013-1 10/13/2010
SMD MLCCs Flexible Termination System (FT-CAP), X7R Dielectric, 6.3VDC-250VDC (Commercial Grade & Automotive Grade)
Reference
Heat Generation T : 20C max. JIS-C-6429 JIS-C-6429
Solderability
J-STD-002
a) Method B, 4 hrs @ 155C, dry heat @ 235C b) Method B @ 215C category 3 c) Method D, category 3 @ 260C
Temperature Cycling Biased Humidity Moisture Resistance Thermal Shock High Temperature Life Storage Life Mechanical Shock Resistance to Solvents
JESD22 Method JA-104 MIL-STD-202 Method 103 MIL-STD-202 Method 106 MIL-STD-202 Method 107 MIL-STD-202 Method 108 MIL-STD-202 Method 108 MIL-STD-202 Method 213 MIL-STD-202 Method 215
1000 Cycles (-55C to +125C), Measurement at 24 hrs. +/- 2 hrs after test conclusion. Load Humidity: 1000 hours 85C/85%RH and Rated Voltage.Add 100K ohm resistor. Measurement at 24 hrs. +/- 2 hrs after test conclusion. Low Volt Humidity: 1000 hours 85C/85%RH and 1.5V.Add 100K ohm resistor. Measurement at 24 hrs. +/- 2 hrs after test conclusion. t = 24 hours/cycle. Steps 7a & 7b not required. Unpowered. Measurement at 24 hrs. +/- 2 hrs after test conclusion. -55C/+125C. Note: Number of cycles required-300, Maximum transfer time-20 seconds, Dwell time-15 minutes. Air-Air. 1000 hours at 125C (85C for X5R, Z5U and Y5V) with 1.5X rated voltage applied. 150C, 0VDC, for 1000 Hours. Figure 1 of Method 213, Condition F. Add aqueous wash chemical - OKEM Clean or equivalent.
KEMET Electronics Corporation P.O. Box 5928 Greenville, SC 29606 (864) 963-6300 www.kemet.com
C1013-1 10/13/2010
SMD MLCCs Flexible Termination System (FT-CAP), X7R Dielectric, 6.3VDC-250VDC (Commercial Grade & Automotive Grade)
KEMET offers Multilayer Ceramic Chip Capacitors packaged in 8mm, 12mm and 16mm tape on 7" and 13" reels in accordance with EIA standard 481. This packaging system is compatible with all tape fed automatic pick and place systems. See Table 2 for details on reeling quantities for commercial chips.
Anti-Static Reel
KE
ME
Chip and KPS Orientation in Pocket (except 1825 Commercial, and 1825 & 2225 Military)
Sprocket Holes
Embossment or Punched Cavity 8mm, 12mm or 16mm Carrier Tape
*EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only.
Pitch (P1)*
2 4 4 8 8 12 4
*Refer to Figure 1 for W and P1 carrier tape reference locations. *Refer to Table 6 for tolerance specifications. KEMET Electronics Corporation P.O. Box 5928 Greenville, SC 29606 (864) 963-6300 www.kemet.com C1013-1 10/13/2010 10
SMD MLCCs Flexible Termination System (FT-CAP), X7R Dielectric, 6.3VDC-250VDC (Commercial Grade & Automotive Grade)
E1
Ao F Ko B1 Bo E2 W
S1 T1
Cover Tape B 1 is for tape feeder reference only, including draft concentric about B o. Center Lines of Cavity
P1 D 1
Embossment For cavity size, see Note 1 Table 5
0.600 (0.024)
0.100 (0.004)
Note 5
1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment location and hole location shall be applied independent of each other. 2. The tape with or without components shall pass around R without damage (see Figure 5). 3. If S1<1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Document 481 paragraph 4.3 (b)). 4. B1 dimension is a reference dimension for tape feeder clearance only. 5. The cavity defined by A0, B0 and K0 shall surround the component with sufficient clearance that: (a) the component does not protrude above the top surface of the carrier tape. (b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed. (c) rotation of the component is limited to 20 maximum for 8 and 12mm tapes and 10 maximum for 16mm tapes (see Figure 3). (d) lateral movement of the component is restricted to 0.5 mm maximum for 8mm and 12mm wide tape and to 1.0mm maximum for 16mm tape (see Figure 4). (e) for KPS Series product A0 and B0 are measured on a plane 0.3mm above the bottom of the pocket. (f) see Addendum in EIA Document 481 for standards relating to more precise taping requirements.
KEMET Electronics Corporation P.O. Box 5928 Greenville, SC 29606 (864) 963-6300 www.kemet.com
C1013-1 10/13/2010
11
SMD MLCCs Flexible Termination System (FT-CAP), X7R Dielectric, 6.3VDC-250VDC (Commercial Grade & Automotive Grade)
E1
A0
F E2 W
B0
T1
P1
Top Cover Tape
T1
1. The cavity defined by A0, B0 and T shall surround the component with sufficient clearance that: a) the component does not protrude beyond either surface of the carrier tape. b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed. d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4). e) see Addendum in EIA Document 481 for standards relating to more precise taping requirements. 2. The tape with or without components shall pass around R without damage (see Figure 5).
KEMET Electronics Corporation P.O. Box 5928 Greenville, SC 29606 (864) 963-6300 www.kemet.com
C1013-1 10/13/2010
12
SMD MLCCs Flexible Termination System (FT-CAP), X7R Dielectric, 6.3VDC-250VDC (Commercial Grade & Automotive Grade)
1. Cover Tape Break Force: 1.0 Kg Minimum. 2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:
Peel Strength
0.1 Newton to 1.0 Newton (10gf to 100gf) 0.1 Newton to 1.3 Newton (10gf to 130gf)
The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be 165 to 180 from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of 30010 mm/minute. 3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA-556 and EIA-624.
Bo
Maximum Rotation ( 20 10
T)
Ao
Maximum Rotation ( 20 10 5
S)
16mm Tape
1.0 mm maximum 1.0 mm maximum
Bending Radius
KEMET Electronics Corporation P.O. Box 5928 Greenville, SC 29606 (864) 963-6300 www.kemet.com
C1013-1 10/13/2010
13
SMD MLCCs Flexible Termination System (FT-CAP), X7R Dielectric, 6.3VDC-250VDC (Commercial Grade & Automotive Grade)
W3 (Includes
W2 (Measured at hub) A D
(See Note)
C
(Arbor hole diameter) If present, tape slot in core for tape start: 2.5 mm min. width x 10.0 mm min. depth
N W1 (Measured at hub)
(see Note)
KEMET Electronics Corporation P.O. Box 5928 Greenville, SC 29606 (864) 963-6300 www.kemet.com
C1013-1 10/13/2010
14
SMD MLCCs Flexible Termination System (FT-CAP), X7R Dielectric, 6.3VDC-250VDC (Commercial Grade & Automotive Grade)
END
START
Top Cover Tape
Components
Straight Edge
250 mm
KEMET Electronics Corporation P.O. Box 5928 Greenville, SC 29606 (864) 963-6300 www.kemet.com
C1013-1 10/13/2010
15
SMD MLCCs Flexible Termination System (FT-CAP), X7R Dielectric, 6.3VDC-250VDC (Commercial Grade & Automotive Grade)
10*
110 0.7
5 0*
W Width
0.5 0.05 0.8 0.07
B Bandwidth
0.2 to 0.4 0.2 to 0.5
S Separation minimum
0.3 0.7
T Thickness
0.5 .05 0.8 .07
Number of Pcs/Cassette
50,000 15,000
Laser marking is available as an extra-cost option for most KEMET ceramic chips. Such marking is two sided, and includes a K to identify KEMET, followed by two characters (per EIA-198) to identify the capacitance value. Note that marking is not available for any Y5V chip. ln addition, the 0603 marking option is limited to the K only. (Marking Optional Not Available for 0402 Size)
Numeral Alpha Character
A B C D E F G H J K L M N P Q R S T U V W X Y Z a b d e f m n t y
KEMET Electronics Corporation P.O. Box 5928 Greenville, SC 29606 (864) 963-6300 www.kemet.com
C1013-1 10/13/2010
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SMD MLCCs Flexible Termination System (FT-CAP), X7R Dielectric, 6.3VDC-250VDC (Commercial Grade & Automotive Grade)
Product Information
Resource Products Technical Resources (Including Soldering Techniques) RoHS Statement Quality Documents http://www.kemet.com/products http://www.kemet.com/technicalpapers http://www.kemet.com/rohs http://www.kemet.com/qualitydocuments Location
Product Request
Resource Sample Request Engineering Kit Request http://www.kemet.com/sample http://www.kemet.com/kits Location
Contact
Resource Website Contact Us Investor Relations Call Us Twitter www.kemet.com http://www.kemet.com/contact http://www.kemet.com/ir 1-877-MyKEMET http://twitter.com/kemetcapacitors Location
Disclaimer
All product specifications, statements, information and data (collectively, the Information) are subject to change without notice. All Information given herein is believed to be accurate and reliable, but is presented without guarantee, warranty, or responsibility of any kind, expressed or implied. Statements of suitability for certain applications are based on our knowledge of typical operating conditions for such applications, but are not intended to constitute and we specifically disclaim any warranty concerning suitability for a specific customer application or use. This Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any technical advice inferred from this Information or otherwise provided by us with reference to the use of our products is given gratis, and we assume no obligation or liability for the advice given or results obtained. Although we design and manufacture our products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage. Although all product-related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicated or that other measures may not be required.
KEMET Electronics Corporation P.O. Box 5928 Greenville, SC 29606 (864) 963-6300 www.kemet.com
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SMD MLCCs Flexible Termination System (FT-CAP), X7R Dielectric, 6.3VDC-250VDC (Commercial Grade & Automotive Grade)
Europe
Southern Europe
Geneva, Switzerland Tel: 41-22-715-0100 Paris, France Tel: 33-1-4646-1009 Sasso Marconi, Italy Tel: 39-051-939111 Milan, Italy Tel: 39-02-57518176 Rome, Italy Tel: 39-06-23231718 Madrid, Spain Tel: 34-91-804-4303
Asia
Northeast Asia
Hong Kong Tel: 852-2305-1168 Shenzhen, China Tel: 86-755-2518-1306 Beijing, China Tel: 86-10-5829-1711 Shanghai, China Tel: 86-21-6447-0707 Taipei, Taiwan Tel: 886-2-27528585
Corporate Offices
Fort Lauderdale, FL Tel: 954-766-2800
North America
Southeast
Lake Mary, FL Tel: 407-855-8886
Southeast Asia
Central Europe
Singapore Tel: 65-6586-1900 Penang, Malaysia Tel: 60-4-6430200 Bangalore, India Tel: 91-806-53-76817
Northeast
Landsberg, Germany Tel: 49-8191-3350800 Dortmund, Germany Tel: 49-2307-3619672 Kwidzyn, Poland Tel: 48-55-279-7025
Central
Northern Europe
Bishops Stortford, United Kingdom Tel: 44-1279-757201 Weymouth, United Kingdom Tel: 44-1305-830747 Coatbridge, Scotland Tel: 44-1236-434455 Frjestaden, Sweden Tel: 46-485-563934 Espoo, Finland Tel: 358-9-5406-5000
West
Mexico
Note: KEMET reserves the right to modify minor details of internal and external construction at any time in the interest of product improvement. KEMET does not assume any responsibility for infringement that might result from the use of KEMET Capacitors in potential circuit designs. KEMET is a registered trademark of KEMET Electronics Corporation. KEMET Electronics Corporation P.O. Box 5928 Greenville, SC 29606 (864) 963-6300 www.kemet.com C1013-1 10/13/2010 18