2) United States Patent Gaynes et al. US0099741 7982 (a0) Patent No.: 4s) Date of Patent: US 9,974,179 B2 *May 15, 2018 os cy ™ o en @ 6s) @) METHOD ant RELIEVING CONNECTORS APPARATUS FOR STRAIN IREACE MOUNT ATTACHED Applicat: INTERNATIONAL BUSINESS MACHINES CORPORATION, Amoak, NY (US) Inventors: Michael A. Gaynes, Vestal, NY (US) Jeffrey D. Gelorme, Baron, CT (US); Robert P. Kuder Il, Hopewell Tunetion, NY (US): Daniel J. tte, ‘Cannel, NY (US). Thomas E Lombardi, Poughkeepsie, NY (US) Marie-Claude Paquet. Quebec (CA) Frank L. Pompeo, Reding, CT (US); David Lz Questad, Hopewell Junction, NY (US): James Speidel, Poughquag NY (US) Sef M. Seidaya Ossinig, NY (US); Son K. Tran, Enda, NY (US) Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION, Amik, NY (US) Notice: Subject any disclaimer, the tem of this patent is extended or ajnsied under 38 US.C. 1548) by 0 days. days This patent i subject to a terminal dis laine. Appl. No. 181466442 Filed: Mar. 22, 2017 Prior Publication Data US 201700196089 AL Jul. 6, 2017 Related U.S. Application Data Continuation of application No, 14955,466, filed on Dec. 1, 2015, now Pat. No, 9,627,784, G1) mee MOIR 1408200601) Harr 4328 (200601) (Continved) (2) usa co {MOSK 1/18 (201301), Hor 402 (0131), 05K 4/40 (2013.01) (Continved) (68) Field of Classifieation Search CPC 2 HOIR T3405; HOTR 43/205; HOIR 49/24 (Continued) 65) References Cited US. PATENT DOCUMENTS (Continsed)| FOREIGN PATENT DOCUMENTS (OTHER PUBLICATIONS. Primary Examiner —Michosl A Lyons {svetant Examiner — Matthew T Drierzyasi (74) Atormes Agent, or Firm —Tutunjan & Bite PC: Daniel P. Moms, ABSTRACT Aa interconnect stricture tht inches 8 component circuit oan containing a plraity of eletieal components, anal a ‘wafer connector assembly. The wafer connector assembly includes» plait of interconnect cireit hoards ha are in clectical connection with the components cituit boat through a plurality of rows of solder ots, the plurality of intereonnet circuit boards having « connection end ichad- ing at least one comtset-An adhesive is present stacy reinforcing at lost «row ofthe solder joints that is pro- (Continsed) HHI {| awd — ~eUS 9,974,179 B2 Page 2 mate tothe connection end of the plurality of interconnect circuit boards of the waler assembly, oD 2) (8) {6 Claims, § Drawing Sheets It C1 MOSK 118 (200601) HOIR 402 (200601) sk 330 (2006.01) us. oC {HOSK 2201/1003 (2013.01): HOSK 22010015 (2013.01; 105K 2201/1002 (2015.01): HOSK 2201/1006 (2013.0; HOSK 2201/0159 (2013.01); HOSK 2201/10166 (201301) Field of Classification Searsh USPC... 439/127, 118, 119, 15, 26, $1, $89, 996; 251121 508, 783 ‘See application file for complete seat history (55) sgpsose Sowsins Tomine saroox6 Rens Reotins shes isos isms References Cited US. PATENT DOCUMENTS BL hina. B Gunsne 8 ino a : 439761 Domi HOUR 1257 100705 Bo+ ROO Hach Ho1L 233672 laa Be 2019 Catan B2 102013 Park eal BS ania Weber ea is T3011 Any out 2849827 a AL, 72008 abi Mts 22018 Ber Hou 23295 * cited by examinerU.S. Patent May 15, 2018 Sheet 1 of 5 US 9,974,179 B2 FIG. 1B 20 6 —_ FIG. 1A 40U.S. Patent May 15, 2018 Sheet 2 of 5 US 9,974,179 B2 40 Qs oe 37 NLM. FIG. 2U.S. Patent May 15, 2018 Sheet 3 of 5 US 9,974,179 B2 2 a TTT ENS FIG.3US 9,974,179 B2 Sheet 4 of 5 May 15, 2018 U.S. Patent av Old & PoE ir Ver Old Sh 0g, oz OLUS 9,974,179 B2 Sheet 5 of 5 May 15, 2018 U.S. Patent dr ‘Old Dr OldUS 9,974,179 B2 1 METHOD AND APPARATUS FOR STRAIN RELIEVING SUREACE MOUNT ATTACHED ‘CONNECTORS ACKGROUND Technical Field The present disclosure relates othe strain rele of solder joints Between connectors and printed circuit boards. Description ofthe Related Art A design practice in electrical interconnection is strain relist Movement or disturbance to an electrical connection an cause intermittent faults (open eiruis) or catstophic Tile. Typically, separable coanectors rely on piste latches of locking parts that ate integrated with plestic housings which atempy to provide coal location and alignment of eontacs In these examples, s well as ther, Contact points ean be soasitve to movement fem mechani «al disturbances caused by handling vibration aod shock SUMMARY In one aspect, an inerwonnect 10 a circuit board is provided that includes a adhesive enhancement ta zone of the interconnect including solder joints that can be vulner 2 able to damage, eg, by insertion force, handing, vibration Sn shock In some embodiments, the intersect to the Circuit board includes a component circuit board containing 8 plurality of electrical components and a wafer connector ‘sembly. The wafer coanector assmbly inches plurality ff interconnect sreit boards that are in eletrical cannes tion wth the components eitcuit board trovgh a phrlity of rows of solder joints. The plurality of interconnect circuit hoards inlude connection end having at east ene contact and a back end that is opposite the connection end. An hesive is preset encapsulating atleast a row of solder joints from sit plurality of rows of solder joints that is proximate tothe conacction end of the plurality of ike Sannet circuit board ofthe wale assem Tn another aspect. an interconnect system ix provide In some embodiments the inlersonnec system includes @ mid plane board for inegration with a computing system the mid Plane board including’ a header conection site; and a component circuit bo! for electrical engagement to the ‘id plane board by reversible eletrical connection to the header connection site through a waler connector assembly thats solder joint connected to the component crit boar The Wafer connector assembly includes a plurality of iter czeet circuit boards that are in eecreal connection with the component eit board though a plurality of rows of solder joins. The plurality of inercoancct circuit boards ince a conection end having at least one eantsct and a hock end that i opposite the conacetion end. An abesive is represent encapsating at esta ro of solder joints fom ‘td plurality of roms of ser joints tha is proximate othe onmeetion end ofthe plurality of interconnect circuit boards ofthe wafer assombly In another aspect ofthe prosent disclosure, # method of Jorming an intereonnect Tor 8 component eiteit board is provided that include an adhesive enhancement to zone Of the inercoanect including solder joints that ean be wulner- able to damage, eg, by insertion fore, handing, vibration and shock. In some embodiments, the method may include providing » component eireit board containing plurality ff eletrcal-compenents. A wafer connector assembly fncloding a plurality of interconnect cit Boards i then ‘connected tothe component eicuit board with a plaraty of 2 ows of solder joints, wherein the platy of circuit boards fare in electrical communication with ot least one of the ‘components in the component cigcuit board throug the Solder joins, and the phaality of interconnect creit boards include « conection end having at least one contact and & hock end that i opposite the connection end. Eoeapsulating ‘with an aesive a least one row of solder joints from said platy of ows of solder joints that is proximate to the ‘connection end of the pli f interconnect circuit boars fof the wafer essembly. BRIEF DESCRIPTION OF DRAWINGS. The following desiled description, piven by way’ of ‘example and’ ot intended to limit the disclosure solely Thereo, will best be appreciated in conjuaction with the accompanying drawings, wherein like reference numerals ‘enote like elements and pars in which FIG. LAs front perspective view of computing system including multiple Blade server boards tha plg into mid plane board via mating male and female surftce mount ‘onnector tha reattached tothe midplane board and blade Server board assemblies respectively, in secomdance with Some embodiments of the present distor FIG. 1B is. perspective view of component cieut board, ic, blade server board, in accondance with some embod ments ofthe present disclosure, FIG. 2 sa perspective view of single blade server boat plugging int, ie, making a reversible electrical connection fo, a mi plane board, in accordance with some embod ments ofthe present disclosure FIG. 3 is a perspective view of the waler connector asembly in eletnicl communication to the component circuit Board through solder joints, in which the wale ‘connestor assembly is being inserted into the header site of {2 mid plane boar, whercin the ploggable conection Is ‘orthogonal tothe plane ofthe solder ois in accordance ‘wih one embodiment ofthe present dislosure FIG 4A is a front perspective view ofa wafer connector assembly solder join connected 4 component circuit board depicting te connection end of the cireuit Boards in the water coanector assembly, wherein the sold joints are filly encapsulated in reinforcing adbesive, in acordance ‘with one embodiment ofthe present dislosue FIG. 4B isa side perspective view ofthe wafer connector assembly depicted in FIG. 4A. FIG. AC isa sie perspective view of anther embodiment of the wafer conaecor assembly inching an adhesive reinforcement to only the fist rows of solder joins that are proximate wo the connection end of the platy of ier ‘connect circuit boards ofthe wafer connector assembly. FIG. 4Disa sie perspective view of anther embodiment fof the wafer conecor assembly inching. an adhesive rinforcement to the frst rows of sokder joints that are proximate 1 the connoetion end of the phiality of iter ‘connect civuit hoards of the wafer connector assembly ad the back rows of solder joins that are proximate to the backside end ofthe pluaity of inferconneet eiruit boards ofthe waler comnestor assembly. DETAILED DESCRIPTION OF THE. PREFERRED EMBODIMENTS Dewilet embodimenis of the claimed simctures and methods ae disclosed herein; however, tito be understood thatthe diselosed embodiments are merely illstrative of the claimed siuctres and methods that may be embodied iUS 9,974,179 B2 3 ‘various forms. In alton, coca of the examples given in onnetion with the various enibodiments i intended Yo be lturtratve, nd not restive. Purter, the figures are not nocesarily (o seal, some Features mi’ be exaaersted 10 how duals of particular components. Therefore, specific ‘trocar and functional dete diselose herein are nol to be intorroted as limiting, but merely as eepreseatative bass for teaching one skied in the ar to variously employ the methods and structures of the present disclosure. For purposes ofthe description herinater, the toms “upp ower" ph "Tet"vetca™ “op “bor tom, and derivatives thereof shall ete to the embodi- ments of the dislonice es iti orented in the drawing figures. The tems “positioned on” means that fst el rent, soch as a fist structure, is present oa a socond sich as a second structure, wherein intervening such a an ineracestctre, 3 intrfoe ayer ‘may be present betweun the hist element andthe second tlement. The term “rect conser” means that fist ele ‘ment, such sft stricture, and a second element, soch 36 ‘second since, re connected without any intermediary conducting inslating or semiconductor layers atthe inter fice ofthe twa elements ‘Strain ele isa design practice in separable electrical imerconnection to prevent mechanical loading 1 an eect cal connection, However its been determined that stain reliet as typically not boon practiced with solder joint, because ofthe inherent seagtho solder and low loads fom handling, shock and vibration. Inthe eae of solr inter connection, strict adherence to stain tele! desigh is not followed for sever reasons, Unlike a separable connector system, in some examples «solder joint a steng, con: tinaot tallied strate and ot stscepibleto mien motion at an inerfce. Further there is typically 2 high ‘umber of solder joints per component unit mass and ths any impoct shock loading is much less than the viel and Tinctre sient of the solder ois However, for high end computers and serves, such as those disclosed herein, ep. depicted in FIG. 1. the mumber fof inpoupat connections is mach higher (00x) than a typical feature option cart for low end personal compere (PC), and mni-range servers and workstations. Te has been dctenmined, tht in the instances, the insertion forces become significant snd cannot be accomplished mally, but require mechanical assistance. An examples connec tor design that requires simultaneous mating of more than 5000 blade to spring connections. The insertion forees are nominally about 55g which an array of an equal number fo solder joiat-must withstand, In some examples, the fonnector designs require at insertion plane Pl That is fnhogonal othe slder joint plane P2, as depicted in FIGS. Zand 3. The solder joint plane P2 is along. the direction of the height ofthe solder joints 30, which extends from the ecomection tothe component eiruit board 10 tothe wafer connection aseinby 20 albo refered to as venta connes- torn this ease, high insertion fares (Pare prelereatlly transmitted oa front ow or rows of solder jos and iat 2 pool Eyre) OF tensile Farce (Fy gn n) Additionally the mechnis for insertion guidance cin have along lever arm and therefore, impart loading moments, Fy ad Eye Soler joints 30 fave been damaged in sic design, resting in electrical opens and in cracks that are ieipent In nature and represent latent oF field reliability failures ‘These method and sitctre that ae ditlosed hersin in some embodiments can provide strain relief 10 surfice ‘mount solder tached coanectoes For example, the methods fix! siructres that are diselsed herein ea provide stsin 4 relief to surface mount solder attached connectors that ‘experience high insertion forces with tensile or pol com ‘peat, or insertion forces tht damage solder joints, which {an rei in mmedate or atet opens. As wl be described 4 ig futhor detail below, a polymeric, liquid adhesive Is induced into the population of solder joints and cured The cured properties of the adhesive allt uniform dist bution of insertion forces over the entire adhesive bond aca rathor da high, concentrated forces over a lew percent oF the tual solder joint population. Repeated connector mat- ings are possible as required fr electrical testing trouble shooting. repair and upgrade while maintaining reliable Solder joint integrity. The methods and structures of the present discomure are now deer in further detail with Teference to FIGS, L440. Insome embodiments, an interconnect system is provide that incads @ header ste 36 for integration wih @ om puting system chassis 40; and a componcatercuit board 10 for reversible electrical connection to the header connection site 35 ofthe computing system chasse 40 though a wafer feannecior assembly 20 that #8 connected through solder joints 40. the component cteit board 1 as depicted in FIGS. 18 snd 2 Referring o FIG. 2, the component circuit board 10 may be a printed cnet bound and may inchide a number of clectncal componcats II integrated therewith, such 3s memory, resistors, capacitors, ight emitting diodes (LEDS) transistors, inductors, inegried circuits, ad combinations thereof Trmsistors integrated in the component circ board may aclude eli effet transistors and fa fype fold ‘llcttrinsistors. In some embodiments, the component iret hoard 10 may be a blade server board ‘As wil he deserihed blo the wafer conasctr assembly 20 includes a plurality of interconnect eieut oars 21 that fare in electeal connsction with the components circuit oan 10 thragh 8 plrality of rows of solder joints 30, as depicted in FIGS, 340. The integrated circuit boards may be laminsied printed circuit boards (OCH), In some ‘embodiments, cach of the interconnect circuit boards 21 may inelode at least one pin roceptcle 22 (1ypcally 2 plurality of pins) for engaging the’ pins from the header ‘connection site 38 of the computer system 100, The pins recepocle 22 may include a conductive componeat, suchas copper, for revemibly engaging the pins of the header ‘connection site 38. The pine eecepacle 21 may be config: ‘efor engagement to the pins athe header connection site 35. The endo the plurality of interconnect ieut boards 21 ‘ofthe wafer connector assembly 20 that inches the pins 22 may be eeered othe eoanection end SI of the plrality ‘of interconnect boards 21. The end of the plurality of interconnect circuit boards 21 ofthe wafer connector asseai- ‘ly 20 thats apposite the connection end St may be refereed tos the back sie end S2 f the wafer connector assembly 20. The waler eoanector sisembly 20-may ako ince framing 23 for providing some mechanical support forthe ‘wafer connector assembly, wherein the framing may ince uiding. members, sich as guide openings for receiving {Bde pins, Alhogh FIGS, 34D depict a wafer connector fsembly 20 inciding 1¥ interconnect hoards 21 the prsent disclosures not Finite to only this examples any ‘bomber of interconnect cre boards 21 may be incl ia the water eanaector sssembly 20. ‘A plurality of solder joins 30 provide for eletical ‘communication between ihe iris on the printed eit ‘oars ofthe pluraity of interconnect ereuit boards of the ‘wafer comector assembly 20 as the circuits nthe com ‘ponent circuit board 10, The plurality of solder joins alsoUS 9,974,179 B2 5 provide for physical engagement of the wafer connector Sssembly 20 10 the component cicuit board. The term older”, as used herein, refers to any mictal or metallic compound or alloy tate melted and then allowed 4 cool In order to join two or more metalic surfaces together. The Plrality of solder joints 30 may be composed of a meta fullable for soldering For example, in sine enbodinents, the slder joints 30 may be composed of sextet alloy oF tin and Tead or 2 lead free solder composition, In some embodimens the solder joints having a height ranging fom (0.5 mmto 3mm. Inother examples, the solder joints 30have ‘height grester than mn. Insome embodiment, the aay ff solder joints may have a total area greater than 30 ans200 ma ‘An adhsive 4 is present encapsulating 48,482, 45h at least a ow of solder joins 30 to sicily reinforce the Pray of rows of sokder joints 30, a depicted in FIGS. AA4D. The adhesive 45 may be polymeric. In some embodiments, the adhesive 48 can be epoxy based resin. In Some examples, the adhesive 48 can be epoxy resin with 2 filler, epoxy aerylate with filer, or polymer with proper fille The abesive 48 is non-conductive. Insome examples, epoxy resin formations that may’ be suitable forte ati sive 48 can inclde, for example, high purity digheidyl tther of bisphenol F or dighvedy ether of isphenol Along ‘with high performance or multifunctional resins, suc asthe Aigyleidy ether of naphthalene dil or the tiepoxide of partaminopheno, Is noed that this only one example ‘an epoxy composition tbat may be used as the abesive 45 of the prosentdaclsure, Other adhesive compositions, txt other epony based resins, are equally stable forthe aahesive 48 that retry reinforces the phrality of rows Of solder joints 30. Further details roaring the adhesive ‘compositions are provided belo FIGS. 44 and 48 depict one embodiment ofthe present disclosure in whieh the solder joins 30 are fully encaps- Jat in a reinforcing adhesive, By “Tully encapsulated” itis ‘ant that each Solder joist 30 for every row of solder joints 30;s surrounded by an aesive so that no point of the solder jt 30 is expose. FIG. 4C depicts another embodiment of the wafer eoancctor assembly 20 inching an adhesive reinforcement 48a 10 only the ist row of solder joints 30 that are proximate to the connection ead SI of the plurality of intertomnet cizeuit boards 21 of the wafer connector ‘ssembly 20, Ia this embodiment, each ofthe sor joints 530i the ist row are encapsulated in the adhesive 48a, i. ‘mirly encapsulated, but the remainder of olde joins 30 that are not nthe ist row and notin contact with adbsive ann are exposed, FIG. AD depicts anoter embodiment ofthe ‘water connector assembly 20 incloding an adhesive rein- foreement 482, 485 the fist rows of solder ois 30 that are proxinato Wo the connection end St of the plrality of Jntersonnect circuit boards 21 ofthe wafer connector asse- bly 20-and the back row of solder joints 30 that are proximate wo the backside end 2 of the plurality of inter Sonnet cist bods ofthe waler connector sembly FIG. 1A depits oe embodiment ofa computing system 100 as employed inthe present disclosure including stipe blade server boards, which may be referral to ane example of «component creuit boar 1, in which the blade server boards plug into a midplane board 36, The mid plane hoard 36inchids the header conection site 38 and provides for engagement tothe computer system chassis 40. The mid plane boar! 36 provides Tor power an signal Io be trans Inte wo each ofthe component eieuit boards 10 that are engages thereto, In some embodiments, reversible clerical conection, ie, the ability to connect and disconneet, 6 between the herder connection site 36 of the mid plane ‘board 36 and the compoaet circuit board 10, eg. lode server board, may be provided by mating male and lemale Surfice mount connectors tha are atte to the mid pane board and blade server board assemblies respectively. As vill be discussed below, the component cireuit board 10 Includes solder joint 30 mounted wafer connector assem bly 20 for engaping the header connection site 38 ofthe mid pave board 36 FIG_ IB depics ope embodiment of a Base server boar! that may provide the component circuit board 1 in acor- dance wi the presen disclosure, The typical dimensions of ‘blade board assembly may inludea wis WI af eppeex- rately SO mm, eight 11 of approxinstely $80 mi, aad 4 depth Dt of approximately 790 mm. Referring to FIGS. 1A and 1B, in some embodiments, mechanical handling equipment’ slled node setation ‘mcchanism (NAM) 37 is roguired to align and plug the large ‘and heavy node-ssenbly ypically weighing about 70 ke, into the mid plane 36, in some embodiments, the tight Spacing of the adjacent component circuit boards 18, e ‘lade assembles, 2 eason fo te Use ofthe NAM 47 for ‘controled insertion and removal of the bide, compo nent cirevit boards 10. As ean be seen in FIG. LA, the ‘component circuit bourds 19, eg. blade server boards, ean imate to top and bottom positens on the mid plane 36. In Some enfodiments every component cret beard 10, €, blade server boar, has a ak of connecters, eg. that are surfce mount soldered ot via an array of several hous Solder joints. Similarly, every muting position for every blade on the mid plane has a bank of connectors, called Iaders, which ma be collectively refered to a8 2 wae connector assembly 20, that are surface mount soldered 10 the component cireit hoard 10 via an ary of several thousand solder joints 30. The component cieut board 10 interconnects wi the mid plane 36 position via separable ‘in and spring contacts that ae housed in the surface mount ‘Sonnectors, hes Wale conactorgssembly 2 iis noted that although FIG. 1A depies eight component ret boards 10 being engsged to a single mid plane board 36 the present disclosure not ited to only this example ‘say numberof component cicuit boards, a8 well a8 mid Plane boards 36, may be integrated into a computer system Chassis 40 FIG. 2 showsa schematic of a component cteuit hoard 10 being insened 1 a bottom position on the mi plane board 36. In some enibodiments, pins 38 extend vertically dow- ‘ward from the surfice mount connector, Le. header con nection ste 38, nthe midplane 36 and engage with female Shing contacts tha are housed inthe wrface mount coe rotor, i, waler connector assimbly 20, of the blade ‘sembly. In some embeudimens, during assembly, because ‘of the several thousand pin to sping matings required per ‘component cit board 10, eg, bide server board othe Trader connection site 38, eto the mid plane board 25, forces on the order of $5 kg may be require to engage the ‘component circuit band 10 te header eoancction site 38, Reforing to FIGS. 344D, the solder joins 30 of the ‘connec ie, wafer connector assembly 20, 08 the coms Pent eitcut board 10, eg. blade server boun! assembly, Ean experiene non-uniform ooding. FIG. 3 is a schematic Side view isang a wafer connector assembly. 20 sl- ‘ered oa component cireit board 10, i which the pli izle connection to the header connection site 38 of the ‘computer system chassis isin #dirscton orthogonal tothe plane of solder joins 30. In some embodiments, the non tniform loading experienced by he solder joints 30 that