Electronic Products August 2013

electronicproducts.
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A Hearst Business Publication
AUGUST 2013
Also
In This ISSUE:
Flash Memory Summit preview
UFS The next generation of
embedded storage
Smarter, slimmer
power supplies
Best performance in a leading role.

Histogram for a statistical view Trend chart to see trends over time
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4 Contents
AUGUST 2013 electronicproducts.com ELECTRONIC PRODUCTS
Features
19
Digital ICs:
UFS The next generation of embedded storage
Universal Flash Storage is set to improve embedded system performance
24
Energy-Saving Initiative Series:
Semiconductor advances make smarter, slimmer power supplies
As equipment becomes smarter, maximizing energy efficiency and usage
modes, power supplies can also act smarter by using the latest power
semiconductor innovations
Vol. 56, No.3 August 2013
Cover Story
28
HCC ultrasound advances
diagnostic clinical
procedures
Cutting-edge ultrasound re-
search requires a high-channel-
count (HCC) system that can
interface to large matrix arrays
Touch Points
6
Viewpoint: Undercover medical research
8
The Story Behind the Story: Dc/dc converters with more
functionality, flexibility, power
11
Outlook (Technology News):
Flash Memory Summit 2013 Santa Clara
Next-gen LED shows new promise

22
Product Trends: Transportation electronics
34
Product Roundup: Sensors and transducers
38
Product Update: Packaging, cabinets, and enclosures
New Products
41 Power Sources 45 Packaging & Interconnections
43 Components & Subassemblies 46 Optoelectronics
44 Test & Measurement 47 Integrated Circuits
34
11
19
Only Online
Electronicproducts.com
Education Center:
How to turn a window, table top, and TV
screen into a touchscreen device
First exoskeleton robot to mimic human
motions
3D-printing artificial bone and nacre
Massive rocket explosion due to technician
putting sensors in upside down
Keller Rinaudo talks about his new soft-
ware which turns iPhones into personal
robots
Throwable camera captures sharp, aerial
photos and video that dont induce motion
sickness
Handibot: A 3D milling and carpentry
robot that does the work for you
Whats It Worth:
Early Digital Meters and Displays
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AUGUST 2013 electronicproducts.com ElEcTronic ProdUcTS
6 Viewpoint
Undercover medical research
N
o one can say I don't put 100% of myself into my work.
In preparing for this, our annual Medical Technology
issue, I actually developed cholelithiasis (gall stones)
and, for the first time since I was born, was admitted to a hospi-
tal Long Island College Hospital, a part of SUNY Downstate
Medical Center for an operation.
From the emergency room, I was quickly transported to
radiology where I expected I would be given some sort of X
ray or MRI. Imagine my surprise, when I was wheeled up next
to an ultrasonography machine. I explained to the technician
that I was fairly certain I was not pregnant, which is the only
instance I knew of from prior experience in which ultrasound
was used. But sure enough, when she applied the wand to my
torso, there was a gall stone about the size of a golf ball nicely
lodged in my gallbladder.
Te ultrasound specialist explained to me that diagnostic ul-
trasonography is being used today as an imaging technique for
looking at all sorts of internal body structures: muscles, joints,
internal organs, and so on. Not only is ultrasound being used
for diagnosis, it is also being used theraputically, bringing heat
or vibration to bear. Hence it can be used to clean teeth, treat
cysts or tumors, break up kidney stones, and remove cataracts.
As the feature article on page28 by Danny Kreindler,
Cephasonics' Senior Director of Technical Marketing and FAE,
explains, ultrasound's potential for medical applications is now
being widely explored at research institutions, particularly
using multichannel ultrasound. As he says, "Ultrasound is the
modality of choice due to more and better data throughput,
higher-resolution imaging, decreasing cost, and less patient
risk." A few of the areas being explored are the use of 2D arrays
of ultrasound sensors to create highly detailed 3D images, a less
painful alternative to mammography, and remote diagnosis.
Tanks to such technologies and MEMS and wireless
communications, sensors are playing an ever-increasing role in
medicine and healthcare. In the on-line issue, you'll fnd articles
by Freescale Semiconductor, Renesas, and Microchip Technol-
ogythat give particular examples of how those technologies are
changing the face of medicine.
But afer spending a week in the hospital, the thing for
which I was most gratefulwas the attention of the doctors,
nurses, and orderlies who made my stay more comfortable and
pleasant than I had reason to expect. On leaving, I jokingly
told the staf that I planned to spend my next vacation there.
Te more technology can do to make it possible for patients to
receive the type of individual attention I did, the more it will
truly beneft all of us.
Richard Comerford
To comment: http://bit.ly/15L10ew
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T
he Ericsson BM456/457 dc/dc converters are the first models in the second genera-
tion of digital Advanced Bus Converter (ABC) products. They target information and
communication technology (ICT) companies that need more advanced functionality
and higher levels of flexibility from board-mounted power source manufacturers. To achieve
this, designers are now combining at the
board level a number of power units that
integrate PMBus interfaces, such as power
interface modules, ABCs, and PoL regu-
lators. In addition, the datacom industry,
working on an ac-source and converting via
narrow-output voltage rectifiers to 48 or 52
V, require an increased level of output power
per quarter-brick module, provided by these
Ericsson products.
e company used a small core design
team that was supported by dedicated re-
sources from dierent design units including
thermal simulation and verication to develop the dc/dc converters. eir biggest challenge
was developing a new product at the same time as a new control IC plus rmware. When they
were developing the rst ABC platform called FRIDA I and integrated digital control and
power management, the company explored new ways to optimize energy utilization and make
it possible for system architects to increase the integration of dc/dc converters within the rest of
the digital chain. Working in close cooperation with silicon vendors,Ericsson achieved the de-
velopment of such a product, but also faced an immediate demand for more advanced features
and an increased level of power required by the datacom industry.
Increasing the level of functionality and making the power module even more e cient
meant that the R&D team had to signicantly increase the level of embedded soware
(rmware) while also increasing the number of commands executed by the processor. As
there was no suitable control IC available, they had to work in close cooperation with silicon
vendors to develop the new control IC for the second-generation FRIDA II, in parallel with
developing the product.
In addition to the complexity of developing a new platform at the same time as the con-
trol IC, there was an additional level of complexity with the development of new algorithms
to optimize the built-in power management. Very few soware designers combine pow-
er-switching expertise with knowledge of developing complex program algorithms.
e development of the rmware requiredthe teamto take a step-by-step approach and
develop a process for design, verication, and validation, and nally function-by-function
implementation. In the development of this new process, the most di cult part was to bal-
ance functionality with processing power. e switching cycle and timing events, combined
with analog delays and sampling limitations, called not only for accuracy, but also thorough
verications and quality checks.
e result of this process was the Ericsson Energy Optimizer Firmware, which optimiz-
es operational parameters to any type of load or line transients such in the case of ATCA
switching from Feed A to Feed B.
is type of complex project normally takes about 36 months. However, due to the exper-
tise gained from the rst-generation FRIDA I, by combining the development of soware and
rmware in a single core team, together with the companys knowledgeof energy management
and dedicated algorithms,creating theBM456/457 dc/dc converterstook only 18 months.
Paul OShea
Dc/dc converters with more
functionality, flexibility, power
Core members of the BM456/457 design team
(le to right): Henrik Borgengren,
Anders Kullman, Fredrik Wahledow, Jonas
Malmberg, and Jan Arvidsson.
Sense-ability.
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Outlook 11
Innovations impacting product, technology and applications
ELECTRONIC PRODUCTS electronicproducts.com AUGUST 2013
Maximum capacitance values up to 10,000 F
Low inductance, low ESR and ESL with low DF
Voltages to 10,000 VDC, ripple currents up to
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I In-house electrical, environmental and reliability testing verification
I Standard designs up to 10,000 VDC/ 750 VAC
I Standard capacitance values up to 10,000 F
I Ripple currents up to 400 Arms
Applications
I Renewable energy inverters solar converters, wind turbines and fuel cells
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I Medical imaging equipment, defibrillators
Model Features &Ordering Information Example: 55PP-600-153-K
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Voltage Code 10K = 10,000 VDC High Voltage Capacitor Series Capacitance Code* 103 = 0.01 F Tolerance** M = 20%
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I Metallized polyester
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I Temperature -55C to +125C
I Voltages up to 10,000 VDC
55PP 600 153 K
Voltage Code 600 = 600 VDC Power Polypropylene Capacitor Series
Capacitance Code* 153 = 0.015 F Tolerance** K = 10%
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I Axial leads or tab termination
I Low ESL & ESR design for high ripple currents
I Temperature -55C to +105C
I Voltages up to 2,000 VDC
I Capacitance 0.015 F to 3.3 F
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capacitors
EMC (www.emc.com) will have on handits XtremSF PCIe fash
hardware that is deployed in
servers to dramatically improve
application performance by
reducing latency and acceler-
ating throughput. XtremSF can also be used
in conjunction with server fash caching sofware from EMC for
accelerated read performance with data protection.
HGST (www.hgst.com) will be at booth 606 demonstrating new
12-Gbit/s SAS SSDs that have high performance, three endur-
ance-level options, capacity up to 1 Tbyte, and proven reliability.
Te companies Ultrastar SLC and MLC drives ft the enterprise
where it is critical that they integrate seamlessly in tiered storage
environments.
PNY (www3.pny.com) will talk to you in booth 414 aboutthe
company'sendurance promise that ofers peace of mind for
solid-state drives with up to 10k program/erase cycles, so you can
easily choose the right drive based on your needs. Tey feature
capacities up to 480 Gbytes and performance up to 550 Mbytes/s.
Viking Technology (www.vikingtechnology.com) will show you
its ArxCis-NV nonvolatile DDR3 DIMM memory in booth 508. It
Starting Monday August 12, at its regular spot in the Santa Clara
Convention Center, the Flash Memory Summit and Exhibition
will again bring together just about anybody who has knowledge
and interest innonvolatile memory. Monday is reserved for four
in-depth seminars, followed by a reception from 5:30 to 7 p.m. Te
regular conference starts Tuesday with a full gaggle of 1-hour
talks that continue until 6 p.m. on Tursday. Tere will be11 half-
hour keynote presentations given during the three conference days.
Te exhibit foor is open on Wednesday (noon to 2 and 5 to
7:30 p.m.) and Tursday (noon to 2 p.m.). Here are just a few of the
many interesting products being shown on the exhibit foor:
LSI Sandforce (www.lsi.com), in booth 402, will show you a
new SSD NAND fash controller delivering the endurance, reli-
ability, and performance customers require, even as fash memory
geometries shrink.
PMC (http://pmcs.com), a leading provider of enterprise storage
system solutions for networked and server storage applications,
will showcase 12-Gbit/s SAS and PCIe Gen 3 solutions. Tey will
be happy to explain how NAND vendors and storage OEMs can
design managed enterprise fash solutions using of-the-shelf MLC
and SLC NAND devices.
Flash Memory Summit 2013 Santa Clara
Key nonvolatile storage conference expects 4,000 attendees
12 Outlook
Innovations impacting product, technology
and applications
Next-gen LED shows
new promise
Researchers from the Smart Lighting Engineering Research
Center at Rensselaer Polytechnic Institute (RPI) have success-
fully integrated an LED and a power transistor on the same gal-
lium nitride (GaN) chip. Tis innovation could open the door
to a new generation of LED technology that is less expensive to
manufacture, signifcantly more efcient, and one that enables
new functionalities and applications beyond illumination.
At the heart of these LED lighting systems are chips made
from GaN. For the LED to function, many external compo-
nents such
as inductors,
capacitors, silicon
interconnects, and
wires must be
installed on or
integrated into
the chip. Te large
size of the chip,
with all of these
necessary com-
ponents, compli-
cates the design
and performance of LED lighting products. Additionally, the
process of assembling these complex LED lighting systems can
Fig. 1: A cross-section of the new
monolithically integrated GaN LED and HEMT
developed by engineers at Rensselaer.
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runs at DDR3 speeds, delivers both performance and
reliability to enterprise applications, and is integrated
into standard server and storage
architecture at the fastest
storage tier. ArxCis-NV also
features practically infnite write endurance.
Seagate Technology (www.seagate.com) will have three 2.5-in.
SSDs. Te 600 SSD is the ultimate SSD to speed up existing laptops
with SATA 6 Gbits/s and up to 480-Gbyte capacity. Te 600 Pro
SSD is an entry-level enterprise SATA 6-Gbit/s drive with up to
480-Gbyte capacity. And, the 1200 SSD enterprise 12-Gbit/s SAS
SSD has capacities up to 800 Gbytes.
Silicon Motion Technology (www.siliconmotion.com) will
demonstrate their SM2246 SATA 6-Gbit/s controller in booth
615. It targets PC/ultrabook and tablet applications, with ultra-low
power consumption and support for the Toggle/ONFI 3.0/Async
interface.
Skyera (www.skyera.com)
has leveraged experience in ad-
vanced networking and chip design to build skyHawk, a vertically
integrated hardware and sofware solution that combines a pur-
pose-built fash storage array and a rich feature set of sofware tools.
Jim Harrison
Not Your Dads LDO
Info & Free Samples
, LT, LTC, LTM, Linear Technology and the Linear logo are
registered trademarks of Linear Technology Corporation. All other
trademarks are the property of their respective owners.
www.linear.com/products/LDOs
1-800-4-LINEAR
Selected LDOs
Current Reference-Based
NPN Positive LDOs
Positive LDOs
Dual Positive LDOs
Dual Positive and Negative LDOs
Negative LDOs
Output
Current (A)
Part
Number
Product Category
LT
3082
LT3085
LT3080
LT3083
LT3008
LT3050
LT3013
LT3022
LT3070
LT3029
LT3032
LT3015
0.2
0.5
1.1
3
0.02
0.1
0.25
1.0
5
0.5 x 2
0.15 x 2
1.5
V
IN
Range (V)
1.2 to 40
1.2 to 36
1.2 to 36
1.2 to 23
2 to 45
2 to 45
4 to 80
0.95 to 10
0.95 to 3
1.9 to 20
1.9 to 20
1.9 to 30
Output Voltage (V)
Adj (0 to 38.5)
Adj (0 to 35.5)
Adj (0 to 35.5)
Adj (0 to 22.5)
Adj (0.6 to 44.5), Fixed
Adj (1.24 to 60)
Adj (0.8 to 1.8)
Adj (1.215 to 19.5)
Adj (1.22 to 19.5), 5
14 Outlook
Innovations impacting product, technology and applications
Fig. 2: Researchers from Smart Lighting
Engineering Research Center at RPI have
integrated an LED and HEMT structure on
the same GaN chip. The device is seen on the
left with the LED on the right.
be slow, manually intensive, and expensive.
Te study, done by a research team led by T. Paul Chow, professor in the
Department of Electrical, Computer, and Systems Engineering (ECSE) at
RPI, sought to solve the challenge by developing a chip with components all
made from GaN. Tis type of monolithically integrated chip simplifes LED
device manufacturing, with fewer assembly steps and less required auto-
mation. Additionally, the LED devices made with monolithically integrated
chips will have fewer parts to malfunction, higher energy efciency and cost
efectiveness, and greater lighting design
fexibility.
Chow and the research team grew a
GaN LED structure directly on top of a
GaN high-electron-mobility transistor
(HEMT) structure. Tey used several
basic techniques to interconnect the
two regions, creating what they are
calling the frst monolithic integration
of a HEMT and an LED on the same
GaN-based chip. Te device, grown on
a sapphire substrate, demonstrated light
output and light density comparable to
standard GaN LED devices. Chow said
the study is an important step toward the
creation of a new class of optoelectronic
device called a light emitting integrated
circuit (LEIC).
Te LEIC will play a pivotal role in
cost-efective monolithic integration of
electronics and LED technology for new
smart lighting applications and more
efcient LED lighting systems, according
to Mr. Chow.
Tis new study, and the device we
have created, is just the tip of the ice-
berg, said Smart Lighting ERC Director
Robert Karlicek, a co-author of the
study and ECSE professor at Rensselaer.
LEICs will result in even higher energy
efciency of LED lighting systems. But
what will be even more exciting are the
new devices, new applications, and new
breakthroughs enabled by LEICsthey
will truly usher in the era of smart
lighting.
Visit http://tinyurl.com/qhfeh3 for
additional information.
Paul OShea
800 453 6202
>> Accelerate your productivity at ni.com/measurements-platform
2013 National Instruments. All rights reserved. LabVIEW, National Instruments, NI, ni.com, and NI CompactDAQ are trademarks of National Instruments.
Other product and company names listed are trademarks or trade names of their respective companies. 12123
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devices available, offering superior accuracy and maximum performance.
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16 Engineering Distribution
IN PARTNERSHIP WITH
Medical Applications
A
D
V
E
R
T
I
S
E
M
E
N
T
Magnetic Resonance Imaging:
Some Key Components
A
s noted on the opposite page, magnetic resonance imaging
(MRI) is a non-invasive diagnostic technology for taking
very clear and detailed pictures of tissues and internal
organs using high-frequency radio waves delivered in pulses and a
strong magnetic field. The magnetic field forces hydrogen atoms in
the body into a particular alignment (resonance). Radio frequency
energy is then distributed over the patient, which is disrupted by
body tissue. The disruptions correspond to varying return signals
that, when processed, create the image. In this article we'll look
at the role played by three product types used in the signal path
whose accurate processing of MRI signals is essential to obtaining
high-quality images: DACs, DSPs, and power amplifiers.
Given adequate support circuitry, component selection and
proper layout, higher DAC precision produces sharper MRI image
resolution. For controlling the magnetic and RF energy in an MRI,
high-resolution, high-speed DACs are needed. High resolution is
required to accurately defne the area of the patient to be scanned.
High-speed is necessary where the signals for the predominant
1.5- and 3-Tesla systems are approximately 64 and 128 MHz.
Fortunately, advances in
semiconductor processing,
DAC architecture, and
fast on-chip calibration
techniques make possible
highly linear, stable,
fast-settling DACs which
provide controllable
precision voltages. Te
Analog Devices AD5791 (Fig. 1), for example, is a single, 20-bit,
serial input, 1-ppm-accurate voltage output DAC that operates
from a bipolar supply of up to 33 V. Besides its impressive linearity,
the AD5791 combines a low 0.05-ppm/C temperature drif, 1-s
settling time, 0.6-Vp-p noise in the 0.1 to 10-Hz frequency band
and better-than-1-ppm long-term stability. Analog Devices also
ofers its EVAL-AD5791, a full-featured evaluation board designed
to allow the user to easily evaluate all features of the AD5791
voltage-output 20-bit DAC.
Accurate signal processing is essential to obtaining high-
quality MRI images. DSPs can be used to properly control
the magnets in the MRI system. A DSP can also take care
of preprocessing the signal before it reaches the image
reconstruction engine. Te TI TMS320C6672 DSP (Fig. 2) is
the highest-performance fxed/foating-point DSP based on TI's
KeyStone multi-core architecture. Incorporating the C66x DSP
core, this device can run at a core speed of up to 1.5 GHz. TI's
TMS320C6672 DSP combines
both fxed and foating point
performance, an increased number
of peripherals and memory per
core, ofers 3-GHz cumulative DSP
and is fully backward compatible
with TI's existing C6000 family
of DSPs. Te C6672 device has a
complete set of development tools,
which include an enhanced C
compiler, an assembly optimizer to
simplify programming and scheduling, and a Windows debugger
interface for visibility into source-code execution.
Radio frequency power amplifers (RFPAs) for MRI are designed
to take a relatively weak RF signal and boost it up to a stronger RF
signal. How well this is done can have a direct impact on signal-
to-noise ratio (SNR) and other parameters that can become clearly
visible in MRI scans. (For example, failure to achieve the desired
noise levels can lead to "ghosting" artifacts in the image.) Based
on the STMicroelectronics STAC4932B RF power transistors,
the company's STEVAL-IMR002V1 demonstration board helps
designers implement a 2-kW 100-V 123-MHz Class AB peak power
amplifer (PPA) for 3-Tesla MRI applications. It uses double push-
pull bolt-down devices, two STAC4932B N-channel MOSFETs and
can exceed 2,000 W at 123 MHz with large signal gain of 19 dB in
Class AB and a drain efciency of 60%.
With Mouser expanding its Medical Applications website,
engineers will fnd a new MRI section with resources listed by
supplier to bring them up to date on the newest technology and
design developments. An interactive block diagram is used for easy
navigation to a broad selection of products.
BY MURRAY SLOVICK
Fig. 1: Analog Devices AD5791
20-bit DAC.
Fig. 2: Functional diagram
of TI TMS320C6672.
Engineering Distribution 17
IN PARTNERSHIP WITH
MRI Technology and Semiconductors:
Worth Closer Examination
M
agnetic resonance imaging (MRI), first introduced in
hospitals in the early 1980s, is one of the most useful
imaging techniques for medical diagnostics. MRI
provides very clear and detailed pictures of tissues and internal
organs using a strong magnetic field and high-frequency radio
waves delivered in pulses. MRI offers images with excellent
contrast between soft tissues. MRI images can differ in con-
trast based upon the specific imaging technique used. This is
different from ultrasound, X-rays, or computed tomography,
which use only absorption, reflection, or scattering to form
images. Since MRI does not expose the patient to radiation and
has many other advantages, applications for MRI have grown
very broad. Specifically, it is well suited for cardiology and in
diagnosing cancer, stroke, and brain disorders.
For clinical use, MRIs use 1.5- or 3-Tesla magnets, a
measure of magnetic feld strength. Te natural magnetic
fux at the earths surface is only about 50 T. MRI resolution
improves with a lower signal-to-noise ratio (SNR), which
improves with an increasing magnetic feld strength. In the
MRI chamber, atoms in the body are literally magnetized, and
pulsed RF is shot at the patient. Te pulse resonates with the
magnetized nuclei at a selected frequency. Tis fips the spin on
all resonating nuclei to align them in the same direction, and is
called nuclear magnetic resonance (NMR). NMR is created in
the patients body one slice at a time.
Te magnetic resonance at the nuclear level is strong
enough to induce a perceivable current in the nearby RF coil.
Tis induced current is a signal that can be amplifed with
very sensitive electronics that are specifcally designed to
reduce electrical noise in the system. Noise competes with
and corrupts the MRI signal. Accurate, precision devices
that introduce the least noise and are stable over varying
temperatures are required. Analog Devices new family of
precision voltage reference chips (ADR45xx) introduce less
than 1 Vp-p (peak-to-peak) to a V
OUT
of 2.048. For MRI, high
speed is also a necessary attribute to rapidly communicate and
process large amounts of imaging data.
In an MRI, once the signal is captured, magnetized nuclei
spin-states return to normal in an exponential decay. Te decay
is also exploited to manipulate image contrast for diagnostics.
RF pulses are repeated with varying amplitudes in every slice.
MRI allows detailed contrast manipulation, which
dramatically enhances the diagnostic value of MRI because
tissue contrast can be tailored to a particular purpose. Other
imaging technologies do not have this feature.
Since newer products tend to provide better overall
performance, Mouser
has assembled a
Medical Imaging site
specifcally designed
to provide design
engineers with a
jump-start on part
selection.
MRI has brought
a whole new level of
vision to medicine that
continues to improve
with new technology
found at Mouser.
By Mouser Electronics, www.mouser.com
Fig. 1: (Left) Excerpts demonstrating the affect of temperature on
output voltage regulation. (Right) The test plots for the occurance of
noise (peak 10 Hz) with respect to output voltage. (Courtesy Analog
Devices datasheet for AD4525)
Fig. 2: Mouser Medical Imaging applications
block diagram with parts selected for MRI
across multiple manufacturers.
Learn more at mouser.com/applications/medical-application-mri/
A
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Digtal ICs 19
ElEctronic Products electronicproducts.com AuGust 2013
UFS The next
generation
of embedded
storage
Universal Flash Storage is set to
improve embedded system
performance
BY SCOTT BEEKMAN
Director, Managed NAND Memory Products
Toshiba America Electronic Components
www.toshiba.com/taec/
F
or a few years now, e-MMC (Embedded Multi-Media
Controller) has been the leading high-density embed-
ded storage solution for mobile devices and for good
reason. As a JEDEC standard solution, widely adopted by an
enormous and growing smartphone and tablet market, the
e-MCC format enabled a wide variety of applications to take
advantage of the infrastructure of memory, chipset, and OS
vendors that support this solution. These applications include
games, digital video cameras, printers, servers, eReaders,
security systems, medical, automotive, and many more. The
e-MMC market has skyrocketed from under $1 billion in
global sales in 2009 to about $5 billion in 2012, and it contin-
ues to grow.
So, what embedded Gbyte storage solution comes afer
e-MMC? As mobile devices become more sophisticated, inter-
We provide interconnect designs that take extremes
of shock and vibration in stride, and meet ne-pitch
specications ranging from 2.54mm down to 0.8mm
pin-to-pin spacing. Our extensive selection of headers
and sockets can be congured to accommodate a
wide range of board-to-board requirements.
Unique connector housings can be provided in two
options: molded, using high temperature thermoplas-
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quick turnaround. Whatever the challenge, Mill-Max is
your solution.
Dont see what you need? Rapid prototyping
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DESIGNS AND OPTIONS TO
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www.mill-max.com/EP635
Fig.1: UFS vs. e-MMC topology.
20 Digital ICs
face speeds and system level performance
for embedded storage must continue to
advance. For this reason, a new JEDEC
standard embedded storage interface
solution is taking shape Universal Flash
Storage (UFS). Enabling signifcant boosts
in interconnect performance; UFS is in-
tended to be the next gen-
eration of mobile mass
storage afer e-MMC.
Like e-MMC, UFS incor-
porates into one package
one or multiple NAND
fash die and a controller
die that performs NAND
management functions
such as error code correc-
tion (ECC), wear-leveling
and block management,
to simplify integration
into product designs.
UFS operation
UFS is not backward
compatible to e-MMC
and has a serial interface,
in contrast to e-MMC's
parallel format. As shown in Fig. 1, UFS
supports full duplexing, enabling both
reading and writing between the host
processor and UFS device at the same
time; e-MMC supports half duplexing,
only allowing either reading or writing
between the host processor and e-MMC
device.
One key beneft of UFS is its faster
interface. While e-MMC version 4.5 and
5.0 have maximum interface speeds of
200 and 400 Mbytes/s, respectively, UFS
version 2.0 HS-G2 (High-Speed Gear
2) can supporttwo lanes, each operat-
ing at a maximum speed of around 360
Mbytes/s, for a total of 720 Mbytes/s.
HS-G3 (High-Speed Gear 3) can sup-
porttwo lanes, each operating at a max-
imum speed of around 720 Mbytes/s, or
1,440 Mbytes/s total.
Since NAND performance can be a
bottleneck, especially for write oper-
ations, the beneft of the faster UFS
interface is best achieved by interleaving
multiple NAND die within the UFS
device. Tis is managed by the UFS con-
troller. For this reason, higher densities,
which have more die to interleave, can
have higher performance, and are ex-
pected to be the target for UFS initially.
Figure 2 highlights some key diferences
between UFS and e-MMC.
Other UFS benefts
Te e-MMC solutionhas a feature called
Packed Command, which enables the
host system to issue a set of multiple
commands to the e-MMC device, rather
than one command at a time. However,
Fig. 2: UFS vs. e-MMC: key feature comparison.
for e-MMC, these sets of commands
must all be read commands, or write
commands, but not both intermixed. UFS
has Command Queuing, which enables
the host system to issue multiple read and
write commands, to be executed by the
UFS device in parallel, enabling improved
system performance.
UFS has better power
efciency during read and
write operations, though
e-MMC uses less power
during idle or sleep states,
and therefore e-MMC
likely uses less power
overall, depending on the
application's use case.
Production ramp
Te e-MMC market's
size and momentum will
likely mean that these
two mobile embedded
solutions will continue to
be supported in parallel
for some time, with UFS
initially supporting the
needs of applications demanding higher
performance, and typically at higher
densities, and e-MMC supporting the
needs of applications driven to maintain
the lowest cost.
An earlier version of UFS, version
1.1 (see Fig. 3), has been sampling since
early 2013 for initial chipset and OS de-
velopment. UFS version 2.0 is expected
to be the frst high-speed UFS solution
that broadly goes to mass production, in
early 2014. UFS will likely take a greater
share of the embedded storage market as
economies of scale increase and the rela-
tive additional cost over that of e-MMC
decreases over time.
Fig. 3: Te THGLF0G9B8JBAIE 64-Gbyte UFS 1.1 storage IC comes in a
169-ball FBGA package.
Optik-D
Series
Low insertion loss of 0.06 dB
(typical) means less optical
power is required, which can
mean the difference between
an inexpensive LED laser and a
costly solid state laser
Suitable for harsh environments
More cost effective than
D38999 and ARINC
600-based systems
Wide availability of accessories
Precision guide pin ensures
proper alignment
Hybrid Combo-D connector
allows for combination of
optical, power, signal and/or
coax in a single connector
Fiber Optic Connectors
for Rugged Applications
Conforms to ARINC 801
www.connectpositronic.com/optik-d
Crimp sleeve not shown
22 Product Trends
Insight into current product developments
Applications in
Transportation electronics
T
he design of transportation
systems is at a crossroads for
certain. The move to electric
and hybrid-electric automobiles is
very significant now and I think it will
continue to grow quickly. When will
that technology, along newer automotive
safety systems, be widely implemented
in buses, trucks, and trains? There are
some hybrid buses, but not a lot. Maybe
a better question is why hasnt it been
done already. But, there are many active
innovations in public transport and in
automotive.
Public transportation
Tere are some new and interesting
applications in public transportation,
and systems in many cities could use a
number of updates. Fare collection is
one area to look at. Rainer Lutz, senior
global marketing manager at NXP tells
us that electronic ticketing is making
access to public transport faster, more
reliable, and more secure. Mifare, NXPs
extensive range of contactless IC prod-
ucts, is the most popular and advanced
development platform. It is used in over
650 cities from London to Auckland and
from Moscow to Sao Paulo.
Innovative smart mobility concepts
are being implemented that combine
metro, bus, taxi and micro payments as
well as bike and car rental on a single
card. In addition, regional and country-
wide schemes extend the scope of the
passengers travel experience incorporat-
ing street parking or museum entrance
fees, for example.
Rainer adds that the latest industry
trends also include mobile ticketing
using NFC phones and banking cards
which can be used for public transpor-
tation; both can use Mifare function-
ality for a seamless integration.Mobile
ticketing enables the integration of
travel information and ticketing in one
device, encouraging a sustainable urban
lifestyle.
Automotive convenience
Some signifcant automotive advances
fall under a heading of convenience
but, at lease for some people, these may
be moving to the Cant Live Without
category. Google and Apple Maps with
trafc info and Garmin systems with
trafc updates are being widely used.
And now there are signs on city streets
showing real-time availability of parking
spaces in nearby garages. But, Id have to
say the main emphasis in transportation
electronics is in automotive safety.
Automotive safety
Renesasis one of the leading chip
suppliers for automotive. I spoke with
Amrit Vivekanand, vice president of the
automotive marketing unit at Renesas.
Amrit said, With all the post-crash
safety technology, such as air bags, that
we have today, there are still close to 100
automotive related deaths per day in
the U.S., and this statistic unfortunately
has been staying fat. Focus is shifing
to pre-crash active safety and crash
prevention as the only way to reduce
the level of fatalities. Tis shif will drive
tremendous electronic content into the
vehicle.
All this pre-crash and post-crash
technologies and the innovation that has
been spawned will make autonomous
driving a reality, delivering intelligent
and self-aware automobiles. For the IC
manufacturer, we know that devices that
combine the performance of high-end
SOCs and the safety levels of drivetrain/
chassis applications will be required.
Te backup camera may also soon be
a safety requirement. Te Department
of Transportation has delayed the new
car requirement until 2015. Tey say
more analysis of the cost, said to be $2.7
B or as much as $18 M per life saved, is
needed before issuing the mandate. Te
agency has previously delayed the rule
three times,
Jim Harrison
Vishay Intertechnology: www.vishay.com
Freescale Semiconductor: www.freescale.com
International Rectifier:www.irf.com
40-V family of automotive-qualifed MOS-
FETs ofer R
DS(on)
as low as 0.75-m at 10 V
GS.
Te family of 22 devices come in D2Pak-7P,
D2Pak, DPak, TO-262, IPAK, and TO-220
packages and current ratings up to 240 A.
Te devices ofer 765-mJ single-pulse ava-
lanche energy and a tested value to 1,485 mJ.
Pricing begins at $0.39 ea/100,000.
Te AEC-Q200-qual-
ifed IHTH-
0750IZ-5A and
IHTH-1125KZ-5A
high-current, high-
temp through-hole
inductors come in
0750 and 1125 case sizes. Tey operate up to
155C, with rated currents to 125 A and values
from 0.47to 100 H. Tey have a frequency
range up to 10 MHz, and handle high tran-
sient-current spikes without hard saturation.
Te Qorivva
MPC577xK
32-bit embed-
ded MCU is
designed for
automotive
radar systems,
providing
high levels of
digital and analog integration for next-gen-
eration advanced driver assistance systems
(ADAS) systems. When combined with the
MRD2001 77-GHz radar front-end chipset,
it ofers a complete system-level radar
solution.
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Can perform measurements at high speed under multiple conditions
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Measurements necessary to evaluate transformers
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All the features of the IM3523 and IM3533 plus:
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24 Energy-Saving Initiative
Semiconductor advances make
smarter, slimmer power supplies
As equipment becomes smarter, maximizing energy efficiency and usage
modes, power supplies can also act smarter by using the latest power
semiconductor innovations
BY TIM KASKE, Product Marketing
Manager for DC-DC Power Products,
ON Semiconductor, www.onsemi.com
A
s PCs and televisions adopt
ever slimmer and more elegant
form factors, power supplies
must achieve lower profiles and adapt-
ers for ultra-portable computers must
become more compact and lightweight
travelling companions.
To help meet targets such as these,
quasi-square-wave resonant (QR)
power supplies provide high switch-
ing efciency and reduce EMI, which
can simplify shielding or suppres-
sion. Managing the power supply, a
combined fyback and power-factor
correction (PFC) controller allows
designers to reduce component count.
Moreover, by turning of
the PFC under low/no-load
condition, the controller can
improve standby efciency.
Te roadmap for this type of
device is moving towards
further feature integration
and enhanced switching performance
for lower audible noise.
Combination QR/PFC controllers
A number of combination devices are
available, featuring PFC and quasi-reso-
nant fyback control in a single package.
High-voltage IC technology allows
direct startup from the rectifed ac-line
voltage. Logic circuitry controls the
fyback and PFC switching waveforms
as well as functionality such as sof-
start and protection features including
overcurrent, overvoltage, and overtem-
perature protection, safe restart and
demagnetization detection.
During normal operation, PFC en-
hances efciency by minimizing reactive
power and preventing distortion of the
line-voltage waveform. It is mandatory
in appliances rated over 70 W, but is not
required at lower power levels, where
energy losses in the PFC circuitry can
reduce efciency. To save these losses,
some commercial combination fyback/
PFC controllers are able to turn the PFC
of and hence improve efciency at light
loads and in standby mode.
A novel feature of ON Semicon-
ductors NCP1937 controller allows
the user to program the PFC disable
threshold based on the percentage
of output power. Internal circuitry
generates a current proportional to
the output power, which is scaled and
averaged using an external resistor
and capacitor to produce a voltage
proportional to output power. Te IC
uses this voltage in conjunction with
an integrated PFC disable timer and
a reference that varies with the line
voltage to coordinate turning of and
re-enabling the PFC. Tis allows the
PFC stage to be disabled between 25
and 50% of the load at low line and be-
tween 50 and 75% at high line. Te PFC
stage is also disabled during power-up
until the fyback sof-start time expires.
In addition, the circuitry needed to
turn of PFC by opening the feedback
connection is integrated in the device.
Conventional combination devices re-
quire an external feedback connection
with a MOSFET circuit to open or close
the loop as required. Figure 1 illustrates
the PFC on/of control circuitry.
This feature provides one example
of how advances in high-voltage IC
technology are allowing manufactur-
ers to deliver more highly integrated
controllers that allow power supply
designers to eliminate additional
external circuitry and further improve
efficiency across the load range. ICs
with high-voltage capability have typ-
ically provided only limited digital ca-
pability. More advanced high-voltage
processes now allow smaller digital
feature sizes, permitting extra on-chip
functionality, which enables designers
to build smarter and more accurate
power supply solutions within smaller
form factors than has been possible in
the past.
Fig. 1: Integrated circuitry for PFC on/of control.
EMI Filter
Line
Rectifier IC and Switches LEDs
IC
310
320
330
340
350
360
370
380
390
6
0

7
0

8
0

9
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C
u
r
r
e
n
t

(
m
A
)

Input Voltage
LED Current (mA)
LEDrivIR
IRS2980
IRS2980 Features
Internal high voltage regulator
Hysteretic current control
High side current sensing
PWM dimming with analog or PWM
control input
Free running frequency with maximum
limiting (150kHz)
IRS2980 Benets
Low component count
Off-line operation
Very simple design
Inherent stability
Inherent short circuit protection
Demo Board Specications
Input Voltage 70V to 250V (AC)
Output Voltage 0V to 50V (DC)
Regulated Output Current: 350mA
Power Factor > 0.9
Low component count
Dimmable 0 to 100%
Non-isolated Buck regulator
for more information call 1.800.981.8699 or visit us at www.irf.com
High-Voltage Buck Control ICs for
Constant LED Current Regulation
THE POWER MANAGEMENT LEADER
Part
Number
Package Voltage
Gate
Drive Current
Startup
Current
Frequency
IRS2980S SO-8 450V +180 / -260 mA <250 A <150 kHz
IRS25401S SO-8 200V +500 / -700 mA <500 A <500 kHz
IRS25411S SO-8 600V +500 / -700 mA <500 A <500 kHz
IRPLLED7 Demo Board
LED Current vs Input Voltage
IRPLLED7 Demo Board
an electronic products special series
26 Energy-Saving Initiative
Keys to improvement
ON Semiconductors 700-V high-volt-
age process also allows the controller
to integrate most of the circuitry for
discharging the X2 input flter capacitor
when the ac-line voltage is removed
a feature required by safety agency
standards. Tis saves the PCB space
and power consumed by the external
resistor network used for X2 ca-
pacitor discharge. Te NCP1937
controller has two high-voltage
startup circuits, and a novel
approach is used to reconfgure
these to discharge the input flter
capacitance upon removal of the
ac-line voltage.
Other integrated features
made possible by the advanced
process technology, saving sever-
al external components, include
a power-savings mode (PSM)
in which the supply current is
reduced to below 70 A. Te
typical approach taken with
conventional fyback control ICs
uses an active-of signal to initiate
the low-power mode, which requires an
additional bias current to pull down the
optocoupler on the secondary side and
reduces the overall system efciency.
In contrast, the NCP1937 has internal
circuitry that eliminates the need for
such a bias current, thereby improv-
ing system efciency when no load is
present.
Te increased digital integration
combined with the advanced 700-V
high-voltage process also allows more
of the circuitry required for protection
features, such as fault detection, current
sensing, and overpower compensation
to be implemented on chip, reducing
reliance on external components.
Better user experience
QR operation of the fyback converter
is currently popular in laptop power
adapters and televisions, mainly by
virtue of zero-voltage switching (ZVS),
or valley switching, which improves
switching efciency and produces lower
electromagnetic interference (EMI)
than a hard-switching architecture.
By nature, the QR converters switch-
ing frequency varies according to input
and output load conditions and tends
to increase as the output load decreas-
es. In a conventional QR converter,
the free-running frequency is typically
clamped at 125 kHz, which is below
the 150-kHz CISPR-22 EMI starting
point. Hence, at light loads, the MOS-
FET cannot turn on as soon as a valley
is detected but must wait8 s, causing
some valleys to be ignored. However, if
the output power is at a level such that
the of-time needed for cycle-by-cycle
energy balance falls between adjacent
valleys, two or three cycles of frst-val-
ley switching may be followed by one
cycle of second-valley switching. Tis
phenomenon, known as valley jumping,
causes large variations in the switching
frequency, which are compensated by
large changes in the peak current, result-
ing in audible noise in the transformer.
Skip-cycle or frequency-foldback
operation is ofen used to reduce the
switching frequency as the frequency
clamp is reached. Tis is efective in
increasing light-load efciency, but does
not prevent valley jumping. Another
drawback of this approach is the rela-
tively low minimum switching frequency
required, typically around 30 kHz, neces-
sitating a larger transformer.
ON Semiconductors patented Valley
Lockout technique eliminates valley
jumping by locking the converter in its
selected valley until a signifcant change
in output power is detected. In the
NCP1937 this is achieved by using a gang
of comparators to monitor the voltage on
the feedback pin and feed the informa-
tion to a counter. Te hysteresis on each
comparator locks the operating valley.
In addition to this, a frequency foldback
circuit based on a VCO reduces the
switching frequency as the output power
decreases, delivering a further improve-
ment in efciency at light load.
With this innovation, which delivers
improved efciency and a better user
experience, combined with increased
on-chip integration of features essential
for correct operation of fyback/PFC
combination controllers, designers can
meet the requirements of todays con-
sumer and business electronics markets.
Demands to continue improving
the energy efciency of high-volume
electronic products such as PCs and
televisions are coming from many
directions, including governments
and eco-design bodies. For end users,
products that are smaller, slimmer,
and lighter are consistent with meeting
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IF Frequency
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HMC1015 26 - 32 +13 LO, TPL-BAL 16 - 22 -10 45 22
HMC560LM3 24 - 40 +13 LO, DBL-BAL DC - 17 -10 35 21
HMC1043LC3 26 - 32 +13 LO, TPL-BAL DC - 2 -10 35 19
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28 Cover Story
HCC ultrasound advances
diagnostic clinical procedures
Cutting-edge ultrasound research requires a high-channel-count (HCC)
system that can interface to large matrix arrays
BY DANNY KREINDLER, Senior
Director of FAE and Technical Marketing
Cephasonics, www.cephasonics.com
O
ne area of medical research
thathas beengaining a lot of
attention is shear-wave
elastography imaging. This
technique has enormous poten-
tial for medical diagnosis due
to its higher contrast properties
compared to traditional B-mode
or harmonic imaging. In shear-
wave elastography imaging, after
generating a push pulse, a shear
wave is created in the region
of interest in the tissue. This
imaging technique is done today
using one-dimensional linear
arrays that produce a less satis-
factory two-dimensional slice.
Capturing the shear-wave with
a high-channel-count (HCC)
ultrasound matrix array, and
then generating and processing
volumetric data,may lead not
only to research breakthroughs
in this field, but eventually clin-
ical adoption of new diagnosis
methodsfor many diseases,
including breast cancer.
Shear-wave elastography, as well
ascutting-edge ultrasound research in
many felds, requires an HCC ultra-
sound system that can interface to large
matrix arrays.In the past, researchers
seeking such a high channel-count
system mostly built the system on their
own. However, academic institutes found
such an endeavor to be very costly and
time-consuming, ofen running way
over budget and taking years longer than
planned to build. Afer all, universities
need to focus on conducting research
using the system; they are not set up to
build the system itself. Further, support
and continuous maintenance of a one-
of-a-kind in-house-built system is very
costly, and can result in lengthy down-
timeduring whichno research can be
conductedwith the system.
AnHCC system needs to be, in
essence, both a fexible ultrasound gener-
ator and a high-bandwidth data acquisi-
tion system (DAS). Any HCC system is
comprised ofthe fve major electronics
subsystems seen in Fig.1.
TeHCC system's ultrasound gen-
erator (TX) includes all the transmit
circuitry and digital beam formation
required to generate ultrasound pulses to
the transducer.Te ultrasound receiver
(RX)provides all analog conditioning
circuitry, the ADCs, and (optional)
digital receive beam formation required
to sample RF data from each channel
and, optionally, generate beam data from
it. Te data transportand interconnect
subsystemfundamentally includes the
multiple high-speed data links, their con-
trol, protocol, cabling, and connectors re-
quired to transport the receive data from
the RX subsystem to thehost subsystem.
Te host computer (Host)isthe
master controllerfor the system hard-
ware, including TX and RX, memory,
HDD, and so forth. Te Host contains
very high-end graphic processing units
(GPUs) toprovide researchers with fast
memory and I/O data paths, as well as
access to the high-performance compu-
tation needed to run complex research
algorithms. Lastly, there is the Power
Supply Unit (PSU), whichsupplies all
power rails to the system, including the
ultrasound-specifc high-voltage rails
required by the ultrasound generator.
Fig. 1: Te high-level block diagram for a high-channel-count systemshowsitsfve major
subsystems:(counterclockwise from upper lef) the ultrasound generator, the ultrasound receiver, the
data transport & interconnect subsytem, the host, and the power supply unit.
30 Cover Story
A realization of such an HCC system
will require a hierarchical architecture.
A baseline system of some number
of channels (typically a power or two
such as 64, 128, or 256 channels) can
be designed. Tis baseline system will
include a number of transmit and receive
channels along with all their control and
timing circuitry, and ultrasound-spe-
cifc high-voltage power supplies. In
this baseline system, the TX subsystem
consists of a number of transmitter mod-
ules that include a fne delay resolution
and multiple-level pulsing circuitry for
each channel allowing users to generate
virtually any arbitrary transmit sequence
at various voltage outputs. Since most
ultrasound transducers can use the same
elements both for transit and receive, the
baseline RX subsystem will consist of the
same number of receiver modules imple-
menting the same number of channels.
Tis symmetrical approach simplifes the
wiring between the electronics and the
transducer connector. Receive channels
will be amplifed with commontime/
gain compensation (TGC) to account for
signal attenuation with depth in the tis-
sue. Next, at the channel level, sampling
of the analog signal is accomplished by
a dedicated ADC. Sampling rates should
range up to 65 Msamples/s to comfort-
ably oversample signals in the ultrasound
bandwidth.
HCC systems inherently imply trans-
port of huge amounts of data. For exam-
ple, a 4,096-channel system, using 12-bit
ADCs sampling at 65 MHz will produce
approximately 3.2 Tbits of raw RF
channel data per second. Many research
applications indeed require all this data,
and thus the system needs to be designed
for such a "worst-case" scenario. But,
transporting and storing so much data
further upstream can be expensive, and
pointless when all that data is not needed
to accurately conduct the research at
hand. Tus, the RX module should also
implement several signal-processing
functions including demodulation, fl-
tering, and decimation. Tese functions
can be used to reduce data rates. Further,
for quick imaging or for probe placement
verifcation, a beam-formed data path
can be provided as well.
A number of such baseline systems
are then properly interconnected to
create larger systems. For example, four
1,024-channel systems can be used to
build a 4,096-channel system.
Te data transport and interconnect
subsystem is designated as its own sub-
system due to its complexity andthe very
high throughput demands placed on it,
as previously discussed. Although ofen
overlooked, the design and implementa-
tion of such a subsystem is non-trivial.
Te performance, robustness, fexibil-
ity, and viability of the system depend
on it. Te subsystem needs to support
continuous data transfer without much
limitation. In some extreme situations
where this is not feasible with raw data,
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32 Cover Story
a capture-and-store option should be
supported. For example, in a 128-channel
RX module, a 12-cm scan with 6,400 12-
bit samples at a 40-MHz sampling rate
will produce 9.83 Mb per fring (12 bits/
samples x 6,400 samples x 128 channels).
Using a fast 9-Gbit DRAM, 1,000 frings
can be stored in the front-end. Finally, a
scalable protocol for properly handling
and tagging the various sources types of
data (channel, beam, and so on) needs
to be implemented as part of any such
subsystem (Fig. 2).
Te Host complex in a baseline unit
of a very-large-channel-count system
is responsible for communicating user
commands to the front-end controller
and timing circuitry, and receiving the
very-high-bandwidth data coming from
the RX subsystemacross thedata trans-
port and interconnect subsystem. Very
high-end GPUs in the Host subsystem
are responsible for some or all of the
researcher's demanding computation
needs. In larger systems using two, four,
or more baseline systems hierarchically,
another CPU/GPU server is needed to
aggregate these baseline systems.
Te PSU has to realize the ultra-
sound-specifc high-voltage dc/dc
converter modules. Ultrasound power
supplies are nontrivial. Extreme care must
be taken to control noise in the design. A
noisy PSU can contaminate the acquired
data in many ways and may even compro-
mise the research being conducted.
Finally, the HCC system must
provide researchers full control over all
of the system's confgurability in real
time. Tis interface preferably should
abstract the hardware and low-level reg-
ister access and allow parameters to be
defned and set in high-level structures
such as scans, frames, beams, frings,
patterns, frequencies, flter coe cients,
and the like. Te acquired ultrasound
data is available to the user via a shared
memory interface.
Te 1,024- to 4,096-channel cQuest
Gri n ultrasound research system recent-
ly introduced by Cephasonics employs
much of the above-mentioned critical
architectural aspects. Tis HCC system
also combinesa MATLAB interface
topromote a fast learning curvefor sys-
temoperation, and with proven, reliable
technology to oer a much-needed 'buy'
alternative to in-house implementations.
Systems such as this willenable worldwide
ultrasound researchers to focus entirely
on conducting cutting-edge research that
will hopefully lead to revolutionary new
diagnostic clinical procedures.
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Fig. 2: Te front end of an actualHCC ultrasound system shows some of
theunique electronics needed to implement such a system.
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Panasonics latest ADW1 Series
latching-type power relay
contributes to device energy
savings. Fully IEC60335-1
compliant, this relay offers a
surge breakdown voltage of
12,000 V. Perfect for energy-
saving requirements while
capable of switching 8 A on
the contacts for applications
such as smart meters, industrial
equipment, security equipment,
home appliances and various
power supplies.
Panasonics New Hybrid design
Surface Mount Aluminum
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Bluetooth, which is based
on IEEE 802.15.1, was
developed for the purpose
of sending larger amounts
of data quickly from
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handheld devices. Key
features include high
data rate, frequency
hopping, very small form
factor and modest power
consumption.
Panasonic offers a new
Bluetooth RF module
product line that makes
connectivity between
mobile devices easily
implemented, creating a
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sensors to the Web.
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spikes. Panasonics NN30
Series has a user adjustable
output voltage and a
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Measurement Specialties
MS5805a miniature altimeter
34 Product Roundup
Sensors & Transducers
P
ressure sensors have gotten more ca-
pable and are tackling a wide variety
of applications in which measuring
pressure doesn't seem to be the point.
Among the following sampling of pressure
sensing devices from major suppliers,
you'll find devices that serve as altimeters
and replacements for ultrasonic and radar
devices, as well as ones who tackle pressure
measurement in novel ways.
Measurement Specialties (www.
meas-spec.com) recently released the
MS5805a miniature
altimeter, actually
a low-power digital
barometric pressure
sensor. Te sensor's
high precision it
integrates a 24-bit
delta-sigma ADC
suits it for portable,
battery-operated
devices such as
ftness gadgets, bike
computers, adven-
ture or multimode
watches, variome-
ters, and dataloggers. Te sensor interfaces
to virtually any microcontroller.
With a conversion time down to 0.5
ms via an IC interface, the device works
from a 1.8 to 3.6-V supply, consuming just
0.6 A in operation and less than 0.1 A
in standby mode at 25C. Te fast conver-
sion time includes an
oversampling selection
of up to 8192, allowing
exceptionally low
noise performance.
With resolution of
0.02 mbar (equivalent
to a 20 cm change in
elevation), the inte-
grated digital pressure
sensor has a pressure
accuracy of 4 mbar
for pressures ranging
from 300 to 1,200 mbar and temperatures
of 20 to 85C. Further, it is splashproof
down to 40 m and includes temperature
measurement capabilities with an accuracy
of 2C and a temperature resolution less
than 0.01C.It is priced at $5.25 per unit in
quantities of 10,000.
Te Vortex1 from Farsens (www.
farsens.com) is a battery-free RFID sensor
tag capable of transmitting pressure data
along with a unique identifer to a com-
mercial EPC C1G2. Te device features a
LPS331AP pressure sensor from ST Micro-
electronics with an absolute pressure range
from 260 to 1,260 mbar. Te tag comes
in a variety of antenna designs and sizes
to adapt the performance to the required
application. Te reading distance for the
battery free pressure sensor tag is around
1.5 m and it can be embedded in a
wide variety of materials, such as
plastics or concrete. Evaluation kits
are available.
Te tag is designed for moni-
toring pressure-sensitive assets and
process management. Tat it needs
no wiring simplifes retroftting pip-
ing systems, gas/liquid containers, or
similar assets and processes due to
the low installa-
tion investment
required and the
savings associated
to sensor mainte-
nance due to battery changes.
American Sensor Technologies (AST,
www.astsensors.com) has released the
AST46DS explosion-proof pressure
transducer with display. Available for pres-
sures from 1 to 20,000 PSI, the sensor is
price-competitive, and ofers zero function
capability, voltage or 4 to 20-mA
output signals, and all 316L
stainless steel sensor materials.
Te voltage output signal
suits oil and gas well site applica-
tions. With many
SCADA / RTU
sites powered by solar panels in remote
locations, a pressure transducer with low
current consumption can have an extended
operating life; the AST46DS can operate as
low as 8 Vdc and has current consumption
as low as 2 mA. For ofshore platforms, the
transducer housing has a special layered
Farsens
Vortex1
American Sensor
Technologies
AST46DS explosion-
proof pressure
transducer with
display
American Sen-
sor Technologies
AST4530 PVDF /
PTFE submersible
pressure transducer
36 Product Roundup
Sensors & Transducers
paint suitable for NEMA 4X environments
and salt spray conditions. Using 316L stain-
less steel, the $825 transducer is compliant
to NACE MR0175/ISO 15156.
AST has also introduced the AST4530
PVDF / PTFE submersible pressure trans-
ducer with measurement ranges from 0 to
2.5 psi up to 30 psi. Intended for liquid-level
measurement of corrosive liquids in which
stainless steel or titanium cannot survive,
the AST4530 is designed to ofer excellent
long-term survivability and stability.
Submersible pressure transducers
ofer some fexibility in comparison to
ultrasonic and radar level sensors. Vapors
generated from the liquid will not afect the
sensing element of a submersible pressure
transducer, since it is designed for optimal
compatibility. Foaming or refections of the
liquid will not generate false readings, be-
cause the sensor measures liquid pressure
based on specifc gravity.
All exposed sensor materials are
optimized for compatibility, including the
PVDF cable and seal. Changes in pressure
are transmitted through a PTFE diaphragm
and converted to an output signal using
ASIC electronics. Ratiometric 1 to 5 and 0.5
to 4.5-V outputs are available for low-cur-
rent-consumption applications, whereas a 4
to 20-mA output is available long distance
transmissions. Te $595 submersible trans-
ducers are vented to atmosphere through
the cable for optimal accuracy.
Honeywell Sensing and Control (mea-
surementsensors.honeywell.com) is now
ofering the Model S Series of subminia-
ture pressure transducers. Featuring 1%
accuracy, the sensors ft into tight spaces
with little clearance, and measure pressure
ranges from 100 to 15,000 psi. Te
rugged transducers are designed to
handle high temperatures as well
as pressures, and have a fush
diaphragm manufac-
tured from 17-4
PH stainless steel
with a high nat-
ural frequency
for applications
such as engine
and transmission test
stands, pressure brake testing, and hydrau-
lic sensor testing.
Tese transducers have a small electri-
cal zero-balance circuit board, which is in
the lead wire (approximately 1 in x 0.087
in thick); the board does not have to be at
the same temperature as the transducers.
All transducers have four strain gages in a
Wheatstone-bridge confguration.
Honeywell also introduced two new
Wing Union / Hammer Union pressure
sensors for such applications as oil and gas
drilling, mud pumps / mud logging, frac-
turing and cementing, acidizing, well-head
measurement, and standpipe stimulation.
Te model 425 is available in two accuracy
levels (0.2% or 0.1% BFSL), while the
Model 427 (0.2% BFSL) provides a wide,
shallow sensing port that facilitates seam-
less fow of more viscous media blends.
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38 Product Update
Packaging, Cabinets, and Enclosures
Keypad enclosures offer more choices
The Comtec range of sloping front keypad enclosures is now available in seven standard
sizes with external dimensions from 4.72 x 5.90 x 1.69
in. to 11.41 x 7.87 x 3.11 in. Four sizes are available
with a battery compartment aperture in the base sec-
tion which is designed for mounting an accessory bat-
tery cradle. Three types of battery cradle are offered:
one 9-V cell, two 9-V cells, or four 1.5-V AA cells.
The enclosures are molded in fine textured ABS
(UL 94 HB) and come in two standard colors:
off-white (RAL 9002) or black (RAL 9005). Priced
starting at $22, they feature a so-called softline design
with an ergonomically inclined (10) operating area to ensure comfortable operation of
controls. Typical applications include telecom equipment, intercoms, surveillance
devices, data collection, point-of-sale terminals, and a broad range of instrumentation.
OKW Enclosures: www.okwenclosures.com
Vent aims to improve outdoor enclosure
For large outdoor enclosures with a volume over 200 l, the PolyVent XL screw-in
protective vent is said to improve the enclosure's integrity, reliability, and safety in
such applications as solar power, telecommunications, and exterior lighting. The vent
meets the IP69K and UL 746C requirements, passes the IEC 62108 hail-impact test,
performs over a 40 to 125C range, and requires no maintenance for the life of the
electronics and the housing.
Changes in environmental temperatures cause air inside large-volume housings to
expand resulting in pressures that sometimes exceed 200 mbar (3 psi) which can
lead to failure of the housing seals and compromised internal electronics. The vent
Rack enclosures are strong and flexible
For high-density server and network requirements, Titan DT series rack enclosures
are said to be the strongest rack in the industry - with certified
static and dynamic load ratings of 5,400 and 3,300 lbs, respec-
tively - andoffer a broad range of rack heights (24, 42, 44, 47,
and 51 RU) and depths (36, 42, and 45 in.) to create extra space
for power, cable, and cooling management. Cable raceways are
available infour widths - 6, 8, 10, and 12 in. - to handle cable
bundles of different sizes, and door options include vented or
solid styles, including full doors or French doors with keyed
handles. Vented doors have a 77% open pattern to provide
optimal heat dissipation.
Available in 12 standard colors with a 10 year warranty, the
cabinets employ an overhead chimney design to help dissipate
thermal loads inside the rack, while hot/cold containment options
prevent air mixing and lower total cost of ownership. Mount-
ing-channel designs with finger cable management limit twisting
and sag, and other mounting-channel options can accept 1-RU
devices, freeing-up additional RU slots within the rack. Additional
options include overhead raceway choices, toolless power-strip mounting, and
heavy-duty stationary/retractable shelves. An on-line rack configurator simplifies order
specification, and racks ship with accessories mounted to user specifications.
AMCO Enclosures: www.amcoenclosures.com
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40 Product Update
Packaging, Cabinets, and Enclosures
Flameproof meter
enclosures are IECEx
certified
Now available with IECEx certification,
XJ_X series screw-cover flameproof
meter enclosures
come in 68
standard sizes,
all approved to
gas group
IIB+H2 with an
IP66 rating. The
enclosures are
available with solid cover
or viewing window.
In addition to IEC 60079-0:2011, IEC
60079-1:2007-04, IEC 60079-31:2008
international standard qualifications, the
enclosures have UL, and cUL approvals,
and are also available with certifications
rated to the ATEX Directive and
compliant with all current standards.
Adalet: www.adalet.com
can equalizes internal
pressure by allowing air
to flow into and out of
the housing at a rate of
16 l/m at 12 mbar. At the
same time, the vent
prevents liquid ingress at
a pressure of 0.3 bar for
60 s (equivalent to water
immersion to a 3-m depth). This
capability lets manufacturers simplify
enclosure design and protect electronics
without adding stronger seals or extra
bolts, which can results in substantial
savings.
W.L. Gore & Associates: www.gore.com/
en_xx/products/venting/protective/index.
html?xcmp=iga_ptv_pr_xl
Tablet enclosures tout
lower cost, not quality
Suited for portable, desktop or wall
mounted electronic applications,
TB-3261x series tablet enclosures are said
to be 20-30% less expensive than leading
competitive enclosures but do not cut
quality. Costs
depend on
size and range
from $7 to
$32, with
discounts for
quantity
pricing. The enclosures are made from
high-impact ABS plastic that is flame
retardant to UL94-VO (white color) and
UL94-HB (black color).
The enclosures are available in a range
of sizes from 5.5 x 3.9 x 1.2 in. to 12.7 x
9.1 x 1.2 in. and feature a recessed area
for a touch or LCD screen. The design
uses tongue-and-groove sealing to offer
high protection from dust and moisture;
with an optional silicone sponge gasket,
the enclosures achieve an IP65 rating for
waterproofing and dust.
Bud Industries: www.budind.com/
New Products 41
96% efficient, buck converter
demo board uses eGaN FETs
Te EPC9107 is a fully functional buck
power conversion demonstration circuit
board that features a 9 to 28-V input with a
3.3-V 15-A-maximum-output 1-MHz buck
converter. It uses theEPC2015eGaN FET
in conjunction with theLM5113100-V half-
bridge gate driver from Texas Instruments.
Te demonstration board is 3 in. square
Dc/dc converters feature 20-kV isolation
Te DIO 120 series of dc/dc converters power electronic circuits foating on several
kilovolts of operating voltage. Tey are typically used for high-power gate drivers and
similar applications in oil and gas, mining, railway, and industrial environments.
Te 120-W converters accept a single-input 24- or 48-Vdc and deliver 12-, 15 or
24-Vdc (5-A current limit) output. Tey are tested for corona (partial-discharge)
extinction at a minimum of 10 kVrms and hi-pot tested for 20 kVrms. Te feedback
system on the primary side employs a sensing circuit instead of optical components,
for improved reliability. Typical operating voltage potential between primary and
secondary is 2 to 5 kVrms. Tese convection-cooled units are rated for operation
from 20 to 50C. Tey are fltered to meet EN55022 Class A conducted and radiated
requirements and comply with UL 508 and equivalent industrial safety standards.
Absopulse Electronics: www.absopulse.com
www.globtek.com
Need Power?
Think
GlobTek
Green Power Supplies Meet Efficiency
Level V Requirements 90W
Desktop style
Power
Supplies with
IEC 60320/
C6, C8 or C14
inlets have
Double-
Enforced In-
sulation Mechanical Configurations, Reg-
ulated Outputs voltage from: 12 to 48Vdc
in 0.1V increments, up to 90W of cotinu-
ous output power. GlobTeks GT-41133
series of enclosed power supplies are
housed in Impact Resistant non-vented
Polycarbonate Case, Thermal conduction
Cooling, Case Dimensions: 62 x 150 x 34
(mm). This Family features: Regulated
output with very low ripple, Built-in
...for more click www.globtek.com
Lithium Ion
(Li-Ion) Battery
Charger
In response to in-
creased concern
and requirements
of portable equip-
ment and device manufacturers for safety
related to Lithium Ion (Li-Ion) batteries,
GlobTeks latest generation battery
charger designs include numerous redun-
dant safety features which when commu-
nicating with electronics in Lithium
(Li-Ion) batteries prevents failure or
damage of the battery pack during charg-
ing. Aside from safety, the charger in-
cludes many features to maintain and
lengthen battery life. The GlobTek GT-
93023-12012(R) is a customized bespoke
multiple-bay battery charger designed to
charge 5 battery packs in unison. The
International Power Cordsets
This wide range of
international power
cordsets are ap-
proved to interna-
tional safety agency
requirements. De-
signs are available
in various lengths,
cable types, conductor gauge, termination,
and jacket color. Cordsets are ideal for
portable equipment, communication,
video, power tools, consumer electronics
or industrial and medical equipment.
Many designs are available
ISO
9001:2008/
13485/14001
Certified
Power Sources
42 New Products
40-W LED drivers feature line V dimming
Te LED-40W-TL family of dimmable constant-current
drivers is designed for simple dimming control of LEDs. Te
40-W LED drivers feature line voltage dimming and each unit
includes leading-edge (incandescent) and trailing-edge (ELV)
dimming. Te
drivers feature
a <10% to 100%
dimming range,
and are com-
patible with
industry-stan-
dard controls.
Five con-
stant-current
driver models
ofer diferent
output currents. Input voltage is 120 Vac or 230 Vac version.
Te thermal plastic enclosures are IP66 rated and are suit-
able for outdoor wet location applications. Te drivers ofer
over-voltage, over-current and short circuit protection. Tey are
UL Recognized for both US and Canada, and are CE certifed.
Thomas Research Products: www.trpssl.com
Ac adapter supply now operates -40 to +40C
Te GT-43007 wall plug in power supply ac adapter have been tested, certifed, and
upgraded to operate from-40 to +40C. Te adapter is available in Class II, two-
prong, interchangeable blade confgurations.
It has individual feld replaceable input plugs
for North America/Japan, Europe, United
Kingdom, Australia and New Zealand, Chi-
na, Korea, Argentina, India, Brazil, and an
IEC320 type confguration.
Te adapter power supply has an input
range from 90 to 264 Vac at 50 to 60Hz and
a factory confgurable output from 5 to 48-
Vdc with a maximum of 40-W continuous
output. It complies with North American
Energy Star, Canadian NRCAN, and other worldwide requirements for Level-V
efciency compliance and is produced in an ISO9001, ISO13485, and ISO14001
certifed facility. Te product is suitable for most applications requiring dc-power
and common applications include medical devices, portable electronic devices, toilet
sensors and actuation devices, home automation and control
equipment, appliances, instruments, and as a power source for
li-ion battery chargers.
GlobTek: www.globtek.com
POWERGATE LLC 866-588-1750 www.powergatellc.com
Power Sources Unlimited 800-966-7784 www.psui.com/traco
150 Watt DC/DC-Converter
Most reliable and easy to install
New Models
43160 VDC input voltage range
www.tracopower.com
Compact dimension: 4" x 2" x 1.5"
Ultra-wide input voltage ranges: 936, 1875, 43160 VDC
Constant current output characteristic for battery load applications
Output voltages: 12, 15, 24, 28, 48 VDC, adjustable +20%
Meets FCC class A without external components,
optional EMI filter to meet FCC class B
Protection against: over-temperature, overload, short circuit,
over-voltage, under-voltage and reverse voltage on input
Very high efficiency up to 89%
Wide operating temperature range: -40C to +75C
TEP 150WI Series
Picture with optional
EMI filter for FCC class B
and contains a closed-loop buck converter with optimized control loop. Te complete
power stage including eGaN FETs, driver, inductor. and input/output caps is in a 0.5
x 0.5-in. layout. Te demo boardcontains various probe points to facilitate simple
waveform measurement and efciency calculation.
Effcient Power Conversion (EPC): www.epc-co.com
Power Sources
New Products 43
DC link capacitors offer high
energy density
Te type 948D high energy density DC
link capacitors target larger inverter sys-
tems where high bus voltage, capacitance
and ripple current ratings are required
for smoothing and fltering. Te devices
ofer 990 to 2700 F with rms current
ratings up to
160 A and
voltage
ratings
of 800
to 1300
Vdc.
Te
capacitors
are housed in a plastic
rectangular package that is nearly a cube
with 6.5 inch sides. Typical ESR varies
from 0.7 to 1.1 m, ambient operating
temperature is -25 to 70C, and induc-
tance is only 42 nH. From $75 ea/OEM
quantities with 4 to 10 week lead times.
Cornell Dubilier: www.cde.com/
Thermistor probes have
M12 connections
Te TH-21 Series thermistor probes are
construct-
ed with a
glass-en-
capsulated
thermistor
element that
provides
excellent
stability
and accura-
cy. With a
continuous temperature rating of 80 to
200C max, and intermittent operation
to 250C, these sensors can be used in
applications previously out of reach of
epoxy-coated thermistor sensors. Priced
from $65 each, the probes can be ordered
in any length, but a minimum immersion
depth of 1.5 in. is recommended. Te
probes suit laboratory, R&D, automation
and automotive applications.
Omega Engineering: www.omega.com
or send direct for
free PICO Catalog
Call Toll Free 800 431-1064
Fax 914-738-8225
E Mail: info@picoelectronics.com
from
low-
profile
.18"ht.
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U
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F
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C
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M
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(a
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le
)
T
r
a
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o
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m
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r
s

&

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d
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o
r
s
Size
does
matter!
Audio Transformers
Pulse Transformers
DC-DC Converter
Transformers
MultiPlex Data Bus
Transformers
Power &
EMI Inductors
See Picos full Catalog im
m
ediately
w
w
w
. pi coel ect roni cs. com
PICOElectronics, Inc.
143 Sparks Ave. Pelham, N.Y. 10803-1837
Delivery - Stock to one week
Al N Power Resistors & Terminations
N-Series
Power Ratings to 380W
Characterized to 40GHz
8 Sizes- 0505 to 3725
Values 10 to 2K
Solder, Epoxy or Wirebond Terminals
4 Weeks Max Lead Time!
Thick & Thin Film Resistors
RCI Series & TPI Series
8 Sizes - 0201 to 2512
Tolerances to 0.1%
Power ratings to 2W
Values 0.068 to 22M
RoHS Compliant Nickel Barrier Terminals
Millions in Stock!
Since 1974
Components & Subassemblies
44 New Products
PCIe daq card offers faster streaming,
sampling
A next-generation PCIe
instrumentation platform,
UltraFast UF4eofers
increased streaming band-
width and higher sampling rates. Acquisition data is stored inside
a 4-Gbyte on-board bufer and can be read out at more than 3
Gbyte/s through the PCI Express x8 Gen2 bus. Te plug-in cards
are compatiblewith Gen1 and Gen3, and need a PCI Express slot
with 8 or 16 physical lanes. Te frst released model, the UF4e-
4451-x8, comes with four channels, a signal bandwidth of 250
MHz, and 500-Msample/s synchronous sampling speed at 14 bit
ADC resolution.
To optimize data storage and bus transfer, repetitive signals can
be stored in separate segments using Multiple Recording mode
while transferring data in parallel, a feature that is particularly use-
ful for radar applications. Te card is also equipped with diferent
acquisition modes like single-shot, streaming (FIFO), gated (Gated
Sampling), or the combination of segmented acquisition of fast
signals in parallel to slow continuous data recording (ABA mode).
All trigger events can be time stamped using either the internal
clock circuit or an external time reference signal. All features of the
card are supported by the UltraFast SBench 6 sofware which runs
native under 32- and 64-bit Linux as well as Windows.
Strategic Test: www.strategic-test.com
3 outputs, with 1 channel isolated
for more flexibility
Max. power up to 195W
Low ripple noise: <350Vms/2mVpp
Fast transient response time: <50 s
Standard OVP/OCP/OTP protection functions
Supports output delay, analysis,
monitor and preset functions
USB host & device, LAN, RS232, and digital IO
DC Power Supplies
NEW! DP800
Configure & Analyze more
Signals and Measurements
at an Exceptional Value!
Buy online @ RigolPower.com
COMPARE & SAVE
Starting at
$
409
Radio tester analyzes impact of applications
on mobile devices
Te R&S CMW500 wide-
band radio communication
tester equipped with the
R&S CMW-KM051 option
is the world's frst integrat-
ed end-to-end test solution that examines the impact applications
have on smartphones and the network using IP and protocol
statistical analysis. Te tester can analyze and test IP-based ap-
plications using the ipoque deep packet inspection (DPI) engine.
Te combination of RF, protocol and application testing in a single
instrument allows network operators, smartphone manufactur-
ers and application developers to test how mobile apps afect the
performance of wireless communication devices and the networks
on which they operate.
Te radio comm tester provides a real-time testing environ-
ment for wireless communications networks such as LTE, WCD-
MA and WLAN. Using the integrated data application unit, the
instrument combines standard RF testing requirements with the
IP world. Te R&S CMW KM051 option helps analyze and test
IP-based applications, giving network operators a way to qualify
applications or optimize them for their networks. Smartphone
manufacturers can also obtain more precise information on how
certain applications afect resources such as battery capacity.
Rohde & Schwarz: www.rohde-schwarz.com/
Test & Measurement
New Products 45
Connectors suit next-gen devices
For applications such as solid-state drives and wireless cards used in advanced por-
table devices and tablets, as well as desktops and servers, M.2 next-generation form
factor (NGFF) connectors are designed to meet
market needs for slim solutions. Te competitively
priced miniaturized connectors not only support
higher data rates such as PCI Express 3.0, SATA
3.0, and USB 3.0, but also save more than 20% of
PCB real estate and reduce profle height by 15% (as compared to
PCI Express Mini Card connectors).
Versions have either a standard top or a midplane (ofset) PCB mount. Te con-
nectors accept both single- and double-sided modules, have 0.5-mm pitch with 67
positions and, through several keying options, ensure proper mating with module cards.
TE Connectivity: http://www.te.com/support-center/
LOCAs cure rapidly with UV, moisture
Loctite 5191 and 5193 silicone liquid, optically clear adhesives (LOCAs) feature a pat-
ented chemical breakthrough that increases cure speed and improves optical properties.
Designed for bonding of cover lenses or touch panel sensors directly to LCDs, the adhe-
sives are compatible with either 365-nm (UV) or 405-nm (violet) LED light sources.
5191 cures on exposure to UV light and is easier to handle in some cases, while 5193
cures on exposure to moisture as well as UV. Te low viscosity LOCAs require only
2,000 mJ for full cure in less than 2 s, anda 750-m thick lamination has a b* value of
0.3 for yellowing and 0.2% haze afer 500 hrs QUV aging.
Henkel: www.henkelna.com/industrial
www.masterbond.com
Hackensack, NJ 07601 USA +1.201.343.8983
mainmasterbond.com
Featuring the newest:
white papers
videos
e-newsletters
technical tips
mull this over
Stay informed with
the latest in adhesive technology
Visit our
resource library
Packaging & Interconnections
46 New Products
Color LEDs offer industrys highest efficacy
Te XLamp XP-E2 color LEDs deliver up to 88% higher
maximum light output compared to alternative high-power
color LEDs.
Built on the SC
LED platform
technology,
the color LEDs
deliver higher
lumens-per-watt
and lumens-per-
dollar compared
to the original
XP-E color LEDs.
Te color
LEDs feature
a 3.45 x 3.45-mm footprint and are optically compatible
with the original XP-E LED providing drop-in-ready
performance enhancements. Te LEDs deliver up to 1,409
mW for royal blue, 109 lumens for blue, 253 lumens for
green, 203 lumens for amber, 193 lumens for red-orange
and 155 lumens for red, all at maximum drive currents. Te
devices have a 5C/W thermal resistance, a viewing angle of
110 to 135.
Cree: www.cree.com/modules
Multi-touch control wheel reads gestures
Te T2 Multi-Touch Control Wheel (MTCW) series is part
of its Instinct Touch Technology control system. It enables
the system to interpret fnger gestures for machine command
and image manipulation.
It has a diameter about
4.5-in. and is available in
standard white, black or
custom colors. Te device
ofers the functionality of
four devices, including a
multi-touch touchpad, a
virtual 4 to 256-position
rotary encoder, a virtual
four-position joystick, and a
proximity sensor.
Te MTCW suits
medical imaging, gaming, industrial control, and of-highway
equipment. It can be used in any application where instinctive
and intuitive fnger movements can be used to initiate a variety
of commands. Te device provides a gesture recognition library
to track movements on the devices touch pad, using as many
as fve fngers at a time. Te data is then read as gestures, which
are fed to the users application or operating system.
Grayhill: www.grayhill.com
Paper Tube Company
1033 S. Noel Ave., Wheeling, IL 60090
5 - The Original
To receive literature & details fast - www.pptube.com
Phone: 847-537-4250 Fax: 847-537-5777 E-Mail: sales@pptube.com
DuPont Co.
420F, 720 VPM!
High Temperature - High Dielectric
NOMEX
for Electrical/Electronic
Tubing, Bobbins, Fabricated Parts
Widely specified for its excellent electrical,
thermal and mechanical properties
Nomex tubing is produced by Precision
with an exclusive, special binder to
provide a thermally
stable class H
insulating tubing.
U/L Recognized.
re Mo Than 7 Years
Optoelectronics
New Products 47
HIGHLIGHT OF THE MONTH
Linear regulator targets high-in/out applications
Te LT30811.5-A linear regulator has an extended safe operating
area (SOA) compared to existing regulators, making it suit-
able for highinput-to-output voltage and high-output current
applications. It uses a current-source reference for single-resistor
output-voltage settings and output adjustability down to 0 V.
Output current limit can be set externally
with a single resistor.
Te linear regulator architecture,
combined with mV regulation, enables
multiple ICs to be paralleled for heat
spreading and higher output current. Te
device achieves line and load regulation
of <2 mV independent of output voltage
and features an input voltage range from
1.2 to 40 V. Te device suits multiple-rail
LIN xceiver is robust, low
power, low cost
Te MLX80030 LIN transceiver provides
slew rate control for best EME behavior,
is highly EMI resistant, and meets IEC
61000-4-2 for enhanced ESD robustness.
Te chip combines a physical layer LIN
transceiver (LIN 2.x
and SAEJ2602)
with a 3.3
V/70 mA
voltage
regulator and
has a RESET
output for the
system MCU.
Te ICs baud rate is up
to 20 k and it provides a high impedance
output in case of loss of ground or battery.
Te compact SOIC8 packaged transceiver
costs only $0.34 ea/50,000 and takes only
750 A typical and 1,500 A maximum
from a 5 to 18 V supply. Sleep mode cur-
rent is 30 A maximum over the devices
-40 to 125C operating range.
Melexis Microelectronic Systems:
www.melexis.com
applications. Output voltage is programmable with a single re-
sistor from 0 to 38.5 V with a 1.2-V dropout. Te
on-chip trimmed 50-A current reference is 1%
accurate. Te LT3081 is ofered in a variety of
thermally enhanced surface-mount compatible
packages.
Linear Technology: www.linear.com
PCM
Data
Interface
BICK
LRCK/DSDR2
SDATA1/DSDL1
Control
Register
CSN/SMUTE
CCLK/DEM0
CDTI/DEM1
CAD0/
SD
CAD1/
DIF0
PSN DZF/
DIF1
DIF2
8x
Interpolator
Modulator
AOUTLP1
AOUTLN1
VREF VREFH1
VREFL1
DATT
SMUTE
SDATA2/DSDL2
DATT
SMUTE
8x
Interpolator
Modulator
SCF
AOUTRP1
AOUTRN1
AOUTLP2
AOUTLN2
AOUTRP2
AOUTRN2
VCOM1
VREF VREFH2
VREFL2
VCOM2
Clock
Divider
MCLK
DSD
Data
Interface
TDM/DSDR1
32-bit Quad DAC with Low Latency
For more information visit our website at:
http://www.akm.com
Contact our technical support staff at:
1-888-AKMSEMI (256-7364)
E-mail: icinfo@akm.com
New 4-Channel Audio DAC Family
For Audiophile and Pro Audio Applications
The AK4413 and AK4414 are four-channel, high performance audio
DAC's. The AK4414 features a 32-bit digital filter path, while the
lower-cost AK4413 utilizes a 24-bit digital filter path. The devices
deliver 120dB dynamic range at very low latency. The AK4414 offers
very low THD+N at -107dB. There are four selectable digital flter
options. Both devices can be operated in stereo mode, boosting
dynamic range to 123dB.
Featuring Multiple Digital Filter Options
AK4413/14 Features
AK4414: 32-bit four-channel audio DAC
AK4413: 24-bit four-channel audio DAC
- 120dB dynamic range (123dB in stereo mode)
- Very low THD+N: -107dB (AK4414), -104dB (AK4413)
Voltage outputs enable simple confguration
Four selectable digital flter options:
- Standard FIR, sharp or slow roll-off (29/fs or 6/fs latency)
- Short delay, sharp or slow roll-off (7/fs or 5.5/fs latency)
44-pin LQFP package
Low power operation
- 5V analog, 3V digital, 225mW power consumption
Buy Now
Integrated Circuits
Absopulse Electronics Ltd. 42
Agilent Technologies, Inc. Cover 2, 18, 39
AKM Semiconductor, Inc. 47
Allied Electronics Inc. Cover 3
AMCO Enclosures an IMS Engineered Products Brand 14
API Technologies Spectrum Controls 11
Avnet Electronic Marketing 3
Coilcraf CPS 2
Coilcraf, Inc. 10
Cosel USA, Inc. 31
Data Modul Inc 12
Datatronics Distribution Inc. 30
Digi-Key Corporation Cover 1, 1, 35
Equipto Electronics Corp. 40
Floyd Bell Inc. 34, 48
GlobTek, Inc. Cover 1, 41
Hammond Manufacturing Company Inc. 38
Hioki USA Corporation 23
Hittite Microwave Corporation 27
International Manufacturing Services Inc. 43
International Rectifer 25
Linear Technology Corporation Cover 4, 13
Master Bond Inc. 45
Maxim Integrated 37
Melexis 36
MICROMO Electronics, Inc. 29
Mill-Max Manufacturing Corp. 19
Minmax Technology Co., Ltd. 41
Mornsun America 5
Mouser Electronics 7, 16, 17
National Instruments 15
Newark/element 14 9
OKW Enclosures, Inc. 45
Panasonic Industrial Company 33
Pico Electronics, Inc. 43
Positronic Industries 21
TRACOPOWER 42
Precision Paper Tube Company 46
Rigol Technologies 44
RTG, Inc. 46
TAIYO YUDEN (USA) INC. 32
Universe Kogaku (America), Inc. 48
48 Product Mart
Electronic Products Presented by the Manufacturer
Turbo Light
Waterproof Led Panel Indicators

Tiny (approx.1x1) LED Panel Indicators provide BRIGHT
output with super-sleek design. Available in variety of voltages
and output up to 14,500 cd/m2! Rugged, tamper-proof, lo-
profle panel mount design is IP68 and NEMA 4X. Available
in 5 colors and 3 brightness levels. ISO 9001:2000 registered
company all products made in the USA.
Floyd Bell Inc.
Tel: (614) 294-4000
Fax: (614) 291-0823
sales@foydbell.com
www.foydbell.com
Very High Resolution, Low Distortion Lenses
Very High-Resolution 29MM F/3.0 lens with minimal distortion and
a fat feld, used for measurement, machine vision and other high
performance applications. Custom packaging, integrated flters and
custom aperture ratios available. View outline drawing and detailed
specs. Compatible with our focusing C-Mount adaptor. 19mm
barrel, offered in a wide range of focal lengths. Design assistance
available for custom lens assemblies.
Universe Kogaku Lenses
Tel: 516-624-2444
info@ukaoptics.com
www.ukaoptics.com/
new_top-29.html
Ultra Loud Piezoelectric Alarms
Ultra Loud selection of piezoelectric whoops, warbles, sirens,
beeps and more offers 1000Hz lower frequency than industry
counterparts. Available in variety of voltages and output up
to 108dB! Rugged panel mount products are IP68 and NEMA
4X when used with optional gasket. ISO 9001:2000 registered
company all products made in the USA.
Floyd Bell Inc.
Tel: (614) 294-4000
Fax: (614) 291-0823
sales@foydbell.com
www.foydbell.com
Voice-Capable Alarms Replace Ambiguous Beep
Sometimes a beep or whoop doesnt convey enough
information.
Announcer Series alarms from Floyd Bell play a pre-recorded
audio message or voice instructions up to ten seconds
(up to 90dB).
Choose from standard messages (Warning!), or custom
message production. Announcer Series alarms come standard
with quick connect terminals
and voltage range to ft your
application.
Floyd Bell Inc.
888-FLOYD-BELL
sales@foydbell.com
www.foydbell.com
For Reprints contact Wrights Media 877-652-5295
Audiolarm II

Piezoelectric Alarms
The industrys largest selection of piezoelectric whoops, warbles,
sirens, beeps and more. Available in variety of voltages and
output up to 103dB! Rugged panel mount products are IP68
and NEMA 4X when used with optional gasket. ISO 9001:2000
registered company all products made in the USA.
Floyd Bell Inc.
Tel: (614) 294-4000
Fax: (614) 291-0823
sales@foydbell.com
www.foydbell.com
ADVERTISER INDEX
This index is provided as an additional service.
The publisher does not assume any liability for errors or omissions.
Explore our Automation and Control Specialog and our
Control Cabinet Product Finder at alliedelec.com/control
Allied stocks all the top brands under one roof.
The Best in Automation & Control
Allied Electronics, Inc 2013. Allied Electronics and the Allied Electronics logo are trademarks of Allied Electronics, Inc. An Electrocomponents Company.
1.800.433.5700
Tiny All-in-One
14-Bit 4.5Msps SAR ADC
Complete 14-Bit/12-Bit Pin-Compatible SAR ADC Family Features
4.5Msps Throughput Rate
Low Noise: 77.5dB SNR, -85dB THD
(5V Supply)
3.75LSB INL, 0.99LSB DNL Max
(5V Supply)
Low Power: 31mW at 4.5Msps
(5V Supply)
Flexible 3V or 5V Supply Operation
Internal Reference: 2.048V or
4.096V Span
Guaranteed Operation 40C to 125C
8-Lead TSOT-23 Package
2312-14 2313-14 2314-14
2312-12 2313-12
500ksps 2.5Msps 4.5Msps 5Msps
14-Bit
12-Bit 2315-12
Power
Consumption
3V/5V
8mW/14mW 14mW/26mW 18mW/ 31mW 19mW/ 32mW
20ppm/C Max Integrated Reference in 8mm
2
TSOT
The LTC
2314-14 leads a family of highly integrated 14-/12-bit Successive Approximation Register (SAR) ADCs from 500ksps
to 5Msps, available in tiny 8-lead TSOT-23 packages. These ADCs integrate a precision bandgap reference with guaranteed
20ppm/C maximum temperature coefficient and an internal reference buffer in an 8mm
2
footprint, saving space in high density
designs. They offer the flexibility of 3V or 5V supply operation and low power consumption, including nap and sleep modes.
Info & Free Samples
1-800-4-LINEAR
www.linear.com/LTC2314-14
AUGUST 2013
Also
In This ISSUE:
SiC power devices improve
efficiency, performance, cost
What you need to know about
the wide-temperature UPS
Source guides: Who makes
what for power projects
Control the
HEAT with no
compromise
p4
A Hearst Business Publication

Twelfth Annual Supplement to Electronic Products Magazine
1 2 t h A N N U A L P O WE R S U P P L E ME N T
More New Products
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Power Supplement Contents 3
ELECTRONIC PRODUCTS POWER SUPPLEMENT electronicproducts.com AUGUST 2013
MEGA Electronics Inc.
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FEATURES
Innovative technology ofers no-compromise PoL designs......................................4
SiC power devices improve efciency, performance and cost..................................8
What you need to know about industrial UPSs .......................................................12
Cost-efective sync rectifcation in ac/dc supplies ...................................................15
Power Vents: Market analysis .....................................................................................20
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DC/DC power supplies................................................................................................27
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Digital Imagery by Don Wilber
4 Power Supplement
AUGUST 2013 electronicproducts.com ElEcTronic ProdUcTS PowEr SUPPlEmEnT
Innovative technology offers
no-compromise PoL designs
Breakthroughs in thermal encapsulation, packaging innovations, and digital
capabilities enable dc/dc power solutions with little compromise
BY KARIM WASSEF, Product Line
Director, GE Critical Power
www.gecriticalpower.com
H
istorically, designers searching
for low-profile, completely dig-
ital point-of-load (PoL) power
supplies only found compromises. The
device they found might be digital, but
too large or too tall; or it might have a
limited input/output range and insuffi-
cient output current at real application
temperatures and conditions. Or it could
have been thermally challenged, or it re-
quired an independent external voltage,
meaning extra devices, extra costs, and
various and sundry difficulties in design
and manufacturing.
Breakthroughs in thermal encapsu-
lation technologies, packaging innova-
tions, and, of course, digital capabilities
have enabled dc/dc power solutions
with little compromise. Some modules
can achieve 40% greater power density
over comparable previous-generation
devices, 95% efciency, a wide oper-
ating range (3 to 14.5 V
IN
with 4.5 to
5.5 V
OUT
) and real power throughput
of 12 A in less space than any other
full range module with a 20.32 x 11.43
x 3-mm footprint. By coupling these
achievements with manufacturing
innovations that allow deployment
anywhere on circuit boards top or
bottom sides and even on mezzanine
daughtercards designers now dont
have to settle for less.
Keeping its cool
Although several advancements were
needed to make these all-in-one power
modules possible, one of the most critical
was a new generation of encapsulation
technology. Encapsulation is usually con-
sidered a thermal management technol-
ogy and this new generation of modules
certainly excels at difusing heat uniformly
across the device, but just as important are
some of the other efects that these new
encapsulation techniques have enabled.
Innovations in materials science have
played a huge role in improving encapsu-
lation technology, but other factors, such
as how the material is applied, the design
of the power module itself and the preci-
sion of the modules fabrication environ-
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Power Supplement 5
ment are just as critical to more efective
thermal performance.
One of several benefcial efects of
better heat dissipation from innovative
encapsulation technology has been
unmatched power density without sac-
rifcing features. Because these modules
can move heat away from hot spots and
shif it to other areas, the device is able to
output more current than similarly sized
modules. In fact, based on real-world
performance benchmarks, one example of
such a device, the SlimLynx module, has
shown that it can output up to 12 A with
12 V
IN
and 1.2 V
OUT
at 75C (seeFigs. 1
and2) with no additional airfow. Even at
the rated full output power of 66 W with
12 V
IN
, 12 A, and 5.5 V
OUT
, such devices
can operate without derating at over 60C
without any airfow. Tis represents 95 W/
cm
3
without air cooling. Tis outstanding
performance can even be achieved in a
closed box. High-quality encapsulation
technology such as this can accelerate a
new products time to market because
design and manufacturing processes are
simplifed.
Fig. 2: Plot of the e ciency of the SlimLynx
module at 12 V
IN
and 25C for various output
voltage set points.
Fig. 1: ermal derating of the SlimLynx
module at 12-V
IN
for various output voltage
set points.
SURGE PROTECTORS
6 Power Supplement
AUGUST 2013 electronicproducts.com ElEcTronic ProdUcTS PowEr SUPPlEmEnT
In manufacturing, for example, some
low-profle digital PoL power modules
cannot survive the higher refow solder
temperatures required by certain lead-
free RoHS-compliant processes. Tis
signifcantly reduces the markets that the
end product can address, which limits its
value. When the encapsulation technol-
ogy of a PoL module can withstand the
higher refow solder temperatures, it can
be deployed globally without sacrifcing
power performance.
Gateway to digital innovation
Besides advanced encapsulation, a few of
the 3-mm-high full-range PoL modules
are digital, which means the device can
act as a gateway or portal into the world
of digital innovation. In addition to sav-
ing room on a board design for greater
functionality by integrating the many
associated resistors, capacitors and other
types of devices that usually accompany
analog solutions, these digital dc/dc sup-
plies also include digital communications
capabilities. Some even conform to the
Distributed Power Open Standards Alli-
ance (DOSA) specifcation, and support
inter-integrated-circuit (I
2
C) connectivi-
ty with Power Management Bus (PMbus)
protocol functionality.
Trough this digital portal, these
modules give designers, users, and even
the systems operating frmware the kind
of visibility that had previously been im-
possible. Designers might use this access
to monitor the ongoing power conditions
of the system so the power set points
may be altered dynamically. Tis insight
can be a powerful debugging tool during
development and a useful access method
for controlling the power parameters of a
system remotely.
For example, during the develop-
ment of a high-speed, high-throughput
communications board for wireless
base stations the designer could moni-
tor the power consumption of a critical
feld-programmable gate array (FPGA)
and discover that the device is consum-
ing far more power than expected. A
further analysis of how the frmware is
being processed by the FPGA could lead
to code revisions that yield more efective
code execution and reduced power
consumption. Of course, this is just the
tip of the iceberg when it comes to what
can be accomplished through the digital
capabilities of this new breed of digital
POL modules. Te only real limitations
on such devices are the ingenuity and
creativity of designers.
Ease of use
Other innovations in packaging tech-
nologies also make these devices easy to
be designed into new product designs
and to be assembled onto high-quality
circuit boards. For instance, some feature
innovative solder grid array packaging
that can simplify design, improve man-
ufacturing yields, and increase reliability
in the feld.
Tis type of ball-grid-array packag-
ing technology incorporates additional
Power Supplement 7
ElEctronic Products PowEr suPPlEmEnt electronicproducts.com AuGust 2013
controlled solder bumps on the underside
of a surface-mount (SMT) power module.
Tis reinforces the solder joint reliability
of an assembly by providing additional
points where the module attaches to the
underlying circuit board. Tese extra
solder bumps ensure that each pad mates
with the main boards solder paste during
manufacturing. Moreover, the extra solder
bumps function in concert with the mod-
ules encapsulation technology to increase
the thermal efciency of the device and
the system. Te interconnect resulting
from power grid array packaging can
improve heat transfer from hot spots on
the module, resulting in a more uniform
temperature distribution between the
main circuit board and the power module.
Encapsulation, advanced packaging, and
other features make it possible for a few of
these new modules, such as the SlimLynx,
to drive the full load rating of 12 A at 75C
with no airfow at all.
Of course, todays densely populated
circuit boards ofen challenge designers
to fnd any real estate on a design for PoL
power modules. Because of the low pro-
fle and slim dimensions (20.32 x 11.43
x 3 mm) as well as the rectangular shape
of some all-in-one PoL devices, design-
ers can ft the module where one could
not have been placed previously. In fact,
the relatively narrow rectangular shape
requires less board space than a square
confguration and lets designers place
the device on narrow "runway" areas of
the board that are not well suited to the
typical square device. Additionally, un-
like some older modules, certain devices
in this new generation of dc/dc supplies
have advanced mechanical construction
that makes them compatible with reverse
solder refow. As a result, they can be
placed on the back side of a board even
though this would require a second pass
through refow.Alternatively, the module
could be designed into a mezzanine
daughtercard assembly, saving mother-
board real estate that the designer could
devote to other resources or capabilities.
Te continuous, clean, and fat surfaces
of some of these modules also make
them compatible with high-speed pick-
and-place assembly machines, accelerat-
ing the manufacturing process further.
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8 Power Supplement
AUGUST 2013 electronicproducts.com ELECTRONIC PRODUCTS POWER SUPPLEMENT
SiC power devices improve
efficiency, performance and cost
SiC power devices are ready to impact mainstream
power applications in solar inverters, motor drives,
and other industrial power converters
BY PAUL KIERSTEAD
Director of Marketing, Cree, SiC Power
www.cree.com/
W
ith the latest introductions of
next-generation silicon carbide
(SiC) MOSFETs and diodes,
SiC power devices are ready to impact
mainstream power applications in solar
inverters, motor drives, UPS systems, trac-
tion, and wind and other industrial power
converters. Benefits from their inherent
switching efficiency, ruggedness, and high
power density can reduce power consump-
tion in power converters, increase the
productivity of alternative energy systems,
or significantly reduce the size, weight, and
cost of systems by enabling higher switch-
ing speeds as compared to silicon-based
solutions. SiC power devices are now
being introduced by many vendors, and,
most important, SiC switch technology is
maturing, with several vendors introducing
or sampling SiC MOSFETs. Crees intro-
duction of its second-generation MOSFET
technology including 50-A MOSFETs
and Schottky diodes at 650, 1,200, and
1,700 V is a prime example.
Te key to realizing the potential ben-
efts of these new SiC devices is targeting
the right applications, knowing how to
choose the right-size devices for a given
system, and optimizing performance
with particular design goals in mind.
New SiC component costs are coming
down signifcantly and, by taking full
advantage of their capabilities, system
designers can make higher-performing,
higher-efciency, and lower-cost systems.
In most applications requiring blocking
voltages above 600 V, SiC MOSFETs will
be competing with silicon IGBTs. Te SiC
MOSFET has signifcant switching-ef-
ciency benefts derived from its unipolar
architecture. IGBTs depend on bipolar p-n
junctions to block and conduct. In contrast,
the MOSFET is a feld-efect device with
no p-n barrier junction to dissipate and no
resulting tail currents that waste energy like
the IGBT. SiC MOSFETs have only 20%
of the switching losses of silicon IGBTs at
Power Supplement 9
2
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s
www.murata-ps.com/ac-dc
For more information email: sales@murata-ps.com
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1,200 V and less than 15% of the losses of
1,700-V silicon transistors. Tese benefts
grow as switching frequency increases.
Less obvious are the potential advantag-
es in conduction losses from the MOSFET.
Figure 1 shows the characteristic IV curves
for a 50-A IGBT and a SiC MOSFET cho-
sen to match voltage drop at the maximum
50-A rating. SiC MOSFETs have a linear
on-resistance across the devices entire
operating range. In contrast, the IGBT
acts as a diode in series with a resistor and
exhibits the characteristic knee voltage
common with any bipolar device. Most
systems do not operate at or even near the
maximum operating conditions for the
switches. As can be seen in Fig. 1, at an
average operating current of 25 A, the SiC
MOSFET shows a signifcant advantage in
conduction losses. Te forward drop of the
SiC MOSFET is 1 V, whereas the IGBT for-
ward drop is nearly 1.4 V, resulting in 40%
higher conduction losses for the IGBT. In
many applications, IGBTs are signifcantly
over-rated to compensate for this poor
switching efciency, further increasing the
MOSFET advantage. As such, smaller SiC
MOSFET ratings can be used to achieve
much higher efciency, which provides
benefts regarding the physical size of sys-
tem implementation, thermal dissipation,
and ultimately, overall system cost.
Figure 2 summarizes the device efcien-
cy advantage. As devices have more amps
to address a given system power require-
ment, the advantage of SiC over silicon
IGBTs increases. Additionally, even when
the system switching frequency is increased
by nearly seven times, the SiC MOSFET
remains much more efcient. Higher
frequencies enable the reduction of flter
inductor and capacitor ratings, resulting in
smaller, lighter, and less costly solutions.
Te efect is illustrated in Table 1 ,
which depicts a two-level, three-phase in-
verter application that was simulated using
diferent IGBT and SiC MOSFET ratings.
Te simulation was frst done at a conser-
vative 3 kHz the frequency at which
IGBTs provide the best advantages. Using
IGBTs rated from 600 to 1,200 A, one can
see a respectable efciency range from
98.9% to 99.1%, but similar SiC efciencies
Fig. 1: 50-A IGBT4 and 50-A SiC MOSFET
I-V Curves
Fig. 2: Conduction plus switching
in inverter simulation
10 Power Supplement
can be achieved with smaller
ratings of 250 to 400 A. In all
cases, SiC efciency beats the
IGBT solutions ranging from
99.4% to 99.7%. Signifcant
rating reduction helps ofset
the higher cost of SiC and
provide smaller, lighter, and
cooler-running power mod-
ules. Enhanced efciency also
provides lower system operating tempera-
tures, enabling reduced heatsink sizes, fan
sizes, or, in extreme cases, even eliminating
costly liquid cooling. Furthermore, as an
SiC modules frequency is increased to 10
and 25 kHz, SiC efciency remains as good
or better than that achieved by the IGBT.
Figure 3 summarizes switching and
conduction losses for a 600-A IGBT solu-
tion versus a 300-A SiC MOSFET-based
solution. At half the module rating and
more than three times the switching
frequency, there is still an energy loss
reduction of 33%, which drives down oper-
ating temperatures and reduces the systems
cooling costs. For grid-connected systems
such as solar inverters, UPS units or
industrial power converters increased
frequency will shrink the magnetic and ca-
pacitive elements by many times. In addi-
tion to the bill-of-material savings, smaller
systems are easier to install and maintain,
and are much less expensive to ship. In
transportation applications, smaller, lighter
systems can pay for themselves many times
over in energy consumption alone.
Tese dramatic reductions in required
amperage ratings make the new 50-A SiC
MOSFET and Schottky diodes equivalent
to much larger single silicon devices. As
SiC MOSFETs and diodes parallel nicely,
the new devices enable modules that can
power systems into the hundreds of kilo-
watts. As the performance of SiC devices
improves, larger devices are being intro-
duced, package options are expanding, and
the prices of the new devices are drastically
decreasing from previous generations, all of
which is good news for system designers.
Cost reductions of more than half over
previous generations are already readily
available and, with higher volumes and
further device innovations targeted for the
future, pricing is expected to continue to
come down.
Fig. 3: 300-A SiC MOSFET module vs.
600-A IGBT module
Table 1: 250-kW inverter loss analysis MOSFET vs Si IGBT
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12 Power Supplement
What you need to know about
industrial UPSs
A manufacturers safety agency approval is key
for industrial applications in harsh temperatures
BY MICHAEL A. STOUT
Vice President Engineering
Falcon Electric, www.FalconUPS.com
W
hen most of us think about
an uninterruptible power
supply (UPS), the little box
we have connected to our home or office
workstation comes to mind. It sits there
faithfully doing its job day after day, and
we only notice it when it beeps while
providing backup power, preventing the
loss of our work. For some, the loss of
work is a minor inconvenience, but for
others it means recreating hours or even
days of work. The UPS used in these
applications is typically very low cost and
low tech, providing the limited functions
of battery backup and surge protection.
In a controlled office environment, this
may be all that is needed. The UPSs used
for this application are referred to as off-
line or line-interactive, which designates
their design topology. In these types of
UPS models, utility power passes directly
through the UPS, with their inverters
operating only when utility power has
been lost and they are operating from
their internal batteries.
However, for a companys server
room, UPS requirements are a bit more
demanding. Te companys data, com-
munications and productivity are on the
line. Servers, network infrastructure, In-
ternet, and telecommunications must be
protected with a higher level of reliability.
Due to the amount of interconnectivity
culminating in the server room, a UPS
is required that ofers a higher level of
power protection in addition to battery
backup. A mid-priced double-conversion
online UPS is ideal for this higher-level
application. Te online UPS (see Fig. 1)
regenerates clean, regulated power when
operating from utility and battery. Te
online UPS eliminates many more kinds
of power anomalies, providing a much
more stable power source to the server
room equipment. As with the of-line
and line-interactive UPS, Te majority of
the online UPS products on the market
Dont sacrice performance or service for price. Call today for a surprisingly
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Power Supplement 13
have been designed to be installed in a
protected and temperature-controlled
environment.
But not all UPSs are located in a
protected ofce or server room envi-
ronment. An ever exploding number of
industrial applications are so demanding
that the UPS industry has started to
ofer online UPSs having a much more
robust design. Tey are referred to as an
industrial or high-temperature online
UPS. Ofce or server-level UPS products
are typically rated for use in a 0 to 40C
operational temperature environment.
However, the industrial UPS may have
a 30to 65C operational temperature
specifcation with the emphases on
higher temperatures. Tis class of UPS is
not weather-proof and must be protected
in an indoor location or in a properly
rated NEMA-type enclosure. Yet its wide
operational temperature range, tied with
its high level of power conditioning and
protection, makes the online UPS the
ideal solution for harsh environments.
One such application subjected to
both high and low temperature extremes
is in the oil and gas industry. Oil and gas
are under great pressure at the well head.
To control the fow, a motor operated
valve (MOV) is installed at the well head
and controlled by a system control and
data acquisition system (SCADA). Te
control of the MOV is critical as it must
always be secured in a closed position
should the SCADA system detect any
abnormality at the well head site. Due
to the remote locations of well heads,
power outages are very common. A loss
of power would result in the MOV being
lef in an open state and the oil fow lef
uncontrolled. Te ramifcations of an
uncontrolled MOV could range from a
costly oil spill cleanup to the total loss of
the well. To protect against this problem,
a UPS is incorporated into the SCADA
system and MOV control. In addition
to MOV control, the SCADA system
monitors the well head pressure, controls
onsite ground water and oil separation,
Fig. 1: Online UPS diagram.
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14 Power Supplement
monitors various containment tank levels
and acquires critical data from various
site sensors. It continuously commu-
nicates the site status in real-time to a
central monitoring location via a wireless
transceiver. UPS backup power is essen-
tial to all of these operations. Yet, due to
the remote location of the site, providing
a temperature controlled environment is
far too costly. An online industrial UPS
provides a very high level of protec-
tion against power-quality problems
while supplying ideal power to the
sites SCADA equipment over the
entire range of seasonal temperature
extremes.
Another application subjected
to harsh environments is toll roads.
Trough the distribution of small
transponders linked electronical-
ly to their respective users credit or
ATM account and fxed radio frequen-
cy identifcation (RFID) transceivers
located at toll collection points, toll road
computing systems are dependent on
clean, continuous power. Long gone
are the "old school toll booth bottle-
necks thanks to RFID transceivers and
automated number plate recognition
(ANPR) systems that read vehicle license
plates and checks a database for a valid
or invalid users status. If the transponder
number and license plate number agree,
the user is billed. In the event of a loss
of utility power, all of this equipment
must be powered for up to seventy-two
hours. Te support electronics and UPSs
are housed in NEMA 3R enclosures
(see Fig. 2) stationed on the side of the
freeway, adjacent to the toll collection
facilities; they are subject to the same
seasonal temperature extremes of theoil
feld application. Again, an industrial
UPS is essential to system reliability and
proftability.
As the industrial UPS market
is relatively new, care must be used
when purchasing a UPS stating high-
temperature capabilities. Due to the
critical and unique challenges present
when installing an online UPS in a high-
temperature application, the importance
of the UPS manufacturer receiving a
safety agency approval such as a UL
Listing mark is a vital consideration. A
review of the manufacturers product
specifcation with respect to operating
temperature range and safety agency
listing status is essential as not all
manufacturers stating high-temperature
product specifcations have submitted
their products to an approved safety
agency like UL or ETL for evaluation
at the stated temperature range and
subsequent listing mark.
Fig. 2: Falcon
Electric SSG series
double-conversion
UPS in NEMA-rated
enclosure are UL,
cUL, and CE-Listed
to operate between
20and 55C
and30 and 65C.
Rediscover the power
of Astrodyne.
Now you can power up with
our expanded technologies,
engineering support, and
global manufacturing. With
the addition of the RO Asso-
ciates and Jerome Industries
brands to our extensive
line-up of standard, modifed
and custom solutions, youll
fnd even more experience,
personal service, and creative
thinking to help you solve
those demanding power
challenges quickly and reliably.
A better choice.
For both custom-designed
and standard solutions,
Astrodyne can meet the most
critical Medical, Defense,
Aerospace and Industrial
power requirements. Choose
Astrodyne with complete
confdence. Learn how we
can bring more power to you.
Visit us online today!
More power to you.
www.astrodyne.com
Power Supplement 15
Cost-effective sync rectification
in ac/dc supplies
For optimum efficiency, cost, and reliability, an economical solution is
needed to control the synchronous rectifier MOSFETs without allowing
reverse current to flow during turn-off
BY HELEN DING
International Rectifier, www.irf.com
S
ynchronous rectification is being
used to improve performance in an
increasing number of ac/dc power
supply applications, as tougher ecodesign
targets drive designers to achieve further
gains in energy efficiency. For optimum
efficiency, cost, and reliability, an eco-
nomical solution is needed to control the
synchronous rectifier MOSFETs without
allowing reverse current to flow during
turn-off.
As power supply designers seek
further improvement in efciency, more
and more are choosing to use a synchro-
nous rectifer in place of the traditional
high-speed or Schottky diode in fyback
or forward converters, as shown inFig.
1. Tis requires control of the MOSFETs
(synchronous rectifer MOSFET for both
Forward and Freewheeling), to turn the
device on and of at the correct times to
maintain the fow of current through the
load.
When the converter is operating in
discontinuous-conduction mode (DCM),
the current in the output inductor is
allowed to decay to zero while the syn-
chronous rectifer MOSFET is turned on.
Te secondary-side gate-control signals
may be coordinated by sensing the
MOSFET drain-to-source voltage (V
DS
).
Controllers designed to operate this way
are available from several manufacturers.
Te IR1169 SmartRectifer controller
uses IRs proprietary High-Voltage IC
(HVIC) technology to connect direct-
ly to the MOSFET drain and source.
Tis approach minimizes demand for
additional components, thereby reducing
bill-of-materials (BOM) costs.
Te IR1169 has intelligent controls
built inthat sense and control the sec-
16 Power Supplement
Fig. 1: Schematic of forward converter with synchronous
rectifer. Diodes shown are the MOSFET body diodes.
ondary synchronous rectifer MOSFET
from initial startup and during the
operation properly control its signals to
prevent unwanted reverse current fows
as well as improving overall efciency
and prevent stress on converter compo-
nents.
At higher output-power levels, oper-
ating the converter in continuous-cur-
rent mode (CCM) signifcantly improves
energy efciency by preventing the in-
ductor current from decaying to zero. In
CCM, the dI/dt slope at turn-of is much
steeper than is the case in DCM. Te
IR1169 internal circuitry ensures proper
operation in such a condition in order to
avoid possible reverse-current fow.
For proper control, a timely monitor-
ing of the gate-control signal generated
by the primary-side MOSFET controller
is needed. However, since the isolat-
ed topology prevents making a direct
connection, most controllers need to
sense this signal via a pulse transformer.
Tis approach has a number of draw-
backs. Te use of an additional magnetic
component adds cost to the design while
also reducing system reliability and
occupying a large PCB area. Some sec-
ondary-side controllers require a special
signal, and therefore can only be used
with a specifc primary-side controller.
Te IR1169 secondary-side controller
has integrated circuitry that allows an
ordinary primary-side gate-drive signal
to be connected using a simple and
low-cost capacitor circuit. Tis approach
eliminates the need for a pulse trans-
former, and so allows designers to build
smaller, more economical and more
reliable power supplies.
A forward converter using two
IR1169s to control the forward and syn-
chronous rectifer MOSFETs is shown in
18 Power Supplement
Fig. 2. A high-voltage safety-qualifed Y
capacitor is connected to the IR1169 and
the gate-drive output of the primary-side
controller. A standard Y capacitor is
also placed between the primary ground
and secondary ground to help close the
current-fowing loop. When the primary
controller generates a gate-drive pulse,
this signal is received by the IR1169 and
it properly controls and synchronizes the
MOSFET, preventing any shoot-through
current condition.
Te synchronous rectifcation
improves system efciency and reduces
power losses, compare with Schottky
diodes solution. It enables the use of a
smaller heatsink, whereby reducing the
size and weight of power supply.
Internal circuitry of the IR1169 allows
VDS sensing in DCM or CCM mode.
Hence this controller is suitable for
high-efciency synchronous rectifca-
tion in power supplies for cost-sensitive
equipment such as small PCs and home
electronics in the range of 150-300 W,
as well as high-power applications such
as enterprise computing and telecom or
networking infrastructure equipment up
to 600 W and higher.
Maximizing energy efciency has be-
come an important goal for power supply
designers, and is encouraging adoption
of more sophisticated operating princi-
ples such as synchronous rectifcation.
Cost and reliability continue to be key
concerns, however, and both are served
by minimizing the number of compo-
nents required. High-voltage IC technol-
ogy allowing direct sensing of MOSFET
voltages, and synchronization circuitry
capable of eliminating the pulse trans-
former in isolated synchronous rectifers,
each provide valuable help enabling
designers to achieve this goal.
Fig. 2: Synchronous rectifer
capable of CCM operation without pulse
transformer.
CURRENT CONTROLS THE CAR
WE CONTROL THE CURRENT
Isotek Corporation An Isabellenhtte Company 1199 G.A.R. Highway Swansea, MA 02777
Tel 508 673 2900 / 800-LOW-OHMS Fax 508 676 0885 www.isotekcorp.com sales@isotekcorp.com
LOW-OHMIC PRECISION AND POWER RESISTORS
_
Passenger comfort / Chassis // 100 mOhm 2 A
_
Electronic stability control // 50 mOhm 5 A
_
Gasoline and diesel direct injection // 10 mOhm 10 A
_
Power train / Automatic gear box // 5 mOhm 20 A
_
Air conditioning / Cooler blower // 1 mOhm 40 A
_
Electrohydraulic power steering // 0.5 mOhm 80 A
_
Starter generator / Hybrid vehicles // 0.2 mOhm 300 A
_
Energy / Battery management // 0.1 mOhm 1500 A
Sample quantities available from stock
20 Power Supplement
Power Vents: Market analysis
R
esearch news from IHS/IMS says
that the adapter power supplies
from 2012 to 2017 will grow by $2
billion, driven by new applications such
as tablets, wireless power, and LED light,
which will offset the decline in cell-
phone charging. The report says that the
anticipated contraction of chargers in the
cellphone market is due to the design of a
wired universal charging solution.
The GSMA organization of mobile op-
erators introduced the universal charger
to reduce electronics waste by making
universal adapters for all cellphones and
by removing the bundled charger for all
cellphones. This will cause the power
adapter market to decline from 2014
through 2015. The growth of the wireless
power and LED lighting markets turn
the decline around and provide greater
opportunities for power adapter manu-
facturers. Contact jonathan.cassell@ihs.
com for more information.
In other news from IHS/IMS, the
digital power market is currently one
of the fastest growing segments of the
power management industry for power
supply and power IC manufacturers. Ear-
ly adopters of digital power components
offer applications for servers and tele-
communications/data-communications.
However, manufacturers in other sectors
are now beginning to adopt digital power
solutions, creating more opportunities.
The report analyses both the digital pow-
er supply and digital power IC markets
and provides forecasts to 2017.
The total global market for digital
power components is forecast to qua-
druple to $15 billion from 2012 to 2017.
The market for digital power supplies is
projected to grow to almost $12.5 billion
in 2017 and the digital power IC market
is forecast to be worth over $2.5 billion.
The digital power IC market is projected
to grow at a faster rate as they are used
in the end-equipment at board level and
also in digital power supplies.
Customers outside the telecom mar-
ket are beginning to adopt digital control
and digital management solutions as
manufacturers become more aware of the
benefits they can offer compared with
some analog products. One advantage
includes reducing the overall BoM cost
by reducing the number of discrete com-
ponents, reducing the overall footprint,
increasing power density, providing the
ability to monitor and optimize power
levels and system requirements. Over
two-thirds of manufacturers and design-
ers surveyed predicted that more than
10% of their products will have digital
control or digital management in 2015.
Contact Jonathon.eykyn@ihs.com for
more information.
Paul O'Shea
www.tracopower.com
POWERGATE LLC 866-588-1750 www.powergatellc.com
Power Sources Unlimited 800-966-7784 www.psui.com/traco
Allied Electronics 800-433-5700 www.alliedelec.com
NEWARK 800-463-9275 www.newark.com
DC/DC Converter
SMD-Package 1 to 15 Watt
Medical Safety 1 to 10 Watt
DIP-Package 2 to 60 Watt
SIP-Package 1 to 6 Watt
High Power Modules 75 to 240 Watt
Non Isolated Switching Regulators 1 30 A
Industrial Converters up to 22 kW
High Voltage Converters 180 2000 VDC
AC/DC Power Supplies
*For a complete category listing, visit www.eem.com AUGUST 2013 electronicproducts.com ELECTRONIC PRODUCTS POWER SUPPLEMENT
22 Source Guide
Company URL
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s
3Y Power Technology 3YPower.com
AAK Corp. aakcorp.com
Abbott Technologies, Inc. abbott-tech.com
Absolute Process
Instruments Inc.
api-usa.com

Absopulse Electronics
Limited
absopulse.com

AcBel Polytech Inc acbel.com
Acon, Inc. aconinc.com
Acopian Power Supplies acopian.com
Acqutek Corporation acqu.com
Advanced Conversion
Technology
actpower.com

Advanced Power
Designs, Inc.
vxibus.com

Advanced Power Solutions advpower.com
AE Techron, Inc. aetechron.com
Aerovox Corp. aerovox.com
AES Corp. aes-intellinet.com
Alarm Controls Corp. alarmcontrols.com
Alfa Electronics, Inc. alfaelectronics.com
AlfaMag Electronics LLC alfamag.com
All Shore Industries Inc. allshore.com
Allegro MicroSystems, Inc. allegromicro.com
Alpha Technologies Inc. alpha.com
Altech Corp. altechcorp.com
American Power
Conversion
apcc.com

American Power
Design, Inc.
apowerdesign.com

American Reliance Inc. amrel.com/ari_
product.html

Americor
Electronics, Ltd.
americor-usa.com

AMETEK Programmable
Power
programmable
power.com

Amveco Magnetics Inc amveco.com
Analog Modules, Inc. analogmodules.com
Analytic Systems analyticsystems.com
Applied Power Systems Inc appliedps.com
APtronic AG aptronic.de
APW Power Supplies apw.com
APX Technologies Inc. apxonline.com
Arnold Magnetics amcpower.com
Astrodyne Corporation astrodyne.com
Astro-Geo-Marine, Inc. astrogeomarine.com
A-Systems, Inc. a-systems.com
LT8705
Fixed Output
1.3V to 80V
Variable Input
2.8V to 80V
Output Current:
Regulate or
Monitor
Input Current:
Regulate or
Monitor
Up to 250W
CSN
GND
CSP
BG
1
TG
1
CSNIN
CSPIN
FBIN FBOUT
BG
2
TG
2
CSPOUT
CSNOUT
I
OUT
SET I
IN
SET
V
OUT
SET V
IN
SET
80V Sync Buck-Boost
Info & Free Samples
The LT
8705 is the latest in our growing family of single inductor buck-boost controllers. This wide input voltage
range, high power controller is capable of delivering efficiencies up to 98.5% for a 48V, 5A output from an input voltage
range of 2.8V to 80V. Using a single inductor and 4 external MOSFETs, the LT8705 can deliver output power up to 250W.
Input or output voltage or current, any of these can be regulated with the devices 4 control loops. Its input regulation
loop is ideal for high impedance sources such as solar panels.
www.linear.com/product/LT8705
1-800-4-LINEAR
36V to 80V Input; 48V, 5A Output
Features
Single Inductor
Very High Efficiency
V
IN
Range: 2.8V to 80V
V
OUT
Range: 1.3V to 80V
V
OUT
, I
OUT
, V
IN
, I
IN
Feedback Loops
Current Monitors
Synchronous Rectification
Quad N-Channel MOSFET Gate Drivers
Solar-Powered Battery Charger Capable
Four Regulation Loops (V
OUT
, I
OUT
, V
IN
and I
IN
)
video.linear.com/138
100
99.0
98.0
97.0
96.0
95.0
94.0
93.0
92.0
91.0
90.0
0.5 1.00 2.00 3.00 4.00 5.00
E
f
f
i
c
i
e
n
c
y

(
%
)
Load Current (A)
V
IN
= 36V
V
IN
= 48V
V
IN
= 80V
24 Source Guide
Company URL
1

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s
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l
e
s
Autec Power Systems, Inc. autec.com
Automated Business
Power (ABP)
abpco.com

Automation
Components Inc.
workaci.com
Automation Systems
Interconnect, Inc.
asi-ez.com

Avionic Instruments avionicinstruments.
com

B & B Electronics
Manufacturing Company
bb-elec.com

B & J - USA bnj-usa.com
B&K Precision bkprecision.com
Babcock, Inc. babcockinc.com
Banner Engineering
Corporation
bannerengineering.
com

BC Systems, Inc. bcpowersys.com
Bear Power Supplies bearpwr.com
Behlman Electronics, Inc. behlman.com
Bellnix America, Inc. bellnix.com
Betatronics, Inc.
BI Technologies bitechnologies.com
Bias Power, LLC biaspower.com
Bocatech Inc bocatechinc.com
Brandt Electronics, Inc. brandtelectronics.com
Bravo Communications,
Inc.
bravobravo.com

C & C Jetronic ccjetronic.com
Cabur Srl cabur.it
Calex Manufacturing
Company, Inc.
calex.com

Calibrators, Inc. calibratorsinc.com
California Instruments
Corp.
calinst.com

Calrad Electronics calrad.com
Carlo Gavazzi
Automation
GavazziOnline.com

CCI Power Supplies, LLC ccips.com
Century Electronics centuryele.com
CET Technology cettech.com
Chassis Plans chassis-plans.com
Cherokee International cherokeepwr.com
Chinfa Electronics chinfa.com.tw
Chroma ATE Inc. chromaus.com
CML Innovative
Technologies
cml-it.com
Communication Coil Inc. communicationcoil.

com

Compact Power Company compactpowerco.com
Computer Power Supply,
Inc. (CPS)
cpshv.com

Control Cable, Inc. controlcable.com
Control Resources Inc. controlres.com
*For a complete category listing, visit www.eem.com ELECTRONIC PRODUCTS POWER SUPPLEMENT electronicproducts.com AUGUST 2013
Source Guide 25
Company URL
1

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s
Conversion Devices, Inc. cdipower.com
Cosel U.S.A. Inc. coselusa.com
Coto Technology cotorelay.com
Cougar Electronics Corp. cougarelectronics.com
Criterion Instruments, Ltd. criterioninstr.com
CUI Inc cui.com
DongAh Elecomm dongahusa.com
Elma Electronic Inc. elma.com
EMCO High Voltage
Corporation
emcohighvoltage.com

Endicott Research Group,
Inc.
ergpower.com

ETA-USA - ETA Electric Ind.
Co. Ltd.
eta-usa.com

FCI Semiconductor fcisemi-mag.com
Our GRN Series is Growing!
www.ipdpower.com sales@ipdpower.com
570-824-4666 Fax: 570-824-4843
300 Stewart Road
Wilkes-Barre, PA 18706
ipdpower.com
GRN 45 & GRN 60 Series Power Supply
For Medical and Industrial applications
45 Watt Multi Output: 60 Watt Single Output:
2.5 x 4.25 x 1.0 Size 2.0 x 3.0 x 1.0 Size
86% Peak Effciency >90% Peak Effciency
<
<
0.3 Watt No-Load Input Power
EN 60601-1 & EN 60950-1 Safety EN 60601-1 & EN 60950-1 Safety
GRN 80 Series Power Supply
For Medical and Industrial applications
80 Watt Multi Output: 80 Watt Single Output:
3.0 x 5.0 x 1.0 Size 2.5 x 4.25 x 1.0 Size
87% Peak Effciency 89% Peak Effciency
<
<
0.3 Watt No-Load Input Power
EN 60601-1 & EN 60950-1 Safety EN 60601-1 & EN 60950-1 Safety
Accepted
26 Source Guide
Company URL
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5

W

O
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t
p
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C

B
o
a
r
d

M
o
u
n
t
a
b
l
e
,

P
o
w
e
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S
u
p
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s
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a
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s

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I
n
c
l
.

M
e
t
e
r
e
d

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n
i
t
s
)
L
e
s
s

t
h
a
n

1

W

O
u
t
p
u
t

P
C

B
o
a
r
d

M
o
u
n
t
a
b
l
e

P
o
w
e
r

S
u
p
p
l
i
e
s
M
e
d
i
c
a
l

L
i
n
e
a
r

P
o
w
e
r

S
u
p
p
l
i
e
s
M
e
d
i
c
a
l

S
w
i
t
c
h
i
n
g

P
o
w
e
r

S
u
p
p
l
i
e
s
O
p
e
n

F
r
a
m
e

P
o
w
e
r

S
u
p
p
l
i
e
s
P
l
u
g
-
I
n

P
o
w
e
r

S
u
p
p
l
i
e
s
P
o
w
e
r

F
a
c
t
o
r

C
o
r
r
e
c
t
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d

(
P
F
C
)

P
o
w
e
r

S
u
p
p
l
i
e
s
P
o
w
e
r

M
o
d
u
l
e
s
Gaia Converter Inc. gaia-converter.com
GlobTek, Inc. globTek.com
Integrated Power Designs,
Inc.
ipdpower.com

International Rectifer
Corp.
irf.com

Interpower Corporation interpower.com
Keithley Instruments, Inc. keithley.com
Keytronics, Inc. keytronics.com
Krohn-Hite Corp. krohn-hite.com
Linear Technology Corp. linear.com
M. S. Kennedy Corp. mskennedy.com
Mean Well USA Inc meanwellusa.com
MEGA Electronics, Inc. megaelectronics.com
MicroPower Direct micropowerdirect.com
Minmax Technology
Co., Ltd
minmax.com.tw

Mornsun America mornsunamerica.com
MTM Power mtm-power.com
Murata Electronics
North America, Inc. -
Headquarters
murata.com

Murata Power Solutions Inc murata-ps.com
Omega Engineering omega.com
Omron Electronic
Components LLC
components.omron.
com

Pico Electronics, Inc. picoelectronics.com
Power Mate Technology,
Inc.
powermateusa.com

Ross Engineering Corp. rossengineeringcorp.
com

Solid State Devices, Inc. ssdi-power.com
Stanford Research
Systems, Inc.
thinksrs.com
TDI Power tdipower.com
TDK Corporation of Am. tdk.com
TDK-Lambda Americas
Inc. - Low Power Div
us.tdk-lambda.com/lp

TDK-Lambda Americas,
Inc. - High Power Div
us.tdk-lambda.
com/hp

Tektronix, Inc. tek.com
Total Power International,
Inc.
total-power.com

TRACOPOWER tracopower.com
Triad Magnetics TriadMagnetics.com
Unipower Corp. unipower-corp.com
Vicor Corp. vicorpower.com
WAGO Corp. wago.us
XP Power xppower.com
Yuan Dean Scientifc
Co. Ltd.
yuan-dean.com

DC to DC Power Supplies
Source Guide 27
*For a complete category listing, visit www.eem.com ELECTRONIC PRODUCTS POWER SUPPLEMENT electronicproducts.com AUGUST 2013
Company URL
1
-
2
9
9

W

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s
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s
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a
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C

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o

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C

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o
n
v
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r
t
e
r
s
M
o
d
u
l
a
r

D
C

t
o

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C

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v
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r
s
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t
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p
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p
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t
o

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v
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s
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C
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M
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u
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t
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g

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C

t
o

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v
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r
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e
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s
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n
t
-
o
f
-
L
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a
d

(
P
O
L
)

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C

t
o

D
C

C
o
n
v
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r
t
e
r
s
P
r
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c
i
s
i
o
n
,

L
o
w

N
o
i
s
e

C
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n
v
e
r
t
e
r
s
P
r
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g
r
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m
m
a
b
l
e

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C

t
o

D
C

C
o
n
v
e
r
t
e
r
s
S
u
r
f
a
c
e

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n
t

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C

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n
v
e
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t
e
r
s
X
-
R
a
y

C
o
n
v
e
r
t
e
r
s
Acopian Power Supplies acopian.com
Advanced Power Solutions advpower.com
Bel Fuse Inc. belfuse.com
Calex Manufacturing Company, Inc. calex.com
CUI Inc cui.com
EMCO High Voltage Corporation emcohighvoltage.com
Endicott Research Group, Inc. ergpower.com
ETA-USA - ETA Electric Ind. Co. Ltd. eta-usa.com
Gaia Converter Inc. gaia-converter.com
Integrated Power Designs, Inc. ipdpower.com
MTM Power mtm-power.com
Recom Power recom-power.com
Ross Engineering Corp. rossengineeringcorp.com
TDK Corporation of America tdk.com
TDK-Lambda Americas Inc. - Low Power Div us.tdk-lambda.com/lp
Total Power International, Inc. total-power.com
TRACOPOWER tracopower.com
Vicor Corp. vicorpower.com
WAGO Corp. wago.us
XP Power xppower.com
Yuan Dean Scientifc Co. Ltd. yuan-dean.com
MTMGreen Power
www.mtm-power.com
Hotline: +1 774 565 3800 bucacci @ mtm-power.com
Electromobility
Wind Energy
Railway Technology
Industry
Transformers
28 Source Guide
Company URL
4
0
0

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s
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r
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e
r
s
Abracon Corporation abracon.com
Advanced Power
Solutions
advpower.com
Allied Components
International
alliedcomponents.com
Alpha Technologies Inc. alpha.com
Altran Corp. altrancorp.com
Amecon, Inc.
amecon-magnetics.
com

American Aerospace Ctrls. a-a-c.com
American Magnetics amermag.com
American Power
Conversion
apcc.com
American Toppower
americantoppower.
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American Trans-Coil Corp. atc-us.com
American Zettler azettler.com
Americor Electronics, Ltd. americor-usa.com
AmgloKemlite
Laboratories, Inc.
amglo.com
Amidon Inductive
Components
amidoncorp.com
Amplivox Sound
Systems - Powerlink Div
ampli.com
Amprobe amprobe.com
Amveco Magnetics Inc amveco.com
Andover, Incorporated andovercoils.com
Anoma North America
Corporation
anoma.com
API Delevan Inc. delevan.com
APX Technologies Inc. apxonline.com
Atlas/Soundolier atlassound.com
Automation
Components Inc.
workaci.com
Avel Lindberg Inc. avellindberg.com
Avionic Instruments
avionicinstruments.
com

Avtech Electrosystems
Limited
avtechpulse.com
Coilcraft CPS coilcraft-cps.com
CUI Inc cui.com
Datatronic
Distribution, Inc.
datatronics.com
EMCO High Voltage
Corporation
emcohighvoltage.com
Endicott Research
Group, Inc.
ergpower.com
Hioki USA Corporation hiokiusa.com
NTE Electronics, Inc. nteinc.com
Pearson Electronics, Inc.
pearsonelectronics.
com

Ross Engineering Corp.
rossengineeringcorp.
com

TDK Corporation of
America
tdk.com
TE Connectivity te.com
Total Power
International, Inc.
total-power.com
WAGO Corp. wago.us
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Altech Corp. altechcorp.com
American Electrical Inc americanelectrical.com
APM Hexseal Corp. apmhexseal.com
B & B Electronics Manufacturing Company bb-elec.com
Carling Technologies Inc carlingtech.com
Central Semiconductor Corp. centralsemi.com
Clare, Inc. clare.com
E-T-A Circuit Breakers e-t-a.com/us_home.html
KOA Speer Electronics, Inc. koaspeer.com
Lumex, Inc. lumex.com
Murata Electronics North America, Inc. - Headquarters murata.com
NIC Components Corp. niccomp.com
Ross Engineering Corp. rossengineeringcorp.com
TDK Corporation of America tdk.com
TE Connectivity te.com
WAGO Corp. wago.us
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D
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b
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e
r
s
Advanced Linear Devices, Inc. aldinc.com
Agilent Technologies agilent.com
Allegro MicroSystems, Inc. allegromicro.com
Applied Power Systems Inc. appliedps.com
Avago Technologies avagotech.com
Central Semiconductor Corp. centralsemi.com
Clare, Inc. clare.com
Cree Inc. cree.com
Electronic Devices, Inc. edidiodes.com
Intersil Corporation intersil.com
IXYS Corporation ixys.com
KOA Speer Electronics, Inc. koaspeer.com
Lumex, Inc. lumex.com
NIC Components Corp. niccomp.com
Omron Electronic Components LLC components.omron.com
ON Semiconductor, L.L.C. onsemi.com
ELECTRONIC DEVICES, INC.
21 Gray Oaks Avenue, Yonkers, New York 10710
Tel: (800) 678-0828 / (914) 965-4400 / Fax: (914) 965-5531
Email: sales@edidiodes.com
www.edidiodes.com
RECTI FI ERS
BRI DGES
DI ODES
HV ASSEMBLI ES
Full lines of standard and many unique designs
Specialist in manufacturing rectiers since 1951
Recoveries to 50 ns
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Diodes to 6 Amps, to 30,000 PRV
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RoHS Compliant, ISO9001 Certied,
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Inquire for catalog or visit website.
Total Switching Losses (uJ)
Conduction Losses vs Switching Losses Tradeoff
2.6
2.4
2.2
2
1.8
1.6
1.4
1.2
1
0 1000 2000 3000 4000 5000 6000
V
c
e
(
o
n
)

(
V
)
Standard IGBT
Ultrafast IGBT
Fast IGBT
V
ce(on)
(V)
16.0
18.0
20.0
14.0
12.0
10.0
8.0
6.0
4.0
2.0
0.0
0.00 0.50 1.00 1.50 4.00 2.00 2.50 3.00 3.50
C
u
r
r
e
n
t

(
A
)
Short Circuit vs Efficiency Tradeoff
No guaranteed
Short Circuit
10us Short Circuit
Frequency (kHz)
0.1
30
25
20
15
10
5
1 10 100
R
M
S

C
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t

C
a
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a
b
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i
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y

(
A
)
Fast IGBT
Standard IGBT
Ultrafast IGBT
Speed Tradeoffs
Use application conditions
Calculate conduction losses
Calculate switching losses
Provide MSRP to show cost implicactions
of design choices
http://mypower.irf.com/IGBT
http://mypower.irf.com/IGBT
for more information call 1.800.981.8699 or visit us at www.irf.com
THE POWER MANAGEMENT LEADER
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IR's Online Selection Tool
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Online IGBT
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Conditions Optimized IGBT

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