BTA/BTB24, BTA25, BTA26

and T25 Series

25A TRIACS

SNUBBERLESS & STANDARD

MAIN FEATURES:

A2

Symbol

Value

Unit

IT(RMS)

25

VDRM/VRRM

600 and 800

IGT (Q1)

35 to 50

A2
G

A1

A1
A2
G

mA

IT(RMS)

ITSM
I t
dI/dt

RMS on-state current (full sine wave)

Non repetitive surge peak on-state

current (full cycle, Tj initial = 25C)
It Value for fusing
Critical rate of rise of on-state current
IG = 2 x IGT , tr 100 ns

PG(AV)
Tstg
Tj

Peak gate current

Average gate power dissipation
Storage junction temperature range
Operating junction temperature range

TO-220AB
(BTB24)

A1 A2
G

D2PAK
(T25G)

A1
A2

A1 A2

Value

DPAK
TO-220AB
RD91
TOP3 Ins.
TO-220AB Ins.
F = 60 Hz
F = 50 Hz

TOP3
Insulated
(BTA26)

RD91
(BTA25)

Parameter

VDSM/VRSM Non repetitive surge peak off-state

voltage
IGM

A2

TO-220AB
Insulated
(BTA24)

DESCRIPTION
Available either in through-hole of surface and T25
mount packages, the BTA/BTB24-25-26 triac
series is suitable for general purpose AC power
switching. They can be used as an ON/OFF
function in applications such as static relays,
heating regulation, water heaters, induction motor
starting circuits...or for phase control operation in
high power motor speed controllers, soft start
circuits...The snubberless versions (BTA/BTB...W
and T25 series) are specially recommended for
use on inductive loads, thanks to their high
commutation performances.
By using an internal ceramic pad, the BTA series
provides voltage insulated tab (rated at 2500V
RMS) complying with UL standards (File ref.:
E81734).
ABSOLUTE MAXIMUM RATINGS
Symbol

A1
A2
G

Tc = 100C
Tc = 90C
Tc = 75C
t = 16.7 ms
t = 20 ms

tp = 10 ms

Unit

25

260
250

340

A s

F = 120 Hz

Tj = 125C

50

A/s

tp = 10 ms

Tj = 25C

VDRM/VRRM

tp = 20 s

Tj = 125C

Tj = 125C

- 40 to + 150
- 40 to + 125

+ 100

September 2002 - Ed: 6A

This datasheet has been downloaded from http://www.digchip.com at this page

1/9

BTA/BTB24, BTA25, BTA26 and T25 Series

ELECTRICAL CHARACTERISTICS (Tj = 25C, unless otherwise specified)

SNUBBERLESS (3 Quadrants) T25-G, BTA/BTB24...W, BTA25...W, BTA26...W

Symbol

IGT (1)
VGT

Test Conditions

Quadrant

RL = 33

VD = 12 V

VGD

VD = VDRM

IH (2)

IT = 500 mA

IL

IG = 1.2 IGT

RL = 3.3 k

Tj = 125C

T25

CW

BW

35

35

50

mA

MAX.

I - II - III

MAX.

1.3

I - II - III

MIN.

0.2

I - III

VD = 67 % VDRM gate open Tj = 125C

(dI/dt)c (2) Without snubber

Unit

T2535
I - II - III

MAX.

50

50

75

mA

MAX.

70

70

80

mA

80

80

100

MIN.

500

500

1000

V/s

MIN.

13

13

22

A/ms

II
dV/dt (2)

BTA/BTB

Tj = 125C

STANDARD (4 Quadrants): BTB24...B, BTA25...B, BTA26...B

Symbol

Test Conditions

IGT (1)
VD = 12 V

Quadrant

RL = 33

Value

Unit

I - II - III
IV

MAX.

50
100

mA

VGT

ALL

MAX.

1.3

VGD

VD = VDRM

ALL

MIN.

0.2

IH (2)

IT = 500 mA

MAX.

80

mA

IL

IG = 1.2 IGT

70

mA

RL = 3.3 k

Tj = 125C

I - III - IV

MAX.

II
dV/dt (2)

VD = 67 % VDRM gate open Tj = 125C

(dV/dt)c (2) (dI/dt)c = 13.3 A/ms

Tj = 125C

160
MIN.

500

V/s

MIN.

10

V/s

STATIC CHARACTERISTICS
Symbol

Test Conditions

VTM (2)

ITM = 35 A

Vto (2)

tp = 380 s

Unit

Tj = 25C

MAX.

1.55

Threshold voltage

Tj = 125C

MAX.

0.85

Rd (2)

Dynamic resistance

Tj = 125C

MAX.

16

IDRM

VDRM = VRRM

Tj = 25C

mA

IRRM
Note 1: minimum IGT is guaranted at 5% of IGT max.
Note 2: for both polarities of A2 referenced to A1

2/9

Value

Tj = 125C

MAX.

BTA/BTB24, BTA25, BTA26 and T25 Series

THERMAL RESISTANCES
Symbol
Rth(j-c)

Parameter

Value

Junction to case (AC)

Junction to ambient

Rth(j-a)

DPAK
TO-220AB

0.8

RD91 (Insulated)
TOP3 Insulated

1.1

TO-220AB Insulated

1.7

DPAK

45

TOP3 Insulated

50

S = 1 cm

TO-220AB
TO-220AB Insulated

Unit
C/W

C/W

60

S: Copper surface under tab

PRODUCT SELECTOR
Voltage (xxx)
Part Number

Sensitivity

Type

Package

50 mA

Standard

TO-220AB

50 mA

Snubberless

TO-220AB

BTA/BTB24-xxxCW

35 mA

Snubberless

TO-220AB

BTA25-xxxB

50 mA

Standard

RD-91

BTA25-xxxBW

50 mA

Snubberless

RD-91

BTA25-xxxCW

35 mA

Snubberless

RD-91

BTA26-xxxB

50 mA

Standard

TOP3 Ins.

BTA26-xxxBW

50 mA

Snubberless

TOP3 Ins.

BTA26-xxxCW

35 mA

Snubberless

TOP3 Ins.

T2535-xxxG

35 mA

Snubberless

DPAK

600 V

800 V

BTB24-xxxB

BTA/BTB24-xxxBW

BTB: Non insulated TO-220AB package

ORDERING INFORMATION

BT A 24 -

600

BW

(RG)

TRIAC
SERIES
INSULATION:
A: insulated
B: non insulated

VOLTAGE:
600: 600V
800: 800V

SENSITIVITY & TYPE

B: 50mA STANDARD
BW: 50mA SNUBBERLESS
CW: 35mA SNUBBERLESS

PACKING MODE
Blank: Bulk
RG: Tube

CURRENT:
24: 25A in TO-220AB
25: 25A in Rd91
26: 25A in TOP3

3/9

BTA/BTB24, BTA25, BTA26 and T25 Series

T 25 35

600 G

(-TR)

TRIAC
SERIES
PACKAGE:
G: D2PAK

CURRENT: 25A

VOLTAGE:
600: 600V
800: 800V

PACKING MODE:
Blank: Tube
-TR: Tape & Reel

SENSITIVITY:
35: 35mA

OTHER INFORMATION
Part Number

Marking

Weight

Base
quantity

Packing
mode

BTA/BTB24-xxxyz

BTA/BTB24xxxyz

2.3 g

250

Bulk

BTA/BTB24-xxxyzRG

BTA/BTB24-xxxyz

2.3 g

50

Tube

BTA25-xxxyz

BTA25xxxyz

20 g

25

Bulk

BTA26-xxxyz

BTA26xxxyz

4.5 g

120

Bulk

T2535-xxxG

T2535xxxG

1.5 g

50

Tube

T2535-xxxG-TR

T2535xxxG

1.5 g

1000

Tape & reel

Note: xxx= voltage, y = sensitivity, z = type

4/9

BTA/BTB24, BTA25, BTA26 and T25 Series

Fig. 1: Maximum power dissipation versus RMS

on-state current (full cycle).

Fig. 2-1: RMS on-state current versus case

temperature (full cycle).

P (W)

IT(RMS) (A)

30

30

25

25

20

20

15

15

10

10

BTB/T25

BTA24

5
0

IT(RMS) (A)
0

10

15

BTA25/26

20

25

Fig. 2-2: DPAK RMS on-state current versus

ambient temperature (printed circuit board FR4,
copper thickness: 35 m), full cycle.

Tc(C)
0

25

50

75

100

125

Fig. 3: Relative variation of thermal impedance

versus pulse duration.

IT(RMS) (A)

K=[Zth/Rth]

4.0

1E+0
2

D PAK
(S=1cm2)

3.5

Zth(j-c)

3.0
1E-1

2.5

Zth(j-a)
BTA/BTB24/T25

2.0
1.5

1E-2
Zth(j-a)
BTA26

1.0
0.5
0.0

tp (s)

Tamb(C)
0

25

Fig. 4:
values).

50

75

100

125

On-state characteristics (maximum

1E-3
1E-3

1E-1

1E+0

1E+1

1E+2 5E+2

Fig. 5: Surge peak on-state current versus

number of cycles.

ITM (A)

ITSM (A)

300
100

1E-2

300
250

Tj max

t=20ms

One cycle

Non repetitive
Tj initial=25C

200
150

10

Repetitive
Tc=75C

Tj=25C

100
Tj max.
Vto = 0.85 V
Rd = 16 m

VTM (V)
1
0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

50
Number of cycles

4.5

10

100

1000

5/9

BTA/BTB24, BTA25, BTA26 and T25 Series

Fig. 6: Non-repetitive surge peak on-state

current for a sinusoidal pulse with width
tp < 10ms, and corresponding value of It.

Fig. 7: Relative variation of gate trigger current,

holding current and latching current versus
junction temperature (typical values).
IGT,IH,IL[Tj] / IGT,IH,IL [Tj=25C]

ITSM (A), It (As)

2.5

3000
Tj initial=25C

1000

2.0

dI/dt limitation:
50A/s

IGT

1.5
IH & IL
ITSM

1.0
0.5

It

Tj(C)

tp (ms)
100
0.01

0.10

1.00

10.00

Fig. 8: Relative variation of critical rate of

decrease of main current versus (dV/dt)c (typical
values).

100.0

50
40
30
20
S(cm)

6/9

20

24

28

100

120

140

Fig. 9: Relative variation of critical rate of

decrease of main current versus junction
temperature.

60

16

80

DPAK

12

60

70

40

Rth(j-a) (C/W)

20

80

Fig. 10: DPAK Thermal resistance junction to

ambient versus copper surface under tab (printed
circuit board FR4, copper thickness: 35 m).

-20

(dI/dt)c [Tj] / (dI/dt)c [Tj specified]

(dI/dt)c [(dV/dt)c] / Specified (dI/dt)c

2.4
2.2
2.0
1.8
1.6
BW/CW/T2535
1.4
B
1.2
1.0
0.8
0.6
(dV/dt)c (V/s)
0.4
0.1
1.0
10.0

10

0.0
-40

32

36

40

Tj (C)
0

25

50

75

100

125

BTA/BTB24, BTA25, BTA26 and T25 Series

PACKAGE MECHANICAL DATA
DPAK (Plastic)
DIMENSIONS
REF.

A
E

Min.

C2

L2

D
L
L3
A1
B2

Millimeters

B
G
A2
2.0 MIN.
FLAT ZONE
V2

A
A1
A2
B
B2
C
C2
D
E
G
L
L2
L3
R
V2

4.30
2.49
0.03
0.70
1.25
0.45
1.21
8.95
10.00
4.88
15.00
1.27
1.40

Typ.

Min.

Typ.

Max.

4.60
2.69
0.23
0.93

1.40

0.40
0

Max.

Inches

0.169
0.181
0.098
0.106
0.001
0.009
0.027
0.037
0.048 0.055
0.60 0.017
0.024
1.36 0.047
0.054
9.35 0.352
0.368
10.28 0.393
0.405
5.28 0.192
0.208
15.85 0.590
0.624
1.40 0.050
0.055
1.75 0.055
0.069
0.016
8
0
8

FOOTPRINT DIMENSIONS (in millimeters)

DPAK (Plastic)
16.90

10.30

5.08
1.30

3.70
8.90

7/9

BTA/BTB24, BTA25, BTA26 and T25 Series

PACKAGE MECHANICAL DATA
RD91 (Plastic)
DIMENSIONS
L2

A2

L1

REF.

Millimeters
Min.

B2
B1

C2

C1
A1

N2

N1
B
F

E3
I
A

A
A1
A2
B
B1
B2
C
C1
C2
E3
F
I
L1
L2
N1
N2

Max.
40.00
30.30
22.00
27.00
16.50
24.00
14.00
3.50
3.00
0.90
4.50
13.60
3.50
1.90
43
38

29.90

13.50

1.95
0.70
4.00
11.20
3.10
1.70
33
28

Inches
Min.

Max.
1.575
1.193
0.867
1.063
0.650
0.945
0.551
0.138
0.118
0.035
0.177
0.535
0.138
0.075
43
38

1.177

0.531

0.077
0.027
0.157
0.441
0.122
0.067
33
28

PACKAGE MECHANICAL DATA

TOP3 (Plastic)
DIMENSIONS
REF.

Millimeters
Min.

A
B
C
D
E
F
G
H
J
K
L
P
R

8/9

Typ.

4.4
1.45
14.35
0.5
2.7
15.8
20.4
15.1
5.4
3.4
4.08
1.20
4.60

Inches

Max.

Min.

4.6
1.55
15.60
0.7
2.9
16.5
21.1
15.5
5.65
3.65
4.17
1.40

0.173
0.057
0.565
0.020
0.106
0.622
0.815
0.594
0.213
0.134
0.161
0.047

Typ.

Max.
0.181
0.061
0.614
0.028
0.114
0.650
0.831
0.610
0.222
0.144
0.164
0.055

0.181

BTA/BTB24, BTA25, BTA26 and T25 Series

PACKAGE MECHANICAL DATA
TO-220AB (Plastic)
DIMENSIONS
B

REF.

Millimeters

Inches

b2

Min.
L
F
I
A

l4

c2

a1

l3
l2
a2

b1

M
c1

A
a1
a2
B
b1
b2
C
c1
c2
e
F
I
I4
L
l2
l3
M

Typ.

15.20

Max.

Min.

Typ.

15.90 0.598
3.75

Max.
0.625

0.147

13.00
14.00 0.511
0.551
10.00
10.40 0.393
0.409
0.61
0.88 0.024
0.034
1.23
1.32 0.048
0.051
4.40
4.60 0.173
0.181
0.49
0.70 0.019
0.027
2.40
2.72 0.094
0.107
2.40
2.70 0.094
0.106
6.20
6.60 0.244
0.259
3.75
3.85 0.147
0.151
15.80 16.40 16.80 0.622 0.646 0.661
2.65
2.95 0.104
0.116
1.14
1.70 0.044
0.066
1.14
1.70 0.044
0.066
2.60
0.102

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of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
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