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DATA SHEET
TEA1506P; TEA1506AP;
TEA1506T; TEA1506AT
GreenChipII SMPS control IC
Product specification
2003 Sep 09
Philips Semiconductors
Product specification
TEA1506P; TEA1506AP;
TEA1506T; TEA1506AT
APPLICATIONS
Distinctive features
TEA1506P
TEA1506AP
MDB504
2003 Sep 09
Philips Semiconductors
Product specification
TEA1506P; TEA1506AP;
TEA1506T; TEA1506AT
GENERAL DESCRIPTION
GreenChip(1)II
ORDERING INFORMATION
PACKAGE
TYPE NUMBER
NAME
TEA1506P
DESCRIPTION
VERSION
DIP8
SOT97-1
SO14
SOT108-1
TEA1506AP
TEA1506T
TEA1506AT
2003 Sep 09
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DRAIN
Iprot(DEM)
internal
supply
GND
VALLEY
UVLO start
clamp
2
(3)
VOLTAGE
CONTROLLED
OSCILLATOR
LOGIC
(7)
DEM
100
mV
UP/DOWN
COUNTER
FREQUENCY
CONTROL
LOGIC
Iprot(CTRL)
CTRL
OVERVOLTAGE
PROTECTION
DRIVER
Philips Semiconductors
(2)
8
(14)
SUPPLY
MANAGEMENT
BLOCK DIAGRAM
k, full pagewidth
2003 Sep 09
VCC
DRIVER
(11)
1
(6)
Iss
POWER-ON
RESET
LEB
S
3.8 V
soft
start
S2
blank
UVLO
0.5 V
5
OCP
TEA1506P;
TEA1506AP
(TEA1506T;
TEA1506 AT)
short
winding
MAXIMUM
ON-TIME
PROTECTION
0.88 V
MDB505
Product specification
OVERPOWER
PROTECTION
Isense
TEA1506P; TEA1506AP;
TEA1506T; TEA1506AT
OVERTEMPERATURE
PROTECTION
(9)
Philips Semiconductors
Product specification
TEA1506P; TEA1506AP;
TEA1506T; TEA1506AT
DESCRIPTION
DIP8
SO14
VCC
supply voltage
GND
ground
CTRL
control input
DEM
Isense
DRIVER
11
HVS
12, 13
DRAIN
14
n.c.
1, 4, 5, 8,
10
handbook, halfpage
n.c. 1
handbook, halfpage
VCC 1
8 DRAIN
GND 2
7 HVS
TEA1506P
VCC 2
13 HVS
GND 3
12 HVS
n.c. 4
n.c. 5
DEM 4
5 Isense
14 DRAIN
TEA1506T 11 DRIVER
TEA1506AT
10 n.c.
CTRL 6
Isense
DEM 7
n.c.
MDB506
MDB507
2003 Sep 09
Philips Semiconductors
Product specification
TEA1506P; TEA1506AP;
TEA1506T; TEA1506AT
0.52 V
MGU233
sense(max)
handbook, halfpage
MGU508
handbook, halfpage
(kHz)
VCO
fixed
1V
(typ)
quasi resonant
175
1.5 V
(typ)
VCTRL
P (W)
Oscillator
The maximum fixed frequency of the oscillator is set by an
internal current source and capacitor. The maximum
frequency is reduced once the control voltage enters the
VCO control window. Then, the maximum frequency
changes linearly with the control voltage until the minimum
frequency is reached (see Figs 6 and 7).
2003 Sep 09
Philips Semiconductors
Product specification
TEA1506P; TEA1506AP;
TEA1506T; TEA1506AT
MGU509
f
(kHz)
handbook, halfpage
175 kHz
175
25
VCO2
level
VCO1
level
Vsense(max) (V)
fosc
1.5 V VCTRL
current
comparator
CTRL
fmax
DRIVER
DRIVER
fmin
Isense
X2
dV2
Vx
cycle
skipping
V
I
dV1
150
Vx (mV)
OSCILLATOR
150 mV
0
Vx (mV)
MGU510
The voltage levels dV1 and dV2 are fixed in the IC to 50 mV (typical) and 18 mV (typical) respectively.
2003 Sep 09
Philips Semiconductors
Product specification
TEA1506P; TEA1506AP;
TEA1506T; TEA1506AT
Demagnetization
The system will be in discontinuous conduction mode all
the time. The oscillator will not start a new primary stroke
until the secondary stroke has ended.
Demagnetization features a cycle-by-cycle output
short-circuit protection by immediately lowering the
frequency (longer off-time), thereby reducing the power
level.
Ns
----------- { I (OVP)(DEM) R DEM + V clamp(DEM)(pos) }
N aux
where Ns is the number of secondary turns and Naux is the
number of auxiliary turns of the transformer.
2003 Sep 09
Philips Semiconductors
Product specification
TEA1506P; TEA1506AP;
TEA1506T; TEA1506AT
primary
stroke
secondary
ringing
secondary
stroke
drain
valley
secondary
stroke
oscillator
MGU235
2003 Sep 09
Philips Semiconductors
Product specification
TEA1506P; TEA1506AP;
TEA1506T; TEA1506AT
MGU236
handbook, halfpage
Vsense(max)
0.52 V
(typ)
0.3 V
(typ)
IDEM
24 A
(typ)
2003 Sep 09
10
Philips Semiconductors
Product specification
TEA1506P; TEA1506AP;
TEA1506T; TEA1506AT
handbook, halfpage
ISS
Soft start-up
0.5 V
start-up
RSS
5 Isense
Vocp
CSS
Rsense
MGU237
V ocp ( I SS R SS )
I primary(max) = ---------------------------------------------R sense
Driver
= R SS C SS
Since the soft start current ISS is supplied from pin DRAIN,
the RSS value will not affect the VCC current during start-up.
2003 Sep 09
11
Philips Semiconductors
Product specification
TEA1506P; TEA1506AP;
TEA1506T; TEA1506AT
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134); note 1.
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
Voltages
continuous
0.4
VCC
supply voltage
+20
VCTRL
0.4
+5
VDEM
current limited
0.4
Vsense
current limited
0.4
VDRAIN
0.4
+650
ICTRL
mA
IDEM
250
+250
Isense
+10
mA
IDRIVER
0.8
+2
IDRAIN
mA
Currents
d < 10 %
General
Ptot
0.75
Tstg
storage temperature
Tamb < 70 C
55
+150
Tj
20
+145
Vesd
2000
1500
any pin
MM; note 3
400
Notes
1. All voltages are measured with respect to ground; positive currents flow into the IC; pin VCC may not be current
driven. The voltage ratings are valid provided other ratings are not violated; current ratings are valid provided the
maximum power rating is not violated.
2. Human Body Model (HBM): equivalent to discharging a 100 pF capacitor through a 1.5 k resistor.
3. Machine Model (MM): equivalent to discharging a 200 pF capacitor through a 0.75 H coil and a 10 resistor.
THERMAL CHARACTERISTICS
SYMBOL
Rth(j-a)
PARAMETER
thermal resistance from junction to
ambient
QUALITY SPECIFICATION
In accordance with SNW-FQ-611-D.
2003 Sep 09
12
CONDITIONS
VALUE
UNIT
in free air
100
K/W
Philips Semiconductors
Product specification
TEA1506P; TEA1506AP;
TEA1506T; TEA1506AT
CHARACTERISTICS
Tamb = 25 C; VCC = 15 V; all voltages are measured with respect to ground; currents are positive when flowing into
the IC; unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
BVDSS
breakdown voltage
500
50
650
10.3
11
11.7
8.1
VCC(UVLO)
8.7
9.3
VCC(hys)
VCC(start) VCC(UVLO)
2.0
2.3
2.6
ICC(oper)
1.3
1.5
mA
ICC(start)
0(1)
70
ICC(protection)
0.85
mA
50
100
150
mV
50(2)
10
nA
0.5
0.25
0.05
0.5
0.7
0.9
1.1
1.5
1.9
tleb
ns
demagnetization comparator
threshold voltage on pin DEM
Iprot(DEM)
VDEM = 50 mV
IDEM = 250 A
minimum on-time
ton(max)
maximum on-time
latched
40
50
60
fosc(l)
20
25
30
kHz
fosc(h)
VCTRL < 1 V
145
175
205
kHz
Vvco(start)
VCO1
mV
Vvco(nom)
VCO1 50
mV
Oscillator
1.0
VCTRL(max)
1.5
Iprot(CTRL)
1(2)
0.8
0.5
2003 Sep 09
VCTRL = 1.5 V
13
Philips Semiconductors
Product specification
TEA1506P; TEA1506AP;
TEA1506T; TEA1506AT
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
85
+85
V/s
tvalley-swon
150(2)
ns
0.48
0.52
0.56
tPD
140
185
ns
Vswp
0.83
0.88
0.96
tleb
300
370
440
ns
ISS
45
60
75
54
60
66
24
100
IOPP50%(DEM)
VCC = 9.5 V;
VDRIVER = 2 V
135
mA
Isink
VCC= 9.5 V;
VDRIVER = 2 V
240
mA
VCC = 9.5 V;
VDRIVER = 9.5 V
560
mA
VCC > 12 V
11.5
12
Vo(max)
Overtemperature protection
Tprot(max)
130
140
150
Tprot(hys)
8(2)
Notes
1. For VCC 2 V.
2. Guaranteed by design.
2003 Sep 09
14
Philips Semiconductors
Product specification
TEA1506P; TEA1506AP;
TEA1506T; TEA1506AT
A converter with the TEA1506 consists of an input filter, a transformer with a third winding (auxiliary), and an output stage
with a feedback circuit.
Capacitor CVCC (at pin VCC) buffers the supply voltage of the IC, which is powered via the resistor RS during start-up and
via the auxiliary winding during operation.
A sense resistor converts the primary current into a voltage at pin Isense. The value of this sense resistor defines the
maximum primary peak current.
Do
Vi
Vo
Ci
RS
Np
VCC
CVCC
CCTRL
RCTRL
GND
CTRL
DEM
Co
8 DRAIN
1
2
Ns
TEA1506P
TEA1506AP
7
6
5
HVS
n.c.
power
MOSFET
DRIVER
Isense
RSS
CSS
Rsense
Dmicro
VC
RDEM
Naux
Cmicro
MICROCONTROLLER
Rreg1
Rreg2
MDB508
2003 Sep 09
15
Philips Semiconductors
Product specification
TEA1506P; TEA1506AP;
TEA1506T; TEA1506AT
Vi
VD
(power
MOSFET)
Vi
Vo
VCC
Vgate
VC
start-up
sequence
normal
operation
overvoltage
protection
(TEA1506AP/TEA1506AT)
2003 Sep 09
16
output
short-circuit
normal
operation
MDB509
Philips Semiconductors
Product specification
TEA1506P; TEA1506AP;
TEA1506T; TEA1506AT
SOT97-1
ME
seating plane
A2
A1
c
Z
w M
b1
e
(e 1)
MH
b2
5
pin 1 index
E
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
min.
A2
max.
b1
b2
D (1)
E (1)
e1
ME
MH
Z (1)
max.
mm
4.2
0.51
3.2
1.73
1.14
0.53
0.38
1.07
0.89
0.36
0.23
9.8
9.2
6.48
6.20
2.54
7.62
3.60
3.05
8.25
7.80
10.0
8.3
0.254
1.15
inches
0.17
0.02
0.13
0.068
0.045
0.021
0.015
0.042
0.035
0.014
0.009
0.39
0.36
0.26
0.24
0.1
0.3
0.14
0.12
0.32
0.31
0.39
0.33
0.01
0.045
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
JEITA
SOT97-1
050G01
MO-001
SC-504-8
2003 Sep 09
17
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-13
Philips Semiconductors
Product specification
TEA1506P; TEA1506AP;
TEA1506T; TEA1506AT
SOT108-1
A
X
c
y
HE
v M A
Z
8
14
Q
A2
(A 3)
A1
pin 1 index
Lp
1
7
e
detail X
w M
bp
2.5
5 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
D (1)
E (1)
HE
Lp
Z (1)
mm
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
8.75
8.55
4.0
3.8
1.27
6.2
5.8
1.05
1.0
0.4
0.7
0.6
0.25
0.25
0.1
0.7
0.3
0.010 0.057
0.004 0.049
0.01
0.16
0.15
0.05
0.028
0.024
0.01
0.01
0.004
0.028
0.012
inches 0.069
0.244
0.039
0.041
0.228
0.016
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT108-1
076E06
MS-012
2003 Sep 09
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
18
8
0o
Philips Semiconductors
Product specification
TEA1506P; TEA1506AP;
TEA1506T; TEA1506AT
Introduction
WAVE SOLDERING
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
MANUAL SOLDERING
REFLOW SOLDERING
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
2003 Sep 09
19
Philips Semiconductors
Product specification
TEA1506P; TEA1506AP;
TEA1506T; TEA1506AT
MANUAL SOLDERING
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 C. When using a dedicated tool, all other leads can
be soldered in one operation within 2 to 5 seconds
between 270 and 320 C.
PACKAGE(1)
MOUNTING
WAVE
REFLOW(2) DIPPING
suitable(3)
suitable
Through-holesurface mount
PMFP(9)
not suitable
not suitable
Surface mount
not suitable
suitable
not suitable(5)
suitable
suitable
suitable
suitable
suitable
recommended(6)(7)
not
not recommended(8)
Notes
1. For more detailed information on the BGA packages refer to the (LF)BGA Application Note (AN01026); order a copy
from your Philips Semiconductors sales office.
2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods.
3. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
4. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account
be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature
exceeding 217 C 10 C measured in the atmosphere of the reflow oven. The package body peak temperature
must be kept as low as possible.
5. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder
cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.
6. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
7. Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is definitely not
suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
8. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
9. Hot bar soldering or manual soldering is suitable for PMFP packages.
2003 Sep 09
20
Philips Semiconductors
Product specification
TEA1506P; TEA1506AP;
TEA1506T; TEA1506AT
DATA SHEET
STATUS(1)
PRODUCT
STATUS(2)(3)
Development
DEFINITION
Objective data
II
III
Product data
This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Relevant changes will
be communicated via a Customer Product/Process Change Notification
(CPCN).
Production
This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
DEFINITIONS
DISCLAIMERS
2003 Sep 09
21
Contact information
For additional information please visit http://www.semiconductors.philips.com.
Fax: +31 40 27 24825
For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
SCA75
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
613502/01/pp22
Sep 09