Solder Wiki Inc Solder Melting Points

8/21/2017 Solder - Wikipedia
Solder
From Wikipedia, the free encyclopedia
Solder (/ so ldr/, [1]

ldr/
/ s
[1]
dr/
or in North America / s
[2]
) is a fusible metal alloy used to create a
permanent bond between metal workpieces. The word solder comes from the Middle English word soudur, via Old
[3]
French solduree and soulder, from the Latin solidare, meaning "to make solid". In fact, solder must be melted in
order to adhere to and connect the pieces together, so a suitable alloy for use as solder will have a lower melting
point than the pieces it is intended to join. Whenever possible, the solder should also be resistant to oxidative and
corrosive effects that would degrade the joint over time. Solder that is intended for use in making electrical
connections between electronic components also usually has favorable electrical characteristics.
[4]
Soft solder typically has a melting point range of 90 to 450C (190 to 840F; 360 to 720K), and is commonly
used in electronics, plumbing, and sheet metal work. Manual soldering uses a soldering iron or soldering gun. Alloys
A soldered joint used to attach a
that melt between 180 and 190C (360 and 370F; 450 and 460K) are the most commonly used. Soldering
wire to the pin of a component on
performed using alloys with a melting point above 450C (840F; 720K) is called "hard soldering", "silver
the rear of a printed circuit board
soldering", or brazing.
In specic proportions, some alloys can become eutectic that is, their melting point is the same as their freezing
point. Non-eutectic alloys have markedly different solidus and liquidus temperatures, and within that range they
exist as a paste of solid particles in a melt of the lower-melting phase. In electrical work, if the joint is disturbed in
the pasty state before it has solidied totally, a poor electrical connection may result; use of eutectic solder reduces
this problem. The pasty state of a non-eutectic solder can be exploited in plumbing, as it allows molding of the
solder during cooling, e.g. for ensuring watertight joint of pipes, resulting in a so-called "wiped joint".
For electrical and electronics work, solder wire is available in a range of thicknesses for hand-soldering, and with
Spool of solder, 1.6 mm diameter
cores containing ux. It is also available as a paste or as a preformed foil shaped to match the workpiece, more
suitable for mechanized mass-production. Alloys of lead and tin were commonly used in the past and are still
available; they are particularly convenient for hand-soldering. Lead-free solders have been increasing in use due to
regulatory requirements plus the health and environmental benets of avoiding lead-based electronic components. They are almost exclusively used
[5]
today in consumer electronics.
Plumbers often use bars of solder, much thicker than the wire used for electrical applications. Jewelers often use solder in thin sheets, which they cut
into snippets.
Contents
1 Lead-free solder
2 Lead solder
3 Flux-core solder
4 Hard solder
https://en.wikipedia.org/wiki/Solder 1/57
5 Solder alloys
5.1 Notes on the above table
5.2 Properties
5.3 Solidifying
5.4 Alloying element roles
5.5 Impurities in solders
6 Intermetallics in solders
7 Glass solder
8 Preform
9 See also
10 References
11 Bibliography
12 External links
Lead-free solder
On July 1, 2006 the European Union Waste Electrical and Electronic Equipment Directive (WEEE) and Restriction of
Hazardous Substances Directive (RoHS) came into effect prohibiting the inclusion of signicant quantities of lead in
most consumer electronics produced in the EU. In the US, manufacturers may receive tax benets by reducing the
use of lead-based solder. Lead-free solders in commercial use may contain tin, copper, silver, bismuth, indium, zinc,
antimony, and traces of other metals. Most lead-free replacements for conventional 60/40 and 63/37Sn-Pb solder
[6]
have melting points from 5 to 20C higher, though there are also solders with much lower melting points.
It may be desirable to use minor modication of the solder pots (e.g. titanium liners or impellers) used in wave-
soldering, to reduce maintenance cost due to increased tin-scavenging of high-tin solder.

Pure tin solder wire
Lead-free solder may be less desirable for critical applications, such as aerospace and medical projects, because its
properties are less thoroughly known.
Tin-Silver-Copper (Sn-Ag-Cu, or "SAC") solders are used by two-thirds of Japanese manufacturers for reow and
wave soldering, and by about 75% of companies for hand soldering. The widespread use of this popular lead-free
solder alloy family is based on the reduced melting point of the Sn-Ag-Cu ternary eutectic behavior (217C), which
is below the 22/78Sn-Ag (wt.%) eutectic of 221C and the 59/41Sn-Cu eutectic of 227C (recently revised by P.
Snugovsky to 53/47Sn-Cu). The ternary eutectic behavior of Sn-Ag-Cu and its application for electronics assembly
was discovered (and patented) by a team of researchers from Ames Laboratory, Iowa State University, and from
Sandia National Laboratories-Albuquerque.
Soldering copper pipes using a
Much recent research has focused on selection of 4th element additions to Sn-Ag-Cu to provide compatibility for propane torch and lead-free solder
the reduced cooling rate of solder sphere reow for assembly of ball grid arrays, e.g., 18/64/14/4Tin-Silver-Copper-
Zinc (Sn-Ag-Cu-Zn) (melting range of 217220C) and 18/64/16/2Tin-Silver-Copper-Manganese (Sn-Ag-Cu-Mn)
(melting range of 211215C).
Tin-based solders readily dissolve gold, forming brittle intermetallics; for Sn-Pb alloys the critical concentration of gold to embrittle the joint is about
4%. Indium-rich solders (usually indium-lead) are more suitable for soldering thicker gold layer as the dissolution rate of gold in indium is much slower.
Tin-rich solders also readily dissolve silver; for soldering silver metallization or surfaces, alloys with addition of silvers are suitable; tin-free alloys are
also a choice, though their wettability is poorer. If the soldering time is long enough to form the intermetallics, the tin surface of a joint soldered to gold
[7]
is very dull.
Lead solder
Tin-lead (Sn-Pb) solders, also called soft solders, are commercially available with tin concentrations between 5%
and 70% by weight. The greater the tin concentration, the greater the solders tensile and shear strengths.
Historically, lead has been widely believed to mitigate the formation of tin whiskers, though the precise mechanism
[8]
for this is unknown. Today, many techniques are used to mitigate the problem, including changes to the annealing
process (heating and cooling), addition of elements like copper and nickel, and the inclusion of conformal
[9] [10]
coatings. Alloys commonly used for electrical soldering are 60/40Sn-Pb, which melts at 188C (370F), and
63/37Sn-Pb used principally in electrical/electronic work. 63/37 is a eutectic alloy of these metals, which:
1. has the lowest melting point (183C or 361F) of all the tin-lead alloys; and
2. the melting point is truly a point not a range.
In the United States, lead is prohibited in solder and ux in plumbing applications for drinking water use, per the
[11]
Safe Drinking Water Act (SDWA). Historically, a higher proportion of lead was used, commonly 50/50. This had
Sn60Pb40 solder
the advantage of making the alloy solidify more slowly. With the pipes being physically tted together before
soldering, the solder could be wiped over the joint to ensure water tightness. Although lead water pipes were
displaced by copper when the signicance of lead poisoning began to be fully appreciated, lead solder was still used until the 1980s because it was
thought that the amount of lead that could leach into water from the solder was negligible from a properly soldered joint. The electrochemical couple of
copper and lead promotes corrosion of the lead and tin. Tin, however, is protected by insoluble oxide. Since even small amounts of lead have been found
[12]
detrimental to health, lead in plumbing solder was replaced by silver (food-grade applications) or antimony, with copper often added, and the
proportion of tin was increased (see Lead-free solder.)
The addition of tinmore expensive than leadimproves wetting properties of the alloy; lead itself has poor wetting characteristics. High-tin tin-lead
[13]
alloys have limited use as the workability range can be provided by a cheaper high-lead alloy.
Karl J. Puttlitz; Kathleen A. Stalter (2004). Handbook
of lead-free solder technology for microelectronic
In electronics, components on printed circuit boards (PCBs) are connected to the printed circuit, and
assemblies hence
. CRC to other
Press. p.541. components, by soldered joints. For
ISBN0-8247-4870-0.
miniaturized PCB joints with surface mount components, solder paste has largely replaced solid solder.
[7]
Lead-tin solders readily dissolve gold plating and form brittle intermetallics. 60/40Sn-Pb solder oxidizes on the surface, forming a complex 4-layer
structure: tin(IV) oxide on the surface, below it a layer of tin(II) oxide with nely dispersed lead, followed by a layer of tin(II) oxide with nely dispersed
[14]
tin and lead, and the solder alloy itself underneath.
Lead, and to some degree tin, as used in solder contains small but signicant amounts of radioisotope impurities. Radioisotopes undergoing alpha decay
are a concern due to their tendency to cause soft errors. Polonium-210 is especially problematic; lead-210 beta decays to bismuth-210 which then beta
[15][16]
decays to polonium-210, an intense emitter of alpha particles. Uranium-238 and thorium-232 are other signicant contaminants of alloys of lead.
Flux-core solder
Flux is a reducing agent designed to help reduce (return oxidized metals to their metallic state) metal oxides at the
points of contact to improve the electrical connection and mechanical strength. The two principal types of ux are
acid ux (sometimes called "active ux"), used for metal mending and plumbing, and rosin ux (sometimes called
"passive ux"), used in electronics, where the corrosiveness of the vapors released when acid ux is heated would
risk damaging delicate circuitry.
Due to concerns over atmospheric pollution and hazardous waste disposal, the electronics industry has been
gradually shifting from rosin ux to water-soluble ux, which can be removed with deionized water and detergent,
instead of hydrocarbon solvents.

Electrical solder with an integrated
rosin core, visible as a dark spot in

In contrast to using traditional bars or coiled wires of all-metal solder and manually applying ux to the parts being
the cut end of the solder wire.
joined, much hand soldering since the mid-20th century has used ux-core solder. This is manufactured as a coiled
wire of solder, with one or more continuous bodies of non-acid ux embedded lengthwise inside it. As the solder
melts onto the joint, it frees the ux and releases that on it as well.
Hard solder
Hard solders are used for brazing, and melt at higher temperatures. Alloys of copper with either zinc or silver are the most common.
In silversmithing or jewelry making, special hard solders are used that will pass assay. They contain a high proportion of the metal being soldered and
lead is not used in these alloys. These solders vary in hardness, designated as "enameling", "hard", "medium" and "easy". Enameling solder has a high
melting point, close to that of the material itself, to prevent the joint desoldering during ring in the enameling process. The remaining solder types are
used in decreasing order of hardness during the process of making an item, to prevent a previously soldered seam or joint desoldering while additional
sites are soldered. Easy solder is also often used for repair work for the same reason. Flux or rouge is also used to prevent joints from desoldering.
Silver solder is also used in manufacturing to join metal parts that cannot be welded. The alloys used for these purposes contain a high proportion of
silver (up to 40%), and may also contain cadmium.
Solder alloys
M.P. C
Composition Toxic Eutectic Comments Sn Pb Ag Cu Sb Bi In Zn Cd Au oth.
S/L
Galvanite Lead-free
galvanizing solder
formulation designed
specically for high
quality repairs to
galvanized steel
surfaces. Simple,
[17]
Sn50Zn49Cu1 200/300 no effective and easy to 50 1 49
use, in both
manufacturing and
eld applications.
Metallurgically bonds
to the steel, for a
seamless protective
[17]
barrier.
KappFree provides
good joint strength,
vibration resistance,
and thermal cycle
fatigue resistance in
both piping and
[18]
electrical products as
Sn95.5Cu4Ag0.5 226/260 no 95.5 .5 4
opposed to tin-lead
solders. Higher
working temperature.
Wets well to brass,
copper, and stainless
steel. Good electrical

[18]
conductivity.
M.P. C
S/L
[19]
Kapp Eco-Babbitt
Commonly used in
capacitor
manufacturing as
protective coating to
shield against
electromotive force
(EMF) and
electromagnetic
interference (EMI)
with the specied
performance of the
[19]
Sn90Zn7Cu3 200/222 no capacitor, to prevent 90 3 7
current and charge
leakage out of and
within the layers of the
capacitor, and to
prevent the
development of
electron ows within
the coating material
itself, that would
diminish capacitor
performance, coating,
[19]
and capacitor life.
M.P. C
S/L
Sn10, UNS L54520,
ASTM10B. Balls for
CBGA components,
replaced by
[6]
Sn95.5Ag3.9Cu0.6.
Low cost and good
bonding properties.
Rapidly dissolves gold
and silver, not
recommended for
[22]
those. Used for
[20]
268/302 fabrication of car
Pb90Sn10 Pb no 10 90
[21]
275/302 radiators and fuel
tanks, for coating and
bonding of metals for
moderate service
temperatures. Body
[23]
solder. Has low
thermal EMF, can be
used as an alternative
to Cd70 where
parasitic
thermocouple voltage
[24]
has to be avoided.
Used for fabrication of
car radiators and fuel
tanks, for coating and

[23]
Pb88Sn12 254/296 Pb no bonding of metals for 12 88
moderate service
temperatures. Body
solder.
Used for coating tubes
[23]
and sheets and
Pb85Sn15 227/288 Pb no 15 85
fabrication of car
radiators. Body solder.
Sn20, UNS L54711.
[21]
Used for coating
Pb80Sn20 183/280 Pb no 20 80
radiator tubes for
[23]
joining ns.
M.P. C
S/L
Crude solder for
construction plumbing
works, ame-melted.
Used for soldering car
[20]
engine radiators. Used
Pb75Sn25 183/266 Pb no 25 75
for machine, dip and
hand soldering of
plumbing xtures and
ttings. Superior body

[23]
solder.
Sn30, UNS L54280,
crude solder for
construction plumbing
works, ame-melted,
good for machine and

[25]
[20]
torch soldering.
185/255
Pb70Sn30 Pb no Used for soldering car 30 70
[21]
183/257
engine radiators. Used
for machine, dip and
hand soldering of
plumbing xtures and
ttings. Superior body

[23]
solder.
"Plumber solder", for
Pb68Sn32 253 Pb no construction plumbing 32 68

[26]
works
[21]
Pb68Sn30Sb2 185/243 Pb no Pb68 30 68 2
Kapp GalvRepair
Economical solder for
repairing & joining
most metals including

[27]
Sn30Pb50Zn20 177/288 Pb no Aluminum and cast 30 50 20
Iron. Have been used
for cast Iron and
galvanized surface
[27]
repair.
M.P. C
S/L
Economical solder for
repairing & joining
most metals including
[27]
Aluminum and cast
Sn33Pb40Zn28 230/275 Pb no 33 40 28
Iron. Have been used
for cast Iron and
galvanized surface
[27]
repair.
PM 33, crude solder
for construction
plumbing works,
Pb67Sn33 187230 Pb no 33 67
ame-melted,
temperature depends
on additives
Sn35. Used as a
cheaper alternative of
[21]
Pb65Sn35 183/250 Pb no Sn60Pb40 for wiping 35 65
and sweating
[23]
joints.
Sn40, UNS L54915.
For soldering of brass

[25]
and car radiators.
For bulk soldering, and
[20]
where wider melting
183/238
Pb60Sn40 Pb no point range is desired. 40 60
[21]
183/247
For joining cables. For
wiping and joining lead
pipes. For repairs of
radiators and
[23]
electrical systems.
For soldering radiator

[23]
Pb55Sn45 183/227 Pb no cores, roof seams, and 45 55
for decorative joints.
M.P. C
S/L
Sn50, UNS L55030.
"Ordinary solder", for
soldering of brass,
electricity meters, gas
meters, formerly also
tin cans. General
purpose, for standard
tinning and
sheetmetal work.
[20]
183/216 Becomes brittle below
Sn50Pb50 Pb no 50 50
[21] [7][26]
183212 150C. Low
cost and good bonding
properties. Rapidly
dissolves gold and
silver, not
recommended for
[22]
those. For wiping
and assembling
plumbing joints for

[23]
non-potable water.
Savbit, Savbit 1, Sav1.
Minimizes dissolution
of copper. Originally
designed to reduce
erosion of the
soldering iron tips.
[28]
About 100 times
Sn50Pb48.5Cu1.5 183/215 Pb no 50 48.5 1.5
slower erosion of
copper than ordinary
tin/lead alloys.
Suitable for soldering
thin copper platings
and very thin copper

[29]
wires.
M.P. C
S/L
Sn60, ASTM60A,
ASTM60B. Common in
electronics, most
popular leaded alloy
for dipping. Low cost
and good bonding
properties. Used in
both SMT and
through-hole
electronics. Rapidly
dissolves gold and
[20] silver, not

183/190
Sn60Pb40 Pb near 60 40
[21] recommended for
183/188
[22]
those. Slightly
cheaper than
Sn63Pb37, often used
instead for cost
reasons as the melting
point difference is
insignicant in
practice. On slow
cooling gives slightly
duller joints than

[29]
Sn63Pb37.
Cu2. Copper content
increases hardness of
the alloy and inhibits

[21][30]
Sn60Pb38Cu2 183/190 Pb dissolution of 60 38 2
soldering iron tips and
part leads in molten
solder.
Sn60Pb39Cu1 Pb no 60 39 1
"Tinman's solder",
Sn62Pb38 183 Pb near used for tinplate 62 38

[26]
fabrication work.
M.P. C
S/L
Sn63, ASTM63A,
ASTM63B. Common in
electronics;
exceptional tinning
and wetting
properties, also good
for stainless steel. One
of the most common
solders. Low cost and
good bonding
properties. Used in
both SMT and
through-hole
electronics. Rapidly
[31]
Sn63Pb37 183 Pb yes 63 37
dissolves gold and
silver, not
recommended for
[22]
those. Sn60Pb40 is
slightly cheaper and is
often used instead for
cost reasons, as the
melting point
difference is
insignicant in
practice. On slow
cooling gives slightly
brighter joints than

[29]
Sn60Pb40.
Sn63PbP. A special
alloy for HASL
machines. Addition of
[32]
phosphorus reduces
Sn63Pb37P0.00150.04 183 Pb yes 63 37 P
oxidation. Unsuitable
for wave soldering as
it may form metal
foam.
M.P. C
S/L
Similar to Sn63Pb37.
Copper content
increases hardness of
[30] the alloy and inhibits

Sn62Pb37Cu1 183 Pb yes 62 37 1
dissolution of
soldering iron tips and
part leads in molten
solder.
[20]
Sn70Pb30 183/193 Pb no Sn70 70 30
[21]
formerly used for
Sn90Pb10 183/213 Pb no 90 10
joints in food industry
Sn95Pb5 238 Pb no plumbing and heating 95 5
For higher-
[30]
Pb92Sn5.5Ag2.5 286/301 Pb no temperature 5.5 92 2.5
applications.
Used for soldering iron

Pb80Sn12Sb8 Pb no 12 80 8
[26]
and steel
[21]
Used for soldering iron
Pb80Sn18Ag2 252/260 Pb no 18 80 2
[26]
and steel
Pb79Sn20Sb1 184/270 Pb no Sb1 20 79 1
General purpose
solder. Antimony
content improves
mechanical properties
Pb55Sn43.5Sb1.5 Pb no 43.5 55 1.5
but causes brittleness
when soldering
cadmium, zinc, or
[26]
galvanized metals.
Bi14. Good fatigue
resistance combined
with low melting point.

[20]
Sn43Pb43Bi14 144/163 Pb no Contains phases of tin 43 43 14
[33]
and lead-bismuth.
Useful for step
soldering.
M.P. C
S/L
[21]
Sn46Pb46Bi8 120/167 Pb no Bi8 46 46 8
Bi52. Good fatigue
resistance combined
with low melting point.
Reasonable shear
strength and fatigue
Bi52Pb32Sn16 96 Pb yes? properties. 16 32 52
Combination with
lead-tin solder may
dramatically lower
melting point and lead

[33]
to joint failure.
[21]
Bi46Sn34Pb20 100/105 Pb no Bi46 34 20 46
Sn62. Common in
electronics. The
strongest tin-lead
solder. Appearance
identical to Sn60Pb40
or Sn63Pb37. Crystals
of Ag3Sn may be seen
growing from the
solder. Extended heat
treatment leads to
formation of crystals
[20] of binary alloys. Silver

Sn62Pb36Ag2 179 Pb yes 62 36 2
content decreases
solubility of silver,
making the alloy
suitable for soldering
silver-metallized
surfaces, e.g. SMD
capacitors and other
silver-metallized
[7][29][33]
ceramics.
Not recommended for

[22]
gold. General-
purpose.
[20]
Sn62.5Pb36Ag2.5 179 Pb yes 62.5 36 2.5
M.P. C
S/L
Sn10, Pb88. Silver
content reduces
solubility of silver
coatings in the solder.

[20]
268/290 Not recommended for
Pb88Sn10Ag2 Pb no 10 88 2
[34] [22]
267/299 gold. Forms a
eutectic phase, not
recommended for
operation above
120C.
[20]
Pb90Sn5Ag5 292 Pb yes 5 90 5
[20]
287/296
Pb92.5Sn5Ag2.5 Pb no Pb93. 5 92.5 2.5
[21]
299/304
Pb94, HMP alloy,
HMP. Service
temperatures up to
255C. Useful for step
soldering. Also can be
used for extremely low
temperatures as it
[20]
296/301
Pb93.5Sn5Ag1.5 Pb no remains ductile down 5 93.5 1.5
[21]
305/306
to 200C, while
solders with more
than 20% tin become
brittle below 70C.
Higher strength and
better wetting than

[29]
Pb95Sn5.
[20]
Pb95.5Sn2Ag2.5 299/304 Pb no 2 95.5 2.5
Wettability and low-
temperature
malleability of indium,
strength improved by
[35]
addition of silver.
In97Ag3 143 yes 3 97
Particularly good for
cryogenic
applications. Used for
packaging of photonic
devices.
M.P. C
S/L
Nearly as wettable and
low-temperature
[36]
malleable as indium.
In90Ag10 143/237 no 10 90
Large plastic range.
Can solder silver, red
glass and ceramics.
Less gold dissolution
and more ductile than
lead-tin alloys. Used
[22]
for die attachment,
In75Pb25 156/165 Pb no 25 75
general circuit
assembly and
packaging
[22]
closures.
In70. Suitable for gold,

[20]
160/174 low gold-leaching.
In70Pb30 Pb no 30 70
[21][37]
165/175 Good thermal fatigue
properties.
In60. Low gold-

[20]
174/185 leaching. Good
In60Pb40 Pb no 40 60
[21]
173/181 thermal fatigue
properties.
M.P. C
S/L
In50. Only one phase.
Resoldering with lead-
tin solder forms
indium-tin and indium-
lead phases and leads
to formation of cracks
between the phases,
joint weakening and

[33]
failure. On gold
[22]
surfaces gold-indium
180/209
In50Pb50 Pb no intermetallics tend to 50 50
[21]
178/210
be formed, and the
joint then fails in the
gold-depleted zone
and the gold-rich

[38]
intermetallic. Less
gold dissolution and
more ductile than

[22]
lead-tin alloys.
Good thermal fatigue
properties.
Cerroseal 35. Fairly
well wets glass, quartz
and many ceramics.
Malleable, can
compensate some
[39]
In50Sn50 118/125 no thermal expansion 50 50
differences. Low vapor
pressure. Used in low
temperature physics
as a glass-wetting
[40]
solder.
[41]
In70Sn15Pb9.6Cd5.4 125 Pb,Cd 15 9.6 70 5.4
M.P. C
S/L
In25. Low gold-
leaching. Good
thermal fatigue
properties. Used for
die attachment of e.g.

[22] [38]
250/264 GaAs dies. Used
Pb75In25 Pb no 75 25
[42]
240/260 also for general circuit
assembly and
packaging closures.
Less dissolution of
gold and more ductile

[22]
than tin-lead alloy.
[20]
162 General purpose. Good
Sn70Pb18In12 Pb yes 70 18 12
[43]
154/167 physical properties.
Good wettability. Not

[22]
Sn37.5Pb37.5In25 134/181 Pb no recommended for 37.5 37.5 25
[22]
gold.
[20]
Pb90In5Ag5 290/310 Pb no 90 5 5
UNS L51510. Minimal
leaching of gold, good
[20]
thermal fatigue
Pb92.5In5Ag2.5 300/310 Pb no 92.5 2.5 5
properties. Reducing
atmosphere
frequently used..
[21]
Pb92.5In5Au2.5 300/310 Pb no In5 92.5 5 2.5
[21]
305/364
Pb94.5Ag5.5 Pb no Ag5.5, UNS L50180 94.5 5.5
[44]
304/343
[45]
Pb95Ag5 305/364 Pb no 95 5
M.P. C
S/L
Ag2.5, UNS L50132.
Used during World War
II to conserve tin. Poor
corrosion resistance;
[20]
joints suffered
303
[21]
corrosion in both
Pb97.5Ag2.5 304 Pb yes no 97.5 2.5
[46]
atmospheric and
304/579
underground
conditions, all had to
be replaced with Sn-

[47]
Pb alloy joints.
Torch solder.
Important for hybrid

Sn97.5Pb1Ag1.5 305 Pb yes 97.5 1 1.5
[7]
circuits assembly.
Ag1.5, ASTM1.5S. High
melting point, used for
commutators,
armatures, and initial
solder joints where
remelting when
working on nearby
joints is
[25]
undesirable. Silver
content reduces
coatings in molten
[20]
solder. Not
Pb97.5Ag1.5Sn1 309 Pb yes 1 97.5 1.5
recommended for
[22]
gold. Standard
PbAgSn eutectic
solder, wide use in
semiconductor
assembly. Reducing
protective atmosphere
(e.g. 12% hydrogen)
often used. High creep
resistance, for use at
both elevated and
cryogenic
temperatures.
M.P. C
S/L
exceptional strength,
silver gives it a bright
Pb54Sn45Ag1 177210 Pb long-lasting nish; 45 54 1
ideal for stainless

[25]
steel
high-temperature
Pb96Ag4 305 Pb 96 4
[25]
joints
[21]
Pb96Sn2Ag2 252/295 Pb Pb96 2 96 2
[7]
Sn61Pb36Ag3 Pb 61 36 3
[7]
Sn56Pb39Ag5 Pb 56 39 5
[7]
Sn98Ag2 98 2
Very high tensile
strength. For die
Sn65Ag25Sb10 233 yes attachment. Very 65 25 10
brittle. Old Motorola
die attach solder.
M.P. C
S/L
SAC305. It is the
JEITA recommended
alloy for wave and
reow soldering, with
alternatives SnCu for
wave and SnAg and
SnZnBi for reow
soldering. Usable also
for selective soldering
and dip soldering. At
high temperatures
tends to dissolve
copper; copper
217/220 buildup in the bath has

Sn96.5Ag3.0Cu0.5 near 96.5 3 0.5
[21][48]
217/218 detrimental effect (e.g.
increased bridging).
Copper content must
be maintained
between 0.40.85%,
e.g. by relling the
bath with Sn97Ag3
alloy. Nitrogen
atmosphere can be
used to reduce losses
by dross formation.
Dull, surface shows
formation of dendritic
tin crystals.
M.P. C
S/L
SN96C-Ag3.5 A
commonly used alloy.
Used for wave
high temperatures
tends to dissolve
copper; copper
buildup in the bath has
detrimental effect (e.g.
Sn95.8Ag3.5Cu0.7 217218 near Copper content must 95.8 3.5 0.7
be maintained
between 0.40.85%,
e.g. by relling the
bath with Sn96.5Ag3.5
alloy (designated e.g.
SN96Ce). Nitrogen
atmosphere can be
by dross formation.
Dull, surface shows
tin crystals.
Determined by NIST to
Sn95.6Ag3.5Cu0.9 217 yes 95.6 3.5 0.9
be truly eutectic.
M.P. C
S/L
SN96C. Preferred by
the European IDEALS
consortium for reow
high temperatures
tends to dissolve
copper; copper
buildup in the bath has
detrimental effect (e.g.
[49]
Sn95.5Ag3.8Cu0.7 217 almost Copper content must 95.5 3.8 0.7
be maintained
between 0.40.85%,
e.g. by relling the
bath with Sn96.2Ag3.8
alloy (designated e.g.
SN96Ce). Nitrogen
atmosphere can be
by dross formation.
Dull, surface shows
tin crystals.
Preferred by the
European IDEALS
Sn95.25Ag3.8Cu0.7Sb0.25 95.25 3.8 0.7 0.25
consortium for wave
soldering.
Recommended by the
US NEMI consortium
for reow soldering.
Used as balls for
BGA/CSP and CBGA
components, a
[50]
Sn95.5Ag3.9Cu0.6 217 yes 95.5 3.9 0.6
replacement for
Sn10Pb90. Solder
paste for rework of

[6]
BGA boards. Alloy
of choice for general
SMT assembly.
M.P. C
S/L
SAC405. Lead-Free,
Cadmium Free
formulation designed
specically to replace
[51]
Lead solders in
Sn95.5Ag4Cu0.5 217 yes 95.5 4 0.5
Copper and Stainless
Steel plumbing, and in
electrical and
electronic
[18]
applications.
[20]
Sn96.5Ag3.5 221 yes Sn96, Sn96.5, 96S. 96.5 3.5
Fine lamellar structure
of densely distributed
Ag3Sn. Annealing at
125C coarsens the
structure and softens

[6]
the solder. Creeps
via dislocation climb
as a result of lattice
[16]
diffusion. Used as
wire for hand
soldering rework;
compatible with
SnCu0.7, SnAg3Cu0.5,
SnAg3.9Cu0.6, and
similar alloys. Used as
solder spheres for
BGA/CSP
components. Used for
step soldering and die
attachment in high
power devices.
Established history in
[6]
the industry. Widely
used. Strong lead-free
joints. Silver content
minimizes solubility of
silver coatings. Not
recommended for
[22]
gold. Marginal
wetting. Good for step
soldering. Used for
M.P. C
S/L
soldering stainless
steel as it wets
stainless steel better
than other soft
solders. Silver content
does not suppress
dissolution of silver
[29]
metallizations.
High tin content
allows absorbing
signicant amount of
gold without
[52]
embrittlement.
ASTM96TS. "Silver-
bearing solder". Food
service equipment,
refrigeration, heating,
air conditioning,
[25]
plumbing. Widely
Sn96Ag4 221229 no 96 4
used. Strong lead-free
joints. Silver content
minimizes solubility of
silver coatings. Not
recommended for
[22]
gold.
Widely used. Strong
lead-free joints. Silver
content minimizes
coatings. Not
recommended for
gold. Produces strong

[53]
Sn95Ag5 221/254 no and ductile joints on 95 5
Steel. The resulting
joints have high
tolerance to vibration
and stress, with tensile
strengths to 30,000
[53]
psi on Stainless.
M.P. C
S/L
Produces strong and
ductile joints on

[53]
Sn94Ag6 221/279 no joints have high 94 6
strengths to 30,000
[53]
psi on Stainless.
Produces strong and
ductile joints on
joints have high
strengths to 31,000
[53]
psi on Stainless.
[53]
Sn93Ag7 221/302 no Audio industry 93 7
standard for vehicle
and home theater
speaker installations.
Its 7% Silver content
requires a higher
temperature range,
but yields superior
strength and vibration

[54]
resistance.
Sn95Ag4Cu1 95 4 1
Sn99. Good strength,
non-dulling. Use in
food processing
equipment, wire
Sn 232 pure 99.99
tinning, and
[25]
alloying.
Susceptible to tin
pest.
M.P. C
S/L
Sn99Cu1. Also
designated as
Sn99Cu1. Cheap
alternative for wave
soldering,
recommended by the
US NEMI consortium.
Coarse microstructure
with ductile fractures.
Sparsely distributed
[55]
Cu6Sn5. Forms
large dendritic -tin
crystals in a network
of eutectic
microstructure with
Sn99.3Cu0.7 227 yes 99.3 0.7 (Ni)
nely dispersed
Cu6Sn5. High melting
point unfavorable for
SMT use. Low
strength, high
ductility. Susceptible
[16]
to tin pest. Addition
of small amount of
nickel increases its
uidity; the highest
increase occurs at
0.06% Ni. Such alloys
are known as nickel
modied or nickel
[56]
stabilized.
M.P. C
S/L
SCA, SAC, or SnAgCu.
Tin-silver-copper
alloy. Relatively low-
cost lead-free alloy for
simple applications.
Can be used for wave,
selective and dip
soldering. At high
temperatures tends to
dissolve copper;
copper buildup in the
bath has detrimental
effect (e.g. increased
[57]
Sn99Cu0.7Ag0.3 217/228 no bridging). Copper 99 0.3 0.7
content must be
maintained between
0.40.85%, e.g. by
relling the bath with
Sn96.2Ag3.8 alloy
(designated e.g.
SN96Ce). Nitrogen
atmosphere can be
by dross formation.
Dull, surface shows
tin crystals.
For high-temperature
uses. Allows removing
insulation from an
enameled wire and

[58]
227/250 applying solder
Sn97Cu3 97 3
[23]
232/332 coating in a single
operation. For radiator
repairs, stained glass
windows, and potable
water plumbing.
M.P. C
S/L
High hardness, creep-
resistant. For
radiators, stained
glass windows, and
[23]
potable water
Sn97Cu2.75Ag0.25 228/314 97 0.25 2.75
plumbing. Excellent
high-strength solder
for radiator repairs.
Wide range of patina
and colors.
For soldering
aluminium. Good
wettability of
Zn100 419 pure 100
aluminium, relatively
good corrosion
[59]
resistance.
Used as a non-
superconducting
solder in low-
temperature physics.
Bi100 271 pure 100
Does not wet metals
well, forms a
mechanically weak
[40]
joint.
M.P. C
S/L
KappAloy9 Designed
specically for
Aluminum-to-
Aluminum and
Aluminum-to-Copper
soldering. It has good
corrosion resistance
and tensile strength.
Lies between soft
solder and silver

[60]
Sn91Zn9 199 yes brazing alloys, thereby 91 9
avoiding damage to
critical electronics and
substrate deformation
and segregation. Best
solder for Aluminum
wire to Copper busses
or Copper wire to
Aluminum busses or
[60]
contacts. UNS#:
L91090
M.P. C
S/L
KappAloy15 Designed
specically for
Aluminum-to-
Aluminum and
Aluminum-to-Copper
soldering. It has good
and tensile strength.
Lies between soft
solder and silver
[60]
brazing alloys, thereby
Sn85Zn15 199/260 no 85 15
avoiding damage to
critical electronics and
substrate deformation
and segregation. Has a
wide plastic range this
makes it ideal for hand
soldering Aluminum
plates and parts,
allowing manipulation
of the parts as the

[60]
solder cools.
For soldering
Zn95Al5 382 yes aluminium. Good 95 Al5
[59]
wetting.
Do not use on lead-
containing
[61]
metallizations. U.S.
Sn91.8Bi4.8Ag3.4 211/213 no 91.8 3.4 4.8
Patent 5,439,639 (ICA
Licensed Sandia
Patent).
M.P. C
S/L
KappAloy30 For
soldering of
aluminium. Good
wetting. Used
extensively in spray
wire form for

[60]
Sn70Zn30 199/316 no capacitors and other 70 30
electronic parts.
Higher temperature
and higher tensile
strength compared to
85Sn/15Zn and
[60]
91Sn/9Zn.
KappAloy20 For
soldering of
aluminium. Good
wetting. Used
wire form for

[60]
electronic parts.
Higher temperature
and higher tensile
85Sn/15Zn and
[60]
91Sn/9Zn.
KappAloy40 For
soldering of
aluminium. Good
wetting. Used
wire form for

[60]
electronic parts.
Higher temperature
and higher tensile
85Sn/15Zn and
[60]
91Sn/9Zn.
[21]
Pb63Sn35Sb2 185/243 Pb no Sb2 35 63 2
M.P. C
S/L
Poor wetting of
Pb63Sn34Zn3 170/256 Pb no aluminium. Poor 34 63 3

[47]
corrosion rating.
For soldering
Pb92Cd8 310? Pb,Cd ? aluminium. US patent 92 8

[62]
1,333,666.
For low-temperature
soldering of heat-
sensitive parts, and for
[30]
soldering in the
Sn48Bi32Pb20 140/160 Pb no 48 20 32
vicinity of already
soldered joints
without their
remelting.
Prone to corrosion and
oxidation due to its
zinc content. On
copper surfaces forms
a brittle Cu-Zn
Sn89Zn8Bi3 191198 intermetallic layer, 89 3 8
reducing the fatigue
resistance of the joint;
nickel plating of
copper inhibits
[63]
this.
High dross due to zinc.

[64]
Sn83.6Zn7.6In8.8 181/187 no Covered by U.S. 83.6 8.8 7.6
Patent #5,242,658.
Lead-free. Corrosion
[65]
concerns and high
Sn86.5Zn5.5In4.5Bi3.5 174/186 no 86.5 3.5 4.5 5.5
drossing due to zinc
content.
Potential use in ip-
[66]
chip assembly, no
Sn86.9In10Ag3.1 204/205 86.9 3.1 10
issues with tin-indium
eutectic phase.
[63]
Sn95Ag3.5Zn1Cu0.5 221L no 95 3.5 0.5 1
M.P. C
S/L
Sb5, ASTM95TA. The
US plumbing industry
standard. It displays
good resistance to
thermal fatigue and
good shear strength.
Forms coarse
dendrites of tin-rich
solid solution with
SbSn intermetallic
dispersed between.
Very high room-
temperature ductility.
Creeps via viscous
glide of dislocations
by pipe diffusion. More
creep-resistant than
SnAg3.5. Antimony can
be toxic. Used for
sealing chip
[20]
235/240 packagings, attaching
Sn95Sb5 no 95 5
[21]
232/240 I/O pins to ceramic
substrates, and die
attachment; a possible
lower-temperature
replacement of
[16]
AuSn. High
strength and bright
nish. Use in air
conditioning,
refrigeration, some
food containers, and
high-temperature
[25]
applications. Good
wettability, good long-
term shear strength at
100C. Suitable for
potable water
systems. Used for
stained glass,
plumbing, and radiator
repairs.
M.P. C
S/L
[67]
Sn97Sb3 232/238 no 97 3
[68]
Sn99Sb1 232/235 no 99 1
Sn99Ag0.3Cu0.7 99 0.3 0.7
217225 Ag03A. Patented by

Sn96.2Ag2.5Cu0.8Sb0.5 96.2 2.5 0.8 0.5
[21]
217 AIM alliance.
Patented by
Sn88In8.0Ag3.5Bi0.5 197208 88 3.5 0.5 8
Matsushita/Panasonic.
Addition of silver
improves mechanical
strength. Established
137/139
Bi57Sn42Ag1 history of use. Good 42 1 57
[69]
139/140
thermal fatigue
performance.
Patented by Motorola.
[20][22]
Bi58Sn42 138 yes Bi58. Reasonable 42 58
shear strength and
fatigue properties.
Combination with
lead-tin solder may
dramatically lower
melting point and lead

[33]
to joint failure.
Low-temperature
eutectic solder with

[22]
high strength.
Particularly strong,
[20]
very brittle. Used
extensively in
through-hole
technology assemblies
in IBM mainframe
computers where low
soldering temperature
was required. Can be
used as a coating of
copper particles to
facilitate their bonding
under pressure/heat
M.P. C
S/L
and creating a
conductive
[63]
metallurgical joint.
Sensitive to shear
rate. Good for
electronics. Used in
thermoelectric
applications. Good
thermal fatigue
[70]
performance.
Established history of
use. Expands slightly
on casting, then
undergoes very low
further shrinkage or
expansion, unlike
many other low-
temperature alloys
which continue
changing dimensions
for some hours after

[40]
solidication.
[71]
Bi58Pb42 124/126 Pb 42 58
In80. Compatible with
gold, minimum gold-

[21]
142/149 leaching. Resistant to
In80Pb15Ag5 Pb no 15 5 80
[72]
149/154 thermal fatigue. Can
be used in step
soldering.
In40. Low gold-
[21]
leaching. Good
Pb60In40 195/225 Pb no 60 40
thermal fatigue
properties.
[21]
Pb70In30 245/260 Pb no In30 70 30
[21]
Sn37.5Pb37.5In26 134/181 Pb no In26 37.5 37.5 26
[21]
130/154
Sn54Pb26In20 Pb no In20 54 26 20
[73]
140/152
M.P. C
S/L
In19. Low gold-

[21]
270/280 leaching. Good
Pb81In19 Pb no 81 19
[74]
260/275 thermal fatigue
properties.
In52. Suitable for the
cases where low-
temperature soldering
is needed. Can be used

[63]
for glass sealing.
Sharp melting point.
Good wettability of
In52Sn48 118 yes glass, quartz, and 48 52
many ceramics. Good
low-temperature
malleability, can
compensate for
different thermal
expansion coefcients
of joined materials.
[20]
very low tensile
Sn52In48 118/131 no 52 48
strength
[75]
Sn58In42 118/145 no 58 42
General-purpose.
[76]
Maintains creep
Sn51.2Pb30.6Cd18.2 145 Pb,Cd yes 51.2 30.6 18.2
strength well.
Unsuitable for gold.
Similar mechanical
properties with
Sn63Pb37,
Sn62Pb36Ag2 and
[77] Sn60Pb40, suitable

Sn77.2In20Ag2.8 175/187 no 77.2 2.8 20
lead-free replacement.
Contains eutectic Sn-
In phase with melting
point at 118C, avoid
use above 100C.
[78]
In74Cd26 123 Cd yes 74 26
M.P. C
S/L
[79]
In61.7Bi30.8Cd7.5 62 Cd yes 30.8 61.7 7.5
[80]
Bi47.5Pb25.4Sn12.6Cd9.5In5 57/65 Pb,Cd no 12.6 25.4 47.5 5 9.5
[81]
Bi48Pb25.4Sn12.8Cd9.6In4 61/65 Pb,Cd no 12.8 25.4 48 9.6
[82]
Bi49Pb18Sn15In18 58/69 Pb no 15 18 49 18
Cerrolow 136. Slightly
expands on cooling,
later shows slight
shrinkage in couple
hours afterwards.
Bi49Pb18Sn12In21 58 Pb yes 12 18 49 21
Used as a solder in
low-temperature
[40]
physics. Also the
ChipQuik desoldering
[83]
alloy.
[84]
Bi50.5Pb27.8Sn12.4Cd9.3 70/73 Pb,Cd no 12.4 27.8 50.5 9.3
Cerrobend. Used in
Bi50Pb26.7Sn13.3Cd10 70 Pb,Cd yes low-temperature 13.3 26.7 50 10

[40]
physics as a solder.
Cerrolow 117. Used as
a solder in low-
Bi44.7Pb22.6In19.1Cd5.3Sn8.3 47 Cd,Pb yes 8.3 22.6 44.7 19.1 5.3
temperature
[40]
physics.
[20]
In60Sn40 113/122 no 40 60
In51.0Bi32.5Sn16.5 60.5 yes Field's metal 16.5 32.5 51
Bi49.5Pb27.3Sn13.1Cd10.1 70.9 Pb,Cd yes Lipowitz Metal 13.1 27.3 49.5 10.1
Wood's metal, mostly

Bi50.0Pb25.0Sn12.5Cd12.5 71 Pb,Cd yes 12.5 25 50 12.5
used for casting.
Bi50.0Pb31.2Sn18.8 97 Pb no Newton's metal 18.8 31.2 50
M.P. C
S/L
Rose's metal. It was
used to secure cast
iron railings and
Bi50Pb28Sn22 109 Pb no balusters in pockets in 22 28 50
stone bases and steps.
Does not contract on
cooling.
ChipQuik desoldering
Bi56Sn30In14 79/91 no 30 56 14
[85]
alloy, lead-free
KappTec General
purpose solder that
will join all solderable
metals except
Aluminum. High
temperature, high
strength solder. It is
[86]
Cd95Ag5 338/393 Cd no used in applications 5 95
where alloys melting
higher than soft
solders are required,
but the cost and
strength of Silver-
brazing alloys is not

[86]
necessary.
Medium temperature
alloy that provide
strong, corrosion-
resistant joints on
[87]
most metals. Also
for soldering
aluminium and die-

[26]
cast zinc alloys.
[87]
Cd82.5Zn17.5 265 Cd yes Used in cryogenic 17.5 82.5
physics for ataching
electrical potential
leads to specimens of
metals, as this alloy
does not become
superconductive at
liquid helium
[40]
temperatures.
M.P. C
S/L
Medium temperature
alloy that provide
strong, corrosion-
resistant joints on
most metals. Works
especially well on
Aluminum-to-
Aluminum and
[87]
Aluminum-to-Copper
Cd70Zn30 265/300 Cd no 30 70
joints, with excellent
and superior strength
in high vibration and
high stress
applications in
electronics, lighting
and electrical
[87]
products.
Medium temperature
alloy that provide
strong, corrosion-
resistant joints on
most metals. Works
especially well on
Aluminum-to-
Aluminum and
[87]
Aluminum-to-Copper
Cd60Zn40 265/316 Cd no 40 60
joints, with excellent
and superior strength
in high vibration and
high stress
applications in
electronics, lighting
and electrical
[87]
products.
M.P. C
S/L
KappTecZ High
temperature, high
strength solder that
may be used on most
metals, but works
extremely well on
Aluminum, Copper and
Stainless Steel. It has

[88]
Cd78Zn17Ag5 249/316 Cd no a high tolerance to 5 17 78
vibration and stress,
and good elongation
for use on dissimilar
metals. Above its
liquidus of 600F, this
solder is extremely
uid and will penetrate

[88]
the closest joints.
[89]
KappRad
Developed specically
to join and repair
Aluminum and
[89]
Aluminum/Copper
Sn40Zn27Cd33 176/260 Cd no 40 27 33
radiators and heat
exchangers. A lower
melting point makes
delicate repair work

[89]
easier.
For soldering
Zn90Cd10 265/399 Cd aluminium. Good 90 10

[59]
wetting.
For soldering
Zn60Cd40 265/335 Cd aluminium. Very good 60 40

[59]
wetting.
M.P. C
S/L
Cd70, thermal-free
solder. Produces low
thermal EMF joints in
[21]
copper, does not form
Cd70Sn30 140/160 Cd no 29.56 70.44
parasitic
thermocouples. Used
in low-temperature
[40]
physics.
[21]
Sn50Pb32Cd18 145 Cd,Pb Cd18 50 32 18
Low melting
temperature allows
[90]
Sn40Pb42Cd18 145 Cd,Pb repairing pewter and 40 42 18
zinc objects, including
die-cast toys.
For soldering
aluminium. Excellent
Zn70Sn30 199/376 no 30 70
[47]
wetting. Good
strength.
For soldering
Zn60Sn40 199/341 no aluminium. Good 40 60

[59]
wetting.
For soldering
Zn95Sn5 382 yes? aluminium. Excellent 5 95

[47]
wetting.
[91]
Sn90Au10 217 yes 90 10
Au80Sn20 280 yes Au80. Good wetting, 20 80
high strength, low
creep, high corrosion
resistance, high
thermal conductivity,
high surface tension,
zero wetting angle.
Suitable for step
soldering. The original
ux-less alloy, does
not need ux. Used for
die attachment and
attachment of metal
M.P. C
S/L
lids to semiconductor
packages, e.g. kovar
lids to ceramic chip
carriers. Coefcient of
expansion matching
many common
materials. Due to zero
wetting angle requires
pressure to form a
void-free joint. Alloy of
choice for joining
gold-plated and gold-
alloy plated surfaces.
As some gold
dissolves from the
surfaces during
soldering and moves
the composition to
non-eutectic state (1%
increase of Au content
can increase melting
point by 30C),
subsequent
desoldering requires
higher
[92]
temperature.
Forms a mixture of
two brittle
intermetallic phases,
[93]
AuSn and Au5Sn.
Brittle. Proper wetting
achieved usually by
using nickel surfaces
with gold layer on top
on both sides of the
joint.
Comprehensively
tested through
military standard
environmental
conditioning. Good
long-term electrical
performance, history
M.P. C
S/L
[38]
of reliability. One
of the best materials
for soldering in
optoelectronic devices
and components
[94]
packaging. Low
vapor pressure,
suitable for vacuum
work. Generally used
in applications that
require a melting
temperature over
[95]
150C. Good
ductility. Also
classied as a braze.
Au98. A non-eutectic
alloy used for die
attachment of silicon
dies. Ultrasonic
[21]
Au98Si2 370/800 assistance is needed 98 Si2
to scrub the chip
surface so a eutectic
(3.1% Si) is reached at
reow.
[92]
Au97. AuSi3.2 is a
eutectic with melting
point of 363C. AuSi
forms a meniscus at
the edge of the chip,
unlike AuSn, as AuSi

[21]
370 reacts with the chip
Au96.8Si3.2 yes 96.8 Si3.2
[96]
363 surface. Forms a
composite material
structure of submicron
silicon plates in soft
gold matrix. Tough,
slow crack
[55]
propagation.
M.P. C
S/L
Au88. Used for die
attachment of some
[20]
chips. The high
[21]
Au87.5Ge12.5 361 356 yes temperature may be 87.5 Ge12.5
detrimental to the
chips and limits

[38]
reworkability.
Au82. High-
[21]
temperature,
Au82In18 451/485 no 18 82
extremely hard, very
stiff.
M.P. C
S/L
In99. Used for die
attachment of some
chips. More suitable
for soldering gold,
dissolution rate of
gold is 17 times slower
than in tin-based
solders and up to 20%
of gold can be
tolerated without
signicant
embrittlement. Good
performance at
cryogenic
[97]
temperatures.
In100 157 pure Wets many surfaces 99.99
incl. quartz, glass, and
many ceramics.
Deforms indenitely
under load. Does not
become brittle even at
low temperatures.
Used as a solder in
low-temperature
physics, will bond to
aluminium. Can be
used for soldering to
thin metal lms or
glass with an
ultrasonic soldering
[40]
iron.
M.P. C
S/L
C-Solder. Lead-free,
low-temperature
soldering alloy for
joining of various
carbon materials
including carbon bres
and carbon nanotube
bres in both carbon-
carbon and carbon-
metal arrangements.
[98]
Produces
Sn90.7Ag3.6Cu0.7Cr5 217/1050 no 90.7 3.6 0.7 Cr5
mechanically strong
and electrically
conductive bonds.
Provides wetting of
[99]
carbon and other
materials generally
considered as difcult
to solder, including
aluminium, stainless
steel, titanium, glass,

[100]
ceramics.
Notes on the above table
[20]
Temperature ranges for solidus and liquidus (the boundaries of the mushy state) are listed as solidus/liquidus.
[20]
In the Sn-Pb alloys, tensile strength increases with increasing tin content. Indium-tin alloys with high indium content have very low tensile strength.
For soldering semiconductor materials, e.g. die attachment of silicon, germanium and gallium arsenide, it is important that the solder contains no
impurities that could cause doping in the wrong direction. For soldering n-type semiconductors, solder may be doped with antimony; indium may be
[47]
added for soldering p-type semiconductors. Pure tin and pure gold can be used.
Various fusible alloys can be used as solders with very low melting points; examples include Field's metal, Lipowitz's alloy, Wood's metal, and Rose's
metal.
Properties
3 [101][102]
The thermal conductivity of common solders ranges from 32 to 94 W/(mK), and the density from 9.25 to 15.00g/cm .
[102] [102]
Thermal conductivity Melting point
Material
[W/(mK)] [C]
Sn-37Pb (eutectic) 50.9 183
Sn-2.8Ag-20.0In 53.5 175186
Sn-2.5Ag-0.8Cu-0.5Sb 57.26 215217
Pb-5Sn 63 310
Lead (Pb) 35.0 327.3
Tin (Sn) 73.0 231.9
Aluminum (Al) 240 660.1
Copper (Cu) 393401 1083
FR-4 1.7
Solidifying
The solidifying behavior depends on the alloy composition. Pure metals solidify at a certain temperature, forming crystals of one phase. Eutectic alloys
also solidify at a single temperature, all components precipitating simultaneously in so-called coupled growth. Non-eutectic compositions on cooling
start to rst precipitate the non-eutectic phase; dendrites when it is a metal, large crystals when it is an intermetallic compound. Such a mixture of solid
particles in a molten eutectic is referred to as a mushy state. Even a relatively small proportion of solids in the liquid can dramatically lower its
[56]
uidity.
The temperature of total solidication is the solidus of the alloy, the temperature at which all components are molten is the liquidus.
The mushy state is desired where a degree of plasticity is benecial for creating the joint, allowing lling larger gaps or being wiped over the joint (e.g.
when soldering pipes). In hand soldering of electronics it may be detrimental as the joint may appear solidied while it is not yet. Premature handling of
such joint then disrupts its internal structure and leads to compromised mechanical integrity.
Alloying element roles
Different elements serve different roles in the solder alloy:
Antimony is added to increase strength without affecting wettability. Prevents tin pest. Should be avoided on zinc, cadmium, or galvanized metals
[26]
as the resulting joint is brittle.
Bismuth signicantly lowers the melting point and improves wettability. In presence of sufcient lead and tin, bismuth forms crystals of
Sn Pb Bi with melting point of only 95C, which diffuses along the grain boundaries and may cause a joint failure at relatively low
16 32 52
temperatures. A high-power part pre-tinned with an alloy of lead can therefore desolder under load when soldered with a bismuth-containing
solder. Such joints are also prone to cracking. Alloys with more than 47% Bi expand upon cooling, which may be used to offset thermal expansion
mismatch stresses. Retards growth of tin whiskers. Relatively expensive, limited availability.
Copper lowers the melting point, improves resistance to thermal cycle fatigue, and improves wetting properties of the molten solder. It also slows
down the rate of dissolution of copper from the board and part leads in the liquid solder. Forms intermetallic compounds. May promote growth of
tin whiskers. Supersaturated (by about 1%) solution of copper in tin may be employed to inhibit dissolution of thin-lm under-bump metallization
[103]
of BGA chips, e.g. as Sn Ag Cu .
94 3 3
[103]
Nickel can be added to the solder alloy to form a supersaturated solution to inhibit dissolution of thin-lm under-bump metallization.
Indium lowers the melting point and improves ductility. In presence of lead it forms a ternary compound that undergoes phase change at 114C.
Very high cost (several times of silver), low availability. Easily oxidizes, which causes problems for repairs and reworks, especially when oxide-
removing ux cannot be used, e.g. during GaAs die attachment. Indium alloys are used for cryogenic applications, and for soldering gold as gold
dissolves in indium much less than in tin. Indium can also solder many nonmetals (e.g. glass, mica, alumina, magnesia, titania, zirconia, porcelain,
brick, concrete, and marble). Prone to diffusion into semiconductors and cause undesired doping. At elevated temperatures easily diffuses
through metals. Low vapor pressure, suitable for use in vacuum systems. Forms brittle intermetallics with gold; indium-rich solders on thick gold
[104]
are unreliable. Indium-based solders are prone to corrosion, especially in presence of chloride ions.
Lead is inexpensive and has suitable properties. Worse wetting than tin. Toxic, being phased out. Retards growth of tin whiskers, inhibits tin pest.
Lowers solubility of copper and other metals in tin.
Silver provides mechanical strength, but has worse ductility than lead. In absence of lead, it improves resistance to fatigue from thermal cycles.
Using SnAg solders with HASL-SnPb-coated leads forms SnPb Ag phase with melting point at 179C, which moves to the board-solder
36 2
[6]
interface, solidies last, and separates from the board. Addition of silver to tin signicantly lowers solubility of silver coatings in the tin phase. In
eutectic tin-silver (3.5% Ag) alloy it tends to form platelets of Ag Sn, which, if formed near a high-stress spot, may serve as initiating sites for
3
[103]
cracks; silver content needs to be kept below 3% to inhibit such problems.
Tin is the usual main structural metal of the alloy. It has good strength and wetting. On its own it is prone to tin pest, tin cry, and growth of tin
whiskers. Readily dissolves silver, gold and to less but still signicant extent many other metals, e.g. copper; this is a particular concern for tin-rich
alloys with higher melting points and reow temperatures.
Zinc lowers the melting point and is low-cost. However it is highly susceptible to corrosion and oxidation in air, therefore zinc-containing alloys
are unsuitable for some purposes, e.g. wave soldering, and zinc-containing solder pastes have shorter shelf life than zinc-free. Can form brittle Cu-
Zn intermetallic layers in contact with copper. Readily oxidizes which impairs wetting, requires a suitable ux.
Germanium in tin-based lead-free solders inuences formation of oxides; at below 0.002% it increases formation of oxides. Optimal concentration
[105]
for suppressing oxidation is at 0.005%.
Impurities in solders
Impurities usually enter the solder reservoir by dissolving the metals present in the assemblies being soldered. Dissolving of process equipment is not
[106]
common as the materials are usually chosen to be insoluble in solder.
Aluminium little solubility, causes sluggishness of solder and dull gritty appearance due to formation of oxides. Addition of antimony to solders
forms Al-Sb intermetallics that are segregated into dross.
Antimony added intentionally, up to 0.3% improves wetting, larger amounts slowly degrade wetting
Arsenic forms thin intermetallics with adverse effects on mechanical properties, causes dewetting of brass surfaces
Cadmium causes sluggishness of solder, forms oxides and tarnishes
Copper most common contaminant, forms needle-shaped intermetallics, causes sluggishness of solders, grittiness of alloys, decreased wetting
Gold easily dissolves, forms brittle intermetallics, contamination above 0.5% causes sluggishness and decreases wetting. Lowers melting point
[52]
of tin-based solders. Higher-tin alloys can absorb more gold without embrittlement.
[7]
Iron forms intermetallics, causes grittiness, but rate of dissolution is very low; readily dissolves in lead-tin above 427C.
Nickel causes grittiness, very little solubility in Sn-Pb
Phosphorus forms tin and lead phosphides, causes grittiness and dewetting, present in electroless nickel plating
Silver often added intentionally, in high amounts forms intermetallics that cause grittiness and formation of pimples on the solder surface
Sulfur forms lead and tin suldes, causes dewetting
Zinc in melt forms excessive dross, in solidied joints rapidly oxidizes on the surface; zinc oxide is insoluble in uxes, impairing repairability;
copper and nickel barrier layers may be needed when soldering brass to prevent zinc migration to the surface
Intermetallics in solders
[106]
Many different intermetallic compounds are formed during solidifying of solders and during their reactions with the soldered surfaces.
The intermetallics form distinct phases, usually as inclusions in a ductile solid solution matrix, but also can form the matrix itself with metal inclusions or
form crystalline matter with different intermetallics. Intermetallics are often hard and brittle. Finely distributed intermetallics in a ductile matrix yield a
hard alloy while coarse structure gives a softer alloy. A range of intermetallics often forms between the metal and the solder, with increasing proportion
of the metal; e.g. forming a structure of Cu-Cu Sn-Cu Sn -Sn.

3 6 5
Layers of intermetallics can form between the solder and the soldered material. These layers may cause mechanical reliability weakening and
brittleness, increased electrical resistance, or electromigration and formation of voids. The gold-tin intermetallics layer is responsible for poor
mechanical reliability of tin-soldered gold-plated surfaces where the gold plating did not completely dissolve in the solder.
Gold and palladium readily dissolve in solders. Copper and nickel tend to form intermetallic layers during normal soldering proles. Indium forms
intermetallics as well.
Indium-gold intermetallics are brittle and occupy about 4 times more volume than the original gold. Bonding wires are especially susceptible to indium
[107]
attack. Such intermetallic growth, together with thermal cycling, can lead to failure of the bonding wires.
Copper plated with nickel and gold is often used. The thin gold layer facilitates good solderability of nickel as it protects the nickel from oxidation; the
[16]
layer has to be thin enough to rapidly and completely dissolve so bare nickel is exposed to the solder.
Lead-tin solder layers on copper leads can form copper-tin intermetallic layers; the solder alloy is then locally depleted of tin and form a lead-rich layer.
[108]
The Sn-Cu intermetallics then can get exposed to oxidation, resulting in impaired solderability.
Two processes play a role in a solder joint formation: interaction between the substrate and molten solder, and solid-state growth of intermetallic
compounds. The base metal dissolves in the molten solder in an amount depending on its solubility in the solder. The active constituent of the solder
reacts with the base metal with a rate dependent on the solubility of the active constituents in the base metal. The solid-state reactions are more
complex the formation of intermetallics can be inhibited by changing the composition of the base metal or the solder alloy, or by using a suitable
[109]
barrier layer to inhibit diffusion of the metals.
Tin Lead Indium
Copper Cu4Sn, Cu6Sn5, Cu3Sn, Cu3Sn8 Cu3In, Cu9In4
Nickel Ni3Sn, Ni3Sn2, Ni3Sn4 NiSn3 Ni3In, NiIn Ni2In3, Ni3In7
Iron FeSn, FeSn2
Indium In3Sn, InSn4 In3Pb
Antimony SbSn
Bismuth BiPb3
Silver Ag6Sn, Ag3Sn Ag3In, AgIn2
Gold Au5Sn, AuSn AuSn2, AuSn4 Au2Pb, AuPb2 AuIn, AuIn2
Palladium Pd3Sn, Pd2Sn, Pd3Sn2, PdSn, PdSn2, PdSn4 Pd3In, Pd2In, PdIn Pd2In3
Platinum Pt3Sn, Pt2Sn, PtSn, Pt2Sn3, PtSn2, PtSn4 Pt3Pb, PtPb PtPb4 Pt2In3, PtIn2, Pt3In7
Cu Sn common on solder-copper interface, forms preferentially when excess of tin is available; in presence of nickel (Cu,Ni) Sn compound can
6 5 6 5
be formed
Cu Sn common on solder-copper interface, forms preferentially when excess of copper is available, more thermally stable than Cu Sn , often
3 6 5
present when higher-temperature soldering occurred
Ni Sn common on solder-nickel interface

3 4
FeSn very slow formation

2
Ag Sn- at higher concentration of silver (over 3%) in tin forms platelets that can serve as crack initiation sites.
3
AuSn
4
-phase brittle, forms at excess of tin. Detrimental to properties of tin-based solders to gold-plated layers.
AuIn forms on the boundary between gold and indium-lead solder, acts as a barrier against further dissolution of gold
2
Glass solder
Glass solders are used to join glasses to other glasses, ceramics, metals, semiconductors, mica, and other materials, in a process called glass frit
bonding. The glass solder has to ow and wet the soldered surfaces well below the temperature where deformation or degradation of either of the
joined materials or nearby structures (e.g., metallization layers on chips or ceramic substrates) occurs. The usual temperature of achieving owing and
wetting is between 450 and 550C.
Two types of glass solders are used: vitreous, and devitrifying. Vitreous solders retain their amorphous structure during remelting, can be reworked
repeatedly, and are relatively transparent. Devitrifying solders undergo partial crystallization during solidifying, forming a glass-ceramic, a composite of
glassy and crystalline phases. Devitrifying solders usually create a stronger mechanical bond, but are more temperature-sensitive and the seal is more
[110]
likely to be leaky; due to their polycrystalline structure they tend to be translucent or opaque. Devitrifying solders are frequently "thermosetting",
as their melting temperature after recrystallization becomes signicantly higher; this allows soldering the parts together at lower temperature than the
subsequent bake-out without remelting the joint afterwards. Devitrifying solders frequently contain up to 25% zinc oxide. In production of cathode ray
tubes, devitrifying solders based on PbO-B O -ZnO are used.

2 3
Very low temperature melting glasses, uid at 200400C, were developed for sealing applications for electronics. They can consist of binary or
[111]
ternary mixtures of thallium, arsenic and sulfur. Zinc-silicoborate glasses can also be used for passivation of electronics; their coefcient of thermal
expansion must match silicon (or the other semiconductors used) and they must not contain alkaline metals as those would migrate to the
[112]
semiconductor and cause failures.
[113]
The bonding between the glass or ceramics and the glass solder can be either covalent, or, more often, van der Waals. The seal can be leak-tight;
glass soldering is frequently used in vacuum technology. Glass solders can be also used as sealants; a vitreous enamel coating on iron lowered its
[114]
permeability to hydrogen 10 times. Glass solders are frequently used for glass-to-metal seals and glass-ceramic-to-metal seals.
Glass solders are available as frit powder with grain size below 60 micrometers. They can be mixed with water or alcohol to form a paste for easy
[115]
application, or with dissolved nitrocellulose or other suitable binder for adhering to the surfaces until being melted. The eventual binder has to be
burned off before melting proceeds, requiring careful ring regime. The solder glass can be also applied from molten state to the area of the future joint
during manufacture of the part. Due to their low viscosity in molten state, lead glasses with high PbO content (often 7085%) are frequently used. The
most common compositions are based on lead borates (leaded borate glass or borosilicate glass). Smaller amount of zinc oxide or aluminium oxide can
be added for increasing chemical stability. Phosphate glasses can be also employed. Zinc oxide, bismuth trioxide, and copper(II) oxide can be added for
inuencing the thermal expansion; unlike the alkali oxides, these lower the softening point without increasing of thermal expansion.
Glass solders are frequently used in electronic packaging. CERDIP packagings are an example. Outgassing of water from the glass solder during
encapsulation was a cause of high failure rates of early CERDIP integrated circuits. Removal of glass-soldered ceramic covers, e.g., for gaining access to
[116]
the chip for failure analysis or reverse engineering, is best done by shearing; if this is too risky, the cover is polished away instead.
As the seals can be performed at much lower temperature than with direct joining of glass parts and without use of ame (using a temperature-
controlled kiln or oven), glass solders are useful in applications like subminiature vacuum tubes or for joining mica windows to vacuum tubes and
instruments (e.g., Geiger tube). Thermal expansion coefcient has to be matched to the materials being joined and often is chosen in between the
coefcients of expansion of the materials. In case of having to compromise, subjecting the joint to compression stresses is more desirable than to
tensile stresses. The expansion matching is not critical in applications where thin layers are used on small areas, e.g., reable inks, or where the joint will
[111]
be subjected to a permanent compression (e.g., by an external steel shell) offsetting the thermally introduced tensile stresses.
Glass solder can be used as an intermediate layer when joining materials (glasses, ceramics) with signicantly different coefcient of thermal
[117] [118]
expansion; such materials cannot be directly joined by diffusion welding. Evacuated glazing windows are made of glass panels soldered together.
A glass solder is used, e.g., for joining together parts of cathode ray tubes and plasma display panels. Newer compositions lowered the usage
temperature from 450 to 390C by reducing the lead(II) oxide content down from 70%, increasing the zinc oxide content, adding titanium dioxide and
bismuth(III) oxide and some other components. The high thermal expansion of such glass can be reduced by a suitable ceramic ller. Lead-free solder
glasses with soldering temperature of 450C were also developed.
Phosphate glasses with low melting temperature were developed. One of such compositions is phosphorus pentoxide, lead(II) oxide, and zinc oxide, with
[119]
addition of lithium and some other oxides.
Conductive glass solders can be also prepared.
Preform
[120]
A preform is a pre-made shape of solder specially designed for the application where it is to be used. Many methods are used to manufacture the
solder preform, stamping being the most common. The solder preform may include the solder ux needed for the soldering process. This can be an
[121]
internal ux, inside the solder preform, or external, with the solder preform coated.
See also
Body solder
RoHS
Solderability
Solder mask
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Alloy" (http://www.matweb.com/search/DataSheet.aspx?MatGUID=1 matweb.com/search/DataSheet.aspx?MatGUID=67e162f8c187441a8
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20 August 2016. 778b662660244af7b8d9689a007e8813). Retrieved 20 July 2016.
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55. Ganesan and Pecht p. 404 33eb48bba5f38c1217c73ce3). Retrieved 20 July 2016.
56. "The Fluidity of the Ni-Modied Sn-Cu Eutectic Lead-Free Solder" (ht 69. "Indium Corp. Indalloy 282 57Bi/42Sn/1Ag Lead-Free Solder
tp://www.aimsolder.com/sites/default/les/the_uidity_of_the_ni- Alloy" (http://www.matweb.com/search/DataSheet.aspx?MatGUID=
modied_sn-cu_eutectic_lead-free_solder_white_paper.pdf) (PDF). 3f9d5aa624ea454f81308048ab101817). Retrieved 20 July 2016.
Retrieved 20 August 2016. 70. "Indium Corp. Indalloy 281 Bi-Sn Solder Alloy" (http://www.matwe
57. Balver Zinn Solder SCA (SnCu0.7Ag0.3) (http://www.balverzinn.co b.com/search/DataSheet.aspx?MatGUID=967a4cd7871b46fa9128a2
m/downloads/Solder_SCA.pdf) 9c303cf8be). Retrieved 20 July 2016.
58. Balver Zinn Solder Sn97Cu3 (http://www.balverzinn.com/download 71. "Indium Corp. Indalloy 67 Bismuth-Lead Solder Alloy" (http://www.m
s/Solder_Sn97Cu3.pdf) Archived (https://web.archive.org/web/2011 atweb.com/search/DataSheet.aspx?MatGUID=4c19e3682c3b4d319
0707210148/http://www.balverzinn.com/downloads/Solder_Sn97C 8f3025b81cce73f). Retrieved 20 July 2016.
u3.pdf) 2011-07-07 at the Wayback Machine. 72. "Indium Corp. Indalloy 2 In-Pb-Ag Solder Alloy" (http://www.matw
59. Howard H. Manko (8 February 2001). Solders and soldering: materials, eb.com/search/DataSheet.aspx?MatGUID=03e0734456b74c088b9f
design, production, and analysis for reliable bonding (https://books.go 9c19f6af6ab9). Retrieved 20 July 2016.
ogle.com/books?id=MvSMg5HC1YcC&pg=PA396). McGraw-Hill 73. "Indium Corp. Indalloy 532 Tin Solder Alloy" (http://www.matweb.co
Professional. pp.396. ISBN978-0-07-134417-3. Retrieved 17 April m/search/DataSheet.aspx?MatGUID=fcd842de41fd4fcba925041861
2011. 2914bf). Retrieved 20 July 2016.
60. "KappAloy" (http://www.kappalloy.com/tin-zinc-solder.php). Kapp 74. "Indium Corp. Indalloy 150 Pb-In Solder Alloy" (http://www.matwe
Alloy & Wire, Inc. Retrieved 23 October 2012. b.com/search/DataSheet.aspx?MatGUID=d7525946b1a446afa73b5
61. "Indium Corp. Indalloy 249 91.8Sn/3.4Ag/4.8Bi Lead-Free Solder dd52997a283). Retrieved 20 July 2016.
Alloy" (http://www.matweb.com/search/DataSheet.aspx?MatGUID=f 75. "Indium Corp. Indalloy 87 Indium-Tin Solder Alloy" (http://www.mat
bf7a599eb0e407981ed2f785bbe24ee). Retrieved 20 July 2016. web.com/search/DataSheet.aspx?MatGUID=aea1c42aa0a341aa948
62. Composition And Physical Properties Of Alloys (http://www.csudh.e d7103c3a4564b). Retrieved 20 July 2016.
du/oliver/chemdata/alloys.htm) Archived (https://web.archive.org/ 76. "Indium Corp. Indalloy 181 Sn-Pb-Cd Solder Alloy" (http://www.mat
web/20120426211236/https://www.csudh.edu/oliver/chemdata/all web.com/search/DataSheet.aspx?MatGUID=199da4a304e4410486
oys.htm) 2012-04-26 at the Wayback Machine.. Csudh.edu (2007- 8eaf537a7c9a16). Retrieved 20 July 2016.
08-18). Retrieved 2010-07-06. 77. "Indium Corp. Indalloy 227 Sn-In-Ag Solder Alloy" (http://www.ma
63. Karl J. Puttlitz; Kathleen A. Stalter (2004). Handbook of lead-free tweb.com/search/DataSheet.aspx?MatGUID=e2f902d610494ab7a7f
solder technology for microelectronic assemblies (https://books.googl 500fcfbdb43cc). Retrieved 20 July 2016.
e.com/?id=H75TywRXUK4C&pg=PA21). CRC Press. ISBN0-8247- 78. "Indium Corp. Indalloy 253 Indium Solder Alloy" (http://www.matwe
4870-0. b.com/search/DataSheet.aspx?MatGUID=1fef3a2158ba400abe6f7e
2a5c171ca1). Retrieved 20 July 2016.
79. "Indium Corp. Indalloy 18 Indium Solder Alloy" (http://www.matweb.c 96. "Indium Corp. Indalloy 184 Gold Solder Alloy" (http://www.matweb.c
om/search/DataSheet.aspx?MatGUID=4ccb81db2b7e4eb5a5174094 om/search/DataSheet.aspx?MatGUID=ac3061509fca4befa1191973b
45b37deb). Retrieved 20 July 2016. e39cd62). Retrieved 20 July 2016.
80. "Indium Corp. Indalloy 140 Bismuth Solder Alloy" (http://www.matwe 97. T.Q. Collier (MayJun 2008). "Choosing the best bumb for the buck"
b.com/search/DataSheet.aspx?MatGUID=61beeec304154e14b71198 (https://books.google.com/?id=71tVjt0QUrEC&pg=PT27). Advanced
4757f073ed). Retrieved 20 July 2016. Packaging. 17 (4): 24. ISSN1065-0555 (https://www.worldcat.org/iss
81. "Indium Corp. Indalloy 147 Bismuth Solder Alloy" (http://www.matwe n/1065-0555).
b.com/search/DataSheet.aspx?MatGUID=bf336aff588c4e72acb714 98. M. Burda; et al. (Aug 2015). "Soldering of carbon materials using
d5a4ae13c6). Retrieved 20 July 2016. transition metal rich alloys" (http://pubs.acs.org/doi/abs/10.1021/ac
82. "Indium Corp. Indalloy 21 Bismuth Solder Alloy" (http://www.matwe snano.5b02176). ACS Nano. 9 (8): 8103.
b.com/search/DataSheet.aspx?MatGUID=5a48bcea477c4b2eb9153 99. Technical Data Sheet, Cametics C-Solder active soldering alloy (htt
f5fc28243da). Retrieved 20 July 2016. p://www.cametics.com/resources/upload/data%20sheets/Cametic
83. Johnson Manufacturing Co, MSDS for Chip Quik Alloy w/Lead (htt s%20C-SOLDER%20Technical%20data%20sheet%20-%20Augus
p://www.chipquik.com/msds/SMD1.pdf). Retrieved on February 6, t%202016.pdf)
2015. 100. http://www.cametics.com/en/Services/Blog/?
84. "Indium Corp. Indalloy 22 Bismuth Solder Alloy" (http://www.matwe id=171/Soldering_of_Carbon Soldering of dissimilar materials
b.com/search/DataSheet.aspx?MatGUID=82d47484509e4e81b53f4 101. "Thermal Properties of Metals, Conductivity, Thermal Expansion,
87bed41a324). Retrieved 20 July 2016. Specic Heat - Engineers Edge" (http://www.engineersedge.com/pr
85. "Chip Quik - SMD Removal Kit (Chip Quik Alloy 2.5ft, ux, alcohol operties_of_metals.htm). Retrieved 20 July 2016.
pads) lead-free" (http://www.chipquik.com/store/product_info.php? 102. "Database for Solder Properties with Emphasis on New Lead-free
products_id=220001). Retrieved 20 July 2016. Solders" (http://www.metallurgy.nist.gov/solder/NIST_LeadfreeSold
86. "KappTec" (http://www.kappalloy.com/tec-solder.php). Kapp Alloy & er_v4.pdf) (PDF). metallurgy.nist.gov. 2012-07-10. Retrieved
Wire, Inc. Retrieved 23 October 2012. 2013-06-08.
87. "Kapp Cad/Zinc" (http://www.kappalloy.com/cad-zinc-solder.php). 103. King-Ning-Tu Solder Joint Technology Materials, Properties, and
Kapp Alloy & Wire, Inc. Retrieved 23 October 2012. Reliability (Springer 2007)
88. Kapp Alloy. "KappTecZ" (http://www.kappalloy.com/tecz- 104. I. R. Walker (31 March 2011). Reliability in Scientic Research:
solder.php). Kapp Alloy & Wire, Inc. Retrieved 25 October 2012. Improving the Dependability of Measurements, Calculations,
89. "KappRad" (http://www.kappalloy.com/kapprad-solder.php). Kapp Equipment, and Software (https://books.google.com/books?id=zhX_
Alloy & Wire, Inc. Retrieved 25 October 2012. 5hccFWMC&pg=PA160). Cambridge University Press. pp.160.
90. Soft Solders (http://www.cupalloys.co.uk/soft-solders-c41.html). ISBN978-0-521-85770-3. Retrieved 14 May 2011.
www.cupalloys.co.uk (2009-01-20). Retrieved 2010-07-06. 105. Balver Zinn Desoxy RSN (http://www.balverzinn.com/downloads/DE
91. "Indium Corp. Indalloy 238 Sn-Au Solder Alloy" (http://www.matw SOXY_RSN_GB.pdf)
eb.com/search/DataSheet.aspx?MatGUID=ec6a4e98e2294ead8788 106. Michael Pecht (1993). Soldering processes and equipment (https://bo
107da410c9d8). Retrieved 20 July 2016. oks.google.com/?id=Mu0o3X_k7p8C&pg=PA18). Wiley-IEEE. p.18.
92. Gold Tin The Unique Eutectic Solder Alloy (http://www.indium.co ISBN0-471-59167-X.
m/_dynamo/download.php?docid=298) 107. http://nepp.nasa.gov/wirebond/literatures/na-gsfc-2004-01.pdf
93. "Chip Scale Review Magazine" (http://www.chipscalereview.com/iss GSFC NASA Advisory: Indium solder encapsulating gold bonding wire
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Chipscalereview.com. 2004-04-20. Retrieved 2010-03-31. that results in wire interconnection rupture
94. Au/Sn Solder Alloy and Its Applications in Electronics Packaging (htt 108. Jennie S. Hwang (1996). Modern solder technology for competitive
p://www.ametek-ecp.com/~/media/ametek-ecp/les/cwtechnicalpa electronics manufacturing (https://books.google.com/?id=GTq6w21s
pers/coining_english_gold_tin_paper.ashx) 2cwC&pg=PA397). McGraw-Hill Professional. p.397. ISBN0-07-
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p.389. ISBN0-7506-7757-0. 120. http://www.quadsimia.com/, Quadsimia Internet Solutions -. "Solder
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ogle.com/?id=sdKAPJh5RgQC&pg=PA273). Springer. p.273. ISBN1- com/products/solderfabrications/preforms.php). Retrieved 20 July
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Bibliography
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78617-9.
External links
Phase diagrams of different types of solder alloys (http://www.metallurgy.nist.gov/phase/solder/solder.html)
Retrieved from "https://en.wikipedia.org/w/index.php?title=Solder&oldid=795901337"
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Solder Wiki Inc Solder Melting Points

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8/21/2017 Solder - Wikipedia

Solder (/ so ldr/, [1]

5.1 Notes on the above table

5.4 Alloying element roles

5.5 Impurities in solders

soldering, to reduce maintenance cost due to increased tin-scavenging of high-tin solder.

properties are less thoroughly known.

Sandia National Laboratories-Albuquerque.

Soldering copper pipes using a

Zinc (Sn-Ag-Cu-Zn) (melting range of 217220C) and 18/64/16/2Tin-Silver-Copper-Manganese (Sn-Ag-Cu-Mn)

(melting range of 211215C).

2. the melting point is truly a point not a range.

proportion of tin was increased (see Lead-free solder.)

of lead-free solder technology for microelectronic

risk damaging delicate circuitry.

instead of hydrocarbon solvents.

rosin core, visible as a dark spot in

silver (up to 40%), and may also contain cadmium.

specically for high

to the steel, for a

good joint strength,

and thermal cycle

both piping and

Wets well to brass,

copper, and stainless

steel. Good electrical

with the specied

current and charge

leakage out of and

within the layers of the

electron ows within

the coating material

itself, that would

Sn10, UNS L54520,

ASTM10B. Balls for

Low cost and good

Rapidly dissolves gold

and silver, not

tanks, for coating and

bonding of metals for

thermal EMF, can be

Used for fabrication of

car radiators and fuel

tanks, for coating and

Used for coating tubes

radiators. Body solder.

Sn20, UNS L54711.

Crude solder for

Used for soldering car

plumbing xtures and

ttings. Superior body

Sn30, UNS L54280,

crude solder for

good for machine and

for machine, dip and

plumbing xtures and

ttings. Superior body

"Plumber solder", for

Pb68Sn32 253 Pb no construction plumbing 32 68

Economical solder for

repairing & joining

most metals including

Iron. Have been used

for cast Iron and