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BC846 series

65 V, 100 mA NPN general-purpose transistors


Rev. 9 25 September 2012 Product data sheet

1. Product profile
1.1 General description
NPN general-purpose transistors in Surface-Mounted Device (SMD) plastic packages.
Table 1. Product overview Package NXP BC846 BC846W BC846T
[1]

Type number[1]

PNP complement JEITA SC-70 SC-75 JEDEC TO-236AB BC856 BC856W BC856T

SOT23 SOT323 SOT416

Valid for all available selection groups.

1.2 Features and benefits


General-purpose transistors SMD plastic packages Two different gain selections

1.3 Applications
General-purpose switching and amplification

1.4 Quick reference data


Table 2. Symbol VCEO IC hFE Quick reference data Parameter collector-emitter voltage collector current DC current gain hFE group A hFE group B VCE = 5 V; IC = 2 mA Conditions open base Min 110 110 200 Typ 180 290 Max 65 100 450 220 450 Unit V mA

NXP Semiconductors

BC846 series
65 V, 100 mA NPN general-purpose transistors

2. Pinning information
Table 3. Pin 1 2 3 Pinning Description base emitter collector
1 2
006aaa144

Simplified outline

Graphic symbol

SOT23, SOT323, SOT416


3 1 2
sym021

3. Ordering information
Table 4. Ordering information Package Name BC846 BC846W BC846T
[1]

Type number[1]

Description plastic surface-mounted package; 3 leads plastic surface-mounted package; 3 leads plastic surface-mounted package; 3 leads

Version SOT23 SOT323 SOT416

SC-70 SC-75

Valid for all available selection groups.

4. Marking
Table 5. BC846 BC846A BC846B BC846W BC846AW BC846BW BC846T BC846AT BC846BT
[1] * = placeholder for manufacturing site code

Marking codes Marking code[1] 1D* 1A* 1B* 1D* 1A* 1B* 1M 1A 1B

Type number

BC846_SER

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NXP B.V. 2012. All rights reserved.

Product data sheet

Rev. 9 25 September 2012

2 of 15

NXP Semiconductors

BC846 series
65 V, 100 mA NPN general-purpose transistors

5. Limiting values
Table 6. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VCBO VCEO VEBO IC ICM IBM Ptot Parameter collector-base voltage collector-emitter voltage emitter-base voltage collector current peak collector current peak base current total power dissipation SOT23 SOT323 SOT416 Tj Tamb Tstg
[1]

Conditions open emitter open base open collector single pulse; tp 1 ms single pulse; tp 1 ms Tamb 25 C
[1]

Min -

Max 80 65 6 100 200 200

Unit V V V mA mA mA

65 65

250 200 150 150 +150 +150

mW mW mW C C C

junction temperature ambient temperature storage temperature

Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint.

6. Thermal characteristics
Table 7. Symbol Rth(j-a) Thermal characteristics Parameter thermal resistance from junction to ambient SOT23 SOT323 SOT416
[1]

Conditions in free air


[1]

Min

Typ

Max

Unit

500 625 833

K/W K/W K/W

Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.

BC846_SER

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Product data sheet

Rev. 9 25 September 2012

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NXP Semiconductors

BC846 series
65 V, 100 mA NPN general-purpose transistors

7. Characteristics
Table 8. Characteristics Tamb = 25 C unless otherwise specified. Symbol ICBO Parameter collector-base cut-off current emitter-base cut-off current DC current gain hFE group A hFE group B DC current gain hFE group A hFE group B VCEsat VBEsat VBE fT Cc Ce NF collector-emitter saturation voltage base-emitter saturation voltage base-emitter voltage transition frequency collector capacitance emitter capacitance noise figure IC = 10 mA; IB = 0.5 mA IC = 100 mA; IB = 5 mA IC = 10 mA; IB = 0.5 mA IC = 100 mA; IB = 5 mA IC = 2 mA; VCE = 5 V IC = 10 mA; VCE = 5 V VCE = 5 V; IC = 10 mA; f = 100 MHz VCB = 10 V; IE = ie = 0 A; f = 1 MHz VEB = 0.5 V; IC = ic = 0 A; f = 1 MHz IC = 200 A; VCE = 5 V; RS = 2 k; f = 1 kHz; B = 200 Hz
[1] [2] [2] [3] [3]

Conditions VCB = 30 V; IE = 0 A VCB = 30 V; IE = 0 A; Tj = 150 C VEB = 5 V; IC = 0 A VCE = 5 V; IC = 10 A

Min -

Typ -

Max 15 5 100

Unit nA A nA

IEBO hFE

VCE = 5 V; IC = 2 mA 110 110 200 580 100 -

180 290 180 290 90 200 760 900 660 2 11 2

450 220 450 200 400 700 770 3 10 mV mV mV mV mV mV MHz pF pF dB

[1] [2] [3]

Pulse test: tp 300 s; = 0.02. VBEsat decreases by approximately 1.7 mV/K with increasing temperature. VBE decreases by approximately 2 mV/K with increasing temperature.

BC846_SER

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Product data sheet

Rev. 9 25 September 2012

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NXP Semiconductors

BC846 series
65 V, 100 mA NPN general-purpose transistors

400 hFE
(1)

mgt723

1200 VBE (mV) 1000


(1)

mgt724

300
800

(2)

200

(2)

600
(3)

(3)

400

100
200

0 101

10

102 I C (mA)

103

0 101

10

102 I C (mA)

103

VCE = 5 V (1) Tamb = 150 C (2) Tamb = 25 C (3) Tamb = 55 C

VCE = 5 V (1) Tamb = 55 C (2) Tamb = 25 C (3) Tamb = 150 C

Fig 1.

Selection A: DC current gain as a function of collector current; typical values


103
mgt725

Fig 2.

Selection A: Base-emitter voltage as a function of collector current; typical values


mgt726

VCEsat (mV)

1200 VBEsat (mV) 1000


(1)

800
(2)

102
(1) (2) (3)

600
(3)

400

200

10 101

10

102 I C (mA)

103

0 101

10

102 I C (mA)

103

IC/IB = 20 (1) Tamb = 150 C (2) Tamb = 25 C (3) Tamb = 55 C

IC/IB = 10 (1) Tamb = 55 C (2) Tamb = 25 C (3) Tamb = 150 C

Fig 3.

Selection A: Collector-emitter saturation voltage as a function of collector current; typical values

Fig 4.

Selection A: Base-emitter saturation voltage as a function of collector current; typical values

BC846_SER

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NXP B.V. 2012. All rights reserved.

Product data sheet

Rev. 9 25 September 2012

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NXP Semiconductors

BC846 series
65 V, 100 mA NPN general-purpose transistors

600 hFE 500


(1)

mgt727

1200 VBE (mV) 1000


(1)

mgt728

400
(2)

800
(2)

300

600
(3)

200
(3)

400

100

200

0 101

10

102 I C (mA)

103

0 102

101

10

102 103 I C (mA)

VCE = 5 V (1) Tamb = 150 C (2) Tamb = 25 C (3) Tamb = 55 C

VCE = 5 V (1) Tamb = 55 C (2) Tamb = 25 C (3) Tamb = 150 C

Fig 5.

Selection B: DC current gain as a function of collector current; typical values


104
mgt729

Fig 6.

Selection B: Base-emitter voltage as a function of collector current; typical values


mgt730

VCEsat (mV) 103

1200 VBEsat (mV) 1000


(1)

800
(2)

600
(3)

102
(1) (3) (2)

400

200

10 101

10

102 I C (mA)

103

0 101

10

102 I C (mA)

103

IC/IB = 20 (1) Tamb = 150 C (2) Tamb = 25 C (3) Tamb = 55 C

IC/IB = 10 (1) Tamb = 55 C (2) Tamb = 25 C (3) Tamb = 150 C

Fig 7.

Selection B: Collector-emitter saturation voltage as a function of collector current; typical values

Fig 8.

Selection B: Base-emitter saturation voltage as a function of collector current; typical values

BC846_SER

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NXP B.V. 2012. All rights reserved.

Product data sheet

Rev. 9 25 September 2012

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NXP Semiconductors

BC846 series
65 V, 100 mA NPN general-purpose transistors

8. Package outline

3.0 2.8
3

1.1 0.9

0.45 0.15 2.5 1.4 2.1 1.2

1.9 Dimensions in mm

0.48 0.38

0.15 0.09 04-11-04

Fig 9.

Package outline SOT23 (TO-236AB)

2.2 1.8 3 0.45 0.15

1.1 0.8

2.2 1.35 2.0 1.15

2 0.4 0.3 1.3 0.25 0.10 04-11-04

Dimensions in mm

Fig 10. Package outline SOT323 (SC-70)

BC846_SER

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NXP B.V. 2012. All rights reserved.

Product data sheet

Rev. 9 25 September 2012

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NXP Semiconductors

BC846 series
65 V, 100 mA NPN general-purpose transistors

1.8 1.4 3 0.45 0.15

0.95 0.60

1.75 0.9 1.45 0.7

2 0.30 0.15 1 0.25 0.10 04-11-04

Dimensions in mm

Fig 11. Package outline SOT416 (SC-75)

9. Packing information
Table 9. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number[2] BC846 BC846W BC846T
[1] [2]

Package SOT23 SOT323 SOT416

Description 4 mm pitch, 8 mm tape and reel 4 mm pitch, 8 mm tape and reel 4 mm pitch, 8 mm tape and reel

Packing quantity 1000 -215 -115 -115 3000 4000 -235 -135 -135

For further information and the availability of packing methods, see Section 13. Valid for all available selection groups.

BC846_SER

All information provided in this document is subject to legal disclaimers.

NXP B.V. 2012. All rights reserved.

Product data sheet

Rev. 9 25 September 2012

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NXP Semiconductors

BC846 series
65 V, 100 mA NPN general-purpose transistors

10. Soldering
3.3 2.9 1.9

solder lands solder resist 3 1.7 2 solder paste 0.6 (3) occupied area Dimensions in mm 0.5 (3) 0.6 (3) 1
sot023_fr

0.7 (3)

Fig 12. Reflow soldering footprint SOT23 (TO-236AB)


2.2 1.2 (2)

1.4 (2) solder lands 4.6 2.6 solder resist occupied area Dimensions in mm 1.4

preferred transport direction during soldering 2.8 4.5


sot023_fw

Fig 13. Wave soldering footprint SOT23 (TO-236AB)

BC846_SER

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NXP B.V. 2012. All rights reserved.

Product data sheet

Rev. 9 25 September 2012

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NXP Semiconductors

BC846 series
65 V, 100 mA NPN general-purpose transistors

2.65 1.85 1.325 solder lands


2

solder resist solder paste occupied area Dimensions in mm

2.35

0.6 (3)

1.3 0.5 (3)

0.55 (3)

sot323_fr

Fig 14. Reflow soldering footprint SOT323 (SC-70)


4.6 2.575 1.425 (3) solder lands solder resist occupied area 3.65 2.1 1.8 Dimensions in mm preferred transport direction during soldering

09 (2)

sot323_fw

Fig 15. Wave soldering footprint SOT323 (SC-70)

BC846_SER

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NXP B.V. 2012. All rights reserved.

Product data sheet

Rev. 9 25 September 2012

10 of 15

NXP Semiconductors

BC846 series
65 V, 100 mA NPN general-purpose transistors

2.2 1.7

solder lands solder resist 0.85 0.5 (3) 1 2 solder paste occupied area Dimensions in mm 0.6 (3) 1.3
sot416_fr

Fig 16. Reflow soldering footprint SOT416 (SC-75)

BC846_SER

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NXP B.V. 2012. All rights reserved.

Product data sheet

Rev. 9 25 September 2012

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NXP Semiconductors

BC846 series
65 V, 100 mA NPN general-purpose transistors

11. Revision history


Table 10. Revision history Release date 20120925 Data sheet status Product data sheet Product data sheet Product data sheet Product data sheet Change notice Supersedes BC846_SER v.8 BC846_BC546_SER v.7 BC846_BC546_SER v.6 Document ID BC846_SER v.9 Modifications: BC846_SER v.8 BC846_BC546_SER v.7 BC846_BC546_SER v.6

Table 6 Limiting values: Ptot values corrected

20120424 20091117 20060207

BC846_SER

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NXP B.V. 2012. All rights reserved.

Product data sheet

Rev. 9 25 September 2012

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NXP Semiconductors

BC846 series
65 V, 100 mA NPN general-purpose transistors

12. Legal information


12.1 Data sheet status
Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet
[1] [2] [3]

Product status[3] Development Qualification Production

Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification.

Please consult the most recently issued document before initiating or completing a design. The term short data sheet is explained in section Definitions. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.

12.2 Definitions
Draft The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet.

Suitability for use NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customers own risk. Applications Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customers sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customers applications and products planned, as well as for the planned application and use of customers third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customers applications or products, or the application or use by customers third party customer(s). Customer is responsible for doing all necessary testing for the customers applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customers third party customer(s). NXP does not accept any liability in this respect. Limiting values Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customers general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP B.V. 2012. All rights reserved.

12.3 Disclaimers
Limited warranty and liability Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof.

BC846_SER

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Product data sheet

Rev. 8 25 September 2012

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NXP Semiconductors

BC846 series
65 V, 100 mA NPN general-purpose transistors
In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors specifications such use shall be solely at customers own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors standard warranty and NXP Semiconductors product specifications.

Export control This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Quick reference data The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Non-automotive qualified products Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications.

12.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.

13. Contact information


For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com

BC846_SER

All information provided in this document is subject to legal disclaimers.

NXP B.V. 2012. All rights reserved.

Product data sheet

Rev. 8 25 September 2012

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NXP Semiconductors

BC846 series
65 V, 100 mA NPN general-purpose transistors

14. Contents
1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 10 11 12 12.1 12.2 12.3 12.4 13 14 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Thermal characteristics . . . . . . . . . . . . . . . . . . 3 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7 Packing information . . . . . . . . . . . . . . . . . . . . . 8 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 12 Legal information. . . . . . . . . . . . . . . . . . . . . . . 13 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 13 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Contact information. . . . . . . . . . . . . . . . . . . . . 14 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Please be aware that important notices concerning this document and the product(s) described herein, have been included in section Legal information.

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For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 25 September 2012 Document identifier: BC846_SER

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