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Abstract
Science and Technology has begun a new revolution in human life. Due the development in technology, electronic equipments
especially laptops ensue to be smaller, lighter and faster. As a high processing unit is involved, laptops are subjected to release a
lot of heat, and in turn creating hot spots on the processing unit. Since the cooling system currently employed is not much efficient
to drive away the heat in hot spots, it is replaced with modern miniature Loop Heat Pipe (mLHP) technology for enhanced
cooling. In addition, this novel passive cooling solution has so many advantages compared to the existing active cooling solutions
such as the noise-free operation, lower energy consumption and higher reliability. In this paper, a digital prototype of laptop with
the new cooling technique is designed and analyzed using Computational Fluid Dynamics software Fluent. This analysis is
carried out with various heat dissipation rates of the heat source 30 W, 32 W, 43 W for different working conditions such as
standard use of the notebook, standard use while charging the battery and 100% CPU load respectively. The heat dissipation and
distribution for different working conditions are investigated. Based on the results obtained, a contemporary
2.
LHPs
AS
THERMAL
MANAGEMENT
DEVICES
At present, different cooling alternatives are available for
the thermal management of the electronic devices. An
optimum choice depends on number of factors such as
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Volume: 03 Issue: 05 | May-2014, Available @ http://www.ijret.org
676
5. CFD PROCESSING
4. CFD MODEL
Cooling System
The first and foremost step in CFD preprocessing of the
modeled loop heat pipe cooling system is geometry clean
up. This cleanup has been done using the ANSA meshing
tool which is very robust clean up tool. Extracting the fluid
region is the next step in which all the surfaces which are in
the contact of fluid are taken alone and all other surfaces are
removed completely Extracted domain of the cooling system
is shown in figure 2.
Fig - 2
5.2 Meshing
Fan condition with the air outlet of 0.1 m3/min is setup for
condensing units The inlet and outlet of pump to heat pipe is
left as the discontinuity as CFD software has the pump
condition that can be defined for the desired flow rate. The
cooling unit is assembled similar to the CFD base model
shown in Figure 1.
The entirely assembled cooling system with two
evaporators, one microchannel, two condensers are set as a
single unit along with the surrounding laptop component
blocks such as CPU, RAM, Graphics card, HDD drive, flash
storage, Battery, DVD, etc.
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Volume: 03 Issue: 05 | May-2014, Available @ http://www.ijret.org
677
Dissipatio Dissipation at
n at
Normal
Condition
Component Normal while
Condition
(W)
charging (W)
Dissipation Maximum
at
100%
Operating
CPU load Temperatu
re
(W)
Tmax C
CPU
21
21
30
100
RAM
0.5
0.5
0.5
70
HDD
60
Graphics
card
85
0.5
0.5
85
PCMCIA
70
Battery
55
Total
30
32
43
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678
Fig 4
Fig 3
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679
Fig 5
The temperature distribution plot is maximum at CPU
followed by the HDD then the battery. At maximum
operating temperature the HDD extracts 100% C.P.U load.
Hence it is better for a notebook computer to operate at
normal working conditions. The temperature distribution
plot clearly shows that maximum heat is contributed on
CPU, which is 335 K. In addition, the different components
that dissipate heat are also maintained at a temperature range
within maximum operating temperature. The battery, does
not dissipate heat as it generates heat due to the effect of
100% CPU load working condition of the laptop.
Fig 6
Therefore from the results obtained, it is noted that the new
cooling system effectively drives away heat under 100%
CPU loads, than the present cooling system.In a related way,
the CFD average temperature (Tavg) values and CFD hot
spot temperature individual components of laptops can be
obtained from Figure 2. The values obtained from Figure 4
are noted down in Table 2 and Table 3 to find out how
effectively the miniature Loop Heat Pipe cooling system
works under 100% CPU load to drive away the excess heat
generated in the system.
CPU
50
51
62
100
RAM
40
44
52
70
HDD
46
43
55
60
Graphics
card
47
44
52
85
South
Bridge
40
42
47
85
PCMCIA
38
39
43
70
Battery
33
44
49
55
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Volume: 03 Issue: 05 | May-2014, Available @ http://www.ijret.org
680
55
55
65
100
RAM
43
46
54
70
HDD
48
48
59
60
Graphics
card
48
45
53
85
South
Bridge
42
43
48
85
PCMCIA 40
40
45
70
Battery
45
54
55
35
Temperature
Maximum
Distribution Temperature
at 100%
Distribution Operating
CPU Load at 100%
Temperat
C
CPU
Load ure
C
(mLHP)
(conventional
)
Tmax C
Component
CPU
81
65
100
RAM
63
54
70
HDD
68*
59
60
Graphics card
61
53
85
South Bridge
56
48
85
PCMCIA
51
45
70
54
55
Battery
62*
From the Table 4, it is clear that the Hard Disk Drive and
Battery are exposed to work at a higher temperature,
exceeding the maximum operating temperature, under 100%
CPU load condition. But the usage of miniature Loop Heat
Pipe cooling system enables more efficient cooling and also
helps the components of laptops to work below the
maximum temperature range. Hence the mLHP cooling
solution is considered as the better cooling system when
compared to the existing cooling system.
7. CONCLUSIONS
The thermal management of a typical notebook computer
passive heat dissipation path is investigated with the help of
a commercial CFD software package, ANSYS Fluent.From
the obtained CFD results, the usage of miniature loop heat
pipe for cooling system is a better cooling solution for the
notebook computers. It also shows that the performance for
high-powered chip cooling application can be easily
integrated into the compact enclosures of modern laptops.
Finally, in conclusion this passive cooling solution is better
in heat dissipation and cooling the system when compared to
the existing active cooling solutions.It also has additional
advantages such as the noise-free operation, lower energy
consumption and higher reliability.
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Volume: 03 Issue: 05 | May-2014, Available @ http://www.ijret.org
681
REFERENCES
[1]. Randeep Singh, Aliakbar Akbarzadeh, and Masataka
Mochizuki, 2010 Thermal Potential of Flat Evaporator
Miniature Loop Heat Pipes for Notebook Cooling,
Components and Packing Technologies, IEEE Transactions
on (Volume: 33, Issue 1)
[2]. Ilker Tari and Fidan Seza Yalcin, 2010 CFD Analyses
of a Notebook Computer Thermal Management System and
a Proposed Passive Cooling Alternative, Components and
Packing Technologies, IEEE Transactions on (Volume: 33,
Issue 2)
[3]. S. H. Moon , G. Hwang , H. G. Yun , T. G. Choy and Y.
Kang II, 2002 "Improving thermal performance of miniature
heat pipe for notebook PC cooling", Microelectron. Rel.,
Vol. 42, no. 1, pp. 135 140
[4]. M.-I. Baek and J.-M. Lee, 2000 "Thermal design for
notebook PC by using thermal analysis", Proc. 9th Int.
FLOWTHERM User Conference
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Volume: 03 Issue: 05 | May-2014, Available @ http://www.ijret.org
682