Wire, Cable and Accessories

General Information and Selection

Different strain gage installation conditions and test
specifications often necessitate the use of different
types or sizes of leadwires. For accurate, reliable strain
measurements, it is important to use an appropriate type
of leadwire for each installation. Micro-Measurements
stocks a wide variety of wires and cables, cataloged in
tabular form on the following pages. All wires and cables
listed in the tables have been proven in the field to give
excellent sensor performance when properly used in the
specified environments. Special gage wiring problems may
require the use of wires not listed here. In such cases, our
Applications Engineering Department can recommend
appropriate wire types and can suggest suppliers.

WIRE AND CABLE CODING SYSTEM

3 26 D F V
Number of Conductors
AWG (American Wire Gauge) Wire Size

Types of Wire Construction Insulation

A: Solid copper F: Flat cable E: Etched TFE Teflon
B: Stranded copper J: Twisted cable with jacket F: Fiberglass braid
D: Tinned stranded copper S: Shielded/twisted with jacket K: Kapton (polyimide) wrap
F: Silver-plated stranded T: Twisted cable without jacket N: Nylon/polyurethane enamel
G: Nickel-clad solid copper W: Round single wire P: Polyurethane enamel
H: Solid Manganin Q: Polyimide enamel
J: Solid Balco T: TFE Teflon
V: Vinyl (PVC)
Diameter Diameter
AWG (nominal) AWG (nominal)
in (mm) in (mm)
22 0.0253 0.643 34 0.0063 0.160
Balco is a Registered Trademark of W.B. Driver Company.
26 0.0159 0.404 36 0.0050 0.127 Teflon and Kapton are Registered Trademarks of DuPont.
27 0.0142 0.361 37 0.0045 0.114
30 0.0100 0.254 42 0.0025 0.064
*Solid core wire

RIBBON WIRE CODING SYSTEM

1 G L 64 001
Number of Conductors Thickness, in mils
Alloy Width
G: NiClad copper 64: 1/64 in (0.4 mm)
K: Nichrome V L: Uninsulated ribbon 16: 1/16 in (1.6 mm)
08: 1/8 in (3.2 mm)

The Wire and Cable Coding System shown above gives according to the number of conductors. All wires and
the unique designation of each wire type for ordering cables are supplied on spools for user convenience.
purposes. The leadwire and cabling selection charts Some styles may not be continuous length.
presented on the next three pages are organized

References:
Application Note: TT-601, Techniques for Bonding Leadwires to Surfaces Experiencing High Centrifugal Forces.
Application Note: TT-604, Leadwire Attachment Techniques for Obtaining Maximum Fatigue Life of Strain Gages.
Application Note: TT-608, Techniques for Attaching Leadwires to Unbonded Strain Gages.

Document No.: 11024 For technical questions, contact www.micro-measurements.com

Revision: 08-Dec-2014 micro-measurements@vpgsensors.com 1
Wire, Cable and Accessories

General Information and Selection

SINGLE-CONDUCTOR TYPES: SOLID WIRE

Type Packaging
Description
(See Note 1) Foot (Meter)*

Solid copper wire, polyurethane enamel: General-purpose intragage

134-AWP 500 ft (150 m)
hookup wire. Useful from 100 to +300F (75 to +150C). Enamel coating
136-AWP 500 ft (150 m)
easily removed by applying heat from soldering iron.

AWP AWN Solid copper wire, nylon/polyurethane enamel: Identical in use and
127-AWN 500 ft (150 m)
specifications to Type AWP above, but with superior abrasion resistance
130-AWN 500 ft (150 m)
and slightly reduced insulation resistance at elevated temperatures.
134-AWN 500 ft (150 m)
134-AWN and 136-AWN are available in four colors; specify: R (red),
136-AWN 500 ft (150 m)
W (white), B (black), G (green).

Solid copper wire, polyimide enamel: Intragage hookup wire. Temperature

127-AWQ 500 ft (150 m)
range 452 to +428F (269 to +220C) short term. Enamel is extremely
130-AWQ 500 ft (150 m)
tough and abrasion resistant, with excellent electrical properties; generally
134-AWQ 500 ft (150 m)
removed by mechanical scraping or sanding.

Solid nickel-clad copper wire, fiberglass braid insulation: Useful from

AWQ GWF 126-GWF 100 ft (30 m)
452 to +482F (269 to +250C). Recommended for use with WK-Series
126-GWF 1000 ft (300 m)
gages when silver solder is used for lead attachment.

Solid manganin wire, nylon/polyurethane enamel: Used for bridge

137-HWN 200 ft (60 m) balance and span set in transducer circuits. Nominal resistance: 14 ohms/ft
(50 ohms/m). Temperature range: +10 to +125F (10 to +50C).

Solid Balco wire, nylon/polyurethane enamel: Used for bridge

HWN JWN temperature compensation of zero shift or span. Nominal resistance: 19
142-JWN 500 ft (150 m)
ohms/ft (65 ohms/m). Temperature coefficient of resistance: +0.25%/F
(+0.45%/C). Temperature range: +10 to +300F (10 to +150C).

SINGLE-CONDUCTOR TYPES: STRANDED WIRE

Type Packaging
Description
(See Note 1) Foot (Meter)*
Stranded tinned-copper wire, vinyl insulation: General-purpose
leadwire. Useful to +180F (+80C). Vinyl insulation becomes brittle at low
126-DWV 100 ft (30 m)
temperature; not normally used below 60F (50C). Specify red, white,
black, or green.

Stranded silver-plated copper wire, Kapton polyimide insulation: High-

performance. Recommended for unusually severe service from 452 to
126-FWK 25 ft (7.5 m)
over +600F (269 to +315C) short term. Excellent resistance to abrasion,
radiation, and outgassing in high vacuum. Treated for bondability.

DWV FWK FWT Stranded silver-plated copper wire, Teflon insulation: Wide
temperature range. Useful from 452 to +500F (269 to +260C). When
130-FWT 100 ft (30 m) bonding to Teflon-insulated wire, insulation must be treated with Tetra-Etch
compound (see Special-Purpose Materials.) Specify red, white, black, or
green.

*Some types may not be continuous length.

Note 1: Products shown in bold are RoHS compliant.

Balco is a Registered Trademark of W.B. Driver Company.

Kapton and Teflon are Registered Trademarks of DuPont.
TetraEtch is a Registered Trademark of W.L. Gore.

www.micro-measurements.com For technical questions, contact Document No.: 11024

2 micro-measurements@vpgsensors.com Revision: 08-Dec-2014
 Wire, Cable and Accessories

General Information and Selection

THREE-CONDUCTOR CABLE
Type Packaging
Description
(See Note 1) Foot (Meter)*

Stranded tinned-copper wire, 3-conductor twisted cable, chrome

322-DJV 500 ft (150 m) PVC vinyl jacket, vinyl insulation: Good choice for use with EGP-Series
Embedment Strain Gages. Color-coded red/white/black.

326-DFV 100 ft (30 m) Stranded tinned-copper wire, 3-conductor flat cable, vinyl insulation:
DJV DFV 326-DFV 1000 ft (300 m) Convenient general-purpose cable. For use from 60 to +180F (50 to
330-DFV 100 ft (30 m) +80C). Flat construction requires minimum space. Color-coded red/white/
330-DFV 1000 ft (300 m) black.

326-BSV 100 ft (30 m) Stranded copper wire, 3-conductor twisted cable, PVC insulated,
326-BSV 1000 ft (300 m) braided shield: For use from 60 to 180F (50 to +80C).

Stranded tinned-copper wire, 3-conductor twisted cable, vinyl

326-DTV 100 ft (30 m) insulation: Convenient general-purpose cable for low electrical noise
326-DTV 1000 ft (300 m) pickup. For use from 60 to +180F (50 to +80C). Color-coded red/
white/black.

BSV DTV DSV Stranded tinned-copper wire, 3-conductor twisted cable, vinyl
326-DSV 100 ft (30 m) insulation, braided shield, vinyl jacket: Special-purpose cable to minimize
326-DSV 1000 ft (300 m) electrical noise interference. Useful from 60 to +180F (50 to +80C).
Color-coded red/white/ black.

Stranded silver-plated copper wire, 3-conductor flat cable, etched

330-FFE 100 ft (30 m)
Teflon insulation: For use from 85F to +392F (65C to +200C). Color-
330-FFE 1000 ft (300 m)
coded red/white/black. Insulation treated for bonding.

FFE
Stranded silver-plated copper wire, 3-conductor twisted cable, Teflon
insulation, Teflon jacket: Small, flexible. For use from 452 to +500F
330-FJT 100 ft (30 m)
(269 to +260C). Color-coded red/white/black. When bonding Teflon-
330-FJT 1000 ft (300 m)
insulated wire, insulation must be treated with Tetra-Etch compound (see
Special-Purpose Materials.)
Stranded silver-plated copper wire, 3-conductor twisted cable, etched
Teflon insulation: Small, flexible cable. For use from 452 to +500F
336-FTE 50 ft (15 m)
(269 to +260C). Color-coded red/white/black. Insulation treated for
bonding.

Stranded silver-plated copper wire, 3-conductor twisted cable, etched

330-FTE 100 ft (30 m)
Teflon insulation: For use from 452 to +500F (269 to +260C). Color-
330-FTE 500 ft (150 m)
coded red/white/black. Insulation treated for bonding.
FJT FTE GJF
Solid nickel-clad copper wire, 3-conductor twisted cable, fiberglass
326-GJF 100 ft (30 m) braid insulation and jacket: For use from 452 to +900F (269 to
326-GJF 1000 ft (300 m) +480C). Recommended for use with WK-Series gages when silver solder is
used for lead attachment. Color-coded red/white/black.

*Some types may not be continuous length.

Note 1: Products shown in bold are RoHS compliant.

Teflon is a Registered Trademark of DuPont.

TetraEtch is a Registered Trademark of W.L. Gore.

Document No.: 11024 For technical questions, contact www.micro-measurements.com

Revision: 08-Dec-2014 micro-measurements@vpgsensors.com 3
Wire, Cable and Accessories

General Information and Selection

FOUR-CONDUCTOR CABLE
Type Packaging
Description
(See Note 1) Foot (Meter)*

426-DFV 100 ft (30 m)

Stranded tinned-copper wire, 4-conductor flat cable, vinyl insulation:
426-DFV 1000 ft (300 m)
For use from 60 to +180F (50 to +80C). Conductors easily separated
430-DFV 100 ft (30 m)
for stripping and wiring. Color-coded red/white/black/green.
430-DFV 1000 ft (300 m)
DFV DSV
Stranded tinned-copper wire, 4-conductor polypropylene insulated:
422-DSV 100 ft (30 m)
Twisted shielded pairs (red/black and white/green) with a drain wire, PVC
422-DSV 1000 ft (300 m)
jacket. For use from 60 to +180F (30 to +60C).

426-BSV 100 ft (30 m) Stranded copper wire, 4-conductor twisted cable, PVC insulated
426-BSV 1000 ft (300 m) braided shield: For use from 60 to +180F (50C to +80C).

Stranded tinned-copper wire, 4-conductor twisted cable, vinyl

426-DTV 100 ft (30 m)
BSV DTV insulation: For use from 60 to +180F (50 to +80C). Color-coded red/
426-DTV 1000 ft (300 m)
white/black/green.

Stranded silver-plated copper wire, 4-conductor twisted cable, Teflon

insulation, braided shield, Teflon jacket: Small, flexible cable. For use
430-FST 100 ft (30 m) from 452 to +500F (269 to +260C). Color-coded red/white/black/
430-FST 1000 ft (300 m) green. When bonding Teflon-insulated wire, insulation must be treated with
Tetra-Etch compound (see Special-Purpose Materials, document number
11008).

FST FTT Stranded silver-plated copper wire, 4-conductor twisted cable, Teflon
insulation: Small, flexible cable. For use from 452 to +500F (269
436-FTT 100 ft (30 m)
to +260C). Color coded red, white, black, green. When bonding Teflon
436-FTT 500 ft (150 m)
insulated wire, insulation must be treated with Teflon etchant, such as
TEC-1 (see Special- Purpose Materials, document number 11008).

Stranded silver-plated copper wire, 4-conductor flat cable, Teflon

insulation: For use from 452 to +500F (269 to +260C). Color coded
426-FFT 100 ft (30 m)
red, white, black, green. When bonding Teflon insulated wire, insulation
426-FFT 500 ft (150 m)
must be treated with a Teflon etchant, such as TEC-1 (see Special-Purpose
Materials, document number 11008).
FFT

FLAT RIBBON LEAD (UNINSULATED)

Packaging
Type Description
Foot (Meter)*

Uninsulated flat ni-clad copper ribbon: 1/64 in wide x 0.001in thick (0.4
1-GL-64-001 50 ft (15 m) x 0.025 mm). For use from 452 to 900F (269 to +480C). Can be easily
soldered or spot welded.

Uninsulated Nichrome V: 1/16 in wide x 0.002 in thick (1.6 x 0.05 mm). For
1-KL-16-002 50 ft (15 m)
use from 452 to + 2000F (269 to +1100C).

Uninsulated Nichrome V: 1/8 in wide x 0.003 in thick (3.2 x 0.08 mm). For
1-KL-08-003 50 ft (15 m)
use from 452 to +2000F (269 to +1100C).

Uninsulated Nichrome V: 1/8 in wide x 0.005 in thick (3.2 x 0.127 mm). For
1-KL-08-005 50 ft (15 m)
use from 452 to +2000F (269 to +1100C).

*Some types may not be continuous length.

Note 1: Products shown in bold are RoHS compliant.

Teflon is a Registered Trademark of DuPont.

TetraEtch is a Registered Trademark of W.L. Gore.

www.micro-measurements.com For technical questions, contact Document No.: 11024

4 micro-measurements@vpgsensors.com Revision: 08-Dec-2014
 Wire, Cable and Accessories

General Information and Selection

HST-1 HEAT-SHRINKABLE WIRE SPLICE SEALANT

Fast, easy-to-use method for protecting wire splice connections.

Constructed of irradiated polyolefin plastic tubing with a heat-
flowable inner liner sealant. Forms an immediate and tight seal
to splice connection at a shrink temperature of +275F (+135C).
Inside diameter before heating is 0.125 in (3.2 mm); after heating,
0.023 in (0.6 mm). Large range of shrinkage allows use with
leadwire insulation diameters from 0.03 to 0.11 in (0.75 to 2.8
mm). The operating temperature range is 65 to +230F (55 to
+110C). Package of eight 6-in (150-mm) lengths.

THERMAL WIRE STRIPPER

The ease and simplicity of operation of the Thermal Wire Stripper

make it ideal for most strain gage leadwire stripping. The variable
heat control allows stripping of all thermoplastic insulations,
including Teflon, in sizes No. 18 to No. 36 AWG (1 to 0.1 mm
diameter). The foot switch and tweezer hand- piece give excellent
operator control over the stripping operation. Includes power
unit and foot switch, both with 3-wire NEMA plugs, and tweezer
handpiece.
WTS-1: 110Vac
WTS-2: 220Vac
WTS-A Replacement Elements: Set of two.

Teflon is a Registered Trademark of DuPont.

Document No.: 11024 For technical questions, contact www.micro-measurements.com

Revision: 08-Dec-2014 micro-measurements@vpgsensors.com 5
 Legal Disclaimer Notice
Vishay Precision Group, Inc.

Disclaimer
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Copyright Vishay Precision Group, Inc., 2014. All rights reserved.

Document No.: 63999 www.vpgsensors.com

Revision: 15-Jul-2014 1

Strain Gages and Instruments
Strain Gage Soldering Techniques
Introduction
T he most com mon method of mak i ng ele ctr ical
connections in strain gage circuits is by means of soft
solders, in wire form. Other methods, such as spot
welding, brazing, compression bonding, paste solders,
and conductive epoxies, are also available, but find only
limited application. Solders have many advantages for
strain gage use they are low in cost, readily available in
various alloy compositions to provide a range of melting
temperatures, and are easily obtained in the form of either
solid wire or wire with a core of flux. They are convenient
to use, and offer an excellent combination of electrical and
mechanical properties.
Although soldering is basically a simple procedure,
it must be done with appropriate tools, supplies, and
techniques to assure accurate strain measurement. This is
particularly true when test requirements are severe in the
sense of approaching the limits of the strain gage circuit
capabilities; e.g., long-term stability, high-elongation
measurements, fatigue endurance, etc. Use of improper
materials or techniques can significantly degrade strain
gage performance.
The purpose of this Application Note is to outline
recommended procedures and materials for attaching
leadwires to strain gage solder tabs or to bonded
printed-circuit terminals. These reliable, experience-
proven methods are based on the use of a professional
quality soldering station, in conjunction with Micro-
Measurements solders and installation accessories.
Soldering Station and Pencil
For precision soldering of strain gages, it is always necessary
to use a temperature- or power-controlled soldering station
that provides low voltage and adjustable temperature to
the soldering iron tip. An unregulated soldering iron,
connected directly to the power line, is not ordinarily
suitable for strain gage use because the tip temperature is
apt to be far too high. This tends to oxidize the tip, and to
instantly vaporize the flux, making soldering much more
difficult. In addition, the unnecessarily high temperature
may damage the strain gage, the bonding adhesive, or even
the test specimen. For these reasons, the soldering station
should incorporate provision for adjusting the soldering
Document Number: 11089 For technical support, contact
Revision 13-Nov-2010 micro-measurements@vishaypg.com
Micro-Measurements
Application Note TT-609
temperature to suit varying installation conditions and
requirements. The temperature must be adjusted, of
course, to accommodate the melting points of the different
solders commonly used for strain gage connections, but
also to allow for environmental conditions such as drafts
or outdoor soldering in cold weather. Moreover, the
temperature controller should be carefully designed to
ensure that it does not generate electrical noise that could
adversely affect nearby measuring instruments when both
are in use.
Design of the soldering pencil also requires special
consideration. It should be light in weight, with a very
flexible power cord, and with the gripping area thermally
insulated from the heating element. These characteristics
contribute to the comfort, ease, and precision of soldering,
and minimize operator fatigue during long periods of
use. The soldering tip itself should be of the flat, chisel, or
screwdriver type. Pointed tips should not be used, because
they tend to draw solder away from the work area, and thus
make it more difficult to achieve a proper joint. In contrast,
flat tips act to confine the solder, while offering greater
surface area for better heat transfer and more effective
soldering, generally.
Micro-Measurements soldering units incorporate all of the
above features and a number of others, designed to help the
user easily make consistent, reliable solder joints. These
soldering units are widely used by professional strain gage
installers everywhere, in both stress analysis laboratories
and in transducer manufacture.
Solder Selection
The Micro-Measurements Division stocks a broad range
of solder types to meet various installation and test
requirem ents.While solders are sometimes selected to
provide specific electrical or mechanical properties, the
most common basis for selection is simply the melting-
temperature range. Low-melting-point solders, for
Tech Note
example, are generally used for strain gage installations
on nonmetallic test parts to avoid damaging the gage,
bonding adhesive, or test material due to overheating. In
contrast, high-temperature solders are normally selected
only when necessary to satisfy elevated-temp erature
testing requirements. These solders are somewhat more
difficult to handle because the higher working temp erature
www.micro-measurements.com
207
 TT-609
Micro-Measurements
Strain Gage Soldering Techniques
rapidly vaporizes the f lux, and oxidizes the soldering
tip, both of which tend to impede the soldering process.
Specially designed soldering tips are recommended for
high-temperature use.
For routine applications, where test conditions do not
dictate the use of either a low- or high-temperature solder,
an alloy with an intermediate melting temperature is the
normal selection. The 63/37 tin-lead alloy ( Type 361A-
20R) is an excellent choice for general-purpose strain
gage soldering. As an eutectic alloy, it has a sharply
defined melting temp erature a characteristic that
largely eliminates cold solder joints. The addition of a
trace of antimony provides superior performance when
the soldered connections will be exposed to very low
(cryogenic) temperatures for long periods of time.
The general-purpose solders are supplied with a core of
activated rosin f lux.This makes soldering much more
convenient, and is particularly useful in field applications
where accessory liquid rosin flux (M-Flux AR) may not be
available. Solid-wire solder, with externally applied acid
flux (M-Flux SS), is recommended for making soldered
connections to Micro-Measurements K- and D-alloy
(modified Karma and isoelastic) strain gages. Rosin-core
solders should not be used in conjunction with acid flux.
Silver solder ( Type 1240-FPA) is available for applica
tions where leadwire connections will be exposed to
temperatures above about +550F (+290C). This solder,
in paste form, is not suitable for attaching wires directly
to strain gage solder tabs or to bondable terminals, but is
intended for connecting instrument leads to preattached
strain gage leads, as with WK-Series gages using a special
resistance soldering unit. Techniques for making leadwire
connections with silver solder are described in Micro-
Measurements Application Note TT-602, Silver Soldering
Technique for Attachment of Leads to Strain Gages.
Soldering Flux
The function of a soldering flux is to remove oxidation
from the members being joined (solder tabs, terminals,
leadwires), and to prevent further oxidation during
soldering. For making leadwire splices, or soldering
directly to constantan foil or copper terminals, the flux
contained in a rosin-core solder is usually sufficient.
With higher temperature solders, however, it may be
necessary to supply additional flux. A liquid activated-
Tech Note
rosin flux such as M-Flux AR is recommended for this
purpose.
Acid fluxes should never be used on constantan strain
gages or copper terminals, or for splicing copper leadwires;
and paste f luxes, containing chlorides, should not be
used under any circumstances for strain gage soldering.
www.micro-measurements.com For technical questions, contact
208 micro-measurements@vishaypg.com
When tinning bare (without soldering options) solder
tabs of Micro-Measurements K- and D-alloy strain
gages, a liquid acid flux (M-Flux SS) is recommended.
After the tinning operation, the residual flux must be
completely neutralized within one to two minutes;
and then the leadwire joint can be completed using the
same solder and M-Flux AR rosin flux or a rosin-cored
solder.
Preparation of the Soldering Tip
New soldering tips should always be tinned with solder prior
to initial use. This is easily accomplished by wrapping one
to two in (25 to 50 mm) of solder wire around the working
portion of the tip while the soldering iron is cold, before
applying power to the soldering station. If rosin-core
solder is used, no external flux is required. With solid-wire
solder, however, the wrapped tip should be dipped into
liquid rosin flux (M-Flux AR) to provide sufficient flux
for initial tinning. Set the control on the soldering station
to the appropriate temperature range for the solder, and
apply power to the unit. Allow the soldering pencil to heat
until the solder wrapped around the tip melts completely.
Remove excess melted solder from the tip with a dry gauze
sponge. Never knock the heated soldering pencil against
any object to remove excess solder, since this may result in
personal injury or damage to the soldering pencil.
 ote: Cross-alloying of solders can change the electrical,
N
chemical, thermal and mechanical properties of the solder
being used. To prevent cross-alloying, it is recommended
that only one type of solder be used with each soldering
tip. Of course, if one type of solder is incorporated in a
gage with solder dots and another type is added, a mixture
is produced. This mixture cannot be expected to have
melting and strength properties any better than those of
the lower temperature component.
Oxidation of the soldering tip seriously hinders the
soldering operation. The tendency for oxidation can be
minimized by ensuring that excess melted solder remains
on the tip at all times when it is not actually in use.
Negligent maintenance practices, or wiping the hot tip
with materials that char on the surface, will produce a
buildup of oxide that prevents proper soldering. If the tip
does become oxidized, the following procedure is effective
for cleaning and re-tinning:
1. Set the soldering station to the appropriate temperature
range for the solder in use.
2. Place several drops of M-Flux SS on a glass plate.
Re-tin the soldering surface by holding the heated tip in
the SS flux while feeding solder onto the tip. A generous
amount of solder is essential for proper tinning.
Document Number: 11089
Revision: 13-Nov-2010

Strain Gage Soldering Techniques
3. Wipe the excess solder from the tinned tip with a dry
gauze sponge. For severely oxidized tips, it may be
necessary to repeat this operation several times to
obtain a properly tinned surface. The soldering tip
should never be filed or sanded, since this may remove
the plating on the tip, accelerating the oxidation and
leading to the early deterioration of the tip. After the
cleaning operation, remove excess solder, re-tin and
clean the tip several times, using rosin-core solder, or
solid-wire solder withM-Flux AR.
Tinning Solder Tabs and
Bondable Terminals
All strain gage solder tabs, terminals, and leadwires must
be properly tinned before making soldered connections.
This helps ensure active surface wetting and good heat
transfer during the soldering operation. Tinning stranded
leadwires to produce a formable solid conductor will also
greatly simplify the leadwire attachment procedure.
Before tinning the solder tabs on open-face (unencapsulat-
ed) strain gages, the measuring grid should be protected
with PDT-1 drafting tape.The drafting tape is positioned
to cover the entire grid and the upper portion of the solder
tabs, as shown in Figure 1. This not only shields the grid
from soldering flux and inadvertent solder splash, but
also restricts the flow of solder on the tabs. The tinned
area on the solder tabs should be only large enough to
easily accommodate the leadwire size in use. The latter
consideration is particularly important when making
installations for dynamic applications or large-strain
measurement.
The tinning procedure for strain gage tabs and terminals
consists of first cleaning and reapplying a small amount of
solder to the hot soldering iron tip. Next, apply a drop of
Figure 1 Gage grid and upper portion of
solder tabs masked with drafting tape.
Document Number: 11089 For technical questions, contact
Revision: 13-Nov-2010 micro-measurements@vishaypg.com
TT-609
Micro-Measurements
M-Flux AR to the tab or terminal (this step can be omitted
if a rosin-core solder is used). When soldering directly to
bare Karma or isoelastic foil, use M-Flux SS on the gage
tabs only. Hold the soldering pencil in a nearly horizontal
position (<30), with the flat surface of the tip parallel to
the solder tab or terminal. Place the solder wire flat on the
gage tab, and press firmly with the tinned hot soldering tip
for about one to two seconds, while adding approximately
1/8 in (3 mm) of fresh solder at the edge of the tip. This
procedure assures that there is sufficient solder and flux
for effective tinning. Simultaneously lift both the soldering
pencil and solder wire from the tab area.
 OTE: Lifting the soldering iron before lifting the solder
N
may result in the end of the solder wire becoming attached
to the tab; lifting them in the reverse order can leave
a jagged (spike) solder deposit on the tab. When the
operation is performed properly, it will produce a small,
smoothly tinned area on the tab or terminal.
If M-Flux AR or a rosin-core solder is used in the tinning,
it is not necessary to remove the residual soldering flux
at this time. However, when M-Flux SS is employed to
tin the bare solder tabs of K- or D-alloy gages, the acidic
flux residue must be removed immediately following the
tinning operation. To remove the residue, apply M-Prep
Conditioner A liberally, and wash the area with a soft
brush; then blot dry with a clean gauze sponge. Next, wash
again with freely applied M-Prep Neutralizer 5A, and blot
dry with a clean gauze sponge.
 OTE: Special procedures for tinning and wiring strain
N
gages supplied with preattached solder dots are described
in Micro-Measurements Application Note TT-606,
Soldering Techniques for Lead Attachment to Strain Gages
with Solder Dots.
Tinning and Attaching Leadwires
Of course, leadwire ends must be stripped of insulation
before tinning, and this should be done with a thermal
wire stripper to avoid the damage to the wire that often
occurs when mechanical wire strippers are used. After
the wires are stripped, the ends of stranded conductors
should be twisted tightly together before tinning. The bare
leadwire ends can then be tinned easily with the following
procedure:
1. Remove excess solder from the soldering tip, using a
Tech Note
dry gauze sponge. Then melt fresh solder on the hot tip
to form a hemisphere of molten solder about twice the
diameter of the wire to be tinned.
2. If rosin-core solder is used, slowly draw the bare wire
through the molten solder while continuously adding
fresh solder to the interface of the wire and soldering
tip. With solid-wire solder, apply M-Flux AR to the
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209
 TT-609
Micro-Measurements
Strain Gage Soldering Techniques
Figure 2 Trimming leadwire ends before taping in place.
wire end before starting to tin, and proceed in the same
manner. This will produce a smooth, shiny coating of
solder over the bare wire.
For applications employing bondable terminal strips and
stranded instrumentation wire, it may be convenient to use
a single strand of the wire as a jumper between the terminal
and the strain gage solder tab. In such cases, the single
wire strand should be separated out before twisting and
tinning the remaining strands (see Micro-Measurements
Application Note TT-603, The Proper Use of Bondable
Terminals in Strain Gage Applications).
Leadwires should be formed and routed to the strain
gage or terminal strip, then firmly anchored to the
test-part surface with drafting tape before making the
soldered connection. Attempting to route the leadwires
after completing the solder joint will often result
in damage to the gage or terminals. Routing into the
connection area should be along a minimum strain
direction (such as the Poisson direction in a uniaxial
stress field) particularly for high elongation or dynamic
tests. The tinned leadwire end should be trimmed short
enough so that it will not protrude through the connection
area, and cannot inadvertently make electrical contact
with the test-part surface or adjacent solder connections.
Figure 2 illustrates this stage in the procedure. In the final
preparatory step, bend the leadwire end slightly to form
a spring-like loop, and tape the wire firmly in place over
the connection area, using PDT-1 drafting tape. The tape
Tech Note
should be within about 1/8 in (3 mm) of the connection
area, as shown in Figure 3.
Clean and re-tin the soldering iron tip with fresh solder.
The temperature of the iron should be adjusted so that the
solder is easily melted, without rapidly vaporizing the flux.
If the iron temperature is either too low or too high, it may
cause poor solder connections, or it may damage the strain
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210 micro-measurements@vishaypg.com
Figure 3 Leadwire end taped to surface
in preparation for soldering.
gage, terminal, or bonding adhesive. Apply a small amount
of M-Flux AR to the joint area and, holding the soldering
pencil nearly horizontal, firmly press the flat surface of the
tip on the junction for about one second; then lift the tip
from the soldered joint. If needed, additional flux can be
provided during the joining operation by feeding a little
fresh solder into the joint from a spool of rosin-core solder.
This procedure should result in a smooth, hemispherical
solder joint, without any peaks or jagged areas. If the
solder joints are not smooth and uniform in size, repeat the
soldering procedure, using additional flux and/or solder as
necessary.
Cleanup and Inspection of
Soldered Joints
After completing the soldering operation, it is imperative
that all traces of residual f lux be completely removed
with RSK Rosin Solvent. The same solvent is used to
soften the mastic of the drafting tape, permitting its easy
removal. Do not try to pull away the tape with tweezers
or other tools, because this may result in damage to the
soldered connections or the strain gage grid. Thoroughly
clean the entire installation area with generously applied
rosin solvent and a soft-bristled brush. Clean the solder
connection area until no visible signs of residual f lux
remain, and blot the area dry with a clean gauze sponge.
Any traces of residual f lux can cause gage instability
and drift, and will inhibit bonding of the installations
protective coating. Incompletely removed soldering flux is
the most common cause of degraded performance in strain
gage installations. Residual flux mixed with a protective
coating application can completely destroy the coating
objective.
Visually inspect the soldered joints for any gritty or jagged
joint surfaces, and for traces of flux. Solder connections
Document Number: 11089
Revision: 13-Nov-2010
 TT-609
Micro-Measurements

Strain Gage Soldering Techniques

should be smooth, shiny, and uniform in appearance.
Any soldered joints that look questionable should be
re-soldered, and flux removed. Check the resistance-to-
ground of the completed gage installation, using the Model
1300 Gage Installation Tester. Low or marginal resistance
readings suggest a leakage path between the soldered
connections and the test-part surface. This condition
usually results from residual soldering flux, or from bare
leadwire conductors partially shorting the gage tabs or
terminals to the test part. Soldered joints should not be
tested by pulling on the leadwire, or by probing at the joint
area. These practices frequently cause lifting or tearing of
the solder tab from the gage backing material.
Summary
The ability to make consistently good soldered joints is
essential for precision strain gage measurements. The
techniques described here are straightforward and easily
mastered, but they are most effective when used with
professional soldering equipment which is specially
designed for making soldered connections in strain gage
circuits. The soldering pencil should be lightweight, with
a flat chisel or screwdriver tip, and it should be connected
to the soldering station with a very flexible power cord.
Requirements for the soldering station include low-voltage
operation of the soldering pencil, and provision for
temperature adjustment to suit the type of solder and the
application conditions. The equipment should not generate
electrical interference that could affect sensitive measuring
instrumentation. Solder selection is based primarily on the
expected operating temperature range of the strain gage
installation; and all solder tabs, bondable terminals, and
leadwire ends should be tinned before soldering the joints.
Soldered joints should always be smooth and shiny, with
no jagged or irregular edges, and all traces of residual flux
must be thoroughly removed prior to the application of
protective coating. Use of the recommended materials and
techniques, with careful attention to detail, will result in
consistently proper and reliable soldered connections.

Tech Note

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 MICRO-MEASUREMENTS

Strain Gages and Instruments Application Note TT-604

Leadwire Attachment Techniques for

Obtaining Maximum Fatigue Life of Strain Gages
Introduction
Micro-Measurements WA-, WK-, and WD-Series Strain
Gages are manufactured with integral beryllium-copper
lead ribbons. To maximize the inherently good fatigue
life of this gage/lead combination, the gage-to-instrument
leadwire connection must also be highly resistant to
fatigue damage. The techniques described here are
recommended for applications where the cyclic strain
endurance requirements approach the fatigue limits of the Figure 1
gage in use.
Wir ing procedures for gages with integral solder
dots instead of lead ribbons are described in Micro-
Measurements Application Note TT-606, and general gage
Lead Preparation and Attachment
soldering techniques are discussed in detail in Application
Note TT-609. Step 1
Carefully lift the gage lead
Bonding ribbons from the specimen
M-Bond 600 and M-Bond 610 are the strain gage surface by laying the wood
adhesives generally recommended for high-performance extension of a cotton-
applications. However, any M-Bond adhesive can be used tipped applicator firmly
where temperature conditions and other factors permit. across the gage at the lead
Although Micro-Measurements strain gage adhesives are exit point, grasping each
not particularly fatigue sensitive, some potential problem lead end with tweezers
areas are: and raising the lead at a
shallow angle (Figure 2).
A
 dhesive failure due to improper surface preparation Avoid introducing kinks Figure 2
or environmental protection. or sharp corners.
V
 oids or air bubbles in the glueline, causing hot
spots in the gage and subsequent premature failure. Step 2
Bonding instructions for M-Bond 600 and 610 are detailed With tweezers, guide each
in Micro-Measurements Instruction Bulletin B-130. lead ribbon upward and
Wherever possible, the use of bondable terminals is around the tip of a dental
recommended to provide an anchor for the instrument probe to form a small
leadwire, preventing damage to the gage when the leadwire loop above the surface
is subjected to any type of force. Micro-Measurements betwe en the lead ex it
Type CPF-75C terminals are particularly suitable for this point and the edge of the
gage backing (Figure 3).
TECH NOTE

application within their operating temperature range.

If bonded in a high strain field, terminals should be cut in Do not twist or kink the Figure 3
half and/or bonded 90 to the maximum strain direction. ribbons. Once kinked, a
Figure 1 is representative of typical installations. lead will easily break.

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Revision 20-Feb-2012 micro-measurements@vishaypg.com 189
 TT-604
Micro-Measurements

Leadwire Attachment Techniques for

Obtaining Maximum Fatigue Life of Strain Gages
Step 3
Insulated, three-conductor, stranded tinned-copper
leadwire cable is normally selected for static or static/
dynamic measurements. Refer to Micro-Measurements
Strain Gage Accessories Data Book for the selection of a
suitable leadwire. Typically recommended cable types are
Micro-Measurements 326-DFV (flat, and most convenient
for routine applications) or 326-DSV (twisted, and shielded
for use when electrical noise fields are present). Both cables Figure 6 Figure 7
are color-coded red, white, and black. The 326-DFV is
used to illustrate the following step-by-step procedures.
Step 6
Cut the leadwire cable to the appropriate length. At the
gage end of the leadwire, separate the three color-coded With tweezers, form the single wire strands and insert
conductors, and strip 0.5 in (13 mm) of insulation from through the gage lead loops as shown in Figure 6. Tighten
each. A thermal wire stripper is recommended to help the gage lead loops by pulling gently with a pair of tweezers
prevent nicking the wires. (Figure 7). To avoid damage to the gage joint, lightly press
the wood extension of a cotton-tipped applicator over the
area as indicated in the figure.
Step 4
Solder the joints and cut off excess lead ribbons and wire
Separate a single wire strand from both the red conductor strands.
and the black conductor.
Twist the remaining strands of the red conductor together, Step 7
leaving the single strand separated. Twist the remaining
st r a nd s of t h e bl a ck Remove solder flux with rosin solvent, gently blotting dry
conductor together with with a gauze sponge. If any wire strands come in contact
all strands of the white with the specimen, gently lift with a dental probe.
c o n du c t o r, l e av i ng
the single strand from Protective Coating Application
t h e b l a c k c o n du c t o r
Refer to Micro-Measurements Strain Gage Accessories
separated.
Figure 4
Data Book for the selection and application of a suitable
Ti n t h e t wo t w i s t e d protective coating.
bundles of stranded wire
with solder. With diagonal cutters, trim each bundle to
approximately 0.1 in (2.5 mm) from the insulation, being Note: WD-Series Strain Gages are supplied with single
careful not to trim the two single strands of wire extending beryllium-copper leads. The WA- and WK-Series gages, as
from the red conductor and the black/white conductor shown throughout this Application Note, are supplied with
(Figure 4). dual leads. The WD gages should be handled in the same
manner as the dual lead connections.
Step 5
Tin the bonded terminals
w ith solder. Plac e the
tinned, trimmed sections
of the leadwires on the
terminals, and anchor the
TECH NOTE

cable in this position with

drafting tape. Solder the
leads in place (Figure 5),
Figure 5 avoiding large masses of
solder.

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Strain Gages and Instruments
High-Elongation Strain Measurements
Introduction
Experimental stress analysis of structural materials
sometimes requires testing to complete failure. In such
cases, particularly with ductile materials, failure is often
preceded by large local strains, the magnitudes of which
are of interest to the test engineer.
High-elongation strain measurements place severe demands
on the gage installation, and necessitate special gage and
adhesive selection and surface preparation procedures.
This Application Note outlines recommendations for gage
and adhesive selection, surface preparation, gage bonding
and wiring, and protective coating selection for high-
elongation strain measurements.
High elongations are usually expressed as percentages: 1%
elongation is equal to 10 000 microstrain; 5% elongation
is equal to 50 0 0 0 microstrain. The maximum rated
elongation of any bonded strain gage is based on a single
tensile measurement. Cyclic strains of high levels must
be limited to a value much lower than maximum due to
fatigue limitations on the strain gage foil. Consult Micro-
Measurements Tech Note TN-508, Fatigue Characteristics
of Micro-Measurements Strain Gages, for details on strain
gage performance under repetitive loading conditions.
Gage Selection
Selection of proper strain gages for use in high-elongation
testing is based on both anticipated strain levels and test
temperature. Polyimide (E) backing is normally selected
for this type of service because it has superior elongation
capabilities and an operating temperature range suitable
for most high-elongation testing. The E-backing is available
with constantan (A) foil or fully annealed constantan
(P) foil.
EA-Series
Properly installed and wired EA-Series (polyimide-backed
constantan foil) strain gages are capable of measuring
maximum elongations in the range of 3% 5%. While gage
lengths of 1/8 in (3 mm) or longer will normally achieve
5%, shorter gage lengths may be limited to 3%. Since most
structural materials (e.g., metals) yield well below this
limit, the EA-Series is a popular choice for use in obtaining
yield point information on these materials.
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Revision 12-Nov-2010 micro-measurements@vishaypg.com
Micro-Measurements
Application Note TT-605
EP-Series
EP-Series gages are recommended when measurement
requirements are beyond the 3% 5% elongation capability
of the EA-Series. P-alloy is a fully annealed constantan foil
processed for very high ductility. A properly bonded
and wired EP-Series strain gage is capable of strain
measurements to 20% (200 000 microstrain) or greater.
As in the EA-Series, smaller gages will exhibit a lower
maximum elongation capability.
Options
Any leadwire attachment option, such as Option W
(encapsulated gages with integral terminals) or Option
LE (encapsulated gages with leadwires), will lower the
maximum elongation capability of EP-Series gages. But
because the elongation limits of EA-Series strain gages
are more moderate (3% 5%), and because options will
normally withstand at least the lower end of this range,
they are not generally a limitation in the selection of
EA-Series gages.
To obtain maximum possible elongation, select EP-Series
gages without options.
Adhesive Selection
High-elongation strain measurements place severe
demands on the adhesive system. The adhesive must be
rigid enough to prevent gage relaxation (creep), yet flexible
enough to permit large deformations without cracking.
Recommended adhesives are listed in the following
selection chart.
Surface Preparation
The selection and implementation of proper surface
preparation procedures is equally as important as using
proper gages and adhesives. High-elongation measurements
Tech Note
demand closer attention to recommended procedures than
do normal elastic strain measurements.
Micro-Measurements Instruction Bulletin B-129, Surface
Preparation for Strain Gage Bonding, outlines steps for
surface preparation on a variety of materials. These
procedures produce a smooth, clean surface, usually
having been abraded in a single direction during
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191
 TT-605
Micro-Measurements

High-Elongation Strain Measurements

ELONGATION CAPABILITIES
ADHESIVE PREFERRED
GENERAL DESCRIPTION 320F +75F +200F
TYPE CURE
(195C) (+24C) (+95C)

Special pretested grade of cyanoacrylate, 6%

M-BOND certified for strain gage use. Fast room- 3 min at Not Up to 15% for Not
200 temperature cure. +75F (+24C ) applicable installations less applicable
than 30 minutes old
Two-component, 100%-solids epoxy
M-BOND 6 hr at
system. Capable of room-temperature cure. 1% 6 10% 10 15%
AE-10 +75F (+24C )
Transparent, medium-viscosity adhesive.
Two-component, 100%-solids epoxy
M-BOND 2 hr at
system. Moderately elevated temperature cure. 2% 15% 15%
AE-15 +150F (+65C )
Transparent, medium-viscosity adhesive.
Two-component, partially filled, 100%-solids 6 min at
M-BOND epoxy system. May be cured at room +75F (+24C )
4% 10 15% 15 20%
GA-2 temperature. Higher viscosity than AE system. followed by
1 hr at +125F (+50C )
Two-component, filled, 100%-solids epoxy
M-BOND system. Paste-like consistency. Specifically 2 hr at Not
15 20% 15 20%
A-12 recommended for elongations above 10% on +165F (+75C ) applicable
steel.
For additional specifications, consult Micro-Measurements Strain Gage Accessories Data Book
and specific adhesive instruction bulletin.

preparation. Because of higher bondline forces involved
in high-elongation measurements, the surface should be
altered further for greater bond strength, as indicated in
the following procedures:
1. Completely prepare the surface of the test specimen as
described in Bulletin B-129.
2. Abrade the specimen surface in a direction 45 to the
intended axis of strain measurement. On soft materials,
such as aluminum, use 320-grit silicon-carbide paper;
on harder materials, such as steel, use 60-grit.
3. Lightly abrade, with the appropriate grit paper as
indicated in Step 2, in a direction 90 to the first abrasion.
This will produce a cross-hatched abraded surface.
Typical surface roughness desired approximates 250 in
(6.4 m) rms.
4. Repeat the degreasing steps outlined in Bulletin B-129.
5. Condition the surface with Micro-Measurements
Tech Note
Many materials oxidize readily in air. If allowed to
form on the surface, oxidation will greatly reduce
bond strength and elongation capabilities. It is strongly
recommended that the gage bonding operation be
completed as soon as possible after the surface is
prepared.
GageBonding
Follow the standard bonding procedures outlined in the
respective instruction bulletin for the adhesive selected.
Gage Wiring
Relatively high displacements occur with high-elongation
strain measurements, suggesting the use of an external
ter-minal strip. The strain gage should be wired to the
terminal strip with a small-diameter, single-conductor
wire no larger than 30 AWG (0.25 mm diameter) as shown
in Figure 1. Drafting tape (Micro-Measurements PDT-1)

M-Prep Conditioner A (if appropriate for the specimen
materials as detailed in B-129), scrubbing with cotton-
tipped applicators. Wipe dry with a gauze sponge.
6. Neutralize the surface with Micro-Measurements
M-Prep Neutralizer 5A (if appropr iate for the
s p e c i m e n m at e r i a l), s c r ub b i ng w it h c ot t o n -
tipped applicators. Wipe dry with a gauze sponge.
applied over the gage during soldering is recommended to
restrict the flow of solder to the tab ends.
Adequate strain relief loops, as shown in the following
illustration, are of particular importance in high-elongation
measurements. Note also that the leads attached to the
strain gage tabs approach in a direction 90 from the
maximum principal strain axis.

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 TT-605
Micro-Measurements
Tape Coverage

High-Elongation Strain Measurements

Strain relief loop
Tin entire copper Style C terminal
Half-Terminal Technique
terminal,for
leavingUsing
neat Bonded Terminals in High Strain Fields
cut in half lengthwise
dome of solder

Note: When the main leadwire is stranded, it is

often convenient to cut all strands but one to fit
Tape Coverage
the size of the copper terminal. The long strand
can then be used as the jumper wire. Soldering
is made considerably easier by this method.

Strain relief loop

Tin entire copper Style C terminal
terminal, leaving neat cut in half lengthwise
dome of solder

Single Strand

Twist and tin remaining strands before

cutting and soldering to the terminal

Figure 1

After soldering, all tape and soldering f lux should be Instrumentation

removed with several brush applications of rosin solvent
(Micro-Measurements RSK-1).
Gage Linearity
A discussion of high-elongation strain gage measurements
Twist and tin remaining strands before
is not complete without including the cutting
subject of gage
and soldering to the terminal
linearity under plastic straining conditions.
Although constantan alloy is one of the most linear of all
strain gage alloys, it does exhibit small changes in gage
factor during high elongation.
Without treating this subject in detail, it can be shown in
theory that the gage factor of the strain gage approaches a
value of 2+ when the gage alloy is strained beyond its elas-
tic range. The elastic range for constantan is approximately
0.5%.
Using the 2+ guideline, the gage factor at a strain level of
10% would be close to 2.1 in tension and 1.9 in compression.
Wheatstone bridge
Single Strandcircuits are commonly used in strain
gage measurements. These circuits are inherently nonlinear
when large gage resistance changes are encountered.
Consult Micro-Measurements Tech Note TN-507, Errors
Due to Wheatstone Bridge Nonlinearity, for correction
procedures.
Common Installation Problems
Unbonding of the Gage
Assuming the proper adhesive has been selected (see
Chart), loss of bond before maximum gage elongation
is reached can usually be traced to a contaminated or
improperly prepared surface. A visual examination of the
bond area will usually detect this. Cured adhesive on the
back of the strain gage but not on the specimen generally
indicates improper or incomplete surface preparation.
Tech Note

At a 20% strain level, the gage factor approaches 2.2 in
tension and 1.8 in compression.
While these numbers are correct in theory, they have
not, to our knowledge, been substantiated by actual test
results.
It is important to note that some materials, like polyethylene,
are difficult to bond; and it will not be possible to reach
maximum gage elongation before bond failure.
Unbonding of the Gage Tabs
Gage tab unbonding is often due to an excessive amount
of solder, which reinforces the gage tabs, and causes them

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 TT-605
Micro-Measurements

High-Elongation Strain Measurements

to unbond as a result of their inflexibility. Drafting tape
is recommended for restricting the amount of solder (see Thin Metal Strip Hardened
Gage Wiring). to Retain Shape

Excessive soldering temperatures, or terminals placed too

close to gage tabs, can also contribute to this problem.

Gage Grid Failure (Open Circuit) FOOT

Assuming that the strain gage readings were within the STRAIN GAGES
strain range capability of the gage, and that the backing TOP AND BOTTOM
remains bonded, premature grid failures are often the
result of high local strains within the area covered by the
gage. Since the strain gage is an averaging device, it will
indicate average strain along its grid length. Steep strain COMPRESSION
gradients can cause localized excessive strain damage
while the gage may have been indicating a strain that was
well within its elongation limits.
TENSION
Grid failures may also result from strain concentrations
caused by inclusions in the adhesive layer (unmixed
adhesive particles, dirt, etc.) or by uneven gluelines, often
caused by irregular or pitted specimen surfaces or uneven
clamping pressures.

Elongations Exceeding 20% BRIDGE

EXCITATION
Strain measurements, particularly on materials such as
plastic or rubber, sometimes surpass the capability of
the EP-Series strain gage. Measurements in this range
can be obtained through simple flexure devices designed
to reduce the strain level on the gages. These devices,
commonly referred to as clip gages, are shown in Figures Figure 2A Clip Gage (Half Bridge)
2A and 2B. Strain gages are installed on the top and
bottom of the clip, and the clip mounted to the specimen
by bonding or spot welding, depending on the specimen
material. The displacement of the feet under strain causes
corresponding resistance changes in the strain gages. With
the gages wired into either a half or full Wheatstone bridge,
their resistance changes are additive, thereby increasing
the amount of available signal. Wherever space permits,
full bridges are recommended because the effective bridge STRAIN GAGES
output is twice the half-bridge signal for the same foot TOP AND BOTTOM
displacement.
Since the clip gage is normally a nonlinear device, the
gage output is calibrated against known displacements
before installation. The gage zero reading is monitored
during the calibration, since a permanent zero offset after
Tech Note

BRIDGE
calibration can usually be traced to localized yielding of EXCITATION
the metal strip. If this is indicated, the calibration should
be repeated several times to check for reproducibility.
A clip gage is particularly useful in measuring very large
specimen strains or actual displacements occurring
between two bodies, as with expansion joints or crack
Figure 2B Clip Gage (Full Bridge)
openings.

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 Micro-Measurements

Strain Gages and Instruments Application Note TT-606

Soldering Techniques for Lead Attachment to

Strain Gages with Solder Dots
Introduction
Many gages are now purchased with integral solder dots.
These offer advantages of accurately controlled solder
joint size, convenience when working in confined areas,
and of having pretinned hard-to-solder alloys such as
isoelastic and Karma. Controlled joint size, in turn, helps
to increase gage fatigue life, and minimizes thermocouple
Correct
effects.
Shape
If proper installation techniques are used, there should
be no difficulty experienced in obtaining well-soldered
connections; but care must be exercised. Open-faced gages
with Option S (solder dots only) should be coated with
adhesive at the time of installation. Such encapsulation Incorrect
effectively prevents dot enlargement and undesirable Shape
spreading during subsequent soldering steps. To expose
the dots, lightly abrade with 400-grit silicon-carbide paper
or simply solder through this overcoat. Encapsulated gages
Figure 1
do not require additional coating with adhesive.
The following are important guidelines:

Soldering Temperature
T backed gages with Option S, and S Series gages,
have dots composed of +570F (+300C) lead-tin-silver
solder. Micro-Measurements wire solders have melti ng
Iron Direction
points ranging from +361 to +570F (+183 to +300C);
the most common are the +361 and +570F (+183 and
+300C) solder wire with rosin-core flux. Solid wires are
also available, including a popular +430F (+220C) type. Flat Surface
A temperature-controlled soldering station, such as the
Correct
Mark V or Mark VIII Soldering Units, is recommended.
Tip temperature should be high enough to assure good
wetting of the solder but not so high as to remove the
dots, vaporize flux, or hinder keeping the iron properly
tinned and clean. Unfortunately, most uncontrolled irons
are quite capable of tip temperatures in excess of +900F
(+480C), which is much too high for general strain gage
Tech Note

soldering.
Iron Direction
Soldering TipDesign
Incorrect
Never solder with a sharply pointed tip (Figure 1). A hot
point applied to a solder dot usually draws out the solder.
Use a clean, flat 1/16-in (1.5-mm) wide chisel or screwdriver Figure 2
type tip held flat against the work, as in Figure 2.

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 TT-606
Micro-Measurements
Soldering Techniques for Lead Attachment to
Strain Gages with Solder Dots
Fluxing
Proper fluxing is essential. Enough M-Flux AR, either
from melting of flux-core solder or adding M-Flux AR
separately, must be introduced to assure complete wetting
action. This is particularly important with +570F (+300C)
solder as there is an increased tendency for the flux to be
boiled away at higher temperatures.
If spikes are produced instead of smooth beads, it is a
sign of inadequate fluxing, dwelling too long with the iron,
and/or an improper iron temperature.
Rosin flux should always be used in making connections
to Option S gages. All flux residue should be thoroughly
removed with RSK Rosin Solvent.
BeadFormation
It is important to first build up a well-formed bead on
each dot as in Figure 3. This is done by laying rosin-core
solder wire across each dot, firmly applying the iron for
one second, then simultaneously lifting both wire and iron.
See Figure 4. If the first attempt fails, simply repeat this
procedure, making certain to use enough flux. Feeding a
cored solder into the joint area during heat application will
increase the available flux.
Before
After
Figure 3
Iron Direction
Tech Note
Solder
Flat Surface
Figure 4
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Hold-down
Each connecting wire must be carefully and firmly
anc hored in place with spring loading against the dot
bead, as illustrated in Figure 5, before soldering the
connection. When this is properly done, a one-second
touch of a hot iron and fresh solder with f lux should
complete the process.
Solder Compatibilities
All Micro-Measurements solders are compatible with each
other. Of course, if one type is incorporated in the dot and
another added from wire, a mixture is produced. This new
alloy cannot be expected to have melting and strength
properties any better than those of the lower temperature
component. In special cases of mixing +430 and +570F
(+220 and +300C) solders, a final alloy similar to +361F
(+183C) solder can be encountered.
Figure 6 illustrates a typical installation. Note that solder
dot (Option S or SE) gages are always connected to bonded
term inals for strength. Refer to Application Note TT-603,
The Proper Use of Bondable Terminals in Strain Gage
Applications, for other arrangements.
After Soldering
Before Soldering
Figure 5
Figure 6
Document Number: 11086
Revision: 12-Nov-2010
 TT-606
Micro-Measurements

Soldering Techniques for Lead Attachment to

Strain Gages with Solder Dots
The various installation accessories referred to throughout
th is Appl ic at ion Not e are Mic ro -Me a su re ment s
Accessories, listed in our Strain Gage Accessories Data
Book and available directly from Micro-Measurements.
Application Note TT-609, Strain Gage Soldering Techniques,
provides a detailed discussion on general strain gage
soldering techniques.

Tech Note

Document Number: 11086 For technical questions, contact www.micro-measurements.com

Revision: 12-Nov-2010 micro-measurements@vishaypg.com 197