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SIM UNIVERSITY
SCHOOL OF SCIENCE AND TECHNOLOGY








MULTILAYER LTCC BANDPASS FILTER FOR
MICROWAVE APPLICATIONS









STUDENT : GUO LING
(Q0704929)
SUPERVISOR : DR. LUM KUM MENG
PROJECT CODE : JAN2011/ENG/03





A project report submitted to SIM University
in partial fulfilment of the requirements for the degree of
Bachelor of Engineering (or Bachelor of Electronics)


JANUARY 2011
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Abstract

Microwave devices in the consumer electronics market are continuously developing with
size, cost and performance being all-important factors for the success of these devices and
hence, device and component manufacturers have to constantly seek new advanced
integration, packaging and interconnection technologies.

A bandpass filter, which is an essential device in microwave devices, is relatively large in size
as compared to other components hence it is important to choose the right filter design
methodology which fulfils both the requirements of size reduction and ease of integration
with other circuit components.

The use of Low Temperature Co-fired Ceramic (LTCC) technology fulfils both these
conditions as LTCC substrate offers excellent electrical and mechanical properties. It also
offers ease of integration with other passive elements.

For this project, the design of multilayer LTCC bandpass filter with a centre frequency of
2.513GHz has been proposed. DuPont 951 substrate with a relative permittivity of 7.8, a
loss tangent of 0.002 and substrate height ranging from 0.045mm to 0.28mm is chosen as the
material used for the filter prototype, which is designed and simulated using Agilent ADS
Software. The resultant filter response is analyzed to determine if requirements are met.

The filter design was then modified to use FR4-86 substrate instead due to the complexity
and high cost involved with using DuPont 951 substrate for fabrication, FR4 substrate has a
relative permittivity of 4.7, a loss tangent of 0.016 and height of 1600 um. The new filter
design using FR4-86 substrate has a centre frequency of 1.458GHz and its response is
modelled to match the response of the initial filter design using DuPont 951 substrate.

The filter design using FR4-86 substrate is then fabricated and subsequently assembled with
SMA connectors. By using Agilent Network Analyzer E5062A, the filter response of the
fabricated filter prototype is measured and a comparison analysis is performed between the
measured results vs. the simulated results.


















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Acknowledgements

Throughout the course of this project, I have met and overcome various setbacks and these
are the very people who have helped and guided me through those difficult times, and made
the completion of this project possible. I would like to extend my heartfelt gratitude to firstly,
my project supervisor, Dr. Lum Kum Meng, for his trust, patience, encouragement and
utmost support; my wonderful project mates, Mr. Lee Meng Long, Mr. Michael Ng and Mr.
Toh Wen Jie for their much needed inspiration and help in whatever form required and
finally, to my dearest family and loved ones, who stood by me throughout with unwavering
love and support.






































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Table of Contents

Abstract ...................................................................................................................................... 2
Acknowledgements .................................................................................................................... 3
Table of Contents ....................................................................................................................... 4
Index of Tables ......................................................................................................................... 10
1. INTRODUCTION ........................................................................................................... 11
1.1 Project Objectives ...................................................................................................... 11
1.2 Overall Objectives ..................................................................................................... 11
1.3 Layout of Project Report ........................................................................................... 12
2. PROJECT MANAGEMENT ........................................................................................... 13
2.1 Work Breakdown Structure (WBS) ........................................................................... 13
2.2 Time Allocation ......................................................................................................... 14
2.3 Project Plan (Gantt chart) .......................................................................................... 16
2.4 Monitor and Review .................................................................................................. 17
2.5 Resources Required ................................................................................................... 17
2.6 Risk Management ...................................................................................................... 18
3. INVESTIGATION OF PROJECT BACKGROUND ...................................................... 19
3.1 Literature Review on LTCC Technology ................................................................... 19
3.1.1 Brief Historical Review .................................................................................... 19
3.1.2 What is LTCC Technology? ............................................................................. 20
3.1.3 Advantages of LTCC Technology .................................................................... 23
3.1.4 Process of LTCC Technology ........................................................................... 24
3.1.5 Applications of LTCC Technology ................................................................... 29
3.2 Literature Review on Microwave .............................................................................. 30
3.2.1 Microwave Frequency Bands ........................................................................... 31
3.2.2 Applications of Microwave .............................................................................. 32
3.3 Literature Review on Micro-strip Structure and Waves in Micro-strips ................... 32
3.3.1 Fringing Effects, Effective Dielectric Constant and Characteristic Impedance
in Micro-strips .................................................................................................................. 33
3.3.2 Guided Wavelength and Physical Length of Micro-strips ............................... 34
3.3.3 Micro-strip Losses ............................................................................................ 35
3.4 Literature Review on RF Filter Design Methodologies ............................................ 36
3.4.1 Basic RF Filters ................................................................................................ 36
3.4.2 Micro-strip Bandpass Filter Designs ................................................................ 39
3.4.3 Network Variables and Scattering Parameters ................................................. 41
3.5 Agilent Advanced Design System (ADS) Software .................................................. 44
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3.5.1 Key Benefits of Agilent ADS Software ............................................................ 45
3.6 Printed Wiring Board (PWD) Finishes ...................................................................... 45
3.6.1 Organic Solderability Preservative (OSP) ........................................................ 45
3.6.2 Hot Air Solder Levelling (HASL) .................................................................... 46
3.7 Network Analyzer ...................................................................................................... 48
4. PROJECT SELECTIONS ................................................................................................ 50
4.1 Substrate Material Selection ...................................................................................... 50
4.2 Selection of Software Simulator Tool ........................................................................ 51
4.3 Selection of Printed Wiring Board (PWB) Finishes .................................................. 51
4.4 Selection of Measurement Tool ................................................................................. 52
4.5 Selection of SMA Connector ..................................................................................... 52
5. DEVELOPMENTS OF BANDPASS FILTER DESIGN ................................................ 54
5.1 Proposed Specifications of Initial LTCC Filter Design ............................................. 54
5.2 Proposed Configuration of Initial LTCC Filter Design ............................................. 54
5.3 Initial LTCC Filter Design and Simulation using Agilent ADS Software ................. 55
5.4 Simulation Results of Initial LTCC Filter Design ..................................................... 57
5.5 Enhanced LTCC Filter Design ................................................................................... 58
5.6 Simulation Results of Enhanced LTCC Filter Design ............................................... 59
5.7 Modelling of Filter Design using FR4-86 Substrate .................................................. 60
5.8 Re-modelled Initial Filter Design (FR4-86 Substrate) and Simulation using Agilent
ADS Software ...................................................................................................................... 61
5.9 Simulation Results of Re-modelled Initial Filter Design (FR4-86 Substrate) ........... 63
5.10 Enhanced Re-modelled Filter Design using FR4-86 Substrate ............................ 64
5.11 Simulation Results of Enhanced Re-modelled Filter Design using FR4-86
Substrate ............................................................................................................................... 65
5.12 Critical Dimensions of Finalized Filter Design using FR4-86 Substrate .............. 66
6. FABRICATION AND ASSEMBLY OF FILTER PROTOTYPE .................................... 68
6.1 Exporting Gerber Files .............................................................................................. 69
6.2 Assembly of Fabricated Filter Prototype ................................................................... 73
7. COMPARISON BETWEEN MEASURED AND SIMULATED RESULTS ................. 76
7.1 Measurement of Filter Responses .............................................................................. 76
7.2 Comparison Analysis between Measured and Simulated Results ............................. 78
8. CONCLUSION ................................................................................................................ 80
8.1 Suggestion for Future Work ....................................................................................... 80
9. CRITICAL REVIEWS AND REFLECTIONS ............................................................... 81
10. REFERENCES .......................................................................................................... 82
11. APPENDIX A ............................................................................................................ 85
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12. APPENDIX B ............................................................................................................ 87
13. APPENDIX C ............................................................................................................ 89
14. APPENDIX D ............................................................................................................ 91
15. APPENDIX E ............................................................................................................ 92
16. APPENDIX F ............................................................................................................ 94
17. APPENDIX G ............................................................................................................ 96
18. APPENDIX H ............................................................................................................ 98








































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Index of Figures

Figure 1: Work Breakdown Structure (WBS) ........................................................................... 13
Figure 2: Resources required ................................................................................................... 17
Figure 3: Multilayered ceramic circuit board for mainframe computers produced by Fujitsu
(Size 245 x 245mm, 52 layers) (Bar = 50 mm) ........................................................................ 20
Figure 4: Cross-sectional view of the circuit board with Cu in internal wiring (via diameter:
80m. conducting line width: 80m, line spacing: 100 m, dielectric material thickness per
layer: 200 m) ......................................................................................................................... 20
Figure 5: Passive elements ...................................................................................................... 21
Figure 6: Differences between HTCC and LTCC .................................................................... 21
Figure 7: Evolving binding at melting of glass in LTCC glass-ceramic structure .................. 22
Figure 8: Complex LTCC circuit structure .............................................................................. 22
Figure 9: Why use LTCC? 1 = Good / 2 = Average / 3 = Bad ................................................ 23
Figure 10: Overall process of LTCC technology ..................................................................... 24
Figure 11: Raw glass-ceramic sheets ...................................................................................... 24
Figure 12: Result of laser punching with proper parameters: a) Plane of 200 m diameter
hole, lighted from above; b) Plane of the same hole, light from under; c) Worms-eye view of
200 m hole, light from under; d) Raggedness of the edge of 200 m diameter hole ............. 25
Figure 13: Filling via holes of LTCC circuits with vacuum-drawing ...................................... 26
Figure 14: Schema of via-filling .............................................................................................. 26
Figure 15: Five typical types of delamination defects after firing: a) Vertical spitting; b)
Internal interlayer delamination; c) Stepped interlayer delamination; d) Surface blistering; e)
Circular delamination .............................................................................................................. 27
Figure 16: Heat profile of DuPont 951 Green Tape: 1) Warm up; 2) Keep temperature; 3)
Warm up; 4) Keep temperature; 5) Cooling ............................................................................ 28
Figure 17: Shrinkage of LTCC substrate caused by firing ...................................................... 28
Figure 18: Structure of stripline configuration filter with LTCC ............................................ 31
Figure 19: Microwave frequency bands .................................................................................. 31
Figure 20: General micro-strip structure ................................................................................ 33
Figure 21: Waves in micro-strip structure ............................................................................... 33
Figure 22: Loss Tangent effects on S11 and S21 ...................................................................... 35
Figure 23: Configuration of micro-strip enclosure ................................................................. 36
Figure 24: Frequency behaviour of four basic filter types ...................................................... 37
Figure 25: Attenuation profile of Butterworth and Chebyshev filters ..................................... 38
Figure 26: Typical architecture of a multilayer design ............................................................ 39
Figure 27: General configuration of an End-Coupled, half wavelength resonator filter........ 39
Figure 28: General configuration of a Parallel-Coupled, half wavelength resonator filter ... 40
Figure 29: General configuration of a Hairpin-Line bandpass filter ..................................... 40
Figure 30: General configuration of an Inter-Digital bandpass filter .................................... 41
Figure 31: Two-port network configuration ............................................................................ 41
Figure 32: Snapshots of S-parameters generated from Agilent ADS Software momentum ..... 44
Figure 33: Agilent ADS Software user interface...................................................................... 44
Figure 34: Typical OSP process .............................................................................................. 45
Figure 35: Typical HASL process ............................................................................................ 47
Figure 36: Basic blocks of a typical Network Analyzer ........................................................... 49
Figure 37: Agilent Network Analyzer E5062A ........................................................................ 52
Figure 38: Various SMA connectors ........................................................................................ 53
Figure 39: Cross-sectional view of initial LTCC filter design ................................................. 54
Figure 40: Layout architecture of initial LTCC filter design .................................................. 55
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Figure 41: Defining substrate properties for initial LTCC filter design ................................. 55
Figure 42: Setting up of simulation control environment for initial LTCC filter design ......... 56
Figure 43: Defining port properties for initial LTCC filter design ......................................... 56
Figure 44: Layout structure of initial LTCC filter design ....................................................... 57
Figure 45: S11 response of initial LTCC filter design ............................................................. 57
Figure 46: S21 response of initial LTCC filter design ............................................................. 57
Figure 47: Cross-sectional view of enhanced LTCC filter design ........................................... 58
Figure 48: Layout architecture of enhanced LTCC filter design ............................................. 58
Figure 49: Layout structure of enhanced LTCC filter design .................................................. 59
Figure 50: S11 response of enhanced LTCC filter design ....................................................... 59
Figure 51: S21 response of enhanced LTCC filter design ....................................................... 59
Figure 52: Cross-sectional view of re-modelled initial filter design (FR4-86 substrate) ........ 60
Figure 53: Layout architecture of re-modelled initial filter design (FR4-86 substrate) ......... 61
Figure 54: Defining substrate properties for re-modelled initial filter design (FR4-86
substrate).................................................................................................................................. 61
Figure 55: Setting up of simulation control environment for re-modelled initial filter design
(FR4-86 substrate) ................................................................................................................... 62
Figure 56: Defining port properties for re-modelled initial filter design (FR4-86 substrate) 62
Figure 57: Layout structure of re-modelled initial filter design (FR4-86 substrate) .............. 63
Figure 58: S11 response of re-modelled initial filter design (FR4-86 substrate) .................... 63
Figure 59: S21 response of re-modelled initial filter design (FR4-86 substrate) .................... 63
Figure 60: Cross-sectional view of enhanced re-modelled filter design (FR4-86 substrate) .. 64
Figure 61: Layout architecture of enhanced re-modelled filter design (FR4-86 substrate) .... 64
Figure 62: Layout structure of enhanced re-modelled filter design (FR4-86 substrate) ......... 65
Figure 63: S11 and S21 responses of enhanced re-modelled filter design (FR4-86 substrate)
.................................................................................................................................................. 65
Figure 64: Overall dimensions of finalized filter design using FR4-86 substrate; same
dimensions to be used for first and fifth layer (ground plane) ................................................. 66
Figure 65: Critical dimensions of second layer (Parallel-Coupled resonator)....................... 66
Figure 66: Critical dimensions of third layer (Parallel-Coupled resonator) .......................... 66
Figure 67: Critical dimensions of fourth layer (left and right triangle resonators connected
by micro-strip) .......................................................................................................................... 67
Figure 68: Multilayer bandpass filter prototype layout .......................................................... 68
Figure 69: Cond layer ......................................................................................................... 68
Figure 70: Cond2 layer ....................................................................................................... 68
Figure 71: "Resi" layer ............................................................................................................ 69
Figure 72: Diel layer ........................................................................................................... 69
Figure 73: Resi layer without Input / Output ports ............................................................. 69
Figure 74: "Cond" layer with border ....................................................................................... 70
Figure 75: "Cond2" layer with border ..................................................................................... 70
Figure 76: "Resi" layer with border ........................................................................................ 70
Figure 77: "Diel" layer with border ........................................................................................ 71
Figure 78: "Export Gerber Options" window.......................................................................... 71
Figure 79: Step-by-step guide in exporting Gerber files ......................................................... 72
Figure 80: Comparison between a) Conductor layers of the designed filter in Agilent ADS
Software; b) Actual fabricated layers using HASL finishing ................................................... 73
Figure 81: Agilent Network Analyzer E5062A ........................................................................ 76
Figure 82: 2 x BNC adaptors with 50O

termination ............................................................. 76
Figure 83: 2 x BNC to SMA cables .......................................................................................... 76
Figure 84: Connection of BNC end of cable to BNC adaptors on Agilent Network Analyzer
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E5062A ..................................................................................................................................... 77
Figure 85: Connection of SMA end of cable to SMA connectors on fabricated filter prototype
.................................................................................................................................................. 77
Figure 86: S11 response of fabricated filter prototype ............................................................ 78
Figure 87: S21 response of fabricated filter prototype ............................................................ 78
Figure 88: Simulated filter responses from Agilent ADS Software .......................................... 78











































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Index of Tables

Table 1: Time allocation........................................................................................................... 14
Table 2: Project plan (Gantt chart) ......................................................................................... 16
Table 3: Risk matrix ................................................................................................................. 18
Table 4: Applications of LTCC technology in market .............................................................. 30
Table 5: Properties of S-parameters ........................................................................................ 43
Table 6: Substrate material selection criterions ...................................................................... 50
Table 7: Substrate materials from various suppliers ............................................................... 50
Table 8: Substrate materials score chart ................................................................................. 51
Table 9: Software simulator tool selection criterions .............................................................. 51
Table 10: Pros / Cons of OSP and HASL Finishes .................................................................. 51
Table 11: Measurement capabilities of E5062A ...................................................................... 52
Table 12: Proposed specifications of initial LTCC filter design .............................................. 54
Table 13: Proposed specifications of re-modelled initial filter design (FR4-86 substrate) ..... 60
Table 14: Step-by-step guide in assembling the filter prototype .............................................. 75
Table 15: Comparison table between measured vs. simulated results ..................................... 79
































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1. INTRODUCTION

Difficulties in transmitting information end-to-end have always existed in the early days due
to the severe limitations of communication devices. This has led to a widespread interest
from various parties in the research and development of communication devices in hopes of
enhancing the capabilities.

In the current world that we live in, there is huge demand for all things to be small. In the
case of communication systems, it was also no longer good enough to be just wireless; being
small is the key and is essentially what is driving todays technology. In order to meet the
demands, evolution of compact, high reliability and performance components was necessary
to feed the advancement of wireless communication devices.

This report proposes the design of a multilayer LTCC bandpass filter in order to meet the
demands of being compact in size and ease of integration with other circuit components while
not comprising on the quality in performances and reliability.

1.1 Project Objectives

The aim of the project is to design and fabricate a multilayer LTCC bandpass filter for
microwave applications.

The proposed filter is to be designed and simulation carried out to ensure that the desired
filter responses are met. Once this is achieved, the proposed filter is then fabricated and
the actual filter response is measured. A detailed comparison analysis will then be
performed between the actual filter response and the simulated filter response.

1.2 Overall Objectives

The points below illustrate the overall objectives of this project:

- To research and understand the history and evolution of LTCC technology for
microwave applications as well as the concepts, working principles advantages
and applications behind this technology.
- To master and use Agilent Advanced Design System (ADS) software to perform
modelling and simulation of filter designs.
- To utilize and improve project and time management skills.

I consider this project to be significant as LTCC technology offers the possibility of
reducing the size of microwave devices tremendously without sacrificing performances,
which is a critical factor in order to succeed in the increasingly competitive consumer
electronics market.

The possibilities of the use of LTCC technology are limitless and we can only wait to see
what lies ahead in the evolution of LTCC technology.




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1.3 Layout of Project Report

Chapter 1: Introduction
This chapter provides an introduction to the project as well as define the objectives of the
project. It also provides a layout of the report, while the following chapters provide more
in-depth explanations.

Chapter 2: Project Management
This chapter illustrates the project management process. All project management related
activities will be highlighted in this chapter.

Chapter 3: Literature Research
This chapter illustrates on LTCC technology, microwave, micro-strip structure, RF filter
design methodologies, Agilent ADS Software, PWB finishes and Network Analyzer. This
is important as it highlights the fundamental concepts and principles for filter
implementation.

Chapter 4: Project Selections
This chapter illustrates the selection criterions of different aspects in this project such as
substrate materials, software simulator tools and etc.

Chapter 5: Development of Bandpass Filter Design
This chapter first illustrates the design of the filter prototype using LTCC technology and
the subsequent simulation results. It then illustrates the modified filter design using FR4-
86 and the subsequent simulated results.

Chapter 6: Fabrication and Assembly of Filter Prototype
This chapter illustrates the pre-fabrication process of exporting the Gerber files and the
post-fabrication process of assembling the fabricated filter prototype.

Chapter 7: Measured Results vs. Simulated Results
This chapter illustrates the measurement procedures of the fabricated filter prototype and
provides a comparison analysis between the measured and simulated filter responses.

Chapter 8: Conclusion
This chapter provides the conclusion of the project and covers some recommendations for
future work.

Chapter 9: Critical Review and Reflections
This chapter provides a collective project after thoughts in which the experience gained
during the entire duration of the project is shared.









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2. PROJECT MANAGEMENT

Effective project management will be one of the most crucial factors in achieving objectives
within the allocated time and resources. The chapter illustrates how the project is managed
and executed.

The first step in project management is to identify all the tasks required, the resources
allocated and also the possible risks involved.

The next step is to formula a plan, allocate a suitable amount of resources to each task and
manage the risks involved to reduce the occurrence.

The final but most important step is to perform continuous monitoring and review of the
progress. Project Supervisor will also be updated regularly on the progress via emails,
teleconferences or during meet up sessions.

It would be important to tap the valuable experience of the Project Supervisor and hence, all
major design issues, problems and decisions will be discussed and reviewed together.

2.1 Work Breakdown Structure (WBS)

A work breakdown structure (WBS) is used to decompose the project into smaller
components to define and group tasks so as to organize and define the total work scope of
the project



Figure 1: Work Breakdown Structure (WBS)





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2.2 Time Allocation

Group Tasks
Duration Start Date End Date
(Days)
(DD-MM-
YYYY)
(DD-MM-
YYYY)
Management Proposal
Draft Proposal 20 12/2/2011 3/3/2011
Proposal Review 2 4/3/2011 5/3/2011
Finalized Proposal 2 6/3/2011 7/3/2011
Submit Proposal 1 7/3/2011 7/3/2011
Resource
Resource Evaluation 2 18/2/2011 19/2/2011
Resource Selection 1 20/2/2011 20/2/2011
Monitor & Review 294 12/2/2011 2/12/2011
Report
Draft Interim Report 16 19/4/2011 4/5/2011
Interim Report Review 2 5/5/2011 6/5/2011
Finalized Interim report 2 7/5/2011 8/5/2011
Submit interim Report 1 9/5/2011 9/5/2011
Draft Final Report 137 23/6/2011 6/11/2011
Final Report Review 4 7/11/2011 10/11/2011
Finalized Final Report 3 11/11/2011 13/11/2011
Submit Final Report 1 14/11/2011 14/11/2011
Oral Presentation
Draft Poster 7 31/10/2011 6/11/2011
Poster Review 4 7/11/2011 10/11/2011
Finalized Poster 3 11/11/2011 13/11/2011
Submit Poster 1 14/11/2011 14/11/2011
Printing of Poster 7 15/11/2011 21/11/2011
Preparation of Presentation Slides 7 26/11/2011 2/12/2011
Actual Presentation 1 3/12/2011 3/12/2011
Requirements Literature
Research
Conduct Research 110 12/2/2011 1/6/2011
Evaluate Research Findings 93 1/3/2011 1/6/2011
Design Requirements 101 3/3/2011 11/6/2011
Fabrication Requirements 52 22/6/2011 12/8/2011
Filter
Designs
LTCC Filter
Design
Determine Specifications of Key
Parameters 3 3/3/2011 5/3/2011
Design and Analyze Simulated
Results 86 6/3/2011 30/5/2011
Finalize Filter Design 2 31/5/2011 1/6/2011
FR4-86 Filter
Design
Determine Specifications of Key
Parameters 10 2/6/2011 11/6/2011
Design and Analyze Simulated
Results 60 12/6/2011 10/8/2011
Finalize Filter Design 2 11/8/2011 12/8/2011
Fabrication
Fabricate FR4-86 Final Filter Design 28 13/8/2011 9/9/2011
Assembly and Solder Connectors 10 10/9/2011 19/9/2011
Measurement
Measure Actual Filter Response using Network Analyzer 5 20/9/2011 24/9/2011
Analyze Measured Results 5 25/9/2011 29/9/2011

Table 1: Time allocation


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The tasks involved are separated into five main groups, each focusing on a specify area of
the project.

Management

This group consist of tasks related to project management. It includes:

- The proposal of the project which defines the objectives and purpose of the
project. This provides the main direction of the project.
- Time management and resources required for the project.
- Risk management to identify all the risks and how they will be handled.
- Constant monitoring and review of progress via regular conferences with Project
Supervisor.
- Report writing to provide a documentation of the project.
- Oral presentation of project findings.

Requirements

This group consist of identifying the deliverables of the project. It includes:

- Literature research on the background of related topics. This will help in deciding
the type of filter to be designed for the project.
- Identifying the design and fabrication requirements. This will better illustrated the
deliverables in technical terms.

Filter Designs

This group consist of how the deliverables will be achieved. It includes:

- LTCC filter design which consists of determining the specifications of the key
parameters, designing the filter, analysis the simulated results and finalizing the
filter design.
- FR4-86 filter design which also consists of determining the specifications of the
key parameters, designing the filter, analysis the simulated results and finalizing
the filter design.

Fabrication

This group consist of the actual implementing of the filter prototype. It includes:

- Fabrication of the filter prototype.
- Assembly of filter prototype and soldering of connectors.

Measurement

This group consists of verifying the deliverables. It includes:

- Measuring the actual filter response of the fabricated filter prototype.
- Comparison analysis between the measured and simulated results.
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2.3 Project Plan (Gantt chart)



Table 2: Project plan (Gantt chart)

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2.4 Monitor and Review

The project will follow a strict schedule and provide detailed timely updates to the Project
Supervisor. The Work Breakdown Structure and the timeline will serve as the guide to
monitor the progress of the project.

During the meetings, the timeline will be reviewed to check if the project progress is still
in line with the planning. Necessary adjustments will have to be made if there are
slippages.

Whenever there is a major design decision to be made, the Project Supervisor will be
consulted so as to seek his advice on the matter. It is important to seek a second opinion
from an experienced individual like the Project Supervisor to ensure that the project do
not go off track.

Please refer to Appendix H for the Meeting Logs.

2.5 Resources Required

The following table shows the resources required for the completion of this project.



Figure 2: Resources required








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2.6 Risk Management

It is important to identify all potential risk(s). Each risk will be accessed to determine the
risk level, impact and possible solution(s). A Risk Matrix will be tabulated and reviewed
frequently with the Project Supervisor.



Table 3: Risk matrix



























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3. INVESTIGATION OF PROJECT BACKGROUND

3.1 Literature Review on LTCC Technology

One of the most promising integration technologies is the multilayer Low Temperature
Co-fired Ceramic (LTCC) technology. Passive components, such as inductors, capacitors
and filters, can be integrated into the multilayer LTCC substrate using this technology.

The product is based on a glass-ceramic composite and components are made up of
several layers of green sheets with the required circuits printed on them. These layers are
processed in parallel and are stacked accurately prior to firing.

LTCC technology for microwave applications plays an important role in the development
of future electronic devices in high frequency applications for IC packaging radar,
antennas and wireless technologies. In wireless applications, the integration of passive
components corresponds to the trend of mobilization and miniaturization with high
electrical performance using conductive electrode materials such as gold, silver and
copper.

3.1.1 Brief Historical Review

The origin of multilayer ceramic substrate technology is said to lie in developments at
RCA Corporation in the late 1950s, and the bases of current process technologies
(greensheet fabrication technology, via forming technology, and multilayer laminate
technology using the doctor blade method) were discovered at this time. Thereafter,
progress was made using these technologies with IBM taking the lead and the circuit
board (board size: 9cm
2,
with 33 layers, and 100 flip chip bonded LSI components) for
IBMs mainframe computer commercialized in the early 1980s was the inheritance.
Since this multilayer board was co-fired at the high temperature of 1600 C with the
alumina insulating material and conductor material (Mo, W, Mo-Mn), it is called High
Temperature Co-fired Ceramic (HTCC) to distinguish it from the Low Temperature
Co-fired Ceramics (LTCC) developed later. From the middle of the 1980s, efforts to
increase the speed of the mainframe computers accelerated, and as the key to
increasing computer performance, further improvements were made to multilayer
ceramic substrates for high density mounting applications. By using finer wiring in
order to increase wiring density in circuit boards for high density mounting, the
electrical resistance of the wiring increase, and conspicuous attenuation of the signal
occurs. Therefore it is necessary to use materials with low electrical resistance (Cu,
Au or the like) for the wiring. In addition, which the flip chip method of connecting
bare LSI components directly, poor connection of the interconnects may result if the
thermal expansion of the board is not close to that of the silicon components (3.5 x 10
-
6
/C), therefore an insulating material with low thermal expansion (ceramic) is
desirable . Furthermore, to achieve high speed transmission of signals, it is necessary
to ensure that ceramic has a low dielectric constant. By the early 1990s, many
Japanese and American electronics and ceramics manufacturers had developed
multilayer boards (LTCC) that met these requirements. Among them, Fujitsu and IBM
were the first to succeed with commercial applications of multilayer substrates using
copper wiring material and low dielectric constant ceramics. From the latter half of
the 1990s to the present, the focus of applications has shifted to high frequency
wireless for the electronic components, modules and so on used in mobile
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communication devices, primarily mobile phones. For the multilayer circuit board, the
low thermal expansion of ceramics was its biggest merit for the purposes of high
density mounting of LSI components. However, for high frequency communications
application, its low transmission loss is its key feature, and the low dielectric loss of
ceramic gives it an advantage over other materials [1].



Figure 3: Multilayered ceramic circuit board for mainframe computers produced by
Fujitsu (Size 245 x 245mm, 52 layers) (Bar = 50 mm)



Figure 4: Cross-sectional view of the circuit board with Cu in internal wiring (via
diameter: 80m. conducting line width: 80m, line spacing: 100 m, dielectric
material thickness per layer: 200 m)

3.1.2 What is LTCC Technology?

Young and technology-savvy consumers are constantly seeking for smaller, higher
quality, more reliable, faster operation speed and lower cost electronics apparatus
such as mobile communication devices. This has led to the evolution in the
manufacturing industry of multichip modules and multi-layer structure components,
whereby more than two wiring layers are required.
The multilayer Printed Wiring Board (PWB) was hence developed, which allowed
passive devices to be surface mounted as discrete elements. The subsequent advance
in technology gave rise to the Embedded Passive Technology (EPT), which made it
possible to integrate passive elements such as resistors and capacitors (created from
film technology) into the inner layers.

21 | P a g e



Figure 5: Passive elements

The advantages of having embedded passive elements as compared to surface mount
devices (SMD) are as follows:

- Increase in reliability due to reduction in solder bonding.
- Reduction of elements to be placed and attached.
- Reduction of circuit sizes.
- Increase in signal propagation speed.
- Better electromagnetic immunity.
- Lower prime cost.

When it is necessary to use better material than plastic carrier, ceramics or glass-
ceramics will be used. There are two types of raw ceramics to manufacture Multi-
Layer Ceramic (MLC) substrate:

- Ceramics fired at high temperature (T 1500 C): High Temperature Co-fired
Ceramic (HTCC).
- Ceramics fired at low temperature (T 1000 C): Low Temperature Co-fired
Ceramic (LTCC).



Figure 6: Differences between HTCC and LTCC

The base material of HTCC is usually Al2O3 and HTCC substrates are row ceramic
sheets. The material of the embedded layers can only be high melting temperature
metals such as wolfram, molybdenum or manganese due to the high firing
temperature of Al2O3 hence, resulting in the substrate being unsuitable to integrate
passive elements. It is possible though to produce thick-film networks and circuits on
the surface of HTCC ceramic.

22 | P a g e

HTCC substrates could be only manufactured by companies possessing ceramic
technology and the breakthrough came about when the mixing of glass to slurry
resulted in the firing temperature of ceramic-glass substrate to be reduced to 850 C
so that the equipment for conventional thick-film process could be used. LTCC
technology which evolved from HTCC technology inherited the advantageous
features of thick-film technology. Because of the low firing temperature (850 C), the
same materials are used for producing buried and surface wiring and resistive layers
as thick-film hybrid IC (i.e. Au, Ag, PdAg or Cu wiring RuO2 based resistive layers).
It can be fired in an oxygen-rich environment unlike HTCC boards, where reduced
atmosphere is used.

Glass is chosen as the component due to fact that it crystallizes at the temperature of
850 C as well as possessing high bend strength and good electrical parameters.
During the co-firing process, the glass melts and the conductive and ceramic particles
are sintered. The following figure shows the distribution of glass particles in LTCC
glass-ceramic before and after firing.



Figure 7: Evolving binding at melting of glass in LTCC glass-ceramic structure

Hybrid integrated circuits can be realized on the surface of the LTCC substrates and
passive elements can be buried into the substrate. Semiconductor chips can be placed
in a cavity and in some applications, embedded channels are shaped. The number of
layers can be as high as 40. The following figure shows the structure of a complex
circuit realized using LTCC technology [2].



Figure 8: Complex LTCC circuit structure

23 | P a g e

3.1.3 Advantages of LTCC Technology

The LTCC technology avoids many disadvantages that others have and offers the
following benefits [2]:

- Economizes multiple steps of the manufacture process compared with the
conventional thick-film technology (parallel processing).
- Mass production methods can be really applied (several processing steps can
be automated).
- Fabrication techniques are relatively simple and inexpensive.
- Tapes of different compositions can be manufactured with desired layer
properties.
- Thermo-physical properties can be modified.
- Possibility of auto-packaged devices fabrication.
- Electronic circuits can be integrated, using its hybrid nature.
- Design and manufacture 3-dimensional circuits.
- Possibility of cutting the tape / substrate into different shapes.
- Because of the possibility to bury passive components within the substrate, it
reduces the size of circuits (down to about 50 percent in comparison to the
PCB).
- Number of signal layers almost unlimited.
- Ability to perform at frequencies over 30GHz.
- High resistance against ambient working temperatures (up to 350C).
- Good thermal conductivity compared to PCBs (factor 10).
- Good match to semiconductor TCEs.
- Very good hermeticity of the substrate.



Figure 9: Why use LTCC? 1 = Good / 2 = Average / 3 = Bad



24 | P a g e

3.1.4 Process of LTCC Technology

The LTCC process and HTCC process are basically the same except that HTCC
processing requires additional steps such as complex firing conditions, flattening fires
and plating steps [3].



Figure 10: Overall process of LTCC technology

Slitting

Greensheets are shipped on a roll most of the time. The tape has to be unrolled onto a
clean, stainless steel table and cut with a razor, laser or a punch into parts (these parts
have to be a little larger than the blank size, if the material needs to be
preconditioned). If a laser is used, it is important to control the power to avoid firing
of the sheets.



Figure 11: Raw glass-ceramic sheets

25 | P a g e

Preconditioning

Some of these tapes need to be preconditioned. What this means is that the greensheet
has to be baked at 120C for about 30 minutes depending on manufacturer and
material. An example of this would be the DuPont GreenTape. These tapes are
normally shipped with an applied foil or bake sheet, which has to be removed before
the lamination process at the latest. This foil is sometimes used as a filling mask for
the vias by some processors.

Blanking

Orientation marks and lamination tooling holes (and the final working dimension in
case of preconditioned tapes) are created using a blanking die. It is important to note
that it is preferred to rotate the single parts in turns of 90 to compensate for the
different x/y-shrinking of the LTCC.

Forming Vias

Vias may be punched or drilled with a low power laser.



Figure 12: Result of laser punching with proper parameters: a) Plane of 200 m
diameter hole, lighted from above; b) Plane of the same hole, light from under; c)
Worms-eye view of 200 m hole, light from under; d) Raggedness of the edge of 200
m diameter hole

26 | P a g e

Filling Vias

Vias can be filled with a conventional thick film screen printer or an extrusion via
filler.

In the former, the tape has to be placed on a sheet of paper lying on top of a porous
stone and it is held in place by a vacuum pump which is also used as an aid for via
filling. It is important to note that the possibilities of this method are limited as the
vias must have a larger diameter than tape thickness and the smallest possible size of
vias to be filled also depends on the viscosity of the paste. In the latter, the vias is
filled up using a special extrusion via filler that works with pressures of about 4 4.5
bar.

Both methods require a mask which should be made of 150 200 mm thick stainless
steel. Another alternative is to use the Mylar-foil that the tape is usually applied on.

For the filling of blind vias, it is advisable to form the holes concerned of the masks a
little smaller than the diameter of the blind vias. Otherwise, problems might occur
with the filling rate.



Figure 13: Filling via holes of LTCC circuits with vacuum-drawing




Figure 14: Schema of via-filling


27 | P a g e

Printing

A conventional thick film screen printer is used to print the co-fireable conductors and
etc on the greensheet. The screens are standard (250 325) emulsion type thick film
screens. A porous stone is also used to hold the tape in place. Due to the flatness and
solvent absorption of the tape, printing of the conductor tends to be easier and of
higher resolution than standard thick film on alumina. After printing, the vias and
conductors have to be dried in an oven at 80 120C for 5 30 minutes depending on
material. Some pastes need to level at room temperature for a few minutes before
drying. It is good to note that resistors may vary their value when terminated with
different conductors. With the help of a Micro-Screen printer, it is possible to print
conductors with a 50mm line resolution.

Register for Lamination

Each layer is placed in turns over tooling pins. Some processors use heat pliers to fix
the sheets in turns one on top of the other.

Lamination

There are two methods of laminating tapes. The first method is called uniaxial
lamination and the second method is called isostatic press. In uniaxial lamination, the
tapes are pressed between heated platens at 70 C, 200 bar for 10 minutes (typical
values). This method requires a 180 rotation after half the time. The uniaxial
lamination could give rise to problems with cavities / windows and also causes higher
shrinking tolerances as compared to isostatic lamination. The main problem is the
flowing of the tape resulting in high shrinkage tolerances (especially at the edge of the
part) during the firing and varying thicknesses of single parts of each layer (causes
hard problems on the high frequencies sector).

In isostatic press, the stacked tapes are vacuum sealed in a foil and pressed in hot
water. In isostatic press, only the pressure which is about 210 bar, is different when
compared to uniaxial lamination. The other factors during the pressing process such
as temperature and the duration are kept the same.

It is important to note that after the lamination process, the substrate has deformation.
Small amount of divergence from the prescribed parameters can cause delamination.
The following figure shows the five typical types of delamination defects after firing.



Figure 15: Five typical types of delamination defects after firing: a) Vertical spitting;
b) Internal interlayer delamination; c) Stepped interlayer delamination; d) Surface
blistering; e) Circular delamination

28 | P a g e

Co-firing

Laminates are fired in one step on a smooth, flat setter tile. The firing should follow a
specific firing profile hence the need for a programmable box kiln.

A typical profile shows a slow rising temperature of about 2 5 C per minute up to
about 450 C with a dwell time of about one to two hours, where the organic burnout
(binder) takes place.

The temperature is then raised up to 850 875 C with a dwell time of about 10 to 15
minutes. The whole firing cycle lasts between three and eight hours depending on the
material (large / thick parts cause the need of a modification to the firing profile).

The following figure shows the heat profile of DuPont 951 Green Tape.



Figure 16: Heat profile of DuPont 951 Green Tape: 1) Warm up; 2) Keep
temperature; 3) Warm up; 4) Keep temperature; 5) Cooling

During firing, the LTCC substrates shrink and the value of it in case of DuPont 951
raw glass-ceramic is between 12% and 16% (+-0.2%) in the x and y axes and between
15% and 25% (+-0.5%) in the z axes (thickness). The following figure below shows
the shrinkage of the substrate.



Figure 17: Shrinkage of LTCC substrate caused by firing

It is important to note that resistor pastes need to have defined firing conditions
(temperatures) else they vary enormously in value.

29 | P a g e

Post-firing

Some materials need to be post-fired. What this means is that, after the first round of
firing, the paste is to be applied followed by another round of firing. The post-firing
conditions depend on the material used and vary broadly. It is important to note that
resistor pastes need to have defined firing conditions (temperatures) else they vary
enormously in value.

Singulation

If the fired parts have to be cut into smaller pieces or other shapes, there are three
different methods to go about doing so. The first method which is also the most
commonly used method is to use a post fire dicing saw. This method works very well
for rectangular shapes, holds tight outside dimensional tolerances and allows high
quality edges. The second method is to use an ultrasonic cutter. The final part shows
low tolerances and may have unusually shapes. This process is also very slow and
expensive. The third method uses a laser to cut the fired tape. The tolerances are tight
but the qualities of the edges are poor.

3.1.5 Applications of LTCC Technology

The following table highlights some of the applications of LTCC technology used in
the market [4].

S/N Application Frequency Picture
1 Bandpass Filter 24.5 25.5 GHz

2 Waveguide BP-Filter 40.5 41.5 GHz

3 Space: Power Distribution
Network
19 GHz

4 Galileo EBG Patch Antenna 1.23/1.57 GHz

30 | P a g e

5 Bluetooth Modules 2.45 GHz

6 FMCW Radar Sensor 24 GHz

7 WLAN Tx and Rx Modules
with Antenna
60 GHz

8 Microwave package DC 40 GHz

9 Voltage Controlled Oscillator 23 26 GHz

10 SPDT Switch 40 45 GHz

11 Amplifier 21 27 GHz


Table 4: Applications of LTCC technology in market

3.2 Literature Review on Microwave

Essentially, microwaves are electromagnetic waves which travel in straight lines, like
light waves. Their wavelength range from one millimetre to as long as one meter or
equivalently, with frequency range between 0.3 GHz 300 GHz. This includes the entire
Super High Frequency (SHF) band (3 to 30 GHz, or 10 to 1 cm) as well as both the Ultra
High Frequency (UHF) and Extremely High Frequency (EHF) band. In RF engineering,
the upper boundary is normally specified to be around 100 GHz (3mm) with the lower
boundary specified at 1GHz (30cm).

31 | P a g e

When the wavelengths of signals are approximately the same as equipment dimensions,
the apparatus and techniques may be described qualitatively as microwave, so that
lumped parameter model is inaccurate. As a result, practical microwave technique tends
to move away from the discrete capacitors, inductors and resistors which are used with
lower frequency radio waves. Instead, transmission-line theory and distributed circuit
elements are more useful methods for design and analysis. Open-wire and coaxial
transmission lines give way to waveguides and stripline, and resonant lines or cavity
resonators can be used to replace lumped-element tuned circuits. Effects of reflection,
diffraction, scattering and atmospheric absorption usually associated with visible light are
of practical significance in the study of microwave propagation. The same equations of
electromagnetic theory apply to all frequencies [6].


Figure 18: Structure of stripline configuration filter with LTCC

3.2.1 Microwave Frequency Bands

Microwave spectrum is usually defined as electromagnetic energy ranging from
approximately 1 GHz to 100GHz in frequency. Lower frequencies were included in
older usages. Most common applications are within the 1 to 40 GHz range [6].

The different microwave bands are listed in the following table.



Figure 19: Microwave frequency bands

32 | P a g e

3.2.2 Applications of Microwave

The following are some of the applications of microwave [6]:

Communication

- Wireless LAN protocols for example, Bluetooth.
- Metropolitan area networks for example, Worldwide interoperability for
Microwave Access (WiMAX).
- Wide area mobile broadband wireless access.
- Mobile phone networks for example, GSM.
- Microwave radio used in telecommunication and broadcasting transmissions.
- Satellite communications system.

Radar

- Microwave radiation is used to detect the speed, range and other
characteristics of remote objects for example, air traffic control.

Radio astronomy

- Active radar experiments with objects in the Solar system for example,
determination of the distance to the Moon and mapping the invisible surface of
Venus through cloud cover.

Navigation

- Global Navigation Satellite Systems (GNSS) for example, the Chinese
Beidou, the American Global Positioning System (GPS) and Russian
GLONASS.

Power

- Microwave heating used in industrial processes for example, to dry and cure
products.

3.3 Literature Review on Micro-strip Structure and Waves in Micro-
strips

A micro-strip is a type of electrical transmission line which is used to convey microwave
frequency signals. The figure below illustrates the general structure of a micro-strip. It
consists of a micro-strip line with a width of W, and a thickness of t. The micro-strip line
is placed on top of a dielectric substrate that has a thickness of h, and a relative dielectric
constant of c
r
. This dielectric substrate is connected to the ground plane.

33 | P a g e



Figure 20: General micro-strip structure

The figure below shows clearly that the fields in the micro-strip are extended within two
media, which are the air above and the dielectric below. The presence of these two
guided-wave media causes the micro-strip structure to be inhomogeneous and modifies
the mode of propagation to a non-TEM hybrid mode. This causes the propagation
velocities to be dependent on the material properties, which are the permittivityc , the
permeability and dimensions of the micro-strip. According to [8], the non-TEM nature
of the micro-strip is the result of the fringing components E
x
and H
x
at the dielectric-air
interface.



Figure 21: Waves in micro-strip structure

3.3.1 Fringing Effects, Effective Dielectric Constant and Characteristic
Impedance in Micro-strips

When the width W of the micro-strip is much smaller than the height h of the
dielectric substrate, fringing effect will occur and cause the electric fields between the
dielectric-air interface to vary and hence, resulting in a drift of the resonant frequency.

It is therefore, very important to minimise this fringing effect and thus, the effective
dielectric constant c
re
has been introduced to counter the effects of fringing. The closed
form expression of c
re
and the characteristic impedance Z
c
given by [9] are as follows:

34 | P a g e

For narrow micro-strip, W/h s 1:

c
re
=
c
r
+1
2
+
c
r
1
2
1+12
h
W
|
\

|
.
|
0.5
+ 0.04 1
W
h
|
\

|
.
|
2

(
(
(1)
Z
c
=
q
2t c
re
In
8h
W
+0.25
W
h
|
\

|
.
|

whereq=120t ohms is the wave impedance in free space

For wide micro-strip, W/h > 1:

c
re
=
c
r
+1
2
+
c
r
1
2
1+12
h
W
|
\

|
.
|
0.5
(2)

Z
c
=
q
c
re
W
h
+1.393+0.677In
W
h
+1.444
|
\

|
.
|
|
\

|
.
|
1

whereq=120t ohms is the wave impedance in free space

3.3.2 Guided Wavelength and Physical Length of Micro-strips

The physical length l of the micro-strip, which is known as the quarter wavelength
and half wavelength micro-strip lines, can be obtained for the design of micro-strip
filter once the effective dielectric constant c
re
is calculated. The physical length l of the
micro-strip is calculated using the followings equations:

For half wavelength micro-strip:

l =

g
2
(3)
where
g
is the guided wavelength

For quarter wavelength micro-strip:

l =

g
4
(4)
where
g
is the guided wavelength

The guided wavelength is expressed as:

g
=

0
c
re
(5)
where
0
is the free space wavelength of the operating frequency f


35 | P a g e

3.3.3 Micro-strip Losses

A micro-strip has three basic types of losses, conductor losso
c
, dielectric losso
d
and
radiation loss. When designing a micro-strip filter, it is imperative to take note and
account for these losses.

Conductor Loss

The expression for the attenuation contributed by the conductor losso
c
is:

o
c
=
8.686R
s
Z
c
W
dB/unit length
where R
s
= surface resistance in ohms per square for the strip conductor and ground
plane

R
s
can be expressed as:

R
s
=
e
0
2o

where o = conductivity
e = angular frequency

0
= permeability of free space = 4t x 10
7


From these expressions, it can be concluded that a high conductivity material will
suffer less attenuation.

Dielectric Loss

The expression for attenuation contributed by the dielectric losso
d
is:

o
d
= 8.686t
c
re
1
c
r
1
|
\

|
.
|
c
r
c
re
|
\

|
.
|
tano

g
|
\

|
.
|
dB/unit length
where o = loss tangent of the dielectric substrate

The following figure illustrates clearly that the dielectric substrate with lower loss
tangent will suffer from lesser attenuation.



Figure 22: Loss Tangent effects on S11 and S21

36 | P a g e

Radiation Loss

Due to the semi-open structure of the micro-strip, any radiation is either free to
propagate away or to induce current on the metallic enclosure, causing radiation loss
which is also known as housing loss. To minimise radiation loss, the height of the
enclosure H should be at least eight times the substrate thickness h while the distance
to the sidewalls L, should be at least five times the substrate thickness h.



Figure 23: Configuration of micro-strip enclosure

3.4 Literature Review on RF Filter Design Methodologies

RF and microwave filters are electronic filters that perform signal-processing functions to
specifically enhance desired frequency components and remove undesired ones from
signals operating in MHz GHz frequency range.

Let us kick off this section by briefly reviewing the four basic types of filters, low-pass
filter, high-pass filter, bandpass filter and bandstop filter. This is followed by a discussion
on the actual filter responses such as, Butterworth and Chebyshev filters. To cap it off, we
will also discuss about the realization of RF filters.

3.4.1 Basic RF Filters

Let us kick off this section by briefly reviewing the four basic types of filters, low-
pass filter, high-pass filter, bandpass filter and bandstop filter. This is followed by a
discussion on the actual filter responses such as, Butterworth and Chebyshev filters.
We will also discuss about the realization of RF filters as well as multilayer design
techniques.

37 | P a g e

Low-Pass Filter

- Allows low-frequency signals to pass through and attenuates the signals with
frequencies higher than the cut-off frequency.

High-Pass Filter

- Opposite of low-pass filter. It allows high-frequency signals to pass through
but attenuates the signals with frequencies lower than the cut-off frequency.

Bandpass Filter

- Allows frequencies within a certain range to pass through and rejects the
signals with frequencies outside the range.

Bandstop Filter

- Passes most frequencies unaltered, but rejects those signals with frequencies in
a specific range.



Figure 24: Frequency behaviour of four basic filter types

38 | P a g e

Butterworth Filter

A Binomial or Butterworth filter is generally easy to implement as it possesses a
monotonic attenuation profile. However, a higher order which requires more
components is required in order to attain a steep attenuation transition from the pass to
stop band.

A steeper transition from the pass to stop band can be achieved if a certain degree of
variations in the pass-band is permitted.

Chebyshev Filter

A Chebyshev filter has ripples that maintain at equal amplitude in either its pass-band
or stop-band attenuation profile. It also has a steeper attenuation transition from the
pass to stop band as compared to Butterworth filter.

The following figure shows the attenuation profile of Butterworth and Chebyshev
filter.



Figure 25: Attenuation profile of Butterworth and Chebyshev filters

Realization of RF Filters

In order to achieve a realizable filter, filter coefficients have to be de-normalized to
meet realistic frequency and impedance requirements. In addition, the standard low-
pass filter has to be transformed to the required filter types such as high-pass,
bandpass or bandstop. This can be achieved using frequency transformation and
impedance transformation.

It is also important to note that realization of filter designs using discrete components
beyond 500 MHz is extremely difficult as the wavelength becomes comparable with
physical filter element dimensions. This results in various losses and degradation in
circuit performance. Therefore, for practical realization of RF filters, the lumped
component filters must be converted into distributed element realizations.

Tools required to accomplish the conversion are namely Richards transformation and
Kurodas identities, which are discussed by R. Ludwig and P. Bretchko [5].

39 | P a g e

Multilayer Design Techniques

When compared against the single layer technology, the multilayer technology is
highly preferred because of advantages such as reduction in circuit dimensions, ease
of fabrication and high integration density. A typical architecture of a multilayer
design consists of a core material that has been laminated on both sites by a thin layer
of copper metal which can be used as a distributed element for the circuit design. An
epoxy layer is introduced to separate the signal layer and ground layer due to the fact
that the circuit needs to be grounded. The circuit would normally be exposed to air in
practice but however, the circuit would be simulated with the assumption that it is in
an enclosed boundary. This will result in air being recognized as vacuum instead. The
figure below shows the typical architecture of a multilayer design [33].



Figure 26: Typical architecture of a multilayer design

3.4.2 Micro-strip Bandpass Filter Designs

This section will describe briefly, the general configuration of some micro-strip
bandpass filter types [9].

End-Coupled, Half Wavelength Resonator Filter

The following figure shows the general configuration of an End-Coupled micro-strip
bandpass filter. Each open-end micro-strip resonator is approximately a half guided
wavelength long at the centre frequency of the band-pass filter. The coupling from
one resonator to the other is through the gap between two adjacent open ends, and
hence is capacitive.



Figure 27: General configuration of an End-Coupled, half wavelength resonator filter

40 | P a g e

Parallel-Coupled, Half Wavelength Resonator Filter

The figure below shows the general configuration of the Parallel-Coupled micro-strip
bandpass filter that uses half wavelength line resonators. They are positioned so that
adjacent resonators are parallel to each other along half of their length. This
arrangement provides a relatively large coupling for a given spacing between
resonators, hence producing a wider bandwidth.



Figure 28: General configuration of a Parallel-Coupled, half wavelength resonator
filter

Hairpin-Line Bandpass Filter

The following figure illustrates the general configuration of the Hairpin-Line
bandpass filter. Hairpin-Line filter provides a compact structure, which is suitable for
small size realization. They can be conceptually obtained by folding the resonators of
the parallel-coupled micro-strip filter into a U shape. However, a full-wave EM
simulation is required for accurate design of this filter.



Figure 29: General configuration of a Hairpin-Line bandpass filter

41 | P a g e

Inter-Digital Bandpass Filter

The figure below illustrates the general configuration of an Inter-Digital bandpass
filter. It consists of an array of n TEM-mode or quasi-TEM-mode transmission line
resonators, each having length of a quarter wavelength at the centre frequency. The
resonators are short-circuited at one end and open-circuited at the other end with
alternative orientation. Coupling is achieved by the way of the fields fringing between
adjacent resonators separated by spacing S
i,i +1
.



Figure 30: General configuration of an Inter-Digital bandpass filter

3.4.3 Network Variables and Scattering Parameters

The following figure shows a Two-port network which can be used to represent most
microwave filters and filter components. The voltage and current variables at ports 1
and 2 are denoted asV
1
, V
2
, I
1
and I
2
respectively while the terminal impedances at
port 1, port 2 and the source or generator voltage are denoted
as Z
01
, Z
02
and E
s
respectively.



Figure 31: Two-port network configuration

42 | P a g e

The voltage and current variables are complex amplitudes when considering
sinusoidal quantities and hence, the sinusoidal voltage can be represented by:

V
1
t ( )= V
1
cos et +| ( )= Re V
1
e
j et +| ( )
( )
= Re(V
1
e
jet
)

where Re denotes the real part of the expression and the complex amplitude, V
1
is
defined by:

V
1
= V
1
e
j|


To analyze filter networks at microwave frequencies, incident waves a
n
and the
reflected waves b
n
are introduced. The relationship between the wave variables and
the voltage and current variables are as follows:

V
n
= Z
0n
(a
n
+ b
n
)
I
n
=
1
Z
0n
(a
n
b
n
)


or

a
n
=
1
2
(
V
n
Z
0n
+ Z
0n
I
n
)
b
n
=
1
2
(
V
n
Z
0n
Z
0n
I
n
)

where the subscript n = 1 or 2, representing ports 1 and 2 respectively

The scattering or S-parameters can be used to describe and analyze the operation and
electrical characteristic of microwave networks such as filters. Electrical properties of
the network components that can be expressed using S-parameters are reflection
coefficient, transmission coefficients, insertion loss, return loss, voltage standing
wave ratio (VSWR), amplifier stability and gain. The S-parameters of a Two-port
network defined in terms of wave variables are as follows:

S
11
=
b
1
a
1
a
2
=0
=
reflected power at port 1
incident power at port 1
S
21
=
b
2
a
1
a
2
=0
=
transmitted power at port 2
incident power at port 1
S
22
=
b
2
a
2
a
1
=0
=
reflected power at port 2
incident power at port 2
S
12
=
b
1
a
2
a
1
=0
=
transmitted power at port 1
incident power at port 2

where a
n
= 0 implies a perfect impedance match at port n

43 | P a g e

The parameters S
11
and S
22
are known as reflection coefficients and S
12
and S
21
are the
transmission coefficients. S-parameters are complex in general and their amplitudes
are often represented in decibels (dB):

20log S
mn
dB
where m, n = 1, 2

The reflection coefficients S
11
and S
22
can also be expressed in terms of terminal
impedance ( Z
01
or Z
02
) and input impedance ( Z
in1
or Z
in2
) for network analysis and
synthesis as:

S
11
=
Z
in1
Z
01
Z
in1
+ Z
01
S
22
=
Z
in2
Z
02
Z
in2
+ Z
02

where Z
in1
is the input impedance at port 1, Z
in1
=
V
1
I
1

and Z
in2
is the input impedance at port 2, Z
in2
=
V
2
I
2


The Insertion Loss, L
A
between the ports n and m and the Return Loss, L
R
at port n of a
filter can be represented as:

L
A
= 20log S
mn
dB
where m, n = 1, 2 ( m = n )

L
R
= 20log S
nn
dB
where n =1, 2

The voltage standing wave ratio (VSWR) which can be used instead of Return Loss is
expressed by:

VSWR =
1+ S
nn
1 S
nn


Useful network analysis can be obtained with the above S-parameters. The table
below shows several properties of S parameters [9].



Table 5: Properties of S-parameters

44 | P a g e

The following graphs shows the S-parameters generated from Agilent ADS Software
Momentum. For a good filter design, the reflection coefficient should be less than -
10dB, the transmission coefficient should be close to 0dB and have a flat response. In
addition, the filter network should also look symmetrical.



Figure 32: Snapshots of S-parameters generated from Agilent ADS Software
momentum

3.5 Agilent Advanced Design System (ADS) Software

Agilent Advance Design System (ADS) Software is the leading electronic design
automation software for Radio frequency, signal integrity applications and microwave.
Agilent ADS software enjoys high usage by the leading companies in wireless
communication and networking as well as in defence and aerospace industries. Agilent
ADS software can be used as a high frequency design platform for LTE, WiMAX, radar
and satellite [7].



Figure 33: Agilent ADS Software user interface

45 | P a g e

3.5.1 Key Benefits of Agilent ADS Software

The following points are the key benefits of using Agilent ADS Software [7]:

- Agilent ADS Software is a complete and integrated set of fast, easy to use and
accurate system. Circuit and EM simulators enable first-pass design success in
a complete desktop flow.
- Agilent ADS Software has application-specific Design-Guides which
encapsulates years of expertise with a user-friendly interface.
- Agilent ADS Software is supported exclusively or months earlier than others
by leading industry and foundry partners.

3.6 Printed Wiring Board (PWD) Finishes

This section will briefly describe the process cycle of Organic Solderability Preservative
(OSP) and Hot Air Solder Levelling (HASL), which are the two commonly used finishes
in the Printed Wiring Board (PWB) industry today.

3.6.1 Organic Solderability Preservative (OSP)

Organic Solderability Preservative (OSP) is the most widely used coating material in
lead-free soldering due to its low cost, excellent solderability performances and easy
processing method. An anti-oxidant film which is applied onto the exposed copper
surfaces will establish a reaction with the copper, producing a form of organometallic
layer known as the OSP. The coating thickness is approximately 0.1 to 0.5 microns.
OSP has a shelf life of about six months. The flow diagram below illustrates a typical
OSP process.



Figure 34: Typical OSP process

46 | P a g e

Acid Cleaning

An acidic cleaner solution is used to remove surface oils and soldermask residues
from the exposed copper surfaces. This is to prepare the surface to ensure the
controlled, uniform etching process in subsequent stages.

Microetch

Microetch solution, which typically consists of dilute Hydrochloric, Sulphuric, or
Acetic acid, is used to process the board. This etching process removes remaining
contaminants and chemically roughens the surface of the copper to promote adhesion.

Air Knife

Excess solution from the panel is removed via use of an air knife to minimise
oxidation, formation and drag-in of sulfates on the copper surface prior to the OSP
coating application.

OSP

A protective OSP layer is selectively deposited on the exposed copper surfaces by the
OSP formulation in a water and acid bath. This chemically bonds the protective layer
to the copper, forming an organometallic layer that preserves the solderability of the
copper surface for future assembly.

Air Knife

Excess OSP from the panel is removed using an air knife to ensure even coating
across the entire Printed Wiring Board (PWB) surface. This minimises the chemical
losses through drag-out from the OSP bath.

Dry

The final stage of the OSP process is to use warm-air drying to cure the OSP coating
and remove any residual moisture from the board.

3.6.2 Hot Air Solder Levelling (HASL)

Hot Air Solder Levelling (HASL) is a reliable technique used in the industry to ensure
the solderability of PWB during fabrication and through assembly as it provides
protection of the solderable surface from corrosion and contamination. It is a popular
choice in the industry today due to its several benefits including its excellent shelf life
(typically a year, under normal storage conditions). The flow diagram below
illustrates a typical HASL process.

47 | P a g e



Figure 35: Typical HASL process

Pre-Clean

Contaminants from the surface of the copper metal are removed using a microetch
solution which consists of chemistries of Ferric Chloride, Sodium Persulfate or
Peroxide Sulphuric. This is followed by water rinsing and hot air drying.

Pre-Heat

The panel is heated at typically 490F to 510F. The function of the pre-heating stage is
to minimise thermal shock to the PWB when it is immersed in molten solder and also
to prevent blocked or reduced holes.

Flux

Flux is used to provide adequate lubrication to the panel, promote coverage, wetting
of the solder and when applicable, be compatible with oil blankets on the solder. Flux
can be applied by immersion, rolls or spray.

Solder Coating

This is the actual application of the solder. Solder coating should be accomplished in
the shortest possible time, typically less than 2 seconds, to provide adequate solder
wetting with a thin layer of intermetallic compound (IMC). IMC bond is the
formation of the base copper and the solder.

48 | P a g e

Levelling

A pressurized hot air knife is used to remove excess solder, level the remaining
deposits and clear the holes of excess solder. The typical air temperature and air
pressure used are 400F to 500F and 12 to 30 psi respectively.

Cool Down

The levelled molten solder must be allowed to cool down and solidify before the final
stage of post-clean. This is to prevent panel warpage or thermal shock when entering
the post-clean liquid.

Post-Clean

Post-cleaning is the final stage of the HASL process. The primary function of this
stage is to remove any remaining flux from the surface of the PWB after levelling.
Post-cleaning operation typically includes a detergent wash followed by a water rinse
[22].

3.7 Network Analyzer

A network analyzer is a test instrument used to analyze the response of devices and
components at RF or microwave frequencies. This analysis will allow engineers to
understand how the devices will work within the RF circuit for which it is intended.
Devices and components such as transistors, mixers, filters and frequency sensitive
networks are characterized and measured using network analyzer.

The three main types of network analyzers are:

Scalar Network Analyzer (SNA)

- SNA is the simplest among the three types as it only measures the amplitude
properties of the Device under Test (DUT).

Vector Network Analyzer (VNA)

- VNA is more useful compared to SNA as it is able to measure both amplitude and
phase responses of the DUT.

Large Signal Network Analyzer (LSNA)

- LSNA is a highly specialized network analyzer used to investigate the
characteristics of the devices under large signal conditions. It is able to examine
the harmonics and non-linearity of a network under these conditions and provide a
full analysis of its operations.

A typical network analyzer may be divided into four basic blocks, each with its own set of
specialized functions. The following figure shows the four basic blocks of a typical
network analyzer.

49 | P a g e



Figure 36: Basic blocks of a typical Network Analyzer

In the RF network analyzer stimulus/source block, a signal is first generated and applied
to the DUT to obtain its response. The stimulus or RF signal source is essentially a form
of signal generator. There are generally two modes; one is to sweep the power level while
the other is to sweep the frequency.

The stimulus or RF signal is then pass to the signal separation section, where a portion of
the incident signal is measured to provide a reference termed as ratioing using either a
splitter or directional coupler. The incident and reflected travelling waves are also
separated at the input of the DUT in this section using couplers or bridges.

Next, a radio receiver with a demodulator or detector, in the receiver and detector section,
is used to process the signal from the signal separation section to obtain the response of
the DUT.

The processed RF signal from the receiver and detector section is then displayed in a
format that can be interpreted in the processor and display section. With the levels of
processing available today, very sophisticated features are available in most modern
network analyzers. These features included linear and logarithmic sweep, linear and log
formats, polar plots, Smith charts, trace markers, limit lines and pass / fail criteria [8].























50 | P a g e

4. PROJECT SELECTIONS

4.1 Substrate Material Selection

Various substrate materials, each with its own unique characteristics are available in the
market. In order to select a suitable substrate material for the desired filter design, factors
such as dissipation factor, dielectric constant, thermal coefficient of the dielectric constant
and thickness of the substrate have to be considered. The cost of the material will also be
a major factor if fabrication of the filter is required. The table below states the criterion
for the selection.



Table 6: Substrate material selection criterions

The following table shows the substrate material from various suppliers that are being
considered for this project [24].



Table 7: Substrate materials from various suppliers

A score chart is used to determine the substrate material to be used for the project. Please
refer to Appendix A for detailed calculations of the score chart and Appendix B and
Appendix C for the datasheets of DuPont 951 and FR4-86. Based on the results from the
score chart below, DuPont 951AX-Ag will be chosen as the substrate for project
simulation. However due to cost reasons, FR4-86 will be used for fabrication since it has
the lowest cost ratio.

51 | P a g e



Table 8: Substrate materials score chart

4.2 Selection of Software Simulator Tool

Agilent Advance Design System (ADS) Software and Ansoft High Frequency Structural
Simulator (HFSS) are two software simulator tools that can be used for designing and
simulation of the desired filter design. The table below states the criterions for the
selection.



Table 9: Software simulator tool selection criterions

Agilent Advance Design System (ADS) Software has been chosen due to its low resource
consumption requirement and the availability of free evaluation version. Features of
Ansoft HFSS can be found in [25].

4.3 Selection of Printed Wiring Board (PWB) Finishes

The following table highlights the pros and cons of Organic Solderability Preservative
(OSP) and Hot Air Solder Levelling (HASL) finishes. HASL will be chosen for the
fabrication process.



Table 10: Pros / Cons of OSP and HASL Finishes

52 | P a g e

4.4 Selection of Measurement Tool

The Agilent Network Analyzer E5062A which is available in SIM University will be used
to measure the fabricated filter responses. E5062A provides reliable basic S-parameter
measurements with easy-to-use features. It has an operating frequency of 300kHz to
3GHz, supports both 50ohms and 75ohms test port impedances and have an output
frequency resolution of 1Hz. A snapshot of the Agilent Network Analyzer E5062A is
shown below.



Figure 37: Agilent Network Analyzer E5062A

The following table illustrates some of the measurement capabilities of E5062A [27].



Table 11: Measurement capabilities of E5062A

4.5 Selection of SMA Connector

SMA, which is an acronym for Sub-Miniature version A, has a characteristic impedance
of 50O and provides excellent electrical performance from DC to 18 GHz. They are also
compact in size and have outstanding durability. A snapshot of various SMA connectors
such as Semi-Rigid Cable Connector, Flexible Cable Connector, Printed Circuit Board
and Surface Mount Connector is shown below.

53 | P a g e



Figure 38: Various SMA connectors

SMA 1227, PCB Edged Mount Connector has been chosen for this project. Details of
SMA connectors are available at Appendix D. The selection of the SMA connector is
dependent on the design layer-out or structure.


































54 | P a g e

5. DEVELOPMENTS OF BANDPASS FILTER DESIGN

5.1 Proposed Specifications of Initial LTCC Filter Design

In order to kick start the development of the initial multilayer LTCC bandpass filter
design, a realistic design goal will be proposed. The following table illustrates the
proposed specifications of the initial LTCC filter design.



Table 12: Proposed specifications of initial LTCC filter design

5.2 Proposed Configuration of Initial LTCC Filter Design

Once the specifications have been set, the next stage would be to define the configuration
of the initial LTCC filter design layout. The proposed design layout architecture would
consist of five conductive micro-strip layers separated by four layers of DuPont 951
substrate. The first and fifth layers are designed to be ground plane. The second micro-
strip layer is designed to contain a Parallel-Coupled resonator, likewise for the third
micro-strip layer. The fourth micro-strip layer is designed to contain both a left bend
resonator and a right bend resonator. A cross-sectional view as well as the layout
architecture of the initial LTCC filter design is shown below.



Figure 39: Cross-sectional view of initial LTCC filter design

55 | P a g e



Figure 40: Layout architecture of initial LTCC filter design

5.3 Initial LTCC Filter Design and Simulation using Agilent ADS
Software

Defining Substrate Properties and Simulation Control Environment within Agilent
ADS Software

Before the proposed filter can designed using Agilent ADS Software, substrate properties
have to be first defined. The parameters to be defined for substrate properties are
dielectric constant of 7.84, loss tangent of 0.005 and thickness of 100m.

To optimize the performance of the proposed filter, manipulation of the distance of the
gap between resonators to tune the capacitance value and varying the overlapping area
between resonators to tune the coupling strength can be done. Parameters such as
individual substrate height and dimensions of the resonators can also be fine-tuned.

The resultant overall dimensions of the initial LTCC filter design after fine-tuning are
1090m x 1050m x 630m. The height of individual substrate layers have been tuned to
S1=0.26mm, S2=S3=0.045mm and S4=0.28mm.



Figure 41: Defining substrate properties for initial LTCC filter design

56 | P a g e

Once the proposed filter design is completed, simulation control parameters have to be
defined in order to perform simulation. The simulator is set up to perform adaptive sweep
between 0GHz - 10GHz with 999 sample points as shown in the following figure.



Figure 42: Setting up of simulation control environment for initial LTCC filter design

Defining Port Parameters within Agilent ADS Software

In order to simulate the use of 50OSMA connectors, both input and output ports of the
filter must be set to 50O in the Agilent ADS Software Port Properties Editor as shown
in the figure below.



Figure 43: Defining port properties for initial LTCC filter design

57 | P a g e

5.4 Simulation Results of Initial LTCC Filter Design

The simulation results obtained from Agilent ADS Software shows an insertion loss of -
0.006dB, a return loss of -31.588dB and a bandwidth of 2.049GHz at the centre frequency
of 2.535GHz. By comparing the obtained simulated results with the specifications in
Table 12, this initial LTCC filter design has failed to achieve the return loss requirements
of < -35dB and will have to be improved.



Figure 44: Layout structure of initial LTCC filter design



Figure 45: S11 response of initial LTCC filter design



Figure 46: S21 response of initial LTCC filter design

58 | P a g e

5.5 Enhanced LTCC Filter Design

In order to improve the insertion loss and return loss, the enhanced LTCC filter design has
an additional parallel micro-strip at the fourth layer between the left bend and right bend
resonators. The physical lengths of the resonators were also increased in order to obtain a
centre frequency as close as possible to the proposed centre frequency of 2.5GHz. Please
refer to Appendix E for more details of enhancing the initial LTCC filter design.

A cross-sectional view as well as the layout architecture of the enhanced LTCC filter
design is shown below. The dimensions of the enhanced LTCC filter design as well as the
height of individual substrate layers remains unchanged from the initial LTCC filter
design.



Figure 47: Cross-sectional view of enhanced LTCC filter design



Figure 48: Layout architecture of enhanced LTCC filter design

59 | P a g e

5.6 Simulation Results of Enhanced LTCC Filter Design

The simulation results obtained from Agilent ADS Software shows that all specifications
defined in Table 12 have been met. Improvements can be seen for insertion loss from -
0.006dB to -0.002dB and for return loss from -31.588dB to -39.148dB. The centre
frequency has also been improved from 2.535GHz to 2.513GHz with a bandwidth of
1.875GHz.



Figure 49: Layout structure of enhanced LTCC filter design



Figure 50: S11 response of enhanced LTCC filter design



Figure 51: S21 response of enhanced LTCC filter design

60 | P a g e

5.7 Modelling of Filter Design using FR4-86 Substrate

Due to the high cost involved with using DuPont 951 substrate for fabrication as well as
the complexity involved in fabrication of miniaturized components, the enhanced LTCC
filter design will be re-modelled to use FR4-86 substrate instead while the overall
dimensions will also be enlarged.

The original design specifications will also have to be reviewed due to the poorer
performance of FR4-86 substrate. Please refer to Table 6 and Table 7 for more detailed
information of substrate performances. The following table illustrates the proposed
specifications of the re-modelled initial filter design (FR4-86 substrate).



Table 13: Proposed specifications of re-modelled initial filter design (FR4-86 substrate)

The re-modelled initial filter design layout architecture would still consist of five
conductive micro-strip layers separated by four layers of FR4-86 substrate. There are no
changes in the layout except for the fourth layer. There, the left bend and right bend
resonators have evolved to look like triangles instead and will help to improve return loss.
Please refer to Appendix F for more details of re-modelling the filter design using FR4-86
substrate. A cross-sectional view as well as the layout architecture of the re-modelled
initial filter design (FR4-86 substrate) is shown below.



Figure 52: Cross-sectional view of re-modelled initial filter design (FR4-86 substrate)

61 | P a g e



Figure 53: Layout architecture of re-modelled initial filter design (FR4-86 substrate)

5.8 Re-modelled Initial Filter Design (FR4-86 Substrate) and Simulation
using Agilent ADS Software

Defining Substrate Properties and Simulation Control Environment within Agilent
ADS Software

Before the proposed filter can designed using Agilent ADS Software, substrate properties
have to be defined once again. The parameters to be defined for substrate properties are
dielectric constant of 4.7, loss tangent of 0.016 and thickness of 1600m.

The resultant overall dimensions of the re-modelled initial filter design (FR4-86
substrate) after fine-tuning are 16000m x 10500m x 6400m. The height of the
individual substrate layers have also increased to S1=S2=S3=S4=1600m.



Figure 54: Defining substrate properties for re-modelled initial filter design (FR4-86
substrate)

62 | P a g e

Once the proposed filter design has been completed, simulation control parameters will
be defined once again to perform simulation. The simulator is set up to perform adaptive
sweep between 0GHz - 3GHz with 999 sample points as shown in the following figure.



Figure 55: Setting up of simulation control environment for re-modelled initial filter
design (FR4-86 substrate)

Defining Port Parameters within Agilent ADS Software

Both input and output ports of the filter must be set to 50 O in the Agilent ADS Software
Port Properties Editor in order to simulate the use of 50OSMA connectors.



Figure 56: Defining port properties for re-modelled initial filter design (FR4-86
substrate)

63 | P a g e

5.9 Simulation Results of Re-modelled Initial Filter Design (FR4-86
Substrate)

The simulation results obtained from Agilent ADS Software shows an insertion loss of
0.012dB, a return loss of -47.642dB and a bandwidth of 717MHz at the centre frequency
of 396.7MHz. Even though return loss has improved from the previous LTCC filter
design, the overall performance of the re-modelled initial filter design has reduced
substantially due to the quality of substrate used (FR4-86). Centre frequency will have to
be improved drastically which will involve more design changes.



Figure 57: Layout structure of re-modelled initial filter design (FR4-86 substrate)



Figure 58: S11 response of re-modelled initial filter design (FR4-86 substrate)



Figure 59: S21 response of re-modelled initial filter design (FR4-86 substrate)

64 | P a g e

5.10 Enhanced Re-modelled Filter Design using FR4-86 Substrate

In order to improve the centre frequency, the enhanced re-modelled filter design (FR4-86
substrate) will have a micro-strip connecting the left and right triangle resonators at the
fourth layer instead of the additional parallel micro-strip. In order to accommodate the
assembly of the SMA connectors, the overall dimensions of the enhanced re-modelled
filter design (FR4-86 substrate) will also be further enlarged to 43000m x 18000m x
6400m. The height of the individual substrate layers have remained unchanged from
before, S1=S2=S3=S4=1600m. Increases in overall dimensions have also helped to
improve return loss which had been affected by the changes in filter design. Please refer
to Appendix G for more details of enhancing the re-modelled initial filter design.

A cross-sectional view as well as the layout architecture of the enhanced re-modelled
filter design (FR4-86 substrate) is shown below.



Figure 60: Cross-sectional view of enhanced re-modelled filter design (FR4-86 substrate)



Figure 61: Layout architecture of enhanced re-modelled filter design (FR4-86 substrate)

65 | P a g e

5.11 Simulation Results of Enhanced Re-modelled Filter Design using
FR4-86 Substrate

The simulation results obtained from Agilent ADS Software shows an insertion loss of -
0.401dB, a return loss of -39.037dB and a bandwidth of 186MHz at an improved centre
frequency of 1.458GHz. All specifications defined in Table 13 have been achieved. This
filter design has produced the best possible result obtainable from using FR4-86 substrate.
Critical dimensions of the filter prototype will be illustrated in the next section. The next
step forward would be fabrication and assembly of filter prototype in order to measure
and validate the actual filter response.



Figure 62: Layout structure of enhanced re-modelled filter design (FR4-86 substrate)



Figure 63: S11 and S21 responses of enhanced re-modelled filter design (FR4-86
substrate)

66 | P a g e

5.12 Critical Dimensions of Finalized Filter Design using FR4-86
Substrate

The critical dimensions of the individual micro-strip layers are presented below.



Figure 64: Overall dimensions of finalized filter design using FR4-86 substrate; same
dimensions to be used for first and fifth layer (ground plane)



Figure 65: Critical dimensions of second layer (Parallel-Coupled resonator)



Figure 66: Critical dimensions of third layer (Parallel-Coupled resonator)

67 | P a g e



Figure 67: Critical dimensions of fourth layer (left and right triangle resonators
connected by micro-strip)




































68 | P a g e

6. FABRICATION AND ASSEMBLY OF FILTER PROTOTYPE

The finalized design of the multilayer bandpass filter prototype layout is shown in the figure
below.



Figure 68: Multilayer bandpass filter prototype layout

The following figures illustrate the different conductor layers of the multilayer bandpass filter
prototype.



Figure 69: Cond layer



Figure 70: Cond2 layer

69 | P a g e



Figure 71: "Resi" layer



Figure 72: Diel layer

6.1 Exporting Gerber Files

Once the design of filter prototype has been finalized in Agilent ADS software, the
required files in Gerber format needs to be exported in order to fabricate the filter
prototype. The following steps were taken in exporting the Gerber files:

Step 1

Delete the Input / Output ports from the resi layer

Removed Input / Output ports



Figure 73: Resi layer without Input / Output ports

70 | P a g e

Step 2

Create a border for each conductor layer



Figure 74: "Cond" layer with border



Figure 75: "Cond2" layer with border



Figure 76: "Resi" layer with border

71 | P a g e



Figure 77: "Diel" layer with border

Step 3

Setting up and exporting the Gerber files

The following settings were used in exporting the Gerber files:

Output Unit: mm
Number Format: 2:4

In order for the fabricated filter prototype to have the right dimensions, these settings are
made known to the fabrication vendor. This will also ensure that the layout of each
resonator position is aligned. The figure below shows the Export Gerber Options
window with the above settings used.



Figure 78: "Export Gerber Options" window


72 | P a g e

The figures below illustrate the steps of exporting Gerber files.





Figure 79: Step-by-step guide in exporting Gerber files

73 | P a g e

6.2 Assembly of Fabricated Filter Prototype

The designed filter is fabricated on FR4-86 board using HASL finishing. The figure
below shows a comparison between the layouts of each conductor layer of the designed
filter in Agilent ADS Software, with the actual fabricated layers using HASL finishing.









(a)



(b)

Figure 80: Comparison between a) Conductor layers of the designed filter in Agilent ADS
Software; b) Actual fabricated layers using HASL finishing








74 | P a g e

The following table illustrates the steps taken to assemble the individual layers of the
filter prototype together to form the designed multilayer bandpass filter.

Step 1:
Place the
fabricated
PWBs on
a soft-
wooden
board and
use pins to
secure its
position.

Step 2:
The
required
slots for
inserting
the SMA
Connector
s are
removed
using
AEMG
PR-
2228/S4
PCB
Routing
Machine.



75 | P a g e

Step 3:
The PWBs
are further
refined by
filing the
edges with
sandpaper.

Step 4:
The SMA
Connector
s are
soldered
onto the
PWBs.

Step 5:
Lastly, the
assembled
multilayer
bandpass
filter is
inspected
to ensure
no cold
solder
joints.


Table 14: Step-by-step guide in assembling the filter prototype
















76 | P a g e

7. COMPARISON BETWEEN MEASURED AND SIMULATED
RESULTS

7.1 Measurement of Filter Responses

The following equipment and accessories were used in the measurement of the designed
filter response at SIM University.

- Agilent Network Analyzer E5062A



Figure 81: Agilent Network Analyzer E5062A

- 2 x BNC adaptors with 50O termination



Figure 82: 2 x BNC adaptors with 50O

termination

- 2 x BNC to SMA cables



Figure 83: 2 x BNC to SMA cables

77 | P a g e

The following steps illustrate the filter response measurements.

Step 1

Connect the BNC adaptors with 50O

termination to Port 1 and Port 2 of the Agilent
Network Analyzer E5062A.

Step 2

Connect the BNC end of cable to the BNC adaptor and the SMA end of the cable to the
SMA connector on the fabricated filter prototype.

Step 3

Switch on the Agilent Network Analyzer E5062A and tune it to sweep from 1GHz to
2GHz.

Step 4

Obtain the filter responses such as magnitude of S11 and S21, centre frequency and
bandwidth by using measurement and marker functions.

Step 5

Screen capture and save the results of the filter response.



Figure 84: Connection of BNC end of cable to BNC adaptors on Agilent Network
Analyzer E5062A




Figure 85: Connection of SMA end of cable to SMA connectors on fabricated filter
prototype

78 | P a g e

7.2 Comparison Analysis between Measured and Simulated Results

The following figures illustrate the measured filter responses as compared to the
simulated filter responses from Agilent ADS Software.



Figure 86: S11 response of fabricated filter prototype



Figure 87: S21 response of fabricated filter prototype



Figure 88: Simulated filter responses from Agilent ADS Software

79 | P a g e

The filter response measured from fabricated filter prototype is reasonably good. The
fabricated filter prototype is measured as having an insertion loss of 9.0126dB, a return
loss of 38.129dB and a bandwidth of 132MHz at the centre frequency of 1.351GHz while
the simulation produced results of an insertion loss of 0.401dB, a return loss of 39.037dB
and a bandwidth of 186MHz at the centre frequency of 1.458GHz. The table below
summarizes the comparison.



Table 15: Comparison table between measured vs. simulated results

The additional losses in insertion loss and return loss as well as the frequency shift for
both bandwidth and centre frequency observed in the measured filter response could be
due to a slight misalignment of the different layers. These misalignments will result in a
decrease in overall capacitance reactive or an increase in the inductance reactive hence
causing variances in the measured results.

Upon closer examination of the fabricated filter prototype, tiny air gaps can be seen
between the different layers. These air gaps allow air to pass through thus creating an
inconsistent dielectric constant between the different layers which further contributes to
additional losses and frequency shift in bandwidth and centre frequency.
















80 | P a g e

8. CONCLUSION

From the results obtained from the previous chapters, it can be concluded that the objective of
designing a multilayer LTCC bandpass filter can be realized with the implementation of
multilayer resonator configuration on micro-strip filter. However, factors such as ease of
fabrication, ease of assembly and complexity of design have to be taken into consideration as
they can affect filter response.

From the simulation results, it can be shown that by changing the design of the resonators,
better performances can be attained. However, the fact that parameters such as substrate
height, distance of the gap between resonators, overlapping area between resonators are
variable, only served to increase the difficulties of achieving the desired results.

The measured filter response was not able to match up to the simulated filter response and an
analysis was conducted to investigate the possible reasons for the mismatch. It was found that
the likely causes were slight misalignment of the different layers as well as tiny air gaps
existed between the different layers. Solutions to fix the possible highlighted problems will
be suggested for future implementation.

8.1 Suggestion for Future Work

Even though this project has been a success, on hindsight, there are still some areas which
can be further improved to achieve better filter responses. Some suggestions to achieving
better filter responses as follows:

- Ensure proper alignment of the different conductor layers and utilize
commercially available multilayer lamination process. By doing so, the different
layers are fused together by high pressure and heat, hence preventing air gaps
from forming. Frequency shift and additional losses due to misalignment and air
gaps issues are thus resolved.
- Usage of a metal enclosure will produce a better and more realistic filter response
as it reduces the effect of radiation loss. However, the cost of the project will also
increase.
- Other than using FR4-86, usage of other materials with different gains and
insertion loss or adopting VIA-punching can also be explored but the cost of the
project might possibly increase.













81 | P a g e

9. CRITICAL REVIEWS AND REFLECTIONS

This has been an interesting project for me as I had experienced for the first time, the entire
process of producing a micro-strip filter, from the design and simulation phase to the
fabrication and test / measurement phase.

Coming to grips with the theory of micro-strip filter and related topics was only the first tiny
step taken in this project. The next step forward was to list down the requirements of the
project which then leads to filter design and simulation phase. This phase involves not only
understanding thoroughly the requirements of the filter design but also include a significant
amount of work in familiarizing with the software simulator tool in order to design and
perform simulation seamlessly. This phase had to be repeated several times until the proposed
filter design was deemed to have fulfilled all requirements.

The project started fairly well with constant discussions taking place with the Project
Supervisor on the objectives and vision of the project. There was a need to strike a balance, to
propose an exciting yet achievable scope for the project.

However, the progress of the project stalled when I reached the filter design phase due to the
fact that I was weak in this area. Everything was a mess and new problems appeared almost
on a daily basis. It was definitely not an enjoyable experience being a beginner in filter
design. There was a constant need to refer to tutorials and reference materials for help which
was really a vexing experience.

The completion of this project after months of hard work has enriched me in several ways.
The struggles during the filter design and fabrication phases helped me gained valuable
knowledge. The project also made me more disciplined and independent as I had to work
autonomously in order to deliver results. Project management skills were also put to test
during this period. I have now fully understood the importance and meaning of having a well
thought-out plan. Having a plan which is good, clear and concise will help to reduce a lot of
unnecessary re-work. And lastly, good time management skills was also essential as I have a
full time job which was very taxing as it required me to travel frequently overseas for on-site
assistance. Thanks to the full support of my colleagues, I was able to reduce my work-related
travels to spend more time on the project.
















82 | P a g e

10. REFERENCES

[1] S. V. Krishnaswamy, J. Rosenbaum, S. Horwitz, C. Vale, and R. A. Moore, Film
bulk acoustic wave resonator technology, IEEE Proceedings of Ultrasonic
Symposium, December 1990

[2] Ohk-Kun Lim, and Yong-Jun Kim, Design and Fabrication of an Integrated
Bandpass Filter Using Micromachining, Proceedings of the fifth Korean MEMS
Conference, May 2003

[3] A. Sutono, J. Laskar, W.R. Smith, Development of integrated three dimensional
Bluetooth image reject filter, IEEE MIT-S International Microwave Symposium
Digest, Vol. 1, 2000.

[4] LTCC consulting - what is LTCC? retrieved from
http://www.ltcc-consulting.com/What_is_the_LTCC

[5] M. Massiot, Evolution of LTCC technology for industrial applications,
Retrieved from
http://amsacta.cib.unibo.it/423/1/JGM1_Massiot.pdf

[6] Technology, Retrieved from
http://www.ltcc-consulting.com/LTCC_technology

[7] IMST homepage Examples & Solutions retrieved from
http://www.ltcc.de/en/examples.php

[8] Bhartia Bahl Garg Gupta, Microstrip Lines I: Quasi-Static Analyses, Dispersion
Models, and Measurements, Microstrip Lines and Slotlines 2
nd
Edition, London:
Artech House Publisher, 1996

[9] Jia-Sheng Hong, M.J. Lan Caster, Microstrip Lines, Microstrip Filters for
RF/Microwave Applications, New York: John Wiley & Sons Inc., 2001

[10] Jia-Sheng Hong, M.J. Lan Caster, Lumped Inductors and Capacitors, Microstrip
Filters for RF/Microwave Applications, New York: John Wiley & Sons Inc., 2001

[11] Brad R. Jackson, Carlos E. Saavedra, Variable MEMS Capacitors for Millimetre-
Wave Integrated Circuit Filtering Applications, XV Workshop Iberchip, Buenos
Aires - Argentina, Mar 2009

[12] Thomas L. Floyd, Capacitors, Principles of Electric Circuits, New Jersey:
Prentice-Hall Inc., 1997

[13] JuHwan Lim, Dong Yun Jung, et al. Implementation of A 5-GHz LTCC Bandpass
Filter Using Vertically-Interdigitated Capacitors and VIA Engineering,
Microwave and Optical Technology Letters, Feb 2008

[14] Marc E. Goldfarb, Robert A. Pucel, Modelling VIA Hole Grounds in Microstrip,
IEEE Microwave and Guided Wave Letters, June 1991
83 | P a g e

[15] Songping Wu, Xin Chang, et al. Eliminating VIA-Plane Coupling Using Ground
VIAs for High-Speed Signal Transition, IEEE Electrical Performance of
Electronic Packaging, 2008

[16] R. Ludwig, P. Bretchko, An Overview of RF Filter Design, RF Circuit Design
Theory and Applications, New Jersey: Prentice-Hall Inc., 2000

[17] Shimon Caspi, and J. Adelman, Design of Combline and Interdigital Filters with
Tapped-Line Input, IEEE Transactions on Microwave Theory and Techniques,
Vol. 36, April 1988

[18] Jia-Sheng Hong, M.J. Lan Caster, Dissipation Effects on Band-pass and Band-
stop Filters, Microstrip Filters for RF/Microwave Applications, New York: John
Wiley & Sons Inc., 2001

[19] Andrew C. Guyette, Ian C. Hunter, Roger D. Pollard, Perfectly-Matched
Bandstop Filters using Lossy Resonators, 2nd EMRS DTC Technical
Conference, 2005

[20] Agilent EEsof EDA Design & Simulation Software Advance Design System
(ADS) retrieved from
http://www.home.agilent.com/agilent/product.jspx?cc=US&lc=eng&ckey=129711
3&nid=-34346.0.00&id=1297113

[21] United States Environmental Protection Agency. Implementing Cleaner Printed
Wiring Board Technologies: Surface Finishes. Washington: EPA, Mar 2000,
retrieved from
http://www.epa.gov/dfe/pubs/pwb/pdf/sf_guide.pdf

[22] Sherry Goodell, Hot Air Leveling, retrieved from
http://www.goldphoenixpcb.biz/pdf/Chapter_30-HAL.pdf

[23] RF network analyzer basics tutorial, retrieved from
http://www.radio-electronics.com/info/t_and_m/rf-network-analyzer/analyser-
basics-tutorial.php

[24] Reinhard kulke, Matthias Rittweger, et al. LTCC-Multilayer ceramic for Wireless
and Sensor Applications, LTCC An Introduction and Overview, IMST GmbH,
Dec 2001, retrieved from
www.ltcc.de/downloads/rd/pub/10-doc-plus-engl-2001.pdf

[25] Ansoft HFSS, retrieved from
http://www.ansoft.com/products/hf/hfss

[26] Lead-Free Printed Circuit Board Surface Finishes, retrieved from
http://www.trianglecircuits.com/lead-free-finishes.html

[27] Agilent ENA-L RF Network Analyzers, retrieved from
http://cp.literature.agilent.com/litweb/pdf/5989-0018EN.pdf

84 | P a g e

[28] Yoshihiko Imanaka, Multilayered Low Temperature Co-fired Ceramics (LTCC)
Technology http://books.google.com.sg/books?hl=en&lr=&id=uU2-
rnznM2kC&oi=fnd&pg=PR11&dq=history+of+ltcc+technology&ots=loxSOpSu7
Q&sig=jJckqJ-Z4uFZOkwWHIcMZkyE6Wo#v=onepage&q&f=false

[29] IMST homepage - LTCC process retrieved from
http://www.ltcc.de/en/whatis_pro.php

[30] Wikipedia Microwave retrieved from
http://en.wikipedia.org/wiki/Microwave

[31] K.C. Gupta, Ramesh Garg, Inder Bahl, Prakash Bhartia, Microstrip Lines and
Slotlines Second Edition, Artech House, Inc., 1996

[32] Daniel M. Dobkin, The RF in RFID Passive UHF RFID in Practice, Elsevier
Inc., 2008

[33] Ahmad A. Sulaiman, Mohd H. Mokhtar, Mohd H. Jusoh, Nor H. Baba, Rabiatun
A. Awang, Mohd F. Ain Simple Multilayer Hairpin Bandpass Filter retrieved
from
http://www.eurojournals.com/ejsr_42_4_07.pdf




























85 | P a g e

11. APPENDIX A

Appendix A shows the steps taken to compute the Score Chart (Table 3.3) with the given data.

Supplier Substrate Tan(o ) c
r
TCE
ppm/K
Thickness
m
Relative
Price
Arlon AR 600 0.35 6 12 635 6.1
AR 1000 0.35 10 14 635 4.8
Taconic RF-60 0.28 6.15 12 635 1.1
CER-10 0.35 10 14 635 1.8
DuPont 951AX-Au 0.5 7.84 5.8 100 1.5
951AX-Ag 0.2 7.84 5.8 100 1.0
Ferro A6M, Ag 0.2 5.9 8 185 0.6
Nan Ya FR4-86 2.7 4.7 18 1600 0.2

Step 1: Finding the interval value

From the table above, each property of the substrate is divided into 10 equal intervals by the
following equation:


Where,

Vinterval: is the interval value between each range


Vmax: is the highest value of the given properties

Vmin: is the lowest value of the given properties


Example: Finding the interval value of Tan (o )



Step 2: Finding the I nter Range

The 10 equal Interval Range can be computed as follows:

Interval Range (i) Lower Value Li Upper Value Ui
1 Vmin

Vmin + Vinterval

2 Ui-1

Ui-1

+ Vinterval

3 Ui-1

Ui-1

+ Vinterval

4 Ui-1

Ui-1

+ Vinterval

5 Ui-1

Ui-1

+ Vinterval

6 Ui-1

Ui-1

+ Vinterval

7 Ui-1

Ui-1

+ Vinterval
8 Ui-1

Ui-1

+ Vinterval
9 Ui-1

Ui-1

+ Vinterval
10 Ui-1

Ui-1

+ Vinterval


86 | P a g e

Example: Finding the Interval Range of Tan ( )

Interval Range (i) Lower Value Li Upper Value Ui
1 0.2 0.2+0.25=0.45
2 0.45 0.45+0.25=0.7
3 0.7 0.7+0.25=0.95
4 0.95 0.95+0.25=1.2
5 1.2 1.2+0.25=1.45
6 1.45 1.45+0.25=1.7
7 1.7 1.7+0.25=1.95
8 1.95 1.95 +0.25=2.2
9 2.2 2.2+0.25=2.45
10 2.45 2.45+0.25=2.7

Step 3: Assigning a score to each substrate for a given property

A score of 1 to 10 is given to each substrate based on where the property value of that
substrate falls under in the Interval Range Table. (Best: 10, Worst is: 1)

Example: Assigning Score to each substrate based on Tan (o )

Interval Range (i) Lower Value Li Upper Value Ui SCORE
1 0.2 0.45 10
2 0.45 0.7 9
3 0.7 0.95 8
4 0.95 1.2 7
5 1.2 1.45 6
6 1.45 1.7 5
7 1.7 1.95 4
8 1.95 2.2 3
9 2.2 2.45 2
10 2.45 2.7 1











Step 4: Summing up the total Score

Step 1 to 3 is repeated for all the properties of each substrate. The final step will be to sum up
the total score for each substrate to determine the most desired substrate material to be used.
The result is shown in Table 3.3.

Arlon AR 600 0.35 10
AR 1000 0.35 10
Taconic RF-60 0.28 10
CER-10 0.35 10
DuPont 951AX-Au 0.5 9
951AX-Ag 0.2 10
Ferro A6M, Ag 0.2 10
Nan Ya FR4-86 2.7 1
87 | P a g e

12. APPENDIX B













88 | P a g e





89 | P a g e

13. APPENDIX C





90 | P a g e










91 | P a g e

14. APPENDIX D









92 | P a g e


15. APPENDIX E

Rejected Bandpass Filters from LTCC Filter Designs

Index No. Filter design Layout S11 and S21 Response
1


2


3


4


93 | P a g e

5











































94 | P a g e

16. APPENDIX F

Rejected Bandpass Filters from Enhanced LTCC Filter Design to Re-
modelled Initial Filter Design (FR4-86 Substrate)

Index No. Filter design Layout S11 and S21 Response
1


2


3


4



95 | P a g e

5











































96 | P a g e

17. APPENDIX G

Rejected Bandpass Filters from Enhanced Re-modelled Filter Design using
FR4-86 Substrate

Index No.
Filter design Layout S11 and S21 Response
1


2


4


5


97 | P a g e

6


7


8


9


10





98 | P a g e

18. APPENDIX H

CAPSTONE Project Meeting Report 1

1 Date 12 February 2011
2 Time 12:00pm 14.00pm
3 Duration 2 hours
4 Venue UniSIM HQ 5.17B
5 Student Name Guo Ling
6 Project / Supervisor Name MULTILAYER LTCC BANDPASS FILTER
FOR MICROWAVE APPLICATIONS / Dr. Lum
Kum Meng
7 Review of Previous Meeting
and progress
NIL
8 Minutes of current meeting 1. Discussion of project scope.
2. Highlight of project programs
expectation.
3. Highlight of filter design specification
(IEEE paper review)
4. Show understanding for the usage for the
ADS software.
5. Highlight of the first design of the
project.
6. Objective of next meeting, presentation
understand of the first filter design.

9 Action items/ Targets to
achieve
1. Submit the meeting log
2. Know how to use ADS software.
3. Preparation of proposal. (10%)

10 Other comment/Areas to
improve
1. Next meeting will be held on 26 February
at UniSIM HQ 5.17B
11 Reference materials 1. Ishizaki, T., T. Uwano, and H. Miyake,
An extend configuration of a stepped
impedance comb-line filter, IEICE
Trans, Electron., E79-C, 671-678, 1996
2. Sim, S. H., C. Y. Kang, S. J Yoon, Y. J.
Yoon, and H. J. Kim, Broadband
multilayer ceramic chip antenna for
handsets, Electron. Lett., Vol. 38, 205-
207, 2002
3. Lew, D. W., J. S. Park, D. Ahn, N. K.
Kang, C. S Yoo, and J. B. Lim, A design
of the ceramic chip balun using the
multilayer configuration, IEEE Trans.
Microwave Theory Tech., Vol. 49, 220-
224, 2001.
4. Dernovsek, O., A. Naeini, G. Preu, W.
99 | P a g e

Wersing, M. Eberstein b, and W. A.
Schiller, LTCC glass-ceramic
composites for microwave application,
Journal of the European Ceramic Society,
Vol. 21, 1693-169, 2001.
5. Leung, W. Y., K. Keung, M. Cheng, and
K. L. Wu, Multilayer LTCC bandpass
filter design with enhanced stopband
characteristics, IEEE Microwave and
Wireless Components letters, Vol. 12, N0.
7, 240-242, 2002
6. ADS website
7. IEEE-MTT website
12 How did you progress so far?
(10 Excellent, 1 Poor)
NIL
100 | P a g e

CAPSTONE Project Meeting Report 2

1 Date 26 February 2011
2 Time 12:00pm 14.00pm
3 Duration 2 hours
4 Venue UniSIM HQ 5.17B
5 Student Name Guo Ling
6 Project / Supervisor Name MULTILAYER LTCC BANDPASS FILTER
FOR MICROWAVE APPLICATIONS
/ Dr. Lum Kum Meng

7 Review of Previous Meeting
and progress
NIL
8 Minutes of current meeting 1 Demonstration of ADS usage and
function.
2. Expectation of proposal content.
3. Brief highlight of the first filter design.

9 Action items/ Targets to
achieve
1. Submit the meeting log
2. Get familiar with ADS software
3. Preparation of proposal. (70%)

10 Other comment/Areas to
improve
1. Next meeting will be held on 26 February
at UniSIM HQ 5.17B
2. Commencement of the first filter design
using ADS filter momentum.
3. Presentation of first filter design working
mechanism

11 Reference materials 1. Ishizaki, T., T. Uwano, and H. Miyake,
An extend configuration of a stepped
impedance comb-line filter, IEICE
Trans, Electron., E79-C, 671-678, 1996
2. Sim, S. H., C. Y. Kang, S. J Yoon, Y. J.
Yoon, and H. J. Kim, Broadband
multilayer ceramic chip antenna for
handsets, Electron. Lett., Vol. 38, 205-
207, 2002
3. Lew, D. W., J. S. Park, D. Ahn, N. K.
Kang, C. S Yoo, and J. B. Lim, A design
of the ceramic chip balun using the
multilayer configuration, IEEE Trans.
Microwave Theory Tech., Vol. 49, 220-
224, 2001.
4. Dernovsek, O., A. Naeini, G. Preu, W.
Wersing, M. Eberstein b, and W. A.
Schiller, LTCC glass-ceramic
composites for microwave application,
101 | P a g e

Journal of the European Ceramic Society,
Vol. 21, 1693-169, 2001.
5. Leung, W. Y., K. Keung, M. Cheng, and
K. L. Wu, Multilayer LTCC bandpass
filter design with enhanced stopband
characteristics, IEEE Microwave and
Wireless Components letters, Vol. 12, N0.
7, 240-242, 2002
6. ADS website
7. IEEE-MTT website
12 How did you progress so far?
(10 Excellent, 1 Poor)
2
102 | P a g e

CAPSTONE Project Meeting Report 3

1 Date 12 March 2011
2 Time 12:00pm 14.00pm
3 Duration 2 hours
4 Venue UniSIM HQ 5.17B
5 Student Name Guo Ling
6 Project / Supervisor Name MULTILAYER LTCC BANDPASS FILTER
FOR MICROWAVE APPLICATIONS
Dr. Lum Kum Meng

7 Review of Previous Meeting
and progress
NIL
8 Minutes of current meeting 1. Verification of first filter design
performance (ADS Simulation)
2. Discussion on how to improved filter
response
3. Discussion on the key objective for the
next meeting
a. Presentation on the improvement
on the improvement on the filter
b. Research and understand on
design of filter on the microstrip

9 Action items/ Targets to
achieve
1. Submit the meeting log
2. Try to complete drawing of the first filter
design. (50%)

10 Other comment/Areas to
improve
1. Next meeting will be held on 26 March at
UniSIM HQ 5.17B
2. Commencement of the first filter design
using ADS filter momentum.

11 Reference materials 1. Ishizaki, T., T. Uwano, and H. Miyake,
An extend configuration of a stepped
impedance comb-line filter, IEICE
Trans, Electron., E79-C, 671-678, 1996
2. Sim, S. H., C. Y. Kang, S. J Yoon, Y. J.
Yoon, and H. J. Kim, Broadband
multilayer ceramic chip antenna for
handsets, Electron. Lett., Vol. 38, 205-
207, 2002
3. Lew, D. W., J. S. Park, D. Ahn, N. K.
Kang, C. S Yoo, and J. B. Lim, A design
of the ceramic chip balun using the
multilayer configuration, IEEE Trans.
Microwave Theory Tech., Vol. 49, 220-
224, 2001.
103 | P a g e

4. Dernovsek, O., A. Naeini, G. Preu, W.
Wersing, M. Eberstein b, and W. A.
Schiller, LTCC glass-ceramic
composites for microwave application,
Journal of the European Ceramic Society,
Vol. 21, 1693-169, 2001.
5. Leung, W. Y., K. Keung, M. Cheng, and
K. L. Wu, Multilayer LTCC bandpass
filter design with enhanced stopband
characteristics, IEEE Microwave and
Wireless Components letters, Vol. 12, N0.
7, 240-242, 2002
6. Sim, S. H., C. Y. Kang, and J. W. Choi,
A compact lumped-element lowpass
filter using temperature co-fired ceramic
technology, Vol. 23, 2717-2720, 2003
7. Zhao, Y. J. and Y. Z. Yin, An efficient
deign method of LTCC filters with
aggressive space mapping technique,
Microwave and optical technology
Letters, Vol. 41, No. 1, 24-28, 2004
8. IEEE-MTT website
12 How did you progress so far?
(10 Excellent, 1 Poor)
2

104 | P a g e

CAPSTONE Project Meeting Report 4

1 Date 26 March 2011
2 Time 12:00pm 14.00pm
3 Duration 2 hours
4 Venue UniSIM HQ 5.17B
5 Student Name Guo Ling
6 Project / Supervisor Name MULTILAYER LTCC BANDPASS FILTER
FOR MICROWAVE APPLICATIONS
Dr. Lum Kum Meng

7 Review of Previous Meeting
and progress
NIL
8 Minutes of current meeting 1. Verification of first filter design
performance (ADS Simulation)
2. Discussion on next improved filter
metrology
3. Discussion on objective for the next
meeting
9 Action items/ Targets to
achieve
1. Complete drawing of the first filter design
layout
2. Achieve ADS simulation results on the
first filter
3. Submit the meeting log
10 Other comment/Areas to
improve
1. Next meeting will be held on 16 April at
UniSIM HQ 5.17B
11 Reference materials 1. Jia-Sheng Hong, M.J. Lan Caster,
Combline Filter, Microstrip Filters for
RF/Microwave Applications, New York:
John Wiley & Sons Inc., 2001
2. Jia-Sheng Hong, M.J. Lan Caster,
Lumped Inductors and Capacitors,
Microstrip Filters for RF/Microwave
Applications, New York: John Wiley &
Sons Inc., 2001
3. K.C. Gupta, Ramesh Garg, Inder Bahl,
Prakash Bhartia , Microstrip Lines and
Slotlines Second Edition, Artech House,
Inc., 1996
4. IEEE-MTT website
12 How did you progress so far?
(10 Excellent, 1 Poor)
3

105 | P a g e

CAPSTONE Project Meeting Report 5

1 Date 16 April 2011
2 Time 9:00am 11.00am
3 Duration 2 hours
4 Venue UniSIM HQ 5.17B
5 Student Name Guo Ling
6 Project / Supervisor Name MULTILAYER LTCC BANDPASS FILTER
FOR MICROWAVE APPLICATIONS
Dr. Lum Kum Meng

7 Review of Previous Meeting
and progress
NIL
8 Minutes of current meeting 1. Modification on the first filter design,
change the demotion of resonators try to
improve the performance
2. Discussion on objective for the next
meeting
9 Action items/ Targets to
achieve
1. Improve the first design result. (20%)
2. Try to get ready for fabrication
3. Submit the meeting log
10 Other comment/Areas to
improve
1. Next meeting will be held on 30April at
UniSIM HQ 5.17B
11 Reference materials 1. Jia-Sheng Hong, M.J. Lan Caster,
Combline Filter, Microstrip Filters for
RF/Microwave Applications, New York:
John Wiley & Sons Inc., 2001
2. Jia-Sheng Hong, M.J. Lan Caster,
Lumped Inductors and Capacitors,
Microstrip Filters for RF/Microwave
Applications, New York: John Wiley &
Sons Inc., 2001
3. K.C. Gupta, Ramesh Garg, Inder Bahl,
Prakash Bhartia , Microstrip Lines and
Slotlines Second Edition, Artech House,
Inc., 1996
4. IEEE-MTT website
12 How did you progress so far?
(10 Excellent, 1 Poor)
5
106 | P a g e

CAPSTONE Project Meeting Report 6

1 Date 30 April 2011
2 Time 9:00am 11.00am
3 Duration 2 hours
4 Venue UniSIM HQ 5.17B
5 Student Name Guo Ling
6 Project / Supervisor Name MULTILAYER LTCC BANDPASS FILTER
FOR MICROWAVE APPLICATIONS
/ Dr. Lum Kum Meng

7 Review of Previous Meeting
and progress
NIL
8 Minutes of current meeting 1. Verification changes on the first filter
design performance (ADS Simulation)
2. Compare filter designs and discuss
improvement to be made in the designs
3. Discussion on next improved filter design
layout
4. Discussion on objective for the next
meeting
5. Presentation on the improvement of the
filter
6. Research and understand on design of
filter on the bandpass filter parameters

9 Action items/ Targets to
achieve
1. Improve the first design result (50%)
2. Try to get ready for fabrication
3. Submit the meeting log
10 Other comment/Areas to
improve
1. Next meeting will be held on 30April at
UniSIM HQ 5.17B
11 Reference materials 1. Jia-Sheng Hong, M.J. Lan Caster,
Combline Filter, Microstrip Filters for
RF/Microwave Applications, New York:
John Wiley & Sons Inc., 2001
2. Jia-Sheng Hong, M.J. Lan Caster,
Lumped Inductors and Capacitors,
Microstrip Filters for RF/Microwave
Applications, New York: John Wiley &
Sons Inc., 2001
3. K.C. Gupta, Ramesh Garg, Inder Bahl,
Prakash Bhartia , Microstrip Lines and
Slotlines Second Edition, Artech House,
Inc., 1996
IEEE-MTT website
12 How did you progress so far?
(10 Excellent, 1 Poor)
5

107 | P a g e

CAPSTONE Project Meeting Report 7

1 Date 01 June 2011
2 Time 7:30pm 9:30pm
3 Duration 2 hours
4 Venue Serangoon Communicate Center L1
5 Student Name Guo Ling
6 Project / Supervisor Name MULTILAYER LTCC BANDPASS FILTER
FOR MICROWAVE APPLICATIONS
/ Dr. Lum Kum Meng

7 Review of Previous Meeting
and progress
NIL
8 Minutes of current meeting 1. Finalize the first filter design
2. Discuss with supervisor on the second
filter design:
- The second filter center frequency
- Targeted insertion loss and return
loss
9 Action items/ Targets to
achieve
1. Determine the key parameter of the
second filter design.
2. Star to draft the final year project report,
need to get at lease (5%) complete before
next meeting.
3. Submit the meeting log
10 Other comment/Areas to
improve
1. Next meeting will be held on 22th June at
Serangoon Communicate center L1.
11 Reference materials 1. Jia-Sheng Hong, M.J. Lan Caster,
Combline Filter, Microstrip Filters for
RF/Microwave Applications, New York:
John Wiley & Sons Inc., 2001
2. Jia-Sheng Hong, M.J. Lan Caster,
Lumped Inductors and Capacitors,
Microstrip Filters for RF/Microwave
Applications, New York: John Wiley &
Sons Inc., 2001
3. K.C. Gupta, Ramesh Garg, Inder Bahl,
Prakash Bhartia , Microstrip Lines and
Slotlines Second Edition, Artech House,
Inc., 1996
4. IEEE-MTT website
12 How did you progress so far?
(10 Excellent, 1 Poor)
5



108 | P a g e

CAPSTONE Project Meeting Report 8

1 Date 22 June 2011
2 Time 7:30pm 9:30pm
3 Duration 2 hours
4 Venue Serangoon Communicate Center L1
5 Student Name Guo Ling
6 Project / Supervisor Name MULTILAYER LTCC BANDPASS FILTER
FOR MICROWAVE APPLICATIONS
/ Dr. Lum Kum Meng
7 Review of Previous Meeting
and progress
NIL
8 Minutes of current meeting 1. Supervisor checked and advised on the
second filter design, need to improve the
S11 and S21 response of the filter design.
2. Supervisor has provided some contact of
the fabrication vendor.
3. Discuss with supervisor with the main
concept of the final year report.
9 Action items/ Targets to
achieve
1. Determine the key parameter of the
second filter design.
2. Carry on to draft the final year project
report, need to get at lease (10%)
complete before next meeting.
3. Submit the meeting log
10 Other comment/Areas to
improve
1. Next meeting will be held on 6th July at
Serangoon Communicate center L1.
11 Reference materials 1. Jia-Sheng Hong, M.J. Lan Caster,
Combline Filter, Microstrip Filters for
RF/Microwave Applications, New York:
John Wiley & Sons Inc., 2001
2. Jia-Sheng Hong, M.J. Lan Caster,
Lumped Inductors and Capacitors,
Microstrip Filters for RF/Microwave
Applications, New York: John Wiley &
Sons Inc., 2001
3. K.C. Gupta, Ramesh Garg, Inder Bahl,
Prakash Bhartia , Microstrip Lines and
Slotlines Second Edition, Artech House,
Inc., 1996
4. IEEE-MTT website
12 How did you progress so far?
(10 Excellent, 1 Poor)
5
109 | P a g e

CAPSTONE Project Meeting Report 9

1 Date 6 July 2011
2 Time 7:30pm 9:30pm
3 Duration 2 hours
4 Venue Serangoon Communicate Center L1
5 Student Name Guo Ling
6 Project / Supervisor Name MULTILAYER LTCC BANDPASS FILTER
FOR MICROWAVE APPLICATIONS
Dr. Lum Kum Meng

7 Review of Previous Meeting
and progress
NIL
8 Minutes of current meeting 1. Present modified second filter design to
supervisor, due to insertion loss still too
high, filter design still need to be
modified.
2. Discuss the fabrication vendor details
with supervisor.
3. Discuss final report Chapter 1 & 2 details
with supervisor.
9 Action items/ Targets to
achieve
1. Improve the second filter design.
2. Carry on to draft the final year project
report, need to complete Chapter1 and 2
before next meeting.
3. Submit the meeting log
10 Other comment/Areas to
improve
1. Next meeting will be held on 6th July at
Serangoon Communicate center L1.
11 Reference materials 1. Jia-Sheng Hong, M.J. Lan Caster,
Combline Filter, Microstrip Filters for
RF/Microwave Applications, New York:
John Wiley & Sons Inc., 2001
2. Jia-Sheng Hong, M.J. Lan Caster,
Lumped Inductors and Capacitors,
Microstrip Filters for RF/Microwave
Applications, New York: John Wiley &
Sons Inc., 2001
3. K.C. Gupta, Ramesh Garg, Inder Bahl,
Prakash Bhartia , Microstrip Lines and
Slotlines Second Edition, Artech House,
Inc., 1996
4. IEEE-MTT website
12 How did you progress so far?
(10 Excellent, 1 Poor)
5
110 | P a g e

CAPSTONE Project Meeting Report 10

1 Date 20 July 2011
2 Time 7:30pm 9:30pm
3 Duration 2 hours
4 Venue Serangoon Communicate Center L1
5 Student Name Guo Ling
6 Project / Supervisor Name MULTILAYER LTCC BANDPASS FILTER
FOR MICROWAVE APPLICATIONS
Dr. Lum Kum Meng

7 Review of Previous Meeting
and progress
NIL
8 Minutes of current meeting 1. Discuss the re-designed filter simulation
result with supervisor, need to carry
modify the design due the center
frequency shifted.
2. Compare the price from different vendor
and material.
3. Go through report Chapter 3 details with
supervisor.
9 Action items/ Targets to
achieve
1. Get the filter design ready for fabrication
by end of August.
2. Carry on draft the final year project report
(30%).
3. Submit the meeting log
10 Other comment/Areas to
improve
1. Next meeting will be held on 6th July at
Serangoon Communicate center L1.
11 Reference materials 2. Jia-Sheng Hong, M.J. Lan Caster,
Combline Filter, Microstrip Filters for
RF/Microwave Applications, New York:
John Wiley & Sons Inc., 2001
3. Jia-Sheng Hong, M.J. Lan Caster,
Lumped Inductors and Capacitors,
Microstrip Filters for RF/Microwave
Applications, New York: John Wiley &
Sons Inc., 2001
4. K.C. Gupta, Ramesh Garg, Inder Bahl,
Prakash Bhartia , Microstrip Lines and
Slotlines Second Edition, Artech House,
Inc., 1996
5. IEEE-MTT website
12 How did you progress so far?
(10 Excellent, 1 Poor)
5




111 | P a g e

CAPSTONE Project Meeting Report 11

1 Date 12 August 2011
2 Time 11:30am 12:30pm
3 Duration 2 hours
4 Venue SIM Blk82 Lab5.01
5 Student Name Guo Ling
6 Project / Supervisor Name MULTILAYER LTCC BANDPASS FILTER
FOR MICROWAVE APPLICATIONS
/ Dr. Lum Kum Meng

7 Review of Previous Meeting
and progress
NIL
8 Minutes of current meeting 1. Finalized the filter design for fabrication
2. Demo on how to get gerber file by using
ADS software for each filter layer.
3. Go through report Chapter 3 & 4 details
with supervisor.
9 Action items/ Targets to
achieve
1. Get fabrication done before next meeting
2. Once fabrication finished need to start
measurement by using Network Analyzer.
3. Carry on draft the final year project report
(40%).
4. Submit the meeting log
10 Other comment/Areas to
improve
1. Next meeting will be held on 25th
September at SIM Blk82 Lab5.01
11 Reference materials 1. Jia-Sheng Hong, M.J. Lan Caster,
Combline Filter, Microstrip Filters for
RF/Microwave Applications, New York:
John Wiley & Sons Inc., 2001
2. Jia-Sheng Hong, M.J. Lan Caster,
Lumped Inductors and Capacitors,
Microstrip Filters for RF/Microwave
Applications, New York: John Wiley &
Sons Inc., 2001
3. K.C. Gupta, Ramesh Garg, Inder Bahl,
Prakash Bhartia , Microstrip Lines and
Slotlines Second Edition, Artech House,
Inc., 1996
4. IEEE-MTT website
12 How did you progress so far?
(10 Excellent, 1 Poor)
5






112 | P a g e

CAPSTONE Project Meeting Report 12

1 Date 25 August 2011
2 Time 11:30am 12:30pm
3 Duration 2 hours
4 Venue SIM Blk82 Lab5.01
5 Student Name Guo Ling
6 Project / Supervisor Name MULTILAYER LTCC BANDPASS FILTER
FOR MICROWAVE APPLICATIONS
/ Dr. Lum Kum Meng

7 Review of Previous Meeting
and progress
NIL
8 Minutes of current meeting 1. Update supervisor the fabrication has
been complete
2. Discuss the measured result with
supervisor.
3. Supervisor has advised on the measured
and simulated result and to record all
finding in thesis.
9 Action items/ Targets to
achieve
1. Complete the simulation and
measurement result comparison.
2. Carry on draft the final year project
report, need to be complete before end of
October.
3. Submit the meeting log
10 Other comment/Areas to
improve
1. NIL
11 Reference materials 1. Jia-Sheng Hong, M.J. Lan Caster,
Combline Filter, Microstrip Filters for
RF/Microwave Applications, New York:
John Wiley & Sons Inc., 2001
2. Jia-Sheng Hong, M.J. Lan Caster,
Lumped Inductors and Capacitors,
Microstrip Filters for RF/Microwave
Applications, New York: John Wiley &
Sons Inc., 2001
3. K.C. Gupta, Ramesh Garg, Inder Bahl,
Prakash Bhartia , Microstrip Lines and
Slotlines Second Edition, Artech House,
Inc., 1996
4. IEEE-MTT website
12 How did you progress so far?
(10 Excellent, 1 Poor)
5