Professional Documents
Culture Documents
www.ti.com.cn
: AMC1100
250mV
5V 0.075%
1.5mV
3.1mVRMS
5V 8mA
60kHz
8
0.5%
108dB
3.3V
UL1577 IEC60747-5-2
4250 V
1200 V
2.5 kV/s
10
VDD1
AMC1100
(SiO2)
UL1577 IEC60747-5-2
4250 VPEAK
AMC1100
3V 5V
AMC1100 40 C +105 C
SMD (gullwing) -8
VDD2
5V
2V
2.55 V
0V
VINP
VOUTP
VINN
VOUTN
250 mV
3.3 V
2V
1.29 V
GND1
GND2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
AMC1100
ZHCS847 APRIL 2012
www.ti.com.cn
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
VALUE
UNIT
0.5 to 6
10
mA
+150
2500
1000
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated is not implied. Exposure to absolute
maximum rated conditions for extended periods may affect device reliability.
THERMAL INFORMATION
AMC1100
THERMAL METRIC (1)
DUB (SOP)
UNITS
8 PINS
JA
75.1
JCtop
61.6
JB
39.8
JT
27.2
JB
39.4
JCbot
N/A
(1)
C/W
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
AMC1100
www.ti.com.cn
REGULATORY INFORMATION
VDE AND IEC
UL
VPR
TEST CONDITIONS
VALUE
UNIT
1200
VPEAK
1140
VPEAK
1920
VPEAK
2250
VPEAK
Qualification test: t = 60 s
4250
VPEAK
4250
VPEAK
5100
VPEAK
VIO = 500 V at TS
> 109
VIOTM
Transient overvoltage
VISO
RS
Insulation resistance
PD
Pollution degree
TC
Maximum-case temperature
TEST CONDITIONS
MIN
TYP
MAX
UNIT
10
mA
+150
Surge immunity
TEST CONDITIONS
1.2-s or 50-s voltage surge and 8-s or 20-s current surge
VALUE
UNIT
6000
Installation classification
TEST CONDITIONS
Material group
SPECIFICATION
II
I-IV
I-IV
I-III
I-III
AMC1100
ZHCS847 APRIL 2012
www.ti.com.cn
TEST CONDITIONS
MIN
TYP
MAX
UNIT
L(I01)
L(I02)
CTI
Tracking resistance
(comparative tracking index)
> 400
0.014
mm
RIO
Isolation resistance
mm
mm
> 1012
> 1011
CIO
1.2
pF
CI
pF
(1)
Creepage and clearance requirements should be applied according to the specific equipment isolation standards of a specific
application. Care should be taken to maintain the creepage and clearance distance of the board design to ensure that the mounting
pads of the isolator on the printed circuit board (PCB) do not reduce this distance. Creepage and clearance on a PCB become equal
according to the measurement techniques shown in the Isolation Glossary section. Techniques such as inserting grooves or ribs on the
PCB are used to help increase these specifications.
ELECTRICAL CHARACTERISTICS
All minimum and maximum specifications are at TA = 40C to +105C and are within the specified voltage range, unless
otherwise noted. Typical values are at TA = +25C, VDD1 = 5 V, and VDD2 = 3.3 V.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
INPUT
Maximum input voltage before
clipping
VINP VINN
VINP VINN
320
250
mV
+250
-0.16
VCM
VOS
1.5
0.2
+1.5
mV
TCVOS
10
1.5
+10
V/K
CMRR
CIN
CIND
3.6
pF
RIN
28
60
100
kHz
0.5
0.05
+0.5
0.05
+1
0.075
0.015
+0.075
0.1
0.023
+0.1
VIN from 0 V to 5 V at 0 Hz
VIN from 0 V to 5 V at 50 kHz
VINP or VINN
Small-signal bandwidth
VDD1
mV
V
108
dB
95
dB
pF
OUTPUT
Nominal gain
GERR
Gain error
TCGERR
8
Initial, at TA = +25C
56
ppm/K
2.4
ppm/K
VINP = VINN = 0 V
3.1
mVRMS
80
dB
61
dB
3.66
6.6
AMC1100
www.ti.com.cn
TEST CONDITIONS
MIN
TYP
MAX
UNIT
1.6
3.3
3.15
5.6
5.26
9.9
OUTPUT (continued)
VIN to VOUT signal delay
CMTI
Common-mode transient
immunity
VCM = 1 kV
ROUT
2.5
3.75
kV/s
1.15
1.29
1.45
2.4
2.55
2.7
Short-circuit current
20
mA
Output resistance
2.5
POWER SUPPLY
VDD1
4.5
5.0
5.5
VDD2
2.7
5.0
5.5
IDD1
5.4
mA
IDD2
3.8
mA
PDD1
PDD2
V
V
4.4
mA
27.0
44.0
mW
11.4
21.6
mW
22.0
38.5
mW
PIN CONFIGURATION
DUB PACKAGE
SOP-8
(TOP VIEW)
VDD1
VDD2
VINP
VOUTP
VINN
VOUTN
GND1
GND2
PIN DESCRIPTIONS
PIN NAME
PIN NO
FUNCTION
GND1
Power
DESCRIPTION
GND2
Power
VDD1
Power
VDD2
Power
VINN
Analog input
VINP
Analog input
VOUTN
Analog output
VOUTP
Analog output
AMC1100
ZHCS847 APRIL 2012
www.ti.com.cn
TYPICAL CHARACTERISTICS
At VDD1 = VDD2 = 5 V, VINP = 250 mV to +250 mV, and VINN = 0 V, unless otherwise noted.
INPUT OFFSET
vs HIGH-SIDE SUPPLY VOLTAGE
INPUT OFFSET
vs LOW-SIDE SUPPLY VOLTAGE
1.5
1.5
1
Input Offset (mV)
0.5
0
0.5
0.5
0
0.5
1.5
1.5
2
4.5
4.75
5
VDD1 (V)
5.25
2
2.7
5.5
3.3
3.6
VDD2 (V)
Figure 1.
Figure 2.
INPUT OFFSET
vs LOW-SIDE SUPPLY VOLTAGE
INPUT OFFSET
vs TEMPERATURE
2
1.5
0.5
0
0.5
0
0.5
1
1.5
1.5
4.75
5
VDD2 (V)
5.25
2
40 25 10
5.5
20 35 50 65
Temperature (C)
Figure 3.
Figure 4.
INPUT CURRENT
vs INPUT VOLTAGE
130
40
120
30
110
20
100
90
80
30
Figure 5.
110 125
10
60
100
95
20
1
10
Input Frequency (kHz)
80
10
70
50
0.1
0.5
2
4.5
CMRR (dB)
1.5
40
400
300
200
100
0
100
Input Voltage (mV)
200
300
400
Figure 6.
AMC1100
www.ti.com.cn
GAIN ERROR
vs HIGH-SIDE SUPPLY VOLTAGE
120
1
0.8
0.6
0.4
100
110
90
80
0.2
0
0.2
0.4
0.6
70
0.8
60
40 25 10
20 35 50 65
Temperature (C)
80
95
1
4.5
110 125
5.25
Figure 8.
GAIN ERROR
vs LOW-SIDE SUPPLY VOLTAGE
GAIN ERROR
vs LOW-SIDE SUPPLY VOLTAGE
0.6
0.4
0.4
0.2
0
0.2
0.2
0
0.2
0.4
0.4
0.6
0.6
0.8
0.8
1
2.7
3.3
0.8
0.6
1
4.5
3.6
VDD2 (V)
4.75
5
VDD2 (V)
Figure 9.
Figure 10.
GAIN ERROR
vs TEMPERATURE
NORMALIZED GAIN
vs INPUT FREQUENCY
5.25
5.5
10
0
0.6
10
0.8
0.4
0.2
0
0.2
0.4
20
30
40
50
0.6
60
0.8
70
1
40 25 10
5.5
1
VDD2 = 2.7 V to 3.6 V
5
VDD1 (V)
Figure 7.
0.8
4.75
20 35 50 65
Temperature (C)
Figure 11.
80
95
110 125
80
10
100
Input Frequency (kHz)
500
Figure 12.
AMC1100
ZHCS847 APRIL 2012
www.ti.com.cn
OUTPUT VOLTAGE
vs INPUT VOLTAGE
30
4.5
60
VOUTP
VOUTN
4
Output Voltage (V)
Output Phase ()
90
120
150
180
210
240
3.5
3
2.5
2
1.5
270
1
300
0.5
330
360
10
100
Input Frequency (kHz)
0
400
1000
200
100
0
100
Input Voltage (mV)
200
Figure 13.
Figure 14.
OUTPUT VOLTAGE
vs INPUT VOLTAGE
NONLINEARITY
vs HIGH-SIDE SUPPLY VOLTAGE
3.6
3.3
300
300
400
0.1
VDD2 = 2.7 V to 3.6 V
VOUTP
VOUTN
0.08
0.06
2.4
Nonlinearity (%)
2.7
2.1
1.8
1.5
1.2
0.04
0.02
0
0.02
0.04
0.9
0.06
0.6
0.08
0.3
0
400
300
200
100
0
100
Input Voltage (mV)
200
300
0.1
4.5
400
NONLINEARITY
vs LOW-SIDE SUPPLY VOLTAGE
NONLINEARITY
vs LOW-SIDE SUPPLY VOLTAGE
5.5
0.1
VDD2 = 2.7 V to 3.6 V
0.06
0.06
0.04
0.04
0.02
0
0.02
0.04
0.02
0
0.02
0.04
0.06
0.06
0.08
0.08
3
3.3
3.6
0.08
Nonlinearity (%)
Nonlinearity (%)
5.25
Figure 16.
0.1
5
VDD1 (V)
Figure 15.
0.08
0.1
2.7
4.75
0.1
4.5
VDD2 (V)
4.75
5
VDD2 (V)
Figure 17.
Figure 18.
5.25
5.5
AMC1100
www.ti.com.cn
NONLINEARITY
vs TEMPERATURE
0.1
0.1
VDD2 = 3 V
VDD2 = 5 V
0.06
0.06
0.04
0.04
0.02
0
0.02
0.04
0.02
0
0.02
0.04
0.06
0.06
0.08
0.08
0.1
250 200 150 100 50
0
50 100
Input Voltage (mV)
150
200
0.1
40 25 10
250
20 35 50 65
Temperature (C)
80
95
Figure 19.
Figure 20.
2600
100
2400
90
2200
80
2000
70
PSRR (dB)
Noise (nV/sqrt(Hz))
0.08
Nonlinearity (%)
Nonlinearity (%)
0.08
1800
1600
1400
50
40
30
1000
20
800
10
1
10
100
VDD1
VDD2
60
1200
600
0.1
110 125
Frequency (kHz)
10
Ripple Frequency (kHz)
Figure 21.
Figure 22.
FULL-SCALE
STEP RESPONSE
100
10
9
8
500 mV/div
7
6
5
4
200 mV/div
3
2
500 mV/div
1
0
40 25 10
20 35 50 65
Temperature (C)
Figure 23.
80
95
110 125
Time (2 ms/div)
Figure 24.
AMC1100
ZHCS847 APRIL 2012
www.ti.com.cn
8
Signal Delay (s)
7
6
5
4
3
2
1
0
40 25 10
20 35 50 65
Temperature (C)
80
95
VDD2 rising
VDD2 falling
50% to 10%
50% to 50%
50% to 90%
0
3.5
110 125
3.7
3.8
3.9
4
4.1
VDD2 (V)
4.2
Figure 25.
Figure 26.
SUPPLY CURRENT
vs SUPPLY VOLTAGE
4.3
4.4
4.5
8
VDD2 = 2.7 V to 3.6 V
VDD2 = 4.5 V to 5.5 V
3.6
IDD1
IDD2
7
Supply Current (mA)
6
5
4
3
2
1
1
0
40 25 10
20 35 50 65
Temperature (C)
80
95
0
4.5
110 125
4.75
5
Supply Voltage (V)
Figure 27.
Figure 28.
SUPPLY CURRENT
vs TEMPERATURE
5.25
5.5
IDD2 (mA)
5
4
3
2
1
0
2.7
4
3
2
1
3.3
VDD2 (V)
Figure 29.
10
3.6
0
40 25 10
IDD1
IDD2
5
20 35 50 65
Temperature (C)
80
95
110 125
Figure 30.
AMC1100
www.ti.com.cn
THEORY OF OPERATION
INTRODUCTION
The differential analog input of the AMC1100 is a switched-capacitor circuit based on a second-order modulator
stage that digitizes the input signal into a 1-bit output stream. The device compares the differential input signal
(VIN = VINP VINN) against the internal reference of 2.5 V using internal capacitors that are continuously
charged and discharged with a typical frequency of 10 MHz. With the S1 switches closed, CIND charges to the
voltage difference across VINP and VINN. For the discharge phase, both S1 switches open first and then both
S2 switches close. CIND discharges to approximately AGND + 0.8 V during this phase. Figure 31 shows the
simplified equivalent input circuitry.
VDD1
GND1
GND1
CINP = 3 pF
3 pF
400 W
VINP
S1
S2
AGND + 0.8 V
Equivalent
Circuit
VINP
CIND = 3.6 pF
S1
400 W
VINN
RIN = 28 kW
S2
VINN
AGND + 0.8 V
3 pF
CINN = 3 pF
GND1
GND1
RIN =
1
fCLK CDIFF
GND1
(fCLK = 10 MHz)
11
AMC1100
ZHCS847 APRIL 2012
www.ti.com.cn
APPLICATION INFORMATION
CURRENT MEASUREMENT
A typical operation of the AMC1100 is a current-measurement application, as shown in Figure 32. Measurement
of the current through the phase of a power line is done via the shunt resistor RSHUNT (in this case, a two-terminal
shunt). For better performance, the differential signal is filtered using RC filters (components R2, R3, and C2).
Optionally, C3 and C4 can be used to reduce charge dumping from the inputs. In this case, care should be taken
when choosing the quality of these capacitors; mismatch in values of these capacitors leads to a common-mode
error at the modulator input.
Isolation
Barrier
Phase
TMC320
C/F28xxx
R1
Device
1
C1
0.1 mF
R2
12 W
RSHUNT
R3
12 W
C2(1)
330 pF
C3
10 pF
(optional)
(1)
VDD1
VDD2
14
(1)
VINP
VOUTP
13
C5(1)
0.1 mF R
C
3
C4
10 pF
(optional)
VINN VOUTN
GND1
GND2
11
ADC
12
AMC1100
www.ti.com.cn
As shown in Figure 33, it is recommended to place the bypass and filter capacitors as close as possible to the AMC1100 to ensure best performance.
Top View
12 W
SMD 0603
To Shunt
12 W
SMD 0603
330 pF
SMD
0603
LEGEND
Top layer; copper pour and traces
VDD1
VDD2
VINP
VOUTP
0.1 mF
SMD
1206
0.1mF
0.1 mF
SMD
1206
Device
VINN
VOUTN
GND1
GND2
To Filter or ADC
SMD
1206
Clearance area.
Keep free of any
conductive materials.
High-side area
Controller-side area
Via
13
AMC1100
ZHCS847 APRIL 2012
www.ti.com.cn
VOLTAGE MEASUREMENT
The AMC1100 can also be used for isolated voltage measurement applications, as shown in a simplified way in
Figure 34. In such applications, usually a resistor divider (R1 and R2 in Figure 34) is used to match the relatively
small input voltage range of the AMC1100. R2 and the AMC1100 input resistance (RIN) also create a resistance
divider that results in additional gain error. With the assumption that R1 and RIN have a considerably higher value
than R2, the resulting total gain error can be estimated using Equation 1:
R
GERRTOT = GERR + 2
RIN
Where GERR = device gain error.
(1)
L1
R1
R2
RIN
L2
14
AMC1100
www.ti.com.cn
ISOLATION GLOSSARY
Creepage Distance: The shortest path between two conductive input-to-output leads measured along the
surface of the insulation. The shortest distance path is found around the end of the package body.
Clearance: The shortest distance between two conductive input-to-output leads measured through air (line of
sight).
Input-to-Output Barrier Capacitance: The total capacitance between all input terminals connected together,
and all output terminals connected together.
Input-to-Output Barrier Resistance: The total resistance between all input terminals connected together, and
all output terminals connected together.
Primary Circuit: An internal circuit directly connected to an external supply mains or other equivalent source that
supplies the primary circuit electric power.
Secondary Circuit: A circuit with no direct connection to primary power that derives its power from a separate
isolated source.
Comparative Tracking Index (CTI): CTI is an index used for electrical insulating materials. It is defined as the
numerical value of the voltage that causes failure by tracking during standard testing. Tracking is the process that
produces a partially conducting path of localized deterioration on or through the surface of an insulating material
as a result of the action of electric discharges on or close to an insulation surface. The higher CTI value of the
insulating material, the smaller the minimum creepage distance.
Generally, insulation breakdown occurs either through the material, over its surface, or both. Surface failure may
arise from flashover or from the progressive insulation surface degradation by small localized sparks. Such
sparks result from a surface film of a conducting contaminant breaking on the insulation. The resulting break in
the leakage current produces an overvoltage at the site of the discontinuity, and an electric spark is generated.
These sparks often cause carbonization on insulation material and lead to a carbon track between points of
different potential. This process is known as tracking.
Insulation:
Operational insulationInsulation needed for correct equipment operation.
Basic insulationInsulation to provide basic protection against electric shock.
Supplementary insulationIndependent insulation applied in addition to basic insulation in order to ensure
protection against electric shock in the event of a failure of the basic insulation.
Double insulationInsulation comprising both basic and supplementary insulation.
Reinforced insulationA single insulation system that provides a degree of protection against electric shock
equivalent to double insulation.
15
AMC1100
ZHCS847 APRIL 2012
www.ti.com.cn
Pollution Degree:
Pollution Degree 1No pollution, or only dry, nonconductive pollution occurs. The pollution has no influence on
device performance.
Pollution Degree 2Normally, only nonconductive pollution occurs. However, a temporary conductivity caused
by condensation is to be expected.
Pollution Degree 3Conductive pollution, or dry nonconductive pollution that becomes conductive because of
condensation, occurs. Condensation is to be expected.
Pollution Degree 4Continuous conductivity occurs as a result of conductive dust, rain, or other wet conditions.
Installation Category:
Overvoltage CategoryThis section is directed at insulation coordination by identifying the transient overvoltages
that may occur, and by assigning four different levels as indicated in IEC 60664.
1. Signal Level: Special equipment or parts of equipment.
2. Local Level: Portable equipment, etc.
3. Distribution Level: Fixed installation.
4. Primary Supply Level: Overhead lines, cable systems.
Each category should be subject to smaller transients than the previous category.
16
www.ti.com
11-Apr-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Eco Plan
Lead/Ball Finish
(2)
Op Temp (C)
Top-Side Markings
(3)
(4)
AMC1100DUB
ACTIVE
SOP
DUB
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 125
AMC1100
AMC1100DUBR
ACTIVE
SOP
DUB
350
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 125
AMC1100
(1)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
Samples
(TI) JESD46 ,
JESD48 ,
TI
TI TI TI TI
TI TI
TI TI TI TI
TI TI
TI
TI TI
TI
TI TI TI
TI
TI TI
TI
TI
TI TI
TI ISO/TS16949 ISO/TS16949
TI
www.ti.com.cn/audio
www.ti.com.cn/telecom
www.ti.com.cn/amplifiers
www.ti.com.cn/computer
www.ti.com.cn/dataconverters
www.ti.com/consumer-apps
DLP
www.dlp.com
www.ti.com/energy
DSP -
www.ti.com.cn/dsp
www.ti.com.cn/industrial
www.ti.com.cn/clockandtimers
www.ti.com.cn/medical
www.ti.com.cn/interface
www.ti.com.cn/security
www.ti.com.cn/logic
www.ti.com.cn/automotive
www.ti.com.cn/power
www.ti.com.cn/video
(MCU)
www.ti.com.cn/microcontrollers
RFID
www.ti.com.cn/rfidsys
OMAP
www.ti.com/omap
www.ti.com.cn/wirelessconnectivity
www.deyisupport.com
IMPORTANT NOTICE
1568 32 200122
Copyright 2013