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DATA SHEET
TDA4841PS
I2C-bus autosync deflection
controller for PC monitors
Product specification
File under Integrated Circuits, IC02
1999 Oct 25
Philips Semiconductors
Product specification
TDA4841PS
FEATURES
Concept features
Full horizontal plus vertical autosync capability
Extended horizontal frequency range from
15 to 130 kHz
Comprehensive set of I2C-bus driven geometry
adjustments and functions, including standby mode
Vertical section
Moire cancellation
X-ray protection
SDIP32 package.
Focus section
Synchronization
1999 Oct 25
Philips Semiconductors
Product specification
TDA4841PS
PARAMETER
MIN.
TYP.
MAX.
UNIT
V CC
supply voltage
9.2
16
ICC
supply current
70
mA
ICC(stb)
mA
VSIZE
vertical size
60
100
VGA
16.8
VPOS
vertical position
11.5
VLIN
46
VLINBAL
1.25
VHSIZE
0.13
3.6
VHPIN
0.04
1.42
VHEHT
0.02
0.69
VHTRAP
0.5
VHCORT
0.64
+0.2
VHCORB
0.64
+0.2
HPOS
horizontal position
13
HPARAL
horizontal parallelogram
1.5
HPINBAL
EW pin unbalance
1.5
Tamb
ambient temperature
20
+70
ORDERING INFORMATION
PACKAGE
TYPE
NUMBER
NAME
TDA4841PS
SDIP32
1999 Oct 25
DESCRIPTION
plastic shrink dual in-line package; 32 leads (400 mil)
VERSION
SOT232-1
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14
clamping
blanking
CLBL
16
17
HUNLOCK
VERTICAL
SYNC INPUT
AND POLARITY
CORRECTION
150
nF
1.2 V
VREF
VCAP
VAGC
VSMOD
HSMOD
EWDRV
23
24
22
21
31
11
EHT COMPENSATION
VERTICAL
OSCILLATOR
AND AGC
VERTICAL
SYNC
INTEGRATOR
VIDEO CLAMPING
AND
VERTICAL BLANK
7V
EHT compensation
via horizontal size
HORIZONTAL SIZE
AND
VERTICAL SIZE
EW-OUTPUT
18
SCL
VOUT2
VERTICAL LINEARITY
VERTICAL LINEARITY
BALANCE
13
VOUT1
VERTICAL POSITION
VERTICAL SIZE, VOVSCN
HUNLOCK
OUTPUT
OUTPUT
ASYMMETRIC
EW-CORRECTION
20 ASCOR
FOCUS
HORIZONTAL
AND VERTICAL
32 FOCUS
or
PROTECTION
AND SOFT START
TDA4841PS
19
SDA
12
VERTICAL OUTPUT
HORIZONTAL PINCUSHION
HORIZONTAL CORNER
HORIZONTAL TRAPEZIUM
HORIZONTAL SIZE
I2C-BUS
RECEIVER
X-RAY
I2C-BUS REGISTERS
6 BDRV
VCC
10
9.2 to 16 V
PGND 7
SGND 25
HSYNC
(TTL level)
15
4 BSENS
SUPPLY
AND
REFERENCE
COINCIDENCE DETECTOR
FREQUENCY DETECTOR
PLL1 AND
HORIZONTAL
POSITION
(video)
3.3 k
100 nF
X-RAY
PROTECTION
HORIZONTAL
OSCILLATOR
27
28
29
30
HPLL1
HBUF
HREF
HCAP
HPLL2
RHBUF
(1)
10 nF
(2%)
12 nF
3 BOP
(2)
B+ CONTROL
APPLICATION
5 BIN
HORIZONTAL
OUTPUT
STAGE
PLL2, PARALLELOGRAM,
PIN UNBALANCE AND
SOFT START
26
8.2
nF
B+
CONTROL
Philips Semiconductors
VSYNC
(TTL level)
100
nF
(5%)
22
k
(1%)
BLOCK DIAGRAM
1999 Oct 25
EHT compensation
via vertical size
HFLB
XSEL
XRAY
8 HDRV
MHB603
RHREF
(1%)
Product specification
TDA4841PS
(1) For the calculation of fH range see Section Calculation of line frequency range.
(2) See Figs 25 and 26.
Philips Semiconductors
Product specification
TDA4841PS
PINNING
SYMBOL
PIN
DESCRIPTION
HFLB
XRAY
BOP
BSENS
BIN
BDRV
PGND
power ground
HDRV
XSEL
VCC
10
supply voltage
EWDRV
11
EW waveform output
VOUT2
12
VOUT1
13
VSYNC
14
HSYNC
15
CLBL
16
HUNLOCK
17
SCL
18
SDA
19
ASCOR
20
VSMOD
21
VAGC
22
VREF
23
VCAP
24
SGND
25
signal ground
HPLL1
26
HBUF
27
HREF
28
HCAP
29
HPLL2
30
HSMOD
31
FOCUS
32
1999 Oct 25
Philips Semiconductors
Product specification
TDA4841PS
handbook, halfpage
HFLB 1
32 FOCUS
XRAY 2
31 HSMOD
BOP 3
30 HPLL2
BSENS 4
29 HCAP
BIN 5
28 HREF
BDRV 6
27 HBUF
PGND 7
26 HPLL1
HDRV 8
25 SGND
TDA4841PS
XSEL 9
24 VCAP
VCC 10
23 VREF
EWDRV 11
22 VAGC
VOUT2 12
21 VSMOD
VOUT1 13
20 ASCOR
VSYNC 14
19 SDA
HSYNC 15
18 SCL
CLBL 16
17 HUNLOCK
MHB604
FUNCTIONAL DESCRIPTION
Horizontal sync separator and polarity correction
HSYNC (pin 15) is the input for horizontal synchronization
signals, which can be DC-coupled TTL signals (horizontal
or composite sync) and AC-coupled negative-going video
sync signals. Video syncs are clamped to 1.28 V and
sliced at 1.4 V. This results in a fixed absolute slicing level
of 120 mV related to sync top.
Philips Semiconductors
Product specification
TDA4841PS
Frequency-locked loop
Horizontal oscillator
spread of
for fmax
for fmin
IC
3%
5%
CHCAP
2%
2%
RHREF, RHBUF
2%
2%
Total
7%
9%
f sync ( min )
f min = ---------------------- = 28.4 kHz
1.09
1999 Oct 25
78 kHz k
R HBUFpar = ------------------------------------------------------------------- = 726
2
f max + 0.0012 f max [ kHz ]
Philips Semiconductors
Product specification
1999 Oct 25
TDA4841PS
Philips Semiconductors
Product specification
X-ray protection
The X-ray protection input XRAY (pin 2) provides a voltage
detector with a precise threshold. If the input voltage at
XRAY exceeds this threshold for a certain period of time,
control bit SOFTST is reset, which switches the IC into
protection mode. In this mode several pins are forced into
defined states:
TDA4841PS
Calculation of ffr(V) total spread
Contributing elements
10%
Spread of IC
3%
Spread of RVREF
1%
Spread of CVCAP
5%
Total
19%
1999 Oct 25
Philips Semiconductors
Product specification
V HSIZE
V HSIZE + V HEHT 1 ---------------
14.4 V
g(HSIZE,HSMOD) = 1 ------------------------------------------------------------------------14.4 V
I HREF
and h(I HREF) = -----------------------------------I HREF
f = 70 kHz
1999 Oct 25
TDA4841PS
10
Philips Semiconductors
Product specification
TDA4841PS
1. Mode 1
Horizontal size is controlled via register HSIZE and
causes a DC shift at the EWDRV output. The complete
waveform is also multiplied internally by a signal
proportional to the line frequency [which is detected
via the current at HREF (pin 28)]. This mode is to be
used for driving EW diode modulator stages which
require a voltage proportional to the line frequency.
2. Mode 2
The EW drive waveform does not track with the line
frequency. This mode is to be used for driving
EW modulators which require a voltage independent
of the line frequency.
Output stage for asymmetric correction waveforms
[ASCOR (pin 20)]
GENERAL DESCRIPTION
1999 Oct 25
11
Philips Semiconductors
Product specification
1999 Oct 25
TDA4841PS
12
Philips Semiconductors
Product specification
RESET
increase supply voltage,
reload registers,
soft start via I2C-bus
reload registers,
soft start via I2C-bus or via
supply voltage
reload registers,
soft start via I2C-bus
release pin 30
1999 Oct 25
TDA4841PS
13
Philips Semiconductors
Product specification
TDA4841PS
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134); all voltages measured with respect to ground.
SYMBOL
PARAMETER
MIN.
MAX.
UNIT
0.5
+16
pin BIN
0.5
+6.0
0.5
+6.5
0.5
+8.0
pin XRAY
0.5
+8.0
0.5
+6.5
0.5
+16
VCC
supply voltage
Vi(n)
input voltage
Vo(n)
CONDITIONS
output voltage
VI/O(n)
0.5
+6.0
Io(HDRV)
100
mA
Ii(HFLB)
10
+10
mA
Io(CLBL)
10
mA
Io(BOP)
mA
Io(BDRV)
50
mA
Io(EWDRV)
mA
Io(FOCUS)
mA
Tamb
ambient temperature
20
+70
Tj
junction temperature
150
Tstg
storage temperature
55
+150
Vesd
note 1
150
+150
note 2
2000
+2000
Notes
1. Machine model: 200 pF; 0.75 H; 10 .
2. Human body model: 100 pF; 7.5 H; 1500 .
THERMAL CHARACTERISTICS
SYMBOL
Rth(j-a)
PARAMETER
CONDITIONS
VALUE
UNIT
55
K/W
in free air
QUALITY SPECIFICATION
In accordance with URF-4-2-59/601; EMC emission/immunity test in accordance with DIS 1000 4.6 (IEC 801.6).
SYMBOL
VEMC
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
emission test
note 1
1.5
mV
immunity test
note 1
2.0
Note
1. Tests are performed with application reference board. Tests with other boards will have different results.
1999 Oct 25
UNIT
14
Philips Semiconductors
Product specification
TDA4841PS
CHARACTERISTICS
VCC = 12 V; Tamb = 25 C; peripheral components in accordance with Fig.1; unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
1.7
VHSYNC(sl)
1.2
1.4
1.6
tr(HSYNC)
10
500
ns
tf(HSYNC)
10
500
ns
tW(HSYNC)(min)
0.7
Ii(HSYNC)
input current
Vi(HSYNC) = 0.8 V
200
Vi(HSYNC) = 5.5 V
10
INPUT CHARACTERISTICS FOR AC-COUPLED VIDEO SIGNALS (SYNC-ON-VIDEO, NEGATIVE SYNC POLARITY)
VHSYNC
Rsource = 50
300
mV
VHSYNC(AC,sl)
Rsource = 50
90
120
150
mV
Vclamp(HSYNC)
1.1
1.28
1.5
Ich(HSYNC)
1.7
2.4
3.4
tW(HSYNC)(min)
0.7
Rsource(max)
duty cycle = 7%
1500
Ri(diff)(HSYNC)
during sync
80
25
td(HPOL)
0.3
1.8
ms
fH = 15.625 kHz;
IHREF = 0.52 mA
14
20
26
fH = 31.45 kHz;
IHREF = 1.052 mA
10
13
fH = 64 kHz;
IHREF = 2.141 mA
3.9
5.7
6.5
fH = 100 kHz;
IHREF = 3.345 mA
2.5
3.8
4.5
1.7
VVSYNC(sl)
Ii(VSYNC)
input current
1999 Oct 25
15
1.2
1.4
1.6
10
Philips Semiconductors
Product specification
PARAMETER
TDA4841PS
CONDITIONS
MIN.
TYP.
MAX.
UNIT
400
td(VPOL)
0.45
1.8
ms
0.6
0.7
0.8
measured at VCLBL = 3 V
Vclamp(CLBL)
4.32
4.75
5.23
TCclamp
temperature coefficient of
Vclamp(CLBL)
mV/K
STPSclamp
RL = 1 M; CL = 20 pF
50
ns/V
td(HSYNCt-CLBL)
130
ns
tclamp(max)
1.0
td(HSYNCl-CLBL)
300
ns
tclamp(max)
0.15
Vblank(CLBL)
notes 1 and 2
1.7
1.9
2.1
tblank(CLBL)
220
260
300
TCblank
temperature coefficient of
Vblank(CLBL)
Vscan(CLBL)
TCscan
305
350
395
mV/K
0.59
0.63
0.67
temperature coefficient of
Vscan(CLBL)
mV/K
Isink(CLBL)
2.4
mA
IL(CLBL)
3.0
mA
1999 Oct 25
ICLBL = 0
16
Philips Semiconductors
Product specification
PARAMETER
TDA4841PS
CONDITIONS
MIN.
TYP.
MAX.
UNIT
30.53
31.45
32.39
kHz
ffr(H)
ffr(H)
spread of free-running
frequency (excluding spread of
external components)
3.0
TCfr
temperature coefficient of
free-running frequency
100
+100
106/K
fH(max)
130
kHz
VHREF
2.43
2.55
2.68
250
mV
IL = 0
Vblank(HUNLOCK)
0.9
1.1
TCblank
temperature coefficient of
Vblank(HUNLOCK)
0.9
mV/K
TCsink
temperature coefficient of
Isink(HUNLOCK)
0.15
%/K
Isink(int)
1.4
2.0
2.6
mA
IL(max)
VHUNLOCK = 1 V
mA
ILI
leakage current
VHUNLOCK = 5 V in case of
unlocked PLL1 and/or
protection active
25
40
80
ms
15
PLL1 phase comparator and frequency-locked loop: pins HPLL1 and HBUF
tW(HSYNC)(max)
tlock(HPLL1)
Ictrl(HPLL1)
control currents
VHBUF
1999 Oct 25
notes 4 and 5
145
minimum horizontal
frequency
2.55
maximum horizontal
frequency
0.5
17
Philips Semiconductors
Product specification
PARAMETER
TDA4841PS
CONDITIONS
MIN.
TYP.
MAX.
UNIT
HPINBAL
HPARAL
HMOIRE
register HPOS = 0
13
13
register HPINBAL = 0;
note 6
1.2
1.2
0.02
register HPARAL = 0;
note 6
1.2
1.2
0.02
relative modulation of
horizontal position by
1 horizontal frequency;
2
phase alternates with
1 vertical frequency
2
register HMOIRE = 0;
control bit MOD = 0
0.02
maximum advance;
register HPINBAL = 32;
register HPARAL = 32
36
horizontal parallelogram
correction (referenced to
horizontal period)
75
PLL2
28
mV/%
VPROT(HPLL2)(max)
4.6
Ich(PLL2)
Idch(PLL2)
1999 Oct 25
18
Philips Semiconductors
Product specification
PARAMETER
TDA4841PS
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Ii(HFLB) = 5 mA
5.5
Vneg(HFLB)
Ii(HFLB) = 1 mA
0.75
Ipos(HFLB)
mA
Ineg(HFLB)
mA
Vsl(HFLB)
slicing level
2.8
Io(HDRV) = 20 mA
0.3
Io(HDRV) = 60 mA
0.8
VHDRV = 16 V
10
Io(HDRV) = 20 mA;
fH = 31.45 kHz; see Fig.16
42
45
48
Io(HDRV) = 20 mA;
fH = 58 kHz; see Fig.16
45.5
48.5
51.5
Io(HDRV) = 20 mA;
fH = 110 kHz; see Fig.16
49
52
55
6.22
6.39
6.56
saturation voltage
ILO(HDRV)
tW(XRAY)(min)
Ri(XRAY)
XRAYrst
30
500
standby mode
pin 9 open-circuit or
connected to GND
VCC(XRAY)(min)
VCC(XRAY)(max)
RXSEL
56
130
1999 Oct 25
19
Philips Semiconductors
Product specification
PARAMETER
TDA4841PS
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Vertical oscillator (oscillator frequency in application without adjustment of free-running frequency ffr(V))
ffr(V)
free-running frequency
RVREF = 22 k;
CVCAP = 100 nF
40
42
43.3
Hz
fcr(V)
50
160
Hz
VVREF
3.0
td(scan)
220
260
300
305
350
395
120
200
300
150
220
nF
IVAGC
CVAGC
VSIZE
VSIZEVGA
register VGAIN = 0;
register VSIZE = 127;
bit VOVSCN = 0; note 8
70
100
register VSIZE = 0;
register VGAIN = 63;
bit VOVSCN = 0; note 8
60
100
70
115.9
116.8
117.7
Ii(VSMOD)
Ii(VSMOD) = 0
Ii(VSMOD) = 120 A
VSMOD = 0
VSMOD = 7%
120
Ri(VSMOD)
input resistance
300
500
Vref(VSMOD)
5.0
fro(VSMOD)
Ii(VSMOD) = 60 A + 15 A 1
(RMS)
MHz
1999 Oct 25
20
Philips Semiconductors
Product specification
PARAMETER
TDA4841PS
CONDITIONS
MIN.
TYP.
MAX.
UNIT
VPOS
register VOFFS = 0
register VOFFS = 15
register VOFFS = 8
0.25
register VPOS = 0
11.5
11.5
register VPOS = 64
0.09
46
maximum VLIN
0.7
register VLINBAL = 0;
note 8
1.85
1.40
0.95
0.95
1.40
1.85
register VLINBAL = 8;
note 8
0.08
register VMOIRE = 0;
control bit MOD = 0
0.03
VLIN
VMOIRE
0.76
0.85
0.94
mA
Io(VOUT)(max)
0.54
0.6
0.66
mA
VVOUT
4.2
E(offset)(max)(V)
2.5
LEV(max)
1.5
1999 Oct 25
21
Philips Semiconductors
Product specification
PARAMETER
TDA4841PS
CONDITIONS
MIN.
TYP.
MAX.
UNIT
EW drive output
EW DRIVE OUTPUT STAGE: PIN EWDRV; see Figs 8 to 11
Vo(const)(EWDRV)
register HPIN = 0;
register HTRAP = 32;
register HSIZE = 255;
control bit VSC = 1
Vo(EWDRV)(max)
note 9
IL(EWDRV)
load current
TCEWDRV
temperature coefficient of
output signal
VHPIN(EWDRV)
VHCORT(EWDRV)
VHCORB(EWDRV)
VHTRAP(EWDRV)
1.05
1.2
1.35
7.0
mA
600
106/K
0.04
1.42
register HPIN = 0;
control bit VSC = 1; note 8
register HCORT = 0;
control bit VSC = 0; note 8
0.2
0.64
register HCORT = X;
control bit VSC = 1; note 8
register HCORB = 0;
control bit VSC = 0; note 8
0.2
0.64
register HCORB = X;
control bit VSC = 1; note 8
0.5
0.5
VHSIZE(EWDRV)
VHEHT(EWDRV)
Ii(HSMOD)
EHT compensation on
horizontal size via HSMOD
(pin 31)
input current (pin 31)
0.01
0.13
3.6
IHSMOD = 0; note 8
0.02
0.69
VHEHT = 0.02 V
VHEHT = 0.69 V
120
300
500
Ri(HSMOD)
input resistance
Vref(HSMOD)
Ii(HSMOD) = 0
5.0
fro(HSMOD)
Ii(HSMOD) = 60 A
+ 15 A (RMS)
MHz
1999 Oct 25
22
Philips Semiconductors
Product specification
PARAMETER
TDA4841PS
CONDITIONS
MIN.
TYP.
MAX.
UNIT
80
kHz
0.72
1.42
1.42
register HPARAL = 0;
note 8
0.825
0.825
0.05
register HPINBAL = 0;
note 8
1.0
1.0
0.05
Vo(ASCOR)(max)
6.5
Vc(ASCOR)
centre voltage
4.0
Vo(ASCOR)(min)
1.9
Io(ASCOR)(max)
Vo(ASCOR) 1.9 V
1.5
mA
Isink(ASCOR)(max)
Vo(ASCOR) 1.9 V
50
fH(MULTI)
VPAR(EWDRV)
LEEWDRV
VHPINBAL(ASCOR)
1999 Oct 25
23
Philips Semiconductors
Product specification
PARAMETER
TDA4841PS
CONDITIONS
MIN.
TYP.
MAX.
UNIT
tW(hfb)(min)
register HFOCAD = 0;
see Fig.28
300
ns
register HFOCAD = 1;
see Fig.28
350
ns
register HFOCAD = 2;
see Fig.28
400
ns
register HFOCAD = 3;
see Fig.28
450
ns
1.9
7.5
5.5
operation without
pre-correction
tW(hfb)(max)
VHFOCUS(p-p)
register HFOCUS = 0
0.06
register HFOCUS = 31
3.3
VVFOCUS(p-p)
register VFOCUS = 0;
note 8
0.02
1.1
Vo(FOCUS)(max)
Io(FOCUS) = 0
6.15
6.4
6.65
Vo(FOCUS)(min)
Io(FOCUS) = 0
1.0
1.3
1.6
Io(FOCUS)(max)
1.5
mA
CL(FOCUS)(max)
20
pF
input voltage
5.25
Ii(BIN)(max)
Vref(int)
2.37
2.5
2.58
Vo(BOP)(min)
0.5
Vo(BOP)(max)
5.0
5.3
5.6
Io(BOP) < 1 mA
Io(BOP)(max)
500
gm(OTA)
transconductance of OTA
note 11
30
50
70
mS
Gv(ol)
note 12
86
dB
CBOP(min)
10
nF
1999 Oct 25
24
Philips Semiconductors
Product specification
PARAMETER
TDA4841PS
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Vi(BOP)
ILI(BSENS)(max)
discharge disabled
note 13
20
mA
ILO(BDRV)
VBDRV = 16 V
Vsat(BDRV)
saturation voltage
Io(BDRV) < 20 mA
300
mV
toff(BDRV)(min)
minimum off-time
250
ns
td(BDRV-HDRV)
500
ns
capacitive load;
IBSENS = 0.5 mA
0.85
1.0
1.15
Idch(BSENS)
discharge current
4.5
6.0
7.5
mA
Vth(BSENS)(restart)
fault condition
1.2
1.3
1.4
CBSENS(min)
nF
9.2
16
ICC
supply current
70
mA
ICC(stb)
mA
PSRR
f = 1 kHz
50
dB
VCC(blank)
8.2
8.6
9.0
VCC(blank)(min)
2.5
3.5
4.0
Von(VCC)
7.9
8.3
8.7
Voff(VCC)
7.7
8.1
8.5
1999 Oct 25
25
Philips Semiconductors
Product specification
PARAMETER
TDA4841PS
CONDITIONS
MIN.
TYP.
MAX.
UNIT
4.6
VHPLL2(bduty)(ul)
4.0
VHPLL2(bduty)(ll)
3.2
VHPLL2(hduty)(ul)
3.2
VHPLL2(hduty)(ll)
1.8
VHPLL2(stby)(ll)
1.1
VHPLL2(stby)(ul)
VHPLL2(stby)(ll)
Notes
1. For duration of vertical blanking pulse see subheading Vertical oscillator (oscillator frequency in application without
adjustment of free-running frequency ffr(V)).
2. Continuous blanking at CLBL (pin 16) will be activated, if one of the following conditions is true:
a) No horizontal flyback pulses at HFLB (pin 1) within a line
b) X-ray protection is triggered
c) Voltage at HPLL2 (pin 30) is low during soft start
d) Supply voltage at VCC (pin 10) is low
e) PLL1 unlocked while frequency-locked loop is in search mode.
3. Oscillator frequency is fmin when no sync input signal is present (no continuous blanking at pins 16 and 17).
4. Loading of HPLL1 (pin 26) is not allowed.
5. Voltage at HPLL1 (pin 26) is fed to HBUF (pin 27) via a buffer. Disturbances caused by horizontal sync are removed
by an internal sample-and-hold circuit.
6. All vertical and EW adjustments according note 8, but VSIZE = 80% (register VSIZE = 63, VGAIN = 63 and control
bit VOVSCN = 0).
7. Value of resistor at VREF (pin 23) may not be changed.
1999 Oct 25
26
Philips Semiconductors
Product specification
TDA4841PS
8. All vertical and EW adjustments are specified at nominal vertical settings; unless otherwise specified, which means:
a) VSIZE = 100% (register VSIZE = 127, VGAIN = 63 and control bit VOVSCN = 0)
b) VSMOD = 0 (no EHT compensation)
c) VPOS centred (register VPOS = 64)
d) VLIN = 0 (register VLIN = X and control bit VSC = 1)
e) VLINBAL = 0 (register VLINBAL = 8)
f) FHMULT = 0
g) HPARAL = 0 (register HPARAL = 32)
h) HPINBAL = 0 (register HPINBAL = 32)
i) Vertical oscillator synchronized.
9. The output signal at EWDRV (pin 11) may consist of horizontal pincushion + corner correction + DC shift + trapezium
correction. If the VOVSCN control bit is set, and the VPOS adjustment is set to an extreme value, the tip of the
parabola may be clipped at the upper limit of the EWDRV output voltage range. The waveform of corner correction
will clip if the vertical sawtooth adjustment exceeds 110% of the nominal setting.
10. If fH tracking is enabled, the amplitude of the complete EWDRV output signal (horizontal pincushion + corner
correction + DC shift + trapezium) will be changed proportional to IHREF. The EWDRV low level of 1.2 V remains fixed.
11. First pole of transconductance amplifier is 5 MHz without external capacitor (will become the second pole, if the OTA
operates as an integrator).
V BOP
12. Open-loop gain is -------------- at f = 0 with no resistive load and CBOP = 10 nF (from BOP (pin 3) to GND).
V BIN
13. The recommended value for the pull-up resistor at pin 6 (BDRV) is 1 k.
1999 Oct 25
27
Philips Semiconductors
Product specification
TDA4841PS
MBG590
handbook, halfpage
MGS274
handbook, halfpage
IVOUT1
IVOUT1
IVOUT2
IVOUT2
l2
l1(1)
I1(1)
I2
t
t
(1) I1 is the maximum amplitude setting at register VSIZE = 127,
register VGAIN = 63, control bit VOVSCN = 0.
I 2
VSIZE = -------- 100%
I 1
I 2
VSMOD = -------- 100%
I 1
I 2
VGAIN = -------- 100%
I 1
MBG592
handbook, halfpage
MBG594
handbook, halfpage
IVOUT1
IVOUT1
l2/t
IVOUT2
IVOUT2
l1(1) l2
l1(1)/t
I 2 I 1
VOFFS = ---------------------- 100%
2 I 1
I 1 I 2
VLIN = ---------------------- 100%
I 1
1999 Oct 25
28
Philips Semiconductors
Product specification
MGM068
handbook, halfpage
TDA4841PS
MGM069
handbook, halfpage
IVOUT1
VEWDRV
IVOUT2
VHPIN(EWDRV)
I2
I1(1)
t
t
Fig.8
Fig.7 IVOUT1 and IVOUT2 as functions of time.
MGM070
handbook, halfpage
VEWDRV
MGM071
handbook, halfpage
VEWDRV
VHCOR(EWDRV)
VHTRAP(EWDRV)
t
t
1999 Oct 25
29
Philips Semiconductors
Product specification
MGM072
handbook, halfpage
TDA4841PS
MGM073
handbook, halfpage
VASCOR
VEWDRV
Vc(ASCOR)
VHPARAL(ASCOR)
VHSIZE(EWDRV)
VHEHT(EWDRV)
handbook, halfpage
MGM074
VASCOR
Vc(ASCOR)
VHPINBAL(ASCOR)
1999 Oct 25
30
Philips Semiconductors
Product specification
TDA4841PS
Pulse diagrams
1.4 V
inhibited
internal trigger
inhibit window
(typical 4 ms)
vertical blanking pulse
at CLBL (pin 16)
vertical blanking pulse
at HUNLOCK (pin 17)
IVOUT1
differential output currents
VOUT1 (pin 13) and
VOUT2 (pin 12)
IVOUT2
7.0 V maximum
EW drive waveform
at EWDRV (pin 11)
DC shift 3.6 V maximum
low-level 1.2 V fixed
MGM075
1999 Oct 25
31
Philips Semiconductors
Product specification
TDA4841PS
PLL2
control range
MGS275
1999 Oct 25
32
Philips Semiconductors
Product specification
TDA4841PS
MGM077
relative tHDRV(OFF)/tH
(%)
52
45
15
30
110
130 f (kHz)
H
handbook, fullcomposite
pagewidth sync (TTL)
internal integration of
composite sync
internal vertical
trigger pulse
b. Generation of video clamping pulses during vertical sync with serration pulses.
1999 Oct 25
33
Philips Semiconductors
Product specification
TDA4841PS
I2C-BUS PROTOCOL
Data format
The format of data for the I2C-bus is given in Table 4.
Table 4
S(1)
Data format
SLAVE ADDRESS(2)
A(3)
SUBADDRESS(4)
A(3)
DATA(5)
A(3)
P(6)
Notes
1. S = START condition.
2. SLAVE ADDRESS (MAD) = 1000 1100.
3. A = acknowledge, generated by the slave. No acknowledge is given, if the supply voltage is below 8.2 V for start-up
and 8.0 V for shut-down procedure.
4. SUBADDRESS (SAD).
5. DATA byte. If more than 1 byte of DATA is transmitted, then no auto-increment of the significant subaddress is
performed.
6. P = STOP condition.
This mode should be used if many register values have to
be changed subsequently, i.e. during start-up, mode
change, etc., and while there is no picture visible on the
screen (blanked). The number of transmissions per
V-period is not limited.
Buffered mode
Direct mode
Buffered mode.
Direct mode
1999 Oct 25
34
Philips Semiconductors
Product specification
TDA4841PS
CONTROL
BIT
BLKDIS
REGISTER ASSIGNMENT
SAD1 SAD2
(HEX) (HEX) D7 D6 D5 D4 D3 D2 D1 D0
FUNCTION
0: vertical, protection and horizontal unlock
blanking available on pins CLBL and HUNLOCK
0A
8A
D6
0B
8B
D6
0B
8B
D7
02
82
D6
08
88
D7
0F
8F
D6
09
89
D6
09
89
D7
04
84
D6
1A
9A
D0
1A
9A
D1
FHMULT
VSC
MOD
VOVSCN
CLAMP
VBLK
ACD
STDBY(3)
SOFTST(3)
Notes
1. X = dont care.
2. # = this bit is occupied by another function. If the register is addressed, the bit values for both functions must be
transferred.
3. Bits STDBY and SOFTST can be reset by the internal protection circuit.
1999 Oct 25
35
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FUNCTION
REGISTER ASSIGNMENT
SAD1 SAD2
CTRL
(HEX) (HEX) D7 D6 D5 D4 D3 D2 D1 D0 BIT
FUNCTION
TRACKS WITH
36
Horizontal size
HSIZE
01
81
D7 D6 D5 D4 D3 D2 D1 D0
0.1 to 3.6 V
Horizontal position
HPOS
07
87
D7 D6 D5 D4 D3 D2 D1 D0
13% of horizontal
period
Horizontal pincushion
HPIN
0F
8F
D5 D4 D3 D2 D1 D0
0 to 1.42 V
VSIZE, VOVSCN,
VPOS, HSIZE and
HSMOD
Horizontal trapezium
correction
HTRAP
03
83
D5 D4 D3 D2 D1 D0
500 mV (p-p)
VSIZE, VOVSCN,
VPOS, HSIZE and
HSMOD
Horizontal corner
correction at top of
picture
HCORT
04
84
D5 D4 D3 D2 D1 D0
VSC
+15 to 46% of
parabola amplitude
VSIZE, VOVSCN,
VPOS, HSIZE and
HSMOD
Horizontal corner
correction at bottom
of picture
HCORB
02
82
D5 D4 D3 D2 D1 D0
VSC
+15 to 46% of
parabola amplitude
VSIZE, VOVSCN,
VPOS, HSIZE and
HSMOD
Horizontal
parallelogram
HPARAL
09
89
D5 D4 D3 D2 D1 D0
ACD
1.2% of horizontal
period
VSIZE, VOVSCN
and VPOS
EW pin balance
HPINBAL
0B
8B
D5 D4 D3 D2 D1 D0
ACD
1.2% of horizontal
period
VSIZE, VOVSCN
and VPOS
VSIZE
08
88
D6 D5 D4 D3 D2 D1 D0
60 to 100%
VSMOD
Vertical position
VPOS
0D
8D
D6 D5 D4 D3 D2 D1 D0
Vertical gain
VGAIN
0A
8A
Vertical offset
VOFFS
0E
8E
Vertical linearity
VLIN
05
85
Vertical linearity
balance
VLINBAL
05
85
Vertical size
D5 D4 D3 D2 D1 D0
#
D7 D6 D5 D4
#
D3 D2 D1 D0
#
D3 D2 D1 D0
VSC
RANGE
11.5%
VSMOD
70 to 100%
4%
2 to 46%
VSIZE, VOVSCN,
VPOS and VSMOD
1.4% of 100%
vertical size
VSIZE, VOVSCN,
VPOS and VSMOD
Product specification
BITS
TDA4841PS
NAME
Philips Semiconductors
I2C-bus data can be transmitted in direct or buffered mode and is defined by the MSB of the register subaddress:
1999 Oct 25
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BITS
VMOIRE
00
80
D5 D4 D3 D2 D1 D0
MOD 0 to 0.08% of
vertical amplitude
HMOIRE
06
86
D5 D4 D3 D2 D1 D0
Vertical focus
VFOCUS
0E
8E
Horizontal focus
HFOCUS
0C
8C
Horizontal focus
pre-correction
HFOCAD
0C
8C
D7 D6 D5 D4
#
D7 D6
X
X
D4 D3 D2 D1 D0
#
RANGE
0 to 1.1 V
VSIZE, VOVSCN
and VPOS
0 to 3.3 V
300 to 450 ns
Notes
1. X = dont care.
2. # = this bit is occupied by another function. If the register is addressed, the bit values for both functions must be transferred.
Philips Semiconductors
FUNCTION
TRACKS WITH
NAME
37
1999 Oct 25
REGISTER ASSIGNMENT
SAD1 SAD2
CTRL
(HEX) (HEX) D7 D6 D5 D4 D3 D2 D1 D0 BIT
FUNCTION
Product specification
TDA4841PS
Philips Semiconductors
Product specification
TDA4841PS
Start-up procedure
VCC < 8.3 V:
START
L1
no acknowledge is given by IC
all register contents are random
L2
STDBY = 1
SOFTST = 0
all other register contents are random
8CH
1AH
00H
A P
STDBY = 0
SOFTST = 0
all other register contents are random
8CH
SAD
DATA
A P
STDBY = 0
SOFTST = 0
registers are pre-set
no
yes
S
8CH
1AH
02H
L3
A P
STDBY = 0
SOFTST = 1
IC in full operation:
STDBY = 0
SOFTST = 1
no
change/refresh of data?
SOFTST = 0?
yes
S
8CH
SAD
no
yes
DATA
A P
L4 (1)
Soft-down sequence:
MGL791
1999 Oct 25
38
Philips Semiconductors
Product specification
TDA4841PS
L4
8CH
1AH
00H
A P
Protection mode:
STDBY = 0
SOFTST = 0
STDBY = 0
SOFTST = 0
registers are set
no
STDBY = 1?
no
SOFTST = 1?
yes
yes
L3 (1)
8CH
1AH
01H
A P
STDBY = 1
SOFTST = 0
all other register contents are random
L2 (1)
MGL790
1999 Oct 25
39
Philips Semiconductors
Product specification
TDA4841PS
(ANY Mode)
VCC < 8.1 V
Power-Down Mode
VCC
no acknowledge is given by IC
all register contents are random
8.6 V
8.1 V
VCC
8.6 V
8.1 V
L1 (1)
MGM079
Power-down mode
Power dip of VCC < 8.6 V:
Normal operation
I2C-bus transmission
chip address
8CH
subaddress
A
0XH
data
A
XXH
acknowledge was
given on data?
no
I2C-bus transmission
chip address
S
yes
8CH
subaddress
A
0XH
data
A
XXH
acknowledge was
given on data?
no
Standby mode
MGS276
1999 Oct 25
40
Philips Semiconductors
Product specification
TDA4841PS
MGM082
VCC
8.3 V
3.5 V
time
a. Start-up sequence.
MGM083
VCC
8.6 V continuous blanking (pin 16 and 17) activated
PLL2 soft-down sequence is triggered(2)
8.1 V
3.5 V
time
b. Shut-down sequence.
1999 Oct 25
41
Philips Semiconductors
Product specification
TDA4841PS
MHB495
VHPLL2
4.6 V continuous blanking off
PLL2 enabled
frequency detector enabled
HDRV/HFLB protection enabled
BDRV duty cycle has reached nominal value
cl
e
in
cr
ea
se
s
4.0 V
du
ty
cy
3.2 V
1.8 V
1.0 V
time
MHB496
VHPLL2
ty
du
e
cl
cy
e
cr
de
2.8 V
es
as
BDRV floating
HDRV duty cycle begins to decrease(1)
1.8 V
HDRV floating
time
(1) Pins HDRV and BDRV are floating for VCC < 8.6 V.
Fig.23 Activation of PLL2 soft-start and soft-down sequences via the I2C-bus.
1999 Oct 25
42
Philips Semiconductors
Product specification
TDA4841PS
VXRAY
VHUNLOCK
floating
floating
VOUT1, VOUT2
floating
approximately 25 ms
1999 Oct 25
43
MGM087
Philips Semiconductors
Product specification
TDA4841PS
APPLICATION INFORMATION
VCC
Vi
2 VHDRV
VHPLL2
R6(1)
6
SOFT START
S
3 VBDRV
D2
OTA
2.5 V
TR1
R
INVERTING
BUFFER
HORIZONTAL
OUTPUT
STAGE
DISCHARGE
1 horizontal
flyback pulse
D1
VBIN
VBOP
4
R5
4 VBSENS
R1
R4
C4
C1
R2
C2
R3
MGM080
CBOP
>10 nF
EWDRV
For f < 50 kHz and C2 < 47 nF calculation formulas and behaviour of the OTA are the same as for an OP. An exception is the limited output current at
BOP (pin 3). See Chapter Characteristics, subheading B+ control section; see Figs 25 and 26.
(1) The recommended value for R6 is 1 k.
1 horizontal
flyback pulse
2 VHDRV
ton
3 VBDRV
td(BDRV)
toff(min)
VBSENS = VBOP
VRESTART(BSENS)
4 VBSENS
VSTOP(BSENS)
MBG600
1999 Oct 25
44
Philips Semiconductors
Product specification
TDA4841PS
VCC
2 VHDRV
VHPLL2
horizontal
flyback pulse
1
R4(1)
6
INVERTING
BUFFER
SOFT START
S
OTA
2.5 V
3 VBDRV
HORIZONTAL
OUTPUT
STAGE
EHT
transformer
D2
5 IMOSFET
DISCHARGE
5
EHT adjustment
R1
TR1
VBOP
R2
VBIN
R3
D1
4 VBSENS
C1
CBSENS
MGM081
TR2
power-down
>2 nF
CBOP > 10 nF
(1) The recommended value for R4 is 1 k.
handbook,
pagewidth
1 full
horizontal
flyback pulse
2 VHDRV
ton
3 VBDRV
toff
td(BDRV)
VBOP
VBOP
4 VBSENS
VRESTART(BSENS)
VSTOP(BSENS)
5 IMOSFET
MBG602
1999 Oct 25
45
Philips Semiconductors
Product specification
TDA4841PS
handbook, halfpage
I
VOUT
(A)
(1)
MBG551
+415
I1(2)
I2(3)
I3(4)
415
VVCAP
I1 I3
Which means: I 0 = -------------2
I2 I3
I1 I2
Vertical linearity error = 1 max -------------- or --------------
I0
I0
H-focus pre-correction
handbook, halfpage
(1)
(2)
MGS282
t precor = 450 ns
t precor = 300 ns
1999 Oct 25
46
Philips Semiconductors
Product specification
TDA4841PS
17
18
19
20
22
23
24
25
external components of
vertical section
26
27
28
29
30
31
32
external components of
horizontal section
21
external components of
horizontal section
100 F
47 pF
12 V
external components
of driver stages
MHB605
SMD
For optimum performance of the TDA4841PS the ground paths must be routed as shown.
Only one connection to other grounds on the PCB is allowed.
Note: The tracks for HDRV and BDRV should be kept separate.
1999 Oct 25
47
16
15
14
13
12
10
11
TDA4841PS
2 nF
47 nF
Philips Semiconductors
Product specification
TDA4841PS
SYMBOL
INTERNAL CIRCUIT
HFLB
1.5 k
1
7x
MBG561
XRAY
5 k
2
6.25 V
MBG562
BOP
5.3 V
MBG563
BSENS
MBG564
1999 Oct 25
48
Philips Semiconductors
Product specification
SYMBOL
TDA4841PS
INTERNAL CIRCUIT
BIN
5
MBG565
BDRV
6
MBG566
PGND
HDRV
MGM089
XSEL
4 k
9
MBK381
10
VCC
10
MGM090
11
EWDRV
108
11
108
MBG570
1999 Oct 25
49
Philips Semiconductors
Product specification
13
14
SYMBOL
TDA4841PS
INTERNAL CIRCUIT
VOUT2
12
MBG571
13
MBG572
VOUT1
VSYNC
100
1.4 V
14
2 k
7.3 V
MBG573
15
HSYNC
1.28 V
85
1.4 V
15
7.3 V
MBG574
16
CLBL
16
MBG575
1999 Oct 25
50
Philips Semiconductors
Product specification
SYMBOL
TDA4841PS
INTERNAL CIRCUIT
HUNLOCK
17
MGM091
18
SCL
18
MGM092
19
SDA
19
MGM093
20
ASCOR
480
20
MGM094
21
VSMOD
250
21
5V
MGM095
1999 Oct 25
51
Philips Semiconductors
Product specification
SYMBOL
TDA4841PS
INTERNAL CIRCUIT
VAGC
22
MBG581
23
VREF
23
3V
MBG582
24
VCAP
24
MBG583
25
SGND
26
HPLL1
signal ground
26
4.3 V
MGM096
27
HBUF
27
5V
MGM097
1999 Oct 25
52
Philips Semiconductors
Product specification
SYMBOL
28
HREF
29
HCAP
TDA4841PS
INTERNAL CIRCUIT
76
2.525 V
28
7.7 V
29
MBG585
30
HPLL2
7.7 V
30
HFLB
6.25 V
MGM098
1999 Oct 25
53
Philips Semiconductors
Product specification
SYMBOL
TDA4841PS
INTERNAL CIRCUIT
HSMOD
250
5V
31
MGM099
32
FOCUS
120
32
200
120
MGM100
pin
7.3 V
pin
7.3 V
MBG559
MBG560
1999 Oct 25
54
Philips Semiconductors
Product specification
TDA4841PS
PACKAGE OUTLINE
SDIP32: plastic shrink dual in-line package; 32 leads (400 mil)
SOT232-1
ME
seating plane
A2 A
A1
c
e
(e 1)
w M
b1
MH
b
17
32
pin 1 index
E
16
10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
min.
A2
max.
b1
D (1)
E (1)
e1
ME
MH
Z (1)
max.
mm
4.7
0.51
3.8
1.3
0.8
0.53
0.40
0.32
0.23
29.4
28.5
9.1
8.7
1.778
10.16
3.2
2.8
10.7
10.2
12.2
10.5
0.18
1.6
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
EIAJ
ISSUE DATE
92-11-17
95-02-04
SOT232-1
1999 Oct 25
EUROPEAN
PROJECTION
55
Philips Semiconductors
Product specification
TDA4841PS
SOLDERING
Introduction to soldering through-hole mount
packages
Manual soldering
Apply the soldering iron (24 V or less) to the lead(s) of the
package, either below the seating plane or not more than
2 mm above it. If the temperature of the soldering iron bit
is less than 300 C it may remain in contact for up to
10 seconds. If the bit temperature is between
300 and 400 C, contact may be up to 5 seconds.
Suitability of through-hole mount IC packages for dipping and wave soldering methods
SOLDERING METHOD
PACKAGE
DIPPING
DBS, DIP, HDIP, SDIP, SIL
WAVE
suitable(1)
suitable
Note
1. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
1999 Oct 25
56
Philips Semiconductors
Product specification
TDA4841PS
DEFINITIONS
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
PURCHASE OF PHILIPS I2C COMPONENTS
Purchase of Philips I2C components conveys a license under the Philips I2C patent to use the
components in the I2C system provided the system conforms to the I2C specification defined by
Philips. This specification can be ordered using the code 9398 393 40011.
1999 Oct 25
57
Philips Semiconductors
Product specification
1999 Oct 25
58
TDA4841PS
Philips Semiconductors
Product specification
1999 Oct 25
59
TDA4841PS
Internet: http://www.semiconductors.philips.com
SCA 68
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
545004/01/pp60
Oct 25