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VOLT
METER
EARTH SURFACE
l
a a a h
ρ1
ρ2
4πaR
V ρ= = 2πaR
R= 1+
2a
−
a
I a 2 + 4l 2 a2 + l 2
Fall of Potential Method or 3PM
SOURCE CURRENT
METER
VOLT
METER
EARTH SURFACE
ρ2
l
2πlR 2πlR
V ρ= ≅
R= 8l 2l
ln( ) − 1 ln( )
I d a
Principle: RE 3pole
Maximum Theoretical Accuracy
LEAD LENGTH MAXIMUM THEORETICAL
ACCURACY
2L 50%
4L 75%
8L 87.5%
16L 93.7%
32L 96.8%
2.5A Current
2,500V
IEEE is a registered trademark of The Institute of Electrical and Electronics Engineers, Inc.
Touch Potential
0.116
IB = for 50 kg body weight
ts
0.157
IB = for 70 kg body weight
ts
ts time in seconds
Body Current Versus Time
C-Curves (Cs versus hs)
ρ
0.09 1 −
ρs
Cs = 1 −
2hs + 0.09
Cs = surface layer
rerating factor
hs = thickness of the
surface material
Conductor Equations
TCAP ⋅10 − 4 K o + Tm
where I = Amm 2 ln
α ρ
c r r o a
t K + T
I is the rms current in Ka
Amm2 is the conductor cross section in mm2
Tm is the maximum allowable temperature in oC
Ta is the ambient temperature in oC
Tr is the reference temperature for material constants in oC
αo is the thermal coefficient of resistivity at 0oC in 1/oC
αr is the thermal coefficient of resistivity at reference temperature Tr in 1/oC
ρr is the resistivity of the ground conductor at reference temperature Tr in µΩ-cm
Ko 1/αo or (1/αr) - Tr in oC
tc is the duration of current in s
TCAP is the thermal capacity per unit volume from table 11-1, in J/(cm3·oC)
Ultimate Current Carrying Capabilities of
Copper Conductors
Currents are RMS values, for frequency of 60 Hz, X/R = 40
Current in kilo-amperes
#1 42.41 28 21 16 13 11 7
1/0 53.48 36 26 20 17 14 8
2/0 67.42 45 33 25 21 18 11
3/0 85.03 57 42 32 27 23 14
4/0 107.20 72 53 40 34 30 17
250 126.65 85 62 47 40 35 21
kcmil
E
I0 =
3 ⋅ R f + ( R1 + R2 + R0 ) + j ( X 1 + X 2 + X 0 )
3I 0 =
(
(3) 115,000 3 ) = 3180 A
3(0 ) + (4.0 + 4.0 + 10.0 ) + j (10.0 + 10.0 + 40.0 )
Step 2 – Fault Current & Conductor Size
For the 13 kV bus fault, the 115 kV equivalent fault impedances must be transferred to the 13 kV side of
the transformer. It should be noted that, due to the delta-wye connection of the transformer, only the
positive sequence 115 kV fault impedance is transferred. Thus
2
13
Z1 = [4.0 + j10.0] + 0.034 + j1.014 = 0.085 + j1.142
115
Z 0 = 0.034 + j1.014
3I 0 =
(
(3) 13,000 3 ) = 6,814 Amps
3(0) + (0.085 + 0.085 + 0.034 ) + j (1.142 + 1.142 + 1.014 )
Decrement factor Df is approximately1.0; thus, the rms asymmetrical fault current
is also 6814 A
Conductor size
Akcmil = I ⋅ K f tc
Etouch 70 = (1000 + 1.5Cs ρ s )0.157 / t s = [(1000 + 1.5(0.74 )2500 )]0.157 0.5 = 838.2
Step 4 - Initial Design
Assume a preliminary layout of 70 m × 70 m grid with equally spaced conductors,
with spacing D = 7 m, grid burial depth h = 0.5 m, and no ground rods. The total
length of buried conductor, LT, is 2 × 11 × 70 m = 1540 m.
Step 5 -Determination of Grid
Resistance
For L = 1540 m, and grid area A = 4900 m2, the resistance is
1 1 1
Rg = ρ + 1 +
T
L 20 A 1 + h 20 / A
1 1 1
R g = 400 + 1+ = 2.78 ohms
1540 20 ⋅ 4900 1 + 0.5 20 4900
Step 6 - Maximum grid current Ig
Given from Step 2 – Df = 1.0, and Sf = 0.6
Ig
Sf = IG = Df ⋅ Ig
3 ⋅ Io
Though the 13 kV bus fault value of 6814 A is greater than the 115 kV
bus fault value of 3180 A, The wye-grounded 13 kV transformer
winding is a “local” source of fault current and does not contribute to
the GPR. Thus, the maximum grid current is based on 3180 A.
IG = D f ⋅ S f ⋅ 3 ⋅ I0
I G = (1)(0.6)(3180) = 1908 A
Step 7 - Ground Potential Rise GPR
Now it is necessary to compare the product of IG and Rg, or
GPR, to the tolerable touch voltage, Etouch70
GPR = I G ⋅ Rg
GPR = 1908 ⋅ 2.78 = 5304 volts
1 1
K ii = = = 0.57 h 0.5
(2 ⋅ 11) Kh = 1+ = 1+ = 1.225
(2 ⋅ n )
2 2 11
n
h0 1 . 0
Km =
1 72
+
(7 + 2 ⋅ 0.5)
2
−
0.5 0.57 8
2π
ln
⋅ ⋅ ⋅ ⋅ ⋅
+ ln
π ( ⋅ − ) = 0.89
16 0. 5 0 . 01 8 7 0 . 01 4 0. 01 1 .225 2 11 1
1 1 1
Rg = ρ + 1 + = 400 1 + 1 1 + 1 = 2.75ohms
T
L 20 A 1 + h 20 / A 1690 20 ⋅ 4900 1 + 0.5 20 4900
h 0.5
Kii = 1.0 with rods Kh = 1+ = 1+ = 1.225
h0 1.0
1 72 (7 + 2 ⋅ 0.5)
2
0.5 1.0 8
Km = ln + − + ln = 0.77
2π 16 ⋅ 0 .5 ⋅ 0 .01 8 ⋅ 7 ⋅ 0. 01 4 ⋅ 0 .01 1. 225 π (2 ⋅ 11 − 1)
The step voltage has not been calculated yet, the new values of Ki, Es, LS, and Ks
have to be also calculated. Note that the value for Ki is still 2.272 (same as for
mesh voltage).
Final Design
Ks =
1 1
+
1
+
π 2 ⋅ h D + h D
1
1 − (
0 . 5 n −2
)
=
1 1
+
1
+
π 2 ⋅ 0.5 7 + 0.5 7
1
(
1 − 0 .5 ) = 0.406
11− 2
Native Soil
Upper Layer Resistivity
400.0
Layer Resistivity
2500
Layer Thickness (m)
0.1000
k Factor
-0.7241
Reduction Factor
0.7406
WinIGS - Form: GRD_RP02 - Copyright © A. P. Meliopoulos 1998-2013
Computer Software Calculations
Computer Software Calculations
Comparison of Design Results
Manual Software
• Exothermic
– Molecular bond
51
Comparison: Mechanical vs.
Exothermic Connectors
Molecular Bond Mechanical Connection
Molecular bonds guarantee uniform conductivity across the entire cross section of the
conductor.
Connectors
2000 Edition
Exothermic Connections - Rated the same as the conductor - 1083 °C
Brazed Connections - 450 °C based on copper based brazing alloys melting
at 600 °C
Pressure Connectors - 250-350 °C
Bolted Connectors - 250 °C
2000 Edition
Connectors meet IEEE 837, IEEE Standard for Qualifying Permanent
Connections Used in Substation Grounding
National Electrical Grounding
Research Project (NEGRP)
55
NEGRP Study - After 10 Years in the
Same Soil Conditions
Mechanical Mechanical
Compression Exothermic
56
•Exothermic - heat producing reaction
⇒Cu Oxide + AL -> Copper + Al Oxide
⇒Reaction Temperature at 4500° F
58
Exothermic Welding Reaction
59
Exothermic Welds in Grounding
Typical Substation Connection
Applications
60
Connector “A”, Connector “B”, Type “L”, #1
#2 CYCLE #8
CYCLE #4
61
Advantages of Exothermic
Connections
• Provides a molecular bond between
conductors
– Ensures equal current sharing between
conductor strands
• Current carrying capacity equal to or
exceeding conductor ampacity
• Permanent
– Will not loosen or corrode or increase in
resistance
– Will last longer than conductors
62
IEEE Std 837 - 2002
Mechanical Tests Sequential Tests
• Four Tests
– Classified As Sequential Tests Sequential Tests
Sequential.
Current Current
Temperature Temperature
IEEE is a registered trademark of The Institute of Electrical and Electronics Engineers, Inc.
IEEE Std. 837 - 2002
• Mechanical Tests
– Test 1 - Mechanical Pullout:
• The Connector Pullout Values Shall Meet Minimum Pullout Values With
No Visible Movement of the Pre-marked Conductor With Respect to the
Connector
– Conductors Can Not Move Under Load of 2225 N for Sizes up to 4/0 AWG
• Mechanical Tests
– Test 2 - Electromagnetic Force Withstand:
• (3) Surges, 0.2 Second Each
• The Connection Shall Remain Intact With No Visible Movement of the
Pre-marked Conductor With Respect to the Connector
• The Resistance of the Connection Shall Not Increase by More Than 50%.
IEEE is a registered trademark of The Institute of Electrical and Electronics Engineers, Inc.
IEEE Std 837 - 2002
• Sequential Tests 3 and 4
– Current-thermal Cycling
• 25 Cycles at 350° C
– Freeze-thaw
• 10 Cycles; -10° to +20° C for 2 Hours
– Nitric (Acidic) and Salt Spray (Alkaline)
• Nitric - 10% HNO3 Solution (Volume)
• CU - Reduce Control Conductor Cross Sectional Area 80% of
Original
– Salt Spray (Per ANSI/ASTM B117-85)
– Fault Current (3 Surges)
• 90% Symmetrical RMS Fusing Current for 10 Seconds
IEEE is a registered trademark of The Institute of Electrical and Electronics Engineers, Inc.
IEEE Std 837 - Future
• Likely to be issued in 2014
• Changes to include
• New wave forms and current levels for EMF testing
• Removal of resistance criteria
• Connections must be qualified for various conductor
types in order to meet IEEE 837 requirements (i.e.,
connector manufacturers that claim compliance with
CCSC must test with CCSC)
• Above grade conductors can not be restrained
IEEE is a registered trademark of The Institute of Electrical and Electronics Engineers, Inc.
Ground Electrodes
Features & Service Life
Ground Rod Choices
69
Comparing Copper-bonded &
Galvanized Steel Ground Rods
70
Comparing Copper-bonded &
Galvanized Steel Ground Rods
• The thickness and type of coating material
determines corrosion resistance and
service life
• Copper-bonded steel rods
– Coated with 10 mils (.010” or .254mm) of
copper
• Galvanized steel rods
– Coated with 3.9 mils (.0039” or .099mm) of zinc
– Limited by hot dip galvanizing process
• Thicker coating = longer service life
71
Corrosion Protective Mechanism
• Copper is resistant to corrosion in most
soils
• Zinc is sacrificial in most soils and with
respect to most metals
• Corrosion protection mechanisms are
different
– The copper coating is designed to prevent
corrosion of the steel core
– The zinc coating will delay corrosion of the
steel core by providing a sacrificial barrier
72
NEGRP Corrosion Protective
Mechanism
Galvanized Ground Rod
73
National Electrical Grounding Research
Project (NEGRP)
• Electrodes removed for corrosion analysis
– Balboa: January 29, 2001 (9 years)
– Pawnee: March 17, 2003 (11 years)
– Pecos: April 12, 2004 (12 years)
– Lone Mountain: April 14, 2004 (12 years)
• Moderate to severe corrosion of galvanized
rods
• Minimal corrosion of copper-bonded rods
• Observations were same at all sites
NEGRP: Electrodes H & I
78
Ground Enhancement - Bentonite
Bentonite clay
• Low initial cost
• Ineffective when dry
• Resistivity of 2.5 Ω·m at 300% moisture
• Low resistivity results mainly from an electrolytic
process
• May shrink and pull away from rod or soil when it dries
• IEEE® Std 80 – 2000 Section 14.5
o “It may not function well in a very dry environment, because
it may shrink away from the electrode, increasing the
electrode resistance”
79
IEEE is a registered trademark of The Institute of Electrical and Electronics Engineers, Inc.
Ground Enhancement Material (GEM)
Parameters:
• Environmentally friendly
• Hygroscopic
• Permanent, maintenance free
• Low resistivity
• Unremarkable affect by wet, dry or freezing
conditions
• Works in any type of soil
• Cost effective
GEM Encased Electrode (NEGRP “E”)
81
8 Years Data from NEGRP - Performance
Evaluation of GEM Encased Electrodes
Balboa, NEVADA
400
Soil resistivity, R (Ωm)
Soil moisture, M (%)
Soil temperature, T (°C)
300
T, M and R
200
100
0
08/22/92 08/22/94 08/21/96 08/21/98 08/20/00
100
Vert. - driven
Measured resistance (Ω)
Vert. - GEM
80 Horiz. - concrete
Horiz. - GEM
60
40
20
0 82
08/22/92 08/22/94 08/21/96 08/21/98 08/20/00
NEGRP Study Investigation Results of
GEM Encased Electrodes
• For all investigated electrodes the
resistance of GEM encased electrodes
is on the average 50% lower than
resistance of driven ground rods
• GEM also reduces the seasonal and
long-term variability of the resistance
83
GEM in Grounding Wells
• Material
– Copper
– Copper - bonded steel
– Copper – clad steel
– Composite
• Size
– Sufficient to withstand maximum fault current for
maximum clearing time
– Resist underground corrosion
89
Advantages of Copper Conductors
90
Advantages of Copper-Clad Steel &
Copper-Bonded Steel Conductors
91
Formed Copper-bonded Steel
Conductors
UL® 467 30 Bend
o Test
93
UL is a registered trademark of UL LLC.
UL® 467 30 Bend
o Test
Galvanized Steel
Conductors
94
Field-bent Copper-bonded Conductor
95
Pre-bent Copper-bonded Conductor
96
Composite Conductors
Composite Conductor Chart
Composite Conductor Testing
ERICO Confidential 99
Composite Conductor Features
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