SMT Components

SIPLACE Pro Programming Training

Logistics & Assembly Systems

 Logistics & Assembly Systems

Component Models and Package Types

SMT Components Surface Mount Components

Important Package Types for passive components.

2
 Logistics & Assembly Systems

Component Models and Package Types

SMT Components Chip Components

Resistors,
Capacitors,
Inductors.

Comparison of Chip models to scale.

The trend towards smaller dimensions is also apparent

here. A size 0201 resistor or capacitor only requires 2.5%
of the surface area required by 1206 a component.

3
 Logistics & Assembly Systems

Component Models and Package Types

SMT Components SOT Components

SOT - Small Outline Transistors

SMD package types for discrete

semiconductor components (diodes
and transistors). Components with
high power dissipation are also
available in SMD packages.

4
 Logistics & Assembly Systems

Component Models and Package Types

SMT Components Integrated Circuits

QFP - Quad Flat Pack and PLCC - Plastic Leaded Chip Carrier

QFP - Quad Flat Pack in use today:

80PinQFP

132PinQFP

PLCC - Plastic Leaded Chip Carrier in

use today:

28PinPLCC

32PinPLCC

44PinPLCC

68PinPLCC

5
 Logistics & Assembly Systems

Component Models and Package Types

SMT Components SOIC Components

SOIC - Small Outline Integrated Circuit

6
 Logistics & Assembly Systems

Pin Forms for SMD Components

SMT Components

Gull wing I connection Metalized

connection connection

Balls
BGA
Ball Grid Array

Connection Bumps
J connection
strip
Flip chip

7
 Logistics & Assembly Systems

Component Package Forms

SMT Components SMT Package Forms for ICs - Plastic

SO
Small Outline

QFP
Quad Flatpack

Plastic GA
Packages Grid Array

FP
Flatpack

PLCC
Plastic Lead Chip Carrier

8
 Logistics & Assembly Systems

Component Package Forms

SMT Components SMT Package Forms for ICs - Plastic

SO(L)
Small Outline

SOJ
Small Outline J-Lead
SO
Small
Outline
SSOP / TSSOP
(Thin) Shrink Small Outline

TSOP I/II
Thin Small Outline Package

9
 Logistics & Assembly Systems

Component Package Forms

SMT Components SMT Package Forms for ICs - Plastic

BQFP
Bumpered Quad Flatpack

MQFP
Metric Quad Flatpack

QFP FQFP
Quad Flatpack Fine Pitch Quad Flatpack

TQFP
Thin Quad Flatpack

GQFP
Guard Ring Quad Flatpack

10
 Logistics & Assembly Systems

Component Package Forms

SMT Components SMT Package Forms for ICs - Plastic

PLCC
Plastic Lead Chip Carrier

Plastic FP
Packages Flatpack

GA BGA
Grid Array Ball Grid Array

11
 Logistics & Assembly Systems

Component Orientation in SIPLACE Machines

SMT Components Component coordinates - Rule 1

Rule 1
A rectangular nozzle is located with ist
longitudinal axis parallel to the X axis.

12
 Logistics & Assembly Systems

Component Orientation in SIPLACE Machines

SMT Components Component coordinates - Rule 2

Rule 2
Pin 1 is in the bottom left corner or in the center of the
left side.
With diodes, the anode must point in the positive
direction of the X axis.

13
 Logistics & Assembly Systems

Component Orientation in SIPLACE Machines

SMT Components Component coordinates - Rule 3

Rule 3
The side with most leads is at the bottom.

14
 Logistics & Assembly Systems

Component Orientation in SIPLACE Machines

SMT Components Component coordinates - Rule 4

Rule 4
If a component has a special feature, e.g. if one
pin is wider, this pin is at the bottom.

15
 Logistics & Assembly Systems

Component Orientation in SIPLACE Machines

SMT Components Overview of Pick-up Angles

Diodes

Feeder direction
Tantal

SOT 23

SO

PLCC

16
 Logistics & Assembly Systems

Component Orientation in SIPLACE Machines

SMT Components

Pick-up angle for SIPLACE 80

placement systems

17
 Logistics & Assembly Systems

Component Orientation in SIPLACE Machines

SMT Components

Pick-up angle for HS and HF

placement systems

18