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Figure 1.
1
RDATA_VCC
WP/CD
VCC
RDAT3_GND
Pin configuration
DAT2_In
DAT2_Ex
DAT3_In
DAT3_Ex
GND
CMD_In
Applications
CMD_Ex
CLK_In
CLK_Ex
Mobile telephones,
DAT0_In
DAT0_Ex
Navigation systems
DAT1_In
DAT1_Ex
Portable devices.
Figure 2.
Description
Vcc
R12
R7 R8 R9
R10 R11
WP/CD
DAT2_In
R1
DAT2_Ex
DAT3_In
R2
DAT3_Ex
CMD_In
R3
CMD_Ex
CLK_In
R4
CLK_Ex
DAT0_In
R5
DAT0_Ex
R6
DAT1_Ex
DAT1_In
GND
R13
GND
November 2008
Rev 1
1/12
www.st.com
Characteristics
EMIF06-MSD02N16
Characteristics
Table 1.
Symbol
VPP
Tj
Parameter
Unit
8
12
125
2
kV
Top
- 30 to + 85
Tstg
- 55 to + 150
Table 2.
Symbol
Parameter
VBR
Breakdown voltage
IRM
VRM
Stand-off voltage
VCL
Clamping voltage
Rd
Dynamic resistance
IPP
RI/O
CLINE
IF
VBR
VCL
VF
VRM
IRM
IR
IPP
Test conditions
VBR
IR = 1 mA
IRM
VRM = 3 V
Min.
Typ.
Max.
Unit
200
nA
36
45
54
Pull-up resistors
80
90
100
R13
375
470
565
Cline
20
pF
2/12
Value
EMIF06-MSD02N16
Figure 3.
0.00
Characteristics
Figure 4.
dB
0.00
dB
-10.00
-20.00
-10.00
-30.00
-40.00
-50.00
-20.00
-60.00
-70.00
-80.00
-30.00
-90.00
-100.00
-40.00
-110.00
F (Hz)
-130.00
100.0k
1.0M
10.0M
100.0M
DAT0
DAT2
CLK
Figure 5.
F (Hz)
-120.00
-50.00
1.0G
-140.00
100.0k
1.0M
DAT2 -DAT3
DAT1
DAT3
CMD
10.0M
100.0M
DAT2 -DAT1
1.0G
55 V Max
IN
-41 V Max
OUT
39 V Max
-34 V Max
OUT
Figure 7.
Line capacitance versus reverse voltage applied on DATx and CMD line
CLINE(pF)
16
14
12
10
8
6
4
VLINE(V)
2
0
0.0
1.0
2.0
3.0
4.0
5.0
3/12
Application information
EMIF06-MSD02N16
Application information
The EMIF06-mSD02N16 is a dedicated interface device for micro SD card/T-Flash card in
mobile phones. The device provides:
2.1
ESD protection
EMI filterering
Pull-up resistors
ESD protection
Each pin is connected to a TVS diode able to withstand 12 kV on all pins except on
DATx_In, CMD_In and CLK_In.
2.2
EMI filtering
DATx, CMD and CLK lines are immunized against EMI radiations thanks to pi-filters. To
avoid any degradation of the signal integrity at high frequency, the total line capacitance
stays lower than 20 pF making the device compatible with a clock frequency up to 52 MHz.
2.3
Pull-up resistors
As recommended by the SD Specifications (Part 1 Physical Layer Version 2.00), all the data
lines DATx and the CMD line must be pulled-up with resistors of 10 to 100 k to avoid bus
floating not only in SD 4-bit mode but also in SD 1-bit and SPI mode.
For the EMIF06-MSD02N16 device the pull-up resistor value has been fixed at 90 k. This
value makes the EMIF06-MSD02N16 compatible with most of the level shifters that may be
used in the circuit including auto direction-sensing translators known to exhibit a weak
current output.
2.4
4/12
EMIF06-MSD02N16
Figure 8.
Application information
Mechanical card detection
V DD
Pull - up
resistor
Host
controller
GND
WP/CD
GND
Contact when
inserting the card
SD card
NC
Pin 1DAT2
Pin 2CD/DAT3
Pin 3CMD
Pin 4 VCC
Pin 5CLK
Pin 6GND
Figure 9.
Pin 7DAT0
NC
DAT2 Pin 1
CD/DAT3 Pin 2
CMD Pin 3
VCC Pin 4
CLK Pin 5
GND Pin 6
DAT0 Pin 7
DAT1 Pin 8
Pin 8DAT1
Top level
DAT3 pull-up
Card detect pull-up
Top level
DAT3 pull-up
Card detect pull-up
Bottom view
Top view
In case of electrical card detection, the user must add a pull-down on the circuit connected
to the CD/DAT3 pin of the micro-SD/T-Flash pin as shown in Figure 10.
Figure 10. Electrical card detection
Host
controller
DAT3 (CD)
Pull - down
resistor
GND
V DD
50 k
SD card
5/12
EMIF06-MSD02N16
NC
PinPin
4 VCC
4
PinPin
5 CLK
5
PinPin
6 GND
6
Pin
Pin
7DAT0
DAT0
7
PinPin
3 CMD
3
PinPin
8 DAT1
8
Pin
Pin
1DAT2
DAT2
1
PinPin
2 CD/DAT3
2
NC
DAT2
Pin
Pin
1 1
CD/DAT3
Pin2Pin 2
CMD
Pin
Pin
3 3
VCC
Pin
Pin
4 4
CLK
Pin
Pin
5 5
GND
Pin
Pin
6 6
DAT0
Pin
Pin
7 7
DAT1
Pin
Pin
8 8
Top level
DAT3 pull
pull- down
Top level
DAT3 pull -down
Bottom view
Top view
6/12
06 - MSD02
N16
EMIF06-MSD02N16
Package information
Package information
Millimeters
Inches
Min.
Typ.
Max.
Min.
Typ.
Max.
0.45
0.50
A1
0.00
0.15
0.20
b1
0.25
0.30
3.45
3.50
D2
2.70
2.80
1.15
1.20
E2
0.25
0.30
0.05 0.000
0.002
Pin 1
Index area
1
D
A1
M
E2
D2
L
k
1
b
0.40
0.016
0.20
0.008
L1
b1
0.20
0.25
L1
0.15
0.006
0.20
0.008
1.6
0.70
0.30
N6
2.30
0.45
0.40
0.20
7/12
Package information
EMIF06-MSD02N16
Note:
8/12
5.5 0.1
All dimensions in mm
1.75 0.1
12.00 0.3
3.70 0.1
0.80 0.1
1.55 0.05
4.00 0.1
2.00 0.1
N6
N6
1.70 0.1
N6
N6
N6
N6
4.00 0.1
Product marking may be rotated by 90 for assembly plant differentiation. In no case should
this product marking be used to orient the component for its placement on a PCB. Only pin 1
mark is to be used for this purpose.
EMIF06-MSD02N16
5.1
b)
2.
Reference design
a)
b)
Stencil opening for central exposed pad: Opening to footprint ratio is 50%.
c)
5 m
420 m
450 m
15 m
3.00
190 m
15 m
1.6
0.70
0.30
200 m
2.30
0.45
2800 m
300 m
200 m
50 m
2100 m
0.20
Footprint
50 m
350 m
0.40
350 m
Stencil window
Footprint
9/12
5.2
5.3
5.4
10/12
EMIF06-MSD02N16
Solder paste
1.
2.
3.
Offers a high tack force to resist component movement during high speed
4.
Placement
1.
2.
It is recommended to use the lead recognition capabilities of the placement system, not
the outline centering
3.
4.
3.5 N placement force is recommended. Too much placement force can lead to
squeezed out solder paste and cause solder joints to short. Too low placement force
can lead to insufficient contact between package and solder paste that could cause
open solder joints or badly centered packages.
5.
To improve the package placement accuracy, a bottom side optical control should be
performed with a high resolution tool.
6.
For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is
recommended during solder paste printing, pick and place and reflow soldering by
using optimized tools.
To control the solder paste amount, the closed via is recommended instead of open
vias.
2.
The position of tracks and open vias in the solder area should be well balanced. The
symmetrical layout is recommended, in case any tilt phenomena caused by
asymmetrical solder paste amount due to the solder flow away.
EMIF06-MSD02N16
5.5
Ordering information
Reflow profile
Figure 18. ST ECOPACK recommended soldering reflow profile for PCB mounting
Temperature (C)
260C max
255C
220C
180C
125 C
2C/s recommended
2C/s recommended
6C/s max
6C/s max
3C/s max
3C/s max
0
0
90 to 150 sec
7
Time (min)
10-30 sec
90 sec max
Note:
Minimize air convection currents in the reflow oven to avoid component movement.
Ordering information
Table 4.
Ordering information
Order code
Marking
Package
Weight
Base qty
Delivery mode
EMIF06-MSDN16
N6(1)
Micro QFN
6.17 mg
3000
Revision history
Table 5.
Date
Revision
21-Nov-2008
Changes
Initial release.
11/12
EMIF06-MSD02N16
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