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Description
Applications
Ordering Information
Part Number
Operating Temperature
Range
Package
Packing Method
FAN6961SZ
-40C to +125C
FAN6961DZ
-40C to +125C
FAN6961SY
-40C to +125C
(1)
Note:
1. SZ &SY are for Eco status, please refer to http://fsce132/pf/FA/FAN6961.html.
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December 2013
FAN6961
Figure 1.
Typical Application
Block Diagram
Application Diagram
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2
F- Fairchild Logo
Z- Plant Code
X- Year Code
Y- Week Code
TT: Die Run Code
T: Package Type (S=SOP, D=DIP)
P: Z: Pb Free
Y: Green Compound
M: Manufacture Flow Code
FAN6961
TPM
Pin Configuration
Figure 4.
Marking Information
Pin Definitions
Pin #
Name
Description
INV
COMP
MOT
CS
Current Sense. Input to the over-current protection comparator. When the sensed voltage across
the sense resistor reaches the internal threshold (0.8 V), the switch is turned off to activate cycleby-cycle current limiting.
ZCD
Zero Current Detection. This pin is connected to an auxiliary winding via a resistor to detect the
zero crossing of the switch current. When the zero crossing is detected, a new switching cycle is
started. If it is connected to GND, the device is disabled.
GND
Ground. The power ground and signal ground. Placing a 0.1 F decoupling capacitor between
VCC and GND is recommended.
GATE
Driver Output. Totem-pole driver output to drive the external power MOSFET. The clamped gate
output voltage is 16.5 V.
VCC
Inverting Input of the Error Amplifier. INV is connected to the converter output via a resistive
divider. This pin is also used for over-voltage clamping and open-loop feedback protection.
Output of the Error Amplifier. To create a precise clamping protection, a compensation network
between this pin and GND is suggested.
Maximum On Time. A resistor from MOT to GND is used to determine the maximum on-time of
the external power MOSFET. The maximum output power of the converter is a function of the
maximum on time.
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Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only. All voltage values, except differential voltage, are given with
respect to GND pin.
Symbol
Parameter
VVCC
DC Supply Voltage
VHIGH
Gate Driver
Min.
-0.3
Max.
Unit
30
30.0
VLOW
-0.3
7.0
VZCD
-0.3
12.0
PD
Power Dissipation
TJ
JA
TSTG
TL
ESD
SOP
400
DIP
800
-40
SOP
150
DIP
113
-65
+125
+150
SOP
+230
DIP
+260
mW
C
C/W
C
C
2.5
KV
200
Symbol
TA
Parameter
Min.
-40
Typ.
Max.
Unit
+125
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4
Unless otherwise noted, VCC=15 V and TJ= -40C to 125C. Current is defined as positive into the device and
negative out of the device.
Symbol
Parameter
Conditions
Min.
Typ.
Max.
Units
24.5
VCC Section
VCC-OP
VCC-ON
11.5
12.5
13.5
VCC-OFF
8.5
9.5
10.5
ICC-ST
Startup Current
VCC=VCC-ON 0.16 V
10
20
ICC-OP
VCC=12 V, VCS=0 V,
CL=3 nF, fSW =60 KHz
4.5
mA
27.8
28.8
VCC-OVP
26.8
30
Reference Voltage
2.475
Gm
Transconductance
125
VINVH
2.65
VINVL
2.25
2.500
2.525
V
mho
2.70
2.30
4.8
1.15
1.25
1.35
VINV-OVP
2.70
2.75
2.80
VINV-UVP
0.40
0.45
0.50
VINV=2.35 V, VCOMP=1.5 V
10
20
VINV=1.5 V,
550
800
VINV=2.65 V, VCOMP=5 V
10
20
ICOMP
Source Current
Sink Current
Electrical Characteristics
Current-Sense Section
VPK
tPD
Propagation Delay
tLEB
0.77
0.82
0.87
200
V
ns
RMOT=24 k, VCOMP=5 V
400
500
RMOT=24 k,
VCOMP=VOZ+50 mV
270
350
16.0
17.5
1.4
ns
Gate Section
VZ-OUT
VCC=25 V
VOL
VCC=15 V, IO=100 mA
VOH
VCC=14 V, IO=100 mA
tR
Rising Time
80
ns
tF
Falling Time
40
ns
14.5
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5
Unless otherwise noted, VCC=15 V and TJ=-40C to 125C. Current is defined as positive into the device and negative
out of the device.
Symbol
Parameter
Conditions
Min.
Typ.
Max.
Units
1.9
2.1
2.3
VZCD Increasing
VZCD Decreasing
0.35
IZCD=3 mA
IZCD=-1.5 mA
0.3
VCOMP=5 V,
fSW =60 KHz
100
Restart Time
300
tINHIB
RMOT=24 k
VDIS
tDEAD
tRESTART
tZCD-DIS
12
V
V
500
400
ns
700
2.8
130
RMOT=24 k,
VZCD=100 mV
200
s
250
800
mV
Electrical Characteristics
1.25
RMOT=24 k,
VCS=0 V, VCOMP=5 V
1.30
25
1.35
V
s
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6
3.0
2.515
2.4
I CC-OP (mA)
V ref (V)
2.525
2.505
2.495
2.485
1.8
1.2
0.6
2.475
0.0
20
35
50
65
80
95 110 125
Temperature ()
20
35
50
65
80
95 110 125
Temperature ()
24.60
14.0
24.52
13.4
V th-ON (V)
t ON-MAX (s)
24.44
24.36
24.28
12.8
12.2
11.6
24.20
-40 -25 -10
20
35
50
65
80
11.0
95 110 125
Temperature ()
35
50
65
80
95 110 125
Temperature ()
10.5
16.0
10.1
13.6
I CC-ST (A)
V th-OFF (V)
20
9.7
9.3
8.9
11.2
8.8
6.4
8.5
4.0
-40 -25 -10
20
35
50
65
80
95 110 125
Temperature ()
20
35
50
65
80
95 110 125
Temperature ()
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7
18.0
1.330
17.4
V Z-OUT (V)
V MOT (V)
1.350
1.310
1.290
1.270
16.8
16.2
15.6
1.250
15.0
-40 -25 -10
20
35
50
65
80
95 110 125
Temperature ()
20
35
50
65
80
Temperature ()
95 110 125
0.87
V PK (V)
0.85
0.83
0.81
0.79
0.77
-40 -25 -10
20
35
50
65
80
95 110 125
Temperature ()
Figure 13. VPK vs. TA
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8
Error Amplifier
Startup Current
Typical startup current is less than 20 A. This ultra-low
startup current allows the usage of high resistance, lowwattage startup resistor. For example, 1 M/0.25 W
startup resistor and a 10 F/25 V (VCC hold-up)
capacitor are recommended for an AC-to-DC power
adaptor with a wide input range 85-265 VAC.
Output Driver
With low on resistance and high current driving
capability, the output driver can drive an external
capacitive load larger than 3000 pF. Cross conduction
current has been avoided to minimize heat dissipation,
improving efficiency and reliability. This output driver is
internally clamped by a 16.5 V Zener diode.
Operating Current
Operating current is typically 4.5 mA. The low operating
current enables a better efficiency and reduces the
requirement of VCC hold-up capacitance.
2 L Po
Vrms 2
(1)
25
(s )
= R I ( k )
24
Noise Immunity
Noise on the current sense or control signal can cause
significant pulse-width jitter, particularly in the boundarymode operation. Slope compensation and built-in
debounce circuit can alleviate this problem. Because
the FAN6961 has a single ground pin, high sink current
at the output cannot be returned separately. Good highfrequency or RF layout practices should be followed.
Avoiding long PCB traces and component leads,
locating compensation and filter components near to the
FAN6961, and increasing the power MOSFET gate
resistance improve performance.
(2)
Functional Description
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9
Reference Circuit
Figure 14.
Reference Circuit
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10
Physical Dimensions
9.83
9.00
6.67
6.096
8.255
7.61
3.683
3.20
5.08 MAX
7.62
0.33 MIN
3.60
3.00
(0.56)
2.54
0.56
0.355
0.356
0.20
1.65
1.27
9.957
7.87
7.62
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchilds worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductors online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
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11
0.65
3.81
8
5
B
1.75
6.20
5.80
PIN ONE
INDICATOR
4.00
3.80
5.60
1.27
(0.33)
1.27
0.25
C B A
0.25
0.10
1.75 MAX
0.25
0.19
0.10
0.51
0.33
0.50 x 45
0.25
R0.10
GAGE PLANE
R0.10
0.36
8
0
0.90
0.40
SEATING PLANE
(1.04)
DETAIL A
SCALE: 2:1
Figure 16.
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchilds worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductors online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
www.fairchildsemi.com
12
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13