INTRODUCTION

ITI provides an internship training for students to get to know about their knowledge, about their
subject practically and individually. They also teaching and training in different department like
 Transmission Defence Production (TDP)

 Quality Assurance (QA)

 Research and Development (R&D)

 Internet of Things (IoT)

 Moulding

 Information Technology (IT)

 Surface Mounting Technology (SMT)

 Gigabit Passive Optical Network(GPON)

This training is mostly based on telecommunication. this training knowledge marks us to be

aware of the industrial activities, where we exposed to practical situations of manufacturing and
processing.
The different department provides different information and clear view of the work carries in
each of the department through this we can gain knowledge in telecommunication as well as in
electronics section.
Because of the internship training we can gain more knowledge as well as some basic things
about telecommunication as well as electronics.
 TABLE OF CONTENT

1. Company profile

2. About departments

2.1 Telephone defence production

2.2 Information technology

2.3 Internet of things

2.4 Quality assurance

2.5 Surface mounting technology

2.6 R and D department

2.7 GPON

2.8 Moulding

3. Conclusion

4. Reference
 1. Company Profile

ITI limited is an Indian Telephone Industry limited is public sector undertaking of country which
was established in 1948. From small beginning, it was grown into a mammoth multiunit
enterprise with manufacturing units at Dooravaninagar and electronic city in Bangalore in
Karnataka.

In 1964 the company started manufacturing of cross bar automatic exchange and get started in
Noini and Srinagar of J and K. Later company started plants in the Raebareilly in UP, Palkkad in
Kerala and Manakapur.

The company has sales network and service officer comprising regional officers located at
Bangalore, Mumbai, Kolkata, Delhi, Lucknow, Chennai, and no of sub officers under each
region, to represent company in every significant town in line with business strategy. The entire
activities of company are now re-organized as independent business group with manufacturing
facility at Bangalore, Manakapur and Pallakad.

Transmission business group with manufacturing facility at Bangalore, Noini, terminal

equipment business group with manufacturing facility at Bangalore and Noini.

The company has R&D infrastructure attached to the independent business group. Then main
R&D Division are at Bangalore and Noini. Forward looking at technology. The R and D is
engaged in continuous development and absorption of technology.

The company lays a strong emphasis on quality which taken as corporate management function
under in independent execution director. A large no of company products are covered under the
self-certification scheme by majors customer i.e., department of telecommunication,
International quality management system. The company has adopted ISO 9000, taking it as a
Tool for organization change and work redesign.
Human resource development is another thrust in company involving professional and
organizational development activities.

The company products range includes all that is required to equip National and International
telecommunication network, Satellite with simple telephone to state to the art digital
switching,satellite communication and optical communication.

95% of company product are supplied to department of telecommunication now as BSNL, other
significant customers of company are Defence and Railways, for even few special turkey
projects has also been executed.

Highlights:
ITI is telecom pioneer in India since 1948 contributor of more than 70% of Indian telecom
network. World’s 9th largest telecommunication company.
 US $400 million company.
 High impact turkey specialist for total telecom and IT solutions

 An ISO 9000 company with compony with store of art manufacturing facilities.

 Dependable integrated logistics.

 Joint ventures/Strategic alliance with global telecom leaders.

 Representation on National and International level quality standards panels.

Customer Profile:

 Department of telecommunication (DOT), now known as Bharat Sanchar Nigam Limited

(BSNL).
 Mahanagar Telephone Niagm Limited (MTNL)

 Videsh Sanchar Nigam Limited (VSNL)

 Defence and Para-Defence
 Railways

 Police and Internal security

 Oil Sector and Steel Sector

 Post Offices
 ISRO (Indian Space Research Organization
TASK PERFORMED

CHAPTER 1

2.1 TELEPHONE DEFENCE PRODUCTION

ITI mainly manufactures defence products that are used for communication purpose.
Communication devices must be rigid, resistance or withstand to all kind of environment,
temperature and pressure.

THERE IS DIFFERENT TYPE OF COMMUNICATION:

1. Point to point communication:

It is type of communication which has dedicated link between source and destination.

2. Simplex communication:
Type of communication in which information is send only in one direction through channel.

3. Half duplex communication:

In this type of communication, signal is transmitted in both the direction but not simultaneously.

4. Full duplex communication:

In this communication, signal able to transmit in both directions at the same instant of time.

THE EVOLUTION OF TELEPHONES IN ITI

1. Magneto telephone:
 It uses point to point communication.

 It uses 3v battery cells for switch.

  It uses fully duplexed telephone.

 Battery is used for speech purpose.

 It is hand operated generator.

 It worth with 40km with wide cable.

 The main application of magneto telephone is in Railways

.
2. 5B telephone:
 It uses point to point communication.
 It is operated by hands.

 It worth with 40km with wide cable.

 The main feature is it is water resistance.

 It is mainly used in military application.

3. Auto field 2A telephone:

 It is half duplexed telephone.
 Transducer and receiver are identically interchangeable.

 It has keypad for dialling purpose.

 It is mainly used in military purpose.

 They can draw power from their own battery of telephone exchange.

 It can be used in the temperature range of -55°c to +70°c.

 To overcome the drawback of 5B telephone, auto field 2A telephone was introduced.

4. 5C telephone:
 There are 4 operating modes,
  I .Magneto mode : To provide point to point communication.

 II. Auto mode : For exchange lines.

 III. Radio mode : Simplex communication is provided.

 IV. Line man short : Four LED condition are provided which gives information about the
in ring, out ring, line man short and battery low.
 A 4.5 battery is provided and it can work under 2.8 volt condition.

 When voltage fall below 2.5 volt, the low charge LED glows.

 When incoming call is arriving, the in ring LED glows.

 When call is made, out ring LED glows.

 It is used in bunkers.

 It provides good speed upto 40 km and it can expandable upto 60km.

 For relaying purpose piezoelectric buzzers are used.

 Application is in military purpose.

5. Sound power telephone:

 It is hand operated current generator.
 It don’t need extra power source.

 It is a full duplex communication.

 It is usually wall mounted telephone.

 The application is in navy.

6. Executive telephone system – 04(ETS -04):

 It needs 12volt battery supply for speech purpose in telecom.

 It is a fully duplexed communication.

 It has 3 visual condition:

 Transducer transmitter and receiver can identically interchangeable.

I. Power

II. Ringing

III. Exchange line

 It is used to maintain secrecy.

 It operates in 2 operating mode:

I. DTMF mode

II. Pulse mode

 Transducer transmitter and receiver can identically interchangeable.

 The keypad contain 4 extra keys:

I. I - Intercom

II. X - Exchange

III. F - Reset

IV. R - Radial

 It uses piezoelectric buzzer for ringing which uses 75volt.

 When phones are in exchange, that time out source person holds with music.

 When both in intercom, then one person is with engage line.

 This machine is used to check the frequency in DTMF.

 There are 2 frequencies i.e. low frequency and high frequency.

 When we press any digit there is a beep sound in machine which confirms the DTMF is
working properly.
 If we select the digit, the row and column frequency will be displayed on the display
screen.
 There are different frequencies for different dial number.

 Phone works in 50mA in 0km and 17mA in 6km.

 Intercom is works in 130volt battery supply.

CHAPTER 2

2.2 INFORMATION TECHNOLOGY

The study or use of system computers for storing, retrieving and sending information.
Information technology is the use of any computers, storage, networking and other physical
devices infrastructure and processes to create, process, store, secure and exchange all forms of
electronic data. It is considered to be subset of information and communication technology. It is
the oldest technology of information.

Anything that render data, information or perceived knowledge is any visual format via any
multimedia distribution mechanism, is considered part of the domain space is called information
technology.IT professionals performs variety of function that range from installing application to
designing computer network and information data bases. A few of the duties that IT perform may
include data management, networking, engineering computer hardware, data bases and software
design as well as management and distribution of entire system.

In earlier days we use assembly level language, but now we use high level languages. A high
level language can easily understand by programmer, but machine have to decode this languages.

There are many impact of IT, some of them are:

 Increased functionality

 Storage

 Speed
  Safety

 Improved accuracy

 Faster processing

 Graphic software
 Electronic fund transfer
 Online banking
 Social media
 Online business
 Security
 Self-learning
 Image processing

Increased functionality:
Computerised accounting systems have also improved the functionality of accounting
department by increasing the timeliness of accounting information. By improving the timeliness
of financial information, accountant can be prepare report and operational analysis that give
management an accurate picture of current operation.

Storage:
Before inventing modern storage devices, the storage devices were very big in size and consume
more area, but now we have SD cards that can store up to 2 to 256 GB.

Speed:
Now a day’s speed internet is in Gbps and before when speed was too low, it was measured in
kbps.

Safety:
The use of internet is safe. No other users can interference in between.
Improves accuracy:
Most computerised accounting system has internal checks and balance measures to ensure that
all transaction is properly balanced.

Faster processing:
Most computerised accounting system allow users to process large amount of financial
information shortening the time period of aids companies in cost central, which improves
overall company efficiency. Using IT, the time consumed will reduces and provide fast process.

Graphic software:
Graphic can be prepared by using graphic software. Graphic can be printed on the papers pr
displayed on slides, transparencies and photos.

Electronic fund transfer:

Companies can connect to the bank through EFT. This system enables companies to make
payment and collection electronically. In this case, when company wants to pay for account
payable to a suppliers and it can do via EFT.

Online banking:
Online banking is possible through internet. There is no need to go banks to do transaction. We
can use through net banking via smartphones, computers etc.

Social media:
it has made to possible to connect people around the around. It helpful to seek information it is
possible through some social applications like Twitter, Facebook, Whatsapp, telegram etc.

Self-learning:
We can get to know the information just by using Google or other search port. We can access
information that we need officially.
Image processing:
Creating, storing and updating papers from document take time. In addition it is costly to process
and store document. Fortunately, these costs can be eliminated with the help of document
imaging system.

Security:
Because of IT, the information is stored and secured in clouds.

VARIOUS OPERATING SYSTEM ARE USED TO FORM THE INVENSION OF

COMPUTERS, SOME OF THEM ARE:

1. DOS(disc operating system):

DOS is an OS, it contain a disc that it has some code to understand the command given by user.
It is first operating system.

2. AMD(advanced micro devices):

These are used in the manufacturing microprocessor. It is an American multinational
semiconductor company that develops processors and related technologies for business and
consumers markets.

Main product includes,

 Microprocessor

 Motherboard chipset

 Embedded processor

 Graphic processor

3. Microsoft windows:
It is a group of several graphical operating system families. All of which core device developed
is marketed and sold by Microsoft.
Windows family includes windows MS, windows 1.0 to 2.0, windows 3.0 to 3.1, windows 95,
windows 98, windows me, windows NT 31, windows 2000, windows XP, windows vista,
windows 7, windows 8, windows 8.1, windows 10.
The important difference between DOS and windows OS are, windows have GUI i.e. graphical
user interface. GUI is more users friendly and can be understand by any version of OS.

4. Linux:
Linux is an open free service OS, I is compatible with any device and any OS. There are
different version of Linux,
 Red hot
 Fedora

 Cent
 Open SUSE
 Mandriva
 Ubuntu etc
 CHAPTER 3

2.3 INTERNET OF THINGS (IOT)

The interconnection via the internet of computing devices embedded in everyday objects,
enabling them to send and receive.

The internet of things is the new of physical devices, vehicles, home appliances and other items
with electronics, software, sensors, actuator and connectivity which enables these things to
connect and exchange data, creating opportunities for more direct integration of the physical
world into computer based system, resulting in efficiency improvements, economic benefits and
reduced human excursion.

IOT verticals:
  Smart environment
 Lighting
 Waste management
 Parking management
 Energy health
 Intelligent transport system
 E-governance
 Smart education
 Smart agriculture
 SCADA solution in waste gas and electricity
 RFID based solution
 Smart industry etc.

Intelligent transport system:

 Weather information

 Commercial vehicle operation

 Variable message sign

  E- collection

 E- tolling

 Radio frequency identification

 Congestion management

 Emergency response

 Advanced devices assistance system

 Lane departure working system

 Intersection safety

 Inter model coordination

Traffic violation detection system using automatic number plate recognition:

 Red light violation

 Zebra crossing violation

 Free left violation

 Wrong direction movement violation

 Automatic traffic counting

 Traffic accident recording system

 E-challan system

3-D printing:

 3-D printing is done in ITI

  3-D printing is process in which material is joined or solidized under computer control to
create a 3-D object, with material being added together.

 It is done using FDM, an additive manufacturing technology for plastic

 In project machine up tom360000 colours can be added into single model.

 This model is used for medical purpose.

Smart education:

 Using IOT we can identify the following:

 Smart document camera

 Smart board or interactive white board

 Learning resources or software

 Smart table interactive learning centre

 Smart board interactive displays

 Video conferencing

 Ultra short throw projection response system

 IRIS connect

Smart environment:
Testing IOT we can identify the following:
 Soil pollution
 Air pollution

 Surface water pollution

 Ocean pollution

 Underground water pollution

  Agriculture environment

Smart lightning system:

Light can be controlled from anywhere around the world even the contrast of light can be
controlled.

Smart parking:
 Guidance

 Real time detection

 Reporting

 Alerting

RFID based solution:

 Identification
 Logistic

 Asset management

 Access control
  Payment

 Product tracking

SCADA solution in water gas: They streamline and integrate our dispersed assets access the gas
wall pad, pipeline and terminal, market from measurement to host system.

CHAPTER 4

2.4 QUALITY ASSURANCE

Every end product /material is made up of raw material. Different types of materials ar made up
of different raw materials. Before using these raw material to make end products they are tested.
These testing involves
 Chemical testing
  Electrical testing

 Mechanical testing

1. Chemical Lab (Chemical testing):

Chemical lab of ITI consists of various equipment’s for studying any raw material and analyzing
it. The raw materials which are going to use in manufacturing and fabrication process are
examined in this lab. All the impurities are checked for various tests, we need various
equipment’s they are as follows,

a) X-Ray Florescence meter:

 This equipment is used for Inorganic identification.

 It is used to identify the coating thickness of the raw material.

Example: vanadium, gold plating, palladium.

b) Atomic Absorption Spectrophotometer(AAS):

Automatic absorption spectroscopy is a spectroanalytical procedure for the quantitative
determination of chemical elements,using the absorption of optical radiation by free atoms in
gaseous state.
This meter is used to check the impurities in the solution.

c)Carbon Sulphur Analyzer (CSA):

This device is designed to measure the carbon and sulphur content in metals, ores, ceramics and
other in-organic material. Alloys mostly contains carbon and Sulphur amount, the Carbon-
Sulphur quantities can be measured with this analyzer that is low carbon- high carbon.

d) Fourier transform IR Spectrometer:

For telephone outer coverings of use various thermoplastic polymers. These polymers sometimes
might contain contaminated compound in them which can to go through few tests to check their
structure and purity.
 This meter is used to for polymer identification.

 It works on the principles of Fourier transform.

 It uses infrared rays.

e) PH meter:
Chemical substances have their own pH level which decides whether the solution is acidic or
basic with its pH value.

f) Titration method:
To check upon the chemical response we do titration where small-small amount of one chemical
is added to another and their response is checked, the amount is controlled using titration pipe.
There are 2 types of titration are present those are, Acid based titration and Oxidation based
titration.
Three main analysis are carried out as,

i. Volumetric Analysis: In this amount of chemical added will affected the response and will be
responsible for chemical changes depending upon the volume of chemical added. This is
commonly used in qualitative analysis.

ii. Polymetric Analysis: the working of polymers depends upon their both physical and
chemical characteristics. This polymetric analysis helps to keep data of polymers working
efficiency.

iii. Gravimetric Analysis: The mass of any substance or compound in material decides its
performance. Hence the performance of material can be prejudge depending upon its using
gravimetric analysis.
2. Electrical Lab:
The components used for PCB are firstly go through various tests to check their ability to
withstand critical conditions they are as follows,
(a) Micro meter:
(b) Precision LCR Meter:

 These are the instruments used to determine the Inductance, Resistance, Capacitance.

 Frequency range is 20Hz-2MHz.

(c) Crystal impedance meter:

 In this the frequency is 1-60MHz.

 It requires external power supply to operate.

(d) Active Component tester:

Active components, the name itself indicates that it includes transistors, IC, diodes etc., to check
such components we need active component tester which will check the proper working
characteristics of these components. Ideal values are already fitted up in Computer and whole
system works with the help of software called as ‘SCADUS’. Active components are used in
amplifiers, equalizers then comparators where small change in their characteristics can change
whole repose of the system.

3. Mechanical Lab
Mechanical components which are part of manufacturing plants design are first tested for their
physical characteristics by using various methods as follows, these various methods are carried
out using various machines as,

Universal testing machine: This machine checks overall physical characteristics of given metal
such as, tensileness, elongation, compression, bending capacity of the materials.
 Brinell Hardness tester: It Checks how hard is the raw material by applying load.
 Hot air Oven: Telephonic connecting are usually made underground where temperature
effect on wire, whether they can withstand any climate changes, maxi
temperature=3000C (99 days testing will continue)
.
 Drill machine: Hand Operated drilling machines is use to make hole in sheet or metal
plate. Hole size can be controlled using drill bits manually. Drill bit is actually a rotating
cutting tool. The drill bit is pressed against the work piece to make hole.

 ASTM Stamp Machine: This machine created the dumbbell shape sheet by punch
pressing on normal sheet. This is also hand pressing machine. If we want to decrease
thickness then it can be done using filling.

 All Cut Machine: It cuts all type of sheets also handled manually. But sheet thickness is
limited to 5mm only.

 Bending Machine: To bend any sheet or metal road manually we use this machine.

 Weighing Machine: Small sheets can be weighed in this machine weighing limits goes
from 5mg to 200g.

 Solder Bath Machine: Solder metal used for Soldering is should be tested first to cross
check its conductivity. The purity of solder affects conductivity hence is solder bath test
all these things must be calculated for final use.
CHAPTER 5
2.5 Surface Mounting Technology (SMT)
 In PCB manufacturing section we produce only bare boards which consists of holes and
routes. After that, for mounting purpose we differentiate into two categories as, Surface
Mounting (which can not be done manually without machine) and another one is through
hole component mounting (Where we put components on PCB manually and solder to
their connecting legs).

Process Chart:

Description of each process is given below:

1. PCB Loader (Machine Model ALD-23 CEU YI LINK):This is the first step /stage in the
PCB manufacturing in which the bare PCB board on which the PCB circuit is loaded. The bare
PCB board consists of layouts on which the components are implemented.

2. Automatic Solder Paste Printer (Model SERIO 4000/EKRA): Automatic solder paste
printer designed to apply solder paste using a device called ‘Stencil’. The solder paste is mainly
composed of Tin & Silver. This paste is smeared on the parts of bare PCB where we are going to
implant the components.

3. Automatic Solder Paste Inspection System (Model KY80302L/Koh young):This is an

another important step in manufacturing the PCB, in which solder paste which is smeared on the
bare PCB is inspect whether the solder is smeared in the right way or not.

4. Automatic Pick and Place Machine (model NXT-8 + XPF-W FUJI): After completing the
inspection of the solder paste the board is passed to the Automatic pick and place unit. Each
component is picked from the packaging using either a vaccume or gripper nozzle, checked by
the vision system and placed on the PCB which is previously programmed. Typically the pick &
place machine place 49,600 components per hour.

5. Automatic Optical Inspection System (model FX-12-220/Nordson):In this unit the

orientation of the components are checked

6. SMT Reflow Oven (model SOLTEC XPM 3m-1240/ Vitronics): This unit provide the
mechanical strength to the components that are implemented on the board. In this step the board
consisting of components is passed to the different temperature zones, which are maintained
different temperatures. Typically board is passed from low temperature zone to high temperature
zone, and it is followed by cooling zone. In this paste is heated to melt and to that some other
materials are added to provide the strength to the components later it is cooled.
7. PCB Unloader: This is the last unit in manufacturing the PCB. Through this unit we are going
to get the complete PCB.
8. X-Ray Inspection (model XTY-160/Nikon): This is an optional unit in manufacturing the
PCB, through which we can detect whether ther is bridging between the holes in BGM
components.

CHAPTER 6

2.6 RESEARCH AND DEVELOPMENT

 R&D Department is responsible for innovations in d esign, products and style. This department
is responsible for creating innovative new products to keep companies a step ahead of the
competition. Many companies also rely on the R&D department to improve existing consumer
products, and to explore new ways of producing them.

It deals with a lot of experimentation as well, where the professionals try to develop something
totally new, or significantly improve already existing technologies.
Sub departments of R&D
1. Power supply
2. Reliability testing lab

3. PCB section

1. POWER SUPPLY LAB:

A power supply is a hardware component that supplies power to an electrical device. It receives
power from an electrical outlet and converts the current from AC (alternating current) to DC
(direct current). It provides a specified voltage up to a specified current to operate other electrical
or electronic devices.

Different types of power supply

Regulated: it provides a constant output voltage, independent of the output current and power
supply is regulated (varied).
 Unregulated: it provides certain voltage at a particular current, fixed power supply.

 Linear: output is constant DC

 Nonlinear: output is variable DC

  Switch mode power supply: it changes output voltage and current by switching ideally.
In ITI limited they are using linear regulated power supply.

Regulated linear power supply

 The main aim of this supply is to provide the required level of DC power to the load.
 The DC power supply uses an AC supply as the input.
 Different applications require different levels of attributes voltages.
 Nowadays the DC power supplies provide an accurate output voltage
 This voltage is regulated by an electronic circuitry
 So that it provides a constant output voltage over a wide range of output loads.

Input transformer
 The input transformer is used to convert the incoming line voltage down to the required
level of the power supply

 Here we are using a step-down transformer it has capacity to step down 400V to 48V

Rectifiers
  The rectifier used to convert the incoming signal from an AC format to raw DC/pulsating
DC

 Different types of rectifiers available are Half wave rectifier, full wave rectifier, and
bridge rectifier

Filter capacitor
 The pulsated DC from the rectifier is fed to the smoothing capacitor

 It will remove the unwanted ripples in the pulsated DC, so they use large value
capacitors

Voltage regulator
 A linear regulator has an active (BJT or MOSFET) pass device (series or shunt)
controlled by a high gain differential amplifier

 It compares the output voltage with a precise reference voltage

 Adjust the pass device to maintain a constant level output voltage

 Fig 2: Regulated linear power supply circuit diagram

2. RELIABILITY TESTING LAB:

 The reliability test is very much essential as it is important to know whether the
component can withstand the environmental changes

 In this lab we will check the component whether it is reliable to work in different
environment condition

 These reliability labs are connected to all the department

 Inside the chamber they create partial atmosphere like cold, hot, dry, temperature variant
conditions
 This can be done through control monitor system where we can control the chamber
climate

 This testing is compulsory for all the devices to check their reliability

DIFFERENT TESTING CHAMBERS

 Cold and Dry chamber: this is done to check whether the device withstand in too cold
or at too dry condition, consider example
Size: 40*30*25 (L*B*H) cm
Volume: 30Ltrs
Temperature range: -70c to 150c

 Climatic chamber
Size: 58*80*68 cm
Volume: 300Ltrs
 Temp range: -50c to 125c
Humidity range: 20% to 95% RH (Reliable humidity)

 Cold and dry altitude chamber

Size: 122*122*122 cm
Volume: 1600Ltrs
Temp range: -60c to 100c
Altitude range: 40000Fts/12000mtrs
Application: in aerospace

 Salt spray test chamber

Size: 85*55*65 cm
Temp range: up to 50c
Humidity range: 35%RH
Application: coastal areas to avoid corrosion

 Dust chamber
Size: 100*100*100
Temp range: up to 60c

 Thermal and rapid temp cycling chamber

Operation ramp/rate: 15c/min
Size: 1200*1200*1300 mm
Temp range: 70c to 188c
Humidity range: 10% to 98%RH
Application: to avoid malfunctioning of the device due to sudden change in temp

 Vibration test chamber

 Frequency range: 5hz to 3000hz
Acceleration: 75gm
Max pay load capacity: 100kg
Application: during device transportation

3. PCB SECTION:
PCB stands for Printed Circuit Board. A printed circuit board mechanically supports &
electrically connects electronic component or electrical component using conductive track, pads
sheet layer of a non-conductive substrate.
PCB require additional design effort to layout the circuit but manufacturing & assembly can be
automated .specialized CAD software can be fabricated at the work of layout.
 PCB can be single-sided (one copper layer)

 Double-sided (two copper layer on both sides)

 Multi-layer (outer & inner layer of copper, alternating with layers of substrate)

DOUBLE SIDE PRINTED CIRCUIT BOARD PROCESS:

1. Plated through hole: the PCB layouts are printed on the board and it drills the holes to place
the component on PCB at required and accurate place.

2. Scrubbing: it is done to remove dust and finger

prints on the board.it is done by using chemicals.

3. Lamination: photosensitive material/sheet is laminated on PCB card for protection.

4. Exposing: the lamination coating is exposed to UV light.

5. Developing: In this process film is removed at the required places & board is developed for
further plating.
6. Copper and tin plating: the copper & tin are plated on the PCB. The copper is plated on 35
micron & tin is deposited on PCB board.

7. Film stripping: the film is stripped away forever it is not required.

8. Etching: the PCB board is placed in acid solution to remove unwanted copper & tin material,
only the required path is retained.

9. Tin stripping: the tin is removed here.

10. Solder masking: this process is done in HAM machine, photosensitive film is used in this
process.

11. Expose & developing: the masked solder is exposed from required places & the card is
developed.

12. Solder coating: the PCB is passed through hot air level process at a temperature round 300c.

13. Trim to final stage: the unwanted portion is removed from PCB, the PCB is cut & shaped in
exact size & shape. The V grave cutting machine is used for thin process.

14. Bare board testing: the error faults in PCB are tested and detected.

15. Legend marking: the naming of component are done.

MULTILAYER PCB PROCESS:

The multilayer PCB manufacturing is basically the PCB’s with multiple layers. It may be 2 layer,
4 layer, 8 layer. But the thickness of PCB remain same at 1.6mm. And steps involved are,
1. Inner layer raw material

2. Inner layer lamination

3. Inner layer exposing

4. Inner layer Etching

5. Inner layer developing

6. Inner layer stripping

7. Guide hole drilling

8. Black oxide

9. Four layer construction layup

10. Multilayer pressing

11. CNC drilling

12. Deshmear

MACHINARY USED FOR MULTILAYER PCB PRODUCTION

1. Auto saving machine: It is used for cutting raw sheets in required size

2. Jump scoring machine: It uses an sheet cut & copies it onto the raw material sheets

3. Hot air oven: The PCB contain pressure and hot air in blown oven

4. PCB pressing: The PCB pressing is done in hydraulic pressing machine

5. High speed CNC micro drilling machine: The drilling is done at 400rpm, PCB is completely
auto drilled, six drilling probes are present in a single machine. Hence the boards are drilled at
same time.

6. Routing machine: it functions according to the diameter.

7. Dry film developing system: Inner layer is exposed in their machine yellow light is used
because of the board photo sensitivity.

8. Pressing machine: Heating and cooling is done temperature at -190c and 250 PSI pressure, it
depends on thickness and size of the board.
CHAPTER 7
2.7 GPON SECTION
GPON stands for gigabyte passive optical network deals with tripple play(data, voice, video)
transmission over optical network. It is a telecommunication technology used to provide fiber to
end costumer both domestic and commercial. A GPON is distinguishing feature is that it
implement a point to multiple point architecture, in which the upward optical splitter are used to
enable a single optical fiber. To serve multiple end points the end points often individual
customer. we can connect external equipment such as phones, personal computers and WIFI to
GPON system. It has two power supply system. In GPON machine 12 fans are places for cooling
the system. there are two traces since each trace has 6 fans. In GPON we count two telephone
high speed internet which involves uploading speed of internet is upto 2.8gbps, while the serving
speed of internet is upto 2.5gbps.
GPON consists of two important network transmission in telephone they are
 OLT(optical line termination)

 ONT(optical network termination

1.OLT(optical line termination):

It converts optical signal to electrical signal power distribution unit.
OLToperates at -48 volts.

Features of OLT:

 OLT provides high speed internet, WIFI, IPIV services.

  It gives three different cards are PDC(power distribution cards), SCM(switch control
module cards) and QPIC(quad pin interface card).

 In GPON ther are total 24 chard slots and two traces. Each trace handles 14 slots in which
two are SCM cards and 12 are QPIC cards.

 SCM stands for switch control module and the QPIC for quad pin interface card.

 SCM is a main card on system. It has all the controls between 14 slots.

 Two slots are allocated to SCM cards and remaining 12 cards are allocated to QPIC
cards.

 There are total 4 slots allocated to SCM cards and each SCM card carries or support 32
subscribers at a time.

 There are 8 port for SCM if any 4 is fallen then the card from remaining extra slot
automatically takes charge.

 Around 6000 users can be connect at a time for 2.5gbps serving speed.

 In a GPON machine 48 ports are available, each ports can carry 32 OLT’s hence there are
total 1536 ONT’s can be connected.

2. ONT (optical network terminal):

Specifications:

It can be installed in grama panchayats.

ONT operates at +12 volts.

It consists of two phone ports.

Three HIS(high speed internet) services.

One WIFI port and two USBs.

In ONT internet protocol transmission are used.

  Telephones are provided by -48 volts because the positive terminal is grounded to avoid
corrosion.

 For the breakdown voltage zener diode is used to aware facility of network like village
gram panchayats, malls and appartments.

The GPON technology is made under the C Dot standards. The communication can be done very
nicely upto 20kms through a optical fibre cabel. The splitters are connected to split the single
network for many subscriber. Therefore many subscribers can connect at a time.

The driver behind the modern passive optical network core are highly reliablility, low cost and
passive functionality. Single mode passive optical component includes branching devices such as
WDM isolaters, circulators etc.
CHAPTER 8
2.8 MOULDING

Here Moulding is divided into two main blocks those are Injection Moulding and Central
Machine Shop. Let us elaborate each of the types in briefly.

1. Injection Moulding:
For Moulding purpose, we use thermoplastic material. Thermoplastic materials are as follows,

 Acrylic

 Butadiene

 Nylon

 ABS (Acrylonitrile butadiene styrene)

 PC (Poly Carbon)

 PS (Poly Sterile)

 LDPE (Low Density Polyethylene)

 HDPE (High Density Polyethylene)

For military purpose we use high impact grade forest green ABS. It is green in color and hardest
to prevent military communication equipment’s from breaking. They can sustain themselves
even if any vehicle passes from over it.
There are various models of military telephones as,

I. 5C: It weighs 2.4kg and operates in four different modes as magneto mode, battery
mode, line mode, antenna mode.

II. 5B: It is older model of 5C. It used to weigh 5.6kg.

III. Field auto telephone: It is used for general communication by military officers. They
cannot be used on fields or on base camps of version 1.28.

IV. NUTAN: It is special edition of telephone which gives end to end privacy for user
and maintains complete secrecy hence ITI has provide all VIP’s of India a NUTAN
telephone.

Moulding specification:
we use thermoplastic material for Moulding hence we need to melt the material. The melting
process starts with pre-heating. For different materials, temperature varies.
Pre-heating Standards: PC material = 1200 C
ABS material = 800 C
Pre-heating is done for 1-2 hours.
Moulding machine consists of two main sections those are,
 Core Section

 Cavity Section.

Pressure applied to mould containg molten material limits the weight of product that is for
specific Moulding machine the weight to be applied is fixed hence the product specifications are
also fixed. They are given as follows,
 150 tons = 165 gm

 200 tons = 448 gm

 350 tons = 752 gm

Moulding machines mould part contains both inject IN and inject OUT pins. Inject IN pins
allows molten material to get filled up into the mould and inject OUT pins helps to take out the
moulded part easily.

2. Central Machine Shop:

I. CNC Turret Punch Press Machine:
CNC means computerized Numatics control (air pressure control). This machine punches and
gives cuts on the feed sheet. It takes approximately half an hour to complete one sheet depending
upon work to be done on it.

Specification: Press Capacity = 30 metric tons

Maxi sheet size = 1524 x 2500 mm
Sheet weight (maxi) = 146kg
Turret Speed = 30 rpm
AIR supply = 6kg/cm2
It applies 6 bar pressure and costs around 4.5 crores.

II. Press Break Machine: This break punched sheets and folds them into compact boxes as cage
for electronic devices. This costs around 1.5crore.

III. Power Press machine: This machine applies approximately 30 tons of pressure on sheet for
folding and Pressure can be adjusted according to alignment required that is 60 0 or 900 etc.
 3. CONCLUSION
It was an esteemed privilege for us to undergo in-plant training in ITI Bangalore, the first public
sector organizations in India under telecom sector, which has contributed up to 70% of the
present national telecom network as a pioneering venture in the field of telecommunications.
Network Management Systems, Secure communication, Encryption and Networking Solutions
for Internet Connectivity are some of the major initiatives taken by the company. ITI mainly do
the manufacturing of telephone and related equipments for communication and for defence
purposes. A demonstration of various telephones and multiplexing equipments in defence area
was given to us. As the budding engineers, it was really a great experience for us, to feel and
experience the manufacturing, testing, fabrication of various telephones and related equipments
for communication including switching equipments.
 4. REFERENCE
1) www.itiltd-india.com

2) MANAGEMENT ACCOUNTING textbook by K.K.GUPTA

3) www.googlesearch.com

4) MANNUALS OF INDIAN TELEPHONE INDUSTRY

5) www.wikipidea.com

6) Financial matters of ITI LTD