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ADC techniques for the nanoscale era

2010-09-28
Carsten Wulff
Outline

•  Who  am  I,  what  have  I  done,  and  what  do  I  do  
•  Nanoscale  effects  to  worry  about  
•  Reliability  effects  
•  Nanoscale  blocks  
•  Nanoscale  layout  
If  there  is  Cme:  
•  CBSC  and  my  ADC  

2   ©  Carsten  Wulff    
September  10    
Who am I?

•  Carsten  Wulff  
•  Born  Friday  13.  August  1976  
•  R  &  D  engineer  at  wireless  department  at  Nordic  
Semiconductor  
•  Married  with  three  kids    
•  Graduated  from  NTNU  2002  (Programmable  analog  integrated  
circuit  with  TOC,  0.6um  AMS)  
•  Ph.D  from  NTNU  in  2008  (Efficient  ADCs  in  nano-­‐scale  CMOS  
technology,  90nm  ST)  
•  Fortunate  to  spend  a  year  at  University  of  Toronto  
(2006-­‐2007)  with  David  Johns  and  Ken  MarCn  
•  h^p://www.scribd.com/carstenwulff  
•  h^p://www.wulff.no/carsten  3   ©  Carsten  Wulff    
September  10    
ADC figure of merit
JSSC 1975-2005
ISSCC 2000-2008

10000 Linear Settling FOM limit


Parasitic FOM limit M0=10 C0=1fF
Parasitic FOM limit M0=200 C0=10fF
1000
JSSC 2006 -
Constant FOM limit
100
FOM in fJ/step

10

0.1

0.01

0.001

0.0001
2 4 6 8 10 12 14 16 18 20

Effective Number of Bits


FOM  =  Power/(2^(2*ENOB)*fs)   4   ©  Carsten  Wulff    
September  10    
Nanoscale effects

Things to worry about in nanoscale


technologies
Nanoscale papers

Proceedings  of  the  IEEE,  october  2009  

Norchip  2009  

6   ©  Carsten  Wulff    
September  10    
Headroom

•  Most  nanoscale  processes  has  a  power  supply  of  1-­‐1.2V  


•  You  can  run  at  higher  voltages  (maybe  up  to  1.4V),  but  then  
you  have  to  worry  about  hot  electron  effects  
•  Consequences:  
•  You can’t get everything in strong inversion, so just forget about
it, use weak inversion when needed.
•  Don’t stack transistors too high, so forget about
•  Telescopic OTA
•  Straight cascodes

7   ©  Carsten  Wulff    
September  10    
Headroom, what works

•  Wide  swing  current  mirrors  (use  everywhere)    


•  Current  mirror  OTAs  or  folded  cascode  OTAs  
•  Have  good  control  over  what  is  the  maximum  raCng  for  your  
process,  and  run  up  twoards  VMAX  (for  example  in  90nm  LP  
this  can  be  up  to  1.45V  on  VDS)  

8   ©  Carsten  Wulff    
September  10    
Output resistance

•  Output  resistance  of  nanoscale  transistors  is  very  poor.  Don’t  


expect  to  get  more  than  20dB(10x)  from  a  single  transistor  
amplifier  
•  Use  4F  for  current  mirror  transistors  
•  Use  wide  swing  cascodes  everywhere  
•  Don’t  go  below  10uA  for  bias  currents  unless  you  really  have  
to  

9   ©  Carsten  Wulff    
September  10    
Nanoscale transistor

Lewyn,  Norchip  2009  

New  features  in  sub  100nm  technologies:  


-­‐   Stress  is  acCvely  used  to  increase  mobility  
-­‐   Very  thin  oxide,  reduced  power  supply  to  keep  verCcal  field  in  check  
-­‐   Halo  implant  that  increases  drain-­‐source  conductance  at  longer  
channel  lengths  
-­‐   Hot  carrier  effects  
-­‐   Stress  from  the  STI  (shallow  trench  isolaCon)  
-­‐   Proximity  to  well  edge  
-­‐   Lithography  issues  since  the  minimum  dimensions  
10  
are  less  than  the  ©  Carsten  Wulff    
wavelength  used  to  expose  the  photoresist  (λ  =  193nm)   September  10    
Well proximity

102*3.4.-2536,+7/
•  Threshold  voltage  increases  with  
proximity  to  well  edge  
•  Place  switch  transistors  in  a  

)*+,+-./0/,

)*+,+-./0/,
transmission  gate  far  from  well  
edge  
•  Place  bias  transistors  (diode  
!"# !"# !"#

connected  transistors)  and  the   $%&&

transistors  they  bias  far  from  well  


edge  
•  How  far  is  far:     ! (
'
! (
'
' '

•  Absolute minimum 1.5um !"# !"# !"#

•  Recommended > 2um $%&&

11   ©  Carsten  Wulff    
September  10    
Shallow trench isolation

•  Stress  is  acCvely  used  in  nanoscale  transistors  to  control  


threshold  voltage  
9,..*)*!3-'&7,/,3:-12*-3&-/*!;34-&.-1,..2+,&!

! ! ! !
"#$ "#$ "#$

%&'()*++,&!-&.-+,/,0&!-12*-3&-34*)'5/-*6(5!+,&!-',+'5304-
7*38**!-+,/,0&!-1,&6,1*-5!1-+,/,0&!

•  Use  larger  than  minimum  (from  DRM)  length  of  diffusion  


•  Make  sure  diffusion  length  set  at  schemaCc  simulaCon  
matches  the  one  used  in  layout  

12   ©  Carsten  Wulff    
September  10    
Reliability effects

  DDB: Time dependent dielectric breakdown - Essential for analog design


T
 HCI: Hot carrier injection - Essential for analog design
 NBTI & PBTI: Negative Bias Temperature instability - Lanny commented it was
not that important for analog design
Time dependent dielectric breakdown (TDDB)

•  -­‐  Electrons  (in  NMOS)  see  a  high  verCcal  electric  field  and  if  this  field  exceeds  
around  5MV/cm  electrons  will  go  into  the  gate  
•  -­‐  Trapped  charges  in  the  dioxide  shios  the  threshold  voltage  
•  -­‐  Can  cause  a  short  of  the  dioxide  
•  -­‐  This  effect  sets  the  maximum  VGS  

14   ©  Carsten  Wulff    
September  10    
Hot carrier injection

•  -­‐  Electron  is  accelerated  due  to  the  high  horizontal  field  (high  Vds).  It  
impacts  the  crystal  laqce  and  generates  a  electron  hole  pair.    
•  -­‐  If  the  impact  is  high  enough  energy  the  electron  can  pass  through  
the  gate  and  cause  damage  
Can  occur  at  moderate  VGS  and  high  VDS  
  

15   ©  Carsten  Wulff    
September  10    
HCI effect: Channel initiated secondary electron

•  -­‐  An  fast  electron  impacts  the  laqce  and  creates  a  hole-­‐electron  pair.    
•  -­‐  Due  to  a  high  VSB  the  hole  is  accelerated  towards  the  substrate.  It  
can  impact  the  laqce  again  and  make  a  new  hole-­‐electron  pair.    
•  -­‐  The  secondary  electron  sees  a  very  high  electric  field  and  will  
accelerate  towards  the  gate  

Sets  the  maximum  VSB.  VSB  ~  2VDD  a  factor  10  reduced  lifeBme  
16   ©  Carsten  Wulff    
September  10    
Nanoscale blocks

F-based design
Typical differential OTA
Typical bias voltage generator
Typical comparator
Differential reference voltage
F based transistor design

•  1F  =  1  gate  length  
•  Why:  schemaCc  is  independent  of  technology  
•  Use  a  small  number  of  different  transistors  
•  Always  use  larger  than  1F25  length  for  analog  transistors  
•  Widths:  6F,  8F,  24F  
Lengths   Purpose  
1F   Digital  transistors,  posiCve  feedback  
inverters  
1F25   DifferenCal  pairs  
2F   Cascodes  
4F   Current  mirror  transistors  
12F   Standalone  current  mirrors,  cascode  
bias  transistors  
18   ©  Carsten  Wulff    
September  10    
Differential OTA – CM OTA with CT CMFB

Things  to  watch  out  for:  


-­‐  Common  mode  stability  at  high  input  common  modes  

,/0/0 ,/0/0 !"# ,/0/0 !"# ,/0/0 ,/0/0 !"#' ,/0/0


23' 23' 23, 23' 23' 23/

!$# ,/0,0 !$# ,/0,0


23/ 23/
!(% !(#

!(%
,*+ -*.
!&% ,/0'0,)1 ,/0'0,)1 !&#
23'* 23'*

'**.
(56718591:;<918+1(=>1<?@A5

,/0'0,)1 ,/0'0,)1 !$% ,/0,0


23, 23, 234

)**+
'**. )**+

!"% ,/0/0 ,/0/0 ,/0/0 ,/0,0


23, 23' 23, 23,

$20"
19   ©  Carsten  Wulff    
September  10    
Differential OTA – Bias voltages

Things  to  watch  out  for:  


-­‐  Current  source  transistors  in  saturaCon  over  PVT  

$%&%& $%&%& $%&%& $%&%&


'() '() '() '()

!"#
)-./ !"#)
$%&$& $%&$& *&)$& $%&$&
'($ '($ '() '($

!+#
!+,
$%&$& *&)$&
'($ '()

!",

$%&)$& $%&)$& $%&%& $%&)$& $%&)$&


'() '() '() '() '()

20   ©  Carsten  Wulff    
September  10    
Differential pair dynamic comparator

•  Also  called  the  


Strongarm  latch   !"# )*+,+-.

•  If  mismatch  is  criCcal  add  


a  preamplifier  
(differenCal  pair  with   $%& )*+,+-. )*+,+-. $%'
resisCve  or  diode  
connected  load)  
-)+,+ -)+,+ $('

$(&

!"# -)+,+ -)+,+ -)+,+ -)+,+ !"#

21   ©  Carsten  Wulff    
September  10    
Differential reference voltage

•  If  you  don’t  care  about  gain  error,  use  three  unity  gain  
amplifier  with  a  resisCve  divider  at  the  input.  Remember  to  
low-­‐pass  filter  the  input.  
!"#
$%&%$%'(%#
)*+,-.%
!/3
1R
1R
23
3#8#2/?
"3<#8#/01"#9: 4/;"
/01"

43

"67#8#/05"#9: 4/;"
/05"
!>

43

"3=#8#/02"#9: 4/;"
/02"

@*-A#(*;>%'B-,%A#(C$$%',#;D$$*$#
23 EFG#HB%%#I*J'B#K#7-$,D'L

22   ©  Carsten  Wulff    
September  10    
Nanoscale Layout

Transistor layout rules


Layout example
Transistor layout rules

Rule   Why  
Always  use  two  fingers   Transistor  parameters  
change  with  current  
direcCon  
Always  run  all  gates  in   Stress  in  X  and  Y  
same  direcCon   direcCon  affect  transistor  
differently  
Always  have  dummy  poly   Be^er  poly  control   " ! "

during  processing  
Always  have  larger  than   Less  stress  from  shallow  
minimum  length  of   trench  isolaCon  
diffusion  
Always  place  transistors   Reduce  mismatch  in  
far  from  well  edge   threshold  voltage  
Be  careful  with  metal   Metal  changes  the  stress  
rouCng  across  transistors   in  the  channel  

24   ©  Carsten  Wulff    
September  10    
Layout from Lanny Lewyn

•  Extremely  uniform  poly  


•  Short  distance  to  
substrate  contact  
•  All  gates  in  same  
direcCon  

25   ©  Carsten  Wulff    
September  10    
Things you should know about

Sooware:  
  SchemaCc  (Mentor  graphics,  Cadence,  Synopsys,  Tanner  tools)  
  Layout  (Mentor  graphics,  Cadence,  Synopsys,  Tanner  tools)  
  SimulaCon  (Eldo,  Spectre,  Hspice,  SMASH)  
  ScripCng  (Bash,  Perl,  TCL,  LISP)  
  Editors  (Emacs)  
  Math  sooware  (Matlab,  Maple,  Octave)  
InformaCon  sources:  
  h^p://ieeexplore.ieee.org  
  h^p://webcast.berkeley.edu/    
      EE240  spring  2007  to  spring  2010  
  For  new  tricks,  scan  JSSC  (all  papers)  each  month  
26   ©  Carsten  Wulff    
September  10    
CBSC pipelined ADC with comparator preset, and
comparator delay compensation

Carsten Wulff1, Trond Ytterdal2


1.  Nordic Semiconductor ASA, Trondheim Norway
2.  Norwegian University of Science and Technology, Trondheim, Norway
Outline

•  What are comparator based switched capacitor circuits?

•  How was our ADC implemented?

•  What was the measured performance of our ADC?

28 © Carsten Wulff September 10


Session_12_Penmor Sepke1/7/06
et al, ISSCC 2006,
3:32 PM Page 2208.5-bit, 8MHz, 2.5mW

ISSCC 2006 / SESSION 12 / NYQUIST ADCs / 12.4

12.4 Comparator-Based Switched-Capacitor Circuits is a constant offset in the output if the ramp rate a
delay are constant. The current source I2 turns o
For Scaled CMOS Technologies
after the switch opens, but this does not affect the
Todd Sepke1, John K. Fiorenza1, Charles G. Sodini1, Peter Holloway2, Preliminary analysis indicate CBSC circuits are m
Hae-Seung Lee1 cient than conventional opamp-based circuits, be
the virtual-ground condition is more energy efficie
MIT, Cambridge, MA
1 the virtual ground.
National Semiconductor, Salem, NH
2

The CBSC concept is general and can be applied t


Two side effects of technology scaling that have a significant data analog circuit. For example, the CBSC desig
impact on analog circuit design are the reduced signal swing and be applied to a pipelined ADC signal path, as
the decrease in intrinsic device gain. Gain is important in feed- 12.4.3. The comparator now controls both the s
back-based analog signal-processing systems, because it deter- and the strobe time for the bit-decision comparato
+  Completely   minesnew  
the aaccuracy
pproach  of tthe
o  switched-­‐capacitor  
output value. Cascodedcircuits  
amplifier CBSC pipeline ADC is constructed and operates
-­‐    Limited  sstages
peed  have
(dual  
been ramp   system)  
a popular solution to increase amplifier gain, opamp version of the ADC. Figure 12.4.4 show
but they further reduce the signal swings of scaled technologies. schematic of the first two stages of the prototype C
-­‐    Single  ended  
An alternative method for achieving high gain in an operational pipeline ADC.
amplifier without reducing signal swing is to cascade several
lower-gain amplifiers. Nested-Miller compensation approaches To make its decisions quickly, the comparator mu
[1] can be used to stabilize the cascaded feedback system, but the gain and minimum delay. Unlike the opamp, the
frequency response of the closed-loop system is significantly sac- achieve the required gain with the cascade of seve
rificed to ensure stability. A recent development in the area of erate-gain stages without concern for stabilit
pipeline ADCs avoids these problems by using open-loop ampli- Figure 12.4.5 shows the schematic of the compara
fiers with digital calibration to compensate for the gain variation pipeline. The first stage is a band-limited stage t
[2]. In this paper, a comparator-based switched-capacitor (CBSC) noise in the comparator decision. Two diode-con
circuit design methodology is described that 29 eliminates the use of © Carsten Wulff September 10
devices clamp the output swing for faster recovery
opamps in sampled-data systems. band-limiting stage is a cascade of three broadban
ferential amplifier stages with PMOS triode load
What we wanted to do

Primary goals:
Increase Speed (target 100MHz)
Differential circuit

Secondary goals:
Keep resolution (target 8.5-bits)
High efficiency < 10mW

30 © Carsten Wulff September 10


What we achieved

Increased Speed (60MHz)


Differential Circuit

Resolution not as high as wanted (7.05-bit)


High efficiency (8.5mW)

31 © Carsten Wulff September 10


How does a comparator-based switched-capacitor circuit work?

!" #$!%& +,$-,$*2#*#'3-0"1

!"
!"#"$ %&'()"*+,$-,$ ./01
!",-.

+
!"#$%"%&#'&(%)*+,'-
#%

!&

#$ !"

!#'()(*

32 © Carsten Wulff September 10


Implementation

33 © Carsten Wulff September 10


ADC system block diagram

G6-
+#
3 "A1
;+,+1)(-&''"'-."''&.1+"#-<"77-.9+*-+#-8"71=)'&> H+,+1)(-
0?;I
"A1*A1
J;?I
3-6

E77-.9+*F-
?#)(",- 01),&- 01),&- 01),&- 245-6+1- "77(+#&-
@#*A1 2 3 : 7()89 .)(+6')1+"#-
&#,+#&

B&74-C"(1),&8 !"#$"%&'()**+#,-
D+)8+#, .("./-<78>
<,&#4-"77-.9+*> .("./-,&#

34 © Carsten Wulff September 10


The pipelined stage

BCC0?20$,!!.D/
2E90F+.2 *"!
%A' !# !" %GHI'

!$
!# %&' 0:
*#! *"! *#! *C7!,$,0C$/E90+/D9-90,88K/
'J88?J!/
%*; %)' FC10$C88.D/0+$.2+C8D
FJ$$.10/2CJ$F.
0# !"
!#,

%&( %&(
!#,

!# !# !"
0>:?"@ 0"
!"
!$
6=<* %*;
0" !#
%&( %&'
!#,

!#,

0# !" %)(
*#1 *"1 %*;
'J88?DCE1
*#1 /FJ$$.10/2CJ$F.
0:
!# %&'

!$
!# <=* !"
%A( %GHI(
*"1

6,7!891-/4!#5 *+,$-./0$,123.$/4!"5

35 © Carsten Wulff September 10


!+$
The comparator !"# !,. /)0

!,-

!"$ 1,

!+#
%& %' ()%* %*
-0 -1
!+$
!"# !,. /)0%12345

-2
(4 (5 !,-

!%&'
!"$
1,
!"# !"$
-. ()*+*, -/ !+#
%& %' ()%* %*

!+$
!"# !,. /)0%12345

(3
!,-

!"$ 1,

!+#
%& %' ()%* %*
36 © Carsten Wulff September 10
Results

37 © Carsten Wulff September 10


Lab setup

1
#
($0
&)
*$.
*/
-*
-)

2/ 6-(-
$.
,-

-3
$+
&*

4) )/(),
()

/5 +-
&'

$
$%

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#
"

($%
!

&' 4891
() &
*$-
'6
!"#"$"%&'()*"+,-./0

$
1'&*0(2"3,40."%-55*6

1'&*0(2"7,'&/"1()*680.
!"#"$"%&'()*"+,-./0

19:

38 © Carsten Wulff September 10


Improvement INL & DNL

40 2
30
1

INL [LSB]
INL [LSB]

20
0
10

0 −1

−10 −2
0 50 100 150 200 250 0 50 100 150 200 250
Output Code
Output Code
50 2
40
1

DNL [LSB]
DNL [LSB]

30
20 0
10
−1
0
−10 −2
0 50 100 150 200 250 0 50 100 150 200 250
Output Code Output Code

Default  values  (set  before  producCon)   With  calibraCon  


ENOB  =  2.5-­‐bit   ENOB  =  7.05-­‐bit  

39 © Carsten Wulff September 10


FFT, SNR, SNDR & SFDR

0 70

−20 60

−40 50
Magnitude [dB]

Magnitude [dB]
−60 40

−80 30

−100 20

−120
10 SNDR
SNR
−140 SFDR
0 5 10 15 20 25 30 0
5 10 15 20 25 30 35 40
Frequency [MHz]
Input Frequency [MHz]

40 © Carsten Wulff September 10


Summary  of  calibrated  ADC  performance  
Table 10.1: Summary of calibrated ADC performance
Technology 1.2V/1.8V 90nm CMOS
Sampling Frequency 60 MS/s
Resolution 8 bits
Full scale input 0.8V
Size 0.85mm x0.35 mm
DNL (LSB) 0.52 / -0.54
INL (LSB) 0.6 / -0.77
SNR (29.4MHz input) 44.5 dB
SNDR (29.4MHz input) 44.2 dB
SFDR (29.4MHz input) 60 dB
ADC core power 5.9mW
Clock power 2.3mW
Input switches (1.8V) 0.3mW
Waldon Figure of Merit 1.07 pJ/step
Thermal Figure of Merit 8.09 fJ/step

41 © Carsten Wulff September 10


http://www.wulff.no/carsten

Papers, thesis, FOM source data, CBSC modeling, pipelined


schematics…
Questions?

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