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bq27520-G4
SLUSB20B NOVEMBER 2012 REVISED DECEMBER 2015
Applications
Smartphones, Feature Phones, and Tablets
Digital Still and Video Cameras
Handheld Terminals
MP3 or Multimedia Players
Description
The Texas Instruments bq27520-G4 system-side LiIon battery fuel gauge is a microcontroller peripheral
that provides fuel gauging for single-cell Li-Ion battery
packs.
The
device
requires
little
system
microcontroller firmware development. The fuel
gauge resides on the main board of the system and
manages an embedded battery (non-removable) or a
removable battery pack.
The fuel gauge uses the patented Impedance
Track algorithm for fuel gauging, and provides
information such as remaining battery capacity
(mAh), state-of-charge (%), run-time to empty
(minimum), battery voltage (mV), temperature (C),
and state of health (%).
Battery fuel gauging requires only PACK+ (P+),
PACK (P), and optional Thermistor (T) connections
to a removable battery pack or embedded battery
circuit. The device uses a 15-ball NanoFree
(DSBGA) package in the nominal dimensions of 2610
1956 m with 0.5-mm lead pitch. It is ideal for
space-constrained applications.
Device Information (1)
PART NUMBER
bq27520-G4
(1)
PACKAGE
DSBGA (15)
Power
Management
Controller
I2C
LDO
PACK+
Battery
Low
Voltage
Sense
DATA
Temp
Sense
BAT_GD
PROTECTION
IC
PACK-
FETs
CHG
DSG
Current
Sense
SOC_INT
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
bq27520-G4
SLUSB20B NOVEMBER 2012 REVISED DECEMBER 2015
www.ti.com
Table of Contents
1
2
3
4
5
6
7
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Device Comparison Table.....................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
4
5
7.1
7.2
7.3
7.4
7.5
7.6
7.7
7.8
7.9
7.10
5
5
5
5
6
6
6
6
6
7
7
7
8
Overview .................................................................
Functional Block Diagram .......................................
Feature Description.................................................
Device Functional Modes........................................
Programming...........................................................
10
11
12
12
17
11 Layout................................................................... 26
11.1 Layout Guidelines ................................................. 26
11.2 Layout Example .................................................... 27
28
28
28
28
28
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision A (August 2013) to Revision B
Page
Deleted minimum and maximum values for Power-on reset hysteresis ................................................................................ 6
Added Device Information table, ESD Ratings table, Feature Description section, Device Functional Modes,
Programming section, Application and Implementation section, Power Supply Recommendations section, Device
and Documentation Support section, and Mechanical, Packaging, and Orderable Information. ......................................... 12
Page
bq27520-G4
www.ti.com
PACKAGE (2)
TA
COMMUNICATION
FORMAT
DSBGA-15
40C to 85C
I2C (1)
bq27520-G4
SLUSB20B NOVEMBER 2012 REVISED DECEMBER 2015
www.ti.com
(TOP VIEW)
B3
C3
D3
E3
E3
D3
C3
B3
A3
A2
B2
C2
D2
E2
E2
D2
C2
B2
A2
A1
B1
C1
D1
E1
E1
D1
C1
B1
A1
A3
(BOTTOM VIEW)
xx
xx
Pin A1
Index Area
DIM
MIN
TYP
MAX
2580
2610
2640
1926
1956
1986
UNITS
m
Pin Functions
PIN
NAME
NUMBER
TYPE (1)
DESCRIPTION
BAT
E2
Cell-voltage measurement input. ADC input. Recommend 4.8 V maximum for conversion
accuracy.
BAT_GD
B2
Battery Good push-pull indicator output. Active low and output disabled by default. Polarity
is configured via Op Config [BATG_POL] and the output is enabled via OpConfig C
[BATGSPUEN].
BAT_LOW
C3
Battery Low push-pull output indicator. Active high and output enabled by default. Polarity is
configured via Op Config [BATL_POL] and the output is enabled via OpConfig C
[BATLSPUEN].
BI/TOUT
E3
IO
Battery-insertion detection input. Power pin for pack thermistor network. Thermistormultiplexer control pin. Use with pullup resistor >1 M (1.8 M, typical).
CE
D2
Chip Enable. Internal LDO is disconnected from REGIN when driven low.
Note: CE has an internal ESD protection diode connected to REGIN. Recommend
maintaining VCE VREGIN under all conditions.
REGIN
E1
SCL
A3
Slave I2C serial communications clock input line for communication with system (Master).
Open-drain IO. Use with 10-k pullup resistor (typical).
SDA
B3
IO
Slave I2C serial communications data line for communication with system (Master). Opendrain IO. Use with 10-k pullup resistor (typical).
SOC_INT
A2
SOC state interrupts output. Generates a pulse under the conditions specified in the
bq27520-G4 Technical Reference Manual, SLUUA35. Open drain output.
SRN
B1
IA
Analog input pin connected to the internal coulomb counter with a Kelvin connection where
SRN is nearest the VSS connection. Connect to 5-m to 20-m sense resistor.
SRP
A1
IA
Analog input pin connected to the internal coulomb counter with a Kelvin connection where
SRP is nearest the PACK connection. Connect to 5-m to 20-m sense resistor.
TS
D3
IA
VCC
D1
Regulator output and bq27520-G4 processor power. Decouple with 1-F ceramic capacitor
to VSS.
VSS
C1, C2
Device ground
(1)
bq27520-G4
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7 Specifications
7.1 Absolute Maximum Ratings (1)
over operating free-air temperature range (unless otherwise noted)
VREGIN
Regulator input
MIN
MAX
UNIT
0.3
5.5
0.3
6.0
(2)
VCE
CE input pin
0.3
VREGIN + 0.3
VCC
Supply voltage
0.3
2.75
VIOD
0.3
5.5
VBAT
0.3
5.5
0.3
VI
0.3
TA
Tstg
Storage temperature
(1)
(2)
6.0
(2)
VCC + 0.3
40
85
65
150
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
Condition not to exceed 100 hours at 25C lifetime.
Electrostatic discharge
(1)
2000
Pin E2
1500
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
VREGIN
Supply voltage
CREGIN
CLDO25
tPUCD
No flash writes
Nominal capacitor values specified.
Recommend a 5% ceramic X5Rtype capacitor located close to the
device.
NOM
MAX
2.8
4.5
2.45
2.8
0.47
UNIT
V
0.1
250
ms
(1)
YZF (DSBGA)
UNIT
15 PINS
RJA
70
C/W
RJC(top)
17
C/W
RJB
20
C/W
JT
C/W
JB
18
C/W
RJC(bot)
NA
C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
bq27520-G4
SLUSB20B NOVEMBER 2012 REVISED DECEMBER 2015
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ICC
ISLP+
(1)
TEST CONDITIONS
TYP
MAX
UNIT
118
62
23
ISLP
(1)
IHIB
(1)
(1)
MIN
TEST CONDITIONS
MIN
VOL
IOL = 3 mA
VOH(PP)
IOH = 1 mA
VOH(OD)
VIL(CE)
VIH(CE)
Ilkg
(1)
(1)
UNIT
V
VCC 0.5
VIH
MAX
0.4
VIL
TYP
V
VCC 0.5
0.3
0.6
0.3
0.6
1.2
BAT INSERT CHECK mode active
1.2
VCC + 0.3
0.8
2.65
0.3
V
V
V
A
VHYS
MIN
TYP
MAX
2.05
2.15
2.20
115
UNIT
V
mV
TEST CONDITIONS
MIN
TYP
MAX
2.3
2.5
2.6
2.3
UNIT
V
V
LDO output current, IOUT, is the total load current. LDO regulator should be used to power internal fuel gauge only.
MIN
TYP
MAX
UNIT
fOSC
8.389
MHz
fLOSC
32.768
kHz
bq27520-G4
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TEST CONDITIONS
MIN
TYP
MAX
UNIT
VADC1
VSS 0.125
VADC2
VSS 0.125
VIN(ADC)
0.05
GTEMP
tADC_CONV
Conversion time
Resolution
VOS(ADC)
(1)
ZADC2
(1)
Ilkg(ADC)
(1)
ms
15
bits
ZADC1
(1)
125
14
Input offset
V
mV/C
mV
8
Device not measuring cell voltage
M
100
0.3
TEST CONDITIONS
VSR
tSR_CONV
Conversion time
Single conversion
Resolution
Input offset
INL
Ilkg(SR)
(1)
(1)
MAX
UNIT
0.125
s
15
bits
V
10
0.007
(1)
TYP
14
VOS(SR)
ZIN(SR)
MIN
0.125
0.034
% FSR
2.5
0.3
(1)
Data retention
Flash-programming write cycles (1)
tWORDPROG
(1)
ICCPROG
(1)
tDFERASE
tIFERASE
(1)
tPGERASE
(1)
(1)
(1)
MIN
TYP
MAX
UNIT
10
Years
20,000
Cycles
ms
10
mA
200
ms
200
ms
20
ms
bq27520-G4
SLUSB20B NOVEMBER 2012 REVISED DECEMBER 2015
www.ti.com
NOM
MAX
UNIT
tr
300
ns
tf
300
ns
tw(H)
600
ns
tw(L)
1.3
tsu(STA)
600
ns
td(STA)
600
ns
tsu(DAT)
100
ns
th(DAT)
ns
tsu(STOP)
t(BUF)
fSCL
Clock frequency
(1)
600
ns
66
(1)
400
kHz
If the clock frequency (fSCL) is > 100 kHz, use 1-byte write commands for proper operation. All other transactions types are supported at
400 kHz. (See I2C Interface and I2C Command Waiting Time).
bq27520-G4
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VREGIN = 2.7 V
VREGIN = 4.5 V
2.6
2.65
2.55
2.5
2.45
2.4
2.35
8.7
8.6
8.5
8.4
8.3
8.2
8.1
8
-40
Temperature (qC)
-20
20
40
Temperature (qC)
D001
34
33.5
33
32.5
32
31.5
31
30.5
30
-40
-20
20
40
Temperature (qC)
60
80
100
100
D002
3
2
1
0
-1
-2
-3
-4
-5
-30
-20
D003
80
60
-10
10
20
30
Temperature (qC)
40
50
60
D004
bq27520-G4
SLUSB20B NOVEMBER 2012 REVISED DECEMBER 2015
www.ti.com
8 Detailed Description
8.1 Overview
The bq27520-G4 fuel gauge accurately predicts the battery capacity and other operational characteristics of a
single Li-based rechargeable cell. It can be interrogated by a system processor to provide cell information, such
as time-to-empty (TTE), state-of-charge (SOC), and SOC interrupt signal to the host.
Information is accessed through a series of commands, called Standard Commands. Further capabilities are
provided by the additional Extended Commands set. Both sets of commands, indicated by the general format
Command( ), are used to read and write information contained within the device control and status registers, as
well as its data flash locations. Commands are sent from system to gauge using the I2C serial communications
engine, and can be executed during application development, system manufacture, or end-equipment operation.
Cell information is stored in the device in non-volatile flash memory. Many of these data flash locations are
accessible during application development. They cannot generally be accessed directly during end-equipment
operation. Access to these locations is achieved by either use of the companion evaluation software, through
individual commands, or through a sequence of data-flash-access commands. To access a desired data flash
location, the correct data flash subclass and offset must be known.
The key to the high-accuracy gas gauging prediction is Texas Instruments proprietary Impedance Track
algorithm. This algorithm uses cell measurements, characteristics, and properties to create state-of-charge
predictions that can achieve less than 1% error across a wide variety of operating conditions and over the
lifetime of the battery.
The fuel gauge measures charge and discharge activity by monitoring the voltage across a small-value series
sense resistor (5 m to 20 m, typical) located between the system VSS and the battery PACK terminal. When
a cell is attached to the device, cell impedance is learned based on cell current, cell open-circuit voltage (OCV),
and cell voltage under loading conditions.
The external temperature sensing is optimized with the use of a high-accuracy negative temperature coefficient
(NTC) thermistor with R25 = 10.0 k 1%. B25/85 = 3435K 1% (such as Semitec NTC 103AT). Alternatively,
the fuel gauge can also be configured to use its internal temperature sensor or receive temperature data from the
host processor. When an external thermistor is used, a 18.2-k pullup resistor between the BI/TOUT and TS
pins is also required. The fuel gauge uses temperature to monitor the battery-pack environment, which is used
for fuel gauging and cell protection functionality.
To minimize power consumption, the device has different power modes: NORMAL, SNOOZE, SLEEP,
HIBERNATE, and BAT INSERT CHECK. The fuel gauge automatically changes modes depending upon the
occurrence of specific events, though a system processor can initiate some of these modes directly.
For complete operational details, see bq27520-G4 Technical Reference Manual, SLUUA35.
NOTE
The following formatting conventions are used in this document:
Commands: italics with parentheses( ) and no breaking spaces, for example, Control( ).
Data Flash: italics, bold, and breaking spaces, for example, Design Capacity.
Register bits and flags: italics with brackets [ ], for example, [TDA]
Data flash bits: italics, bold, and brackets [ ], for example, [LED1]
Modes and states: ALL CAPITALS, for example, UNSEALED mode.
10
bq27520-G4
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REGIN
LDO
POR
2.5 V
VCC
HFO
BAT
CC
HFO
SRN
LFO
HFO/128
4R
HFO/128
SRP
MUX
ADC
Wake
Comparator
TS
Internal
Temp
Sensor
BI/TOUT
HFO/4
SDA
SOCINT
22
I2C Slave
Engine
Instruction
ROM
22
CPU
VSS
SCL
I/O
Controller
Instruction
FLASH
BAT_LOW
8
Wake
and
Watchdog
Timer
GP Timer
and
PWM
BAT_GD
Data
SRAM
Data
FLASH
11
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SLUSB20B NOVEMBER 2012 REVISED DECEMBER 2015
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bq27520-G4
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13
bq27520-G4
SLUSB20B NOVEMBER 2012 REVISED DECEMBER 2015
www.ti.com
POR
Entry To NORMAL
Flags [BAT_DET] = 1
NORMAL
Entry To SLEEP+
Operation Configuration [SLEEP] = 1
AND
CONTROL_STAUS [SNOOZE] = 1]
AND
AverageCurrent ( ) < Sleep Current
Flags [BAT_DET] = 0
SLEEP+
Entry To SLEEP+
Operation Configuration [SLEEP] = 1
AND
AverageCurrent ( ) < Sleep Current
AND
CONTROL_STAUS [SNOOZE] = 0
Entry to SLEEP+
CONTROL_STATUS [SNOOZE] = 1
Entry to SLEEP
CONTROL_STATUS [SNOOZE] = 0
SLEEP
Fuel gauging and data
updated every 20 seconds.
(LFO ON and HFO OFF)
To WAIT_HIBERNATE
System Sleep
14
bq27520-G4
www.ti.com
Entry To NORMAL
Flags [BAT_DET] = 1
Flags [BAT_DET] = 0
NORMAL
Fuel gauging and data
updated every second.
HIBERNATE
To SLEEP
WAIT_HIBERNATE
Exit From WAIT_HIBERNATE
Cell relaxed
AND
AverageCurrent () < Hibernate
Current
OR
Cell relaxed
AND
VCELL < Hibernate Voltage
System Shutdown
Figure 7. Power Mode DiagramSystem Shutdown
15
bq27520-G4
SLUSB20B NOVEMBER 2012 REVISED DECEMBER 2015
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16
bq27520-G4
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8.5 Programming
8.5.1 Standard Data Commands
The fuel gauge uses a series of 2-byte standard commands to enable system reading and writing of battery
information. Each standard command has an associated command-code pair, as indicated in Table 1. Because
each command consists of two bytes of data, two consecutive I2C transmissions must be executed both to
initiate the command function and to read or write the corresponding two bytes of data. Additional options for
transferring data are described in Extended Data Commands. Read and write permissions depend on the active
access mode, SEALED or UNSEALED. For details, see bq27520-G4 Technical Reference Manual, SLUUA35.
See Communications for I2C details.
Table 1. Standard Commands
COMMAND CODE
UNIT
SEALED
ACCESS
CNTL
NA
RW
RW
NAME
Control( )
AtRate( )
AR
mA
AtRateTimeToEmpty( )
ARTTE
Minutes
Temperature( )
TEMP
0.1K
RW
Voltage( )
VOLT
mV
FLAGS
NA
NominalAvailableCapacity( )
NAC
mAh
FullAvailableCapacity( )
FAC
mAh
RemainingCapacity( )
RM
mAh
FullChargeCapacity( )
FCC
mAh
AI
mA
TTE
Minutes
SI
mA
StandbyTimeToEmpty( )
STTE
Minutes
StateOfHealth( )
SOH
% / num
CC
num
SOC
mA
0.1K
Flags( )
AverageCurrent( )
TimeToEmpty( )
StandbyCurrent( )
CycleCount( )
StateOfCharge( )
InstantaneousCurrent( )
InternalTemperature( )
INTTEMP
ResistanceScale( )
OperationConfiguration( )
Op Config
NA
mAh
UFRM
mAh
FRM
mAh
UFFCC
mAh
FFCC
mAh
UFSOC
DesignCapacity( )
UnfilteredRM( )
FilteredRM( )
UnfilteredFCC( )
FilteredFCC( )
TrueSOC( )
17
bq27520-G4
SLUSB20B NOVEMBER 2012 REVISED DECEMBER 2015
www.ti.com
COMMAND
CODE
UNIT
SEALED
ACCESS (1) (2)
UNSEALED
ACCESS (1) (2)
0x34 to 0x3D
NA
DataFlashClass( )
(2)
0x3E
NA
NA
RW
DataFlashBlock( )
(2)
0x3F
NA
RW
RW
0x40 to 0x5F
NA
RW
BlockDataCheckSum( )
0x60
NA
RW
RW
BlockDataControl( )
0x61
NA
NA
RW
ApplicationStatus( )
0x6A
NA
0x6B to 0x7F
NA
BlockData( )
Reserved
(1)
(2)
SEALED and UNSEALED states are entered via commands to Control( ) 0x00 and 0x01.
In sealed mode, data flash cannot be accessed through commands 0x3E and 0x3F.
8.5.3 Communications
8.5.3.1 I2C Interface
The bq27520-G4 fuel gauge supports the standard I2C read, incremental read, quick read, one byte write, and
incremental write functions. The 7-bit device address (ADDR) is the most significant 7 bits of the hex address
and is fixed as 1010101. The first 8-bits of the I2C protocol is, therefore, 0xAA or 0xAB for write or read,
respectively.
Host generated
S
ADDR[6:0]
0 A
Gauge generated
CMD [7:0]
DATA [7:0]
A P
ADDR[6:0]
ADDR[6:0]
0 A
1 A
DATA [7:0]
N P
A Sr
ADDR[6:0]
1 A
DATA [7:0]
N P
ADDR[6:0]
0 A
CMD [7:0]
A Sr
ADDR[6:0]
1 A
DATA [7:0]
A ...
DATA [7:0]
N P
ADDR[6:0]
0 A
CMD[7:0]
DATA [7:0]
DATA [7:0]
...
A P
Figure 8. I2C Read, Incremental Read, Quick Read, One Byte Write, and Incremental Write Functions
The quick read returns data at the address indicated by the address pointer. The address pointer, a register
internal to the I2C communication engine, increments whenever data is acknowledged by the fuel gauge or the
I2C master. Quick writes function in the same manner and are a convenient means of sending multiple bytes to
consecutive command locations (such as two-byte commands that require two bytes of data).
The following command sequences are not supported:
Attempt to write a read-only address (NACK after data sent by master):
18
bq27520-G4
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ADDR [6:0]
0 A
CMD [7:0]
DATA [7:0]
A P
66ms
ADDR [6:0]
0 A
CMD [7:0]
DATA [7:0]
A P
66ms
ADDR [6:0]
0 A
CMD [7:0]
A Sr
ADDR [6:0]
1 A
DATA [7:0]
DATA [7:0]
N P
66ms
N P
66ms
Waiting time inserted between two 1-byte write packets for a subcommand and reading results
(required for 100 kHz < fSCL 400 kHz)
ADDR [6:0]
0 A
CMD [7:0]
DATA [7:0]
ADDR [6:0]
0 A
CMD [7:0]
A Sr
ADDR [6:0]
A
1 A
DATA [7:0]
DATA [7:0]
A P
A
66ms
DATA [7:0]
Waiting time inserted between incremental 2-byte write packet for a subcommand and reading results
(acceptable for fSCL 100 kHz)
ADDR [6:0]
DATA [7:0]
0 A
A
CMD [7:0]
DATA [7:0]
A Sr
N P
ADDR [6:0]
1 A
DATA [7:0]
DATA [7:0]
66ms
19
bq27520-G4
SLUSB20B NOVEMBER 2012 REVISED DECEMBER 2015
www.ti.com
APPROXIMATE
DURATION
SLEEP
HIBERNATE
Clock stretch occurs at the beginning of all traffic as the device wakes up.
BAT INSERT
CHECK,
NORMAL,
SNOOZE
Clock stretch occurs within the packet for flow control (after a start bit, ACK or first data bit).
100 s
24 ms
20
5 ms
72 ms
116 ms
144 ms
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21
bq27520-G4
SLUSB20B NOVEMBER 2012 REVISED DECEMBER 2015
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U1
BQ27520
Figure 12. bq27520-G4 System-Side Li-Ion Battery Fuel Gauge Typical Application Schematic
22
bq27520-G4
www.ti.com
DEFAULT
UNIT
RECOMMENDED SETTING
Design Capacity
1000
mAh
Set based on the nominal pack capacity as interpreted from cell manufacturer's
datasheet. If multiple parallel cells are used, should be set to N Cell Capacity.
Reserve Capacity-mAh
mAh
Set to desired runtime remaining (in seconds / 3600) typical applied load
between reporting 0% SOC and reaching Terminate Voltage, if needed.
Should be configured using TI-supplied Battery Management Studio software.
Default open-circuit voltage and resistance tables are also updated in
conjunction with this step. Do not attempt to manually update reported Device
Chemistry as this does not change all chemistry information! Always update
chemistry using the appropriate software tool (that is, bqStudio).
Set to 10 to convert all power values to cWh or to 1 for mWh. Design Energy
is divided by this value.
Chem ID
0100
hex
Load Mode
Set to applicable load model, 0 for constant current or 1 for constant power.
Load Select
Set to load profile which most closely matches typical system load.
Qmax Cell 0
1000
mAh
Set to initial configured value for Design Capacity. The gauge will update this
parameter automatically after the optimization cycle and for every regular
Qmax update thereafter.
4200
mV
Set to nominal cell voltage for a fully charged cell. The gauge will update this
parameter automatically each time full charge termination is detected.
Terminate Voltage
3200
mV
Ra Max Delta
44
Charging Voltage
4200
mV
Set based on nominal charge voltage for the battery in normal conditions
(25C, etc). Used as the reference point for offsetting by Taper Voltage for full
charge termination detection.
Taper Current
100
mA
Set to the nominal taper current of the charger + taper current tolerance to
ensure that the gauge will reliably detect charge termination.
Taper Voltage
100
mV
Sets the voltage window for qualifying full charge termination. Can be set
tighter to avoid or wider to ensure possibility of reporting 100% SOC in outer
JEITA temperature ranges that use derated charging voltage.
60
mA
Sets threshold for gauge detecting battery discharge. Should be set lower than
minimal system load expected in the application and higher than Quit Current.
75
mA
Sets the threshold for detecting battery charge. Can be set higher or lower
depending on typical trickle charge current used. Also should be set higher
than Quit Current.
Quit Current
40
mA
Sets threshold for gauge detecting battery relaxation. Can be set higher or
lower depending on typical standby current and exhibited in the end system.
299
mA
1131
mW
Sleep Current
15
mA
Sets the threshold at which the fuel gauge enters SLEEP mode. Take care in
setting above typical standby currents else entry to SLEEP may be
unintentionally blocked.
Submit Documentation Feedback
23
bq27520-G4
SLUSB20B NOVEMBER 2012 REVISED DECEMBER 2015
www.ti.com
DEFAULT
UNIT
RECOMMENDED SETTING
CC Gain
10
CC Delta
10
CC Offset
1418
Counts
Board Offset
Counts
Pack V Offset
mV
24
bq27520-G4
www.ti.com
VREGIN = 2.7 V
VREGIN = 4.5 V
2.6
2.65
2.55
2.5
2.45
2.4
2.35
8.7
8.6
8.5
8.4
8.3
8.2
8.1
8
-40
Temperature (qC)
-20
20
40
Temperature (qC)
D001
34
33.5
33
32.5
32
31.5
31
30.5
30
-40
-20
20
40
Temperature (qC)
60
80
100
100
D002
3
2
1
0
-1
-2
-3
-4
-5
-30
-20
D003
80
60
-10
10
20
30
Temperature (qC)
40
50
60
D004
25
bq27520-G4
SLUSB20B NOVEMBER 2012 REVISED DECEMBER 2015
www.ti.com
11 Layout
11.1 Layout Guidelines
11.1.1 Sense Resistor Connections
Kelvin connections at the sense resistor are just as critical as those for the battery terminals themselves. The
differential traces should be connected at the inside of the sense resistor pads and not anywhere along the highcurrent trace path to prevent false increases to measured current that could result when measuring between the
sum of the sense resistor and trace resistance between the tap points. In addition, the routing of these leads
from the sense resistor to the input filter network and finally into the SRP and SRN pins needs to be as closely
matched in length as possible else additional measurement offset could occur. It is further recommended to add
copper trace or pour-based "guard rings" around the perimeter of the filter network and coulomb counter inputs to
shield these sensitive pins from radiated EMI into the sense nodes. This prevents differential voltage shifts that
could be interpreted as real current change to the fuel gauge. All of the filter components need to be placed as
close as possible to the coulomb counter input pins.
11.1.2 Thermistor Connections
The thermistor sense input should include a ceramic bypass capacitor placed as close to the TS input pin as
possible. The capacitor helps to filter measurements of any stray transients as the voltage bias circuit pulses
periodically during temperature sensing windows.
11.1.3 High-Current and Low-Current Path Separation
For best possible noise performance, it is extremely important to separate the low-current and high-current loops
to different areas of the board layout. The fuel gauge and all support components should be situated on one side
of the boards and tap off of the high-current loop (for measurement purposes) at the sense resistor. Routing the
low-current ground around instead of under high-current traces will further help to improve noise rejection.
26
bq27520-G4
www.ti.com
SCL
To system host
processor
SDA
BAT_LOW
BATTERY PACK
CONNECTOR
BAT_GD
C1
PACK+
C2
BI/TOUT
BAT
REGIN
C3
THERM
CE
VCC
VSS
VSS
SDA
BAT_GD
SRN
SCL
SOC_INT
SRP
TS
BAT_LOW
SOC_INT
PACK
10 m 1%
Ground return to
system
27
bq27520-G4
SLUSB20B NOVEMBER 2012 REVISED DECEMBER 2015
www.ti.com
12.3 Trademarks
Impedance Track, NanoFree, E2E are trademarks of Texas Instruments.
All other trademarks are the property of their respective owners.
12.5 Glossary
SLYZ022 TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
28
www.ti.com
9-Sep-2014
PACKAGING INFORMATION
Orderable Device
Status
(1)
Eco Plan
Lead/Ball Finish
(2)
(6)
(3)
Op Temp (C)
Device Marking
(4/5)
BQ27520YZFR-G4
ACTIVE
DSBGA
YZF
15
3000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 85
BQ27520
BQ27520YZFT-G4
ACTIVE
DSBGA
YZF
15
250
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 85
BQ27520
(1)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 1
Samples
www.ti.com
9-Sep-2014
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
17-Jun-2015
Device
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
BQ27520YZFR-G4
DSBGA
YZF
15
3000
180.0
8.4
BQ27520YZFR-G4
DSBGA
YZF
15
3000
178.0
BQ27520YZFT-G4
DSBGA
YZF
15
250
180.0
BQ27520YZFT-G4
DSBGA
YZF
15
250
178.0
2.1
2.76
0.81
4.0
8.0
Q1
9.2
2.1
2.76
0.81
4.0
8.0
Q1
8.4
2.1
2.76
0.81
4.0
8.0
Q1
9.2
2.1
2.76
0.81
4.0
8.0
Q1
Pack Materials-Page 1
W
Pin1
(mm) Quadrant
17-Jun-2015
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
BQ27520YZFR-G4
DSBGA
YZF
15
3000
182.0
182.0
20.0
BQ27520YZFR-G4
DSBGA
YZF
15
3000
270.0
225.0
227.0
BQ27520YZFT-G4
DSBGA
YZF
15
250
182.0
182.0
20.0
BQ27520YZFT-G4
DSBGA
YZF
15
250
270.0
225.0
227.0
Pack Materials-Page 2
Height (mm)
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