Professional Documents
Culture Documents
Submitted by
MUDAVATH BABURAM
13001-M-036
Under the Guidance of
Mr. ANAND
(Lecturer)
MECHANICAL ENGINEERING
2013-2016
2
ASIFNAGAR, HYDERABAD-500028.
CERTIFICATE
This is to certify that the project entitled, “DESIGN OF MINI COMPRESSOR LESS
PELTIER REFRIGERATOR” is being submitted by
MUDAVATH BABURAM (13001-M-036)
INTERNAL GUIDE
K. RAMULU
DECLARATION
Abstract
we designed and constructed a COMPRESSOR LESS PELTIER
REFRIGERATOR with an interior cooling volume of 3.45 cubic
meters (1.5m x 1.0m x 2.3m). The Peltier refrigerator was
equipped with on/off control which was found to be adequate to
meet the required precision of +/- 15 degrees Celsius put forth in
the project requirements.
One liter of water was placed inside the cooler to test the
performance of the device. We tested the maximum
performance of the device by cooling a sample down to -5
degrees Celsius. Temperature control was also tested by cooling
one liter of water from room temperature down to -5 degrees
Celsius. On/off control was found to give adequate performance
and we met or exceeded all of our project requirements set forth
in the fall semester of 2016.
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TITLE PAGE
NO.
CHAPTER:1 INTRODUCTION 6
CHAPTER:2 THEORY OF PELTIER 8
UNIT
Peltier History
Peltier Structure
Peltier theory
Why use TE coolers
Disadvantages
Which industries use TE cooling
and their applications?
Basic Principles
Semiconductor P and N Type
Doping
Thermoelectric materials
Condensation
TE performance
Peltier History
Peltier structure
A typical thermoelectric module consists of an array of
Bismuth Telluride semiconductor pellets that have been
carrier–either positive or negative–carries the majority of
current. The pairs of
P/N pellets are configured so that they are
connected electrically in series, but thermally in
parallel. Metalized ceramic substrates provide the
platform for the pellets and the small conductive
tabs that connect them.
Peltier Theory
When DC voltage is applied to the module, the
positive and negative charge carriers in the pellet
array absorb heat energy from one substrate surface
and release it to the substrate at the opposite side.
The surface where heat energy is absorbed becomes
cold; the opposite surface where heat energy is
released becomes hot. Reversing the polarity will
result in
Reversed hot and cold sides
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Electronic
Medical
Aerospace
Telecommunications
Cooling:
Electronic enclosures
Laser diodes
Laboratory instruments
Temperature baths
Refrigerators
Telecommunications equipment
Temperature control in missiles and space systems
Heat transport ranges vary from a few mill watts to
several thousand watts, however, since the efficiency of
TE devices are low, smaller heat transfer applications
are more practical.
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An entire assembly
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THERMOELECTRIC MATERIALS
Bi2Te3 Properties:
Below is a plot of the figure of merit (Z), Seebeck
coefficient, electrical resistivity, and thermal
conductivity, as a function of temperature for Bi2Te3.
Carrier concentration will alter the values below.
Condensation
A common problem with TE cooling is that
condensation may occur causing corrosion and eroding
the TE’s inherent reliability.
Condensation occurs when the dew point is reached.
The dew point is the temperature to which air must be
cooled at constant pressure for the water vapor to start
to condense Condensation occurs because the air loses
the ability to carry the water vapor that condenses. As
the air’s temperature decreases its water vapor carrying
capacity decreases.
Since TE coolers can cool to low and even below
ambient temperatures, condensation is a problem. The
most common sealant employed is silicon rubber.
Research has been performed to determine the most
effective sealing agent used to protect the chip from
water. Four sealants were used to seal a TE cooling
device and the weight gain due to water entering the
device measured. The best sealants should have the
lowest weight gain. The epoxy has virtually no weight
Gain
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Thermoelectric Performance
TE performance depends on the following factors:
The temperature of the cold and hot sides.
Thermal and electrical conductivities of the
device’s materials.
Contact resistance between the TE device and
heat source/heat sink.
Thermal resistance of the heat sink.
Coefficient of Performance
A typical AC unit has a COP of approximately 3. TE
coolers usually have COP’s below 1; 0.4 to 0.7 is a
typical range.
Below are COP values plotted versus the ratio of
input current to the module’s Imax specification. Each
line corresponds with a constant DT/DTmax (the ratio
of the required temperature difference to the module's
max temperature difference specification).
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DESIGN METHODOLY OF TE
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EVAPORATOR:-
• A mini sized Evaporator is made of Aluminum
as it retains cooling effect for long period.
• The size of Evaporator is 15*12*23 = 4140 cc
Pump:-
A pump is a device that moves fluids. Pumps are selected for
processes not only to raise and transfer fluids, but also to
meet some other criteria. This other criteria may be constant
flow rate or constant pressure.
In this project pumping system is provide to water
inorder to circulate around the hotside of the peltier. It is
done because the rate of heat dissipation is higher with
water rather than fan. This increases the efficiency of the
system.
The water pump employed is mini sized, it is capable of
running at 12v and 5Amp
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SUMP:
A sump is a cubiodal shape water container in which
pump is employed for circulation of coolant.the size of the
sump employed in this project is 20*130*200 mm.
Sump serves as a base part of peltier cooler, on which
evaporator is mounted. The peltier that is attached to the
bottom side of the evaportor is fixed with heatsink over it
which is submerged in the water of the sump.
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12V –BATTERY:-
Peltier device is powered by 12v battery.
an electric battery is a device consisting of two or
more electrochemical cells that convert stored chemical
energy into electrical energy. each cell has a positive
terminal, or cathode, and a negative terminal, or anode. the
terminal marked positive is at a higher electrical potential
energy than is the terminal marked negative. the terminal
marked negative is the source of electrons that when
connected to an external circuit will flow and deliver energy
to an external device.
`
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HEATSINK:-
HEATSINK is a passive heat exchanger that transfers the
heat generated by an electronic or a mechanical device into a
coolant fluid in motion. Then-transferred heat leaves the
device with the fluid in motion, therefore allowing the
regulation of the device temperature at physically feasible
levels.. The heat sink used in this fridge is of the dimension
7.5cm X 8cm X 4.5 cm (L x B x H).
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Insulation Material:-
PLASCTIC TUBE:-
Plastic tube conveys the water from the sump to the peltier
device which is employed at the upper side of the evaporator
box. One end of the tube is connecting to the water pump
and another is connected to a section attached to the peltier.
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1. Outer dimensions
Length 160mm
Breadth 110mm
Height 240mm
2. Inner dimensions
Length 150mm
Breadth 100mm
Height 230mm
3. Volume of the Fridge 3450000mm3
Fridge:-
The cost analysis for this project is done as follows. All the
components along with the miscellaneous cost are
included in the total cost of this fridge.
The cost Analysis shows that the Overall Cost of the Project
strikes Rs. 2750/-
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CHAPTER 7 CONCLUSION