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Leadframe

Chip
Wire

Conductive epoxy
Die bond pad
Epoxy molding compound
(IC case)

Component-Level Thermal and Flow


Analysis
I-DEAS ESC Tutorials

Learn how to:

construct a detailed model of a single board


component
use thermal couplings to reduce model size and
solution time
assemble three parts and their FE models
analyze thermal behavior of the resulting
assembly

ESCtut11a

Before you begin...

1 of 2

Prerequisite tutorials:
1. Quick Tips to Using IDEAS
and
Creating Parts
2. Sketching and Constraining
3. Extruding and Revolving
4. ESC: Cooling a Simple Electronic System
Recommended tutorials:
1. ESC: Modifying a Design to Improve
Performance
2. ESC: Modeling a Heat Sink in Natural
Convection
3. ESC: Forced Convection in a Telephone
Switch
4. ESC: Forced Convection in a Telephone
Switch
5. ESC: Natural Convection in a Card Cage

Before you begin...

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In this tutorial you will analyze the thermal behavior of


a Plastic Quad Flat Pack. This is a component level
analysis. You will learn how Thermal Couplings can
dramatically reduce your model size and solution time.
Traditionally, people have attempted (more or less
successfully) to analyze single electronic components
using traditional CFD methods, i.e., very detailed and
large fluid meshes, all geometric instances explicitly
modeled, leading to very long setup and solution times.
ESC has a unique set of tools that allows you to
dramatically reduce the complexity of such models. It
uses a revolutionary approach that has proven to be
quick, very efficient and accurate.
Thermal Couplings allow you to characterize the heat
transfer process between discontinuous meshes. It
also allows you to eliminate some of the geometric
complexities and concentrate on thermally important
features of a given problem.
Thermal Coupling calculation methods are explained
thoroughly in this tutorial.
After you finish the tutorial, you can compare your
model with an archived sample model. This sample
was created using the techniques described in this
tutorial and should match your model perfectly.
The archived sample is stored as:
.../ideas/examples/esc/workshop/plas_quad.arc.Z (first
part of the path may vary slightly depending on your
I-DEAS installation.)

Setup

1 of 1

To begin the tutorial, start the I-DEAS Simulation


software and create a model file.
Change units to millimeters.
Options
Units
mm (milli_newton)
Remember
Dont forget to save your model file frequently.

Part 1: Creating the Geometry


Create new part

1 of 3

In this model, you will assemble 3 FE Models which


will be created using 3 different parts. ESC boundary
conditions will be applied onto the resulting model.
First, create and dimension the basic outline of the IC
case. All dimensions are shown in millimeters.

Sketch in Place a line and Extrude-Partition Thru All to


create a new surface in the middle of the case.

Sketch in Place on the mid-surface and create a New


Part 0.5 mm thick in the -Z direction.

Name the larger part IC Case and Put Away the part.

Things to notice Two parts are created. The second


one will be used to model details inside the chip
assembly.
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Create new part

2 of 3

The top surface of the 0.5 mm-thick part will be used to


model the Leadframe as well as the Chip. The bottom
surface will be used to model the Die Bond Pad.
Sketch the inner Leadframe outline as a 14 mm
square, centered on the top surface. Extrude-Split
Surface to create a new surface.

Using the same technique, create new surfaces for:


the 7mm x 7mm Chip centered on the top
surface of the .5mm thick part
the 12mm x 12mm Die Bond Pad centered on
the bottom surface of the .5mm thick part.
Leadframe
(top surface)
Chip
(top surface)

Die Bond Pad


(bottom surface)

Name the part Chip_Leads.

Create new part

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Get the IC case from the Bin and create a rectangular


part 150mm x 200mm x 50 mm. Partition it to create
the PC board surface which should line up with the
bottom of the IC case. The IC Case is centered inside
this new part in the XY plane.

Name this new part WindTunnel-PCB


Save your model file.
File
Save

Part 2: Meshing the Component


Meshing
t

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Fe

Al
Cu

Emissivity

Thickness
(mm)

Thermal
Conductivity
(W/m C)

Material Type
(Isotropic or
Orthotropic)

Switch to the Meshing task and create Materials and


Physical Property for the following components.

Component
Chip

Iso

149

0.508

1.0

Die Bond Pad

Iso

300

0.150

1.0

Leadframe

Ortho

1.0

IC Case

Iso

kx=300 0.150
ky=0.63
0.63
N/A

PC Board

Iso

17.7

0.85

1.6

1.0

Things to notice
The IC Case will be meshed with solid elements.

Meshing

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Put Away all parts except the Chip_Leads; with this


part, create an FE model.

Define and Generate a Beam Mesh for the outer edge


of the Die Bond Pad (cyan)

Once you have selected the four


edges, use MB3 Save as group
and create the Die Bond Pad outer
edge group.

Use an Element Length of 2.33 mm and a Null


Conductive Material. Pick Set as Defaults, then select
the color CYAN.
Why: We want the element length and the material
selection to still apply for the next beam mesh
definition but not the color.
Define and Generate a Beam Mesh for:
Inner edge of the Leadframe (magenta)
Outer edge of the Leadframe (red)
Remember
Create a group just after selecting.
Things to notice
With Set as defaults, only the color has to be changed
on the Define Mesh form.
These 12 edges could have been meshed all at once
but they would not have had different colors nor would
they have been in separate groups. If you forgot to
create the groups, continue with meshing, you will
have a chance to add them later.
Beam Elements are used by the Thermal Couplings or
Boundary Conditions on edges of shelled surfaces.
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Meshing

3 of 9

Define and Generate the Leadframe mesh.

Save as group
Use a Quadrilateral Shell Mesh, a Physical Property of
0.15mm and an Element Length of 2.33 mm.
To select the Leadframe material, pick other on the
define mesh form. Then, on the Materials form, set the
material type filter to Orthotropic.

Things to notice
The defaults you set on the Beam Mesh Definition form
apply only for beam elements, not for shell elements.
Try to make a habit of creating groups just after
selecting the geometry. This facilitates any further
picking of your geometry and speeds up boundary
condition definition.

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Meshing

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The Leadframe conducts in an Orthotropic fashion.


Lets use the Thermal Conductivity of Copper in the
radial direction and Plastic in the tangential direction.
Hint
Draw a temporary circle to help
orient the shell elements.
Use Material Orientation to
take advantage of Orthotropic
Conduction modeling.

Select all shell elements.


Use Standard Axes
Stationary Curve Tangent
Pick the temporary circle.
Use Modify Orientation and rotate the orientation
vectors 90 to obtain the orientation shown below:

Select all shell elements.


Rotate Axes
Check I-DEAS Prompt.
90 (type in and press Return)
Things to notice
The orientation vectors become the X material
direction.

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Meshing

5 of 9

Define and Generate Shell Meshes (and groups!) for


the Chip and the Die Bond Pad. Make sure you select
the right Materials and Physical Properties. Use an
Element Length of 2.33 mm.
Specify different colors to improve visibility.

Note: the following illustration shows triangular shells


for the Die Bond Pad for the purpose of demonstrating
that you can make use of different Element Types
using Thermal Couplings.

Optional Create any groups you forgot to create. (Going


back a few pages will help you remember which
surfaces or edges to select). Turn OFF element and
node visibility to facilitate selection but do not forget to
turn it back ON after.

Things to notice These small surfaces and edges will


be harder to select once the whole system is put
together.

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Meshing

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Put Away the Chip_Leads part and Get the IC case


from the Bin. Create an FE Model for the IC case,
select the IC case material as Default Material.

Define and generate a mesh on the top surface.

Just after picking the surface, use:


MB3 Save as group and name it TOP IC CASE.
Why: Again, these small surfaces will be harder to
select later.
Use the Null Conductive Material and Null thickness
Physical Property, pick Set as Defaults. Specify a
Mapped Shell Mesh and use 8 x 8 elements.
Repeat this procedure for the other two surfaces.
Remember to Save as group after selecting each
surface.
Use these colors for the meshes:

top
light blue

middle
dark green

bottom orange

Note that the order of these colors in the selection form


is also from top to bottom.

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Meshing

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Next, Define and generate a Mapped Solid Hexahedral


Mesh on both volumes in this part.

Use the IC case Material previously defined. Use 8 x 8


x 3 elements on each volume.

Things to notice
The top surface mesh will convect heat to the
fluid.
The bottom surface mesh will be used to couple
the IC case to the PC Board (Radiation and
Conduction through Air).
The middle surface mesh will be used to couple
the Chip, the Leadframe and the Die Bond Pad
to the IC Case.
Optional
Again create any groups you forgot to create.

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Meshing

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Put Away the IC case and Get the WindTunnel-PCB


part from the Bin.
Create a 3rd FE Model for the WindTunnel-PCB.
Select the PC Board as default material.
Define and generate a Mapped Solid Brick Mesh on
both volumes in this part. Use the pre-defined
ESC_AIR Material. Use 20 x 15 x 3 elements on each
volume.

Optional
You can define a Bias
using the Mapped
Options to get a finer
mesh near the center
of the Wind Tunnel
where the Plastic
Quad Flat Pack is
located. A bias factor
of 2 was used on the
example shown above
and at right.

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Meshing

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Define and generate a Mapped Shell Mesh for the PC


Board.

Use the Material and Physical Property table already


defined for the PC Board.
Check (and merge) coincident nodes.

All done
Check I-DEAS Prompt.
0.0001 (type in and press Return)
Lower Label
Yes (three times)
If there are no coincident nodes in the model the last
two picks (Yes, Yes) are unnecessary.
Save your model file.
File
Save

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Part 3: Assembling the geometries and


meshes

In this part of the tutorial you will:


combine together different meshes and
geometries using Append or the Master
Assembly task

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Assembling (with Append)

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To combine your meshes and geometries, you can use


the Append command or the Master Assembly task
(requires a Master Assembly license).
To use the Master Assembly task, go to the next page.
Combine the Chip_Leads assembly and the IC case
FEM to the WindTunnel-PCB FEM with the Append
command
Open the on-screen menus with Ctrl-M.
Select Manage
Select Copy Options
On the Copy/Append form, toggle Append ON.
Review the form; Nodes & Elements, Geometry
and TMG & ESC should all be toggled ON.
(Toggle them ON if they are not). Pick OK.
From the menu, select Append.
On the Select Source FEM Model form, pick
the Chip_Leads FEM. Hold Ctrl key and pick IC
case FEM. Pick OK.
On the Select Destination FEM Model form, pick
the WindTunnel-PCB FEM. Pick OK.
Check the I-DEAS Prompt region and press
return three times to accept the default labeling.
Warning! If the geometry switch is off, geometry will not
be copied and creating geometry based boundary
conditions on source FEM geometries will not be
possible.
When you append to a part, the destination part is
modified. If you wish to keep an unmodified copy of
the destination part for another purpose, copy it
before appending to it.
Save your model file.
File
Save
Your geometry is now ready for the definition of
boundary conditions, go to part 4.
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Assembling (with Master Assembly)

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Combine the Chip_Leads, the IC case and the


WindTunnel-PCB FEMs with the Master Assembly
task. (Requires a Master Assembly license).
Switch to the Master Assembly task and construct an
assembly
Master Assembly

Name: Full Assembly


OK
Use instances of the IC Case, Chip_Leads, and
WindTunnelPCB.
Get
From Bin
Select Part /Assembly form
Name: IC Case (hold Ctrl key)
Name: Chip_Leads
Name: WindTunnelPCB
OK
Continued on next page...

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Assembling

2of 2 (continued)

Switch to the Meshing task and create an FE Model for


the assembly.

FE Model Create form


Part or Assembly:Full Assembly
Define Assembly FEM
Define Assembly form
Assembly Instance: Full Assembly
Things to notice All instances are automatically
selected when the assembly name is picked.
Use FE Models
Things to notice All instance Fems will be used.
FE Append Options: Make sure that
the Geometry switch is toggled on.
Geometry switch
OK (3 forms)
Warning! If the geometry switch is off, geometry will not
be copied preventing the creation of geometry based
boundary conditions.
Name form
Name: Full Assembly Part
OK
Things to notice A new part is created.
Save your model file.
File
Save
Your geometry is now ready for boundary condition
definition.
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Part 4: Defining thermal and flow boundary


conditions; solving the model

In this part of the tutorial you will use I-DEAS


Electronic System Cooling (ESC) to:
define the boundary conditions of your model
obtain a solution of your model

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Boundary Conditions

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Switch to the Electronic System Cooling task.


Electro-System Cooling
Turn OFF element and node visibility to facilitate
surface and edge selection.

Why: Although thermal boundary conditions and flow


surface definitions can be applied to elements,
geometry should be used wherever possible. Doing
this saves you from having to recreate these
boundary conditions if the model geometry is modified
later.

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Boundary Conditions

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Create the following Thermal Couplings. When


selecting, remember to use groups.

1. Chip to Die Bond Pad:


We are modeling the Die Attach with a thermal
coupling: k/l = 2.5 W/mC/0.0005 m = 5000 W/m2C
Primary Elements:
Secondary Elements:
Coupling Type:
Value:

Chip surface
Die Bond Pad surface
Coefficient
5000

2. Chip to IC Case
Use k of The Chip and 50 % of its thickness:
k/l = 149 W/mC /(0.5 x 0.000508m)= 586000 W/m2C
Primary Elements:
Secondary Elements:
Coupling Type:
Value:

Chip surface
IC Case Middle surface
Coefficient
586000

3. Die Bond Pad to Case


Use k of the Pad and 50 % of its thickness. Use a
multiplying factor to take into account heat dissipation
from both sides.
k/l = 300 W/mC /(0.5 x 0.00015m) = 4000000W/m2C
Multiplying factor:
( (0.012 m)2 - (0.007 m)2 / (0.012 m)2 ) + 1 = 1.66
(Chip side is partially exposed)
Primary Elements:
Secondary Elements:
Coupling Type:
Value:

Die Bond Pad surface


IC Case Middle surface
Coefficient
6640000
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Boundary Conditions

2 of 3 (cont.)

4. Leadframe to Case
Use kx of the Leadframe and 50 % of its thickness.
Use a multiplying factor of 2 to take into account
heat dissipation from both sides.
k/l = 300 W/mC /(0.5 x 0.00015m)= 4000000 W/m2C
Multiplying factor: 2
Primary Elements:
Secondary Elements:
Coupling Type:
Value:

Leadframe surface
IC Case Middle surface
Coefficient
8000000

5. Die Bond Pad to Leadframe


Most of the Heat Transfer process here occurs by
conduction through plastic. So lets first
calculate an absolute heat transfer coefficient:
A = inner perimeter x thickness of Leadframe
= (4 x 0.014 m) x 0.00015
= 8.4E-6 m2
l = 0.001 m (Distance of Leadframe to Chip)
ky = 0.63 W/mC
k*A/l= 5.29E-3 W/C
To obtain a length based thermal coupling, divide this
value by the inner perimeter of the Leadframe.
5.29E-3 W/C / (4 x 0.014 m) = .1 W/mC
Primary Elements: Leadframe Inner Edges
(Use group to select the edges)
Secondary Elements: Die Bond Pad Outer Edges
(Use group to select the edges)
Coupling Type:
Edge
Value:
0.1
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Boundary Conditions

2 of 3 (cont.)

6. Leads to PC Board
Most of the Heat Transfer process here occurs by
conduction along the length of the Leads outside
the IC Case. So lets first calculate an absolute heat
transfer coefficient for one lead.
A =Cross section of one lead = 0.0002m x 0.00015m
= 3.0E-8 m2
l = 0.0015 m
k = 300 W/mC
k*A/l= 6E-3 W/C so for 256 leads: 1.536 W/C
To obtain a length based thermal coupling, divide this
value by the outer perimeter of the Leadframe.
1.536 W/C / (4 x .028 m) = 13.71 W/mC
Primary Elements: Leadframe Outer Edges
(Use group to select the edges)
Secondary Elements:
PC Board surface
Coupling Type:
Edge
Value:
13.71
7. IC Case to PC Board
In this model, we did not explicitly model fluid
underneath the IC Case. In reality there is an air gap of
0.2mm. Model conduction through this air gap using a
Thermal Coupling:
k = 0.0263 W/mC (Air)
k/l = 0.0263 W/mC / 0.0002 m= 131 W/m2C
Primary Elements:
Secondary Elements:
Coupling Type:
Value:

IC Case Bottom Surface


PC Board surface
Coefficient
131.5
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Boundary Conditions

2 of 3 (cont.)

8. Radiation: IC Case to PC Board


Radiation might be significant between the IC Case
and the PC Board. The surface emissivities were
defined in the material properties.
Primary Elements:
IC Case Bottom Surface
Secondary Elements:
PC Board
Coupling Type:
Radiative
Value:
0.88(GBF=1/(1+1/21)
for parallel surfaces.1=0.8,2 =0.85)
A good practice is to start from the heat source and
make sure heat can flow from the source (i.e. the
chip) to convective surfaces or temperature sinks.

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Boundary Conditions

3 of 3

Define a 1.5 W Thermal Boundary Condition


on the Chip.
h

Define a Surface Property. Use the


Calculate Roughness from Surface
Obstruction option.
Define a Flow Surface. Select the PC Board
surface as the Flow Surface and the IC Case
Top as the Flow Surface Obstruction. This
way, the top of the IC Case will also convect
to the fluid and will add local roughness
effects.
Define a 2 m/s Outlet Fan on one of the
openings of the wind tunnel.
Fan

Vent

Define a Vent To Ambient on the other


opening of the wind tunnel .
Specify a Run Directory.

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Solve and Post Process

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Save your model file.


File
Save
Solve your model. Load Results and Post process.

Calculate jc based on the temperature difference


obtained between the Chip and the hottest region of
the Top of the IC case.

Lower the Coupled Solver temperature change criteria,


solve again and check the difference in the energy
convergence.
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Wrap up
You have completed the Component-Level Thermal
and Flow Analysis ESC tutorial. Be sure to save your
work before exiting I-DEAS.
File
Save
See also...
Help, Manuals, Table of Contents
Simulation: Thermal Analysis Users Guide
I-DEAS Electronic System Cooling

To exit this tutorial, select:


File
Exit
Warning!
Do not use the menu in the I-DEAS Icons window to
exit. Use the menu in the Acrobat Reader window.

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