EASWARI ENGINEERING COLLEGE / DEPARTMENT OF ECE AP 9256: Electroma !et"c I!ter#ere!ce a!$ Com%at"&"l"t' "! S'(tem De(" !)*+e(t"o!

,a!.NIT)I :: EMI/EMC CONCEPTS / PART / A S0No *+e(t"o! 20 What is meant by electromagnetic compatibility? 2. Define ESD. 3. What are the three criteria to be satisfied by any system to become electromagnetically compatible? #. $o% do yo& pre'ent emission? ). ,. 1. ". 4. 1!. 11. 12. 13. 1#. 1). 1,. 11. 1". 14. 2!. 21. 22. Why is E*+ a 'ital problem? Why do %e feel electric shoc- at times. %hen %e to&ch /0 and +omp&ter monitors? 2ist the so&rces of E*3. What is cond&cted co&pling of E*3? A bi-e started or a mi5ie &nder r&nning condition dist&rbs a /0 recei'ers f&nctioning. Why? Dra% an e6&i'alent circ&it model for electrostatic discharge. What are the 'ario&s type of radiation co&pling in E*3? What is cond&cted interference? 3s it possible to de'elop circ&it models of E*3? (ame the t%o factors that tend to affect the amo&nt of interference that %o&ld other%ise be transmitted along a cond&cted path. Define E*3 and E*+. What is transient s&ppression? $o% to classify E*37E*+? What are the different &nits of parameters for the meas&rements of E*3? What are +E and 8E? What is E*9? What do yo& &nderstand abo&t the effect of E*3 on sec&red comm&nications? Determine the ratio of :a; t%o po%ers 91 < 1mW and 92 < 2! W. :b; t%o 'oltages '1 < 1! m0 and '2 < 2! m0. and :c; t%o c&rrents i1 < 2 mA and i2 < !.) A in d=. Ans%ers> #3 d=. 2)# d=. #" d=. Determine the follo%ing 6&antities in the indicated &nits> 2!m0 :d=m0;. )! m0 :d=m0;. 1!!mA :d=mA;. 3! W :d=W;. 3!! mW :d=m;. Ans%ers> ", d=m0. ?2, d=m0. #! d=mA. 1#>11 d=W. ?)>23 d=m. Determine the absol&te 'al&es of the follo%ing 6&antities> ,! d=m07m. 12! d=m07m. 3! d=m0. ,, d=m. Ans%ers> 1 m07m. 1 07m. 31., m0. 34"1 W. Determine the %a'elength at the follo%ing fre6&encies in metric &nits> :a; ,!! *$@ in epo5y glass:Ar < #.1;. :b; 3 B$@ in air. :c; ) *$@ in poly'inyl chloride:Ar < 3.);. E1am JA-11 JA-11 J -1! JA-!" J -1! (-!" JA-1! JA-1! (-!" (-!, (-!" (-!, (-!, (-!, (-!) (-!) (-!)

23.

2#. 2).

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.NIT)I :: EMI/EMC CONCEPTS / PART / ,

S0No

20 20 40 50 50 60 60 70 90 230 220 220

*+e(t"o! Disting&ish bet%een the feat&res of cond&cted E*3 and radiated E*3. What are the so&rces and 'ictims of E*3? E5plain %ith e5amples. :i;What are the so&rces of E*3? Bi'e e5amples. :ii; E5plain in detail the cond&cted E*3 and radiated E*3 %ith e5amples. :i; +ompare time domain E*3 %ith fre6&ency domain E*3. :ii; E5plain ESD in detail. What are all the remedial proced&res? Why is E*3 significant in system design? E5plain %ith ind&stry citations. What are the so&rces and 'ictim of E*3? $o% do electrostatic discharges occ&r? E5plain in detail E*3 radiation $a@ards. $o% are the 'ario&s so&rces of E*3 -ept &nder control and meas&red? What are the 'ario&s parameters of meas&rement? Bi'e their rele'ant &nits. Discriminate time domain and fre6&ency domain emi. %hy does one analy@e in fre6&ency approach analysis.. design and location of high 'oltage e6&ipments. E5plain the different so&rces of E*3 in detail. Disc&ss ho% lightning discharges affect the transmission line comm&nication. E5plain the transient effects and ho% to minimi@e the transient effects? Disc&ss in detail the design practice for minimi@ing cond&cti'e interference. An ESD discharge is modeled as a capacitance of 1)!pf. +harged to 2 F0 and discharged thro&gh a resistance of 1 - ohms. i. Write do%n the e5pression for the c&rrent %a'eform ii. Appro5imating the c&rrent %a'eform as a short dipole. calc&late the interference po%er at a distance of 1!cm and find its 'ariation %ith time. E5plain in detail classification of interference? $o% do yo& minimi@e each? E5plain abo&t transients and its remedies. E5plain in detail classification of E*37E*+. $o% do yo& minimi@e each? Disc&ss ho% lightning discharges affects the transmission lines comm&nication. E5plain the transient effects. $o% to minimi@e them? With s&itable e5amples. e5plain intentional and &nintentional electromagnetic emissions d&ring operation of 'ario&s e6&ipments. $o% to control them?

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240 250 250 260 260 270

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.NIT)II :: EMI COUPLING PRINCIPLES / PART / A Sl0No0 *+e(t"o! 20 2ist o&t the types of co&pling bet%een cables.72ist the E*3 co&pling methods. 2. 3. #. ). Define Bro&nd co&pled 3nterference. Define edge rate. What is transient co&pling? Define /ransient +o&pling. Define cross tal- %ith reference to E*37E*+ design iss&es? E1am JA-11 JA-11 J -1! J -1! J -!" J -1! JA-1! JA-!" J -!" JA-1! JA-!4 JA-!4 JA-!1 JA-!, JA-!,

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Define GBro&ndH %ith respect to %or-ing on electrical gadgets. What is electromagnetic emission? $o% does one a'oid po%er mains interference?

Why is a limit on the lo%er fre6&ency portion of the cond&cted emission and %hich is the standard follo%ed d&ring the testing accordingly? 1!. What are the steps in the proced&re to analy@e E*9 s&sceptibility? 11. What allo%s a cond&cti'e transfer to occ&r? 12. What does co&pling mean? 13. What is mean by gro&nd loop co&pling? 7 What is B2+? 1#. Dra% common mode and differential mode co&pling in circ&its. 1). 2ist the dra%bac-s of 'ario&s co&pling mechanisms. 1,. =rief abo&t po%er s&pply and po%er main co&pling? 11. $o% field co&pling affects the systems? 1". Define 23S(. 14. Dra% +* and D* co&pling in circ&its. 2!. $o% field co&pling affects the system?

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.NIT)II :: EMI COUPLING PRINCIPLES / PART / , Sl0No0 *+e(t"o! 20 Describe the differences bet%een radiated D* and +* co&pling %ith s&itable e5ample. 20 Disc&ss in detail abo&t gro&nd loop co&pling and po%er s&pply co&pling. 40 E5plain in detail the cond&cted. radiated and common impedance gro&nd co&plings %ith e5amples. 50 What is radiated differential mode co&pling? 3n %hat %ay this is different from the radiated common mode co&pling? E5plain this %ith e5ample. 50 E5plain cable co&pling and its electromagnetic impact in system design. 60 What is Differential mode co&pling:D*+;? $o% do radiated co&pling and transient co&pling 'ary from D*+? 60 Disc&ss the impact of radiated common mode and radiated differential mode co&pling? Also e5plain ho% do common mains s&pply is a fre6&ent so&rce of cond&cted interference. $o% do s&rges on main po%er s&pply affect appliances? $o% to a'oid it %ith appropriate design and location? 70 Bi'e s&itable e5amples for intentional and &nintentional electromagnetic emissions d&ring operation of 'ario&s e6&ipments. $o% to control them? Also list o&t electric field intensity le'els of 'ario&s home appliances. Also pro'e +E is more significant than radiated one. 90 $o% do cable co&pling. near and far co&pling of E* fields prod&ced can be red&ced? $o% to enhance imm&nity of circ&its7e6&ipments systems. 230 E5plain 'ario&s remedial acti'ities for co&pling in circ&its. 220 E5plain ho% po%er s&pply main affects the system. 220 With neat diagram e5plain gro&nd loop co&pling and near field co&pling. 240 With neat diagram e5plain near field co&pling. 250 E5plain in detail 'ario&s co&pling methods7mechanisms. E5am JA-11 JA-11 J -1! J -1! JA-1! JA-1! JA-!1 *ar-s 1, "E" 1, 1, 1, 1, 1,

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.NIT)III :: EMI CONTROL TECHNIQUES / PART / A Sl0No0 20 What is E*3 shielding? 2. 3. +lassify E*3 filters. What are the ad'antages of m&ltipoint gro&nding? *+e(t"o! E5am JA-11 JA-11 J -1!
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Sl0No0 *+e(t"o! #. What is the f&nctionality of transient s&ppressors? ). ,. 1. ". 4. What is meant by Gb&lgingH capacitor? What is the need for shielding? What does transient s&ppressor mean? (ame fo&r techni6&es7approaches to combat E*3. What does G+hemical SaltingH mean?

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1!. What is an electrical filter? 11. Write the definitions of gro&nding and bonding. 12. Dra% the diagram of isolation transformer? 13. What are all the proced&res considered for cable ro&ting? 1#. What is meant by signal control? 1). Bi'e at least 2 proced&res for component selection and mo&nting. 1,. Differentiate 'ario&s shielding methods. 11. What is the need for E*3 Bas-et? 1". What is an opto-isolator? 14. Define SE*+A9. 2!. What are all the tests that can be carried o'er in a shielding room? 21. Define shielding effecti'eness. 22. 2ist any fo&r shielding materials.

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.NIT)III :: EMI CONTROL TECHNIQUES / PART / , Sl0No0 *+e(t"o! 20 E5plain abo&t the 'ario&s types of non-solid shielding techni6&es. 20 What ate the factors infl&encing the E*3 performances of the bonding? $o% can bonding be made? *ention some g&idelines for good bonds. 40 :i; What are 3solation /ransformers? E5plain in detail. :ii; E5plain 'ario&s method of gro&nding %ith e5amples. 50 :i;What are transient s&ppressors? E5plain them. :ii; E5plain briefly the cable ro&ting and signal control techni6&es. 50 $o% does an isolation transformer control E*3? E5plain shielding and filtering methods of controlling E*3. 60 $o% does cable ro&ting control E*3? $o% is signal control achie'ed? 60 E5plain 'ario&s gro&nding techni6&es &sed in electronic circ&its. 70 a. sing spherical gro&nd electrodes define gro&nd resistance. $o% does the gro&nd resistance 'ary %ith different soils? b. What are the 'ario&s preca&tions ta-en to red&ce gro&nd resistance? 90 3ll&strate ho% the effecti'eness of shielding obtained in S*9S and ind&strial comp&ters. 230 Disc&ss in detail gro&nding design g&idelines. 220 Describe the shielding effecti'eness of both solid and non-solid materials incl&ding m&ltiple soil shields and thin film shielding. 220 Iilters may be designed %ith t%o different types of components. What are they? Disc&ss all the techni6&es for designing filter. 240 E5plain +hemical salting techni6&e. 250 E5plain 'ario&s proced&res for cable ro&ting. 250 With neat diagram. e5plain bonding. 260 E5plain the basics of shielding. E5plain different shielding techni6&es. E5plain the concepts of shielding? 260 Differentiate bet%een single and do&ble shields. =riefly e5plain abo&t shielding discontin&ities. 270 What are E*3 Bas-ets? E5plain. 2ist the applications of Bas-ets. E5am JA-11 JA-11 J -1! J -1! JA-1! JA-1! J -!" JA-!1 JA-!1 JA-!, JA-!, JA-!, *ar-s 1, 1, "E" "E" 1, 1, 1, "E" 1, 1, 1, 1,

.NIT)I8 :: EMC DESIGN OF PCBS / PART / A Sl.(o. J&estion 1. 2ist o&t the co&pling sit&ations to be addressed d&ring the physical layo&t process. 2. 3. #. Define > 9+= trace impedance %ith respect to E*3. What is Koning? Define @oning. What is meant by /ermination in 9+= fabrication? E5am JA-11 JA-11 J -1! JA-!4 JA-1!
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Sl.(o. ). ,. 1. ". 4.

J&estion What do yo& &nderstand by Gro&tingH %ith reference to 9+= design and fabrication? $o% does cable ro&ting a'oid E*3? 2ist some proced&res for red&cing cross tal-. 7 $o% to a'oid cross tal- in 9+= design. Define the term trace in 9+=. What is the &se of deco&pling capacitors?

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1!. Why gro&nding is s&ch an important iss&e in 9+= design? 11. 2ist some proced&res for effecti'e gro&nding in 9+= design. 12. What is impedance control in 9+=s? 13. $o% effecti'ely 9+=s are designed? 1#. 2ist the important consideration of the 9+= si@ing. 1). Bi'e at least t%o proced&res for component mo&nting. 1,. What is the relation bet%een 8adiation and loop area in 9+= design? 11. Dra% the circ&it e6&i'alent of 2 and + &sed in 9+= design. .NIT)I8 :: EMC DESIGN OF PCBS / PART / , Sl0No0 *+e(t"o! 20 :i; Disc&ss abo&t the 'ario&s factors to be considered for E*+ design of 9+=. :ii; E5plain in detail abo&t 03As connection and termination. 20 :i; What is meant by s&sceptibility le'el? E5plain the relationship bet%een 9+= traces and s&sceptibility le'el. :ii; Disc&ss briefly on control de'ices for cross tal-. 40 :i; $o% do yo& control the impedance 'al&e %hile designing the 9+=? E5plain. :ii; E5plain the po%er distrib&tion deco&pling concept. 50 Write short notes on the follo%ing > :i; 9+= *otherboard design :ii; 9ropagation delay. 50 Disc&ss ho% electromagnetic compatibility is achie'ed %hile 9+= is prepared for ind&stry applications. 60 Write short notes on the follo%ing > :i; Koning :ii; 9o%er distrib&tion deco&pling :iii; /ermination 60 What is cross tal- %ith reference to the design of 9+=s and ho% to
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Sl0No0 70 90 230 220 220

240 250 250 260 260

*+e(t"o! minimi@e it %hen miniat&ri@ation is the concern of todayHs technology? Disc&ss ho% component selection and mo&nting control E*3? What are all the proced&res &sed for effecti'e gro&nding in 9+= design? $o% do motherboard designs and performance models help for better performance? E5plain in detail the steps in'ol'ed in motherboard design. Select and recommend a s&itable capacitor of a standard 'al&e to offer ma5im&m filtering and also meet the safety re6&irement of less than )mA lea-age c&rrent %hen connected bet%een the line and gro&nd of a 23!0)!$@ po%er s&pply. E5plain @oning in 9+= design. E5plain 'ario&s proced&res for red&cing cross tal-. Why digital circ&its are so sensiti'e in 9+=s. E5plain. E5plain 'ario&s s&ppression techni6&es in 9+= design. E5plain the importance of 9+= design.

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.NIT)8 :: EMI MEASUREMENTS AND STANDARDS / PART / A Sl0No0 *+e(t"o! 20 What is the main difference bet%een radiated meas&rements for class A de'ices and others? 2. What is the significance of narro% band test? 3. #. ). ,. 1. 1. ". 4. What for *32 S/D #,1. #,2 and #,3 are &sed? What are class A de'ices %ith reference to I++? *ention the t%o 'ery important needs for /E* cell. Why do +3S98 standards e'ol'e? +an $igh 0oltage lines be allo%ed to cross residential sites? J&stify. $o% test bed is selected for ESD testing? What are +3S98 standards for E*3+? What are +lass A de'ices %ith reference to I++? E1am JA-11 JA-11 J -1! J -1! J -1! JA-1! JA-1! JA-!4 JA-!4 J -!" J -!" JA-!1

1!. What are *32 S/D #,1.#,2 and #,3? 11. (ame at least t%o standards for design g&idelines and /est and *eas&rement proced&res p&blished by 3EEE7A(S3. 2. What is the obLecti'e of re6&irements +S 1!371!#71!)? 3. E5pand the terms +3S98.I++?

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Sl0No0 *+e(t"o! #. Differentiate *ilitary standard and +i'ilian standards in meas&rements? ). ,. 1. ". 4. What are the ad'antages of loop antenna? Specify the antenna &sed for micro%a'e fre6&encies. Define the term 23S(? With 23S( dra% the basic circ&it &sed for 83 meas&rements? What is a c&rrent probe?

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1!. What are the ad'antages of MA/S? 11. What are all the dra%bac-s of MA/S? 12. What are all the factors to be considered for MA/S? 13. What are all the types of MA/S? 1#. With neat diagrams e5plain /E* +E22 1). Bi'e some g&idelines to carry MA/S. 1,. Dra% t%o arrangements of MA/S.

.NIT)8 :: EMI MEASUREMENTS AND STANDARDS / PART / , Sl0No0 *+e(t"o! 20 :i; What is the need for E*3 standards? E5plain. :ii;Disc&ss briefly on I++ reg&lations. 20 E5plain briefly abo&t the meas&rements &sing an anechoic chamber. 40 50 50 60 60 :i; E5plain the ci'ilian standards I++. +3S98 and 3E+ in detail. :ii; *ention the re6&irements for the E*3 shielded chamber. :i; E5plain the *32 S/D #,1E. :ii; =riefly e5plain the 'ario&s E*3 /est instr&ments. :iii; What is EI/ test bed? $o% are meas&rements made in the follo%ing > :i; /5 785 Antennas :ii; E*3 85 and spectr&m analyser What are the needs for ci'ilian and military standards? +ompare and contrast these standards %ith reference to 3E+ and *32#,1E#,2. Why do the standards 'ary %ith reference to ci'ilian and military applications? What are the 'ario&s standards for ci'ilian applications? $o% do they e'ol'e? Disc&ss them in detail. E5am JA-11 JA-11 J -1! J -1! JA-1! JA-1! JA-!4 *ar-s "E" 1, 11E) )E,E) "E" 1, 1,

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Sl0No0 *+e(t"o! 70 Disc&ss open area test site proced&re to carry o&t tests. What are its limitations? $o% does one address them in testing? 90 E5plain the proced&re for selection of MA/S. 230 E5plain 'ario&s testing antenna and their fre6&encies as specified in +3S98 standard. 220 What is the need for standards? Why to e'ol'e military and ci'ilian standards? Disc&ss a test bed for ESD and EI/ based on s&itable standard. 220 What does the standard *32 #,1D7#,2 emphasi@e? What are the problems one may face by 'iolating the reg&lations in it? 3f possible. a case st&dy be referred to s&pport yo&r L&stification. 240 E5plain MA/S %ith s&itable diagrams. E5plain abo&t anechoic chamber. 250 $o% does /ime domain method impro'e the effecti'eness of shielding? 250 E5plain I++7+3S98 +E and 8E standards. 260 E5plain and test proced&re for *32S/D. 260 Write short notes on sensors73nLectors. 270 Write short notes on co&plers? 290 E5plain the t%o types of MA/S meas&rements. 7 E5plain the meas&rement of 8E and 8S &sing MA/S. 230 What is /E* cell? E5plain in detail %ith neat diagram. 220 +ompare shielding %ith MA/S.

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