Monitor and Control OfGreenhouse Environment GreenBee

Biju Patnaik University of Technology
Rourkela
PROJECT REPORT
ON
Monitor and Control of Greenhouse

Environment
The Project GreenBee
A Project report submitted in partial fulfillment of the requirement for the award of
Bachelor of Engineering
In
Applied Electronics and Instrumentation Engineering
Submitted by:
Chinmayananda Das (Regd No.0501229084)

Under the guidance of
Prof. Subhendu Behera

Dept. of Applied Electronics & Instrumentation Engineering
Dhaneswar Rath Institute of Engineering & Management Studies, Cuttack.
DEPARTMENT OF APPLIED ELECTRONICS AND INSTRUMENTATION ENGINEERING

DHANESWAR RATH INSTITUTE OF ENGINEERING & MANAGMENT STUDIES
CUTTACK
DHANESWAR RATH INSTITUTE OF ENGINEERING & MANAGMENT STUDIES

CUTTACK
(Affiliated To Biju Patnaik University of Technology)
Dept. of Applied Electronics & Instrumentation

Engineering
Certificate
Certified that the project work entitled Monitor and Control of Greenhouse
Environment is a bonafide work carried out by:
Chinmayananda Das (Regd No.0501229084)

in partial fulfillment for the award of the degree of Bachelor of Engineering in Applied
Electronics and Instrumentation Engineering under Biju Pattnaik University Of
Technology, Rourkela, during the year 2005-2009. It is certified that all corrections/ suggestions
indicated for Internal Assessment have been incorporated in the report and deposited in the
departmental library. The project report has been approved as it satisfies the academic
requirements in respect of the project work prescribed for the said degree.
Signature:
Project Guide:
HOD Dept. of AE&I:
Project Incharge:
Name:
Name:
Name:
Date:
Date:
Date:
Internal examiner:
examiner: Name:
External
Name:
ACKNOWLEDGEMENT
The completion of any project brings with it a sense of satisfaction, but it is never
complete without thanking those people who made it possible and whose constant support
has crowned our efforts with success.
One cannot even imagine the power of the force that guides us all and neither can we
succeed without acknowledging it. Our deepest gratitude to Almighty God for holding our
hands and guiding us throughout our lives.
I would also like to express our gratitude to Prof. Subhendu Behera Head of the
Department, Applied Electronics and Instrumentation DRIEMS, Cuttack for encouraging
and inspiring us to carry out the project in the department lab.
I would also like to thank our guide, Er. J. N Mishra Dept. of A p p l i e d Electronics
and Communication for his expert guidance, encouragement and valuable suggestions at
every step.
We also would like to thank all the staff members of AE&I dept. for providing us with
the required facilities and support towards the completion of the project.
We are extremely happy to acknowledge and express our sincere gratitude to our
parents for their constant support and encouragement and last but not the least, friends and
well wishers for their help and cooperation and solutions to problems during the course of
the project.
Also our friends at 8051projects.net who provided solutions at times when we were
against the wall in need of help.
iii
MONITOR AND CONTROL OF GREENHOUSE ENVIRONMENT
SYNOPSIS
Appropriate environmental conditions are necessary for optimum plant growth, improved
crop yields, and efficient use of water and other resources. Automating the data acquisition
process of the soil conditions and various climatic parameters that govern plant growth allows
information to be collected at high frequency with less labor requirements. The existing systems
employ PC or SMS-based systems for keeping the user continuously informed of the conditions
inside the greenhouse; but are unaffordable, bulky, difficult to maintain and less accepted by the
technologically unskilled workers.
The objective of this project is to design a simple, easy to install, microcontroller-based
circuit to monitor and record the values of temperature, humidity, soil moisture and sunlight of
the natural environment that are continuously modified and controlled in order optimize them to
achieve maximum plant growth and yield. The controller used is a low power, cost efficient chip
manufactured by ATMEL having 8K bytes of on-chip flash memory. It communicates with the
various sensor modules in real-time in order to control the light, aeration and drainage process
efficiently inside a greenhouse by actuating a cooler, fogger, dripper and lights respectively
according to the necessary condition of the crops. An integrated Liquid crystal display (LCD) is
also used for real time display of data acquired from the various sensors and the status of the
various devices. Also, the use of easily available components reduces the manufacturing and
maintenance costs. The design is quite flexible as the software can be changed any time. It can
thus be tailor-made to the specific requirements of the user.
This makes the proposed system to be an economical, portable and a low maintenance
solution for greenhouse applications, especially in rural areas and for small scale agriculturists.
DEPARTMENT OF AE & I
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CONTENTS
NAME OF THE CHAPTER
1.
PAGE NO.
INTRODUCTION
1.1 CURRENT SCENARIO..2
1.1.1 MANUAL SETUP..2
1.1.2 PARTIALLY AUTOMATED SETUP...2
1.1.3 FULLY AUTOMATED SETUP....3
1.2 PROBLEM DEFINITION...3
1.3 PROPOSED MODEL FOR AUTOMATION OF GREENHOUSE...4
2.
SYSTEM MODEL
2.2 BASIC MODEL OF THE SYSTEM......6
2.3 PARTS OF THE SYSTEM.7
2.4 STEPS FOLLOWED IN DESIGNING THE SYSTEM.8
3.
BASIC THEORY
3.1 LIFE PROCESSES INSIDE A GREENHOUSE
3.1.1 PHOTOSYNTHETIC PROCESS.12
3.1.2 TRANSPIRATION...13
4.
HARDWARE DESCRIPTION
4.1 TRANSDUCERS
4.1.1 SOIL MOISTURE SENSOR...16
2009-2010
4.1.1.1 FEATURES
16
4.1.1.2 FUNCTIONAL DESCRIPTION
17
4.1.2 LIGHT SENSOR

4.1.2.1 FEATURES
18
4.1.2.2 FUNCTIONAL DESCRIPTION
19
4.1.3 HUMIDITY SENSOR

4.1.3.1
FEATURES-------------------------------------------------------------4.1.3.2 FUNCTIONAL DESCRIPTION--------------------------------
20
21
4.1.4 TEMPERATURE SENSOR

4.1.4.1
FEATURES----------------------------------------------------------4.1.4.2 FUNCTIONAL
DESCRIPTION-----------------------------------4.2 ANALOG TO DIGITAL CONVERTER (ADC 0809)
22
4.2.1
DESCRIPTION---------------------------------------------------------------4.2.2
FEATURES------------------------------------------------------------------------4.2.3 CONVERSION METHOD
USED------------------------------------------4.2.4 PIN DIAGRAM OF ADC
0809---------------------------------------------4.2.5 SELECTING AN ANALOG
CHANNEL----------------------------------------4.3 CLOCK CIRCUITRY FOR THE ADC
24
4.3.1 FUNCTIONAL
23
24
25
26
27
29
4.4 MICROCONTROLLER
4.4.1 CRITERIA FOR CHOOSING A
MICROCONTROLLER-------------------------4.4.2
DESCRIPTION----------------------------------------------------------------4.4.2
FEATURES---------------------------------------------------------------------4.4.4 PIN CONFIGURATION---------------------------------------------------
31
4.4.5 BLOCK DIAGRAM--------------------------------------------------------
34
4.4.6 PIN
DESCRIPTION--------------------------------------------------------4.4.6.1 POWER-ON RESET
CIRCUIT----------------------------------4.4.6.2 OSCILLATOR CLOCK
CIRCUIT---------------------------------4.4.7 SPECIAL FUNCTION
REGISTERS------------------------------------4.4.8 MEMORY
ORGANIZATION---------------------------------------------4.4.9 WATCHDOG TIMER------------------------------------------------------
35
31
32
33
36
37
38
39
40
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4.4.10 TIMERS AND COUNTERS..41

4.4.11 INTERRUPTS....42
4.4.12 MICROCONTROLLER CONFIGURATION USED IN THE SET-UP..42
4.5 LIQUID CRYSTAL DISPLAY...44
4.5.1 SIGNALS TO THE LCD..........44
4.5.1.1 LOGIC STATUS ON THE CONTROL LINES45
4.5.1.2 WRITING AND READING DATA FROM THE LCD45
4.5.2 PIN DESCRIPTION..........45
4.6 ALARM CIRCUITRY.....46
4.7 RELAYS............47
4.8 POWER SUPPLY CONNECTION....50
5. SYSTEMS USED IN WORK MODE
5.1 DRIP IRRIGATION SYSTEM FOR CONTROLLING SOIL MOISTURE.54
5.2 ARTIFICIAL GROWING LIGHTS FOR CONTROLLING ILLUMINATION......55
5.3 HEATERS AND FANS FOR CONTROLLING TEMPERATURE
5.3.1 COOLING EQUIPMENT..56
5.3.2 HEATING EQUIPMENT..56
5.4 HUMIDIFICATION SYSTEMS56
6. SOFTWARE
6.1 INTRODUCTION TO KEIL SOFTWARE
6.1.1 WHAT IS Vision3?..........................................................................................59
6.1.2 STEPS FOLLOWED IN CREATING AN APPLICATION IN Vision359
6.1.3 DEVICE DATABASE...64
6.1.4 PERIPHERAL SIMULATION..64
6.2 PROGRAMMER64
6.3 ProLoad PROGRAMMING SOFTWARE..65
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7. FLOWCHART
7.1 FLOWCHART REPRESENTING THE WORKING OF THE SYSTEM...68
7.2 FLOWCHART FOR LCD INITIALIZATION.........69
7.3 FLOWCHART FOR ADC INITIALIZATION.71
8. RESULT ANALYSIS
8.1 SENSOR READINGS

8.1.1 SOIL MOISTURE SENSOR......74
8.1.2 LIGHT SENSOR........75
8.1.3 HUMIDITY SENSOR........76
8.1.4 TEMPERATURE SENSOR77
9. ADVANTAGES AND DISADVANTAGES
9.1 ADVANTAGES..80
9.2 DISADVANTAGES80
10. FUTURE SCOPE .82
11. CONCLUSION.84
I.
REFERENCES.85
II.
ANNEXURE-I.. 87
III.
ANNEXURE-II 91
IV.
ANNEXURE-III...95
V.
ANNEXURE-IV...97
VI.
ANNEXURE-V...115
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LIST OF FIGURES
I.
Figure 2.1 Block diagram of the system..6
II.
Figure 3.2 Block diagram of photosynthesis..12
III.
Figure 3.2 Transpiration.14
IV.
Figure 4.1 Soil moisture sensor circuit..17
V.
Figure 4.2 Light Dependent Resistor.18
VI.
Figure 4.2.1 Structure of a Light Dependent Resistor...18
VII.
Figure 4.3 Light sensor circuit...19
VIII.
Figure 4.4 HIH-4000-001 Humidity sensor...20
IX.
Figure 4.5 Humidity sensor circuit.21
X.
Figure 4.6 LM35 temperature sensor.22
XI.
Figure 4.7 Temperature sensor circuit...23
XII.
Figure 4.8 Getting data from the analog world..24
XIII.
Figure 4.9 Block diagram of ADC 080925
XIV.
Figure 4.10 Flowchart explaining the Successive Approximation method...26
XV.
Figure 4.11 Pin diagram of ADC 0809..26
XVI.
Figure 4.12 ADC 0809 pin details for the system..28
XVII.
Figure 4.13 Timing diagram of ADC 080929
XVIII.
Figure 4.14 Clock circuitry for the ADC...30
XIX.
Figure 4.15 The effect of using a Schmitt trigger instead of a comparator30
XX.
Figure 4.16 Pin diagram of AT89S5233
XXI.
Figure 4.17 Block diagram of the microcontroller.34
XXII.
Figure 4.18 Power-on reset circuit.36
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XXIII.
Figure 4.19 Oscillator clock circuit38
XXIV.
Figure 4.20 Internal memory block40
XXV.
Figure 4.21 Microcontroller Pin Details.43
XXVI.
Figure 4.22 Address locations for a 2x16 line LCD..44
XXVII.
Figure 4.23 Pin diagram of 2x16 line LCD46
XXVIII.
Figure 4.24 Electrical symbol of a buzzer..46
XXIX.
Figure 4.25 Buzzer circuitry..47
XXX.
Figure 4.26 Sugar Cube Relay...48
XXXI.
Figure 4.27 Circuit symbols of relays49
XXXII.
Figure 4.28 Relay circuitry50
XXXIII.
Figure 4.29 +5V Power supply circuit...51
XXXIV.
Figure 4.30 +12V Power supply circuit.51
XXXV.
Figure 5.1 Drip irrigation system...54
XXXVI.
Figure 6.1 Window for choosing the target device60
XXXVII.
Figure 6.2 Project workspace pane.61
XXXVIII.
Figure 6.3 Project options dialog...61
XXXIX.
Figure 6.4 Save All and Build All Target Files buttons..61
XL.
Figure 6.5 Vision3 Debugger window.62
XLI.
Figure 6.6 Reset, Run and Step into options..63
XLII.
Figure 6.7 Programming window..66
XLIII.
Annexure-I: Snapshots of the System..88-90
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LIST OF TABLES
I.
Table 2.1 Importance of the various parameters.8
II.
Table 4.1 Selection of the input channels..27
III.
Table 4.2 Alternate functions of Port 3..36
IV.
Table 4.3 Pin description of the LCD46
V.
Table 8.1 Soil moisture sensor readings74
VI.
Table 8.2 Light sensor readings.75
VII.
Table 8.3 Humidity sensor readings..76
VIII.
Table 8.4 Temperature sensor readings.77
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CHAPTER 1
INTRODUCTION
Department of AE & I
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INTRODUCTION
We live in a world where everything can be controlled and operated automatically,
but there are still a few important sectors in our country where automation has not been
adopted or not been put to a full-fledged use, perhaps because of several reasons one such
reason is cost. One such field is that of agriculture. Agriculture has been one of the primary
occupations of man since early civilizations and even today manual interventions in farming
are inevitable. Greenhouses form an important part of the agriculture and horticulture sectors
in our country as they can be used to grow plants under controlled climatic conditions for
optimum produce. Automating a greenhouse envisages monitoring and controlling of the
climatic parameters which directly or indirectly govern the plant growth and hence their
produce. Automation is process control of industrial machinery and processes, thereby
replacing human operators.
1.1 CURRENT SCENARIO

Greenhouses in India are being deployed in the high-altitude regions where the subzero temperature up to -40 C makes any kind of plantation almost impossible and in arid
regions where conditions for plant growth are hostile. The existing set-ups primarily are:
1.1.1 MANUAL SET-UP:
This set-up involves visual inspection of the plant growth, manual irrigation of plants,
turning ON and OFF the temperature controllers, manual spraying of the fertilizers and
pesticides. It is time consuming, vulnerable to human error and hence less accurate and
unreliable.
1.1.2 PARTIALLY AUTOMATED SET-UP:
This set-up is a combination of manual supervision and partial automation and is
similar to manual set-up in most respects but it reduces the labor involved in terms of
irrigating the set-up.
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1.1.3 FULLY- AUTOMATED:

This is a sophisticated set-up which is well equipped to react to most of the climatic
changes occurring inside the greenhouse. It works on a feedback system which helps it to
respond to the external stimuli efficiently. Although this set-up overcomes the problems
caused due to human errors it is not completely automated and expensive.
1.2 PROBLEM DEFINITION

A number of problems associated with the above mentioned systems are enumerated
as below:
1. Complexity involved in monitoring climatic parameters like humidity, soil moisture,
illumination, soil pH, temperature, etc which directly or indirectly govern the plant
growth.
2. Investment in the automation process are high, as todays greenhouse control systems are
designed for only one parameter monitoring (as per GKVK research center); to control
more than one parameter simultaneously there will be a need to buy more than one
system.
3. High maintenance and need for skilled technical labor. The modern proposed systems use
the mobile technology as the communication schemes and wireless data acquisition
systems, providing global access to the information about ones farms. But it suffers from
various limitations like design complexity, inconvenient repairing and high price. Also
the reliability of the system is relatively low, and when there are malfunctions in local
devices, all local and tele data will be lost and hence the whole system collapses. More
over farmers in India do not work under such sophisticated environment and find no
necessity of such an advanced system, and cannot afford the same.
Keeping these issues in view, a microcontroller based monitoring and control system is
designed to find implementation in the near future that will help Indian farmers.
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1.3 PROPOSED MODEL FOR AUTOMATION OF GREENHOUSE

The proposed system is an embedded system which will closely monitor and control
the microclimatic parameters of a greenhouse on a regular basis round the clock for
cultivation of crops or specific plant species which could maximize their production over the
whole crop growth season and to eliminate the difficulties involved in the system by reducing
human intervention to the best possible extent. The system comprises of sensors, Analog to
Digital Converter, microcontroller and actuators.
When any of the above mentioned climatic parameters cross a safety threshold which
has to be maintained to protect the crops, the sensors sense the change and the
microcontroller reads this from the data at its input ports after being converted to a digital
form by the ADC. The microcontroller then performs the needed actions by employing relays
until the strayed-out parameter has been brought back to its optimum level. Since a
microcontroller is used as the heart of the system, it makes the set-up low-cost and effective
nevertheless. As the system also employs an LCD display for continuously alerting the user
about the condition inside the greenhouse, the entire set-up becomes user friendly.
Thus, this system eliminates the drawbacks of the existing set-ups mentioned in the
previous section and is designed as an easy to maintain, flexible and low cost solution.
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CHAPTER 2
SYSTEM MODEL
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BASIC MODEL OF THE SYSTEM
Fig. 2.1 Block diagram of the system
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2.1 PARTS OF THE SYSTEM:
Sensors (Data acquisition system)

Temperature sensor (LM35)
Humidity sensor (HIH4000)
Light sensor (LDR)
Moisture sensor
Analog to Digital Converter ( ADC 0808/0809)
Microcontroller (AT89S52)
Liquid Crystal Display (Hitachi's HD44780)
Actuators Relays
Devices controlled
Water Pump (simulated as a bulb)
Sprayer (simulated as a bulb)
Cooler (simulated as a fan)
Artificial Lights (simulated as 2 bulbs)
Buzzer
TRANSDUCERS (Data acquisition system):

This part of the system consists of various sensors, namely soil moisture, humidity,
temperature and light. These sensors sense various parameters- temperature, humidity, soil
moisture and light intensity and are then sent to the Analog to Digital Converter.
ANALOG TO DIGITAL CONVERDER (ADC):
The analog parameters measured by the sensors are then converted to corresponding
digital values by the ADC.
MICROCONTROLLER:
The microcontroller is the heart of the proposed embedded system. It constantly
monitors the digitized parameters of the various sensors and verifies them with the
predefined threshold values and checks if any corrective action is to be taken for the
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condition at that instant of time. In case such a situation arises, it activates the actuators to
perform a controlled operation.
ACTUATORS:
An array of actuators can be used in the system such as relays, contactors, and change
over switches etc. They are used to turn on AC devices such as motors, coolers, pumps,
fogging machines, sprayers. For the purpose of demonstration relays have been used to drive
AC bulbs to simulate actuators and AC devices. A complete working system can be realized
by simply replacing these simulation devices by the actual devices.
DISPLAY UNIT:
A Liquid crystal display is used to indicate the present status of parameters and the
respective AC devises (simulated using bulbs). The information is displayed in two modes
which can be selected using a push button switch which toggles between the modes. Any
display can be interfaced to the system with respective changes in driver circuitry and code.
2.2 STEPS FOLLOWED IN DESIGNING THE SYSTEM:

Three general steps can be followed to appropriately select the control system:
Step # 1: Identify measurable variables important to production.
It is very important to correctly identify the parameters that are going to be measured
by the controllers data acquisition interface, and how they are to be measured. The
set of variables typically used in greenhouse control is shown below:
Sl. No.
Variable to be monitored
Its Importance
Temperature
Affects all plant metabolic functions.
Humidity
Soil moisture
Affects transpiration rate and the plant's thermal

control mechanisms.
Affects salinity, and pH of irrigation water
Solar Radiation
Affects photosynthetic rate, responsible for most

thermal load during warm periods
Table 2.1 Importance of the various parameters

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An electronic sensor for measuring a variable must readily available, accurate, reliable
and low in cost. If a sensor is not available, the variable cannot be incorporated into the
control system, even if it is very important. Many times variables that cannot be directly or
continuously measured can be controlled in a limited way by the system. For example,
fertility levels in nutrient solutions for greenhouse production are difficult to measure
continuously.
Step# 2: Investigate the control strategies.
An important element in considering a control system is the control strategy that is to

be followed. The simplest strategy is to use threshold sensors that directly affect
actuation of devices. For example, the temperature inside a greenhouse can be
affected by controlling heaters, fans, or window openings once it exceeds the
maximum allowable limit. The light intensity can be controlled using four threshold
levels. As the light intensity decreases one light may be turned on. With a further
decrease in its intensity a second light would be powered, and so on; thus ensuring
that the plants are not deprived of adequate sunlight even during the winter season or
a cloudy day.
More complex control strategies are those based not only on the current values of the
controlled variables, but also on the previous history of the system, including the rates
at which the system variables are changing.
Step #3: Identify the software and the hardware to be used.
It is very important that control system functions are specified before deciding what
software and hardware system to purchase. The model chosen must have the ability
to:
1. Expand the number of measured variables (input subsystem) and controlled
devices (output subsystem) so that growth and changing needs of the
production operation can be satisfied in the future.
2. Provide a flexible and easy to use interface.
3. It must ensure high precision measurement and must have the ability resist
noise.
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Hardware must always follow the selection of software, with the hardware required
being supported by the software selected. In addition to functional capabilities, the selection
of the control hardware should include factors such as reliability, support, previous
experiences with the equipment (successes and failures), and cost.
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CHAPTER 3
BASIC THEORY
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BASIC THEORY
3.1 LIFE PROCESSES INSIDE GREENHOUSE:

3.1.1 PHOTOSYNTHETIC PROCESS
The two major life-processes occurring in plants are photosynthesis and transpiration.
Photosynthesis is the conversion of light energy into chemical energy by living organisms.
The raw materials are carbon dioxide and water; the energy source is sunlight; and the endproducts are oxygen and (energy rich) carbohydrates, for example sucrose, glucose and
starch. This process is arguably the most important biochemical pathway, since nearly all
life on Earth either directly or indirectly depends on it.
Fig 3.1 Block diagram of photosynthesis

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A commonly used but slightly simplified equation for photosynthesis is:

6 CO2(g) + 12 H2O(l) + photons C6H12O6(aq.) + 6 O2(g) + 6 H2O(l)
(3.1)
Carbon dioxide + water + light energy glucose + oxygen + water

Light energy obtained from the sun is very essential for photosynthesis. The photons
present in light are responsible for triggering the light-reaction in plants. Plants need an
optimum amount of exposure to light in a day. This optimum period is called its photoperiod. The plant sensitivity curve for photosynthesis has its peak at the red side of the
spectrum. This indicates that providing plants with the wavelengths best suited to
photosynthesis is most efficient with the use of artificial light. Tests show a mean deviation
from the average sensitivity curve of less than 5% for a wide variety of plants. The curve
shows that the maximum sensitivity for photosynthesis lies in the far red at approximately
675 nm. The plant sensitivity curve disputes two common misconceptions. The first is that an
"ideal" plant growing lamp duplicates the spectral energy distribution of the sun. Sunlight has
a continual spectrum, radiating energy in wavelengths that contribute less to photosynthesis,
and are therefore "wasted" on the plant. For this reason, many lamps are more efficient than
sunlight for plants.
Plants need dark periods. Periods of light (called photo-periods) and dark periods and
their relative lengths have an effect on plant maturity. The dark period of each day affects
flowering and seeding of most plants. Although many plants can grow under continuous
light, nearly all plants prefer a dark period each day for normal growth. All plants need some
darkness to grow well or to trigger flowering. The ideal photoperiods of plants vary, some
preferring long days and short nights; others the reverse; and some do best when the length of
the night and day periods are equal.
3.1.2 TRANSPIRATION
Transpiration is the evaporation of water from the aerial parts of plants, especially
leaves but also stems, flowers and roots Transpiration also cools plants and enables mass
flow of mineral nutrients and water from roots to shoots. Mass flow is caused by the decrease
in hydrostatic (water) pressure in the upper parts of the plants due to the diffusion of water
out of stomata into the atmosphere. Water is absorbed at the roots by osmosis, and any
dissolved mineral nutrients travel with it through the xylem.
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The rate of transpiration is directly related to the degree of stomatal opening, and to
the evaporative demand of the atmosphere surrounding the leaf. The amount of water lost by
a plant depends on its size, along with the surrounding light intensity, temperature, humidity,
and wind speed (all of which influence evaporative demand). Soil water supply and soil
temperature can influence stomatal opening, and thus the transpiration rate.
Fig 3.2 Transpiration

The moisture content in the soil is a very crucial factor in the process of transpiration
as the absorption of mineral salts from the soil through the process of osmosis is directly
dependent on the moisture content in the soil.
The greenhouse works best when the temperature is not too hot and not too cold.
Though it sounds simple in the spring and autumn we can easily have a wide range of
temperatures from the cold in the middle of the night to the excessive heat of the day when
the sun is shining. During the day the rays from the sun penetrate the greenhouse and warm
up and light up the surroundings. Light escapes through the glass walls but the heat in form
of infra-red radiations gets trapped inside the green house leading to an incubating effect and
the temperature inside gradually increases. This increased temperature leads to an increase in
the rate of transpiration which is harmful to the plants.
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CHAPTER 4
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4.1 TRANSDUCERS:
A transducer is a device which measures a physical quantity and converts it into a
signal which can be read by an observer or by an instrument. Monitoring and controlling of a
greenhouse environment involves sensing the changes occurring inside it which can
influence the rate of growth in plants. The parameters which are of importance are the
temperature inside the greenhouse which affect the photosynthetic and transpiration
processes are humidity, moisture content in the soil, the illumination etc. Since all these
parameters are interlinked, a closed loop (feedback) control system is employed in
monitoring it. The sensors used in this system are:
1. Soil Moisture Sensor(Transistor amplifier)
2. Light Sensor ( LDR (Light Dependent Resistor) )
3. Humidity Sensor (HIH4000)
4. Temperature Sensor (LM35)
4.1.1 SOIL MOISTURE SENSOR

4.1.1.1 Features of the Soil moisture sensor:
1. The circuit designed uses a 5V supply, fixed resistance of 100, variable resistance
of 10, two copper leads as the sensor probes, 2N222N transistor.
2. It gives a voltage output corresponding to the conductivity of the soil.
3. The conductivity of soil depends upon the amount of moisture present in it. It
increases with increase in the water content of the soil.
4. The voltage output is taken at the transmitter which is connected to a variable
resistance. This variable resistance is used to adjust the sensitivity of the sensor.
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SENSOR LEADS
VCC
100
2N222N
ADC IN 5
10 k
Fig. 4.1 Soil moisture sensor
4.1.1.2 Functional description of Soil moisture sensor:

The two copper leads act as the sensor probes. They are immersed into the specimen soil
whose moisture content is under test. The soil is examined under three conditions:
Case#1: Dry condition- The probes are placed in the soil under dry conditions and are
inserted up to a fair depth of the soil. As there is no conduction path between the two copper
leads the sensor circuit remains open. The voltage output of the emitter in this case ranges
from 0 to 0.5V.
Case#2: Optimum condition- When water is added to the soil, it percolates through the
successive layers of it and spreads across the layers of soil due to capillary force. This water
increases the moisture content of the soil. This leads to an increase in its conductivity which
forms a conductive path between the two sensor probes leading to a close path for the current
flowing from the supply to the transistor through the sensor probes. The voltage output of the
circuit taken at the emitter of the transistor in the optimum case ranges from 1.9 to 3.4V
approximately.
Case#3: Excess water condition- With the increase in water content beyond the optimum
level, the conductivity of the soil increases drastically and a steady conduction path is
established between the two sensor leads and the voltage output from the sensor increases no
further beyond a certain limit. The maximum possible value for it is not more than 4.2V.
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4.1.2 LIGHT SENSOR

Light Dependent Resistor (LDR) also known as photoconductor or photocell, is a
device which has a resistance which varies according to the amount of light falling on its
surface. Since LDR is extremely sensitive in visible light range, it is well suited for the
proposed application.
Fig. 4.2 Light Dependent Resistor

4.1.2.1 Features of the light sensor:
The Light Dependent Resistor (LDR) is made using the semiconductor Cadmium
Sulphide (CdS).
The light falling on the brown zigzag lines on the sensor causes the resistance of
thedevice to fall. This is known as a negative co-efficient. There are some LDRs that
work in the opposite way i.e. their resistance increases with light (called positive coefficient).
he resistance of the LDR decreases as the intensity of the light falling on it increases.
Incident photons drive electrons from the valence band into the conduction band.
conduction band
Cadmium
Cadmium
Sulphide
Sulphide
track
Band gap
valence band
Fig. 4.2.1 Structure of a Light Dependent Resistor, showing Cadmium Sulphide track
and an atom to illustrate electrons in the valence and conduction bands
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4.1.2.2 Functional description
An LDR and a normal resistor are wired in series across a voltage, as shown in the
circuit below. Depending on which is tied to the 5V and which to 0V, the voltage at
the point between them, call it the sensor node, will either rise or fall with increasing
light. If the LDR is the component tied directly to the 5V, the sensor node will
increase in voltage with increasing light
The LDR's resistance can reach 10 k ohms in dark conditions and about 100 ohms in
full brightness.
The circuit used for sensing light in our system uses a 10 k fixed resistor which is
tied to +5V. Hence the voltage value in this case decreases with increase in light
intensity.
VCC
10K
ADC_IN4
LDR
GND
Fig. 4.3 Light sensor circuit
The sensor node voltage is compared with the threshold voltages for different levels
of light intensity corresponding to the four conditions- Optimum, dim, dark and night.
The relationship between the resistance RL and light intensity Lux for a
typical LDR is:
RL = 500 / Lux k
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(4.1)
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With the LDR connected to 5V through a 10K resistor, the output voltage of the LDR
is :
Vo = 5*RL / (RL+10)
(4.2)
In order to increase the sensitivity of the sensor we must reduce the value of the fixed
resistor in series with the sensor. This may be done by putting other resistors in
parallel with it.
The humidity sensor HIH4000, manufactured by Honeywell is used for sensing the
humidity. It delivers instrumentation quality RH (Relative Humidity) sensing performance in
a low cost, solder able SIP (Single In-line Package). Relative humidity is a measure, in
percentage, of the vapour in the air compared to the total amount of vapour that could be held
in the air at a given temperature.
Fig. 4.4 HIH-4000-001 Humidity Sensor

4.1.3.1 Features:
Linear voltage output vs. %RH
Laser trimmed interchangeability
Low power design
High accuracy
Fast response time
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Stable, low drift performance
Chemically resistant
The RH sensor is a laser trimmed, thermoset polymer capacitive sensing element with
on-chip integrated signal conditioning. The sensing element's multilayer construction
provides excellent resistance to most application hazards such as wetting, dust, dirt,
oils and common environmental chemicals.
VCC
12.5 k
Vin
HIH4000 GND
Vout
3
To ADC IN6
Fig 4.5 Humidity sensor circuit
4.1.3.2 Functional description
The sensor develops a linear voltage vs. RH output that is ratiometric to the supply
voltage. That is, when the supply voltage varies, the sensor output voltage follows in
the same proportion. It can operate over a 4-5.8 supply voltage range. At 5V supply
voltage, and room temperature, the output voltage ranges from 0.8 to 3.9V as the
humidity varies from 0% to 100% (noncondensing).
The humidity sensor functions with a resolution of up to 0.5% of relative humidity

(RH).
With a typical current draw of only 200 A, the HIH-4000 Series is ideally suited for
low drain, battery operated systems.
The change in the RH of the surroundings causes an equivalent change in the voltage
output. The output is an analog voltage proportional to the supply voltage.
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Consequently, converting it to relative humidity (RH) requires that both the supply
and sensor output voltages be taken into account according to the formula:
RH = ((Vout / Vsupply) 0.16) /0.0062, typical at 25C
.(4.3)
This voltage is converted to the digital form by the ADC and then sent as input to the
microcontroller which reads the data.

National Semiconductors LM35 IC has been used for sensing the temperature. It is
an integrated circuit sensor that can be used to measure temperature with an electrical output
o
proportional to the temperature (in C). The temperature can be measured more accurately
with it than using a thermistor. The sensor circuitry is sealed and not subject to oxidation, etc.
Fig. 4.6 LM35 temperature sensor

4.1.4.1 Features:
Calibrated directly in Celsius (Centigrade)
Linear + 10.0 mV/C scale factor
0.5C accuracy guaranteed (at +25C)
Rated for full 55 to +150C range
Suitable for remote applications
Low cost due to wafer-level trimming
Operates from 4 to 30 volts
Less than 60 A current drain
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Low self-heating, 0.08C in still air
Nonlinearity only 14C typical
Fig. 4.7 Temperature sensor circuit

4.1.4.2 Functional description:
o
The sensor has a sensitivity of 10mV / C.
The output of LM35 is amplified using a LM324 single power supply (+5V) op-amp.
The op-amp is designed to have a gain of 5.
The circuitry measures temperatures with a resolution of up to 0.5 degree Celsius.
The output voltage is converted to temperature by a simple conversion factor. The

general equation used to convert output voltage to temperature is:
o
Temperature ( C) = (Vout * 100 ) / 5 C
(4.4)
So if Vout is 5V, then, Temperature = 100 C
The output voltage varies linearly with temperature.
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4.2 ANALOG TO DIGITAL CONVERTER (ADC 0809)

In physical world parameters such as temperature, pressure, humidity, and velocity
are analog signals. A physical quantity is converted into electrical signals. We need an analog
to digital converter (ADC), which is an electronic circuit that converts continuous signals
into discrete form so that the microcontroller can read the data. Analog to digital converters
are the most widely used devices for data acquisition.
Analog world
(temperature,
pressure, etc.)
Transducer
Signal
Conditioning
Analog to
Digital Converter
Microcontroller
Fig. 4.8 Getting data from the analog world

4.2.1 DESCRIPTION
The ADC0809 data acquisition component is a monolithic CMOS device with an 8bit analog-to-digital converter, 8-channel multiplexer and microprocessor compatible control
logic. The 8-bit A/D converter uses successive approximation as the conversion technique.
The converter features a high impedance chopper stabilized comparator, a 256R voltage
divider with analog switch tree and a successive approximation register. The 8-channel
multiplexer can directly access any of 8-single-ended analog signals.
The design of the ADC0809 has been optimized by incorporating the most desirable
aspects of several A/D conversion techniques. The device offers high speed, high accuracy,
minimal temperature dependence, excellent long-term accuracy and repeatability, and
consumes minimal power. These features make it ideally suited for applications from process
and machine control to consumer and automotive applications.
4.2.2 FEATURES
1. Easy interface to all microcontrollers.
2. Operates ratiometrically or with 5 VDC or analog span adjusted voltage reference.
3. No zero or full-scale adjust required.
4. 8-channel multiplexer with address logic.
5. 0V to 5V input range with single 5V power supply.
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6. Outputs meet TTL voltage level specifications.

7. 28-pin molded chip carrier package.
Fig. 4.9 Block diagram of ADC 0809

4.2.3 CONVERSION METHOD USED
Following are the most used conversion methods:
Digital-Ramp ADC
Successive Approximation ADC
Flash ADC
Successive approximation ADC is suitable for the proposed application. It is much
faster than the digital ramp ADC because it uses digital logic to converge on the value closest
to the input voltage. A comparator and a DAC (Digital to Analog Converter) are used in the
process. A flowchart explaining the working is shown below.
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Fig. 4.10 Flowchart explaining the Successive approximation method

4.2.4 PIN DIAGRAM OF ADC 0808/0809
Fig. 4.11 Pin diagram of ADC 0809

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We use A, B, C addresses to select IN0-IN7 and activate Address latch enable (ALE)
to latch in the address. SC is for Start Conversion. EOC is for End of Conversion and OE is
for Output Enable. The output pins D0-D7 provides the digital output from the chip. Vref (-)
and Vref (+) are the reference voltages.
4.2.5 SELECTING AN ANALOG CHANNEL
How to select the channel using three address pins A, B, C is shown in Table below:
Select Analog Channel
IN0
IN1
IN2
IN3
IN4
IN5
IN6
IN7
Table 4.1 Selection of the input channels

The ADC 0804 is most widely used chip, but since it has only one analog input, ADC
0809 is chosen as this chip allows the monitoring of up to 8 different transducers using only a
single chip. The 8 analog input channels are multiplexed and selected according to the
requirement. But for the proposed application only the last 4 channels i.e., IN4, IN5, IN6 and
IN7 are used to monitor the four parameters- temperature, humidity, soil moisture and light
intensity. Hence the address line ADD_C is given to Vcc (+ 5V) as it is always high in this
case. Vref (+) and Vref (-) set the reference voltages. If Vref (-) =Gnd and Vref (+) =5V, the step
size is 5V/256=19.53.
Since there is no self clocking in this chip, the clock must be provided from an
external source to the Clock (CLK) pin. The 8-bit output from the ADC is given to Port 0 of
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the microcontroller and the control signals ADD_A, ADD_B, ADD_C, ALE, START, OE,
EOC are given to Port 1 as shown in the figure below.
+5V
11
26
17
IN0
27
VCC
D0
IN1
D1
IN2
D2
IN3
D3
28
1
2
TEMPERATURE SENSOR
IN4
D4
IN5
D5
IN6
HUMIDITY SENSOR
ADC0809
IN7
12
+5v
D7
Vref+
ADD_A
Vref-
ADD_B
CLOCK
ADD_C
21
25
PIN 3.4 OF MC
PIN 3.5 OF MC
23
OE
VCC
PIN 3.1 OF MC
START
EOC
22
7
PIN 3.3 OF MC
PIN 1.7 OF MC
24
10
PIN 3.0 OF MC
PIN 1.6 OF MC
D6
16
PIN 1.5 OF MC
20
5
LIGHT SENSOR
PIN 1.3 OF MC
PIN 1.4 OF MC
18
19
PIN 1.1 OF MC
15 PIN 1.2 OF MC
8
3
MOISTURE SENSOR
PIN 1.0 OF MC
14
GND
PIN 3.7 OF MC
ALE
13
Fig. 4.12 ADC 0809 pin details as used for this application
At a certain point of time, even though there is no conversion in progress the
ADC0809 is still internally cycling through 8 clock periods. A start pulse can occur any time
during this cycle but the conversion will not actually begin until the converter internally
cycles to the beginning of the next 8 clock period sequence. As long as the start pin is held
high no conversion begins, but when the start pin is taken low the conversion will start within
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8 clock periods. The EOC output is triggered on the rising edge of the start pulse. It, too, is
controlled by the 8 clock period cycle, so it will go low within 8 clock periods of the rising
edge of the start pulse. One can see that it is entirely possible for EOC to go low before the
conversion starts internally, but this is not important, since the positive transition of EOC,
which occurs at the end of a conversion, is what the control logic is looking for. Once EOC
does go high this signals the interface logic that the data resulting from the conversion is
ready to be read. The output enable (OE) is then raised high.
Fig 4.13 Timing diagram of ADC 0809

4.3 CLOCK CIRCUITRY FOR ADC:
4.3.1 Functional Description:
The clock for the ADC is generated using the IC CD4093, which is a 2-input Schmitt
triggered NAND gate. A Schmitt trigger is a comparator circuit that incorporates positive
feedback.
The Control pin is pulled high and the capacitor charges and discharges producing
alternate patterns of 0s and 1, generating a square waveform. When the input is higher than a
certain chosen threshold, the output is high; when the input is below another (lower) chosen
threshold, the output is low; when the input is between the two, the output retains its value.
The trigger is so named because the output retains its value until the input changes
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sufficiently to trigger a change. This dual threshold action is called hysteresis, and implies
that the Schmitt trigger has some memory.
Fig. 4.14 Clock circuitry for ADC

The benefit of a Schmitt trigger over a circuit with only a single input threshold is
greater stability (noise immunity). With only one input threshold, a noisy input signal near
that threshold could cause the output to switch rapidly back and forth from noise alone. A
noisy Schmitt Trigger input signal near one threshold can cause only one switch in output
value, after which it would have to move to the other threshold in order to cause another
switch.
Fig. 4.15 The effect of using a Schmitt trigger (B) instead of a comparator (A)
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4.4 MICROCONTROLLER (AT89S52)

4.4.1 CRITERIA FOR CHOOSING A MICROCONTROLLER
The basic criteria for choosing a microcontroller suitable for the application are:
1) The first and foremost criterion is that it must meet the task at hand efficiently and cost
effectively. In analyzing the needs of a microcontroller-based project, it is seen whether an 8bit, 16-bit or 32-bit microcontroller can best handle the computing needs of the task most
effectively. Among the other considerations in this category are:
(a) Speed: The highest speed that the microcontroller supports.
(b) Packaging: It may be a 40-pin DIP (dual inline package) or a QFP (quad flat
package), or some other packaging format. This is important in terms of space,
assembling, and prototyping the end product.
(c) Power consumption: This is especially critical for battery-powered products.
(d) The number of I/O pins and the timer on the chip.
(f) How easy it is to upgrade to higher performance or lower consumption versions.
(g) Cost per unit: This is important in terms of the final cost of the product in which
a microcontroller is used.
2) The second criterion in choosing a microcontroller is how easy it is to develop products
around it. Key considerations include the availability of an assembler, debugger, compiler,
technical support.
3) The third criterion in choosing a microcontroller is its ready availability in needed
quantities both now and in the future. Currently of the leading 8-bit microcontrollers, the
8051 family has the largest number of diversified suppliers. By supplier is meant a producer
besides the originator of the microcontroller. In the case of the 8051, this has originated by
Intel several companies also currently producing the 8051.
Thus the microcontroller AT89S52, satisfying the criterion necessary for the proposed
application is chosen for the task.
4.4.2 DESCRIPTION:
The 8051 family of microcontrollers is based on an architecture which is highly
optimized for embedded control systems. It is used in a wide variety of applications from
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military equipment to automobiles to the keyboard. Second only to the Motorola 68HC11 in
eight bit processors sales, the 8051 family of microcontrollers is available in a wide array of
variations from manufacturers such as Intel, Philips, and Siemens. These manufacturers have
added numerous features and peripherals to the 8051 such as I2C interfaces, analog to digital
converters, watchdog timers, and pulse width modulated outputs. Variations of the 8051 with
clock speeds up to 40MHz and voltage requirements down to 1.5 volts are available. This
wide range of parts based on one core makes the 8051 family an excellent choice as the base
architecture for a company's entire line of products since it can perform many functions and
developers will only have to learn this one platform.
The AT89S52 is a low-power, high-performance CMOS 8-bit microcontroller with
8K bytes of in-system programmable Flash memory. The device is manufactured using
Atmels high-density nonvolatile memory technology and is compatible with the industrystandard 80C51 instruction set and pinout. The on-chip Flash allows the program memory to
be reprogrammed in-system or by a conventional nonvolatile memory programmer. By
combining a versatile 8-bit CPU with in-system programmable Flash on a monolithic chip,
the Atmel AT89S52 is a powerful microcontroller which provides a highly-flexible and costeffective solution to many embedded control applications. In addition, the AT89S52 is
designed with static logic for operation down to zero frequency and supports two software
selectable power saving modes. The Idle Mode stops the CPU while allowing the RAM,
timer/counters, serial port, and interrupt system to continue functioning. The Power-down
mode saves the RAM con-tents but freezes the oscillator, disabling all other chip functions
until the next interrupt or hardware reset.
4.4.3 FEATURES:
The basic architecture of AT89C51 consists of the following features:
Compatible with MCS-51 Products
8K Bytes of In-System Programmable (ISP) Flash Memory
4.0V to 5.5V Operating Range
Fully Static Operation: 0 Hz to 33 MHz
256 x 8-bit Internal RAM
32 Programmable I/O Lines
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Three 16-bit Timer/Counters
Eight Interrupt Sources
Full Duplex UART Serial Channel
Low-power Idle and Power-down Modes
Interrupt Recovery from Power-down Mode
Watchdog Timer
Fast Programming Time
Flexible ISP Programming (Byte and Page Mode)
4.4.4 PIN CONFIGURATION
Fig. 4.16 Pin diagram of AT89S52
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4.4.5 BLOCK DIAGRAM
Fig. 4.17 Block diagram of the microcontroller
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4.4.6 PIN DESCRIPTION
VCC: Supply voltage.
GND: Ground.
Port 0: Port 0 is an 8-bit open drain bidirectional I/O port. As an output port, each pin
can sink eight TTL inputs. When 1s are written to port 0 pins, the pins can be used as
high-impedance inputs. Port 0 can also be configured to be the multiplexed low-order
address/data bus during accesses to external program and data memory. In this mode,
P0 has internal pull-ups.
Port 1: Port 1 is an 8-bit bidirectional I/O port with internal pull-ups. The Port 1
output buffers can sink/source four TTL inputs. When 1s are written to Port 1 pins,
they are pulled high by the internal pull-ups and can be used as inputs. As inputs, Port
1 pins that are externally being pulled low will source current (IIL) because of the
internal pull-ups. In addition, P1.0 and P1.1 can be configured to be the timer/counter
2 external count input (P1.0/T2) and the timer/counter 2 trigger input (P1.1/T2EX),
respectively, as shown in the following table.
internal pull-ups. Port 2 emits the high-order address byte during fetches from
external program memory and during accesses to external data memory that use 16bit addresses (MOVX @ DPTR). In this application, Port 2 uses strong internal pullups when emitting 1s. During accesses to external data memory that uses 8-bit
addresses (MOVX @ RI), Port 2 emits the contents of the P2 Special Function
register.
pull-ups. Port 3 receives some control signals for Flash programming an verification.
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Port 3 also serves the functions of various special features of the AT89S52, as shown in
the following table.
Alternate functions of Port 3:
Table 4.2 Alternate functions of Port 3

RST: Reset input. A high on this pin for two machine cycles while the oscillator
is running resets the device. This pin drives high for 98 oscillator periods after the
watchdog times out.
4.4.6.1 Power-On Reset circuit
Fig. 4.18 Power-on reset circuit

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In order for the RESET input to be effective, it must have a minimum duration of two
machine cycles.
ALE/PROG: Address Latch Enable (ALE) is an output pulse for latching the
low byte of the address during accesses to external memory. This pin is also the
program pulse input (PROG) during Flash programming. In normal operation,
ALE is emitted at a constant rate of 1/6 the oscillator frequency and may be used
for external timing or clocking purposes. Note, however, that one ALE pulse is
skipped during each access to external data memory. If desired, ALE operation
can be disabled by setting bit 0 of SFR location 8EH. With the bit set, ALE is
active only during a MOVX or MOVC instruction. Otherwise, the pin is weakly
pulled high. Setting the ALE-disable bit has no effect if the microcontroller is in
external execution mode.
PSEN: Program Store Enable (PSEN) is the read strobe to external program
memory. When the AT89S52 is executing code from external program memory,
PSEN is activated twice each machine cycle, except that two PSEN activations
are skipped during each access to external data memory.
EA: External Access Enable. EA must be strapped to GND in order to enable the
device to fetch code from external program memory locations starting at 0000H
up to FFFFH. Note, however, that if lock bit 1 is programmed, EA will be
internally latched on reset. EA should be strapped to VCC for internal program
executions. This pin also receives the 12-volt programming enable voltage (VPP)
during Flash programming.
XTAL1: Input to the inverting oscillator amplifier and input to the internal clock
operating circuit.
XTAL2: Output from the inverting oscillator amplifier.
4.4.6.2 The AT89S52 oscillator clock circuit
It uses a quartz crystal oscillator.
We can observe the frequency on the XTAL2 pin.
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C2
XTAL2
30pF
C1
XTAL1
30pF
GN D
Fig 4.19 The AT89S52 oscillator clock circuit
The crystal frequency is the basic internal frequency of the microcontroller.
The internal counters must divide the basic clock rate to yield standard
communication bit per second (baud) rates.
An 11.0592 megahertz crystal, although seemingly an odd value, yields a crystal

frequency of 921.6 kilohertz, which can be divided evenly by the standard
communication baud rates of 19200, 9600, 4800, 2400, 1200, and 300 hertz.
4.4.7 SPECIAL FUNCTION REGISTERS

The Special Function Registers (SFRs) contain memory locations that are used for
special tasks. Each SFR occupies internal RAM from 0x80 to 0xFF.They are 8-bits wide.
The A (accumulator) register or accumulator is used for most ALU operations and
Boolean Bit manipulations.
Register B is used for multiplication & division and can also be used for general
purpose storage.
PSW (Program Status Word) is a bit addressable register
PC or program counter is a special 16-bit register. It is not part of SFR. Program
instruction bytes are fetched from locations in memory that are addressed by the
PC.
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Stack Pointer (SP) register is eight bits wide. It is incremented before data is
stored during PUSH and CALL executions. While the stack may reside anywhere
in on-chip RAM, the Stack Pointer is initialized to 07H after a reset. This causes
the stack to begin at location 08H.
DPTR or data pointer is a special 16-bit register that is accessible as two 8- bit
registers: DPL and DPH, which are used to used to furnish memory addresses for
internal and external code access and external data access.
Control Registers: Special Function Registers IP, IE, TMOD, TCON, SCON, and
PCON contain
control and status
bits for
the interrupt system, the
Timer/Counters, and the serial port.

Timer Registers: Register pairs (TH0, TL0) and (TH1, TL1) are the 16-bit
Counter registers for Timer/Counters 0 and 1, respectively.
4.4.8 MEMORY ORGANIZATION
MCS-51 devices have a separate address space for Program and Data Memory. Up to
64K bytes each of external Program and Data Memory can be addressed.
Program Memory: If the EA pin is connected to GND, all program fetches are
directed to external memory. On the AT89S52, if EA is connected to VCC,
program fetches to addresses 0000H through 1FFFH are directed to internal
memory and fetches to addresses 2000H through FFFFH are to external memory.
Data Memory: The AT89S52 implements 256 bytes of on-chip RAM. The upper
128 bytes occupy a parallel address space to the Special Function Registers. This
means that the upper 128 bytes have the same addresses as the SFR space but are
physically separate from SFR space. When an instruction accesses an internal
location above address 7FH, the address mode used in the instruction specifies
whether the CPU accesses the upper 128 bytes of RAM or the SFR space.
Instructions which use direct addressing access the SFR space. The lower 128
bytes of RAM can be divided into three segments:
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1. Register Banks 0-3: locations 00H through 1FH (32 bytes). The device after reset
defaults to register bank 0. To use the other register banks, the user must select them
in software. Each register bank contains eight 1-byte registers R0-R7. Reset initializes
the stack point to location 07H, and is incremented once to start from 08H, which is
the first register of the second register bank.
2. Bit Addressable Area: 16 bytes have been assigned for this segment 20H-2FH.
Each one of the 128 bits of this segment can be directly addressed (0-7FH). Each of
the 16 bytes in this segment can also be addressed as a byte.
3. Scratch Pad Area: 30H-7FH are available to the user as data RAM. However, if
the data pointer has been initialized to this area, enough bytes should be left aside to
prevent SP data destruction.
Fig. 4.20 Internal memory block
4.4.9 WATCHDOG TIMER (One-time Enabled with Reset-out)

The WDT is intended as a recovery method in situations where the CPU may be
subjected to software upsets. The WDT consists of a 14-bit counter and the Watchdog Timer
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Reset (WDTRST) SFR. The WDT is defaulted to disable from exiting reset. To enable the
WDT, a user must write 01EH and 0E1H in sequence to the WDTRST register (SFR location
0A6H). When the WDT is enabled, it will increment every machine cycle while the oscillator
is running. The WDT timeout period is dependent on the external clock frequency. There is
no way to disable the WDT except through reset (either hardware reset or WDT overflow
reset). When WDT over-flows, it will drive an output RESET HIGH pulse at the RST pin.
4.4.10 TIMERS AND COUNTERS
Many microcontroller applications require the counting of external events such as the
frequency of a pulse train, or the generation of precise internal time delays between computer
actions. Both of these tasks can be accomplished using software techniques, but software
loops for counting or timing keep the processor occupied so that, other perhaps more
important, functions are not done. Hence the better option is to use interrupts & the two 16bit count- up timers. The microcontroller can programmed for either of the following:
1. Count internal - acting as timer
2. Count external - acting as counter
All counter action is controlled by the TMOD (Timer Mode) and the TCON
(Timer/Counter Control) registers. TCON Timer control SFR contains timer 1& 2 overflow
flags, external interrupt flags, timer control bits, falling edge/low level selector bit etc.
TMOD timer mode SFR comprises two four-bit registers (timer #1, timer #0) used to specify
the timer/counter mode and operation.
The timer may operate in any one of four modes that are determined by modes bits
M1 and M0 in the TMOD register:
TIMER MODE-0: Setting timer mode bits to 00b in the TMOD register results in using the
TH register as an 8-bit counter and TL as a 5-bit counter. Therefore mode0 is a 13-bit
counter.
TIMER MODE-1: Mode-1 is similar to mode-0 except TL is configured as a full 8-bit
counter when the mode bits are set to 01b in TMOD.
TIMER MODE-2: Setting the mode bits to 10b in TMOD configures the timer to use only
the TL counter as an 8-bit counter. TH is used to hold a value that is loaded into TL every
time TL overflows from FFh to 00h. The timer flag is also set when TL overflows.
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TIMER MODE-3: In mode-3, timer-1 simply hold its count, where as timer 0 registers TL0
and TH0 are used as two separate 8-bit counters. TL0 uses the Timer-0 control bits. TH0
counts machine cycles and takes over the use of TR1 and TF1 from Timer-1.
4.4.11 INTERRUPTS
A computer has only two ways to determine the conditions that exist in internal and
external circuits. One method uses software instructions that jump to subroutines on the
states of flags and port pins. The second method responds to hardware signals, called
interrupts that force the program to call a subroutine.
The AT89S52 has a total of six interrupt vectors: two external interrupts (INT0 and
INT1), three timer interrupts (Timers 0, 1, and 2), and the serial port interrupt. Each of these
interrupt sources can be individually enabled or disabled by setting or clearing a bit in
Special Function Register IE. IE also contains a global disable bit, EA, which disables all
interrupts at once.
Each interrupt forces the processor to jump at the interrupt location in the memory.
The interrupted program must resume operation at the instruction where the interrupt took
place. Program resumption is done by storing the interrupted PC address on to stack.
RETI instruction at the end of ISR will restore the PC address.
4.4.12 MICROCONTROLLER CONFIGURATION USED IN THE SET-UP

The microcontroller is interfaced with the ADC in polling mode. INT0 is used for the
LCD mode selection switch in order to switch between two modes of display:
1) Sensor output display
2) Actuator status display
Port details:
Port 0: Interfaced with the LCD data lines.
Port 1: Interfaced with the ADC data lines
Port 2: Interfaced with the LCD Control lines and AC Interface control
Port 3: Interfaced with the ADC control lines
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ADC_D0
P1.0
VCC
LED+
P0.0
ADC_D1
P1.1
ADC_D2
P1.2
ADC_D3
ADC_D4
ADC_D5
ADC_D6
ADC_D7
ADC_A
ADC_ALE
P0.2
P0.3
P0.4
P1.4
DB1
DB2
DB3
DB4
P1.5
P0.5
DB5
P1.6
P0.6
DB6
P1.7
P3.4
P3.5
P0.7
AT89S52
DB7
EA
ALE
P3.1
PSEN
ADC_EOC
ADC_OE
DB0
P1.3
ADC_B
ADC_START
P0.1
P2.7
P3.7
P2.6
ENABLE
P3.3
BUZZER
MODE SELECTION SWITCH
P2.5
P3.0
R/W (Read/Write)
RS (Register select)
P2.4
COOLER
P3.6
P3.2
30 pF
PUMP
P2.3
XTAL2
SPRAYER
P2.2
LIGHT 1
XTAL1
LIGHT 2
30 pF
10uF
RST
GND
RST
P2.1
GND
P2.0
8.2 k
Fig. 4.21 Microcontroller pin details

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4.5 LIQUID CRYSTAL DISPLAY

A liquid crystal display (LCD) is a thin, flat display device made up of any number of
color or monochrome pixels arrayed in front of a light source or reflector. Each pixel consists
of a column of liquid crystal molecules suspended between two transparent electrodes, and
two polarizing filters, the axes of polarity of which are perpendicular to each other. Without
the liquid crystals between them, light passing through one would be blocked by the other.
The liquid crystal twists the polarization of light entering one filter to allow it to pass through
the other.
Many microcontroller devices use 'smart LCD' displays to output visual information.
LCD displays designed around Hitachi's LCD HD44780 module, are inexpensive, easy to
use, and it is even possible to produce a readout using the 8x80 pixels of the display. They
have a standard ASCII set of characters and mathematical symbols.
For an 8-bit data bus, the display requires a +5V supply plus 11 I/O lines. For a 4-bit
data bus it only requires the supply lines plus seven extra lines. When the LCD display is not
enabled, data lines are tri-state and they do not interfere with the operation of the
microcontroller.
Data can be placed at any location on the LCD. For 162 LCD, the address locations
are:
First line
80
81
Second line
C0
C1
82
C2
83
84
C3
C4
85
C5
86
C6
through
8F
through CF
Fig 4.22 Address locations for a 2x16 line LCD

4.5.1 SIGNALS TO THE LCD
The LCD also requires 3 control lines from the microcontroller:
1) Enable (E)
This line allows access to the display through R/W and RS lines. When this line
is low, the LCD is disabled and ignores signals from R/W and RS. When (E) line is
high, the LCD checks the state of the two control lines and responds accordingly.
2) Read/Write (R/W)
This line determines the direction of data between the LCD and microcontroller.
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When it is low, data is written to the LCD. When it is high, data is read from the
LCD.
3) Register select (RS)
With the help of this line, the LCD interprets the type of data on data lines. When it is
low, an instruction is being written to the LCD. When it is high, a character is being written
to the LCD.
4.5.1.1 Logic status on control lines:
E - 0 Access to LCD disabled

- 1 Access to LCD enabled
R/W - 0 Writing data to LCD

- 1 Reading data from LCD
RS - 0 Instruction
- 1 Character
4.5.1.2 Writing and reading the data from the LCD:

Writing data to the LCD is done in several steps:
1) Set R/W bit to low
2) Set RS bit to logic 0 or 1 (instruction or character)
3) Set data to data lines (if it is writing)
4) Set E line to high
5) Set E line to low
Read data from data lines (if it is reading):
1) Set R/W bit to high
2) Set RS bit to logic 0 or 1 (instruction or character)
3) Set data to data lines (if it is writing)
4) Set E line to high
5) Set E line to low
4.5.2 PIN DESCRIPTION
Most LCDs with 1 controller has 14 Pins and LCDs with 2 controller has 16 Pins
(two pins are extra in both for back-light LED connections).
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Fig 4.23 Pin diagram of 2x16 line LCD
Table 4.23 Pin description of the LCD
4.6 ALARM CIRCUITRY

BUZZER:
A buzzer or beeper is a signaling device, usually electronic, typically used in
automobiles, household appliances such as a microwave oven.
Fig. 4.24 Electrical symbol of a buzzer
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It is connected to the control unit through the transistor that acts as an electronic
switch for it. When the switch forms a closed path to the buzzer, it sounds a warning in the
form of a continuous or intermittent buzzing or beeping sound.
The transistor acts as a normal controlled by the base connection. It switches ON
when a positive voltage from the control unit is applied to the base. If the positive voltage is
less than 0.6V, the transistor switches OFF. No current flows through the buzzer in this case
and it will not buzz. As can be seen in the buzzer circuitry given below, a protection resistor
of 10k ohm is used in order to protect the transistor from being damaged in case of excessive
current flow. In our system, the buzzer is designed to give a small beep whenever one of the
devices such as a cooler or a bulb turns on in order to alert the user.
Fig. 4.25 Buzzer circuitry
4.7 RELAYS
A relay is an electrical switch that opens and closes under the control of another
electrical circuit. In the original form, the switch is operated by an electromagnet to open or
close one or many sets of contacts. It was invented by Joseph Henry in 1835. Because a relay
is able to control an output circuit of higher power than the input circuit, it can be considered
to be, in a broad sense, a form of an electrical amplifier.
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Fig. 4.26 Sugar cube relay

Despite the speed of technological developments, some products prove so popular
that their key parameters and design features remain virtually unchanged for years. One such
product is the sugar cube relay, shown in the figure above, which has proved useful to
many designers who needed to switch up to 10A, whilst using relatively little PCB area
Since relays are switches, the terminology applied to switches is also applied to
relays. A relay will switch one or more poles, each of whose contacts can be thrown by
energizing the coil in one of three ways:
1.Normally - open (NO) contacts connect the circuit when the relay is activate d; the circuit
is disconnected when the relay is inactive. It is also called a FORM A contact or make
contact.
2.Normally - closed (NC) contacts disconnect the circuit when the relay is activated ; the
circuit is connected when relay is inactive. It is also called FORM B contact or
break contact
3.Change-over or double-throw contacts control two circuits ; one normally open contact
and one normally closed contact with a common terminal. It is also called a Form C
transfer contact.
The following types of relays are commonly encountered:
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"C" denotes the common terminal in SPDT and DPDT types

Fig. 4.27 Different types of Relays
SPST - Single Pole Single Throw: These have two terminals which can be connected
or disconnected. Including two for the coil, such a relay has four terminals in total. It
is ambiguous whether the pole is normally open or normally closed. The terminology
"SPNO" and "SPNC" is sometimes used to resolve the ambiguity.
SPDT - Single Pole Double Throw: A common terminal connects to either of two
others. Including two for the coil, such a relay has five terminals in total.
DPST - Double Pole Single Throw: These have two pairs of terminals. Equivalent to
two SPST switches or relays actuated by a single coil. Including two for the coil, such
a relay has six terminals in total. It is ambiguous whether the poles are normally open,
normally closed, or one of each.
DPDT - Double Pole Double Throw: These have two rows of change-over terminals.
Equivalent to two SPDT switches or relays actuated by a single coil. Such a relay has
eight terminals, including the coil.
QPDT - Quadruple Pole Double Throw: Often referred to as Quad Pole Double
Throw, or 4PDT. These have four rows of change-over terminals. Equivalent to four
SPDT switches or relays actuated by a single coil, or two DPDT relays. In total,
fourteen terminals including the coil.
The Relay interfacing circuitry used in the application is:
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1N4148
Fig. 4.28 Relay circuitry
4.8 POWER SUPPLY CONNECTION

The power supply section consists of step down transformers of 230V primary to 9V
and 12V secondary voltages for the +5V and +12V power supplies respectively. The stepped
down voltage is then rectified by 4 1N4007 diodes. The high value of capacitor 1000 F
charges at a slow rate as the time constant is low, and once the capacitor charges there is no
resistor for capacitor to discharge. This gives a constant value of DC. IC 7805 is used for
regulated supply of +5 volts and IC 7812 is used to provide a regulated supply of +12 volts in
order to prevent the circuit ahead from any fluctuations. The filter capacitors connected after
this IC filters the high frequency spikes. These capacitors are connected in parallel with
supply and common so that spikes filter to the common. These give stability to the power
supply circuit.
As can be seen from the above circuit diagrams, the rectified voltage from the 4
diodes is given to pin 1 of the respective regulators. Pin 2 of the regulators is connected to
ground and pin 3 to Vcc. With adequate heat sinking the regulator can deliver 1A output
current. If internal power dissipation becomes too high for the heat sinking provided, the
thermal shutdown circuit takes over preventing the IC from overheating.
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Vin
7805
3
Vout
GND
2
1000uf
10uf
230V, 50Hz
1uf
Fig. 4.29 +5V Power supply circuit
Fig. 4.30 +12V Power supply Circuit
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CIRCUIT SCHEMATIC OF THE SYSTEM
CHAPTER 5
SYSTEMS USED IN WORK MODE
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5.1 DRIP IRRIGATION SYSTEM FOR CONTROLLING SOIL MOISTURE

Drip, or micro-irrigation, technology uses a network of plastic pipes to carry a low
flow of water under low pressure to plants.
Polyethylene tubing is run from the source of water to the plant, where the emitter is
attached for dripping water. Emitter line (poly tubing with pre-installed emitters) is used
where a continuous band of water is needed. Fittings are available to make sharp turns
(elbows), branch lines (tees), and to make the transition between different sizes of tubing.
When plants are removed or die, drip lines should be plugged.
Fig. 5.1 Drip irrigation system

Drip irrigation (sometimes called trickle irrigation) works by applying water slowly,
directly to the soil. The high efficiency of drip irrigation results from two primary factors.
The first is that the water soaks into the soil before it can evaporate or run off. The second is
that the water is only applied where it is needed, (at the plant's roots) rather than sprayed
everywhere.
A drip irrigation system slowly provides water to the plant's root system. Regular
watering prevents plant dehydration, but roots don't get overly soaked and in turn, plant
growth can increase up to 50%. Drip systems irrigate all types of landscape: shrubs, trees,
perennial beds, ground covers, annuals and lawns. Drip is the best choice to water roof garDepartment of AE & I
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dens, containers on decks and patios, row crops and kitchen gardens, orchards, and
vineyards.
5.2 ARTIFICIAL GROWING LIGHTS FOR CONTROLLING ILLUMINATION
Growing lights enable cultivators to extend daylight hours - useful for winter and
spring growing when levels of natural lights can be low, and one can therefore improve plant
growth. Three basic types of lamps used in greenhouse lighting are:
Fluorescent lamps - These have the advantage of higher light efficiency with low
heat. This type of lamp is the most widely used for supplemental light. It is available
in a variety of colors but cool-white lamps are the most common. High intensity
(1500 ma) fluorescent tubes that require higher wattage are also commonly used to
reach 2000 foot candles.
Incandescent lamps - These vary in size from 60 watts to 500 watts. The grower can
vary foot-candle levels by adjusting the spacing and mounting height above the
plants.
High-intensity discharge (HID) lamps - These have a long life (5000 hours or
more). With improvements made possible by the addition of sodium and metalhalides, the lamp has a high emission of light in the regions utilized by plants.
The following generally accepted cultural divisions describe light levels:
Very high: Over 5000 footcandles--nearly full sun except at midday, when full
summer sun in most latitudes may reach 10,000 fc.
High: 4000-5000 footcandles--bright light, just under 50% of the full midday sun.
Intermediate: 1800-4000 footcandles--dappled sunlight.
Low: 1000-1800 footcandles--reduced sunlight, so that if a hand is passed over the

leaves it does not produce a shadow.
One footcandle is equal to 10.76 lux, although in the lighting industry, typically this
is approximated as 1 footcandle being equal to 10 lux.
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5.3 TEMPERATURE CONTROLLERS

5.3.1 COOLING EQUIPMENT
There are three primary cooling devices in most greenhouses. These are the vent system,
exhaust fan, and swamp cooler. Some greenhouses may make use of air conditioners and/or
misting systems as well.
Vents are hinged or track connected panels in the roof or sides of greenhouses. They
open up the greenhouse to outside natural air. Hot air that builds up in the greenhouse
can escape, and fresh air can enter the house. The microcontroller can be used to
automate the opening and closing of these vents depending upon requirement.
But during hot summer days, venting alone will not get the job done.
Exhaust fans can move a large volume of the hot greenhouse air out and pull fresh
air in through the rear vent. They're powerful for a reason, as full sun on a hot
summer day can cause temperatures inside the greenhouse to superheat. An exhaust
fan must be able to pull this air out, or the temperatures will continue to rise.
Swamp coolers: come in different widths and lengths. They can be configured to the
appropriate size, as this varies depending on the length and width of the greenhouse,
location where you live, and type of plants you wish to grow.
5.3.2 HEATING EQUIPMENT
Hot-water or steam heater: A hot-water system with circulator or a steam system

linked with automatic ventilation will give adequate temperature control. In some
areas, coal or natural gas is readily available at low cost. This fuel is ideal for hotwater or a central steam system. Steam has an advantage in that it can be used to
sterilize growing beds and potting soils.
Electric heaters: Overhead infrared heating equipment combined with soil cable heat
provides a localized plant environment, which allows plants to thrive even though the
surrounding air is at a lower than normal temperature. Electric resistance-type heaters
are used as space heaters or in a forced air system.
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5.4 HUMIDIFCATION SYSTEMS

Many evaporative cooling and humidifying systems are available: Foggers, Mist
systems, Roof Sprinklers, and Pan & Fan Systems. They add water vapour to the air, and
may subsequently reduce the amount of water that the plants need to transpire.
Roof sprinklers add water vapour and cool the incoming air. On large ranges, it is
possible to decrease the temperature by 3 - 5 C and increase the humidity by 5-10%.
Pad and fan systems consist of porous wet pads at the inlet end of a fan ventilated
greenhouse. As the exhaust fans draw air through the wet pads, water evaporates, cooling
and humidifying the air. Temperatures tend to be coolest nearer the fans and hottest at the
exhaust when using these systems.
Mist and fog systems produce tiny water droplets that evaporate, thereby cooling and
humidifying the greenhouse air. A misting system can provide needed moisture
to maintain a healthy humidity level of 50 to 70%.
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CHAPTER 6
SOFTWARE
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6.1 INTRODUCTION TO KEIL SOFTWARE

Keil MicroVision is an integrated development environment used to create software
to be run on embedded systems (like a microcontroller). It allows for such software to be
written either in assembly or C programming languages and for that software to be simulated
on a computer before being loaded onto the microcontroller.
6.1.1 WHAT IS Vision3?
Vision3 is an IDE (Integrated Development Environment) that helps write, compile,
and debug embedded programs. It encapsulates the following components:
A project manager.
A make facility.
Tool configuration.
Editor.
A powerful debugger.
6.1.2 STEPS FOLLOWED IN CREATING AN APPLICATION IN uVision3:
To create a new project in uVision3:
1. Select Project - New Project.
2. Select a directory and enter the name of the project file.
3. Select Project Select Device and select a device from Device Database.
4. Create source files to add to the project
5. Select Project - Targets, Groups, and Files. Add/Files, select Source Group1, and add
the source files to the project.
6. Select Project - Options and set the tool options. Note that when the target device is
selected from the Device Database all-special options are set automatically. Default
memory model settings are optimal for most applications.
7. Select Project - Rebuild all target files or Build target
To create a new project, simply start MicroVision and select Project=>New
Project from the pulldown menus. In the file dialog that appears, choose a name and base
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directory for the project. It is recommended that a new directory be created for each project,
as several files will be generated. Once the project has been named, the dialog shown in the
figure below will appear, prompting the user to select a target device. In this lab, the chip
being used is the AT89S52, which is listed under the heading Atmel.
Fig. 6.1 Window for choosing the target device

Next, MicroVision must be instructed to generate a HEX file upon program
compilation. A HEX file is a standard file format for storing executable code that is to be
loaded onto the microcontroller.
In the Project Workspace pane at the left, rightclick on Target 1 and select
Options for Target 1 .Under the Output tab of the resulting options dialog, ensure that
both the Create Executable and Create HEX File options are checked. Then click OK
as shown in the two figures below.
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Fig. 6.2 Project Workspace Pane
Fig. 6.3 Project Options Dialog
Next, a file must be added to the project that will contain the project code. To do this,
expand the Target 1 heading, rightclick on the Source Group 1 folder, and select Add
files Create a new blank file (the file name should end in .asm), select it, and click
Add. The new file should now appear in the Project Workspace pane under the Source
Group 1 folder. Double-click on the newly created file to open it in the editor. All code for
this lab will go in this file. To compile the program, first save all source files by clicking on
the Save All button, and then click on the Rebuild All Target Files to compile the
program as shown in the figure below. If any errors or warnings occur during compilation,
they will be displayed in the output window at the bottom of the screen. All errors and
warnings will reference the line and column number in which they occur along with a
description of the problem so that they can be easily located. Note that only errors indicate
that the compilation failed, warnings do not (though it is generally a good idea to look into
them anyway).
Fig. 6.4 Save All and Build All Target Files Buttons
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When the program has been successfully compiled, it can be simulated using the
integrated debugger in Keil MicroVision. To start the debugger, select Debug=>Start/Stop
Debug Session from the pulldown menus.
At the left side of the debugger window, a table is displayed containing several key
parameters about the simulated microcontroller, most notably the elapsed time (circled in the
figure below). Just above that, there are several buttons that control code execution. The
Run button will cause the program to run continuously until a breakpoint is reached,
whereas the Step Into button will execute the next line of code and then pause (the current
position in the program is indicated by a yellow arrow to the left of the code).
Fig. 6.5 Vision3 Debugger window
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Breakpoints can be set by doubleclicking on the grey bar on the left edge of the
window containing the program code. A breakpoint is indicated by a red box next to the line
of code.
Fig. 6.6 Reset, Run and Step into options

The current state of the pins on each I/O port on the simulated microcontroller can
also be displayed. To view the state of a port, select Peripherals=>I/O Ports=>Port n
from the pulldown menus, where n is the port number. A checked box in the port window
indicates a high (1) pin, and an empty box indicates a low (0) pin. Both the I/O port data and
the data at the left side of the screen are updated whenever the program is paused.
The debugger will help eliminate many programming errors, however the simulation
is not perfect and code that executes properly in simulation may not always work on the
actual microcontroller.
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6.1.3 DEVICE DATABASE

A unique feature of the Keil Vision3 IDE is the Device Database, which contains
information about more than 400 supported microcontrollers. When you create a new
Vision3 project and select the target chip from the database, Vision3 sets all assembler,
compiler, linker, and debugger options for you. The only option you must configure is the
memory map.
6.1.4 PERIPHERAL SIMULATION
The Vision3 Debugger provides complete simulation for the CPU and on-chip
peripherals of most embedded devices. To discover which peripherals of a device are
supported, in Vision3 select the Simulated Peripherals item from the Help menu. You may
also use the web-based Device Database. We are constantly adding new devices and
simulation support for on-chip peripherals so be sure to check Device Database often.
6.2 PROGRAMMER
The programmer used is a powerful programmer for the Atmel 89 series of
microcontrollers that includes 89C51/52/55, 89S51/52/55 and many more.
It is simple to use & low cost, yet powerful flash microcontroller programmer for the
Atmel 89 series. It will Program, Read and Verify Code Data, Write Lock Bits, Erase and
Blank Check. All fuse and lock bits are programmable. This programmer has intelligent
onboard firmware and connects to the serial port. It can be used with any type of computer
and requires no special hardware. All that is needed is a serial communication port which all
computers have.
All devices also have a number of lock bits to provide various levels of software and
programming protection. These lock bits are fully programmable using this programmer.
Lock bits are useful to protect the progam to be read back from microcontroller only
allowing erase to reprogram the microcontroller.
Major parts of this programmer are Serial Port, Power Supply and Firmware
microcontroller. Serial data is sent and received from 9 pin connector and converted to/from
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TTL logic/RS232 signal levels by MAX232 chip. A Male to Female serial port cable,
connects to the 9 pin connector of hardware and another side connects to back of computer.
All the programming intelligence is built into the programmer so you do not need
any special hardware to run it. Programmer comes with window based software for easy
programming of the devices.
6.3 ProLoad PROGRAMMING SOFTWARE

ProLoad is a software working as a user friendly interface for programmer boards
from Sunrom Technologies. Proload gets its name from Program Loader term, because
that is what it is supposed to do. It takes in compiled HEX file and loads it to the hardware.
Any compiler can be used with it, Assembly or C, as all of them generate compiled HEX
files. ProLoad accepts the Intel HEX format file generated from compiler to be sent to target
microcontroller. It auto detects the hardware connected to the serial port. It also auto detects
the chip inserted and bytes used. The software is developed in Delphi and requires no
overhead of any external DLL.
The programmer connects to the computers serial port (Comm 1, 2, 3 or 4) with a
standard DB9 Male to DB9 Female cable. Baud Rate - 57600, COMx Automatically selected
by window software. No PC Card Required.
After making the necessary selections, the Auto Program button is clicked as shown
in the figure below which burns the selected hex file onto the microcontroller.
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Fig. 6.7 Programming window
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CHAPTER 7
FLOWCHART
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7.1 FLOWCHART REPRESENTING THE WORKING OF THE SYSTEM:
START
INITIALISE THE LCD
DISPLAY INITIALISATION MESSAGE

B
INITIALISE THE ADC
OBTAIN THE SENSOR DATA

OBTAIN DIGITIZED DATA FROM ADC
STORE DIGITAL OUTPUT IN THE BUFFER MEMORY OF

THE MICROCONTROLLER
CLEAR THE LCD
IS MODE
BUTTON
PRESSED
YES
NO
DISPLAY THE DEVICE STATUS
DISPLAY THE SENSOR DATA
A
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YES
NO
SENSOR
THRESHOLD
CROSSED?
TURN ON ACTUATOR
TURN OFF ACTUATOR
7.2 FLOWCHART FOR LCD INITIALIZATION
START
INTILIAZE THE LCD WITH 2LINES, 5X7 MATRIX
CLEAR REGISTER SELECT, READ/WRITE

AND SET THE ENABLE PIN OF THE LCD
CALL SOME DELAY
CLEAR THE ENABLE PIN OF THE LCD
CALL SOME DELAY

C
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SET THE DISPLAY ON AND THE CURSOR ON

CALL SOME DELAY
CALL SOME DELAY
CLEAR THE LCD AND SHIFT THE CURSOR TO RIGHT

CALL SOME DELAY
CALL SOME DELAY
SHIFT THE CURSOR AT LINE 1, POSITION 0

D
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CALL SOME DELAY
CALL SOME DELAY
STOP
7.3 FLOWCHART FOR ADC INITIALIZATION
START
SELECT AN ANALOG CHANNEL BY SETTING

THE ADDRESS LINES A, B AND C
CLEAR THE OUTPUT ENABLE PIN
ACTIVATE THE ALE PIN WITH
A LOW TO HIGH PULSE
ACTIVATE THE START PIN BY A HIGH TO
LOW PULSE TO INITIATE CONVERSION
NO
IS
EOC =0?
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SET THE OUTPUT ENABLE PIN
CALL SOME DELAY
READ DATA OUT OF THE ADC CHIP
CLEAR THE OUTPUT ENABLE PIN
STOP
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CHAPTER 8
RESULT ANALYSIS
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RESULT ANALYSIS
0
Readings taken at room temperature of 27 C
8.1 TRANSDUCER READINGS

8.1.1 SOIL MOISTURE SENSOR
Tolerance= 0.2 V
Table 8.1 Soil moisture sensor readings
Soil Condition
Transducer
Optimum Range
Soil is dry
0V
Optimum level of
1.9- 3.5V
soil moisture
Slurry soil
>3.5V
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8.1.2 LIGHT SENSOR

Tolerance = 0.1V
Table 8.2 Light sensor readings
Illumination Status
Transducer Optimum
Range
OPTIMUM
0V-0.69V
ILLUMINATION
DIM LIGHT
0.7V-2.5V
DARK
2.5V- 3V
NIGHT
3V-3.47V
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8.1.3.1 FORMULA:
RH = ((Vout / Vcc) 0.16 )/0.0062, typical at 25C
(Ref. Eq.4.3)
where, Vsupply = 4.98V

Tolerance= 0.1V
Table 8.3 Humidity sensor readings
Percentage RH
Transducer Optimum Range
(RELATIVE HUMIDITY)
0%
0-0.8V
0% to 9.81%
0.8-1.1V
12.9% to 20.1%
1.2-1.45V
22.7% to 30.06%
1.5-1.725V
30.8% to 40.5%
1.75-2.05V
41.3%to50.3%
2.075-2.35V
51%to 60.02%
2.375-2.65
61.6%to70.5%
2.7-2.975V
71%to80.2%
3-3.275V
81.1%to 90%
3.3-3.6V
91%to 100%
3.6-3.9V
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8.1.4.1 FORMULA:
o
(Ref. Eq.4.4)
Temperature ( C ) = (Vout/5) *100( C/V)
Table 8.4 Temperature sensor readings
Temperature range in
Temperature sensor
degree Celsius
output(Vout)
100 C
0.5V
150 to 200 C
0.75-1.0V
20 0to 250 C
1.0-1.25V
250 to 30 0C
1.25-1.5V
30 0to 35 0C
1.5-1.75V
350 to 400 C
1.75-2.0V
400 to 45 0C
2.0-2.25V
450 to 500 C
2.25-2.5V
500 to 55 0C
2.5-2.75V
550 to 600C
2.75-3.0V
600 to 650 C
3.0-3.25V
650 to 70 0C
3.25-3.5V
70 0to 750 C
3.5-3.75V
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75 0to 80 0C
3.75-4.0V
80 0to 850 C
4.0-4.25V
85 0to 900 C
4.25-4.5V
900 to 95 0C
4.5-4.75V
950 to 1000 C
4.75-5V
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CHAPTER 9
ADVANTAGES AND DISADVANTAGES
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ADVANTAGES AND DISADVANTAGES

9.1 ADVANTAGES
1. Sensors used have high sensitivity and are easy to handle.
2. Low cost system, providing maximum automation.
3. Closed loop design prevents any chances of disturbing the greenhouse environment.
4. User is indicated for changes in actuator state thereby giving an option for manual
override.
5. Low maintenance and low power consumption.
6. The system is more compact compared to the existing ones, hence is easily portable.
7. Can be used for different plant species by making minor changes in the ambient
environmental parameters.
8. Can be easily modified for improving the setup and adding new features.
9. Labour saving.
10. Provides a user-friendly interface hence will have a greater acceptance by the
technologically unskilled workers.
11. In response to the sensors, the system will adjust the heating, fans, lighting, irrigation
immediately, hence protect greenhouse from damage.
12. Malfunctioning of single sensor will not affect the whole system.
13. Natural resource like water saved to a great extent.
9.2 DISADVANTAGES
1. Complete automation in terms of pest and insect detection and eradication cannot
be achieved.
2. No self-test system to detect malfunction of sensors.
3. Requires uninterrupted power supply.
4. Facility to remotely monitor the greenhouse is not possible.
Page 80
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CHAPTER 10
FUTURE SCOPE
Page 81
2009-2010
SCOPE FOR FURTHER DEVELOPMENT

1) The performance of the system can be further improved in terms of the operating speed,
memory capacity, instruction cycle period of the microcontroller by using other
controllers such as AVRs and PICs. The number of channels can be increased to interface
more number of sensors which is possible by using advanced versions of
microcontrollers.
2) The system can be modified with the use of a datalogger and a graphical LCD panel
showing the measured sensor data over a period of time.
3) A speaking voice alarm could be used instead of the normal buzzer.
4) This system can be connected to communication devices such as modems, cellular phones
or satellite terminal to enable the remote collection of recorded data or alarming of certain
parameters.
5) The device can be made to perform better by providing the power supply with the help of
battery source which can be rechargeable or non-rechargeable, to reduce the requirement
of main AC power.
6) Time bound administration of fertilizers, insecticides and pesticides can be introduced.
7) A multi-controller system can be developed that will enable a master controller along with
its slave controllers to automate multiple greenhouses simultaneously.
Page 82
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CHAPTER 11
CONCLUSION
Page 83
2009-2010
CONCLUSION
A step-by-step approach in designing the microcontroller based system for
measurement and control of the four essential parameters for plant growth, i.e. temperature,
humidity, soil moisture, and light intensity, has been followed. The results obtained from the
measurement have shown that the system performance is quite reliable and accurate.
The system has successfully overcome quite a few shortcomings of the existing
systems by reducing the power consumption, maintenance and complexity, at the same time
providing a flexible and precise form of maintaining the environment.
The continuously decreasing costs of hardware and software, the wider acceptance of
electronic systems in agriculture, and an emerging agricultural control system industry in
several areas of agricultural production, will result in reliable control systems that will
address several aspects of quality and quantity of production. Further improvements will be
made as less expensive and more reliable sensors are developed for use in agricultural
production.
Although the enhancements mentioned in the previous chapter may seem far in the
future, the required technology and components are available, many such systems have been
independently developed, or are at least tested at a prototype level. Also, integration of all
these technologies is not a daunting task and can be successfully carried out.
Page 84
2009-2010
REFERENCES
[1] Dr. R. Jayanthi, Prof. of Horticulture, UAS, GKVK, Bangalore.
IEEE Papers
[2] Stipanicev D., Marasovic J., Networked embedded greenhouse monitoring and control,
Proceedings of 2003 IEEE Conference on Control Applications, June 2003.
[3] Turnell, D.J. de Fatima, Q.V., Turnell, M., Deep, G.S., Freire, R.C.S., FarmWeb-an
integrated, modular farm automation system, Proceedings of IEEE International
Conference on Systems, Man, and Cybernetics, Vol. 2, Oct. 1998.
Books
[3] Rebecca Tyson Northen, Orchids As House Plants, Dover Publications, New York, 2
Edition, 1985.
nd
[4] Muhammad Ali Mazidi, Janice Gillispie Mazidi, Rolin D. Mc Kinlay , The 8051
nd
Microcontroller & Embedded Systems, Pearson Education Inc. 2 Edition, 2008.
[5] Myke Predko, Programming and Customising the 8051 Microcontroller, TMH, 1999.
[6] Kenneth J Ayala, The 8051 Microcontroller Architecture, Programming & Applications,
nd
Penram International, 2 Edition, 1996.
[7] Ramakant Gayakwad, Operational Amplifiers Linear Integrated Circuits, Prentice Hall of
rd
India, 3 Edition.
[8] National Semiconductors, CMOS Logic Databook
[9] SENSORS- The Journal of Applied Sensing Technology, Advanstar Communications Inc
Page 85
2009-2010
Web Resources
[10]
http://freewebs.com/maheshwankede
[11]
http://www.faludi.com
[12]
http://www.electro-tech-online.com
[12]
http://www.8052.com
[13]
http://www.8051projects.net/forum
[14]
http://www.roboticsindia.com
[15]
http://www.datasheetdirect.com
[16]
[17]
http://www.keil.com/appnotes
http://www.google.com
Page 86
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ANNEXURE - I
Page 87
2009-2010
1. Final Prototype:
19
21
20
22
18
17
1
16
10
15
14
13
4
9
14
5
7
12
1. Power Supply +5V

2. Temperature Sensor
3. Humidity Sensor
4. Light sensor
5. Moisture Sensor
6. Power supply junction
7. ADC and Clock circuit board
8. Relay board.
9. Buzzer circuit board
10. Microcontroller board
11. Buzzer
12. Mode selection switch
13. DC -switch
14. LCD Display
15. AC- switch

16. AC fan
17. Power Supply +12V
18. 230V- 9V transformer
19. AC- bulb simulating light1
20. AC- bulb simulating light2
21. AC- bulb simulating sprayer
22. AC-bulb simulating pump
Page 88
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Light Sensor
Soil Moisture Sensor
Humidity Sensor
Temperature Sensor
ADC and Clock Circuit
Page 89
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Microcontroller Board and Buzzer Circuitry
The Two Display Modes of LCD
AC Interface Relay Board
Page 90
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ANNEXURE - II
Page 91
2009-2010
Bill Of Materials:
Sl. No.
1.
2.
List of electrical components

230V, 50Hz,9V transformer
12-0-12V, 500mA,
Quantity in
numbers
1
1
3.
Bridge rectifier
4.
1000uF Electrolytic capacitor
5.
6.
7.
30pF Ceramic capacitor
8.
1nF Ceramic capacitor
9.
10k resistance
20
10.
8.2k resistance
11.
1.2k resistance
12.
1k resistance
13.
1.8k resistance
14.
330 resistance
15.
100 resistance
16.
12.5k resistance
17.
LM7805
18.
LM7812
19.
2x16 Matrix LCD
Page 92
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20.
ADC0809
21.
AT89S52 Microcontroller
22.
Push to ON button
23.
Toggle switches
24.
BC107
25.
Buzzer
26.
8-pin connectors
27.
3-pin connectors
28.
2-pin connectors
15
Single connectors
35
29.
CD4093 Schmitt trigger IC
30.
BC547 Transistor
10
31.
Sugar cube relays
32.
11.0592 MHz Crystal
33.
LDR 12mm
34.
LM324
35.
LM35
36.
2N222N Transistor
37.
HIH4000-001
38.
12.5 k Resistor
39.
AC 5W bulbs
40.
AC 230V Cooling Fan
Page 93
2009-2010
41.
16 Pin Connector
42.
10 Preset
43.
10k Bourns Pot
44.
2.2K Resistor
45.
10k Strip Resistor
46.
0.1uF Tantalum Capacitor
47.
Heat Sink
48.
LED
10
49.
Copper Wire 32AWG
0.5 m
50.
AC Power Cord
2m
51.
Wire Cap
1m
52.
Varo Board(Shoted, Non Shoted )
4 pc, 5pc
53.
HOT GLUE GUN
54.
Fevi Quick
As per
requirement
55.
Connecting Wires
2m
Page 94
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ANNEXURE - III
Page 95
2009-2010
1. SYSTEM INSTALLATION AND FAULT REDUCTION:

The system has to be provided with uninterrupted power supply and should be
installed with care, in a place where the changes in microclimatic parameters are well
pronounced.
For best results with the moisture sensor, the probes must be inserted into the
specimen soil when the soil is dry.
For best results with the humidity sensor HIH4000
Do not expose sensor to condensing environments. Exposure to condensing

environments will cause sensor output to indicate 0 %RH.
Sensor is light sensitive. For best performance, shield sensor from bright light.
Sensor is static sensitive. Sensor connection protected to 15 kV maximum.

For best results with the temperature sensor, the LM35 and accompanying wiring and
circuits must be kept insulated and dry, to avoid leakage and corrosion. Printed-circuit
coatings and varnishes such as Humiseal and epoxy paints or dips can be used to insure that
moisture does not corrode the LM35 or its connections.
2. TROUBLE SHOOTING:
In case of a system hang-up condition, the reset button in the vicinity of the
Microcontroller can be used to revive the system.
In case of anomalies in the readings of the humidity sensor, it is recommended that
the sensor be kept in an air -tight container with silica-gel inside.
In case of anomalies with the moisture sensor, the probes can be stripped off the soil
or mud particles deposited on its surface and in case of sensor-leads-oxidation, it is
recommended that the leads be replaced.
Page 96
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ANNEXURE - IV
Page 97
2009-2010
Source Code
;Chinmaynanda Das, Chandan kumar Singh ,Summit Jindal, Asish Nanda,
Shrideep ;Mohapatra,Nisith Kumar Roy
;Dhaneswar Rath Institute of Engineering and Medical Science, Cuttack
;--------------------------------------------------------;ADC inputs
;IN4 - LM35
;IN5 - MOISTURE SENSOR
;IN6 - HIH4000
;IN7 - LIGHT SENSOR
;ADD_C Connected to Vcc
;--------------------------------------------------------; Microcontroller connections to LCD.
RS
RW
E
BIT
BIT
BIT
P2.5
P2.6
P2.7
; P2.5 is connected to RS pin of LCD

; P2.6 is connected to R/W pin of LCD
; P2.5 is connected to E pin of LCD
LCDDATA
equ
P0
; P0.0-P0.7 are connected to LCD data pins D0-D7
SWITCH
equ
P3.2
; P3.2 (INT0) is connected to SWITCH for LCD
; Microcontroller connections to ADC0808/9 lines.

OE
START
EOC
ADD_A
ADD_B
ALE
EQU
EQU
EQU
EQU
EQU
EQU
P3.0
P3.1
P3.3
P3.4
P3.5
P3.7
ADCDATA
EQU
P1
;
;
;
;
;
;
Pin
Pin
Pin
Pin
Pin
Pin
9 Output Enable
6 Start
7 EOC
25 ADD A
24 ADD B
22 ALE
; Data Lines
; Microcontroller connections to Actuators

COOLER
EQU
P2.4
PUMP EQU
P2.3
SPRAYER
EQU
P2.2
LIGHT1
EQU
P2.1
LIGHT2
EQU
P2.0
BUZZER
EQU
P3.6
;--------------------------------------------------------; Register definitions.
LCD_INTR
BIT
BUZZ
BUZZ1
BUZZ2
BUZZ3
BIT
BIT
BIT
BIT
00h
01h
02h
03h
04h
;LCD Interrupt flag bit

;Buzzer
;Buzzer
;Buzzer
;Buzzer
flag
flag
flag
flag
Page 98
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T_BUFFER
M_BUFFER
RH_BUFFER
L_BUFFER
LIGHT_LEVEL
MOIST_LEVEL
EQU
EQU
EQU
EQU
EQU
EQU
30h
31h
32h
33h
34h
35h
;Temperature buffer (ADC o/p)

;Soil Moisture buffer (ADC o/p)
;RH buffer (ADC o/p)
;Light buffer (ADC o/p)
;Buffer to store light level
;Buffer to store moisture level
;---------------------------------------------------------org 00h
LJMP main
org 03h
LJMP int_isr ; Interrupt for the LCD switch
org 07h
main:
CLR 0A0h
CLR 0B0h
SETB BUZZER
LCALL DELAY
CLR BUZZER
MOV
MOV
MOV
MOV
MOV
MOV
60h,
61h,
62h,
63h,
64h,
65h,
#'C'
#':'
#' '
#'O'
#'F'
#'F'
;Clear Port 2 for the actuators to turn off

;Clear port 3 for the buzzer to turn off
;Turn off buzzer
; Intitialising Actuator status message
MOV 66h, #' '

MOV 67h, #' '
MOV
MOV
MOV
MOV
MOV
MOV
MOV
68h,
69h,
6Ah,
6Bh,
6Ch,
6Dh,
6Eh,
#'P'
#'U'
#':'
#'O'
#'F'
#'F'
#0
MOV
MOV
MOV
MOV
MOV
MOV
70h,
71h,
72h,
73h,
74h,
75h,
#'S'
#'P'
#':'
#'O'
#'F'
#'F'
MOV 76h, #' '

MOV 77h, #' '
MOV
MOV
MOV
MOV
MOV
MOV
MOV
78h,
79h,
7Ah,
7Bh,
7Ch,
7Dh,
7Eh,
#'L'
#'I'
#':'
#'O'
#'F'
#'F'
#0
Page 99
2009-2010

;Main Code
;----------------------------------------------------------------------MOV TMOD, #01h
;Timer 0 Mode 1, 16 bit timer (for generating 5
second delay for LCD)
SETB TCON.0
;Make INT0 edge triggered
MOV IE, #81h ;Enable INT0
CLR LCD_INTR ;Make LCD interrupt flag =0
ACALL lcd_init
;LCD initialisation
ACALL line_1 ;Display welcome message
back:
ACALL adcread
;Read sensor data from ADC
ACALL data_display ;call routine to display to LCD
ACALL threshold_check
;call routine to check threshold
SJMP back
;repeat ADC process
lcd_init:
MOV A, #38H
ACALL comnwrt
ACALL lcddelay
MOV A, #0EH
ACALL comnwrt
ACALL lcddelay
MOV A, #01
ACALL comnwrt
ACALL lcddelay
MOV A, #06H
ACALL comnwrt
ACALL lcddelay
RET
;LCD initialisation
;init. LCD 2 lines,5x7 matrix (CHANGE THIS!!!)
;call command subroutine
;give LCD some time
;display on, cursor on
;give LCD some time
;clear LCD
;give LCD some time
;shift cursor right
;give LCD some time
line_1:
MOV A, #080H
ACALL comnwrt
ACALL lcddelay
MOV DPTR, #init1
repeat1:
CLR A
MOVC A, @A+DPTR
JZ line_2
ACALL datawrt
ACALL lcddelay
INC DPTR
SJMP repeat1
;Displaying initialisation message

;cursor at line 1, position 0
;give LCD some time
;address of line 1 of initialisation message
line_2:
MOV A, #0C0h
ACALL comnwrt
ACALL lcddelay
MOV DPTR, #init2
repeat2:
CLR A
MOVC A, @A+DPTR
JZ line_3
LCALL datawrt
LCALL lcddelay
INC DPTR
SJMP repeat2
;moving the data to accumulator

;call data display routine
;give LCD some time
;increment address

;give LCD some time
;give LCD some time
;increment address
;jump to label repeat2
Page 100
2009-2010

line_3:
MOV A, #080H
ACALL comnwrt
ACALL lcddelay
MOV DPTR, #init3
repeat3:
CLR A
MOVC A, @A+DPTR
JZ line_4
ACALL datawrt
ACALL lcddelay
INC DPTR
SJMP repeat3
line_4:
MOV A, #0C0h
ACALL comnwrt
ACALL lcddelay
MOV DPTR, #init4
repeat4:
CLR A
MOVC A, @A+DPTR
JZ line_5
LCALL datawrt
LCALL lcddelay
INC DPTR
SJMP repeat4
line_5:
MOV A, #080H
ACALL comnwrt
ACALL lcddelay
MOV DPTR, #init5
repeat5:
CLR A
MOVC A, @A+DPTR
JZ line_6
ACALL datawrt
ACALL lcddelay
INC DPTR
SJMP repeat5
line_6:
MOV A, #080H
ACALL comnwrt
ACALL lcddelay
MOV DPTR, #init6
repeat6:
CLR A
MOVC A, @A+DPTR
JZ line_7
LCALL datawrt
LCALL lcddelay
INC DPTR
SJMP repeat6

;give LCD some time
;give LCD some time
;increment address

;give LCD some time
;give LCD some time
;increment address
;give LCD some time
;give LCD some time
;increment address

;give LCD some time
;give LCD some time
;increment address
line_7:
MOV A, #0C0h
ACALL comnwrt

Page 101
2009-2010

ACALL lcddelay
;give LCD some time
MOV DPTR, #init7
repeat7:
CLR A
MOVC A, @A+DPTR
JZ exit
LCALL datawrt
LCALL lcddelay
;give LCD some time
INC DPTR
;increment address
SJMP repeat7
exit:
MOV A, #01h
;clear LCD
LCALL comnwrt
LCALL
lcddelay
;give LCD some time
RET
comnwrt:
;send command to LCD
MOV LCDDATA, A
;copy reg A to port1
CLR RS
;RS=0 for command
CLR RW
;R/W=0 for write
SETB E
;E=1 for high pulse
MOV R3,#50
REG_3:
MOV R4,#255
DJNZ R4,$
DJNZ R3,REG_3
CLR E
;E=0 for H-to-L pulse
RET
datawrt:
;write data to LCD
MOV LCDDATA, A
;copy reg A to port1
SETB RS
;RS=1 for data
CLR RW
;R/W=0 for write
SETB E
;E=1 for high pulse
MOV R3,#50
REG_4:
MOV R4,#255
DJNZ R4,$
DJNZ R3,REG_4
CLR E
;E=0 for H-to-L pulse
RET
lcddelay:
;Delay routine for LCD
MOV R3, #50
here2:
MOV R4, #255
here3:
DJNZ R4, here3
;stay until R4 becomes 0
DJNZ R3, here2
RET
adcread:
;Initializing ADC
;SENSOR 1
MOV ADCDATA, #0FFH ; Data lines for input
SETB EOC
; Make EOC i/p
ACALL delay
CLR ALE
; clearing ALE
CLR START
; Make start high
CLR OE
; Disable o/p
CLR ADD_A
;A=0
CLR ADD_B
;B=0 ;Select IN4
ACALL delay
SETB ALE
;latching the address
Page 102
2009-2010

ACALL delay
SETB START
ACALL delay
CLR ALE
CLR START
JB EOC,$
JNB EOC,$
ACALL delay
SETB OE
ACALL delay
MOV T_BUFFER, ADCDATA
CLR OE
;SENSOR 2
MOV ADCDATA, #0FFH
SETB EOC
ACALL delay
CLR ALE
CLR START
CLR OE
SETB ADD_A
CLR ADD_B
ACALL delay
SETB ALE
ACALL delay
SETB START
ACALL delay
CLR ALE
CLR START
JB EOC,$
JNB EOC,$
ACALL delay
SETB OE
ACALL delay
MOV M_BUFFER, ADCDATA
CLR OE
;SENSOR 3
MOV ADCDATA, #0FFH
SETB EOC
ACALL delay
CLR ALE
CLR START
CLR OE
CLR ADD_A
SETB ADD_B
ACALL delay
SETB ALE
ACALL delay
SETB START
ACALL delay
CLR ALE
CLR START
JB EOC,$
JNB EOC,$
ACALL delay
SETB OE
ACALL delay
MOV RH_BUFFER, ADCDATA
CLR OE
;start conversion pulse

;ALE H-L transition
;START H-L transition
;enable o/p
;store adc data to buffer
;disable o/p
; Data lines for input
; Make EOC i/p
; clearing ALE
; Make start high
; Disable o/p
;A=1
;B=0 Select IN5
;ALE H-L transition
;enable o/p
;disable o/p
; Data lines for input
; Make EOC i/p
; clearing ALE
; Make start high
; Disable o/p
;A=0
;B=1 Select IN6
;ALE H-L transition
;enable o/p
;disable o/p
Page 103
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;SENSOR 4
MOV ADCDATA, #0FFH ; Data lines for input
SETB EOC
; Make EOC i/p
ACALL delay
CLR ALE
; clearing ALE
CLR START
; Make start high
CLR OE
; Disable o/p
SETB ADD_A
;A=1
SETB ADD_B
;B=1 Select IN7
ACALL delay
SETB ALE
ACALL delay
SETB START
ACALL delay
CLR ALE
;ALE H-L transition
CLR START
JB EOC,$
JNB EOC,$
ACALL delay
SETB OE
ACALL delay
MOV L_BUFFER, ADCDATA
CLR OE
RET
delay:
MOV R3, #250
here1:
MOV R4, #255
here:
DJNZ R4, here
DJNZ R3, here1
RET
data_display:
data
;enable o/p
;disable o/p
;Delay subroutine
;LCD routine to display sensor and actuator
JNB LCD_INTR, sensor_display
;if ACT=0, jump to display sensor data
label
MOV A, #01h
ACALL comnwrt
ACALL lcddelay
MOV A,#80H
ACALL comnwrt
ACALL lcddelay
MOV R0, #60h
line1:
CLR A
MOV A, @R0
JZ nxt_line
LCALL datawrt
LCALL lcddelay
INC R0
SJMP line1
nxt_line:
MOV
A, #0C0h
;clear LCD
;give LCD some time
;give LCD some time
;address of display message line 1
;exit loop on completion of display and start
;display of LCD next line
;give LCD some time
;increment address
;repeat display till end of message
;Displaying on line 2 of LCD
Page 104
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LCALL
comnwrt
LCALL
lcddelay
MOV R0, #70h
line2:
CLR A
MOV A, @R0
JZ delay_5s
LCALL datawrt
LCALL lcddelay
INC R0
SJMP line2

;give LCD some time
;address of display message line 2
;exit loop on completion of display & call routine
;to wait 5 sec
;give LCD some time
;increment address
;repeat display till end of message
delay_5s:
MOV R7, #100
sec_5:
MOV TL0, #0FDh
MOV TH0, #4Bh
SETB TR0
JNB TF0, $
CLR TR0
CLR TF0
DJNZ R7, sec_5
;5 second delay routine

;REPEAT 100 TIMES (50ms*100= 5sec)
MOV A, #01h
LCALL comnwrt
LCALL
lcddelay
;clear LCD
sensor_display:
MOV
A,#80H
LCALL
comnwrt
LCALL
lcddelay
;displaying sensor data

;give LCD some time
MOV
LCALL
LCALL
MOV
LCALL
LCALL
;display letter T
;call display subroutine
;give LCD some time
;display : symbol
;give LCD some time
A, #'T'
datawrt
lcddelay
A, #':'
datawrt
lcddelay
;load 4BFDh for 5ms delay

;Start timer 0
;Check for end of count
;Stop timer
;Clear timer 0 flag
;Repeat till R7=0
;give LCD some time
MOV A, T_BUFFER
MOV DPTR, #temp_tens
MOVC A, @A+DPTR
LCALL
datawrt
LCALL
lcddelay
;move sensor data from buffer to accumulator

;address of ASCII code look up table (tens place)
;store corresponding ASCII code to Accumulator
;give LCD some time
MOV A, T_BUFFER
MOV DPTR, #temp_ones
MOVC A, @A+DPTR
LCALL
datawrt
LCALL
lcddelay

;address of ASCII code look up table (ones place)
;give LCD some time
MOV
LCALL
LCALL
;display . symbol
;give LCD some time
A, #'.'
datawrt
lcddelay
MOV A, T_BUFFER
MOV DPTR, #temp_dec

;address of ASCII code look up table (dec. place)
Page 105
2009-2010

MOVC A, @A+DPTR
LCALL
datawrt
LCALL
lcddelay

;give LCD some time
MOV
LCALL
LCALL
MOV
LCALL
LCALL
A, #0DFh
datawrt
lcddelay
A, #'C'
datawrt
lcddelay
;display degree symbol

;give LCD some time
;display letter C
;give LCD some time
MOV
LCALL
LCALL
A, #' '
datawrt
lcddelay
;display space
;give LCD some time
;DISPLAYING SENSOR 2: SOIL MOISTURE

MOV
LCALL
LCALL
MOV
LCALL
LCALL
A, #'S'
datawrt
lcddelay
A, #':'
datawrt
lcddelay
MOV A, M_BUFFER
CJNE A, #67h, dry
dry:
JNC optimum
MOV MOIST_LEVEL, #1
MOV
A, #'D'
LCALL
datawrt
LCALL
lcddelay
MOV
A, #'r'
LCALL
datawrt
LCALL
lcddelay
MOV
A, #'y'
LCALL
datawrt
LCALL
lcddelay
MOV
A, #' '
LCALL
datawrt
LCALL
lcddelay
MOV
A, #' '
LCALL
datawrt
LCALL
lcddelay
SJMP moist_over
optimum:
MOV A, M_BUFFER
CJNE A, #78h, disp_opt
disp_opt:
JNC slurry
MOV MOIST_LEVEL, #2
MOV
A, #'O'
LCALL
datawrt
LCALL
lcddelay
MOV
A, #'p'
LCALL
datawrt
LCALL
lcddelay
;display letter S
;give LCD some time
;display : symbol
;give LCD some time
;Store level in a buffer (for threshold check)

;display D
;give LCD some time
;display r
;give LCD some time
;display y
;give LCD some time
;display space
;give LCD some time
;display space
;give LCD some time
;normal condition

;display O
;give LCD some time
;display p
;give LCD some time
Page 106
2009-2010

MOV
A, #'t'
LCALL
datawrt
LCALL
lcddelay
MOV
A, #'.'
LCALL
datawrt
LCALL
lcddelay
MOV
A, #' '
LCALL
datawrt
LCALL
lcddelay
SJMP moist_over
slurry:
MOV MOIST_LEVEL, #3
MOV
A, #'E'
LCALL
datawrt
LCALL
lcddelay
MOV
A, #'x'
LCALL
datawrt
LCALL
lcddelay
MOV
A, #'c'
LCALL
datawrt
LCALL
lcddelay
MOV
A, #'e'
LCALL
datawrt
LCALL
lcddelay
MOV
A, #'s'
LCALL
datawrt
LCALL
lcddelay
;display t
;give LCD some time
;display space
;give LCD some time
;display space
;give LCD some time

;display E
;give LCD some time
;display x
;give LCD some time
;display c
;give LCD some time
;display e
;give LCD some time
;display s
;give LCD some time
moist_over:
;DISPLAYING SENSOR 3: RELATIVE HUMIDITY
MOV
LCALL
LCALL
A, #0C0H
comnwrt
lcddelay

;give LCD some time
MOV
LCALL
LCALL
MOV
LCALL
LCALL
MOV
LCALL
LCALL
A, #'R'
datawrt
lcddelay
A, #'H'
datawrt
lcddelay
A, #':'
datawrt
lcddelay
;display letter R
;give LCD some time
;display letter H
;give LCD some time
;display : symbol
;give LCD some time
MOV A, RH_BUFFER
MOV DPTR, #rh_tens
MOVC A, @A+DPTR
LCALL
datawrt
LCALL
lcddelay

;address of ASCII code look up table (tens place)
;give LCD some time
MOV A, RH_BUFFER
MOV DPTR, #rh_ones
MOVC A, @A+DPTR
LCALL
datawrt
LCALL
lcddelay

;give LCD some time
Page 107
2009-2010
MOV
LCALL
LCALL
A, #'.'
datawrt
lcddelay
;display . symbol
;give LCD some time
MOV A, RH_BUFFER
MOV DPTR, #rh_dec
MOVC A, @A+DPTR
LCALL
datawrt
LCALL
lcddelay

;give LCD some time
MOV
LCALL
LCALL
A, #'%'
datawrt
lcddelay
;display % symbol
;give LCD some time
MOV
LCALL
LCALL
A, #' '
datawrt
lcddelay
;display space
;give LCD some time
;DISPLAYING SENSOR 4: LIGHT

MOV
LCALL
LCALL
MOV
LCALL
LCALL
A, #'L'
datawrt
lcddelay
A, #':'
datawrt
lcddelay
MOV A, L_BUFFER
CJNE A, #25h, bright
bright:
JNC normal
MOV LIGHT_LEVEL, #1
MOV
A, #'O'
LCALL
datawrt
LCALL
lcddelay
MOV
A, #'p'
LCALL
datawrt
LCALL
lcddelay
MOV
A, #'t'
LCALL
datawrt
LCALL
lcddelay
MOV
A, #'.'
LCALL
datawrt
LCALL
lcddelay
MOV
A, #' '
LCALL
datawrt
LCALL
lcddelay
LJMP light_over
normal:
MOV A, L_BUFFER
CJNE A, #82h, disp_norm
disp_norm:
JNC dim
MOV LIGHT_LEVEL, #2
MOV
A, #'D'
LCALL
datawrt
;display letter L
;give LCD some time
;display : symbol
;give LCD some time

;display S
;give LCD some time
;display u
;give LCD some time
;display n
;give LCD some time
;display n
;give LCD some time
;display space
;give LCD some time

;display D
Page 108
2009-2010

LCALL
MOV
LCALL
LCALL
MOV
LCALL
LCALL
MOV
LCALL
LCALL
MOV
LCALL
LCALL
lcddelay
A, #'i'
datawrt
lcddelay
A, #'m'
datawrt
lcddelay
A, #' '
datawrt
lcddelay
A, #' '
datawrt
lcddelay
;give LCD some time

;display i
;give LCD some time
;display m
;give LCD some time
;display space
;give LCD some time
;display space
;give LCD some time
SJMP light_over
dim:
MOV A, L_BUFFER
CJNE A, #9Dh, disp_dim
disp_dim:
JNC dark
MOV LIGHT_LEVEL, #3
MOV
A, #'D'
LCALL
datawrt
LCALL
lcddelay
MOV
A, #'a'
LCALL
datawrt
LCALL
lcddelay
MOV
A, #'r'
LCALL
datawrt
LCALL
lcddelay
MOV
A, #'k'
LCALL
datawrt
LCALL
lcddelay
MOV
A, #' '
LCALL
datawrt
LCALL
lcddelay

;display D
;give LCD some time
;display a
;give LCD some time
;display r
;give LCD some time
;display k
;give LCD some time
;display space
;give LCD some time
SJMP light_over
dark:
MOV LIGHT_LEVEL, #4
MOV
A, #'N'
LCALL
datawrt
LCALL
lcddelay
MOV
A, #'i'
LCALL
datawrt
LCALL
lcddelay
MOV
A, #'g'
LCALL
datawrt
LCALL
lcddelay
MOV
A, #'h'
LCALL
datawrt
LCALL
lcddelay
MOV
A, #'t'
LCALL
datawrt
LCALL
lcddelay

;display N
;give LCD some time
;display i
;give LCD some time
;display g
;give LCD some time
;display h
;give LCD some time
;display t
;give LCD some time
Page 109
2009-2010

light_over:
RET
threshold_check:
temp_check:
;CHECKING TEMPERATURE THRESHOLD
MOV A, T_BUFFER
;read sensor data from buffer
CJNE A, #83, t_not_equal
;check for ambient temp (32deg C)
SJMP t_within_thresh
;end of threshold checking routine
t_not_equal:
JC t_within_thresh
;jump to within threshold routine
t_outside_thresh:
SETB COOLER
JB BUZZ, no_buzz
SETB BUZZER
ACALL delay
CLR BUZZER
SETB BUZZ
no_buzz:
MOV 63h, #' '
MOV 64h, #'O'
MOV 65h, #'N'
SJMP light_check
t_within_thresh:
MOV A, T_BUFFER
CJNE A, #73, ht_off
ht_off:
JNC light_check
CLR COOLER
CLR BUZZ
MOV 63h, #'O'
MOV 64h, #'F'
MOV 65h, #'F'
light_check:
MOV A, LIGHT_LEVEL
CJNE A, #1, lev2
CLR LIGHT1
CLR LIGHT2
CLR BUZZ1
MOV 7Bh, #'O'
MOV 7Ch, #'F'
MOV 7Dh, #'F'
SJMP humid_check
lev2:
MOV A, LIGHT_LEVEL
CJNE A, #2, lev3
SETB LIGHT1
CLR LIGHT2
JB BUZZ1, no_buzz1
SETB BUZZER
ACALL delay
CLR BUZZER
SETB BUZZ1
no_buzz1:
;turn on heater
;turn on buzzer
;turn off buzzer
;set the buzzer flag high
;turn off heater
;CHECKING LIGHT THRESHOLDS
;turn off light 1

;turn off light 2
;turn on light1
;turn off light2
;turn on buzzer
;turn off buzzer
Page 110
2009-2010

MOV 7Bh, #' '
MOV 7Ch, #'O'
MOV 7Dh, #'N'
SJMP humid_check
lev3:
MOV A, LIGHT_LEVEL
CJNE A, #3, lev4
SETB LIGHT1
SETB LIGHT2
JB BUZZ1, no_buzz11
SETB BUZZER
ACALL delay
CLR BUZZER
SETB BUZZ1
no_buzz11:
MOV 7Bh, #' '
MOV 7Ch, #'O'
MOV 7Dh, #'N'
SJMP humid_check
lev4:
CLR LIGHT1
CLR LIGHT2
CLR BUZZ1
MOV 7Bh, #'O'
MOV 7Ch, #'F'
MOV 7Dh, #'F'
humid_check:
MOV A, RH_BUFFER
CJNE A, #40, h_not_equal
SJMP h_within_thresh
h_not_equal:
JNC h_within_thresh
h_outside_thresh:
SETB SPRAYER
JB BUZZ2, no_buzz2
SETB BUZZER
ACALL delay
CLR BUZZER
SETB BUZZ2
no_buzz2:
MOV 73h, #' '
MOV 74h, #'O'
MOV 75h, #'N'
SJMP moist_check
;turn on light1
;turn on light2
;turn on buzzer
;turn off buzzer
;turn off light1

;turn off light2
;read sensor data from buffer

;check for ambient RH
;end of threshold checking routine
;jump to within threshold routine
;turn on sprayer
;turn on buzzer
;turn off buzzer
h_within_thresh:
CJNE A,#70, sp_off
sp_off:
JC moist_check
CLR
CLR
MOV
MOV
MOV
SPRAYER
BUZZ2
73h, #'O'
74h, #'F'
75h, #'F'
;turn off sprayer
moist_check:
;CHECKING MOISTURE THRESHOLDS
MOV A, MOIST_LEVEL
CJNE A, #1, level2
SETB PUMP
;turn on pump
Page 111
2009-2010

JB BUZZ3, no_buzz3
SETB BUZZER
ACALL delay
CLR BUZZER
SETB BUZZ3
no_buzz3:
MOV 6Bh, #' '
MOV 6Ch, #'O'
MOV 6Dh, #'N'
SJMP th_end_check
level2:
MOV A, MOIST_LEVEL
CJNE A, #2, level3
CLR PUMP
CLR BUZZ3
MOV 6Bh, #'O'
MOV 6Ch, #'F'
MOV 6Dh, #'F'
SJMP th_end_check
level3:
CLR PUMP
CLR BUZZ3
MOV 6Bh, #'O'
MOV 6Ch, #'F'
MOV 6Dh, #'F'
;turn on buzzer
;turn off buzzer
;turn off pump
th_end_check:
end_check: RET
int_isr:
MOV IE, #00h
PUSH 0E0h
PUSH 00h
PUSH 03h
PUSH 04h
PUSH 07h
PUSH 82h
PUSH 83h
SETB LCD_INTR
POP 83h
POP 82h
POP 07h
POP 04h
POP 03h
POP 00h
POP 0E0h
MOV IE, #81h
RETI
;interrupt routine for LCD button

;Disable interrupts
;Push A to stack
;Push R0
;Push R3
;Push R4
;Push R7
;Push DPL
;Push DPH
;Set flag to check interrupt
;Pop DPH
;Pop DPL
;Pop R7 from stack
;Pop R4
;Pop R3
;Pop reg R0
;Pop Accumulator
;Enable INT0
org 600h
init1:
init2:
init3:
init4:
init5:
init6:
init7:
DB
DB
DB
DB
DB
DB
DB
"
Welcome to
",
"Project GreenBee",
"
",
"
",
"
DRIEMS
",
"Initializing the",
"Sensors.........",
0
0
0
0
0
0
0 ; System initialization message
Page 112
2009-2010
temp_tens:
DB '0','0','0','0','0','0','0','0','0','0'
DB 30h, 30h, 30h, 30h, 30h, 30h, 30h, 30h,
DB 30h, 30h, 30h, 30h, 30h, 30h, 31h, 31h,
DB 31h, 31h, 31h, 31h, 31h, 31h, 31h, 31h,
DB 31h, 31h, 31h, 31h, 31h, 31h, 31h, 31h,
DB 31h, 31h, 32h, 32h, 32h, 32h, 32h, 32h,
DB 32h, 32h, 32h, 32h, 32h, 32h, 32h, 32h,
DB 32h, 32h, 32h, 32h, 32h, 32h, 32h, 32h,
DB 33h, 33h, 33h, 33h, 33h, 33h, 33h, 33h,
DB 33h, 33h, 33h, 33h, 33h, 33h, 33h, 33h,
DB 33h, 33h, 33h, 33h, 34h, 34h, 34h, 34h,
DB 34h, 34h, 34h, 34h, 34h, 34h, 34h, 34h,
DB 34h, 34h, 34h, 34h, 34h, 34h, 34h, 34h,
DB 35h, 35h, 35h, 35h, 35h, 35h, 35h, 35h,
DB 35h, 35h, 35h, 35h, 35h, 35h, 35h, 35h,
DB 35h, 35h, 35h, 35h, 35h, 35h, 36h, 36h,
DB 36h, 36h, 36h, 36h, 36h, 36h, 36h, 36h,
30h, 30h
31h, 31h
31h, 31h
31h, 31h
32h, 32h
32h, 32h
33h, 33h
33h, 33h
33h, 33h
34h, 34h
34h, 34h
34h, 34h
35h, 35h
35h, 35h
36h, 36h
36h, 36h
temp_ones:
DB '0', '0',
DB '4', '4',
DB '8', '8',
DB '3', '3',
DB '6', '6',
DB '9', '0',
DB '3', '4',
DB '7', '7',
DB '1', '1',
DB '5', '5',
DB '9', '9',
DB '2', '3',
DB '6', '6',
DB '0', '0',
'3', '3', '4'

'7', '7'
'2', '2'
'5', '6'
'9', '9'
'2', '3'
'6', '7'
'0', '1'
'4', '4'
'8', '8'
'2', '2'
'6', '6'
'0', '0'
'0', '0'
'1',
'5',
'8',
'4',
'7',
'0',
'4',
'8',
'2',
'5',
'9',
'3',
'7',
'0',
'1',
'5',
'8',
'4',
'7',
'1',
'4',
'8',
'2',
'6',
'0',
'4',
'7',
'0',
'2',
'5',
'9',
'5',
'7',
'1',
'5',
'9',
'2',
'6',
'0',
'4',
'0',
'0',
'2',
'6',
'1',
'5',
'8',
'1',
'5',
'9',
'3',
'7',
'0',
'4',
'0',
'0',
'2',
'6',
'1',
'5',
'8',
'2',
'6',
'9',
'3',
'7',
'1',
'5',
'0',
'0',
'3',
'7',
'1',
'5',
'8',
'2',
'6',
'0',
'4',
'7',
'1',
'5',
'0',
'0',
temp_dec:
DB '0', '0','0','0','0','5','5','5','5','5','0'
DB '0', '0','0','5','5','5','5','0','0','0'
DB '0', '5','5','5','5','0','0','0','0','0'
DB '5', '5','5','5','0','0','0','0','5','0'
DB '0', '5','0','5','0','5','0','5','0','0'
DB '5', '0','5','0','5','5','0','5','5','0'
DB '5', '0','0','5','0','5','0','0','5','0'
DB '5', '5','0','5','0','0','5','0','5','0'
DB '0', '5','0','5','5','0','5','0','0','5'
DB '0', '5','5','0','5','0','5','5','0','5'
DB '0', '0','5','0','5','5','0','5','0','0'
DB '5', '5','0','0','5','5','0','0','5','5'
DB '0', '5','0','5','5','5','0','0','5','5'
DB '0', '0','0','0','0','0','0','0','0','0'
rh_tens:
DB '0','0', '0', '0', '0','0','0','0','0','0','0'
DB '0', '0', '0', '0', '0', '0', '0', '0', '0',
DB '0', '0', '0', '0', '0', '0', '0', '0', '0',
DB '0', '0', '0', '0', '0', '0', '0', '0', '0',
DB '0', '0', '0', '0', '0', '0', '0', '0', '0',
Page 113
;10TH
;20TH
;30TH
;40TH
;50TH
;60TH
;70TH
;80TH
;90TH
;100TH
;110TH
;120TH
;130TH
;140TH
'0'
'0'
'0'
'0'
;10th
;20th
;30th
;40th
;50th
2009-2010

DB
DB
DB
DB
DB
DB
DB
DB
DB
DB
DB
DB
DB
DB
DB
DB
DB
DB
DB
DB
DB
'0',
'1',
'1',
'2',
'3',
'3',
'4',
'5',
'5',
'6',
'6',
'7',
'8',
'9',
'9',
'0',
'0',
'*',
'*',
'*',
'*',
'0',
'1',
'1',
'2',
'3',
'3',
'4',
'5',
'5',
'6',
'7',
'7',
'8',
'9',
'9',
'0',
'0',
'*',
'*',
'*',
'*',
'0',
'1',
'1',
'2',
'3',
'3',
'4',
'5',
'5',
'6',
'7',
'7',
'8',
'9',
'9',
'0',
'0',
'*',
'*',
'*',
'*',
'0',
'1',
'2',
'2',
'3',
'3',
'4',
'5',
'5',
'6',
'7',
'7',
'8',
'9',
'9',
'0',
'*',
'*',
'*',
'*',
'*',
'0',
'1',
'2',
'2',
'3',
'4',
'4',
'5',
'5',
'6',
'7',
'7',
'8',
'9',
'9',
'0',
'*',
'*',
'*',
'*',
'*'
'0',
'1',
'2',
'2',
'3',
'4',
'4',
'5',
'6',
'6',
'7',
'7',
'8',
'9',
'9',
'0',
'*',
'*',
'*',
'*',
'0',
'1',
'2',
'2',
'3',
'4',
'4',
'5',
'6',
'6',
'7',
'7',
'8',
'9',
'9',
'0',
'*',
'*',
'*',
'*',
'0',
'1',
'2',
'3',
'3',
'4',
'4',
'5',
'6',
'6',
'7',
'8',
'8',
'9',
'9',
'0',
'*',
'*',
'*',
'*',
'0',
'1',
'2',
'3',
'3',
'4',
'4',
'5',
'6',
'6',
'7',
'8',
'8',
'9',
'9',
'0',
'*',
'*',
'*',
'*',
'0'
'1'
'2'
'3'
'3'
'4'
'5'
'5'
'6'
'6'
'7'
'8'
'9'
'9'
'9'
'0'
'*'
'*'
'*'
'*'
rh_ones:
DB '0', '0',
DB '0', '0',
DB '0', '0',
DB '0', '0',
DB '1', '1',
'0',
'0',
'0',
'0',
'2',
'0',
'0',
'0',
'0',
'2',
'0',
'0',
'0',
'0',
'3',
'0',
'0',
'0',
'0',
'3',
'0',
'0',
'0',
'0',
'4',
'0',
'0',
'0',
'0',
'4',
'0',
'0',
'0',
'0',
'5',
'0', '0' ;10th

'0'
;20th
'0'
;30th
'0'
;40th
'5'
;50th
DB
DB
DB
DB
DB
DB
DB
DB
DB
DB
'6',
'3',
'9',
'5',
'1',
'8',
'4',
'0',
'6',
'3',
'7',
'4',
'9',
'6',
'2',
'8',
'4',
'1',
'7',
'4',
'7',
'4',
'0',
'7',
'3',
'8',
'5',
'1',
'8',
'4',
'8',
'4',
'1',
'7',
'3',
'9',
'6',
'2',
'9',
'4',
'8',
'5',
'1',
'7',
'4',
'0',
'7',
'3',
'0',
'5',
'9',
'5',
'1',
'8',
'4',
'1',
'7',
'3',
'0',
'6',
'0',
'6',
'2',
'9',
'5',
'2',
'8',
'4',
'0',
'7',
'0',
'6',
'3',
'0',
'6',
'2',
'9',
'5',
'1',
'7',
'1',
'7',
'4',
'0',
'6',
'3',
'9',
'5',
'1',
'8',
'1'
'8'
'5'
'0'
'7'
'3'
'0'
'6'
'2'
'8'
;60th
;70th
;80th
;90th
;100th
;110th
;120th
;130th
;140th
;150th
DB
DB
DB
DB
DB
'9',
'6',
'1',
'8',
'4',
'9',
'7',
'2',
'8',
'4',
'1',
'7',
'3',
'9',
'5',
'1',
'7',
'4',
'9',
'6',
'2',
'5',
'5',
'0',
'7',
'2',
'8',
'5',
'1',
'7',
'3',
'9',
'6',
'2',
'8',
'4',
'0',
'6',
'3',
'8',
'4',
'1',
'7',
'3',
'9',
'5'
'1'
'7'
'4'
'0'
;160th
;170th
;180th
;190th
;200th
DB
DB
DB
DB
DB
DB
'*',
'*',
'*',
'*',
'*',
'*',
'*',
'*',
'*',
'*',
'*',
'*',
'*',
'*',
'*',
'*',
'*',
'*',
'*',
'*',
'*',
'*',
'*',
'*',
'*',
'*',
'*',
'*',
'*',
'*'
'*',
'*',
'*',
'*',
'*',
'*',
'*',
'*',
'*',
'*',
'*',
'*',
'*',
'*',
'*',
'*',
'*',
'*',
'*',
'*',
'*'
'*'
'*'
'*'
'*'
;210th
;220th
;230th
;240th
;250th
;256th
rh_dec:
DB '0', '0', '0', '0', '0',
DB '0', '0', '0', '0', '0',
DB '0', '0', '0', '1', '2',
;60th
;70th
;80th
;90th
;100th
;110th
;120th
;130th
;140th
;150th
;160th
;170th
;180th
;190th
;200th
;210th
;220th
;230th
;240th
;250th
'0', '0', '0', '0', '0', '0'

'0', '0', '0', '0', '0'
'3', '4', '5', '6', '6'
Page 114
;10th
;20th
;30th
2009-2010

DB
DB
DB
DB
DB
DB
DB
DB
DB
DB
DB
DB
DB
DB
DB
DB
DB
DB
DB
DB
DB
DB
DB
'7',
'1',
'6',
'0',
'5',
'6',
'6',
'1',
'6',
'0',
'7',
'2',
'7',
'6',
'9',
'8',
'0',
'*',
'*',
'*',
'*',
'*',
'*',
'7',
'1',
'7',
'1',
'5',
'0',
'4',
'9',
'8',
'1',
'5',
'0',
'5',
'4',
'6',
'6',
'4',
'*',
'*',
'*',
'*',
'*',
'*',
'8',
'2',
'7',
'1',
'5',
'0',
'3',
'8',
'4',
'9',
'4',
'8',
'1',
'7',
'5',
'5',
'5',
'*',
'*',
'*',
'*',
'*',
'*',
'8',
'2',
'8',
'1',
'5',
'6',
'5',
'7',
'2',
'7',
'2',
'4',
'9',
'7',
'3',
'3',
'6',
'*',
'*',
'*',
'*',
'*',
'*',
'8',
'3',
'8',
'2',
'6',
'7',
'1',
'5',
'0',
'5',
'0',
'6',
'7',
'6',
'5',
'7',
'2',
'*',
'*',
'*',
'*',
'*',
'*'
'9', '9', '9', '0', '0'

'3', '4', '4', '5', '5'
'8', '9', '9', '0', '0'
'2', '3', '3', '3', '4'
'6', '7', '1', '3', '5'
'9', '2', '0', '8', '7'
'9', '7', '5', '6', '3'
'3', '2', '6', '0', '8'
'7', '8', '6', '4', '3'
'4', '3', '1', '9', '6'
'0', '8', '6', '1', '4'
'4', '3', '7', '1', '8'
'9', '3', '7', '5', '9'
'8', '4', '2', '5', '8'
'4', '7', '6', '5', '7'
'1', '2', '3', '5', '4'
'7', '8', '8', '9', '0'
*', '*', '*', '*', '*'
*', '*', '*', '*', '*'
*', '*', '*', '*', '*'
'*', '*', '*', '*', '*'
*', '*', '*', '*', '*'
;40th
;50th
;60th
;70th
;80th
;90th
;100th
;110th
;120th
;130th
;140th
;150th
;160th
;170th
;180th
;190th
;200th
;210th
;220th
;230th
;240th
;250th
;256th
END
Page 115
2009-2010
ANNEXURE - V
Page 116
2009-2010
ADC0808/ADC0809
8-Bit P Compatible A/D Converters with 8-Channel
Multiplexer
General Description
Features
The ADC0808, ADC0809 data acquisition component is a

monolithic CMOS device with an 8-bit analog-to-digital converter, 8-channel multiplexer and microprocessor compatible
control logic. The 8-bit A/D converter uses successive approximation as the conversion technique. The converter features a high impedance chopper stabilized comparator, a
256R voltage divider with analog switch tree and a successive approximation register. The 8-channel multiplexer can
directly access any of 8-single-ended analog signals.
n Easy interface to all microprocessors

n Operates ratiometrically or with 5 VDC or analog span
adjusted voltage reference
n No zero or full-scale adjust required
n 8-channel multiplexer with address logic
n 0V to 5V input range with single 5V power supply
n Outputs meet TTL voltage level specifications
n ADC0808 equivalent to MM74C949
n ADC0809 equivalent to MM74C949-1
The device eliminates the need for external zero and

full-scale adjustments. Easy interfacing to microprocessors
is provided by the latched and decoded multiplexer address
inputs and latched TTL TRI-STATE outputs.
The design of the ADC0808, ADC0809 has been optimized
by incorporating the most desirable aspects of several A/D
conversion techniques. The ADC0808, ADC0809 offers high
speed, high accuracy, minimal temperature dependence,
excellent long-term accuracy and repeatability, and consumes minimal power. These features make this device
ideally suited to applications from process and machine
control to consumer and automotive applications. For
16-channel multiplexer with common output (sample/hold
port) see ADC0816 data sheet. (See AN-247 for more information.)
Key Specifications
n Resolution
n Total Unadjusted Error
n Single Supply
8 Bits
12 LSB and 1 LSB

5 VDC
n Low Power
n Conversion Time
15 mW
100 s
Block Diagram
00567201
See Ordering
Information
2002 National Semiconductor Corporation
DS005672
www.national.com
ADC0808/ADC0809 8-Bit P Compatible A/D Converters with 8-Channel Multiplexer
October 2002
ADC0808/ADC0809
Connection Diagrams
Dual-In-Line Package
Molded Chip Carrier Package
00567212
00567211
Order Number ADC0808CCV or ADC0809CCV

See NS Package V28A
Order Number ADC0808CCN or ADC0809CCN

See NS Package J28A or N28A
Ordering Information
TEMPERATURE RANGE
Error
LSB Unadjusted
1 LSB Unadjusted
12
Package Outline
www.national.com
40C to +85C
ADC0808CCN
ADC0808CCV
ADC0809CCN
ADC0809CCV
N28A Molded DIP
V28A Molded Chip Carrier
(Notes 2,
Dual-In-Line Package (plastic)
1)
260C
Molded Chip Carrier Package
If Military/Aerospace specified devices are required,

please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Supply Voltage (VCC) (Note 3)
0.3V to
(VCC+0.3V)
ADC0808CCV, ADC0809CCV
Range of VCC (Note 1)
65C to +150C
(Notes 1, 2)
TMINTATMAX
ADC0808CCN,ADC0809CCN
0.3V to +15V
Storage Temperature Range
400V
Temperature Range (Note 1)
(START, OE, CLOCK, ALE, ADD A, ADD B, ADD C)

Package Dissipation at TA =25C
220C
Operating Conditions
Except Control Inputs

Voltage at Control Inputs
215C
Infrared (15 seconds)

ESD Susceptibility (Note 8)
6.5V
Voltage at Any Pin
Vapor Phase (60 seconds)
40CTA+85C
40CTA+85C
4.5 VDC to 6.0 VDC
875 mW
Lead Temp. (Soldering, 10 seconds)
Electrical Characteristics
Converter Specifications: VCC =5 VDC =VREF+, VREF() =GND, TMINTATMAX and fCLK =640 kHz unless otherwise stated.
Symbol
Parameter
Conditions
Min
Typ
Max
Units
ADC0808
LSB
TMIN to TMAX
1 2
3 4
0C to 70C
TMIN to TMAX
1
114
LSB
VCC+0.10
VDC
VCC
VCC+0.1
VCC/2
VCC/2+0.1
Total Unadjusted Error
25C
(Note 5)
LSB
ADC0809
Total Unadjusted Error
(Note 5)
VREF(+)
Input Resistance
From Ref(+) to Ref()
1.0
Analog Input Voltage Range
(Note 4) V(+) or V()
GND0.10
Voltage, Top of Ladder
Measured at Ref(+)
Voltage, Center of Ladder
VCC/2-0.1
VREF()
Voltage, Bottom of Ladder
Measured at Ref()
IIN
Comparator Input Current
fc =640 kHz, (Note 6)
2.5
0.1
0.5
LSB
k
Digital Levels and DC Specifications: ADC0808CCN, ADC0808CCV, ADC0809CCN and ADC0809CCV, 4.75VCC5.25V,
40CTA+85C unless otherwise noted
Symbol
Parameter
Conditions
Min
Typ
Max
Units
10
200
nA
1.0
ANALOG MULTIPLEXER
IOFF(+)
OFF Channel Leakage Current
VCC =5V, VIN =5V,

TA =25C
TMIN to TMAX
IOFF()
OFF Channel Leakage Current
VCC =5V, VIN =0,

TA =25C
200
TMIN to TMAX
1.0
10
nA
A
CONTROL INPUTS
VIN(1)
Logical 1 Input Voltage
VIN(0)
Logical 0 Input Voltage
IIN(1)
Logical 1 Input Current
VCC1.5
VIN =15V
1.5
1.0
(The Control Inputs)

IIN(0)
Logical 0 Input Current
VIN =0
1.0
(The Control Inputs)

ICC
Supply Current
fCLK =640 kHz

3
0.3
3.0
mA
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ADC0808/ADC0809
Absolute Maximum Ratings
ADC0808/ADC0809
(Continued)
Digital Levels and DC Specifications: ADC0808CCN, ADC0808CCV, ADC0809CCN and ADC0809CCV, 4.75VCC5.25V,
40CTA+85C unless otherwise noted
Symbol
Parameter
Conditions
Min
Typ
Max
Units
DATA OUTPUTS AND EOC (INTERRUPT)

VOUT(1)
Logical 1 Output Voltage
VCC = 4.75V
2.4
4.5
IOUT = 360A
IOUT = 10A
V(min)
V(min)
VOUT(0)
Logical 0 Output Voltage
IO =1.6 mA
0.45
VOUT(0)
Logical 0 Output Voltage EOC
IO =1.2 mA
0.45
IOUT
TRI-STATE Output Current
VO =5V
A
A
VO =0
Timing Specifications VCC =VREF(+) =5V, VREF() =GND, tr =tf =20 ns and TA =25C unless otherwise noted.
Typ
Max
Units
tWS
Symbol
Minimum Start Pulse Width
Parameter
(Figure 5)
Conditions
MIn
100
200
ns
tWALE
Minimum ALE Pulse Width
(Figure 5)
100
200
ns
ts
Minimum Address Set-Up Time
(Figure 5)
25
50
ns
tH
Minimum Address Hold Time
(Figure 5)
25
50
ns
tD
Analog MUX Delay Time
RS =0 (Figure 5)
2.5
s
ns
From ALE
tH1, tH0
OE Control to Q Logic State
CL =50 pF, RL =10k (Figure 8)
125
250
t1H, t0H
OE Control to Hi-Z
CL =10 pF, RL =10k (Figure 8)
125
250
ns
tc
Conversion Time
fc =640 kHz, (Figure 5) (Note 7)
90
100
116
fc
Clock Frequency
10
640
tEOC
EOC Delay Time
(Figure 5)
1280
kHz
8+2 S
Clock
Periods
CIN
Input Capacitance
At Control Inputs
10
15
pF
COUT
TRI-STATE Output
At TRI-STATE Outputs
10
15
pF
Capacitance
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications do not apply when operating
the device beyond its specified operating conditions.
Note 2: All voltages are measured with respect to GND, unless othewise specified.
Note 3: A zener diode exists, internally, from VCC to GND and has a typical breakdown voltage of 7 VDC.
Note 4: Two on-chip diodes are tied to each analog input which will forward conduct for analog input voltages one diode drop below ground or one diode drop
greater than the VCCn supply. The spec allows 100 mV forward bias of either diode. This means that as long as the analog VIN does not exceed the supply voltage
by more than 100 mV, the output code will be correct. To achieve an absolute 0VDC to 5VDC input voltage range will therefore require a minimum supply voltage of
4.900 VDC over temperature variations, initial tolerance and loading.
Note 5: Total unadjusted error includes offset, full-scale, linearity, and multiplexer errors. See Figure 3. None of these A/Ds requires a zero or full-scale adjust.
However, if an all zero code is desired for an analog input other than 0.0V, or if a narrow full-scale span exists (for example: 0.5V to 4.5V full-scale) the reference
voltages can be adjusted to achieve this. See Figure 13.
Note 6: Comparator input current is a bias current into or out of the chopper stabilized comparator. The bias current varies directly with clock frequency and has
little temperature dependence (Figure 6). See paragraph 4.0.
Note 7: The outputs of the data register are updated one clock cycle before the rising edge of EOC.
Note 8: Human body model, 100 pF discharged through a 1.5 k resistor.
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The bottom resistor and the top resistor of the ladder network in Figure 1 are not the same value as the remainder of
the network. The difference in these resistors causes the
output characteristic to be symmetrical with the zero and
full-scale points of the transfer curve. The first output transition occurs when the analog signal has reached +12 LSB
and succeeding output transitions occur every 1 LSB later up
to full-scale.
Multiplexer. The device contains an 8-channel single-ended

analog signal multiplexer. A particular input channel is selected by using the address decoder. Table 1 shows the input
states for the address lines to select any channel. The
address is latched into the decoder on the low-to-high transition of the address latch enable signal.
The successive approximation register (SAR) performs 8

iterations to approximate the input voltage. For any SAR
type converter, n-iterations are required for an n-bit converter. Figure 2 shows a typical example of a 3-bit converter.
In the ADC0808, ADC0809, the approximation technique is
extended to 8 bits using the 256R network.
TABLE 1.
SELECTED
ADDRESS LINE
ANALOG CHANNEL
IN0
IN1
IN2
IN3
IN4
IN5
IN6
IN7
The A/D converters successive approximation register

(SAR) is reset on the positive edge of the start conversion
start pulse. The conversion is begun on the falling edge of
the start conversion pulse. A conversion in process will be
interrupted by receipt of a new start conversion pulse. Continuous conversion may be accomplished by tying the
end-of-conversion (EOC) output to the SC input. If used in
this mode, an external start conversion pulse should be
applied after power up. End-of-conversion will go low between 0 and 8 clock pulses after the rising edge of start
conversion.
CONVERTER CHARACTERISTICS
The most important section of the A/D converter is the

comparator. It is this section which is responsible for the
ultimate accuracy of the entire converter. It is also the comparator drift which has the greatest influence on the repeatability of the device. A chopper-stabilized comparator provides the most effective method of satisfying all the
converter requirements.
The Converter
The heart of this single chip data acquisition system is its
8-bit analog-to-digital converter. The converter is designed to
give fast, accurate, and repeatable conversions over a wide
range of temperatures. The converter is partitioned into 3
major sections: the 256R ladder network, the successive
approximation register, and the comparator. The converters
digital outputs are positive true.
The chopper-stabilized comparator converts the DC input

signal into an AC signal. This signal is then fed through a
high gain AC amplifier and has the DC level restored. This
technique limits the drift component of the amplifier since the
drift is a DC component which is not passed by the AC
amplifier. This makes the entire A/D converter extremely
insensitive to temperature, long term drift and input offset
errors.
The 256R ladder network approach (Figure 1) was chosen

over the conventional R/2R ladder because of its inherent
monotonicity, which guarantees no missing digital codes.
Monotonicity is particularly important in closed loop feedback
control systems. A non-monotonic relationship can cause
oscillations that will be catastrophic for the system. Additionally, the 256R network does not cause load variations on the
reference voltage.
Figure 4 shows a typical error curve for the ADC0808 as

measured using the procedures outlined in AN-179.
www.national.com
ADC0808/ADC0809
Functional Description
ADC0808/ADC0809
Functional Description
(Continued)
00567202
FIGURE 1. Resistor Ladder and Switch Tree
00567213
00567214
FIGURE 2. 3-Bit A/D Transfer Curve
FIGURE 3. 3-Bit A/D Absolute Accuracy Curve
00567215
FIGURE 4. Typical Error Curve
www.national.com
ADC0808/ADC0809
Timing Diagram
00567204
FIGURE 5.
www.national.com
ADC0808/ADC0809
Typical Performance Characteristics
00567216
FIGURE 6. Comparator IIN vs VIN

(VCC =VREF =5V)
00567217
FIGURE 7. Multiplexer RON vs VIN

(VCC =VREF =5V)
www.national.com
ADC0808/ADC0809
TRI-STATE Test Circuits and

Timing Diagrams
t1H, tH1
t0H, tH0
00567218
00567221
t1H, CL = 10 pF
t0H, CL = 10 pF
00567222
00567219
tH0, CL = 50 pF
tH1, CL = 50 pF
00567223
00567220
FIGURE 8.
Applications Information
DMIN =Minimum data limit

A good example of a ratiometric transducer is a potentiometer used as a position sensor. The position of the wiper is
directly proportional to the output voltage which is a ratio of
the full-scale voltage across it. Since the data is represented
as a proportion of full-scale, reference requirements are
greatly reduced, eliminating a large source of error and cost
for many applications. A major advantage of the ADC0808,
ADC0809 is that the input voltage range is equal to the
supply range so the transducers can be connected directly
across the supply and their outputs connected directly into
the multiplexer inputs, (Figure 9).
OPERATION
1.0 RATIOMETRIC CONVERSION
The ADC0808, ADC0809 is designed as a complete Data
Acquisition System (DAS) for ratiometric conversion systems. In ratiometric systems, the physical variable being
measured is expressed as a percentage of full-scale which is
not necessarily related to an absolute standard. The voltage
input to the ADC0808 is expressed by the equation
Ratiometric transducers such as potentiometers, strain

gauges, thermistor bridges, pressure transducers, etc., are
suitable for measuring proportional relationships; however,
many types of measurements must be referred to an absolute standard such as voltage or current. This means a
system reference must be used which relates the full-scale
voltage
to the standard
volt. For
example,
if
VCC =VREF =5.12V, then the full-scale range is divided into
256 standard steps. The smallest standard step is 1 LSB
which is then 20 mV.
(1)
VIN =Input voltage into the ADC0808
Vfs =Full-scale voltage
VZ =Zero voltage
DX =Data point being measured
DMAX =Maximum data limit
www.national.com
ADC0808/ADC0809
(Continued)
not be more negative than ground. The center of the ladder

voltage must also be near the center of the supply because
the analog switch tree changes from N-channel switches to
P-channel switches. These limitations are automatically satisfied in ratiometric systems and can be easily met in ground
referenced systems.
2.0 RESISTOR LADDER LIMITATIONS

The voltages from the resistor ladder are compared to the
selected into 8 times in a conversion. These voltages are
coupled to the comparator via an analog switch tree which is
referenced to the supply. The voltages at the top, center and
bottom of the ladder must be controlled to maintain proper
operation.
Figure 10 shows a ground referenced system with a separate supply and reference. In this system, the supply must be
trimmed to match the reference voltage. For instance, if a
5.12V is used, the supply should be adjusted to the same
voltage within 0.1V.
The top of the ladder, Ref(+), should not be more positive

than the supply, and the bottom of the ladder, Ref(), should
00567207
FIGURE 9. Ratiometric Conversion System

The ADC0808 needs less than a milliamp of supply current
so developing the supply from the reference is readily accomplished. In Figure 11 a ground referenced system is
shown which generates the supply from the reference. The
buffer shown can be an op amp of sufficient drive to supply
the milliamp of supply current and the desired bus drive, or if
a capacitive bus is driven by the outputs a large capacitor will
supply the transient supply current as seen in Figure 12. The
LM301 is overcompensated to insure stability when loaded
by the 10 F output capacitor.
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The top and bottom ladder voltages cannot exceed VCC and
ground, respectively, but they can be symmetrically less than
VCC and greater than ground. The center of the ladder
voltage should always be near the center of the supply. The
sensitivity of the converter can be increased, (i.e., size of the
LSB steps decreased) by using a symmetrical reference
system. In Figure 13, a 2.5V reference is symmetrically
centered about VCC/2 since the same current flows in identical resistors. This system with a 2.5V reference allows the
LSB bit to be half the size of a 5V reference system.
10
ADC0808/ADC0809
(Continued)
00567224
FIGURE 10. Ground Referenced

Conversion System Using Trimmed Supply
00567225
FIGURE 11. Ground Referenced Conversion System with

Reference Generating VCC Supply
11
www.national.com
ADC0808/ADC0809
(Continued)
00567226
FIGURE 12. Typical Reference and Supply Circuit
00567227
RA =RB
*Ratiometric transducers
FIGURE 13. Symmetrically Centered Reference
3.0 CONVERTER EQUATIONS
The output code N for an arbitrary input are the integers

within the range:
The transition between adjacent codes N and N+1 is given

by:
(4)
Where: VIN =Voltage at comparator input
(2)
VREF(+) =Voltage at Ref(+)
The center of an output code N is given by:
VREF() =Voltage at Ref()

VTUE =Total unadjusted error voltage (typically
VREF(+)512)
(3)
www.national.com
12
(Continued)
If no filter capacitors are used at the analog inputs and the

signal source impedances are low, the comparator input
current should not introduce converter errors, as the transient created by the capacitance discharge will die out before the comparator output is strobed.
4.0 ANALOG COMPARATOR INPUTS

The dynamic comparator input current is caused by the
periodic switching of on-chip stray capacitances. These are
connected alternately to the output of the resistor ladder/
switch tree network and to the comparator input as part of
the operation of the chopper stabilized comparator.
If input filter capacitors are desired for noise reduction and

signal conditioning they will tend to average out the dynamic
comparator input current. It will then take on the characteristics of a DC bias current whose effect can be predicted
conventionally.
The average value of the comparator input current varies

directly with clock frequency and with VIN as shown in
Figure 6.
Typical Application
00567210
*Address latches needed for 8085 and SC/MP interfacing the ADC0808 to a microprocessor
TABLE 2. Microprocessor Interface Table

PROCESSOR
READ
WRITE
INTERRUPT (COMMENT)
8080
MEMR
MEMW
INTR (Thru RST Circuit)
8085
RD
WR
INTR (Thru RST Circuit)
Z-80
RD
WR
INT (Thru RST Circuit, Mode 0)
SC/MP
NRDS
NWDS
SA (Thru Sense A)
6800
VMA 2 R/W
VMA R/W
IRQA or IRQB (Thru PIA)
13
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ADC0808/ADC0809
ADC0808/ADC0809
Physical Dimensions
inches (millimeters)
unless otherwise noted
Molded Dual-In-Line Package (N)

Order Number ADC0808CCN or ADC0809CCN
NS Package Number N28B
www.national.com
14
inches (millimeters) unless otherwise noted (Continued)
Molded Chip Carrier (V)

Order Number ADC0808CCV or ADC0809CCV
NS Package Number V28A
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NATIONALS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL
COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant
into the body, or (b) support or sustain life, and
whose failure to perform when properly used in
accordance with instructions for use provided in the
labeling, can be reasonably expected to result in a
significant injury to the user.
National Semiconductor
Corporation
Americas
Email: support@nsc.com
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Fax: +49 (0) 180-530 85 86
Email: europe.support@nsc.com
Deutsch Tel: +49 (0) 69 9508 6208
English Tel: +44 (0) 870 24 0 2171
Franais Tel: +33 (0) 1 41 91 8790
2. A critical component is any component of a life

support device or system whose failure to perform
can be reasonably expected to cause the failure of
the life support device or system, or to affect its
safety or effectiveness.
Asia Pacific Customer
Response Group
Tel: 65-2544466
Fax: 65-2504466
Email: ap.support@nsc.com
Japan Ltd.
Tel: 81-3-5639-7560
Fax: 81-3-5639-7507
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
ADC0808/ADC0809 8-Bit P Compatible A/D Converters with 8-Channel Multiplexer
Physical Dimensions
PRELIMINARY 3-25-04
Humidity/Moisture Sensors
Humidity Sensor
HIH-4000 Series
FEATURES
Molded thermoset plastic
housing
Linear voltage output vs
%RH
Laser trimmed
interchangeability
Low power design
High accuracy
Fast response time
Stable, low drift
performance
Chemically resistant
TYPICAL APPLICATIONS
Refrigeration Equipment
HVAC Equipment
Medical Equipment
Drying
Metrology
Battery -powered systems
OEM assemblies
WARNING
PERSONAL INJURY DO
NOT USE these products as
safety or emergency stop
devices or in any other
application where failure of
the product could result in
personal injury.
Failure to comply with these
instructions could result in
death or serious injury.
WARNING
MISUSE OF
DOCUMENTATION
The information presented in
this product sheet is for
reference only. Do not use
this document as system
installation information
Complete installation,
operation, and maintenance
information is provided in the
instructions supplied with
each product.
Failure to comply with these
instructions could result in
death or serious injury.
Sensing and Control
The HIH-4000 Series humidity sens or is designed specifically for high

volume OEM (Original Equipment Manufacturer) users. Direct input to a
controller or other device is made possible by this sensors linear voltage
output. With a typical current draw of only 200 A, the HIH-4000 Series is
ideally suited for low drain, battery operated systems. Tight sensor
interchangeability reduces or eliminates OEM production calibration costs.
Individual sensor calibration data is available.
The HIH-4000 Series delivers instrumentation-quality RH (Relative
Humidity) sensing performance in a low cost, solderable SIP (Single In-line
Package). Available in two lead spacing configurations, the RH sensor is a
laser trimmed thermoset polymer capacitive sensing element with on-chip
integrated signal conditioning. The sensing element's multilayer
construction provides excellent resistance to application hazards such as
wetting, dust, dirt, oils, and common environmental chemicals.
Humidity Sensor
HIH- 4000 Series
TABLE 1: PRELIMINARY PERFORMANCE SPECIFICATIONS

@ 5.0 VDC SUPPLY AND 25C UNLESS OTHERWISE NOTED
% RH PERFORMANCE SPECIFICATIONS INCLUDE TEST SYSTEM MEASUREMENT ERRORS (0.5% TYPICAL)
PARAMETER
MINIMUM
TYPICAL
MAXIMUM
UNITS
INTERCHANGEABILITY (Best fit straight line)

0 TO 60% RH
-5
% RH
60% TO 100%
-8
INTERCHANGEABILITY (2nd order curve)
3.5
% RH
%RH
*ACCURACY (Best fit straight line)

**ACCURACY (2nd order curve)
3.5
2.5
% RH
% RH
%RH
0.5
%RH
HYSTERESIS
REPEATABILITY
SETTLING TIME
RESPONSE TIME (1/e in slow moving air)
15
70
mS
Sec
***STABILITY (@ 50% RH in 1 year)
1.2
%RH
****STABILITY (@ 50% RH)
TBD
%RH
POWER REQUIREMENTS
VOLTAGE SUPPLY
CURRENT SUPPLY
VOLTAGE OUPUT (1st order fit)
VOLTAGE OUPUT (2nd order curve fit)
TEMPERATURE COMPENSATION
5.8
500
VDC
A
Vout=Vsupply(0.0062(Sensor RH)+0.16)
Vout=0.00003(Sensor RH)+0.0281(Sensor RH)+0.820
Typical
@ 25C
Vout=(0.0305+0.000044T-0.0000011T)(Sensor RH)+(0.92370.0041T+0.000040T)
T=Temperature in C
OPERATING TEMPERATURE
OPERATING HUMIDITY
STORAGE TEMPERATURE
-40
SEE FIGURE 1
85
-40
0
SEE FIGURE 1
185
100
F
% RH
-40
125
-40
257
STORAGE HUMIDITY
SEE FIGURE 2
F
% RH
*For HIH-4000-003 & -004 Only

**For HIH-4000-003 & -004 Only (Not available at time of publication. Please contact your Honeywell Sales Representative)
***Specification includes testing outside of recommended operating zone
****Specification for recommended operating zone only
Notes:
1. Do not expose sensor to condensing environments
2. Exposure to liquid water will cause sensor output to indicate 0% RH
3. Sensor is light sensitive. For best performance, shield the sensor from bright light.
4. Exposure to > 90% RH causes a reversible shift of 3% RH
5. Sensor is static sensitive. Sensor connection protected to 15kV maximum
6. Sensor output is ratiometric to supply voltage.
2 Honeywell
Sensing and Control
For application help: call 1-800-537-6945
Humidity Sensor
HIH- 4000 Series
FIGURE 1: RECOMMENDED OPERATING CONDITIONS
FIGURE 3: TYPICAL BEST FIT STRAIGHT LINE

4
100%
Relative Humidity
90%
80%
3.5
70%
60%
RECOMMENDED
OPERATING ZONE
50%
40%
30%
20%
0%
-40
-30
-20
-10
10
Operation limited to < 50 hours (Survivability only)

Undefined
20
30
40
50
60
70
80
90
100
Temperature C
FIGURE 2: STORAGE ENVIRONMENT
Voltage Out
2.5
10%
1.5
100%
90%
70%
60%
STORAGE ZONE
50%
0.5
40%
30%
20%
10%
25
0%
-40
-30
-20
-10
10
20
30
40
50
60
70
80
90
50
75
100
%RH
100 110 120 130 140
Temperature C
FACTORY CALIBRATION DATA
FIGURE 4: TYPICAL 2ND ORDER CURVE FIT

4
HIH-4000 sensors may be ordered with a calibration and

data printout (Table 2). See order guide on back page.
3.5
TABLE 2: EXAMPLE DATA PRINTOUT
Model
Channel
Wafer
MRP
Calculated values at 5 V
Vout @ 0% RH
Vout @ 75.3% RH
Linear output for 2% RH
accuracy @ 25 C
Zero offset
Slope
RH
Ratiometric response for 0
to 100% RH
Vout
HIH-4000-001
92
030996M
337313
0.958 V
3.268 V
2.5
Voltage Out
Relative Humidity
80%
1.5
0.958 V
30.680 mV/%RH
(Vout- zero offset)/slope
(Vout-0.958)/0.0307
0.5
Vsupply (0.1915 to 0.8130)
0
0
25
50
75
100
%RH
For application help: call 1-800-537-6945
Honeywell
Sensing and Control
Humidity Sensor
HIH- 4000 Series
ORDER GUIDE
Catalog Listing
Description
HIH-4000-001
Integrated circuitry humidity sensor, 0.100 in lead

pitch SIP
pitch SIP
pitch SIP with calibration and data printout
pitch SIP with calibration and data printout
HIH-4000-002
HIH-4000-003
HIH-4000-004
FIGURE 5: MOUNTING DIMENSIONS

for reference only mm/[in]
HIH-4000-002
HIH-4000-004
HIH-4000-001
HIH-4000-003
4,27
[0.168]
4,27
[0.168]
9,47
[0.373]
9,47
[0.373]
1,90
[0.075]
12,19 MIN
[0.480])
12,70 MIN
[0.50]
OUT
1,27
[0.050]
+
3X 0,38
[0.015]
2,03
[0.080]
2,54
[0.100]
2,54
[0.100]
Sensing and Control

www.honeywell.com/sensing
Honeywell
11 West Spring Street
Freeport, Illinois 61032
00XXXX-1-EN IL50 GLO 0204 Printed in USA
Copyright 2003 Honeywell International Inc. All Rights Reserved.
OUT
5,08
[0.200]
+
3X 0,38
[0.015]
WARRANTY/REMEDY
Honeywell warrants goods of its
manufacture as being free of defective
materials and fa ulty workmanship.
Contact your local sales office for
warranty information. If warranted
goods are returned to Honeywell
during the period of coverage,
Honeywell will repair or replace
without charge those items it finds
defective. The foregoing is Buyers
sole remedy and is in lieu of all
other warranties, expressed or
implied, including those of
merchantability and fitness for a
particular purpose.
Specifications may change without
notice. The information we supply is
believed to be accurate and reliable
as of this printing. However, we
assume no responsibility for its use.
While we provide application
assistance personally, through our
literature and the Honeywell web site,
it is up to the customer to determine
the suitability of the product in the
application.
For application assistance, current
specifications, or name of the nearest
Authorized Distributor, check the
Honeywell web site or call:
1-800-537-6945 USA
1-800-737-3360 Canada
1-815-235-6847 International
FAX
1-815-235-6545 USA
INTERNET
www.honeyw ell.com/sensing
info.sc@honeywell.com
LM35
Precision Centigrade Temperature Sensors
General Description
The LM35 series are precision integrated-circuit temperature
sensors, whose output voltage is linearly proportional to the
Celsius (Centigrade) temperature. The LM35 thus has an
advantage over linear temperature sensors calibrated in
Kelvin, as the user is not required to subtract a large
constant voltage from its output to obtain convenient Centigrade scaling. The LM35 does not require any external
calibration or trimming to provide typical accuracies of 14C
at room temperature and 34C over a full 55 to +150C
temperature range. Low cost is assured by trimming and
calibration at the wafer level. The LM35s low output impedance, linear output, and precise inherent calibration make
interfacing to readout or control circuitry especially easy. It
can be used with single power supplies, or with plus and
minus supplies. As it draws only 60 A from its supply, it has
very low self-heating, less than 0.1C in still air. The LM35 is
rated to operate over a 55 to +150C temperature range,
while the LM35C is rated for a 40 to +110C range (10
with improved accuracy). The LM35 series is available pack-
aged in hermetic TO-46 transistor packages, while the

LM35C, LM35CA, and LM35D are also available in the
plastic TO-92 transistor package. The LM35D is also available in an 8-lead surface mount small outline package and a
plastic TO-220 package.
Features
n
n
n
n
n
n
n
n
n
n
n
Calibrated directly in Celsius (Centigrade)

Linear + 10.0 mV/C scale factor
0.5C accuracy guaranteeable (at +25C)
Rated for full 55 to +150C range
Suitable for remote applications
Low cost due to wafer-level trimming
Operates from 4 to 30 volts
Less than 60 A current drain
Low self-heating, 0.08C in still air
Nonlinearity only 14C typical
Low impedance output, 0.1
for 1 mA load
Typical Applications
DS005516-4
DS005516-3
FIGURE 1. Basic Centigrade Temperature Sensor

(+2C to +150C)
Choose R1 = VS/50 A
V
OUT =+1,500
mV at +150C
= +250 mV at +25C
= 550 mV at 55C
FIGURE 2. Full-Range Centigrade Temperature Sensor
DS005516
www.national.com
LM35 Precision Centigrade Temperature Sensors
November 2000
LM35
Connection Diagrams
TO-46
Metal Can Package*
SO-8
Small Outline Molded Package
DS005516-1
DS005516-21
*Case is connected to negative pin (GND)
N.C. = No Connection
Order Number LM35H, LM35AH, LM35CH, LM35CAH or

LM35DH
See NS Package Number H03H
Top View
Order Number LM35DM
See NS Package Number M08A
TO-92
Plastic Package
TO-220
Plastic Package*
DS005516-2
Order Number LM35CZ,

LM35CAZ or LM35DZ
See NS Package Number Z03A
DS005516-24
*Tab is connected to the negative pin (GND).

Note: The LM35DT pinout is different than the discontinued LM35DP.
Order Number LM35DT

See NS Package Number TA03F
www.national.com
(Note 10)
TO-92 and TO-220 Package,

(Soldering, 10 seconds)
SO Package (Note 12)

Supply Voltage
+35V to 0.2V
Output Voltage
Output Current
Storage Temp.;
+6V to 1.0V
10 mA
260C
215C
220C
ESD Susceptibility (Note 11)

Specified Operating Temperature Range: TMIN to T
(Note 2)
2500V
MAX
LM35, LM35A
55C to +150C
TO-46 Package,
60C to +180C
LM35C, LM35CA
40C to +110C
TO-92 Package,
60C to +150C
LM35D
SO-8 Package,
TO-220 Package,
Lead Temp.:
TO-46 Package,
(Soldering, 10 seconds)
0C to +100C
65C to +150C
65C to +150C
300C
(Notes 1, 6)
LM35A
Parameter
Conditions
Typical
Accuracy
=+25C
(Note 7)
=10C
T
T
A =TMIN
MIN TA TMAX
0.2
0.3
0.4
0.4
0.18
MIN
TA TMAX
+10.0
Nonlinearity
=TMAX
LM35CA
Tested
Design
Tested
Design
Units
Limit
Limit
Limit
Limit
(Max.)
(Note 4)
(Note 5)
(Note 4)
(Note 5)
0.5
1.0
1.0
0.35
Typical
0.2
0.3
0.4
0.4
0.15
0.5
1.0
1.0
C
C
1.5
0.3
+9.9,
mV/C
(Note 8)
Sensor Gain
(Average Slope)
+9.9,
+10.0
+10.1
=+25C
0.4
0.5
0.01
0.02
Load Regulation
(Note 3) 0 IL 1 mA
MIN
Line Regulation
A =+25C
(Note 3)
4V V
Quiescent Current
=+5V, +25C
56
(Note 9)
=+5V
105
S =+30V, +25C
TA TMAX
30V
V S =+30V
56.2
+10.1
1.0
3.0
0.05
0.1
67
56
131
133
3.0
0.05
mV/mA
mV/V
0.1
67
mV/V
A
114
116
68
91.5
4V VS 30V, +25C
0.2
Quiescent Current
4V V
0.5
2.0
0.5
2.0
+0.39
+0.5
+0.39
+0.5
A/C
+1.5
+2.0
+1.5
+2.0
0.2
mV/mA
Change of
30V
1.0
1.0
91
56.2
68
105.5
0.4
0.5
0.01
0.02
1.0
(Note 3)
Temperature
Coefficient of
Quiescent Current
Minimum Temperature
In circuit of
for Rated Accuracy
Figure 1, IL =0
Long Term Stability
T J =TMAX, for
0.08
0.08
1000 hours
www.national.com
LM35
LM35
(Notes 1, 6)
LM35
Parameter
Conditions
Typical
Accuracy,
=+25C
LM35, LM35C
=10C
(Note 7)
A =TMAX
Accuracy, LM35D
(Note 7)
Nonlinearity
T
T
0.4
0.5
0.8
0.8
=TMIN
A =+25C
A
LM35C, LM35D
Tested
Design
Limit
Limit
(Note 4)
(Note 5)
1.0
1.5
1.5
TA =TMAX
TA =TMIN
T MIN TA TMAX
0.3
+10.0
0.5
Typical
0.4
0.5
0.8
0.8
0.6
0.9
0.9
0.2
Tested
Design
Units
Limit
Limit
(Max.)
(Note 4)
(Note 5)
1.0
1.5
1.5
2.0
1.5
C
C
C
C
2.0
2.0
0.5
+9.8,
mV/C
C
C
(Note 8)
Sensor Gain
MIN
TA TMAX
(Average Slope)
+9.8,
+10.0
+10.2
2.0
30V
0.4
0.5
0.01
0.02
=+5V, +25C
56
80
Load Regulation
(Note 3) 0 IL 1 mA
MIN
Line Regulation
A =+25C
=+25C
TA TMAX
(Note 3)
4V V
Quiescent Current
(Note 9)
S =+5V
5.0
0.1
0.2
105
=+30V, +25C
56.2
=+30V
105.5
+10.2
158
0.4
0.5
0.01
0.02
2.0
56
80
161
mV/V
A
138
A
A
82
141
2.0
4V VS 30V, +25C
0.2
Quiescent Current
4V V
0.5
3.0
0.5
3.0
+0.39
+0.7
+0.39
+0.7
A/C
+1.5
+2.0
+1.5
+2.0
0.2
mV/V
0.2
91.5
mV/mA
Change of
30V
2.0
0.1
91
56.2
82
mV/mA
5.0
(Note 3)
Temperature
Coefficient of
Quiescent Current
Minimum Temperature
In circuit of
for Rated Accuracy
Figure 1, IL =0
Long Term Stability
T J =TMAX, for
0.08
0.08
1000 hours
Note 1: Unless otherwise noted, these specifications apply: 55C TJ +150C for the LM35 and LM35A; 40 TJ +110C for the LM35C and LM35CA; and
0 TJ +100C for the LM35D. VS =+5Vdc and ILOAD =50 A, in the circuit of Figure 2. These specifications also apply from +2C to TMAX in the circuit of Figure 1.
Specifications in boldface apply over the full rated temperature range.
Note 2: Thermal resistance of the TO-46 package is 400C/W, junction to ambient, and 24C/W junction to case. Thermal resistance of the TO-92 package is
180C/W junction to ambient. Thermal resistance of the small outline molded package is 220C/W junction to ambient. Thermal resistance of the TO-220 package
is 90C/W junction to ambient. For additional thermal resistance information see table in the Applications section.
Note 3: Regulation is measured at constant junction temperature, using pulse testing with a low duty cycle. Changes in output due to heating effects can be
computed by multiplying the internal dissipation by the thermal resistance.
Note 4: Tested Limits are guaranteed and 100% tested in production.
Note 5: Design Limits are guaranteed (but not 100% production tested) over the indicated temperature and supply voltage ranges. These limits are not used to
calculate outgoing quality levels.
Note 6: Specifications in boldface apply over the full rated temperature range.
Note 7: Accuracy is defined as the error between the output voltage and 10mv/C times the devices case temperature, at specified conditions of voltage, current,
and temperature (expressed in C).
Note 8: Nonlinearity is defined as the deviation of the output-voltage-versus-temperature curve from the best-fit straight line, over the devices rated temperature
range.
Note 9: Quiescent current is defined in the circuit of Figure 1.
Note 10: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications do not apply when operating
the device beyond its rated operating conditions. See Note 1.
Note 11: Human body model, 100 pF discharged through a 1.5 k
resistor.
Note 12: See AN-450 Surface Mounting Methods and Their Effect on Product Reliability or the section titled Surface Mount found in a current National
Semiconductor Linear Data Book for other methods of soldering surface mount devices.
www.national.com
LM35

Thermal Resistance
Junction to Air
Thermal Response
in Still Air
Thermal Time Constant
DS005516-26
DS005516-25
Thermal Response in
Stirred Oil Bath
DS005516-27
Minimum Supply
Voltage vs. Temperature
Quiescent Current
vs. Temperature
(In Circuit of Figure 1.)
DS005516-29
DS005516-28
DS005516-30
Quiescent Current
vs. Temperature
(In Circuit of Figure 2.)
Accuracy vs. Temperature

(Guaranteed)
Accuracy vs. Temperature

(Guaranteed)
DS005516-32
DS005516-33
DS005516-31
www.national.com
LM35
(Continued)
Noise Voltage
Start-Up Response
DS005516-34
DS005516-35
Applications
The TO-46 metal package can also be soldered to a metal

surface or pipe without damage. Of course, in that case the
V terminal of the circuit will be grounded to that metal.
Alternatively, the LM35 can be mounted inside a sealed-end
metal tube, and can then be dipped into a bath or screwed
into a threaded hole in a tank. As with any IC, the LM35 and
accompanying wiring and circuits must be kept insulated and
dry, to avoid leakage and corrosion. This is especially true if
the circuit may operate at cold temperatures where condensation can occur. Printed-circuit coatings and varnishes such
as Humiseal and epoxy paints or dips are often used to
insure that moisture cannot corrode the LM35 or its connections.
The LM35 can be applied easily in the same way as other

integrated-circuit temperature sensors. It can be glued or
cemented to a surface and its temperature will be within
about 0.01C of the surface temperature.
This presumes that the ambient air temperature is almost the
same as the surface temperature; if the air temperature were
much higher or lower than the surface temperature, the
actual temperature of the LM35 die would be at an intermediate temperature between the surface temperature and the
air temperature. This is expecially true for the TO-92 plastic
package, where the copper leads are the principal thermal
path to carry heat into the device, so its temperature might
be closer to the air temperature than to the surface temperature.
These devices are sometimes soldered to a small

light-weight heat fin, to decrease the thermal time constant
and speed up the response in slowly-moving air. On the
other hand, a small thermal mass may be added to the
sensor, to give the steadiest reading despite small deviations
in the air temperature.
To minimize this problem, be sure that the wiring to the

LM35, as it leaves the device, is held at the same temperature as the surface of interest. The easiest way to do this is
to cover up these wires with a bead of epoxy which will
insure that the leads and wires are all at the same temperature as the surface, and that the LM35 dies temperature will
not be affected by the air temperature.
Temperature Rise of LM35 Due To Self-heating (Thermal Resistance,

TO-46,
TO-46*,
TO-92,
TO-92**,
SO-8
SO-8**
TO-220
no heat
sink
small heat fin
no heat
sink
small heat fin
no heat
sink
small heat fin
no heat
sink
Still air
400C/W
100C/W
180C/W
140C/W
220C/W
110C/W
90C/W
Moving air
100C/W
40C/W
90C/W
70C/W
105C/W
90C/W
26C/W
Still oil
100C/W
40C/W
90C/W
70C/W
Stirred oil
50C/W
30C/W
45C/W
40C/W
(Clamped to metal,
Infinite heat sink)
(24C/W)
(55C/W)
*Wakefield type 201, or 1" disc of 0.020" sheet brass, soldered to case, or similar.
**TO-92 and SO-8 packages glued and leads soldered to 1" square of 1/16" printed circuit board with 2 oz. foil or similar.
www.national.com
JA
LM35
DS005516-19
FIGURE 3. LM35 with Decoupling from Capacitive Load
DS005516-6
FIGURE 6. Two-Wire Remote Temperature Sensor

(Output Referred to Ground)
DS005516-20
FIGURE 4. LM35 with R-C Damper

CAPACITIVE LOADS
Like most micropower circuits, the LM35 has a limited ability
to drive heavy capacitive loads. The LM35 by itself is able to
drive 50 pf without special precautions. If heavier loads are
anticipated, it is easy to isolate or decouple the load with a
resistor; see Figure 3. Or you can improve the tolerance of
capacitance with a series R-C damper from output to
ground; see Figure 4.
When the LM35 is applied with a 200 load resistor as
shown in Figure 5, Figure 6 or Figure 8 it is relatively
immune to wiring capacitance because the capacitance
forms a bypass from ground to input, not on the output.
However, as with any linear circuit connected to wires in a
hostile environment, its performance can be affected
adversely by in- tense electromagnetic sources such as
relays, radio trans- mitters, motors with arcing brushes, SCR
transients, etc, as its wiring can act as a receiving
antenna and its internal junctions can act as rectifiers. For
best results in such cases, a bypass capacitor from VIN to
ground and a series R-C
damper such as 75 in series with 0.2 or 1 F from output to
ground are often useful. These are shown in Figure 13,
Figure 14, and Figure 16.
DS005516-7
FIGURE 7. Temperature Sensor, Single Supply, 55 to

+150C
DS005516-8

(Output Referred to Ground)
DS005516-5

(Grounded Sensor)
DS005516-9
FIGURE 9. 4-To-20 mA Current Source (0C to +100C)
www.national.com
LM35
(Continued)
DS005516-11
FIGURE 11. Centigrade Thermometer (Analog Meter)
DS005516-10
FIGURE 10. Fahrenheit Thermometer

DS005516-12
FIGURE 12. Fahrenheit ThermometerExpanded Scale

Thermometer
(50 to 80 Fahrenheit, for Example Shown)
DS005516-13
FIGURE 13. Temperature To Digital Converter (Serial Output) (+128C Full Scale)
DS005516-14
FIGURE 14. Temperature To Digital Converter (Parallel TRI-STATE Outputs for

Standard Data Bus to P Interface) (128C Full Scale)
www.national.com
LM35
(Continued)
DS005516-16
* =1% or 2% film resistor
Trim RB for VB =3.075V

Trim RC for VC =1.955V
Trim RA for VA =0.075V + 100mV/C x Tambient
Example, VA =2.275V at 22C
FIGURE 15. Bar-Graph Temperature Display (Dot Mode)
DS005516-15
FIGURE 16. LM35 With Voltage-To-Frequency Converter And Isolated Output

(2C to +150C; 20 Hz to 1500 Hz)
www.national.com
LM35
Block Diagram
DS005516-23
www.national.com
10
LM35
Physical Dimensions
inches (millimeters) unless otherwise noted
TO-46 Metal Can Package (H)

Order Number LM35H, LM35AH, LM35CH,
LM35CAH, or LM35DH
NS Package Number H03H
SO-8 Molded Small Outline Package (M)

Order Number LM35DM
NS Package Number M08A
11
www.national.com
LM35
Physical Dimensions
Power Package TO-220 (T)

Order Number LM35DT
NS Package Number TA03F
www.national.com
12
LM35 Precision Centigrade Temperature Sensors
Physical Dimensions
TO-92 Plastic Package (Z)

Order Number LM35CZ, LM35CAZ or LM35DZ
NS Package Number Z03A
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LM124/LM224/LM324/LM2902
Low Power Quad Operational Amplifiers
General Description
Advantages
The LM124 series consists of four independent, high gain,

internally frequency compensated operational amplifiers
which were designed specifically to operate from a single
power supply over a wide range of voltages. Operation from
split power supplies is also possible and the low power
supply current drain is independent of the magnitude of the
power supply voltage.
n Eliminates need for dual supplies

n Four internally compensated op amps in a single
package
n Allows directly sensing near GND and VOUT also goes
to GND
n Compatible with all forms of logic
n Power drain suitable for battery operation
Application areas include transducer amplifiers, DC gain

blocks and all the conventional op amp circuits which now
can be more easily implemented in single power supply
systems. For example, the LM124 series can be directly
operated off of the standard +5V power supply voltage which
is used in digital systems and will easily provide the required
interface electronics without requiring the additional 15V
power supplies.
Unique Characteristics
n In the linear mode the input common-mode voltage
range includes ground and the output voltage can also
swing to ground, even though operated from only a
single power supply voltage
n The unity gain cross frequency is temperature
compensated
n The input bias current is also temperature compensated
Features
n Internally frequency compensated for unity gain
n Large DC voltage gain 100 dB
n Wide bandwidth (unity gain) 1 MHz
(temperature compensated)
n Wide power supply range:
Single supply 3V to 32V
or dual supplies 1.5V to 16V
n Very low supply current drain (700 A) essentially
independent of supply voltage
n Low input biasing current 45 nA
(temperature compensated)
n Low input offset voltage 2 mV
and offset current: 5 nA
n Input common-mode voltage range includes ground
n Differential input voltage range equal to the power
supply voltage
n Large output voltage swing 0V to V+ 1.5V
Connection Diagrams
00929901
Top View
Order Number LM124J, LM124AJ, LM124J/883 (Note 2), LM124AJ/883 (Note 1), LM224J, LM224AJ, LM324J,
LM324M, LM324MX, LM324AM, LM324AMX, LM2902M, LM2902MX, LM324N, LM324AN, LM324MT,
LM324MTX or LM2902N LM124AJRQML and LM124AJRQMLV(Note 3)
See NS Package Number J14A, M14A or N14A
DS009299
www.national.com
LM124/LM224/LM324/LM2902 Low Power Quad Operational Amplifiers
August 2000
LM124/LM224/LM324/LM2902
Connection Diagrams
(Continued)
00929933
Order Number LM124AW/883, LM124AWG/883, LM124W/883 or LM124WG/883

LM124AWRQML and LM124AWRQMLV(Note 3)
See NS Package Number W14B LM124AWGRQML
and LM124AWGRQMLV(Note 3) See NS Package
Number WG14A
Note 1: LM124A available per JM38510/11006
Note 2: LM124 available per JM38510/11005
Note 3: See STD Mil DWG 5962R99504 for Radiation Tolerant Device
Schematic Diagram
(Each Amplifier)
00929902
www.national.com
(Note 12)

LM124/LM224/LM324
LM2902
LM124A/LM224A/LM324A
Supply Voltage, V+
32V
Differential Input Voltage
26V
32V
26V
0.3V to +32V
0.3V to +26V
50 mA
50 mA
Molded DIP
1130 mW
1130 mW
Cavity DIP
1260 mW
1260 mW
Small Outline Package
800 mW
800 mW
Continuous
Continuous
Input Voltage
Input Current
(VIN
<
0.3V) (Note 6)
Power Dissipation (Note 4)
Output Short-Circuit to GND

(One Amplifier) (Note 5)
V+ 15V and TA = 25C
Operating Temperature Range
40C to +85C
LM324/LM324A
0C to +70C
LM224/LM224A
25C to +85C
LM124/LM124A
55C to +125C
65C to +150C
65C to +150C
260C
260C
260C
260C
215C
215C
220C
220C
Lead Temperature (Soldering, 10 seconds)

Soldering Information
Soldering (10 seconds)
Small Outline Package
See AN-450 Surface Mounting Methods and Their Effect on Product Reliability for other methods of soldering surface mount
devices.
ESD Tolerance (Note 13)
250V
250V
V+ = +5.0V, (Note 7), unless otherwise stated
Parameter
LM124A
Conditions
Input Offset Voltage
(Note 8) TA = 25C
Input Bias Current
IIN(+) or IIN(), VCM = 0V,
(Note 9)
TA = 25C
Input Offset Current
Min
Typ
LM224A
Max Min
Typ
LM324A
Max Min
Typ
Max
Units
mV
20
50
40
80
45
100
nA
10
15
30
nA
TA = 25C
Input Common-Mode
V+ = 30V, (LM2902, V+ = 26V),
Voltage Range (Note

10)
TA = 25C
Supply Current
Over Full Temperature Range
V+1.5
V+1.5
V+1.5
RL = On All Op Amps
+
mA
V = 30V (LM2902 V = 26V)

V+ = 5V
Large Signal
V+ = 15V, RL 2k,
Voltage Gain
(VO = 1V to 11V), TA = 25C
Common-Mode
DC, VCM = 0V to V+ 1.5V,
1.5
0.7
1.2
1.5
0.7
1.2
1.5
0.7
1.2
50
100
50
100
25
100
V/mV
70
85
70
85
65
85
dB
www.national.com
LM124/LM224/LM324/LM2902
LM124/LM224/LM324/LM2902
(Continued)
Parameter
LM124A
Conditions
Rejection Ratio
TA = 25C
Power Supply
V+ = 5V to 30V
Rejection Ratio
(LM2902, V+ = 5V to 26V),
LM224A
LM324A
Max
Units
Min
Typ
Max Min
Typ
Max Min
Typ
65
100
65
100
65
100
dB
120
dB
TA = 25C
Amplifier-to-Amplifier
f = 1 kHz to 20 kHz, TA = 25C
Coupling (Note 11)
(Input Referred)
Output
Current
VIN+ = 1V, VIN = 0V,
Source
120
120
20
40
20
40
20
40
10
20
10
20
10
20
12
50
12
50
12
50
mA
V+ = 15V, VO = 2V, TA = 25C

Sink
VIN = 1V, V
+
IN
= 0V,
V+ = 15V, VO = 2V, TA = 25C

VIN = 1V, VIN+ = 0V,
V = 15V, VO = 200 mV, TA = 25C

Short Circuit to Ground
(Note 5) V+ = 15V, TA = 25C
(Note 8)
VOS Drift
RS = 0
IIN(+) IIN(), VCM = 0V
IOS Drift
RS = 0
10
200
10
200
Input Bias Current
IIN(+) or IIN()
40
100
40
100
Input Common-Mode
V+ = +30V
60
40
60
20
V+2
20
30
30
V+2
mA
mV
V/C
75
nA
10
300
pA/C
40
200
nA
V+2
Large Signal
V+ = +15V (VOSwing = 1V to 11V)

25
25
15
V/mV
V = 30V
RL = 2 k
26
26
26
(LM2902, V+ = 26V)
RL = 10 k
27
RL 2 k
VOH
40
30
(LM2902, V = 26V)
Output
60
4
Voltage Range (Note

10)
Voltage Gain
40
Voltage
Swing
Output
Current
VOL
V+ = 5V, RL = 10 k
Source
VO = 2V
28
5
VIN+ = +1V,
10
27
20
20
28
27
5
10
20
20
28
5
10
20
20
VIN = 0V,
mA
V+ = 15V
VIN = +1V,
Sink
mV
10
15
VIN+ = 0V,
V+ = 15V
Parameter
LM124/LM224
Conditions
(Note 8) TA = 25C
Input Bias Current
(Note 9)
TA = 25C
Min
Typ
LM324
Max Min
Typ
LM2902
Max Min
Typ
Max
Units
mV
45
150
45
250
45
250
nA
30
50
50
nA
TA = 25C
Input Common-Mode
V+ = 30V, (LM2902, V+ = 26V),
Voltage Range (Note

10)
TA = 25C
www.national.com
V+1.5
V+1.5
V+1.5
(Continued)
Parameter
Supply Current
LM124/LM224
Conditions
Min
Typ
LM324
Max Min
Typ
LM2902
Max Min
Typ
Max
Units
Over Full Temperature Range

RL = On All Op Amps
+
mA
V = 30V (LM2902 V = 26V)
1.5
1.5
1.5
V+ = 5V
0.7
1.2
0.7
1.2
0.7
1.2
Large Signal
V+ = 15V, RL 2k,
Voltage Gain
(VO = 1V to 11V), TA = 25C
Common-Mode
DC, VCM = 0V to V+ 1.5V,
Rejection Ratio
TA = 25C
Power Supply
V+ = 5V to 30V
Rejection Ratio
(LM2902, V+ = 5V to 26V),
50
100
25
100
25
100
V/mV
70
85
65
85
50
70
dB
65
100
65
100
50
100
dB
120
dB
TA = 25C
Amplifier-to-Amplifier
f = 1 kHz to 20 kHz, TA = 25C
Coupling (Note 11)
(Input Referred)
Output
Current
VIN+ = 1V, VIN = 0V,
Source
120
120
20
40
20
40
20
40
10
20
10
20
10
20
12
50
12
50
12
50
mA
V+ = 15V, VO = 2V, TA = 25C

Sink
VIN = 1V, V
+
IN
= 0V,
V+ = 15V, VO = 2V, TA = 25C

VIN = 1V, VIN+ = 0V,
V = 15V, VO = 200 mV, TA = 25C

Short Circuit to Ground
(Note 5) V+ = 15V, TA = 25C
(Note 8)
VOS Drift
RS = 0
IIN(+) IIN(), VCM = 0V
IOS Drift
RS = 0
10
Input Bias Current
IIN(+) or IIN()
40
Input Common-Mode
40
60
V = +30V
7
150
45
10
300
V 2
40
500
V 2
40
200
mV
nA
pA/C
500
+
mA
V/C
10
+
60
10
7
100
40
V 2
nA
V
(LM2902, V = 26V)
Large Signal
V+ = +15V (VOSwing = 1V to 11V)
Voltage Gain
RL 2 k
VOH
60
7
Voltage Range (Note

10)
Output
40
25
15
15
V/mV
26
22
V = 30V
RL = 2 k
26
(LM2902, V+ = 26V)
RL = 10 k
27
Voltage
Swing
Output
Current
VOL
V+ = 5V, RL = 10 k
Source
VO = 2V
28
5
27
20
28
5
23
20
24
5
VIN = +1V,
10
20
10
20
10
mV
20
VIN = 0V,
Sink
100
mA
V+ = 15V
VIN = +1V,
VIN+ = 0V,
V+ = 15V
Note 4: For operating at high temperatures, the LM324/LM324A/LM2902 must be derated based on a +125C maximum junction temperature and a thermal
resistance of 88C/W which applies for the device soldered in a printed circuit board, operating in a still air ambient. The LM224/LM224A and LM124/LM124A can
be derated based on a +150C maximum junction temperature. The dissipation is the total of all four amplifiers use external resistors, where possible, to allow the
amplifier to saturate of to reduce the power which is dissipated in the integrated circuit.
Note 5: Short circuits from the output to V+ can cause excessive heating and eventual destruction. When considering short circuits to ground, the maximum output
current is approximately 40 mA independent of the magnitude of V+. At values of supply voltage in excess of +15V, continuous short-circuits can exceed the power
dissipation ratings and cause eventual destruction. Destructive dissipation can result from simultaneous shorts on all amplifiers.
Note 6: This input current will only exist when the voltage at any of the input leads is driven negative. It is due to the collector-base junction of the input PNP
transistors becoming forward biased and thereby acting as input diode clamps. In addition to this diode action, there is also lateral NPN parasitic transistor action
www.national.com
LM124/LM224/LM324/LM2902
LM124/LM224/LM324/LM2902
(Continued)
on the IC chip. This transistor action can cause the output voltages of the op amps to go to the V+voltage level (or to ground for a large overdrive) for the time
duration that an input is driven negative. This is not destructive and normal output states will re-establish when the input voltage, which was negative, again returns to
a value greater than 0.3V (at 25C).
Note 7: These specifications are limited to 55C TA +125C for the LM124/LM124A. With the LM224/LM224A, all temperature specifications are limited to
25C TA +85C, the LM324/LM324A temperature specifications are limited to 0C TA +70C, and the LM2902 specifications are limited to 40C TA
+85C.
Note 8: VO . 1.4V, RS = 0 with V+ from 5V to 30V; and over the full input common-mode range (0V to V+ 1.5V) for LM2902, V+ from 5V to
26V.
Note 9: The direction of the input current is out of the IC due to the PNP input stage. This current is essentially constant, independent of the state of the output so
no loading change exists on the input lines.
Note 10: The input common-mode voltage of either input signal voltage should not be allowed to go negative by more than 0.3V (at 25C). The upper end of the
common-mode voltage range is V+ 1.5V (at 25C), but either or both inputs can go to +32V without damage (+26V for LM2902), independent of the magnitude
of V+.
Note 11: Due to proximity of external components, insure that coupling is not originating via stray capacitance between these external parts. This typically can be
detected as this type of capacitance increases at higher frequencies.
Note 12: Refer to RETS124AX for LM124A military specifications and refer to RETS124X for LM124 military specifications.
Note 13: Human body model, 1.5 k in series with 100 pF.

Input Voltage Range
Input Current
00929934
00929935
Supply Current
Voltage Gain
00929936
www.national.com
00929937
LM124/LM224/LM324/LM2902
(Continued)
Open Loop Frequency

Response
Common Mode Rejection

Ratio
00929938
00929939
Voltage Follower Pulse

Response
Voltage Follower Pulse

Response (Small Signal)
00929940
00929941
Large Signal Frequency

Response
Output Characteristics
Current Sourcing
00929942
00929943
www.national.com
LM124/LM224/LM324/LM2902
(Continued)
Output Characteristics
Current Sinking
Current Limiting
00929944
00929945
Input Current (LM2902 only)
Voltage Gain (LM2902 only)
00929946
00929947
Application Hints
should be provided to prevent the input voltages from going

negative more than 0.3 VDC (at 25C). An input clamp diode
with a resistor to the IC input terminal can be used.
The LM124 series are op amps which operate with only a

single power supply voltage, have true-differential inputs,
and remain in the linear mode with an input common-mode
voltage of 0 VDC. These amplifiers operate over a wide range
of power supply voltage with little change in performance
characteristics. At 25C amplifier operation is possible down
to a minimum supply voltage of 2.3 VDC.
To reduce the power supply drain, the amplifiers have a

class A output stage for small signal levels which converts to
class B in a large signal mode. This allows the amplifiers to
both source and sink large output currents. Therefore both
NPN and PNP external current boost transistors can be used
to extend the power capability of the basic amplifiers. The
output voltage needs to raise approximately 1 diode drop
above ground to bias the on-chip vertical PNP transistor for
output current sinking applications.
The pinouts of the package have been designed to simplify

PC board layouts. Inverting inputs are adjacent to outputs for
all of the amplifiers and the outputs have also been placed at
the corners of the package (pins 1, 7, 8, and 14).
For ac applications, where the load is capacitively coupled to

the output of the amplifier, a resistor should be used, from
the output of the amplifier to ground to increase the class A
bias current and prevent crossover distortion.
Precautions should be taken to insure that the power supply

for the integrated circuit never becomes reversed in polarity
or that the unit is not inadvertently installed backwards in a
test socket as an unlimited current surge through the resulting forward diode within the IC could cause fusing of the
internal conductors and result in a destroyed unit.
Where the load is directly coupled, as in dc applications,

there is no crossover distortion.
Capacitive loads which are applied directly to the output of
the amplifier reduce the loop stability margin. Values of
50 pF can be accommodated using the worst-case noninverting unity gain connection. Large closed loop gains or
resistive isolation should be used if larger load capacitance
must be driven by the amplifier.
Large differential input voltages can be easily accommodated and, as input differential voltage protection diodes are
not needed, no large input currents result from large differential input voltages. The differential input voltage may be
larger than V+ without damaging the device. Protection
www.national.com
(Continued)
output source current which is available at 25C provides a

larger output current capability at elevated temperatures
(see typical performance characteristics) than a standard IC
op amp.
The bias network of the LM124 establishes a drain current

which is independent of the magnitude of the power supply
voltage over the range of from 3 VDC to 30 VDC.
The circuits presented in the section on typical applications

emphasize operation on only a single power supply voltage.
If complementary power supplies are available, all of the
standard op amp circuits can be used. In general, introducing a pseudo-ground (a bias voltage reference of V+/2) will
allow operation above and below this value in single power
supply systems. Many application circuits are shown which
take advantage of the wide input common-mode voltage
range which includes ground. In most cases, input biasing is
not required and input voltages which range to ground can
easily be accommodated.
Output short circuits either to ground or to the positive power

supply should be of short time duration. Units can be destroyed, not as a result of the short circuit current causing
metal fusing, but rather due to the large increase in IC chip
dissipation which will cause eventual failure due to excessive junction temperatures. Putting direct short-circuits on
more than one amplifier at a time will increase the total IC
power dissipation to destructive levels, if not properly protected with external dissipation limiting resistors in series
with the output leads of the amplifiers. The larger value of
Typical Single-Supply Applications
(V+ = 5.0 VDC)
Non-Inverting DC Gain (0V Input = 0V Output)
00929905
*R not needed due to temperature independent IIN
DC Summing Amplifier
(VINS 0 VDC and VO VDC)
Power Amplifier
00929907
00929906
V0 = 0 VDC for VIN = 0 VDC
Where: V0 = V1 + V2 V3 V4
(V1 + V2) (V3 + V4) to keep VO
AV = 10
> 0 VDC
www.national.com
LM124/LM224/LM324/LM2902
Application Hints
LM124/LM224/LM324/LM2902
(V+ = 5.0 VDC) (Continued)
LED Driver
BI-QUAD RC Active Bandpass Filter
00929908
00929909
fo = 1 kHz
Q = 50
AV = 100 (40 dB)
Fixed Current Sources
Lamp Driver
00929911
00929910
www.national.com
10
LM124/LM224/LM324/LM2902
Pulse Generator

Current Monitor
00929915
Squarewave Oscillator
00929912
*(Increase R1 for IL small)
Driving TTL
00929916
Pulse Generator
00929913
Voltage Follower
00929914
00929917
11
www.national.com
LM124/LM224/LM324/LM2902
High Compliance Current Sink
00929918
IO = 1 amp/volt VIN
(Increase RE for Io small)
Low Drift Peak Detector
00929919
www.national.com
12
Comparator with Hysteresis
Ground Referencing a Differential Input Signal
00929920
00929921
VO = VR
Voltage Controlled Oscillator Circuit
00929922
*Wide control voltage range: 0 VDC VC 2 (V 1.5 VDC)
Photo Voltaic-Cell Amplifier
00929923
13
www.national.com
LM124/LM224/LM324/LM2902
LM124/LM224/LM324/LM2902
AC Coupled Inverting Amplifier
00929924
AC Coupled Non-Inverting Amplifier
00929925
www.national.com
14
LM124/LM224/LM324/LM2902
DC Coupled Low-Pass RC Active Filter
00929926
fO = 1 kHz
Q=1
AV = 2
High Input Z, DC Differential Amplifier
00929927
15
www.national.com
LM124/LM224/LM324/LM2902
High Input Z Adjustable-Gain

DC Instrumentation Amplifier
00929928
Using Symmetrical Amplifiers to

Reduce Input Current (General Concept)
Bridge Current Amplifier
00929930
00929929
www.national.com
16
LM124/LM224/LM324/LM2902
Bandpass Active Filter
00929931
fO = 1 kHz
Q = 25
17
www.national.com
LM124/LM224/LM324/LM2902
Physical Dimensions
inches (millimeters) unless otherwise noted
Ceramic Dual-In-Line Package (J)

Order Number JL124ABCA, JL124BCA, JL124ASCA, JL124SCA, LM124J,
LM124AJ, LM124AJ/883, LM124J/883, LM224J, LM224AJ or LM324J
NS Package Number J14A
MX S.O. Package (M)

Order Number LM324M, LM324MX, LM324AM, LM324AMX, LM2902M or LM2902MX
NS Package Number M14A
www.national.com
18
LM124/LM224/LM324/LM2902
Physical Dimensions
Molded Dual-In-Line Package (N)

Order Number LM324N, LM324AN or LM2902N
NS Package Number N14A
Ceramic Flatpak Package

Order Number JL124ABDA, JL124ABZA, JL124ASDA, JL124BDA, JL124BZA,
JL124SDA, LM124AW/883, LM124AWG/883, LM124W/883 or LM124WG/883
NS Package Number W14B
19
www.national.com
LM124/LM224/LM324/LM2902 Low Power Quad Operational Amplifiers
Physical Dimensions
14-Pin TSSOP
Order NumberLM324MT or LM324MTX
NS Package Number MTC14
LIFE SUPPORT POLICY


BANNED SUBSTANCE COMPLIANCE

National Semiconductor certifies that the products and packing materials meet the provisions of the Customer Products
Stewardship Specification (CSP-9-111C2) and the Banned Substances and Materials of Interest Specification
(CSP-9-111S2) and contain no Banned Substances as defined in CSP-9-111S2.
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Email: new.feedback@nsc.com
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Support Center
Japan Customer Support Center
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Email: jpn.feedback@nsc.com
Tel: 81-3-5639-7560
LM78XX/LM78XXA
3-Terminal 1A Positive Voltage
Regulator
Features
General Description
Output Current up to 1A
The LM78XX series of three terminal positive regulators

are available in the TO-220 package and with several
fixed output voltages, making them useful in a wide
range of applications. Each type employs internal current
limiting, thermal shut down and safe operating area protection, making it essentially indestructible. If adequate
heat sinking is provided, they can deliver over 1A output
current. Although designed primarily as fixed voltage
regulators, these devices can be used with external components to obtain adjustable voltages and currents.
Output Voltages of 5, 6, 8, 9, 10, 12, 15, 18, 24

Thermal Overload Protection
Short Circuit Protection
Output Transistor Safe Operating Area Protection
Product Number
Output Voltage Tolerance
Package
Operating Temperature
4%
TO-220
-40C to +125C
LM7805CT
LM7806CT
LM7808CT
LM7809CT
LM7810CT
LM7812CT
LM7815CT
LM7818CT
LM7824CT
LM7805ACT
0C to +125C
2%
LM7806ACT
LM7808ACT
LM7809ACT
LM7810ACT
LM7812ACT
LM7815ACT
LM7818ACT
LM7824ACT
2006 Fairchild Semiconductor Corporation
www.fairchildsemi.com
LM78XX/LM78XXA 3-Terminal 1A Positive Voltage Regulator
May 2006
LM78XX/LM78XXA Rev. 1.0.1
Block Diagram
Input
Series Pass
Element
1
Current
Generator
Starting
Circuit
Output
3
SOA
Protection
Reference
Voltage
Error
Amplifier
Thermal
Protection
GND
2
Figure 1.
Pin Assignment
TO-220
GND
1. Input
2. GND
3. Output
Figure 2.

Absolute maximum ratings are those values beyond which damage to the device may occur. The datasheet
specifications should be met, without exception, to ensure that the system design is reliable over its power supply,
temperature, and output/input loading variables. Fairchild does not recommend operation outside datasheet
specifications.
Symbol
VI
Parameter
Input Voltage
Value
Unit
VO = 5V to 18V
35
VO = 24V
40
RJC
Thermal Resistance Junction-Cases (TO-220)
C/W
RJA
Thermal Resistance Junction-Air (TO-220)
65
C/W
TOPR
Operating Temperature
Range
-40 to +125
TSTG
LM78xx
LM78xxA
0 to +125
-65 to +150
Refer to the test circuits. -40C < TJ < 125C, IO = 500mA, VI = 10V, CI = 0.1F, unless otherwise specified.
Symbol
VO
Parameter
Conditions
Output Voltage
Min.
Typ.
Max.
Unit
4.8
5.0
5.2
4.75
5.0
5.25
VO = 7V to 25V
4.0
100
VI = 8V to 12V
1.6
50.0
IO = 5mA to 1.5A
9.0
100
IO = 250mA to 750mA
4.0
50.0
5.0
8.0
mA
0.03
0.5
mA
VI = 7V to 25V
0.3
1.3
IO = 5mA
-0.8
mV/C
f = 10Hz to 100kHz, TA = +25C
42.0
V/VO
62.0
73.0
dB
IO = 1A, TJ = +25C
2.0
TJ = +25C
5mA IO 1A, PO 15W,
VI = 7V to 20V
Regline
Line Regulation(1)
TJ = +25C
(1)
Regload Load Regulation

IQ
IQ
VO/T
VN
TJ = +25C
Quiescent Current
TJ = +25C
Quiescent Current Change IO = 5mA to 1A

Output Voltage Drift
(2)
Output Noise Voltage

(2)
RR
Ripple Rejection
VDROP
Dropout Voltage
(2)
f = 120Hz, VO = 8V to 18V
mV
mV
rO
Output Resistance
f = 1kHz
15.0
ISC
Short Circuit Current
VI = 35V, TA = +25C
230
mA
TJ = +25C
2.2
IPK
Peak Current
(2)
Notes:
1. Load and line regulation are specified at constant junction temperature. Changes in VO due to heating effects
must be taken into account separately. Pulse testing with low duty is used.
2. These parameters, although guaranteed, are not 100% tested in production.
Electrical Characteristics (LM7805)
(Continued)
Refer to the test circuits. -40C < TJ < 125C, IO = 500mA, VI = 11V, CI = 0.33F, CO = 0.1F, unless otherwise specified.
Symbol
VO
Parameter
Conditions
Output Voltage
Min
Typ.
Max.
Unit
5.75
6.0
6.25
5.7
6.0
6.3
VI = 8V to 25V
5.0
120
VI = 9V to 13V
1.5
60.0
IO = 5mA to 1.5A
9.0
120
IO = 250mA to 750mA
3.0
60.0
TJ = +25C
5mA IO 1A, PO 15W,
VI = 8.0V to 21V
Regline
Regload
Line Regulation(3)
TJ = +25C
(3)
TJ = +25C
Load Regulation
mV
mV
IQ
Quiescent Current
TJ = +25C
5.0
8.0
mA
IQ
Quiescent Current
Change
IO = 5mA to 1A
0.5
mA
VI = 8V to 25V
1.3
IO = 5mA
-0.8
mV/C
f = 10Hz to 100kHz, TA = +25C
45.0
V/VO
62.0
73.0
dB
IO = 1A, TJ = +25C
2.0
VO/T
VN
(4)

(4)
RR
Ripple Rejection
VDROP
Dropout Voltage
(4)
f = 120Hz, VO = 8V to 18V
rO
Output Resistance
f = 1kHz
19.0
ISC
VI = 35V, TA = +25C
250
mA
TJ = +25C
2.2
IPK
Peak Current
(4)
Notes:
(Continued)
Symbol
VO
Regline
Parameter
Output Voltage
Line Regulation(5)
IQ
VO/T
VN
Min.
Typ.
Max.
Unit
TJ = +25C
7.7
8.0
8.3
5mA IO 1A, PO 15W,

VI = 10.5V to 23V
7.6
8.0
8.4
VI = 10.5V to 25V
5.0
160
VI = 11.5V to 17V
2.0
80.0
IO = 5mA to 1.5A
10.0
160
IO = 250mA to 750mA
5.0
80.0
TJ = +25C
(5)
IQ
Conditions
TJ = +25C
mV
mV
Quiescent Current
TJ = +25C
5.0
8.0
mA
Quiescent Current Change
IO = 5mA to 1A
0.05
0.5
mA
VI = 10.5V to 25V
0.5
1.0
IO = 5mA
-0.8
mV/C
f = 10Hz to 100kHz, TA = +25C
52.0
V/VO
f = 120Hz, VO = 11.5V to 21.5V
56.0
73.0
dB
IO = 1A, TJ = +25C
2.0
(6)

(6)
RR
Ripple Rejection
VDROP
Dropout Voltage
(6)
rO
Output Resistance
f = 1kHz
17.0
ISC
VI = 35V, TA = +25C
230
mA
TJ = +25C
2.2
IPK
Peak Current
(6)
Notes:
(Continued)
Symbol
VO
Parameter
Conditions
Output Voltage
Min.
Typ.
Max.
Unit
8.65
9.0
9.35
8.6
9.0
9.4
6.0
180
2.0
90.0
12.0
180
4.0
90.0
5.0
8.0
mA
0.5
mA
VI = 11.5V to 26V
1.3
IO = 5mA
-1.0
mV/C
f = 10Hz to 100kHz, TA = +25C
58.0
V/VO
56.0
71.0
dB
IO = 1A, TJ = +25C
2.0
TJ = +25C
5mA IO 1A, PO 15W,
VI = 11.5V to 24V
Regline
Line Regulation(7)
TJ = +25C VI = 11.5V to 25V

VI = 12V to 17V
(7)
TJ = +25C IO = 5mA to 1.5A

IO = 250mA to 750mA
IQ
IQ
VO/T
VN
Quiescent Current
TJ = +25C

(8)

(8)
RR
Ripple Rejection
VDROP
Dropout Voltage
(8)
f = 120Hz, VO = 13V to 23V
mV
mV
rO
Output Resistance
f = 1kHz
17.0
ISC
VI = 35V, TA = +25C
250
mA
TJ = +25C
2.2
IPK
Peak Current
(8)
Notes:
(Continued)
Symbol
Min.
Typ.
Max.
Unit
TJ = +25C
9.6
10.0
10.4
5mA IO 1A, PO 15W,

VI = 12.5V to 25V
9.5
10.0
10.5
VI = 12.5V to 25V
10.0
200
VI = 13V to 25V
3.0
100
IO = 5mA to 1.5A
12.0
200
IO = 250mA to 750mA
4.0
400
5.1
8.0
mA
0.5
mA
VI = 12.5V to 29V
1.0
Output Voltage Drift(10)
IO = 5mA
-1.0
mV/C
VN
f = 10Hz to 100kHz, TA = +25C
58.0
V/VO
RR
Ripple Rejection(10)
f = 120Hz, VO = 13V to 23V
56.0
71.0
dB
Dropout Voltage
IO = 1A, TJ = +25C
2.0
rO
Output Resistance(10)
f = 1kHz
17.0
ISC
VI = 35V, TA = +25C
250
mA
IPK
Peak Current(10)
TJ = +25C
2.2
VO
Regline
Parameter
Output Voltage
Line Regulation(9)
Regload Load Regulation(9)

IQ
IQ
VO/T
VDROP
Quiescent Current
Conditions
TJ = +25C
TJ = +25C
TJ = +25C
mV
mV
Notes:
(Continued)
Symbol
VO
Regline
Parameter
Conditions
Output Voltage
Line Regulation(11)
Min.
Typ.
Max.
Unit
TJ = +25C
11.5
12.0
12.5
5mA IO 1A, PO 15W,

VI = 14.5V to 27V
11.4
12.0
12.6
10.0
240
3.0
120
11.0
240
5.0
120
5.1
8.0
mA
0.1
0.5
mA
VI = 14.5V to 30V
0.5
1.0
IO = 5mA
-1.0
mV/C
f = 10Hz to 100kHz, TA = +25C
76.0
V/VO
55.0
71.0
dB
IO = 1A, TJ = +25C
2.0
TJ = +25C VI = 14.5V to 30V

VI = 16V to 22V
Regload
(11)
TJ = +25C IO = 5mA to 1.5A
Load Regulation
IO = 250mA to 750mA
IQ
Quiescent Current
TJ = +25C
IQ
VO/T
(12)
VN

(12)
RR
Ripple Rejection
VDROP
Dropout Voltage
(12)
f = 120Hz, VI = 15V to 25V
mV
mV
rO
Output Resistance
f = 1kHz
18.0
ISC
VI = 35V, TA = +25C
230
mA
TJ = +25C
2.2
IPK
Peak Current
(12)
Notes:
(Continued)
Symbol
VO
Regline
Parameter
Output Voltage
Line Regulation(13)
Conditions
Min.
Typ.
Max.
Unit
TJ = +25C
14.4
15.0
15.6
5mA IO 1A, PO 15W,

VI = 17.5V to 30V
14.25
15.0
15.75
11.0
300
3.0
150
12.0
300
4.0
150
5.2
8.0
mA
0.5
mA
VI = 17.5V to 30V
1.0
IO = 5mA
-1.0
mV/C
f = 10Hz to 100kHz, TA = +25C
90.0
V/VO
54.0
70.0
dB
IO = 1A, TJ = +25C
2.0
TJ = +25C VI = 17.5V to 30V

VI = 20V to 26V
(13)
TJ = +25C IO = 5mA to 1.5A

IO = 250mA to 750mA
IQ
IQ
VO/T
VN
Quiescent Current
TJ = +25C

(14)

(14)
RR
Ripple Rejection
VDROP
Dropout Voltage
(14)
f = 120Hz, VI = 18.5V to 28.5V
mV
mV
rO
Output Resistance
f = 1kHz
19.0
ISC
VI = 35V, TA = +25C
250
mA
TJ = +25C
2.2
IPK
Peak Current
(14)
Notes:
(Continued)
Symbol
VO
Regline
Parameter
Conditions
Output Voltage
Line Regulation(15)
(15)
Min.
Typ.
Max.
Unit
TJ = +25C
17.3
18.0
18.7
5mA IO 1A, PO 15W,

VI = 21V to 33V
17.1
18.0
18.9
TJ = +25C VI = 21V to 33V
15.0
360
VI = 24V to 30V
5.0
180
15.0
360
5.0
180
5.2
8.0
mA
mA
TJ = +25C IO = 5mA to 1.5A

IO = 250mA to 750mA
IQ
Quiescent Current
TJ = +25C
mV
mV
IQ
0.5
VI = 21V to 33V
1.0
VO/T
(16)
IO = 5mA
-1.0
mV/C
f = 10Hz to 100kHz, TA = +25C
110
V/VO
53.0
69.0
dB
IO = 1A, TJ = +25C
2.0
VN

(16)
RR
Ripple Rejection
VDROP
Dropout Voltage
(16)
f = 120Hz, VI = 22V to 32V
rO
Output Resistance
f = 1kHz
22.0
ISC
VI = 35V, TA = +25C
250
mA
TJ = +25C
2.2
IPK
Peak Current
(16)
Notes:
10
(Continued)
Symbol
VO
Regline
Parameter
Conditions
Output Voltage
Line Regulation(17)
Typ.
Max.
Unit
TJ = +25C
23.0
24.0
25.0
5mA IO 1A, PO 15W,

VI = 27V to 38V
22.8
24.0
25.25
VI = 27V to 38V
17.0
480
VI = 30V to 36V
6.0
240
IO = 5mA to 1.5A
15.0
480
IO = 250mA to 750mA
5.0
240
5.2
8.0
mA
mA
TJ = +25C
(17)

IQ
Min.
TJ = +25C
Quiescent Current
TJ = +25C
mV
mV
IQ
0.1
0.5
VI = 27V to 38V
0.5
1.0
VO/T
(18)
IO = 5mA
-1.5
mV/C
f = 10Hz to 100kHz, TA = +25C
60.0
V/VO
50.0
67.0
dB
IO = 1A, TJ = +25C
2.0
VN

(18)
RR
Ripple Rejection
VDROP
Dropout Voltage
(18)
f = 120Hz, VI = 28V to 38V
rO
Output Resistance
f = 1kHz
28.0
ISC
VI = 35V, TA = +25C
230
mA
TJ = +25C
2.2
IPK
Peak Current
(18)
Notes:
11
(Continued)
Refer to the test circuits. 0C < TJ < 125C, IO = 1A, VI = 10V, CI = 0.33F, CO = 0.1F, unless otherwise specified.
Symbol
VO
Regline
Parameter
Conditions
Output Voltage
Line Regulation(19)
Min.
Typ.
Max.
Unit
TJ = +25C
4.9
5.0
5.1
IO = 5mA to 1A, PO 15W,

VI = 7.5V to 20V
4.8
5.0
5.2
VI = 7.5V to 25V, IO = 500mA
5.0
50.0
VI = 8V to 12V
3.0
50.0
VI = 7.3V to 20V
5.0
50.0
VI = 8V to 12V
1.5
25.0
TJ = +25C, IO = 5mA to 1.5A
9.0
100
IO = 5mA to 1A
9.0
100
IO = 250mA to 750mA
4.0
50.0
TJ = +25C
(19)
mV
mV
IQ
Quiescent Current
TJ = +25C
5.0
6.0
mA
IQ
Quiescent Current
Change
IO = 5mA to 1A
0.5
mA
VI = 8V to 25V, IO = 500mA
0.8
VI = 7.5V to 20V, TJ = +25C
0.8
IO = 5mA
-0.8
mV/C
f = 10Hz to 100kHz, TA = +25C
10.0
V/VO
f = 120Hz, IO = 500mA, VI = 8V to 18V
68.0
dB
IO = 1A, TJ = +25C
2.0
VO/T
VN
(20)

(20)
RR
Ripple Rejection
VDROP
Dropout Voltage
(20)
rO
Output Resistance
f = 1kHz
17.0
ISC
VI = 35V, TA = +25C
250
mA
TJ = +25C
2.2
IPK
Peak Current
(20)
Notes:
12
Electrical Characteristics (LM7805A)
(Continued)
Symbol
VO
Regline
Regload
IQ
IQ
VO/T
VN
Parameter
Conditions
Output Voltage
Line Regulation(21)
(21)
Load Regulation
Quiescent Current
Min.
Typ.
Max.
Unit
TJ = +25C
5.58
6.0
6.12

VI = 8.6V to 21V
5.76
6.0
6.24
VI = 8.6V to 25V, IO = 500mA
5.0
60.0
VI = 9V to 13V
3.0
60.0
TJ = +25C
VI = 8.3V to 21V
5.0
60.0
VI = 9V to 13V
1.5
30.0
TJ = +25C, IO = 5mA to 1.5A
9.0
100
IO = 5mA to 1A
9.0
100
IO = 250mA to 750mA
5.0
50.0
TJ = +25C
4.3
6.0
mA
0.5
mA
VI = 19V to 25V, IO = 500mA
0.8
VI = 8.5V to 21V, TJ = +25C
0.8
IO = 5mA
-0.8
mV/C
f = 10Hz to 100kHz, TA = +25C
10.0
V/VO
f = 120Hz, IO = 500mA, VI = 9V to 19V
65.0
dB
IO = 1A, TJ = +25C
2.0
(22)

(22)
RR
Ripple Rejection
VDROP
Dropout Voltage
(22)
mV
mV
rO
Output Resistance
f = 1kHz
17.0
ISC
VI = 35V, TA = +25C
250
mA
TJ = +25C
2.2
IPK
Peak Current
(22)
Notes:
13
(Continued)
Symbol
VO
Parameter
Conditions
Output Voltage
Min.
Typ.
Max.
Unit
7.84
8.0
8.16
7.7
8.0
8.3
VI = 10.6V to 25V, IO = 500mA
6.0
80.0
VI = 11V to 17V
3.0
80.0
TJ = +25C
VI = 10.4V to 23V
6.0
80.0
VI = 11V to 17V
2.0
40.0
TJ = +25C, IO = 5mA to 1.5A
12.0
100
IO = 5mA to 1A
12.0
100
IO = 250mA to 750mA
5.0
50.0
TJ = +25C
5.0
6.0
mA
0.5
mA
VI = 11V to 25V, IO = 500mA
0.8
VI = 10.6V to 23V, TJ = +25C
0.8
IO = 5mA
-0.8
mV/C
f = 10Hz to 100kHz, TA = +25C
10.0
V/VO
f = 120Hz, IO = 500mA,
VI = 11.5V to 21.5V
62.0
dB
IO = 1A, TJ = +25C
2.0
TJ = +25C
VI = 10.6V to 23V
Regline
Regload
IQ
IQ
VO/T
VN
Line Regulation(23)
(23)
Load Regulation
Quiescent Current
(24)

(24)
RR
Ripple Rejection
VDROP
Dropout Voltage
(24)
mV
mV
rO
Output Resistance
f = 1kHz
18.0
ISC
VI = 35V, TA = +25C
250
mA
TJ = +25C
2.2
IPK
Peak Current
(24)
Notes:
14
(Continued)
Symbol
VO
Regline
Regload
IQ
IQ
VO/T
Parameter
Conditions
Output Voltage
Line Regulation(25)
(25)
Load Regulation
Quiescent Current
Min.
Typ.
Max.
Units
TJ = +25C
8.82
9.0
9.16

VI = 11.2V to 24V
8.65
9.0
9.35
VI = 11.7V to 25V, IO = 500mA
6.0
90.0
VI = 12.5V to 19V
4.0
45.0
TJ = +25C
VI = 11.5V to 24V
6.0
90.0
VI = 12.5V to 19V
2.0
45.0
TJ = +25C, IO = 5mA to 1.5A
12.0
100
IO = 5mA to 1A
12.0
100
IO = 250mA to 750mA
5.0
50.0
TJ = +25C
5.0
6.0
mA
0.5
mA
VI = 12V to 25V, IO = 500mA
0.8
VI = 11.7V to 25V, TJ = +25C
0.8
IO = 5mA
-1.0
mV/C
(26)
mV
mV
VN
f = 10Hz to 100kHz, TA = +25C
10.0
V/VO
RR
Ripple Rejection(26)
f = 120Hz, IO = 500mA,
VI = 12V to 22V
62.0
dB
Dropout Voltage
IO = 1A, TJ = +25C
2.0
rO
Output Resistance(26)
f = 1kHz
17.0
ISC
VI = 35V, TA = +25C
250
mA
IPK
Peak Current(26)
TJ = +25C
2.2
VDROP
Notes:
15
(Continued)
Symbol
VO
Regline
Parameter
Conditions
Output Voltage
Line Regulation(27)
Min.
Typ.
Max.
Units
TJ = +25C
9.8
10.0
10.2

VI = 12.8V to 25V
9.6
10.0
10.4
VI = 12.8V to 26V, IO = 500mA
8.0
100
VI = 13V to 20V
4.0
50.0
VI = 12.5V to 25V
8.0
100
VI = 13V to 20V
3.0
50.0
TJ = +25C, IO = 5mA to 1.5A
12.0
100
IO = 5mA to 1A
12.0
100
IO = 250mA to 750mA
5.0
50.0
TJ = +25C
Regload
(27)
Load Regulation
mV
mV
IQ
Quiescent Current
TJ = +25C
5.0
6.0
mA
IQ
Quiescent Current
Change
IO = 5mA to 1A
0.5
mA
VI = 12.8V to 25V, IO = 500mA
0.8
VI = 13V to 26V, TJ = +25C
0.5
IO = 5mA
-1.0
mV/C
f = 10Hz to 100kHz, TA = +25C
10.0
V/VO
f = 120Hz, IO = 500mA, VI = 14V to 24V
62.0
dB
IO = 1A, TJ = +25C
2.0
VO/T
VN
(28)

(28)
RR
Ripple Rejection
VDROP
Dropout Voltage
(28)
rO
Output Resistance
f = 1kHz
17.0
ISC
VI = 35V, TA = +25C
250
mA
TJ = +25C
2.2
IPK
Peak Current
(28)
Notes:
16
(Continued)
Symbol
VO
Regline
Regload
IQ
IQ
VO/T
VN
Parameter
Conditions
Output Voltage
Line Regulation(29)
(29)
Load Regulation
Quiescent Current
Min.
Typ.
Max.
Units
TJ = +25C
11.75
12.0
12.25

VI = 14.8V to 27V
11.5
12.0
12.5
VI = 14.8V to 30V, IO = 500mA
10.0
120
VI = 16V to 22V
4.0
120
TJ = +25C
VI = 14.5V to 27V
10.0
120
VI = 16V to 22V
3.0
60.0
TJ = +25C, IO = 5mA to 1.5A
12.0
100
IO = 5mA to 1A
12.0
100
IO = 250mA to 750mA
5.0
50.0
TJ = +25C
5.1
6.0
mA
0.5
mA
VI = 14V to 27V, IO = 500mA
0.8
VI = 15V to 30V, TJ = +25C
0.8
IO = 5mA
-1.0
mV/C
f = 10Hz to 100kHz, TA = +25C
10.0
V/VO
f = 120Hz, IO = 500mA,
VI = 14V to 24V
60.0
dB
IO = 1A, TJ = +25C
2.0
(30)

(30)
RR
Ripple Rejection
VDROP
Dropout Voltage
(30)
mV
mV
rO
Output Resistance
f = 1kHz
18.0
ISC
VI = 35V, TA = +25C
250
mA
TJ = +25C
2.2
IPK
Peak Current
(30)
Note:
17
(Continued)
Symbol
VO
Regline
Regload
IQ
IQ
VO/T
VN
Parameter
Conditions
Output Voltage
Line Regulation(31)
(31)
Load Regulation
Quiescent Current
Min.
Typ.
Max.
Units
TJ = +25C
14.75
15.0
15.3

VI = 17.7V to 30V
14.4
15.0
15.6
VI = 17.4V to 30V, IO = 500mA
10.0
150
VI = 20V to 26V
5.0
150
TJ = +25C VI = 17.5V to 30V
11.0
150
VI = 20V to 26V
3.0
75.0
TJ = +25C, IO = 5mA to 1.5A
12.0
100
IO = 5mA to 1A
12.0
100
IO = 250mA to 750mA
5.0
50.0
TJ = +25C
5.2
6.0
mA
0.5
mA
VI = 17.5V to 30V, IO = 500mA
0.8
VI = 17.5V to 30V, TJ = +25C
0.8
IO = 5mA
-1.0
mV/C
f = 10Hz to 100kHz, TA = +25C
10.0
V/VO
f = 120Hz, IO = 500mA,
VI = 18.5V to 28.5V
58.0
dB
IO = 1A, TJ = +25C
2.0
(32)

(32)
RR
Ripple Rejection
VDROP
Dropout Voltage
(32)
mV
mV
rO
Output Resistance
f = 1kHz
19.0
ISC
VI = 35V, TA = +25C
250
mA
TJ = +25C
2.2
IPK
Peak Current
(32)
Notes:
18
(Continued)
Symbol
VO
Regline
Regload
IQ
IQ
VO/T
VN
Parameter
Min.
Typ.
Max.
Units
TJ = +25C
17.64
18.0
18.36

VI = 21V to 33V
17.3
18.0
18.7
VI = 21V to 33V, IO = 500mA
15.0
180
VI = 21V to 33V
5.0
180
TJ = +25C
VI = 20.6V to 33V
15.0
180
VI = 24V to 30V
5.0
90.0
TJ = +25C, IO = 5mA to 1.5A
15.0
100
IO = 5mA to 1A
15.0
100
IO = 250mA to 750mA
7.0
50.0
Quiescent Current
TJ = +25C
5.2
6.0
mA
Quiescent Current Change
IO = 5mA to 1A
0.5
mA
VI = 12V to 33V, IO = 500mA
0.8
VI = 12V to 33V, TJ = +25C
0.8
IO = 5mA
-1.0
mV/C
f = 10Hz to 100kHz, TA = +25C
10.0
V/VO
f = 120Hz, IO = 500mA,
VI = 22V to 32V
57.0
dB
IO = 1A, TJ = +25C
2.0
Output Voltage
Line Regulation(33)
(33)
Load Regulation
(34)

(34)
RR
Ripple Rejection
VDROP
Dropout Voltage
(34)
Conditions
mV
mV
rO
Output Resistance
f = 1kHz
19.0
ISC
VI = 35V, TA = +25C
250
mA
TJ = +25C
2.2
IPK
Peak Current
(34)
Notes:
19
(Continued)
Symbol
VO
Regline
Parameter
Conditions
Output Voltage
Line Regulation(35)
Min.
Typ.
Max.
Units
TJ = +25C
23.5
24.0
24.5

VI = 27.3V to 38V
23.0
24.0
25.0
VI = 27V to 38V, IO = 500mA
18.0
240
VI = 21V to 33V
6.0
240
VI = 26.7V to 38V
18.0
240
VI = 30V to 36V
6.0
120
TJ = +25C, IO = 5mA to 1.5A
15.0
100
IO = 5mA to 1A
15.0
100
IO = 250mA to 750mA
7.0
50.0
TJ = +25C
5.2
6.0
mA
0.5
mA
VI = 27.3V to 38V, IO = 500mA
0.8
VI = 27.3V to 38V, TJ = +25C
0.8
IO = 5mA
-1.5
mV/C
f = 10Hz to 100kHz, TA = +25C
10.0
V/VO
f = 120Hz, IO = 500mA,
VI = 28V to 38V
54.0
dB
IO = 1A, TJ = +25C
2.0
TJ = +25C
Regload
IQ
IQ
VO/T
VN
(35)
Load Regulation
Quiescent Current
(36)

(36)
RR
Ripple Rejection
VDROP
Dropout Voltage
(36)
mV
mV
rO
Output Resistance
f = 1kHz
20.0
ISC
VI = 35V, TA = +25C
250
mA
TJ = +25C
2.2
IPK
Peak Current
(36)
Notes:
20
5.75
VI = 10V
VO = 5V
IO = 5mA
TJ = 25C
VO = 100mV
2.5
OUTPUT CURRENT (A)
QUIESCENT CURRENT (mA)
5.5
5.25
5
4.75
2
1.5
1
.5
4.5
-50
-25
25
50
75
100
125
JUNCTION TEMPERATURE (C)
QUIESCENT CURRENT (mA)
NORMALIZED OUTPUT VOLTAGE (V)
1.01
0.99
-25
25
50
75
100
JUNCTION TEMPERATURE (C)
Figure 5. Output Voltage
15
20
25
30
35
Figure 4. Peak Output Current
VI VO = 5V
IO = 5mA
0.98
-50
10
INPUT-OUTPUT DIFFERENTIAL (V)
Figure 3. Quiescent Current
1.02
125
TJ = 25C
VO = 5V
IO = 10mA
6
5.5
5
4.5
10
15
20
25
30
INPUT VOLTAGE (V)
Figure 6. Quiescent Current
35
21
Input
CI
LM78XX
Output
CO
0.33F
0.1F
Figure 7. DC Parameters
LM78XX
Input
Output
270pF
RL
2N6121
or EQ
0.33F
VO
VO
100
30S
0V
Figure 8. Load Regulation
5.1
Input
LM78XX
0.33F
3
Output
RL
470F
120Hz
Figure 9. Ripple Rejection
22
LM78XX
Input
CI
Output
CO
0.33F
0.1F
Figure 10. Fixed Output Regulator
Input
CI
LM78XX
Output
CO
0.33F
0.1F
IQ
R1
V XX
IO
RL
V XX
IO =
+I
R1 Q
Notes:
1. To specify an output voltage, substitute voltage value for XX. A common ground is required between the input and the
output voltage. The input voltage must remain typically 2.0V above the output voltage even during the low point on the
input ripple voltage.
2. CI is required if regulator is located an appreciable distance from power supply filter.
3. CO improves stability and transient response.
Figure 11.
Input
CI
LM78XX
CO
0.33F
Output
0.1F
V XX
R1
IQ
R2
IRI 5 IQ
VO = VXX(1 + R2 / R1) + IQR2
Figure 12. Circuit for Increasing Output Voltage
23
Output
LM7805
2
CI
0.33F
CO
- 2
LM741
+ 3
4
10k
0.1F
IRI 5 IQ
VO = VXX(1 + R2 / R1) + IQR2
Figure 13. Adjustable Output Regulator (7V to 30V)
Input
Q1 BD536
IQ1
R1
R1 =
LM78XX
IREG
V BEQ1
Output
3
IO
0.1F
0.33F
IREGIQ1 BQ1
IO = IREG + BQ1 (IREGVBEQ1/R1)
Figure 14. High Current Voltage Regulator
Input
Q1
RSC
Q2
R1
3
0.33F
Q1 = TIP42
Q2 = TIP42
RSC =
LM78XX
2
3
0.1F
V BEQ2
I SC
Figure 15. High Output Current with Short Circuit Protection

Output
Input
24
LM78XX
VI
VO
0.33F
0.1F
COMMON
COMMON
LM741
4
-VIN
4.7k
4.7k
-VO
TIP42
Figure 16. Tracking Voltage Regulator
1
+20V
0.33F
LM7815
2
3
+15V
0.1F
1N4001
2.2F
1F +
1
2
-20V
1N4001
MC7915
3
-15V
Figure 17. Split Power Supply (15V 1A)
25
Input
+
0.1F
2
1
LM78XX
Figure 18. Negative Output Voltage Circuit
D45H11
Input
1mH
Output
470
4.7
Z1
0.33F
10F
LM78XX
2
+
0.5
2000F
Figure 19. Switching Regulator
26
Output
Dimensions in millimeters
TO-220
4.50
0.20
0.10
0.10
2.54TYP
[2.54 0.20]
18.95MAX.
15.90
1.52
0.10
0.80
0.10
+0.10
0.50 0.05
2.54TYP
[2.54 0.20]
10.00
+0.10
1.30 0.05
0.30
0.10
0.20
10.08
(1.00)
(3.00)
(1.46)
9.20
0.20
13.08
1.27
0.20
(3.70)
1.30
3.60
2.80
0.10
(8.70)
0.20
(1.70)
9.90
2.40
0.20
0.20
27
Mechanical Dimensions
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when properly used in accordance with instructions for use
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2. A critical component is any component of a life support

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PRODUCT STATUS DEFINITIONS

Definition of Terms
Datasheet Identification
Product Status
Definition
Advance Information
Formative or In
Design
This datasheet contains the design specifications for

product development. Specifications may change in
any manner without notice.
Preliminary
First Production
This datasheet contains preliminary data, and

supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice in order to improve
design.
No Identification Needed
Full Production
This datasheet contains final specifications. Fairchild

Semiconductor reserves the right to make changes at
any time without notice in order to improve design.
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Not In Production
This datasheet contains specifications on a product

that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.
Rev. I19
28
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SEMICONDUCTOR TECHNICAL DATA
NPN Silicon
COLLECTOR
1
2
BASE
3
EMITTER
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Collector Emitter Voltage
VCEO
40
Vdc
Collector Base Voltage
VCBO
75
Vdc
Emitter Base Voltage
VEBO
6.0
Vdc
Collector Current Continuous
IC
600
mAdc
Total Device Dissipation @ TA = 25C

Derate above 25C
PD
625
5.0
mW
mW/C
Total Device Dissipation @ TC = 25C

Derate above 25C
PD
1.5
12
Watts
mW/C
TJ, Tstg
55 to +150
Symbol
Max
Unit
Operating and Storage Junction

Temperature Range
CASE 2904, STYLE 17

TO92 (TO226AA)
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction to Ambient
R JA
200
C/W
Thermal Resistance, Junction to Case
R JC
83.3
C/W
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)

Characteristic
Symbol
Min
Max
Unit
Collector Emitter Breakdown Voltage

(IC = 10 mAdc, IB = 0)
V(BR)CEO
40
Vdc
Collector Base Breakdown Voltage

(IC = 10 Adc, IE = 0)
V(BR)CBO
75
Vdc
Emitter Base Breakdown Voltage

(IE = 10 Adc, IC = 0)
V(BR)EBO
6.0
Vdc
Collector Cutoff Current

(VCE = 60 Vdc, VEB(off) = 3.0 Vdc)
ICEX
10
nAdc

(VCB = 60 Vdc, IE = 0)
(VCB = 60 Vdc, IE = 0, TA = 150C)
ICBO
0.01
10
Emitter Cutoff Current

(VEB = 3.0 Vdc, IC = 0)
IEBO
10
nAdc

(VCE = 10 V)
ICEO
10
nAdc
Base Cutoff Current

(VCE = 60 Vdc, VEB(off) = 3.0 Vdc)
IBEX
20
nAdc
OFF CHARACTERISTICS
Motorola SmallSignal Transistors, FETs and Diodes Device Data

Motorola, Inc. 1996
Adc
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) (Continued)

Characteristic
Symbol
Min
Max
Unit
35
50
75
35
100
50
40
300
0.3
1.0
0.6
1.2
2.0
fT
300
MHz
Output Capacitance
(VCB = 10 Vdc, IE = 0, f = 1.0 MHz)
Cobo
8.0
pF
Input Capacitance
(VEB = 0.5 Vdc, IC = 0, f = 1.0 MHz)
Cibo
25
pF
2.0
0.25
8.0
1.25
8.0
4.0
50
75
300
375
5.0
25
35
200
ON CHARACTERISTICS
DC Current Gain
(IC = 0.1 mAdc, VCE = 10 Vdc)
(IC = 1.0 mAdc, VCE = 10 Vdc)
(IC = 10 mAdc, VCE = 10 Vdc)
(IC = 10 mAdc, VCE = 10 Vdc, TA = 55C)
(IC = 150 mAdc, VCE = 10 Vdc)(1)
(IC = 150 mAdc, VCE = 1.0 Vdc)(1)
(IC = 500 mAdc, VCE = 10 Vdc)(1)
hFE
Collector Emitter Saturation

Voltage(1) (IC = 150 mAdc, IB = 15
mAdc)
(IC = 500 mAdc, IB = 50 mAdc)
Base Emitter Saturation
Voltage(1) (IC = 150 mAdc, IB = 15
mAdc)
(IC = 500 mAdc, IB = 50 mAdc)
VCE(sat)
VBE(sat)
Vdc
Vdc
SMALL SIGNAL CHARACTERISTICS

Current Gain Bandwidth Product(2)
(IC = 20 mAdc, VCE = 20 Vdc, f = 100 MHz)
Input Impedance
(IC = 1.0 mAdc, VCE = 10 Vdc, f = 1.0 kHz)
(IC = 10 mAdc, VCE = 10 Vdc, f = 1.0 kHz)
hie
Voltage Feedback Ratio

hre
SmallSignal Current Gain

hfe
Output Admittance
hoe
Collector Base Time Constant

(IE = 20 mAdc, VCB = 20 Vdc, f = 31.8 MHz)
rb Cc
150
ps
NF
4.0
dB
(VCC = 30 Vdc, VBE(off) = 2.0 Vdc,

IC = 150 mAdc, IB1 = 15 mAdc) (Figure 1)
td
10
ns
tr
25
ns
(VCC = 30 Vdc, IC = 150 mAdc,

IB1 = IB2 = 15 mAdc) (Figure 2)
ts
225
ns
tf
60
ns
Noise Figure
(IC = 100 Adc, VCE = 10 Vdc, RS = 1.0 k , f = 1.0 kHz)
X 10 4
mhos
SWITCHING CHARACTERISTICS
Delay Time
Rise Time
Storage Time
Fall Time
1. Pulse Test: Pulse Width

300 s, Duty Cycle
2.0%.
2. fT is defined as the frequency at which |hfe| extrapolates to unity.
SWITCHING TIME EQUIVALENT TEST CIRCUITS

+ 30 V
+ 30 V
1.0 to 100 s,
DUTY CYCLE 2.0%
+16 V
0
2V
200
1.0 to 100 s,
DUTY CYCLE 2.0%
+16 V
0
1k
< 2 ns
1k
14 V
CS* < 10 pF
< 20 ns
Figure 1. TurnOn Time
CS* < 10 pF
1N914
Scope rise time < 4 ns

*Total shunt capacitance of test jig,
connectors, and oscilloscope.
4V
Figure 2. TurnOff Time
1000
700
500
hFE, DC CURRENT GAIN
200
TJ = 125C
300
200
25C
100
70
50
55C
30
VCE = 1.0 V
VCE = 10 V
20
10
0.1
0.2
0.3
0.5 0.7
1.0
2.0
3.0
5.0 7.0 10
20
30
IC, COLLECTOR CURRENT (mA)
50
70
100
200
300
500 700 1.0 k
VCE , COLLECTOREMITTER VOLTAGE (VOLTS)
Figure 3. DC Current Gain
1.0
TJ = 25C
0.8
0.6
IC = 1.0 mA
10 mA
150 mA
500 mA
0.4
0.2
0
0.005
0.01
0.02 0.03
0.05
0.1
0.2
0.3
0.5
1.0
IB, BASE CURRENT (mA)
2.0
3.0
5.0
10
20
30
50
Figure 4. Collector Saturation Region
200
500
IC/IB = 10
TJ = 25C
100
70
t, TIME (ns)
30
t, TIME (ns)
tr @ VCC = 30 V
td @ VEB(off) = 2.0 V
td @ VEB(off) = 0
50
20
10
7.0
5.0
200
ts = ts 1/8 tf
100
70
50
tf
30
20
10
7.0
5.0
3.0
2.0
5.0 7.0
10
20 30
50 70 100
200 300
500
5.0 7.0 10
20
70
100
200
300
500
10
RS = OPTIMUM
SOURCE
RESISTANCE
IC = 1.0 mA, RS = 150

500 A, RS = 200
100 A, RS = 2.0 k
50 A, RS = 4.0 k
8.0
6.0
f = 1.0 kHz
8.0
NF, NOISE FIGURE (dB)
NF, NOISE FIGURE (dB)
50
Figure 6. Turn Off Time
10
4.0
2.0
IC = 50 A
100 A
500 A
1.0 mA
6.0
4.0
2.0
0
0.01 0.02 0.05 0.1 0.2
0.5 1.0 2.0
5.0 10
20
50
0
50
100
100 200
f, FREQUENCY (kHz)
Ceb
10
7.0
5.0
Ccb
0.2 0.3
0.5 0.7 1.0

2.0 3.0 5.0 7.0 10
REVERSE VOLTAGE (VOLTS)
Figure 9. Capacitances
20 30
50
f T, CURRENTGAIN BANDWIDTH PRODUCT (MHz)
20
0.1
5.0 k 10 k 20 k
50 k 100 k
Figure 8. Source Resistance Effects
30
3.0
500 1.0 k 2.0 k
RS, SOURCE RESISTANCE (OHMS)
Figure 7. Frequency Effects
CAPACITANCE (pF)
30
Figure 5. Turn On
Time
2.0
VCC = 30 V
IC/IB = 10
IB1 = IB2
TJ = 25C
300
500
VCE = 20 V
TJ = 25C
300
200
100
70
50
1.0
2.0
3.0
5.0 7.0 10
20 30
50
70 100
Figure 10. CurrentGain Bandwidth Product
1.0
+0.5
TJ = 25C
0
VBE(sat) @ IC/IB = 10
0.6
COEFFICIENT (mV/C)
V, VOLTAGE (VOLTS)
0.8
1.0 V
VBE(on) @ VCE = 10 V
0.4
0.2
0
R VC for VCE(sat)
0.5
1.0
1.5
R VB for VBE
2.0
VCE(sat) @ IC/IB = 10
0.1 0.2
0.5 1.0 2.0 5.0 10 20

50 100 200
500 1.0 k
Figure 11. On Voltages
2.5
0.1 0.2
0.5
1.0 2.0
5.0
10
20
50 100 200
500
Figure 12. Temperature Coefficients
PACKAGE DIMENSIONS
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. CONTOUR OF PACKAGE BEYOND DIMENSION R
IS UNCONTROLLED.
4. DIMENSION F APPLIES BETWEEN P AND L.
DIMENSION D AND J APPLY BETWEEN L AND K
MINIMUM. LEAD DIMENSION IS UNCONTROLLED
IN P AND BEYOND DIMENSION K MINIMUM.
R
P
L
SEATING
PLANE
K
DIM
A
B
C
D
F
G
H
J
K
L
N
P
R
V
D
X X
H
V
SECTION XX
N
N
CASE 02904
(TO226AA)
ISSUE AD
INCHES
MIN
MAX
0.175
0.205
0.170
0.210
0.125
0.165
0.016
0.022
0.016
0.019
0.045
0.055
0.095
0.105
0.015
0.020
0.500
0.250
0.080
0.105
0.100
0.115
0.135
MILLIMETERS
MIN
MAX
4.45
5.20
4.32
5.33
3.18
4.19
0.41
0.55
0.41
0.48
1.15
1.39
2.42
2.66
0.39
0.50
12.70
6.35
2.04
2.66
2.54
2.93
3.43
STYLE 17:
PIN 1. COLLECTOR
2. BASE
3. EMITTER
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee
regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or
circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. Typical parameters which may be
provided in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating
parameters, including Typicals must be validated for each customer application by customers technical experts. Motorola does not convey any license
under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for
surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product
could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized
application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs,
damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such
unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola andare
registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer.
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P2N2222A/D
DISCRETE SEMICONDUCTORS
M3D125
BC107; BC108; BC109

NPN general purpose transistors
Product specification
Supersedes data of 1997 Jun 03
File under Discrete Semiconductors, SC04
1997 Sep 03
Philips Semiconductors
BC107; BC108; BC109
FEATURES
PINNING
Low current (max. 100 mA)
PIN
Low voltage (max. 45 V).

APPLICATIONS
DESCRIPTION
emitter
base
collector, connected to the case
General purpose switching and amplification.

DESCRIPTION
3
2
2
PNP complement: BC177.

3
MAM264
Fig.1
Simplified outline (TO-18; SOT18)

and symbol.
QUICK REFERENCE DATA

SYMBOL
VCBO
VCEO
PARAMETER
collector-base voltage
CONDITIONS
UNIT
BC107
50
BC108; BC109
30
BC107
45
BC108; BC109
20
200
mA
300
mW
collector-emitter voltage
open base
peak collector current
Ptot
total power dissipation
Tamb
hFE
DC current gain
IC = 2 mA; VCE = 5 V
25 C
BC107
110
450
BC108
110
800
200
800
BC109
transition frequency
1997 Sep 03
MAX.
open emitter
ICM
fT
MIN.
IC = 10 mA; VCE = 5 V; f = 100 MHz
100
MHz
BC107; BC108; BC109
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
VCBO
VCEO
VEBO
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
open emitter
BC107
50
BC108; BC109
30
BC107
45
BC108; BC109
20
BC107
BC108; BC109
emitter-base voltage
open base
open collector
IC
collector current (DC)
100
mA
ICM
200
mA
IBM
peak base current
200
mA
Ptot
300
mW
Tstg
storage temperature
+150
Tj
junction temperature
175
Tamb
operating ambient temperature
+150
Tamb
25 C
65
65
SYMBOL
PARAMETER
CONDITIONS
VALUE
UNIT
Rth j-a
thermal resistance from junction to ambient note 1
0.5
K/mW
Rth j-c
thermal resistance from junction to case
0.2
K/mW
Note
1. Transistor mounted on an FR4 printed-circuit board.
1997 Sep 03
BC107; BC108; BC109
CHARACTERISTICS
Tj = 25 C unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
IE = 0; VCB = 20 V
15
nA
ICBO
collector cut-off current
IE = 0; VCB = 20 V; Tj = 150 C
15
IEBO
emitter cut-off current
IC = 0; VEB = 5 V
50
nA
hFE
DC current gain
IC = 10 A; VCE = 5 V
BC107A; BC108A
hFE
VCEsat
VBEsat
VBE
90
BC107B; BC108B; BC109B
40
150
BC108C; BC109C
100
270
BC107A; BC108A
110
180
220
BC107B; BC108B; BC109B
200
290
450
BC108C; BC109C
420
520
800
90
250
mV
IC = 100 mA; IB = 5 mA
200
600
mV
IC = 10 mA; IB = 0.5 mA; note 1
700
mV
IC = 100 mA; IB = 5 mA; note 1
900
mV
DC current gain
IC = 2 mA; VCE = 5 V
collector-emitter saturation voltage IC = 10 mA; IB = 0.5 mA

base-emitter saturation voltage
base-emitter voltage
IC = 2 mA; VCE = 5 V; note 2
550
620
700
mV
770
mV
pF
Cc
collector capacitance
IE = ie = 0; VCB = 10 V; f = 1 MHz
2.5
Ce
emitter capacitance
IC = ic = 0; VEB = 0.5 V; f = 1 MHz
fT
IC = 10 mA; VCB = 5 V; f = 100 MHz 100
noise figure
IC = 200 A; VCE = 5 V; RS = 2 k ;
f = 30 Hz to 15.7 kHz
dB
IC = 200 A; VCE = 5 V; RS = 2 k ;
f = 1 kHz; B = 200 Hz
10
dB
dB
BC109B; BC109C
F
noise figure
BC107A; BC108A
BC107B; BC108B; BC108C
BC109B; BC109C
Notes
1. VBEsat decreases by about 1.7 mV/K with increasing temperature.
2. VBE decreases by about 2 mV/K with increasing temperature.
1997 Sep 03
pF
MHz
BC107; BC108; BC109
PACKAGE OUTLINE
Metal-can cylindrical single-ended package; 3 leads
SOT18/13
seating plane
j
B
D1
2
3
a
A
10 mm
scale
DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)
UNIT
D1
mm
5.31
4.74
2.54
0.47
0.41
5.45
5.30
4.70
4.55
1.03
0.94
1.1
0.9
15.0
12.7
0.40
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT18/13
B11/C7 type 3
TO-18
1997 Sep 03
EIAJ
45
EUROPEAN
PROJECTION
ISSUE DATE
97-04-18
BC107; BC108; BC109
DEFINITIONS
Data Sheet Status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the
specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from
such improper use or sale.
1997 Sep 03
BC107; BC108; BC109

NOTES
1997 Sep 03
Philips Semiconductors a worldwide company

Argentina: see South America
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,
Tel. +61 2 9805 4455, Fax. +61 2 9805 4466
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 160 1010,
Fax. +43 160 101 1210
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,
220050 MINSK, Tel. +375 172 200 733, Fax. +375 172 200 773
Belgium: see The Netherlands
Brazil: see South America
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,
51 James Bourchier Blvd., 1407 SOFIA,
Tel. +359 2 689 211, Fax. +359 2 689 102
Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. +1 800 234 7381
China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. +852 2319 7888, Fax. +852 2319 7700
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,

Tel. +31 40 27 82785, Fax. +31 40 27 88399
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,
Tel. +64 9 849 4160, Fax. +64 9 849 7811
Norway: Box 1, Manglerud 0612, OSLO,
Tel. +47 22 74 8000, Fax. +47 22 74 8341
Philippines: Philips Semiconductors Philippines Inc.,
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474
Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,
Tel. +48 22 612 2831, Fax. +48 22 612 2327
Portugal: see Spain
Romania: see Italy
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,
Tel. +7 095 755 6918, Fax. +7 095 755 6919
Colombia: see South America
Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231,

Tel. +65 350 2538, Fax. +65 251 6500
Slovakia: see Austria
Czech Republic: see Austria
Slovenia: see Italy
Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S,

Tel. +45 32 88 2636, Fax. +45 31 57 0044
Finland: Sinikalliontie 3, FIN-02630 ESPOO,
Tel. +358 9 615800, Fax. +358 9 61580920
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,
2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000,
Tel. +27 11 470 5911, Fax. +27 11 470 5494
South America: Rua do Rocio 220, 5th floor, Suite 51,
04552-903 So Paulo, SO PAULO - SP, Brazil,
Tel. +55 11 821 2333, Fax. +55 11 829 1849
Spain: Balmes 22, 08007 BARCELONA,
Tel. +34 3 301 6312, Fax. +34 3 301 4107
France: 4 Rue du Port-aux-Vins, BP317, 92156 SURESNES Cedex,

Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427
Germany: Hammerbrookstrae 69, D-20097 HAMBURG,
Tel. +49 40 23 53 60, Fax. +49 40 23 536 300
Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS,
Tel. +30 1 4894 339/239, Fax. +30 1 4814 240
Hungary: see Austria
India: Philips INDIA Ltd, Band Box Building, 2nd floor,
254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,
Tel. +91 22 493 8541, Fax. +91 22 493 0966
Indonesia: see Singapore
Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. +353 1 7640 000, Fax. +353 1 7640 200
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,
TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007
Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,
20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108,
Tel. +81 3 3740 5130, Fax. +81 3 3740 5077
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. +82 2 709 1412, Fax. +82 2 709 1415
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. +60 3 750 5214, Fax. +60 3 757 4880
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. +9-5 800 234 7381
Middle East: see Italy
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,

Tel. +46 8 632 2000, Fax. +46 8 632 2745
Switzerland: Allmendstrasse 140, CH-8027 ZRICH,
Tel. +41 1 488 2686, Fax. +41 1 481 7730
Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. +886 2 2134 2865, Fax. +886 2 2134 2874
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. +66 2 745 4090, Fax. +66 2 398 0793
Turkey: Talatpasa Cad. No. 5, 80640 GLTEPE/ISTANBUL,
Tel. +90 212 279 2770, Fax. +90 212 282 6707
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381
Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 625 344, Fax.+381 11 635 777
For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications,
Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
Internet: http://www.semiconductors.philips.com
Philips Electronics N.V. 1997
SCA55
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
117047/00/04/pp8
Date of release: 1997 Sep 03
Document order number:
9397 750 02817
DISCRETE SEMICONDUCTORS
M3D186
BC546; BC547
Supersedes data of 1997 Mar 04
1999 Apr 15
BC546; BC547
FEATURES
PINNING
Low current (max. 100 mA)
PIN
Low voltage (max. 65 V).

APPLICATIONS
DESCRIPTION
emitter
base
collector
General purpose switching and amplification.

DESCRIPTION
NPN transistor in a TO-92; SOT54 plastic package.
PNP complements: BC556 and BC557.
Fig.1
Simplified outline (TO-92; SOT54)

and symbol.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
VCBO
VCEO
VEBO
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
open emitter
BC546
80
BC547
50
BC546
65
BC547
45
BC546
BC547
emitter-base voltage
open base
open collector
IC
collector current (DC)
100
mA
ICM
200
mA
IBM
peak base current
200
mA
Ptot
500
mW
Tstg
storage temperature
+150
Tj
junction temperature
150
Tamb
operating ambient temperature
+150
Tamb
65
65
Note
1999 Apr 15
25 C; note 1
BC546; BC547
SYMBOL
Rth j-a
PARAMETER
CONDITIONS
thermal resistance from junction to ambient
note 1
VALUE
UNIT
0.25
K/mW
Note
CHARACTERISTICS
Tj = 25 C unless otherwise specified.
SYMBOL
ICBO
PARAMETER
collector cut-off current
CONDITIONS
TYP.
15
nA
100
IC = 0; VEB = 5 V
hFE
DC current gain
IC = 10 A; VCE = 5 V;
see Figs 2, 3 and 4
150
BC547C
270
IC = 2 mA; VCE = 5 V;
see Figs 2, 3 and 4
nA
90
BC546B; BC547B
BC546A
UNIT
IE = 0; VCB = 30 V; Tj = 150 C
emitter cut-off current
DC current gain
MAX.
IE = 0; VCB = 30 V
IEBO
BC546A
MIN.
110
180
220
BC546B; BC547B
200
290
450
BC547C
420
520
800
BC547
110
800
BC546
110
450
collector-emitter saturation
voltage
IC = 10 mA; IB = 0.5 mA
90
250
mV
IC = 100 mA; IB = 5 mA
200
600
mV
VBEsat
base-emitter saturation voltage
IC = 10 mA; IB = 0.5 mA; note 1
700
VBE
base-emitter voltage
VCEsat
IC = 100 mA; IB = 5 mA; note 1

mV
900
580
660
IC = 10 mA; VCE = 5 V
mV
700
mV
770
mV
Cc
collector capacitance
IE = ie = 0; VCB = 10 V; f = 1 MHz
1.5
pF
Ce
emitter capacitance
IC = ic = 0; VEB = 0.5 V; f = 1 MHz
11
pF
fT
IC = 10mA; VCE = 5 V; f = 100 MHz 100
noise figure
IC = 200 A; VCE = 5 V;
RS = 2 k ; f = 1 kHz; B = 200 Hz
Notes
1. VBEsat decreases by about 1.7 mV/K with increasing temperature.
2. VBE decreases by about 2 mV/K with increasing temperature.
1999 Apr 15
MHz
2
10
dB
BC546; BC547
MBH723
250
hFE
200
VCE = 5 V
150
100
50
0
10
10
102
10
IC (mA)
103
BC546A.
Fig.2 DC current gain; typical values.
MBH724
300
hFE
VCE = 5 V
200
100
0
10 2
10 1
10
BC546B; BC547B.
1999 Apr 15
102
IC (mA)
103
BC546; BC547
MBH725
600
VCE = 5 V
hFE
400
200
0
10
10
10
BC547C.
1999 Apr 15
102
IC (mA)
103
BC546; BC547
PACKAGE OUTLINE
Plastic single-ended leaded (through hole) package; 3 leads
SOT54
E
d
L
b
1
e1
3
b1
L1
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)

UNIT
b1
e1
L1(1)
mm
5.2
5.0
0.48
0.40
0.66
0.56
0.45
0.40
4.8
4.4
1.7
1.4
4.2
3.6
2.54
1.27
14.5
12.7
2.5
Note
1. Terminal dimensions within this zone are uncontrolled to allow for flow of plastic and terminal irregularities.
OUTLINE
VERSION
SOT54
1999 Apr 15
REFERENCES
IEC
JEDEC
EIAJ
TO-92
SC-43
EUROPEAN
PROJECTION
ISSUE DATE
97-02-28
BC546; BC547
DEFINITIONS
Data Sheet Status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the
specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from
such improper use or sale.
1999 Apr 15
Philips Semiconductors a worldwide company

Argentina: see South America
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,

Tel. +31 40 27 82785, Fax. +31 40 27 88399
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,

Tel. +61 2 9805 4455, Fax. +61 2 9805 4466
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213,
Tel. +43 1 60 101 1248, Fax. +43 1 60 101 1210
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,

Tel. +64 9 849 4160, Fax. +64 9 849 7811
Norway: Box 1, Manglerud 0612, OSLO,
Tel. +47 22 74 8000, Fax. +47 22 74 8341
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,

220050 MINSK, Tel. +375 172 20 0733, Fax. +375 172 20 0773
Pakistan: see Singapore
Belgium: see The Netherlands
Philippines: Philips Semiconductors Philippines Inc.,

106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474
Brazil: see South America

Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,
51 James Bourchier Blvd., 1407 SOFIA,
Tel. +359 2 68 9211, Fax. +359 2 68 9102
Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. +1 800 234 7381, Fax. +1 800 943 0087
Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,

Tel. +48 22 612 2831, Fax. +48 22 612 2327
Portugal: see Spain
Romania: see Italy
China/Hong Kong: 501 Hong Kong Industrial Technology Centre,

72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. +852 2319 7888, Fax. +852 2319 7700
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,

Tel. +7 095 755 6918, Fax. +7 095 755 6919
Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,
Tel. +65 350 2538, Fax. +65 251 6500
Slovakia: see Austria
Colombia: see South America

Czech Republic: see Austria
Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V,
Tel. +45 33 29 3333, Fax. +45 33 29 3905
Finland: Sinikalliontie 3, FIN-02630 ESPOO,
Tel. +358 9 615 800, Fax. +358 9 6158 0920
Slovenia: see Italy

South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,
2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000,
Tel. +27 11 470 5911, Fax. +27 11 470 5494
South America: Al. Vicente Pinzon, 173, 6th floor,
04547-130 SO PAULO, SP, Brazil,
Tel. +55 11 821 2333, Fax. +55 11 821 2382
France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex,

Tel. +33 1 4099 6161, Fax. +33 1 4099 6427
Germany: Hammerbrookstrae 69, D-20097 HAMBURG,
Tel. +49 40 2353 60, Fax. +49 40 2353 6300
Spain: Balmes 22, 08007 BARCELONA,

Tel. +34 93 301 6312, Fax. +34 93 301 4107
Hungary: see Austria
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,

Tel. +46 8 5985 2000, Fax. +46 8 5985 2745
Switzerland: Allmendstrasse 140, CH-8027 ZRICH,
Tel. +41 1 488 2741 Fax. +41 1 488 3263
India: Philips INDIA Ltd, Band Box Building, 2nd floor,

254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,
Tel. +91 22 493 8541, Fax. +91 22 493 0966
Indonesia: PT Philips Development Corporation, Semiconductors Division,
Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510,
Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080
Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. +66 2 745 4090, Fax. +66 2 398 0793
Turkey: Talatpasa Cad. No. 5, 80640 GLTEPE/ISTANBUL,
Tel. +90 212 279 2770, Fax. +90 212 282 6707
Ireland: Newstead, Clonskeagh, DUBLIN 14,

Tel. +353 1 7640 000, Fax. +353 1 7640 200
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,
TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007
Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,
20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,

252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku,

TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5077
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,

MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,

Tel. +82 2 709 1412, Fax. +82 2 709 1415
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. +60 3 750 5214, Fax. +60 3 757 4880
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,

Tel. +1 800 234 7381, Fax. +1 800 943 0087
Uruguay: see South America
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,

Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087
Middle East: see Italy
Vietnam: see Singapore

Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 62 5344, Fax.+381 11 63 5777
For all other countries apply to: Philips Semiconductors,

International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
Internet: http://www.semiconductors.philips.com
Philips Electronics N.V. 1999
SCA63
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
115002/00/03/pp8
Date of release: 1999 Apr 15
Document order number:
9397 750 05677
HD44780U (LCD-II)
(Dot Matrix Liquid Crystal Display Controller/Driver)
ADE-207-272(Z)
'99.9
Rev. 0.0
Description
The HD44780U dot-matrix liquid crystal display controller and driver LSI displays alphanumerics,
Japanese kana characters, and symbols. It can be configured to drive a dot-matrix liquid crystal display
under the control of a 4- or 8-bit microprocessor. Since all the functions such as display RAM, character
generator, and liquid crystal driver, required for driving a dot-matrix liquid crystal display are internally
provided on one chip, a minimal system can be interfaced with this controller/driver.
A single HD44780U can display up to one 8-character line or two 8-character lines.
The HD44780U has pin function compatibility with the HD44780S which allows the user to easily replace
an LCD-II with an HD44780U. The HD44780U character generator ROM is extended to generate 208 5
8 dot character fonts and 32 5 10 dot character fonts for a total of 240 different character
fonts.
The low power supply (2.7V to 5.5V) of the HD44780U is suitable for any portable battery-driven product
requiring low power dissipation.
Features
5 8 and 5 10 dot matrix
possible
Low power operation support:
2.7 to 5.5V
Wide range of liquid crystal display driver power
3.0 to 11V
Liquid crystal drive waveform
A (One line frequency AC waveform)
Correspond to high speed MPU bus interface
2 MHz (when VCC = 5V)
4-bit or 8-bit MPU interface enabled
80 8-bit display RAM (80 characters

max.)
9,920-bit character generator ROM for a total of 240 character fonts
208 character fonts (5 8 dot)
HD44780U
64 8-bit character generator RAM
16-common 40-segment liquid crystal display driver
Programmable duty cycles
1/8 for one line of 5 8 dots with cursor
1/11 for one line of 5 10 dots with cursor
1/16 for two lines of 5 8 dots with cursor
Wide range of instruction functions:
Display clear, cursor home, display on/off, cursor on/off, display character blink, cursor shift,
display shift
Pin function compatibility with HD44780S
Automatic reset circuit that initializes the controller/driver after power on
Internal oscillator with external resistors
Low power consumption
Type No.
Package
CGROM
HD44780UA00FS
HCD44780UA00
HD44780UA00TF
HD44780UA02FS
HCD44780UA02
HD44780UA02TF
FP-80B
Chip
TFP-80F
Japanese standard font
FP-80B
Chip
TFP-80F
European standard font
HD44780UBxxFS
HCD44780UBxx
HD44780UBxxTF
FP-80B
Chip
TFP-80F
Custom font
Note: xx: ROM code No.
HD44780U
HD44780U Block Diagram
OSC1 OSC2
Reset
circuit
ACL
Timing
generator
CPG
RS
R/W
E
Instruction
register (IR)
Address
counter
DB0 to
DB3
40-bit
shift
register
DB4 to
DB7
Display
data RAM
(DDRAM)
80 8 bits
Instruction
decoder
MPU
interface
Input/
output
buffer
CL1
CL2
16-bit
shift
register
Common
signal
driver
40-bit
latch
circuit
Segment
signal
driver
SEG1 to
SEG40
Data
register
(DR)
8
40
8
LCD drive
voltage
selector
Busy
flag
GND
COM1 to
COM16
Character
generator
ROM
(CGROM)
9,920 bits
Character
generator
RAM
(CGRAM)
64 bytes
5
Cursor
and
blink
controller
Parallel/serial converter
and
attribute circuit
VCC
V1
V2
V3
V4
V5
HD44780U
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
SEG23
SEG24
SEG25
SEG26
SEG27
SEG28
SEG29
SEG30
SEG31
SEG32
SEG33
SEG34
SEG35
SEG36
SEG37
SEG38
HD44780U Pin Arrangement (FP-80B)
SEG22
SEG21
SEG20
SEG19
SEG18
SEG17
SEG16
SEG15
SEG14
64
63
62
61
60
59
58
57
56
SEG13
SEG12
SEG11
SEG10
SEG9
SEG8
SEG7
SEG6
SEG5
SEG4
SEG3
SEG2
SEG1
GND
OSC1
10
55
11
54
12
FP-80B
(Top view)
13
53
52
40
39
38
OSC2
V1
V2
V3
V4
V5
CL1
CL2
VCC
M
D
RS
R/W
E
DB0
DB1
37
41
36
42
24
35
43
23
34
44
22
33
45
21
32
46
20
31
47
19
30
48
18
29
49
17
28
16
27
50
26
51
15
25
14
SEG39
SEG40
COM16
COM15
COM14
COM13
COM12
COM11
COM10
COM9
COM8
COM7
COM6
COM5
COM4
COM3
COM2
COM1
DB7
DB6
DB5
DB4
DB3
DB2
HD44780U
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
60
59
58
57
56
55
54
53
52
TFP-80F
(Top view)
10
11
51
50
40
39
38
37
36
COM16
COM15
COM14
COM13
COM12
COM11
COM10
COM9
COM8
COM7
COM6
COM5
COM4
COM3
COM2
COM1
DB7
DB6
DB5
DB4
DB0
DB1
DB2
DB3
35
33
34
RS
R/W
32
31
30
41
29
42
20
28
43
19
27
44
18
26
45
17
25
46
16
24
47
15
23
48
14
22
49
13
21
12
GND
OSC1
OSC2
V1
V2
V3
V4
V5
CL1
CL2
VCC
SEG20
SEG19
SEG18
SEG17
SEG16
SEG15
SEG14
SEG13
SEG12
SEG11
SEG10
SEG9
SEG8
SEG7
SEG6
SEG5
SEG4
SEG3
SEG2
SEG1
79
80
SEG21
SEG22
SEG23
SEG24
SEG25
SEG26
SEG27
SEG28
SEG29
SEG30
SEG31
SEG32
SEG33
SEG34
SEG35
SEG36
SEG37
SEG38
SEG39
SEG40
HD44780U Pin Arrangement (TFP-80F)
HD44780U
HD44780U Pad Arrangement
Chip size:
4.90
4.90 mm2
Coordinate: Pad center (m)

Origin:
Chip center
Pad size:
2
114
80
114 m2
63
Type code
HD44780U
23
42
X
HD44780U
HCD44780U Pad Location Coordinates
Pad No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
Function
SEG22
SEG21
SEG20
SEG19
SEG18
SEG17
SEG16
SEG15
SEG14
SEG13
SEG12
SEG11
SEG10
SEG9
SEG8
SEG7
SEG6
SEG5
SEG4
SEG3
SEG2
SEG1
GND
OSC1
OSC2
V1
V2
V3
V4
V5
CL1
CL2
VCC
M
D
RS
R/W
E
DB0
DB1
Coordinate
X (um)
Y (um)
2100
2313
2280
2313
2313
2089
2313
1833
2313
1617
2313
1401
2313
1186
2313
970
2313
755
2313
539
2313
323
2313
108
2313
108
2313
323
2313
539
2313
755
2313
970
2313
1186
2313
1401
2313
1617
2313
1833
2313
2073
2280
2290
2080
2290
1749
2290
1550
2290
1268
2290
941
2290
623
2290
304
2290
48
2290
142
2290
309
2290
475
2290
665
2290
832
2290
1022
2290
1204
2290
1454
2290
1684
2290
Pad No.
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
Function
DB2
DB3
DB4
DB5
DB6
DB7
COM1
COM2
COM3
COM4
COM5
COM6
COM7
COM8
COM9
COM10
COM11
COM12
COM13
COM14
COM15
COM16
SEG40
SEG39
SEG38
SEG37
SEG36
SEG35
SEG34
SEG33
SEG32
SEG31
SEG30
SEG29
SEG28
SEG27
SEG26
SEG25
SEG24
SEG23
Coordinate
X (um)
Y (um)
2070
2290
2260
2290
2290
2099
2290
1883
2290
1667
2290
1452
2313
1186
2313
970
2313
755
2313
539
2313
323
2313
108
2313
108
2313
323
2313
539
2313
755
2313
970
2313
1186
2313
1401
2313
1617
2313
1833
2313
2095
2296
2313
2100
2313
1617
2313
1401
2313
1186
2313
970
2313
755
2313
539
2313
323
2313
108
2313
108
2313
323
2313
539
2313
755
2313
970
2313
1186
2313
1401
2313
1617
2313
HD44780U
Pin Functions
Signal
No. of
Lines
I/O
Device
Interfaced with
RS
MPU
Selects registers.
0: Instruction register (for write) Busy flag:
address counter (for read)
1: Data register (for write and read)
R/W
MPU
Selects read or write.

0: Write
1: Read
MPU
Starts data read/write.
DB4 to DB7
I/O
MPU
Four high order bidirectional tristate data bus

pins. Used for data transfer and receive between
the MPU and the HD44780U. DB7 can be used
as a busy flag.
DB0 to DB3
I/O
MPU
Four low order bidirectional tristate data bus pins.

Used for data transfer and receive between the
MPU and the HD44780U.
These pins are not used during 4-bit operation.
CL1
Extension driver
Clock to latch serial data D sent to the extension

driver
CL2
Extension driver
Clock to shift serial data D
Extension driver
Switch signal for converting the liquid crystal

drive waveform to AC
Extension driver
Character pattern data corresponding to each

segment signal
COM1 to COM16 16
LCD
Common signals that are not used are changed

to non-selection waveforms. COM9 to COM16
are non-selection waveforms at 1/8 duty factor
and COM12 to COM16 are non-selection
waveforms at 1/11 duty factor.
SEG1 to SEG40 40
LCD
Segment signals
V1 to V5
Power supply
Power supply for LCD drive

VCC V5 = 11 V (max)
VCC, GND
Power supply
VCC: 2.7V to 5.5V, GND: 0V
OSC1, OSC2
Oscillation
resistor clock
When crystal oscillation is performed, a resistor

must be connected externally. When the pin input
is an external clock, it must be input to OSC1.
Function
HD44780U
Function Description
Registers
The HD44780U has two 8-bit registers, an instruction register (IR) and a data register (DR).
The IR stores instruction codes, such as display clear and cursor shift, and address information for display
data RAM (DDRAM) and character generator RAM (CGRAM). The IR can only be written from the MPU.
The DR temporarily stores data to be written into DDRAM or CGRAM and temporarily stores data to be
read from DDRAM or CGRAM. Data written into the DR from the MPU is automatically written into
DDRAM or CGRAM by an internal operation. The DR is also used for data storage when reading data
from DDRAM or CGRAM. When address information is written into the IR, data is read and then stored
into the DR from DDRAM or CGRAM by an internal operation. Data transfer between the MPU is then
completed when the MPU reads the DR. After the read, data in DDRAM or CGRAM at the next address is
sent to the DR for the next read from the MPU. By the register selector (RS) signal, these two registers can
be selected (Table 1).
Busy Flag (BF)
When the busy flag is 1, the HD44780U is in the internal operation mode, and the next instruction will not
be accepted. When RS = 0 and R/ W = 1 (Table 1), the busy flag is output to DB7. The next instruction
must be written after ensuring that the busy flag is 0.
Address Counter (AC)
The address counter (AC) assigns addresses to both DDRAM and CGRAM. When an address of an
instruction is written into the IR, the address information is sent from the IR to the AC. Selection of either
DDRAM or CGRAM is also determined concurrently by the instruction.
After writing into (reading from) DDRAM or CGRAM, the AC is automatically incremented by 1
(decremented by 1). The AC contents are then output to DB0 to DB6 when RS = 0 and R/W = 1 (Table 1).
Table 1
Register Selection
RS
R/W
Operation
IR write as an internal operation (display clear, etc.)
Read busy flag (DB7) and address counter (DB0 to DB6)
DR write as an internal operation (DR to DDRAM or CGRAM)
DR read as an internal operation (DDRAM or CGRAM to DR)
HD44780U
Display Data RAM (DDRAM)
Display data RAM (DDRAM) stores display data represented in 8-bit character codes. Its extended
capacity is 80 8 bits, or 80 characters. The area in display data RAM (DDRAM) that is not used
for display can be used as general data RAM. See Figure 1 for the relationships between DDRAM
addresses and positions on the liquid crystal display.
The DDRAM address (ADD ) is set in the address counter (AC) as hexadecimal.
1-line display (N = 0) (Figure 2)
When there are fewer than 80 display characters, the display begins at the head position. For
example, if using only the HD44780, 8 characters are displayed. See Figure 3.
When the display shift operation is performed, the DDRAM address shifts. See Figure 3.
High order
bits
Low order
bits
Example: DDRAM address 4E
AC
(hexadecimal) AC6 AC5 AC4 AC3 AC2 AC1 AC0
Figure 1 DDRAM Address

Display position
(digit)
DDRAM
00
address
(hexadecimal)
01
02
79
..................
03 04
Figure 2 1-Line Display

Display
position
DDRAM
address
00 01 02 03 04 05 06 07
For
shift left
01 02 03 04 05 06 07 08
For
shift right 4F 00 01 02 03 04 05 06
Figure 3 1-Line by 8-Character Display Example
10
80
4E 4F
HD44780U
2-line display (N = 1) (Figure 4)
Case 1: When the number of display characters is less than 40 2 lines, the two lines are
displayed from the head. Note that the first line end address and the second line start address are not
consecutive. For example, when just the HD44780 is used, 8 characters 2 lines are displayed.
See Figure 5.
When display shift operation is performed, the DDRAM address shifts. See Figure 5.
Display
position
00
DDRAM
address
(hexadecimal) 40
39
40
01
02
03 04
..................
26 27
41
42
43 44
..................
66 67
Figure 4 2-Line Display

Display
position
DDRAM
address
00 01 02 03 04 05 06 07
For
shift left
01 02 03 04 05 06 07 08
40 41 42 43 44 45 46 47
41 42 43 44 45 46 47 48
27 00 01 02 03 04 05 06
For
shift right
67 40 41 42 43 44 45 46
11
HD44780U
Case 2: For a 16-character 2-line display, the HD44780 can be extended using one 40output extension driver. See Figure 6.
When display shift operation is performed, the DDRAM address shifts. See Figure 6.
Display
position
DDRAM
address
9 10 11 12 13 14 15 16
00 01 02 03 04 05 06 07 08 09 0A 0B 0C 0D 0E 0F
40 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D 4E 4F
HD44780U display
For
shift left
Extension driver
display
01 02 03 04 05 06 07 08 09 0A 0B 0C 0D 0E 0F 10
41 42 43 44 45 46 47 48 49 4A 4B 4C 4D 4E 4F 50
27 00 01 02 03 04 05 06 07 08 09 0A 0B 0C 0D 0E
For
shift right
67 40 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D 4E
12
HD44780U
Character Generator ROM (CGROM)
The character generator ROM generates 5 8 dot or 5 10 dot character patterns from 8-bit
character codes (Table 4). It can generate 208 5 8 dot character patterns and 32 5 10 dot character
patterns. User- defined character patterns are also available by mask-programmed ROM.
Character Generator RAM (CGRAM)
In the character generator RAM, the user can rewrite character patterns by program. For 5 8 dots,
eight character patterns can be written, and for 5 10 dots, four character patterns can be written.
Write into DDRAM the character codes at the addresses shown as the left column of Table 4 to show the
character patterns stored in CGRAM.
See Table 5 for the relationship between CGRAM addresses and data and display patterns.
Areas that are not used for display can be used as general data RAM.
Modifying Character Patterns
Character pattern development procedure
The following operations correspond to the numbers listed in Figure 7:
1. Determine the correspondence between character codes and character patterns.
2. Create a listing indicating the correspondence between EPROM addresses and data.
3. Program the character patterns into the EPROM.
4. Send the EPROM to Hitachi.
5. Computer processing on the EPROM is performed at Hitachi to create a character pattern listing, which
is sent to the user.
6. If there are no problems within the character pattern listing, a trial LSI is created at Hitachi and samples
are sent to the user for evaluation. When it is confirmed by the user that the character patterns are
correctly written, mass production of the LSI proceeds at Hitachi.
13
HD44780U
Hitachi
User
Start
Computer
processing
Create character
pattern listing
Evaluate
character
patterns
No
Determine
character patterns
Create EPROM
address data listing
Write EPROM
EPROM
OK?
Hitachi
Yes
Art work
M/T
Masking
Trial
Sample
Sample
evaluation
OK?
6
No
Yes
Mass
production
Note: For a description of the numbers used in this figure, refer to the preceding page.
Figure 7 Character Pattern Development Procedure
14
HD44780U
Programming character patterns
This section explains the correspondence between addresses and data used to program character patterns
in EPROM. The HD44780U character generator ROM can generate 208 5 8 dot character patterns
and
32 5 10 dot character patterns for a total of 240 different character patterns.
Character patterns
EPROM address data and character pattern data correspond with each other to form a 5 8 or 5
10 dot character pattern (Tables 2 and 3).
Table 2
Example of Correspondence between EPROM Address Data and Character Pattern

(5 8 Dots)
EPROM Address
Data
LSB
O 4 O3 O2 O1 O0
A 1 1A 1 0 A 9 A 8 A 7 A 6 A 5 A 4 A 3 A 2 A 1
A0
Character code
Notes: 1.
2.
3.
4.
5.
6.
Cursor position
Line
position
EPROM addresses A11 to A4 correspond to a character code.

EPROM addresses A3 to A0 specify a line position of the character pattern.
EPROM data O4 to O0 correspond to character pattern data.
EPROM data O5 to O7 must be specified as 0.
A lit display position (black) corresponds to a 1.
Line 9 and the following lines must be blanked with 0s for a 5 8 dot character fonts.
15
HD44780U
Handling unused character patterns
1. EPROM data outside the character pattern area: Always input 0s.
2. EPROM data in CGRAM area: Always input 0s. (Input 0s to EPROM addresses 00H to FFH.)
3. EPROM data used when the user does not use any HD44780U character pattern: According to the user
application, handled in one of the two ways listed as follows.
a. When unused character patterns are not programmed: If an unused character code is written into
DDRAM, all its dots are lit. By not programing a character pattern, all of its bits become lit. (This is
due to the EPROM being filled with 1s after it is erased.)
b. When unused character patterns are programmed as 0s: Nothing is displayed even if unused
character codes are written into DDRAM. (This is equivalent to a space.)
Table 3
Example of Correspondence between EPROM Address Data and Character Pattern

(5 10 Dots)
EPROM Address
Data
LSB
A 1 1A 1 0 A9 A 8 A7 A 6 A5 A 4 A3 A 2 A1 A 0 O 4 O3 O2 O1 O0
Character code
Notes: 1.
2.
3.
4.
5.
6.
16
Cursor position
Line
position
EPROM addresses A11 to A3 correspond to a character code.

EPROM addresses A3 to A0 specify a line position of the character pattern.
EPROM data O4 to O0 correspond to character pattern data.
EPROM data O5 to O7 must be specified as 0.
A lit display position (black) corresponds to a 1.
Line 11 and the following lines must be blanked with 0s for a 5 10 dot character fonts.
HD44780U
Table 4
Lower
4 Bits
Upper 4
Bits
Correspondence between Character Codes and Character Patterns (ROM Code: A00)
0000 0001 0010
xxxx0000
CG
RAM
(1)
xxxx0001
(2)
xxxx0010
(3)
xxxx0011
(4)
xxxx0100
(5)
xxxx0101
(6)
xxxx0110
(7)
xxxx0111
(8)
xxxx1000
(1)
xxxx1001
(2)
xxxx1010
(3)
0011 0100 0101
0110
0111 1000
1001 1010
1011 1100 1101
1110 1111
xxxx1011
xxxx1100
xxxx1101
xxxx1110
xxxx1111
(4)
(5)
(6)
(7)
(8)
Note: The user can specify any pattern for character-generator RAM.
17
HD44780U
Table 4
Lower
4 Bits
Upper 4
Bits
Correspondence between Character Codes and Character Patterns (ROM Code: A02)
0000 0001 0010
xxxx0000
CG
RAM
(1)
xxxx0001
(2)
xxxx0010
(3)
xxxx0011
(4)
xxxx0100
(5)
xxxx0101
(6)
xxxx0110
(7)
xxxx0111
(8)
xxxx1000
(1)
xxxx1001
(2)
xxxx1010
(3)
xxxx1011
xxxx1100
xxxx1101
xxxx1110
xxxx1111
(4)
(5)
(6)
(7)
(8)
18
0011 0100 0101
0110
0111 1000 1001 1010
1011 1100 1101
1110 1111
HD44780U
Table 5
For 5
Relationship between CGRAM Addresses, Character Codes (DDRAM) and Character

Patterns (CGRAM Data)
8 dot character patterns
Character Codes
(DDRAM data)
CGRAM Address
Character Patterns
(CGRAM data)
7 6 5 4 3 2 1 0
5 4 3 2 1 0
7 6 5 4 3 2 1 0
High
High
High
Low
0 0 0 0 * 0 0 0
0 0 0 0 * 0 0 1
0 0 0 0 * 1 1 1
0 0 0
0 0 1
1 1 1
Low
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
1
1
1
1
0
0
1
1
0
1
0
1
* * *
* * *
* * *
* * *
* * *
Low
1
1
1
1
1
1
1
0
1
0
1
0
1
0
0
0
1
0
0
1
0
0
0
0
0
1
1
0
1
0
0
0
1
0
0
1
1
0
0
0
0
0
1
1
1
1
1
0
1
0
0
1
0
1
0
0
0
1
1
0
1
0
0
0
0
1
1
0
0
0
1
0
1
0
1
0
1
0
0
0
Character
pattern (1)
Cursor position
Character
pattern (2)
Cursor position
* * *
Notes: 1. Character code bits 0 to 2 correspond to CGRAM address bits 3 to 5 (3 bits: 8 types).
2. CGRAM address bits 0 to 2 designate the character pattern line position. The 8th line is the
cursor position and its display is formed by a logical OR with the cursor.
Maintain the 8th line data, corresponding to the cursor display position, at 0 as the cursor display.
If the 8th line data is 1, 1 bits will light up the 8th line regardless of the cursor presence.
3. Character pattern row positions correspond to CGRAM data bits 0 to 4 (bit 4 being at the left).
4. As shown Table 5, CGRAM character patterns are selected when character code bits 4 to 7 are
all 0. However, since character code bit 3 has no effect, the R display example above can be
selected by either character code 00H or 08H.
5. 1 for CGRAM data corresponds to display selection and 0 to non-selection.
* Indicates no effect.
19
HD44780U
Table 5
For 5
Relationship between CGRAM Addresses, Character Codes (DDRAM) and Character

Patterns (CGRAM Data) (cont)
10 dot character patterns
Character Codes
(DDRAM data)
CGRAM Address
Character Patterns
(CGRAM data)
7 6 5 4 3 2 1 0
5 4 3 2 1 0
7 6 5 4 3 2 1 0
High
High
High
Low
0 0 0 0 * 0 0 *
0 0 0 0 * 1 1 *
0 0
1 1
Low
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
1
1
1
1
1
1
1
0
0
0
1
1
1
1
0
1
1
0
0
1
1
1
0
1
0
1
0
1
* * *
* * *
* * *
* * *
* * *
Low
0
0
1
1
1
1
1
1
1
1
0
*
0
0
0
1
0
0
1
0
0
0
0
*
0
0
1
0
0
0
1
0
0
0
0
*
0
0
1
0
0
0
1
0
0
0
0
*
0
0
0
1
1
1
0
0
0
0
0
*
Character
pattern
Cursor position
* * * * *
* * *
* * *
* * * * *
* * *
* * * * *
Notes: 1. Character code bits 1 and 2 correspond to CGRAM address bits 4 and 5 (2 bits: 4 types).
2. CGRAM address bits 0 to 3 designate the character pattern line position. The 11th line is the
cursor position and its display is formed by a logical OR with the cursor.
Maintain the 11th line data corresponding to the cursor display positon at 0 as the cursor display.
If the 11th line data is 1, 1 bits will light up the 11th line regardless of the cursor presence.
Since lines 12 to 16 are not used for display, they can be used for general data RAM.
3. Character pattern row positions are the same as 5 8 dot character pattern positions.
4. CGRAM character patterns are selected when character code bits 4 to 7 are all 0.
However, since character code bits 0 and 3 have no effect, the P display example above can be
selected by character codes 00H, 01H, 08H, and 09H.
5. 1 for CGRAM data corresponds to display selection and 0 to non-selection.
* Indicates no effect.
20
HD44780U
Timing Generation Circuit
The timing generation circuit generates timing signals for the operation of internal circuits such as
DDRAM, CGROM and CGRAM. RAM read timing for display and internal operation timing by MPU
access are generated separately to avoid interfering with each other. Therefore, when writing data to
DDRAM, for example, there will be no undesirable interferences, such as flickering, in areas other than the
display area.
Liquid Crystal Display Driver Circuit
The liquid crystal display driver circuit consists of 16 common signal drivers and 40 segment signal
drivers. When the character font and number of lines are selected by a program, the required common
signal drivers automatically output drive waveforms, while the other common signal drivers continue to
output non-selection waveforms.
Sending serial data always starts at the display data character pattern corresponding to the last address of
the display data RAM (DDRAM).
Since serial data is latched when the display data character pattern corresponding to the starting address
enters the internal shift register, the HD44780U drives from the head display.
Cursor/Blink Control Circuit
The cursor/blink control circuit generates the cursor or character blinking. The cursor or the blinking will
appear with the digit located at the display data RAM (DDRAM) address set in the address counter (AC).
For example (Figure 8), when the address counter is 08H, the cursor position is displayed at DDRAM
address 08H.
AC6 AC5 AC4 AC3 AC2 AC1 AC0
AC
Display position
10
11
DDRAM address
(hexadecimal)
00
01
02
03
04
05
06
07
08
09
0A
Display position
10
11
DDRAM address
(hexadecimal)
00
01
02
03
04
05
06
07
08
09
0A
40
41
42
43
44
45
46
47
48
49
4A
For a 1-line display
For a 2-line display
cursor position
cursor position
Note: The cursor or blinking appears when the address counter (AC) selects the
character generator RAM (CGRAM). However, the cursor and blinking become
meaningless.
The cursor or blinking is displayed in the meaningless position when the AC is a CGRAM address.
Figure 8 Cursor/Blink Display Example
21
HD44780U
Interfacing to the MPU
The HD44780U can send data in either two 4-bit operations or one 8-bit operation, thus allowing
interfacing with 4- or 8-bit MPUs.
For 4-bit interface data, only four bus lines (DB4 to DB7) are used for transfer. Bus lines DB0 to DB3
are disabled. The data transfer between the HD44780U and the MPU is completed after the 4-bit data
has been transferred twice. As for the order of data transfer, the four high order bits (for 8-bit operation,
DB4 to DB7) are transferred before the four low order bits (for 8-bit operation, DB0 to DB3).
The busy flag must be checked (one instruction) after the 4-bit data has been transferred twice. Two
more 4-bit operations then transfer the busy flag and address counter data.
For 8-bit interface data, all eight bus lines (DB0 to DB7) are used.
RS
R/W
E
DB7
IR7
IR3
BF
AC3
DR7
DR3
DB6
IR6
IR2
AC6
AC2
DR6
DR2
DB5
IR5
IR1
AC1
DR5
DR1
DB4
IR4
IR0
AC0
DR4
DR0
Instruction register (IR)

write
AC5
AC4
Busy flag (BF) and

address counter (AC)
read
Figure 9 4-Bit Transfer Example
22
Data register (DR)

read
HD44780U
Reset Function
Initializing by Internal Reset Circuit
An internal reset circuit automatically initializes the HD44780U when the power is turned on. The
following instructions are executed during the initialization. The busy flag (BF) is kept in the busy state
until the initialization ends (BF = 1). The busy state lasts for 10 ms after VCC rises to 4.5 V.
1. Display clear
2. Function set:
DL = 1; 8-bit interface data
N = 0; 1-line display
F = 0; 5 8 dot character font
3. Display on/off control:
D = 0; Display off
C = 0; Cursor off
B = 0; Blinking off
4. Entry mode set:
I/D = 1; Increment by 1
S = 0; No shift
Note:
If the electrical characteristics conditions listed under the table Power Supply Conditions Using
Internal Reset Circuit are not met, the internal reset circuit will not operate normally and will fail to
initialize the HD44780U. For such a case, initial-ization must be performed by the MPU as
explained in the section, Initializing by Instruction.
Instructions
Outline
Only the instruction register (IR) and the data register (DR) of the HD44780U can be controlled by the
MPU. Before starting the internal operation of the HD44780U, control information is temporarily stored
into these registers to allow interfacing with various MPUs, which operate at different speeds, or various
peripheral control devices. The internal operation of the HD44780U is determined by signals sent from the
MPU. These signals, which include register selection signal (RS), read/
write signal (R/W), and the data bus (DB0 to DB7), make up the HD44780U instructions (Table 6). There
are four categories of instructions that:
Designate HD44780U functions, such as display format, data length, etc.
Set internal RAM addresses
Perform data transfer with internal RAM
Perform miscellaneous functions
23
HD44780U
Normally, instructions that perform data transfer with internal RAM are used the most. However, autoincrementation by 1 (or auto-decrementation by 1) of internal HD44780U RAM addresses after each data
write can lighten the program load of the MPU. Since the display shift instruction (Table 11) can perform
concurrently with display data write, the user can minimize system development time with maximum
programming efficiency.
When an instruction is being executed for internal operation, no instruction other than the busy flag/address
read instruction can be executed.
Because the busy flag is set to 1 while an instruction is being executed, check it to make sure it is 0 before
sending another instruction from the MPU.
Note:
Be sure the HD44780U is not in the busy state (BF = 0) before sending an instruction from the
MPU to the HD44780U. If an instruction is sent without checking the busy flag, the time between
the first instruction and next instruction will take much longer than the instruction time itself. Refer
to Table 6 for the list of each instruc-tion execution time.
Table 6
Instructions
Code
Execution Time
(max) (when f cp or
f OSC is 270 kHz)
Instruction RS
R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Description
Clear
display
Clears entire display and

sets DDRAM address 0 in
address counter.
Return
home
Sets DDRAM address 0 in

address counter. Also
returns display from being
shifted to original position.
DDRAM contents remain
unchanged.
1.52 ms
Entry
mode set
I/D
Sets cursor move direction

and specifies display shift.
These operations are
performed during data write
and read.
37 s
Display
on/off
control
Sets entire display (D) on/off, 37 s

cursor on/off (C), and
blinking of cursor position
character (B).
Cursor or
display
shift
S/C R/L
Moves cursor and shifts

display without changing
DDRAM contents.
Function
set
DL
Sets interface data length

37 s
(DL), number of display lines
(N), and character font (F).
Set
CGRAM
address
ACG ACG ACG ACG ACG ACG Sets CGRAM address.

CGRAM data is sent and
received after this setting.
37 s
Set
DDRAM
address
ADD ADD ADD ADD ADD ADD ADD Sets DDRAM address.
DDRAM data is sent and
received after this setting.
37 s
Read busy 0
flag &
address
BF
AC
0 s
24
AC
AC
AC
AC
AC
AC
Reads busy flag (BF)

indicating internal operation
is being performed and
reads address counter
contents.
37 s
HD44780U
Table 6
Instructions (cont)
Execution Time
(max) (when f cp or
f OSC is 270 kHz)
Code
Instruction RS
R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Description
Write data
to CG or
DDRAM
Write data
Writes data into DDRAM or

CGRAM.
37 s
tADD = 4 s*
Read data 1
from CG or
DDRAM
Read data
Reads data from DDRAM or

CGRAM.
37 s
tADD = 4 s*
= 1:
= 0:
= 1:
= 1:
= 0:
= 1:
= 0:
= 1:
= 1:
= 1:
Increment
Decrement
Accompanies display shift
Display shift
Cursor move
Shift to the right
Shift to the left
8 bits, DL = 0: 4 bits
2 lines, N = 0: 1 line
5 10 dots, F = 0: 5 8
DDRAM: Display data RAM

CGRAM: Character generator
RAM
ACG:
CGRAM address
ADD:
DDRAM address
(corresponds to cursor
address)
AC: Address counter used for
both DD and CGRAM
addresses
Execution time
changes when
frequency changes
Example:
When fcp or fOSC is
250 kHz,
37 s 270 = 40 s
250
= 1:
= 0:
Internally operating
Instructions acceptable
I/D
I/D
S
S/C
S/C
R/L
R/L
DL
N
F
dots
BF
BF
Note:
indicates no effect.
* After execution of the CGRAM/DDRAM data write or read instruction, the RAM address counter
is incremented or decremented by 1. The RAM address counter is updated after the busy flag
turns off. In Figure 10, tADD is the time elapsed after the busy flag turns off until the address
counter is updated.
Busy signal
(DB7 pin)
Address counter
(DB0 to DB6 pins)
Busy state
A+1
t ADD
Note: t ADD depends on the operation frequency

t ADD = 1.5/(f cp or f OSC ) seconds
Figure 10 Address Counter Update
25
HD44780U
Instruction Description
Clear Display
Clear display writes space code 20H (character pattern for character code 20H must be a blank pattern) into
all DDRAM addresses. It then sets DDRAM address 0 into the address counter, and returns the display to
its original status if it was shifted. In other words, the display disappears and the cursor or blinking goes to
the left edge of the display (in the first line if 2 lines are displayed). It also sets I/D to 1 (increment mode)
in entry mode. S of entry mode does not change.
Return Home
Return home sets DDRAM address 0 into the address counter, and returns the display to its original status
if it was shifted. The DDRAM contents do not change.
The cursor or blinking go to the left edge of the display (in the first line if 2 lines are displayed).
Entry Mode Set
I/D: Increments (I/D = 1) or decrements (I/D = 0) the DDRAM address by 1 when a character code is
written into or read from DDRAM.
The cursor or blinking moves to the right when incremented by 1 and to the left when decremented by 1.
The same applies to writing and reading of CGRAM.
S: Shifts the entire display either to the right (I/D = 0) or to the left (I/D = 1) when S is 1. The display does
not shift if S is 0.
If S is 1, it will seem as if the cursor does not move but the display does. The display does not shift when
reading from DDRAM. Also, writing into or reading out from CGRAM does not shift the display.
Display On/Off Control
D: The display is on when D is 1 and off when D is 0. When off, the display data remains in DDRAM, but
can be displayed instantly by setting D to 1.
C: The cursor is displayed when C is 1 and not displayed when C is 0. Even if the cursor disappears, the
function of I/D or other specifications will not change during display data write. The cursor is displayed
using 5 dots in the 8th line for 5 8 dot character font selection and in the 11th line for the 5 10
dot character font selection (Figure 13).
B: The character indicated by the cursor blinks when B is 1 (Figure 13). The blinking is displayed as
switching between all blank dots and displayed characters at a speed of 409.6-ms intervals when fcp or f OSC
is 250 kHz. The cursor and blinking can be set to display simultaneously. (The blinking frequency changes
according to f OSC or the reciprocal of fcp. For example, when fcp is 270 kHz, 409.6 250/270 = 379.2 ms.)
26
HD44780U
Cursor or Display Shift
Cursor or display shift shifts the cursor position or display to the right or left without writing or reading
display data (Table 7). This function is used to correct or search the display. In a 2-line display, the cursor
moves to the second line when it passes the 40th digit of the first line. Note that the first and second line
displays will shift at the same time.
When the displayed data is shifted repeatedly each line moves only horizontally. The second line display
does not shift into the first line position.
The address counter (AC) contents will not change if the only action performed is a display shift.
Function Set
DL: Sets the interface data length. Data is sent or received in 8-bit lengths (DB7 to DB0) when DL is 1,
and in 4-bit lengths (DB7 to DB4) when DL is 0.When 4-bit length is selected, data must be sent or
received twice.
N: Sets the number of display lines.
F: Sets the character font.
Note:
Perform the function at the head of the program before executing any instructions (except for the
read busy flag and address instruction). From this point, the function set instruction cannot be
executed unless the interface data length is changed.
Set CGRAM Address

Set CGRAM address sets the CGRAM address binary AAAAAA into the address counter.
Data is then written to or read from the MPU for CGRAM.
27
HD44780U
RS
Clear
display
Code
0
RS
Return
home
Code
RS
Entry
mode set
Code
0
RS
Display
on/off control
Code
RS
Cursor or
display shift
Code
0
RS
Function set
Code
RS
Set CGRAM
address
Code
R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0

0

0
Note: * Dont care.

0
I/D

0

0
S/C
R/L

0
DL

0
Higher
order bit
Figure 11 Instruction (1)
28
Lower
order bit
Note: * Dont care.
HD44780U
Set DDRAM Address
Set DDRAM address sets the DDRAM address binary AAAAAAA into the address counter.
Data is then written to or read from the MPU for DDRAM.
However, when N is 0 (1-line display), AAAAAAA can be 00H to 4FH. When N is 1 (2-line display),
AAAAAAA can be 00H to 27H for the first line, and 40H to 67H for the second line.
Read Busy Flag and Address
Read busy flag and address reads the busy flag (BF) indicating that the system is now internally operating
on a previously received instruction. If BF is 1, the internal operation is in progress. The next instruction
will not be accepted until BF is reset to 0. Check the BF status before the next write operation. At the same
time, the value of the address counter in binary AAAAAAA is read out. This address counter is used by
both CG and DDRAM addresses, and its value is determined by the previous instruction. The address
contents are the same as for instructions set CGRAM address and set DDRAM address.
Table 7
Shift Function
S/C
R/L
Shifts the cursor position to the left. (AC is decremented by one.)
Shifts the cursor position to the right. (AC is incremented by one.)
Shifts the entire display to the left. The cursor follows the display shift.
Shifts the entire display to the right. The cursor follows the display shift.
Table 8
Function Set
No. of
Display
Lines
5 8 dots
1/8
5 10 dots
1/11
5 8 dots
1/16
Note:
Character Font
Duty
Factor
Remarks
Cannot display two lines for 5 10 dot character font
Indicates dont care.
29
HD44780U
Cursor
5 8 dot
character font
5 10 dot
character font
Alternating display
Cursor display example
Blink display example
Figure 12 Cursor and Blinking

RS
Set DDRAM
address
Code

0
Higher
order bit
RS
Read busy flag
and address
Code
Lower
order bit

1
BF
Higher
order bit
30
Lower
order bit
HD44780U
Write Data to CG or DDRAM
Write data to CG or DDRAM writes 8-bit binary data DDDDDDDD to CG or DDRAM.
To write into CG or DDRAM is determined by the previous specification of the CGRAM or DDRAM
address setting. After a write, the address is automatically incremented or decremented by 1 according to
the entry mode. The entry mode also determines the display shift.
Read Data from CG or DDRAM
Read data from CG or DDRAM reads 8-bit binary data DDDDDDDD from CG or DDRAM.
The previous designation determines whether CG or DDRAM is to be read. Before entering this read
instruction, either CGRAM or DDRAM address set instruction must be executed. If not executed, the first
read data will be invalid. When serially executing read instructions, the next address data is normally read
from the second read. The address set instructions need not be executed just before this read instruction
when shifting the cursor by the cursor shift instruction (when reading out DDRAM). The operation of the
cursor shift instruction is the same as the set DDRAM address instruction.
After a read, the entry mode automatically increases or decreases the address by 1. However, display shift
is not executed regardless of the entry mode.
Note:
The address counter (AC) is automatically incremented or decremented by 1 after the write
instructions to CGRAM or DDRAM are executed. The RAM data selected by the AC cannot be
read out at this time even if read instructions are executed. Therefore, to correctly read data,
execute either the address set instruction or cursor shift instruction (only with DDRAM), then just
before reading the desired data, execute the read instruction from the second time the read
instruction is sent.
RS
Write data to
CG or DDRAM
Code

0
Higher
order bits
RS
Read data from
CG or DDRAM
Code
Lower
order bits

1
Higher
order bits
Lower
order bits
31
HD44780U
Interfacing the HD44780U
Interface to MPUs
Interfacing to an 8-bit MPU
See Figure 16 for an example of using a I/O port (for a single-chip microcomputer) as an interface
device.
In this example, P30 to P37 are connected to the data bus DB0 to DB7, and P75 to P77 are connected to
E, R/W, and RS, respectively.
RS
R/W
E
Internal
operation
Functioning
DB7
Data
Busy
Busy
Instruction
write
Busy flag
check
Busy flag
check
Not
busy
Data
Busy flag
check
Instruction
write
Figure 15 Example of Busy Flag Check Timing Sequence

H8/325
HD44780U
P30 to P37
P77
P76
P75
DB0 to DB7
E
RS
R/W
COM1 to
COM16
LCD
SEG1 to
SEG40
Figure 16 H8/325 Interface (Single-Chip Mode)
32
16
40
HD44780U
Interfacing to a 4-bit MPU
The HD44780U can be connected to the I/O port of a 4-bit MPU. If the I/O port has enough bits, 8-bit
data can be transferred. Otherwise, one data transfer must be made in two operations for 4-bit data. In
this case, the timing sequence becomes somewhat complex. (See Figure 17.)
See Figure 18 for an interface example to the HMCS4019R.
Note that two cycles are needed for the busy flag check as well as for the data transfer. The 4-bit
operation is selected by the program.
RS
R/W
E
Internal
operation
DB7
Functioning
IR7
IR3
Instruction
write
Busy AC3
Not
busy AC3
Busy flag
check
Busy flag
check
D7
D3
Instruction
write
Note: IR7 , IR3 are the 7th and 3rd bits of the instruction.
AC3 is the 3rd bit of the address counter.
Figure 17 Example of 4-Bit Data Transfer Timing Sequence

HMCS4019R
HD44780
D15
RS
D14
R/W
D13
R10 to R13
4
DB4 to DB7
COM1 to
COM16
16
LCD
SEG1 to
SEG40
40
Figure 18 Example of Interface to HMCS4019R
33
HD44780U
Interface to Liquid Crystal Display
Character Font and Number of Lines: The HD44780U can perform two types of displays, 5 8 dot
and
5 10 dot character fonts, each with a cursor.
Up to two lines are displayed for 5 8 dots and one line for 5 10 dots. Therefore, a total of
three types of common signals are available (Table 9).
The number of lines and font types can be selected by the program. (See Table 6, Instructions.)
Connection to HD44780 and Liquid Crystal Display: See Figure 19 for the connection examples.
Table 9
Common Signals
Number of Lines
Character Font
Number of Common Signals
Duty Factor
5 8 dots + cursor
1/8
5 10 dots + cursor
11
1/11
5 8 dots + cursor
16
1/16
HD44780
COM1
COM8
SEG1
SEG40
Example of a 5
8 dot, 8-character
1-line display (1/4 bias, 1/8 duty cycle)
HD44780
COM1
COM11
SEG1
SEG40
Example of a 5
10 dot, 8-character
Figure 19 Liquid Crystal Display and HD44780 Connections
34
HD44780U
Since five segment signal lines can display one digit, one HD44780U can display up to 8 digits for a 1-line
display and 16 digits for a 2-line display.
The examples in Figure 19 have unused common signal pins, which always output non-selection
waveforms. When the liquid crystal display panel has unused extra scanning lines, connect the extra
scanning lines to these common signal pins to avoid any undesirable effects due to crosstalk during the
floating state.
HD44780
COM1
COM8
COM9
COM16
SEG1
SEG40
Example of a 5
8 dot, 8-character
Figure 19 Liquid Crystal Display and HD44780 Connections (cont)
35
HD44780U
Connection of Changed Matrix Layout: In the preceding examples, the number of lines correspond to the
scanning lines. However, the following display examples (Figure 20) are made possible by altering the
matrix layout of the liquid crystal display panel. In either case, the only change is the layout. The display
characteristics and the number of liquid crystal display characters depend on the number of common
signals or on duty factor. Note that the display data RAM (DDRAM) addresses for 4 characters 2
lines and for 16 characters 1 line are the same as in Figure 19.
HD44780
COM1
COM8
SEG1
SEG40
COM9
COM16
5 8 dot, 16-character 1-line display
(1/5 bias, 1/16 duty cycle)
Figure 20 Changed Matrix Layout Displays
36
HD44780U
Power Supply for Liquid Crystal Display Drive
Various voltage levels must be applied to pins V1 to V5 of the HD44780U to obtain the liquid crystal
display drive waveforms. The voltages must be changed according to the duty factor (Table 10).
VLCD is the peak value for the liquid crystal display drive waveforms, and resistance dividing provides
voltages V1 to V5 (Figure 21).
Table 10
Duty Factor and Power Supply for Liquid Crystal Display Drive
Duty Factor
1/8, 1/11
1/16
Bias
Power Supply
1/4
1/5
V1
VCC1/4 VLCD
VCC1/5 VLCD
V2
VCC1/2 VLCD
VCC2/5 VLCD
V3
VCC1/2 VLCD
VCC3/5 VLCD
V4
VCC3/4 VLCD
VCC4/5 VLCD
V5
VCCVLCD
VCCVLCD
VCC (+5 V)
VCC (+5 V)
VCC
V1
VCC
R
V2
V3
V4
V5
V1
VLCD
V2
V3
V4
V5
VR
R
R
VLCD
R
R
VR
5 V
1/4 bias
(1/8, 1/11 duty cycle)
5 V
1/5 bias
(1/16, duty cycle)
Figure 21 Drive Voltage Supply Example
37
HD44780U
Relationship between Oscillation Frequency and Liquid Crystal Display Frame
Frequency
The liquid crystal display frame frequencies of Figure 22 apply only when the oscillation frequency is 270
kHz (one clock pulse of 3.7 s).
1/8 duty cycle
COM1
VCC
400 clocks
1
11
V1
V2 (V3)
V4
V5
1 frame
1 frame = 3.7 s
400
Frame frequency =
8 = 11850 s = 11.9 ms
1
= 84.3 Hz
11.9 ms
1/11 duty cycle

COM1
VCC
400 clocks
1
V1
V2 (V3)
V4
V5
1 frame
1 frame = 3.7 s
400
Frame frequency =
11 = 16300 s = 16.3 ms
1
= 61.4 Hz
16.3 ms
1/16 duty cycle

COM1
VCC
200 clocks
1
16
V1
V2
V3
V4
V5
1 frame
1 frame = 3.7 s
200
Frame frequency =
16 = 11850 s = 11.9 ms
1
= 84.3 Hz
11.9 ms
Figure 22 Frame Frequency
38
HD44780U
Instruction and Display Correspondence
8-bit operation, 8-digit 1-line display with internal reset
Refer to Table 11 for an example of an 8-digit 1-line display in 8-bit operation. The HD44780U
functions must be set by the function set instruction prior to the display. Since the display data RAM
can store data for 80 characters, as explained before, the RAM can be used for displays such as for
advertising when combined with the display shift operation.
Since the display shift operation changes only the display position with DDRAM contents unchanged,
the first display data entered into DDRAM can be output when the return home operation is performed.
4-bit operation, 8-digit 1-line display with internal reset
The program must set all functions prior to the 4-bit operation (Table 12). When the power is turned on,
8-bit operation is automatically selected and the first write is performed as an 8-bit operation. Since
DB0 to DB3 are not connected, a rewrite is then required. However, since one operation is completed in
two accesses for 4-bit operation, a rewrite is needed to set the functions (see Table 12). Thus, DB4 to
DB7 of the function set instruction is written twice.
8-bit operation, 8-digit 2-line display
For a 2-line display, the cursor automatically moves from the first to the second line after the 40th digit
of the first line has been written. Thus, if there are only 8 characters in the first line, the DDRAM
address must be again set after the 8th character is completed. (See Table 13.) Note that the display shift
operation is performed for the first and second lines. In the example of Table 13, the display shift is
performed when the cursor is on the second line. However, if the shift operation is performed when the
cursor is on the first line, both the first and second lines move together. If the shift is repeated, the
display of the second line will not move to the first line. The same display will only shift within its own
line for the number of times the shift is repeated.
Note:
When using the internal reset, the electrical characteristics in the Power Supply Conditions Using
Internal Reset Circuit table must be satisfied. If not, the HD44780U must be initialized by
instructions. See the section, Initializing by Instruction.
39
HD44780U
Table 11
8-Bit Operation, 8-Digit 1-Line Display Example with Internal Reset

Instruction
Step
No.
RS
Power supply on (the HD44780U is initialized by the internal

reset circuit)
Initialized. No display.
Function set
0
0
0
Sets to 8-bit operation and

selects 1-line display and 5
8 dot character font. (Number
of display lines and character
fonts cannot be changed after
step #2.)
R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Display
Display on/off control

0
0
0
0
Entry mode set

0
0
0
Write data to CGRAM/DDRAM

1
0
0
1
0
0

1
0
0
1
0
0
8
9
10
40

1
0
0
1
0
0
Entry mode set

0
0
0

1
0
0
0
1
0
Turns on display and cursor.

Entire display is in space mode
because of initialization.
Sets mode to increment the

address by one and to shift the
cursor to the right at the time of
write to the DD/CGRAM.
Display is not shifted.
Writes H. DDRAM has already

been selected by initialization
when the power was turned on.
The cursor is incremented by
one and shifted to the right.
H_
Writes I.
HI_
Operation
HITACHI_
HITACHI_
ITACHI _
Writes I.
Sets mode to shift display at

the time of write.
Writes a space.
HD44780U
Table 11
8-Bit Operation, 8-Digit 1-Line Display Example with Internal Reset (cont)
Instruction
Step
No.
RS
11

1
0
0
1
0
0
12
13
14
15
16
17
18
19
TACHI M_
Cursor or display shift

0
0
0
0
MICROKO_

0
0
0
0
MICROK_
O

1
0
0
1
0
0

0
0
0
0

0
0
0
0

1
0
0
1
0
0
MICROKO_
Writes O.
Shifts only the cursor position

to the left.
Shifts only the cursor position
to the left.
ICROCO_
Writes C over K.
The display moves to the left.
MICROCO_
Shifts the display and cursor

position to the right.
MICROCO_
Shifts the display and cursor

position to the right.
ICROCOM_
Writes M.
Return home
0
0
0
Writes M.

1
0
0
1
0
0
20
21
Operation
H_
ITACHI
Returns both display and

cursor to the original position
(address 0).
41
HD44780U
Table 12

Instruction
Step
No.
RS

reset circuit)
Function set
0
0
0
Sets to 4-bit operation.

In this case, operation is
handled as 8 bits by initialization, and only this instruction
completes with one write.
Function set
0
0
0
0
0
0
0
0
1
*
0
*

0
0
0
0
0
0
1
1
0
1
0
0
Entry mode set

0
0
0
0
0
0
0
1
0
0
Note:
42
R/W DB7 DB6 DB5 DB4
0
1

1
0
0
1
0
0
1
0
1
0
0
0
Display
Operation
Sets 4-bit operation and

8 dot character font. 4-bit
operation starts from this step
and resetting is necessary.
(Number of display lines and
character fonts cannot be
changed after step #3.)
_
H_
The control is the same as for 8-bit operation beyond step #6.

Entire display is in space mode
Sets mode to increment the
address by one and to shift the
Writes H.
one and shifts to the right.
HD44780U
Table 13
Instruction
Step
No.
RS

reset circuit)
Function set
0
0
0
Sets to 8-bit operation and

8 dot character font.

0
0
0
0

1
0
0
1
0
0
Operation

All display is in space mode
Entry mode set

0
Sets mode to increment

the
address by one and
Writes H. DDRAM has already
been selected by initialization
when the power was turned on.
one and shifted to the right.
H_

1
0
0
1
0
0
Set DDRAM address

0
0
1
1
HITACHI_
HITACHI
_
Writes I.
Sets DDRAM address so that

the cursor is positioned at the
head of the second line.
43
HD44780U
Table 13
8-Bit Operation, 8-Digit 2-Line Display Example with Internal Reset (cont)
Instruction
Step
No.
RS

1
0
0
1
0
0
10
11
12
13
44
HITACHI
M_
HITACHI
MICROCO_
Entry mode set

0
0
0
HITACHI
MICROCO_

1
0
0
1
0
0
ITACHI
ICROCOM_
Writes O.
Sets mode to shift display at

the time of write.
Writes M. Display is shifted to
the left. The first and second
lines both shift at the same
time.
Return home
0
0
0
Writes M.

1
0
0
1
0
0
14
15
Operation
H_ ITACHI
MICROCOM
Returns both display and

cursor to the original position
(address 0).
HD44780U
Initializing by Instruction
If the power supply conditions for correctly operating the internal reset circuit are not met, initialization by
instructions becomes necessary.
Refer to Figures 23 and 24 for the procedures on 8-bit and 4-bit initializations, respectively.
Power on
Wait for more than 15 ms

after VCC rises to 4.5 V

RS R/WDB7 DB6 DB5 DB4 DB3DB2 DB1

DB0
0 0 0
0 1 1
* *
*
*
BF cannot be checked before this instruction.

Function set (Interface is 8 bits long.)
Wait for more than 4.1 ms
RS R/WDB7 DB6 DB5 DB4 DB3 DB2 DB1

DB0
0 0 0
0 1 1
* *
*
*

Wait for more than 100 s

DB0
0 0 0
0 1 1
* *
*
*

BF can be checked after the following instructions.

When BF is not checked, the waiting time between
instructions is longer than the execution instuction
time. (See Table 6.)
DB0
0 0 0
0 1 1 N F
* *
Function set (Interface is 8 bits long. Specify the

number of display lines and character font.)
The number of display lines and character font
cannot be changed after this point.
0
0
0
0
0
0
0
0
0
0
0
0
Display off
I/D
Display clear
Entry mode set
Initialization ends
Figure 23 8-Bit Interface
45
HD44780U
Power on

RS R/W DB7 DB6 DB5

DB4
0 0 0 0 1 1

Wait for more than 4.1 ms
RS R/W DB7 DB6 DB5

DB4
0 0 0 0 1 1

Wait for more than 100 s
RS R/W DB7 DB6 DB5

DB4
0 0 0 0 1 1
RS R/W DB7 DB6 DB5

DB4
0 0 0 0 1 0
0
0
0
0
0
0
0
0
0
N
0
1
0
F
0
0
1
*
0
0
0
*
0
0
0
0
0
0
0
0
0
0
0
0
0
1
0
0
0
0
0
0
0
1
0
I/D
0
S

BF can be checked after the following instructions.

When BF is not checked, the waiting time between
instructions is longer than the execution instuction
time. (See Table 6.)
Function set (Set interface to be 4 bits long.)
Interface is 8 bits in length.
Function set (Interface is 4 bits long. Specify the
number of display lines and character font.)
The number of display lines and character font
cannot be changed after this point.
Display off
Display clear
Initialization ends
Entry mode set
Figure 24 4-Bit Interface
46
HD44780U
Absolute Maximum Ratings*
Item
Symbol
Value
Unit
Notes
Power supply voltage (1)
VCCGND
0.3 to +7.0
Power supply voltage (2)
VCCV5
0.3 to +13.0
1, 2
Input voltage
Vt
0.3 to VCC +0.3
Operating temperature
Topr
30 to +75
Storage temperature
Tstg
55 to +125
Note:
If the LSI is used above these absolute maximum ratings, it may become permanently damaged.
Using the LSI within the following electrical characteristic limits is strongly recommended for
normal operation. If these electrical characteristic conditions are also exceeded, the LSI will
malfunction and cause poor reliability.
47
HD44780U
DC Characteristics (VCC = 2.7 to 4.5 V, Ta = 30 to +75C*3)
Item
Symbol
Min
Typ
Max
Unit
Input high voltage (1)

(except OSC1)
VIH1
0.7V CC
VCC
Input low voltage (1)

(except OSC1)
VIL1
0.3
0.55

(OSC1)
VIH2
0.7V CC
VCC
15

(OSC1)
VIL2
0.2V CC
15
Output high voltage (1) VOH1

(DB0DB7)
0.75V CC
I OH = 0.1 mA
Output low voltage (1)

(DB0DB7)
0.2V CC
I OL = 0.1 mA

(except DB0DB7)
0.8V CC
I OH = 0.04 mA

(except DB0DB7)
VOL2
0.2V CC
I OL = 0.04 mA
Driver on resistance
(COM)
RCOM
20
Id = 0.05 mA,
VLCD = 4 V
13
(SEG)
RSEG
30
Id = 0.05 mA,
VLCD = 4 V
13
Input leakage current
I LI
VIN = 0 to VCC
Pull-up MOS current

(DB0DB7, RS, R/W)
I p
10
50
120
VCC = 3 V
Power supply current
I CC
150
300
Rf oscillation,
external clock
VCC = 3 V,
f OSC = 270 kHz
LCD voltage
VLCD1
3.0
11.0
VCCV5, 1/5 bias 16
VLCD2
3.0
11.0
VCCV5, 1/4 bias 16
Note:
48
VOL1
Test Condition Notes*
Refer to the Electrical Characteristics Notes section following these tables.
10, 14
HD44780U
AC Characteristics (VCC = 2.7 to 4.5 V, Ta = 30 to +75C*3)
Clock Characteristics
Item
Symbol Min
Typ
Max
Unit
External External clock frequency

clock
External clock duty
operation
External clock rise time
f cp
125
250
350
kHz
Duty
45
50
55
t rcp
0.2
t fcp
0.2
190
270
350
kHz
External clock fall time
Rf
Clock oscillation frequency f OSC
oscillation
Note:
Test Condition Note*

11
Rf = 75 k,
VCC = 3 V
12
Bus Timing Characteristics

Write Operation
Item
Symbol
Min
Typ
Max
Unit
Test Condition
Enable cycle time
t cycE
1000
ns
Figure 25
Enable pulse width (high level)
PWEH
450
Enable rise/fall time
t Er, t Ef
25
Address set-up time (RS, R/W to E) t AS
60
Address hold time
t AH
20
Data set-up time
t DSW
195
Data hold time
tH
10
Item
Symbol
Min
Typ
Max
Unit
Test Condition
Enable cycle time
t cycE
1000
ns
Figure 26
PWEH
450
t Er, t Ef
25
60
Address hold time
t AH
20
Data delay time
t DDR
360
Data hold time
t DHR
Read Operation
49
HD44780U
Interface Timing Characteristics with External Driver
Item
Symbol
Min
Typ
Max
Unit
Test Condition
High level
t CWH
800
ns
Figure 27
Low level
t CWL
800
Clock set-up time
t CSU
500
Data set-up time
t SU
300
Data hold time
t DH
300
M delay time
t DM
1000
1000
Clock rise/fall time
t ct
200
Clock pulse width
Power Supply Conditions Using Internal Reset Circuit

Item
Symbol
Min
Typ
Max
Unit
Test Condition
Power supply rise time
t rCC
0.1
10
ms
Figure 28
Power supply off time
t OFF
50
HD44780U
DC Characteristics (VCC = 4.5 to 5.5 V, Ta = 30 to +75C*3)
Item
Symbol
Min
Typ
Max
Unit

(except OSC1)
VIH1
2.2
VCC

(except OSC1)
VIL1
0.3
0.6

(OSC1)
VIH2
VCC1.0
VCC
15

(OSC1)
VIL2
1.0
15

(DB0DB7)
2.4
I OH = 0.205 mA

(DB0DB7)
0.4
I OL = 1.2 mA

(except DB0DB7)
0.9 VCC
I OH = 0.04 mA

(except DB0DB7)
VOL2
0.1 VCC
I OL = 0.04 mA
(COM)
RCOM
20
Id = 0.05 mA,
VLCD = 4 V
13
(SEG)
RSEG
30
Id = 0.05 mA,
VLCD = 4 V
13
Input leakage current
I LI
VIN = 0 to VCC
Pull-up MOS current

(DB0DB7, RS, R/W)
I p
50
125
250
VCC = 5 V
Power supply current
I CC
350
600
Rf oscillation,
external clock
VCC = 5 V,
f OSC = 270 kHz
10, 14
LCD voltage
VLCD1
3.0
11.0
VCCV5, 1/5 bias
16
VLCD2
3.0
11.0
VCCV5, 1/4 bias
16
Note:
VOL1
Test Condition
Notes*
51
HD44780U
AC Characteristics (VCC = 4.5 to 5.5 V, Ta = 30 to +75C*3)
Clock Characteristics
Item
Symbol Min
Typ
Max
Unit
External External clock frequency

clock
External clock duty
operation
External clock rise time
f cp
125
250
350
kHz
11
Duty
45
50
55
11
t rcp
0.2
11
t fcp
0.2
11
190
270
350
kHz
External clock fall time
Rf
Clock oscillation frequency f OSC
oscillation
Note:
Test Condition Notes*
Rf = 91 k
VCC = 5.0 V
12
Bus Timing Characteristics

Write Operation
Item
Symbol
Min
Typ
Max
Unit
Test Condition
Enable cycle time
t cycE
500
ns
Figure 25
PWEH
230
t Er, t Ef
20
40
Address hold time
t AH
10
Data set-up time
t DSW
80
Data hold time
tH
10
Item
Symbol
Min
Typ
Max
Unit
Test Condition
Enable cycle time
t cycE
500
ns
Figure 26
PWEH
230
t Er, t Ef
20
40
Address hold time
t AH
10
Data delay time
t DDR
160
Data hold time
t DHR
Read Operation
52
HD44780U
Interface Timing Characteristics with External Driver
Item
Symbol
Min
Typ
Max
Unit
Test Condition
High level
t CWH
800
ns
Figure 27
Low level
t CWL
800
Clock set-up time
t CSU
500
Data set-up time
t SU
300
Data hold time
t DH
300
M delay time
t DM
1000
1000
Clock rise/fall time
t ct
100
Clock pulse width
Power Supply Conditions Using Internal Reset Circuit

Item
Symbol
Min
Typ
Max
Unit
Test Condition
Power supply rise time
t rCC
0.1
10
ms
Figure 28
Power supply off time
t OFF
53
HD44780U
Electrical Characteristics Notes
1. All voltage values are referred to GND = 0 V.
VCC
B
V1
A = VCC V5
B = VCC V1
A 1.5 V
B 0.25 A
A
V5
The conditions of V1 and V5 voltages are for proper

operation of the LSI and not for the LCD output level.
The LCD drive voltage condition for the LCD output
level is specified as LCD voltage VLCD.
2. VCC V1 V2 V3 V4 V5 must be maintained.

3. For die products, specified at 75C.
4. For die products, specified by the die shipment specification.
5. The following four circuits are I/O pin configurations except for liquid crystal display output.
Input pin
Pin: E (MOS without pull-up)
Output pin
Pins: CL1, CL2, M, D
Pins: RS, R/W (MOS with pull-up)

VCC
PMOS
VCC
PMOS
VCC
PMOS
PMOS
NMOS
NMOS
(pull up MOS)
NMOS
I/O Pin
Pins: DB0 DB7
(MOS with pull-up)
VCC
(pull-up MOS)
VCC
(input circuit)
PMOS
PMOS
Input enable
NMOS
VCC
NMOS
PMOS
Output enable
Data
NMOS
(output circuit)
(tristate)
54
HD44780U
6. Applies to input pins and I/O pins, excluding the OSC1 pin.
7. Applies to I/O pins.
8. Applies to output pins.
9. Current flowing through pullup MOSs, excluding output drive MOSs.
10. Input/output current is excluded. When input is at an intermediate level with CMOS, the excessive
current flows through the input circuit to the power supply. To avoid this from happening, the input
level must be fixed high or low.
11. Applies only to external clock operation.
Th
Oscillator
Tl
OSC1
Open
0.7 VCC
0.5 VCC
0.3 VCC
OSC2
t rcp
Duty =
Th
Th + Tl
t fcp
100%
12. Applies only to the internal oscillator operation using oscillation resistor Rf.
OSC1
Rf
OSC2
R f : 75 k 2% (when VCC = 3 V)
R f : 91 k 2% (when VCC = 5 V)
Since the oscillation frequency varies depending on the OSC1 and
OSC2 pin capacitance, the wiring length to these pins should be minimized.
VCC = 5 V
500
400
300
(270)
max.
200
typ.
min.
50
(91)100
R f (k )
150
f OSC (kHz)
f OSC (kHz)
400
100
VCC = 3 V
500
300
(270)
max.
200
100
typ.
50
(75)
100
min.
150
R f (k )
55
HD44780U
13. RCOM is the resistance between the power supply pins (VCC, V1, V4, V5) and each common signal pin
(COM1 to COM16).
RSEG is the resistance between the power supply pins (VCC, V2, V3, V5) and each segment signal pin
(SEG1 to SEG40).
14. The following graphs show the relationship between operation frequency and current consumption.
VCC = 3 V
1.8
1.6
1.6
1.4
1.4
1.2
1.2
1.0
max.
0.8
typ.
0.6
ICC (mA)
ICC (mA)
VCC = 5 V
1.8
1.0
0.8
0.6
0.4
0.4
0.2
0.2
0.0
0.0
0
100
200
300
fOSC or fcp (kHz)
400
500
max.
typ.
100
200
300
400
500
fOSC or fcp (kHz)
15. Applies to the OSC1 pin.

16. Each COM and SEG output voltage is within 0.15 V of the LCD voltage (V CC, V1, V2, V3, V4, V5)
when there is no load.
56
HD44780U
Load Circuits
Data Bus DB0 to DB7
VCC = 5 V
For VCC = 4.5 to 5.5 V
For VCC = 2.7 to 4.5 V

3.9 k
Test
point
90 pF
11 k
Test
point
IS2074 H
diodes
50 pF
External Driver Control Signals: CL1, CL2, D, M

Test
point
30 pF
57
HD44780U
Timing Characteristics
VIH1
VIL1
RS
VIH1
VIL1
tAS
R/W
tAH
VIL1
VIL1
tAH
PWEH
tEf
VIH1
VIL1
VIH1
VIL1
tEr
tDSW
tH
VIH1
VIL1
DB0 to DB7
VIL1
VIH1
VIL1
Valid data
tcycE
Figure 25 Write Operation

VIH1
VIL1
RS
VIH1
VIL1
tAS
tAH
VIH1
R/W
VIH1
tAH
PWEH
tEf
VIH1
VIL1
VIH1
VIL1
VIL1
tEr
tDDR
DB0 to DB7
tDHR
VOH1
VOL1 *
Valid data
tcycE
Note:
* VOL1 is assumed to be 0.8 V at 2 MHz operation.
Figure 26 Read Operation
58
VOH1
* VOL1
HD44780U
tct
VOH2
CL1
VOH2
tCWH
tCSU
CL2
VOL2
tCWH
VOH2
VOL2
tCSU
tCWL
tct
VOH2
VOL2
D
tDH
tSU
VOH2
t DM
Figure 27 Interface Timing with External Driver
VCC
2.7 V/4.5 V*2
0.2 V
0.2 V
0.2 V
tOFF*1
trcc
0.1 ms
trcc 10 ms
tOFF
1 ms
Notes: 1. tOFF compensates for the power oscillation period caused by momentary power supply
oscillations.
2. Specified at 4.5 V for 5-V operation, and at 2.7 V for 3-V operation.
3. For if 4.5 V is not reached during 5-V operation, the internal reset circuit will not operate
normally.
In this case, the LSI must be initialized by software. (Refer to the Initializing by
Instruction section.)
Figure 28 Internal Power Supply Reset
59
HD44780U
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachis or any third partys patent,
copyright, trademark, or other intellectual property rights for information contained in this document.
Hitachi bears no responsibility for problems that may arise with third partys rights, including
intellectual property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have
received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,
contact Hitachis sales office before using the product in an application that demands especially high
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,
traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly
for maximum rating, operating supply voltage range, heat radiation characteristics, installation
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable
failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other
consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without
written approval from Hitachi.
7. Contact Hitachis sales office for any questions regarding this document or Hitachi semiconductor
products.
Hitachi, Ltd.
Semiconductor & Integrated Circuits.

Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109
URL
NorthAmerica
: http:semiconductor.hitachi.com/
Europe
: http://www.hitachi-eu.com/hel/ecg
Asia (Singapore) : http://www.has.hitachi.com.sg/grp3/sicd/index.htm
Asia (Taiwan)
: http://www.hitachi.com.tw/E/Product/SICD_Frame.htm
Asia (HongKong) : http://www.hitachi.com.hk/eng/bo/grp3/index.htm
Japan
: http://www.hitachi.co.jp/Sicd/indx.htm
For further information write to:
Hitachi Semiconductor
(America) Inc.
179 East Tasman Drive,
San Jose,CA 95134
Tel: <1> (408) 433-1990
Fax: <1>(408) 433-0223
Hitachi Europe GmbH

Electronic components Group
Dornacher Strae 3
D-85622 Feldkirchen, Munich
Germany
Tel: <49> (89) 9 9180-0
Fax: <49> (89) 9 29 30 00
Hitachi Europe Ltd.
Electronic Components Group.
Whitebrook Park
Lower Cookham Road
Maidenhead
Berkshire SL6 8YA, United Kingdom
Tel: <44> (1628) 585000
Fax: <44> (1628) 778322
Hitachi Asia Pte. Ltd.

16 Collyer Quay #20-00
Hitachi Tower
Singapore 049318
Tel: 535-2100
Fax: 535-1533
Hitachi Asia Ltd.
Taipei Branch Office
3F, Hung Kuo Building. No.167,
Tun-Hwa North Road, Taipei (105)
Tel: <886> (2) 2718-3666
Fax: <886> (2) 2718-8180
Hitachi Asia (Hong Kong) Ltd.

Group III (Electronic Components)
7/F., North Tower, World Finance Centre,
Harbour City, Canton Road, Tsim Sha Tsui,
Kowloon, Hong Kong
Tel: <852> (2) 735 9218
Fax: <852> (2) 730 0281
Telex: 40815 HITEC HX
Copyright Hitachi, Ltd., 1998. All rights reserved. Printed in Japan.
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Monitor and Control OfGreenhouse Environment GreenBee

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Biju Patnaik University of Technology

Monitor and Control of Greenhouse

Applied Electronics and Instrumentation Engineering

Chinmayananda Das (Regd No.0501229084)

Prof. Subhendu Behera

DEPARTMENT OF APPLIED ELECTRONICS AND INSTRUMENTATION ENGINEERING

DHANESWAR RATH INSTITUTE OF ENGINEERING & MANAGMENT STUDIES

(Affiliated To Biju Patnaik University of Technology)

Dept. of Applied Electronics & Instrumentation

Chinmayananda Das (Regd No.0501229084)

HOD Dept. of AE&I:

MONITOR AND CONTROL OF GREENHOUSE ENVIRONMENT

MONITOR AND CONTROL OF GREENHOUSE ENVIRONMENT

MONITOR AND CONTROL OF GREENHOUSE ENVIRONMENT

4.1.1.2 FUNCTIONAL DESCRIPTION

4.1.2 LIGHT SENSOR

4.1.2.2 FUNCTIONAL DESCRIPTION

4.1.3 HUMIDITY SENSOR

4.1.4 TEMPERATURE SENSOR

4.4.5 BLOCK DIAGRAM--------------------------------------------------------

MONITOR AND CONTROL OF GREENHOUSE ENVIRONMENT

4.4.10 TIMERS AND COUNTERS..41

MONITOR AND CONTROL OF GREENHOUSE ENVIRONMENT

8.1 SENSOR READINGS

MONITOR AND CONTROL OF GREENHOUSE ENVIRONMENT

Figure 2.1 Block diagram of the system..6

Figure 3.2 Block diagram of photosynthesis..12

Figure 3.2 Transpiration.14

Figure 4.1 Soil moisture sensor circuit..17

Figure 4.2 Light Dependent Resistor.18

Figure 4.2.1 Structure of a Light Dependent Resistor...18

Figure 4.3 Light sensor circuit...19

Figure 4.4 HIH-4000-001 Humidity sensor...20

Figure 4.5 Humidity sensor circuit.21

Figure 4.6 LM35 temperature sensor.22

Figure 4.7 Temperature sensor circuit...23

Figure 4.8 Getting data from the analog world..24

Figure 4.9 Block diagram of ADC 080925

Figure 4.10 Flowchart explaining the Successive Approximation method...26

Figure 4.11 Pin diagram of ADC 0809..26

Figure 4.12 ADC 0809 pin details for the system..28

Figure 4.13 Timing diagram of ADC 080929

Figure 4.14 Clock circuitry for the ADC...30

Figure 4.15 The effect of using a Schmitt trigger instead of a comparator30

Figure 4.16 Pin diagram of AT89S5233

Figure 4.17 Block diagram of the microcontroller.34

Figure 4.18 Power-on reset circuit.36

MONITOR AND CONTROL OF GREENHOUSE ENVIRONMENT

Figure 4.19 Oscillator clock circuit38

Figure 4.20 Internal memory block40

Figure 4.21 Microcontroller Pin Details.43

Figure 4.22 Address locations for a 2x16 line LCD..44

Figure 4.23 Pin diagram of 2x16 line LCD46

Figure 4.24 Electrical symbol of a buzzer..46

Figure 4.25 Buzzer circuitry..47

Figure 4.26 Sugar Cube Relay...48

Figure 4.27 Circuit symbols of relays49

Figure 4.28 Relay circuitry50

Figure 4.29 +5V Power supply circuit...51

Figure 4.30 +12V Power supply circuit.51

Figure 5.1 Drip irrigation system...54

Figure 6.1 Window for choosing the target device60