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htm

Homebrew Condenser Microphone


Amplifier Construction Procedure & Misc.
12/08/03 Rev-13

This page presents detail supplemental construction notes for the various assemblies
associated with the construction of the large diaphragm studio style condenser microphone.
Information not included in the QST article that may be useful.

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Supplemental JFET Amplifier Assembly Procedures


Use and Removal of Plastic Spacer Shim
Thin Foil Available for Diaphragm
Source of Small Flexible Wire
Microphone Cable Pin-out for Icom 756 Series
Photograph of Completed Microphone
Post-Amplifier Schematic...Transistor
Post-Amplifier Schematic...Opamp Integrated Circuit
Connection of Wire #6... Clarification
Suspension of Element in Housing... Clarification
Inspection Hole in Press Fixture... Clarification
Preparation Of Call Sign Decal

Supplemental JFET Amplifier Assembly Procedures

The article that appeared in December 2003 QST did not include
construction details for the FET amplifier/impedance matching assembly.
While not complicated it is very important to shield this circuit effectively.
The method described in this article has proven to be very effective. It is
compact, simple to construct and works well. No doubt there are other
equally effective techniques but this is the one I selected. Note that this
amplifier and the 48 volt battery assembly are installed in the upper
compartment of the microphone... behind the call sign marker. Also note
that no electrical switch is required because the battery has no current
drain other than insulation leakage and the voltage for the JFET transistor
is furnished by the transceiver.

NOTE THAT THIS AMPLIFER IS NOT SUITABLE FOR USE WITH AN AUDIO AMPLIFIER
THAT IS NOT DESIGNED FOR AN ELECTRET MICROPHONE. YOU MUST ADD AS A
MINIMUM, A DRAIN LOAD RESISTOR, A COUPLING CAPACITOR AND A 9 VDC POWER
SOURCE FOR IT TO FUNCTION WITH A REGULAR AUDIO AMPLIFIER. (SEE Figure 6. C3, R3
& +9VDC Supply, later on this page).

Figure 2. Circuit Layout

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Figure 1. Assembly Ready to Install (Photo to be included later)

1. Not drawn to scale. The length of the package may be less than 2 inches and
.5 inches in diameter. Spacing of components in drawing is to improve clarity, may
be assembled tighter. Dots show solder connections. Note that R2 has been deleted.
This improves the gain, however it could lead to instability in some cases. Also note
that the condenser element and the battery shown in the schematic, are not part of
this assembly.

2. Insulate wires and component leads


as necessary. Use selected lengths of
stripped insulation from hookup wire.

3. The shield is made of copper foil


and is lined with wide insulating tape on
the inside. I used wide Mylar tape because
it was immediately available. Seams are
spot soldered as necessary for shielding
and general construction.

4. The "IN" and "OUT" wires are


shielded with flexible braid.

5. The "IN" wire should be as short


as possible, well shielded and flexible. The
R1 10M
capacity of the wire to ground is R2 (10M DELETED)
R3 150
undesirable in that it loads the very high C1 0.1 MFD 50V
impedance capacitor element. C2 0.1 MFD 50V

6. Although not shown as such, the Figure 3. Microphone Schematic

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+48 V lead may be shielded and bypassed B1 48V INTERNAL BATTERY


Q1 MFP-102, JFET, Radio Shack 276-2062
on the battery assembly.

Use and Removal of Plastic Spacer Shim


a. In answer to a frequent question, the plastic shim mentioned is a temporary spacer. From
.003 inch plastic material such as that used for laser printer transparency film, I cut the spacer into
the same shape as the condenser back plate and attached it with three touches of Elmers' all purpose
Glue Stick. This glue is a school type paste in stick form and does not dry with very much strength
making it ideal for a temporary use.

Figure 3A. These are the main components used to construct the
microphone element. The plastic shim, dress hooks and wire not
shown.

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Figure 3B. This illustration shows the set-up for aligning the condenser back plate using the
plastic spacer shim. Two plastic wood working clamps were used (American Tools, 2",
QUICK-GRIP HANDI-CLAMP). Use slow set epoxy so that the operation is not rushed. An
alcohol wetted wipe cloth or tissue is valuable for cleaning off any stray epoxy when finished.

b. When the assembly is pressed face down on to a flat surface, the set-back
distance of the condenser back plate relative to the lip of the ring is established by the
thickness of this spacer. The foam doughnut pushes the plate foreward against the flat
surface while it is pressed.

c. Before clamping the assembly, using a few touches of contact cement, glue the
foam doughnut in to position on the main assembly and then using the same
technique, glue the condenser plate on to the doughnut. This holds the assembly in
place while clamping. Otherwise it is almost impossible to align all the components
while clamping. The glue is used sparingly and does not interfere with the central
purpose of this operation.

d. While pressed into place, epoxy is poured (or pushed) into the hole indexed as
item # 10 in figure 3. When the epoxy has set, the assembly can be unclamped and the
condenser back plate will be firmly held in it's permanent position. I use an epoxy
that cures hard... not the gummy stuff. (The foam doughnut doesn't have enough
push to cause problems after the epoxy cures. The foam doughnut also forms a dike
to prevent the epoxy from migrating beyond the center area. It also forms part of the
acoustic characteristics of the microphone.)

e. When you unclamp it you can then remove the plastic shim and clean the face
of the condenser back plate with an alcohol moistened lint free wipe. You can inspect
the set back dimensions by using a straight edge across the ring and visually observe
the gap. You can also use a metal strait edge and an ohm meter to make certain that it
does not touch.

f. If everything is ok, then the aluminum foil can be applied.

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Figure 3C. This is a front and rear view of the microphone element
assembled, ready for application of the aluminum foil diaphragm.
On the rear view, note the dark colored epoxy filling the center
hole. The front view is after the temporary spacing shim has been
removed and the condenser back plate has been wiped clean. The
condenser plate is set back from the lip of the brass ring by the
thickness of the plastic spacer used and firmly held in place by
the epoxy poured in from the back.

Thin Foil Available for Diaphragm


I recently bought a new micrometer and as a result have been able to more
accurately measure various thin materials. I discovered that some of the store brand
aluminum foils are thinner than the name brand foils. I found one type that is only .0005"
thick. While this is not as good for kitchen use, it is better for microphone diaphragms.
Apparently the lighter weight foil can be produced and sold at lower prices, thus the store
brands seem to be a better choice.

Microphone Cable Pin-out for Icom 756 Series

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Figure 4. Connection Data For Icom-756 Series

Photograph of Completed Microphone

Figure 5. The Studio Style


Homebrew Condenser Microphone

Post-Amplifier Schematic...Transistor

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Figure 6. Amplifier used to match the microphone to a regular (non-electret) amplifier


input.

BAT 9 volt battery (not shown)


C3 4.7 mfd, 25 vdc
C4 10 mfd, 25 vdc
C5 Not assigned
C6 4.7 mfd, 25 vdc
C7 10 mfd, 25 vdc
Q2 2N3904 NPN General Purpose Amplifier
R3A 1 k, 1/4 w
R4 10 k, 1/4 w
R5 1.8 k, 1/4 w
R6 1.2 k, 1/4 w
R7 180, 1/4 w
R8 100, 1/4 w
S1 SPST OFF-ON Switch, (not shown, connected in series with battery supply)
Click here for 2N3904 data and pin-out... in Acrobat format

Post-Amplifier Schematic...Opamp Integrated Circuit

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Figure 7. Another post-amplifier used to match the microphone to a regular (non-


electret) amplifier input. This circuit provides high gain and an opportunity to shape the
frequency response and the output level of the microphone.

BAT 9 volt battery (not shown)


C3 .1 mfd, 50 vdc
C4 10 mfd, 25 vdc
C5 .01 mfd, 50 vdc
C6 10 mfd, 25 vdc
IC1 BA4560 Operational Amplifier
R4 1 k, 1/4 w
R5 47 k, 1/4 w
R6 47 k, 1/4 w
R7 100 k, 1/4 w
R8 10 k, pot
R9 100, 1/4 w
S1 SPST OFF-ON Switch, (not shown, connected in series with battery supply)
Click here for opamp data and pin-out... in Acrobat format

Connection of Wire #6 Clarification

Figure 8. Clarification of Figure 3


(QST Article) revision which better
shows the foil-to-ring glue pattern
and the connection of wire #6 to the
top of the condenser plate. Also
note that the "Jump" is included to
make certain that both sides of the
back frame is grounded

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Suspension of Element in Housing... Clarification

Figure 9. This sketch shows how the microphone is


suspended. An ordinary office rubber band is ideal. The
element weighs less than an ounce and this gives it shock
mount and an easy way to do it. Makes an attractive
pattern as well.

Inspection Hole in Press Fixture... Clarification

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Figure 10. This photo shows a home


made brush for applying the epoxy and
the 1 1/2 inch inspection hole in the
base of the press fixture. The
inspection hole allows you to inspect
the front surface of the aluminum foil
for defects before applying glue to the
foil/ring surface.

Preparation Of Call Sign Decal

Figure 11. To Illustrate the Laser Printer Decal for the


Microphone.

1. Using a computer with a suitable word processing or graphics program, compose the
decal pattern you wish. Make it white letters on a black background. Only make the black

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background a little larger than needed but there is no need to print it black background
image over the whole page.

2. Print the image on a good quality card stock paper using a laser printer. Use a regular
letter size sheet of card stock to make printing easier.

3. Use a yellow highlighting pen and color the white areas. When dry, spray with a clear
spray product to protect the printed image from wear and moisture.

4. Using sewing sissors, trim the pattern to fit the area of the microphone you wish to
apply it. Where the freshly cut paper shows the color of the paper, touch it up with a black
permanent marker. Apply to face plate of microphone with contact cement.

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