You are on page 1of 8

TDA1175

LOW-NOISE VERTICAL DEFLECTION SYSTEM

. COMPLETE VERTICAL DEFLECTION

.. SYSTEM
LOW NOISE
SUITABLE FOR HIGH DEFINITION

. MONITORS
ESD PROTECTED

DESCRIPTION FINDIP
(Plastic Package)
The TDA1175 is a monolithic integrated circuit in
FINDIP plastic package. It is intended for use in ORDER CODE : TDA1175
black and white and colour TV receivers. Low-noise
makes this device particularly suitable for use in
monitors. The functions incorporated are : synchro-
nization circuit, oscillator and ramp generator, high
power gain amplifier, flyback generator, voltage
regulator.

PIN CONNECTIONS

RAMP OUTPUT 1 12 RAMP GENERATOR

SUPPLY VOLTAGE 2 11 COMPENSATION

FLYBACK 3 10 AMP. INPUT

GROUND GROU ND

POWER AMPLIFLIER OUTPUT 4 9 OSCILLATOR


POWER AMPLIFLIER
5 8 SYNC. INPUT
SUPPLY VOLTAGE
REGULATED 6 7 HEIGHT ADJUSTMENT
VOLTAGE
1175-01.EPS

September 1993 1/8


TDA1175

BLOCK DIAGRAM
+ VS
C4 DA

6 2 3 5
FREQ P1
RH C9

VOLTAGE FLYBACK POWER


9 OSCILLATOR 4
REGULATOR GENERATOR AMPLIFIER
C1
RG YOKE
C8
SYNC RAMP BUFFER
SYNC 8 PREAMPLIFI ER 11
CIRCUIT GENERATOR STAGE

C5 C7
RE
7 12 1 10
TABS LINEARITY RD
C2

P2 RA P3 RB RC
HEIGHT C6 RF
C3

1175-02.EPS
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Value Unit
Vs Supply Voltage at Pin 2 35 V
V4, V5 Flyback Peak Voltage 60 V
V10 Power Amplifier Input Voltage + 10 V
– 0.5 V
Io Output Peak Current (non repetitive) at t = 2ms 2 A
Io Output Peak Current at f = 50Hz, t ≤ 10µs 2.5 A
Io Output Peak Current at f = 50Hz, t > 10µs 1.5 A
I3 Pin 3 DC Current at V4 < V2 100 mA
I3 Pin 3 Peak to Peak Flyback Current for f = 50Hz, tfly ≤ 1.5ms 1.8 A
I8 Pin 8 Current ± 20 mA
Ptot Power Dissipation : at Ttab = 90°C 5 W
1175-01.TBL

at Tamb = 80°C (free air) 1 W


Tstg, Tj Storage and Junction Temperature – 40, + 150 °C

THERMAL DATA
Symbol Parameter Value Unit
1175-02.TBL

Rth (j-tab) Thermal Resistance Junction-tab Max. 12 °C/W


Rth (j-amb) Thermal Resistance Junction-ambient Max. 70 °C/W(1)
(1) Obtained with tabs soldered to printed circuit with minimized copper area.

2/8
TDA1175

ELECTRICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)


Symbol Parameter Test Conditions Min. Typ. Max. Unit Fig.
DC CHARACTERISTICS (Refer to the test circuits, VS = 35V)
I2 Pin 2 Quiescent Current I3 = 0 7 14 mA 1b
I5 Pin 5 Quiescent Current I4 = 0 8 17 mA 1b
– I9 Oscillator Bias Current V9 = 1V 0.1 1 µA 1a
– I 10 Amplifier Input Bias Current V10 = 1V 1 10 µA 1b
– I 12 Ramp Generator Bias Current V12 = 0 0.02 0.3 µA 1a
– I 12 Ramp Generator Current I7 = 20µA, V12 = 0 18.5 20 21.5 µA 1b
∆I12
Ramp Generator Non-linearity ∆V12 = 0 to 12V, I7 = 20µA 0.2 1 % 1b
I12
Vs Supply Voltage Range 10 35 V
V1 Pin 1 Saturation Voltage to Ground I1 = 1mA 1 1.4 V
V3 Pin 3 Saturation Voltage to Ground I3 = 10mA 1.5 2.5 V 1a
V4 Qiuescent output Voltage Vs = 10V, R1 = 1kΩ, R2 = 1kΩ 4.1 4.4 4.7 V 1a
Vs = 35V, R1 = 3kΩ, R2 = 1kΩ 8.2 8.8 9.4 V 1a
V4L Output Saturation Voltage to – I4 = 0.1A 0.9 1.2 V 1c
Ground – I4 = 0.8A 1.8 2.2 v 1c
V4H Output Saturation Voltage to Supply I4 = 0.1A 1.4 2.1 V 1d
I4 = 0.8A 2.8 3.1 V 1d
V6 Regulated Voltage at Pin 6 6.5 6.7 6.9 V 1b
V7 Regulated Voltage at Pin 7 I7 = 20µA 6.6 6.8 7 V 1b
|∆V6| |∆V7| Regulated Voltage Drift with Supply ∆Vs = 10 to 35V 1 2 mV/V 1b
,
∆VS ∆VS Voltage
V10 Amplifier Input Reference Voltage V8 ≤ 0.4V 2.20 2.27 2.35 V
AC CHARACTERISTICS (Refer to the AC test circuit, VS = 22V, f = 50Hz)
Is Supply Current Iy = 1APP 140 mA 2
I8 Sync. Input Current (positive or 0.5 2 mA 2
negative)
V4 Flyback Voltage Iy = 1APP 45 V 2
tfly Flyback Time Iy = 1APP 0.7 ms 2
VON Peak to Peak Output Noise Pin 9 Connected to GND 18 30 mVpp 2
fo Free Running Frequency (P1 + R1) = 300kΩ 36 43.5 Hz 2
C9 = 0.1 µF
fOPER Operating Frequency Range 10 120 Hz 2
∆f Synchronization Range I 8 = 0.5mA, C9 = 0.1µF 14 Hz 2
(P1+R1) = 300kΩ
∆f
Frequency Drift with Supply Voltage Vs = 10 to 35V 0.005 Hz/V 2
∆VS
1175-03.TBL

|∆f| Frequency Drift with tab


Ttab = 40 to 120°C 0.01 Hz/°C 2
∆T ab Temperature

3/8
TDA1175

Figure 1 : DC Test Circuits


Figure 1a Figure 1b
+V S
+V S I2
I3
V3

I5

3 2 5 2 5
8

TDA1175 4 9 TDA1175 10
9

I8 7 12 10 R1
TABS 6 12 7
TABS

1k Ω - I9 - I 12 V4 V6 - I 12 - I 10
V7

1V 1V 8V R2
1V
100kΩ
1175-03.EPS

1175-04.EPS
Figure 1c Figure 1d
+V S +V S

I4 V 4H
2 5 2 5

9 TDA1175 4 9 TDA1175 4

10 10
TABS TABS

I4
V 4L

4V 1V
1175-05.EPS

1175-06.EPS

4/8
TDA1175

Figure 2 : AC Test and Application Circuit for Large Screen B/W TV Set 10Ω/20mH/1APP
V S = 22V
0.1µF 1N4001 47 0µF

10 0µF TABS
0.1µF
5 2
3.3Ω

3 4
Yoke
220kΩ 100pF 5.6kΩ Ry = 10Ω 560Ω*
Ly = 20mH
11
SYNC. 470pF 1000µF
8
INPUT TDA1175 5.6kΩ
10
10µF
22kΩ

1
9
100kΩ
P1
100kΩ 6 7 12
R1
47kΩ 1.8kΩ
220kΩ 100kΩ

0.1µF
120kΩ 910kΩ 1Ω
C9 0.1µF

1175-07.EPS
0.1µF

* on appl ication only

Figure 3 : Typical Application Circuit for Small Screen 90o CTV Set (RY = 15Ω, LY = 30mH, IY = 0.82APP)
V S = 26V
C1 D1 C5
0.1µF 1N4001 470µF
C4 TABS
C10
100µF
5 2 R8 0.1µF
3.3Ω

3 4
Yoke
R5 C9 R11
100pF Ry = 15Ω
390kΩ 5.6kΩ
Ly = 30mH
11
C2 0.1µF C6 C12
f sync. 470pF 1000µF
8
= 50Hz TDA1175 R10
R1 10
4.7kΩ 5.6kΩ C11
R6 10µF
18kΩ

1
9 P3
P1 100kΩ
100kΩ 6 7 12
R2
R7 R9
P2 47kΩ 1.5kΩ
150kΩ 100kΩ
C7
0.1µF R12
R3 R4
C3 100kΩ 680kΩ C8 1Ω
1175-08.EPS

0.15µF 0.1µF

5/8
TDA1175

Figure 4 : P.C. Board and Components Layout of the Circuit of Figure 3 (1:1 scale)

C5

D1
R8
R11 C1
C10
R5 GND
C4 C9

R6 C11 VS
R10
YOKE

TDA1175 R7 YOKE ( VO )
R9
R12
C12
SYNC. IN

C6 R4
C7
C3

R1 C8

C2

R3
R2

1175-09.EPS
P1 P2 P3

MOUNTING INSTRUCTION
During soldering the tab temperature must not reduced by soldering the tabs to a suitable copper
exceed 260°C and the soldering time must not be area of the printed circuit board (Figure 5) or to an
longer than 12 seconds. external heatsink (Figure 6).
The external heatsink or printed circuit copper area The diagram of Figure 7 shows the maximum
must be connected to electrical ground. dissipable power Ptot and the Rth j-amb as a function
of the side ”e” of two equal square copper areas
The junction to ambient thermal resistance can be having a thicknessof 35 µ (1.4 mil).
Figure 5 : Example of P.C. Board Copper Area Figure 6 : Example of External Heatsink
Used as Heatsink
COPPER AREA 35µ THICKNESS

HEATSINK
R th = 30°C/W

e
1175-11.EPS
1175-10.EPS

P.C. BOARD

P.C. BOARD

6/8
TDA1175

Figure 7 : Maximum Power Dissipation and Figure 8 : Maximum Allowable Power Dissipation
Junction-ambient Thermal versus Ambient Temperature
Resistance versus ”e”
Ptot (W) R th (°C/W) Ptot (W)
8 80 5
wi

wit
th
R He

h
4 th ats

Infi
6 60 (ta ink
R th (j-a) b-

nit
am ha
b)
=2 ving

eH
3
4 40 5°

eat
C/
W

sin
2 Fre
Ptot ( T amb = 55°C) e Ai

k
r
2 20
1
e (mm)

1175-13.EPS
T amb (°C)
1175-12.EPS
Ptot ( T amb = 70°C)
0 0
0 10 20 30 40 50 -50 0 50 100 150

7/8
TDA1175

PACKAGE MECHANICAL DATA : 12 PINS - PLASTIC FINDIP

D G
e4

I
a1
b1

M
L
b
c e5 e E1
c1 e6
e3 E2

E
KD

12 7

F
1 6

PM-FDIP.EPS
Millimeters Inches
Dimensions
Min. Typ. Max. Min. Typ. Max.
A 3.8 4.05 0.150 0.159
a1 1.5 1.75 0.059 0.069
b 0.55 0.6 0.022 0.024
b1 0.3 0.35 0.012 0.014
c 1.32 0.052
c1 0.94 0.037
D 19.2 19.9 0.756 0.783
E 16.8 17.2 17.6 0.661 0.677 0.693
E1 4.86 5.56 0.191 0.219
E2 10.11 10.81 0.398 0.426
e 2.29 2.54 2.79 0.090 0.100 0.110
e3 17.43 17.78 18.13 0.686 0.700 0.714
e4 7.62 0.300
e5 7.27 7.62 7.97 0.286 0.300 0.314
e6 12.35 12.7 13.05 0.486 0.500 0.514
F 6.3 7.1 0.248 0.280
G 9.8 0.386
I 7.8 8.6 0.307 0.339
K 6.1 6.5 0.240 0.256
FINDIP.TBL

L 2.5 2.9 0.098 0.114


M 2.5 3.1 0.098

Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsibility
for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result
from its use. No licence is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics.
Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all
information previously supplied. SGS-THOMSON Microelectronics products are not authorized for use as critical components in life
support devices or systems without express written approval of SGS-THOMSON Microelectronics.

 1994 SGS-THOMSON Microelectronics - All Rights Reserved


2
Purchase of I C Components of SGS-THOMSON Microelectronics, conveys a license under the Philips
I2C Patent. Rights to use these components in a I2C system, is granted provided that the system conforms to
the I2C Standard Specifications as defined by Philips.

SGS-THOMSON Microelectronics GROUP OF COMPANIES


Australia - Brazil - China - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco
The Netherlands - Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A.

8/8