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HPA600R760MB
Features:
l Fast Switching
l Low Gate Charge
l Low Reverse transfer capacitances
l 100% Single Pulse avalanche energy Test
Applications:
Power switch circuit of adaptor and charger.
Absolute(Tj= 25℃ unless otherwise specified):
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IGSS(F) Gate to Source Forward Leakage VGS =+20V VDS = 0V, -- -- 100 nA
IGSS(R) Gate to Source Reverse Leakage VGS =-20V VDS= 0V, -- -- -100 nA
ON Characteristics
Rating
Symbol Parameter Test Conditions Units
Min. Typ. Max.
R DS(ON) Drain-to-Source On-Resistance VGS=10V,ID =2.5A -- 0.70 0.76 Ω
VGS(TH) Gate Threshold Voltage VDS = V GS , ID = 250µA 2.0 -- 4.0 V
Pulse width tp≤300µs,δ≤2%
Dynamic Characteristics
Rating
Symbol Parameter Test Conditions Units
Min. Typ. Max.
Rg Gate resistance f = 1.0MHz -- 4.5 -- Ω
C iss Input Capacitance -- 360 --
VGS = 0V V DS = 50V
C oss Output Capacitance f = 1.0MHz -- 78 -- pF
C rss Reverse Transfer Capacitance -- 1.2 --
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Thermal Restistance
Symbol Parameter Max. Units
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Characteristics Curve:
Figure.1 Maximum Forward Bias Safe Operating Area Figure.2 Maximum Power Dissipation vs Case Temperature
Figure.3 Maximum Continuous Drain Current vs Case Temperature Figure.4 Typical Output Characteristics
10
D=1
0.5
0.2
ZθJC,Thermal Response[℃/W]
1
0.1
0.05
0.02
0.1
0.01
0.01
Single Pulse
Notes:
1.Duty Cycle, D=t1/t2
2.TJM = PDM*RθJC + TC
0.001
0.00 0.00 0.00 0.00 0.01 0.10 1.00 10.00 100.00
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Figure.6 Typical Transfer Characteristics Figure.7 Typical Body Diode Transfer Characteristics
Figure.8 Typical Drain to Source ON Resistance Figure.9 Typical Drian to Source on Resistance
vs Drain Current vs Junction Temperature
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Figure.10 Typical Theshold Voltage vs Junction Temperature Figure 11 Typical Breakdown Voltage vs Junction Temperature
Figure.12 Typical Capacitance vs Drain to Source Voltage Figure.13 Typical Gate Charge vs Gate to Source Voltage
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Figure 14. Gate Charge Test Circuit Figure 15. Gate Charge Waveforms
Figure 16. Resistive Switching Test Circuit Figure 17. Resistive Switching Waveforms
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Figure 18. Diode Reverse Recovery Test Circuit Figure 19. Diode Reverse Recovery Waveform
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Package Information
A C
D
ΦP
Q
B
B1
G
H
C1
L
E
F
N N
Values(mm)
Items
MIN MAX
A 9.60 10.4
B 15.4 16.2
B1 8.90 9.50
C 4.30 4.90
C1 2.10 3.00
D 2.40 3.00
E 0.60 1.00
F 0.30 0.60
G 1.12 1.42
3.40 3.80
H
1.60 2.90
L* 12.0 14.0
N 2.34 2.74
Q 3.15 3.55
2.90 3.30
*adjustable
TO-220F Package
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Limit ≤
≤0.1% ≤0.1% ≤0.1% ≤0.1% ≤0.1% ≤0.1% ≤0.1% ≤0.1% ≤0.1%
0.01%
Lead Frame ○ ○ ○ ○ ○ ○ ○ ○ ○ ○
Molding ○ ○ ○ ○ ○ ○ ○ ○ ○ ○
Chip ○ ○ ○ ○ ○ ○ ○ ○ ○ ○
Wire Bonding ○ ○ ○ ○ ○ ○ ○ ○ ○ ○
Solder × ○ ○ ○ ○ ○ ○ ○ ○ ○
○:Means the hazardous material is under the criterion of 2011/65/EU.
×:Means the hazardous material exceeds the criterion of 2011/65/EU.
Note
The plumbum element of solder exist in products presently, but within the allowed range
of Eurogroup’s RoHS.
Warnings
1. Exceeding the maximum ratings of the device in performance may cause damage to the device,
even the permanent failure, which may affect the dependability of the machine. It is suggested
to be used under 80 percent of the maximum ratings of the device.
2. When installing the heat sink, please pay attention to the torsional moment and the smoothness
of the heatsink.
3. VDMOSFET is the device which is sensitive to the static electricity, it is necessary to protect
the device from being damaged by the static electricity when using it.
4. This publication is made by Huajing Microelectronics and subject to regular change without
notice.
Add: No.14 Liangxi RD. Wuxi, Jiangsu, China Mail:214061 http://www. crhj.com.cn HTU UTH
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