Preliminary

RJK0389DPA
Silicon N Channel Power MOS FET with Schottky Barrier Diode
High Speed Power Switching REJ03G1722-0400
Rev.4.00
Sep 29, 2009

Features
• Low on-resistance
• Capable of 4.5 V gate drive
• High density mounting
• Pb-free
• Halogen-free

Outline

RENESAS Package code: PWSN0008DD-A

(Package name: WPAK-D2)
2 3 4 9
D1 D1 D1 S1/D2 5 6 7 8

5 6 7 8
1 8 9
G1 G2 1, 8 Gate
2, 3, 4, 9 Drain
4 3 2 1 5, 6, 7, 9 Source
4 3 2 1
S2 S2 S2
5 6 7 (Bottom View)
MOS1 MOS2 and
Schottky Barrier Diode

Absolute Maximum Ratings

(Ta = 25°C)
Ratings
Item Symbol MOS1 MOS2 Unit
Drain to source voltage VDSS 30 30 V
Gate to source voltage VGSS ±20 ±20 V
Drain current ID 15 20 A
Drain peak current ID(pulse)Note1 60 80 A
Reverse drain current IDR 15 20 A
Avalanche current IAP Note 2 8 11 A
Avalanche energy EAR Note 2 6.4 12.1 mJ
Channel dissipation Pch Note3 10 10 W
Channel temperature Tch 150 150 °C
Storage temperature Tstg –55 to +150 –55 to +150 °C
Notes: 1. PW ≤ 10 μs, duty cycle ≤ 1%
2. Value at Tch = 25°C, Rg ≥ 50 Ω
3. Tc = 25°C

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RJK0389DPA Preliminary

Electrical Characteristics

• MOS1
(Ta = 25°C)
Item Symbol Min Typ Max Unit Test Conditions
Drain to source breakdown voltage V(BR)DSS 30 — — V ID = 10 mA, VGS = 0
Gate to source leak current IGSS — — ±0.1 μA VGS = ±20 V, VDS = 0
Zero gate voltage drain current IDSS — — 1 μA VDS = 30 V, VGS = 0
Gate to source cutoff voltage VGS(off) 1.2 — 2.5 V VDS = 10 V, ID = 1 mA
Static drain to source on state RDS(on) — 8.2 10.7 mΩ ID = 7.5 A, VGS = 10 V Note4
resistance RDS(on) — 11.8 16.5 mΩ ID = 7.5 A, VGS = 4.5 V Note4
Forward transfer admittance |yfs| — 32 — S ID = 7.5 A, VDS = 10 V Note4
Input capacitance Ciss — 860 — pF VDS = 10 V
Output capacitance Coss — 165 — pF VGS = 0
Reverse transfer capacitance Crss — 53 — pF f = 1 MHz
Gate Resistance Rg — 4.2 — Ω
Total gate charge Qg — 6.3 — nC VDD = 10 V
Gate to source charge Qgs — 2.3 — nC VGS = 4.5 V
Gate to drain charge Qgd — 1.4 — nC ID = 15 A
Turn-on delay time td(on) — 6.9 — ns VGS = 10 V, ID = 7.5 A
Rise time tr — 4.1 — ns VDD ≅ 10 V
Turn-off delay time td(off) — 40.8 — ns RL = 1.33 Ω
Fall time tf — 5.6 — ns Rg = 4.7 Ω
Body–drain diode forward voltage VDF — 0.84 1.10 V IF = 15 A, VGS = 0 Note4
Body–drain diode reverse trr — 20 — ns IF =15 A, VGS = 0
recovery time diF/ dt = 100 A/μs
Notes: 4. Pulse test

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RJK0389DPA Preliminary

• MOS2
(Ta = 25°C)
Item Symbol Min Typ Max Unit Test Conditions
Drain to source breakdown voltage V(BR)DSS 30 — — V ID = 10 mA, VGS = 0
Gate to source leak current IGSS — — ±0.1 μA VGS = ±20 V, VDS = 0
Zero gate voltage drain current IDSS — — 1 mA VDS = 30 V, VGS = 0
Gate to source cutoff voltage VGS(off) 1.2 — 2.5 V VDS = 10 V, ID =1 mA
Static drain to source on state RDS(on) — 6.8 8.9 mΩ ID = 10 A, VGS = 10 V Note4
resistance RDS(on) — 10.5 14.7 mΩ ID = 10 A, VGS = 4.5 V Note4
Forward transfer admittance |yfs| — 38 — S ID = 10 A, VDS = 10 V Note4
Input capacitance Ciss — 1000 — pF VDS = 10 V
Output capacitance Coss — 240 — pF VGS = 0
Reverse transfer capacitance Crss — 100 — pF f = 1 MHz
Gate Resistance Rg — 4.5 — Ω
Total gate charge Qg — 7.2 — nC VDD = 10 V
Gate to source charge Qgs — 2.9 — nC VGS = 4.5 V
Gate to drain charge Qgd — 2.2 — nC ID = 20 A
Turn-on delay time td(on) — 8.5 — ns VGS = 10 V, ID = 10 A
Rise time tr — 4.0 — ns VDD ≅ 10 V
Turn-off delay time td(off) — 39 — ns RL = 1.0 Ω
Fall time tf — 6.6 — ns Rg = 4.7 Ω
Schottky Barrier diode forward voltage VF — 0.44 — V IF = 2 A, VGS = 0 Note4
Body–drain diode reverse trr — 12 — ns IF = 20 A, VGS = 0
recovery time diF/ dt = 100 A/μs
Notes: 4. Pulse test

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RJK0389DPA Preliminary

Main Characteristics

• MOS1

Power vs. Temperature Derating Maximum Safe Operation Area

20 1000
Pch (W)

ID (A)
15 100
Channel Dissipation

1m

Drain Current
10 10 10 s
ms
Operation in
this area is
5 1 limited by RDS(on) DC
op
er
Tc = 25°C ati
on
1 shot Pulse
0.1
0 50 100 150 200 0.1 1 10 100

Case Temperature Tc (°C) Drain to Source Voltage VDS (V)

Typical Output Characteristics Typical Transfer Characteristics

20 20
4.5 V VDS = 10 V
10 V 3.2 V Pulse Test Pulse Test
16 16
ID (A)

ID (A)

12 3.0 V 12
Drain Current

Drain Current

8 8

2.8 V
4 4 25°C
Tc = 75°C
VGS = 2.6 V –25°C

0 2 4 6 8 10 0 1 2 3 4 5

Drain to Source Voltage VDS (V) Gate to Source Voltage VGS (V)

Drain to Source Saturation Voltage vs. Static Drain to Source on State Resistance
Gate to Source Voltage vs. Drain Current
100
VDS (on) (mV)

200
Drain to Source Saturation Voltage

Pulse Test Pulse Test

150 30

VGS = 4.5 V
100 10
ID = 10 A
10 V

50 5A 3

2A
1
0 4 8 12 16 20 1 3 10 30 100 300 1000

Gate to Source Voltage VGS (V) Drain Current ID (A)

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RJK0389DPA Preliminary

Static Drain to Source on State Resistance Typical Capacitance vs.

vs. Temperature Drain to Source Voltage
50 10000
Pulse Test

3000
40

Capacitance C (pF)
1000
30 Ciss
ID = 2 A, 5 A, 10 A 300
20
VGS = 4.5 V 100 Coss

10
30 Crss
VGS = 0
10 V 2 A, 5 A, 10 A f = 1 MHz
0 10
–25 0 25 50 75 100 125 150 0 10 20 30

Case Temperature Tc (°C) Drain to Source Voltage VDS (V)

Reverse Drain Current vs.

Dynamic Input Characteristics Source to Drain Voltage
50 20 50
VDS (V)

VGS (V)

ID = 15 A VGS 10 V Pulse Test

Reverse Drain Current IDR (A)
40 16 40 5V
VDD = 25 V
10 V
Drain to Source Voltage

Gate to Source Voltage

30 12 30
VDS

20 8 20

VGS = 0, –5 V
10 4 10
VDD = 25 V
10 V
0 0
0 8 16 24 32 40 0 0.4 0.8 1.2 1.6 2.0

Gate Charge Qg (nc) Source to Drain Voltage VSD (V)

Maximum Avalanche Energy vs.

Channel Temperature Derating
Repetitive Avalanche Energy EAR (mJ)

10

0
25 50 75 100 125 150

Channel Temperature Tch (°C)

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RJK0389DPA Preliminary

Normalized Transient Thermal Impedance vs. Pulse Width

3
Tc = 25°C

1
D=1

0.5
0.3

0.2

0.1 0.1

0.05 PW
PDM D=
.02 T
0 se
0.03
1 p ul
0.0 hot PW
1 s T

0.01
1m 10 m 100 m 1 10

Pulse Width PW (s)

Avalanche Test Circuit Avalanche Waveform

VDSS
1
EAR = L • IAP2 •
L 2 VDSS – VDD
VDS
Monitor
IAP V(BR)DSS
Monitor
IAP
Rg D. U. T VDD VDS
ID
Vin
15 V
VDD
0

Switching Time Test Circuit Switching Time Waveform

Vin Monitor Vout 90%

Monitor
D.U.T.
Rg RL Vin 10%

Vout 10% 10%

Vin VDS
10 V = 10 V
90% 90%

td(on) tr td(off) tf

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RJK0389DPA Preliminary

• MOS2 and Schottky Barrier Diode

Power vs. Temperature Derating Maximum Safe Operation Area

20 1000
Pch (W)

ID (A)
15 100
Channel Dissipation

1m

Drain Current
10 10 s
10 ms
Operation in
this area is

DC
5 1 limited by RDS(on)

Op
er
ati
Tc = 25°C

on
0.1 1 shot Pulse
0 50 100 150 200 0.1 1 10 100

Case Temperature Tc (°C) Drain to Source Voltage VDS (V)

Typical Output Characteristics Typical Transfer Characteristics

20 20
4.5 V VDS = 10 V
3.0 V Pulse Test
10 V Pulse Test
16 16
ID (A)

ID (A)

2.9 V
12 12
Drain Current

Drain Current

2.7 V
8 8

25°C
4 2.5 V 4
Tc = 75°C
–25°C
0 2 4 6 8 10 0 1 2 3 4 5

Drain to Source Voltage VDS (V) Gate to Source Voltage VGS (V)

Drain to Source Saturation Voltage vs. Static Drain to Source on State Resistance
Gate to Source Voltage vs. Drain Current
100
VDS (on) (mV)

200
Drain to Source Saturation Voltage

Pulse Test Pulse Test

150 30

VGS = 4.5 V
100 10

ID = 10 A 10 V
50 3
5A
2A
1
0 4 8 12 16 20 1 3 10 30 100 300 1000

Gate to Source Voltage VGS (V) Drain Current ID (A)

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RJK0389DPA Preliminary

Static Drain to Source on State Resistance Typical Capacitance vs.

vs. Temperature Drain to Source Voltage
50 10000
Pulse Test

40 3000

Capacitance C (pF)
1000
30 Ciss
300
ID = 2 A, 5 A, 10 A
20
Coss
100
VGS = 4.5 V
Crss
10
30
VGS = 0
10 V 2 A, 5 A, 10 A f = 1 MHz
0 10
–25 0 25 50 75 100 125 150 0 10 20 30

Case Temperature Tc (°C) Drain to Source Voltage VDS (V)

Reverse Drain Current vs.

Dynamic Input Characteristics Source to Drain Voltage
50 20 50
VDS (V)

VGS (V)

ID = 20 A VGS Pulse Test

Reverse Drain Current IDR (A) 10 V
40 16 40
VDD = 25 V 5V
10 V
Drain to Source Voltage

Gate to Source Voltage

30 12 30
VDS

20 8 20

VGS = 0, –5 V
10 4 10
VDD = 25 V
10 V
0 0
0 0 0.4 0.8 1.2 1.6 2.0
8 16 24 32 40

Gate Charge Qg (nc) Source to Drain Voltage VSD (V)

Maximum Avalanche Energy vs.

Channel Temperature Derating
Repetitive Avalanche Energy EAR (mJ)

20

16

12

0
25 50 75 100 125 150

Channel Temperature Tch (°C)

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RJK0389DPA Preliminary

Normalized Transient Thermal Impedance vs. Pulse Width

3
Tc = 25°C

1
D=1

0.5
0.3

0.2

0.1 0.1

0.05 PW
PDM D=
T
2
0.03 0.0
1 se
0 . 0
pul PW
hot T
1s
0.01
1m 10 m 100 m 1 10

Pulse Width PW (s)

Avalanche Test Circuit Avalanche Waveform

VDSS
1
EAR = L • IAP2 •
L 2 VDSS – VDD
VDS
Monitor
IAP V(BR)DSS
Monitor
IAP
Rg D. U. T VDD VDS
ID
Vin
15 V
VDD
0

Switching Time Test Circuit Switching Time Waveform

Vin Monitor Vout 90%

Monitor
D.U.T.
Rg RL Vin 10%

Vout 10% 10%

Vin VDS
10 V = 10 V
90% 90%

td(on) tr td(off) tf

REJ03G1722-0400 Rev.4.00 Sep 29, 2009

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RJK0389DPA Preliminary

Package Dimensions
Package Name JEITA Package Code RENESAS Code Previous Code MASS[Typ.]
WPAK-D2 - PWSN0008DD-A WPAK-DV(2) 0.07g

Unit : mm

0.5 ± 0.15
5.1 ± 0.2 0.8 Max
0.4 ± 0.06

3.9 ± 0.2

0.9 ± 0.15

2.2 ± 0.2
(0.6) (0.6)
+0.1

+0.1
6.1 −0.3

5.9 −0.2

1.1 ± 0.2

0.45 ± 0.1
(0.05)
0.4 ± 0.15

0.5 ± 0.15
0.635Max 1.27 Typ 0.2 Typ 0.935 ± 0.15

2.9 ± 0.2
Stand-off

4.9 ± 0.1
0.05Max
0Min

(Ni/Pd/Au plating)

Ordering Information
Part No. Quantity Shipping Container
RJK0389DPA-00-J53 3000 pcs Taping

REJ03G1722-0400 Rev.4.00 Sep 29, 2009

Page 10 of 10
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