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Description
10-bit resolution
1 LSB max DNL
1 LSB max INL
4 (MCP3004) or 8 (MCP3008) input channels
Analog inputs programmable as single-ended or
pseudo-differential pairs
On-chip sample and hold
SPI serial interface (modes 0,0 and 1,1)
Single supply operation: 2.7V - 5.5V
200 ksps max. sampling rate at VDD = 5V
75 ksps max. sampling rate at VDD = 2.7V
Low power CMOS technology
5 nA typical standby current, 2 A max.
500 A max. active current at 5V
Industrial temp range: -40C to +85C
Available in PDIP, SOIC and TSSOP packages
Applications
Package Types
Sensor Interface
Process Control
Data Acquisition
Battery Operated Systems
VREF
CH0
CH1
CH0
CH1
CH2
CH3
NC
NC
DGND
1
2
3
4
5
6
7
MCP3004
14
13
12
11
10
9
8
VDD
VREF
AGND
CLK
DOUT
DIN
CS/SHDN
PDIP, SOIC
Input
Channel
Max
DAC
Comparator
10-Bit SAR
Sample
and
Hold
Control Logic
Shift
Register
1
2
3
4
5
6
7
8
MCP3008
CH7*
CH0
CH1
CH2
CH3
CH4
CH5
CH6
CH7
16
15
14
13
12
11
10
9
VDD
VREF
AGND
CLK
DOUT
DIN
CS/SHDN
DGND
DOUT
DS21295D-page 1
MCP3004/3008
NOTES:
DS21295D-page 2
MCP3004/3008
1.0
ELECTRICAL
CHARACTERISTICS
ELECTRICAL SPECIFICATIONS
Electrical Characteristics: Unless otherwise noted, all parameters apply at VDD = 5V, VREF = 5V,
TA = -40C to +85C, fSAMPLE = 200 ksps and fCLK = 18*fSAMPLE. Unless otherwise noted, typical values apply for
VDD = 5V, TA = +25C.
Parameter
Sym
Min
Typ
Max
Units
tCONV
10
clock
cycles
Conditions
Conversion Rate
Conversion Time
Analog Input Sample Time
tSAMPLE
Throughput Rate
fSAMPLE
1.5
clock
cycles
200
75
ksps
ksps
VDD = VREF = 5V
VDD = VREF = 2.7V
DC Accuracy
Resolution
10
bits
Integral Nonlinearity
INL
0.5
LSB
Differential Nonlinearity
DNL
0.25
LSB
Offset Error
1.5
LSB
Gain Error
1.0
LSB
-76
dB
61
dB
78
dB
Dynamic Performance
Reference Input
Voltage Range
0.25
VDD
Note 2
Current Drain
100
0.001
150
3
A
A
CS = VDD = 5V
Analog Inputs
Input Voltage Range for CH0 or
CH1 in Single-Ended Mode
VSS
VREF
IN-
VREF+IN-
VSS-100
VSS+100
mV
DS21295D-page 3
MCP3004/3008
ELECTRICAL SPECIFICATIONS (CONTINUED)
Electrical Characteristics: Unless otherwise noted, all parameters apply at VDD = 5V, VREF = 5V,
TA = -40C to +85C, fSAMPLE = 200 ksps and fCLK = 18*fSAMPLE. Unless otherwise noted, typical values apply for
VDD = 5V, TA = +25C.
Parameter
Sym
Min
Typ
Max
Units
0.001
Switch Resistance
1000
Sample Capacitor
20
pF
0.3 VDD
V
V
Leakage Current
Conditions
Digital Input/Output
Data Coding Format
Straight Binary
VIH
VIL
VOH
4.1
VOL
0.4
ILI
-10
10
0.7 VDD
ILO
-10
10
CIN,
COUT
10
pF
fCLK
3.6
1.35
MHz
MHz
VDD = 5V (Note 3)
VDD = 2.7V (Note 3)
tHI
125
ns
tLO
125
ns
tSUCS
100
ns
tCSD
ns
tSU
50
ns
tHD
50
ns
tDO
125
200
ns
ns
tEN
125
200
ns
ns
tDIS
100
ns
CS Disable Time
tCSH
270
ns
tR
100
ns
tF
100
ns
Pin Capacitance
(All Inputs/Outputs)
Timing Parameters
Clock Frequency
DS21295D-page 4
MCP3004/3008
ELECTRICAL SPECIFICATIONS (CONTINUED)
Electrical Characteristics: Unless otherwise noted, all parameters apply at VDD = 5V, VREF = 5V,
TA = -40C to +85C, fSAMPLE = 200 ksps and fCLK = 18*fSAMPLE. Unless otherwise noted, typical values apply for
VDD = 5V, TA = +25C.
Parameter
Sym
Min
Typ
Max
Units
Conditions
Operating Voltage
VDD
2.7
5.5
Operating Current
IDD
425
225
550
Standby Current
IDDS
0.005
CS = VDD = 5.0V
Power Requirements
TEMPERATURE CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, VDD = +2.7V to +5.5V, VSS = GND.
Parameters
Sym
Min
Typ
Max
Units
TA
-40
+85
TA
-40
+85
TA
-65
+150
JA
70
C/W
JA
108
C/W
JA
100
C/W
JA
70
C/W
JA
90
C/W
Conditions
Temperature Ranges
TCSH
CS
TSUCS
THI TLO
CLK
TSU
DIN
THD
MSB IN
TEN
DOUT
FIGURE 1-1:
TR
TDO
NULL BIT
MSB OUT
TF
TDIS
LSB
DS21295D-page 5
MCP3004/3008
Test Point
1.4V
VDD
3 k
Test Point
VDD/2
3 k
DOUT
DOUT
100 pF
CL = 100 pF
tEN Waveform
tDIS Waveform 1
VSS
tDIS Waveform 2
VOH
VOL
DOUT
tF
tR
CS
1
CLK
B9
DOUT
CLK
tEN
tDO
DOUT
CS
FIGURE 1-2:
VIH
DOUT
Waveform 1*
90%
TDIS
DOUT
Waveform 2
*
FIGURE 1-3:
DS21295D-page 6
10%
MCP3004/3008
2.0
Note:
Note: Unless otherwise indicated, VDD = VREF = 5V, fCLK = 18* fSAMPLE, TA = +25C.
1.0
1.0
0.8
0.6
0.4
0.4
Positive INL
0.2
INL (LSB)
INL (LSB)
0.8
0.6
0.0
-0.2
Negative INL
-0.4
Positive INL
0.2
0.0
-0.2
Negative INL
-0.4
-0.6
-0.6
-0.8
-0.8
-1.0
-1.0
0
25
50
75
100
125
150
175
200
225
250
25
FIGURE 2-1:
vs. Sample Rate.
50
75
100
FIGURE 2-4:
Integral Nonlinearity (INL)
vs. Sample Rate (VDD = 2.7V).
0.8
0.6
INL(LSB)
INL(LSB)
1.0
1.0
0.8
0.6
0.4
0.2
0.0
-0.2
-0.4
-0.6
-0.8
-1.0
Positive INL
0.4
Positive INL
0.2
0.0
-0.2
Negative INL
-0.4
Negative INL
-0.6
-0.8
-1.0
0
0.0
0.5
1.0
VREF (V)
FIGURE 2-2:
vs. VREF.
2.0
2.5
3.0
FIGURE 2-5:
Integral Nonlinearity (INL)
vs. VREF (VDD = 2.7V).
0.5
0.5
VDD = VREF = 5 V
fSAMPLE = 200 ksps
0.4
0.4
0.3
0.3
0.2
0.2
INL (LSB)
INL (LSB)
1.5
VREF (V)
0.1
0.0
-0.1
0.1
0.0
-0.1
-0.2
-0.2
-0.3
-0.3
-0.4
-0.4
-0.5
-0.5
0
128
256
384
512
640
768
896
1024
Digital Code
FIGURE 2-3:
Integral Nonlinearity (INL)
vs. Code (Representative Part).
128
256
384
512
640
768
896
1024
Digital Code
FIGURE 2-6:
Integral Nonlinearity (INL)
vs. Code (Representative Part, VDD = 2.7V).
DS21295D-page 7
MCP3004/3008
Note: Unless otherwise indicated, VDD = VREF = 5V, fCLK = 18* fSAMPLE, TA = +25C.
0.6
0.6
0.4
0.4
INL (LSB)
INL (LSB)
Positive INL
0.2
0.0
-0.2
0.2
0.0
Negative INL
-0.2
Negative INL
-0.4
-0.4
-0.6
-0.6
-50
-25
25
50
75
-50
100
-25
FIGURE 2-7:
vs. Temperature.
25
50
75
100
Temperature (C)
Temperature (C)
FIGURE 2-10:
Integral Nonlinearity (INL)
vs. Temperature (VDD = 2.7V).
0.6
0.6
VDD = VREF = 2.7 V
0.4
0.2
DNL (LSB)
DNL (LSB)
0.4
Positive DNL
0.0
Negative DNL
-0.2
0.2
Positive DNL
0.0
Negative DNL
-0.2
-0.4
-0.4
-0.6
-0.6
0
25
50
75
100
125
150
175
200
225
250
25
FIGURE 2-8:
Differential Nonlinearity
(DNL) vs. Sample Rate.
0.8
0.8
0.6
0.2
0.0
Negative DNL
-0.4
0.0
-0.2
-0.6
-0.8
1
VREF (V)
FIGURE 2-9:
(DNL) vs. VREF.
DS21295D-page 8
Differential Nonlinearity
Negative DNL
-0.4
-0.8
-1.0
Positive DNL
0.2
-0.6
100
0.4
Positive DNL
DNL (LSB)
DNL (LSB)
0.6
-0.2
75
FIGURE 2-11:
Differential Nonlinearity
(DNL) vs. Sample Rate (VDD = 2.7V).
1.0
0.4
50
-1.0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
VREF(V)
FIGURE 2-12:
Differential Nonlinearity
(DNL) vs. VREF (VDD = 2.7V).
MCP3004/3008
Note: Unless otherwise indicated, VDD = VREF = 5V, fCLK = 18* fSAMPLE, TA = +25C.
1.0
1.0
VDD = VREF = 5 V
fSAMPLE = 200 ksps
0.8
0.6
0.6
0.4
0.4
DNL (LSB)
DNL (LSB)
0.8
0.2
0.0
-0.2
0.2
0.0
-0.2
-0.4
-0.4
-0.6
-0.6
-0.8
-0.8
-1.0
-1.0
0
128
256
384
512
640
768
896
1024
128
256
384
Digital Code
512
640
768
896
1024
Digital Code
FIGURE 2-16:
Differential Nonlinearity
(DNL) vs. Code (Representative Part,
VDD =2.7V).
FIGURE 2-13:
Differential Nonlinearity
(DNL) vs. Code (Representative Part).
0.6
0.6
0.4
0.4
DNL (LSB)
DNL (LSB)
Positive DNL
0.2
0.0
-0.2
0.2
Positive DNL
0.0
Negative DNL
-0.2
Negative DNL
-0.4
-0.4
-0.6
-0.6
-50
-25
25
50
75
-50
100
-25
Temperature (C)
25
50
75
100
Temperature (C)
FIGURE 2-14:
Differential Nonlinearity
(DNL) vs. Temperature.
FIGURE 2-17:
Differential Nonlinearity
(DNL) vs. Temperature (VDD = 2.7V).
2.0
1.5
VDD = 2.7 V
fSAMPLE = 75 ksps
1.0
0.5
0.0
-0.5
VDD = 5 V
fSAMPLE = 200 ksps
-1.0
-1.5
6
VDD = 5 V
fSAMPLE = 200 ksps
5
4
3
VDD = 2.7 V
fSAMPLE = 75 ksps
2
1
-2.0
0
0
VREF(V)
FIGURE 2-15:
VREF (V)
FIGURE 2-18:
DS21295D-page 9
MCP3004/3008
Note: Unless otherwise indicated, VDD = VREF = 5V, fCLK = 18* fSAMPLE, TA = +25C.
1.2
0.0
VDD = VREF = 2.7 V
fSAMPLE = 75 ksps
-0.2
-0.3
-0.4
VDD = VREF = 5 V
fSAMPLE = 200 ksps
-0.5
VDD = VREF = 5 V
fSAMPLE = 200 ksps
1.0
-0.1
0.8
VDD = VREF = 2.7 V
fSAMPLE = 75 ksps
0.6
0.4
0.2
0.0
-0.6
-50
-25
25
50
75
-50
100
-25
FIGURE 2-19:
FIGURE 2-22:
Temperature.
80
50
75
100
80
VDD = VREF = 5 V
fSAMPLE = 200 ksps
70
VDD = VREF = 5 V
fSAMPLE = 200 ksps
70
60
60
SINAD (dB)
SNR (dB)
25
Temperature (C)
Temperature (C)
50
40
VDD = VREF = 2.7 V
fSAMPLE = 75 ksps
30
50
30
20
20
10
10
40
0
1
10
100
10
FIGURE 2-20:
Input Frequency.
100
FIGURE 2-23:
Signal-to-Noise and
Distortion (SINAD) vs. Input Frequency.
70
-10
60
THD (dB)
-30
SINAD (dB)
-20
VDD = VREF = 2.7 V
fSAMPLE = 75 ksps
-40
-50
-60
-70
-80
VDD = VREF = 5 V
fSAMPLE = 200 ksps
-90
VDD = VREF = 5 V
fSAMPLE = 200 ksps
50
40
30
20
10
0
-100
1
10
100
FIGURE 2-21:
Total Harmonic Distortion
(THD) vs. Input Frequency.
DS21295D-page 10
-40
-35
-30
-25
-20
-15
-10
-5
FIGURE 2-24:
Signal-to-Noise and
Distortion (SINAD) vs. Input Signal Level.
MCP3004/3008
Note: Unless otherwise indicated, VDD = VREF = 5V, fCLK = 18* fSAMPLE, TA = +25C.
10.00
10.0
9.8
9.6
9.4
9.2
9.0
8.8
8.6
8.4
8.2
8.0
9.25
VDD = VREF = 5 V
fSAMPLE = 200 ksps
9.00
0.0
0.5
1.0
1.5
2.0
2.5
VDD = VREF = 5V
fSAMPLE = 200 ksps
ENOB (rms)
ENOB (rms)
9.75
3.0
3.5
4.0
4.5
5.0
10
Input Frequency (kHz)
VREF (V)
FIGURE 2-25:
(ENOB) vs. VREF.
VDD = VREF = 5 V
fSAMPLE = 200 ksps
90
SFDR (dB)
80
70
60
VDD = VREF = 2.7 V
fSAMPLE = 75 ksps
50
40
FIGURE 2-28:
Effective Number of Bits
(ENOB) vs. Input Frequency.
100
30
20
10
0
1
10
0
VDD = VREF = 5 V
fSAMPLE = 200 ksps
-10
-20
-30
-40
-50
-60
-70
1
100
10
VDD = VREF = 5 V
FSAMPLE = 200 ksps
FINPUT = 10.0097 kHz
4096 points
20000
40000
60000
80000
100000
Frequency (Hz)
FIGURE 2-27:
Frequency Spectrum of
10 kHz Input (Representative Part).
1000
10000
FIGURE 2-29:
Power Supply Rejection
(PSR) vs. Ripple Frequency.
0
-10
-20
-30
-40
-50
-60
-70
-80
-90
-100
-110
-120
-130
Amplitude (dB)
Amplitude (dB)
FIGURE 2-26:
Spurious Free Dynamic
Range (SFDR) vs. Input Frequency.
100
0
-10
-20
-30
-40
-50
-60
-70
-80
-90
-100
-110
-120
-130
100
5000
Frequency (Hz)
FIGURE 2-30:
Frequency Spectrum of
1 kHz Input (Representative Part, VDD = 2.7V).
DS21295D-page 11
MCP3004/3008
550
550
500
500
450
450
400
400
350
350
IDD (A)
IDD (A)
Note: Unless otherwise indicated, VDD = VREF = 5V, fCLK = 18* fSAMPLE, TA = +25C.
300
250
200
VREF = VDD
All points at fCLK = 3.6 MHz except
at VREF = VDD = 2.5 V, fCLK = 1.35 MHz
150
100
50
300
250
200
150
VREF = VDD
All points at fCLK = 3.6 MHz except
at VREF = VDD = 2.5 V, fCLK = 1.35 MHz
100
50
0
0
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
2.0
6.0
2.5
3.0
3.5
FIGURE 2-31:
FIGURE 2-34:
500
450
400
IREF (A)
IDD (A)
350
300
VDD = VREF = 5 V
250
200
VDD = VREF = 2.7 V
150
100
50
0
10
100
1000
120
110
100
90
80
70
60
50
40
30
20
10
0
4.5
5.0
5.5
6.0
10
10000
VDD = VREF = 5 V
100
1000
10000
FIGURE 2-32:
4.0
VDD (V)
VDD (V)
FIGURE 2-35:
550
500
VDD = VREF = 5 V
fCLK = 3.6 MHz
450
140
IREF (A)
IDD (A)
350
300
250
200
150
50
100
80
60
40
100
VDD = VREF = 5 V
fCLK = 3.6 MHz
120
400
20
0
-50
-25
25
50
75
100
-50
-25
Temperature (C)
FIGURE 2-33:
DS21295D-page 12
25
50
75
100
Temperature (C)
FIGURE 2-36:
MCP3004/3008
Note: Unless otherwise indicated, VDD = VREF = 5V, fCLK = 18* fSAMPLE, TA = +25C.
2.0
70
VREF = CS = VDD
60
IDDS (pA)
50
40
30
20
10
0
1.8
VDD = VREF = 5 V
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
VDD (V)
FIGURE 2-37:
-50
-25
25
50
75
100
Temperature (C)
FIGURE 2-39:
Analog Input Leakage
Current vs. Temperature.
100.00
VDD = VREF = CS = 5 V
IDDS (nA)
10.00
1.00
0.10
0.01
-50
-25
25
50
75
100
Temperature (C)
FIGURE 2-38:
DS21295D-page 13
MCP3004/3008
NOTES:
DS21295D-page 14
MCP3004/3008
3.0
PIN DESCRIPTIONS
TABLE 3-1:
MCP3004
MCP3008
PDIP, SOIC,
TSSOP
PDIP, SOIC
CH0
Analog Input
CH1
Analog Input
CH2
Analog Input
CH3
Analog Input
CH4
Analog Input
CH5
Analog Input
CH6
Analog Input
CH7
Analog Input
3.1
Symbol
DGND
10
CS/SHDN
11
DIN
10
12
DOUT
Serial Data In
Serial Data Out
13
CLK
14
AGND
13
15
VREF
14
16
VDD
5,6
NC
No Connection
Serial Clock
Analog Ground
3.5
3.4
11
3.3
Digital Ground
12
3.2
Description
3.6
The SPI serial data output pin is used to shift out the
results of the A/D conversion. Data will always change
on the falling edge of each clock as the conversion
takes place.
3.7
DS21295D-page 15
MCP3004/3008
NOTES:
DS21295D-page 16
MCP3004/3008
4.0
DEVICE OPERATION
4.2
Reference Input
EQUATION 4-1:
V REF
LSB Size = -----------1024
The theoretical digital output code produced by the A/D
converter is a function of the analog input signal and
the reference input, as shown below.
EQUATION 4-2:
4.1
Analog Inputs
1024 V IN
Digital Output Code = -------------------------V REF
Where:
VIN
VREF
DS21295D-page 17
MCP3004/3008
VDD
RSS
Sampling
Switch
VT = 0.6V
CHx
CPIN
7 pF
VA
VT = 0.6V
SS
ILEAKAGE
1 nA
RS = 1 k
CSAMPLE
= DAC capacitance
= 20 pF
VSS
Legend
VA = Signal Source
SS = sampling switch
FIGURE 4-1:
4
VDD = VREF = 5 V
fSAMPLE = 200 ksps
3
0
100
1000
10000
FIGURE 4-2:
Maximum Clock Frequency
vs. Input resistance (RS) to maintain less than a
0.1 LSB deviation in INL from nominal
conditions.
DS21295D-page 18
MCP3004/3008
5.0
SERIAL COMMUNICATION
TABLE 5-1:
Control Bit
Selections
Input
Configuration
Single/
D2* D1 D0
Diff
Channel
Selection
single-ended
CH0
single-ended
CH1
single-ended
CH2
single-ended
CH3
differential
CH0 = IN+
CH1 = IN-
differential
differential
CH2 = IN+
CH3 = IN-
differential
TABLE 5-2:
Control Bit
Selections
Input
Configuration
Channel
Selection
single-ended
CH0
single-ended
CH1
single-ended
CH2
single-ended
CH3
single-ended
CH4
single-ended
CH5
single-ended
CH6
single-ended
CH7
differential
CH0 = IN+
CH1 = IN-
differential
differential
CH2 = IN+
CH3 = IN-
differential
differential
CH4 = IN+
CH5 = IN-
differential
differential
CH6 = IN+
CH7 = IN-
differential
Single
/Diff
D2
D1 D0
DS21295D-page 19
MCP3004/3008
tCYC
tCYC
tCSH
CS
tSUCS
CLK
DIN
DOUT
Start
D2 D1 D0
SGL/
DIFF
HI-Z
Null
Bit B9 B8 B7 B6 B5 B4 B3 B2 B1 B0 *
tCONV
tSAMPLE
D2
Start
Dont Care
SGL/
DIFF
HI-Z
tDATA **
* After completing the data transfer, if further clocks are applied with CS low, the A/D converter will output LSB
first data, then followed with zeros indefinitely. See Figure 5-2 below.
** tDATA: during this time, the bias current and the comparator powers down while the reference input becomes
a high-impedance node.
FIGURE 5-1:
tCYC
CS
tCSH
tSUCS
Power Down
CLK
DIN
DOUT
Start
Dont Care
D2 D1 D0
SGL/
DIFF
HI-Z
Null
B9 B8 B7 B6 B5 B4 B3 B2 B1 B0 B1 B2 B3 B4 B5 B6 B7 B8 B9*
Bit
HI-Z
(MSB)
tSAMPLE
tCONV
tDATA **
* After completing the data transfer, if further clocks are applied with CS low, the A/D converter will output zeros
indefinitely.
** tDATA: During this time, the bias circuit and the comparator powers down while the reference input becomes
a high-impedance node, leaving the CLK running to clock out LSB first data or zeroes.
FIGURE 5-2:
DS21295D-page 20
MCP3004/3008
6.0
APPLICATIONS INFORMATION
6.1
CS
SCLK
DIN
10
11
12
13
14 15 16
17
0
?
NULL
BIT B9 B8
0
?
0
?
0
?
0
?
Start
Bit
1
?
SGL/
DIFF D2 D1 DO X
?
18 19
20
21 22
23
24
Dont Care
HI-Z
DOUT
B7
0 B9 B8
? (Null)
B6 B5 B4 B3 B2 B1 B0
B7 B6 B5 B4 B3 B2 B1 B0
Data stored into MCU receive
register after transmission of last
8 bits
FIGURE 6-1:
SPI Communication with the MCP3004/3008 using 8-bit segments
(Mode 0,0: SCLK idles low).
DS21295D-page 21
MCP3004/3008
CS
SCLK
10
11 12 13 14 15
16
17 18 19
20
21 22
23
24
DIN
Start
Dont Care
NULL
BIT B9
HI-Z
DOUT
Start
Bit
FIGURE 6-2:
6.2
SGL/ D2 D1 DO
DIFF
0
?
0
?
0
?
0
?
0
?
SGL/
DIFF D2
0
?
D1 DO X
?
X
?
B8
0
(Null) B9 B8
B7 B6 B5 B4 B3 B2 B1 B0
Data stored into MCU receive
register after transmission of last
8 bits
If the signal source for the A/D converter is not a lowimpedance source, it will have to be buffered or
inaccurate conversion results may occur (see Figure 42). It is also recommended that a filter be used to
eliminate any signals that may be aliased back in to the
conversion results, as is illustrated in Figure 6-3, where
an op amp is used to drive, filter and gain the analog
input of the MCP3004/3008. This amplifier provides a
low-impedance source for the converter input, plus a
low-pass filter, which eliminates unwanted highfrequency noise.
10 F
4.096V
Reference
0.1 F
MCP1541
1 F
1 F
VIN
R1
C1
R2
C2
DS21295D-page 22
SPI Communication with the MCP3004/3008 using 8-bit segments (Mode 1,1: SCLK idles high).
6.3
B6 B5 B4 B3 B2 B1 B0
B7
MCP601
IN+ V
REF
MCP3004
IN-
+
-
R
R3 4
FIGURE 6-3:
The MCP601 Operational
Amplifier is used to implement a second order
anti-aliasing filter for the signal being converted
by the MCP3004.
MCP3004/3008
6.4
Layout Considerations
VDD
MCP3004/08
Digital Side
Analog Side
-SPI Interface
-Shift Register
-Control Logic
-Sample Cap
-Capacitor Array
-Comparator
Substrate
5 - 10
DGND
AGND
0.1 F
Device 4
Device 1
FIGURE 6-5:
Separation of Analog and
Digital Ground Pins.
Device 3
Device 2
FIGURE 6-4:
VDD traces arranged in a
Star configuration in order to reduce errors
caused by current return paths.
6.5
DS21295D-page 23
MCP3004/3008
NOTES:
DS21295D-page 24
MCP3004/3008
7.0
PACKAGING INFORMATION
7.1
Example:
MCP3004
I/P e3
XXXXXXXXXXXXXX
XXXXXXXXXXXXXX
YYWWNNN
0819256
Example:
XXXXXXXXXXX
XXXXXXXXXXX
YYWWNNN
MCP3004
3
ISL e^^
XXXXXXXXXXX
0819256
Example:
XXXXXXXX
3004
YYWW
I819
NNN
256
Legend: XX...X
Y
YY
WW
NNN
e3
Note:
Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week 01)
Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3)
can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available characters
for customer-specific information.
DS21295D-page 25
MCP3004/3008
Package Marking Information (Continued)
16-Lead PDIP (300 mil) (MCP3008)
Example:
XXXXXXXXXXXXXX
XXXXXXXXXXXXXX
YYWWNNN
XXXXXXXXXXXXX
XXXXXXXXXXXXX
YYWWNNN
DS21295D-page 26
MCP3008-I/P e3
0819256
Example:
MCP3008
3
I/SL e^^
XXXXXXXXXX
0819256
MCP3004/3008
3
%&
%! %4" ) ' %
4$%
%"%
%%255)))&
&54
NOTE 1
E1
D
E
A2
L
A1
b1
b
eB
6%
&
9&%
7!&(
$
7+8-
7
7:
;
%
%
%
<
<
""4
4
0
,
0
1 %
%
0
<
<
!" %
!" ="%
,
,0
""4="%
-
0
>
: 9%
,0
0
0
%
%
0
,
0
9" 4
>
0
(
0
?
>
1
<
<
6 9"="%
9
) 9"="%
:
)*
1+
,
!"#$%! & '(!%&! %(
%")%%%"
*$%+ % %
, &
"-"
%!"&
"$
% !
"$
% !
%#". "
&
"%
-/0
1+21 &
%#%!
))%
!%%
) +01
DS21295D-page 27
MCP3004/3008
! "
! ##$% &' !"(
3
%&
%! %4" ) ' %
4$%
%"%
%%255)))&
&54
D
N
E
E1
NOTE 1
1
e
h
A2
A1
L1
6%
&
9&%
7!&(
$
99-
-
7
7:
;
%
: 8%
<
1+
<
""4
4
0
<
<
%"
$$*
<
0
: ="%
""4="%
-
,1+
: 9%
>?01+
0
?1+
+&$ @
%
A
0
<
0
%9%
<
% %
9
-3
%
B
<
>B
9" 4
<
0
9"="%
,
<
0
" $%
0B
<
0B
" $%1
%%
&
0B
<
0B
!"#$%! & '(!%&! %(
%")%%%"
*$%+ % %
, &
"-"
%!"&
"$
% !
"$
% !
%#"0&& "
&
"%
-/0
1+2 1 &
%#%!
))%
!%%
-32 $ &
'! !)%
!%%
'$
$
&%
!
) +?01
DS21295D-page 28
MCP3004/3008
)
! "
! ##$% &' !"(
3
%&
%! %4" ) ' %
4$%
%"%
%%255)))&
&54
DS21295D-page 29
MCP3004/3008
*+ !+#, ! "
!* & *!!"
3
%&
%! %4" ) ' %
4$%
%"%
%%255)))&
&54
D
N
E
E1
NOTE 1
1 2
e
b
A2
A1
6%
&
9&%
7!&(
$
L1
99-
-
7
7:
;
%
: 8%
<
?01+
<
""4
4
>
0
%"
$$
0
<
0
: ="%
""4="%
-
,
?1+
""49%
0
0
%9%
0
?
0
% %
9
0
-3
%
B
<
>B
9" 4
<
9"="%
(
<
,
!"#$%! & '(!%&! %(
%")%%%"
&
"-"
%!"&
"$
% !
"$
% !
%#"0&& "
, &
"%
-/0
1+2 1 &
%#%!
))%
!%%
-32 $ &
'! !)%
!%%
'$
$
&%
!
) +>1
DS21295D-page 30
MCP3004/3008
-
3
%&
%! %4" ) ' %
4$%
%"%
%%255)))&
&54
NOTE 1
E1
3
D
E
A
A2
L
A1
b1
b
eB
6%
&
9&%
7!&(
$
7+8-
7
7:
;
?
%
%
%
<
<
""4
4
0
,
0
1 %
%
0
<
<
!" %
!" ="%
,
,0
""4="%
-
0
>
: 9%
,0
00
0
%
%
0
,
0
9" 4
>
0
(
0
?
>
1
<
<
6 9"="%
9
) 9"="%
:
)*
1+
,
!"#$%! & '(!%&! %(
%")%%%"
*$%+ % %
, &
"-"
%!"&
"$
% !
"$
% !
%#". "
&
"%
-/0
1+2 1 &
%#%!
))%
!%%
) +1
DS21295D-page 31
MCP3004/3008
-
! "
! ##$% &' !"(
3
%&
%! %4" ) ' %
4$%
%"%
%%255)))&
&54
D
N
E1
NOTE 1
1
e
b
h
A1
L1
6%
&
9&%
7!&(
$
A2
99-
-
7
7:
;
?
%
: 8%
<
1+
<
""4
4
0
<
<
%"
$$*
<
0
: ="%
""4="%
-
,1+
: 9%
1+
0
?1+
+&$ @
%
A
0
<
0
%9%
<
% %
9
-3
%
B
<
>B
9" 4
<
0
9"="%
,
<
0
" $%
0B
<
0B
" $%1
%%
&
0B
<
0B
!"#$%! & '(!%&! %(
%")%%%"
*$%+ % %
, &
"-"
%!"&
"$
% !
"$
% !
%#"0&& "
&
"%
-/0
1+2 1 &
%#%!
))%
!%%
-32 $ &
'! !)%
!%%
'$
$
&%
!
) +>1
DS21295D-page 32
MCP3004/3008
3
%&
%! %4" ) ' %
4$%
%"%
%%255)))&
&54
DS21295D-page 33
MCP3004/3008
NOTES:
DS21295D-page 34
MCP3004/3008
APPENDIX A:
REVISION HISTORY
Undocumented changes.
DS21295D-page 35
MCP3004/3008
NOTES:
DS21295D-page 36
MCP3004/3008
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
/XX
Device
Temperature
Range
Package
Device
Examples:
a)
b)
c)
d)
a)
Temperature Range
Package
P
SL
ST
= -40C to
+85C
(Industrial)
b)
MCP3004-I/P:
Industrial Temperature,
PDIP package.
MCP3004-I/SL: Industrial Temperature,
SOIC package.
MCP3004-I/ST: Industrial Temperature,
TSSOP package.
DS21295D-page 37
MCP3004/3008
NOTES:
DS21295D-page 38
Note the following details of the code protection feature on Microchip devices:
Microchip products meet the specification contained in their particular Microchip Data Sheet.
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchips Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as unbreakable.
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchips code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,
PICSTART, rfPIC, SmartShunt and UNI/O are registered
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
FilterLab, Linear Active Thermistor, MXDEV, MXLAB,
SEEVAL, SmartSensor and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, CodeGuard,
dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, In-Circuit Serial
Programming, ICSP, ICEPIC, Mindi, MiWi, MPASM, MPLAB
Certified logo, MPLIB, MPLINK, mTouch, PICkit, PICDEM,
PICDEM.net, PICtail, PIC32 logo, PowerCal, PowerInfo,
PowerMate, PowerTool, REAL ICE, rfLAB, Select Mode, Total
Endurance, WiperLock and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
2008, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
DS21295D-page 39
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01/02/08
DS21295D-page 40