You are on page 1of 18

Freescale Semiconductor

Technical Data

Document Number: MC33385


Rev. 6.0, 11/2006

Quad Low-side Driver


33385
LOW-SIDE DRIVER

Features
RDSON of 250m per Output at 25C
Supplied from the main 5V VCC
Input CMOS Compatible
Diagnostic through SPI
Nominal Current of 2A per Output
Current Limitation at 3A with Automatic Turn Off
Output Internally Clamped at 50V typ for Inductive Load Drive
Junction to Case Thermal Resistance of 4.4C/W
Individual Output over Temperature Shutdown
Pb-Free Packaging Designated by Suffix Code VW

DH SUFFIX
VW SUFFIX (PB-FREE)
98ASH70702A
20-PIN HSOP

ORDERING INFORMATION
Device
MC33385DH/R2
MC33385VW/R2

VPWR

33385

Voltage
Regulator
VCC

MCU

NCS
CLK
SDI
SDO
NRE
NON1
NON2
NON3
NON4

OUT1
OUT2
OUT3
OUT4
GND1-4

Figure 1. MC33385 Simplified Application Diagram

There are no disclaimers required on the Final publication of a data sheet.


Freescale Semiconductor, Inc., 2007. All rights reserved.

Temperature
Range (TA)

Package

-40C to 125C

20 HSOP

ARCHIVE INFORMATION

ARCHIVE INFORMATION

The MC33385 is a Quad Low-side Driver fully protected switch. This


device is a general purpose Low-side Driver but has been especially
designed to operate in engine management applications as injector
driver or automotive gear box. It is interfaced directly with a
microcontroller for parallel control of the load and the individual output
diagnostic is done through a SPI. The diagnostic logic recognizes 4
failure types at each output stage: overcurrent, short to GND, open
load, and over-temperature.

BLOCK DIAGRAM

BLOCK DIAGRAM

VCC

Charge Pump

TRIGGER

NON1
NON2

OUT1
OUT2

S
URES
RES

NON3

dv/dt control

DRIVER
R

NON4

OUT4
RES
URES

Over-temp. detection

ON1

FR Reset
IRES

VCC

I-SCB filter
t-ISCB
ON1

SDI
VCC

I-OL filter
t-IOL

CLK

NON1
VCC
Shift
Register

NCS

Failure
Register
(FR)

SCG filter
t-SCG
URES

RES

Under Voltage
Reset

Reset

Vref

OSC

IRES

SDO

GND

Oscillator

NRES

Figure 2. 33385 Simplified Internal Block Diagram

33385

Analog Integrated Circuit Device Data


Freescale Semiconductor

ARCHIVE INFORMATION

ARCHIVE INFORMATION

OUT3

PIN CONNECTIONS

PIN CONNECTIONS

21

GND2 1

20 GND1

OUT2 2

19 OUT1
18 N.C

N.C 3

17 NON1

NON2 4
SDI 5

16 SDO

CLK 6

15 NRES

NCS 7

14 VCC

NON4 8

13 NON3

OUT4 9

12 OUT3

GND4 10

21

ARCHIVE INFORMATION

ARCHIVE INFORMATION

Heat sink

11 GND3

Figure 3. 33385 Pin Connections


Table 1. 33385 Pin Definitions
Pin Number

Pin Name

Definition

GND2

Ground 2

OUT2

Output Channel 2
NC

3
4

NON2

Input Control Signal for Channel 2

SDI

Serial Data Input

CLK

Clock Line for Serial Interface

NCS

Chip Select for Serial Interface

NON4

Input Control Signal for Channel 4

OUT4

Output Channel 4

10

GND4

Ground 4

11

GND3

Ground 3

12

OUT3

Output Channel 3

13

NON3

Input Control Signal for Channel 3

14

Vcc

5V Power Supply

15

NRES

Reset Input

16

SDO

Data Output of Serial Interface

17

NON1

Input Control Signal Channel 1


NC

18
19

OUT1

Output Channel 1

20

GND1

Ground 1

Case

Connected to the PCB Ground for Thermal Purposes

33385

Analog Integrated Circuit Device Data


Freescale Semiconductor

ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS

ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 2. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Ratings

Symbol

Value

Unit

Vcc

7.0

Continuous Output Voltage (With no reverse current)

VOUT

45

Continuous Current

IOUTC

2.5

Peak Output Current

IOUTP

ISCBMAX

Clamped Energy at the Switching OFF (See Figure 9)

WOFF

70

mJ for 1ms

Input Voltage (Inputs)

VIN

VCC + 0.3

Input Protection Diode Current

IIN

1.0

mA

Input Voltage (Outputs)

VO

VCC + 0.3

Input Protection Diode Current

IO

1.0

mA

TJ

150

RTHJC

4.5

ARCHIVE INFORMATION

Voltage Range

THERMAL RATINGS
Operating Junction Temperature
Thermal Resistance : Junction-case (One power stage in use)
Thermal Resistance : Junction-ambient (Device soldered on printed circuit board)

RTHJA

50

Peak Package Reflow Temperature During Reflow (1), (2)

TPPRT

Note 2

Notes
1. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
2. Freescales Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL),
Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e.
MC33xxxD enter 33xxx), and review parametrics.

33385

Analog Integrated Circuit Device Data


Freescale Semiconductor

ARCHIVE INFORMATION

ELECTRICAL RATINGS

ELECTRICAL CHARACTERISTICS
STATIC CHARACTERISTICS

STATIC CHARACTERISTICS
Table 3. Static Electrical Characteristics
Characteristics noted under conditions 7.0 V VSUP 18 V, - 40C TA 125C, GND = 0 V unless otherwise noted. Typical
values noted reflect the approximate parameter means at TA = 25C under nominal conditions unless otherwise noted.
Characteristic

Symbol

Min

VCC

Junction Temperature Continuous (Continuous)

TJ1

Junction Temperature Dynamical (Time limited)

Typ

Max

Unit

4.5

5.5

- 40

150

TJ2

185

IOUT

ISCBMAX

SUPPLY VOLTAGE
Supply Voltage Range

ARCHIVE INFORMATION

ARCHIVE INFORMATION

JUNCTION TEMPERATURE

OUTPUT CURRENT
Output Current Range
RESET BEHAVIOUR
Reset Changeable (at NRES-Pin)
Undervoltage Reset (Independent of NRES)

VCC

VCCRES

5.5

VCCRES

3.35

3.95

VCCPRO

1.5

4.0

TOFF

155

185

ICCSTB1
ICCSTB2

6.0

mA

7.0

mA

ICCOPM

17

mA

ICC

100

mA

50

mA

Active for VCC = 0V to VCCPRO


UNDERVOLTAGE PROTECTION
Protection active for VCC =0V to VCCPRO
OVER TEMPERATURE
Temperature Detection Threshold
SUPPLY CURRENT
Standby Current (without load) (NON1...NON4 = High Level)
5.15V VCC
5.5V VCC
Operating Mode (For 5.15V VCC) (Iout 1...4) = 2A
ICC During Reverse Output Current
(IOUT = - 5A on one output)
INPUTS (NONx, NCS, CLK, NRES, SDI)
Low Threshold

VINL

-0.3

0.2*VCC

High Threshold

VINH

0.7*VCC

VCC + 0.3

VHYST

0.85

Hysteresis

V
10

- 20

Input Current (VIN = VCC)

IIN

Input Current (VCC >VRES & 0V<VIN < 0.9*VCC)

IIN

- 100

High Output Level (ISDO = -2mA)

VSDOH

VCC - 0.4

Low Output Level (ISDO = 3.2mA)

VSDOL

Tristate Leakage Current (NCS = HIGH, VSDO = 0V to VCC)

ISDOL

- 10

Average Output Current

IOUTA

2.5

Output Peak Current

IOUTP

ISCBMAX

SERIAL DATA OUTPUT


V
0.4

10

OUTPUTS (OUT 1...4)

33385

Analog Integrated Circuit Device Data


Freescale Semiconductor

ELECTRICAL CHARACTERISTICS
STATIC CHARACTERISTICS

Table 3. Static Electrical Characteristics (continued)


Characteristics noted under conditions 7.0 V VSUP 18 V, - 40C TA 125C, GND = 0 V unless otherwise noted. Typical
values noted reflect the approximate parameter means at TA = 25C under nominal conditions unless otherwise noted.
Min

Typ

Max

Unit

Leakage Current 1 (NON = High, VOUT = 25V, VCC = 5V)

IOUTL

10

Leakage Current 2 (NON = High, VOUT = 16V, VCC = 1V)

IOUTL2

10

58

VCLP+1

Output Clamp Voltage (IOUT = 1A)

ARCHIVE INFORMATION

Symbol

VCLP

45

Matching Clamp Voltage (Between two outputs)

VCLPM

VCLP-1

Clamped Energy at the Switching OFF (See Figure 9)

WOFF

50

On Resistance (IOUT = 2A, TJ = 150C, NON = LOW)

RDSON

Output Low Voltage Limitation (IOUT = 150mA)


Output Capacitance (Guaranteed by design)

VOUTLIM

50

mJ for 1ms

65

COUT

500

220

mV

350

pF

OUTPUTS REVERSE DIODE


Reverse Output Current

IRD

2,5

IRDP

5.0

VRD1

1.0

1.7

VRD2

0.85

1.7

Short Current Limit

ISCB

3.0

VCC Undervoltage

VCCMIN

3.35

3.95

VREF

0.390xVCC

0.435xVCC

Open Load Threshold Current

IOL

10

50

mA

Pull-up Resistor

ROL

2.0

8.0

Temperature Detection Threshold

TOFF

155

185

Reverse Peak current

(1)

Reverse Voltage Drop


- IOUT = - 5A
- IOUT = - 2,5A
POWERSTAGE PROTECTION

DIAGNOSTIC
Short to GND Threshold Voltage for IOUT 2A

Notes

1.

For t 2ms. Max. reverse current is limited to - 10A (for all outputs together)

33385

Analog Integrated Circuit Device Data


Freescale Semiconductor

ARCHIVE INFORMATION

Characteristic

ELECTRICAL CHARACTERISTICS
DYNAMIC CHARACTERISTIC

DYNAMIC CHARACTERISTIC
Table 4. Dynamic Electrical Characteristics
Characteristics noted under conditions 7.0 V VSUP 18 V, - 40C TA 125C, GND = 0 V unless otherwise noted. Typical
values noted reflect the approximate parameter means at TA = 25C under nominal conditions unless otherwise noted.
Characteristic

Symbol

Min

fIN

0.0

OVRP1

2.0
3.5
1.75

Typ

Max

Unit

1000

Hz

3.0
6.0

5.0

V/s

10

V/s

3.0

4.0

V/s

40

2.5

5.0

1.0

3.0

4.7

7.5

100

3.0

12

INPUTS
Input Frequency (NON1 to NON4)
OUTPUTS TIMING

VOUT = 4V... 16V


VOUT = 16V... Vclp
Negative Output Voltage Ramp

OVRP2
(25%... 75%)

Internal Switch-on-Time Charge Pump

OVRN
tDCP

ARCHIVE INFORMATION

ARCHIVE INFORMATION

Positive Output Voltage Ramp (with inductive load)

(NON = LOW... VGATE = 0.9 * VBAT)


Turn ON Delay

tDON

1.0

(NON = 50%, VOUT = 0.9 * VBAT)


Turn OFF Delay
(NON = 50%, VOUT = 0.1 * VBAT)
(NON = 50%, VOUT = 4V)
Undervoltage Protection

tDOFFA
tDOFFB
tRPON

Max ON time after a output voltage ramp from


0V to 25V at VCC = 0V...VCCPRO
Matching Turn ON Delay

tMON

- 3.0

(NON = 50%, VOUT = 0.9 * VBAT)


Rise time Turn OFF

tROFF

8.5

(10% - 90% of VCLP)


DIAGNOSTIC
TSCG

140

250

tOL

140

250

Clock Frequency (50% duty cycle)

fCLK

3.0

MHz

Minimum Time CLK = HIGH

tCLH

100

ns

Minimum Time CLK = LOW

tCLL

100

ns

Short to GND Filter Time


Open Load Filter Time
SERIAL DIAGNOSTIC LINK : LOAD CAPACITOR AT SDI AND SDO = 100PF

Propagation Delay (CLF Data at SDO valid)

tPCLD

100

ns

NCS = LOW to Data at SDO Valid

tPCLD

100

ns

CLK Low Before NCS Low

tSCLCH

100

ns

CLK Change Low/High after NCS = Low

tHCLCL

100

ns

SDI Input Set up Time

tSCLD

20

ns

(Setup time CLK to NCS change High/Low)

(CLK change High/Low after SDI data valid)


SDI Input Hold Time (SDI data hold after CLK change High/Low)

tHCLD

CLK Low Before NCS High

tSCLCL

20
150

ns
ns

33385

Analog Integrated Circuit Device Data


Freescale Semiconductor

ELECTRICAL CHARACTERISTICS
DYNAMIC CHARACTERISTIC

Table 4. Dynamic Electrical Characteristics (continued)


Characteristics noted under conditions 7.0 V VSUP 18 V, - 40C TA 125C, GND = 0 V unless otherwise noted. Typical
values noted reflect the approximate parameter means at TA = 25C under nominal conditions unless otherwise noted.
Symbol

Min

CLK High After NCS High

tHCLCH

150

NCSLow/High to Output Data Flout

tPCHDZ

100

ns

Capacitance at SDI, SDO, CLk, CS

tPCLD

10

pF

NCS Filter time (Pulses tFNCS will be ignored)

tFNCS

40

ns

Max

Unit
ns

ARCHIVE INFORMATION

10

Typ

ARCHIVE INFORMATION

Characteristic

33385

Analog Integrated Circuit Device Data


Freescale Semiconductor

ELECTRICAL CHARACTERISTICS
TIMING DIAGRAMS

TIMING DIAGRAMS

NCS
CLK
SDO

FSL

LSB

SDI

D1

LSB

D2

D1

D3

D2

D4

D5

D3

D4

D6

D5

MSB

D6

MSB

NOTE : FR -RESET means Reset failure storage (internal signal)

ARCHIVE INFORMATION

ARCHIVE INFORMATION

FR-RESET

Figure 4. Timing Diagram to Read the Diagnostic Register

MSB

D7

LSB
D6

D5

D4

D3

D2

D1

D0

FSL

FAILURE INDICATOR BIT


Only valid during NCS = LOW to the first
Low to High CLK change
1 : failure stored
0 : no failure
STATUS CHANNEL 4
11 : no failure
01 : open circuit
10: short to battery or overtemperature
00 : short to gnd
STATUS CHANNEL 3
STATUS CHANNEL 2
STATUS CHANNEL 1

Figure 5. Diagnostic Failure Register Structure


.
NCS
tSCLCH

tHCLCH

tCLH

tCLL

tSCLCH

tHCLCH

CLK
tCSDV

SDO

tPCLD

tPCHDZ

FSL

D0
tCSDV

SDI

D7
tHCLD
D0

D1

D7

Figure 6. Serial Interface Timing

33385

Analog Integrated Circuit Device Data


Freescale Semiconductor

ELECTRICAL CHARACTERISTICS
TIMING DIAGRAMS

Failure detection time


for an SCG failure
off
on

NON

SCG-failure

VDRAIN

VDRAIN < VREF at off-state

t-SCG (filter-time)

ARCHIVE INFORMATION

Failure detection

Failure store

Figure 7. Diagram to Short-Circuit to GND Failure (SCG-Failure) Detection


Sporadic failure detection

Statical failure detection

Failure detection active


for an sporadic OL-failure

NON

Iload

off
on

I-OL

Iload > I-OL


Iload > IOL for t > tol

Diagnostic active
retrigger t filter

t < t-ol

retrigger filter

t-ol (filter-time)
tol
Sporadic failure-detection

Failure detection

Failure store

Figure 8. Diagram to Open Load Failure (OL-Failure) Detection

33385

10

Analog Integrated Circuit Device Data


Freescale Semiconductor

ARCHIVE INFORMATION

Filter time

ELECTRICAL CHARACTERISTICS
ELECTRICAL PERFORMANCE CURVES

350

- 40C

300
Energy (mJ)

250
200

25C

150
100

125C

50
0
3

3,5

Figure 9. Max Clamp- Energy Specification

ELECTRICAL PERFORMANCE CURVES

380
3
375
2,75

VCC=5,5V

370
365

2,25

VINL/VCC

ICCSTB (mA)

2,50
VCC=5,5V

2
1,75

VCC=4,5V

355
350

VCC=5,15V

1,50

360

345
1,25
1
-50

340
-50
-25

0
25
50
75
T, TEMPERATURE (C)

100

12,50

624

12,00

623

11,50

622

11,00

100

125

VinH/Vcc

621

10,50
10,00
9,50

8,50
-50

0
25
50
75
T, TEMPERATURE (C)

Figure 12. Low Threshold Input Voltage versus


Temperature

Figure 10. Standby Current versus Temperature

9,00

-25

125

VCC=4,5V ou 5,5V

620
619
618

VCC=5,15V
All outputs=2A

-25

0
25
50
75
T, TEMPERATURE (C)

617
100

125

616
-50

-25

0
25
50
75
T, TEMPERATURE (C)

100

125

Figure 11. Operating Mode Current versus Temperature


Figure 13. High Threshold Input Voltage versus
Temperature

33385

Analog Integrated Circuit Device Data


Freescale Semiconductor

11

ARCHIVE INFORMATION

1,5
1
2
2,5
Pulse-Duration (ms)

0,5

ICCOPM (mA)

ARCHIVE INFORMATION

ELECTRICAL CHARACTERISTICS
ELECTRICAL PERFORMANCE CURVES

55,00

3,78

54,50

3,77

54,00

3,76

IOUT1=1A

52,50

3,74
3,73

52,00

3,72

51,50

3,71
-25

0
25
50
75
T, TEMPERATURE (C)

100

3,70
-50

125

Figure 14. Output Clamp Voltage versus Temperature

-25

0
25
50
75
T, TEMPERATURE (C)

100

125

Figure 17. Vcc Undervoltage versus Temperature

400

4,60
VCC=4,5V
IOUT1=3A

375

4,50

350

4,40

325

4,30

300

4,20

ISCB (A)

RDSON (m)

3,75

275

4,10

250

4,00

225

3,90

200
-50

-25

0
25
50
75
T, TEMPERATURE (C)

100

125

VCC=5,5V

3,80
-50

VCC=4,5V

-25

0
25
50
75
T, TEMPERATURE (C)

100

125

Figure 18. Short Current Limit versus Temperature

Figure 15. Rdson versus Temperature


24,50
24,25
24,00
23,75
23,50
23,25
23,00
22,75
22,50
-50

-25

0
25
50
75
T, TEMPERATURE (C)

100

Figure 16. Open Load versus Temperature

125

Figure 19. Inductive Switching

33385

12

Analog Integrated Circuit Device Data


Freescale Semiconductor

ARCHIVE INFORMATION

VCCMIN (V)

53,00

51,00
-50

IOL (mA)

ARCHIVE INFORMATION

VCLP (V)

53,50

ELECTRICAL CHARACTERISTICS
ELECTRICAL PERFORMANCE CURVES

In1 (1V/div)

tDON

VOUT1(2V/div)

VOUT1(2V/div)
tDOFFA
tDOFFB

Figure 20. Turn on Delay

ARCHIVE INFORMATION

ARCHIVE INFORMATION

In1 (1V/div)

Figure 21. Turn off Delay

33385

Analog Integrated Circuit Device Data


Freescale Semiconductor

13

FUNCTIONAL DESCRIPTION
INTRODUCTION

FUNCTIONAL DESCRIPTION

ARCHIVE INFORMATION

The device is a Quad Low-side Driver driven by four


CMOS input stages. Each output power transistor is
protected against short to VBAT by a zener clamp against
overvoltage.
A diagnostic logic recognizes four failure types at the
output stage : overcurrent, short to GND, open-load and
overtemperature.
The failures are individually stored in a byte which can be
read out via the serial interface (SPI).

OUTPUT STAGE CONTROL


Each of the four output stages is switched ON and OFF by
an individual control line (NON-Input). The logic level of the
control line is CMOS compatible. The output transistors are
switched off when the inputs are not connected.

POWER TRANSISTORS
Each of the four output stages has its own zener clamp.
This causes a voltage limitation at the power transistors when
inductive loads are switched off. The drain voltage ramp
occurring when output is switched on or off, is within defined
limits. Output transistors can be connected in parallel to
increase current capability. In this case, the associated inputs
should be connected together.

SHORT-CIRCUIT AND OVERTEMPERATURE


PROTECTION
If the output current increases above the short current limit
for a time longer than tSCB or if the temperature increases
above TOFF then the power transistor is immediately
switched off. It remains switched off until the control signal on
the NON-Input is switched off and on again.

DIAGNOSTICS
The following failures at the output stage are recognized :
Short -Circuit to VBAT or overtemp = SCB (Highest priority)
Short -Circuit to GND.................... = SCG
Open Load...................................... = OL (Lowest priority)
The SCB failure is recognized by an overcurrent (current
above the short current limit) or an overtemperature.

If the current through the output stage is lower than the


IOL-reference, after a filter time an OL failure will be
recognized. This measurement is active while the power
stage is switched on.
The SCG failure will recognize when the drain voltage is
lower than the OL reference limit, while the output stage is
switched off. All four outputs have an independent
overtemperature detection and shutdown. All failures are
stored in individual registers.
They can be read by the microprocessor via the serial
interface. There is no failure detected if the power stage
control time is shorter than the filter time.

DIAGNOSTIC INTERFACE
The communication between the microprocessor and the
failure register runs via the SPI link. If there is a failure stored
in the failure register, the first bit of the shift register is set to
a high level. With the High/Low change on the NCS pin, the
first bit of the diagnostic shift register will be transmitted to the
SDO output. The SDO output is the serial output from the
diagnostic shift register and it is put into a tri-state when the
NCS pin is high. The CLK pin clocks the diagnostic shift
register. New SDO data will appear on every rising edge of
this pin and new SDI data will be latched on every CLKs
falling edge into the shift register. With the first positive pulse
of the CLK, the failure register will be cleared. There is no bus
collision at a small spike at the NCS. The CLK is always LOW
while the NCS-signal is changing.

RESET
There are two different reset functions realized :
Under voltage reset : as long as the VCC voltage is lower
than VCCRES, the power stages are switched off and the
failure-registers are reset.
Reset pin : as long as the NRES-pin is low, following
circuits are reset :
Power stages
Failure register

UNDERVOLTAGE PROTECTION
At low VCC voltage, the device remains switched off even
if there is a voltage ramp at the OUT pin.

33385

14

Analog Integrated Circuit Device Data


Freescale Semiconductor

ARCHIVE INFORMATION

INTRODUCTION

PACKAGING
PACKAGE DIMENSIONS

PACKAGING
PACKAGE DIMENSIONS

ARCHIVE INFORMATION

ARCHIVE INFORMATION

For the most current package revision, visit www.freescale.com and perform a keyword search using the 98A listed below.

DH SUFFIX
VW (PB-FREE) SUFFIX
20-PIN HSOP
PLASTIC PACKAGE
98ASH70702A
ISSUE B

33385

Analog Integrated Circuit Device Data


Freescale Semiconductor

15

PACKAGING
PACKAGE DIMENSIONS

ARCHIVE INFORMATION

ARCHIVE INFORMATION

PACKAGE DIMENSIONS (CONTINUED)

DH SUFFIX
VW (PB-FREE) SUFFIX
20-PIN HSOP
PLASTIC PACKAGE
98ASH70702A
ISSUE B

33385

16

Analog Integrated Circuit Device Data


Freescale Semiconductor

REVISION HISTORY

REVISION HISTORY

REVISION

Implemented Revision History page


Added Pb-Free suffix code VW
Converted to Freescale format, and adjusted to the prevailing form and style

ARCHIVE INFORMATION

11/2006

DESCRIPTION OF CHANGES

ARCHIVE INFORMATION

6.0

DATE

33385

Analog Integrated Circuit Device Data


Freescale Semiconductor

17

Home Page:
www.freescale.com
Web Support:
http://www.freescale.com/support
USA/Europe or Locations Not Listed:
Freescale Semiconductor, Inc.
Technical Information Center, EL516
2100 East Elliot Road
Tempe, Arizona 85284
+1-800-521-6274 or +1-480-768-2130
www.freescale.com/support
Europe, Middle East, and Africa:
Freescale Halbleiter Deutschland GmbH
Technical Information Center
Schatzbogen 7
81829 Muenchen, Germany
+44 1296 380 456 (English)
+46 8 52200080 (English)
+49 89 92103 559 (German)
+33 1 69 35 48 48 (French)
www.freescale.com/support
Japan:
Freescale Semiconductor Japan Ltd.
Headquarters
ARCO Tower 15F
1-8-1, Shimo-Meguro, Meguro-ku,
Tokyo 153-0064
Japan
0120 191014 or +81 3 5437 9125
support.japan@freescale.com
Asia/Pacific:
Freescale Semiconductor Hong Kong Ltd.
Technical Information Center
2 Dai King Street
Tai Po Industrial Estate
Tai Po, N.T., Hong Kong
+800 2666 8080
support.asia@freescale.com
For Literature Requests Only:
Freescale Semiconductor Literature Distribution Center
P.O. Box 5405
Denver, Colorado 80217
1-800-441-2447 or 303-675-2140
Fax: 303-675-2150
LDCForFreescaleSemiconductor@hibbertgroup.com

MC33385
Rev. 6.0
11/2006

RoHS-compliant and/or Pb-free versions of Freescale products have the functionality


and electrical characteristics of their non-RoHS-compliant and/or non-Pb-free
counterparts. For further information, see http://www.freescale.com or contact your
Freescale sales representative.
For information on Freescales Environmental Products program, go to http://
www.freescale.com/epp.

Information in this document is provided solely to enable system and software


implementers to use Freescale Semiconductor products. There are no express or
implied copyright licenses granted hereunder to design or fabricate any integrated
circuits or integrated circuits based on the information in this document.
Freescale Semiconductor reserves the right to make changes without further notice to
any products herein. Freescale Semiconductor makes no warranty, representation or
guarantee regarding the suitability of its products for any particular purpose, nor does
Freescale Semiconductor assume any liability arising out of the application or use of any
product or circuit, and specifically disclaims any and all liability, including without
limitation consequential or incidental damages. Typical parameters that may be
provided in Freescale Semiconductor data sheets and/or specifications can and do vary
in different applications and actual performance may vary over time. All operating
parameters, including Typicals, must be validated for each customer application by
customers technical experts. Freescale Semiconductor does not convey any license
under its patent rights nor the rights of others. Freescale Semiconductor products are
not designed, intended, or authorized for use as components in systems intended for
surgical implant into the body, or other applications intended to support or sustain life,
or for any other application in which the failure of the Freescale Semiconductor product
could create a situation where personal injury or death may occur. Should Buyer
purchase or use Freescale Semiconductor products for any such unintended or
unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and
its officers, employees, subsidiaries, affiliates, and distributors harmless against all
claims, costs, damages, and expenses, and reasonable attorney fees arising out of,
directly or indirectly, any claim of personal injury or death associated with such
unintended or unauthorized use, even if such claim alleges that Freescale
Semiconductor was negligent regarding the design or manufacture of the part.
Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc.
All other product or service names are the property of their respective owners.
Freescale Semiconductor, Inc., 2007. All rights reserved.

ARCHIVE INFORMATION

ARCHIVE INFORMATION

How to Reach Us:

You might also like