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1. Product profile
1.3 Applications
Low current peripheral driver
Control of IC inputs
Replaces general-purpose transistors in digital applications
2. Pinning information
Table 3. Pinning
Pin Description Simplified outline Graphic symbol
1 GND (emitter) TR1
6 5 4 6 5 4
2 input (base) TR1
3 output (collector) TR2
R1 R2
4 GND (emitter) TR2
TR2
5 input (base) TR2 TR1
1 2 3
6 output (collector) TR1 001aab555 R2 R1
1 2 3
sym063
3. Ordering information
Table 4. Ordering information
Type number Package
Name Description Version
PEMH9 - plastic surface-mounted package; 6 leads SOT666
PIMH9 SC-74 plastic surface-mounted package (TSOP6); 6 leads SOT457
PUMH9 SC-88 plastic surface-mounted package; 6 leads SOT363
4. Marking
Table 5. Marking codes
Type number Marking code[1]
PEMH9 H9
PIMH9 H9
PUMH9 H*9
PEMH9_PIMH9_PUMH9 All information provided in this document is subject to legal disclaimers. NXP B.V. 2013. All rights reserved.
5. Limiting values
Table 6. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
Per transistor
VCBO collector-base voltage open emitter - 50 V
VCEO collector-emitter voltage open base - 50 V
VEBO emitter-base voltage open collector - 6 V
VI input voltage
positive - +40 V
negative - 6 V
IO output current - 100 mA
ICM peak collector current single pulse; - 100 mA
tp 1 ms
Ptot total power dissipation Tamb 25 C
PEMH9 (SOT666) [1] - 200 mW
PIMH9 (SOT457) [1] 250 mW
PUMH9 (SOT363) [1] - 200 mW
Per device
Ptot total power dissipation Tamb 25 C
PEMH9 (SOT666) [1] - 300 mW
PIMH9 (SOT457) [1] 400 mW
PUMH9 (SOT363) [1] - 300 mW
Tj junction temperature - 150 C
Tamb ambient temperature 55 +150 C
Tstg storage temperature 65 +150 C
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
PEMH9_PIMH9_PUMH9 All information provided in this document is subject to legal disclaimers. NXP B.V. 2013. All rights reserved.
006aac766
500
Ptot
(mW)
(1)
400
(2)
300
200
100
0
-75 -25 25 75 125 175
Tamb (C)
6. Thermal characteristics
Table 7. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
Per transistor
Rth(j-a) thermal resistance from in free air
junction to ambient
PEMH9 (SOT666) [1] - - 625 K/W
PIMH9 (SOT457) [1] - - 500 K/W
PUMH9 (SOT363) [1] - - 625 K/W
Per device
Rth(j-a) thermal resistance from in free air
junction to ambient
PEMH9 (SOT666) [1] - - 417 K/W
PIMH9 (SOT457) [1] - - 313 K/W
PUMH9 (SOT363) [1] - - 417 K/W
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
PEMH9_PIMH9_PUMH9 All information provided in this document is subject to legal disclaimers. NXP B.V. 2013. All rights reserved.
006aac751
103
duty cycle = 1
Zth(j-a) 0.75
(K/W) 0.5
0.33
102 0.2
0.1
0.05
0.02 0.01
10
1
10-5 10-4 10-3 10-2 10-1 1 10 102 103
tp (s)
006aac767
103
duty cycle = 1
Zth(j-a)
0.75
(K/W)
0.5
0.33
102 0.2
0.1
0.05
0.02 0.01
10
1
10-5 10-4 10-3 10-2 10-1 1 10 102 103
tp (s)
PEMH9_PIMH9_PUMH9 All information provided in this document is subject to legal disclaimers. NXP B.V. 2013. All rights reserved.
006aac750
103
duty cycle = 1
Zth(j-a) 0.75
(K/W) 0.5
0.33
102 0.2
0.1
0.05
0.02
0.01
10
1
10-5 10-4 10-3 10-2 10-1 1 10 102 103
tp (s)
PEMH9_PIMH9_PUMH9 All information provided in this document is subject to legal disclaimers. NXP B.V. 2013. All rights reserved.
7. Characteristics
Table 8. Characteristics
Tamb = 25 C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
Per transistor
ICBO collector-base cut-off VCB = 50 V; IE = 0 A - - 100 nA
current
ICEO collector-emitter cut-off VCE = 30 V; IB = 0 A - - 100 nA
current VCE = 30 V; IB = 0 A; - - 5 A
Tj = 150 C
IEBO emitter-base cut-off VEB = 5 V; IC = 0 A - - 150 A
current
hFE DC current gain VCE = 5 V; IC = 5 mA 100 - -
VCEsat collector-emitter IC = 5 mA; IB = 0.25 mA - - 100 mV
saturation voltage
VI(off) off-state input voltage VCE = 5 V; IC = 100 A - 0.7 0.5 V
VI(on) on-state input voltage VCE = 0.3 V; IC = 1 mA 1.4 0.8 - V
R1 bias resistor 1 (input) 7 10 13 k
R2/R1 bias resistor ratio 3.7 4.7 5.7
Cc collector capacitance VCB = 10 V; IE = ie = 0 A; - - 2.5 pF
f = 1 MHz
fT transition frequency VCE = 5 V; IC = 10 mA; [1] - 230 - MHz
f = 100 MHz
PEMH9_PIMH9_PUMH9 All information provided in this document is subject to legal disclaimers. NXP B.V. 2013. All rights reserved.
006aac784 006aac785
103 1
hFE (1)
(2)
(3)
VCEsat
(V)
102
(1)
10-1
(2)
(3)
10
1 10-2
10-1 1 10 102 10-1 1 10 102
IC (mA) IC (mA)
VCE = 5 V IC/IB = 20
(1) Tamb = 100 C (1) Tamb = 100 C
(2) Tamb = 25 C (2) Tamb = 25 C
(3) Tamb = 40 C (3) Tamb = 40 C
Fig 5. DC current gain as a function of collector Fig 6. Collector-emitter saturation voltage as a
current; typical values function of collector current; typical values
006aac786 006aac787
10 10
VI(on) VI(off)
(V) (V)
(1)
1 1 (1)
(2)
(2)
(3)
(3)
10-1 10-1
10-1 1 10 102 10-1 1 10
IC (mA) IC (mA)
PEMH9_PIMH9_PUMH9 All information provided in this document is subject to legal disclaimers. NXP B.V. 2013. All rights reserved.
006aac788 006aac757
3 103
Cc
(pF)
fT
(MHz)
2
102
0 10
0 10 20 30 40 50 10-1 1 10 102
VCB (V) IC (mA)
8. Test information
PEMH9_PIMH9_PUMH9 All information provided in this document is subject to legal disclaimers. NXP B.V. 2013. All rights reserved.
9. Package outline
6 5 4 6 5 4 0.6
0.2
0.3
0.1
1.7 1.3 3.0 1.7
1.5 1.1 2.5 1.3 pin 1 index
pin 1 index
1 2 3 1 2 3
0.27 0.18 0.40 0.26
0.5 0.08 0.95 0.25 0.10
0.17
1 1.9
Dimensions in mm 04-11-08 Dimensions in mm 04-11-08
Fig 11. Package outline PEMH9 (SOT666) Fig 12. Package outline PIMH9 (SOT457)
2.2 1.1
1.8 0.8
6 5 4 0.45
0.15
2.2 1.35
2.0 1.15 pin 1
index
1 2 3
0.3 0.25
0.65 0.2 0.10
1.3
Dimensions in mm 06-03-16
PEMH9_PIMH9_PUMH9 All information provided in this document is subject to legal disclaimers. NXP B.V. 2013. All rights reserved.
10. Soldering
3.45
1.95
0.95
solder paste
occupied area
0.7 Dimensions in mm
(6)
0.8
(6)
2.4 sot457_fr
5.3
1.5
(4)
solder lands
1.475
solder resist
0.45
5.05
(2)
occupied area
1.475
Dimensions in mm
preferred transport
direction during soldering
1.45
(6)
2.85 sot457_fw
PEMH9_PIMH9_PUMH9 All information provided in this document is subject to legal disclaimers. NXP B.V. 2013. All rights reserved.
2.65
solder lands
2.35 1.5 0.6 0.5 0.4 (2)
(4) (4) solder resist
solder paste
1.5
solder lands
4.5 0.3 2.5
solder resist
occupied area
1.5
Dimensions in mm
preferred transport
1.3 1.3 direction during soldering
2.45
5.3 sot363_fw
PEMH9_PIMH9_PUMH9 All information provided in this document is subject to legal disclaimers. NXP B.V. 2013. All rights reserved.
2.75
2.45
2.1
1.6
solder lands
0.4
(6) 0.25 0.3
0.538 (2) (2) placement area
0.55
2 1.7 1.075
(2) solder paste
occupied area
0.325 0.375
(4) (4) Dimensions in mm
1.7
0.45 0.6
(4) (2)
0.5 0.65
(4) (2) sot666_fr
PEMH9_PIMH9_PUMH9 All information provided in this document is subject to legal disclaimers. NXP B.V. 2013. All rights reserved.
PEMH9_PIMH9_PUMH9 All information provided in this document is subject to legal disclaimers. NXP B.V. 2013. All rights reserved.
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term short data sheet is explained in section Definitions.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
12.3 Disclaimers NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customers applications or products, or the application or use by customers
Limited warranty and liability Information in this document is believed to
third party customer(s). Customer is responsible for doing all necessary
be accurate and reliable. However, NXP Semiconductors does not give any
testing for the customers applications and products using NXP
representations or warranties, expressed or implied, as to the accuracy or
Semiconductors products in order to avoid a default of the applications and
completeness of such information and shall have no liability for the
the products or of the application or use by customers third party
consequences of use of such information. NXP Semiconductors takes no
customer(s). NXP does not accept any liability in this respect.
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors. Limiting values Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
In no event shall NXP Semiconductors be liable for any indirect, incidental,
damage to the device. Limiting values are stress ratings only and (proper)
punitive, special or consequential damages (including - without limitation - lost
operation of the device at these or any other conditions above those given in
profits, lost savings, business interruption, costs related to the removal or
the Recommended operating conditions section (if present) or the
replacement of any products or rework charges) whether or not such
Characteristics sections of this document is not warranted. Constant or
damages are based on tort (including negligence), warranty, breach of
repeated exposure to limiting values will permanently and irreversibly affect
contract or any other legal theory.
the quality and reliability of the device.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors aggregate and cumulative liability towards Terms and conditions of commercial sale NXP Semiconductors
customer for the products described herein shall be limited in accordance products are sold subject to the general terms and conditions of commercial
with the Terms and conditions of commercial sale of NXP Semiconductors. sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
Right to make changes NXP Semiconductors reserves the right to make agreement is concluded only the terms and conditions of the respective
changes to information published in this document, including without agreement shall apply. NXP Semiconductors hereby expressly objects to
limitation specifications and product descriptions, at any time and without applying the customers general terms and conditions with regard to the
notice. This document supersedes and replaces all information supplied prior purchase of NXP Semiconductors products by customer.
to the publication hereof.
PEMH9_PIMH9_PUMH9 All information provided in this document is subject to legal disclaimers. NXP B.V. 2013. All rights reserved.
No offer to sell or license Nothing in this document may be interpreted or Translations A non-English (translated) version of a document is for
construed as an offer to sell products that is open for acceptance or the grant, reference only. The English version shall prevail in case of any discrepancy
conveyance or implication of any license under any copyrights, patents or between the translated and English versions.
other industrial or intellectual property rights.
Export control This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
12.4 Trademarks
authorization from competent authorities. Notice: All referenced brands, product names, service names and trademarks
Quick reference data The Quick reference data is an extract of the are the property of their respective owners.
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
PEMH9_PIMH9_PUMH9 All information provided in this document is subject to legal disclaimers. NXP B.V. 2013. All rights reserved.
14. Contents
1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 General description . . . . . . . . . . . . . . . . . . . . . 1
1.2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1
2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2
4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
6 Thermal characteristics . . . . . . . . . . . . . . . . . . 4
7 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 7
8 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 9
8.1 Quality information . . . . . . . . . . . . . . . . . . . . . . 9
9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10
10 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
11 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 14
12 Legal information. . . . . . . . . . . . . . . . . . . . . . . 15
12.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 15
12.2 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
12.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
12.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 16
13 Contact information. . . . . . . . . . . . . . . . . . . . . 16
14 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section Legal information.