Service Manual LG L177ws

Website:http://biz.LGservice.
com
COLOR MONITOR
SERVICE MANUAL
CHASSIS NO. : LM76D
MODEL:
L177WSB (L177WSB-*FS.K***AP*)
) **Same model for Service
CAUTION
BEFORE SERVICING THE UNIT,

READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
Downloaded from www.Manualslib.com manuals search engine
CONTENTS
SPECIFICATIONS ................................................... 2
PRECAUTIONS ....................................................... 3
TIMING CHART ....................................................... 7
DISASSEMBLY ........................................................ 8
BLOCK DIAGRAM...................................................10
DISCRIPTION OF BLOCK DIAGRAM .................. 11
ADJUSTMENT ...................................................... 13
SERVICE OSD ........................................................14

TROUBLESHOOTING GUIDE .............................. 15
WIRING DIAGRAM ............................................... 21
EXPLODED VIEW...................................................22
REPLACEMENT PARTS LIST ...............................24
SCHEMATIC DIAGRAM ......................................... 26
SPECIFICATIONS
4. Max. Resolution
D-sub Analog
1. LCD CHARACTERISTICS
Type
: TFT Color LCD Module
Active Display Area
Pixel Pitch
Color Depth
Size
Electrical Interface
Surface Treatment
Operating Mode
Backlight Unit
: 17 inch
: 0.255 (H) x 0.255 (V)
: 8bits, 16.2M colors

: 254.5 (H) x 389.2 (W) x 11.5(D)
5. POWER SUPPLY
5-1. Power : AC 100~240V, 50/60Hz , 0.8A
5-2. Power Consumption
MODE
: LVDS
: Hard-coating(3H), Anti-Glare
POWER ON (NORMAL)
: Normally White, Transmissive mode
: 2-CCFL
2. OPTICAL CHARACTERISTICS
2-1. Viewing Angle by Contrast Ratio
10
Left : -70 min., -80(Typ) Right : +70 min., +80(Typ)

Top :+60 min., +75(Typ) Bottom : -70 min., -85(Typ)
2-2. Luminance
: 175(min), 250(Typ) (Full White pattern, 0.70V) -6500K

: 110(min) (Full White pattern, 0.70V) -9300K
75%(min)
2-3. Contrast Ratio
: 5000:1 (DFC)
3. SIGNAL (Refer to the Timing Chart)

3-1. Sync Signal
Type
: Separate Sync, SOG
3-2. Video Input Signal
1) Type
2) Voltage Level
a) Color 0, 0
b) Color 7, 0
c) Color 15, 0
3) Input Impedance
: R, G, B Analog
: 0~0.71 V
: 0 Vp-p
: 0.467Vp-p
: 0.714Vp-p
: 75
H/V SYNC VIDEO POWER CONSUMPTION LED COLOR

ON/ON ACTIVE
less than 27 W
BLUE
STAND-BY
OFF/ON
OFF
less than 1 W
AMBER
SUSPEND
ON/OFF
OFF
less than 1 W
AMBER
DPMS OFF
OFF/OFF OFF
less than 1 W
AMBER
less than 1 W
OFF
POWER S/W Off
6. ENVIRONMENT
6-1. Operating Temperature : 10C~35C (50F~95F)
(Ambient)
6-2. Relative Humidity
: 10%~80% (Non-condensing)
6-3. MTBF
: 50,000 HRS with 90% Confidence
Lamp Life
: 50,000 Hours(Min)
7. DIMENSIONS (with TILT/SWIVEL)
Width
Depth
Height
: 409.3 mm (16.11'')
: 204.0 mm (8.03'')
: 362.0mm (14.25'')
8. WEIGHT (with TILT/SWIVEL)

Net. Weight
Gross Weight
3-3. Operating Frequency

Horizontal
: 30 ~ 83kHz
Vertical
: 56 ~ 75Hz
-2Downloaded from www.Manualslib.com manuals search engine
: 1440 x 900@75Hz
: 2.8 kg (6.17 lbs)

: 4.0 kg (8.82 lbs)
PRECAUTION
WARNING FOR THE SAFETY-RELATED COMPONENT.
WARNING
There are some special components used in LCD

monitor that are important for safety. These parts are
marked on the schematic diagram and the
replacement parts list. It is essential that these critical
parts should be replaced with the manufacturers
specified parts to prevent electric shock, fire or other
hazard.
Do not modify original design without obtaining written
permission from manufacturer or you will void the
original parts and labor guarantee.
BE CAREFUL ELECTRIC SHOCK !

If you want to replace with the new backlight (CCFL) or
inverter circuit, must disconnect the AC adapter
because high voltage appears at inverter circuit about
650Vrms.
Handle with care wires or connectors of the inverter
circuit. If the wires are pressed cause short and may
burn or take fire.
Leakage Current Hot Check Circuit
TAKE CARE DURING HANDLING THE LCD MODULE

WITH BACKLIGHT UNIT.
AC Volt-meter
Must mount the module using mounting holes arranged

in four corners.
Do not press on the panel, edge of the frame strongly
or electric shock as this will result in damage to the
screen.
Do not scratch or press on the panel with any sharp
objects, such as pencil or pen as this may result in
damage to the panel.
Protect the module from the ESD as it may damage the
electronic circuit (C-MOS).
Make certain that treatment persons body are
grounded through wrist band.
Do not leave the module in high temperature and in
areas of high humidity for a long time.
The module not be exposed to the direct sunlight.
Avoid contact with water as it may a short circuit within
the module.
If the surface of panel become dirty, please wipe it off
with a softmaterial. (Cleaning with a dirty or rough cloth
may damage the panel.)
CAUTION
Please use only a plastic screwdriver to protect yourself
from shock hazard during service operation.
Good Earth Ground

such as WATER PIPE,
CONDUIT etc.
To Instruments
exposed
METALLIC PARTS
1.5 Kohm/10W
SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this
service manual and its supplements and addenda, read
and follow the SAFETY PRECAUTIONS on page 3 of this
publication.
NOTE: If unforeseen circumstances create conflict
between the following servicing precautions and any of the
safety precautions on page 3 of this publication, always
follow the safety precautions. Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC
power source before;
a. Removing or reinstalling any component, circuit
board module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical
plug or other electrical connection.
c. Connecting a test substitute in parallel with an
electrolytic capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect
polarity installation of electrolytic capacitors may
result in an explosion hazard.
d. Discharging the picture tube anode.
2. Test high voltage only by measuring it with an
appropriate high voltage meter or other voltage
measuring device (DVM, FETVOM, etc) equipped with
a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Discharge the picture tube anode only by (a) first
connecting one end of an insulated clip lead to the
degaussing or kine aquadag grounding system shield
at the point where the picture tube socket ground lead
is connected, and then (b) touch the other end of the
insulated clip lead to the picture tube anode button,
using an insulating handle to avoid personal contact
with high voltage.
4. Do not spray chemicals on or near this receiver or any
of its assemblies.
5. Unless specified otherwise in this service manual,
clean electrical contacts only by applying the following
mixture to the contacts with a pipe cleaner, cottontipped stick or comparable non-abrasive applicator;
10% (by volume) Acetone and 90% (by volume)
isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual,
lubrication of contacts in not required.
6. Do not defeat any plug/socket B+ voltage interlocks
with which receivers covered by this service manual
might be equipped.
7. Do not apply AC power to this instrument and/or any of
its electrical assemblies unless all solid-state device
heat sinks are correctly installed.
8. Always connect the test receiver ground lead to the
receiver chassis ground before connecting the test
receiver positive lead.
Always remove the test receiver ground lead last.
9. Use with this receiver only the test fixtures specified in

this service manual.
CAUTION: Do not connect the test fixture ground strap
to any heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be
damaged easily by static electricity. Such components
commonly are called Electrostatically Sensitive (ES)
Devices. Examples of typical ES devices are integrated
circuits and some field-effect transistors and
semiconductor "chip" components. The following
techniques should be used to help reduce the incidence of
component damage caused by static by static electricity.
1. Immediately before handling any semiconductor
component or semiconductor-equipped assembly, drain
off any electrostatic charge on your body by touching a
known earth ground. Alternatively, obtain and wear a
commercially available discharging wrist strap device,
which should be removed to prevent potential shock
reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with
ES devices, place the assembly on a conductive
surface such as aluminum foil, to prevent electrostatic
charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or
unsolder ES devices.
4. Use only an anti-static type solder removal device.
Some solder removal devices not classified as "antistatic" can generate electrical charges sufficient to
damage ES devices.
5. Do not use freon-propelled chemicals. These can
generate electrical charges sufficient to damage ES
devices.
6. Do not remove a replacement ES device from its
protective package until immediately before you are
ready to install it. (Most replacement ES devices are
packaged with leads electrically shorted together by
conductive foam, aluminum foil or comparable
conductive material).
7. Immediately before removing the protective material
from the leads of a replacement ES device, touch the
protective material to the chassis or circuit assembly
into which the device will be installed.
CAUTION: Be sure no power is applied to the chassis
or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion
such as the brushing together of your clothes fabric or
the lifting of your foot from a carpeted floor can
generate static electricity sufficient to damage an ES
device.)
General Soldering Guidelines

1. Use a grounded-tip, low-wattage soldering iron and
appropriate tip size and shape that will maintain tip
temperature within the range or 500 F to 600 F.
2. Use an appropriate gauge of RMA resin-core solder
composed of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a
mall wire-bristle (0.5 inch, or 1.25cm) brush with a
metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal
temperature.
(500 F to 600 F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static,
suction-type solder removal device or with solder
braid.
CAUTION: Work quickly to avoid overheating the
circuitboard printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal
temperature (500 F to 600 F)
b. First, hold the soldering iron tip and solder the strand
against the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of
the component lead and the printed circuit foil, and
hold it there only until the solder flows onto and
around both the component lead and the foil.
CAUTION: Work quickly to avoid overheating the
circuit board printed foil.
d. Closely inspect the solder area and remove any
excess or splashed solder with a small wire-bristle
brush.
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong)
through which the IC leads are inserted and then bent flat
against the circuit foil. When holes are the slotted type,
the following technique should be used to remove and
replace the IC. When working with boards using the
familiar round hole, use the standard technique as
outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation
by gently prying up on the lead with the soldering iron
tip as the solder melts.
2. Draw away the melted solder with an anti-static
suction-type solder removal device (or with solder
braid) before removing the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad
and solder it.
3. Clean the soldered areas with a small wire-bristle
brush. (It is not necessary to reapply acrylic coating to
the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as
close as possible to the component body.
2. Bend into a "U" shape the end of each of three leads
remaining on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the
corresponding leads extending from the circuit board
and crimp the "U" with long nose pliers to insure metal
to metal contact then solder each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor
leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the
circuit board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close
as possible to diode body.
2. Bend the two remaining leads perpendicular y to the
circuit board.
3. Observing diode polarity, wrap each lead of the new
diode around the corresponding lead on the circuit
board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder
joints of the two "original" leads. If they are not shiny,
reheat them and if necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board
hollow stake.
2. Securely crimp the leads of replacement component
around notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the
replaced component and adjacent components and the
circuit board to prevent excessive component
temperatures.
Circuit Board Foil Repair

Excessive heat applied to the copper foil of any printed
circuit board will weaken the adhesive that bonds the foil
to the circuit board causing the foil to separate from or
"lift-off" the board. The following guidelines and
procedures should be followed whenever this condition is
encountered.
At IC Connections
To repair a defective copper pattern at IC connections use
the following procedure to install a jumper wire on the
copper pattern side of the circuit board. (Use this
technique only on IC connections).
1. Carefully remove the damaged copper pattern with a
sharp knife. (Remove only as much copper as
absolutely necessary).
2. carefully scratch away the solder resist and acrylic
coating (if used) from the end of the remaining copper
pattern.
3. Bend a small "U" in one end of a small gauge jumper
wire and carefully crimp it around the IC pin. Solder the
IC connection.
4. Route the jumper wire along the path of the out-away
copper pattern and let it overlap the previously scraped
end of the good copper pattern. Solder the overlapped
area and clip off any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper
pattern at connections other than IC Pins. This technique
involves the installation of a jumper wire on the
component side of the circuit board.
1. Remove the defective copper pattern with a sharp
knife.
Remove at least 1/4 inch of copper, to ensure that a
hazardous condition will not exist if the jumper wire
opens.
2. Trace along the copper pattern from both sides of the
pattern break and locate the nearest component that is
directly connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead
of the nearest component on one side of the pattern
break to the lead of the nearest component on the
other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is
dressed so the it does not touch components or sharp
edges.
TIMING CHART
VIDEO
A
E
D
SYNC
C
DOT
mode
section
polarity
CL O CK
[MHz]
10
11
12
H(P ixels)
V( Lines)
H(P ixels )
V( Lines)
H(P ixels )
V( Lines)
H(P ixels )
V( Lines)
H(P ixels )
V( Lines)
H(P ixels)
V(Lines)
H(P ixels)
+/-
V(Lines)
+/-
H(P ixels)
V(Lines)
H(P ixels)
V(Lines)
H(P ixels)
+/-
V(Lines)
+/-
H(P ixels)
+/-
V(Lines)
+/-
H(P ixels)
V(Lines)
25.175
28.321
25.175
31.5
40.0
49.5
57.283
65.0
78.75
100.0
92.978
108.0
Front
Syn c
Back
Resol -
Porch
Porch
ution
(D)
(C )
(B)
640
16
96
48
640
449
350
37
60
350
900
720
18
108
54
720
Freque n cy
Total
[kHz] /[Hz]
Period (E ) (A)
31.469
800
70.09
31.468
70.08
449
400
12
35
400
31.469
800
640
16
96
48
640
59.94
525
480
10
33
480
37.5
840
640
16
64
120
640
75
500
480
16
480
37.879
1056
800
40
128
88
800
60.317
628
600
23
600
46.875
1056
800
16
80
160
800
75.0
625
600
21
600
49.725
1152
832
32
64
224
832
74.55
667
624
39
624
48.363
1344
1024
24
136
160
1024
60.0
806
768
29
768
60.123
1312
1024
16
96
176
1024
75.029
800
768
28
768
68.681
1456
1152
32
128
144
1152
75.062
915
870
39
870
61.805
1504
1152
18
134
200
1152
65.96
937
900
31
900
63.981
1688
1280
48
112
248
1280
60.02
1066
1024
38
1024
Display
DISASSEMBLY
1. Put a cushion or soft cloth on a flat
2. Place the monitor face down on
surface.
the cushion or soft cloth.
3. Slide the Cable Deco Cover out from the stand body.
4. Nip Latch inside, Take off the stand base from stand body.
5. Please pull the stand body lightly
6. Remove the screws.
to separate it from the hinge body.
7. Pull the front cover upward,then separate all the latches.
8. Place the monitor face down,then disassemble back cover.
Filter
-912V
1. 8V
3.3V
12V
5V
Inverter( 2Lamps )
LIPS
Analog(Vsync/Hsync)
Analog(R/G/B)
OSD
5V
Crystal
Clock
Generator
1.8V
3. 3 V
14.318MHz
Regulator
3. 3 V
EEPROM
(System)
SDATA
/SCLK
Dual
Interface
Engine
Display
Processing
Engine
interface
LVDS
1440*900@60Hz
3.3V
Flash ROM
MCU
LVDS
Panel
Interface
Module
KEY
TSUMU58CWHL
BLOCK DIAGRAM
D-Sub
Main Board
(Scaler &
DC DC
converter)
Module Vcc
- 10 L
Line Filter
Start
Power
Control
IC
Drive
Aux
Dimming (Lamp Current Control)
Inverter On/OFF (3.3V)
12V
5V
POWER
Feedback
SMPS
5V
12V
Inverter
Control
IC
Drive Block
N-ch
P-ch
13V
INVERTER
Lamp
Current
Feedback
Inverter
Trans
Over
Voltage
Protection
Low
LAMP
High
BLOCK DIAGRAM-POWER
DESCRIPTION OF BLOCK DIAGRAM

1. Video Controller Part.
This part amplifies the level of video signal for the digital conversion and converts from the analog video signal to the
digital video signal using a pixel clock.
The pixel clock for each mode is generated by the PLL.
The range of the pixel clock is from 25MHz to 136MHz.
This part consists of the Scaler, ADC convertor, TMDS receiver and LVDS transmitter.
The Scaler gets the video signal converted analog to digital, interpolates input to 1440 X 900 resolution signal and
outputs 8-bit R, G, B signal to transmitter.
2. Power Part.
This part consists of the one 3.3V, and one 1.8V regulators to convert power which is provided 5V in Power board.
12V is provided for inverter, 5V is provided for LCD panel.
Also, 5V is converted 3.3V and 1.8V by regulator. Converted power is provided for IC in the main board.
The inverter converts from DC12V to AC 700Vrms and operates back-light lamps of module.
3. MICOM Part.
This part is include video controller part. And this part consists of EEPROM IC which stores control data, Reset IC and
the Micom.
The Micom distinguishes polarity and frequency of the H/V sync are supplied from signal cable.
The controlled data of each modes is stored in EEPROM.
- 11 Downloaded from www.Manualslib.com manuals search engine
LIPS Board Block Diagram
12V
50 ~ 60Hz
LINE
100 ~ 240V
EMI
COMPONENTS
INPUT RECTIFIER
AND FILTER
HVDC
SWITCHING
TRANSFORMER
100KHz
OUTPUT RECTIFIER
AND FILTER
5V
GND
PWM CONTROL
CIRCUIT
PHOTO-COUPLER
ISOLATION
PRIMARY
12V
SIGNAL
COLLENTION
SECONDARY
INVERTER CIRCUIT
High Voltage
Operation description_LIPS
1. EMI components.
This part contains of EMI components to comply with global marketing EMI standards like FCC,VCCI CISPR, the
circuit included a line-filter, across line capacitor and of course the primary protection fuse.
2. Input rectifier and filter.
This part function is for transfer the input AC voltage to a DC voltage through a bridge rectifier and a bulk capacitor.
3. Energy Transfer.
This part function is for transfer the primary energy to secondary through a power transformer.
4. Output rectifier and filter.
This part function is to make a pulse width modulation control and to provide the driver signal to power switch, to
adjust the duty cycle during different AC input and output loading condition to achieve the dc output stabilized, and
also the over power protection is also monitor by this part.
5. Photo-Coupler isolation.
This part function is to feed back the DC output changing status through a photo transistor to primary controller to
achieve the stabilized DC output voltage.
6. Signal collection.
This part function is to collect the any change from the DC output and feed back to the primary through photo
transistor.
ADJUSTMENT
Windows EDID V1.0 User Manual
2. EDID Read & Write

1) Run WinEDID.exe
Operating System: MS Windows 98, 2000, XP

Port Setup: Windows 98 => Dont need setup
Windows 2000, XP => Need to Port Setup.
This program is available to LCD Monitor only.
1. Port Setup
a) Copy UserPort.sys file to
c:\WINNT\system32\drivers folder
b) Run Userport.exe
2) Edit Week of Manufacture, Year of Manufacture,

Serial Number
a) Input User Info Data
b) Click Update button
c) Click Write button
c) Remove all default number

d) Add 300-3FF
e) Click Start button.

f) Click Exit button.
SERVICE OSD
1) Turn off the power switch at the front side of the display.
2) Wait for about 5 seconds and press MENU, POWER switch with 1 second interval.
3) The SVC OSD menu contains additional menus that the User OSD menu as described below.
a) Auto Color : W/B balance and Automatically sets the gain and offset value.
b) NVRAM INIT : EEPROM initialize.(24C08)
c) CLEAR ETI : To initialize using time.
d) AGING : Select Aging mode(on/off).
e) R/G/B-9300K : Allows you to set the R/G/B-9300K value manually.
f) R/G/B-6500K : Allows you to set the R/G/B-6500K value manually.
g) R/G/B-Offset : Allows you to set the R/G/B-Offset value manually.(Analog Only)
h) R/G/B-Gain : Allows you to set the R/G/B-Gain value manually.(Analog Only)
i) MODULE : To select applied module.
A
BM
Compatible PC
Video Signal
Generator
15
d
se
RS
23
No
2C
tu
PARALLEL POR
AL
LE
5V
PA
R
OFF
ON
Power inlet (required)

Power Select Switch
(110V/220V)
Power LED
PO
S
MO
N
IT
OR
YN
CS
T
WE
R
VG
E S Switch
OFF
V-Sync On/O Switch

(Switch must be ON )
Figure 1. Cable Connection
ON
V-S
Control Line
11
6
TROUBLESHOOTING GUIDE
1. NO POWER - MAIN
NO POWER
(POWER INDICATOR OFF)
CHECK J703
VOLTAGE
PIN5, PIN6 (5V)?
NO
CHECK POWER BOARD,

AND FIND OUT A SHORT
POINT AS OPENING
EACH POWER LINE
YES
CHECK
U601 PIN2 VOLTAGE
(3.3V) ?
NO
CHECK 3.3V LINE

(OPEN CHECK)
NO PROBLEM
YES
CHECK KEY CONTROL
CONNECTOR ROUTINE
IS U201
PIN75 (3.3V)
VOLTAGE ?
NO
CHECK 3.3V LINE
YES
CHECK U201 PIN 96

PULSE
NO
YES
CHECK U201
Waveforms
1
U201-#96
CHECK X-TAL
2. NO RASTER (OSD IS NOT DISPLAYED) LIPS
NO RASTER
(OSD IS NOT DISPLAYED)
J703
PIN5, PIN6
5V?
NO
CHECK POWER BOARD,

AND FIND OUT A SHORT
POINT AS OPENING EACH
POWER LINE
YES
J703 PIN9
5V?
NO
CHECK MICOM INV

ON/OFF PORT.
YES
J703 PIN10
5V?
NO
1. CONFIRM BRIGHTNESS
OSD CONTRL STATE.
2. CHECK MICOM DIM-ADJ
PORT
YES
CHECK
PULSE AS
CONTACTING SCOPE
PROBE TO CAUTION LABEL.
(CONTACT PROBE TO
CAUTION LABEL.
CAN YOU SEE PULSE
AT YOUR
SCOPE?
NO
YES
REPLACE CCFL LAMP

IN THE LCD MODULE
LIPS
3. NO RASTER (OSD IS NOT DISPLAYED) MAIN
NO RASTER
(OSD IS NOT DISPLAYED)
U201
PIN 16, 75
3.3V?
NO
CHECK U601
YES
U201
PIN96, 97
OSCILLATE AS
14.31MHZ?
1. CHECK C509, C510

SOLDERING CONDITION
2. CHECK X501
3. TROUBLE IN U201
NO
YES
U201
PIN27 IS 48KHz H-SYNC?
PIN28 IS 60Hz V-SYNC?
IS PULSE APPEARED
AT SIGNAL PINS?
AT MODE 12?
CHECK CONNECTION
LINE FROM D-SUB TO
U201
NO
YES
TROUBLE IN CABLE
OR LCD MODULE
Waveforms
1
U201-#96, 97
U201-#27 H-SYNC
U201-#28 V-SYNC
4. TROUBLE IN DPM - MAIN
TROUBLE IN DPM
NO
CHECK
R730, R731
CHECK PC
PC IS NOT GOING
INTO DPM OFF MODE
YES
CHECK
U201 PIN 27,28
SYNC PULSE ?
NO
YES
TROUBLE IN U201
Waveforms
3
R442 H-Sync
R443 V-Sync
CHECK H/V SYNC LINE
5. POWER - LIPS
NO POWER
(POWER INDICATOR OFF)
CHECK
Fuse F101 OK?
NO
Troub e n Fuse (F101)
YES
CHECK
C101 Voltage
(AC110V->160Vdc
(AC220V->304Vdc
NO
Check BD101
YES
Check IC101
PIN5 Voltage
NO
Troub e n IC101
YES
Check D201, D202

Voltage
NO
YES
CHECK 5V, 12V L ne
Troub e n D201, D202
6. Raster - LIPS
NO Raster
(Lamp Off)
CHECK
P201 Pin9
3.3V?
NO
Check Scaler Output

(Main Board)
YES
Check IC301 Pin2

5V?
NO
Check Q301, Q302
YES
Check U301 Pin6 VSEN,

Less than 3V
NO
Check the waveform of U301

Pin1, 15
NO
Check the waveform of U301

Pin2, 3
YES
Check U301 Pin12 SSTCMT,

Less than 1V
If waveform is no problem
Check U301
Drain waveform
NO
YES
CHECK T301
Check D304
Or Trouble in U301
WIRING DIAGRAM
30P
11P
6631T20023J
6P
6631900030F
4P
6631V12031H
EAD37413101
310
300
500
200
430
910
930
520
900
510
920
410
420
400
EXPLODED VIEW
- 22 -
EXPLODED VIEW PARTS LIST

Ref. No.
200
300
310
Part No.
Description
EAJ38936201
LCD,Module-TFT,LM171WX3-TLA1 WXGA 17.1INCH 1280X720 250CD COLOR 60% 16/10

800:1 LPL 17"W response time :8ms,P4,Color Depth:16.7M. Viewing Angle:160/160 LG PHILIPS LCD
EAJ39167201
LCD,Module-TFT,HSD170MGW1-B00 WXGA 17.0INCH 1440X900 250CD COLOR 63% 16/10 600:1 Hannstar
17"W ZBD, 2CCFL(Edge type),16.2M, Viewing Angle 80/80/80/80. Non-Glare. HANNSTAR DISPLAY CORPORATION
EAJ39167202
LCD,Module-TFT,HSD170MGW1- B00 WXGA 17.0INCH 1440X900 250CD COLOR 63% 16/10 600:1 Hannstar
17"W Non-ZBD, 2CCFL(Edge type),16.2M, Viewing Angle 80/80/80/80, Non-Glare HANNSTAR DISPLAY CORPORATION
EAJ39167203
LCD,Module-TFT,HSD170MGW1-B01 WXGA 17.0INCH 1440X900 250CD COLOR 63% 16/10 600:1 Hannstar 17"W, ZBD,
2CCFL(Edge type),16 2M, Viewing Angle 80/80/80/80. Non-Glare. Source/Gate IC : Novatek. HANNSTAR DISPLAY CORPORATION
EAJ39167204
LCD,Module-TFT,HSD170MGW1- B01 WXGA 17.0 NCH 1440X900 250CD COLOR 63% 16/10 600:1 Hannstar 17"W Non-ZBD,
2CCFL(Edge type),16.2M, Viewing Angle 80/80/80/80. Non-Glare.Source/Gate IC : Novatek HANNSTAR DISPLAY CORPORATION
ABJ34560301
Cabinet Assembly,L177WSB . 17" Cabinet Assy black NT local
Lens,MOLD PMMA SAMSUNG TECHWIN LENS Lx72 / Lx7w lens ,

MFB38581401 power LED Knob Double injection Power LED for L1972, Lxx7W
MFB38581403
Lens,MOLD PMMA SAMSUNG TECHWIN LENS Lx72 / Lx7w lens ,

power LED Knob Double injection Power LED for L1972, Lxx7W-"01" for CKD
400
ACQ34560801 Cover Assembly,Rear,L177WSB . 17" Back cover Assy Black NT local
410
ADV33844405 Frame Assembly,L177WSB . 17" L177WSB REAR FRAME ASSY LPL-HSD
420
MAZ40651001 Bracket,PRESS SBHG 0.6T BRACKET L177WSB - SBHG L177WSB Metal Bracket HSD
MAZ39062501 Bracket,PRESS SBHG 0.6 BRACKET L177W - SBHG L177W Metal Bracket
430
MDQ39702401 Frame,PRESS SPTE 0.3t L177WSB. SUS L177WSB Lamp Wire Shield(Metal) Set
500
EBR38509601
Upper SMT PCB,CONTROL S.T - L177WS
510
EBR39262801
PCB Assembly,MAIN T.T S chassis L177WSB BFS
520
EAY38422101
Power Supply Assembly,FREE L177WS LCD Lianchang
900
ACQ33707104 Cover Assembly,L177WS/WSB LM57B 19" Cover, Hinge Assy, Normal Stand, L177W ND Local
910
MCK38601901 Cover,MOLD ABS L1954 ABS L1954 COVER, STAND BODY
920
MCK38602601 Cover,MOLD ABS L1954 ABS L1954, COVER CABLE
930
AAN33777301
Base Assembly,ASSY L177W - L177W Stand base Assy_black
REPLACEMENT PARTS LIST

DATE:2007.07.20
LOC NO.
PART NO.
DESCRIPTION/SPECIFICATION
LOC NO.
CAPACITORs
C502
C503
C504
C505
C506
C507
C508
C509
C510
C511
C512
C513
C514
C515
C516
C517
C518
C519
C520
C521
C522
C523
C524
C525
C526
C527
C601
C602
C603
C604
C605
C702
C703
C704
C705
C706
C720
C721
C722
C723
ICs
U201
U502
U503
U601
U602
DESCRIPTION/SPECIFICATON
TRANSISTORs
0CK473CK56A
0CK473CK56A
0CK473CK56A
0CK473CK56A
0CC102CK41A
0CK473CK56A
0CK473CK56A
0CC220CK41A
0CC220CK41A
0CK104CK56A
0CE106CF638
0CK104CK56A
0CK104CK56A
0CK104CK56A
0CK104CK56A
0CK104CK56A
0CK104CK56A
0CK104CK56A
0CK104CK56A
0CK104CK56A
0CK104CK56A
0CK104CK56A
0CK104CK56A
0CK104CK56A
0CK104CK56A
0CK104CK56A
0CE107EF610
0CK103CK51A
0CK475CC94A
0CE107EF610
0CE477EF638
0CK103CK51A
0CK103CK51A
0CK104CK56A
0CK105CD56A
0CC101CK41A
0CC680CK41A
0CC680CK41A
0CC680CK41A
0CC680CK41A
Capacitor,Ceramic,Chip,C1608X7R1H473KT 47nF
Capacitor,Ceramic,Chip,C1608C0G1H102JT 1nF
Capacitor,Ceramic,Chip,C1608C0G1H220JT 22pF
Capacitor,Ceramic,Chip,0603B104K500CT 100nF
Capacitor,AL,Radial,SHL5.0TP16VB10M 10uF
Capacitor,AL,Radial,KMG16VB100M 100uF 20
Capacitor,Ceramic,Chip,C1608Y5V0J475ZT 4.7u
Capacitor,AL,Radial,KMG16VB100M 100uF 20
Capacitor,AL,Radial,KMG5.0TP16VB470M 470
Capacitor,Ceramic,Chip,C1608X7R1A105KT 1uF
Capacitor,Ceramic,Chip,C1608C0G1H101JT 100p
0DSIH00018A
0DSIH00018A
0DSIH00018A
0DZ560009GB
0DZ560009GB
0DZ560009GB
0DZ560009GB
0DZ560009GB
0DZ560009GB
0DZ560009GB
0DZ560009GB
0DZ560009GB
0DZ560009GB
0DZ560009GB
0DZ560009GB
0DZ560009GB
Diode,Switching,ENKMC2837 T112 1.2V

Diode,Zener,BZT52C5V6S (F) 5.6V
EAN39545901
EAN37157001
0IMMR00203A
0IPMGA0010A
0IPMG00049A
IC,Protocol Controller,TSUMU58BWHL LF 0.3T

IC,Serial Flash Memory,W25X20VSNIG 2MBIT 25
IC,EEPROM,FM24C08 8KBIT 1KX8BI
IC,LDO Voltage Regulator,AZ1117H 3.3 4.75TO10
IC,LDO Voltage Regulator,AZ1117H
DIODEs
D711
D712
D713
ZD1
ZD2
ZD3
ZD4
ZD5
ZD6
ZD7
ZD705
ZD706
ZD707
ZD709
ZD710
ZD8
PART NO.
Q501
Q601
Q602
Q701
Q702
TR,Bipolar,2N3904S NPN 6V 60V 4

TR,Bipolar,2N3904S NPN 6V 60V 4
TR,Bipolar,KTA1273 PNP 5V 30V
TR,Bipolar,2N3906S RTK PNP 5V
TR,Bipolar,2N3906S RTK PNP 5V
RESISTORs
R1
R2
R3
R4
R5
R501
R502
R503
R504
R505
R506
R507
R508
R509
R510
R511
R512
R513
R514
R515
R516
R517
R518
R519
R520
R521
R522
R524
R525
R6
R601
R602
R603
R604
R605
R606
R607
R608
R701
R702
R703
R704
R705
R706
R707
R708
R709
R710
R711
R726
R727
R728
R729
R730
R731
R732
R733
R734
- 24 -
0TRKE80046A
0TRKE80046A
0TR127309AA
0TR390609DC
0TR390609DC
0RJ7501D677
0RJ7501D677
0RJ1201D677
0RJ1801D677
0RJ1201D677
0RJ0562D677
0RJ0562D677
0RJ0562D677
0RJ0562D677
0RJ1001D677
0RJ0562D677
0RJ0562D677
0RJ1002D677
0RJ3900D677
0RJ4700D677
0RJ2002D677
0RJ1002D677
0RJ1002D677
0RJ1002D677
0RJ1002D677
0RJ4701D677
0RJ4701D677
0RJ1000D677
0RJ4701D677
0RJ0332D677
0RJ0332D677
0RJ4701D677
0RJ0000D677
0RJ0000D677
0RJ1801D677
0RJ2001D677
0RJ3900D677
0RJ3900D677
0RJ1002D677
0RX0681K668
0RJ0000D677
0RH1002D622
0RJ1002D677
0RJ0000D677
0RJ4701D677
0RJ4701D677
0RJ1200D677
0RJ1200D677
0RJ1000D677
0RJ1000D677
0RJ1000D677
0RJ2001D677
0RJ4701D677
0RJ4701D677
0RJ4701D677
0RJ4701D677
0RJ0332D677
0RJ0000D677
0RJ0682D677
0RJ0682D677
0RJ0332D677
0RJ0752D677
0RJ0752D677
Resistor,Chip,MCR03EZPJ752 7.5KOHM
Resistor,Chip,MCR03EZPJ560 56OHM 5
Resistor,Chip,MCR03EZPJ102 1KOHM 5
Resistor,Chip,MCR03EZPJ103 10KOHM
Resistor,Chip,MCR03EZPJ391 390OHM
Resistor,Chip,MCR03EZPJ203. 20KOHM
Resistor,Chip,MCR03EZPJ000 0OHM 5%
Resistor,Metal Oxide Film,RSD02F36R80J
Resistor,Chip,MCR10EZHJ103 10KOHM
LOC NO.
R736
PART NO.
0RJ0752D677
LOC NO.
CONNECTORs
J1
J2
J404
J701
J703
J707
P2
SWITCHs
SW1
SW2
SW3
SW4
SW5
SW6
OTHERs
D1
X501
6602T12005E
6602T12005C
6630V90220E
6630G100316
6630V90220K
EAG37060101
6602T12004C
Connector,Wafer,12505WR 06A00 6P 1.2

Connector,Wafer,12505WR 04A00 4P 1.2
Connector,Wafer,TJC2004 6A 6P 2.0MM
Connector,DSUB,DZ11AA1 HVG PF D SUB
Connector,Wafer,TJC2004 11A 11P 2.0M
Connector,FFC/FPC/PIC,10031HR 30 30P 1.00M
Connector,Wafer,12505WS 04A00 4P 1.2
6600R00004C
6600R00004C
6600R00004C
6600R00004C
6600R00004C
6600R00004C
Switch,Tact,JTP1127WEM 1C1P 15VD

0DLGP0128AA
6212AA2001G
LED,Chip,GPTD1210YBC BLUE/YEL
Crystal,HLX U F 14.31818M 18
- 25 -
PART NO.
SCHEMATIC DIAGRAM
1. SCALER
2. POWER & WAFER
3. INVERTER
4. POWER
P/NO : MFL30290846
JULY. 2007
Printed in China

Service Manual LG L177ws

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Service Manual LG L177ws

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Website:http://biz.LGservice.

) **Same model for Service

BEFORE SERVICING THE UNIT,

Downloaded from www.Manualslib.com manuals search engine

SERVICE OSD ........................................................14

: 0.255 (H) x 0.255 (V)

: 8bits, 16.2M colors

: Normally White, Transmissive mode

Left : -70 min., -80(Typ) Right : +70 min., +80(Typ)

: 175(min), 250(Typ) (Full White pattern, 0.70V) -6500K

2-3. Contrast Ratio

3. SIGNAL (Refer to the Timing Chart)

H/V SYNC VIDEO POWER CONSUMPTION LED COLOR

POWER S/W Off

8. WEIGHT (with TILT/SWIVEL)

3-3. Operating Frequency

-2Downloaded from www.Manualslib.com manuals search engine

: 2.8 kg (6.17 lbs)

There are some special components used in LCD

BE CAREFUL ELECTRIC SHOCK !

Leakage Current Hot Check Circuit

TAKE CARE DURING HANDLING THE LCD MODULE

Must mount the module using mounting holes arranged

-3Downloaded from www.Manualslib.com manuals search engine

Good Earth Ground

9. Use with this receiver only the test fixtures specified in

-4Downloaded from www.Manualslib.com manuals search engine

General Soldering Guidelines

-5Downloaded from www.Manualslib.com manuals search engine

Circuit Board Foil Repair

-6Downloaded from www.Manualslib.com manuals search engine

-7Downloaded from www.Manualslib.com manuals search engine

2. Place the monitor face down on

the cushion or soft cloth.

5. Please pull the stand body lightly

6. Remove the screws.

to separate it from the hinge body.

7. Pull the front cover upward,then separate all the latches.

8. Place the monitor face down,then disassemble back cover.

-8Downloaded from www.Manualslib.com manuals search engine

Downloaded from www.Manualslib.com manuals search engine

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Dimming (Lamp Current Control)

Inverter On/OFF (3.3V)

DESCRIPTION OF BLOCK DIAGRAM

- 11 Downloaded from www.Manualslib.com manuals search engine

LIPS Board Block Diagram

- 12 Downloaded from www.Manualslib.com manuals search engine

2. EDID Read & Write

Operating System: MS Windows 98, 2000, XP

2) Edit Week of Manufacture, Year of Manufacture,

c) Remove all default number

e) Click Start button.

- 13 Downloaded from www.Manualslib.com manuals search engine

Power inlet (required)

V-Sync On/O Switch

Figure 1. Cable Connection

- 14 Downloaded from www.Manualslib.com manuals search engine

CHECK POWER BOARD,

CHECK 3.3V LINE

CHECK 3.3V LINE

CHECK U201 PIN 96

- 15 Downloaded from www.Manualslib.com manuals search engine