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Measurement
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a r t i c l e
i n f o
Article history:
Received 20 August 2012
Received in revised form 7 February 2013
Accepted 13 May 2013
Available online 25 May 2013
Keywords:
Transient hot wire
Platinum
Thermal conductivity
Dual wire method
a b s t r a c t
A modied measurement device to measure thermal conductivity of uids using transient
hot-wire technique has been designed, developed, tested and presented in this paper. The
equipment is designed such that the thermal conductivity could be measured using both
single wire sensor of different length and dual wire sensor. The sensor, which is also a heater, is a platinum micro-wire of 50 lm diameter. The inuence of wire length on the measurement of thermal conductivity of uids is tested using two single wires of length 50 mm
and 100 mm. The thermal conductivity is also measured using a dual hot wire arrangement; which is achieved by placing the 100 mm and 50 mm wires in a Wheatstone bridge
with the 100 mm wire as the sensor and 50 mm wire as a compensation wire. The apparatus requires a 100 ml of test uid to perform the experiment. The testing temperature of
the test uid during the experimentation can be suitably varied by the choice of heat
exchange uid used in the apparatus. Water is chosen as testing uids for primary standards. When compared to single wires, the thermal conductivity of the uids measured
is consistent with dual-wire method with an uncertainty of 0.25%.
2013 Elsevier Ltd. All rights reserved.
1. Introduction
The thermal conductivity of uids is the most essential
parameter required for thermal design and its consideration. Laser ash method [1], thermo reectance techniques [2], 3-omega technique [35] etc. techniques are
gaining importance since it measures properties based on
either steady state or pseudo steady state solutions.
Traditionally, transient hot wire techniques; which uses
Fouriers transient heat conduction model, is a well-established method for accurate measurement of thermal conductivity over a wide variety of substances such as solids
2747
Nomenclature
T
r
t
q
k
R
Greek letters
a
thermal diffusivity (m2 s1)
D
change
c
Eulers constant
e
emissivity
2. Mathematical model
Subscript
f
0
LONG
SHORT
g
ID
PT
uid
initial
long wire
short wire
bridge
ideal
platinum
DT 2 DT 1
1 @
@T
1 @T
r
r @r
@r
af @t
@T
q
t 0 and r 0lim r
r!0
@r
2pkf
t P 0 and r 1limfDTr; tg 0
r!1
where DT T T 0
Using the above, the temperature change at a radial distance r, from the heat source is conforms to a Eq. (3) by
applying boundary conditions (2). Upon exponential integration the solution is given in Eq. (4).
DTr; t Tr; t T 0
q
r2
Ei
4pkf
4af t
3
DT Tr;t T 0
8
2 2
39
>
>
r2
r2
<
=
4af t
4af t
q
6 4af t
7
c ln
::
:::::::
4
5
2
>
1 1!
4pkf >
2 2!
r
:
;
4
4af t
q
DT Tr; t T 0
c ln
4pkf
r2
q
t2
ln
4pkf
t1
kf
q d lnt
4p dDT
Eq. (3) can also be re-written as Eq. (8) such that both
thermal conductivity and thermal diffusivity could be
achieved from the same equation
4af t
q
DT Tr; t T 0
c ln
4pkf
r2
4af t k
q
ln
e
4pkf
r2
4af
q
q
ln 2 ek
lnt
4pkf
4pkf
r
The slope of the equation can give the thermal conductivity and the intercept will give the thermal diffusivity. In
this paper thermal conductivity is the matter of interest.
3. Apparatus design and circuitry
The schematic layout of the apparatus along with the
instrumentation circuitry is shown in Fig. 1a, b and c and
the essential apparatus dimensions are shown in Table 1.
The apparatus consist of three chambers respectively vacuum chamber (1), coolant chamber (2) and the platinum
micro-wire assembly chamber (3). The entire apparatus
is constructed using SS 316. The vacuum chamber, which
is the exterior compartment, ensures heat inltration to
and from the ambient. It is ensured that the chamber is
vacuumed using a vacuum pump (4), prior conducting
the experimentation. The next inner concentric chamber
is the coolant chamber. Based on the temperature requirement, the coolant can be appropriately chosen to maintain
the temperature in the micro-wire chamber which is lled
with the test uid.
The coolant is pumped from a temperature controlled
bath into the coolant chamber through 5 and leaves the
chamber through exit pipe 6. The temperature of the
2748
Table 1
Essential parameters.
S. No.
Description
Dimension
1
2
3
4
5
6
50 lm
100 mm
50 mm
8 mm
100 mm
150 mm
bringing out the apparatus using the feed through connectors. The entire assembly is perfectly insulated with thermo-foam insulation (11). The vacuum system provided is
connected to a single stage vacuum pump, which gets its
automatic feedback from an absolute pressure gauge. Since
the uid used in the present study is non-volatile, the liquid is manually fed by volume measurement. The data
from the circuitry is taken to a computational device using
Agilent data acquisition system.
In a transient hot wire method, the thermal conductivity of a uid is measured using the rate of increase of temperature of micro-wire with time for an applied step
change of voltage. The overall apparatus is completely isolated from all sources of vibration, such that the test uid
in which the micro-wires are suspended is in absolute static condition. This condition is synonymous to Eq. (1),
which mandates that the heat transfer process in the uid
is only through conduction. The supply voltage generates a
constant heat ux per unit length throughout the microwire which is transferred to the static uid medium. The
change in resistance of the sensing wire is related to the
rate at which the heat is removed from the wire and thus
the thermal properties of the uid. The resistance of the
micro-wire during heating could also be measured by placing a resistor in series with a power supply, nding the potential difference across the resistor and dividing by the
current through the micro-wire. This would only end in
practical difculties and inaccuracies. For instance, in order
to measure resistance, consider that the voltmeter is
2749
DV g
R1 R3 DR3 R2 R4 DR4
V IN
R1 R2 R3 DR3 R4 DR4
R1 R2 R3 R4 100 X
where
R3 = Rbalast1 + Rlong
Simplifying
DV g
and
V IN Rt
8 R3
R4 = Rbalast2 + Rshort
10
qt I2 R
Vt=R3 t R4 t2 RLong RShort =lLong lShort
11
DRSHORT DRLONG =2
Rt Ro 1 a DT
12
2750
4. Temperature corrections
It is essential to mention about the inherent deviation
present in approach. As per the mathematical model, the
wire is assumed have a zero radius and innite length immersed in an innite medium. But in reality both the diameter and length of the wire have denite values. Also, the
sensor, the platinum wire, mathematically has innite
thermal conductivity and zero heat capacity, which is
approximate. Due to the heating of the micro-wire, the
temperature difference in the test uid could activate natural convection. Even though Eq. (8) mandates only conduction heat transfer, presence of convection would
reduce the temperature and enhance the mathematical value of the thermal conductivity. Still, the presence of such a
convective current could be identied by departure from
the non-linear trend. The convection current are dominant
in gases, and in the presence study the test uids are liquids and thus effect of convective current is assumed negligible. Most of the uids are not transparent to infrared
and radiation component in those uids follows the same
radiation principle. Considering the radiation between
the platinum wire and the cell wall as between diffusive
grey surfaces, the radiation is correction is taken as Eq.
(13) [1315].
dT R
13
2751
2752
[14] R.A. Perkins, H.M. Roders, C.A. Nieto de Castro, A high temperature
transient hot-wire thermal conductivity apparatus for uids, J. Res.
Natl. Inst. Stan. 96 (3) (1991) 247269.
[15] H.M. Roder, R.A. Perkins, A. Laesecke, Absolute steady-state thermal
conductivity measurements by use of a transient hot-wire system, J.
Res. Natl. Inst. Stan. 105 (2) (2000) 221253.
[16] A.I. Johns, A.C. Scott, J.T.R. Watson, D. Ferguson, A.A. Clifford,
Measurement of the thermal conductivity of gases by the transient
hot-wire method, Philos. Tr. R. Soc. S-A 325 (1585) (1988) 295356.
[17] H.S. Carslaw, J.C. Jaeger, Conduction of Heat in Solids, Oxford
University Press, London, 1959 (Chapter 5).
[18] REFPROP, NIST Standard Reference Database 23, Version 7.01, 2004.