Professional Documents
Culture Documents
No. 0062E
L32N04A
L32N05A
L42N05A
Contents
*
*
*
*
*
SERVICING NOTICES...........................2-4
PRODUCT SPECIFICATIONS...............5
FUNCTIONAL OVERVIEW....................6-8
BLOCK DIAGRAMS...............................9
TROUBLESHOOTING...........................10-16
* SCHEMATIC DIAGRAMS......................17-33
Power PCB Board (L32N04A / N05A)....17-19
Power PCB Board (L42N05A)................20-22
Main PCB & Others (Common)..............23-33
* PRINTED CIRCUIT BOARDS.................34-39
* PEPLACEMENT PART LISTS................40-51
LCD Television
Aug 2011
[Note 1]
If you have not the 500V insulation
resistance meter, use a Tester.
[Note 2]
External exposure metal: Antenna terminal
Headphone jack
IMPORTANT
When you exchange IC and Transistor with a heat sink, apply silicon grease on the contact
section of the heat sink. Before applying new silicon grease, remove all the old silicon grease.
(Old grease may cause damage to the IC and Transistor).
-2-
Servicing Notices
A. REMOVAL AND INSTALLATION OF
FLAT PACKAGE IC
REMOVAL
NOTE
Some ICs on the PCB are affixed with glue, so be
careful not to break or damage the foil of each IC
leads or solder lands under the IC when removing it.
NOTE
Masking is carried out on all the parts located within
10 mm distance from IC leads.
Masking Tape
(Cotton Tape)
Blower type IC
desoldering machine
IC
Tweezers
g 2-1
Fig.
2. Heat the IC leads using a blower type IC desoldering
machine. (Refer to Fig. 2-2.)
Fig. 2-3
NOTE
Blower type IC
desoldering machine
NOTE
Do not move the Braided Shield Wire in the vertical
direction towards the IC pattern.
Soldering Iron
IC
Fig. 2-2
IC pattern
-3-
Fig. 2-4
Servicing Notices
B. INSTALLATION
1. Take care of the polarity of new IC and then install the
new IC fitting on the printed circuit pattern. Then solder
each lead on the diagonal positions of IC temporarily.
(Refer to Fig. 2-5.)
IC
Soldering Iron
Fig. 2-8
Solder temporarily
Solder temporarily
Fig. 2-5
NOTE
Soldering Iron
IC
Supply soldering
from upper position
to lower position
Fig. 2-6
3. Absorb the solder left on the lead using the Braided
Shield Wire. (Refer to Fig. 2-7.)
NOTE
Do not absorb the solder to excess.
Soldering Iron
IC
Fig. 2-7
-4-
Model Name
L32N05A
L42N05A
L32N04A
Size
Resolution
Power Requirement
32
42
1366 x 768
1920 x 1080
90W
150W
Standby Power
Less than 1W
Audio Output
Dimension(WxHxD)
2 x 6W
With Stand
Without Stand
Weight
Terminals/ Input
Signals
2 x 8W
With Stand
10.5 kg
Without Stand
8.5 kg
Analog
18.0 kg
15.0 kg
PAL B/G, D/K, I
NTSC M
SECAM B/G, D/K
AV1
(Composite)
AV2
(Component)
HDMI1, 2, 3
Terminals/ Output
Signals
AV Out (Monitor)
RGB (Analog)
MEDIA1, MEDIA2
USB Port
CVBS
(Video and audio output are available only when
the TV input source is set to TV or AV1 mode.)
roni-shared.blogspot.com for
Headphone
Note:
The audio input terminals are shared between AV1 and AV2.
-5-