Professional Documents
Culture Documents
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Logistics & Assembly Systems
Resistors,
Capacitors,
Inductors.
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Logistics & Assembly Systems
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Logistics & Assembly Systems
QFP - Quad Flat Pack and PLCC - Plastic Leaded Chip Carrier
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Logistics & Assembly Systems
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Logistics & Assembly Systems
SMT Components
Balls
BGA
Ball Grid Array
Connection Bumps
J connection
strip
Flip chip
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Logistics & Assembly Systems
SO
Small Outline
QFP
Quad Flatpack
Plastic GA
Packages Grid Array
FP
Flatpack
PLCC
Plastic Lead Chip Carrier
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Logistics & Assembly Systems
SO(L)
Small Outline
SOJ
Small Outline J-Lead
SO
Small
Outline
SSOP / TSSOP
(Thin) Shrink Small Outline
TSOP I/II
Thin Small Outline Package
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Logistics & Assembly Systems
BQFP
Bumpered Quad Flatpack
MQFP
Metric Quad Flatpack
QFP FQFP
Quad Flatpack Fine Pitch Quad Flatpack
TQFP
Thin Quad Flatpack
GQFP
Guard Ring Quad Flatpack
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Logistics & Assembly Systems
PLCC
Plastic Lead Chip Carrier
Plastic FP
Packages Flatpack
GA BGA
Grid Array Ball Grid Array
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Logistics & Assembly Systems
Rule 1
A rectangular nozzle is located with ist
longitudinal axis parallel to the X axis.
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Logistics & Assembly Systems
Rule 2
Pin 1 is in the bottom left corner or in the center of the
left side.
With diodes, the anode must point in the positive
direction of the X axis.
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Logistics & Assembly Systems
Rule 3
The side with most leads is at the bottom.
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Logistics & Assembly Systems
Rule 4
If a component has a special feature, e.g. if one
pin is wider, this pin is at the bottom.
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Logistics & Assembly Systems
Diodes
Feeder direction
Tantal
SOT 23
SO
PLCC
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Logistics & Assembly Systems
SMT Components
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Logistics & Assembly Systems
SMT Components
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