FDS4435

June 1999

FDS4435
P-Channel Logic Level PowerTrenchTM MOSFET
General Description
This P-Channel Logic Level MOSFET is produced using Fairchild Semiconductor's advanced PowerTrench process that has been especially tailored to minimize on-state resistance and yet maintain superior switching performance. This device is well suited for low voltage and battery powered applications where low in-line power loss and fast switching are required.

Features
-8.8 A, -30 V. RDS(ON) = 0.020 @ VGS = -10 V RDS(ON) = 0.035 @ VGS = -4.5 V Low gate charge (17nC typical). Fast switching speed. High performance trench technology for extremely low RDS(ON). High power and current handling capability.

Applications
DC/DC converter Load switch Motor drives

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1999 Fairchild Semiconductor Corporation

FDS4435 Rev. D

FDS4435

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Notes: 1: RJA is the sum of the junction-to-case and case-to-ambient resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. RJC is guaranteed by design while RCA is determined by the user's board design.

a) 50 C/W when mounted on a 1 in2 pad of 2 oz. copper.

b) 105 C/W when mounted on a 0.04 in2 pad of 2 oz. copper.

c) 125 C/W on a minimum mounting pad.

Scale 1 : 1 on letter size paper 2: Pulse Test: Pulse Width 300 s, Duty Cycle 2.0%

FDS4435 Rev. D

FDS4435

Typical Characteristics



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Figure 1. On-Region Characteristics.

Figure 2. On-Resistance Variation with Drain Current and Gate Voltage.



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Figure 4. On-Resistance Variation with Gate-to-Source Voltage



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Figure 5. Transfer Characteristics.

Figure 6. Body Diode Forward Voltage Variationwith Source Current and Temperature.

FDS4435 Rev. D

FDS4435

Typical Characteristics

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Figure 7. Gate-Charge Characteristics.

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Figure 8. Capacitance Characteristics.



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Figure 9. Maximum Safe Operating Area.

Figure 10. Single Pulse Maximum Power Dissipation.

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Figure 11. Transient Thermal Response Curve.

Thermal characterization performed using the conditions described in Note 1c. Transient themal response will change depending on the circuit board design.

FDS4435 Rev. D

SO-8 Tape and Reel Data and Package Dimensions

SOIC(8lds) Packaging Configuration: Figure 1.0
Packaging Description:
EL ECT ROST AT IC SEN SIT IVE DEVICES
DO NO T SHI P OR STO RE N EAR ST RO NG EL ECT ROST AT IC EL ECT RO M AGN ETI C, M AG NET IC O R R ADIO ACT IVE FI ELD S

TNR D ATE PT NUMB ER PEEL STREN GTH MIN ___ __ ____ __ ___gms MAX ___ ___ ___ ___ _ gms

Antistatic Cover Tape

ESD Label

SOIC-8 parts are shipped in tape. The carrier tape is made from a dissipative (carbon filled) polycarbonate resin. The cover tape is a multilayer film (Heat Activated Adhesive in nature) primarily composed of polyester film, adhesive layer, sealant, and anti-static sprayed agent. These reeled parts in standard option are shipped with 2,500 units per 13" or 330cm diameter reel. The reels are dark blue in color and is made of polystyrene plastic (antistatic coated). Other option comes in 500 units per 7" or 177cm diameter reel. This and some other options are further described in the Packaging Information table. These full reels are individually barcode labeled and placed inside a standard intermediate box (illustrated in figure 1.0) made of recyclable corrugated brown paper. One box contains two reels maximum. And these boxes are placed inside a barcode labeled shipping box which comes in different sizes depending on the number of parts shipped.

Static Dissipative Embossed Carrier Tape

F63TNR Label Customized Label

F852 NDS 9959 F852 NDS 9959 F852 NDS 9959 F852 NDS 9959
SOIC (8lds) Packaging Information Packaging Option Packaging type Qty per Reel/Tube/Bag Reel Size Box Dimension (mm) Max qty per Box Weight per unit (gm) Weight per Reel (kg) Note/Comments Standard (no flow code) TNR 2,500 13" Dia 343x64x343 5,000 0.0774 0.6060 L86Z Rail/Tube 95 530x130x83 30,000 0.0774 F011 TNR 4,000 13" Dia 343x64x343 8,000 0.0774 0.9696 D84Z TNR 500 7" Dia 184x187x47 1,000 0.0774 0.1182

F852 NDS 9959

Pin 1

SOIC-8 Unit Orientation

343mm x 342mm x 64mm Standard Intermediate box ESD Label F63TNR Label sample
LOT: CBVK741B019 FSID: FDS9953A QTY: 2500 SPEC:

F63TNLabel F63TN Label ESD Label

(F63TNR)3

D/C1: D9842 D/C2:

QTY1: QTY2:

SPEC REV: CPN: N/F: F

SOIC(8lds) Tape Leader and Trailer Configuration: Figure 2.0

Carrier Tape Cover Tape

Components Trailer Tape 640mm minimum or 80 empty pockets Leader Tape 1680mm minimum or 210 empty pockets

July 1999, Rev. B

SO-8 Tape and Reel Data and Package Dimensions, continued

SOIC(8lds) Embossed Carrier Tape Configuration: Figure 3.0
T E1

P0

D0

F K0 Wc B0 E2 W

Tc A0 P1 D1

User Direction of Feed

Dimensions are in millimeter Pkg type SOIC(8lds) (12mm)

A0
6.50 +/-0.10

B0
5.30 +/-0.10

W
12.0 +/-0.3

D0
1.55 +/-0.05

D1
1.60 +/-0.10

E1
1.75 +/-0.10

E2
10.25 min

F
5.50 +/-0.05

P1
8.0 +/-0.1

P0
4.0 +/-0.1

K0
2.1 +/-0.10

T
0.450 +/0.150

Wc
9.2 +/-0.3

Tc
0.06 +/-0.02

Notes: A0, B0, and K0 dimensions are determined with respect to the EIA/Jedec RS-481 rotational and lateral movement requirements (see sketches A, B, and C).
20 deg maximum Typical component cavity center line

0.5mm maximum

B0 20 deg maximum component rotation

0.5mm maximum

Sketch A (Side or Front Sectional View)

Component Rotation

A0 Sketch B (Top View)

Typical component center line

Sketch C (Top View)

Component lateral movement

SOIC(8lds) Reel Configuration: Figure 4.0

Component Rotation

W1 Measured at Hub

Dim A Max

Dim A max

Dim N

See detail AA

7" Diameter Option

B Min Dim C See detail AA W3

Dim D min

13" Diameter Option

W2 max Measured at Hub DETAIL AA

Dimensions are in inches and millimeters

Tape Size
12mm

Reel Option
7" Dia

Dim A
7.00 177.8 13.00 330

Dim B
0.059 1.5 0.059 1.5

Dim C
512 +0.020/-0.008 13 +0.5/-0.2 512 +0.020/-0.008 13 +0.5/-0.2

Dim D
0.795 20.2 0.795 20.2

Dim N
2.165 55 7.00 178

Dim W1
0.488 +0.078/-0.000 12.4 +2/0 0.488 +0.078/-0.000 12.4 +2/0

Dim W2
0.724 18.4 0.724 18.4

Dim W3 (LSL-USL)
0.469 0.606 11.9 15.4 0.469 0.606 11.9 15.4

12mm

13" Dia

1998 Fairchild Semiconductor Corporation

July 1999, Rev. B

SO-8 Tape and Reel Data and Package Dimensions, continued

SOIC-8 (FS PKG Code S1)

1:1
Scale 1:1 on letter size paper
Dimensions shown below are in: inches [millimeters]

Part Weight per unit (gram): 0.0774

September 1998, Rev. A

TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks.

ACEx CoolFET CROSSVOLT E2CMOSTM FACT FACT Quiet Series FAST FASTr GTO HiSeC
DISCLAIMER

ISOPLANAR MICROWIRE POP PowerTrench QFET QS Quiet Series SuperSOT-3 SuperSOT-6 SuperSOT-8

SyncFET TinyLogic UHC VCX

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LIFE SUPPORT POLICY FAIRCHILDS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or 2. A critical component is any component of a life support device or system whose failure to perform can systems which, (a) are intended for surgical implant into be reasonably expected to cause the failure of the life the body, or (b) support or sustain life, or (c) whose support device or system, or to affect its safety or failure to perform when properly used in accordance with instructions for use provided in the labeling, can be effectiveness. reasonably expected to result in significant injury to the user. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Product Status Formative or In Design Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design.

Preliminary

First Production

No Identification Needed

Full Production

Obsolete

Not In Production

This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only.

Rev. D