Clariion Hardware SRG r29

Copyright 2009 EMC Corporation. Do not Copy - All Rights Reserved.
CLARiiON Hardware
2009 EMC Corporation. All rights reserved.
Welcome to CLARiiON Hardware. The AUDIO portion of this course is supplemental to the material and is not a replacement for the student notes accompanying this course. EMC recommends downloading the Student Resource Guide from the Supporting Materials tab, and reading the notes in their entirety. Copyright 2009 EMC Corporation. All rights reserved. These materials may not be copied without EMC's written consent. EMC believes the information in this publication is accurate as of its publication date. The information is subject to change without notice. THE INFORMATION IN THIS PUBLICATION IS PROVIDED AS IS. EMC CORPORATION MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WITH RESPECT TO THE INFORMATION IN THIS PUBLICATION, AND SPECIFICALLY DISCLAIMS IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE. Use, copying, and distribution of any EMC software described in this publication requires an applicable software license. EMC2, EMC, CLARiiON, Navisphere, and Symmetrix are registered trademarks, and MirrorView, SAN Copy, and SnapView are trademarks of EMC Corporation. All other trademarks used herein are the property of their respective owners.
CLARiiON Hardware - 1
CLARiiON Hardware
Upon completion of this course, you will be able to: Describe CLARiiON CX4 Architecture and Features Describe CLARiiON CX4 Cabling Describe CLARiiON CX4-120, 240, 480, 960 Specifications Discuss Enterprise Flash Directors
The objectives for this course are shown here. Please take a moment to review them.
Lesson 1: CX4 Architecture and Features

Upon completion of this lesson, you will be able to: Explain CLARiiON CX4 Features Identify CLARiiON CX4 Common Hardware
The objectives for this lesson are shown here. Please take a moment to review them.
CLARiiON Fibre Channel Timeline
1997
1998
1999
2000
2001
2002
2003
2005
2006/2007 2008
FC5500 FC5700 FC5300 FC4500 FC4700
CX3-10c CX4-120 CX300 CX300i CX500 CX500i CX3-20 (c, f) CX4-240 CX3-40 (c, f) CX4-480 CX700 (Series 1) (Series 2) CX3-80 CX4-960 CX200 CX400 CX600
(Series 3) (Series 4)
The CLARiiON storage array is the EMC mid-tier storage offering which delivers enterprise quality features and functionality. This does not mean that the CLARiiON range cannot meet with the most demanding of storage environments, but rather the CLARiiON range meets with a different set of criteria than the traditional "high end" storage solution. The CLARiiON FC5500 was the first full Fibre Channel storage system. It offered both frontend and back-end Fibre Channel connectivity. The CX4 series is the fourth generation of the CLARiiON CX line of storage systems. Each generation has added enhancements to performance, availability, and scalability, while the high level architecture has remained constant. This allows interoperability between generations and helps preserve the customers investment in hardware, software, knowledge, and skills.
Basic Architecture
Optical Fibre or iSCSI
IP or FC SAN
Copper Fibre Switched Or Direct Connect
External High-Availability Storage Device

Fibre Channel or iSCSI connectivity to host systems Fibre Channel internal architecture for disks
2009 EMC Corporation. All rights reserved. CLARiiON Hardware - 5
The CLARiiON basic architecture allows for flexible host attach through optical Fibre Channel or copper iSCSI ports in the array. The connection to all backend disks is through Fibre Channel loops, implemented using copper cables.
Architecture: Multiple Arrays from One Server

Objects in Clients UI are automatically updated
Management Station with Browser
Storage Domain Domain Members Domain Master

To manage multiple CLARiiONs from a single user interface, at least one storage domain must be created and each domain must have a domain master. The domain master maintains the master database of configuration information for the domain and shares this with the other storage nodes in the domain. Navisphere Manager is typically connected to the domain master, but can be connected to any storage node in the domain. Commands from Navisphere Manager are sent to the connected storage system and relayed to the target storage system. Status updates are transferred from the attached storage systems to the connected storage system and passed to the Navisphere Manager interface.
Modular Approach
All CX4 Series arrays start with a minimum requirement of an SPE, a DAE3P-OS and SPS unit(s) Capacity can be added at any time by attaching additional Disk Array Enclosures (DAE)
CX4-960 Array
CX4-120, CX4-240, CX4-480 Series Arrays

Add-on DAE3P
DAE3P-OS
SPE SPS
All CX4 Series arrays start with a minimum configuration of a Storage Processor Enclosure (SPE) and a Disk Array Enclosure (DAE3P), containing the storage array operating software and Standby Power Supplies (SPS). Additional DAEs can be added to an array to increase storage capacity. The SPE houses the storage processors which are work centers of CX4 arrays. The DAE3P-OS (Bus 0, Enclosure 0) contains the system disks in the first five slots. These disks store the storage processor operating systems and configuration information. The DAE3P-OS can also contain up to 10 additional data disks. The SPS enclosure contains the SPS units. These units provide power to save the contents of write cache memory to protect against data loss due to a utility power failure or critical component failure.
The CLARiiON Storage Processor (SP) Intro

The I/O and Functionality Center of the array
Front-End Fibre or iSCSI Memory Back-End Fibre Disk Drives Write Cache
To hosts or switches
Read Cache System
Read and Write cache sizes are tunable. System memory is fixed in each model/FLARE level. The amount of memory installed is model dependent. The number of frontend ports and backend loops (backend loops are also referred to as backend buses) per SP is configurable with specific limits for each model.
CLARiiON Asymmetric Logic Unit Access (ALUA)

Asymmetric Logical Unit Access (ALUA)
Not the same as Active-Active Array model
FE Ports
SP A
Host side
Upper Level Redirector
Host side ALUA Redirection CMI

Upper Level Redirector
SP B
Layered drivers
Lower Level Redirector
Backend path fault redirection CMI
Layered drivers
Lower Level Redirector
FLARE
FLARE
LUN
Consult EMC Support Matrix for supported Operating Systems

Asymmetric Logic Unit Access (ALUA) is an emerging SCSI communications standard, which allows a host to see a LUN over paths through both SPs, even though the LUN is still owned by only one of the SPs. Although this model allows a LUN to be seen over both SPs, the data will normally be to the LUN over an optimal path that goes through the owning SP. ALUA compliance is or will be required by many new operating systems for Mid-tier storage systems like Windows 2008. It is a request forwarding implementation that honors the storage systems LUN ownership feature (only one controller owns a given LUN). However, when necessary or appropriate, it allows I/O to route through either controller (in the case of the CLARiiON, the SP). When the data must be transmitted to the LUN over a path through the non-owning SP, the data will be redirected to the owning SP to service the disks comprising the LUN. In the CLARiiON, it is over the CMI path. This new model should not be confused with a true Active/Active storage system, like the Symmetrix, in which all ports on all directors can have equal access to any LUN.
Fault Masking Examples
Host
Host
SP A
SP B
SP A
SP B
DAE
DAE
In the event of a front-end path failure, there is no need to trespass LUNs immediately. The Upper Redirector will route the I/O to the SP owning the LUNs through the CMI channel. The owning SP will then service the request to the backend. Note: The acknowledgement must follow the same route back to the Host. With ALUA, suboptimal path I/O redirection is through the CMI connection and may not yield the best performance. ALUA will not be the default mode of operation. The user will select a failover mode for each initiator per best practice for the host attached; the Failover Mode behavior is set per initiator. When load balancing in ALUA configurations, I/Os have to be received and acknowledged over the same path. In the event of a back-end path failure, there is no need to trespass LUNs immediately. The Lower Redirector will route the I/O to the SP owning the LUNs through the CMI channel. The host is unaware of failure and the LUNs do not have to be trespassed. An additional benefit of the lower-redirector is internal in that the layered drivers (including metalun components) are also unaware of the redirect. In the CLARiiON, however, the Flare operating environment will track the number of I/Os going to the non-owning SP. If it determines that it will be more efficient for the array, it will temporarily move the ownership of the LUN to the non-owning SP and move it back when the causal condition is repaired. This is a CLARiiON enhancement, not part of ALUA. Best Practice: Always load balance only across a single SP, where multi front end ports exist for an SP.
Best Practices for ALUA Failover/Performance

Balance LUN ownership between the two SPs Ensure that hosts are still using optimal paths to their LUNs. Ensure that all LUNs are returned to the default owner (SP) after NDUs In case of failure or performance issue, ensure I/O is routing through the optimal path ALUA with PowerPath is the optimum solution
In order to avoid the performance hit experienced when I/O is routed to the non-owning SP of a LUN, it is recommended that the failover software be configured to allow load balancing only across the active-optimal path for a given LUN. PowerPath will do this by default. If a SAN changes due to zone reconfiguration, component failures or component replacements, these changes may cause I/O paths to change and thus effect the performance. Ensure that all LUNs are returned to the default owner (SP) after NDU operations. Again, PowerPath does this automatically. ALUA with PowerPath is the optimum solution for failover scenarios. Under normal conditions, PowerPath will issue I/O to a LUN only on optimal paths (paths to the owning SP). Only if all the paths to the owning SP (optimal paths) are dead will it send I/O to the non-optimal path. PowerPath will also issue a trespass command to make the non-optimal path optimal. PowerPath monitors and optimizes (by issuing a trespass) the I/O paths; therefore, is treated as an explicit failover software since it will load balance only across the optimal paths. If all optimal paths fail, PowerPath issues a trespass and makes the non-optimal paths optimal and load balances across them. PowerPath also supports the Asymmetric Active/Active feature for operating systems that do not have native failover software that supports ALUA.
CX4-120, CX4-240 & CX4-480 Common Features

2U (3.5) x 24 Storage Processor Enclosure contains: 2 Storage Processors (SPs)
Each SP is a combination of Replaceable Units
CPU Module + I/O Modules = SP
4 Power Supplies with integrated Blower Modules

Each Power Supply/Blower Module is a FRU
Midplane for 12v DC distribution, CMI, Rsum PROM and Peer-to-Peer functions
Dual AC cords hardwired to chassis Each cord connects to 2 Power Supplies
The CX4-120, CX4-240 and CX4-480 Storage Processor Enclosure is 2U tall x 24 inches deep and is rack mountable. The enclosure and the midplane (not a FRU itself) houses and interconnects the remaining FRUs and support system Power/Enclosure Fault indicators. The design allows for two horizontal CPU Modules, up to five vertical I/O modules per CPU Module, and four Power Supplies with integrated Blower Modules. Each unit is an FRU. The front end SFP (Small Form-factor Pluggable) optical transceivers in each SP are also FRUs. The low-cost Midplane provides for 12v DC distribution, a CLARiiON Messaging Interface (CMI), Peer-to-Peer functions, and Rsum PROM (which contains items such as the array serial number, midplane part number and WWN seed). There are dual AC cords hardwired to the rear of the chassis with male IEC (International Electrotechnical Commission) at the SPS/PDU (Power Distribution Unit) end. Each cord connects to two power supplies, one for each of the Storage Processors.
Storage Processor Enclosure Front View

PS A0 PS A1 PS B0 PS B1
CPU Module A CPU Module Handles

CPU Module Power & Fault LEDs System Power & Fault LEDs CPU Module B
The front view of the CX4-120, CX4-240, and CX4-480 Storage Processor Enclosure is shown. The front of the SPE allows access to the power supply/blower modules and the CPU Modules.
Storage Processor Boot LED Behavior

CX4-120, CX4-240, CX4-480
SP Power LED (Green) SP Fault LED (Amber/Blue)
CX4-960
Boot State Fault LED Initial Power On Off Executing BIOS Hz Amber Executing POST 1 Hz Amber POST Starting OS 4 Hz Amber OS Booted Hz Blue FLARE Driver Start 1Hz Blue FLARE Driver Complete 4 Hz Blue FLARE Ready for I/O Off
Each Storage Processor boots independently. The three LEDs, between the power supplies for each SP in the CX4-120, CX4-240 and CX4-480 models or on the upper left corner of each SP in the CX4-960, may be monitored during the Storage Processor boot sequence. At initial power-up, the Power LED will be on and the Fault LED will be off while the power supplies and the voltages on the SP stabilizes. The first stage in the SP boot sequence is the BIOS test. This is indicated by the Power LED on and the Fault LED (amber) blinking at a rate of once every 4 seconds (.25 Hz). The second stage in the SP boot sequence is the SP POST (Power On Self-Test). This is indicated by the Power LED on and the Fault LED (amber) blinking at a rate of once a second (1 Hz). Extended POST checks every PROM checksum on the array. The third stage in the boot sequence has POST start the OS load. This is indicated by the Power LED on and the Fault LED (amber) blinking at a rate of 4 times a second (4 Hz). The fourth stage in the SP boot sequence is the OS boot complete. This is indicated by the Power LED on and the Fault LED (blue) blinking at the rate of once every 4 seconds (.25 Hz). The fifth stage in the SP boot sequence has the OS start the FLARE drivers. This is indicated by the Power LED on and the Fault LED (blue) blinking at the rate of once every second (1 Hz). The sixth stage in the SP boot sequence is the successful start the FLARE drivers. This is indicated by the Power LED on and the Fault LED (blue) blinking at the rate of 4 times a second (4 Hz). If all steps are completed successfully, the Fault LED will turn off and the Power LED will remain on.
SP Maintenance Overview
Removing powered SPs:
Entire SP can be hot-swapped in the enclosure An I/O Module or I/O Filler cannot be hot-swapped in a powered SP as this will cause the entire SP to lose power immediately
Note: NST MUST be used to swap faulted I/O Modules
A partially full SP (one without either an I/O Module or I/O Filler in each I/O Module slot) will not receive power when inserted
Always cold-insert an SP, I/O Module, or I/O Filler

The soft-start circuitry in the Power Supply will not supply power until a complete SP is detected
An SP can be hot-swapped from the enclosure in its entirety. An I/O Module or I/O Filler cannot be hot-swapped from a powered SP. In either case, the entire SP will lose power immediately. A partially full SP (one that does not have either an I/O Module or I/O Filler in each I/O Module slot) will not receive power when inserted. An SP, I/O Module or I/O Filler is always coldinserted because the soft-start circuitry in the Power Supply will not supply power until a complete SP is detected.
Use Caution when Removing SPs

Heat Sinks = 3 lb each
Use caution when removing the SPs. The heat sinks in the rear weigh 3 lb each. Do not expect to maintain control of the board from the handles.
Caution is important when removing the SPs. Dual heat sinks that weigh three pounds each are located in the rear of the board, so the weight is unevenly distributed. Remove the SP carefully. Do not expect to maintain control of the board from the handles! The board must be supported from the bottom and no protective cover on the bottom of the board is installed.
CX4-120, CX4-240 & CX4-480 CPU Module LEDs

PWR GOOD LED UNSAFE TO REMOVE LED CPU FAULT/STATUS LED
CPU Module Status LEDs Green (Power Good) LED Amber/Blue (Fault) LED Amber 1/4Hz = BIOS 1Hz = POST 4Hz = POST starting OS Solid = CPU FLT Blue 1/4Hz = OS booted 1Hz = FLARE driver start 4Hz = FLARE driver complete White (Unsafe to Remove) LED Persisting Memory In the process of Vaulting cache Update Resume or Flashing Firmware updates
Power Supply/Blower Modules
Power & Fault LEDs Green = Power Good Amber = Power Fault
Power Supply Handle Release
The CX4-120, CX4-240 and CX4-480 feature common 400 Watt 2U Power Supplies. The Power Supplies are available in a standard AC input or a -48V DC input for the Telco industry. They include integrated Dual Counter Rotating Fans. There are two Power Supplies per Storage Processor, therefore four power supplies per system. Both power supplies for a storage processor must be removed before the CPU Module can be removed.
CX4-120, CX4-240 and CX4-480 Power Distribution

SPS-A
PS-A0
SPA - 12V
PS-A1
PS-B0
SPB - 12V
PS-B1
SPS-B
The power distribution for the CX4-120, CX4-240, and CX4-480 SPE is illustrated. The Power Supplies provide 12v DC to their respective SPs, with the dual AC cords hardwired to the chassis power for the Power Supplies. SPS-A powers PS-A0 and PS-B0, while SPS-B powers PS-A1 and PS-B1. Note: The base CX4-120 model contains a single SPS unit mounted as SPS-A. The connection that would normally attach to SPS-B is connected to the Power Distribution Unit (PDU). If the optional second SPS is ordered, the power connections are made the same as the CX4-240 and CX4-480 models. There are four power supplies in the SPE: two power supplies are associated with each SP and supply power to only that SP.
CX4-120, CX4-240, CX4-480 Power Cabling
The SPS units in a CX4-120, CX4-240 and CX4-480 should only be used to power the SPE and first DAE. Connections A are the input power to the SPS units from the power distribution units (PDUs). Connections B are the input power to the SPE power supplies from the SPS units. Connections C are the input power to the first DAE from the SPS units. All remaining DAEs must be powered from the PDUs.
CX4-120, CX4-240 and CX4-480 HA Model

Fault
Single PS / Blower, either side PS / Blower, 1 on each side PS / Blower, 2 on the same side Single SPS, either side, CX4-120 (with optional dual SPS) CX4-240 or CX4-480 Single SPS, either side, CX4-120 (with optional dual SPS) CX4-240 or CX4-480 Single SPS CX4-120 (without optional dual SPS)
Write Caching
ON ON ON ON
Comment
CX4-120/CX4-240/CX4480 HW is still HA here SP powered off Due to any AC Loss
ON
Due to SPS Comm Loss Due to AC or SPS Comm Loss

OFF
The table on the slide shows the High Availability Model for the CX4-120, CX4-240 and CX4480 with various Power Supply/Blower Modules faults. Only three out of four power supplies need be operational to start write caching. A single power supply can power a single storage processor and a single blower can cool a single storage processor. Both SPs can have a single fault and still maintain write caching, provided both SPS units are fully charged. The CX4-120, CX4-240 and CX4-480 systems can run indefinitely with one Power Supply/Blower Module faulted or removed on each SP, and still maintain High Availability (HA). A second Power Supply/Blower Module fault on an SP will cause the SP to power down immediately causing write cache to disable. Note: The CX4-120 can be ordered with an optional second SPS and operates the same as the CX4-240 and CX4-480, when so configured.
Storage Processor Enclosure Rear View

Management Module B Management Module A
SP B
SP A
Power Input B
B0 B1 B2 B3 B4 I/O Module Slots B
A0 A1 A2 A3 A4 I/O Module Slots A
Power Input A
Dogtag
Note: CX4-480 minimum configuration shown
The rear view of the CX4-120, CX4-240, and CX4-480 Storage Processor Enclosure (SPE) is shown. The rear of the SPE allows access to the I/O Modules and the Management Modules. The CX4-120, CX4-240 and CX4-480 SPE provide slots for one (1) Management Module and five (5) I/O Modules per Storage Processor. The Management Modules are required for all models. The minimum and maximum number of I/O Modules is model dependent and will be discussed later.
Management Module
GbE Service LAN
(SPA = 128.221.1.250) (SPB = 128.221.1.251) (Subnet mask = 255.255.255.248)
GbE Management LAN

Address provider by Customer, set during initialization
Service Port COM1
SPS Port COM2
NMI Button
The Management LAN IP address is provided by the customer and set during array initialization. The CX4-120, CX4-240, and CX4-480 models Service LAN has a fixed IP Address and Subnet mask. This LAN is accessed via either a straight through cable or a crossover cable connecting a PC to the Service LAN port. A serial interface is provided to monitor the Standby Power Supply (SPS) and a serial interface is provided for service. The NMI (Non-Maskable Interrupt) button forces a memory dump of the SPs memory and should only be used under direction of Engineering or Tech Support level 2.
CX4 Series I/O Modules

iSCSI I/O Module
2 iSCSI ports pre module
Port 1 Port 0
FC I/O Module
4 FC ports per module
Port 3 Port 2
Port 1 Port 0
The I/O Modules are a common component across the entire CX4 family of arrays. The modules are available in two versions, Fibre Channel and iSCSI. The FC I/O Module contains four (4) ports and the iSCSI I/O Module contains two (2) ports. All CX4 models require one (1) FC I/O Module per SP installed in slot 0 and one (1) iSCSI I/O Module; the location of the required iSCSI I/O Module is model dependent. Additional required and optional I/O Modules are model dependent.
I/O Module Features

I/O Modules are separate FRUs/CRUs
Can be physically added/replaced independent of CPU Modules I/O Modules are inserted into the CPU Modules On CX4-960, I/O Modules can also be inserted into the I/O Annex area
Removing a powered on I/O Module will cause the SP to immediately reboot

Removing a I/O Module that is not powered up will NOT cause SP to reboot Removing an SFP will NOT cause the SP to reboot Important: Use Navisphere Service Taskbar (NST) to safely replace faulted I/O Modules and SFPs
Manages reboots to guard against Data Unavailability (DU)
I/O modules are both Field Replaceable Units and Customer Replaceable Units and can be physically added independent of CPU modules. If a powered on I/O module is removed, the Storage Processor will immediately reboot.
Front End SFP Optical Transceivers
The Front End SFP (Small Form-factor Pluggable) Optical Transceivers (FRUs) are a common component to all the CX4 Series arrays. They are removed and inserted using the small handle mounted on each.
4-Port 8Gb/s Fibre Channel I/O Module

Port 0 Port 1 Port 2 Port 3
Latch
Power / Fault LED Link LED
Now available in the CLARiiON CX4 series line is the 4-port 8Gbs Fibre channel I/O module, which support 2/4/8 Gb front end host transfer rates. It will connect to the same 2 and 4 Gb back end disk array enclosures (DAEs) as the current 4 Gb FC I/O modules. An 8 Gb SFP will be required for 8Gb FE connectivity. Removing a powered on I/O Module will cause the SP to immediately reboot. Removing an SFP will NOT cause the SP to reboot. Similar to other FC and iSCSI I/O modules, bicolor green/amber LED for power good and fault indicators. The link LED is for link speed, activity and port marking. If the LED is green, the link speed is either (2G/4G). The blue LED is for 8G FC connection. Port marking blinks the LED with or without FC connection for port identification. The I/O module has common design element and a common mechanical latch design to the 4Gb FC I/O module. It is supported on all CX4 arrays (both AC and DC version).
4-Port 8Gb/s Fibre Channel I/O Module and SFP
8 Gb SFP
The 4-Port 8Gbps FC I/O Module pairs can be freely mixed with other previously released components of the UltraFlex Technology (2-Port 1Gbps iSCSI I/O Module and 4-Port 4Gbps FC I/O Module). The 4-Port 8Gbps FC I/O Module is available for all CX4 Series arrays. The 4Port 8Gbps FC I/O Modules will be factory installed for new arrays or services installed for existing CX4 add-ons. Any FC port can be configured as either front-end host / switch connection or back-end DAE connection. Each front end FC port can operate at 2, 4 or 8 Gbps. The 4-Port 8Gbps FC I/O Module cannot replace an existing I/O Module in this release. They can only be added to empty slots. Also it is possible to "mismatch" the 8Gb I/O Modules and SFPs. The mismatch cases are if a 4Gb SFP is inserted into an 8Gb Fibre I/O module, that particular port can run at 2Gb or 4Gb, but not at 8Gb or 1Gb, and if an 8Gb SFP is inserted into a 4Gb Fibre I/O module, that particular port can run at 2Gb or 4Gb, but not at 8Gb or 1Gb. If a completely incompatible SFP is inserted, the SFP will be faulted as incompatible.
2-Port 10Gb/s iSCSI I/O Module
Port 1 Port 0
Latch Power / Fault LED

Now available in the CLARiiON CX4 series line is the 2-port 10Gb/s iSCSI I/O module. The I/O module can only run at 10Gb/s and will not auto-negotiate to 1Gb/s or any other speed. Uses Small Form-factor Pluggables (SFPs) the Flare will persist both ports on a 10Gb/s iSCSI module even if no SFPs are inserted. Must commit FLARE 29 operating bundle or Navisphere will display that the I/O module is an Unsupported device until FLARE is committed.
10 Gb/s iSCSI Limits

On all CX4 arrays, 10Gb/s iSCSI I/O module limits are less than 1Gb/s iSCSI I/O module limits. Not all 1Gb/s I/O modules can be upgraded in some arrays.
No such restriction for FC. You can upgrade all of your 4Gb/s I/O modules to 8 Gb/s.
Modules Per Array Max iSCSI (1G + 10G) Max 10G iSCSI
CX4-120 4 2
CX4-240 8 2
CX4-480 8 4
CX4-960 8 4
10 Gb/s iSCSI I/O module limits are listed here. Please take a moment to review them.
Drive Spin Down

This feature is CLARiiONs second generation drive spin down product
The first generation was only available on the CLARiiON Disk Library
Disk drives can transition into a low power state when idle
In FLARE R29 the spindle motor will be spundown (0 RPM) The electronics will remain at full power Power saving of 55% 60% when drives are spun down Only specific drives are eligible for this feature
Standby state Drives running in low power mode

The drives will return to full power when media access is required
Navisphere GUI and CLI interface to configure this feature and monitor the settings This feature can be enabled at different granularities
Array level RAID Group level
The disk spin down feature is the CLARiiONs second generation spin down product, with the first being available only for the CLARiiON Disk Library. Using this feature, the disk drives transition into a low power state, when idle, by spinning down the spindle motor (0 RPM) which creates a power saving of 55%- 60%. Use the Navisphere GUI or CLI to configure the disk spin down feature. This feature can be enabled at either the Array or RAID Group level.
Drive Spin Down Configurations and Limitations

Drives in slots 0 4 (vault drives) will not be eligible for spin-down Drive Spindown functionality will only be available on the CX4 platform This feature will not be available for any layered features (MetaLUN, thin LUNs, WIL, RLP, CPL, etc.)
Mutually exclusive on a RAID Group basis
Only drives qualified for the low power state of spindown will participate in power savings (SATA drives)
The spin down feature is only available on the CX4 platform. The Vault drives will not be eligible for spin down and spin down will not be available for any layered features. Only SATA drives are qualified to participate in power savings.
Cables and Connectors

Optical cables
Required for Fibre Channel front-end host connection to Storage Processors Conform to industry standard Fibre Channel passive SFP connectors
Copper cables
Required for Fibre Channel back-end connections and all iSCSI connections Utilize industry standard HSSDC2 connections on the DAE side
SFP to HSSDC2 cables are only required for SP to first DAE HSSDC2 to HSSDC2 cables are required for DAE to DAE connections 2Gb/4Gb/s on FC copper cable support
Optical cables are required for Fibre Channel front-end host connections to the Storage Processors of the CX4-120, CX4-240, CX4-480, and CX4-960 arrays. Copper cables are required for Fibre Channel back-end connections and all iSCSI connections. Cables conform to industry standard Fibre Channel passive SFP connectors. CX4-120, CX4-240, CX4-480, and CX4-960 copper FC cables utilize industry standard HSSDC2 (for DAE3P enclosures) connections on the DAE side. SFP to HSSDC2 cables are only required for SP to first DAE.
Lesson 2: DAE3P Features and Rules

Upon completion of this lesson, you will be able to: Describe DAE3P Features Describe DAE3P Rules
The objectives for this lesson are shown here. Please take a moment to review them.
DAE3P Overview
Supports up to 15 low-profile, 2/4Gb/s Fibre Channel disk drives
Can operate at either 4Gb/s or 2Gb/s Drive fillers must be installed in empty slots
Two 4Gb/s Link Control Cards (LCCs) Two Power Supply/Cooling modules
Utilizes same Chassis, Power Supply/Cooling module as DAE2P Enclosure
Uses same cables as DAE2P Enclosure

8 meter maximum between DAE3Ps 5 meter maximum between SPEs and DAEs
Supports the CX4 Series platforms

The DAE3P Disk Enclosure supports up to 15 low-profile, 2/4Gb/s Fibre Channel disk drives, and can operate at either 4G or 2G. If any disk slots are left empty, drive fillers must be installed in those slots. The DAE3P Enclosure supports two 4Gb/s Link Control Cards (LCCs). It utilizes the same Chassis, Power Supply/Cooling module as the DAE2P Enclosure. The same cables used for the DAE2P are also supported by the DAE3P. The maximum cable length between DAEs is 8 meters, while the maximum cable length between the SPEs and the DAEs is 5 meters. The DAE3P supports the new CX4 Series CLARiiON platforms. DAE3P drive support All legacy 2Gb/s FC drives: 36GB 10K RPM 73GB 10K & 15K RPM 146GB 10K & 15K RPM 300GB 10K RPM 500GB 7.2K RPM New 2Gb/4Gb/s FC drives: 73GB 15K RPM 146GB 15K RPM 300GB 15K RPM
DAE3P Front View

Slot 0 Slot 14
Fault LED
The front of the DAE3P enclosure allows access to the FC disk drives. The DAE3P bezel contains a label to indicate the operational speed of the enclosure.
DAE3P Rear View
Power Supply B
LCC B
Power Supply A
LCC A
The SPA loop components are mounted in the bottom of the enclosure and the SPB loop components are mounted in the top of the enclosure. Each power supply in the DAE3P enclosure is capable of powering the entire enclosure in the event of a power supply failure. The two LCC cards connect to all the disks in the enclosure and operate independently. The Loop ID and Enclosure ID on both LCC cards within an enclosure must always match. The DAE3P LCCs power up in local mode and FLARE puts them in remote mode when the enclosure is added to the BE loop. Users can only change the enclosure address when in local mode. This feature is implemented to prevent an accidental change in the enclosure ID during normal system operation. To change back to local mode after an enclosure is in the remote mode, remove the enclosure from the BE loop and power cycle the enclosure. Once in local mode the enclosure ID switches will be enabled again. Five (5) seconds after a button push, a hard reset is issued to all the drives and the new ALPA (Arbitrated Loop Physical Address) values will be in effect. The enclosure ID LEDs will indicate the incremented value each time the switch is pressed. The user could use either LCC switch. The LED displays on both LCCs will report the same value when either switch is used to change the value. If the drives in the enclosure do not support Hard Reset, the DAE will need to be power cycled again.
Power Supply / Blower Module
LED Name (color) Power OK LED (Green)
State ON OFF OFF ON
Description AC power is applied and no faults detected. AC power is removed or fault detected within unit. AC power is applied and no faults detected. AC power is removed or fault detected within unit. Unit power is off due to an environmental fault (either a multiple blower fault or an ambient overtemperature condition). Cooling module normal operation. Single or Multi blower fault detected.
Power Supply Fault LED (Amber) FLASHING
Cooling Module Fault LED (Amber)

OFF ON
Two independent cooling modules provide the front-to-rear airflow inside the DAE3P. Each cooling module houses two blowers. Each power supply module provides power to the resident cooling module, as well as the cooling module that resides on the peer power supply. This is to ensure uninterrupted and continuous operation of the cooling module when the power module of one power supply is faulted. If the DAE experiences any single blower fault, the remaining fans increase their speed to compensate towards the degraded cooling. The system continues to operate uninterrupted. The faulted status is reported to the SP. If the DAE experiences a multi blower fault, FRUMON (FRU Monitor Code) on the LCC powers down all drives after two minutes. The LCC itself remains operational to communicate and preserve the Fibre Channel loop so that communication to the down stream enclosures are kept uninterrupted. There are two thermal sensors on each LCC. Both thermal sensors can report an ambient over temperature condition to each LCC. If both LCCs report an ambient over temperature condition, the FRUMON on the LCC will power down the drives after two minutes. If a DAE is powered up with only one power supply unit installed, FRUMON on the LCCs powers down the drives after two minutes.
CX4 Series Drive Support

The DAE3P: Supports new 2/4Gb/s FC drives Supports SATA drives
High capacity low cost ATA alternative Available in 2/4Gb/s & 3Gb/s
Supports 4 Gb/s Enterprise Flash Drives Supports all legacy 2Gb/s FC drives Does not support older PATA drives
The DAE3P supports many different types of drives, including Fibre Channel, SATA, and Enterprise Flash Drives.
DAE3P/DAE2P Disk Enclosure Rules (1)

DAE3P supports up to 15 low-profile, 2/4Gb/s FC disk drives DAE2P not configured with CX4 Series SPs Will not ship from manufacturing but may be added in field Booting/OS enclosures must be Fibre disks only CX4-120 is the only exception to this rule Diskless enclosures allowed Except on BE0, Enc 0 Do not mix DAE2P and DAE3P enclosures on the same loop 4Gb/s LCCs not allowed in DAE2P enclosure 2Gb/s LCCs dont fit in DAE3P enclosure ATA LCC controllers wont fit in Fibre enclosure chassis
The DAE3P Disk Enclosure supports up to 15 low-profile, 2/4Gb Fibre Channel disk drives, and can operate at either 4Gb/s or 2Gb/s. DAE2P enclosures are not shipped with the CX4 Series SPs but may be added in field. For DAE2P and DAE3P enclosures, all booting/OS enclosures (BE0, Enc 0) must be Fibre disks only. The CX4-120 is the only exception and it may have SATA drives in the booting enclosure. The SPE is required to boot from the first 4 drives in an Array. Diskless enclosures are allowed, except on BE0, Enc 0. Do not mix DAE2P enclosures and DAE3P enclosures on the same loop as the entire loop will run at the slower speed. The new 4Gb/s LCC is not allowed in a DAE2P enclosure, the 2Gb/s LCC is not allowed in a DAE3P enclosure, and the ATA LCC controllers are not allowed in a Fibre enclosure chassis.
DAE3P/DAE2P Disk Enclosure Rules (2)

First five drives in the OS enclosure must be equal size/speed Keep drives in a chassis the same size and speed if possible Install drives of the same type in groups of five Do not mix 2Gb/s drives with 4Gb/s drives in a DAE3P enclosure One transition from faster RPM drives to slower RPM drives allowed within enclosure ATA drives not allowed in Fibre enclosure chassis Empty slots must have drive fillers installed
The first five drives in the OS enclosure (BE0, Enc 0) must all be of equal size/speed. If possible, keep all drives in a chassis the same size and speed. If not, try to install drives of the same type in groups of 5. Do not mix 2Gb/s drives with 4Gb/s drives in a DAE3P enclosure. Only one transition from faster RPM drives to slower RPM drives is allowed within an enclosure. ATA drives are not allowed in a Fibre enclosure chassis. If any disk slots are left empty, drive fillers must be installed in those slots.
Disk Enclosure Interconnect Rules

Preserve the highest possible BE loop speeds
BE loop can operate at one of two speeds Will operate at the lowest loop speed
Determined by the enclosure type and disk drives
DAE3P/4Gb/s drives or empty enclosure = 4Gb/s BE loop speed DAE3P/SATA drives = 4Gb/s BE loop speed DAE3P/2Gb/s drives = 2Gb/s BE loop speed
Each FC DAE back end loop supports up to 120 FC drives

Maximum of 8 DAEs per loop
Each SATA DAE back end loop supports up to 120 SATA drives
Loop 0 supports 105 SATA drives plus the first mandatory FC DAE Exception: CX4-120 allows for a full SATA backend on Loop 0
The objective of the disk enclosure interconnect rules is to preserve the highest possible BE loop speeds. A BE loop can operate at one of two speeds and will operate at the lowest loop speed as determined by the enclosure type and disk drives connected to the loop: DAE3P/4Gb drives or empty enclosure = 4Gb BE loop speed DAE3P/4Gbit SATA drives = 4Gb BE loop speed DAE3P/2Gb drives = 2Gb BE loop speed DAE2-ATA/SATA drives = 2Gb BE loop speed Each Fibre Channel DAE back end loop will support up to 120 Fibre Channel drives or a maximum of 8 DAEs per loop. Each SATA-enabled DAE back end loop will support up to 120 SATA drives. Loop 0 supports up to 105 SATA drives, in addition to the first DAE, which includes the mandatory Fibre Channel drives to support the VAULT OS boot drives. The exception to this rule is the CX4120, which allows for a full SATA backend Loop 0 and a maximum of 120 SATA drives.
Disk Enclosure Interconnect Rules CX4-120 Model
Single Back End (BE) Loop DAE connections to SPE should adhere to the highest-tolowest priority
DAE3P/4Gb/s drives or empty enclosure DAE3P/4Gb/s SATA drives DAE3P/2G/s drives DAE2-ATA/SATA drives
DAE2-ATA/SATA are to be connected as the last chassis on the loop

connect DAE3P enclosures first
The CX4-120 model supports a Single Back End (BE) loop. Disk enclosure connections to the SPE enclosure should adhere to the highest-to-lowest priority as follows: DAE3P/4Gb/s drives or empty enclosure DAE3P/4G/s ATA drives DAE3P/2Gb/s drives DAE2-ATA/SATA drives DAE2-ATA/SATA enclosures are to be connected as the last chassis on the loop, connect DAE3P enclosures first.
Disk Enclosure Interconnect Rules CX4-240, CX4-480 Models
Two BE loops per SP on CX4-240 model
Four BE loops per SP on CX4-480 model Enclosure zero on BE0 should adhere to the highest-tolowest priority
DAE3P/4Gb/s drives DAE3P/2Gb/s drives
The CX4-240 model supports two BE loops per SP. The CX4-480 model supports four BE loops per SP. Enclosure zero on BE0 (the Boot OS) should adhere to the highest-to-lowest priority as follows: DAE3P/4Gb/s drives DAE3P/2Gb/s drives
Disk Enclosure Interconnect Rules CX4-960 Model
Configurations with one type of loop speed

Maintain homogeneous BE loops based on DAE type
DAE3P vs. DAE2-ATA
Balance loops as needed
Configurations with different loop speeds

Maintain homogeneous BE loops based on speed and DAE type
All DAEs on 4Gb/s FC loop fully populated
Add extra 4Gb/s FC drives to empty slots in 2Gb/s FC loop enclosures
All DAEs on 2Gb/s FC loop fully populated

Extra 2Gb/s FC drives should NOT be installed in 4Gb/s FC loop enclosures
When the configuration contains disk enclosures that have one type of loop speed, maintain homogeneous backend loops based on enclosure type (DAE3P vs. DAE2-ATA), then balance the enclosures on the respective loops as needed. When the configuration contains disk enclosures having different loop speeds, maintain homogeneous backend loops based on loop speeds and enclosure type (DAE3P vs. DAE2-ATA), unless the enclosures on all 4Gb/s Fibre Channel loops are fully populated. In this case, any extra 4Gb/s Fibre Channel drives should be added into vacant drive slots on the 2Gb/s Fibre Channel loop. If all 2G/s Fibre Channel loops become fully populated and there are vacant drive slots on the 4Gb/s loop, then the extra drives should NOT be installed.
Lesson 3: CX4-120 Architecture

Upon completion of this lesson, you will be able to:
Describe CLARiiON CX4-120 Architecture Describe CLARiiON CX4-120 Configuration Describe CLARiiON CX4-120 Data Cabling
The objectives for this lesson are shown here. Please take a moment to read them.
CLARiiON CX4-120 Overview

UltraScale Architecture
Two Single 1.2Ghz dual core LV-Woodcrest CPU Modules 6 GB system memory
Connectivity
128 high-availability hosts Up to 6 I/O modules (FC or iSCSI)
8 front-end 1 Gb/s iSCSI host ports max 12 front-end 4 Gb/s Fibre Channel host ports max 2 back-end 4 Gb/s Fibre Channel disk ports max
Scalability
Up to 1,024 LUNs Up to 120 drives
The CX4-120 has an UltraScale Architecture and a 6 GB system memory. It can connect to 128 high-availability hosts and can support both FC and iSCSI I/O modules. It can scale up to 1,024 LUNs and 120 drives.
CX4-120 CPU Module

2 DIMMs CX4-120 CPU
CX4-120 I/O Module Connectors

The CX4-120 CPU Module supports one Intel CPU and 3GB memory per SP using two of the four DDR-II 400 Dual In-line Memory Module (DIMM) slots (one 2GB DIMM and one 1GB DIMM). The SP also contains a tray providing card guides for the assembly. The CPU Module must have the two related power supplies removed before the CPU Module can be replaced.
CX4-120 Specifications
Per SP CPUs (dual core) Max Drives Memory Mirrored Write Cache Max Initiators Max HA Hosts Max LUNs Max Storage Groups 1@1.2Ghz 120 3 GB 600 MB 128 NA NA NA Per Array 2@1.2Ghz 120 6 GB 600 MB 256 128 1024 128
CX4-120 array specifications are listed.
CX4-120 I/O Specifications
Per SP Min I/O Modules 4Gb/s FC I/O Modules 1Gb/s iSCSI I/O Modules FC Ports FC Backend Ports FC Frontend Ports iSCSI Ports 2 1 1 4 1 2 2 Max 3 2 2 8 1 6 4
Per Array Min 4 2 2 8 2 4 4 Max 6 4 4 14 2 12 8
CX4-120 I/O specifications are listed here. Please take a moment to review them.
CX4-120 Model BE Data Cabling

To additional enclosures Maximum of 8 enclosures total
I/O Module 0, Port 0

I/O Module 0, Port 0

Each CX4-120 SP has a single BE port (I/O Module 0, Port 0) and all disk enclosures are cabled to this single port.

Upon completion of this lesson, you will be able to: Describe CLARiiON CX4-240 Architecture Describe CLARiiON CX4-240 Configuration Describe CLARiiON CX4-240 Data Cabling

Two Single 1.6Ghz dual core LV-Woodcrest CPU Modules 8 GB system memory
Connectivity
Scalability
CX4-240 CPU Module

2 DIMMs CX4-240 CPU
CX4-240 I/O Module Connectors

The CX4-240 CPU Module supports one Intel CPU and 4GB memory per SP using two of the four DDR-II 400 Dual In-line Memory Module (DIMM) slots. The DIMMs are individually replaceable. The SP also contains a tray providing card guides for the assembly. The CPU Module must have the two related power supplies removed before the CPU Module can be replaced.
Per SP CPUs (dual core) Max Drives Memory Mirrored Write Cache Max Initiators Max HA Hosts Max LUNs Max Storage Groups 1@1.5Ghz 240 4 GB 1.26 GB 256 NA NA NA Per Array 2@1.5Ghz 240 8 GB 1.26 GB 512 256 1024 512
Per Array Min 4 2 2 8 4 4 4 Max 8 4 6 16 4 12 12
CX4-240 I/O specifications are listed. Please take a moment to review them.
CX4-240 Data Cabling Factory Install

Bus 0 I/O Module 0, Port 0 Bus 1 I/O Module 0, Port 1
The CX4-240 arrays configured and mounted at the factory in an EMC rack will have all the Bus 0 enclosures mounted together, followed by all the Bus 1 enclosures. The actual physical location of an enclosure within the rack does not determine the enclosure address. You may encounter arrays in the field that do not adhere to the manufacturing standard. The factory standard for connecting backend buses is Bus 0 will be connected to I/O Module 0, Port 0 on each SP, and Bus 1 will be connected to I/O Module 0, Port 1 on each SP.
CX4-240 Data Cabling Field Install

Bus 0 I/O Module 0, Port 0 Bus 1 I/O Module 0, Port 1
The recommended backend configuration for field installed CX4-240 arrays is to mount all the enclosure 0s together, followed by the remaining enclosures on Loop 0 physically adjacent, followed by the remaining enclosures on Loop 1. The actual physical location of an enclosure within the rack does not determine the enclosure address and you may encounter arrays in the field that do not adhere to the manufacturing standard. The factory standard for connecting backend buses is Bus 0 will be connected to I/O Module 0, Port 0 on each SP and Bus 1 will be connected to I/O Module 0, Port 1 on each SP.

Upon completion of this lesson, you will be able to: Describe CLARiiON CX4-480 Architecture Describe CLARiiON CX4-480 Configuration Describe CLARiiON CX4-480 Data Cabling

Two 2.2Ghz dual core LV-Woodcrest CPU Modules 16 GB system memory
Connectivity
Scalability
CX4-480 Storage Processor

4 DIMMs
CX4-480 CPU Module
A CX4-480 Storage Processor consists of a base PCB/Motherboard and an I/O Module. The Motherboard supports two Intel CPUs and 8GB of memory (Four DDR-II 400 DIMM slots) per storage processor. The DIMMs are individually replaceable. The Motherboard includes a tray, which provides card guides for the assembly. The Storage Processor can be hot-swapped from the enclosure in its entirety after removing the power supplies.
Per SP CPUs (dual core) Max Drives Memory Cache Mirrored Write Cache Max Initiators Max HA Hosts Max LUNs Max Storage Groups 1@2.2Ghz 480 8GB ~6GB ~3GB 256 NA NA NA Per Array 2@2.2Ghz 480 16GB ~12GB ~3GB 512 256 4096 512
Per Array Min 6 4 2 16 8 8 4 Max 10 6 6 24 8 16 12
CX4-480 I/O specifications are listed.

Bus 0 I/O Module 0, Port 0 Bus 1 I/O Module 0, Port 1 Bus 2 I/O Module 1, Port 0 Bus 3 I/O Module 1, Port 1
The CX4-480 arrays configured and mounted at the factory in an EMC rack will have all the Bus 0 enclosures mounted together, followed by all the Bus 1 enclosures, followed by all the Bus 2 enclosures, followed by all the Bus 3 enclosures. The actual physical location of an enclosure within the rack does not determine the enclosure address and you may encounter arrays in the field that do not adhere to the manufacturing standard. The factory standard for connecting backend buses is Bus 0 will be connected to I/O Module 0, Port 0 on each SP, Bus 1 will be connected to I/O Module 0, Port 1 on each SP, Bus 2 will be connected to I/O Module 1, Port 0 on each SP and Bus 3 will be connected to I/O Module 1, Port 1 on each SP.
CX4-480 Data Cabling Field Install

Bus 0 I/O Module 0, Port 0 Bus 1 I/O Module 0, Port 1 Bus 2 I/O Module 1, Port 0 Bus 3 I/O Module 1, Port 1
The recommended backend configuration for field installed CX4-480 arrays is to mount all the enclosure 0s for all buses together, followed by the remaining enclosures on Loop 0 physically adjacent, followed by the remaining enclosures on Loop 1 physically adjacent, followed by the remaining enclosures on Loop 2 physically adjacent, followed by the remaining enclosures on Loop 3 physically adjacent. The actual physical location of an enclosure within the rack does not determine the enclosure address and you may encounter arrays in the field that do not adhere to the manufacturing standard.

Upon completion of this lesson, you will be able to: Describe CLARiiON CX4-960 Architecture Describe CLARiiON CX4-960 Configuration Describe CLARiiON CX4-960 Cabling

Four Quad Core 2.33Ghz Clovertown CPU Modules 32 GB system memory
Connectivity
Scalability
Up to 4096 LUNs Up to 960 drives
CX4-960 Features
High End of the CLARiiON SAN/NAS offering Features include:
4U x 24 rack-mount SPE Two hot-swappable power supplies Four hot-swappable blower modules 2U standby power supply (SPS) Separate 3U rack-mountable DAE
The CX4-960 are the high end of the CLARiiON SAN/NAS offering. It is offered in two models, the base model and a model with an expansion option. The difference between the two models is the number of frontend ports, backend ports and therefore supported disk drives. The CX4-960 has a 4U rack-mountable (SPE) Storage Processor Enclosure containing two hotswappable storage processors, two hot-swappable power supplies and four hot-swappable blower modules. The midplane design interconnects the FRUs. The CX4-960 base model supports four Back End (BE) loops per Storage Processor, and the CX4-960 expansion model supports eight Back End ports per Storage Processor. A 2U standby power supply (SPS) is installed for each SP. Disk support is provided through a separate 3U rack-mountable (DAE) Disk Array Enclosure.
CX4-960 SPE (Rear View)

Power Supply B SPB Power Supply A
Management Module B
I/O Annex
SPA
Management Module A
The rear of CX4-960 SPE chassis allows access to a number of components. Dual power supplies, SPA is powered by the right PS and SPB is powered by the left PS. Note, the Power Supplies are serviced from the front. The chassis provides three rows of I/O Module connectors. The top row contains I/O Modules used by SPB, the middle row contains I/O Modules used by SPA and the bottom row is the I/O Annex. The two left slots are for I/O Modules used by SPB and the two right slots are for I/O Modules used by SPA. Each SP is controlled through a Management Module. The Management Module for SPA is mounted on the right and the Management Module for SPB is mounted on the left.
CX4-960 SPE Chassis (Front View )

Power Supply A A Blowers/Fans B C D Power Supply B
Enclosure Fault LED Power Fault LED

The front of the CX4-960 SPE allows access to the two power supplies and four blower modules. The hot-swappable power supplies provide 1200 Watts of 12-Volt main, auxiliary, and blower power in a load-sharing highly-available 1+1 configuration. CX4-960 models support four hot-swappable blower modules, in a 3+1 configuration. Enclosure fault and power LEDs are also shown.
CX4-960 Storage Processor

CPU Module DIMMs
Slot 0 Slot 1 Slot 2 Slot 3

I/O Modules
The CX4-960 SP consists of a CPU Module and a minimum of two (2) I/O Modules and a maximum of six (6) I/O Modules, four (4) directly connect to the CPU Module and two (2) mounted within the I/O Annex. The entire SP itself is not a FRU and will not be spared as an assembly. The CPU Module and I/O Module FRUs are rear-serviced FRUs and will be stocked separately as spares.
CX4-960 (w/o Expansion Option) Specifications

Per SP CPUs (quad core) Max Drives Memory Cache Mirrored Write Cache Max Initiators Max HA Hosts Max LUNs Max Storage Groups 2@2.33Ghz 960 16GB ~14GB ~3GB 512 NA NA NA Per Array 4@2.33Ghz 960 32GB ~28GB ~3GB 1024 512 4096 1024
CX4-960 without the expansion option array specifications is listed.
CX4-960 (w/o Expansion Option) I/O Specifications
Per Array Min 6 4 2 16 8 8 4 Max 12 8 8 40 16 24 16
CX4-960 without the expansion option I/O specifications is listed.
CX4-960 (with Expansion Option) Specifications

Per SP CPUs (quad core) Max Drives Memory Cache Mirrored Write Cache Max Initiators Max HA Hosts Max LUNs Max Storage Groups 1@2.33Ghz 960 16GB ~14GB ~3GB 512 NA NA NA Per Array 2@2.33Ghz 960 32GB ~28GB ~3GB 1024 512 4096 1024
CX4-960 with the expansion option array specifications is listed.
CX4-960 (w Expansion Option) I/O Specifications
Per Array Min 6 6 2 16 8 8 4 Max 12 8 6 40 16 24 16
CX4-960 with the expansion option I/O specifications is listed.
CX4-960 Power Cabling
The SPS units in a CX4-960 should only be used to power the SPE and first DAE. Connections A are the input power to the SPS units from the power distribution units (PDUs). Connections B are the input power to the SPE power supplies from the SPS units. Connections C are the input power to the first DAE from the SPS units. Connections D are the input power to the remaining DAEs from the PDUs.

Bus 0 I/O Module 0, Port 0 Bus 1 I/O Module 0, Port 1 Bus 2 I/O Module 1, Port 0 Bus 3 I/O Module 1, Port 1 Bus 4 I/O Module 2, Port 0 With Bus 5 I/O Module 2, Port 1 expansion Bus 6 I/O Module 3, Port 0 option Bus 7 I/O Module 3, Port 1
The CX4-960 arrays configured and mounted at the factory in an EMC rack will have all the Bus 0 enclosures mounted together followed by all the Bus 1 enclosures followed by all the Bus 2 enclosures followed by all the Bus 3 enclosures, etc. The actual physical location of an enclosure within the rack does not determine the enclosure address and you may encounter arrays in the field that do not adhere to the manufacturing standard. The factory standard for connecting backend buses is Bus 0 will be connected to I/O Module 0, Port 0 on each SP Bus 1 will be connected to I/O Module 0, Port 1 on each SP Bus 2 will be connected to I/O Module 1, Port 0 on each SP Bus 3 will be connected to I/O Module 1, Port 1 on each SP Bus 4 will be connected to I/O Module 2, Port 0 on each SP Bus 5 will be connected to I/O Module 2, Port 1 on each SP Bus 6 will be connected to I/O Module 3, Port 0 on each SP Bus 7 will be connected to I/O Module 3, Port 1 on each SP
CX4-960 (w/o Exp) Data Cabling Field Install

Bus 0 I/O Module 0, Port 0 Bus 1 I/O Module 0, Port 1 Bus 2 I/O Module 1, Port 0 Bus 3 I/O Module 1, Port 1 Bus 4 I/O Module 2, Port 0 With Bus 5 I/O Module 2, Port 1 expansion Bus 6 I/O Module 3, Port 0 option Bus 7 I/O Module 3, Port 1
The recommended backend configuration for field installed CX4-960 arrays is to mount all the enclosure 0s for all buses together followed by the remaining enclosures on Loop 0 physically adjacent, followed by the remaining enclosures on Loop 1 physically adjacent, followed by the remaining enclosures on Loop 2 physically adjacent, followed by the remaining enclosures on Loop 3 physically adjacent, etc. The actual physical location of an enclosure within the rack does not determine the enclosure address and you may encounter arrays in the field that do not adhere to the manufacturing standard.
CX4-960 FRUs Power

Front-serviced FRUs Power Supply
Hot-swappable Provides 1200 Watts of 12/24-Volt Main, Auxiliary, and Blower power Load-sharing Highly-Available 1+1 Configuration
Blower
Hot-swappable 3+1 configuration
Standby Power Supply (SPS)

2.4kw back up source Half the width of 2U in standard rack/each weighs 65lbs (30kgs) Two SPSs are utilized for redundant power configuration
The power supplies and blower modules are front-serviced FRUs. The CX4-960 hot-swappable power supplies provide 1200 Watts of 12 volt and 24 volt main, auxiliary, and blower power in a load-sharing highly-available 1+1 configuration. The CX4-960 supports four hot-swappable Blower Modules, in a 3+1 configuration. The CX4-960 utilizes a larger Standby Power Supply (SPS) than the CX4-120, CX4-240 and CX4-480 models to support the increased power requirements of the system. It is a 2.4kw back up source which takes up half the width of a 2U in a standard rack. The weight is 65 lbs (~30kgs) maximum per single SPS unit. For the CX4-960, two SPSs are utilized side by side, each providing a power supply for the CX4-960 SPE and the first DAE for a redundant power configuration.
Power Supply FRU
AC power
Power LED
Fault LED
The CX4-960 Power Supply FRU is shown from a front, angled, and rear view with AC power and Power LED identified.
Blower/fans FRUs
The Blower/fans are shown removed from the chassis. The Blower modules contain a Fault LED, but no Power LED or Resume PROM.
CX4-960 Fans Management

4 Fan packs each pack contains 1 fan
Pulling one pack will not be a multi-fan failure Pulling one pack does not result in write cache dumping
Processor throttling
Double failure
The FLARE Software dumps Write Cache to the Vault [if applicable] The SPs will then shutdown and reboot
After the fan(s) are replaced, the Storage Processor reboots to return the SP to optimal Core Frequency running state
There are four fan packs, each containing one fan. Pulling one pack will not be a multi-fan failure as it was in the CX series 1 and 2 arrays, and pulling one pack does not result in write cache dumping. A single CX4-960 blower can remain faulted (or can be permanently removed) with no change in the performance. A single blower fault is serviced without a reboot. The clock throttling AND ultimate power-down/reset only occur with a multi-blower fault or removal. This latter case can also be encountered if you have a single blower faulted and accidentally remove the adjacent working blower. Check the fault LEDs before removing a fan. Once two fan packs are not working, both SPs will either power-down (if the blower is not reinserted), or reset (if the blower is re-inserted). No data will be lost, but the array will become unavailable during the SP reboot. The CX4-960 use processor throttling, a mechanism that enables dynamic switching of the CPU core voltage and CPU clock frequency. This slows down the Processor/Clock Speed, reducing the heat generation. Clock throttling is only available on the CX4-960 platform.
Dual Standby Power Supplies (SPS) FRUs

Dual CX4-960 SPSs
The CX4-960 system uses two side-by-side SPSs. Each supplies a power supply of the CX4960 SPE, and the first DAE for a redundant power configuration. Note: Only two (2) outlets are used in a CLARiiON.
SPS Details
Input Connector
On-Line Enabled / On-Line Charging
Output Connectors
On-Battery
Battery Failure Internal Check
RJ-12
Circuit Breaker
The new SPS supports the increased power requirements of the system. It is a 2.4kw back up source which takes up half the width of 2U in a standard rack. The weight is 65 lbs maximum per single SPS unit. Batteries are replaced by qualified service personnel only and not in the field. Operator access procedures are specified in manufacturer documentation (also as part of safety agency reports). Four LEDs are located at the rear of the SPS, in order from top to bottom, as viewed from the rear of the unit. Name On-Line, Enabled Color Green Steady Description Location
Illuminated when SPS is operating in On-Line mode and batteries are fully charged and ready. Extinguished if any yellow LED is on. Top
On-Line, Charging On Battery Battery Failure Internal Check
Green Flashing when SPS is operating in On-Line mode Flashing and battery is charging and not ready. Yellow Yellow Yellow Illuminated when SPS is operating in On-Battery mode. Illuminated when battery lifetime is exceeded or self-test failure detected. SPS should be replaced. Illuminated when an SPS internal fault is detected. The SPS should be replaced. 2nd 3rd Bottom
FRUs (continued)
I/O modules
Four port 1/2/4Gb/s FC (front and/or backend) Two port 100/1000 Gb/s iSCSI (front-end only)
Management Module
Hot swappable Used for CMI (CLARiiON Messaging Interface)
DIMMs
Offline replaceable
The CX4-960 support the same I/O modules as the other three CX4 UltraFlex Series models. These I/O Modules MUST be replaced using the Navisphere Service Taskbar. The DIMMs for the FC system are offline replaceable.
Management Module FRU

Fault LED Power LED
USB
Service Port Comm Port Management Port SPS Port
NMI Button
There are two hot-swappable, rear serviced Management slots, each containing a Management Module. Each module contains two (2) Ethernet ports. The top port is the management port used by the customer and its parameters are set at initialization time. The bottom Ethernet port is the service port and its parameters are statically set at the factory. Each module contains two (2) serial ports. The top serial port is the com port, used as a serial service connection to the SP. The bottom serial port is used to monitor the state of the SPS. Each module contains two (2) LEDs. The power LED is green and indicates that power is good when illuminated. The fault LED is amber and illuminates if a fault is detected within the Management Module.
Management Module Use

If a Management Module is present on the SP, then it receives the same power branch as its corresponding SP (A or B) Removal of a Management Module will cause the corresponding SP to reset If the Management Module is not detected at SP powerup/reset, subsequent insertions/removals will have no effect on the SP
If a Management Module is present on the SP, then it receives the same power branch as its corresponding SP (A or B): Its power is based on whether a complete associated SP is inserted The Management Module must support hot-removal and hot-insert Insertion or removal of a Management Module has no impact on the SPs power (however, the SP will reset) If the Management Module corresponding to an SP (A or B) is present when the SP is powered up or reset: It will be enumerated and tested as part of the SP, and its resources will be available to the higher-level software If the Management Module is subsequently removed after this detection, it will cause an SP reset If the Management Module is not detected at SP power-up/reset, subsequent insertions/removals will have no effect on the SP. Only after the SP is power-toggled or reset, with the Management Module inserted, can the Management Module be discovered and interact with the SPs reset.
Lesson 7: Enterprise Flash Drives

Upon completion of this module, you will be able to: Identify Flash Drive supported arrays Identify Flash Drive Capabilities
CX4 Series Enterprise Flash Drives

Enterprise Flash Drives (EFD) CLARiiON model support
CX4 120 and CX4 240 supports up to 30 EFDs CX4 960 and CX4 480 supports up to 60 EFDs
Drives can be configured on different bus

Drives can be used on any 4Gb/s enclosure EFDs can be mixed with FC in the same enclosure EFDs and SATA drives must be in a separate enclosure
The CLARiiON CX4 series has the capability to use Enterprise Flash Drives or EFDs. Some other terms for the EFDs in the industry include Solid State Disk (SSD) and Flash Solid State Disk (FSSD). It is not a requirement to have a dedicated bus or enclosure for EFDs. The EFDs do not need any special enclosure. EFD drives can be used in any existing 4Gb/s enclosure and can be mixed with FC drives in the same enclosure. SATA drives and EFD must be in separate enclosures.
CX4 Series Flash Drive Features

Supports all RAID Types EFDs and FC drives cannot share RAID Groups
Cannot mix drives in a RG or metaLUN
LUN migration Virtual Provisioning is supported Supports all replication technologies

SnapView, MirrorView, SAN Copy, RLPs, and CPLs
Cannot be used as Vault drives
EFDs also support all RAID configurations and a LUN can be migrated to and from an EFD RAID group. Also, Virtual Provisioning is supported. All array based replication technologies are supported. EFDs can also be used in Reserved LUN Pools or Clone Private LUNs. The use of EFDs as vault drives is not supported.
CX4 Series Flash Drive Features (continued)

Same Hot spare guidelines as other drive types
EFDs spared for only other EFDs
Default Read and Write cache behavior

Off for all LUNs bound on EFDs
Suitable Application Profiles

Low response, high throughput such as OLTP apps Multi-threaded, small block I/O Transaction based Primary read workloads
The hot spare guidelines for EFDs are the same as the hot spare guidelines for FC drives, which means there should be 1 hot spare for up to 30 drives. All EFD hot spares configured in the array would count towards the maximum EFD limit for the system. EFDs can only be a spare for other EFDs. CLARiiON cache will be turned OFF by default for LUNs bound on EFDs. You can manually turn the cache ON using Navisphere. This is consistent with the recommended best practices for EFDs. EFDs will show the highest improvements versus FC drives in the following situations: Multi-threaded applications Small block I/Os primarily read workloads applications where the drive performance is the limiting factor This leads to a strategy focusing on hotspots by application need, such as the file system, database, and application metadata and map areas. In addition, applications requiring low response times and high throughput such as OLTP applications are well suited for EFD use.
Course Summary
Key points covered in this course:
CLARiiON CX4 architecture and features CLARiiON CX4 cabling CLARiiON CX4-120, 240, 480, 960 specifications Enterprise Flash Directors
These are the key points covered in this course. Please take a moment to review them. This concludes the training. Please proceed to the Course Completion slide to take the assessment.

Clariion Hardware SRG r29

Uploaded by

Document Information

Original Description:

Original Title

Copyright

Available Formats

Share this document

Share or Embed Document

Sharing Options

Did you find this document useful?

Is this content inappropriate?

Copyright:

Available Formats

Clariion Hardware SRG r29

Uploaded by

Copyright:

Available Formats

Copyright 2009 EMC Corporation. Do not Copy - All Rights Reserved.

2009 EMC Corporation. All rights reserved.

Copyright 2009 EMC Corporation. Do not Copy - All Rights Reserved.

2009 EMC Corporation. All rights reserved.

Copyright 2009 EMC Corporation. Do not Copy - All Rights Reserved.

Lesson 1: CX4 Architecture and Features

2009 EMC Corporation. All rights reserved.

Copyright 2009 EMC Corporation. Do not Copy - All Rights Reserved.

CLARiiON Fibre Channel Timeline

FC5500 FC5700 FC5300 FC4500 FC4700

2009 EMC Corporation. All rights reserved.

Copyright 2009 EMC Corporation. Do not Copy - All Rights Reserved.

External High-Availability Storage Device

Copyright 2009 EMC Corporation. Do not Copy - All Rights Reserved.

Architecture: Multiple Arrays from One Server

Storage Domain Domain Members Domain Master

Copyright 2009 EMC Corporation. Do not Copy - All Rights Reserved.

CX4-120, CX4-240, CX4-480 Series Arrays

2009 EMC Corporation. All rights reserved.

Copyright 2009 EMC Corporation. Do not Copy - All Rights Reserved.

The CLARiiON Storage Processor (SP) Intro

Read Cache System

2009 EMC Corporation. All rights reserved.

Copyright 2009 EMC Corporation. Do not Copy - All Rights Reserved.

CLARiiON Asymmetric Logic Unit Access (ALUA)

Host side ALUA Redirection CMI

Backend path fault redirection CMI

Consult EMC Support Matrix for supported Operating Systems

Copyright 2009 EMC Corporation. Do not Copy - All Rights Reserved.

Fault Masking Examples

2009 EMC Corporation. All rights reserved.

Copyright 2009 EMC Corporation. Do not Copy - All Rights Reserved.

Best Practices for ALUA Failover/Performance

2009 EMC Corporation. All rights reserved.

Copyright 2009 EMC Corporation. Do not Copy - All Rights Reserved.

CX4-120, CX4-240 & CX4-480 Common Features

4 Power Supplies with integrated Blower Modules

2009 EMC Corporation. All rights reserved.

Copyright 2009 EMC Corporation. Do not Copy - All Rights Reserved.

Storage Processor Enclosure Front View

CPU Module A CPU Module Handles

Copyright 2009 EMC Corporation. Do not Copy - All Rights Reserved.

Storage Processor Boot LED Behavior

Copyright 2009 EMC Corporation. Do not Copy - All Rights Reserved.

Always cold-insert an SP, I/O Module, or I/O Filler

2009 EMC Corporation. All rights reserved.

Copyright 2009 EMC Corporation. Do not Copy - All Rights Reserved.

Use Caution when Removing SPs

Copyright 2009 EMC Corporation. Do not Copy - All Rights Reserved.

CX4-120, CX4-240 & CX4-480 CPU Module LEDs

2009 EMC Corporation. All rights reserved.

Copyright 2009 EMC Corporation. Do not Copy - All Rights Reserved.

Power Supply/Blower Modules

Power Supply Handle Release

2009 EMC Corporation. All rights reserved.

Copyright 2009 EMC Corporation. Do not Copy - All Rights Reserved.

CX4-120, CX4-240 and CX4-480 Power Distribution

2009 EMC Corporation. All rights reserved.

Copyright 2009 EMC Corporation. Do not Copy - All Rights Reserved.

CX4-120, CX4-240, CX4-480 Power Cabling

2009 EMC Corporation. All rights reserved.

Copyright 2009 EMC Corporation. Do not Copy - All Rights Reserved.