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Advances in Europe - China Green Electronics Collaboration

Otto Andersen1, Idun Husabø Anderssen1, Johan Liu2,6, David Whalley3, Helge Kristiansen4, Tom Ove Grønlund4, Krystyna
Bukat5, Xiuzhen Lu6
1
Western Norway Research Institute1, 2Chalmers University of Technology, Sweden, 3Loughborough University, UK, 4Conpart
AS, Norway, 5ITR - Tele and Radio Research Institute, Warsaw, Poland, 6Sino-Swedish Microsystem integration (SMIT)
Centre, Shanghai University

will prevail for years to come. The urgency and extent of the
Abstract
e-waste problem calls for efforts to promote new product
A newly initiated effort in research on Green Electronics
designs and production processes of a greener nature. As
has resulted in recent advances in the collaboration between
such, technology transfers in the name of green electronics, as
China and Europe. The effort was initiated with the research
intended in the Technology Agreement between China and
project EC-GEPRO (Europe-China Cooperation in Green
Europe, remain extremely important.
Electronics Production Research). This is funded by the
European Commission and engages actors and stimulates
high-level debates and cooperation on the development of In this respect, the unique characteristic of EC-GEPRO is
Green Electronics. This is done through co-organising as well that it involves Chinese as well as European partners with
as evaluating the 2nd International Eco-electronics world class leading competence within the field of green
conferences December 7-8, 2006 in Beijing. An evaluation of electronics. The project is coordinated by Western Norway
this conference was carried out by the project, and important Research Institute (WNRI), a private Norwegian research
issues for improving future collaborative efforts of similar institute with a long standing history of EU funded projects.
type were identified. In addition to expressing concerns about The institute, which has participated in European Union
language and culture gaps, survey respondents placed Framework Programmes 4, 5 & 6, has previously coordinated
particular emphasis on the lack of international networks and and is currently coordinating large EU funded projects. The
contacts as a barrier to further international collaboration, Sino-Swedish Microsystem Integration Technology (SMIT)
whilst suggesting possible ways of overcoming the various Center at Shanghai University (SU) are experts in providing
obstacles. In addition, the project has co-organised the IEEE assistance to industrial companies in handling the scientific
CPMT symposium on Green Electronics in Gothenburg on problems and challenges connected with electronics
May 23-24 2007. production.
Loughborough University (LU) has extensive
knowledge and experience in relation to electronics packaging
Background and manufacturing, including simulation and control of
International efforts to phase out the use of hazardous electronics manufacturing processes, soldering and
materials such as lead and bromine in the electronics conductive adhesive bonding, and novel packaging
production sector have come a long way with the technologies utilising soluble and biodegradable polymers.
implementation of the WEEE (Directive 2002/96/EC on This is being utilised in EC-GEPRO’s contributions towards
Waste Electrical and Electronic Equipment) and RoHS advancing the state of the art in Green Electronics.
directives (Directive 2002/95/EC on the Restriction of certain Loughborough’s Centre for Sustainable MAnufacturing and
Hazardous Substances Directive) in the legislation of most Reuse/Recycling Technologies (SMART) will also contribute
European Union (EU) member states. Still, however, non- to EC-GEPRO in the areas of sustainable design and end of
biodegradable ‘e-waste’ continues to constitute a large and life management.
global environmental hazard (according to some estimates, as The Tele and Radio Institute of Warsaw (ITR) is the
much as 4000 tonnes of toxic e-waste is discarded worldwide leading institute within Green Electronics research in Poland
every hour, constituting a global environmental problem [1]. and particularly supports small and medium sized enterprises
As an example, disposal of e-waste in landfills accounts for as (SMEs) in application of selected electronic technologies.
much as 40% of the total lead found in landfills [2]. Western Moreover, ITR has unique experience with managing a large
countries still export their hazardous e-waste to China European and Chinese network of SMEs in the area of
through, for instance Guiyu (Guangdong province), where the electronic packaging and adhesives.
e-waste is processed in ways extremely harmful to local Chalmers Technological University (CTU) has a
ecology and human beings [3]. longstanding record of participation in EU projects. Over time
Although Chinese legislation in this realm is moving in the participating IVF - The Swedish Institute of Production
the direction of the EU countries, the problem of e-dumping Engineering Research, Division of Electronics Packaging -
has specialised in researching, organising and administering

1
Who will present the paper and to whom correspondence should be made:
Otto Andersen, PO.Box 163, N-6851 Sogndal, Norway, Office phone: +47 57 67 61 71, Mobile phone: +47 977 10 928,
Fax: +47 57 67 61 90, www.vestforsk.no, oan@vestforsk.no

1-4244-1253-6/07/$25.00 ©2007 IEEE Proceedings of HDP’07


dissemination, exploitation and training programmes, as well
as managing large projects in electronics assembly and life With Green electronics materials the focus is on the
cycle assessment of electronic products. specific type of lead (Pb) -free solder pastes, conductive
Conpart is a Norwegian producer of high-value added adhesives, halogen-free substrates and components. These
polymer particles for use in the electronics industry. The materials give the possibility to eliminate the use of the
particles are used either in anisotropic conductive adhesives environmentally harmful Pb and bromine (Br) compounds
(ACA) or in ball grid arrays (BGA). that are traditionally used in materials for interconnecting
electronic components on printed circuit board substrates.

Objectives In this project’s research on environmentally friendly


The overall objective of EC-GEPRO is to support the electronics, a significant focus is on lead-free joining
transition towards sustainable production and consumption in processes, particularly on the use of lead free solders and
the electronics sector, through increasing knowledge and metal plated monospheres provided by Conpart, a Norwegian
awareness. This is being facilitated through increased firm. These are investigated in green electronics primarily in
international collaboration in the development of eco-efficient anisotropic conductive adhesives (Figure 1).
and sustainable products within the electronics sector, under
the heading Green electronics. Increasing the links between
European researchers and Chinese scientists will contribute
specifically to increased transition in this direction.

Research Areas
Figure 1 Anisotropic conductive adhesives (ACA).
The EC-GEPRO project is targeted at large industrial
(Figure provided by Helge Kristiansen, Conpart)
actors, politicians, at both regional and national level; and
other key decision makers, who use, develop and promote
Green electronics in their countries. The research areas which The Conpart monospheres will also be applied as a
are be covered, in cooperation between Europe and China are: compliant core for the conductive balls used in ball grid
• Advance Green electronics design, production and arrays (Figure 2).
products
• Optimizing the life-cycle properties of electronics
products
• Novel materials and technologies for microelectronics
integration

The European-Chinese Research Teams


An important task of EC-GEPRO is the he formation of
research teams. Through the creating of European-Chinese
teams in topics connected to Green electronics cooperation
are being established. The teams focus on three aspects of
Green electronics:
• Green electronics design
• Green electronics assembly
• Green electronics materials Figure 2 Memory module showing components mounted
as Ball Grid Arrays (BGAs). (Photo provided by Helge
On the level of Green electronics design the focus is to Kristiansen, Conpart)
incorporate life-cycle environmental aspects into the design of
electronic products and production processes, with the aim of
reducing their life-cycle environmental impacts (incl. material Figure 3 shows a novel approach to green electronic
and energy resource reduction). manufacture using thermoplastics not only to replace non-
recyclable thermosetting polymers, but which through over-
moulding of the components and subsequent sequential build
Green electronics assembly concerns the processes
up of the interconnection also removes the need for soldering
connected to assembling electronics components and also the
or other joining processes altogether.
life-cycle environmental impacts of the materials being used
in the processes. These include substrate interconnects as well
as components and process equipments used in the
assembling of electronics.

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environmental research (e.g. in Norway or Sweden). One
additional student may spend time in the UK working with
eco-friendly processes for one month. Furthermore, one
researcher from Europe is being spending 6-12 months in
China, connected to the Green electronics Centre of
Excellence in Shanghai. For the purpose of these exchanges,
Electronics integrated into soluble therm oplastic the necessary funding schemes are being developed during
the 2-year project period.
Solvent spray

International Conferences
Organising two international conferences on green
electronics, with participants from Europe and China, are also
included in the work packages of this project.
The operational objective of the conference is to identify
research needs and develop concrete research initiatives in the
area of Green electronics.
The participants will cover all life cycle stages of
electronics from design and manufacture, to use and final
Solvent / polymer solution disposal, and come from a variety of sectors including
a) Polymer dissolved in solvent government, industry, and research institutes/universities.
The conference is being supported from all EC-PEPRO
partners. It will include invited speakers from Europe and
China, and be open to the general public. Dedicated
workshops and an exhibition of advances in green electronics
is being organised in connection with the conference.

Other developments
b) Electronics and polymer separated As part of the collaboration, the SMIT Center, Shanghai
Figure 3 Proposed highly recyclable electronics packaging University and Chalmers University of Technology a web
technology course has been developed on lead free solders for
semiconductor packaging applications in collaboration with
EU and other international partners.
Centre of Excellence Tin-lead solders have been used for a long time in the
An important task has been the establishing of a Centre of electrical industry due to its many advantages compared to
Excellence dedicated to Green Electronics located in other materials. The problem with the alloy is that lead is
Shanghai. The initial tasks of the Centre of Excellence has toxic even in small amounts. Lead binds to proteins in the
been to facilitate project events organisation, while later body and inhibits normal processing and functions. Therefore
activities include promoting continued Europe and China there is a political ambition to replace use of lead in products
cooperation and research on Green electronics. The plan is wherever possible. Lead in gasoline and paint has been
that this is being continues beyond the 2 year project period, forbidden in many countries for years and now the time has
on a self-sustainable basis. come to replace lead in electronics. In Europe, through the
ROHS directive, and in China for example lead in the
manufacture of most products must be replaced before the end
Sino-European Exchange Programme of 2006.
As part of the project, an exchange programme for The ambition with this web based information is to
students and researchers within the area of Green electronics provide knowledge of lead-free soldering for semiconductor
is being established, allowing students and researchers to packaging applications through open access modules that
spend time at host universities in Europe and China. The allow self training. The content of the web course is being
programme is being coordinated by the Green electronics divided into the following parts:
Centre of Excellence in Shanghai. In collaboration with • Introduction to Lead Free Solders
European partners, universities and research institutes the • Basic Process Technology for Lead Free Soldering
programme will facilitate increased mobility for both students • Semiconductor Lead Free Flip-Chip Packaging
and researchers dedicated to improving their knowledge Technology
connected to Green electronics. • Semiconductor Lead Free BGA, CSP and Wafer Level
The program will allow the exchange of three students Packaging Technology
from Shanghai University to European universities or • Mechanical Properties of Lead Free Solders –Tensile,
Aging and Creep properties
institutes for a period of 1-4 months a year to focus on
• Mechanical Properties of Lead Free Solders – Fatigue

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Properties
• Failure mechanisms and reliability issues
• Life Cycle Analysis (LCA) and Future Challenges for
Lead Free Technology

The course includes a large number of exercises,


examination questions and video demonstrations of the
experimental work for self study. For the exercises and
examinations, answers are being provided. The course will
provide an off-line possibility to contact the instructor, who
will answer student questions through email. It is believed
that such internet training courses can be an efficient way to
transfer and exchange knowledge between the EU and China.

Yet another advance is the fact that as part of a


programme to promote bilateral research collaboration,
entitled BILAT, The Research Council of Norway has
provided Western Norway Research Institute with a grant of
NOK 150,000 (€ 19,000) to support additional Sino-
Norwegian collaborative endeavours within Green Electronics
research. Some of this funding has already provided financial
support for the inclusion of EU-China Green Electronics
collaboration in the submitted proposal Nano Lead-free
Solder Paste for Interconnects (NALSPI) in the EU’s Seventh
Framework Programme, theme ICT.

Acknowledgments
EC-GEPRO is funded by a grant from the European
Commission 6th Framework Programme, the NMP priority 3
(Nanotechnologies and nano-sciences, knowledge-based
multifunctional materials and new production processes and
devices).

References
1. Murphy, D., “Dumping Ground,” Scanorama, Nov. 2005,
p.82
2. Griffith University, “E-Waste research group at Griffith
University - Facts and figures”, http://www.griffith.edu.au
/school/eng/ewaste/content_facts.html, last accessed 22
Nov. 2006.
3. Wingfield-Hayes, R. and Shukman, D., 31 May 2006, BBC
News) http://search.bbc.co.uk/cgibin/search/results.pl?q=
china&edition=I, last accessed 22 Nov. 2006.

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