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IEEE JOURNAL OF SOLID-STATE CIRCUITS, VOL. 48, NO.

8, AUGUST 2013

1933

0.5 V Start-Up 87% Efficiency 0.75 mm On-Chip


Feed-Forward Single-Inductor Dual-Output
(SIDO) Boost DC-DC Converter for Battery
and Solar Cell Operation Sensor Network
Micro-Computer Integration
Yasunobu Nakase, Shinichi Hirose, Hiroshi Onoda, Yasuhiro Ido, Yoshiaki Shimizu, Tsukasa Oishi,
Toshio Kumamoto, and Toru Shimizu, Senior Member, IEEE

AbstractAn on-chip low power single-inductor dual-output


(SIDO) DC-DC boost converter is proposed for battery and solar
cell operating sensor network applications. A proposed feed
forward control determines the Ton/Toff ratio precisely for each
output without any compensation or linear capacitor. This feature
helps reduce the costs of the external components and utilize
an inexpensive process technology. A test chip was fabricated by
190-nm flash-memory embedded micro-computers CMOS process
technology and can achieve an efficiency of 87% with a small area
size of just 0.75 mm. For solar cell operation, a 0.5 V start-up
was achieved even with a high threshold voltage of 0.7 V with a
proposed forward back biased charge pump. A constant voltage
algorithm was implemented as a maximum power point tracking
(MPPT) control. With this MPPT control, a solar cell with an open
voltage of 1.03 V and a short current of 83 mA was able to charge
a super capacitor of 0.4 F up to 5 V within 80 s.
Index TermsBoost, DC-DC converter, energy harvesting, feed
forward control.

I. INTRODUCTION

ECENTLY, wireless sensor networks have been widely


used to improve energy efficiency by controlling
building, office, and home environments [1][3]. A large
number of sensor nodes are distributed to monitor environmental parameters such as temperature, humidity, illumination
intensity, and so on. Each node consists of a micro-computer for
controlling the node operation, sensors, and sensor interfaces

Manuscript received November 29, 2012; revised March 28, 2013; accepted
March 28, 2013. Date of publication May 13, 2013; date of current version July
19, 2013. This paper was approved by Guest Editor Ken Suyama.
Y. Nakase, Y. Ido, and T. Kumamoto are with the Core Technology Business
Division, Renesas Electronics Corporation, Hyogo 664-0005, Japan (e-mail:
yasunobu.nakase.yg@renesas.com).
T. Oishi and Y. Shimizu are with Fundamental Technology Unit, Renesas
Design Corporation, Hyogo 664-0005, Japan.
S. Hirose and H. Onoda are with Renesas Design Corporation, Hyogo 6640005, Japan.
T. Shimizu is with Global Business Innovation and Strategy Marketing Division, 1st Solution Business Unit, Renesas Electronics Corporation, Tokyo 1000004, Japan.
Color versions of one or more of the figures in this paper are available online
at http://ieeexplore.ieee.org.
Digital Object Identifier 10.1109/JSSC.2013.2258826

Fig. 1. SIDO DC-DC converter for battery operating sensor node.

and a radio frequency (RF) module to send the measured data.


The sensor nodes are placed in every conceivable indoor location, so battery operation is required to ensure flexibility of the
placement. A single-inductor dual-output (SIDO) architecture
is suitable for such application. As shown in Fig. 1, one output
VCCX supplies power between 3 V and 5 V with around 10 mA
to the sensors. The other output VCCY supplies power of 3 V
with more than 25 mA to a micro-computer control circuits
(Cntrl CKT) of the DC-DC converter and sensor network RF
modules such as ZigBee.
When the clock MCLK is at a high level (Ton period), an
inductor stores the current, and when it is at a low level (Toff
period), the current is delivered to the output VCCX or VCCY
when the respective signal CLKX or CLKY is low. It is preferable for the SIDO converter to be embedded in a relatively small
area with a micro-computer because of the size limitation of the
sensor nodes.
To determine the Ton period, feed back control has generally
been used. When the output voltage is lower than that of an expected value, the Ton period is increased through a feed back
loop. To obtain a precise output level, the gain of this feed back
loop should be high enough. Therefore, phase compensation is
necessary to prevent an oscillation. This requires additional capacitors outside the chip for the compensation. This is problematic for the feed back control because the capacitors slow the
response. In a case of load transient, it takes almost from 0.5 ms
to 1 ms [4] for the output voltage to become stable. For sensor
network applications, the SIDO converter frequently changes

0018-9200/$31.00 2013 IEEE

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IEEE JOURNAL OF SOLID-STATE CIRCUITS, VOL. 48, NO. 8, AUGUST 2013

Fig. 2. Single output DC-DC converter.

Fig. 3. Conventional discontinuous conduction mode (DCM) controls for dual


outputs.

Fig. 4. Conventional feed forward control. OSP refers to one-shot pulse


generator.

the outputs for charging up. The Ton/Toff ratio needs to be determined immediately when the output changes, so feed back
control is not suitable for SIDO architecture. The other problem
of feed back control can be explained simply by using a single
output boost converter as shown in Fig. 2. The transfer function
is given by [5]

voltage
is lower than that of the triangle waveform, the clock is set low and the Ton/Toff ratio is determined
as

(1)

(2)

The transfer function depends on all of the parameters. For


each different value of L, C, R, Vin, and Vout, compensation
circuits should be optimized. Therefore, it is difficult to support
a wide range of input and output voltages and the values of L,
C, and R.
Many types of discontinuous conduction mode (DCM) operation have been proposed as methods that do not require compensation. Fig. 3 (i) shows a case in which each output is alternately charged in every cycle [6], [7]. In Fig. 3 (ii), both outputs
are charged in every cycle [8]. Large transistors are necessary
in DCM to obtain a high efficiency because the peak inductor
current is large. Fig. 3 (iii) shows the pseudo continuous conduction mode (CCM). The peak inductor current IL can be reduced
by flowing a constant current [9]. This mode has achieved efficiencies of 88.4% and 89.4% with chip sizes of 2.4 mm [6]
and 4.25 mm [9], respectively. These sizes, however, are too
large for micro-computer integration. Furthermore, each output
is required to supply almost the same amount of load current in
[9] to keep the offset current at a constant level.
Feed forward control [10] is another method that does not
require compensation. Its operation is shown in Fig. 4. A current source charges a capacitor C. When the capacitor voltage
reaches VREF, a one-shot pulse (OSP) generator discharges the
capacitor, thus generating a triangle waveform. When the scaled

(3)
(4)
The Ton/Toff duty ratio is set to
in an ideal
case [11]. From (4), the desired ratio can be obtained by setting
VREF as
. There are a few problems with this scheme in
terms of practical use. For example, to obtain a precise ratio, the
capacitor needs to have linear characteristics, but such a capacitor requires a large area size or expensive additional processes
such as a polysilicon process. When is set to 0.2 and the input
voltage range is assumed to range from 0.5 V to 3 V, the value
of
varies from 0.1 V to 0.6 V. For the lower Vin, the
offset voltage of the comparator creates a larger impact.
When sensor nodes are placed outdoors, a solar cell is used
for power in order to reduce or eliminate battery maintenance
issues. In this case, a maximum power point tracking (MPPT)
control is used to extract the maximum power from a solar cell
by modulating the clock pulsewidth [12][14]. Since the output
of a solar cell is unstable, a super capacitor is used to store the
electric power generated by the solar cell [15], [16]. The super
capacitor then supplies power to the sensor node through a low
drop-out regulator (LDO) as shown in Fig. 5. In the case of a
single output converter, the output must supply the power to
both a super capacitor and its control circuits. It takes a very
long time for the control circuits to operate properly because
the output voltage rises very slowly due to the super capacitor.
The SIDO architecture also has an advantage in that one output
charges the super capacitor while the other simultaneously supplies the power to the control circuits.
A boost converter is required to start up from a single cell
voltage of 0.5 V [13]. It has been realized by using low threshold
voltage process technology [17], by supplying a clock signal
from outside [14], or by using a dedicated start-up IC [18]. Selfcontained systems do not employ these methods.

NAKASE et al.: ON-CHIP FEED-FORWARD SIDO BOOST DC-DC CONVERTER

1935

Fig. 5. SIDO DC-DC converter for solar cell operating sensor node.

In this paper, we propose an on-chip low power SIDO DC-DC


converter operating with both a battery and a single solar cell
[19]. A high efficiency of 87% is achieved with a small area
size of just 0.75 mm and no external components for compensation by using a new feed forward control. This feed forward control does not require a linear capacitor and reduces
the impact of comparator offset because the operating point can
be set to a higher voltage. Quick response is also realized by
the feed forward control because it can determine the proper
duty ratio immediately. Two-stage start-up architecture realizes
0.5 V start-up without any special process technology, additional ICs, or assistance from the outside. A constant voltage
or fractional open-circuit voltage method [20], [21] is implemented as an MPPT function. This method is both simple and
effective. The proposed converter is applicable to a power supplier for a sensor node in both indoor and outdoor systems with
a small foot-print.

Fig. 6. Block diagram of SIDO DC-DC boost converter.

Fig. 7. Control circuits (Cntrl CKT) from Fig. 6 composed of two parts: FF
and CLK Gen.

II. FEED FORWARD CONTROL FOR SIDO ARCHITECTURE


The block diagram of the proposed converter is shown in
Fig. 6. VBAT is the input voltage. The first output VCCX can
be set between 3 V and 5 V to deal with the wide variety of
supply voltages for the sensors. The voltage of the second output
VCCY is predefined at 3 V. DVCCY supplies power to the internal control circuits (Cntrl CKT). pMOS transistors PX0 and
PY0 are used as rectifier transistors. When DVCCY reaches
3 V, the VCCX and VCCY power lines become available by
setting the signal PWS to low. The pMOS transistors PX1 and
PY1 have two roles. One is to control the slew rate of VCCX
and VCCY at the beginning of supplying powers. When one of
the outputs supplies the power to a micro-computer, it requires
some voltage slew rate of the power line to invoke power on the
reset function. The other role is to shut down the power lines
when a large load current flows.
The control circuits are composed of two parts as shown in
Fig. 7, the feed forward pulsewidth modulator (FF-PWM) and
the clock signal generator (CLK Gen). FF-PWM generates the
basic clock signal CLK. As explained later, the optimum duty
ratio is calculated immediately from the input and the expected
output voltages.
The circuit configuration of the control circuits (Cntrl CKT)
is shown in Fig. 8. This block generates the main clock MCLK
and the rectifier pMOS control signals CLKX and CLKY from
the CLK signal through the non-overlap circuit. A short current
is prevented since the nMOS driver and the pMOS rectifier transistors do not turn on at the same time. CLK Gen also provides

Fig. 8. Clock generator (CLK Gen) circuit configuration.

the signals SCTY and NOP. When SCTY is at a high level, the
VCCY is selected to be charged. The NOP signal indicates that
both VCCX and VCCY have reached their expected voltages.
When NOP becomes a high level, the FF-PWM block stops.
The SIDO operation is shown in Fig. 9. For each cycle, the inductor stores a current and delivers it to either one of the outputs.

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IEEE JOURNAL OF SOLID-STATE CIRCUITS, VOL. 48, NO. 8, AUGUST 2013

Fig. 10. Feed-forward pulsewidth modulation (FF-PWM). OSP refers to oneshot pulse generator.
Fig. 11. Simple model for analyzing effect of parasitic resistances.

The duties are therefore

(7)
(8)

Fig. 9. Proposed feed-forward control of charging outputs.

Each output is alternately charged for several cycles in continuous conduction mode (CCM). When VCCY is lower than the
expected voltage of 3 V, the SCTY is set to high as shown in
Fig. 8. The signal CLKY then becomes active. DVCCY and
VCCY are charged before VCCX, and as a result, the control
circuits (Cntrl CKT) are always stable. After VCCY reaches 3 V,
DVCCX and VCCX are selected. When both outputs of VCCX
and VCCY have reached the expected voltages, operation stops
by setting the NOP signal to high.
Fig. 10 shows the circuit configuration of the feed forward
pulsewidth modulator (FF-PWM). It consists of three parts:
a standard current generator
, a Ton period generator
, and a Toff period generator
. OSP refers to a
one-shot pulse generator. The
block generates a current
that is proportional to VBAT. At the end of the Toff period,
the
block is activated. The Ton period is determined
as the interval until the capacitor voltage reaches the reference
voltage VREF. Ton and Toff periods are given as

The resistor R in (5) and (6) is equal to RY or


when VCCY or VCCX is selected, respectively. In
an ideal case, the Ton/Toff ratio should be equal to
[11]. The desired duty ratio is obtained
by setting
and
.
For example, with reference to Fig. 10, when VREF and Rcs
are 0.8 V and 80
, respectively, Ics is set to 10 A. RY and
RX should be set to 300
and 100
.
The expected VCCX can be changed by setting VREF2 at
another voltage since Ics is determined by VREF2 when VCCX
is selected as shown in Fig. 10. If VREF2 is set to 1 V, Ics is
12.5 A. The expected VCCX is set to 5 V because VCCX is
given as
A. In contrast,
if VREF2 is set to 0.6 V, Ics becomes 7.5 A. The expected
VCCX is 3 V because VCCX is given as
A.
In practice, the duty ratio should be set to larger than the ideal
values to compensate for the power loss due to parasitic resistances. A simple model as shown in Fig. 11 explains the effect
of these resistances. The figure shows one of the outputs. The
on-resistances of nMOS and pMOS transistors N0 and P0 are
indicated by Rn and Rp. The power loss of pMOS transistor P1
is small and can be neglected. The effective input voltage
is lower than Vin by a voltage drop in the resistance. In contrast,
the effective output voltage
is higher than Vout.
(9)
(10)

(5)
(6)

Rn and Rp are 0.5 and 1.2 , respectively. The third term


in (10) is an input offset voltage generated during the Ton
period. M is the effective voltage conversion ratio given by
. Then,
can be considered an inductor

NAKASE et al.: ON-CHIP FEED-FORWARD SIDO BOOST DC-DC CONVERTER

1937

Fig. 13. Control circuits for constant voltage maximum power point tracking
(MPPT).
Fig. 12. Electrical characteristics of solar cell.

current. From (9) and (10), the sustainable load current can be
calculated for a given M value.
(11)
As the M value is set larger than its ideal value of Vout/Vin,
the sustainable load current increases. However, the power loss
increases because the inductor current increases. We therefore
set the M value to 7% larger than its ideal value. The sustainable
load current of VCCX is given as follows. When the VBAT is
0.5 V, the M value is
. VCCX
can supply a load current of 3.7 mA. When VBAT is 1.5 V, the
sustainable load current increases up to 30 mA.
As shown in (11), the sustainable load current is not determined from the Ton and Toff periods themselves but rather their
ratio. Equations (7) and (8) mean that the ratio is independent of
the value of the capacitors. Therefore, capacitor linearity is not
required in this proposed control. In practice, varactors are used
as non-linear capacitors. Furthermore, a precise ratio is obtained
even at low VBAT. Since the comparator operates at the input
range around VREF (0.8 V in this case), the offset voltage has
only minimal impact compared with the conventional control.
III. OPERATION WITH SOLAR CELL
In the case of solar cell operation, an MPPT control is used instead of the feed forward control. Fig. 12 shows electrical characteristics of a solar cell. Open voltage is defined as the voltage
when no current flows and short current is defined as the current
when the voltage is zero. For each point, the power is zero. As
the Ton period increases, the solar cell current increases and its
voltage decreases. Various methods have been proposed to operate a converter at the maximum power point, most of them requiring complicated calculation algorithms. An exception is the
constant voltage or fractional open-circuit voltage method. This
method takes advantage of the fact that the maximum power
is obtained at some fixed fraction (around 80%) of the open
voltage as shown in Fig. 12. The proposed converter employs
this simple method.
Fig. 13 shows the main part of the control circuits for the
MPPT function. The VMON signal is asserted every 20 ms from
an external controller. When VMON is high, the main clock
MCLK stops and the solar cell voltage is sampled. This is an
open voltage because the converter does not drive a load. A

Fig. 14. Circuit configuration during start-up operation.

comparator CMP compares the solar cell voltage (VBAT) with


80% of its open voltage. When VBAT becomes lower than 80%
of its open voltage, the CLK_EN signal becomes low and the
clock signal MCLK halts at a low level. In this situation, more
current is pulled from a solar cell than it can supply. After the
input voltage has recovered, the converter resumes operation.
As a result, the duty ratio is automatically determined to operate
at the maximum solar power.
IV. 0.5-V START-UP CIRCUITS OPERATION AND ANALYSIS
Fig. 14 shows the circuit configuration during start-up. Since
the control circuits are inactive, the main clock MCLK is at
a low level and the rectifier signals CLKX and CLKY are at
a high level. The signal PWS is also at a high level. A ring
oscillator (Ring Osc) supplies a substitute clock signal SCLK
with a 50% duty ratio. Since pMOS transistors PX0 and PY0
are off, an inductor current charges the capacitor CX through the
parasitic PN diodes of PX0 and PY0. In this period, both back
gates of these pMOS transistors PX0 and PY0 are connected to
the DVCCY node.
When the VBAT is higher than 1.5 V, it directly supplies
power to the ring oscillator. In contrast, when it is lower than
1.5 V, a charge pump supplies the power through the VRNG
node. In this case, a charge pump supplies a current ICP to the
capacitor CCP. After the VRNG voltage reaches 1.2 V, the ring
oscillator begins to operate. The ring oscillator raises the voltage
of DVCCY and when it reaches 2.5 V, the feed forward control is activated. As shown later, it takes 20 ms for DVCCY
to rise to 2.5 V when VBAT is 0.5 V. During this period, the
charge pump supplies a current ICP of 0.28 A and the ring
oscillator consumes a current IRNG of 3 A. Therefore, the capacitor CCP must supply the difference of these currents, i.e.,

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IEEE JOURNAL OF SOLID-STATE CIRCUITS, VOL. 48, NO. 8, AUGUST 2013

Fig. 15. Ring oscillator start-up period analysis.

2.7 A (IRNG-ICP). If the voltage drop of the VRNG during


20 ms is less than 50 mV, the CCP should be larger than
A

(12)

considering the
We selected a four times larger CCP of 4.5
variation of transistor performance and possible different external inductor values.
A waiting time of VRNG to reach 1.2 V occupies almost all
of the start-up time. This wait time
can be expressed by
(13)
,
, and
Substituting
A, we obtain
.
Here, we develop an expression for the DVCCY rising time.
Fig. 15 shows the inductor current at start-up. The converter
operates in the DCM. Since the sub-clock SCLK oscillates at
330 KHz, the cycle time Tcyc is 3 s. An nMOS switch is turned
on during the Ton period, which is equal to a half of the Tcyc.
The inductor current reaches its peak value Ip at the end of the
Ton period and decreases to zero during the
period. Ip and
are given as
(14)
(15)

If all of the inductor current is used to charge the outputs, the


average current Ix of charging the capacitor CX is given by
(16)
However, a half of Ix is wasted by the parasitic PNP transistors
of pMOS transistors PX0 and PY0 as shown in Fig. 14. Therefore, the voltage of DVCCY is expressed as
(17)
(18)

,
,
By substituting the parameters of
, and
s, we obtain the time of 20 ms
for DVCCY to reach 2.5 V.
Fig. 16 shows the circuit configuration of a charge pump and
its back gate voltage controller. The charge pump is composed
of nMOS transistors. When the VBAT is below 1.5 V, the
detector outputs at a high level. In addition, when the VBAT is
higher than 0.5 V, nMOS transistor N1 and pMOS transistors P1
and P2 are turned on. Since the voltage of VP is equal to VBAT,
VBAT is supplied to both the local oscillator and the charge
pump. Voltages VB1 and VB2 are then set as (VBAT-VF). VF
is a forward voltage drop of parasitic PN diodes between the
source and the back gate of transistors P1 and P2. Therefore, all
pMOS transistors in the local oscillator are deeply forward biased. Fig. 17 shows the relationship between the forward back
bias voltages VB2 and VBAT. When the VBAT is lower than
VF, which is around 0.7 V, the forward bias is equal to the
VBAT. In contrast, when the VBAT is higher than VF, the forward bias voltage is fixed to VF. The charge pump supplies
a current to the capacitor CCP, and the capacitor supplies the
power to the ring oscillator through VRNG by pMOS transistor
P3.
When the VBAT is in the range between 1.5 V and 3 V, the
voltages between any nodes of thin oxide transistors must be
lower than the breakdown voltage of 2 V. In this case, transistors P1 and P2 are turned off. The local oscillator and the charge
pump are isolated from the VBAT. The VBAT directly supplies the power to the ring oscillator via VRNG. The back gate
voltage VB1 is set equal to the VBAT. The back gate voltage
VB2 is equal to a half of the VBAT due to the resistors R2.
Since the transistors N1 and N3 are off and N2 is on, the gate
and source voltages of the transistor P2 are also equal to a half
of the VBAT due to the resistors R1. As a result, the voltages
between any nodes in the thin oxide transistors never exceed a
half of the VBAT.
V. IMPLEMENTATION AND EXPERIMENTAL RESULTS
We fabricated a test chip by 190 nm CMOS process technology as shown in Fig. 18. The threshold voltage is 0.7 V and
the active area size is 1.7 mm 0.44 mm.
Fig. 19 shows the measurement and simulation results of the
charge pump supply current. A current of 0.28 A was obtained
at a VBAT of 0.5 V.
Fig. 20 shows the start-up waveforms at the VBAT of 0.5 V.
The charge pump supplied a current to the capacitor CCP. When
its voltage VCP reached 1.2 V, the ring oscillator started to oscillate. The ring oscillator operation time was of the order of ten
milliseconds. This result indicates that the DVCCY is charged
up first. It takes 13 s for the outputs to reach their expected voltages of 3 V and 5 V. This rising interval is almost identical to
the calculated result. After DVCCY reached 2.5 V, the feed forward control (FF-PWM) began to operate.
Fig. 21 shows the waveforms of the feed forward control with
battery operation at a VBAT of 1.5 V. The waveform of the
terminal INDCNT shown in Fig. 6 can be considered an inverse
of the main clock MCLK. When charging VCCX or VCCY, the
amplitude of the waveform of INDCNT is equal to 5 V or 3 V,
respectively. This result shows that VCCY can be charged when

NAKASE et al.: ON-CHIP FEED-FORWARD SIDO BOOST DC-DC CONVERTER

1939

Fig. 16. Circuit configuration of charge pump and back gate controller.

Fig. 17. Back gate bias of pMOS transistors.

Fig. 19. Charge pump supply current.

Fig. 18. Micrograph of SIDO DC-DC converter test chip.

its voltage is lower than 3 V. The ripple voltage is within 50 mV


for each output.
Fig. 22 shows comparison results of the measured and simulated Ton/Toff ratios. The desired ratios were obtained within a
VBAT range of 0.5 V and 2.5 V. In the conventional feed forward control, as the input voltage becomes lower, the Toff period becomes shorter. Therefore, a small error in the Toff period
can cause a large difference in the Ton/Toff ratio. In contrast,
with the proposed control, the impact of any errors in the Toff

Fig. 20. Start-up waveforms at VBAT of 0.5 V. VCP refers to the voltage of
capacitor CCP.

period is small. From (5) and (6), the clock cycle time Tcyc is
given as
(19)

1940

Fig. 21. Feed forward control measured waveforms. Measurement conditions


,
mA, and
mA.
are

IEEE JOURNAL OF SOLID-STATE CIRCUITS, VOL. 48, NO. 8, AUGUST 2013

Fig. 23. Experimental results of efficiency and output voltage dependence on


VCCX load current IloadX.

Fig. 22. Comparison of Ton/Toff ratio for each output. Expected VCCX is 5 V.
Fig. 24. Experimental results of efficiency and output voltage dependence on
VCCY load current IloadY.

This indicates that the proposed feed forward control sets the
cycle time longer as the input voltage becomes lower. Therefore, the Toff period also becomes longer compared with the
conventional control.
Figs. 23 and 24 show the measured results of the efficiency
dependence of the VCCX and VCCY on load currents IloadX
and IloadY, respectively. The IloadY is kept at 4 mA (Fig. 23).
The voltage VCCX maintains within 10% of the 5 V target while
supplying 10 mA, 20 mA, and 40 mA of IloadX at VBAT of
1 V, 1.5 V, and 2 V, respectively. The IloadX is kept at 6 mA
(Fig. 24). The voltage VCCY maintains within 10% of the 3 V
target while supplying 15 mA, 40 mA, and more than 50 mA
of IloadY at VBAT of 1 V, 1.5 V, and 2 V, respectively. An
efficiency of 87% was achieved at a VBAT of 2 V and IloadY of
15 mA. The power consumption with zero load current, 0.5 mW,
was measured at the input node.
Fig. 25 shows the line transient results. The VBAT changed
from 1 V to 2 V every 800 s. The rise and fall times of the
VBAT were 17 s. The response is stable even without any compensation. There are no overshoot or undershoot phenomena
when VBAT changed.
Fig. 26 shows the measured results of charging a super capacitor from a solar cell. The solar cell had an open voltage of
1.03 V and a short current of 83 mA under an indoor light condition as shown in Fig. 12. A super capacitor of 0.4 F was attached
to a VCCX and charged from 0 V to 5 V within 80 s. The solar

Fig. 25. Measured waveforms of line regulation. Measured conditions are


mA and
mA. X and Y refer to charging VCCX and
VCCY, respectively.

cell output voltage, which was equal to the VBAT, is stable at


0.77 V due to the implemented constant voltage MPPT control.
VI. SUMMARY
We have proposed an on-chip low power single-inductor
dual-output (SIDO) DC-DC converter for battery and solar

NAKASE et al.: ON-CHIP FEED-FORWARD SIDO BOOST DC-DC CONVERTER

Fig. 26. Experimental results of charging super capacitor with MPPT control.

cell operating sensor network applications. The proposed feed


forward control does not require any phase compensation. In
addition, it determines the Ton/Toff ratio precisely even at a
low input voltage without a linear capacitor. These features
help reduce the cost of external components and process technology. A test chip was fabricated by 190 nm CMOS process
technology and achieved an efficiency of 87% with a small area
size of just 0.75 mm .
For solar cell operation, we were able to achieve 0.5 V
start-up even with a process technology for flash-memory
embedded micro-computers by utilizing the proposed forward
back biased charge pump. A constant voltage algorithm was
implemented as the maximum power point tracking (MPPT)
control. With this MPPT control, a solar cell with an open
voltage of 1.03 V and a short current of 83 mA charged a super
capacitor of 0.4 F up to 5 V within 80 s.

1941

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Yasunobu Nakase received the B.S. and M.S.


degrees in physics from Ritsumeikan University,
Kyoto, Japan, and the Ph.D. degree in electronic
engineering from Osaka University, Osaka, Japan.
He joined Mitsubishi Electric Corp. in 1983. He
worked for research and development of high speed
SRAMs, CMOS arithmetic processing units and high
speed interface circuits. From 2002 to 2008, he transferred temporally to Renesas Design Corp., Hyogo,
Japan, to build an analog design division. He moved
to Renesas Electronics Corp. in 2010. Since then, he
has been a senior engineer for development of analog IPs, especially DC-DC
converters for energy harvesting applications. He is a member of the Institute
of Electronics, Information and Communication Engineers (IEICE) of Japan.

Shinichi Hirose received B.E. degree in Industry


Chemistry from Kyushu Institute of Technology
in 1978 and M.E. degree in Applied Electronics
from the University of Electro-Communications
in 1982. He joined Mitsubishi Electric Corp. in
1982. He worked for development of one chip
MCUs and their embedded analog IPs. He moved to
Renesas Electronics Corp. in 2010. From then, he is
developing DC-DC converters for energy harvesting
applications.

1942

IEEE JOURNAL OF SOLID-STATE CIRCUITS, VOL. 48, NO. 8, AUGUST 2013

Hiroshi Onoda received the B.E. and M.E. degrees


in Faculty of Engineering from Osaka University,
Osaka, Japan, in 1981 and 1983, respectively.
He joined Mitsubishi Electric Corp. in 1983. He
worked for research and development of Focused
Ion Beam lithography, flash memory process integration, and HVIC (high voltage analog IC) process
integration. He moved to Renesas Electronics Corp.,
Hyogo, Japan, in 2010. Since then, he has been
working for development of analog IPs, especially
DC-DC converters.

Yasuhiro Ido received the B.E. degree in electrical


and electronic engineering from Tokushima University, Japan, in 1994 and the M.E. degree in energy
engineering and science from Nagoya University,
Japan, in 1996.
He joined Mitsubishi Electric Corp. in 1996. He
worked for research and development of memory
testing. He moved to Renesas Electronics Corp.,
Hyogo, Japan, in 2010. Since then, he has been
working for development of analog IPs, especially
DC-DC converters.

Yoshiaki Shimizu received the B.E. degree in Faculty of Engineering from Kansai University, Japan,
in 1982.
He joined Mitsubishi Electric Corp. in 1982.
He worked for research and development of SoC.
He moved to Renesas Electronics Corp., Hyogo,
Japan, in 2010. Since then, he has been working for
development of several kinds of analog IPs.

Tsukasa Oishi received the B.S. and M.S. degrees


from Shibaura Institute of Technologies, Tokyo,
Japan, in 1985 and 1987, respectively. He received
the Ph.D. degree from Waseda University, Japan, in
2005.
He joined Mitsubishi Electric Corp. in 1987. Since
then, he has been working for R&D of memory (Dynamic RAM and system memory) design. From 1987
to 2002, he developed Dynamic RAM (large scale,
low voltage, multi-function, and system application)
and Magnetic RAM. In 2003, he joined Renesas

Technology Corp., Hyogo, Japan. From 2003 to 2006, he was a manager of


R&D activities for various IPs of microcontroller applications. From 2003 to
2008, he developed Flash memory technology (NOR-type and MONOS-type)
for microcontroller application. From 2006 to 2009, he developed analog
circuit technology for Microcontroller application. In 2010, he joined Renesas
Electronics Corp. From 2010, he is a department manager of the Platform
Integration Division. He is managing R&D activities for various analog IPs and
microcontroller design platform. In the academic area, he is a visiting senior
researcher for system memories and analog IPs in Waseda University.

Toshio Kumamoto received the B.E. and Ph.D.


degrees in electrical engineering from Osaka Prefecture University, Osaka, Japan, in 1983 and 1991,
respectively.
He joined Mitsubishi Electric Corp. in 1983. He
worked for research and development of A/D and
D/A converters. He moved to Renesas Electronics
Corp., Hyogo, Japan, in 2010. Since then, he has
been working for development of several analog IPs
including A/D and D/A converters.
Dr. Kumamoto is a member of the Institute of Electronics, Information and Communication Engineers (IEICE) of Japan.

Toru Shimizu (M86SM05) received the B.S.,


M.S., and Ph.D. degrees in information science from
The University of Tokyo, Japan.
Since 1986, he has been involved in microprocessor, microcontroller and SoC design R&D,
working in Mitsubishi Electric, Renesas Technology,
and Renesas Electronics, Hyogo, Japan. He leads
many design projects of embedded microprocessor
LSIs. Leading edge RISC microprocessors with
embedded DRAM, micro-controllers with embedded
flash memory, multi-core SoCs for embedded processing are some of the project outputs. His R&D activities cover not only LSI
design and architecture but embedded software and application systems.
Dr. Shimizu is a senior member of the IEICE. He is a steering committee
member of the A-SSCC and a director of the Executive Committee.

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