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Abhishek Aravind
A0114117W
Tcpu= 1000C
CPU
Tgpu= 1500C
GPU
Heat Sink
Texit= 250C
Conduit
Background
Water cooling is often used to dissipate heat in data centers. Certain
configurations can become very hot during intense processing, such as is the
case when crunching large quantities of data. Copper heat sinks are often
combined with these liquid cooling systems in order to make the system more
efficient and stable. Boiling in the heat transfer mechanism can lead to pressure
buildup which can be very hazardous. To ascertain the risk of this happening
during normal operation, stress tests are run on the system in order to ascertain
safety. Due to the safety processes in place, the test is run for a maximum of 2
hours, the maximum possible time without human intervention. Only the points
of contact between the gpu and cpu transfer heat to the heat sink as well as the
exit of the conduit. The rest of the apparatus is insulated.
Aim
Ascertain if water inside the conduit will reach critical temp, 100 0C.
Governing Equations
T
Q
= 2 T +
t
C p
Initial Conditions
Uniform Initial temp: 200C
Boundary Conditions:
CPU Temperature: 1000C
GPU Temperature: 1500C
Conduit Exit Temperature:250C
Assumptions
Geometry
Heat Sink
Height: 1m
Length: 1m
Conduit
Height:0.2m
Length:1m
=8890kg/m3
Cp=385.4J/Kg.K
k = 383.5W/m.K
Water:
=998.2kg/m3
Cp=4182J/Kg.K
k = 383.5W/m.K
Matlab Solution
Initializing mesh and setting boundary conditions to simulate point of contact
between heat sink and CPU/GPU. Other boundaries are set with zero heat flux to
show insulation.
PDE specifitations are set according to aforementiond parameters.
Variation
Conclusion:
Copper conduit can be a feasible replacement to water cooling conduit.