Internal Use Only

Service Manual

LGUN270

Date: June , 2011 / Issue 1.0

UN270

CDMA Mobile Subscriber Unit

UN270

SERVICE MANUAL

TRIPLE BAND, TRIPLE MODE

[PCS/GPS/CELLULAR]
CDMA MOBILE PHONE

LG Electronics Inc.

Features of UN270
1. Wave Type
x CELLULAR : G7W
x PCS : G7W
2. Frequency Scope

Transmit Frequency (MHz)

Receive Frequency (MHz)

CELLULAR

PCS

CELLULAR

PCS

GPS

824.82 ~ 848.19

1850~1910

869.82~893.19

1930~1990

1575.42

3. Rated Output Power :

CELLULAR = 0.282W / PCS = 0.282W

4. Output Conversion Method : This is possible by correcting the key board channel.
5. Voltage and Current Value of Termination Part Amplifier (Catalogue included)

MODE

Part Name

Voltage

Current

Power

CELLULAR

ACPM-7354

4.2V

600mA

0.282W

PCS

ACPM-7354

4.2V

600mA

0.282W

6. Functions of Major Semi-Conductors

Classification
QSC6055

Function
Terminal operation control and digital signal processing
Converts RF signal to baseband signal
Converts baseband signal to RF signal

MCP (H8BCS0SIBAR-46M)

NAND (2Gbit) + DDR (1Gbit)

Storing of terminal operation program

7. Frequency Stability
x CELLULAR : 0.5PPM
x PCS : 0.1PPM

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UN270

Table of Contents
General Introduction ...................................... 2
Chapter 1. System Introduction ..................... 3
1. System Introduction.................................... 3
1.1 CDMA Abstract ................................... 3
2. Features and Advantages of CDMA
Mobile Phone...............................................5
2.1 Various Types of Diversities ................ 5
2.2 Power Control ...................................... 5
2.3 Voice Encoder and Variable Data
Speed
..........................................................6
2.4 Protecting Call Confidentiality ............. 6
2.5 Soft Handoff ........................................ 6
2.6 Frequency Re-Use and Sector
Segmentation
...............................................6
2.7 Soft Capacity ....................................... 7
3. Structure and Functions of tri-band
CDMA Mobile Phone
.......................................8
4. Specification .............................................. 9
4.1 General Specification .......................... 9
4.1.1 Transmit/Receive Frequency
Interval
....................................................9
4.1.2 Number of Channels (Channel
Bandwidth)
...............................................9
4.1.3 Operating Voltage.........................9
4.1.4 Battery Power Consumption ........9
4.1.5 Operating Temperature ................9
4.1.6 Frequency Stability .......................9
4.1.7 Antenna ........................................9
4.1.8 Size and Weight ...........................9
4.1.9 Channel Spacing ..........................9
4.1.10 Battery Type, Capacity and
Orerating.........................................10
Time
4.2 Receive Specification ........................ 10
4.2.1 Frequency Range .......................10
4.2.2 Local Oscillating Frequency
Range
................................ ...................10
4.2.3 Sensitivity
........................................10
4.2.4 Selectivity ...................................10
4.2.5 Interference Rejection ................10
4.2.6 Spurious Wave Suppression ......10
4.2.7 CDMA Input Signal Range .........11
4.3 Transmit Specification ....................... 11
4.3.1 Frequency Range .......................11
4.3.2 Local Oscillating Frequency
Range
....................................................11
4.3.3 Intermediate Frequency ..............11
4.3.4 Output Power ..............................11
4.3.5 CDMA TX Frequency Deviation...11
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4.3.6 CDMA TX Conducted Spurious

Emissions ................................
...............11
4.3.7 CDMA Minimum TX Power
Control
................................ ............... ...11
4.4 MS (Mobile Station) Transmitter
Frequency ..........................................12
4.4.1 CELLULAR mode ...................... 12
4.4.2 PCS mode ................................. 12
4.5 MS (Mobile Station) Receiver
Frequency ..........................................13
4.5.1 CELLULAR mode ...................... 13
4.5.2 PCS mode ................................. 13
4.5.3 GPS mode : 1575.42MHz .......... 13
4.5.4 Bluetooth mode : 2400MHz ~
2483.5MHz ......................................... 13
4.6 AC Adaptor ........................................ 14
4.7 Cigar Lighter Charger ........................ 14
4.8 Hands-Free Kit .................................. 14
5. Installation ................................................ 14
5.1 Installing a Battery Pack .................... 14
5.2 For Adapter Use ................................ 14
5.3 For Mobile Mount .............................. 14
5.3.1 Installation Position
........................... 14
5.3.2 Cradle Installation ...................... 14
5.3.3 Interface Box .............................. 15
5.3.4. Microphone Installation ............. 15
5.3.5 Cable Connections .................... 15
Chapter 2. Circuit Description ...................... 16
1. RF Transmit/Receive Part......................... 16
1.1 Overview ........................................... 16
1.2 Description of Rx Part Circuit ............ 16
1.2.1 Quadplexer (U102) .................... 16
1.2.2 LNAs (U2101) ............................ 18
1.2.3 GPS LNA (U1007) ..................... 20
1.2.4 Down-converter Mixers (U2101). 20
1.2.5 Rx RF SAW Filters
(FL1004/FL1008) ......................... 20
1.2.6 RF Receiver (U2101).................. 20
1.3 Description of Transmit Part Circuit ... 21
1.3.1 RF Transmitter (U2101) ............. 21
1.3.2 Dual Power Amplifier (U1000) ... 23
1.4 Description of Frequency
Synthesizer Circuit ............................ 24
1.4.1 Voltage Control Temperature
Compensation Crystal Oscillator .. 24
2. Digital/Voice Processing Part ................... 24
2.1 Overview ........................................... 24
2.2 Configuration ..................................... 24
2.2.1 Keypad/LED and Receptacle Part 24

UN270
2.2.2 Voice Processing Part ......................24
2.2.3 QSC6055 Part ..................................24
2.2.4 Memory Part ....................................24
2.2.5 Power Supply Part ...........................25
2.3 Circuit Description ............................. 25
2.3.1 Keypad/LCD and Receptacle Part ...25
2.3.2 Audio Processing Part .....................25
2.3.3 MODEM Part ..................................25
2.3.4 Memory Part ....................................26
2.3.5 Power Supply Part ...........................26
2.3.6 Logic Part ........................................26

Chapter 3. Trouble Shooting ................ 28

1. Rx Part Trouble ................................ 28

1.1 DCN & PCS Rx Trouble .................... 28

1.1.1 Checking DC Power Supply
Circuit ................................ ........... 29
1.1.2 Checking Rx Signal Path .................30
1.1.3 Checking VCTCXO Circuit.............32

2. Tx Part Trouble ................................ 34

2.1 DCN & PCS Tx Trouble..................... 34

2.1.1 Checking DC Power Supply
Circuit ................................ ........... 34
2.1.2 Checking VCTCXO Circuit.............35
2.1.3 Checking Tx SAW Filter IN/OUT ...38
2.1.4 Checking Tx Dual PAM ..................39
2.1.5 Checking Quadplexer and Mobile
Switch .......................................... 41

3. Bluetooth Trouble ............................. 42

4. Power ............................................... 44

4.1 Power On Trouble ............................. 44

4.2 Charging Trouble ............................... 47

5. Logic Part Trouble ............................ 49

5.1 LCD Trouble ...................................... 49

5.2. Camera Trouble ............................... 52
5.3 Audio Trouble .................................... 55
5.3.1 Speaker Trouble ..............................55
5.3.2 MIC Trouble ....................................57
5.3.3 Receiver Trouble .............................59

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5.3.4 Ear-Jack Trouble ............................ 60

5.4 Vibrator & Touch Trouble .................. 63
5.5 USB Trouble ...................................... 66
5.6 Disassembly Guide for Hidden
Screw .............................................. 78

Safety ................................................... 68
Glossary ............................................. 71
Appendix............................................... 84
1. Block Diagram .................................. 84
2. Circuit Drawing ................................. 85

2.1 Main PCB .......................................... 85

2.2 KEY-PCB........................................... 85
2.3 MAIN F-PCB...................................... 85

3. BGA Pin Map .................................... 94

3.1 EUSY0336202 (QSC6055) : 424

CSP (Bottom View) ............................ 94
3.2 EUSY0347506
(H8BCS0SI0BAR-46M) : 149 FBGA
(Top View) ........................................ 95
3.3 EUSY0418701
(BCM2070B2KUBXG) : 42-bump
WLBGA (Top View) ........................... 96
3.4 EUSY0403901 (WM9093ECS-R) :
20-bump CSP (Top View) ....................... 97

4. PCB Layout ...................................... 98

4.1 Main PCB .......................................... 98

4.1.1 Top Side ......................................... 98
4.1.2 Bottom Side .................................... 99

5. Exploded Diagram ........................... 100

5.1 Full Exploded View .......................... 100

5.2 Assy Full Exploded View .................. 101
5.3 Seviceable Part ............................... 102

6. Part Lists .......................................... 103

6.1 Main PCB Top ................................... 103

6.2 Main PCB Bottom .............................. 104
6.3 Full BOM List ..................................... 124

UN270

General Introduction
The UN270 phone has been designed to operate on the latest digital mobile communication technology, Code Division
Multiple A ccess (CDMA ). This CDMA dig ital techn ology h as g reatly enh anced voice clarity and can provide a
variety of advanced features. Currently, CDMA m obile co mmunication techn ology h as been co mmercially u sed in
Cellular and P ersonal Com munication Serv ice (P CS). T he di fference betw een them is the operating frequency
spectrum. Cellular uses 800MHz and PCS uses 1.9GHz. T he UN270 support GPS Mode, we usually call it tri -band
phone. We call it tri-mode ph one. If on e of th e Cellu lar and P CS base station s is located n earby, Call f ail rate of
triple-mode phone is less than dual-mode phone or single-mode phone.
The CDMA technology adopts DSSS (Direct Sequence Spread Spectru m). This feature of DSSS enab les the phone
to keep communication from being crossed and to u se one frequency channel by multiple users in the same specific
area, resu lting th at it in creases th e capacity 10 tim es m ore co mpared w ith th at in the analog mode currently used.
Soft/Softer Handoff, Hard Handof f, an d Dy namic RF pow er Con trol techn ologies are co mbined in to th is ph one to
reduce the call being interrupted in a middle of talking over the phone.
Cellular and PCS CDMA network consists of MSO (Mobile Switching Office), BSC (Base Station Controller), BTS
(Base station Transmission System), and MS (Mo bile Station ).

The f ollowing tab le lis ts som e m ajor CDMA

Standards.

CDMA Standard

Designator

Description

Basic air interface

TIA/EIA/IS-95-A/B/C

Protocol between MS and BTS for Cellular & AMPS

ANSI J-STD-008

Protocol between MS and BTS for PCS

Network T

Service T

Performance T

IA/EIA/IS-634

MAS-BS

TIA/EIA/IS/651

PCSC-RS

TIA/EIA/IS-41-C

Intersystem operations

TIA/EIA/IS-124

Nom-signaling data comm.

IA/EIA/IS-96-B

Speech CODEC

TIA/EIA/IS-99

Assign data and fax

TIA/EIA/IS-637

Short message service

TIA/EIA/IS-657

Packet data

IA/EIA/IS-97

Cellular base station

TIA/EIA/IS-98

Cellular mobile station

ANSI J-STD-018

PCS personal station

ANSI J-STD-019

PCS base station

TIA/EIA/IS-125

Speech CODEC

* TSB 74: Protocol between an IS-95A system and ANSI J-STD-008

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Chapter 1. System Introduction

1. System Introduction
1.1 CDMA Abstract
The CDMA mobile communication system has a channel hand-off function that is used for collecting the information
on the locations and m ovements of mobile telephones from the cell site by automatically controlling several cell site
through the setup o f d ata transm ission ro utes, and then enabling one switching system to carry out the automatic
remote ad justment. T his is to m aintain co ntinuously the call state thro ugh the auto matic location confirmation and
automatic radio channel conversion when the busy subscriber moves from the ser vice area of one cell site to th at of
another by using automatic location confirmation and automatic radio channel conversion functions. The call state can
be maintained continuously by the information exchange between switching systems when the busy subscriber moves
from one cellular system area to the other cellular system area.
In th e cellu lar sy stem, th e cell site is a sm all-sized low output type and utilizes a frequency allocation system that
considers mutual interference, in an ef fort to enab le the r e-use of corresponding frequency from a cell site sep arated
more than a certain distance. The analog cellular systems are classified further into an AMPS system, E-AMPS System,
NMT system, ETACS system, and JTACS system depending on technologies used.
Unlike th e tim e div ision m ultiple access (T DMA) or f requency div ision m ultiple access (FDMA ) u sed in th e band
limited environment, the Code Division Multiple Access (CDMA) system which is one of digital cellular systems is a
multi-access techn ology u nder th e interference lim ited env ironment. It can process m ore n umber of su bscribers
compared to oth er systems (T DMA system has the processing capacity three times greater than the existing FDMA
system whereas CDMA system, about 12~15 times of that of the existing system).
CDMA system can be explained as follows; TDMA or CDMA can be used to enable each person to talk alternately or
provide a sep arate room for each person when two persons desire to talk with each oth er at th e same time, whereas
FDMA can be used to enable one person to talk in soprano, whereas the other in bass (one of the two talkers can carry
out synchronization for hearing in case there is a bandpass filter function in the area of the hearer). Another available
method is to make two persons to sing in different languages at the same time, space, and f requency when wishing to
let the audience hear the singing without being confused. This is the characteristic of CDMA.
On th e oth er h and, w hen em ploying th e CDMA technology, each signal has a different pseudo-random binary
sequence used to spread the spectrum of carrier. A great number of CDMA signals share the same frequency spectrum.
In the perspective of frequency area or time area, several CDMA signals are overlapped. Among these types of signals,
only desired signal energy is selected and received through the use of pre-determined binary sequence; desired signals
can be separated, and then received with the correlator used for recovering the spectrum into its original state. At this
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time, the spectrums of other signals that have different codes are n ot recovered into its original state , and ap pears as
the self-interference of the system.

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2. Features and Advantages of CDMA Mobile Phone

2.1 Various Types of Diversities
When employing the narrow band modulation (30kHz band ) th at is th e sam e as th e analog FM m odulation sy stem
used in the existing cellular system, the multi-paths of radio waves create a serious fading. However, in the CDMA
broadband modulation (1.25 MHz band), th ree ty pes of div ersities ( time, f requency, and space) are u sed to red uce
serious fading problems generated from radio channels in order to obtain high-quality calls.
Time d iversity ca n b e o btained thro ugh the use of code inter leaving and error correction code whereas frequency
diversity can be obtained by spreading signal energy to wider frequency band. The fading related to normal frequency
can affect th e n ormal 200~300k Hz am ong s ignal ban ds an d ac cordingly, s erious effect can be av oided. Mo reover,
space diversity (also called path diversity) can be realized with the following three types of methods.
First, it can be obtained by the d uplication of cell site rec eive antenna. Second, it can b e obtained through the use o f
multi-signal processing device th at receives a transm it signal having each different transmission delay time and then,
combines them. T hird, it can b e o btained thro ugh the m ultiple cell site co nnection (Soft Handoff) that connects the
mobile station with more than two cell sites at the same time.

2.2 Power Control

The CDMA system utilizes the forward (from a base station to mobile stations) and backward (from the mobile station
to the base station) power control in order to increase the call processing capacity and obtain high-quality calls. In case
the originating signals of mobile stations are receiv ed by th e cell site in th e m inimum call qu ality lev el (sig nal to
interference) thro ugh the use o f transm it p ower co ntrol on all the mobile s tations, the sy stem cap acity can b e
maximized. If th e sig nal pow er of m obile station is receiv ed too stron g, th e perf ormance of th at m obile station is
improved. However, because of this, the interference on other mobile stations using the same channel is increased and
accordingly, the call quality of other subscribers is reduced unless the maximum accommodation capacity is reduced.
In th e CDMA sy stem, f orward pow er con trol, back ward open loop pow er con trol, and closed loop pow er con trol
methods are used. The forward power control is carried out in th e cell site to red uce th e transmit p ower on mobile
stations less affected by the multi-path fading and shadow phenomenon and the interference of other cell sites when
the mobile station is n ot engaged in the call or is relativ ely nearer to th e corresponding cell site. This is also used to
provide additional power to mobile station s h aving h igh call error rates, located in bad recep tion areas or f ar away
from the cell site.
The backward open loop pow er control is carried ou t in a co rresponding mobile station; the mobile station measures
power receiv ed f rom th e cell site and

then, reversely in creases/decreases transm it power in order to compensate

channel changes caused by the forward link path loss and terrain characteristics in relation to the mobile station in the
cell site. By doing so, all the mobile transmit signals received by the base station have same strength.
Moreover, the backward closed loop pow er control used by the mobile station is performed to control power using
the commands issued out by the cell site. T he cell site rec eives t he signal of each corresponding mobile station and
compares th is w ith th e pre -set th reshold v alue and th en, issu es ou t pow er increase/decrease commands to the
corresponding mobile station every 1.25msec (800 times per second). By doing so, the gain tolerance and the different
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radio propagation loss on the forward/backward link are complemented.

2.3 Voice Encoder and Variable Data Speed

The bi- directional v oice serv ice h aving v ariable data speed prov ides v oice co mmunication w hich employs voice
encoder algorithm having power variable data rate between the base station and the mobile station. On the other hand,
the transmit voice encoder performs voice sampling and then, creates enco ded v oice pack ets to be sent ou t to th e
receive voice encoder, whereas the receive voice encoder demodulates the received voice packets into voice samples.
One of the two voice encoders described in the above is selected for use depending on inputted automatic conditions
and message/data; both of them utilize four-stage frames of 9600, 4800, 2400, an d 1200 bits per second for cellular
and 14400,7200,3600,1800 bits per s econd f or P CS, s o P CS prov ide relatively better voice quality (almost twice
better th an th e existin g cellular sy stem). In ad dition, th is ty pe of v ariable v oice e ncoder u tilizes ad aptive threshold
values on selecting required data rate. It is ad justed in accordance with the size of background noise and the data rate
is increased to high rate only when the voice of caller is inputted.
Therefore, back ground n oise i s su ppressed and h igh-quality v oice transm ission is possible under the environment
experiencing serious noise. In addition, in case th e caller does n ot talk, data transm ission rate is red uced so th at the
transmission is carried out in low energy. T his will red uce the interference on other CDMA signals and as a result,
improve system performance (capacity increased by about two times).

2.4 Protecting Call Confidentiality

Voice privacy is provided in the CDMA system by means of the private long code mask used for PN spreading. Voice
privacy can be ap plied on th e traf fic chann els on ly. A ll calls are in itiated u sing th e pu blic lon g co de m ask f or PN
spreading. The mobile station user may request voice privacy during call setup using the origination message or page
response message, and during traffic channel operation using the long code transition request order.
The T ransition to priv ate lon g co de m ask w ill n ot be performed if authentication is not performed. To initiate a
transition to the private or pu blic lo ng co de m ask, eith er th e base station or th e m obile station sends a lon g co de
transition request order on the traffic channel.

2.5 Soft Handoff

A h andoff in w hich th e m obile station co mmences co mmunications w ith a n ew base station w ithout interrupting
communications with the old base station . Soft handoff can only be used between CDMA channels having identical
freqeuncy assignments.

2.6 Frequency Re-Use and Sector Segmentation

Unlike the existing analog cellular system, the CDMA system can reuse the same frequency at the adjacent cell. there
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is no need to prep are a sep arate frequency plan. Total interference generated on mobile station signals received from
the cell site is th e su m of in terference g enerated f rom ot her mobile stations in the same cell site and interference
generated f rom th e mobile station of ad jacent cell site. T hat is, each m obile station sig nal g enerates in terference in
relation to the signals of all the other mobile stations.
Total in terference f rom all th e ad jacent cell sites is

the ratio of in terference f rom all th e cell sites v ersus total

interference from other mobile stations in the same cell site (ab out 65%). In the case of directional cell site, one cell
normally uses a 120sector antenna in order to div ide the sector into three. In this case, each antenna is used only for
1/3 of mobile stations in the cell site and acco rdingly, interference is red uced by 1/3 on the average and th e capacity
that can be supported by the entire system is increased by three times.

2.7 Soft Capacity

The subscriber capacity of the CDMA system is flexible depending on the relation between the number of users and
service classes. For exam ple, th e system operato r can in crease the number of channels available for use during the
busy hour despite the drop in call qu ality. This type of function requires 40% of normal call channels in the standby
mode during the handoff, in an effort to avoid call disconnection resulting from the lack of channels.
In addition, in the CDMA system, services and service charges are classified further into different classes so that more
transmit power can be allocated to high class service users for easier call set -up; they can also be given higher priority
of using hand-off function than the general users.

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3. S tructure and Functions of tri-band CDMA

Phone

Mobile

The hardware structure of CDMA mobile phone is made up of radio frequency (RF) part and logic part. The RF part
is co mposed of Receiv er part (Rx ), T ransmitter part (T x) and L ocal part (L O). For the purpose of operating on
tri-band, It is n ecessary du al T x path , tri Rx path , du al P LL and switching system for band selection. The mobile
phone antenna is connected with quadplexer which div ides anten na in put/output sig nals between cellu lar f requency
band (824~894 MHz) and PCS frequency band (1850~1990MHz). Quadplexer carries out separating Rx band and Tx
band. The Rx signals from the antenna are directly converted into baseband signal by the frequency synthesizer and
frequency down converter. And then, are converted into digital signals v ia A nalog-to-Digital Con verter (A DC). In
front of the ADC, switching system is required to choose which band path should be open. The digital signals send to
5 correlators in each CDMA de-modulator. Of these, one is called a searcher whereas the remaining 4 are called data
receivers (fingers). Digitalized signals include a g reat number of call sig nals that have been sent out by the adjacent
cells. T hese sig nals are detected w ith pseudo -noise seq uence (P N Sequ ence). Sig nal to in terference ratio (C/I) on
signals that match the d esired PN sequence are increased through this type of correlation detection process, but other
signals obtain processing gain by not increasing the ratio. The carrier wave of pilot chann el f rom th e cell site m ost
adjacently located is demodulated in order to obtain the sequence of encoded data symbols. During the operation with
one cell site, th e searcher searches ou t multi-paths in accordance with terrain and bu ilding reflections. On three data
receivers, the most powerful 3 paths are allocated f or th e parallel tracin g and re ceiving. Fadin g resis tance can be
improved a great deal by obtaining the diversity combined output for de -modulation. Moreover, the searcher can be
used to determ ine the most powerful path f rom the cell sites even during the soft handoff between the two cell sites.
Moreover, 3 data receiv ers are allocated in order to carry out the de -modulation of these paths. Output data th at has
been demodulated changes the data string in the combined data row as in the case of original signals(deinterleaving),
and then, are demodulated by the forward error correction decoder which uses the Viterbi algorithm.
Mobile statio n user inf ormation sen d o ut f rom the m obile statio n to the cell site pass through the digital voice
encoder via a mike. Then, they are encoded and forward errors are corrected through the use of convolution encoder.
Then, the order of code rows is chang ed in accordance with a certain regulation in order to rem ove any errors in the
interleaver. Symbols made through the above p rocess ar e sp read after b eing load ed o nto P N ca rrier waves. A t this
time, PN sequence is selected by each address designated in each call.
Signals that have been code spread as above are digital modulated (QPSK) and then, power controlled at the automatic
gain control amplifier (AGC Amp). Then, they are converted into RF band by the frequency synthesizer synchronizing
these signals to proper output frequencies.
Transmit signals obtained pass through the quadplexer filter and then, are sent out to the cell site via the antenna.

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4. Specification
4.1 General Specification
4.1.1 Transmit/Receive Frequency Interval
1) CELLULAR : 45 MHz
2) PCS : 80 MHz

4.1.2 Number of Channels (Channel Bandwidth)

1) CELLULAR : 20 Channels
2) PCS : 48 Channels

4.1.3 Operating Voltage

DC 3.3~4.2V

4.1.4 Battery Power Consumption

DC 3.7V
SLEEP

IDLE

MAX POWER

CELLULAR

1.0mA

80~90mA

550 mA (24.5 dBm)

PCS

1.0 mA

80~90mA

600 mA (24.5 dBm)

4.1.5 Operating Temperature

-20qC ~ +50qC

4.1.6 Frequency Stability

1) CDMA : 0.5PPM
2) PCS : 0.1PPM

4.1.7 Antenna
Fixed Type (Internal Antenna),

50

4.1.8 Size and Weight

1) Size : W x H x D : 103 x 52 x 16.6mm
2) Weight : 120.8g

4.1.9 Channel Spacing

1) CELLULAR : 1.25MHz
2) PCS: 1.25 MHz

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4.1.10 Battery Type, Capacity and Orerating Time

Unit = Hours, Minutes
Standard (1000mAh)
PCS(Slot Cycle 2)

About 500 Hrs (SCI=2)

Cellular (Slot Cycle 2)

About 500 Hrs (SCI=2)

Stand-by Time
PCS(Slot Cycle 2)

About 360 Min.(typical Quadplexer, -92dBm Input)

Cellular (Slot Cycle 2)

About 350 Min.(typical Quadplexer, -92dBm Input)

Talk Time

4.2 Receive Specification

4.2.1 Frequency Range
1) CELLULAR : 869.820 MHz ~ 893.190 MHz
2) PCS : 1930 MHz ~ 1990 MHz
3) GPS : 1575.42 MHz

4.2.2 Local Oscillating Frequency Range

1) CELLULAR : 1738.08MHz ~ 1787.94MHz
2) PCS : 1715.56MHz a 1768.89MHz
3) GPS : 3150.84MHz

4.2.3 Sensitivity
1) CELLULAR : -104dBm (C/N 12dB or more)
2) PCS : -104dBm (C/N 12dB or more)
3) GPS : -148.5dBm

4.2.4 Selectivity
1) CELLULAR : 3dB C/N Degration (With Fch1.25 kHz : -30dBm)
2) PCS : 3dB C/N Degration (With Fch1.25 kHz : -30dBm)

4.2.5 Interference Rejection

1) Single Tone : -30dBm at 900 kHz (CELLULAR), -30dBm at 1.25MHz(PCS)
2) Two Tone

: -43dBm at 900 kHz & 1700kHz(CELLULAR), -43dBm at 1.25 MHz & 2.05 MHz

4.2.6 Spurious Wave Suppression

M aximum of - 80dB

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4.2.7 CDMA Input Signal Range

z Dynamic area of more than -104~ -25 dB: 79dB at the 1.23MHz band.

4.3 Transmit Specification

4.3.1 Frequency Range
1) CELLULAR : 824.820MHz ~ 848.190MHz
2) PCS : 1850 MHz ~ 1910 MHz

4.3.2 Local Oscillating Frequency Range

1) CELLULAR : 1738.08MHz ~ 1787.94MHz
2) PCS : 1715.56MHz ~1768.89MHz

4.3.3 Intermediate Frequency

Direct Conversion

4.3.4 Output Power

1) CELLULAR : 0.282W
2) PCS: 0.282W

4.3.5 CDMA TX Frequency Deviation

1) CELLULAR: +300Hz or less
2) PCS: 150Hz

4.3.6 CDMA TX Conducted Spurious Emissions

1) CELLULAR :

900kHz : - 42 dBc/30kHz below

1.98MHz : - 54 dBc/30kHz below

2) PCS

-42 dBc / 30KHz below

4.3.7 CDMA Minimum TX Power Control

1) CELLULAR : - 50dBm below
2) PCS: - 50dBm below

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4.4 MS (Mobile Station) Transmitter Frequency

4.4.1 CELLULAR mode
Ch #

Center Freq. (MHz)

Ch #

Center Freq. (MHz)

1011

824.640

404

837.120

29

825.870

445

838.350

70

827.100

486

839.580

111

828.330

527

840.810

152

829.560

568

842.040

193

830.790

609

843.270

234

832.020

650

844.500

275

833.250

697

845.910

316

834.480

738

847.140

363

835.890

779

848.370

4.4.2 PCS mode

12

Ch #

Center Freq (MHz)

Ch #

Center Freq (MHz)

Ch #

Center Freq (MHz)

25

1851.25

425

1871.25

825

1891.25

50

1852.50

450

1872.50

850

1892.50

75

1853.75

475

1873.75

875

1893.75

100

1855.00

500

1875.00

900

1895.00

125

1856.25

525

1876.25

925

1896.25

150

1857.50

550

1877.50

950

1897.50

175

1858.75

575

1878.75

975

1898.75

200

1860.00

600

1880.00

1000

1900.00

225

1861.25

625

1881.25

1025

1901.25

250

1862.50

650

1882.50

1050

1902.50

275

1863.75

675

1883.75

1075

1903.75

300

1865.00

700

1885.00

1100

1905.00

325

1866.25

725

1886.25

1125

1906.25

350

1867.50

750

1887.50

1150

1907.50

375

1868.75

775

1888.75

1175

1908.75

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4.5 MS (Mobile Station) Receiver Frequency

4.5.1 CELLULAR mode
Ch. #

Center Freq. (MHz)

Ch. #

Center Freq. (MHz)

1011

869.640

404

882.120

29

870.870

445

883.350

70

872.100

486

884.580

111

873.330

527

885.810

152

874.560

568

887.040

193

875.790

609

888.270

234

877.020

650

889.500

275

878.250

697

890.910

316

879.480

738

892.140

363

880.890

779

893.370

4.5.2 PCS mode

Ch #

Center Freq (MHz)

Ch #

Center Freq (MHz)

Ch #

Center Freq (MHz)

25

1931.25

425

1951.25

825

1971.25

50

1932.50

450

1952.50

850

1972.50

75

1933.75

475

1953.75

875

1973.75

100

1935.00

500

1955.00

900

1975.00

125

1936.25

525

1956.25

925

1976.25

150

1937.50

550

1957.50

950

1977.50

175

1938.75

575

1958.75

975

1978.75

200

1940.00

600

1960.00

1000

1980.00

225

1941.25

625

1961.25

1025

1981.25

250

1942.50

650

1962.50

1050

1982.50

275

1943.75

675

1963.75

1075

1983.75

300

1945.00

700

1965.00

1100

1985.00

325

1946.25

725

1966.25

1125

1986.25

350

1947.50

750

1967.50

1150

1987.50

375

1948.75

775

1968.75

1175

1988.75

4.5.3 GPS mode : 1575.42MHz

4.5.4 Bluetooth mode : 2400MHz ~ 2483.5MHz
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4.6 AC Adaptor
See Appendix

4.7 Cigar Lighter Charger

See Appendix

4.8 Hands-Free Kit

See Appendix

5. Installation
5.1 Installing a Battery Pack
1) The Battery pack is keyed so it can only fit one way. Align the groove in the battery pack with the rail
on the back of the phone until the battery pack rests flush with the back of the phone.
2) Slide the battery pack forward until you hear a click, which locks the battery in place.

5.2 For Adapter Use

1) Plug the adapter into a wall outlet. The adapter can be operated from a 110V source.
When AC power is connected to the adapter.
2) Insert the adapter jack into the phone with the installed battery pack.
Red light indicates battery is being charged.. Green light indicates battery is fully charged.

5.3 For Mobile Mount

5.3.1 Installation Position
In order to red uce ech o sou nd when u sing th e Hands -Free Kit, m ake su re th at th e speak er and microphone are not
facing each other and keep microphone a generous distance from the speaker.

5.3.2 Cradle Installation

Choose an appropriate flat surface where the unit will not interface with drivers movement or passengers co mfort.
The driver/user should be ab le to access th e phone with ease. Using the four self-tapping screws provided, mount the
supplied bra cket on th e selected area. T hen w ith th e f our m achine screw s prov ided, m ount th e co unterpart on the
reverse side of the reverse side of the cradle. Secure the two brackets firmly together by using the two bracket joint
screws provide.
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The distance between the cradle and the interface box must not exceed the length of the main cable.

5.3.3 Interface Box

Choose an ap propriate flat surface ( somewhere under the dash on the passenger side is pref erred ) and m ount the IB
bracket with the four self-tapping screws provided. Clip the IB into the IB bracket.

5.3.4. Microphone Installation

Install the microphone either by clipping I onto the sun visor (drivers side) or by attaching it to door pos t (drivers
side), using a Velcro adhesive tape (not included).

5.3.5 Cable Connections

5.3.5.1 Power and Ignition Cables
Connect the red wire to the car battery positive terminal and the black wire to the car ground. Connect the green wire
to the car ignition sensor terminal. ( In order to operate HFK please make sure to connect green wire to ignition sensor
terminal.) Connect the kits power cable connector to the interface box power receptacle.

5.3.5.2 Antenna Cable Connection

Connect the antenna coupler cable co nnector f rom th e crad le to th e extern al anten na co nnector. ( A ntenna is n ot
included.)

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Chapter 2. Circuit Description

1. RF Transmit/Receive Part
1.1 Overview
The Tx and Rx part employs the Direct Conversion system. The Tx and Rx frequencies are respectively
824.04~848.97MHz and 869.04~893.97MHz for cellular and 1850~1910MHz and 1930~1990MHz for PCS. The
block diagram is shown in [Figure 1-1]. RF signals received through the antenna are seperated by quadplexer.
RF Signal fed into the low noise amplifier (in QSC6055) through the quadplexer. Then, they are combined with the
signals of local oscillator (VCO) at the down conversion mixer(in QSC6055) in order to create Base-band frequency.
Then, this signal is changed into digital signal by the analog to digital converter (ADC, A/D Converter), and the digital
circuit part of the QSC(Qualcomm Single Chip)6055 processes the data from ADC. The digital processing part is a
demodulator.
In the case of transmission, RF Transmitter(in QSC6055) receives QPSK-modulated anlog signal from the QSC6055.
In QSC6055, the baseband quadrature signals are upconverted to the Cellular or PCS frequency bands and amplified
to provide signal drive capability to the power amp.
After that, the RF signal is amplified by the Power Amp in order to have enough power for radiation.
Finally, the RF signal is sent out to the cell site via the antenna after going through the coupler and quadplexer.
[Figure 1-1] Block Diagram Of

1.2.1 Quadplexer (U102)

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The ACFM-7107 is a quadplexer that combines a US PCS duplexer, a cellular band duplexer and a S-GPS
band filter into a single, miniature package with a single antenna port.
The main function of quadplexer

is to prohibit the other band signals from flowing into the

one band circuit and vice versa. RF designer can use common tri-band antenna regardless of frequency band
(800, 1575 and 1900 MHz).

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1.2.2 LNAs (U2101)

The QSC6055 has cellular and PCS LNAs, respectively.

The characteristics of Low Noise Amplifier (LNA) are low

noise figure, high gain, high intercept point and high reverse isolation.
The frequency selectivity characteristic of mobile phone is mostly determined by LNA.
The specification of UN270 LNAs are described below:

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1.2.2.1 Cellular CDMA LNA performance specifications

1.2.2.2 PCS CDMA LNA performance specifications

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1.2.3 GPS LNA (U1007)

The characteristics of L ow No ise A mplifier (L NA) are low n oise f igure, h igh g ain, h igh intercept point and high
reverse isolation. The frequency selectivity characteristic of mobile phone is mostly determined by LNA.
The specification of UN270 GPS LNA is described below

1.2.4 Down-converter Mixers (U2101)

The QSC6055 device performs signal down-conversion for Cellular, PCS and GPS tri-band applications. It contains
all th e circu itry (w ith th e ex ception of ex ternal f ilters) needed to support conversion of received RF signals to
baseband signals. The three downconverting Mixers (Cellular, PCS and GP S), and an LO Buffer Amplifier to buffer
the RF VCO to the RF T ransmit Upco nverter. T he G PS L NA & m ixers of fer th e m ost ad vanced and in tegrated
CDMA Rx solution designed to meet cascaded Noise Figure (NF) and Third-order Intercept Point (IIP3) requirements
of IS-98C and J-STD-018 specifications for Sensitivity, Two-Tone Intermodulation, and Single-tone Desense.
Operation modes and band selection are specially controlled from the Qualcomm Single Chip QSC6055.

1.2.5 Rx RF SAW Filters (FL1004/FL1008)

The main function of Rx RF SAW filter is to attenuate mobile phone spurious frequency, attenuate direct RF
Frequency pick up, attenuate noise at the image frequency originating in or amplified by the LNA and suppress
second harmonic originating in the LNA. The Rx RF SAW filter usually called image filter.

1.2.6 RF Receiver (U2101)

The circu it f unctions of th e R F R eceiver(in QSC 6055) in clude R x A utomatic Gain C ontroller (A GC) with 90 dB
dynamic range, quadrature RF mixers, down-conversion mixer from RF to base -band, low pass filters and A nalog to
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Digital Converters (ADC) for converting to digital base-band. The RFR includes clock generators that drive the digital
processor and a VCO which generates the LO frequency for base-band down-conversion.
Switching system is located in front of the RFR RX_IN_C_LB and RX_IN_C_HB terminal and is for band selection
between cellular and PCS. T he Rx A GC eith er am plifies or attenu ates the received CDMA RF sig nal to prov ide a
constant-amplitude signal to the I/Q down-converter. The RF output of the Rx AGC amplifier separate into I-channel
and Q-channel base-band components and down-converted by mixer with quadrature LO. LO signals are generated by
a Voltage Controlled Oscillator (VCO) and f requency stabilized by external varactor-tuned resonant tank circuit. T he
I/Q down converter outputs the CDMA signals at baseband frequency. Low-pass filtering enables the receiver to select
the desired baseband sig nals f rom the ef fects of u nwanted n oise or ad jacent-channel in terference. I/Q base band
components are converted to digital signals by two identical 4-bit ADCs.

1.3 Description of Transmit Part Circuit

1.3.1 RF Transmitter (U2101)
The RF Transmitter(in QSC6055, base-band-to-RF Transmit Processor) performs all Tx signal-processing functions
required between dig ital base -band and th e P ower Amplifier Module (P AM). T he b ase-band qu adrature sig nals are
up-converted to the Cellular or PCS frequency bands and amplified to provide signal drive capability to the PAM. The
RFT in cludes an RF m ixer f or u pconverting analog baseba nd to RF, a prog rammable PLL for generating Tx LO
frequency, two cellular and two PCS driver amplifiers and Tx power control through an 85 dB VGA. As added benefit,
the single sideband upconversion eliminates the need for a band pass filter normally required between the upconverter
and driver amplifier.
I, I/, Q an d Q/ s ignals proceed from the QSC6055 are an alog signal. In CDMA mode, These signals are modulated
by Quadrature Phase Shift King (QPSK). I and Q are 90 deg . out of phase, and I and I/ are 180 deg . Tx IF signal can
be obtain ed by m ixing an alog s ignal w ith 228.6 MHz(Cellular)/263.6(PCS) 1 st local osillator f requency w hich is
generated by T x VC O. T he T x IF s ignal is amplified by AGC con trolled by QSC6055. The second mixer on RFT
converts I F signals into RF signals . After p assing thr ough the upconverter , RF signal is inputted into the Power
Amplifier Module.
1.3.1.1 Cellular CDMA transmit signal path performance specifications

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1.3.1.2 PCS CDMA transmit signal path performance specifications

1.3.2 Dual Power Amplifier (U1000)

The power amplifier that can be u sed in th e PCS and CDMA m ode h as lin ear am plification capab ility and h igh
efficiency. For higher efficiency, it is made up of one MMIC (Monolithic Microwave Integrated Circuit) for which RF
input ter minal and in ternal inter face cir cuit ar e in tegrated o nto o ne IC after going thro ugh the AlGaAs/GaAs HBT
(heterojunction bipolar transistor) process. The module of pow er am plifier is m ade u p of an ou tput end in terface
circuit in cluding th is MMIC. T he m aximum power th at can be in putted t hrough th e in put term inal is +1 0dBm and
conversion gain is about 28dB. RF transmit signals that have been am plified through the power amplifier are sent to
the quadplexer.

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1.4 Description of Frequency Synthesizer Circuit

1.4.1 Voltage Control Temperature Compensation Crystal Oscillator
(VCTCXO, X2201)
The temperature variation of mobile phone can be compensated by TCXO. The reference frequency of a mobile phone
is -30~+85 qC. The receives frequency tuning signals called T RK_LO_ADJ from QSC6055 as 0.5V~2.5V DC via R
and C filter in order to g enerate th e ref erence f requency of 19. 2MHz and in put it in to th e f requency synthesizer of
UHF band. Frequency stability depending on temperature is 2.0 ppm.

2. Digital/Voice Processing Part

2.1 Overview
The digital/voice processing part processes th e u ser's co mmands and processes all th

e dig ital and v oice sig nal

processing in order to operate in the phone. The digital/voice processing part is made up of a keypad/LCD, receptacle
part, voice processing part, modem part, memory part, and power supply part.

2.2 Configuration
2.2.1 Keypad/LED and Receptacle Part
This is used to transmit k eypad sig nals to QSC6055. It is m ade u p of a k eypad back light part th at illu minates th e
keypad, LCD part that displays the operation status onto the screen, and a receptacle that receives and sends out voice
and data with external sources.

2.2.2 Voice Processing Part

The voice processing part is m ade up of an audio co dec used to convert MIC signals into digital voice signals and
digital voice signals into analog voice signals, amplifying part for amplifying the voice signals and sending them to the
ear piece, amplifying part that amplifies ringer signals coming out from QSC6055, and amplifying part that amplifies
signals coming out from MIC and transferring them to the audio processor.

2.2.3 QSC6055 Part

QSC6055 (Qu alcomm Sin gle C hip) is th e core elem ents of C DMA terminal and carries out the functions of CPU,
encoder, interleaver, deinterleaver, Viterbi decoder, Mod/Demod, and vocoder.

2.2.4 Memory Part

The memory part is made up of a DDR/NAND memory.

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2.2.5 Power Supply Part

The pow er su pply part is m ade u p of circuits f or g enerating v arious ty pes of power, used for the digital/voice
processing part.

2.3 Circuit Description

2.3.1 Keypad/LCD and Receptacle Part
Once th e k eypad is press ed, th e k ey s ignals are s ent out to QSC6055 f or proces sing. In addition , w hen th e k ey is
pressed, the keypad lights up through the use of 7 LEDs. The terminal status and operation are displayed on the screen
for the user with the characters and icons on the LCD.
Moreover, it exchanges aud io signals an d data with external sources through the rec eptacle, and then receives power
from the battery or external batteries.

2.3.2 Audio Processing Part

MIC signals are in putted into the audio codec (included in QSC6055) and converted into digital signals. Oppositely,
digital audio signals are converted into analog signals after going through the audio codec. These signals are amplified
at the audio amplifier and transmitted to the ear-piece. The signals from QSC6055 activate the ringer by using signals
generated in the timer in QSC6055.

2.3.3 MODEM Part

QSC6055 is the core element of CDMA system terminal that includes ARM926 EJS microprocessor core. It supports
both CDMA and GPS, operating in both the cellular and PCS spectrums. The subsystems within the QSC6055 include
a CDMA processor , a m ulti-standard Voco der, an in tegrated CODEC w ith earpiece and microphone amplifiers,
general-purpose A DC f or su bsytem m onitoring, an ARM926 EJ S microprocessor, and both Universal Serial
Bus(USB) and an RS-232 serial interfaces supporting forward and reverse link data communications of 307.2 Kbps
simultaneously. And it also co ntains complete digital modulation and demodulation systems for CDMA standards, as
specified in IS-95-A/B/C.
In QSC, coded symbols are in terleaved in order to co pe with multi-path fading. Each data chann el is scrambled by
the lon g co de P N seq uence of th e u ser in order to ensu re th e co nfidentiality of calls. Moreover, binary quadrature
codes are used based on walsh functions in order to discern each channel. Data created thus are 4-phase modulated by
one pair of Pilot PN code and they are used to create I and Q data.
When received, I and Q data are dem odulated into symbols by the demodulator, and then de-interleaved in reverse to
the case of transmission. Then, the errors of data receiv ed from viterbi decoder are detected and corrected. They are
voice-decoded at the vocoder in order to output digital voice data..

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[Figure 2-2] Block Diagram of Digital/Voice Processing Part

2.3.4 Memory Part

MCP contents 1 Gbits N AND f lash m emory an d 512 M bits D DR S RAM. In th e F lash M emory part of M CP are
programs used f or ter minal o peration. T he p rograms ca n be changed thr ough d own lo ading after the assembling of
terminals. On the SDRAM data generated during the terminal operation are stored temporarily.

2.3.5 Power Supply Part

When the battery voltage (+4.0V) is fed and the PWR key of keypad is pressed, the power-up circuitry in PM (power
management) circuit(in QSC6055) is activated by the PWR_ON_SW/ signal, and then the LDO regulators embedded
in PM circuit are operated and +1.3V_MSMC, +2.6V_MSMP, +1.8V_MSME and +2.1V_MSMA are generated.
The Rx part (+2.1V_RFRX) and Tx part voltage (+2.1V_RFTX) are regulated by QSC6055

2.3.6 Logic Part

The log ic part con sists of in ternal C PU of QSC, R AM, MCP. The QSC6055 receives TCXO (= 19.2MHz) from
X2201 and controls the phone in both CDMA and GPS modes. The major components are as follows:
z

CPU

The ARM926 EJS microprocessor in cludes a 3 stag e pipelin ed RISC architectu re, both 32 -bit A RM and 16 -bit
THUMB instruction sets, a 32 -bit ad dress bu s, and a 32 -bit internal data bu s. It h as a h igh perf ormance and low
power consumption.
z

MCP

Flash ROM is u sed to store th e terminals program. Using the down-loading program, the program can be changed
even after the terminal is fully assembled.
SDRAM is used to store the internal flag information, call processing data, and timer data.

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External KEYPAD & Qwerty KEYPAD

For k ey recog nition, k ey m atrix is setu p u sing Key coder IC. 7 L EDs and backlight circuitry are included in the
keypad for easy operation in the dark.
z

TOUCH WINDOW

For key recognition, the touch controller MDR2 perf orms digital preprocessing of

the touch-screen measuements

by u sing T OUCH_X+, T OUCH_Y+, T OUCH_X- an d T OUCH_Y-. T ouch w indows also supports vibe-touch
function when pressing is recognized.
z

LCD MODULE

LCD module contains a controller which will display the information onto the LCD by 16-bit data from the QSC6055.

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Chapter 3. Trouble Shooting

1. Rx Part Trouble
1.1 DCN & PCS Rx Trouble
Test Point

[Figure 4-1-1] DCN & PCS Rx Part

Checking Flow

START
Check

PCS
DCN or PCS?

DCN
Rx TEST SETUP(HHP)

Rx TEST SETUP(HHP)

- Test Channel : DCN 384

- Test Channel : PCS 600

Check

Check
Rx TEST SETUP(HHP)
- Sector Power : -30 dBm

Redownload SW, CAL

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1.1.1 Checking DC Power Supply Circuit

QSC6055
TP1

+2.1V_RFRX1

VREG_RFRX1

C2157 0.1u

C2156 0.1u

C2155 1u

C2154 0.1u

C2153 1u

C2152 0.1u

C2151 0.1u

C2150 0.1u

C2149 0.1u

C2148 1u

C2147 1u

C2146 1u

C2144 1u

C2145 1u

C2143 1u

C2142 1u

C2141 1u

C2140 1u

C2139 2.2u

R21

R2113

+2.1V_RFRX1

TP2

R2114

+2.6V_BT
R2115

+1.3V_MPLL
+2.1V_MSMA
+1.8V_MSME

R2116

R2117

+1.8V_MSME
+2.6V_MSMP

R2118

+2.6V_MSMP
0

R2119

-1.8V_NCP
0

+2.25V_SMPS_RF
+2.1V_RFRX2

R2120

+2.1V_RFRX2
R2121

+2.1V_RFTX
+2.8V_LCD

R2122

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C2172 2.2u

C2171 4.7u

C2170 4.7u

C2169 2.2u

C2168 4.7u

C2167 2.2u

C2163 1u

+1.3V_MSMC

C2166 2.2u

C2165 2.2u

R2123

+2.8V_TCXO

C2164 2.2u

+2.8V_LCD
+2.8V_TCXO

UN270

1.1.2 Checking Rx Signal Path

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+-,&7<

)(('

$17

+-,&7<

)(('

$17

UN270

1. Check TP1 of U1002

If there is any major difference
with Graph 1-1-2-1
&

&

'1,

S

&

&

'1,

/
Q
'1,
6: 106

*

$

&

*

2. Check TP2(DCN Path)

And TP3(PCS Path) of U1002
If there is any major difference
with Graph 1-1-2-2

/

*1'

&
S

/
Q
$&)0

5

/

5


Q



6$)3 6$)3

8
&(//B5;

*B6/8*
$17

3&6B5;
&(//B7;
3&6B7;

/

/

'1,

'1,






&
'1,

Waveform

Graph 1-1-2-1

Graph 1-1-2-2

Graph 1-1-2-3 (a)

31

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1.1.3 Checking VCTCXO Circuit

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Internal Use Only

TP1 (+2.8V_TCXO)

5



9&217

*1'

9''

287




&

7&;2
Q

& X



S

5

.

& Q

9B7&;2

5

&

75.B/2B$'-

& Q

;
'6$6&$

TP2
(VCTCXO : 19.2Mhz)

Graph 1-1-3

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2. Tx Part Trouble
2.1 DCN & PCS Tx Trouble

2.1.1 Checking DC Power Supply Circuit

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TP1

K16
K18

+2.1V_RFTX

K21
K22
AB17

+VPWR

VDD_RFTX_3
VDD_RFTX_4
VDD_RFTX_5
VDD_RFTX_6
VDD_RFTX_7
VDD_RFTX_8
VDD_RFTX_9
VDD_SPKR
VREG_RFRX1

C2158 0.1u

TP2
+2.1V_RFRX1

R2113

+2.1V_RFRX1
R2114

V23

U22

REF_BYP

C2157 0.1u

C2156 0.1u

C2155 1u

C2154 0.1u

C2153 1u

C2151 0.1u

C2152 0.1u

C2149 0.1u

C2150 0.1u

C2148 1u

C2147 1u

C2145 1u

C2146 1u

C2144 1u

C2143 1u

C2142 1u

C2141 1u

C2140 1u

C2139 2.2u

R21

VDD_RFTX_2

VREG 5V

J23

AB18

J21

VDD_RFTX_1

REF_ISET

H22

REF_GND

H18

10

V22

R2111

R2112 121K

H16

+2.1V_RFTX

+2.6V_BT
R2115

+1.3V_MPLL
+2.1V_MSMA
+1.8V_MSME

R2116

R2117

+1.8V_MSME
+2.6V_MSMP

R2118

+2.6V_MSMP
0

R2119

-1.8V_NCP
0

2.25V_SMPS_RF
+2.1V_RFRX2

R2120

+2.1V_RFRX2

22.1.2
..11.2 C
Ch
Checking
hecking VCTCXO
VCTCXO Ci
Cir
Circuit
rcuit
it
R2121

+2.1V_RFTX
+2.8V_LCD

R2122

35

LG Electronics Inc.
35

C2175 4 7

C2174 10u

C2172 2.2u

C2173 1u

C2171 4.7u

C2169 2.2u

C2170 4.7u

C2168 4.7u

C2167 2.2u

C2166 2.2u

C2163 1u

+1.3V_MSMC

C2165 2.2u

R2123

+2.8V_TCXO

C2164 2.2u

+2.8V_LCD
+2.8V_TCXO

UN270

36

LG Electronics Inc.
36

UN270

Internal Use Only

TP1 (+2.8V_TCXO)

5



9&217

*1'

9''

287




&

7&;2
Q

& X



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5

.

& Q

9B7&;2

5

&

75.B/2B$'-

& Q

;
'6$6&$

TP2
(VCTCXO : 19.2Mhz)

37

LG Electronics Inc.
37

UN270

2.1.3 Checking Tx SAW Filter IN/OUT

38

LG Electronics Inc.
38

UN270

2.1.4 Checking Tx Dual PAM

39

LG Electronics Inc.
39

UN270

PCS TX
3$0B&3/B287
'&1B7;

/
Q

/
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/
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S

&

S

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&

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5)287B&(//

9&&

5)287B3&6

8
5),1B&(//
902'(

9&&

9(1B3&6

9(1B&(//

5),1B3&6

6$:(30)+)
287

287

*1'
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5
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&

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3$0B,1B/%

3$0B,1B3&6

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40

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/
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3&6B7;

3$0B,1B/%

3$0B,1B3&6

0+]
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LG Electronics Inc.

40

DCN TX

Internal Use Only

UN270

Internal Use Only

2.1.5 Checking Quadplexer and Mobile Switch

TP1,TP2
[Graph 2-1-5(a)]

TP4

TP3
TP3,TP4
[Graph 2-1-5(b)]

41

LG Electronics Inc.
41

TP2

TP1

UN270

Internal Use Only

3. Bluetooth Trouble

TP1
9B%7

TP2

&

&

&

Q

X

Q

&

S

Q

X

TP3

&

&

9B0603

9B0603

)% 

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&
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'1,

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;
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(
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TP5

)
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0+]

&

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S

&
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)

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%

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95(*

)

$

9''3;
(
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&

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567B1
%
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6&/
6'$

70

8
%&0%.8%;*

/32B,1

&
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63,0B&/.
63,0B&6B1

3&0B,1
(
3&0B287
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$
3&0B6<1&

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%7B8$57B5;'
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73

5 

%

+86%B'1
$
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TP6

TP8

&

TP4


9B0603

5

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5
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0

TP7

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&

&

.

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42

LG Electronics Inc.
42

UN270

43

LG Electronics Inc.
43

UN270

4. Power
4.1 Power On Trouble

TP3

TP6
TP4

TP1
TP8

TP5

TP7

TP2

44

LG Electronics Inc.
44

UN270

Circuit

Internal Use Only

9B5)5;

9B5)7;

9B5)7;

93:5

9B5)5;

9B03//

9B060$
9B060(

9B0603

9B1&3

9B6036B5)
9B5)5;

9B5)7;
9B/&'

9B7&;2

9B060&

9B5)5;

& X
5

& X



9B%7

9B060(

9B0603

9B5)5;

9B/&'

9B7&;2

& X

& X

& X

& X
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5

5

& X



5

5

5

& X

5

5

5

5

5

5

& X

& X

& X

& X

& X

& X
& X

& X

& X

& X

& X

& X

& X

& X

& X

& X

& X

& X

$$
$$
9
<
:
$$
$%
$%
:
$$
$%

45

LG Electronics Inc.
45

&%/B3:5B1
.3'B3:5B1
321B5(6(7B1
36B+2/'
63.5B287B0
63.5B287B3
86%B'0
86%B'3
86%B,'
9,%B'59B1
%$7B)(7B1B%$7B
&+*B&17B1
,616B0
,616B3
86%B9%86
9%$7
9&+*
9&2,1

9''B5)5;B

$$

;7$/B.B287

9''B5)5;B

$$

;7$/B.B,1

$

$$

;7$/B0B287

9''B5)5;B

9

;7$/B0B,1

%

9

;2B7+B*1'

&

:

;2B$'&B5()

9''B5)5;B

9

;2B$'&B,1

&

<

7&;2B287

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8
:

96:B5)

9''B5)5;B

;



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& S

7

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5

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3

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5

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7&;2

& S

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9''B5)5;B

9

95(*B58,0

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$&

95(*B5)7;

(

$&

95(*B5)5;

9''B5)7;B

7
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95(*B5)

9''B5)7;B

/

X

X
/

9
:

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)

7
$$

95(*B0603

+

7

9''B5)7;B

$&

95(*B060(

+

3

95(*B060$

9''B5)7;B

:

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+

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9''B5)7;B

$%

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-

9

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:

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.

5()B*1'

9

9''B5)7;B

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5()B%<3

9

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& X

5 .

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& X

& X

.

5

& X

$%

& X

& X

UN270

TP3
TP4
TP5
TP8
TP6
TP7

46

LG Electronics Inc.
46

UN270

4.2 Charging Trouble

TP4

TP3

TP2

TP5

TP1

CNC3001

Check 5.0V
(D3001) TP1

Check 5.0V
(R3006)

&1




8

5

9B0603

86%B'
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86%B'

='

9%86
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287

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9$

5



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+VPWR(C3020)

&2//(&725B%

&2//(&725

(0,77(5

6285&(
'5$,1



TP3

5

'5$,1B%
1&

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1&
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4

5

[Figure 4-3-8] Charging part

&
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73

73

TP4

)/

93:5
& X

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&

X

S

X

3URWHFW3RZHURII7XQQLQJ&DSB4:(57<&$6(

[Figure 4-3-9] Charging part

47

LG Electronics Inc.
47

UN270

TP1

TP2

TP3

TP4

TP4

48

LG Electronics Inc.
48

UN270

5. Logic Part Trouble

5.1 LCD Trouble

49

LG Electronics Inc.
49

UN270

Internal Use Only

&

X

5

93:5

CP_EN
(TP2)





TP1
&

&



X

&

&

&

,1

287

,1

%/

/('B%/B287
5


&



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%/



%/



%/B$8;


&3B(1

,&B6'$

CPI2C clock
(TP4)



%/B$8;
(1



/'2$

/'2%
6'$
/'2&

$8;0XVWXVHXQGHUP$&K
9B&$0B,29''

P$

9B&$0B$9''

P$

9B&$0B'9''

P$

9B728&+



(3

/'2'



5
.

3*1'

6&/

$*1'

,&B6&/

P$



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0$,1B/('
0$,1B/('
0$,1B/('
0$,1B/('
0$,1B/('
0$,1B/('



%/

8



%/

CPI2C data
(TP3)

0$,1B/('



%/

&

&

&

&

&

X

X

X

X

X

5
.
5

9B0603

.

[Figure 4-4-1-4] Charge Pump for Main LCD Back Light

LCD_DATA[0]~[3]
(TP12)

2.8V_LCD
(TP5)

TP6
LCD_DATA[4]~[7]
(TP13)

9B/&'

TP7

&

&

S

X
)/

,1287B$

,1287B%

,1287B$

,1287B%

,1287B$

,1287B%

,1287B$



*

,1287B%

(%,B'>@
(%,B'>@
(%,B'>@
(%,B'>@





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S)
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&1

TP8

*






















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73

(%,B2(

,1287B$

,1287B%

,1287B$

,1287B%

,1287B$

,1287B%

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0/&'B96<1&

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73

TP10

73

S)















0,&3
0,&B%,$6

73

6.3'B/('B(1
($51
($53

352;,B287
9B352;,
&

TP11

X

352;,B'B6'$
5

728&+B;
728&+B;
9B0603

,1287B$
,1287B$

,1287B%

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(%,B'>@
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(%,B'>@
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S)

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,1287B$





























































(%,B'>@
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S)
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3:5B21B6:
93:5
68%B52:

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,1287B$

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,1287B$

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,1287B$






(%,B'>@
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S)

68%B&2/
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5('B(1

.

9B0603

352;,B'B6&/
728&+B<
728&+B<
)2/'(5B&/26(

LCD_DATA[8]~[11]
(TP14)
[Figure 4-4-1-5] Main Connector LCD part Check Circuit

50

)/

9B060(



(%,B:(

,1287B$

*

0/&'B5(6(7

/('B%/B287
0$,1B/('
0$,1B/('
0$,1B/('
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TP9



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73

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)/

73

LG Electronics Inc.
50

5

9B0603

.

LCD_DATA[12]~[15]
(TP15)

UN270

51

LG Electronics Inc.
51

UN270

Internal Use Only

5.2. Camera Trouble

&

X

5

93:5





,1

TP1
TP2

&

&



X

&

&

&

287

/('B%/B287
5


&

CP_EN
(TP4)

,1

%/
%/

X

%/
%/

8

CPI2C data
(TP5) &3B(1

%/
%/
%/B$8;

,&B6'$

%/B$8;
(1

/'2$

/'2%
6'$
/'2&

(3

$*1'

3*1'



5
.

/'2'



CPI2C clock
(TP6)

6&/

,&B6&/



0$,1B/('



0$,1B/('
0$,1B/('
0$,1B/('
0$,1B/('
0$,1B/('
0$,1B/('
0$,1B/('









P$
P$

9B&$0B$9''

P$

9B&$0B'9''



P$

9B728&+

&

&

&

&

&

X

X

X

X

X

5

5
.

[Figure 4-4-2-2] Charge Pump Part for CAM power

52

$8;0XVWXVHXQGHUP$&K
9B&$0B,29''

.

9B0603

TP3

LG Electronics Inc.
52

UN270

Internal Use Only

73









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,1287B$

,1287B$

,1287B%

,1287B%

,1287B%

,1287B%

)/

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S)

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)/

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,1287B$

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'
'
'
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'

&

X

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&

6

3&/.
96<1&
+6<1&
67$1'%<
6&.
6'$
5(6(7%
0&/.















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)/

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&

5

S

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5

&

.

.
5

S

TP13

&

73 73

&
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5



5



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TP14
S

&$0B3&/.

&$0B96<1&
&$0B+6<1&
&$0B,&B6&/
&$0B,&B6'$

9B&$0B,29''

&$0B3:5B'2:1

&$0B5(6(7

&$0B0&/.

53

&$0B'$7$>@
&$0B'$7$>@
&$0B'$7$>@
&$0B'$7$>@

&$0B'$7$>@
&$0B'$7$>@
&$0B'$7$>@
&$0B'$7$>@

5

S)

5

73

5

X

(TP12)

(TP11)

*


*


CAM 12C data

(TP7)

*










3*1'
3*1'
3*1'
3*1'
3*1'
3*1'
3*1'
3*1'
'*1'
'*1'
'*1'
$*1'
$*1'
'9''
9'',2
$9''









*

*




*


PCLK
(TP10)

MCLK
(TP9)

9B&$0B'9''

9B&$0B$9''

9B&$0B,29''

&

LG Electronics Inc.

53

X

CAM 12C clock

(TP8)

CAM_DATA [0]~[3]
(TP15)
CAM_DATA [4]~[7]
(TP16)

UN270

54

LG Electronics Inc.
54

UN270

5.3 Audio Trouble

5.3.1 Speaker Trouble

HPH_OUT_L_P
(TP3)

L5002

82n

L5003

82n

SVDD

CN5001

SPK+
C5016 1u

SPK-

HPH_OUT_L_P
EMS1812TPB6

C5017 1u

HPH_OUT_R_N
VA5102

C2
C1

IN1IN1+

VA5103

D2
D1

SPK-(TP2)
HPH_OUT_L_P
(TP4)

55

D4

SPK+(TP1)

LG Electronics Inc.
55

D3
C3

IN2IN2+
IN3IN3+

IC6501
WM9093ECS-R

UN270

56

LG Electronics Inc.
56

UN270

5.3.2 MIC Trouble

[MIC]
MIC_BIAS (TP2, R104)

MIC100
SUMY0003816
OBM-410L44-RC1882

MIC_BIAS (TP1, R8015)

L100

R104

82n

R8015
2.2K

Close to QSC
USB_D+

HPH_OUT_L
HPH_OUT_R
MIC_BIAS
RED_EN
GREEN_EN
VIB_DRV/
USB_D+

MIC_BIAS
0

MIC1P
VA100
ICVL0505101V150FR

HPH_OUT_L_P
HPH_OUT_R_N
MIC_BIAS
RED_EN
GREEN_EN

CLOSE TO MIC

57

LG Electronics Inc.
57

UN270

58

LG Electronics Inc.
58

UN270

5.3.3 Receiver Trouble

EAR10 (TP1)

CN103
1

EAR10P

EAR10N

VA104

59

LG Electronics Inc.
59

VA105

UN270

Internal Use Only

5.3.4 Ear-Jack Trouble

PAD_EAR_SENSE (TP1)

EAR_SENSE (TP2)

J5100
JAM3333-F47-7F
1

EAR_MIC
HPH_L

4
5

6
ASSIST_PIN
3
M1-R
2
M6-GND

VA5101
ICVL0505101V150FR

PAD_EAR_SENSE/
HPH_R
VA5100
ICVL0505101V150FR

M5-MIC
M4-L
M3-DETECT

HPH_OUT_L/R (TR4)

HPH_L/R (TP3)

C6504 0.1u

D2
D1
D3
C3

1K

11
C5103 470p

R5104

1K
C5102 10u

R5103

9
10

MIC_BIAS_EN

8
7

VCC2

A0

VCC1

0B0

0B1
S0

A1
1B0

1B1

GND1

S1

GND2

15K

U5100
NLAS3158MNR2G

12

IN1IN1+
IN2IN2+

EAR_MIC (TP6)

EAR_MIC

5
3
6

5
VCC
GND

60

U5101
NCS2200SQ2T2G

LG Electronics Inc.
60

C5104 1u

EARPHONE_KEY (TP7)

VINVIN+

R5106 47K

4
3

D5100

1
OUT

R5105 560K

+2.6V_MSMP

EARPHONE_KEY

WM9

IN3IN3+

R5102

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5.4 Disassembly Guide for Hidden Screw

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Safety
IMPORTANT
Read This Information Before Using Your Hand-Held Portable
Cellular Telephone

First introduction in 1984, the hand-held portable cellular telephone is one of the most
exciting and innovative electronic products ever developed.
With it you can stay in contact with your office, your home, emergency service, and others. For the safe and efficient
operation of your phone, observe these guidelines.
Your cellular phone is a radio transmitter and receiver. When it is ON, it receiv es and also sends o ut radio frequency
(RF) energy. T he ph one operates in th e f requency ra nge of 824 MHz to 894 MHz an d em ploys com monly u sed
frequency modulation (FM) techniques. When you use your phone, the cellular system handling your calls controls the
power level at which your phone transmits. The power level can range from 0.006 of a watt to .6 of a watt.

Exposure to Radio Frequency Energy

In 1991 th e In stitute of Electrical and Electron ics En gineers (I EEE), and in 1992 th e American Nation al Stan dards
Institute (ANSI) updates the 1982 ANSI Standard for safety levels with respect to human exposure to RF energy. Over
120 scientists, engineers, and ph ysicians from universities, government health agencies, an d industry, after reviewing
the av ailable boy of research , deve loped th is u pdated S tandard. In March, 1993, the US Federal Communications
Commission (FCC) proposed the adoption of this updated Standard.
The desig n of y our ph one co mplies w ith th is u pdated S tandard. Of co urse, if y ou w ant to lim it RF exposu re even
further than the updated ANSI Standard, you may choose to control the duration of your calls and opration your phone
in the most power efficient manner.

Efficient Phone Operation

For your phone to operate at th e low est pow er lev el, co nsistent w ith satisf actory call qu ality, please observ e th e
following guidelines:
If y our ph one h as an exten dable anten na, exten d it fully. Some models allow you to place a call w ith th e anten na
retracted. However, your phone operates more efficiently with the antenna fully extended.
Hold the phone as you would any other telephone. While speaking directly into the mouthpiece, position the antenna
up and over your shoulder.
Do not hold th e antenn a w hen th e ph one is IN USE . Holdin g th e antenn a a ffects call qu ality and m ay cau se th e
phone to operated at a higher power level than needed.

Antenna Care and Replacement

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Do not use the phone with a damaged antenna. If a damaged antenna comes into contact with skin, a minor bum may
result. Replace a damaged antenna immediately. Consult your manual to see if you may change your antenna yourself.
If so, use only a manufacture approves antenna. Otherwise, take your phone to a qualifies service center for repair.
Use only the supplied or approv ed antenna. Non-approved antennas, modifications, or attach ments, could impair call
quality, damage the phone, and violate FCC egulations.

Driving
Check the laws and regulations on the use of cellular telephones in the areas where you drive. Always obey them. Also,
when using your phone while driving, please:
Give full attention to the driving. Use hands-free operation, if available, and pull off the road and park before making
or answering a call if driving conditions require .

Electronic Devices
Most modem electronic equipment is shielded f rom RF en ergy. How ever, RF ener gy f rom cellu lar telep hones m ay
affect inadequately shielded electronic equipment.
RF energy may effect improperly installed or inadequately shielded electronic operating and entertainment system in
motor vehicles. Check with the manufacturer or its representative to determine if these systems are adequately shielded
from external RF energ y. You sh ould check w ith th e m anufacturer of any eq uipment th at h as been ad ded to y our
vehicle.
Consult the manufacturer of any personal medical devices (such as pacemakers, hearing aids, etc.) to determine if they
are adequately shielded from external RF energy.
Turn y our ph one OFF in h ealth care f acilities. W hen any regu lations posted in the areas instruct y ou to do so.
Hospitals or health care facilities may be using equipment that could be sensitive to external RF energy.

Aircraft
Turn your phone OFF before boarding any aircraft.
Use it on the ground only with crew permission. Do not use it in the air.
To prevent possible interference with aircraft systems, US Federal Aviation Administration (FAA) regulations require
you to h ave permission from a crew member to u se your phone while the plane is on the ground. Using your phone
while the plane is in the air.

Children
Do not allow children to play with your phone. It is n ot a toy. Children could hurt themselves or oth ers (by poking
themselves or others in the eye with the antenna, for example). Children also co uld damage the phone, or m ake calls
that increase your telephone bills.

Blasting Areas
To avoid interfering with blasting operations, turn you unit OFF when in a blasting area or in areas posted Turn off
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two-way radio. Construction crews often use remote control RF devices to set off explosives.

Potentially Explosive Atmospheres

Turn y our ph one OFF w hen in any area w ith a potentially explosiv e atm osphere. It is rare, bu t your phone or
accessories could generate sparks. Sparks in such area cou ld cause an ex plosion or fire resulting in bodily injury or
even death.
Areas with a potentially explosive atmosphere are often, but n ot always, clearly marked. T hey include fueling areas
such as g as station; below deck on boats; f uel or chem ical tr ansfer or storage f acilities; areas w here the air co ntains
chemical or particles, such as grain, dust, or metal powders; and any other area where you would normally be advised
to turn off your vehicle engine.
Do not transport or store flammable gas, liquid, or explosives in the compartment of your vehicle which contains your
phone or accessories.
Vehicles using liquefied petroleum gas (such as propane or butane) must compl7y with the National Fire Protection
Standard (NFPA-58). For a copy of this standard, contact the National Fire Protection Association, One Battery march
Park, Quincy, MA 02269, Attn: Publication Sales Division.

Rule of Thumb: Using common sense at all times when handling, installing or using the
phone. Any questions should be directed to you nearest Service Center or authorized service
technician or electrician.

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Glossary
General Terms
Abbreviated Alert. An abbreviated alert is u sed to remind the mobile station user that previously selected alternative
routing features are still active.
AC. See Authentication Center.
Access Attempt. A sequence of o ne or m ore access probe seq uences on th e A ccess Ch annel co ntaining th e sam e
message. See also Access Probe and Access Probe Sequence.
Access Channel. A Reserv e CDMA Ch annel u sed by m obile station s f or communicating to the base station. The
Access Ch annel is u sed f or sh ort sig naling m essage exchang es su ch as call originations, responses to p ages, and
registrations. The Access Channel is a slotted random access channel.
Access Channel Message. The information part of an access probe con sisting of the message body, length field, and
CRC.
Access Channel Message Capsule. An Access Channel message plus the padding.
Access Channel Preamble. The preamble of an access probe consisting of a sequence of all-zero frames that is sent at
the 4800bps rate.
Access Channel Request Message. An Access Channel message that is autonomously generated by the mobile station.
See also Access Channel Response Message.
Access Channel Response Message. A m essage on th e A ccess Ch annel g enerated to rep ly to a m essage receiv ed
from the base station.
Access Channel Slot. The assigned time interval for an access probe. An Access Channel slot co nsists of an in teger
number of frames. The transmission of an access probe is performed within the boundaries of an Access Channel slot.
Access Probe. On e A ccess Ch annel transm ission co nsisting of a preamble and a m essage. T he transmission is an
integer number of frames in length and transmits one Access Channel message. See also Access Probe Sequence and
Access Attempt.
Access Probe Sequence. A sequence of one or more access probes on the Access Channel. The same Access Channel
message is transmitted in every access probe of an access attempt. See also Access Probe and Access Attempt.
Acknowledgement. A Layer 2 response by the mobile station or the base station confirming that a signaling message
was received correctly.
Action Time. The time at which the action implied by a message should take effect.
Active Set. The set of pilots associated with the CDMA Channels containing Forward Traffic Channels assigned to a
particular mobile station.
Aging. A mechanism through which the mobile station maintains in its Neighbor Set the pilots that have been recently
sent to it from the base station and the pilots whose handoff drop timers have recently expired.
A-key. A secret, 64 -bit pattern stored in the mobile station. It is u sed to generate update the mobile station s Shared
Secret Data. The A-key is used in the mobile station authentication process.
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Analog Access Channel. An analog control channel used by a mobile station to access a system to obtain service.
Analog Color-Code. An analog signal (see Supervisory Audio Tone) transmitted by a base station on an analog voice
channel and used to detect capture of a mobile station by an interfering base station or the capture of a base station by
an interfering mobile station.
Analog Control Channel. An analog chann el u sed f or th e transm ission of dig ital co ntrol information from a base
station to a mobile station or from a mobile station to a base station.
Analog Paging Channel. A forward analog control channel that is used to page mobile stations and send orders.
Analog Voice Channel. An analog channel on which a voice conversation occurs and on which brief digital messages
may be sent from a base station to a mobile station or from a mobile station to a base station.
Authentication. A procedure used by a base station to validate a mobile station s identity.
Authentication Center (AC). An entity that manages the authentication information related to the mobile station.
Authentication Response (AUTHR). An 18-bit ou tput of th e auth entication alg orithm. It is u sed, f or exam ple, to
validate mobile station registrations, origination and terminations. A method of registration in which the mobile station
registers without an explicit command from the base station.
AWGN. Additive White Gaussian Noise.
Bad Frames. Frames classified as erasures (frame category 10) or9600bps frames, primary traffic only with bit errors
(frame category 9). See also Good Frames.
Base Station. A station in th e Do mestic P ublic Cellu lar Rad io T elecommunications Serv ice, oth er th an a m obile
station, used for communicating with mobile stations. Depending upon the context, the term base station may refer to a
cell, a sector within a cell, an MSC, or other part of the cellular system. See also MSC.
Base Station Authentication Response (AUTHBS). A n 18 -bit pattern g enerated by t he auth entication alg orithm.
AUTHBS is used to confirm the validity of base station orders to update the Shared Secret Data.
Base Station Random Variable (RANDBS). A 32-bit random number g enerated by th e m obile station f or
authenticating base station orders to update the Shared Secret Data.
BCH Code. See Bose-Chaudhuri-Hocquenghem Code.
Busy-Idle Bits. The portion of the data stream transmitted by a base station on a forward analog control channel that
is used to indicate the current busy-idle status of the corresponding reverse analog control channel.
Call Disconnect. T he process that releases the resources handling a particu lar call. The disconnect process bein gs
either w hen th e m obile station u ser in dicates th e end of th e call by g enerating an on -hook con dition or other call
release mechanism, or when the base station initiates a release.
Call History Parameter(COUNT). A modulo-64 event counter maintained by the mobile station and Authentication
Center that us used for clone detection.
Candidate Set. The set of pilots th at h ave been receiv ed w ith su fficient streng th by th e m obile station to be
successfully dem odulated, bu t h ave n ot been pl aced in th e A ctive Set by the base station. See also Active Set.
Neighbor Set, and Remaining Set.
. See Code Division Multiple Access
CDMA Channel. The set of channels transmitted betw een th e base station w ithin a g iven CDMA f requency s
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assignment. See also Forward CDMA Channel and Reverse CDMA Channel.
CDMA Channel Number. An 11-bit number corresponding to the center of the CDMA frequency assignment.
CDMA Frequency Assignment.

A 1.23MHz segment of spectrum centered on one of the 30K Hz channels of the

existing analog system.

Code Channel. A subchannel of a Forward CDMA Channels. A Forward CDMA Channel contains 64 code channels.
Code channel zero is assigned to the P ilot Channel. Code channels 1 through 7 may be assigned to the either P aging
Channels or the Traffic Channels. Code Ch annel 32 m ay be assigned to eith er a Sy nc Channel or a T raffic Channel.
The remaining code channels may be assigned to Traffic Channels.
Code Division Multiple Access (CDMA).

A technique for spread-spectrum multiple-access digital communications

that creates channels through the use of unique code sequences.

Code Symbol.

The ou tput of an error -correcting enco der. In formation bits are in put to th e enco der and code

symbols are output from the encoder. See Convolutional Code.

Continuous Transmission.

A mode of operation in which Discontinuous Transmission is not permitted.

Control Mobile Attenuation Code(CMAC). A 3 -bit f ield in th e Con trol-Filler Message th at speci fies th e
maximum authorized power level for a mobile transmitting on an analog reverse control channels.
Convolution Code.

A ty pe of error -correcting co de. A code sy mbol can be con sidered as th e con volution of th e

input data sequence with the impulse response of a generator function.

CRC. See Cyclic Redundancy Code.
Cyclic Redundancy Code (CRC).

A class of lin ear error detectin g co des which g enerate parity check bits by

finding the remainder of a polynomial division.

Data Burst Randomizer.

The function that determines which power control groups within a f rame are transmitted

on the Reverse Traffic Channel when the data rate is lower than 9600 bps. The data burst randomizer determines, for
each m obile station , th e pseudo ran dom position of th e transm itted pow er co ntrol g roups in th e f rame while
guaranteeing that every modulation symbol is transmitted exactly once.
DBc. The ratio(in dB) of the sideband power of a signal, measured in a g iven bandwidth at a g iven frequency offset
from th e cen ter f requency of th e same sig nal, to th e to tal in band power of th e sig nal. For CDMA, the total inband
power of the signal is measured in a 1.23MHz bandwidth around the center frequency of the CDMA signal.
DBm.

A measure of power expressed in terms of its ration (in dB) to one milliwatt.

DBm/Hz.

A measure of power spectral density . DB m/Hz is the pow er in one Hertz of bandwidth. Where power is

expressed in units of dBm.

DBW.

A measure of power expressed in terns of its ration (in dB) to one Watt.

Dedicated Control Channel. An analog conrtol channel used for the transmisson of digital control information from
either a base station or a mobile station.
Deinterleaving.

The process of unpermuting the symbols that were permuted by the interleaver..

Deinterleavering is performed on reveived symbols prior to decoding.

Digital Color Code(DCC). A digital signal transmitted by a base station on a f orward analog control channel that is
used to detect capture of a base station by an interfering mobile station.
Dim-and-Burst.

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A m ode of operation in w hich a m obile station transm itter auton omously

Discontinuous Transmission (DTX).

switches between two transmitter power levels while the mobile station is in the conversation state on an analog voice
channel.
Distance-Based Registration.

An autonomous registration method in which the mobile station registers whenever it

enters a cell whose distance from the cell in which the mobile station last registered exceeds a given threshold.
See Dual Tone Multifrequency.

DTMF.

Dual-Tone Multifrequency(DTMF).

Signaling by the simultaneous transmission of two tones, one from a group of

low frequencies and another from a group of high frequencies. Each group of frequecies consists of four frequencies.
Eb.

The energy of an information bit.

Ec/I0.

The ratio in (dB) between the p ilot energy accumulated over one PN chip period(Ec) to th e power spectral

density in the received bandwidth(Io).

Effective Radiated Power (ERP).

The transmitted power multiplied by the antenna gain referenced to a h alf wave

dipole.
Electronic Serial Number(ESN).

A 32-bit number ass igned by th e m obile station m anufacturer, u niquely

identifying the mobile station equipment.

Encoder Tail Bits.

A fixed sequence of bits added to the end of a block of data to reset the convolutional encoder to

a known state.
ERP.

See Effective Radiated Power.

ESN. See Electronic Serial Number.

Extended Protocol.

An optional expansion of the signaling message between the base station and mobile station to

allow for the addition of new system features and operational capabilities.
Fade Timer. A timer kept by the mobile station as a measure of Forward Traffic Channel continuity. If the Fade timer
expires, the mobile station drops the call.
Flash. An indication sent on an analog voice channel or CDMA Traffic Channel indicating that the user Directed the
mobile station to invoke special processing.
Foreign NID Roamer. A mobile station operating in the same system (SID) but a dif ferent network (NID)Form the
one in which service was subscribed. See also Foreign SID Roamer and Roamer.
Foreign SID Roamer. A m obile station operatin g in a sy stem (SID) other th an th e on e f rom w hich serv ice was
subscribed. See also Foreign NID Roamer and Roamer.
Forward Analog Control Channel (FOCC). An analog voice channel used from a base station to a mobile station.
Forward

Analog Voice Channel (FVC). An analog voice channel used

from a base station to a mobile station.

Forward CDMA Channel. A CDMA Channel form a base station to mobile stations. The Forward CDMA Channel
contains one or more code channels that are transmitted on a CDMA frequency assignment using a Particular pilot PN
offset. The code channels are associated with the Pilot Channel, Sync Channel, Paging Channels, and Traffic Channels.
The Forward CDMA Channel always carries a P ilot Ch annel and m ay carry u p to on e Sy nc Ch annel, u p to seven
Paging Channels, and up to 63 Traffic Channels, as long as the total number of channels, including the Pilot Channel,
is no greater than 64.

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Forward Traffic Channel. A code chann el used to transport u ser and sig naling traffic from the base station to th e
mobile station.
A basic timing interval in the system. For th e Access Channel, Paging Channel, and T raffic Channel, a f rame is 20
ms long. For the Sync Channel, a frame is 26.666ms long.
Frame Category. A classification of a receiv ed Traffic Channel frame based u pon transmission data rate, th e Frame
contents (primary traffic, secondary traffic, or signaling traffic), and whether there are detected error in the frame.
Frame Offset. A tim e sk ewing of T raffic Ch annel f rames f rom Sy stem T ime in in teger m ultiples of 1.25 ms. The
maximum frame offset is 18..75 ms..
Frame Quality Indicator. The CRC check applied to 9600 bps and 4800 bps Traffic Channel frames.
Global Positioning System (GPS). A US government satellite system that provides location and time Information to
users. See Navstar GPS Space segment / Navigation User interfaces ICD-GPS-200 for Specifications.
Half Frame. A 10 ms interval on the paging Channel. Two half frames comprise a frame, the first half frame begins at
the same time as the frame.
Handoff. The of transferring communication whth a station mobile station from one base station to another.
Hard Handoff. A handoff characterized by a tem porary disconnection of the Traffic Channel. Hard handoffs Occur
when th e m obile station is transf erred between disj oint A ctive Sets, th e CDMA f requency ass ignment chang es, the
frame offset changes, or the mobile station is directed from a CDMA Traffic Channel to an analog voice channel, See
also Soft Handoff.
Hash Function. A function used by the mobile station to select on e out of N available resource. The hash function
distributes the available resources uniformly among a random sample of mobile stations.
HLR. See Home Location Register.
Home Location Register (HLR). T he location register to w hich a MIN is assigned f or record pu rposes su ch as
subscriber information.
Home System. The cellular system in which the mobile station subscribes for service.
Idle Handoff. The act of transferring recep tion of th e P aging Channel f rom on e bass station to anoth er, w hen th e
mobile station is in the Mobile Station Idle State.
Implicit Registration. A registrationachieved by a su ccessful transmission of an orig ination or page respon se on the
Access Channel.
Interleaving. The process of permuting a sequence of symbols.
kHz. Kilohertz (103 Hertz).
ksps. Kilo-symbols per second (103 symbols per second).
Layer 1. See Physical Layer.
Layer 2. Layer 2 provides for the correct transmission and reception of signaling messages, including partial duplicate
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detection. See also Layering and Layer 3.

Layer 3. Layer 3 provides the control of the cellular telephone systems. Signaling messages originate and terminate at
layer 3. See also Layering and Layer 2.

Local Control. An optional mobile station feature used to perform manufacturer-specific functions.
A PN sequence with period 242-1 that is u sed for scrambling on the Forward CDMA Channel and spreadin g on the
Reverse CDMA Channel. The long code uniquely identifies a mobile station on both the Reverse Traffic Channel and
the Forward Traffic Channel.

The long code provides limited privacy. The long code also separates multiple Access

Channels on the same CDMA channel. See also Public Long Code and Private Long Code.
Long Code Mask. A 42 -bit bin ary n umber th at creates th e u nique identity of th e lon g co de. See also P ublic L ong
Code, Private Long Code, Public Long Code Mask, and Private Long Code Mask.
LSB. Least significant bit.
Maximal Length Sequence (m-Sequence). A binary sequence of period 2n-1, n a positiv e integer, with no internal
periodicities. A maximal length sequence can be generated by a tapped n-bit shift register with linear feedback.
Mcps. Megachips per second (106 chips per second).
Mean Input Power. T he total receiv ed calorim etric pow er m easured in a specif ied bandw idth at th e anten na
connector, including all internal and external signal and noise sources.
Mean Output Power. The total transm itted calorim etric pow er m easured in a specif ied bandw idth at th e anten na
connector when the transmitter is active.
Message. A data structure that conveys control information or application information. A message consists of a length
field (MSG_LENGTH), a message body (the part conveying the information), and a CRC.
Message Body. The part of the message contained between the length field (MSG_LENGTH) and the CRC field.
Message Capsule. A sequence of bits co mprising a sin gle m essage and pad ding. T he pad ding alw ays f ollows th e
message and may be of zero length.
Message CRC. The CRC associated with a message. See also Cyclic Redundancy Check.
Message Field. A basic named element in a message. A message field may consist of zero or more bits.
Message Record. An entry in a message consisting of one or more field that repeats in the message.
MHz. Megahertz.(106 Herz)
MIN. See Mobile Station Identification Number.
Mobile Protocol Capability Indicator (MPCI). A 2-bit field used to indicate

m obile station s capabilities.

Mobile Station. A station in the Domestic Public Cellu lar Rad io T elecommunications Serv ice in tended to be u sed
while in motion or du ring halts at u nspecified points. Mobile station include portable units (e.g., handheld personal
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units) and units installed in vehicles.

Mobile Station Class. Mo bile station classes def ine m obile station ch aracteristics su ch as slotted operation

and

transmission power.
Mobile Station Identification Number (MIN). The 34 -bit n umber th at is a dig ital rep resentation of th e 10 -digit
directory telephone number assigned to a mobile station.
Mobile Station Originated Call. A call originating from a mobile station.
Mobile Station Terminated Call. A call received by a mobile station (not to be co nfused with a discon nect or call
release).
Mobile Switching Center (MSC). A configuration of equipment that provides cellular radiotelephone service. Also
called the Mobile Telephone Switching Office (MTSO)
Modulation Symbol. T he ou tput of th e data m odulator bef ore spread ing. On the Reverse Traffic Channel, 64-ary
orthogonal modulation is u sed an d s ix code s ymbol (when the data rate is 9600bps) or each repeated code symbol
(when the data rate is less than 9600bps) is one modulation symbol.
Ms. Millisecond.
MSB. Most significant bit.
MSC. See Mobile Switching Center.
Multiplex Option. The ability of the multiplex sublayer and lower layer to be tailored to prov ide special capabilities.
A m ultiplex option def ines su ch charac teristics as th e f rame f ormat and th e rate decision rules. See also Multiplex
Sublayer.
Multiplex Sublayer. One of the conceptual layers of the system th at multiplexes and demultiplexes primary traffic,
secondary traffic, and signaling traffic.
NAM. See Number Assignment Module.
Narrow Analog. A type of voice channel that uses 10kHz channel spacing and subaudible signaling.
Neighbor Set. The set of pilots ass ociated w ith th e CDMA Ch annel th at are probab le can didates f or h andoff.
Normally, the Neighbor Set co nsists of th e pilots ass ociated with CDMA Channel that cover geographical areas n ear
the mobile station. See also Active Set, Candidate Set, and Remaining Set.
-

A network is a subset of a cellular system, such as an area-wide cellular network, a private group of base stations,
or a group of base stations set up to handle a special requirement. A network can be as small or as large as needed,
as long as it is fully contained within a system. See also System.

Network Identification (NID). A number that uniquely identifies a network within a cellular system. See also System
Identification.
NID. See Network Identification.
Non-Autonomous Registration. A registration method in w hich th e base station in itiates registration . See also
Autonomous Registration.
Non-Slotted Mode. An operation mode of the mobile station in which the mobile station continuously monitors the
Paging Channel when in the Mobile Station Idle State.
Ns. Nanosecond.
NULL. Not having any value.
Null Traffic Channel Data. On e or m ore f rames of 16 1 s f ollowed by eig ht 0 s s ent at th e 1200bps rate. Nu ll \
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Traffic Channel data is sent when no service option is activ e and n o sig naling m essage is bein g sent. Null T raffic
Channel data serves to maintain the connectivity between the mobile station and the base station.
Number Assignment Module (NAM). A set of MIN-related parameters stored in the mobile station.
Numeric Information. Numeric information consists of param eters th at ap pear as n umeric f ields in m essage
exchanged by the base station and the m obile station and in formation u sed to describe th e operation of th e m obile
station.
OLC. See Overload Class (CDMA) or Overload Control (analog).
Optional Field. A field defined within a message structure that is optionally to the message recipient.
Order. A type of message that contains control codes for either the mobile station or the base station.
Ordered Registration. A registration method in which the base station orders the mobile station to send registration
related parameters.
Overhead Message. A message sent by the base station on the Paging Channel to co mmunicate base-station-specific
and system-wide information to mobile station.
Overload Class. The means used to co ntrol sy stem access by mobile station s, ty pically in em ergency or oth er
overload con ditions. Mo bile station are as signed on e (or m ore) of six teen ov erload classed, A ccess to th e CDM A
system can then be controlled on a per class basis by persistence values transmitted by the base station.
Overload Control (OLC). A means reverse analog control channel accesses by mobile stations. Mobile station are
assigned one(or more) of sixteen control levels. Access is selectively restricted by a base station setting one or m ore
OLC bits in the Overload Control Global Action Message.
Packet. The unit of information exchanged between the service option applications of the base station and the mobile
station.
Padding. A sequence of bits used to fill from the end of a message to the end of a message capsule, typically to the
end of the frame or half frame. All bits in the padding are '0'.
Paging. The act of seeking a mobile station when a call has been placed to that mobile station.
Paging Channel (Analog). See Analog Paging Channel.
Paging Channel (CDMA). A code channel in a Forward CDMA Channel used for transmission of control
information and pages from a base station to a mobile station.
Paging Channel Slot. An 80ms interval on the Paging Channel. Mobile station operating in the slotted mode are
assigned specific slots in which day monitor messages from the base station.
Parameter-Change Registration. A registration method in which the mobile station registers when certain of its
stored parameters change.
Parity Check Bits. Bits added to a sequence of information bits to provide error detection, correction, or both.
Persistence. A probability measure used by the mobile station to determine if it should transmit in a given Access
Channel Slot.
Physical Layer. The part of the communication protocol between the mobile station and the base station that is
responsible for the transmission and reception of data. The physical layer in the transmitting station is presented a
frame by the multiplex sublayer and transforms it into an over-the-air waveform. The physical layer in the receiving
station transforms the waveform back into a frame and presents it to the multiplex sublayer above it.
Pilot Channel. An unmodulated, direct-sequence spread spectrum signal transmitted continuously by each CDMA
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base station. The Pilot Channel allows a mobile station to acquire the timing of the Forward CDMA Channel, provides
a phase reference for coherent demodulation, and provides a means for signal strength comparisons between base
station for determining when to handoff.
Pilot PN Sequence. A pair of modified maximal length PN sequences with period 215 used to spread the Foward
CDMA Channel and the Reserve CDMA Channel. Different base station are identified by different pilot PN sequence
offsets.
Pilot PN Sequence Offset Index. The PN offset in units of 64 PN chips of a pilot, relative to the zero offset pilot PN
sequence.
PN Chip. One bit in the PN sequence.
PN Sequence. Pseudonoise sequence. A periodic binary sequence.
Power Control Bit. A bit sent in every 1.25ms interval on the Forward Traffic Channel to signal the mobile station to
increase or decrease its transmit power.
Power Control Group. A 1.25ms interval on the Forward Traffic Channel and the Reverse Traffic Channel.
See also Power Control Bit.
Power-Down Registration. Au autonomous registration method in which the mobile station registers on power up.
PPM. Parts per million.
Preamble. See Access Channel Preamble and Traffic Channel Preamble.
Primary CDMA Channel. A CDMA Channel at a pre-assigned frequency assignment used by the mobile station for
initial acquisition. See also Secondary CDMA Channel.
Primary Paging Channel (CDMA). The default code channel (code channel 1) assigned for paging on a CDMA
Channel.
Primary Traffic. The main traffic stream carried between the mobile station and the base station, supporting the
active promaty service option, on the Traffic Channel. See also Secondary Traffic, Signaling Traffic, and Servic3e
Option.
Private Long Code. The long code characterized by the private long code mask. See also Long Code.
Private Long Code Mask. The long code mask used to form the private long code. See also Public Long Code Mask
and Long Code.
Public Long Code. The long code characterized by the public long code mask.
Public Long Code Mask. The long code mask used to form the private long code. The mask contains the ESN of the
mobile station. See also Private Long Code Mask and Long Code.
Punctured Code. An error-correcting code generated from another error-correcting code by deleting (i.e., puncturing)
code symbols from the code output.
Quick Rep eats. A dditional transm issions of identical copies of a m essage w ithin a sh ort in terval to in crease th e
probability that the message is received correctly.
Receive Objective Loudness Rating (ROLR). A perceptually weighted transducer gain of telephone receivers
relating electrical excitation from a reference generator to sound pressure at the earphone. The receive objective
loudness tating is normally specified in dB relative to one Pascal per millivolt. See IEEE Standard 269-1992, IEEE
Standard 661-1979, CCITT Recommendation P.76, and CCITT Recommendation P.79.
Registration. The process by which a mobile station identifies its location and parameters to a base station.
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Registration Zone. A co llection of one or m ore base station s treated as a u nit when determining whether a mobile
station should perform zone-based registration.
Release. A process that the mobile station and base station use to inform each other of call disconnect.
The set of all allowable pilot offsets as determined by PILOT_INC, excluding the pilot offsets of the pilots in the
Active Set, Candidate Set, and Neighbor Set. See also Active Set, Candidate Set, and Neighbor Set.
Request. A layer 3 message generated by either the mobile station or the base station to retrieve information, ask for
service, or command an action.
Response. A layer 3 message generated as a result of another message, typically a request.
Reverse Analog Control (RECC). The analog control channel used from a mobile station to a base station.
Reverse Analog Voice Channel (RVC). The analog voice channel used from a mobile station to a base station.
Reverse CDMA Channel. The CDMA Channel from the mobile station to the base station. From the base station s
perspective, the Reverse CDMA Channel is the sum of all mobile station transmissions on a CDMA frequency
assignment.
Reverse Traffic Channel. A Reverse CDMA Channel used to transport user and signaling traffic from a single
mobile station to one or more base stations.
Roamer. A mobile station operating in a cellular system (or network) other than the one from which service was
subscribed. See also Foreign NID Roamer and Foreign SID Roamer.
ROLR. See Receive Objective Loudness Rating.
SAT. See Supervisory Audio Tone.
Scan of Channels. The procedure by which a mobile station examines the signal strength of each forward analog
control channel.
SCI. Synchronized Capsule Indicator bit.
Search Window. The range of PN sequence offsets that a mobile station searches for a pilot.
Secondary CDMA Channel. A CDMA Channel at a preassigned frequency assignment used by the mobile station for
initial acquisition. See also Primary CDMA Channel.
Secondary Traffic. An additional traffic stream that can be carried between the mobile station and the base station on
the Traffic Channel. See also Primary Traffic and Signaling Traffic.
Seizure Precursor. The initial digital sequence transmitted by a mobile station to a base station on a reverse analog
control channel.
Seizure Option. A service capability of the system. Service options may be applications such as voice, data, or
facsimile.
Shard Secret Data (SSD). A 128-bit pattern stored in the mobile station (in semi-permanent memory) and known by
the base station. SSD is a concatenation of two 64-bit subsets: SSD_A, which is used to support the authentication
procedures and SSD_B, which serves as one of the inputs to the process generating the encryption mask and private
long code.
Short Message Services (SMS). A suite of services which include SMS Text Delivery, Digital Paging (i.e., Call Back
Number CBN), and Voice Mail Notification (VMN).
SID. See System Identification.
Signaling Tone. A 10kHz tone transmitted by a mobile station on an analog voice channel to: 1) confirm orders,
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2)signal flash requests, and 3) signal release requests.

Signal Traffic. Control message that are carried between the mobile station and base station on the Traffic Channel.
See also Primary Traffic and Secondary Traffic.
Slot Cycle. A periodic interval at which a mobile station operating in the slotted monitors the Paging Channel.
Slotted Mode. An operation mode of the mobile station in which the mobile station monitors only selected slots on
the Paging Channel when in the Mobile Station Idle State.
Soft Handoff. A handoff occurring while the mobile station is in the Mobile Station Control on the Traffic Channel
State. This handoff is characterized by commencing communications with a new base station on the same CDMA
frequency assignment before terminating communications with the old base station. See also Hard Handoff.
SOM. Start-of-Message Bit.
SPS. Symbols per second.
- An identification of certain characteristics of a mobile station. Classes are defined in Table 2.3.3-1.
Status Information. The following status information is used to describe mobile station operation when using the
analog system.
Serving-System Status. Indicates whether a mobile station is turned to channels associated with System A or
System B.
First Registration ID Status. A status variable used by the mobile station in association with its processing of
received Registration ID messages.
First Location Area ID Status. A status variable used by the mobile station in association with its processing of
received Location Area ID messages.
Location Registration ID Status. A status variable used by the mobile station in association with its processing of
power-up registration and location-based registration.
First Idle ID Status. A status variable used by the mobile station in association with its processing of the Idle
Task.
Local Control Status. Indicates whether a mobile station must respond to local control messages.
Roam Status. Indicates whether a mobile station is in its home system.
Termination Status. Indicates whether a mobile station must terminate the call when it is on an analog voice
channel.
Supervisory Audio Tone (SAT). One of three tones in the 6 kHz region that is transmitted on the forward analog
voice channel by a base station and transponder on the reverse analog voice channel by as mobile station.
Supplementary Digital Color Code (SDCC1, SDCC2). Additional bits assigned to increase the number of color
codes from four to sixty four, transmitted on the forward analog control channel.
Symbol. See Code Symbol and Modulation Symbol.
Sync Channel. Code channel 32 in the Forward CDMA Channel which transports the synchronization message to the
mobile station.
Sync Channel Superframe. An 80ms interval consisting of three Sync Channel frames (each 26.666ms in length).
System. A system is a cellu lar teleph one serv ice th at cov ers a g eographic area su ch as a city . Metropolitan reg ion,
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country, or group of countries.

System Time.

See also Network.

The tim e ref erence used by th e sy stem. Sy stem Time is sy nchronous to UT C tim e(except f or leap

seconds) and u sed th e sam e tim e orig in as GP S tim e. Of fset by th e propagation delay f rom th e base station to the
mobile station. See also Universal coordinated Time.
Timer-Based Registration.

A registration method in which the mobile station registers whenever a counter reaches

a predetermined value. The counter is incremented an average of once per 80 ms period.

A reference established by th e m obile station that i s sy nchronous w ith th e earliest arriv ing

Time Reference.

multipath component used for demodulation.

TOLR.

See Transmit Objective Loudness Rating.

Traffic Channel.

A communication path between a m obile statio n and base station u sed f or u ser and sig naling

traffic. T he ter m T raffic Ch annel im plies a Forw ard T raffic Ch annel and Reverse T raffic Ch annel pair. See also
Forward Traffic Channel and Reverse Traffic Channel.
Traffic Channel Preamble.

A sequence of all-zero frames that is sent at the 9600 bps rate by the mobile station on

the Reverse Traffic Channel. The Traffic Channel preamble is sent during initialization of the Traffic Channel.
Transmit Objective Loudness Rating(TOLR).

A perceptually weighted transducer gain of telephone transmitters

relation sound pressure at the microphone to voltage at a reference electrical termination. It is normally specified in dB
relative to on

e m illivolt per P

ascal. See IEEE

Standard 269 -1992, IEEE Standard 661-1979, CCITT

Recommendation P.76 , and CCITT Recommendation. P.79

Unique Challenge-Response Procedure.

An exchange of information between a m obile station and a base station

for th e pu rpose of con firming th e m obile station s identity . T he procedu re is in itiated by th e base station and is
characterized by th e u se of a challeng e-specific random n umber(i.e., RA NDU) in stead of th e rando m v ariable
broadcast globally(RAND).
Unique Random Variable(RANDU).

A 24-bit random number generated by th e base s tation in s upport of th e

Unique Challenge-Response procedure.

Universal Coordinated Time(UTC). A n in ternationally agreed -upon tim e scale m aintained by th e B ureau
International de l Heure(BIH) u sed as th e tim e ref erence by n early all co mmonly available tim e and f requency
distribution systems i.e., WWW, WWVH, LORAN-C, Transit, Omega, and GPS.
UTC. Universal Temps Coordine. See Universal Coordinated Time.
Voice Channel. See Analog Voice Channel.
Voice Mobile Attenuation Code(VMAC). A 3- bit f ield in th e Ex tended A ddress W ord co mmanding th e initial
mobile power level when assigning a mobile station to an analog voice channel.
Voice Privacy.

The process by which user voice transmitted over a CDMA Traffic Channel is a af forded a m odest

degree of protection against eavesdropping over the air.

Walsh Chip.

The shortest identifiable component of a Walsh function.

There are 2N Walsh chips in one Walsh

function w here N is th e order of th e W alsh f unction. On the Forward CDMA channel one Walsh chip equals
1/1.2288MHz, or 813.802ns. On the Reverse CDMA Channel, one Walsh chip equals 4/1.2288MHz, or 3.255
N

Walsh Function. One of 2 time orthogonal binary functions (note that the functions are orthogonal after mapping 0
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to 1 and 1 to 1).
Zone-Based Registration. An autonomous registration method in which the mobile station registers whenever it
enters a zone that is not in the mobile station s zone list.
. Microsecond

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Appendix 1.
1. Block Diagram

67

Internal Use Only

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UN270

2. Circuit Drawing
2.1 Main PCB

2.2 KEY-PCB

2.3 MAIN F-PCB

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Appendix 2. Circuit diagram

MAIN PCB CIRCUIT DIAGRAM

[TX-DCN/PCS]
[FRONT END]

DNI

L1000

L1056

DCN_TX
L1003

L1004

DNI

DNI

L1057

DNI

VCC2

PCS_TX

C1093

C1102

1p

1.2p

PA_RANGE_0

VEN_CELL

RFOUT_PCS

C1016

PAM_IN_LB

100p

L1060

PAM_IN_LB

L1001

1n

C1013

C1014

C1015

1n

100p

100p

R1000
100K

GND3

GND6

GND5

CDMA_LB_RTR_OUT

2.2n

C1104

GND1

GND4

L1061

1
4

IN2

GND2

8
10

100p

IN1

OUT2

C1103

PAM_IN_PCS

C1017

FL1000

OUT1

CDMA_PA_ON0
PA_ON_PCS

VEN_PCS
RFIN_PCS

SAWEP836MFH2F00

2.2n

DNI

VCC1

C1005

VMODE

2.2n

GND

RFIN_CELL

RFOUT_CELL

10

L1052

U1000

CPL

12

2.7n

1n
SW1001 NMS-180
3
G1
1
A
2
C
4
G2

2.2u

ACPM-7354

14

PAM_CPL_OUT

TX SAW

C1001

2.2u

15

C1106

C1003

DNI

100p

C1002

C1101

+VPWR
C1000

GND

HJ-ICT-03Y

FEED

ANT1000

FEED

HJ-ICT-03Y

CDMA_HB_RTR_OUT

100p

PAM_IN_PCS

100p

836.5MHz

L1007
10n

GND

L1009

C1096
100p

100n

[TX-AWS]

C1022
DNI

C1033

R1001

R1009

18

0
SAFP0000501

5
6

DNI
DNI_SMPY0019401
AWT6309R
9
PGND
8
VCC
C1031

CDMA_PWR_DET_IN

200p

PAM_OUT_AWS

L1017

C1030

300

DNI

IN

TER

COU

DNI
R1003

DNI

DNI

C1035
C1039

FL1002
DNI

DNI

DNI_SDMY0003301

ANT

DNI

2
4
5

CDMA_PA_ON1
+2.6V_MSMP
CDMA_PCS_MODE

3
2
1

U1006

VBATT
RFIN

GND2

VMODE

GND1

VEN

FL1001
DNI_SFSY0034401
SAFEA1G73AA0F00
4

PAM_IN_AWS
1
2

IN
OUT
G3 G2 G1

1732.5MHz

L1015
DNI

PAM_IN_AWS

PA_RANGE_0

CDMA_AWS_RTR_OUT

L1018
DNI

C1036

C1037

C1038 R1004

DNI

DNI

DNI

DNI

AWS_TX

GND4
8
GND5
9
GND6

881.5MHz

33n
C1053

DNI

CDMA_LB_MIX_INM

1p

C1045

DNI

DNI

C1095

R1018
C1046

DNI

DNI

1.8p

GND

FEED

C1042

DNI

CDMA_AWS_MODE
CDMA_PCS_MODE

C-CLIP_GR700

CDMA_HB_RTR_IN

100p

DNI_SFAC0002001

C1097

C1098

DNI_MCIZ0002701

VC2

ANT1007

VC1
GND

1.8n
C1051

4.7n

OUT2

FEED

L1062

PCS_RX

L1028

82p

C1054
R1005

4.7n

1.5p

IN

OUT1

3
2

CDMA_LB_MIX_INP

C1048
C1052

FL1003

L1023

82p

FL1004

DNI

[HINGE_CONTACT C- CLIP]
ANT1006

DNI

SAFP0000501

L1029

G1 O1
IN
G2 O2

100p

L1022

DNI
C1041

DNI

C1050

15n

C1040

AWS_RX

C1049

L1026

DNI

L1021

[LNA_INPUT-PCS/AWS]
C1044

39p

S
U1004

GND1
GND2
GND3

[LNA_OUTPUT]
+2.1V_RFRX1

VCC

B1

1732.5 MHz,2132.5 MHz

DNI

CDMA_LB_LNA_OUT

GND

AWS_RX

TX

L1019

L1020
DNI

RX

RFOUT

B0

C-CLIP_GR700

U1003

PAM_CPL_OUT

C1034

+VPWR

DNI

300

+2.8V_TCXO

0
DNI_EUSY0186502

C1025

R1002

VDD

OUT

PORT3

GND1

DNI

GND3

PORT2

DNI

C1029

C1027

PORT1

DNI

U1005

PCS_TX

CDMA_PCS_MODE

C1026

DNI

GND2

PAM_OUT_AWS

AWS_TX

DCN_TX

SLUG_GND
9
CTL

R1013 SAFP0000501

PA_ON_PCS

XM0830SM-BL0912

DNI_SFAC0002301

LDC151G8620Q-359

DNI

PCS_RX

DNI_SCDY0004301

C1024

C1028

L1014
DNI

DNI

C1019

DNI

L1013

CDMA_LB_RTR_IN

15p
L1011

DNI

DNI

CELL_TX
PCS_TX

DNI

15n

C1032

ANT

C1018

L1010

1
2

PCS_RX

DNI

G_SLUG

3.3n

0
0
SAFP0000501 SAFP0000501

U1002
CELL_RX

L1012

R1016

L1053

ACFM-7107

R1015

DNI

ANT1002

Internal Use Only

R1017
0
SAFP0000501

0.5p

1K

DNI
L1030

R1006

3.3n

DNI

RXSAW_IN_AWS
L1031
DNI

CDMA_AWS_MODE
CDMA_PCS_MODE

FL1005
OUT1

VC1
VC2

GND

DNI

2.7p

[GPS LNA]

[MIXER INPUT]

C1060 C1061

C1062

DNI

1
3

OUT2

C1063

DNI_SFAC0002001
5
IN

2.2n

C1064

DNI

L1032

CDMA_HB_LNA_OUT

DNI

C1058

DNI

DNI
DNI

33p

C1059

C1056

C1057

+2.1V_RFRX1

RXSAW_IN_HB

DNI

L1051

33p

GPS_IN

L1033
DNI
R1020

C1066
L1036

C1070

L1050

DNI

+2.1V_RFRX2

12

C1067

10p

0.1u

5.6n

PORT3+

1960MHz

RXSAW_OUTM_HB

GND2

GND1
P1

1
2
3

FL1010
B9433 DNI_SFSY0035002

DNI

P3

P2

C1090

DNI

GND3

RXSAW_OUTM_HB

DNI

FL1009 DNI_SFAC0002701
5

L1044

240MHz

OUT
IN
G1 G2 G3
5

L1049
DNI

4
3

DNI

C1092

L1048

CDMA_HB_MRDRTR_IN

DNI

86

DNI

C1075

CDMA_HB_MIX_INP
C1079

2
3

CDMA_AWS_MODE
CDMA_HB_MIX_INM

C1082
DNI

L1063
3.9n

C1086

100p

C1088

100p

R1007

10K

GND
S_D

VDD

FIL_OUT

ALM-2412U1007

L1055

5
4

C1073

3.3n

100p

6.8p

DNI

1GHz,2GHz

PORT1-

1.8n

DNI
6

DNI

PORT3-

5
C1081

L1042
DNI

GPS_IN

100p
C1089

100p

C1087
L1046

MHz

C1071

4
100n

C1100

RXSAW_OUTP_HB

CTL1

DNI

FL1011
3 B9444
G3
1
OUT IN
G2 G1
5 2 1575.42

L1045

DNI

2
FL1008
G1 O1
1
SAFEB1G96FL0F00
IN
G2 O2

DNI

L1043

SW1002 NMS-180
3
G1
1
A
2
C
4
G2

C1085

RXSAW_IN_HB

PORT1+

CTL2

1.8n
C1080

PORT2+

PORT2-

CDMA_GPS_MODE
C1065

FL1007

DNI

C1074

L1041

RXSAW_OUTP_HB

DNI_SFAY0012701
XM0860SR-DL0801
7

RXSAW_OUTM_AWS
CDMA_PCS_MODE

100p

R1010
DNI

RXSAW_OUTM_AWS

DNI

L1035
DNI

C1078

DNI

DNI

5
2140MHz

1.8p

R1011
0

DNI

ANT1005
C1105

ANT1003

RXSAW_OUTP_AWS

3
2
FL1006
G1 O1
SAFEB2G14FB0F00
IN
G2 O2 DNI_SFSY0028201

L1037

[GPS/AWS_MRD]

MRD_ANT

DNI

RXSAW_OUTP_AWS
RXSAW_IN_AWS

RF_IN

DNI

R1008
6.8n

SAFP0000501
L1034

SAFP0000501

DNI

R1019

L1064
3.9n

L1038
DNI

C1099
DNI

CDMA_GPS_RTR_IN

Internal Use Only

MAIN PCB CIRCUIT DIAGRAM

[QSC6055 MODULE]
CORE_QSC6055_2G1G_STG_03

CDMA_AWS_RTR_OUT
MLCD_CS/
LCD_RS/
BT_UART_TXD
MLCD_RESET/
CDMA_PA_ON1
SD_CMD
SD_CLK
BATT_ID_PU
SD_LDO_EN
PA_RANGE_0
BT_PCM_SYNC
BT_PCM_DOUT
BT_PCM_CLK
CDMA_AWS_MODE
CAM_MCLK
CDMA_PCS_MODE
LIN_PWM_FREQ
LCD_ID
MOTOR_EN
CDMA_GPS_MODE
RTCK
TDO
CDMA_PA_ON0
EAR10N
EAR10P
HPH_OUT_L_P
HPH_OUT_R_N
MIC_BIAS
RED_EN
GREEN_EN

R8015
2.2K

Close to QSC

USB_D+
USB_DPS_HOLD
CDMA_HB_LNA_OUT
BT_UART_RXD
TCK
BATT_THM_ADC
TRST/
TMS
MIC1P
EAR_MIC
ACC_ADC
PCB_REV_ADC
PWR_ON_SW/
CDMA_HB_MIX_INP
CDMA_HB_MIX_INM
CDMA_PWR_DET_IN
CDMA_GPS_RTR_IN
TEMP_ADC
+2.6V_MSMP
TDI
CDMA_HB_RTR_IN
CDMA_LB_RTR_IN
CDMA_LB_MIX_INP
CDMA_LB_MIX_INM
CDMA_HB_MRDRTR_IN
+VPWR
+VCHAR
+VBATT
+5.0V_USB
ISNS_P
ISNS_M
RESIN/

CDMA_AWS_RTR_OUT
MLCD_CS/
LCD_RS
BT_UART_TXD
MLCD_RESET/
CDMA_PA_ON1
GPIO[2]
GPIO[7]
GPIO[9]
MLCD_VSYNC
PA_RANGE_0
BT_PCM_SYNC
BT_PCM_DOUT
BT_PCM_CLK
GPIO[31]
GPIO[46]
GPIO[49]
GPIO[50]
GPIO[52]
AUDIO_AMP_EN
CDMA_GPS_MODE
RTCK
TDO
CDMA_PA_ON0
EAR10N
EAR10P
HPH_OUT_L
HPH_OUT_R
MIC_BIAS
RED_EN
GREEN_EN
VIB_DRV/
USB_D+
USB_DPS_HOLD
CDMA_HB_LNA_OUT
BT_UART_RXD
LINE_IN_R_N
TCK
LINE_IN_L_P
BATT_THM_ADC
TRST/
TMS
MIC1P
EAR_MIC
ACC_ADC
PCB_REV_ADC
PWR_ON_SW/
CDMA_HB_MIX_INP
CDMA_HB_MIX_INM
CDMA_PWR_DET_IN
CDMA_GPS_RTR_IN
TEMP_ADC
+VDD_P6
TDI
CDMA_HB_RTR_IN
CDMA_LB_RTR_IN
CDMA_LB_MIX_INP
CDMA_LB_MIX_INM
CDMA_LB_MRDRTR_IN
CDMA_HB_MRDRTR_IN
+VPWR
+VCHAR
+VBATT
+5.0V_USB
ISNS_P
ISNS_M
RESIN/

[ PCB Revision ]

[ARRAY TP]

+2.6V_BT
+1.8V_MSME
+2.6V_MSMP
+2.1V_RFRX2
+2.8V_TCXO
+2.8V_LCD
+2.1V_RFRX1
SPKR_OUT_N
SPKR_OUT_P

+2.6V_BT
+1.8V_MSME
+2.6V_MSMP
+2.1V_RFRX2
+2.8V_TCXO
+2.8V_LCD
+2.1V_RFRX1
SPKR_OUT_N
SPKR_OUT_P
LINE_OUT_R_N
LINE_OUT_L_P
EBI2_D[0]
EBI2_D[1]
EBI2_D[2]
EBI2_D[3]
EBI2_D[4]
EBI2_D[5]
EBI2_D[6]
EBI2_D[7]
EBI2_D[8]
EBI2_D[9]
EBI2_D[10]
EBI2_D[11]
EBI2_D[12]
EBI2_D[13]
EBI2_D[14]
EBI2_D[15]
EBI2_OE/
EBI2_WE/
CDMA_LB_LNA_OUT
CDMA_HB_RTR_OUT
CDMA_LB_RTR_OUT
GPIO[21]
CHG_CNT/
BATT_FET/
GPIO[16]
GPIO[17]
GPIO[19]
GPIO[23]
GPIO[48]
GPIO[3]
GPIO[4]
GPIO[5]
GPIO[6]
GPIO[54]
GPIO[51]
GPIO[47]
GPIO[45]
GPIO[44]
GPIO[43]
GPIO[42]
GPIO[41]
GPIO[40]
GPIO[39]
GPIO[38]
FOLDER_CLOSE/
GPIO[36]
GPIO[35]
GPIO[34]
GPIO[33]
GPIO[32]
GPIO[8]
EAR_SENSE/
GPIO[11]
LCD_ID
GPIO[14]
GPIO[15]
GPIO[18]
GPIO[20]
GPIO[22]
GPIO[24]
BATT_ID
BT_PCM_DIN

+2.8V_TCXO

R8000
100K

PCB_REV_ADC
C8000

R8001
75K

33n

UART8000

EBI2_D[0]
EBI2_D[1]
EBI2_D[2]
EBI2_D[3]
EBI2_D[4]
EBI2_D[5]
EBI2_D[6]
EBI2_D[7]
EBI2_D[8]
EBI2_D[9]
EBI2_D[10]
EBI2_D[11]
EBI2_D[12]
EBI2_D[13]
EBI2_D[14]
EBI2_D[15]
EBI2_OE/
EBI2_WE/
CDMA_LB_LNA_OUT
CDMA_HB_RTR_OUT
CDMA_LB_RTR_OUT
QKEY_RESET/
CHG_CNT/
BATT_FET/
PROXI_3D_SCL
I2C_SCL
TOUCH_I2C_SCL
QKEY_I2C_SCL
CAM_I2C_SCL
SD_DATA[0]
SD_DATA[1]
SD_DATA[2]
SD_DATA[3]
EARPHONE_KEY
FOLDER_CLOSE/
CAM_I2C_SDA
CAM_DATA[7]
CAM_DATA[6]
CAM_DATA[5]
CAM_DATA[4]
CAM_DATA[3]
CAM_DATA[2]
CAM_DATA[1]
CAM_DATA[0]
PROXI_OUT/
CP_EN
TOUCH_EN
CAM_VSYNC
CAM_HSYNC
CAM_PCLK
TOUCH_IRQ
EAR_SENSE
SD_DET/
MLCD_VSYNC
GPIO_EXP_CONT
PROXI_3D_SDA
I2C_SDA
TOUCH_I2C_SDA
QKEY_INT/
QKEY_I2C_SDA
BATT_ID
BT_PCM_DIN

12
11
10

USB_D+
USB_D+VCHAR
+VPWR

9
8
7
6
5
4
3
2
1

CTS
RTS
DSR
NC4
NC3
NC2
VBAT
ON_SW
NC1
TX
RX
GND

2.5G

UTXD
URXD
PWR
VBAT
ON_SW
VCHAR
TX
RX
GND

REVISION R8000

TP8000

USB_D+

TP8001

USB_D-

TP8002

<BOSS HOLE>
OJ8000

OJ8001

5.6K

07-1A

100K

12K

1B-2C

100K

19.1K

2D-3E

100K

27K

3F-50

100K

36K

51-62

100K

47K

63-72

100K

B
C

3G

[PRODUCTION TP_2pie]
+VCHAR

ADC_range(HEX)_8bit

R8001

100K

56K

73-84

1.0

100K

75K

85-9C

1.1

100K

100K

9D-B4

1.2

100K

130K

B5-CC

1.3

100K

130K

CD-E4

1.4

100K

130K

E5-FC

[JTAG]
JTAG8000

TCK
RTCK
TDO
TDI
TMS
TRST/
+2.6V_MSMP
RESIN/
PS_HOLD

PROXI_LDO_EN

MIC_BIAS_EN

1M

OUT5

DNI

GND

SKPD_LED_EN

R8020

100K

OUT4

R8019

1M

R8021

1u

CAM_RESET/

100K

EN_SET
OUT3

C8001

CAM_PWR_DOWN

R8018

GPIO_EXP_CONT

OUT2

100K

OUT1
IN

R8017

+2.6V_MSMP

R8016

U8000

87

3
4
5
6
7
8
9
10

R8013
DNI

47K

+2.6V_MSMP

R8014

[GPIO EXPENDER]
1

TCK
RTCK
TDO
TDI
TMS
TRST
VCC
RESIN
PS_HOLD
GND

MAIN PCB CIRCUIT DIAGRAM

Internal Use Only

2G NAND 1G DDR SDRAM

VCCN1
VSS1
VSS2
VSS3
VSS4
VSS5
VSS6
VSSQ

EBI2_CS1/

R2204

H2
C5
C9
G2
H10
P7
P9

10K

EBI2_WE/
EBI2_OE/
EBI2_LB/
EBI2_UB/
EBI2_BSY/
NAND_WP/
+1.8V_MSME
+1.8V_MSME
EBI2_WE/
EBI2_OE/

P5
C4
C2210 1n

C2209 0.1u

P4

VDDQ1
P8
VDDQ2

+1.8V_MSME
C2208 0.1u

VDD1
C8
VDD2
P6
VDD3

88

+2.8V_TCXO

R2201

R2202

2K

100

X2201
DSA321SCA
R2203

51

4
C2204 0.1u

G3
M3
F3
L3
K3
E3
N3

TRK_LO_ADJ

C2205 47p

TP2202

TCXO
C2203 10n

EBI2_D[0]
EBI2_D[1]
EBI2_D[2]
EBI2_D[3]
EBI2_D[4]
EBI2_D[5]
EBI2_D[6]
EBI2_D[7]
EBI2_D[8]
EBI2_D[9]
EBI2_D[10]
EBI2_D[11]
EBI2_D[12]
EBI2_D[13]
EBI2_D[14]
EBI2_D[15]

C2207 2.2u

H8BCS0SI0BAR-46M

_CE
_WEN
_RE
ALE
CLE
R__B
_WP

P10
N10
M10
L10
F10
E10
D10
C10
N11
M11
L11
K11
G11
F11
E11
D11

C2206 2.2u

U2201

I_O0
I_O1
I_O2
I_O3
I_O4
I_O5
I_O6
I_O7
I_O8
I_O9
I_O10
I_O11
I_O12
I_O13
I_O14
I_O15

C2202 33n

A1
A2
A3
A10
A11
A12
B1
B2
B3
B10
B11
B12
C1
C2
C3
C11
C12
D1
D2
D3
E2
H11
F2
F9
G6
G9
G10
H3
H4
H5
H6
H7
H8
H9
J2

NC1
NC2
NC3
NC4
NC5
NC6
NC7
NC8
NC9
NC10
NC11
NC12
NC13
NC14
NC15
NC16
NC17
NC18
NC19
NC20
NC21
NC22
NC23
NC24
NC25
NC26
NC27
NC28
NC29
NC30
NC31
NC32
NC33
NC34
NC35

A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
A13
DQ0
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
DQ8
DQ9
DQ10
DQ11
DQ12
DQ13
DQ14
DQ15
LDQM
UDQM
LDQS
UDQS
_CLK
CLK
CKE
BA0
BA1
_RAS
_CAS
_WED
_CS

NC36
NC37
NC38
NC39
NC40
NC41
NC42
NC43
NC44
NC45
NC46
NC47
NC48
NC49
NC50
NC51
NC52
NC53
NC54
NC55
NC56
NC57
NC58
NC59
NC60
NC61
NC62
NC63
NC64
NC65
NC66
NC67
NC68
NC69
NC70

EBI1_D[0]
EBI1_D[1]
EBI1_D[2]
EBI1_D[3]
EBI1_D[4]
EBI1_D[5]
EBI1_D[6]
EBI1_D[7]
EBI1_D[8]
EBI1_D[9]
EBI1_D[10]
EBI1_D[11]
EBI1_D[12]
EBI1_D[13]
EBI1_D[14]
EBI1_D[15]
EBI1_DQM[0]
EBI1_DQM[1]
EBI1_DQS[0]
EBI1_DQS[1]
EBI1_M_CLK/
EBI1_M_CLK
EBI1_DQM[2]
EBI1_BA[0]
EBI1_BA[1]
EBI1_ADV/
EBI1_OE/
EBI1_WE/
EBI1_CS0/

D4
E4
F4
G4
G8
F8
E8
D8
D9
G7
G5
F7
E7
E9
L4
M4
N4
L5
M5
N5
M6
N6
M7
N7
L8
M8
N8
L9
M9
N9
K6
K7
L6
L7
C6
C7
D7
E5
F5
F6
E6
D6
D5

J3
J4
J5
J6
J7
J8
J9
J10
J11
K2
K4
K5
K8
K9
K10
L2
M2
N2
P1
P2
P3
P11
P12
Q1
Q2
Q3
Q10
Q11
Q12
T1
T2
T3
T10
T11
T12

TP2201

EBI1_A[0]
EBI1_A[1]
EBI1_A[2]
EBI1_A[3]
EBI1_A[4]
EBI1_A[5]
EBI1_A[6]
EBI1_A[7]
EBI1_A[8]
EBI1_A[9]
EBI1_A[10]
EBI1_A[11]
EBI1_A[12]
EBI1_A[13]

EBI2_D[0]
EBI2_D[1]
EBI2_D[2]
EBI2_D[3]
EBI2_D[4]
EBI2_D[5]
EBI2_D[6]
EBI2_D[7]
EBI2_D[8]
EBI2_D[9]
EBI2_D[10]
EBI2_D[11]
EBI2_D[12]
EBI2_D[13]
EBI2_D[14]
EBI2_D[15]

VCONT

GND

VDD

OUT

2
3

C2201

TCXO
1n

R2117

M10

VDD_RFRX2_8

M11

VDD_RFRX2_9

M12

VDD_RFTX_1

N6

VDD_RFTX_2

N10

VDD_RFTX_3

N11

VDD_RFTX_4

N12

VDD_RFTX_5

P8

VDD_RFTX_6

LGE Internal Use Only

100p

2
FC-135

USB_D+
USB_DSPKR_OUT_P
SPKR_OUT_N
PS_HOLD
RESIN/
PWR_ON_SW/

C2177 1u

C2176 1u

C2175 4.7u

C2174 10u

C2172 2.2u

C2173 1u

C2171 4.7u

C2170 4.7u

C2168 4.7u

4.7u

C2162 12p

4.7u
L2102

C2161 12p

L2101

C2169 2.2u

DNC_10

L10

L8

AC23

K8

AC12

DNC_9

DNC_7

DNC_5

DNC_8

DNC_4

DNC_6

F17

LCD_RS

F16

E18

DNC_2

DNC_3

U2

E17

T1

E16

DNC_1

LCD_EN

LCD_RS

V2

P6

LCD_CS_N

EBI2_UB_N

EBI2_WE_N

W3

EBI2_OE/
EBI2_UB/
EBI2_WE/
MLCD_CS/

EBI2_CS1/
EBI2_LB/

Y3

GND_DIG_12

GND_DIG_41

GND_DIG_13

GND_DIG_42

U2101

GND_DIG_16

GND_DIG_45
GND_DIG_46

GND_DIG_18

GND_DIG_47

GND_DIG_19

GND_DIG_48

GND_DIG_20

GND_DIG_49

GND_DIG_21

GND_DIG_50

GND_DIG_22

GND_MPLL_1

GND_DIG_23

GND_MPLL_2

GND_DIG_24

GND_MPLL_3

GND_DIG_25

GND_MSMC

GND_DIG_26

GND_NCP

GND_DIG_27

GND_SPKR

GND_DIG_28

GND_TCXO

TCK
TDI

R9

TDO

R10

TMS

R11

TRST_N

R14

WDOG_EN

R15

PA_ON0

R16

CCOMP

T8

EAR1ON

T9

GND_DIG_44

GND_DIG_17

RTCK

R8

GND_DIG_43

QSC6055-CD

C2160

CDMA_LB_MRDRTR_IN

89

EAR1OP

T10

HKAIN0

T11

HKAIN1

T14

HPH_OUT_L_P

T15

HPH_OUT_R_N

T16

HPH_VNEG

AC16

HSET_BIAS

P12

LINE_IN_L_P

R12

LINE_IN_R_N

T12

LINE_OUT_L_P

AB15

LINE_OUT_R_N

T18

MIC1N

AC17

MIC1P

U21

MIC2N
MIC2P

GND_BUCKRF

GND_A_RF_45

N19

AB21

GND_A_RF_41

GND_A_RF_44

GND_A_RF_42

GND_A_RF_40

GND_A_RF_39

GND_A_RF_43

N16

N15

N14

N13

M15

GND_A_RF_38

M14

GND_A_RF_37

M13

L22

GND_A_RF_36

L15

GND_A_RF_34

GND_A_RF_33

GND_A_RF_32

GND_A_RF_35

L14

L13

K19

GND_A_RF_30

GND_A_RF_31

K15

K14

GND_A_RF_29

GND_A_RF_27

GND_A_RF_28

J22

J18

J15

K13

GND_A_RF_24

GND_A_RF_25

GND_A_RF_26

J14

J13

H19

GND_A_RF_23

GND_A_RF_22

H15

GND_A_RF_21

H14

GND_A_RF_20

H13

GND_A_RF_19

F22

GND_A_RF_18

CDMA_HB_MRDRTR_IN

+VCHAR
+VBATT
+5.0V_USB
ISNS_P
ISNS_M
CHG_CNT/
BATT_FET/
VIB_DRV/

X2101

C2167 2.2u

EBI2_OE_N

GND_DIG_40

C2159

TCXO

C2166 2.2u

EBI2_M_CLK

AB3

GND_DIG_39

F19

GND_A_RF_17

F15

E22

GND_A_RF_15

GND_A_RF_16

E19

E14

GND_A_RF_14

D22

GND_A_RF_11

GND_A_RF_13

GND_A_RF_12

B22

C19

GND_A_RF_10

B20

GND_A_RF_9

B19

GND_A_RF_7

GND_A_RF_6

GND_A_RF_8

B18

B17

B16

B15

GND_A_RF_5

GND_A_RF_4

B14

A23

DIV_RX_IN_HB

GND_A_RF_1

GND_5V

DIV_RX_IN_LB

A17

A16

A14

MPP4

AC19

MPP3

AA21

MPP2

MPP1

VCOIN

REF_BYP

U22

V18

VREG_RFRX1

V17

VDD_SPKR

AB19

VDD_RFTX_9

R2119

C2165 2.2u

Y1

GND_DIG_37
GND_DIG_38

GND_DIG_10

RED_EN
GREEN_EN
ACC_ADC
PCB_REV_ADC

EBI2_LB_N

R3

EBI2_CS1_N

U1

EBI2_CS0_N

GND_DIG_8
GND_DIG_9
GND_DIG_11

RESOUT_26V_N

P14

VDD_RFTX_8

100p

C2164 2.2u

GND_DIG_36

RESOUT_18V_N

P13

GND_DIG_29

VDD_RFTX_7

C2163 1u

R2123

GND_DIG_7

P11

P15

C7
E6
A11
E9
AA14

EAR_SENSE/

AB4

GPIO[11]

AA4

MLCD_VSYNC
LCD_ID

P5
T2

GPIO[14]
GPIO[15]
GPIO[16]
GPIO[17]
GPIO[18]
GPIO[19]
GPIO[20]
GPIO[21]
GPIO[22]
GPIO[23]
GPIO[24]

AC11
AB12
AA12
AA11
AB11
W10
V9
W9
AB10
AC10
A9

BATT_ID
PA_RANGE_0
BT_PCM_SYNC
BT_PCM_DIN
BT_PCM_DOUT
BT_PCM_CLK

E7
E10
B11
F9
C10
AB5

GPIO[31]
GPIO[32]
GPIO[33]
GPIO[34]
GPIO[35]
GPIO[36]

AB7
AA6
W6
AC6
AC7
W7

FOLDER_CLOSE/

AA7

GPIO[38]
GPIO[39]
GPIO[40]
GPIO[41]
GPIO[42]
GPIO[43]
GPIO[44]
GPIO[45]
GPIO[46]
GPIO[47]
GPIO[48]
GPIO[49]
GPIO[50]
GPIO[51]
GPIO[52]

V6
AC8
AB8
V7
AB9
W8
AC9
AB6
V8
AA9
V5
AC5
H5
H6
AC13

AUDIO_AMP_EN

AB13

GPIO[54]

W12

CDMA_GPS_MODE
TRK_LO_ADJ
+VDD_P6

F8
W5

R2108

F11

4.7K

B12
A12
B4

NAND_WP/

C9
A7

RTCK
TCK
TDI
TDO
TMS
TRST/

A5
B6
F6
A6
B5
F10
A8

CDMA_PA_ON0

F23
L19

EAR10N
EAR10P
TEMP_ADC
BATT_THM_ADC
HPH_OUT_L
HPH_OUT_R
-1.8V_NCP
MIC_BIAS
LINE_IN_L_P
LINE_IN_R_N
LINE_OUT_L_P
LINE_OUT_R_N

L18
P21
P22
M21
L16
M19
R19
G18
F18
L21
M22
G23
G22
H21
G21

C2137 DNI

L12

VDD_RFRX2_7

GND_DIG_35

MODE_2

B7

C2138 0.1u

L9
L11

VDD_RFRX2_6

GND_DIG_34

MODE_1

P10

B9

C2136 0.1u

L6

VDD_RFRX2_5

GND_DIG_33

MODE_0

P9

GPIO[2]
GPIO[3]
GPIO[4]
GPIO[5]
GPIO[6]
GPIO[7]
GPIO[8]
GPIO[9]

B8

C2134 0.1u

K12

VDD_RFRX2_4

GND_DIG_32

GND_DIG_5
GND_DIG_6

GND_DIG_15

K11

VDD_RFRX2_2
VDD_RFRX2_3

GND_DIG_3
GND_DIG_4

GND_DIG_14

K10

VDD_RFRX2_1

GND_DIG_31

E8

C2135 0.1u

K9

VDD_RFRX1_8

GND_DIG_30

GND_DIG_2

BT_UART_RXD
BT_UART_TXD
MLCD_RESET/
CDMA_PA_ON1

B10

F7

C2133 0.1u

K6

VDD_RFRX1_7

GND_DIG_1

A10

A4

C2132 0.1u

VDD_RFRX1_6

+2.8V_LCD

+1.3V_MSMC

AC4

J12

+2.8V_TCXO

R5

J11

R2120

+2.8V_TCXO

W2

J10

VDD_RFRX1_4
VDD_RFRX1_5

+2.1V_RFRX2

R2122

EBI2_BSY_N

J9

VDD_RFRX1_3

R2118

R2121

V1

J8

VDD_RFRX1_2

-1.8V_NCP

+2.1V_RFTX
+2.8V_LCD

EBI2_A_D_15
J6

VDD_RFRX1_1

+2.6V_MSMP

+2.25V_SMPS_RF
+2.1V_RFRX2

R6

H12

W1

H11

VDD_P7_1

+1.8V_MSME

+2.6V_MSMP

EBI2_A_D_14

H10

VDD_P6_3
VDD_P7_2

C2178 2.2u

EBI2_A_D_13

T5

H9

VDD_P6_2

+1.3V_MPLL
R2116

EBI2_A_D_12

Y2

EBI2_A_D_9

AA1

F12

VDD_P6_1

+2.6V_BT

+2.1V_MSMA
+1.8V_MSME

EBI2_A_D_11

EBI2_A_D_10

EBI2_A_D_8

T6

U3

EBI2_A_D_7

AC2

AA2

EBI2_A_D_6

EBI2_A_D_5

EBI2_A_D_4

U6

U5

AB1

EBI2_A_D_3

E12

VDD_P5_1

+2.1V_RFRX1

R2115

EBI2_A_D_2

G3

EBI1_OE_N

EBI1_WE_N

EBI2_A_D_1

EBI2_A_D_0

AC3

EBI1_DQS[0]
EBI1_DQS[1]
EBI1_M_CLK
EBI1_M_CLK/
EBI1_OE/
EBI1_WE/
EBI2_D[0]
EBI2_D[1]
EBI2_D[2]
EBI2_D[3]
EBI2_D[4]
EBI2_D[5]
EBI2_D[6]
EBI2_D[7]
EBI2_D[8]
EBI2_D[9]
EBI2_D[10]
EBI2_D[11]
EBI2_D[12]
EBI2_D[13]
EBI2_D[14]
EBI2_D[15]
EBI2_BSY/
K5

J5

E2

K2

L5

R1

EBI1_M_CLK_N

EBI1_M_CLK

EBI1_DQS_1

EBI1_DQS_0

EBI1_DQM_3

A2

E1

K1

EBI1_CS1_N

EBI1_DQM_0

EBI1_DQM_1

R2

B3

EBI1_CS0_N

N5

A3

EBI1_ADV_N

P1

P2

N2

M5

N1

M6

F5

E5

C5

C4

G6

D3

E3

G5

B1

EBI1_A_D_31

EBI1_A_D_30

EBI1_A_D_29

EBI1_A_D_27

EBI1_A_D_28

EBI1_A_D_26

EBI1_A_D_25

EBI1_A_D_24

EBI1_A_D_23

EBI1_A_D_22

EBI1_A_D_21

EBI1_A_D_20

EBI1_A_D_19

EBI1_A_D_17

EBI1_A_D_16

EBI1_A_D_18

D2

C1

C2

EBI1_A_D_15

EBI1_A_D_14

EBI1_A_D_13

EBI1_A_D_12

G2

D1

EBI1_A_D_11

G1

F2

EBI1_A_D_10

H2

H1

J2

J1

L1

M2

F1

EBI1_A_D_9

EBI1_A_D_8

EBI1_A_D_5

EBI1_A_D_7

EBI1_A_D_6

EBI1_A_D_4

EBI1_A_D_3

EBI1_A_D_2

VDD_P4_2

R2113

R2114

EBI1_A_D_1

TRUSTED_BOOT_GPIO_57

C2157 0.1u

C2156 0.1u

C2155 1u

C2154 0.1u

C2153 1u

C2151 0.1u

C2152 0.1u

C2150 0.1u

C2148 1u

VDD_P4_1

C2158 0.1u

+2.1V_RFRX1

C2149 0.1u

C2147 1u

C2145 1u

C2146 1u

C2143 1u

C2144 1u

C2142 1u

C2141 1u

C2139 2.2u

C2140 1u

R21

TRK_LO_ADJ_GPIO_56

AC20

AB17

+VPWR

M1

TP2101

K22

VDD_P2_3

VBAT

K21

UIM_DATA_UART2_TX_D_GPIO_55

VCHG

K16
K18

+2.1V_RFTX

VDD_P2_2

ISNS_P

J23

UIM_CLK_UART2_RFR_N_GPIO_54

USB_VBUS

J21

VDD_P2_1

W22

10

H22

UIM_RESET_UART2_CTS_N_GPIO_53

AA22

H18

VDD_P1_7

V23

+2.1V_RFTX

R2111

EBI1_CS3_N_GPIO_52

AB16

H16

VDD_P1_6

ISNS_M

F14

EBI1_CS2_N_BT_PWR_EN_GPIO_51

AB23

E15

VDD_P1_5

CHG_CNT_N

E13

GP_CLK_GPIO_50

AA23

C17

VDD_P1_4

BAT_FET_N_BAT_

R2110

C16

I2C_SCL_GPIO_48
HEADSET_DET_N_ETM_TSYNC_A_GPIO_49

W21

C15

CAM_DATA_9_ETM_TPKT_B_7_GPIO_45

VDD_P1_3

VIB_DRV_N

4.7

C14

CAM_DATA_7_ETM_TPKT_B_5_GPIO_43

VDD_P1_2

Y22

B13

+2.1V_RFRX2

CAM_DATA_6_ETM_TPKT_B_4_GPIO_42
CAM_DATA_8_ETM_TPKT_B_6_GPIO_44

I2C_SDA_GPIO_47

USB_ID

A13

CAM_DATA_5_ETM_TPKT_B_3_GPIO_41

CAM_CLK_GPIO_46

V14

F21

CAM_DATA_4_ETM_TPKT_B_2_GPIO_40

VDD_MPLL_2

AA17

F13

CAM_DATA_3_ETM_TPKT_B_1_GPIO_39

VDD_P1_1

USB_DM

E21

VDD_MPLL_1

USB_DP

C22

VDD_IN2_4

AA15

C21

VDD_IN2_2
VDD_IN2_3

AA16

C20

2.2

VDD_IN2_1

SPKR_OUT_P

R2109

VDD_IN1_6

AA18

C18

U2101
QSC6055-CD

VDD_IN1_5

SPKR_OUT_M

B21

+2.1V_RFRX1

CAM_DATA_2_ETM_TPKT_B_0_GPIO_38

AA19

C8

VDD_IN1_4

PS_HOLD

C6

CAM_DATA_1_ETM_PSTAT_B_0_GPIO_37

PON_RESET_N

AA10

+2.6V_MSMP

CAM_DATA_0_ETM_PSTAT_B_1_GPIO_36

VDD_IN1_3

V12

AA8

CAM_DIS_GPIO_35

VDD_IN1_2

KPD_PWR_N

AA5

VDD_IN1_1

V13

V10
C11

+2.6V_MSMP
+VDD_P6
+VDD_P6

CAM_VSYNC_ETM_TSYNC_B_GPIO_34

VDD_EFUSE

CBL_PWR_N

E11

+1.8V_MSME

CAM_HSYNC_ETM_PSTAT_B_2_GPIO_33

W16

V3

VDD_CORE_12

XTAL_32K_OUT

T3

CAM_PCLK_GPIO_32

V15

P3

RINGER_CAM_FLASH_ETM_TCLK_GPIO_31

XTAL_32K_IN

+1.8V_MSME
+1.8V_MSME

AUX_PCM_CLK_SDAC_CLK_BT_PCM_CLK_GPIO_30

VDD_CORE_11

Y23

N3

AUX_PCM_DOUT_SDAC_DOUT_BT_PCM_DOUT_GPIO_29

VDD_CORE_9
VDD_CORE_10

XTAL_19M_OUT

M3

VDD_CORE_8

XTAL_19M_IN

L3

AUX_PCM_DIN_SDAC_MCLK_BT_PCM_DIN_GPIO_28

XO_TH_GND

J3
K3

VDD_CORE_7

T23

R2107 10K

H3

AUX_PCM_SYNC_SDAC_L_R_BT_PCM_SYNC_GPIO_27

U23

F3

C2131 2.2u

C2130 0.1u

C2129 0.1u

C2127 4.7u

C2128 0.1u

C2126 1n

C2125 4.7u

C2123 0.1u

C2124 1n

C2121 0.1u

C2122 0.1u

C2120 0.1u

C2118 0.1u

C2119 0.1u

T13

VDD_CORE_6

R23

R13

PA_R0_GP_PDM_1_FAILED_BOOT_GPIO_26

W23

W15

GP_PDM_2_ETM_PSTAT_A_2_WLAN_MUX_EN_GPIO_25

VDD_CORE_5

XO_ADC_REF

W14

+1.3V_MPLL

VDD_CORE_4

XO_ADC_IN

U19

KEYSENSE_0N_ETM_TPKT_A_7_GPIO_24

TCXO_OUT

+2.25V_SMPS_RF

VDD_CORE_3

VSW_RF

P19

KEYSENSE_1N_ETM_TPKT_A_6_GPIO_23

P23

AC14

VDD_CORE_2

V11

AB22

KEYSENSE_2N_ETM_TPKT_A_5_GPIO_22

R22

W19
AB20

VDD_CORE_1

VSW_MSMC

V19

+VPWR

KEYSENSE_3N_ETM_TPKT_A_4_GPIO_21

AC22

U18

DNI

+VPWR

VDD_A_5

VSW_5V

W11

KYPD_MEMO_ETM_PSTAT_A_1_GPIO_19
KEYSENSE_4N_ETM_TPKT_A_3_GPIO_20

AC15

+2.8V_LCD

KYPD_17_ETM_TPKT_A_1_GPIO_18

VDD_A_3

VREG_XO

AC1

R2106

KYPD_15_ETM_TPKT_A_0_GPIO_17

VDD_A_2
VDD_A_4

AC18

AB2

VDD_A_1

T21

R2105

AA3
AA13

KYPD_9_ETM_PSTAT_A_0_GPIO_16

VREG_USB

N9

KYPD_11_ETM_TPKT_A_2_GPIO_15

NCP_FB

W18

12K

N8

NCP_CTC2

VREG_RFRX2

M9

MDP_VSYNC_SEC_ETM_KSENSE_INT_BT_WAKEUP_GPIO_14

VREG_TCXO

M8

NCP_CTC1

VREG_RUIM

C12

MDP_VSYNC_PRI_GPIO_13

VREG_RFTX

C3

C2117 2.2u

C2116 220p

R2104 5.1K

C2115 3.3n
R2103 5.1K

C2114 4.7n

C2113 68n
510
R2102

C2111 82n

C2110 0.1u

C2112 4.7n

560
R2101

C2108 1u

C2109 33p

C2107 1u

C2106 1u

C2104 33p

C2105 0.1u

C2102 0.1u

C2103 0.1u

C2101 0.1u

B2

VCO_TUN_TX

T19

+1.3V_MSMC

EBI2_CS3_N_GPIO_12

T22

A1

VCO_TUN_GRX

V21

N22

EBI2_CS2_N_ETM_MODE_CS_N_WLAN_PWR_EN_GPIO_11

AA20

N21

VCO_TUN_CRX

VREG_RF

M18

EBI1_A_D_0

L2
M16

UART2_RX_D_UIM_PWR_DIS_GPIO_10

VREG_NCP

N18
G19

TX_OUT_LB_B

VREG_MSMP

R18

-1.8V_NCP
+2.1V_MSMA

UART1_RFR_N_GPIO_9

VREG_MSME1

P16

TX_OUT_LB_A

P18

J19

UART1_CTS_N_GPIO_8

W17

C13

SDCC_CLK_GPIO_7

TX_OUT_HB_B

AC21

D21

SDCC_DATA3_GPIO_6

TX_OUT_HB_A

VREG_MMC

CDMA_LB_RTR_OUT

RX_IN_GPS

VREG_MSMA

K23

SDCC_DATA2_GPIO_5

VREG_MPLL

L23

SDCC_DATA1_GPIO_4

RX_IN_C_LB

V16

N23

SDCC_CMD_GPIO_2
SDCC_DATA0_GPIO_3

RX_IN_C_HB

AB14

A15
M23

RBIAS_RX
RBIAS_TX

REF_ISET

A18

PA_ON1_GPIO_1

PWR_DET_IN

W13

J16
A19

CDMA_HB_RTR_IN
CDMA_LB_RTR_IN
CDMA_GPS_RTR_IN
CDMA_AWS_RTR_OUT
CDMA_HB_RTR_OUT

UART1_TX_D
GP_PDM_0_ETM_MODE_INT_GPIO_0

REF_GND

A20

UART1_RX_D

MIX_INP_C_HB
MIX_INM_C_HB

Y21

E23
H23

LNA_OUT_C_LB
MIX_INP_C_LB
MIX_INM_C_LB

VREG_5V

D23

LNA_OUT_C_HB

V22

B23

AB18

A21

C23

R2112 121K

A22

CDMA_HB_LNA_OUT
CDMA_LB_LNA_OUT
CDMA_LB_MIX_INP
CDMA_LB_MIX_INM
CDMA_HB_MIX_INP
CDMA_HB_MIX_INM
CDMA_PWR_DET_IN

EBI1_DQM_2

EBI1_D[0]
EBI1_D[1]
EBI1_D[2]
EBI1_D[3]
EBI1_D[4]
EBI1_D[5]
EBI1_D[6]
EBI1_D[7]
EBI1_D[8]
EBI1_D[9]
EBI1_D[10]
EBI1_D[11]
EBI1_D[12]
EBI1_D[13]
EBI1_D[14]
EBI1_D[15]
EBI1_A[0]
EBI1_A[1]
EBI1_A[2]
EBI1_A[3]
EBI1_A[4]
EBI1_A[5]
EBI1_A[6]
EBI1_A[7]
EBI1_A[8]
EBI1_A[9]
EBI1_A[10]
EBI1_A[11]
EBI1_A[12]
EBI1_A[13]
EBI1_BA[0]
EBI1_BA[1]
EBI1_ADV/
EBI1_CS0/

QSC6055

EBI1_DQM[0]
EBI1_DQM[1]
EBI1_DQM[2]

MAIN PCB CIRCUIT DIAGRAM

Internal Use Only

MIC1P
EAR_MIC

MAIN PCB CIRCUIT DIAGRAM

Internal Use Only

[BlueTooth_BCM2070BOKUBG(EXT_LPO)]

[SIDE KEY_TACT S/W]

+2.6V_BT

COM

C6003

C6004

C6005

10n

1u

10n

26MHz

C6018

15p

12p

2-1

1-1

GND
3

2-1

GPIO_0
GPIO_6
GPIO_1
GPIO_5

GND

10

R6043

10

R6042

10

10

R6040
R6039

2-1

1-1

VA6000

MAIN_LED8

GND

SW6001

VA6020

VA6001

BT_PCM_DOUT
BT_PCM_DIN
BT_PCM_CLK
BT_PCM_SYNC

C2

UART_TXD
D2
UART_RXD
F2
UART_RTS_N
E3
UART_CTS_N

XIN
XOUT

R6041

1-1
SW6003

A6

B1

F7

A3

A7

VREG

VREGHV

D4
E4
C4
A4
R6013

R6014

BT_UART_RXD
BT_UART_TXD

TP6001

LOCK

R6044 0

B2

VA6022

HUSB_DN
A2
HUSB_DP

VA6021

R6022 470
1

10M

GND
R6024

R6027 470

External LPO

TP6000

FN
R6028

KB6001

KB6002

KB6003

KB6004

KB6005

KB6006

KB6009

KB6010

KB6011

KB6012

KB6013

KB6014

KB6007

470
KB6008

3.3K

R6029

+2.6V_MSMP

QKEY_INT/
QKEY_I2C_SCL
+2.6V_MSMP

KB6000

R6030

CLR

KB6015

470
KB6016

KB6017

KB6018

KB6019

KB6020

KB6021

R6031

KB6022

UP

KB6023

ENTER

28
27

QKEY_RESET/
+2.6V_MSMP

26
120K

R6033

25
24
23

3.3K

KB6024

GND2

GND1

RESETB

U6002
PP2106M3

XI
XO
CLK_SEL

P54
P53
P52
P51

VDD

P50

P10

P47

8
9

R6032

10

470

11
12

KB6028

KB6029

KB6030

KB6031

KB6032

KB6033

KB6034

KB6035

KB6036

KB6037

KB6038

KB6039

14

LEFT

R6035

P46

P45

KB6027

OK

RIGHT

SHIFT

470

15

16

P44

17

P43

13

R6034

18

KB6026

KB6025

P15

P17

P55

P56

P57

PGND

P41

QKEY_I2C_SDA
+2.6V_MSMP

22

TEST

29

SEL_28P

470

P42

R6036

KB6040

KB6041

KB6042

SPACE

KB6044

KB6045

KB6046

DOWN

SUB_COL4

SUB_COL5

SUB_ROW1

470

R6037

KB6047

.,

470

[Qwerty with PP2106M3]

UP
R6038

90

VA6017

VA6016

VA6015

VA6014

VA6013

VA6012

VA6010

VA6011

VA6009

VA6008

VA6007

VA6005

VA6006

VA6003

VA6005

470

VA6002

DNI

R6025 470
R6026 470

P40

10n

32.768KHz

750K

19

C6022

R6023 470

20

C6021

21

R6020

R6018 470
R6021 470

R6017

0.1u

C6024

R6019

0.1u

BT_LPO

R6016 470

X6001SSP-T7-F_12.5PF_20PPM
3

VCC

C6023

20p

U6001

20p

0
R6015

C6020

+2.6V_MSMP

C6019

F6
F3
E6
D7
B6
A1

VSS6
VSS5
VSS4
VSS3
VSS2
VSS1

C6017

C3
D5
B3
F4

LPO_IN

PCM_IN
PCM_OUT
PCM_CLK
PCM_SYNC

C6

GND

U6000
BCM2070B2KUBXG

LD6003

F5
E5

TM2

SPIM_CLK
SPIM_CS_N

LD6002

CAM

RST_N
B5
REG_EN

SCL
SDA

LD6001

MAIN_LED7
C5

RFP

LD6000

VA6019

2-1

B4

BT_LPO

X6000
TSX-3225_26MHZ

D3

C1
E2

each CH. 30mA under check

C6016

DNI

RES

E1
D1

C6015

2450MHz

+2.6V_MSMP

2.2u
C6006

C7

VDDPX
E7
VDDRF

D6

15K

1-1

DNI

10p

SW6002

C6014

DNI

C6007

DOWN

1.2p
C6013

IN
OUT
4
GND1 GND2

100p

1
2

VDD_USB
B7
VDDTF

FL6000

C6011

10p

C6012

R6009

10p

VDDC1
F1
VDDC2

C6026SDBTPTR3015

VDDO

DUMMY1

A5

10n

VBAT

DUMMY2

C6008
15p

DUMMY3
FEED

C6025

VA6018

LED_BL_OUT

+2.6V_MSMP
ANT6000

10n

SW6000

10p

FB6000 600

C6002

[KEYPAD BACKLIGHT]

UP

2.2u
C6000

C6001

DOWN

LOCK

CAM
COM

MAIN PCB CIRCUIT DIAGRAM

Internal Use Only

[Touch & Haptic Driver]

C5001
2.2u

15
1
2
3

SDA
XP

SCL

YP

SADD

XN

LEN

YN

INTB
PWM/CLK

19

PAD_EAR_SENSE/

HEN
PGND

1K

10

MIC_BIAS_EN

A0

VCC1

0B0

0B1
S0

8
7

VCC2

A1
1B0

1B1

GND1

S1

GND2

GND

6
17
5
10
16

R5009

TOUCH_EN

TOUCH_IRQ
LIN_PWM_FREQ

MOTOR_EN

12
R5013

13

200K
C5006

L5000

82n

L5001

82n

CN5000
1
2

3.9n

15K
1

R5008

14

11

C5005 1u
1K

9
11
C5103 470p

R5104

C5102 10u

R5103

GAIN

TOUCH_I2C_SDA
TOUCH_I2C_SCL

Close to Motor(eliminate Motor noise)

R5102

12

EAR_MIC

5
3
6

VCC

OUT

GND

VINVIN+

U5101
NCS2200SQ2T2G
D5100

R5106 47K

4
3

C5104 1u

[AUDIO_SUB SYSTEM]

CLOSE TO EARJACK
J5100
JAM3333-F47-7F

D4

SVDD
B3
B2

I2C_SCL
I2C_SDA

C6510

2.2u

+1.8V_MSME

91

R6502 20

C6503 0.1u
C6508 0.1u

C6504 0.1u

HPH_L
HPH_R

C6506 2.2u

CPVDD
A3
CPVSS
A4
CP
A5
CN

L5002

82n

L5003

82n

SPK+
SPK-

CN5001
1
2
EMS1812TPB6

A2

HPL
A1
HPR

B5

SCL
SDA

CLOSE TO EARJACK

IN3IN3+

SPK-

C6507 2.2u

D3
C3

IC6501
WM9093ECS-R

IN2IN2+

SPK+

C6505 2.2u

D2
D1

IN1IN1+

HPVDD

HPH_OUT_R_N

C2
C1

B4

C5017 1u

GND

HPH_OUT_L_P

C5

OUT+
D5
OUT-

R6501 20

C5016 1u

BIAS

PAD_EAR_SENSE/
HPH_R

M5-MIC
M4-L

M3-DETECT
6
ASSIST_PIN
3
M1-R
2
M6-GND

B1

4
5

[SPK_OUT]

+VPWR

C4

EAR_MIC
HPH_L

C6509 2.2u

VA5101
ICVL0505101V150FR

EARPHONE_KEY

R5105 560K

+2.6V_MSMP

VA5100
ICVL0505101V150FR

+2.6V_MSMP
+2.6V_MSMP

U5100
NLAS3158MNR2G

VDP
VDN

1M

Q5100

18

1M

VDDP

R5012

+2.6V_MSMP

2
47K

S
G

R5101

R5100 200K

C5101 27p

C5100 100n

EAR_SENSE

R5005

TOUCH_X+
TOUCH_Y+
TOUCH_XTOUCH_Y-

VDD

R5011

VBAT

ACTIVE HIGH

R5000
DNI

R5002
4.7K

U5001

+2.6V_TOUCH

4.7K

C5000
2.2u

+2.6V_TOUCH

4.7K

+2.6V_TOUCH

R5001

+VPWR

R5003

[EARJACK CIRCUIT]

VA5102

VA5103

MAIN PCB CIRCUIT DIAGRAM

Internal Use Only

[MAIN_B TO B CONN_60PIN 1.0T_LSM]

[CAM_SOCKET_MITSUMI]

+2.8V_LCD
C4000

C4001

33p

0.1u
FL4000

+2.6V_CAM_IOVDD

C4004

C4005

C4006

C4007

100p

100p

15p

15p

58

57

56

55

54

53

52

51

10

50

11

49

12

48

13

47

14

INOUT_A2

INOUT_B2

INOUT_A3

INOUT_B3

INOUT_A4

INOUT_B4

TP4009

15pF

TP4012

9
8
7

46

15

45

16

44

17

43

18

42

19

41

20

40

21

39

22

38

23

37

24

36

25

35

26

34

27

33

28

32

29

31

30

+1.8V_MSME
MIC1P
MIC_BIAS
SKPD_LED_EN
EAR10N
EAR10P

PROXI_OUT/
+3.0V_PROXI

4.7u

PROXI_3D_SDA
R4018

TOUCH_X+
TOUCH_X+2.6V_MSMP

INOUT_A1

INOUT_B2

INOUT_A2

INOUT_B3

INOUT_A3

INOUT_B4

INOUT_A4

G2

LED_BL_OUT
MAIN_LED1
MAIN_LED2
MAIN_LED3
MAIN_LED4
MAIN_LED5
MAIN_LED6

FL4002
INOUT_B1

10

INOUT_A1

INOUT_B2

INOUT_A2

INOUT_B3

INOUT_A3

INOUT_B4

INOUT_A4

8
7
6

0.1u

U4000

SD_DET/ : GPIO Pull-up

TP4011
R3201

+3.0V_SD

+1.8V_MSME

VOUT
GND

1
2

+3.0V_SD

15pF

INOUT_A2
INOUT_A3

INOUT_B4

INOUT_A4

1u

1u

SW

ZD4000

1 C1

SD_DATA[2]
SD_DATA[3]
SD_CMD
+3.0V_SD
SD_CLK

2 C2
3 C3
4 C4
5 C5
6 C6
7 C7

S4001

[TEMP CHECK]
R4016

TEMP_ADC
33n

92

C4012

51K

68K

+2.8V_TCXO

PT4000

COM

150K

ZD4006

ZD4005

ZD4004

ZD4003

ZD4002

8 C8
G6 G4 G2

R4017

SD_DATA[0]
SD_DATA[1]

4
3

TP4010

G5 G3 G1

EBI2_D[12]
EBI2_D[13]
EBI2_D[14]
EBI2_D[15]

2
3
4

15pF

PROXI_3D_SCL
R4019
4.7K

+2.6V_MSMP

[PROXI LDO(300mA)]
DNI
+VPWR
PROXI_LDO_EN

C4014

INOUT_A1

DNI_EUSY0365101 U4631

C4013

56K

R4014

56K

56K

R4013

R4012

56K

56K

R4010

R4011

47K

VDD
CE

PGND

SD_DET/

4
3

+VPWR
SD_LDO_EN

INOUT_B3

Card Insert : Switch ON

EBI2_D[8]
EBI2_D[9]
EBI2_D[10]
EBI2_D[11]

INOUT_B2

TOUCH_Y+
TOUCH_YFOLDER_CLOSE/

[SD Socket(1.62T)_ALPS] [SD LDO(300mA)]

SUB_COL4
SUB_COL5
GREEN_EN
RED_EN

C4661
DNI

VDD
CE

PGND

C4010

0.1u

15pF

INOUT_B1

PWR_ON_SW/
+VPWR
SUB_ROW1

C4009

FL4008
9

4.7K

0.1u

EBI2_D[4]
EBI2_D[5]
EBI2_D[6]
EBI2_D[7]

FL4005
INOUT_B1

+2.6V_MSMP
C4008

G1

G2

G1
4

INOUT_B1

C4663

ZD4001

R4009

INOUT_A1

CAM_MCLK

30

1u

+2.8V_CAM_AVDD

R4008

TP4008

100

C4015

+2.6V_CAM_IOVDD

R4007

MLCD_VSYNC

CAM_RESET/

R4006

+1.8V_CAM_DVDD

EBI2_OE/
EBI2_WE/

CAM_PWR_DOWN

R4005

FL4007

MLCD_RESET/
100

59

TP4006
TP4005

2.2K
R4004

INOUT_B4

G2

R4002
2.2K
R4003

INOUT_B3

15pF

15pF

G2

INOUT_A3
INOUT_A4

TP4004

G1

7.5pF

INOUT_B2

INOUT_B4

INOUT_A2

60

10

INOUT_B3

INOUT_A4

CAM_VSYNC
CAM_HSYNC
CAM_I2C_SCL
CAM_I2C_SDA

INOUT_B1

7.5pF

INOUT_A3

10

TP4007

INOUT_B2

INOUT_A4

EBI2_D[0]
EBI2_D[1]
EBI2_D[2]
EBI2_D[3]

10

INOUT_B4

INOUT_B1

INOUT_B4

G2

INOUT_B3

INOUT_A1
INOUT_A2

INOUT_A3

G1

INOUT_A3
INOUT_A4

LCD_RS/
MLCD_CS/

FL4004
1
2

INOUT_A2

INOUT_B3

10

INOUT_B2

G1

INOUT_A2

S4000

20
19
18
12
11
10
9
7

INOUT_A1

G2

INOUT_B1

PCLK
VSYNC
HSYNC
STANDBY
SCK
SDA
RESETB
MCLK

8
15
21
6
17
13
14
16

INOUT_A1

TP4002 TP4003

G2

D0
D1
D2
D3
D4
D5
D6
D7

LCD_ID

G1

22
23
24
1
2
3
4
5

INOUT_A1

INOUT_B2

CN4000

FL4003

TP4001

FL4006

CAM_DATA[4]
CAM_DATA[5]
CAM_DATA[6]
CAM_DATA[7]

15p

10

10

7.5pF

C4003

15p

G2

INOUT_B3
INOUT_B4

G1

INOUT_B2

INOUT_A4

INOUT_B1

INOUT_A2
INOUT_A3

10

INOUT_A1

G1

C4002

32
31
30
29
28
27
26
25

PGND1
PGND2
PGND3
PGND4
PGND5
PGND6
PGND7
PGND8

DGND1
DGND2
DGND3
AGND1
AGND2
DVDD
VDDIO
AVDD

CAM_DATA[0]
CAM_DATA[1]
CAM_DATA[2]
CAM_DATA[3]

G2

10

FL4001

TP4000

CAM_PCLK

30

R4001

INOUT_B1

G1

VOUT
GND

1
2

+3.0V_PROXI
C4662
1u

MAIN PCB CIRCUIT DIAGRAM

Internal Use Only

ISNS_P

COLLECTOR

2.2u

CHG_CNT/

NC2

GATE

CN3000

+VCHAR

BASE

DRAIN

[ Battery Connector]
C3000

EMITTER

SOURCE

0.1

R3004

10

DRAIN_B
COLLECTOR_B

NC1

51K

Q3000
1

R3000

[Charging Circuit_QSC]

+VBATT

D1

R3001 80.6K

+2.6V_MSMP

BATT_FET/

1
2

BATT_THM_ADC

ISNS_M

TP3000

3
R3002 4.7K

BATT_ID_PU

TP3001

4
D2

FL3000

ZD3002

C3019
56p

300K

2.2u

47p

C3001

R3005

C3004

VA3000

C3002 100u
C3020

+VBATT

GND2 GND1

VA3001

IN

OUT
C3003

33n

+VPWR

BATT_ID

100u

Protect Power off Tunning Cap_QWERTY CASE

[Charging Pump AAT2862]

C3005

21

I2C_SDA

LDOB
SDA
LDOC

EP

PGND

20

AGND

LDOD

R3013
100K

SCL

25

I2C_SCL

200mA

+2.6V_CAM_IOVDD

200mA

+2.8V_CAM_AVDD

200mA

+1.8V_CAM_DVDD

200mA

+2.6V_TOUCH

11

C3014

C3015

C3016

C3017

C3018

2.2u

2.2u

2.2u

2.2u

2.2u

IN2

IC1
IC2

OVLO

3
4

USB_DACC_ADC
USB_D+

VBUS
DD+
ID

7
9
11
13
15

04-5151-005-103-883
ENRY0011401

R3014
2.2K

+2.6V_MSMP

DNI

AUX : Must use under 30mA/Ch.

OUT2

14

ZD3001

LDOA

10

12
1

ZD3000

EN

16

C3010

CP_EN

BL8_AUX2

17

IN1

DNI

18

OUT1

C3009

BL7_AUX1

19

+VCHAR

10

200K

VA3002

BL6

15

33n

BL5

14

MAIN_LED2
MAIN_LED3
MAIN_LED4
MAIN_LED5
MAIN_LED6
MAIN_LED7
MAIN_LED8

R3007

C3011

BL4

U3001

1u

BL3

13

+2.6V_MSMP

D3001

BL2

8
U3000

+5.0V_USB

MAIN_LED1

C3006

BL1

12

R3006

GND

IN2

10u

LED_BL_OUT

R3016

PGND

22
C1-

C2-

24

OUT

C3013

23

IN1

CN3001
1

C1+

1u

C3008 1u

+VPWR

C2+

C3007

R3008

[ Micro USB]

1u

R3015
2.2K

[MICRO USB IO CAN]

[SHIELD CAN_CLIP]
SC300

CN3002
1
2

93

UN270

3. BGA Pin Map

3.1 EUSY0336202 (QSC6055) : 424 CSP (Bottom View)

69

LG Electronics Inc.
94

UN270

3.2 EUSY0347506 (H8BCS0SI0BAR-46M) : 149 FBGA (Top View)

All pins are used

70

LG Electronics Inc.
95

UN270

3.3 EUSY0418701 (BCM2070B2KUBXG) : 42-bump WLBGA (Top

View)

71

LG Electronics Inc.
96

UN270

3.4 EUSY0403901 (WM9093ECS-R) : 20-bump CSP (Top View)

72

LG Electronics Inc.
97

UN270

4. PCB Layout
4.1 Main PCB
4.1.1 Top Side

KB6000

KB6012

LD6000

KB6001

KB6013

KB6026

KB6014

KB6002

KB6027

KB6015

KB6003

KB6039

R6041

> >>>>>>>>>>>>

KB6007

LD6002

KB6006

KB6019

R6042

VA6001

KB6005

KB6018

>

KB6004

KB6017

KB6031

LD6001

KB6016

KB6030

KB6042

KB6029

41
60
KB

KB6028

KB6040

KB6009

KB6021

KB6033

KB6045

R6043

LD6003

KB6010

KB6022

KB6034

KB6046

KB6011

KB6023

KB6035

KB6047

98

ANT1007

;8.A>>>>>

KB6008

KB6020

KB6032

KB6044

LG Electronics Inc.

73

KB6025

KB6037

KB6038

KB6024

KB6036

VA6000
R6040

ANT1006

C1029
C1024
C1026

R1016

C1051

ANT1000

C1003

SW1001

ANT1002

C1002

L1052

SC300

C1022
L1012

C1035 C1039

C2148B
C2147B

U1005

R1004

C1030 L1017
L1053 C1031

U1006

FL1008
FL1006

C1038

C2133B
C2135B
C2141B
C2142B
C2140B

L1044
L1041
L1037
L1034

R4016

R3201

C1075

1
E

AB

AA

AC

L1036

R8013

FL4000

R3014

C3006

FL1011

FL1009

R8014
TP8001

R5011

TP4005

TP4009

R6037

R6018

VA6003
TP4012

VA6004

R4019 R4018

VA6005 R6036

R6030

VA6009

R6031

VA6008

R6032

VA6007

R6035

VA6006

C4661

U4631

VA6002 C4663

R6022

VA6021

TP4000

C1087

R3006
R3000
TP3000

C4003

R4001 C4002

R3002

C4662

R8016

ZD3002

C3001

C4008

S4000

FL4004

R4003
R4002

R5104

C5102

C1105

R4004
U5100

C6008

C6018

C6005

C5100

C4010

R5100

R4007

C6002

R8019
R8020

R6501

C6020

X6001

U6001

C6021

C6004

R6015

R6039

CN5000

C6015

C5101

R5105

R6017

R6019

FB6000

C6001

C4009
R4008

TP4007

C4007

R4006
C4006

L1043

R5103

R1011

ANT1005

TP4010

U8000

R8021

R6502

C6507 C6505

C3019

VA3001

R3001 R3005

TP3001
TP6001

R4009
C3004

R3004
C3003

R3008

U3001

R3016

FL4001

C3000

C3010
ZD3000

C3009

R3013
C3016 C3017

R3007

C3011

VA3002

C3007

C3015

C1080

C3018

C3014

L5003

TP8002

TP4011

R5013
C5006

R6016

VA6016
VA6015
R6021

R6029

VA6014

R6023

VA6013

C1092
L1045

CN3000
D3001

CN3002

ZD3001

Q3000
C3020

C3002

R4005

C4005

R3015

FL3000

FL4006

TP4002

TP4003

L5000

L5001

FL6000

C6014

C6013

U5101

C5103 C4004

R5106

Q5100

C5104

C6017

C6012

R6009

R5101

C3013

X6000

R6044

U6000
7
C6007

C6011
C6026

R5102 VA5100
D5100

VA5101

AN
T6
00
0

U3000

C3008

SW1002
R1010

VA3000

R6013

R6014

L1046

C6508

C6510

F
E
D
C
B
A

C6003

C6006

C6000

C1071

FL4003

TP8000

C4013

R5008 C5005 R5005

R5000
R5002

R5001

VA6017

30

L1051

L1050

31

C2205B R2202B

R8000
C8000
R8001

L1038
L1055

C1099

VA5103

R2114B

C2123B
C2121B

C2204B C2203B
R2203B R2201B
R2123B C2202B

C1067

C1073

R1008

C1066

U1007

R1007

C1065

C1100

C1089

FL1010

L1049

C1090

L1048

VA5102 L5002

ZD4000

C1104

L1061

C1079
C1082
C1081

C1070

C2164B
C2173B

R8015 C2126B C2124B

C2125B

X2101B

C2137B C2158B

C2167B R2112B C2161B C2162B

C2174B
C2171B
C2168B
C2170B
R2117B

C2120B

C2105B
R2108B

VA6018

0
0
0

R4017 C4012

C1103

L1060

C1088 C1085
C1086 C1078
C1074

C2169B

C2165B C2177B

23

C2151B

C2201B

S
6

X2201B

U2201B

12

60

C1018

C2159B
C2160B

R2105B
C2145B
R2110B

C2146B R2102B
C2144B
R2120B

U1004

C1032 L1018

C1025
L1007

C1016 C1015

C1000
C1005

C1048

R1005

L1029

C1037
C1036

C1017

U1000

C1014

C1057 L1031
C1058

L1030
C1056

C2132B R2113B R2121B R2116B R2122B R2106B

FL1004

C1054

R1006

C2115B
C2116B
C2112B
C2111B
R2104B

C1019

W
6
0

C2114B

C2113B

0
3
VA6022

R2204B C2154B

C2103B C2155B

C2106B C2208B C2156B C2104B

TP2202B

C2107B C2209B C2149B R2118B

VA6019

R1002 R1003
R1001 C1033

L1056

R1020 C1064
C1063 L1033
C1060

C1042
C1095
R1018
C1098
L1011

L1010

L1057

C1013

C1041

C1049 C1097

R1017 L1062

C1061

C1045

R2101B R2103B R2111B C2108B R2109B

C2109B

FL1003

L1022

FL1005
C1062 R1019

C2143B C2110B

C1046

R1000

C1001

U1002

L1003
L1032 C1059

L1009

U1003
L1014

L1020

C1027 C1034

C1102

C1093

U2101B
J

R1015 C1096

C1106

L1000
L1019

FL1002

R1009
L1004
C1044

C1050
L1026

C2138B

C2134B

C1052
L1028

C2136B

C2117B

C1053

L1001
R2119B

L2101B
C2172B

C2157B R2115B
B

A
1

TP2201B

C5016

C5017

IC6501

C6509

L1023

L1035 L1042

FL1000
FL1007

C2131B

C2129B

C2128B

C2163B

R1013
L1064
L1063

C2127B

C2130B R2107B

L2102B

C2119B
C2101B

2 C 0 1 C2118B
2 C
20B 5C 1 B2C2175B
2 B C2153B
2 5 1

R5003
TP6000

VA6012

TP2101B

U6002

VA6011

0B C2206B
20 21 C2

U5001
R5009
C6024
F

R6033

C5001

TP4006
TP4008

R6034

C6023
C

A
7
R6028

R6026

R6025

BC 7

R5012
C5000

FL4008

B C2139B
2 2 C2178B
1 2 C C2176B

U4000

FL4002
FL4005

C4014

JTAG8000

C4000

FL4007
VA6010
R6027

R6038

R8017

C2166B

L1015 FL1001

C1028

PT4000

R4010

ZD4003

ZD4002

S4001
TP4004

C4001

CN4000
C8001

R8018
C6503 C6504

C6506

C6016

C6022

R6024

L1013

C1101

CN5001
R4012

R4011

R4014

C4015

ZD4004

ZD4006

R4013

SW6001
ZD4001

ZD4005

VA6020

TP4001

SW6002
C6019
R6020

C1040 L1021

99
LG Electronics Inc.
C3005

74

J5100

ANT1003

25
C60

4.1.2 Bottom Side

UN270

UN270

5. Exploded View
5.1 Full Exploded View

76

74 75

73

57
56

69

54

59

67
77

64
76

53
52

71

62

58

70
55

63
68
65

34

66

32

13

15

29

16

38
37

28
26
27

10
7

45 42

31
12

33

40 43
35
36 41

30

50

49

40
39

24
14
18

19

21
20

22 23

25

17
11
9
5

No
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1

75

PART NAME
COVER,BATTERY
BATTERY CELL
DECO, (CAMERA)
SCREW MACHINE, BIND
WINDOW, CAMERA
TAPE, PROTECTION REAR(1)
TAPE, DECO CAMERA
CAP, MS
TAPE, PROTECTION REAR(2)
TAPE, PROTECTION KEY(LOCK)
BUTTON, (LOCK)
SHEET, EAR-JACK
PAD, SUB INTENNA
Label Qualcomm
PAD, (MOTOR)
PAD, (CAMERA)
CAP, (USB)
TAPE, PROTECTION KEY(VOLUME)
BUTTON, (VOLUME)
TAPE, BRACKET CONNECTOR
BRACKET, CONNECTOR
GASKET, CONNECTOR
CAP, (MULTIMEDIA)
TAPE, PROTECTION KEY(CAMERA)
BUTTON, (CAMERA)
COVER, REAR
FILTER, SPEAKER(2)
PAD, SPEAKER
PAD, SPEAKER(2)
SPEAKER
INTENNA, MAIN
Label A/S
CAN ASSY, SHIELD
TAPE, ABSORBER
MOTOR
ANTENNA, SUB
PCB Assembly, Main, SMT
DOME, SHEET ASSY
SCREW, HINGE
INSERT
MAGNET
SHEET, FRONT
TAPE, MAIN CONNECTOR
SHEET, FRONT(2)
COVER FRONT
KEYPAD ASSY MAIN
TAPE, PROTECTION FRONT

PART NUMBER
MCJA00
SBPL00
MDAY00
GMZZ00
MWAE00
MTAB00
MTAA00
MCCZ01
MJN061101
MJN061103
MBJZ02
MHK000000
MPBZ00
MEZ062200
MPBZ02
MPBZ03
MCCZ00
MJN061102
MBJZ00
MJN000000
MBFZ00
MDS000000
MCCZ02
MJN061104
MBJZ01
MCJN00
MFBZ00
MCQ000004
MCQ074200
SUSY00
SNMF01
MEZ000900
ACKA00
MTAZ00
EAU00
SNMF00
SAFF02
ADCA00
GMEY00
MICE00
RAB150000
MCQ000001
MTAZ00
MCQ000000
MCJK00
AKAC00
MTAB00

No

PART NAME

78

SCREW MACHINE,BIND

GMEY00

77

HINGE,ASSY

AEH000000

76

CAP,SCREW

MBL00

75

PAD, LOWER PROXIMITY

MPBZ03

74

TAPE PROTECTION

MJN061100

73

PAD, (T/W CONNECTOR)

MPBZ02

72

PAD, LCD CONN

MCQ015700

71

PAD, (MIC) 2.

MCQ000004

70

DOME SHEET, SUB

ADB00

69

PAD, (FPCB SENSOR)

MCQ000000

68

FILTER, (MIC)

MDJ000000

67

DECO, UPPER COVER L, R

MJN020802

66

INSERT

MET099500

65

DECO, UPPER COVER R

MCR000001

64

DECO, UPPER COVER L

MCR000000

63

MIC PAD

MCQ000001

62

LCD BOTTOM INSULATOR

MEV000001

61

INSULATOR, LCD CONN

MIDZ00

60

TAPE, LCD CONN

MTAZ00

59

FPCB ASSY

SACY00

58

SUB PCB ASSY

SAJY00

57

LCD, ASSY

SVLM00

56

FILTER, (RECEIVER)(3)

MFBZ00

55

KEYPAD ASSY SUB

AEX00

54

COVER UPPER

MCK084400

53

WINDOW, ASSY LCD

EBD00

52

TAPE, PROTECTION WINDOW

MJN089300

51

COVER, LOWER

MCJY00

50

TAPE, WINDOW MAIN(1)

MJN089300

49

TAPE, WINDOW MAIN(2)

MJN089301

48

TAPE, PROTECTION SLIDE

MJN061102

LG Electronics Inc.
100

51

61

60

48

72

Loccation No

44

46

47

78

UN270

5.2 Assy Exploded View

ACGK00
SVLM00

MJN089300
EDB00

AKAC00

MTAB00

ACGU00

MPBZ00

GMEY00

MFBZ00
ACQ00

SACY00

MJN0089300

MJN061102

SAJB00

MBL00
ME000001
GMEY00

MIDZ00
MTAZ00
MCQ000001

AEX00

MCJA00
SBPL00

ACGM01

SAFY00

ACKA00

GMZZ00

Part Name

76

Location No

COVER, BATTERY

MCJA00

BATTERY CELL

SBPL00

SCREW MACHINE, BIND

GMZZ00

COVER ASSY, REAR

ACGM01

CAN ASSY, SHIELD

ACKA00

PCB ASSY MAIN

SAFY00

KEYPAD ASSY MAIN

AKAC00

SCREW, HINGE

GMEY00

COVER ASSY, FRONT

ACGK00

TAPE, PROTECTION FRONT

MTAB00

CAP, SCREW

MBL00

SCREW MACHINE, BIND

GMEY00

COVER ASSY, LOWER

ACGU00

FPCB ASSY

SACY00

LCD BOTTOM LNSULATOR

MEV000001

INSULATOR, LCD CONN

MIDZ00

LCD, ASSY

SVLM00

TAPE, LCD CONN

MTAZ00

SUB PCB ASSY

SAJY00

PAD, MIC SLIDE

MCQ66

KEYPAD ASSY SUB

AEX00

PAD, RCV TOP

MCQ000001

FILTER, (RECEIVER)

MFBZ00

COVER ASSY, UPPER

ACQ00

TAPE, WINDOW MAIN (1)

MJN089300

WINDOW ASSY LCD

EDB00

TAPE, PROTECTION WINDOW

MJN089300

TAPE, PROTECTION SLIDE

MJN061102

LG Electronics Inc.
1

UN270

5.3 Serviceable Parts

MFBZ00

SVLM00

AKAC00
SACY00

EDB00

ACGK00

MPBZ00
SURY00
ACQ00

AEX00
ADB00
GMEY00

MTAB00
MBL00

MIDZ00

ACHU00

MTAZ00

GMEY00

SAJY00

EAU00

SBPL00
MCCZ01

GMZZ00
ACGM01
SNMF01
ACKA00
SAFY00
ADCA00

Part Name

Location No

COVER, BATTERY

77

MCJA00

BATTERY CELL

SBPL00

CAP, MS

MCCZ01

SCREW MACHINE, BIND

GMZZ00

COVER ASSY, REAR

ACGM01

INTENNA, MAIN

SNMF01

MOTOR

EAU00

CAN ASSY, SHIELD

ACKA00

PCB ASSY MAIN

SAFY00

DOME, SHEET ASSY

ADCA00

KEYPAD ASSY MAIN

AKAC00

SCREW, HINGE

GMEY00

COVER ASSY, FRONT

ACGK00

TAPE, PROTECTION FRONT

MTAB00

CAP, SCREW

MBL00

SCREW MACHINE, BIND

GMEY00

COVER ASSY, LOWER

ACGU00

RECEIVER

SURY00

PAD, RCV TOP

MPBZ00

FPCB ASSY

SACY00

FILTER, (RECEIVER)

MFBZ00

INSULATOR, LCD CONN

MIDZ00

LCD, ASSY

SVLM00

TAPE, LCD CONN

MTAZ00

SUB PCB ASSY

SAJY00

ADB73619101

ADB00

KEYPAD ASSY SUB

AEX00

COVER ASSY, UPPER

ACQ00

WINDOW, ASSY LCD

EDB00

LG Electronics Inc.
1

MCJA00

UN270

6. Part Lists
6.1 Main PCB Top
No

Part No

SAFD0150803

EDLH0015107

EDLH0015107

Designator

LD6000

LD6001

Qty

Description

Part Site Specification

PCB
Assembly,Main,SMT
Top

LGUN270.AUCLRD 1.0 MAIN

LED,Chip

99-218UMC/2229397/TR8 WHITE
2.95~3.25 30mA 1200~1600mcd x, y
110mW - R/TP 2P - EVERLIGHT
ELECTRONICS CO., LTD.

LED,Chip

99-218UMC/2229397/TR8 WHITE
2.95~3.25 30mA 1200~1600mcd x, y
110mW - R/TP 2P - EVERLIGHT
ELECTRONICS CO., LTD.

EDLH0015107

LD6002

LED,Chip

99-218UMC/2229397/TR8 WHITE
2.95~3.25 30mA 1200~1600mcd x, y
110mW - R/TP 2P - EVERLIGHT
ELECTRONICS CO., LTD.

EDLH0015107

LD6003

LED,Chip

99-218UMC/2229397/TR8 WHITE
2.95~3.25 30mA 1200~1600mcd x, y
110mW - R/TP 2P - EVERLIGHT
ELECTRONICS CO., LTD.

ERHZ0000206

R6040

Resistor,Chip

MCR01MZP5F10R0 10OHM 1% 1/16W

1005 R/TP - ROHM.

ERHZ0000206

R6041

Resistor,Chip

MCR01MZP5F10R0 10OHM 1% 1/16W

1005 R/TP - ROHM.

ERHZ0000206

R6042

Resistor,Chip

MCR01MZP5F10R0 10OHM 1% 1/16W

1005 R/TP - ROHM.

ERHZ0000206

R6043

Resistor,Chip

MCR01MZP5F10R0 10OHM 1% 1/16W

1005 R/TP - ROHM.

10

MCIZ0008201

ANT1007

Contact

COMPLEX LG-VN530 VRZ DW:DARK

BROWN PRESS, BeCu, , 3.0, 1.5, 1.5,

11

SEVY0003901

VA6000

Varistor

EVL5M02200 5.5V 0% 480F

1.0*0.5*0.6 NONE SMD R/TP
AMOTECH CO., LTD.

12

SEVY0003901

VA6001

Varistor

EVL5M02200 5.5V 0% 480F

1.0*0.5*0.6 NONE SMD R/TP
AMOTECH CO., LTD.

PCB,Main

SPFY0234001 LG-UN270 VRZTG D

FR-4 Staggered via STAGGERED-8
0.75 MAIN UNITECH PRINTED
CIRCUIT BOARD CORP.

13

87

SPFY0234001

SPFY02

LG Electronics Inc.
103

UN270

6.2 Main PCB Bottom

Designa
tor

No

Part No

SAFC0152903

ECCH0000110

C1066

ECCH0000110

Description

Part Site Specification

PCB
Assembly,Main,SMT
Bottom

LGUN270.AUCLRD 1.0 MAIN

Capacitor,Ceramic,Chip

MCH155A100D 10pF 0.5PF 50V NP0 -55TO+125C

1005 R/TP - ROHM Semiconductor KOREA
CORPORATION

C6001

Capacitor,Ceramic,Chip

MCH155A100D 10pF 0.5PF 50V NP0 -55TO+125C

1005 R/TP - ROHM Semiconductor KOREA
CORPORATION

ECCH0000110

C6007

Capacitor,Ceramic,Chip

MCH155A100D 10pF 0.5PF 50V NP0 -55TO+125C

1005 R/TP - ROHM Semiconductor KOREA
CORPORATION

ECCH0000110

C6012

Capacitor,Ceramic,Chip

MCH155A100D 10pF 0.5PF 50V NP0 -55TO+125C

1005 R/TP - ROHM Semiconductor KOREA
CORPORATION

ECCH0000110

C6026

Capacitor,Ceramic,Chip

MCH155A100D 10pF 0.5PF 50V NP0 -55TO+125C

1005 R/TP - ROHM Semiconductor KOREA
CORPORATION

ECCH0000112

C1018

Capacitor,Ceramic,Chip

MCH155C150J 15pF 5% 50V NP0 -55TO+125C 1005

R/TP - ROHM Semiconductor KOREA CORPORATION

ECCH0000112

C4002

Capacitor,Ceramic,Chip

MCH155C150J 15pF 5% 50V NP0 -55TO+125C 1005

R/TP - ROHM Semiconductor KOREA CORPORATION

ECCH0000112

C4003

Capacitor,Ceramic,Chip

MCH155C150J 15pF 5% 50V NP0 -55TO+125C 1005

R/TP - ROHM Semiconductor KOREA CORPORATION

10

ECCH0000112

C4006

Capacitor,Ceramic,Chip

MCH155C150J 15pF 5% 50V NP0 -55TO+125C 1005

R/TP - ROHM Semiconductor KOREA CORPORATION

11

ECCH0000112

C4007

Capacitor,Ceramic,Chip

MCH155C150J 15pF 5% 50V NP0 -55TO+125C 1005

R/TP - ROHM Semiconductor KOREA CORPORATION

12

ECCH0000112

C6017

Capacitor,Ceramic,Chip

MCH155C150J 15pF 5% 50V NP0 -55TO+125C 1005

R/TP - ROHM Semiconductor KOREA CORPORATION

13

ECCH0000112

C6025

Capacitor,Ceramic,Chip

MCH155C150J 15pF 5% 50V NP0 -55TO+125C 1005

R/TP - ROHM Semiconductor KOREA CORPORATION

14

ECCH0000117

C5101

Capacitor,Ceramic,Chip

CL05C270JB5NNNC 27pF 5% 50V NP0 -55TO+125C

1005 R/TP 0.5 SAMSUNG ELECTRO-MECHANICS CO.,
LTD.

15

ECCH0000120

C1053

Capacitor,Ceramic,Chip

MCH155A390J 39pF 5% 50V NP0 -55TO+125C 1005

R/TP - ROHM Semiconductor KOREA CORPORATION

16

ECCH0000122

C2205B

Capacitor,Ceramic,Chip

MCH155A470JK 47pF 5% 50V NP0 -55TO+125C 1005

R/TP - ROHM Semiconductor KOREA CORPORATION

17

ECCH0000122

C3003

Capacitor,Ceramic,Chip

MCH155A470JK 47pF 5% 50V NP0 -55TO+125C 1005

R/TP - ROHM Semiconductor KOREA CORPORATION

18

ECCH0000127

C1044

Capacitor,Ceramic,Chip

MCH155A820J 82pF 5% 50V NP0 -55TO+125C 1005

R/TP - ROHM Semiconductor KOREA CORPORATION

19

ECCH0000127

C1052

Capacitor,Ceramic,Chip

MCH155A820J 82pF 5% 50V NP0 -55TO+125C 1005

R/TP - ROHM Semiconductor KOREA CORPORATION

88

Qty

LG Electronics Inc.
104

UN270

20

ECCH0000133

C2116B

Capacitor,Ceramic,Chip

C1005X7R1H221KT000F 0.22nF 10% 50V X7R

-55TO+125C 1005 R/TP - TDK KOREA
COOPERATION

21

ECCH0000143

C1013

Capacitor,Ceramic,Chip

MCH155CN102KK 1nF 10% 50V X7R -55TO+125C

1005 R/TP - ROHM Semiconductor KOREA
CORPORATION

22

ECCH0000143

C1016

Capacitor,Ceramic,Chip

MCH155CN102KK 1nF 10% 50V X7R -55TO+125C

1005 R/TP - ROHM Semiconductor KOREA
CORPORATION

23

ECCH0000143

C2124B

Capacitor,Ceramic,Chip

MCH155CN102KK 1nF 10% 50V X7R -55TO+125C

1005 R/TP - ROHM Semiconductor KOREA
CORPORATION

24

ECCH0000143

C2126B

Capacitor,Ceramic,Chip

MCH155CN102KK 1nF 10% 50V X7R -55TO+125C

1005 R/TP - ROHM Semiconductor KOREA
CORPORATION

25

ECCH0000143

C2201B

Capacitor,Ceramic,Chip

MCH155CN102KK 1nF 10% 50V X7R -55TO+125C

1005 R/TP - ROHM Semiconductor KOREA
CORPORATION

26

ECCH0000143

C2210B

Capacitor,Ceramic,Chip

MCH155CN102KK 1nF 10% 50V X7R -55TO+125C

1005 R/TP - ROHM Semiconductor KOREA
CORPORATION

27

ECCH0000149

C2115B

Capacitor,Ceramic,Chip

MCH155CN332KK 3.3nF 10% 50V X7R -55TO+125C

1005 R/TP - ROHM Semiconductor KOREA
CORPORATION

28

ECCH0000151

C2112B

Capacitor,Ceramic,Chip

CL05B472KB5NNNC 4.7nF 10% 25V X7R -55TO+125C

1005 R/TP - SAMSUNG ELECTRO-MECHANICS CO.,
LTD.

29

ECCH0000151

C2114B

Capacitor,Ceramic,Chip

CL05B472KB5NNNC 4.7nF 10% 25V X7R -55TO+125C

1005 R/TP - SAMSUNG ELECTRO-MECHANICS CO.,
LTD.

30

ECCH0000155

C2203B

Capacitor,Ceramic,Chip

MCH153CN103KK 10nF 10% 16V X7R -55TO+125C

1005 R/TP - ROHM Semiconductor KOREA
CORPORATION

31

ECCH0000155

C6002

Capacitor,Ceramic,Chip

MCH153CN103KK 10nF 10% 16V X7R -55TO+125C

1005 R/TP - ROHM Semiconductor KOREA
CORPORATION

32

ECCH0000155

C6003

Capacitor,Ceramic,Chip

MCH153CN103KK 10nF 10% 16V X7R -55TO+125C

1005 R/TP - ROHM Semiconductor KOREA
CORPORATION

33

ECCH0000155

C6005

Capacitor,Ceramic,Chip

MCH153CN103KK 10nF 10% 16V X7R -55TO+125C

1005 R/TP - ROHM Semiconductor KOREA
CORPORATION

34

ECCH0000155

C6008

Capacitor,Ceramic,Chip

MCH153CN103KK 10nF 10% 16V X7R -55TO+125C

1005 R/TP - ROHM Semiconductor KOREA
CORPORATION

35

ECCH0000155

C6021

Capacitor,Ceramic,Chip

MCH153CN103KK 10nF 10% 16V X7R -55TO+125C

1005 R/TP - ROHM Semiconductor KOREA
CORPORATION

36

ECCH0000161

C2202B

Capacitor,Ceramic,Chip

MCH153CN333KK 33nF 10% 16V X7R -55TO+125C

1005 R/TP - ROHM Semiconductor KOREA
CORPORATION

37

ECCH0000161

C3001

Capacitor,Ceramic,Chip

MCH153CN333KK 33nF 10% 16V X7R -55TO+125C

1005 R/TP - ROHM Semiconductor KOREA
CORPORATION

38

ECCH0000161

C3011

Capacitor,Ceramic,Chip

MCH153CN333KK 33nF 10% 16V X7R -55TO+125C

1005 R/TP - ROHM Semiconductor KOREA
CORPORATION

39

ECCH0000161

C4012

Capacitor,Ceramic,Chip

MCH153CN333KK 33nF 10% 16V X7R -55TO+125C

1005 R/TP - ROHM Semiconductor KOREA
CORPORATION

40

ECCH0000161

C8000

Capacitor,Ceramic,Chip

MCH153CN333KK 33nF 10% 16V X7R -55TO+125C

1005 R/TP - ROHM Semiconductor KOREA
CORPORATION

89

LG Electronics Inc.
105

UN270

41

ECCH0000175

C1062

Capacitor,Ceramic,Chip

GRM1555C1H2R7B 2.7pF 0.1PF 50V NP0 -55TO+125C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

42

ECCH0000182

C2101B

Capacitor,Ceramic,Chip

GRM155R61A104K 0.1uF 10% 10V X5R -55TO+85C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

43

ECCH0000182

C2102B

Capacitor,Ceramic,Chip

GRM155R61A104K 0.1uF 10% 10V X5R -55TO+85C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

44

ECCH0000182

C2103B

Capacitor,Ceramic,Chip

GRM155R61A104K 0.1uF 10% 10V X5R -55TO+85C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

45

ECCH0000182

C2105B

Capacitor,Ceramic,Chip

GRM155R61A104K 0.1uF 10% 10V X5R -55TO+85C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

46

ECCH0000182

C2110B

Capacitor,Ceramic,Chip

GRM155R61A104K 0.1uF 10% 10V X5R -55TO+85C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

47

ECCH0000182

C2118B

Capacitor,Ceramic,Chip

GRM155R61A104K 0.1uF 10% 10V X5R -55TO+85C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

48

ECCH0000182

C2119B

Capacitor,Ceramic,Chip

GRM155R61A104K 0.1uF 10% 10V X5R -55TO+85C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

49

ECCH0000182

C2120B

Capacitor,Ceramic,Chip

GRM155R61A104K 0.1uF 10% 10V X5R -55TO+85C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

50

ECCH0000182

C2121B

Capacitor,Ceramic,Chip

GRM155R61A104K 0.1uF 10% 10V X5R -55TO+85C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

51

ECCH0000182

C2122B

Capacitor,Ceramic,Chip

GRM155R61A104K 0.1uF 10% 10V X5R -55TO+85C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

52

ECCH0000182

C2123B

Capacitor,Ceramic,Chip

GRM155R61A104K 0.1uF 10% 10V X5R -55TO+85C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

53

ECCH0000182

C2128B

Capacitor,Ceramic,Chip

GRM155R61A104K 0.1uF 10% 10V X5R -55TO+85C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

54

ECCH0000182

C2129B

Capacitor,Ceramic,Chip

GRM155R61A104K 0.1uF 10% 10V X5R -55TO+85C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

55

ECCH0000182

C2130B

Capacitor,Ceramic,Chip

GRM155R61A104K 0.1uF 10% 10V X5R -55TO+85C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

56

ECCH0000182

C2132B

Capacitor,Ceramic,Chip

GRM155R61A104K 0.1uF 10% 10V X5R -55TO+85C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

57

ECCH0000182

C2133B

Capacitor,Ceramic,Chip

GRM155R61A104K 0.1uF 10% 10V X5R -55TO+85C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

58

ECCH0000182

C2134B

Capacitor,Ceramic,Chip

GRM155R61A104K 0.1uF 10% 10V X5R -55TO+85C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

59

ECCH0000182

C2135B

Capacitor,Ceramic,Chip

GRM155R61A104K 0.1uF 10% 10V X5R -55TO+85C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

60

ECCH0000182

C2136B

Capacitor,Ceramic,Chip

GRM155R61A104K 0.1uF 10% 10V X5R -55TO+85C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

61

ECCH0000182

C2138B

Capacitor,Ceramic,Chip

GRM155R61A104K 0.1uF 10% 10V X5R -55TO+85C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

90

LG Electronics Inc.
106

UN270

62

ECCH0000182

C2149B

Capacitor,Ceramic,Chip

GRM155R61A104K 0.1uF 10% 10V X5R -55TO+85C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

63

ECCH0000182

C2150B

Capacitor,Ceramic,Chip

GRM155R61A104K 0.1uF 10% 10V X5R -55TO+85C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

64

ECCH0000182

C2151B

Capacitor,Ceramic,Chip

GRM155R61A104K 0.1uF 10% 10V X5R -55TO+85C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

65

ECCH0000182

C2152B

Capacitor,Ceramic,Chip

GRM155R61A104K 0.1uF 10% 10V X5R -55TO+85C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

66

ECCH0000182

C2154B

Capacitor,Ceramic,Chip

GRM155R61A104K 0.1uF 10% 10V X5R -55TO+85C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

67

ECCH0000182

C2156B

Capacitor,Ceramic,Chip

GRM155R61A104K 0.1uF 10% 10V X5R -55TO+85C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

68

ECCH0000182

C2157B

Capacitor,Ceramic,Chip

GRM155R61A104K 0.1uF 10% 10V X5R -55TO+85C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

69

ECCH0000182

C2158B

Capacitor,Ceramic,Chip

GRM155R61A104K 0.1uF 10% 10V X5R -55TO+85C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

70

ECCH0000182

C2204B

Capacitor,Ceramic,Chip

GRM155R61A104K 0.1uF 10% 10V X5R -55TO+85C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

71

ECCH0000182

C2208B

Capacitor,Ceramic,Chip

GRM155R61A104K 0.1uF 10% 10V X5R -55TO+85C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

72

ECCH0000182

C2209B

Capacitor,Ceramic,Chip

GRM155R61A104K 0.1uF 10% 10V X5R -55TO+85C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

73

ECCH0000183

C1097

Capacitor,Ceramic,Chip

GRM1555C1H1R8C 1.8pF 0.25PF 50V NP0

-55TO+125C 1005 R/TP - MURATA MANUFACTURING
CO.,LTD.

74

ECCH0000183

C1105

Capacitor,Ceramic,Chip

GRM1555C1H1R8C 1.8pF 0.25PF 50V NP0

-55TO+125C 1005 R/TP - MURATA MANUFACTURING
CO.,LTD.

75

ECCH0000198

C2117B

Capacitor,Ceramic,Chip

CL05A225MQ5NSNC 2.2uF 20% 6.3V X5R -55TO+85C

1005 R/TP . SAMSUNG ELECTRO-MECHANICS CO.,
LTD.

76

ECCH0000198

C2164B

Capacitor,Ceramic,Chip

CL05A225MQ5NSNC 2.2uF 20% 6.3V X5R -55TO+85C

1005 R/TP . SAMSUNG ELECTRO-MECHANICS CO.,
LTD.

77

ECCH0000198

C2165B

Capacitor,Ceramic,Chip

CL05A225MQ5NSNC 2.2uF 20% 6.3V X5R -55TO+85C

1005 R/TP . SAMSUNG ELECTRO-MECHANICS CO.,
LTD.

78

ECCH0000198

C2166B

Capacitor,Ceramic,Chip

CL05A225MQ5NSNC 2.2uF 20% 6.3V X5R -55TO+85C

1005 R/TP . SAMSUNG ELECTRO-MECHANICS CO.,
LTD.

79

ECCH0000198

C2167B

Capacitor,Ceramic,Chip

CL05A225MQ5NSNC 2.2uF 20% 6.3V X5R -55TO+85C

1005 R/TP . SAMSUNG ELECTRO-MECHANICS CO.,
LTD.

80

ECCH0000198

C2172B

Capacitor,Ceramic,Chip

CL05A225MQ5NSNC 2.2uF 20% 6.3V X5R -55TO+85C

1005 R/TP . SAMSUNG ELECTRO-MECHANICS CO.,
LTD.

81

ECCH0000198

C3015

Capacitor,Ceramic,Chip

CL05A225MQ5NSNC 2.2uF 20% 6.3V X5R -55TO+85C

1005 R/TP . SAMSUNG ELECTRO-MECHANICS CO.,
LTD.

82

ECCH0000198

C3016

Capacitor,Ceramic,Chip

CL05A225MQ5NSNC 2.2uF 20% 6.3V X5R -55TO+85C

1005 R/TP . SAMSUNG ELECTRO-MECHANICS CO.,
LTD.

91

LG Electronics Inc.
107

UN270

83

ECCH0000198

C3017

Capacitor,Ceramic,Chip

CL05A225MQ5NSNC 2.2uF 20% 6.3V X5R -55TO+85C

1005 R/TP . SAMSUNG ELECTRO-MECHANICS CO.,
LTD.

84

ECCH0000198

C3018

Capacitor,Ceramic,Chip

CL05A225MQ5NSNC 2.2uF 20% 6.3V X5R -55TO+85C

1005 R/TP . SAMSUNG ELECTRO-MECHANICS CO.,
LTD.

85

ECCH0000198

C6000

Capacitor,Ceramic,Chip

CL05A225MQ5NSNC 2.2uF 20% 6.3V X5R -55TO+85C

1005 R/TP . SAMSUNG ELECTRO-MECHANICS CO.,
LTD.

86

ECCH0000198

C6006

Capacitor,Ceramic,Chip

CL05A225MQ5NSNC 2.2uF 20% 6.3V X5R -55TO+85C

1005 R/TP . SAMSUNG ELECTRO-MECHANICS CO.,
LTD.

87

ECCH0000198

C6505

Capacitor,Ceramic,Chip

CL05A225MQ5NSNC 2.2uF 20% 6.3V X5R -55TO+85C

1005 R/TP . SAMSUNG ELECTRO-MECHANICS CO.,
LTD.

88

ECCH0000198

C6506

Capacitor,Ceramic,Chip

CL05A225MQ5NSNC 2.2uF 20% 6.3V X5R -55TO+85C

1005 R/TP . SAMSUNG ELECTRO-MECHANICS CO.,
LTD.

89

ECCH0000198

C6507

Capacitor,Ceramic,Chip

CL05A225MQ5NSNC 2.2uF 20% 6.3V X5R -55TO+85C

1005 R/TP . SAMSUNG ELECTRO-MECHANICS CO.,
LTD.

90

ECCH0000198

C6509

Capacitor,Ceramic,Chip

CL05A225MQ5NSNC 2.2uF 20% 6.3V X5R -55TO+85C

1005 R/TP . SAMSUNG ELECTRO-MECHANICS CO.,
LTD.

91

ECCH0000198

C6510

Capacitor,Ceramic,Chip

CL05A225MQ5NSNC 2.2uF 20% 6.3V X5R -55TO+85C

1005 R/TP . SAMSUNG ELECTRO-MECHANICS CO.,
LTD.

92

ECCH0000701

C1102

Capacitor,Ceramic,Chip

C1005C0G1H1R2CT000F 1.2pF 0.25PF 50V NP0

-55TO+125C 1005 R/TP - TDK CORPORATION

93

ECCH0000701

C6011

Capacitor,Ceramic,Chip

C1005C0G1H1R2CT000F 1.2pF 0.25PF 50V NP0

-55TO+125C 1005 R/TP - TDK CORPORATION

94

ECCH0001001

C1065

Capacitor,Ceramic,Chip

C1005C0G1H6R8CT000F 6.8pF 0.5PF 50V NP0

-55TO+125C 1005 R/TP - TDK KOREA
COOPERATION

95

ECCH0002001

C4008

Capacitor,Ceramic,Chip

C1005JB0J104KT000F 0.1uF 10% 6.3V Y5P

-30TO+85C 1005 R/TP - TDK CORPORATION

96

ECCH0002001

C4009

Capacitor,Ceramic,Chip

C1005JB0J104KT000F 0.1uF 10% 6.3V Y5P

-30TO+85C 1005 R/TP - TDK CORPORATION

97

ECCH0002001

C4010

Capacitor,Ceramic,Chip

C1005JB0J104KT000F 0.1uF 10% 6.3V Y5P

-30TO+85C 1005 R/TP - TDK CORPORATION

98

ECCH0002001

C6023

Capacitor,Ceramic,Chip

C1005JB0J104KT000F 0.1uF 10% 6.3V Y5P

-30TO+85C 1005 R/TP - TDK CORPORATION

99

ECCH0002001

C6024

Capacitor,Ceramic,Chip

C1005JB0J104KT000F 0.1uF 10% 6.3V Y5P

-30TO+85C 1005 R/TP - TDK CORPORATION

100

ECCH0002001

C6503

Capacitor,Ceramic,Chip

C1005JB0J104KT000F 0.1uF 10% 6.3V Y5P

-30TO+85C 1005 R/TP - TDK CORPORATION

101

ECCH0002001

C6504

Capacitor,Ceramic,Chip

C1005JB0J104KT000F 0.1uF 10% 6.3V Y5P

-30TO+85C 1005 R/TP - TDK CORPORATION

102

ECCH0004904

C2106B

Capacitor,Ceramic,Chip

GRM155R60J105K 1uF 10% 6.3V X5R -55TO+85C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

103

ECCH0004904

C2107B

Capacitor,Ceramic,Chip

GRM155R60J105K 1uF 10% 6.3V X5R -55TO+85C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

92

LG Electronics Inc.
108

UN270

104

ECCH0004904

C2108B

Capacitor,Ceramic,Chip

GRM155R60J105K 1uF 10% 6.3V X5R -55TO+85C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

105

ECCH0004904

C2140B

Capacitor,Ceramic,Chip

GRM155R60J105K 1uF 10% 6.3V X5R -55TO+85C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

106

ECCH0004904

C2141B

Capacitor,Ceramic,Chip

GRM155R60J105K 1uF 10% 6.3V X5R -55TO+85C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

107

ECCH0004904

C2142B

Capacitor,Ceramic,Chip

GRM155R60J105K 1uF 10% 6.3V X5R -55TO+85C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

108

ECCH0004904

C2143B

Capacitor,Ceramic,Chip

GRM155R60J105K 1uF 10% 6.3V X5R -55TO+85C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

109

ECCH0004904

C2144B

Capacitor,Ceramic,Chip

GRM155R60J105K 1uF 10% 6.3V X5R -55TO+85C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

110

ECCH0004904

C2145B

Capacitor,Ceramic,Chip

GRM155R60J105K 1uF 10% 6.3V X5R -55TO+85C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

111

ECCH0004904

C2146B

Capacitor,Ceramic,Chip

GRM155R60J105K 1uF 10% 6.3V X5R -55TO+85C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

112

ECCH0004904

C2147B

Capacitor,Ceramic,Chip

GRM155R60J105K 1uF 10% 6.3V X5R -55TO+85C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

113

ECCH0004904

C2148B

Capacitor,Ceramic,Chip

GRM155R60J105K 1uF 10% 6.3V X5R -55TO+85C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

114

ECCH0004904

C2163B

Capacitor,Ceramic,Chip

GRM155R60J105K 1uF 10% 6.3V X5R -55TO+85C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

115

ECCH0004904

C2173B

Capacitor,Ceramic,Chip

GRM155R60J105K 1uF 10% 6.3V X5R -55TO+85C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

116

ECCH0004904

C2176B

Capacitor,Ceramic,Chip

GRM155R60J105K 1uF 10% 6.3V X5R -55TO+85C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

117

ECCH0004904

C2177B

Capacitor,Ceramic,Chip

GRM155R60J105K 1uF 10% 6.3V X5R -55TO+85C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

118

ECCH0004904

C4014

Capacitor,Ceramic,Chip

GRM155R60J105K 1uF 10% 6.3V X5R -55TO+85C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

119

ECCH0004904

C6004

Capacitor,Ceramic,Chip

GRM155R60J105K 1uF 10% 6.3V X5R -55TO+85C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

120

ECCH0004904

C8001

Capacitor,Ceramic,Chip

GRM155R60J105K 1uF 10% 6.3V X5R -55TO+85C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

121

ECCH0005602

C2169B

Capacitor,Ceramic,Chip

GRM188R61C225K 2.2uF 10% 16V X5R -55TO+85C

1608 R/TP - MURATA MANUFACTURING CO.,LTD.

122

ECCH0005603

C1000

Capacitor,Ceramic,Chip

GRM188R61A225K 2.2uF 10% 10V X5R -55TO+85C

1608 R/TP - MURATA MANUFACTURING CO.,LTD.

123

ECCH0005603

C1001

Capacitor,Ceramic,Chip

GRM188R61A225K 2.2uF 10% 10V X5R -55TO+85C

1608 R/TP - MURATA MANUFACTURING CO.,LTD.

124

ECCH0005603

C2178B

Capacitor,Ceramic,Chip

GRM188R61A225K 2.2uF 10% 10V X5R -55TO+85C

1608 R/TP - MURATA MANUFACTURING CO.,LTD.

93

LG Electronics Inc.
109

UN270

125

ECCH0005603

C3014

Capacitor,Ceramic,Chip

GRM188R61A225K 2.2uF 10% 10V X5R -55TO+85C

1608 R/TP - MURATA MANUFACTURING CO.,LTD.

126

ECCH0005604

C2174B

Capacitor,Ceramic,Chip

GRM188R60J106M 10000000
pF,6.3V,M,X5R,TC,1608,R/TP,0.8 mm MURATA
MANUFACTURING CO.,LTD.

127

ECCH0006201

C2168B

Capacitor,Ceramic,Chip

C1608X5R0J475KT000N 4.7uF 10% 6.3V X5R

-55TO+85C 1608 R/TP - TDK CORPORATION

128

ECCH0006201

C2170B

Capacitor,Ceramic,Chip

C1608X5R0J475KT000N 4.7uF 10% 6.3V X5R

-55TO+85C 1608 R/TP - TDK CORPORATION

129

ECCH0006201

C2171B

Capacitor,Ceramic,Chip

C1608X5R0J475KT000N 4.7uF 10% 6.3V X5R

-55TO+85C 1608 R/TP - TDK CORPORATION

130

ECCH0006201

C2175B

Capacitor,Ceramic,Chip

C1608X5R0J475KT000N 4.7uF 10% 6.3V X5R

-55TO+85C 1608 R/TP - TDK CORPORATION

131

ECCH0007802

C2125B

Capacitor,Ceramic,Chip

CL10A475KP8NNNC 4.7uF 10% 10V X5R -55TO+85C

1608 R/TP - SAMSUNG ELECTRO-MECHANICS CO.,
LTD.

132

ECCH0007802

C2127B

Capacitor,Ceramic,Chip

CL10A475KP8NNNC 4.7uF 10% 10V X5R -55TO+85C

1608 R/TP - SAMSUNG ELECTRO-MECHANICS CO.,
LTD.

133

ECCH0007803

C3013

Capacitor,Ceramic,Chip

CL10A106MP8NNNC 10uF 20% 10V X5R -55TO+85C

1608 R/TP 0.8MM SAMSUNG ELECTRO-MECHANICS
CO., LTD.

134

ECCH0007803

C5102

Capacitor,Ceramic,Chip

CL10A106MP8NNNC 10uF 20% 10V X5R -55TO+85C

1608 R/TP 0.8MM SAMSUNG ELECTRO-MECHANICS
CO., LTD.

135

ECCH0007804

C2131B

Capacitor,Ceramic,Chip

CL05A225MP5NSNC 2.2uF 20% 10V X5R -55TO+85C

1005 R/TP 0.5MM SAMSUNG ELECTRO-MECHANICS
CO., LTD.

136

ECCH0007804

C2139B

Capacitor,Ceramic,Chip

CL05A225MP5NSNC 2.2uF 20% 10V X5R -55TO+85C

1005 R/TP 0.5MM SAMSUNG ELECTRO-MECHANICS
CO., LTD.

137

ECCH0007804

C2206B

Capacitor,Ceramic,Chip

CL05A225MP5NSNC 2.2uF 20% 10V X5R -55TO+85C

1005 R/TP 0.5MM SAMSUNG ELECTRO-MECHANICS
CO., LTD.

138

ECCH0007804

C2207B

Capacitor,Ceramic,Chip

CL05A225MP5NSNC 2.2uF 20% 10V X5R -55TO+85C

1005 R/TP 0.5MM SAMSUNG ELECTRO-MECHANICS
CO., LTD.

139

ECCH0007804

C3000

Capacitor,Ceramic,Chip

CL05A225MP5NSNC 2.2uF 20% 10V X5R -55TO+85C

1005 R/TP 0.5MM SAMSUNG ELECTRO-MECHANICS
CO., LTD.

140

ECCH0007804

C3004

Capacitor,Ceramic,Chip

CL05A225MP5NSNC 2.2uF 20% 10V X5R -55TO+85C

1005 R/TP 0.5MM SAMSUNG ELECTRO-MECHANICS
CO., LTD.

141

ECCH0007804

C5000

Capacitor,Ceramic,Chip

CL05A225MP5NSNC 2.2uF 20% 10V X5R -55TO+85C

1005 R/TP 0.5MM SAMSUNG ELECTRO-MECHANICS
CO., LTD.

142

ECCH0007804

C5001

Capacitor,Ceramic,Chip

CL05A225MP5NSNC 2.2uF 20% 10V X5R -55TO+85C

1005 R/TP 0.5MM SAMSUNG ELECTRO-MECHANICS
CO., LTD.

143

ECCH0017601

C4663

Capacitor,Ceramic,Chip

CL05A475MQ5NRNC 4.7uF 20% 6.3V X5R -55TO+85C

1005 R/TP 0.5MM SAMSUNG ELECTRO-MECHANICS
CO., LTD.

144

ECTH0002703

C3002

Capacitor,TA,Conformal

TCTAL1A107M8R 0.0001F 20% 10V 50UA

-55TO+125C 0OHM 3.2x1.6x1.1 NONE SMD R/TP
ROHM CO.,LTD.

145

ECZH0000802

C1051

Capacitor,Ceramic,Chip

C1005C0G1H010CT 1pF 0.25PF 50V NP0 -55TO+125C

1005 R/TP - TDK KOREA COOPERATION

94

LG Electronics Inc.
110

UN270

146

ECZH0000802

C1093

Capacitor,Ceramic,Chip

C1005C0G1H010CT 1pF 0.25PF 50V NP0 -55TO+125C

1005 R/TP - TDK KOREA COOPERATION

147

ECZH0000813

C1005

Capacitor,Ceramic,Chip

C1005C0G1H101JT 100pF 5% 50V NP0 -55TO+125C

1005 R/TP - TDK KOREA COOPERATION

148

ECZH0000813

C1014

Capacitor,Ceramic,Chip

C1005C0G1H101JT 100pF 5% 50V NP0 -55TO+125C

1005 R/TP - TDK KOREA COOPERATION

149

ECZH0000813

C1015

Capacitor,Ceramic,Chip

C1005C0G1H101JT 100pF 5% 50V NP0 -55TO+125C

1005 R/TP - TDK KOREA COOPERATION

150

ECZH0000813

C1017

Capacitor,Ceramic,Chip

C1005C0G1H101JT 100pF 5% 50V NP0 -55TO+125C

1005 R/TP - TDK KOREA COOPERATION

151

ECZH0000813

C1050

Capacitor,Ceramic,Chip

C1005C0G1H101JT 100pF 5% 50V NP0 -55TO+125C

1005 R/TP - TDK KOREA COOPERATION

152

ECZH0000813

C1071

Capacitor,Ceramic,Chip

C1005C0G1H101JT 100pF 5% 50V NP0 -55TO+125C

1005 R/TP - TDK KOREA COOPERATION

153

ECZH0000813

C1073

Capacitor,Ceramic,Chip

C1005C0G1H101JT 100pF 5% 50V NP0 -55TO+125C

1005 R/TP - TDK KOREA COOPERATION

154

ECZH0000813

C1080

Capacitor,Ceramic,Chip

C1005C0G1H101JT 100pF 5% 50V NP0 -55TO+125C

1005 R/TP - TDK KOREA COOPERATION

155

ECZH0000813

C1086

Capacitor,Ceramic,Chip

C1005C0G1H101JT 100pF 5% 50V NP0 -55TO+125C

1005 R/TP - TDK KOREA COOPERATION

156

ECZH0000813

C1088

Capacitor,Ceramic,Chip

C1005C0G1H101JT 100pF 5% 50V NP0 -55TO+125C

1005 R/TP - TDK KOREA COOPERATION

157

ECZH0000813

C1096

Capacitor,Ceramic,Chip

C1005C0G1H101JT 100pF 5% 50V NP0 -55TO+125C

1005 R/TP - TDK KOREA COOPERATION

158

ECZH0000813

C1098

Capacitor,Ceramic,Chip

C1005C0G1H101JT 100pF 5% 50V NP0 -55TO+125C

1005 R/TP - TDK KOREA COOPERATION

159

ECZH0000813

C1100

Capacitor,Ceramic,Chip

C1005C0G1H101JT 100pF 5% 50V NP0 -55TO+125C

1005 R/TP - TDK KOREA COOPERATION

160

ECZH0000813

C1101

Capacitor,Ceramic,Chip

C1005C0G1H101JT 100pF 5% 50V NP0 -55TO+125C

1005 R/TP - TDK KOREA COOPERATION

161

ECZH0000813

C1103

Capacitor,Ceramic,Chip

C1005C0G1H101JT 100pF 5% 50V NP0 -55TO+125C

1005 R/TP - TDK KOREA COOPERATION

162

ECZH0000813

C1104

Capacitor,Ceramic,Chip

C1005C0G1H101JT 100pF 5% 50V NP0 -55TO+125C

1005 R/TP - TDK KOREA COOPERATION

163

ECZH0000813

C4004

Capacitor,Ceramic,Chip

C1005C0G1H101JT 100pF 5% 50V NP0 -55TO+125C

1005 R/TP - TDK KOREA COOPERATION

164

ECZH0000813

C4005

Capacitor,Ceramic,Chip

C1005C0G1H101JT 100pF 5% 50V NP0 -55TO+125C

1005 R/TP - TDK KOREA COOPERATION

165

ECZH0000813

C6016

Capacitor,Ceramic,Chip

C1005C0G1H101JT 100pF 5% 50V NP0 -55TO+125C

1005 R/TP - TDK KOREA COOPERATION

166

ECZH0000816

C2161B

Capacitor,Ceramic,Chip

C1005C0G1H120JT000F 12pF 5% 50V NP0

-55TO+125C 1005 R/TP - TDK KOREA
COOPERATION

95

LG Electronics Inc.
111

UN270

167

ECZH0000816

C2162B

Capacitor,Ceramic,Chip

C1005C0G1H120JT000F 12pF 5% 50V NP0

-55TO+125C 1005 R/TP - TDK KOREA
COOPERATION

168

ECZH0000816

C6018

Capacitor,Ceramic,Chip

C1005C0G1H120JT000F 12pF 5% 50V NP0

-55TO+125C 1005 R/TP - TDK KOREA
COOPERATION

169

ECZH0000822

C1048

Capacitor,Ceramic,Chip

C1005C0G1H1R5CT000F 1.5pF 0.25PF 50V NP0

-55TO+125C 1005 R/TP - TDK KOREA
COOPERATION

170

ECZH0000824

C6019

Capacitor,Ceramic,Chip

C1005C0G1H200JT 20pF 5% 50V NP0 -55TO+125C

1005 R/TP - TDK KOREA COOPERATION

171

ECZH0000824

C6020

Capacitor,Ceramic,Chip

C1005C0G1H200JT 20pF 5% 50V NP0 -55TO+125C

1005 R/TP - TDK KOREA COOPERATION

172

ECZH0000830

C1056

Capacitor,Ceramic,Chip

C1005C0G1H330JT000F 33pF 5% 50V NP0

-55TO+125C 1005 R/TP - TDK KOREA
COOPERATION

173

ECZH0000830

C1064

Capacitor,Ceramic,Chip

C1005C0G1H330JT000F 33pF 5% 50V NP0

-55TO+125C 1005 R/TP - TDK KOREA
COOPERATION

174

ECZH0000830

C2104B

Capacitor,Ceramic,Chip

C1005C0G1H330JT000F 33pF 5% 50V NP0

-55TO+125C 1005 R/TP - TDK KOREA
COOPERATION

175

ECZH0000830

C2109B

Capacitor,Ceramic,Chip

C1005C0G1H330JT000F 33pF 5% 50V NP0

-55TO+125C 1005 R/TP - TDK KOREA
COOPERATION

176

ECZH0000830

C4000

Capacitor,Ceramic,Chip

C1005C0G1H330JT000F 33pF 5% 50V NP0

-55TO+125C 1005 R/TP - TDK KOREA
COOPERATION

177

ECZH0000841

C3019

Capacitor,Ceramic,Chip

C1005C0G1H560JT000F 56pF 5% 50V NP0

-55TO+125C 1005 R/TP - TDK KOREA
COOPERATION

178

ECZH0000849

C1033

Capacitor,Ceramic,Chip

C1005C0G1H201JT000F 200pF 5% 50V NP0

-55TO+125C 1005 R/TP - TDK KOREA
COOPERATION

179

ECZH0001002

C1054

Capacitor,Ceramic,Chip

C1005CH1H0R5BT000F 0.5pF 0.1PF 50V NP0

-55TO+125C 1005 R/TP - TDK KOREA
COOPERATION

180

ECZH0001120

C5006

Capacitor,Ceramic,Chip

CC1005X7R1H392KT000F 3.9nF 10% 50V X7R

-55TO+125C 1005 R/TP - TDK KOREA
COOPERATION

181

ECZH0001121

C5103

Capacitor,Ceramic,Chip

C1005X7R1H471KT000F 470pF 10% 50V X7R

-55TO+125C 1005 R/TP - TDK KOREA
COOPERATION

182

ECZH0001215

C2153B

Capacitor,Ceramic,Chip

C1005X5R1A105KT000F 1uF 10% 10V X5R

-55TO+85C 1005 R/TP - TDK KOREA COOPERATION

183

ECZH0001215

C2155B

Capacitor,Ceramic,Chip

C1005X5R1A105KT000F 1uF 10% 10V X5R

-55TO+85C 1005 R/TP - TDK KOREA COOPERATION

184

ECZH0001215

C4013

Capacitor,Ceramic,Chip

C1005X5R1A105KT000F 1uF 10% 10V X5R

-55TO+85C 1005 R/TP - TDK KOREA COOPERATION

185

ECZH0001215

C4015

Capacitor,Ceramic,Chip

C1005X5R1A105KT000F 1uF 10% 10V X5R

-55TO+85C 1005 R/TP - TDK KOREA COOPERATION

186

ECZH0001215

C5005

Capacitor,Ceramic,Chip

C1005X5R1A105KT000F 1uF 10% 10V X5R

-55TO+85C 1005 R/TP - TDK KOREA COOPERATION

187

ECZH0001215

C5016

Capacitor,Ceramic,Chip

C1005X5R1A105KT000F 1uF 10% 10V X5R

-55TO+85C 1005 R/TP - TDK KOREA COOPERATION

96

LG Electronics Inc.
112

UN270

188

ECZH0001215

C5017

Capacitor,Ceramic,Chip

C1005X5R1A105KT000F 1uF 10% 10V X5R

-55TO+85C 1005 R/TP - TDK KOREA COOPERATION

189

ECZH0001215

C5104

Capacitor,Ceramic,Chip

C1005X5R1A105KT000F 1uF 10% 10V X5R

-55TO+85C 1005 R/TP - TDK KOREA COOPERATION

190

ECZH0001420

C3005

Capacitor,Ceramic,Chip

C1608X5R1A105KT000E 1uF 10% 10V X5R

-55TO+85C 1608 R/TP - TDK KOREA COOPERATION

191

ECZH0001420

C3007

Capacitor,Ceramic,Chip

C1608X5R1A105KT000E 1uF 10% 10V X5R

-55TO+85C 1608 R/TP - TDK KOREA COOPERATION

192

ECZH0003103

C1067

Capacitor,Ceramic,Chip

GRM36X7R104K10PT 100nF 10% 10V X7R

-55TO+125C 1005 R/TP - MURATA MANUFACTURING
CO.,LTD.

193

ECZH0003103

C4001

Capacitor,Ceramic,Chip

GRM36X7R104K10PT 100nF 10% 10V X7R

-55TO+125C 1005 R/TP - MURATA MANUFACTURING
CO.,LTD.

194

ECZH0003103

C6508

Capacitor,Ceramic,Chip

GRM36X7R104K10PT 100nF 10% 10V X7R

-55TO+125C 1005 R/TP - MURATA MANUFACTURING
CO.,LTD.

195

ECZH0003124

C2113B

Capacitor,Ceramic,Chip

GRM155R71C683K 68nF 10% 16V X7R -55TO+125C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

196

ECZH0003125

C2111B

Capacitor,Ceramic,Chip

GRM155R71C823K 82nF 10% 16V X7R -55TO+125C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

197

ECZH0003503

C3006

Capacitor,Ceramic,Chip

GRM188R61E105K 1uF 10% 25V X5R -55TO+85C

1608 R/TP - MURATA MANUFACTURING CO.,LTD.

198

ECZH0003503

C3008

Capacitor,Ceramic,Chip

GRM188R61E105K 1uF 10% 25V X5R -55TO+85C

1608 R/TP - MURATA MANUFACTURING CO.,LTD.

199

ECZH0004402

C5100

Capacitor,Ceramic,Chip

CL05F104ZO5NNNC 0.1uF -20TO+80% 16V Y5V

-30TO+85C 1005 R/TP - SAMSUNG
ELECTRO-MECHANICS CO., LTD.

200

EDSY0017701

D3001

Diode,Switching

SDB1040 - - - - - - - - 2P 1 AUK CORP

201

EDTY0008601

ZD3002

Diode,TVS

PSD05-LF 5V 6 13.5V 42A 500W SOD323 R/TP 2P 1

PROTEK DEVICES INC.

202

EDTY0009101

D5100

Diode,TVS

ESD9X5.0ST5G 5V 6.2 12.3V 8.7A 107W SOD528 R/TP

2P 1 ON SEMICONDUCTOR

203

EDTY0009401

ZD4000

Diode,TVS

VMNZ6.8CST2R 5.5V 0 10V 0A 200mW SC70 R/TP 6P

5 ROHM.

204

EDTY0009401

ZD4001

Diode,TVS

VMNZ6.8CST2R 5.5V 0 10V 0A 200mW SC70 R/TP 6P

5 ROHM.

205

EDTY0009401

ZD4002

Diode,TVS

VMNZ6.8CST2R 5.5V 0 10V 0A 200mW SC70 R/TP 6P

5 ROHM.

206

EDTY0009401

ZD4003

Diode,TVS

VMNZ6.8CST2R 5.5V 0 10V 0A 200mW SC70 R/TP 6P

5 ROHM.

207

EDTY0009401

ZD4004

Diode,TVS

VMNZ6.8CST2R 5.5V 0 10V 0A 200mW SC70 R/TP 6P

5 ROHM.

208

EDTY0009401

ZD4005

Diode,TVS

VMNZ6.8CST2R 5.5V 0 10V 0A 200mW SC70 R/TP 6P

5 ROHM.

209

EDTY0009401

ZD4006

Diode,TVS

VMNZ6.8CST2R 5.5V 0 10V 0A 200mW SC70 R/TP 6P

5 ROHM.

210

EDTY0009601

ZD3000

Diode,TVS

Rclamp0521P.TCT 5V 6 5V 4A 100W - R/TP 2P 1

SEMTECH CORPORATION

211

EDTY0009601

ZD3001

Diode,TVS

Rclamp0521P.TCT 5V 6 5V 4A 100W - R/TP 2P 1

SEMTECH CORPORATION

212

ELCH0001035

L1023

Inductor,Multilayer,Chip

HK1005 4N7S-T 4.7NH 0.3NH - 300mA 0.21OHM 4GHZ

8 SHIELD NONE 1.0X0.5X0.5MM R/TP TAIYO YUDEN
CO.,LTD

97

LG Electronics Inc.
113

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213

ELCH0001035

L1028

Inductor,Multilayer,Chip

HK1005 4N7S-T 4.7NH 0.3NH - 300mA 0.21OHM 4GHZ

8 SHIELD NONE 1.0X0.5X0.5MM R/TP TAIYO YUDEN
CO.,LTD

214

ELCH0001048

L1007

Inductor,Multilayer,Chip

1005GC2T10NJLF 10NH 5% - 250mA 0.42OHM 2.5GHZ

8 SHIELD NONE 1.0X0.5X0.5MM R/TP PILKOR
ELECTRONICS LTD.

215

ELCH0001054

L1050

Inductor,Multilayer,Chip

1005GC2T5N6SLF 5.6NH 0.3NH - 300mA 0.27OHM

3.2GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP
PILKOR ELECTRONICS LTD.

216

ELCH0001056

L1056

Inductor,Multilayer,Chip

1005GC2T2N7SLF 2.7NH 0.3NH - 300mA 0.17OHM

5.5GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP
PILKOR ELECTRONICS LTD.

217

ELCH0001057

L1063

Inductor,Multilayer,Chip

1005GC2T3N9SLF 3.9NH 0.3NH - 300mA 0.22OHM

4GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP PILKOR
ELECTRONICS LTD.

218

ELCH0001057

L1064

Inductor,Multilayer,Chip

1005GC2T3N9SLF 3.9NH 0.3NH - 300mA 0.22OHM

4GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP PILKOR
ELECTRONICS LTD.

219

ELCH0001401

L1026

Inductor,Multilayer,Chip

LL1005-FHL15NJ 15NH 5% - 300mA 0.5OHM 2.8GHZ 9

SHIELD NONE 1.0X0.5X0.5MM R/TP TOKO, INC.

220

ELCH0001405

L1012

Inductor,Multilayer,Chip

LL1005-FHL3N3S 3.3NH 0.3NH - 400mA 0.16OHM

9.1GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP TOKO,
INC.

221

ELCH0001412

L1041

Inductor,Multilayer,Chip

LL1005-FHL1N8S 1.8NH 0.3NH - 400mA 0.14OHM

15GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP TOKO,
INC.

222

ELCH0001412

L1044

Inductor,Multilayer,Chip

LL1005-FHL1N8S 1.8NH 0.3NH - 400mA 0.14OHM

15GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP TOKO,
INC.

223

ELCH0001412

L1062

Inductor,Multilayer,Chip

LL1005-FHL1N8S 1.8NH 0.3NH - 400mA 0.14OHM

15GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP TOKO,
INC.

224

ELCH0001417

L1029

Inductor,Multilayer,Chip

LL1005-FHL33NJ_ 33NH 5% - 200mA 1OHM 2.1GHZ

10 SHIELD NONE 1.0X0.5X0.5MM R/TP TOKO, INC.

225

ELCH0001425

L5000

Inductor,Multilayer,Chip

LL1005-FHL82NJ 82NH 5% - 150mA 1.9OHM 1.15GHZ

10 SHIELD NONE 1.0X0.5X0.5MM R/TP TOKO, INC.

226

ELCH0001425

L5001

Inductor,Multilayer,Chip

LL1005-FHL82NJ 82NH 5% - 150mA 1.9OHM 1.15GHZ

10 SHIELD NONE 1.0X0.5X0.5MM R/TP TOKO, INC.

227

ELCH0001425

L5002

Inductor,Multilayer,Chip

LL1005-FHL82NJ 82NH 5% - 150mA 1.9OHM 1.15GHZ

10 SHIELD NONE 1.0X0.5X0.5MM R/TP TOKO, INC.

228

ELCH0001425

L5003

Inductor,Multilayer,Chip

LL1005-FHL82NJ 82NH 5% - 150mA 1.9OHM 1.15GHZ

10 SHIELD NONE 1.0X0.5X0.5MM R/TP TOKO, INC.

229

ELCH0001430

L1009

Inductor,Multilayer,Chip

LL1005-FHLR10J 100NH 5% - 150mA 2.2OHM

1.03GHZ 10 SHIELD NONE 1.0X0.5X0.5MM R/TP
TOKO, INC.

230

ELCH0001430

L1046

Inductor,Multilayer,Chip

LL1005-FHLR10J 100NH 5% - 150mA 2.2OHM

1.03GHZ 10 SHIELD NONE 1.0X0.5X0.5MM R/TP
TOKO, INC.

231

ELCH0004703

L1000

Inductor,Multilayer,Chip

1005GC2T1N0SLF 1NH 0.3NH - 300mA 0.12OHM

10GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP PILKOR
ELECTRONICS LTD.

98

LG Electronics Inc.
114

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232

ELCH0004709

L1030

Inductor,Multilayer,Chip

1005GC2T3N3SLF 3.3NH 0.3NH - 300mA 0.19OHM

4.5GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP
PILKOR ELECTRONICS LTD.

233

ELCH0004709

L1055

Inductor,Multilayer,Chip

1005GC2T3N3SLF 3.3NH 0.3NH - 300mA 0.19OHM

4.5GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP
PILKOR ELECTRONICS LTD.

234

ELCH0004710

L1010

Inductor,Multilayer,Chip

1005GC2T15NJLF 15NH 5% - 250mA 0.53OHM 2GHZ

8 SHIELD NONE 1.0X0.5X0.5MM R/TP PILKOR
ELECTRONICS LTD.

235

ELCH0004713

L1051

Inductor,Multilayer,Chip

1005GC2T6N8JLF 6.8NH 5% - 250mA 0.32OHM 3GHZ

8 SHIELD NONE 1.0X0.5X0.5MM R/TP PILKOR
ELECTRONICS LTD.

236

ELCH0004721

L1032

Inductor,Multilayer,Chip

1005GC2T2N2SLF 2.2NH 0.3NH - 300mA 0.16OHM

6GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP PILKOR
ELECTRONICS LTD.

237

ELCH0004721

L1057

Inductor,Multilayer,Chip

1005GC2T2N2SLF 2.2NH 0.3NH - 300mA 0.16OHM

6GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP PILKOR
ELECTRONICS LTD.

238

ELCH0004721

L1060

Inductor,Multilayer,Chip

1005GC2T2N2SLF 2.2NH 0.3NH - 300mA 0.16OHM

6GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP PILKOR
ELECTRONICS LTD.

239

ELCH0004721

L1061

Inductor,Multilayer,Chip

1005GC2T2N2SLF 2.2NH 0.3NH - 300mA 0.16OHM

6GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP PILKOR
ELECTRONICS LTD.

240

ELCP0008004

L2101B

Inductor,Wire
Wound,Chip

MIP2016D4R7M 4.7UH 30% 0V 900mA 0.16OHM 0HZ

0 SHIELD 2.0X1.6X1.0MM NONE R/TP FDK
CORPORATION.

241

ELCP0008004

L2102B

Inductor,Wire
Wound,Chip

MIP2016D4R7M 4.7UH 30% 0V 900mA 0.16OHM 0HZ

0 SHIELD 2.0X1.6X1.0MM NONE R/TP FDK
CORPORATION.

242

ENBY0036801

CN4000

Connector,BtoB

GB042-60S-H10-E3000 60P 0.40MM STRAIGHT

SOCKET SMD R/TP 1M - LS Mtron Ltd.

243

ENEY0003801

CN5000

Connector,I/O

24-8000-002-000-829 2P 1.00MM ANGLE SOCKET

TYPE SMD R/TP - KYOCERA ELCO KOREA SALES
CO.,LTD.

244

ENJE0007901

J5100

Jack,Phone

JAM3333-F30-7F 1P 4P ANGLE R/TP 4mM BLACK 6P HON HAI PRECISION INDUSTRY CO.,LTD.

245

ENRY0011401

CN3001

Connector,I/O

04-5151-005-103-883 5,0.65
mm,ETC,0.64MM,RECEPTACLE,DIP,R/TP,8.0x5.6x3.0t
KYOCERA ELCO KOREA SALES CO.,LTD.

246

ENSY0022202

S4000

Socket,Camera

CAM-H88(R41-A360A) 80m ohm 9x9x3.95t 24P SMD

R/TP Embo, Contact pin 0.70mm MITSUMI ELECTRIC
CO.,LTD.

247

ENSY0023302

S4001

Card Socket

SCHA5B0501 8,ETC,0.7 mm,15.0x15.0x1.62t,Reverse

ALPS ELECTRIC CO.,LTD.

248

ENWY0008101

SW1001

Connector,RF

NMS-180 NONE STRAIGHT SOCKET SMD T/REEL AU

50OHM 650mDB NAMAE ELECTRONICS INC

249

ENWY0008101

SW1002

Connector,RF

NMS-180 NONE STRAIGHT SOCKET SMD T/REEL AU

50OHM 650mDB NAMAE ELECTRONICS INC

99

LG Electronics Inc.
115

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250

ENZY0029301

CN3000

Connector,Terminal
Block

KQ03LT-4R 4,mm,ETC,VER,P=2.5,H=5.4 HIROSE

KOREA CO.,LTD

251

EQFP0000101

Q5100

FET

2SJ347 P-CHANNEL MOSFET -20V -7 -0.05A 40OHM

100mW SSM R/TP 3P TOSHIBA

252

EQFP0008601

Q3000

FET

NUS5530MN P-CHANNEL MOSFET -20V 20 -3.9A

0.07OHM 1.3W TSOP6 R/TP 8P ON
SEMICONDUCTOR

253

ERHY0000105

R2203B

Resistor,Chip

MCR01MZP5F51R0 51OHM 1% 1/16W 1005 R/TP ROHM.

254

ERHY0000128

R5102

Resistor,Chip

MCR01MZP5F1502 15KOHM 1% 1/16W 1005 R/TP ROHM.

255

ERHY0000150

R8001

Resistor,Chip

RC1005F753CS 75KOHM 1% 1/16W 1005 R/TP SAMSUNG ELECTRO-MECHANICS CO., LTD.

256

ERHY0000254

R5001

Resistor,Chip

MCR01MZP5J472 4.7KOHM 5% 1/16W 1005 R/TP ROHM.

257

ERHY0000254

R5002

Resistor,Chip

MCR01MZP5J472 4.7KOHM 5% 1/16W 1005 R/TP ROHM.

258

ERHY0000254

R5003

Resistor,Chip

MCR01MZP5J472 4.7KOHM 5% 1/16W 1005 R/TP ROHM.

259

ERHY0000275

R4010

Resistor,Chip

MCR01MZP5J563 56KOHM 5% 1/16W 1005 R/TP ROHM.

260

ERHY0000275

R4011

Resistor,Chip

MCR01MZP5J563 56KOHM 5% 1/16W 1005 R/TP ROHM.

261

ERHY0000275

R4012

Resistor,Chip

MCR01MZP5J563 56KOHM 5% 1/16W 1005 R/TP ROHM.

262

ERHY0000275

R4013

Resistor,Chip

MCR01MZP5J563 56KOHM 5% 1/16W 1005 R/TP ROHM.

263

ERHY0000275

R4014

Resistor,Chip

MCR01MZP5J563 56KOHM 5% 1/16W 1005 R/TP ROHM.

264

ERHY0000512

R6017

Resistor,Chip

RC1608J106CS 10MOHM 5% 1/10W 1608 R/TP SAMSUNG ELECTRO-MECHANICS CO., LTD.

265

ERHY0003201

R1005

Resistor,Chip

MCR01MZP5F1001 1KOHM 1% 1/16W 1005 R/TP ROHM.

266

ERHY0003201

R5103

Resistor,Chip

MCR01MZP5F1001 1KOHM 1% 1/16W 1005 R/TP ROHM.

267

ERHY0003201

R5104

Resistor,Chip

MCR01MZP5F1001 1KOHM 1% 1/16W 1005 R/TP ROHM.

268

ERHY0003301

R4004

Resistor,Chip

MCR01MZP5J101 100OHM 5% 1/16W 1005 R/TP ROHM.

269

ERHY0003301

R4005

Resistor,Chip

MCR01MZP5J101 100OHM 5% 1/16W 1005 R/TP ROHM.

270

ERHZ0000201

R2202B

Resistor,Chip

MCR01MZP5F1000 100OHM 1% 1/16W 1005 R/TP ROHM.

271

ERHZ0000203

R1007

Resistor,Chip

MCR01MZP5F1002 10KOHM 1% 1/16W 1005 R/TP ROHM.

272

ERHZ0000203

R2107B

Resistor,Chip

MCR01MZP5F1002 10KOHM 1% 1/16W 1005 R/TP ROHM.

273

ERHZ0000203

R2204B

Resistor,Chip

MCR01MZP5F1002 10KOHM 1% 1/16W 1005 R/TP ROHM.

274

ERHZ0000204

R8000

Resistor,Chip

MCR01MZP5F1003 100KOHM 1% 1/16W 1005 R/TP ROHM.

275

ERHZ0000204

R8016

Resistor,Chip

MCR01MZP5F1003 100KOHM 1% 1/16W 1005 R/TP ROHM.

276

ERHZ0000204

R8017

Resistor,Chip

MCR01MZP5F1003 100KOHM 1% 1/16W 1005 R/TP ROHM.

277

ERHZ0000204

R8018

Resistor,Chip

MCR01MZP5F1003 100KOHM 1% 1/16W 1005 R/TP ROHM.

278

ERHZ0000205

R5011

Resistor,Chip

MCR01MZP5F1004 1MOHM 1% 1/16W 1005 R/TP ROHM.

100

LG Electronics Inc.
116

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279

ERHZ0000205

R5012

Resistor,Chip

MCR01MZP5F1004 1MOHM 1% 1/16W 1005 R/TP ROHM.

280

ERHZ0000205

R8020

Resistor,Chip

MCR01MZP5F1004 1MOHM 1% 1/16W 1005 R/TP ROHM.

281

ERHZ0000205

R8021

Resistor,Chip

MCR01MZP5F1004 1MOHM 1% 1/16W 1005 R/TP ROHM.

282

ERHZ0000212

R2105B

Resistor,Chip

MCR01MZP5F1202 12KOHM 1% 1/16W 1005 R/TP ROHM.

283

ERHZ0000213

R6033

Resistor,Chip

MCR01MZP5F1203 120KOHM 1% 1/16W 1005 R/TP ROHM.

284

ERHZ0000221

R6009

Resistor,Chip

MCR01MZP5F1502 15KOHM 1% 1/16W 1005 R/TP ROHM.

285

ERHZ0000222

R4017

Resistor,Chip

MCR01MZP5F1503 150KOHM 1% 1/16W 1005 R/TP ROHM.

286

ERHZ0000238

R3007

Resistor,Chip

MCR01MZP5F2003 200KOHM 1% 1/16W 1005 R/TP ROHM.

287

ERHZ0000238

R5013

Resistor,Chip

MCR01MZP5F2003 200KOHM 1% 1/16W 1005 R/TP ROHM.

288

ERHZ0000240

R6501

Resistor,Chip

MCR01MZP5F20R0 20OHM 1% 1/16W 1005 R/TP ROHM.

289

ERHZ0000240

R6502

Resistor,Chip

MCR01MZP5F20R0 20OHM 1% 1/16W 1005 R/TP ROHM.

290

ERHZ0000243

R3014

Resistor,Chip

MCR01MZP5F2201 2.2KOHM 1% 1/16W 1005 R/TP ROHM.

291

ERHZ0000243

R3015

Resistor,Chip

MCR01MZP5F2201 2.2KOHM 1% 1/16W 1005 R/TP ROHM.

292

ERHZ0000263

R1002

Resistor,Chip

MCR01MZP5F3000 300OHM 1% 1/16W 1005 R/TP ROHM.

293

ERHZ0000263

R1003

Resistor,Chip

MCR01MZP5F3000 300OHM 1% 1/16W 1005 R/TP ROHM.

294

ERHZ0000265

R3005

Resistor,Chip

MCR01MZP5F3003 300KOHM 1% 1/16W 1005 R/TP ROHM.

295

ERHZ0000285

R6016

Resistor,Chip

MCR01MZP5F4700 470OHM 1% 1/16W 1005 R/TP ROHM.

296

ERHZ0000285

R6018

Resistor,Chip

MCR01MZP5F4700 470OHM 1% 1/16W 1005 R/TP ROHM.

297

ERHZ0000285

R6021

Resistor,Chip

MCR01MZP5F4700 470OHM 1% 1/16W 1005 R/TP ROHM.

298

ERHZ0000285

R6022

Resistor,Chip

MCR01MZP5F4700 470OHM 1% 1/16W 1005 R/TP ROHM.

299

ERHZ0000285

R6023

Resistor,Chip

MCR01MZP5F4700 470OHM 1% 1/16W 1005 R/TP ROHM.

300

ERHZ0000285

R6025

Resistor,Chip

MCR01MZP5F4700 470OHM 1% 1/16W 1005 R/TP ROHM.

301

ERHZ0000285

R6026

Resistor,Chip

MCR01MZP5F4700 470OHM 1% 1/16W 1005 R/TP ROHM.

302

ERHZ0000285

R6027

Resistor,Chip

MCR01MZP5F4700 470OHM 1% 1/16W 1005 R/TP ROHM.

303

ERHZ0000285

R6028

Resistor,Chip

MCR01MZP5F4700 470OHM 1% 1/16W 1005 R/TP ROHM.

304

ERHZ0000285

R6030

Resistor,Chip

MCR01MZP5F4700 470OHM 1% 1/16W 1005 R/TP ROHM.

305

ERHZ0000285

R6031

Resistor,Chip

MCR01MZP5F4700 470OHM 1% 1/16W 1005 R/TP ROHM.

306

ERHZ0000285

R6032

Resistor,Chip

MCR01MZP5F4700 470OHM 1% 1/16W 1005 R/TP ROHM.

307

ERHZ0000285

R6035

Resistor,Chip

MCR01MZP5F4700 470OHM 1% 1/16W 1005 R/TP ROHM.

308

ERHZ0000285

R6036

Resistor,Chip

MCR01MZP5F4700 470OHM 1% 1/16W 1005 R/TP ROHM.

309

ERHZ0000285

R6037

Resistor,Chip

MCR01MZP5F4700 470OHM 1% 1/16W 1005 R/TP ROHM.

101

LG Electronics Inc.
117

UN270

310

ERHZ0000285

R6038

Resistor,Chip

MCR01MZP5F4700 470OHM 1% 1/16W 1005 R/TP ROHM.

311

ERHZ0000286

R4018

Resistor,Chip

MCR01MZP5F4701 4.7KOHM 1% 1/16W 1005 R/TP ROHM.

312

ERHZ0000286

R4019

Resistor,Chip

MCR01MZP5F4701 4.7KOHM 1% 1/16W 1005 R/TP ROHM.

313

ERHZ0000287

R3201

Resistor,Chip

MCR01MZP5F4702 47KOHM 1% 1/16W 1005 R/TP ROHM.

314

ERHZ0000287

R5101

Resistor,Chip

MCR01MZP5F4702 47KOHM 1% 1/16W 1005 R/TP ROHM.

315

ERHZ0000287

R5106

Resistor,Chip

MCR01MZP5F4702 47KOHM 1% 1/16W 1005 R/TP ROHM.

316

ERHZ0000287

R8014

Resistor,Chip

MCR01MZP5F4702 47KOHM 1% 1/16W 1005 R/TP ROHM.

317

ERHZ0000293

R2102B

Resistor,Chip

MCR01MZP5F5100 510OHM 1% 1/16W 1005 R/TP ROHM.

318

ERHZ0000294

R2103B

Resistor,Chip

MCR01MZP5F5101 5.1KOHM 1% 1/16W 1005 R/TP ROHM.

319

ERHZ0000294

R2104B

Resistor,Chip

MCR01MZP5F5101 5.1KOHM 1% 1/16W 1005 R/TP ROHM.

320

ERHZ0000295

R3000

Resistor,Chip

MCR01MZP5F5102 51KOHM 1% 1/16W 1005 R/TP ROHM.

321

ERHZ0000295

R4016

Resistor,Chip

MCR01MZP5F5102 51KOHM 1% 1/16W 1005 R/TP ROHM.

322

ERHZ0000298

R2101B

Resistor,Chip

MCR01MZP5F5600 560OHM 1% 1/16W 1005 R/TP ROHM.

323

ERHZ0000301

R5105

Resistor,Chip

MCR01MZP5F5603 560KOHM 1% 1/16W 1005 R/TP ROHM.

324

ERHZ0000316

R6024

Resistor,Chip

MCR01MZP5F7503 750KOHM 1% 1/16W 1005 R/TP ROHM.

325

ERHZ0000318

R3001

Resistor,Chip

MCR01MZP5F8062 80.6KOHM 1% 1/16W 1005 R/TP ROHM.

326

ERHZ0000401

C1003

Resistor,Chip

MCR01MZSJ000 0OHM 5% 1/16W 1005 R/TP ROHM.

327

ERHZ0000402

R2111B

Resistor,Chip

MCR01MZP5J100 10OHM 5% 1/16W 1005 R/TP ROHM.

328

ERHZ0000406

R1000

Resistor,Chip

MCR01MZP5J104 100KOHM 5% 1/16W 1005 R/TP ROHM.

329

ERHZ0000406

R3013

Resistor,Chip

MCR01MZP5J104 100KOHM 5% 1/16W 1005 R/TP ROHM.

330

ERHZ0000410

R1008

Resistor,Chip

MCR01MZP5J120 12OHM 5% 1/16W 1005 R/TP ROHM.

331

ERHZ0000428

R1001

Resistor,Chip

MCR01MZP5J180 18OHM 5% 1/16W 1005 R/TP ROHM.

332

ERHZ0000437

R2201B

Resistor,Chip

MCR01MZP5J202 2KOHM 5% 1/16W 1005 R/TP ROHM.

333

ERHZ0000439

R5100

Resistor,Chip

MCR01MZP5J204 200KOHM 5% 1/16W 1005 R/TP ROHM.

334

ERHZ0000443

R4002

Resistor,Chip

MCR01MZP5J222 2.2KOHM 5% 1/16W 1005 R/TP ROHM.

335

ERHZ0000443

R4003

Resistor,Chip

MCR01MZP5J222 2.2KOHM 5% 1/16W 1005 R/TP ROHM.

336

ERHZ0000443

R8015

Resistor,Chip

MCR01MZP5J222 2.2KOHM 5% 1/16W 1005 R/TP ROHM.

337

ERHZ0000456

R2109B

Resistor,Chip

MCR01MZP5J2R2 2.2OHM 5% 1/16W 1005 R/TP ROHM.

338

ERHZ0000457

R4001

Resistor,Chip

MCR01MZP5J300 30OHM 5% 1/16W 1005 R/TP ROHM.

339

ERHZ0000457

R4006

Resistor,Chip

MCR01MZP5J300 30OHM 5% 1/16W 1005 R/TP ROHM.

340

ERHZ0000465

R6029

Resistor,Chip

MCR01MZP5J332 3.3KOHM 5% 1/16W 1005 R/TP ROHM.

102

LG Electronics Inc.
118

UN270

341

ERHZ0000465

R6034

Resistor,Chip

MCR01MZP5J332 3.3KOHM 5% 1/16W 1005 R/TP ROHM.

342

ERHZ0000485

R2108B

Resistor,Chip

MCR01MZP5J472 4.7KOHM 5% 1/16W 1005 R/TP ROHM.

343

ERHZ0000485

R3002

Resistor,Chip

MCR01MZP5J472 4.7KOHM 5% 1/16W 1005 R/TP ROHM.

344

ERHZ0000488

R2110B

Resistor,Chip

MCR01MZP5J4R7 4.7OHM 5% 1/16W 1005 R/TP ROHM.

345

ERHZ0003901

R3004

Resistor,Chip

RC2012FR100CS 0.1OHM 1% 1/8W 2012 R/TP SAMSUNG ELECTRO-MECHANICS CO., LTD.

346

ERHZ0004201

R2112B

Resistor,Chip

RC1005F1213CS 121KOHM 1% 1/16W 1005 R/TP SAMSUNG ELECTRO-MECHANICS CO., LTD.

347

ESCY0008301

SW6000

Switch,Tact

EVQP3M01K 12 V,0.05
A,HORIZONTAL,G,10C2P,12VDC, PANASONIC
INDUSTRIAL KOREA CO., LTD

348

ESCY0008301

SW6001

Switch,Tact

EVQP3M01K 12 V,0.05
A,HORIZONTAL,G,10C2P,12VDC, PANASONIC
INDUSTRIAL KOREA CO., LTD

349

ESCY0008301

SW6002

Switch,Tact

EVQP3M01K 12 V,0.05
A,HORIZONTAL,G,10C2P,12VDC, PANASONIC
INDUSTRIAL KOREA CO., LTD

350

ESCY0008301

SW6003

Switch,Tact

EVQP3M01K 12 V,0.05
A,HORIZONTAL,G,10C2P,12VDC, PANASONIC
INDUSTRIAL KOREA CO., LTD

351

EUSY0073401

U6001

IC,Inverter

TC7SH04FU TC7SH04FU,SSOP5-P-0.65A,5
PIN,R/TP,INVERTER,Pb Free TOSHIBA

352

EUSY0173801

U8000

IC,Load Switch

AAT4290IJS AAT4290IJS,SC70JW ,8 PIN,R/TP ,5

Individual Load Switch INSPUR LG DIGITAL MOBILE
COMMUNICATIONS

353

EUSY0250501

U5101

IC,Comparator

NCS2200SQ2T2G NCS2200SQ2T2G,SC70,5
PIN,R/TP,Comparator,pin compatible to EUSY0077701
- - SC70 R/TP 5P - ON SEMICONDUCTOR

354

EUSY0254201

U5100

IC,Analog Switch

NLAS3158MNR2G 1.65~5.5 13SEC 7SEC 0W DFN R/TP

6P 1 ON SEMICONDUCTOR

355

EUSY0300008

U6002

IC,Bus Controller

PP2106M3 1.8/2.6V 1mA - MLF R/TP 28P - G5

CORPORATION

356

EUSY0336202

U2101B

IC,Digital Baseband
Processor,CDMA

QSC6055-CD ,424,CDMA 1x Onechip

BB,AMSS3.3,IC,Digital Baseband Processor CSP R/TP
424P QUALCOMM INCORPORATED.

357

EUSY0347506

U2201B

IC,MCP,NAND

H8BCS0SI0BAR-46M NAND/2G SDRAM/1G 1.7VTO1.9V

14.0x10.0x1.2 TR 149P - - - HYNIX
SEMICONDUCTOR INC.

358

EUSY0365101

U4000

IC,LDO Voltage
Regulator

RP101K302D RP101K302D,PLP1612-4B,4,R/TP,LDO
RICOH COMPANY, LTD.

359

EUSY0374601

U3000

IC,Over Voltage
Protection

MAX14528 MAX14528,TDFN,8,R/TP,Programmable
OVP MAXIM INTEGRATED PRODUCTS INC.

360

EUSY0378001

U3001

IC,Sub PMIC

AAT2862 AAT2862,TQFN34,24,R/TP,3x4x0.8 Advanced

Analogic Technologies HK Limited

103

LG Electronics Inc.
119

UN270

361

EUSY0403901

IC6501

IC,Audio Sub System

WM9093ECS/R 1.71~5.5V 0W WLCSP R/TP 20P WOLFSON MICROELECTRONICS PLC

362

EUSY0418701

U6000

IC,Bluetooth

BCM2070B2KUBXG 2.3VTO5.5V 158.4mW 42P WLBGA R/TP 42P BROADCOM ASIA DISTRIBUTION
PTE LTD

363

EUSY0429101

U5001

IC,Resistive Touch
Screen Controller

MDR2 uQFN,18,R/TP,Haptic Driver Embedded

TSC,IC,A/D Converter - UQFN R/TP 18P MTEKVISION CO., LTD.

364

EXSK0005704

X2201B

Oscillator,VCTCXO

DSA321SCA 19.2mHZ 1.5PPM 2.8V 32.0x25.0x0.9MM

NA SMD R/TP DAISHINKU CORPORATION.

365

EXXY0016002

X6001

Crystal

SSP-T7-F(12.5PF,+/-20PPM) 32.768mHZ 20PPM

12.5pF NA SMD R/TP SEIKO INSTRUMENTS INC.

366

EXXY0018701

X2101B

Crystal

FC-135(12.5PF, +-20PPM) 32.768KHZ 20PPM 12.5PF

32*15 SMD R/TP SEIKO EPSON CORP

367

EXXY0024401

X6000

Crystal

TSX-3225 26MHZ 26MHZ 10PPM 10pF NA SMD R/TP

SEIKO EPSON CORP

368

MBFZ0060301

CN3002

Bracket

COMPLEX LG-UN270 VRZTG ZZ:Without Color PRESS,

STS, , , , ,

369

MCGY0004401

SC300

Clip

COMPLEX LG-VN530 VRZ ZZ:Without Color -

370

MCIZ0008201

ANT100
0

Contact

COMPLEX LG-VN530 VRZ DW:DARK BROWN PRESS,

BeCu, , 3.0, 1.5, 1.5,

371

MCIZ0008201

ANT100
2

Contact

COMPLEX LG-VN530 VRZ DW:DARK BROWN PRESS,

BeCu, , 3.0, 1.5, 1.5,

372

SAFO0000401

R2106B

Wire Pad,Open

AX3100 ATL SV_SHIPBACK,MAIN,A,0OHM DNI

373

SAFO0000501

R1010

Wire Pad,Open

AX3100 ATL SV_SHIPBACK,MAIN,A,0OHM_1005_DNI

374
375
376
377
378
379
380
381
382
383
384
385
386
387
388
389
390
391
392
393
394
395
396
397
398
399
400
401
402
403

SAFP0000401
SAFP0000501
SAFP0000501
SAFP0000501
SAFP0000501
SAFP0000501
SAFP0000501
SAFP0000501
SAFP0000501
SAFP0000501
SAFP0000501
SAFP0000501
SAFP0000501
SAFP0000501
SAFP0000501
SAFP0000501
SAFP0000501
SAFP0000501
SAFP0000501
SAFP0000501
SAFP0000501
SAFP0000501
SAFP0000501
SAFP0000501
SAFP0000501
SAFP0000501
SAFP0000501
SAFP0000501
SAFP0000501
SAFP0000501

R3016
R1009
R1011
R1013
R1015
R1016
R1017
R1018
R1019
R1020
R2113B
R2114B
R2115B
R2116B
R2117B
R2118B
R2119B
R2120B
R2121B
R2122B
R2123B
R3006
R3008
R4007
R4008
R4009
R5005
R5008
R5009
R6013

1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1

Wire Pad,Short
Wire Pad,Short
Wire Pad,Short
Wire Pad,Short
Wire Pad,Short
Wire Pad,Short
Wire Pad,Short
Wire Pad,Short
Wire Pad,Short
Wire Pad,Short
Wire Pad,Short
Wire Pad,Short
Wire Pad,Short
Wire Pad,Short
Wire Pad,Short
Wire Pad,Short
Wire Pad,Short
Wire Pad,Short
Wire Pad,Short
Wire Pad,Short
Wire Pad,Short
Wire Pad,Short
Wire Pad,Short
Wire Pad,Short
Wire Pad,Short
Wire Pad,Short
Wire Pad,Short
Wire Pad,Short
Wire Pad,Short
Wire Pad,Short

AX3100 ATL SV_SHIPBACK,MAIN,A

LG-VS760 VRZ
LG-VS760 VRZ
LG-VS760 VRZ
LG-VS760 VRZ
LG-VS760 VRZ
LG-VS760 VRZ
LG-VS760 VRZ
LG-VS760 VRZ
LG-VS760 VRZ
LG-VS760 VRZ
LG-VS760 VRZ
LG-VS760 VRZ
LG-VS760 VRZ
LG-VS760 VRZ
LG-VS760 VRZ
LG-VS760 VRZ
LG-VS760 VRZ
LG-VS760 VRZ
LG-VS760 VRZ
LG-VS760 VRZ
LG-VS760 VRZ
LG-VS760 VRZ
LG-VS760 VRZ
LG-VS760 VRZ
LG-VS760 VRZ
LG-VS760 VRZ
LG-VS760 VRZ
LG-VS760 VRZ
LG-VS760 VRZ

104

LG Electronics Inc.
120

UN270

404
405
406
407
408
409

SAFP0000501
SAFP0000501
SAFP0000501
SAFP0000501
SAFP0000501
SAFP0000501

R6014
R6015
R6019
R6020
R6039
R6044

1
1
1
1
1
1

Wire
Wire
Wire
Wire
Wire
Wire

410

SETY0007001

PT4000

Thermistor,NTC

NCP15WD683J03RC 68KOHM 5% 0V 0A 4.15KK SMD

P/TP 1005size MURATA MANUFACTURING CO.,LTD.

411

SEVY0003601

VA3000

Varistor

ICVL0505101V150FR 5.6V 0% 60F 1.0*0.5*0.55 NONE

SMD R/TP INNOCHIPS TECHNOLOGY

412

SEVY0003601

VA3001

Varistor

ICVL0505101V150FR 5.6V 0% 60F 1.0*0.5*0.55 NONE

SMD R/TP INNOCHIPS TECHNOLOGY

413

SEVY0003601

VA5100

Varistor

ICVL0505101V150FR 5.6V 0% 60F 1.0*0.5*0.55 NONE

SMD R/TP INNOCHIPS TECHNOLOGY

414

SEVY0003601

VA5101

Varistor

ICVL0505101V150FR 5.6V 0% 60F 1.0*0.5*0.55 NONE

SMD R/TP INNOCHIPS TECHNOLOGY

415

SEVY0003601

VA5102

Varistor

ICVL0505101V150FR 5.6V 0% 60F 1.0*0.5*0.55 NONE

SMD R/TP INNOCHIPS TECHNOLOGY

416

SEVY0003601

VA5103

Varistor

ICVL0505101V150FR 5.6V 0% 60F 1.0*0.5*0.55 NONE

SMD R/TP INNOCHIPS TECHNOLOGY

417

SEVY0003601

VA6002

Varistor

ICVL0505101V150FR 5.6V 0% 60F 1.0*0.5*0.55 NONE

SMD R/TP INNOCHIPS TECHNOLOGY

418

SEVY0003601

VA6003

Varistor

ICVL0505101V150FR 5.6V 0% 60F 1.0*0.5*0.55 NONE

SMD R/TP INNOCHIPS TECHNOLOGY

419

SEVY0003601

VA6004

Varistor

ICVL0505101V150FR 5.6V 0% 60F 1.0*0.5*0.55 NONE

SMD R/TP INNOCHIPS TECHNOLOGY

420

SEVY0003601

VA6006

Varistor

ICVL0505101V150FR 5.6V 0% 60F 1.0*0.5*0.55 NONE

SMD R/TP INNOCHIPS TECHNOLOGY

421

SEVY0003601

VA6007

Varistor

ICVL0505101V150FR 5.6V 0% 60F 1.0*0.5*0.55 NONE

SMD R/TP INNOCHIPS TECHNOLOGY

422

SEVY0003601

VA6008

Varistor

ICVL0505101V150FR 5.6V 0% 60F 1.0*0.5*0.55 NONE

SMD R/TP INNOCHIPS TECHNOLOGY

423

SEVY0003601

VA6009

Varistor

ICVL0505101V150FR 5.6V 0% 60F 1.0*0.5*0.55 NONE

SMD R/TP INNOCHIPS TECHNOLOGY

424

SEVY0003601

VA6010

Varistor

ICVL0505101V150FR 5.6V 0% 60F 1.0*0.5*0.55 NONE

SMD R/TP INNOCHIPS TECHNOLOGY

425

SEVY0003601

VA6011

Varistor

ICVL0505101V150FR 5.6V 0% 60F 1.0*0.5*0.55 NONE

SMD R/TP INNOCHIPS TECHNOLOGY

426

SEVY0003601

VA6012

Varistor

ICVL0505101V150FR 5.6V 0% 60F 1.0*0.5*0.55 NONE

SMD R/TP INNOCHIPS TECHNOLOGY

427

SEVY0003601

VA6013

Varistor

ICVL0505101V150FR 5.6V 0% 60F 1.0*0.5*0.55 NONE

SMD R/TP INNOCHIPS TECHNOLOGY

428

SEVY0003601

VA6015

Varistor

ICVL0505101V150FR 5.6V 0% 60F 1.0*0.5*0.55 NONE

SMD R/TP INNOCHIPS TECHNOLOGY

105

Pad,Short
Pad,Short
Pad,Short
Pad,Short
Pad,Short
Pad,Short

LG Electronics Inc.
121

LG-VS760
LG-VS760
LG-VS760
LG-VS760
LG-VS760
LG-VS760

VRZ
VRZ
VRZ
VRZ
VRZ
VRZ

UN270

429

SEVY0003601

VA6016

Varistor

ICVL0505101V150FR 5.6V 0% 60F 1.0*0.5*0.55 NONE

SMD R/TP INNOCHIPS TECHNOLOGY

430

SEVY0003601

VA6017

Varistor

ICVL0505101V150FR 5.6V 0% 60F 1.0*0.5*0.55 NONE

SMD R/TP INNOCHIPS TECHNOLOGY

431

SEVY0003901

VA6005

Varistor

EVL5M02200 5.5V 0% 480F 1.0*0.5*0.6 NONE SMD

R/TP AMOTECH CO., LTD.

432

SEVY0003901

VA6014

Varistor

EVL5M02200 5.5V 0% 480F 1.0*0.5*0.6 NONE SMD

R/TP AMOTECH CO., LTD.

433

SEVY0003901

VA6018

Varistor

EVL5M02200 5.5V 0% 480F 1.0*0.5*0.6 NONE SMD

R/TP AMOTECH CO., LTD.

434

SEVY0003901

VA6019

Varistor

EVL5M02200 5.5V 0% 480F 1.0*0.5*0.6 NONE SMD

R/TP AMOTECH CO., LTD.

435

SEVY0003901

VA6020

Varistor

EVL5M02200 5.5V 0% 480F 1.0*0.5*0.6 NONE SMD

R/TP AMOTECH CO., LTD.

436

SEVY0003901

VA6021

Varistor

EVL5M02200 5.5V 0% 480F 1.0*0.5*0.6 NONE SMD

R/TP AMOTECH CO., LTD.

437

SEVY0003901

VA6022

Varistor

EVL5M02200 5.5V 0% 480F 1.0*0.5*0.6 NONE SMD

R/TP AMOTECH CO., LTD.

438

SEVY0004301

VA3002

Varistor

ICVL0518100Y500FR 18V 0% 10F 1.0*0.5*0.55 NONE

SMD R/TP INNOCHIPS TECHNOLOGY

439

SFBH0006806

FB6000

Filter,Bead

CIM05J601NC 600 ohm 1.0X0.5X0.5 25% 0.6 ohm

0.3A SMD R/TP 2P 0 SAMSUNG
ELECTRO-MECHANICS CO., LTD.

440

SFDY0003001

FL6000

Filter,Dielectric

DEA202450BT-1275A1 DEA202450BT-1275A1,2450
MHz,2.0*1.25*1.05,SMD,2400M~2500M,IL
1.6,4pin,U-U,50-50,BT BPF TDK CORPORATION

441

SFEY0010501

FL4000

Filter,EMI/Power

ICVE10184E150R101FR ESD/EMI 0HZ 15pF 0H SMD

R/TP INNOCHIPS TECHNOLOGY

442

SFEY0010501

FL4002

Filter,EMI/Power

ICVE10184E150R101FR ESD/EMI 0HZ 15pF 0H SMD

R/TP INNOCHIPS TECHNOLOGY

443

SFEY0010501

FL4003

Filter,EMI/Power

ICVE10184E150R101FR ESD/EMI 0HZ 15pF 0H SMD

R/TP INNOCHIPS TECHNOLOGY

444

SFEY0010501

FL4005

Filter,EMI/Power

ICVE10184E150R101FR ESD/EMI 0HZ 15pF 0H SMD

R/TP INNOCHIPS TECHNOLOGY

445

SFEY0010501

FL4007

Filter,EMI/Power

ICVE10184E150R101FR ESD/EMI 0HZ 15pF 0H SMD

R/TP INNOCHIPS TECHNOLOGY

446

SFEY0010501

FL4008

Filter,EMI/Power

ICVE10184E150R101FR ESD/EMI 0HZ 15pF 0H SMD

R/TP INNOCHIPS TECHNOLOGY

447

SFEY0011401

FL4001

Filter,EMI/Power

ICVE10184E070R101FR ESD/EMI 0HZ 7.5pF 0H SMD

R/TP INNOCHIPS TECHNOLOGY

448

SFEY0011401

FL4004

Filter,EMI/Power

ICVE10184E070R101FR ESD/EMI 0HZ 7.5pF 0H SMD

R/TP INNOCHIPS TECHNOLOGY

449

SFEY0011401

FL4006

Filter,EMI/Power

ICVE10184E070R101FR ESD/EMI 0HZ 7.5pF 0H SMD

R/TP INNOCHIPS TECHNOLOGY

450

SFEY0015301

FL3000

Filter,EMI/Power

NFM18PC104R1C3 ESD/EMI 0HZ 0.1uF 0H SMD R/TP

MURATA MANUFACTURING CO.,LTD.

451

SFSB0002201

FL1000

Filter,Saw,Dual

SAWEP836MFH2F00 836.5MHz, 1880MHz 2.0*1.6*0.6

SMD R/TP 10P MURATA MANUFACTURING CO.,LTD.

106

LG Electronics Inc.
122

UN270

452

SFSY0030001

FL1004

Filter,Saw

SAFEB881MFM0F00 881.5 1.4X1.1X0.6 SMD R/TP 5P

MURATA MANUFACTURING CO.,LTD.

453

SFSY0033404

FL1011

Filter,Saw

B9444 1575.42MHz 1.4*1.1*0.45 SMD R/TP 5P

EPCOS PTE LTD.

454

SFSY0034601

FL1008

Filter,Saw

SAFEB1G96FL0F00 1960 1.4*1.1*0.6 SMD R/TP 5P

MURATA MANUFACTURING CO.,LTD.

455

SMPY0023501

U1000

IC,Power Amplifier

ACPM-7354-TR1
dBm,%,A,dBc,dB,5.0*3.0*1.05,SMD,DCN+USPCS,CPL,
2 MODE,1DCNIN,14CPLOUT,3.2V~4.2V,2,SMD,R/TP,14
AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE.
LIMITED

456

SMZY0021701

U1007

Module,GPS

ALM-2412 ALM-2412,GPS LNA Module integrated

Filter,3.3x2.1x1.1 AVAGO TECHNOLOGIES
INTERNATIONAL SALES PTE. LIMITED

457

SMZY0022401

U1002

Module,Assembly

ACFM-7107 Duplexer module Quadplexer, DCN/US-PCS

duplexer module AVAGO TECHNOLOGIES
INTERNATIONAL SALES PTE. LIMITED

458

SNMF0051501

ANT600
0

Antenna,Helical

SDBTPTR3015 SINGLE -5DB 50OHM 5 PARTRON

COMPANY LIMITED

107

LG Electronics Inc.
123

UN270

6.3 Full BOM List

No
1
2
3

Part No
AGQ86410701
ACQ85468101
ACGM0172205

Designator

Qty
1
1

Description
Phone Assembly
Cover Assembly,EMS
Cover Assembly,Rear

Part Site Specification

LGUN270.AUCLZY BK:Black LGUN270.AUCLZY ZZ:Without Color LGUN270.AUCLRD ZZ:Without Color -

ACQ100400
ACQ063302

MBFZ0060401

MBFZ00

Bracket

COMPLEX LG-UN270 VRZTG ZZ:Without Color

COMPLEX, (empty), , , , ,

MBJZ0046705

MBJZ01

Button

COMPLEX LGUN270.AUCLRD ZZ:Without Color

COMPLEX, (empty), , , , ,

MBJZ0046805

MBJZ02

Button

COMPLEX LGUN270.AUCLRD ZZ:Without Color

COMPLEX, (empty), , , , ,

MBJZ0046905

MBJZ00

Button

COMPLEX LGUN270.AUCLRD ZZ:Without Color

COMPLEX, (empty), , , , ,

MCCZ0047705

MCCZ02

Cap

COMPLEX LGUN270.AUCLRD ZZ:Without Color

COMPLEX, (empty), , , , ,

MCCZ0047805

MCCZ00

Cap

COMPLEX LGUN270.AUCLRD ZZ:Without Color

COMPLEX, (empty), , , , ,

10

MCCZ0047901

MBL000003

Cap

COMPLEX LG-UN270 VRZTG ZZ:Without Color

COMPLEX, (empty), , , , ,

11

MCJN0130105

MCJN00

Cover,Rear

COMPLEX LGUN270.AUCLRD ZZ:Without Color

COMPLEX, (empty), , , , ,

12

MCQ66474101

MCQ074200

Damper,Speaker

COMPLEX LGUN270.AVRZTG ZZ:Without Color -

13

MCQ66499501

MCQ000004

Damper

COMPLEX LGUN270.AVRZTG ZZ:Without Color -

14

MDAY0091501

MDAY00

Decor

COMPLEX LG-UN270 VRZTG ZZ:Without Color MOLD,

ABS MP-211, , , , ,

15

MDS63551701

MDS000000

Gasket

COMPLEX LGUN270.AVRZTG GD:Gold -

16

MFBZ0033401

MFBZ00

Filter

COMPLEX LG-UN270 VRZTG ZZ:Without Color

COMPLEX, (empty), , , , ,

17

MHK63287705

MHK000000

Sheet

COMPLEX LGUN270.AUCLRD ZY:Color Unfixed -

18

MJN67667001

MJN000000

Tape

COMPLEX LGUN270.AVRZTG ZZ:Without Color -

19

MJN67680401

MJN061101

Tape,Protect

COMPLEX LGUN270.AVRZTG ZZ:Without Color -

20

MJN67707601

MJN061102

Tape,Protect

COMPLEX LGUN270.AVRZTG ZZ:Without Color -

21

MJN67707701

MJN061104

Tape,Protect

COMPLEX LGUN270.AVRZTG ZZ:Without Color -

22

MJN67707801

MJN061103

Tape,Protect

COMPLEX LGUN270.AVRZTG ZZ:Without Color -

23

MLAN0000604

MEZ062200

Label,Qualcomm

TR,White,95B

24

MPBZ0338601

MPBZ03

Damper

COMPLEX LG-UN270 VRZTG ZZ:Without Color

COMPLEX, (empty), , , , ,

25

MPBZ0338701

MPBZ02

Damper

COMPLEX LG-UN270 VRZTG ZZ:Without Color

COMPLEX, (empty), , , , ,

26

MPBZ0356101

MPBZ00

Damper

COMPLEX LG-UN270 VRZTG ZZ:Without Color

COMPLEX, (empty), , , , ,

27

MTAA0233601

MTAA00

Tape,Decor

COMPLEX LG-UN270 VRZTG ZZ:Without Color

COMPLEX, (empty), , , , ,

28

MTAB0444601

MTAB00

Tape,Protect

COMPLEX LG-UN270 VRZTG ZZ:Without Color

COMPLEX, (empty), , , , ,

29

MWAE0067201

MWAE00

Window,Camera

COMPLEX LG-UN270 VRZTG ZZ:Without Color

COMPLEX, (empty), , , , ,

30

SNMF0070301

SNMF00

Antenna,Helical

HIR-02A40-0000AA 3.0,-2.0 dB,DCN/USPCS,SPK

ass'y,DUAL,-2.0,50,3.0 E.M.W CO., LTD.

31

SUSY0028910

SUSY00

Speaker,Dual Mode

EMS1812TPB6P Nd-Fe-B 700mW 8OHM 91DB 710HZ

1812*3.0T PIN EM-TECH

108

LG Electronics Inc.
124

UN270

32

ACQ85467701

ACQ072500

Cover Assembly,Slide
Cover
Assembly,Front

33

ACGK0174405

ACQ032700

34

MCJK0137905

MCJK00

Cover,Front

COMPLEX LGUN270.AUCLRD ZZ:Without Color

COMPLEX, (empty), , , , ,

35

MICE0016902

MICE00

Insert,Nut

COMPLEX MECH_COMMON ZZ:Without Color -

36

MPBZ0338201

MCQ000000

Damper

COMPLEX LG-UN270 VRZTG ZZ:Without Color

COMPLEX, (empty), , , , ,

37

MPBZ0338401

MCQ000001

Damper

COMPLEX LG-UN270 VRZTG ZZ:Without Color

COMPLEX, (empty), , , , ,

38

MTAZ0372101

MTAZ00

Tape

COMPLEX LG-UN270 VRZTG ZZ:Without Color

COMPLEX, (empty), , , , ,

39

RAB32795201

RAB150000

40

ACGU0007505

ACQ046001

41
42
43

MCK66701001
AHFY0004505
MJN67696801

MCJY00
AEH000000
MJN061100

1
1
1

Magnet,Switch
Cover
Assembly,Lower
Cover,Lower
Hinge Assembly
Tape,Protect

44

MPBU0114201

MCQ015700

Damper,Connector

COMPLEX LG-UN270 VRZTG ZZ:Without Color

COMPLEX, (empty), , , , ,

45

MPBZ0338106

MCQ000004

Damper

COMPLEX LG-UN270 VRZTG ZZ:Without Color

COMPLEX, (empty), , , , ,

46

MPBZ0338501

MPBZ02

Damper

COMPLEX LG-UN270 VRZTG ZZ:Without Color

COMPLEX, (empty), , , , ,

47

MPBZ0365301

MPBZ03

Damper

COMPLEX LG-UN270 VRZTG ZZ:Without Color

COMPLEX,(empty),

48

ACQ85443501

ACQ084401

49

MCK66677801

MCK084400

Cover
Assembly,Upper
Cover,Upper

LGUN270.AUCLZY BL:Blue LGUN270.AUCLRD ZZ:Without Color -

ND 12.2TO12.6 LGUN270.AUCLRD ZZ:Without Color COMPLEX LGUN270.AUCLZY BK:Black LGUN270.AUCLRD ZZ:Without Color COMPLEX LGUN270.AVRZTG BK:Black -

LGUN270.AUCLZY BK:Black COMPLEX LGUN270.AUCLZY BK:Black -

50

MDQ62899401

MDQ000000

Frame

COMPLEX LGUN270.AUCLZY ZZ:Without Color UPPER

COVER FRAME

51

MICE0016901

MET099500

Insert,Nut

COMPLEX MECH_COMMON ZZ:Without Color -

52

MCQ66704501

MCQ000000

Damper

COMPLEX LGUN270.AUCLZY ZZ:Without Color PAD

FPCB SENSOR

53

MCR64412501

MCR000000

Decor

COMPLEX LGUN270.AUCLZY BK:Black (UPPER COVER

DECO L)

54

MCR64412601

MCR000001

Decor

COMPLEX LGUN270.AUCLZY BK:Black (UPPER COVER

DECO R)

55

MFBZ0028701

MDJ000000

Filter

COMPLEX LG-UN270 VRZTG ZZ:Without Color

COMPLEX, (empty), , , , ,

56

MJN67757101

MJN089300

Tape,Window

COMPLEX LGUN270.AUCLZY ZZ:Without Color

WINDOW TAPE BIG

57

MJN67757201

MJN089301

Tape,Window

COMPLEX LGUN270.AUCLZY ZZ:Without Color

(WINDOW TAPE SMALL)

58

MJN67906001

MJN020802

Tape,Decor

COMPLEX LGUN270.AUCLRD ZZ:Without Color cover

upper deco L, R

59

AEX73718501

AEX076900

60

AKAC0020605

AEX046800

61

EBD61045501

EBD030100

62

GMEY0010601

FAB010001

Screw,Machine

GMEY0010601 BH + 1.4mM 2.5mM MSWR FZB N KUMGANG SCREW CO., LTD

63

GMEY0018101

FAB010000

Screw,Machine

GMEY0018101 FH + 1.4mM 1.5mM SWCH FZB N KUMGANG SCREW CO., LTD

64

MBL64922405

MBL067400

Cap,Screw

COMPLEX LGUN270.AUCLRD ZZ:Without Color -

65

MCQ66825401

MCQ000001

Damper

COMPLEX LGUN270.AUCLRD ZZ:Without Color MIC

PAD COVER UPPER

66

MEV63951301

MEV000001

Insulator

COMPLEX LGUN270T.AVRZTGH BL:Blue LCD BOTTOM

INSULATOR

109

Keypad
Assembly,Sub
Keypad
Assembly,Main
Touch Window
Assembly

LG Electronics Inc.
125

LGUN270.AUCLZY ZZ:Without Color LGUN270.AUCLRD ZZ:Without Color RESISTIVE TOUCH FFP None 2.8 B to B connector
type -

UN270

67

MFBZ0028805

MDJ000001

Filter

COMPLEX LGUN270.AUCLRD ZZ:Without Color

COMPLEX, (empty), , , , ,

68

MIDZ0280101

MEV000000

Insulator

COMPLEX LG-UN270 VRZTG ZZ:Without Color

COMPLEX, (empty), , , , ,

69

MJN67680506

MJN061102

Tape,Protect

COMPLEX LGUN270.AUCLRD ZZ:Without Color -

70

MJN67757301

MJN089300

Tape,Window

COMPLEX LGUN270.AUCLZY ZZ:Without Color TAPE

PROTECTION WINDOW

71

MPBZ0338001

MCQ000000

Damper

COMPLEX LG-UN270 VRZTG ZZ:Without Color

COMPLEX, (empty), , , , ,

72

MTAB0433301

MJN061101

Tape,Protect

COMPLEX LG-UN270 VRZTG ZZ:Without Color

COMPLEX, (empty), , , , ,

73

MTAZ0373801

MJN000000

Tape

COMPLEX LG-UN270 VRZTG ZZ:Without Color

COMPLEX, (empty), , , , ,

74

SACY0118004

EBR070501

75

SACB0065801

SACB00

76

SACE0105804

SACE01

77

EAX64118401

SPCY02

PCB,Flexible

LGUN270.AUCLRD 1.0 POLYI Double 2 0.11 Flexible

78

SACC0079604

SACC00

PCB
Assembly,Flexible,SM
T Bottom

LGUN270.AUCLRD 1.0 FLEXIBLE

79

ECCH0002001

C106

Capacitor,Ceramic,C
hip

C1005JB0J104KT000F 0.1uF 10% 6.3V Y5P

-30TO+85C 1005 R/TP - TDK CORPORATION

80

ECCH0002001

C107

Capacitor,Ceramic,C
hip

C1005JB0J104KT000F 0.1uF 10% 6.3V Y5P

-30TO+85C 1005 R/TP - TDK CORPORATION

81

ENBY0052001

CN102

Connector,BtoB

24-5804-010-000-829+ 10P 0.40MM STRAIGHT

FEMALE SMD R/TP 900mM - KYOCERA ELCO KOREA
SALES CO.,LTD.

82

EUSY0362601

U101

IC,Hall Effect Switch

BU52031NVX SSON004,4,R/TP,Hall
IC,IC,CMOSIC,CMOS - SSON R/TP 4P - ROHM.

83

SEVY0003901

VA104

Varistor

EVL5M02200 5.5V 0% 480F 1.0*0.5*0.6 NONE SMD

R/TP AMOTECH CO., LTD.

84

SEVY0003901

VA105

Varistor

EVL5M02200 5.5V 0% 480F 1.0*0.5*0.6 NONE SMD

R/TP AMOTECH CO., LTD.

85

SEVY0005202

VA100

Varistor

EVLC5S02100 5.5V 0% 100F 1.0*0.5*0.6 UL SMD

R/TP AMOTECH CO., LTD.

86

SEVY0005202

VA101

Varistor

EVLC5S02100 5.5V 0% 100F 1.0*0.5*0.6 UL SMD

R/TP AMOTECH CO., LTD.

87

SEVY0005202

VA102

Varistor

EVLC5S02100 5.5V 0% 100F 1.0*0.5*0.6 UL SMD

R/TP AMOTECH CO., LTD.

88

SEVY0005202

VA103

Varistor

EVLC5S02100 5.5V 0% 100F 1.0*0.5*0.6 UL SMD

R/TP AMOTECH CO., LTD.

89

SACD0093304

SACD00

PCB
Assembly,Flexible,SM
T Top

LGUN270.AUCLRD 1.0 FLEXIBLE

90

ENBY0036701

CN100

Connector,BtoB

GB042-60P-H10-E3000 60P 0.40MM STRAIGHT PLUG

SMD R/TP 1M - LS Mtron Ltd.

91

ENBY0040401

CN101

Connector,BtoB

GB042-50P-H10-E3000 50P 0.4MM STRAIGHT PLUG

SMD R/TP 1M - LS Mtron Ltd.

92

SAJY0051403

EBR072901

93

SAJB0024003

SAJB00

94

ADB73619101

ADB048601

PCB Assembly,Sub
PCB
Assembly,Sub,Insert
Dome
Assembly,Metal

110

PCB
Assembly,Flexible
PCB
Assembly,Flexible,In
sert
PCB
Assembly,Flexible,SM
T

LG Electronics Inc.
126

LGUN270.AUCLRD 1.0 FLEXIBLE

LG-UN270 VRZTG A FLEXIBLE
LGUN270.AUCLRD 1.0 FLEXIBLE

LGUN270.AUCLRD 1.0 SUB

LGUN270.AUCLRD 1.0 SUB
LGUN270.AUCLZY ZZ:Without Color SUB PCB DOME
ASS'Y

UN270

95

SUMY0003816

SUMY00

Microphone,Condens
er

OBM-410L44-RC1882 -44DB 2.2KOHM OMNI 1TO10V

4x1.0t FPCB BSE CO., LTD.

96

SAJE0041903

SAJE00

PCB
Assembly,Sub,SMT

LGUN270.AUCLRD 1.0 SUB

97

EAX64141001

SPEY00

PCB,Keypad

LGUN270.AUCLRD 1.0 FR-4 SBL 4 0.6 Keypad

98

SAJC0040704

SAJC00

PCB
Assembly,Sub,SMT
Bottom

LGUN270.AUCLRD 1.0 SUB

99

ECZH0000813

C105

Capacitor,Ceramic,C
hip

C1005C0G1H101JT 100pF 5% 50V NP0 -55TO+125C

1005 R/TP - TDK KOREA COOPERATION

100

ECZH0000830

C100

Capacitor,Ceramic,C
hip

C1005C0G1H330JT000F 33pF 5% 50V NP0

-55TO+125C 1005 R/TP - TDK KOREA
COOPERATION

101

ECZH0000830

C101

Capacitor,Ceramic,C
hip

C1005C0G1H330JT000F 33pF 5% 50V NP0

-55TO+125C 1005 R/TP - TDK KOREA
COOPERATION

102

ECZH0000830

C102

Capacitor,Ceramic,C
hip

C1005C0G1H330JT000F 33pF 5% 50V NP0

-55TO+125C 1005 R/TP - TDK KOREA
COOPERATION

103

ECZH0000830

C103

Capacitor,Ceramic,C
hip

C1005C0G1H330JT000F 33pF 5% 50V NP0

-55TO+125C 1005 R/TP - TDK KOREA
COOPERATION

104

ELCH0001425

L100

Inductor,Multilayer,C
hip

LL1005-FHL82NJ 82NH 5% - 150mA 1.9OHM 1.15GHZ

10 SHIELD NONE 1.0X0.5X0.5MM R/TP TOKO, INC.

105

ENBY0040501

CN100

Connector,BtoB

GB042-50S-H10-E3000 50P 0.4MM STRAIGHT SOCKET

SMD R/TP 1M - LS Mtron Ltd.

106

ENQY0014301

CN101

Connector,FFC/FPC/
PIC

04-6293-637-005-829+ 37P 0.30MM FFC/FPC

STRAIGHT BOTH SMD R/TP LOCKING - KYOCERA
ELCO KOREA SALES CO.,LTD.

107

EQBN0019901

Q100

TR,Bipolar

2PC4617R NPN 7V 60V 50V 150mA 100NA 390

150mW SC75 R/TP 3P NXP Semiconductors

108

ERHZ0000443

R103

Resistor,Chip

MCR01MZP5J222 2.2KOHM 5% 1/16W 1005 R/TP ROHM.

109

SAFP0000501

R104

Wire Pad,Short

LG-VS760 VRZ

110

SEVY0003601

VA100

Varistor

ICVL0505101V150FR 5.6V 0% 60F 1.0*0.5*0.55

NONE SMD R/TP INNOCHIPS TECHNOLOGY

111

SEVY0005202

VA101

Varistor

EVLC5S02100 5.5V 0% 100F 1.0*0.5*0.6 UL SMD

R/TP AMOTECH CO., LTD.

112

SAJD0043403

SAJD00

PCB
Assembly,Sub,SMT
Top

LGUN270.AUCLRD 1.0 SUB

113

EDLH0012504

LD100

LED,Chip

TWH104-HS WHITE 2.7~3.1 20mA 100~220mcd

X(0.226~0.321)Y(0.22~0.31) 66mW 1005 R/TP 2P SEOUL SEMICONDUCTOR CO.,LTD

114

EDLH0012504

LD101

LED,Chip

TWH104-HS WHITE 2.7~3.1 20mA 100~220mcd

X(0.226~0.321)Y(0.22~0.31) 66mW 1005 R/TP 2P SEOUL SEMICONDUCTOR CO.,LTD

115

EDLH0012504

LD102

LED,Chip

TWH104-HS WHITE 2.7~3.1 20mA 100~220mcd

X(0.226~0.321)Y(0.22~0.31) 66mW 1005 R/TP 2P SEOUL SEMICONDUCTOR CO.,LTD

111

LG Electronics Inc.
127

UN270

116

ERHZ0000504

R100

Resistor,Chip

MCR01MZP5J680 68OHM 5% 1/16W 1005 R/TP ROHM.

117

ERHZ0000504

R101

Resistor,Chip

MCR01MZP5J680 68OHM 5% 1/16W 1005 R/TP ROHM.

118

ERHZ0000504

R102

Resistor,Chip

MCR01MZP5J680 68OHM 5% 1/16W 1005 R/TP ROHM.

119

SURY0010122

EAB010400

Receiver

EMR1207SPT3P FPCB,103 dB,32

ohm,1207,2.7T,HAC,FPC, EM-TECH

120

SVLM0039902

EAJ020200

LCD,Module-TFT

LM275PN2A WQVGA 2.8INCH 240X400 500CD COLOR

70% 15/9 500:1 60Hz Inverter N UN270 2.8" WQVGA
TOVIS TOVIS

121

GMZZ0017701

FAB010000

Screw,Machine

GMZZ0017701 BH + 1.4mM 3mM MSWR NI PLT N ASIA BOLT

122

SAFY0383104

EBR071900

123

SAFB0120303

SAFB01

124

ACKA0034701

ACKA00

PCB Assembly,Main
PCB
Assembly,Main,Inser
t
Can Assembly,Shield

LG-UN270 VRZTG ZZ:Without Color -

125

MLAB0004801

MEZ000900

Label,After Service

COMPLEX LG-LB3300 LGT ZZ:Without Color -

126

MTAZ0373901

MTAZ00

Tape

COMPLEX LG-UN270 VRZTG ZZ:Without Color

COMPLEX, (empty), , , , ,

127

ADCA0120605

ADB048601

Dome
Assembly,Metal

LGUN270.AUCLRD ZZ:Without Color -

128

BRAH0001301

RRAH00

Resin,PC

UF-1060

129

BRAH0002601

RAA050101

Resin

UNIQUE4000HFW ; , , , ,[empty] , , ,[empty]

SERVEONE CO., LTD.

130

EAU61425901

EAU614

Motor,DC

MVMU-A362G 2V 90mA 0A 0RPM 0RPM 60mSEC

0GF.CM 26OHM LG INNOTEK CO., LTD

131

SNMF0070401

SNMF00

Antenna,Helical

HIR-02A41-0000AA 3.0,-2.0
dB,DCN_Rx/GPS/PCS_Rx,Carrier,TRIPLE,-2.0,50,3.0
E.M.W CO., LTD.

132

SVCY0028001

SVCY00

Camera Module

CW1333-ABDBS CMOS,MEGA,hynix 1/6",Socket

type,7x7x4.1t COWELL ELECTRONICS CO.,LTD

133

SAFF0285104

SAFF02

PCB
Assembly,Main,SMT

LGUN270.AUCLRD 1.0 MAIN

134

MLAZ0038301

MEZ000000

Label

COMPLEX LG-VX6000 ZZ:Without Color PID Label 4

Array PRINTING,

135

SAD32888401

SAD010000

136

SAFC0152903

SAFC01

Software,Mobile
PCB
Assembly,Main,SMT
Bottom

137

ECCH0000110

C1066

Capacitor,Ceramic,C
hip

MCH155A100D 10pF 0.5PF 50V NP0 -55TO+125C

1005 R/TP - ROHM Semiconductor KOREA
CORPORATION

138

ECCH0000110

C6001

Capacitor,Ceramic,C
hip

MCH155A100D 10pF 0.5PF 50V NP0 -55TO+125C

1005 R/TP - ROHM Semiconductor KOREA
CORPORATION

139

ECCH0000110

C6007

Capacitor,Ceramic,C
hip

MCH155A100D 10pF 0.5PF 50V NP0 -55TO+125C

1005 R/TP - ROHM Semiconductor KOREA
CORPORATION

140

ECCH0000110

C6012

Capacitor,Ceramic,C
hip

MCH155A100D 10pF 0.5PF 50V NP0 -55TO+125C

1005 R/TP - ROHM Semiconductor KOREA
CORPORATION

141

ECCH0000110

C6026

Capacitor,Ceramic,C
hip

MCH155A100D 10pF 0.5PF 50V NP0 -55TO+125C

1005 R/TP - ROHM Semiconductor KOREA
CORPORATION

142

ECCH0000112

C1018

Capacitor,Ceramic,C
hip

MCH155C150J 15pF 5% 50V NP0 -55TO+125C 1005

R/TP - ROHM Semiconductor KOREA CORPORATION

112

0.00
015
0.00
03

LG Electronics Inc.
128

LGUN270.AUCLRD 1.0 MAIN

LGUN270.AUCLRD 1.0 MAIN

Base UN270ZV2 - NORTH AMERICA QCT LGUN270.AUCLRD 1.0 MAIN

UN270

143

ECCH0000112

C4002

Capacitor,Ceramic,C
hip

MCH155C150J 15pF 5% 50V NP0 -55TO+125C 1005

R/TP - ROHM Semiconductor KOREA CORPORATION

144

ECCH0000112

C4003

Capacitor,Ceramic,C
hip

MCH155C150J 15pF 5% 50V NP0 -55TO+125C 1005

R/TP - ROHM Semiconductor KOREA CORPORATION

145

ECCH0000112

C4006

Capacitor,Ceramic,C
hip

MCH155C150J 15pF 5% 50V NP0 -55TO+125C 1005

R/TP - ROHM Semiconductor KOREA CORPORATION

146

ECCH0000112

C4007

Capacitor,Ceramic,C
hip

MCH155C150J 15pF 5% 50V NP0 -55TO+125C 1005

R/TP - ROHM Semiconductor KOREA CORPORATION

147

ECCH0000112

C6017

Capacitor,Ceramic,C
hip

MCH155C150J 15pF 5% 50V NP0 -55TO+125C 1005

R/TP - ROHM Semiconductor KOREA CORPORATION

148

ECCH0000112

C6025

Capacitor,Ceramic,C
hip

MCH155C150J 15pF 5% 50V NP0 -55TO+125C 1005

R/TP - ROHM Semiconductor KOREA CORPORATION

149

ECCH0000117

C5101

Capacitor,Ceramic,C
hip

CL05C270JB5NNNC 27pF 5% 50V NP0 -55TO+125C

1005 R/TP 0.5 SAMSUNG ELECTRO-MECHANICS CO.,
LTD.

150

ECCH0000120

C1053

Capacitor,Ceramic,C
hip

MCH155A390J 39pF 5% 50V NP0 -55TO+125C 1005

R/TP - ROHM Semiconductor KOREA CORPORATION

151

ECCH0000122

C2205B

Capacitor,Ceramic,C
hip

MCH155A470JK 47pF 5% 50V NP0 -55TO+125C 1005

R/TP - ROHM Semiconductor KOREA CORPORATION

152

ECCH0000122

C3003

Capacitor,Ceramic,C
hip

MCH155A470JK 47pF 5% 50V NP0 -55TO+125C 1005

R/TP - ROHM Semiconductor KOREA CORPORATION

153

ECCH0000127

C1044

Capacitor,Ceramic,C
hip

MCH155A820J 82pF 5% 50V NP0 -55TO+125C 1005

R/TP - ROHM Semiconductor KOREA CORPORATION

154

ECCH0000127

C1052

Capacitor,Ceramic,C
hip

MCH155A820J 82pF 5% 50V NP0 -55TO+125C 1005

R/TP - ROHM Semiconductor KOREA CORPORATION

155

ECCH0000133

C2116B

Capacitor,Ceramic,C
hip

C1005X7R1H221KT000F 0.22nF 10% 50V X7R

-55TO+125C 1005 R/TP - TDK KOREA
COOPERATION

156

ECCH0000143

C1013

Capacitor,Ceramic,C
hip

MCH155CN102KK 1nF 10% 50V X7R -55TO+125C

1005 R/TP - ROHM Semiconductor KOREA
CORPORATION

157

ECCH0000143

C1016

Capacitor,Ceramic,C
hip

MCH155CN102KK 1nF 10% 50V X7R -55TO+125C

1005 R/TP - ROHM Semiconductor KOREA
CORPORATION

158

ECCH0000143

C2124B

Capacitor,Ceramic,C
hip

MCH155CN102KK 1nF 10% 50V X7R -55TO+125C

1005 R/TP - ROHM Semiconductor KOREA
CORPORATION

159

ECCH0000143

C2126B

Capacitor,Ceramic,C
hip

MCH155CN102KK 1nF 10% 50V X7R -55TO+125C

1005 R/TP - ROHM Semiconductor KOREA
CORPORATION

160

ECCH0000143

C2201B

Capacitor,Ceramic,C
hip

MCH155CN102KK 1nF 10% 50V X7R -55TO+125C

1005 R/TP - ROHM Semiconductor KOREA
CORPORATION

161

ECCH0000143

C2210B

Capacitor,Ceramic,C
hip

MCH155CN102KK 1nF 10% 50V X7R -55TO+125C

1005 R/TP - ROHM Semiconductor KOREA
CORPORATION

162

ECCH0000149

C2115B

Capacitor,Ceramic,C
hip

MCH155CN332KK 3.3nF 10% 50V X7R -55TO+125C

1005 R/TP - ROHM Semiconductor KOREA
CORPORATION

163

ECCH0000151

C2112B

Capacitor,Ceramic,C
hip

CL05B472KB5NNNC 4.7nF 10% 25V X7R -55TO+125C

1005 R/TP - SAMSUNG ELECTRO-MECHANICS CO.,
LTD.

113

LG Electronics Inc.
129

UN270

164

ECCH0000151

C2114B

Capacitor,Ceramic,C
hip

CL05B472KB5NNNC 4.7nF 10% 25V X7R -55TO+125C

1005 R/TP - SAMSUNG ELECTRO-MECHANICS CO.,
LTD.

165

ECCH0000155

C2203B

Capacitor,Ceramic,C
hip

MCH153CN103KK 10nF 10% 16V X7R -55TO+125C

1005 R/TP - ROHM Semiconductor KOREA
CORPORATION

166

ECCH0000155

C6002

Capacitor,Ceramic,C
hip

MCH153CN103KK 10nF 10% 16V X7R -55TO+125C

1005 R/TP - ROHM Semiconductor KOREA
CORPORATION

167

ECCH0000155

C6003

Capacitor,Ceramic,C
hip

MCH153CN103KK 10nF 10% 16V X7R -55TO+125C

1005 R/TP - ROHM Semiconductor KOREA
CORPORATION

168

ECCH0000155

C6005

Capacitor,Ceramic,C
hip

MCH153CN103KK 10nF 10% 16V X7R -55TO+125C

1005 R/TP - ROHM Semiconductor KOREA
CORPORATION

169

ECCH0000155

C6008

Capacitor,Ceramic,C
hip

MCH153CN103KK 10nF 10% 16V X7R -55TO+125C

1005 R/TP - ROHM Semiconductor KOREA
CORPORATION

170

ECCH0000155

C6021

Capacitor,Ceramic,C
hip

MCH153CN103KK 10nF 10% 16V X7R -55TO+125C

1005 R/TP - ROHM Semiconductor KOREA
CORPORATION

171

ECCH0000161

C2202B

Capacitor,Ceramic,C
hip

MCH153CN333KK 33nF 10% 16V X7R -55TO+125C

1005 R/TP - ROHM Semiconductor KOREA
CORPORATION

172

ECCH0000161

C3001

Capacitor,Ceramic,C
hip

MCH153CN333KK 33nF 10% 16V X7R -55TO+125C

1005 R/TP - ROHM Semiconductor KOREA
CORPORATION

173

ECCH0000161

C3011

Capacitor,Ceramic,C
hip

MCH153CN333KK 33nF 10% 16V X7R -55TO+125C

1005 R/TP - ROHM Semiconductor KOREA
CORPORATION

174

ECCH0000161

C4012

Capacitor,Ceramic,C
hip

MCH153CN333KK 33nF 10% 16V X7R -55TO+125C

1005 R/TP - ROHM Semiconductor KOREA
CORPORATION

175

ECCH0000161

C8000

Capacitor,Ceramic,C
hip

MCH153CN333KK 33nF 10% 16V X7R -55TO+125C

1005 R/TP - ROHM Semiconductor KOREA
CORPORATION

176

ECCH0000175

C1062

Capacitor,Ceramic,C
hip

GRM1555C1H2R7B 2.7pF 0.1PF 50V NP0 -55TO+125C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

177

ECCH0000182

C2101B

Capacitor,Ceramic,C
hip

GRM155R61A104K 0.1uF 10% 10V X5R -55TO+85C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

178

ECCH0000182

C2102B

Capacitor,Ceramic,C
hip

GRM155R61A104K 0.1uF 10% 10V X5R -55TO+85C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

179

ECCH0000182

C2103B

Capacitor,Ceramic,C
hip

GRM155R61A104K 0.1uF 10% 10V X5R -55TO+85C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

180

ECCH0000182

C2105B

Capacitor,Ceramic,C
hip

GRM155R61A104K 0.1uF 10% 10V X5R -55TO+85C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

181

ECCH0000182

C2110B

Capacitor,Ceramic,C
hip

GRM155R61A104K 0.1uF 10% 10V X5R -55TO+85C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

182

ECCH0000182

C2118B

Capacitor,Ceramic,C
hip

GRM155R61A104K 0.1uF 10% 10V X5R -55TO+85C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

183

ECCH0000182

C2119B

Capacitor,Ceramic,C
hip

GRM155R61A104K 0.1uF 10% 10V X5R -55TO+85C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

184

ECCH0000182

C2120B

Capacitor,Ceramic,C
hip

GRM155R61A104K 0.1uF 10% 10V X5R -55TO+85C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

114

LG Electronics Inc.
130

UN270

185

ECCH0000182

C2121B

Capacitor,Ceramic,C
hip

GRM155R61A104K 0.1uF 10% 10V X5R -55TO+85C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

186

ECCH0000182

C2122B

Capacitor,Ceramic,C
hip

GRM155R61A104K 0.1uF 10% 10V X5R -55TO+85C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

187

ECCH0000182

C2123B

Capacitor,Ceramic,C
hip

GRM155R61A104K 0.1uF 10% 10V X5R -55TO+85C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

188

ECCH0000182

C2128B

Capacitor,Ceramic,C
hip

GRM155R61A104K 0.1uF 10% 10V X5R -55TO+85C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

189

ECCH0000182

C2129B

Capacitor,Ceramic,C
hip

GRM155R61A104K 0.1uF 10% 10V X5R -55TO+85C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

190

ECCH0000182

C2130B

Capacitor,Ceramic,C
hip

GRM155R61A104K 0.1uF 10% 10V X5R -55TO+85C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

191

ECCH0000182

C2132B

Capacitor,Ceramic,C
hip

GRM155R61A104K 0.1uF 10% 10V X5R -55TO+85C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

192

ECCH0000182

C2133B

Capacitor,Ceramic,C
hip

GRM155R61A104K 0.1uF 10% 10V X5R -55TO+85C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

193

ECCH0000182

C2134B

Capacitor,Ceramic,C
hip

GRM155R61A104K 0.1uF 10% 10V X5R -55TO+85C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

194

ECCH0000182

C2135B

Capacitor,Ceramic,C
hip

GRM155R61A104K 0.1uF 10% 10V X5R -55TO+85C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

195

ECCH0000182

C2136B

Capacitor,Ceramic,C
hip

GRM155R61A104K 0.1uF 10% 10V X5R -55TO+85C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

196

ECCH0000182

C2138B

Capacitor,Ceramic,C
hip

GRM155R61A104K 0.1uF 10% 10V X5R -55TO+85C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

197

ECCH0000182

C2149B

Capacitor,Ceramic,C
hip

GRM155R61A104K 0.1uF 10% 10V X5R -55TO+85C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

198

ECCH0000182

C2150B

Capacitor,Ceramic,C
hip

GRM155R61A104K 0.1uF 10% 10V X5R -55TO+85C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

199

ECCH0000182

C2151B

Capacitor,Ceramic,C
hip

GRM155R61A104K 0.1uF 10% 10V X5R -55TO+85C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

200

ECCH0000182

C2152B

Capacitor,Ceramic,C
hip

GRM155R61A104K 0.1uF 10% 10V X5R -55TO+85C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

201

ECCH0000182

C2154B

Capacitor,Ceramic,C
hip

GRM155R61A104K 0.1uF 10% 10V X5R -55TO+85C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

202

ECCH0000182

C2156B

Capacitor,Ceramic,C
hip

GRM155R61A104K 0.1uF 10% 10V X5R -55TO+85C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

203

ECCH0000182

C2157B

Capacitor,Ceramic,C
hip

GRM155R61A104K 0.1uF 10% 10V X5R -55TO+85C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

204

ECCH0000182

C2158B

Capacitor,Ceramic,C
hip

GRM155R61A104K 0.1uF 10% 10V X5R -55TO+85C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

205

ECCH0000182

C2204B

Capacitor,Ceramic,C
hip

GRM155R61A104K 0.1uF 10% 10V X5R -55TO+85C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

115

LG Electronics Inc.
131

UN270

206

ECCH0000182

C2208B

Capacitor,Ceramic,C
hip

GRM155R61A104K 0.1uF 10% 10V X5R -55TO+85C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

207

ECCH0000182

C2209B

Capacitor,Ceramic,C
hip

GRM155R61A104K 0.1uF 10% 10V X5R -55TO+85C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

208

ECCH0000183

C1097

Capacitor,Ceramic,C
hip

GRM1555C1H1R8C 1.8pF 0.25PF 50V NP0

-55TO+125C 1005 R/TP - MURATA
MANUFACTURING CO.,LTD.

209

ECCH0000183

C1105

Capacitor,Ceramic,C
hip

GRM1555C1H1R8C 1.8pF 0.25PF 50V NP0

-55TO+125C 1005 R/TP - MURATA
MANUFACTURING CO.,LTD.

210

ECCH0000198

C2117B

Capacitor,Ceramic,C
hip

CL05A225MQ5NSNC 2.2uF 20% 6.3V X5R -55TO+85C

1005 R/TP . SAMSUNG ELECTRO-MECHANICS CO.,
LTD.

211

ECCH0000198

C2164B

Capacitor,Ceramic,C
hip

CL05A225MQ5NSNC 2.2uF 20% 6.3V X5R -55TO+85C

1005 R/TP . SAMSUNG ELECTRO-MECHANICS CO.,
LTD.

212

ECCH0000198

C2165B

Capacitor,Ceramic,C
hip

CL05A225MQ5NSNC 2.2uF 20% 6.3V X5R -55TO+85C

1005 R/TP . SAMSUNG ELECTRO-MECHANICS CO.,
LTD.

213

ECCH0000198

C2166B

Capacitor,Ceramic,C
hip

CL05A225MQ5NSNC 2.2uF 20% 6.3V X5R -55TO+85C

1005 R/TP . SAMSUNG ELECTRO-MECHANICS CO.,
LTD.

214

ECCH0000198

C2167B

Capacitor,Ceramic,C
hip

CL05A225MQ5NSNC 2.2uF 20% 6.3V X5R -55TO+85C

1005 R/TP . SAMSUNG ELECTRO-MECHANICS CO.,
LTD.

215

ECCH0000198

C2172B

Capacitor,Ceramic,C
hip

CL05A225MQ5NSNC 2.2uF 20% 6.3V X5R -55TO+85C

1005 R/TP . SAMSUNG ELECTRO-MECHANICS CO.,
LTD.

216

ECCH0000198

C3015

Capacitor,Ceramic,C
hip

CL05A225MQ5NSNC 2.2uF 20% 6.3V X5R -55TO+85C

1005 R/TP . SAMSUNG ELECTRO-MECHANICS CO.,
LTD.

217

ECCH0000198

C3016

Capacitor,Ceramic,C
hip

CL05A225MQ5NSNC 2.2uF 20% 6.3V X5R -55TO+85C

1005 R/TP . SAMSUNG ELECTRO-MECHANICS CO.,
LTD.

218

ECCH0000198

C3017

Capacitor,Ceramic,C
hip

CL05A225MQ5NSNC 2.2uF 20% 6.3V X5R -55TO+85C

1005 R/TP . SAMSUNG ELECTRO-MECHANICS CO.,
LTD.

219

ECCH0000198

C3018

Capacitor,Ceramic,C
hip

CL05A225MQ5NSNC 2.2uF 20% 6.3V X5R -55TO+85C

1005 R/TP . SAMSUNG ELECTRO-MECHANICS CO.,
LTD.

220

ECCH0000198

C6000

Capacitor,Ceramic,C
hip

CL05A225MQ5NSNC 2.2uF 20% 6.3V X5R -55TO+85C

1005 R/TP . SAMSUNG ELECTRO-MECHANICS CO.,
LTD.

221

ECCH0000198

C6006

Capacitor,Ceramic,C
hip

CL05A225MQ5NSNC 2.2uF 20% 6.3V X5R -55TO+85C

1005 R/TP . SAMSUNG ELECTRO-MECHANICS CO.,
LTD.

222

ECCH0000198

C6505

Capacitor,Ceramic,C
hip

CL05A225MQ5NSNC 2.2uF 20% 6.3V X5R -55TO+85C

1005 R/TP . SAMSUNG ELECTRO-MECHANICS CO.,
LTD.

223

ECCH0000198

C6506

Capacitor,Ceramic,C
hip

CL05A225MQ5NSNC 2.2uF 20% 6.3V X5R -55TO+85C

1005 R/TP . SAMSUNG ELECTRO-MECHANICS CO.,
LTD.

224

ECCH0000198

C6507

Capacitor,Ceramic,C
hip

CL05A225MQ5NSNC 2.2uF 20% 6.3V X5R -55TO+85C

1005 R/TP . SAMSUNG ELECTRO-MECHANICS CO.,
LTD.

225

ECCH0000198

C6509

Capacitor,Ceramic,C
hip

CL05A225MQ5NSNC 2.2uF 20% 6.3V X5R -55TO+85C

1005 R/TP . SAMSUNG ELECTRO-MECHANICS CO.,
LTD.

226

ECCH0000198

C6510

Capacitor,Ceramic,C
hip

CL05A225MQ5NSNC 2.2uF 20% 6.3V X5R -55TO+85C

1005 R/TP . SAMSUNG ELECTRO-MECHANICS CO.,
LTD.

116

LG Electronics Inc.
132

UN270

227

ECCH0000701

C1102

Capacitor,Ceramic,C
hip

C1005C0G1H1R2CT000F 1.2pF 0.25PF 50V NP0

-55TO+125C 1005 R/TP - TDK CORPORATION

228

ECCH0000701

C6011

Capacitor,Ceramic,C
hip

C1005C0G1H1R2CT000F 1.2pF 0.25PF 50V NP0

-55TO+125C 1005 R/TP - TDK CORPORATION

229

ECCH0001001

C1065

Capacitor,Ceramic,C
hip

C1005C0G1H6R8CT000F 6.8pF 0.5PF 50V NP0

-55TO+125C 1005 R/TP - TDK KOREA
COOPERATION

230

ECCH0002001

C4008

Capacitor,Ceramic,C
hip

C1005JB0J104KT000F 0.1uF 10% 6.3V Y5P

-30TO+85C 1005 R/TP - TDK CORPORATION

231

ECCH0002001

C4009

Capacitor,Ceramic,C
hip

C1005JB0J104KT000F 0.1uF 10% 6.3V Y5P

-30TO+85C 1005 R/TP - TDK CORPORATION

232

ECCH0002001

C4010

Capacitor,Ceramic,C
hip

C1005JB0J104KT000F 0.1uF 10% 6.3V Y5P

-30TO+85C 1005 R/TP - TDK CORPORATION

233

ECCH0002001

C6023

Capacitor,Ceramic,C
hip

C1005JB0J104KT000F 0.1uF 10% 6.3V Y5P

-30TO+85C 1005 R/TP - TDK CORPORATION

234

ECCH0002001

C6024

Capacitor,Ceramic,C
hip

C1005JB0J104KT000F 0.1uF 10% 6.3V Y5P

-30TO+85C 1005 R/TP - TDK CORPORATION

235

ECCH0002001

C6503

Capacitor,Ceramic,C
hip

C1005JB0J104KT000F 0.1uF 10% 6.3V Y5P

-30TO+85C 1005 R/TP - TDK CORPORATION

236

ECCH0002001

C6504

Capacitor,Ceramic,C
hip

C1005JB0J104KT000F 0.1uF 10% 6.3V Y5P

-30TO+85C 1005 R/TP - TDK CORPORATION

237

ECCH0004904

C2106B

Capacitor,Ceramic,C
hip

GRM155R60J105K 1uF 10% 6.3V X5R -55TO+85C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

238

ECCH0004904

C2107B

Capacitor,Ceramic,C
hip

GRM155R60J105K 1uF 10% 6.3V X5R -55TO+85C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

239

ECCH0004904

C2108B

Capacitor,Ceramic,C
hip

GRM155R60J105K 1uF 10% 6.3V X5R -55TO+85C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

240

ECCH0004904

C2140B

Capacitor,Ceramic,C
hip

GRM155R60J105K 1uF 10% 6.3V X5R -55TO+85C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

241

ECCH0004904

C2141B

Capacitor,Ceramic,C
hip

GRM155R60J105K 1uF 10% 6.3V X5R -55TO+85C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

242

ECCH0004904

C2142B

Capacitor,Ceramic,C
hip

GRM155R60J105K 1uF 10% 6.3V X5R -55TO+85C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

243

ECCH0004904

C2143B

Capacitor,Ceramic,C
hip

GRM155R60J105K 1uF 10% 6.3V X5R -55TO+85C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

244

ECCH0004904

C2144B

Capacitor,Ceramic,C
hip

GRM155R60J105K 1uF 10% 6.3V X5R -55TO+85C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

245

ECCH0004904

C2145B

Capacitor,Ceramic,C
hip

GRM155R60J105K 1uF 10% 6.3V X5R -55TO+85C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

246

ECCH0004904

C2146B

Capacitor,Ceramic,C
hip

GRM155R60J105K 1uF 10% 6.3V X5R -55TO+85C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

247

ECCH0004904

C2147B

Capacitor,Ceramic,C
hip

GRM155R60J105K 1uF 10% 6.3V X5R -55TO+85C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

117

LG Electronics Inc.
133

UN270

248

ECCH0004904

C2148B

Capacitor,Ceramic,C
hip

GRM155R60J105K 1uF 10% 6.3V X5R -55TO+85C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

249

ECCH0004904

C2163B

Capacitor,Ceramic,C
hip

GRM155R60J105K 1uF 10% 6.3V X5R -55TO+85C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

250

ECCH0004904

C2173B

Capacitor,Ceramic,C
hip

GRM155R60J105K 1uF 10% 6.3V X5R -55TO+85C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

251

ECCH0004904

C2176B

Capacitor,Ceramic,C
hip

GRM155R60J105K 1uF 10% 6.3V X5R -55TO+85C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

252

ECCH0004904

C2177B

Capacitor,Ceramic,C
hip

GRM155R60J105K 1uF 10% 6.3V X5R -55TO+85C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

253

ECCH0004904

C4014

Capacitor,Ceramic,C
hip

GRM155R60J105K 1uF 10% 6.3V X5R -55TO+85C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

254

ECCH0004904

C6004

Capacitor,Ceramic,C
hip

GRM155R60J105K 1uF 10% 6.3V X5R -55TO+85C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

255

ECCH0004904

C8001

Capacitor,Ceramic,C
hip

GRM155R60J105K 1uF 10% 6.3V X5R -55TO+85C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

256

ECCH0005602

C2169B

Capacitor,Ceramic,C
hip

GRM188R61C225K 2.2uF 10% 16V X5R -55TO+85C

1608 R/TP - MURATA MANUFACTURING CO.,LTD.

257

ECCH0005603

C1000

Capacitor,Ceramic,C
hip

GRM188R61A225K 2.2uF 10% 10V X5R -55TO+85C

1608 R/TP - MURATA MANUFACTURING CO.,LTD.

258

ECCH0005603

C1001

Capacitor,Ceramic,C
hip

GRM188R61A225K 2.2uF 10% 10V X5R -55TO+85C

1608 R/TP - MURATA MANUFACTURING CO.,LTD.

259

ECCH0005603

C2178B

Capacitor,Ceramic,C
hip

GRM188R61A225K 2.2uF 10% 10V X5R -55TO+85C

1608 R/TP - MURATA MANUFACTURING CO.,LTD.

260

ECCH0005603

C3014

Capacitor,Ceramic,C
hip

GRM188R61A225K 2.2uF 10% 10V X5R -55TO+85C

1608 R/TP - MURATA MANUFACTURING CO.,LTD.

261

ECCH0005604

C2174B

Capacitor,Ceramic,C
hip

GRM188R60J106M 10000000
pF,6.3V,M,X5R,TC,1608,R/TP,0.8 mm MURATA
MANUFACTURING CO.,LTD.

262

ECCH0006201

C2168B

Capacitor,Ceramic,C
hip

C1608X5R0J475KT000N 4.7uF 10% 6.3V X5R

-55TO+85C 1608 R/TP - TDK CORPORATION

263

ECCH0006201

C2170B

Capacitor,Ceramic,C
hip

C1608X5R0J475KT000N 4.7uF 10% 6.3V X5R

-55TO+85C 1608 R/TP - TDK CORPORATION

264

ECCH0006201

C2171B

Capacitor,Ceramic,C
hip

C1608X5R0J475KT000N 4.7uF 10% 6.3V X5R

-55TO+85C 1608 R/TP - TDK CORPORATION

265

ECCH0006201

C2175B

Capacitor,Ceramic,C
hip

C1608X5R0J475KT000N 4.7uF 10% 6.3V X5R

-55TO+85C 1608 R/TP - TDK CORPORATION

266

ECCH0007802

C2125B

Capacitor,Ceramic,C
hip

CL10A475KP8NNNC 4.7uF 10% 10V X5R -55TO+85C

1608 R/TP - SAMSUNG ELECTRO-MECHANICS CO.,
LTD.

267

ECCH0007802

C2127B

Capacitor,Ceramic,C
hip

CL10A475KP8NNNC 4.7uF 10% 10V X5R -55TO+85C

1608 R/TP - SAMSUNG ELECTRO-MECHANICS CO.,
LTD.

268

ECCH0007803

C3013

Capacitor,Ceramic,C
hip

CL10A106MP8NNNC 10uF 20% 10V X5R -55TO+85C

1608 R/TP 0.8MM SAMSUNG ELECTRO-MECHANICS
CO., LTD.

118

LG Electronics Inc.
134

UN270

269

ECCH0007803

C5102

Capacitor,Ceramic,C
hip

CL10A106MP8NNNC 10uF 20% 10V X5R -55TO+85C

1608 R/TP 0.8MM SAMSUNG ELECTRO-MECHANICS
CO., LTD.

270

ECCH0007804

C2131B

Capacitor,Ceramic,C
hip

CL05A225MP5NSNC 2.2uF 20% 10V X5R -55TO+85C

1005 R/TP 0.5MM SAMSUNG ELECTRO-MECHANICS
CO., LTD.

271

ECCH0007804

C2139B

Capacitor,Ceramic,C
hip

CL05A225MP5NSNC 2.2uF 20% 10V X5R -55TO+85C

1005 R/TP 0.5MM SAMSUNG ELECTRO-MECHANICS
CO., LTD.

272

ECCH0007804

C2206B

Capacitor,Ceramic,C
hip

CL05A225MP5NSNC 2.2uF 20% 10V X5R -55TO+85C

1005 R/TP 0.5MM SAMSUNG ELECTRO-MECHANICS
CO., LTD.

273

ECCH0007804

C2207B

Capacitor,Ceramic,C
hip

CL05A225MP5NSNC 2.2uF 20% 10V X5R -55TO+85C

1005 R/TP 0.5MM SAMSUNG ELECTRO-MECHANICS
CO., LTD.

274

ECCH0007804

C3000

Capacitor,Ceramic,C
hip

CL05A225MP5NSNC 2.2uF 20% 10V X5R -55TO+85C

1005 R/TP 0.5MM SAMSUNG ELECTRO-MECHANICS
CO., LTD.

275

ECCH0007804

C3004

Capacitor,Ceramic,C
hip

CL05A225MP5NSNC 2.2uF 20% 10V X5R -55TO+85C

1005 R/TP 0.5MM SAMSUNG ELECTRO-MECHANICS
CO., LTD.

276

ECCH0007804

C5000

Capacitor,Ceramic,C
hip

CL05A225MP5NSNC 2.2uF 20% 10V X5R -55TO+85C

1005 R/TP 0.5MM SAMSUNG ELECTRO-MECHANICS
CO., LTD.

277

ECCH0007804

C5001

Capacitor,Ceramic,C
hip

CL05A225MP5NSNC 2.2uF 20% 10V X5R -55TO+85C

1005 R/TP 0.5MM SAMSUNG ELECTRO-MECHANICS
CO., LTD.

278

ECCH0017601

C4663

Capacitor,Ceramic,C
hip

CL05A475MQ5NRNC 4.7uF 20% 6.3V X5R -55TO+85C

1005 R/TP 0.5MM SAMSUNG ELECTRO-MECHANICS
CO., LTD.

279

ECTH0002703

C3002

Capacitor,TA,Confor
mal

TCTAL1A107M8R 0.0001F 20% 10V 50UA

-55TO+125C 0OHM 3.2x1.6x1.1 NONE SMD R/TP
ROHM CO.,LTD.

280

ECZH0000802

C1051

Capacitor,Ceramic,C
hip

C1005C0G1H010CT 1pF 0.25PF 50V NP0 -55TO+125C

1005 R/TP - TDK KOREA COOPERATION

281

ECZH0000802

C1093

Capacitor,Ceramic,C
hip

C1005C0G1H010CT 1pF 0.25PF 50V NP0 -55TO+125C

1005 R/TP - TDK KOREA COOPERATION

282

ECZH0000813

C1005

Capacitor,Ceramic,C
hip

C1005C0G1H101JT 100pF 5% 50V NP0 -55TO+125C

1005 R/TP - TDK KOREA COOPERATION

283

ECZH0000813

C1014

Capacitor,Ceramic,C
hip

C1005C0G1H101JT 100pF 5% 50V NP0 -55TO+125C

1005 R/TP - TDK KOREA COOPERATION

284

ECZH0000813

C1015

Capacitor,Ceramic,C
hip

C1005C0G1H101JT 100pF 5% 50V NP0 -55TO+125C

1005 R/TP - TDK KOREA COOPERATION

285

ECZH0000813

C1017

Capacitor,Ceramic,C
hip

C1005C0G1H101JT 100pF 5% 50V NP0 -55TO+125C

1005 R/TP - TDK KOREA COOPERATION

286

ECZH0000813

C1050

Capacitor,Ceramic,C
hip

C1005C0G1H101JT 100pF 5% 50V NP0 -55TO+125C

1005 R/TP - TDK KOREA COOPERATION

287

ECZH0000813

C1071

Capacitor,Ceramic,C
hip

C1005C0G1H101JT 100pF 5% 50V NP0 -55TO+125C

1005 R/TP - TDK KOREA COOPERATION

288

ECZH0000813

C1073

Capacitor,Ceramic,C
hip

C1005C0G1H101JT 100pF 5% 50V NP0 -55TO+125C

1005 R/TP - TDK KOREA COOPERATION

289

ECZH0000813

C1080

Capacitor,Ceramic,C
hip

C1005C0G1H101JT 100pF 5% 50V NP0 -55TO+125C

1005 R/TP - TDK KOREA COOPERATION

119

LG Electronics Inc.
135

UN270

290

ECZH0000813

C1086

Capacitor,Ceramic,C
hip

C1005C0G1H101JT 100pF 5% 50V NP0 -55TO+125C

1005 R/TP - TDK KOREA COOPERATION

291

ECZH0000813

C1088

Capacitor,Ceramic,C
hip

C1005C0G1H101JT 100pF 5% 50V NP0 -55TO+125C

1005 R/TP - TDK KOREA COOPERATION

292

ECZH0000813

C1096

Capacitor,Ceramic,C
hip

C1005C0G1H101JT 100pF 5% 50V NP0 -55TO+125C

1005 R/TP - TDK KOREA COOPERATION

293

ECZH0000813

C1098

Capacitor,Ceramic,C
hip

C1005C0G1H101JT 100pF 5% 50V NP0 -55TO+125C

1005 R/TP - TDK KOREA COOPERATION

294

ECZH0000813

C1100

Capacitor,Ceramic,C
hip

C1005C0G1H101JT 100pF 5% 50V NP0 -55TO+125C

1005 R/TP - TDK KOREA COOPERATION

295

ECZH0000813

C1101

Capacitor,Ceramic,C
hip

C1005C0G1H101JT 100pF 5% 50V NP0 -55TO+125C

1005 R/TP - TDK KOREA COOPERATION

296

ECZH0000813

C1103

Capacitor,Ceramic,C
hip

C1005C0G1H101JT 100pF 5% 50V NP0 -55TO+125C

1005 R/TP - TDK KOREA COOPERATION

297

ECZH0000813

C1104

Capacitor,Ceramic,C
hip

C1005C0G1H101JT 100pF 5% 50V NP0 -55TO+125C

1005 R/TP - TDK KOREA COOPERATION

298

ECZH0000813

C4004

Capacitor,Ceramic,C
hip

C1005C0G1H101JT 100pF 5% 50V NP0 -55TO+125C

1005 R/TP - TDK KOREA COOPERATION

299

ECZH0000813

C4005

Capacitor,Ceramic,C
hip

C1005C0G1H101JT 100pF 5% 50V NP0 -55TO+125C

1005 R/TP - TDK KOREA COOPERATION

300

ECZH0000813

C6016

Capacitor,Ceramic,C
hip

C1005C0G1H101JT 100pF 5% 50V NP0 -55TO+125C

1005 R/TP - TDK KOREA COOPERATION

301

ECZH0000816

C2161B

Capacitor,Ceramic,C
hip

C1005C0G1H120JT000F 12pF 5% 50V NP0

-55TO+125C 1005 R/TP - TDK KOREA
COOPERATION

302

ECZH0000816

C2162B

Capacitor,Ceramic,C
hip

C1005C0G1H120JT000F 12pF 5% 50V NP0

-55TO+125C 1005 R/TP - TDK KOREA
COOPERATION

303

ECZH0000816

C6018

Capacitor,Ceramic,C
hip

C1005C0G1H120JT000F 12pF 5% 50V NP0

-55TO+125C 1005 R/TP - TDK KOREA
COOPERATION

304

ECZH0000822

C1048

Capacitor,Ceramic,C
hip

C1005C0G1H1R5CT000F 1.5pF 0.25PF 50V NP0

-55TO+125C 1005 R/TP - TDK KOREA
COOPERATION

305

ECZH0000824

C6019

Capacitor,Ceramic,C
hip

C1005C0G1H200JT 20pF 5% 50V NP0 -55TO+125C

1005 R/TP - TDK KOREA COOPERATION

306

ECZH0000824

C6020

Capacitor,Ceramic,C
hip

C1005C0G1H200JT 20pF 5% 50V NP0 -55TO+125C

1005 R/TP - TDK KOREA COOPERATION

307

ECZH0000830

C1056

Capacitor,Ceramic,C
hip

C1005C0G1H330JT000F 33pF 5% 50V NP0

-55TO+125C 1005 R/TP - TDK KOREA
COOPERATION

308

ECZH0000830

C1064

Capacitor,Ceramic,C
hip

C1005C0G1H330JT000F 33pF 5% 50V NP0

-55TO+125C 1005 R/TP - TDK KOREA
COOPERATION

309

ECZH0000830

C2104B

Capacitor,Ceramic,C
hip

C1005C0G1H330JT000F 33pF 5% 50V NP0

-55TO+125C 1005 R/TP - TDK KOREA
COOPERATION

310

ECZH0000830

C2109B

Capacitor,Ceramic,C
hip

C1005C0G1H330JT000F 33pF 5% 50V NP0

-55TO+125C 1005 R/TP - TDK KOREA
COOPERATION

120

LG Electronics Inc.
136

UN270

311

ECZH0000830

C4000

Capacitor,Ceramic,C
hip

C1005C0G1H330JT000F 33pF 5% 50V NP0

-55TO+125C 1005 R/TP - TDK KOREA
COOPERATION

312

ECZH0000841

C3019

Capacitor,Ceramic,C
hip

C1005C0G1H560JT000F 56pF 5% 50V NP0

-55TO+125C 1005 R/TP - TDK KOREA
COOPERATION

313

ECZH0000849

C1033

Capacitor,Ceramic,C
hip

C1005C0G1H201JT000F 200pF 5% 50V NP0

-55TO+125C 1005 R/TP - TDK KOREA
COOPERATION

314

ECZH0001002

C1054

Capacitor,Ceramic,C
hip

C1005CH1H0R5BT000F 0.5pF 0.1PF 50V NP0

-55TO+125C 1005 R/TP - TDK KOREA
COOPERATION

315

ECZH0001120

C5006

Capacitor,Ceramic,C
hip

CC1005X7R1H392KT000F 3.9nF 10% 50V X7R

-55TO+125C 1005 R/TP - TDK KOREA
COOPERATION

316

ECZH0001121

C5103

Capacitor,Ceramic,C
hip

C1005X7R1H471KT000F 470pF 10% 50V X7R

-55TO+125C 1005 R/TP - TDK KOREA
COOPERATION

317

ECZH0001215

C2153B

Capacitor,Ceramic,C
hip

C1005X5R1A105KT000F 1uF 10% 10V X5R

-55TO+85C 1005 R/TP - TDK KOREA COOPERATION

318

ECZH0001215

C2155B

Capacitor,Ceramic,C
hip

C1005X5R1A105KT000F 1uF 10% 10V X5R

-55TO+85C 1005 R/TP - TDK KOREA COOPERATION

319

ECZH0001215

C4013

Capacitor,Ceramic,C
hip

C1005X5R1A105KT000F 1uF 10% 10V X5R

-55TO+85C 1005 R/TP - TDK KOREA COOPERATION

320

ECZH0001215

C4015

Capacitor,Ceramic,C
hip

C1005X5R1A105KT000F 1uF 10% 10V X5R

-55TO+85C 1005 R/TP - TDK KOREA COOPERATION

321

ECZH0001215

C5005

Capacitor,Ceramic,C
hip

C1005X5R1A105KT000F 1uF 10% 10V X5R

-55TO+85C 1005 R/TP - TDK KOREA COOPERATION

322

ECZH0001215

C5016

Capacitor,Ceramic,C
hip

C1005X5R1A105KT000F 1uF 10% 10V X5R

-55TO+85C 1005 R/TP - TDK KOREA COOPERATION

323

ECZH0001215

C5017

Capacitor,Ceramic,C
hip

C1005X5R1A105KT000F 1uF 10% 10V X5R

-55TO+85C 1005 R/TP - TDK KOREA COOPERATION

324

ECZH0001215

C5104

Capacitor,Ceramic,C
hip

C1005X5R1A105KT000F 1uF 10% 10V X5R

-55TO+85C 1005 R/TP - TDK KOREA COOPERATION

325

ECZH0001420

C3005

Capacitor,Ceramic,C
hip

C1608X5R1A105KT000E 1uF 10% 10V X5R

-55TO+85C 1608 R/TP - TDK KOREA COOPERATION

326

ECZH0001420

C3007

Capacitor,Ceramic,C
hip

C1608X5R1A105KT000E 1uF 10% 10V X5R

-55TO+85C 1608 R/TP - TDK KOREA COOPERATION

327

ECZH0003103

C1067

Capacitor,Ceramic,C
hip

GRM36X7R104K10PT 100nF 10% 10V X7R

-55TO+125C 1005 R/TP - MURATA
MANUFACTURING CO.,LTD.

328

ECZH0003103

C4001

Capacitor,Ceramic,C
hip

GRM36X7R104K10PT 100nF 10% 10V X7R

-55TO+125C 1005 R/TP - MURATA
MANUFACTURING CO.,LTD.

329

ECZH0003103

C6508

Capacitor,Ceramic,C
hip

GRM36X7R104K10PT 100nF 10% 10V X7R

-55TO+125C 1005 R/TP - MURATA
MANUFACTURING CO.,LTD.

330

ECZH0003124

C2113B

Capacitor,Ceramic,C
hip

GRM155R71C683K 68nF 10% 16V X7R -55TO+125C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

331

ECZH0003125

C2111B

Capacitor,Ceramic,C
hip

GRM155R71C823K 82nF 10% 16V X7R -55TO+125C

1005 R/TP - MURATA MANUFACTURING CO.,LTD.

121

LG Electronics Inc.
137

UN270

332

ECZH0003503

C3006

Capacitor,Ceramic,C
hip

GRM188R61E105K 1uF 10% 25V X5R -55TO+85C

1608 R/TP - MURATA MANUFACTURING CO.,LTD.

333

ECZH0003503

C3008

Capacitor,Ceramic,C
hip

GRM188R61E105K 1uF 10% 25V X5R -55TO+85C

1608 R/TP - MURATA MANUFACTURING CO.,LTD.

334

ECZH0004402

C5100

Capacitor,Ceramic,C
hip

CL05F104ZO5NNNC 0.1uF -20TO+80% 16V Y5V

-30TO+85C 1005 R/TP - SAMSUNG
ELECTRO-MECHANICS CO., LTD.

335

EDSY0017701

D3001

Diode,Switching

SDB1040 - - - - - - - - 2P 1 AUK CORP

336

EDTY0008601

ZD3002

Diode,TVS

PSD05-LF 5V 6 13.5V 42A 500W SOD323 R/TP 2P 1

PROTEK DEVICES INC.

337

EDTY0009101

D5100

Diode,TVS

ESD9X5.0ST5G 5V 6.2 12.3V 8.7A 107W SOD528 R/TP

2P 1 ON SEMICONDUCTOR

338

EDTY0009401

ZD4000

Diode,TVS

VMNZ6.8CST2R 5.5V 0 10V 0A 200mW SC70 R/TP 6P

5 ROHM.

339

EDTY0009401

ZD4001

Diode,TVS

VMNZ6.8CST2R 5.5V 0 10V 0A 200mW SC70 R/TP 6P

5 ROHM.

340

EDTY0009401

ZD4002

Diode,TVS

VMNZ6.8CST2R 5.5V 0 10V 0A 200mW SC70 R/TP 6P

5 ROHM.

341

EDTY0009401

ZD4003

Diode,TVS

VMNZ6.8CST2R 5.5V 0 10V 0A 200mW SC70 R/TP 6P

5 ROHM.

342

EDTY0009401

ZD4004

Diode,TVS

VMNZ6.8CST2R 5.5V 0 10V 0A 200mW SC70 R/TP 6P

5 ROHM.

343

EDTY0009401

ZD4005

Diode,TVS

VMNZ6.8CST2R 5.5V 0 10V 0A 200mW SC70 R/TP 6P

5 ROHM.

344

EDTY0009401

ZD4006

Diode,TVS

VMNZ6.8CST2R 5.5V 0 10V 0A 200mW SC70 R/TP 6P

5 ROHM.

345

EDTY0009601

ZD3000

Diode,TVS

Rclamp0521P.TCT 5V 6 5V 4A 100W - R/TP 2P 1

SEMTECH CORPORATION

346

EDTY0009601

ZD3001

Diode,TVS

Rclamp0521P.TCT 5V 6 5V 4A 100W - R/TP 2P 1

SEMTECH CORPORATION

347

ELCH0001035

L1023

Inductor,Multilayer,C
hip

HK1005 4N7S-T 4.7NH 0.3NH - 300mA 0.21OHM

4GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP TAIYO
YUDEN CO.,LTD

348

ELCH0001035

L1028

Inductor,Multilayer,C
hip

HK1005 4N7S-T 4.7NH 0.3NH - 300mA 0.21OHM

4GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP TAIYO
YUDEN CO.,LTD

349

ELCH0001048

L1007

Inductor,Multilayer,C
hip

1005GC2T10NJLF 10NH 5% - 250mA 0.42OHM

2.5GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP
PILKOR ELECTRONICS LTD.

350

ELCH0001054

L1050

Inductor,Multilayer,C
hip

1005GC2T5N6SLF 5.6NH 0.3NH - 300mA 0.27OHM

3.2GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP
PILKOR ELECTRONICS LTD.

351

ELCH0001056

L1056

Inductor,Multilayer,C
hip

1005GC2T2N7SLF 2.7NH 0.3NH - 300mA 0.17OHM

5.5GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP
PILKOR ELECTRONICS LTD.

352

ELCH0001057

L1063

Inductor,Multilayer,C
hip

1005GC2T3N9SLF 3.9NH 0.3NH - 300mA 0.22OHM

4GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP PILKOR
ELECTRONICS LTD.

353

ELCH0001057

L1064

Inductor,Multilayer,C
hip

1005GC2T3N9SLF 3.9NH 0.3NH - 300mA 0.22OHM

4GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP PILKOR
ELECTRONICS LTD.

354

ELCH0001401

L1026

Inductor,Multilayer,C
hip

LL1005-FHL15NJ 15NH 5% - 300mA 0.5OHM 2.8GHZ

9 SHIELD NONE 1.0X0.5X0.5MM R/TP TOKO, INC.

122

LG Electronics Inc.
138

UN270

355

ELCH0001405

L1012

Inductor,Multilayer,C
hip

LL1005-FHL3N3S 3.3NH 0.3NH - 400mA 0.16OHM

9.1GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP TOKO,
INC.

356

ELCH0001412

L1041

Inductor,Multilayer,C
hip

LL1005-FHL1N8S 1.8NH 0.3NH - 400mA 0.14OHM

15GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP TOKO,
INC.

357

ELCH0001412

L1044

Inductor,Multilayer,C
hip

LL1005-FHL1N8S 1.8NH 0.3NH - 400mA 0.14OHM

15GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP TOKO,
INC.

358

ELCH0001412

L1062

Inductor,Multilayer,C
hip

LL1005-FHL1N8S 1.8NH 0.3NH - 400mA 0.14OHM

15GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP TOKO,
INC.

359

ELCH0001417

L1029

Inductor,Multilayer,C
hip

LL1005-FHL33NJ_ 33NH 5% - 200mA 1OHM 2.1GHZ

10 SHIELD NONE 1.0X0.5X0.5MM R/TP TOKO, INC.

360

ELCH0001425

L5000

Inductor,Multilayer,C
hip

LL1005-FHL82NJ 82NH 5% - 150mA 1.9OHM 1.15GHZ

10 SHIELD NONE 1.0X0.5X0.5MM R/TP TOKO, INC.

361

ELCH0001425

L5001

Inductor,Multilayer,C
hip

LL1005-FHL82NJ 82NH 5% - 150mA 1.9OHM 1.15GHZ

10 SHIELD NONE 1.0X0.5X0.5MM R/TP TOKO, INC.

362

ELCH0001425

L5002

Inductor,Multilayer,C
hip

LL1005-FHL82NJ 82NH 5% - 150mA 1.9OHM 1.15GHZ

10 SHIELD NONE 1.0X0.5X0.5MM R/TP TOKO, INC.

363

ELCH0001425

L5003

Inductor,Multilayer,C
hip

LL1005-FHL82NJ 82NH 5% - 150mA 1.9OHM 1.15GHZ

10 SHIELD NONE 1.0X0.5X0.5MM R/TP TOKO, INC.

364

ELCH0001430

L1009

Inductor,Multilayer,C
hip

LL1005-FHLR10J 100NH 5% - 150mA 2.2OHM

1.03GHZ 10 SHIELD NONE 1.0X0.5X0.5MM R/TP
TOKO, INC.

365

ELCH0001430

L1046

Inductor,Multilayer,C
hip

LL1005-FHLR10J 100NH 5% - 150mA 2.2OHM

1.03GHZ 10 SHIELD NONE 1.0X0.5X0.5MM R/TP
TOKO, INC.

366

ELCH0004703

L1000

Inductor,Multilayer,C
hip

1005GC2T1N0SLF 1NH 0.3NH - 300mA 0.12OHM

10GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP
PILKOR ELECTRONICS LTD.

367

ELCH0004709

L1030

Inductor,Multilayer,C
hip

1005GC2T3N3SLF 3.3NH 0.3NH - 300mA 0.19OHM

4.5GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP
PILKOR ELECTRONICS LTD.

368

ELCH0004709

L1055

Inductor,Multilayer,C
hip

1005GC2T3N3SLF 3.3NH 0.3NH - 300mA 0.19OHM

4.5GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP
PILKOR ELECTRONICS LTD.

369

ELCH0004710

L1010

Inductor,Multilayer,C
hip

1005GC2T15NJLF 15NH 5% - 250mA 0.53OHM 2GHZ

8 SHIELD NONE 1.0X0.5X0.5MM R/TP PILKOR
ELECTRONICS LTD.

370

ELCH0004713

L1051

Inductor,Multilayer,C
hip

1005GC2T6N8JLF 6.8NH 5% - 250mA 0.32OHM 3GHZ

8 SHIELD NONE 1.0X0.5X0.5MM R/TP PILKOR
ELECTRONICS LTD.

371

ELCH0004721

L1032

Inductor,Multilayer,C
hip

1005GC2T2N2SLF 2.2NH 0.3NH - 300mA 0.16OHM

6GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP PILKOR
ELECTRONICS LTD.

372

ELCH0004721

L1057

Inductor,Multilayer,C
hip

1005GC2T2N2SLF 2.2NH 0.3NH - 300mA 0.16OHM

6GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP PILKOR
ELECTRONICS LTD.

123

LG Electronics Inc.
139

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373

ELCH0004721

L1060

Inductor,Multilayer,C
hip

1005GC2T2N2SLF 2.2NH 0.3NH - 300mA 0.16OHM

6GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP PILKOR
ELECTRONICS LTD.

374

ELCH0004721

L1061

Inductor,Multilayer,C
hip

1005GC2T2N2SLF 2.2NH 0.3NH - 300mA 0.16OHM

6GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP PILKOR
ELECTRONICS LTD.

375

ELCP0008004

L2101B

Inductor,Wire
Wound,Chip

MIP2016D4R7M 4.7UH 30% 0V 900mA 0.16OHM 0HZ

0 SHIELD 2.0X1.6X1.0MM NONE R/TP FDK
CORPORATION.

376

ELCP0008004

L2102B

Inductor,Wire
Wound,Chip

MIP2016D4R7M 4.7UH 30% 0V 900mA 0.16OHM 0HZ

0 SHIELD 2.0X1.6X1.0MM NONE R/TP FDK
CORPORATION.

377

ENBY0036801

CN4000

Connector,BtoB

GB042-60S-H10-E3000 60P 0.40MM STRAIGHT

SOCKET SMD R/TP 1M - LS Mtron Ltd.

378

ENEY0003801

CN5000

Connector,I/O

24-8000-002-000-829 2P 1.00MM ANGLE SOCKET

TYPE SMD R/TP - KYOCERA ELCO KOREA SALES
CO.,LTD.

379

ENJE0007901

J5100

Jack,Phone

JAM3333-F30-7F 1P 4P ANGLE R/TP 4mM BLACK 6P HON HAI PRECISION INDUSTRY CO.,LTD.

380

ENRY0011401

CN3001

Connector,I/O

04-5151-005-103-883 5,0.65
mm,ETC,0.64MM,RECEPTACLE,DIP,R/TP,8.0x5.6x3.0t
KYOCERA ELCO KOREA SALES CO.,LTD.

381

ENSY0022202

S4000

Socket,Camera

CAM-H88(R41-A360A) 80m ohm 9x9x3.95t 24P SMD

R/TP Embo, Contact pin 0.70mm MITSUMI ELECTRIC
CO.,LTD.

382

ENSY0023302

S4001

Card Socket

SCHA5B0501 8,ETC,0.7 mm,15.0x15.0x1.62t,Reverse

ALPS ELECTRIC CO.,LTD.

383

ENWY0008101

SW1001

Connector,RF

NMS-180 NONE STRAIGHT SOCKET SMD T/REEL AU

50OHM 650mDB NAMAE ELECTRONICS INC

384

ENWY0008101

SW1002

Connector,RF

NMS-180 NONE STRAIGHT SOCKET SMD T/REEL AU

50OHM 650mDB NAMAE ELECTRONICS INC

385

ENZY0029301

CN3000

Connector,Terminal
Block

KQ03LT-4R 4,mm,ETC,VER,P=2.5,H=5.4 HIROSE

KOREA CO.,LTD

386

EQFP0000101

Q5100

FET

2SJ347 P-CHANNEL MOSFET -20V -7 -0.05A 40OHM

100mW SSM R/TP 3P TOSHIBA

387

EQFP0008601

Q3000

FET

NUS5530MN P-CHANNEL MOSFET -20V 20 -3.9A

0.07OHM 1.3W TSOP6 R/TP 8P ON
SEMICONDUCTOR

388

ERHY0000105

R2203B

Resistor,Chip

MCR01MZP5F51R0 51OHM 1% 1/16W 1005 R/TP ROHM.

389

ERHY0000128

R5102

Resistor,Chip

MCR01MZP5F1502 15KOHM 1% 1/16W 1005 R/TP ROHM.

390

ERHY0000150

R8001

Resistor,Chip

RC1005F753CS 75KOHM 1% 1/16W 1005 R/TP SAMSUNG ELECTRO-MECHANICS CO., LTD.

391

ERHY0000254

R5001

Resistor,Chip

MCR01MZP5J472 4.7KOHM 5% 1/16W 1005 R/TP ROHM.

392

ERHY0000254

R5002

Resistor,Chip

MCR01MZP5J472 4.7KOHM 5% 1/16W 1005 R/TP ROHM.

393

ERHY0000254

R5003

Resistor,Chip

MCR01MZP5J472 4.7KOHM 5% 1/16W 1005 R/TP ROHM.

394

ERHY0000275

R4010

Resistor,Chip

MCR01MZP5J563 56KOHM 5% 1/16W 1005 R/TP ROHM.

395

ERHY0000275

R4011

Resistor,Chip

MCR01MZP5J563 56KOHM 5% 1/16W 1005 R/TP ROHM.

124

LG Electronics Inc.
140

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396

ERHY0000275

R4012

Resistor,Chip

MCR01MZP5J563 56KOHM 5% 1/16W 1005 R/TP ROHM.

397

ERHY0000275

R4013

Resistor,Chip

MCR01MZP5J563 56KOHM 5% 1/16W 1005 R/TP ROHM.

398

ERHY0000275

R4014

Resistor,Chip

MCR01MZP5J563 56KOHM 5% 1/16W 1005 R/TP ROHM.

399

ERHY0000512

R6017

Resistor,Chip

RC1608J106CS 10MOHM 5% 1/10W 1608 R/TP SAMSUNG ELECTRO-MECHANICS CO., LTD.

400

ERHY0003201

R1005

Resistor,Chip

MCR01MZP5F1001 1KOHM 1% 1/16W 1005 R/TP ROHM.

401

ERHY0003201

R5103

Resistor,Chip

MCR01MZP5F1001 1KOHM 1% 1/16W 1005 R/TP ROHM.

402

ERHY0003201

R5104

Resistor,Chip

MCR01MZP5F1001 1KOHM 1% 1/16W 1005 R/TP ROHM.

403

ERHY0003301

R4004

Resistor,Chip

MCR01MZP5J101 100OHM 5% 1/16W 1005 R/TP ROHM.

404

ERHY0003301

R4005

Resistor,Chip

MCR01MZP5J101 100OHM 5% 1/16W 1005 R/TP ROHM.

405

ERHZ0000201

R2202B

Resistor,Chip

MCR01MZP5F1000 100OHM 1% 1/16W 1005 R/TP ROHM.

406

ERHZ0000203

R1007

Resistor,Chip

MCR01MZP5F1002 10KOHM 1% 1/16W 1005 R/TP ROHM.

407

ERHZ0000203

R2107B

Resistor,Chip

MCR01MZP5F1002 10KOHM 1% 1/16W 1005 R/TP ROHM.

408

ERHZ0000203

R2204B

Resistor,Chip

MCR01MZP5F1002 10KOHM 1% 1/16W 1005 R/TP ROHM.

409

ERHZ0000204

R8000

Resistor,Chip

MCR01MZP5F1003 100KOHM 1% 1/16W 1005 R/TP ROHM.

410

ERHZ0000204

R8016

Resistor,Chip

MCR01MZP5F1003 100KOHM 1% 1/16W 1005 R/TP ROHM.

411

ERHZ0000204

R8017

Resistor,Chip

MCR01MZP5F1003 100KOHM 1% 1/16W 1005 R/TP ROHM.

412

ERHZ0000204

R8018

Resistor,Chip

MCR01MZP5F1003 100KOHM 1% 1/16W 1005 R/TP ROHM.

413

ERHZ0000205

R5011

Resistor,Chip

MCR01MZP5F1004 1MOHM 1% 1/16W 1005 R/TP ROHM.

414

ERHZ0000205

R5012

Resistor,Chip

MCR01MZP5F1004 1MOHM 1% 1/16W 1005 R/TP ROHM.

415

ERHZ0000205

R8020

Resistor,Chip

MCR01MZP5F1004 1MOHM 1% 1/16W 1005 R/TP ROHM.

416

ERHZ0000205

R8021

Resistor,Chip

MCR01MZP5F1004 1MOHM 1% 1/16W 1005 R/TP ROHM.

417

ERHZ0000212

R2105B

Resistor,Chip

MCR01MZP5F1202 12KOHM 1% 1/16W 1005 R/TP ROHM.

418

ERHZ0000213

R6033

Resistor,Chip

MCR01MZP5F1203 120KOHM 1% 1/16W 1005 R/TP ROHM.

419

ERHZ0000221

R6009

Resistor,Chip

MCR01MZP5F1502 15KOHM 1% 1/16W 1005 R/TP ROHM.

420

ERHZ0000222

R4017

Resistor,Chip

MCR01MZP5F1503 150KOHM 1% 1/16W 1005 R/TP ROHM.

421

ERHZ0000238

R3007

Resistor,Chip

MCR01MZP5F2003 200KOHM 1% 1/16W 1005 R/TP ROHM.

422

ERHZ0000238

R5013

Resistor,Chip

MCR01MZP5F2003 200KOHM 1% 1/16W 1005 R/TP ROHM.

423

ERHZ0000240

R6501

Resistor,Chip

MCR01MZP5F20R0 20OHM 1% 1/16W 1005 R/TP ROHM.

424

ERHZ0000240

R6502

Resistor,Chip

MCR01MZP5F20R0 20OHM 1% 1/16W 1005 R/TP ROHM.

425

ERHZ0000243

R3014

Resistor,Chip

MCR01MZP5F2201 2.2KOHM 1% 1/16W 1005 R/TP ROHM.

426

ERHZ0000243

R3015

Resistor,Chip

MCR01MZP5F2201 2.2KOHM 1% 1/16W 1005 R/TP ROHM.

125

LG Electronics Inc.
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427

ERHZ0000263

R1002

Resistor,Chip

MCR01MZP5F3000 300OHM 1% 1/16W 1005 R/TP ROHM.

428

ERHZ0000263

R1003

Resistor,Chip

MCR01MZP5F3000 300OHM 1% 1/16W 1005 R/TP ROHM.

429

ERHZ0000265

R3005

Resistor,Chip

MCR01MZP5F3003 300KOHM 1% 1/16W 1005 R/TP ROHM.

430

ERHZ0000285

R6016

Resistor,Chip

MCR01MZP5F4700 470OHM 1% 1/16W 1005 R/TP ROHM.

431

ERHZ0000285

R6018

Resistor,Chip

MCR01MZP5F4700 470OHM 1% 1/16W 1005 R/TP ROHM.

432

ERHZ0000285

R6021

Resistor,Chip

MCR01MZP5F4700 470OHM 1% 1/16W 1005 R/TP ROHM.

433

ERHZ0000285

R6022

Resistor,Chip

MCR01MZP5F4700 470OHM 1% 1/16W 1005 R/TP ROHM.

434

ERHZ0000285

R6023

Resistor,Chip

MCR01MZP5F4700 470OHM 1% 1/16W 1005 R/TP ROHM.

435

ERHZ0000285

R6025

Resistor,Chip

MCR01MZP5F4700 470OHM 1% 1/16W 1005 R/TP ROHM.

436

ERHZ0000285

R6026

Resistor,Chip

MCR01MZP5F4700 470OHM 1% 1/16W 1005 R/TP ROHM.

437

ERHZ0000285

R6027

Resistor,Chip

MCR01MZP5F4700 470OHM 1% 1/16W 1005 R/TP ROHM.

438

ERHZ0000285

R6028

Resistor,Chip

MCR01MZP5F4700 470OHM 1% 1/16W 1005 R/TP ROHM.

439

ERHZ0000285

R6030

Resistor,Chip

MCR01MZP5F4700 470OHM 1% 1/16W 1005 R/TP ROHM.

440

ERHZ0000285

R6031

Resistor,Chip

MCR01MZP5F4700 470OHM 1% 1/16W 1005 R/TP ROHM.

441

ERHZ0000285

R6032

Resistor,Chip

MCR01MZP5F4700 470OHM 1% 1/16W 1005 R/TP ROHM.

442

ERHZ0000285

R6035

Resistor,Chip

MCR01MZP5F4700 470OHM 1% 1/16W 1005 R/TP ROHM.

443

ERHZ0000285

R6036

Resistor,Chip

MCR01MZP5F4700 470OHM 1% 1/16W 1005 R/TP ROHM.

444

ERHZ0000285

R6037

Resistor,Chip

MCR01MZP5F4700 470OHM 1% 1/16W 1005 R/TP ROHM.

445

ERHZ0000285

R6038

Resistor,Chip

MCR01MZP5F4700 470OHM 1% 1/16W 1005 R/TP ROHM.

446

ERHZ0000286

R4018

Resistor,Chip

MCR01MZP5F4701 4.7KOHM 1% 1/16W 1005 R/TP ROHM.

447

ERHZ0000286

R4019

Resistor,Chip

MCR01MZP5F4701 4.7KOHM 1% 1/16W 1005 R/TP ROHM.

448

ERHZ0000287

R3201

Resistor,Chip

MCR01MZP5F4702 47KOHM 1% 1/16W 1005 R/TP ROHM.

449

ERHZ0000287

R5101

Resistor,Chip

MCR01MZP5F4702 47KOHM 1% 1/16W 1005 R/TP ROHM.

450

ERHZ0000287

R5106

Resistor,Chip

MCR01MZP5F4702 47KOHM 1% 1/16W 1005 R/TP ROHM.

451

ERHZ0000287

R8014

Resistor,Chip

MCR01MZP5F4702 47KOHM 1% 1/16W 1005 R/TP ROHM.

452

ERHZ0000293

R2102B

Resistor,Chip

MCR01MZP5F5100 510OHM 1% 1/16W 1005 R/TP ROHM.

453

ERHZ0000294

R2103B

Resistor,Chip

MCR01MZP5F5101 5.1KOHM 1% 1/16W 1005 R/TP ROHM.

454

ERHZ0000294

R2104B

Resistor,Chip

MCR01MZP5F5101 5.1KOHM 1% 1/16W 1005 R/TP ROHM.

455

ERHZ0000295

R3000

Resistor,Chip

MCR01MZP5F5102 51KOHM 1% 1/16W 1005 R/TP ROHM.

456

ERHZ0000295

R4016

Resistor,Chip

MCR01MZP5F5102 51KOHM 1% 1/16W 1005 R/TP ROHM.

457

ERHZ0000298

R2101B

Resistor,Chip

MCR01MZP5F5600 560OHM 1% 1/16W 1005 R/TP ROHM.

126

LG Electronics Inc.
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458

ERHZ0000301

R5105

Resistor,Chip

MCR01MZP5F5603 560KOHM 1% 1/16W 1005 R/TP ROHM.

459

ERHZ0000316

R6024

Resistor,Chip

MCR01MZP5F7503 750KOHM 1% 1/16W 1005 R/TP ROHM.

460

ERHZ0000318

R3001

Resistor,Chip

MCR01MZP5F8062 80.6KOHM 1% 1/16W 1005 R/TP ROHM.

461

ERHZ0000401

C1003

Resistor,Chip

MCR01MZSJ000 0OHM 5% 1/16W 1005 R/TP ROHM.

462

ERHZ0000402

R2111B

Resistor,Chip

MCR01MZP5J100 10OHM 5% 1/16W 1005 R/TP ROHM.

463

ERHZ0000406

R1000

Resistor,Chip

MCR01MZP5J104 100KOHM 5% 1/16W 1005 R/TP ROHM.

464

ERHZ0000406

R3013

Resistor,Chip

MCR01MZP5J104 100KOHM 5% 1/16W 1005 R/TP ROHM.

465

ERHZ0000410

R1008

Resistor,Chip

MCR01MZP5J120 12OHM 5% 1/16W 1005 R/TP ROHM.

466

ERHZ0000428

R1001

Resistor,Chip

MCR01MZP5J180 18OHM 5% 1/16W 1005 R/TP ROHM.

467

ERHZ0000437

R2201B

Resistor,Chip

MCR01MZP5J202 2KOHM 5% 1/16W 1005 R/TP ROHM.

468

ERHZ0000439

R5100

Resistor,Chip

MCR01MZP5J204 200KOHM 5% 1/16W 1005 R/TP ROHM.

469

ERHZ0000443

R4002

Resistor,Chip

MCR01MZP5J222 2.2KOHM 5% 1/16W 1005 R/TP ROHM.

470

ERHZ0000443

R4003

Resistor,Chip

MCR01MZP5J222 2.2KOHM 5% 1/16W 1005 R/TP ROHM.

471

ERHZ0000443

R8015

Resistor,Chip

MCR01MZP5J222 2.2KOHM 5% 1/16W 1005 R/TP ROHM.

472

ERHZ0000456

R2109B

Resistor,Chip

MCR01MZP5J2R2 2.2OHM 5% 1/16W 1005 R/TP ROHM.

473

ERHZ0000457

R4001

Resistor,Chip

MCR01MZP5J300 30OHM 5% 1/16W 1005 R/TP ROHM.

474

ERHZ0000457

R4006

Resistor,Chip

MCR01MZP5J300 30OHM 5% 1/16W 1005 R/TP ROHM.

475

ERHZ0000465

R6029

Resistor,Chip

MCR01MZP5J332 3.3KOHM 5% 1/16W 1005 R/TP ROHM.

476

ERHZ0000465

R6034

Resistor,Chip

MCR01MZP5J332 3.3KOHM 5% 1/16W 1005 R/TP ROHM.

477

ERHZ0000485

R2108B

Resistor,Chip

MCR01MZP5J472 4.7KOHM 5% 1/16W 1005 R/TP ROHM.

478

ERHZ0000485

R3002

Resistor,Chip

MCR01MZP5J472 4.7KOHM 5% 1/16W 1005 R/TP ROHM.

479

ERHZ0000488

R2110B

Resistor,Chip

MCR01MZP5J4R7 4.7OHM 5% 1/16W 1005 R/TP ROHM.

480

ERHZ0003901

R3004

Resistor,Chip

RC2012FR100CS 0.1OHM 1% 1/8W 2012 R/TP SAMSUNG ELECTRO-MECHANICS CO., LTD.

481

ERHZ0004201

R2112B

Resistor,Chip

RC1005F1213CS 121KOHM 1% 1/16W 1005 R/TP SAMSUNG ELECTRO-MECHANICS CO., LTD.

482

ESCY0008301

SW6000

Switch,Tact

EVQP3M01K 12 V,0.05
A,HORIZONTAL,G,10C2P,12VDC, PANASONIC
INDUSTRIAL KOREA CO., LTD

483

ESCY0008301

SW6001

Switch,Tact

EVQP3M01K 12 V,0.05
A,HORIZONTAL,G,10C2P,12VDC, PANASONIC
INDUSTRIAL KOREA CO., LTD

484

ESCY0008301

SW6002

Switch,Tact

EVQP3M01K 12 V,0.05
A,HORIZONTAL,G,10C2P,12VDC, PANASONIC
INDUSTRIAL KOREA CO., LTD

127

LG Electronics Inc.
143

UN270

485

ESCY0008301

SW6003

Switch,Tact

EVQP3M01K 12 V,0.05
A,HORIZONTAL,G,10C2P,12VDC, PANASONIC
INDUSTRIAL KOREA CO., LTD

486

EUSY0073401

U6001

IC,Inverter

TC7SH04FU TC7SH04FU,SSOP5-P-0.65A,5
PIN,R/TP,INVERTER,Pb Free TOSHIBA

487

EUSY0173801

U8000

IC,Load Switch

AAT4290IJS AAT4290IJS,SC70JW ,8 PIN,R/TP ,5

Individual Load Switch INSPUR LG DIGITAL MOBILE
COMMUNICATIONS

488

EUSY0250501

U5101

IC,Comparator

NCS2200SQ2T2G NCS2200SQ2T2G,SC70,5
PIN,R/TP,Comparator,pin compatible to EUSY0077701
- - SC70 R/TP 5P - ON SEMICONDUCTOR

489

EUSY0254201

U5100

IC,Analog Switch

NLAS3158MNR2G 1.65~5.5 13SEC 7SEC 0W DFN

R/TP 6P 1 ON SEMICONDUCTOR

490

EUSY0300008

U6002

IC,Bus Controller

PP2106M3 1.8/2.6V 1mA - MLF R/TP 28P - G5

CORPORATION

491

EUSY0336202

U2101B

IC,Digital Baseband
Processor,CDMA

QSC6055-CD ,424,CDMA 1x Onechip

BB,AMSS3.3,IC,Digital Baseband Processor CSP R/TP
424P QUALCOMM INCORPORATED.

492

EUSY0347506

U2201B

IC,MCP,NAND

H8BCS0SI0BAR-46M NAND/2G SDRAM/1G 1.7VTO1.9V

14.0x10.0x1.2 TR 149P - - - HYNIX
SEMICONDUCTOR INC.

493

EUSY0365101

U4000

IC,LDO Voltage
Regulator

RP101K302D RP101K302D,PLP1612-4B,4,R/TP,LDO
RICOH COMPANY, LTD.

494

EUSY0374601

U3000

IC,Over Voltage
Protection

MAX14528 MAX14528,TDFN,8,R/TP,Programmable
OVP MAXIM INTEGRATED PRODUCTS INC.

495

EUSY0378001

U3001

IC,Sub PMIC

AAT2862 AAT2862,TQFN34,24,R/TP,3x4x0.8
Advanced Analogic Technologies HK Limited

496

EUSY0403901

IC6501

IC,Audio Sub System

WM9093ECS/R 1.71~5.5V 0W WLCSP R/TP 20P WOLFSON MICROELECTRONICS PLC

497

EUSY0418701

U6000

IC,Bluetooth

BCM2070B2KUBXG 2.3VTO5.5V 158.4mW 42P WLBGA R/TP 42P BROADCOM ASIA DISTRIBUTION
PTE LTD

498

EUSY0429101

U5001

IC,Resistive Touch
Screen Controller

MDR2 uQFN,18,R/TP,Haptic Driver Embedded

TSC,IC,A/D Converter - UQFN R/TP 18P MTEKVISION CO., LTD.

499

EXSK0005704

X2201B

Oscillator,VCTCXO

DSA321SCA 19.2mHZ 1.5PPM 2.8V 32.0x25.0x0.9MM

NA SMD R/TP DAISHINKU CORPORATION.

500

EXXY0016002

X6001

Crystal

SSP-T7-F(12.5PF,+/-20PPM) 32.768mHZ 20PPM

12.5pF NA SMD R/TP SEIKO INSTRUMENTS INC.

501

EXXY0018701

X2101B

Crystal

FC-135(12.5PF, +-20PPM) 32.768KHZ 20PPM 12.5PF

32*15 SMD R/TP SEIKO EPSON CORP

502

EXXY0024401

X6000

Crystal

TSX-3225 26MHZ 26MHZ 10PPM 10pF NA SMD R/TP

SEIKO EPSON CORP

503

MBFZ0060301

CN3002

Bracket

COMPLEX LG-UN270 VRZTG ZZ:Without Color PRESS,

STS, , , , ,

504

MCGY0004401

SC300

Clip

COMPLEX LG-VN530 VRZ ZZ:Without Color -

505

MCIZ0008201

ANT1000

Contact

COMPLEX LG-VN530 VRZ DW:DARK BROWN PRESS,

BeCu, , 3.0, 1.5, 1.5,

506

MCIZ0008201

ANT1002

Contact

COMPLEX LG-VN530 VRZ DW:DARK BROWN PRESS,

BeCu, , 3.0, 1.5, 1.5,

128

LG Electronics Inc.
144

UN270

507

SAFO0000401

R2106B

Wire Pad,Open

AX3100 ATL SV_SHIPBACK,MAIN,A,0OHM DNI

508

SAFO0000501

R1010

Wire Pad,Open

AX3100 ATL SV_SHIPBACK,MAIN,A,0OHM_1005_DNI

509
510
511
512
513
514
515
516
517
518
519
520
521
522
523
524
525
526
527
528
529
530
531
532
533
534
535
536
537
538
539
540
541
542
543
544

SAFP0000401
SAFP0000501
SAFP0000501
SAFP0000501
SAFP0000501
SAFP0000501
SAFP0000501
SAFP0000501
SAFP0000501
SAFP0000501
SAFP0000501
SAFP0000501
SAFP0000501
SAFP0000501
SAFP0000501
SAFP0000501
SAFP0000501
SAFP0000501
SAFP0000501
SAFP0000501
SAFP0000501
SAFP0000501
SAFP0000501
SAFP0000501
SAFP0000501
SAFP0000501
SAFP0000501
SAFP0000501
SAFP0000501
SAFP0000501
SAFP0000501
SAFP0000501
SAFP0000501
SAFP0000501
SAFP0000501
SAFP0000501

R3016
R1009
R1011
R1013
R1015
R1016
R1017
R1018
R1019
R1020
R2113B
R2114B
R2115B
R2116B
R2117B
R2118B
R2119B
R2120B
R2121B
R2122B
R2123B
R3006
R3008
R4007
R4008
R4009
R5005
R5008
R5009
R6013
R6014
R6015
R6019
R6020
R6039
R6044

1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1

Wire Pad,Short
Wire Pad,Short
Wire Pad,Short
Wire Pad,Short
Wire Pad,Short
Wire Pad,Short
Wire Pad,Short
Wire Pad,Short
Wire Pad,Short
Wire Pad,Short
Wire Pad,Short
Wire Pad,Short
Wire Pad,Short
Wire Pad,Short
Wire Pad,Short
Wire Pad,Short
Wire Pad,Short
Wire Pad,Short
Wire Pad,Short
Wire Pad,Short
Wire Pad,Short
Wire Pad,Short
Wire Pad,Short
Wire Pad,Short
Wire Pad,Short
Wire Pad,Short
Wire Pad,Short
Wire Pad,Short
Wire Pad,Short
Wire Pad,Short
Wire Pad,Short
Wire Pad,Short
Wire Pad,Short
Wire Pad,Short
Wire Pad,Short
Wire Pad,Short

AX3100 ATL SV_SHIPBACK,MAIN,A

LG-VS760 VRZ
LG-VS760 VRZ
LG-VS760 VRZ
LG-VS760 VRZ
LG-VS760 VRZ
LG-VS760 VRZ
LG-VS760 VRZ
LG-VS760 VRZ
LG-VS760 VRZ
LG-VS760 VRZ
LG-VS760 VRZ
LG-VS760 VRZ
LG-VS760 VRZ
LG-VS760 VRZ
LG-VS760 VRZ
LG-VS760 VRZ
LG-VS760 VRZ
LG-VS760 VRZ
LG-VS760 VRZ
LG-VS760 VRZ
LG-VS760 VRZ
LG-VS760 VRZ
LG-VS760 VRZ
LG-VS760 VRZ
LG-VS760 VRZ
LG-VS760 VRZ
LG-VS760 VRZ
LG-VS760 VRZ
LG-VS760 VRZ
LG-VS760 VRZ
LG-VS760 VRZ
LG-VS760 VRZ
LG-VS760 VRZ
LG-VS760 VRZ
LG-VS760 VRZ

545

SETY0007001

PT4000

Thermistor,NTC

NCP15WD683J03RC 68KOHM 5% 0V 0A 4.15KK SMD

P/TP 1005size MURATA MANUFACTURING CO.,LTD.

546

SEVY0003601

VA3000

Varistor

ICVL0505101V150FR 5.6V 0% 60F 1.0*0.5*0.55

NONE SMD R/TP INNOCHIPS TECHNOLOGY

547

SEVY0003601

VA3001

Varistor

ICVL0505101V150FR 5.6V 0% 60F 1.0*0.5*0.55

NONE SMD R/TP INNOCHIPS TECHNOLOGY

548

SEVY0003601

VA5100

Varistor

ICVL0505101V150FR 5.6V 0% 60F 1.0*0.5*0.55

NONE SMD R/TP INNOCHIPS TECHNOLOGY

549

SEVY0003601

VA5101

Varistor

ICVL0505101V150FR 5.6V 0% 60F 1.0*0.5*0.55

NONE SMD R/TP INNOCHIPS TECHNOLOGY

550

SEVY0003601

VA5102

Varistor

ICVL0505101V150FR 5.6V 0% 60F 1.0*0.5*0.55

NONE SMD R/TP INNOCHIPS TECHNOLOGY

551

SEVY0003601

VA5103

Varistor

ICVL0505101V150FR 5.6V 0% 60F 1.0*0.5*0.55

NONE SMD R/TP INNOCHIPS TECHNOLOGY

129

LG Electronics Inc.
145

UN270

552

SEVY0003601

VA6002

Varistor

ICVL0505101V150FR 5.6V 0% 60F 1.0*0.5*0.55

NONE SMD R/TP INNOCHIPS TECHNOLOGY

553

SEVY0003601

VA6003

Varistor

ICVL0505101V150FR 5.6V 0% 60F 1.0*0.5*0.55

NONE SMD R/TP INNOCHIPS TECHNOLOGY

554

SEVY0003601

VA6004

Varistor

ICVL0505101V150FR 5.6V 0% 60F 1.0*0.5*0.55

NONE SMD R/TP INNOCHIPS TECHNOLOGY

555

SEVY0003601

VA6006

Varistor

ICVL0505101V150FR 5.6V 0% 60F 1.0*0.5*0.55

NONE SMD R/TP INNOCHIPS TECHNOLOGY

556

SEVY0003601

VA6007

Varistor

ICVL0505101V150FR 5.6V 0% 60F 1.0*0.5*0.55

NONE SMD R/TP INNOCHIPS TECHNOLOGY

557

SEVY0003601

VA6008

Varistor

ICVL0505101V150FR 5.6V 0% 60F 1.0*0.5*0.55

NONE SMD R/TP INNOCHIPS TECHNOLOGY

558

SEVY0003601

VA6009

Varistor

ICVL0505101V150FR 5.6V 0% 60F 1.0*0.5*0.55

NONE SMD R/TP INNOCHIPS TECHNOLOGY

559

SEVY0003601

VA6010

Varistor

ICVL0505101V150FR 5.6V 0% 60F 1.0*0.5*0.55

NONE SMD R/TP INNOCHIPS TECHNOLOGY

560

SEVY0003601

VA6011

Varistor

ICVL0505101V150FR 5.6V 0% 60F 1.0*0.5*0.55

NONE SMD R/TP INNOCHIPS TECHNOLOGY

561

SEVY0003601

VA6012

Varistor

ICVL0505101V150FR 5.6V 0% 60F 1.0*0.5*0.55

NONE SMD R/TP INNOCHIPS TECHNOLOGY

562

SEVY0003601

VA6013

Varistor

ICVL0505101V150FR 5.6V 0% 60F 1.0*0.5*0.55

NONE SMD R/TP INNOCHIPS TECHNOLOGY

563

SEVY0003601

VA6015

Varistor

ICVL0505101V150FR 5.6V 0% 60F 1.0*0.5*0.55

NONE SMD R/TP INNOCHIPS TECHNOLOGY

564

SEVY0003601

VA6016

Varistor

ICVL0505101V150FR 5.6V 0% 60F 1.0*0.5*0.55

NONE SMD R/TP INNOCHIPS TECHNOLOGY

565

SEVY0003601

VA6017

Varistor

ICVL0505101V150FR 5.6V 0% 60F 1.0*0.5*0.55

NONE SMD R/TP INNOCHIPS TECHNOLOGY

566

SEVY0003901

VA6005

Varistor

EVL5M02200 5.5V 0% 480F 1.0*0.5*0.6 NONE SMD

R/TP AMOTECH CO., LTD.

567

SEVY0003901

VA6014

Varistor

EVL5M02200 5.5V 0% 480F 1.0*0.5*0.6 NONE SMD

R/TP AMOTECH CO., LTD.

568

SEVY0003901

VA6018

Varistor

EVL5M02200 5.5V 0% 480F 1.0*0.5*0.6 NONE SMD

R/TP AMOTECH CO., LTD.

569

SEVY0003901

VA6019

Varistor

EVL5M02200 5.5V 0% 480F 1.0*0.5*0.6 NONE SMD

R/TP AMOTECH CO., LTD.

570

SEVY0003901

VA6020

Varistor

EVL5M02200 5.5V 0% 480F 1.0*0.5*0.6 NONE SMD

R/TP AMOTECH CO., LTD.

571

SEVY0003901

VA6021

Varistor

EVL5M02200 5.5V 0% 480F 1.0*0.5*0.6 NONE SMD

R/TP AMOTECH CO., LTD.

572

SEVY0003901

VA6022

Varistor

EVL5M02200 5.5V 0% 480F 1.0*0.5*0.6 NONE SMD

R/TP AMOTECH CO., LTD.

573

SEVY0004301

VA3002

Varistor

ICVL0518100Y500FR 18V 0% 10F 1.0*0.5*0.55 NONE

SMD R/TP INNOCHIPS TECHNOLOGY

574

SFBH0006806

FB6000

Filter,Bead

CIM05J601NC 600 ohm 1.0X0.5X0.5 25% 0.6 ohm

0.3A SMD R/TP 2P 0 SAMSUNG
ELECTRO-MECHANICS CO., LTD.

130

LG Electronics Inc.
146

UN270

575

SFDY0003001

FL6000

Filter,Dielectric

DEA202450BT-1275A1 DEA202450BT-1275A1,2450
MHz,2.0*1.25*1.05,SMD,2400M~2500M,IL
1.6,4pin,U-U,50-50,BT BPF TDK CORPORATION

576

SFEY0010501

FL4000

Filter,EMI/Power

ICVE10184E150R101FR ESD/EMI 0HZ 15pF 0H SMD

R/TP INNOCHIPS TECHNOLOGY

577

SFEY0010501

FL4002

Filter,EMI/Power

ICVE10184E150R101FR ESD/EMI 0HZ 15pF 0H SMD

R/TP INNOCHIPS TECHNOLOGY

578

SFEY0010501

FL4003

Filter,EMI/Power

ICVE10184E150R101FR ESD/EMI 0HZ 15pF 0H SMD

R/TP INNOCHIPS TECHNOLOGY

579

SFEY0010501

FL4005

Filter,EMI/Power

ICVE10184E150R101FR ESD/EMI 0HZ 15pF 0H SMD

R/TP INNOCHIPS TECHNOLOGY

580

SFEY0010501

FL4007

Filter,EMI/Power

ICVE10184E150R101FR ESD/EMI 0HZ 15pF 0H SMD

R/TP INNOCHIPS TECHNOLOGY

581

SFEY0010501

FL4008

Filter,EMI/Power

ICVE10184E150R101FR ESD/EMI 0HZ 15pF 0H SMD

R/TP INNOCHIPS TECHNOLOGY

582

SFEY0011401

FL4001

Filter,EMI/Power

ICVE10184E070R101FR ESD/EMI 0HZ 7.5pF 0H SMD

R/TP INNOCHIPS TECHNOLOGY

583

SFEY0011401

FL4004

Filter,EMI/Power

ICVE10184E070R101FR ESD/EMI 0HZ 7.5pF 0H SMD

R/TP INNOCHIPS TECHNOLOGY

584

SFEY0011401

FL4006

Filter,EMI/Power

ICVE10184E070R101FR ESD/EMI 0HZ 7.5pF 0H SMD

R/TP INNOCHIPS TECHNOLOGY

585

SFEY0015301

FL3000

Filter,EMI/Power

NFM18PC104R1C3 ESD/EMI 0HZ 0.1uF 0H SMD R/TP

MURATA MANUFACTURING CO.,LTD.

586

SFSB0002201

FL1000

Filter,Saw,Dual

SAWEP836MFH2F00 836.5MHz, 1880MHz 2.0*1.6*0.6

SMD R/TP 10P MURATA MANUFACTURING CO.,LTD.

587

SFSY0030001

FL1004

Filter,Saw

SAFEB881MFM0F00 881.5 1.4X1.1X0.6 SMD R/TP 5P

MURATA MANUFACTURING CO.,LTD.

588

SFSY0033404

FL1011

Filter,Saw

B9444 1575.42MHz 1.4*1.1*0.45 SMD R/TP 5P

EPCOS PTE LTD.

589

SFSY0034601

FL1008

Filter,Saw

SAFEB1G96FL0F00 1960 1.4*1.1*0.6 SMD R/TP 5P

MURATA MANUFACTURING CO.,LTD.

590

SMPY0023501

U1000

IC,Power Amplifier

ACPM-7354-TR1
dBm,%,A,dBc,dB,5.0*3.0*1.05,SMD,DCN+USPCS,CPL,
2
MODE,1DCNIN,14CPLOUT,3.2V~4.2V,2,SMD,R/TP,14
AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE.
LIMITED

591

SMZY0021701

U1007

Module,GPS

ALM-2412 ALM-2412,GPS LNA Module integrated

Filter,3.3x2.1x1.1 AVAGO TECHNOLOGIES
INTERNATIONAL SALES PTE. LIMITED

592

SMZY0022401

U1002

Module,Assembly

ACFM-7107 Duplexer module Quadplexer, DCN/US-PCS

duplexer module AVAGO TECHNOLOGIES
INTERNATIONAL SALES PTE. LIMITED

593

SNMF0051501

ANT6000

Antenna,Helical

SDBTPTR3015 SINGLE -5DB 50OHM 5 PARTRON

COMPANY LIMITED

594

SAFD0150803

SAFD01

PCB
Assembly,Main,SMT
Top

LGUN270.AUCLRD 1.0 MAIN

131

LG Electronics Inc.
147

UN270

595

EDLH0015107

LD6000

LED,Chip

99-218UMC/2229397/TR8 WHITE 2.95~3.25 30mA

1200~1600mcd x, y 110mW - R/TP 2P - EVERLIGHT
ELECTRONICS CO., LTD.

596

EDLH0015107

LD6001

LED,Chip

99-218UMC/2229397/TR8 WHITE 2.95~3.25 30mA

1200~1600mcd x, y 110mW - R/TP 2P - EVERLIGHT
ELECTRONICS CO., LTD.

597

EDLH0015107

LD6002

LED,Chip

99-218UMC/2229397/TR8 WHITE 2.95~3.25 30mA

1200~1600mcd x, y 110mW - R/TP 2P - EVERLIGHT
ELECTRONICS CO., LTD.

598

EDLH0015107

LD6003

LED,Chip

99-218UMC/2229397/TR8 WHITE 2.95~3.25 30mA

1200~1600mcd x, y 110mW - R/TP 2P - EVERLIGHT
ELECTRONICS CO., LTD.

599

ERHZ0000206

R6040

Resistor,Chip

MCR01MZP5F10R0 10OHM 1% 1/16W 1005 R/TP ROHM.

600

ERHZ0000206

R6041

Resistor,Chip

MCR01MZP5F10R0 10OHM 1% 1/16W 1005 R/TP ROHM.

601

ERHZ0000206

R6042

Resistor,Chip

MCR01MZP5F10R0 10OHM 1% 1/16W 1005 R/TP ROHM.

602

ERHZ0000206

R6043

Resistor,Chip

MCR01MZP5F10R0 10OHM 1% 1/16W 1005 R/TP ROHM.

603

MCIZ0008201

ANT1007

Contact

COMPLEX LG-VN530 VRZ DW:DARK BROWN PRESS,

BeCu, , 3.0, 1.5, 1.5,

604

SEVY0003901

VA6000

Varistor

EVL5M02200 5.5V 0% 480F 1.0*0.5*0.6 NONE SMD

R/TP AMOTECH CO., LTD.

605

SEVY0003901

VA6001

Varistor

EVL5M02200 5.5V 0% 480F 1.0*0.5*0.6 NONE SMD

R/TP AMOTECH CO., LTD.

606

SPFY0234001

SPFY02

PCB,Main

SPFY0234001 LG-UN270 VRZTG D FR-4 Staggered via

STAGGERED-8 0.75 MAIN UNITECH PRINTED
CIRCUIT BOARD CORP.

607

MLAA0057303

MEZ002100

Label,Approval

COMPLEX LG-SH240 SKTMS ZZ:Without Color -

132

LG Electronics Inc.
148