Strasbaugh Has Over 20 Years of Experience in CMP and Backgrinding for High-

Volume Semiconductor Wafer Manufacturing

Introduction
Strasbaugh’s Semiconductor CMP tools are designed for high reliability, superior process performance and low
cost of ownership. Strasbaugh offers the STB P300 and 6DS-SP CMP systems for high-volume production.
The 6EG and 6EC CMP systems are ideal for low-volume applications, consumables and process research and
development, and whole wafer sample preparation for failure analysis.

Our backgrinding systems, the 7AF and the 7AA-II provide high reliability and excellent process performance for
high volume production as well as research and development.

Key CMP Technologies

• Advanced wafer carriers improve uniformity and reduce edge exclusion

• Multi-zone back pressure further improves within-wafer uniformity and center-to-edge process
performance
• nVision II™ Optical and Motor Current Endpoint featuring SmartPad technology, provides precise, real-
time endpoint control for both metals and dielectrics
• Nova In-line film thickness metrology enables wafer-to-wafer monitoring and advanced process control at
a high throughput
• Integrated post CMP cleaning offers industry-proven, state-of-the-art cleaning capability
• Defectivity controls reduce contamination and increase yield

Key Grinding Technologies

• Force Adaptive, In-feed wafer grinding technology limits grind force

• In-situ thickness measurement
• Thin wafer grinding and handling capabilities

Applications

• Tungsten
• Oxide
• STI
• Copper
• Silicon
• R&D
• Failure Analysis
• 3D Stacked Wafer
• Thin Wafer

Wafer Sizes

• 75mm to 300mm
 • Notched, flatted, and round wafers accommodated

Products

• STB P300™ 300mm Productin CMP

• 6DS-SP 200mm Production CMP
• 6EG 300mm R&D CMP
• 6EC 200mm R&D CMP
• 7AF 200mm Production Wafer Grinder

• 7AA–II 150mm Low- volume Wafer Grinder

STB P300 CMP System

A Better Choice in CMP

The STB P300 is the

semiconductor industry’s first
CMP system designed to
incorporate Next Generation
Factory principles. It
combines the greatest
production and process
flexibility of any CMP machine
on the market with the most
advanced CMP technologies
available. With industry-
leading process performance,
integrated state-of-the art
wafer cleaning, low cost of
ownership, and a capital cost
of approximately 50% of the
competition, the P300 offers
device makers a new and
better choice in CMP.

STB P300 Benefits

• Greatest Production
and Process
Flexibility
• Built for High Volume
Production
 • Small Lot, High Mix
Capability
• Ultra Low Downforce
Process Capability
• Reliable
• Small Footprint
• Reduces Setup
Time and FWD
• Low Cost of
Ownership
• Low Capital Cost

• Handles 150mm,
200mm, or 300mm
Wafers

STB P300 Technologies

• Independent Turrets
• Advanced Wafer Carriers
• Optical Endpoint Detection
• Ultra-Precise Pad Conditioning
• Industry-Proven, Integrated Cleaning

To request more information on Strasbaugh’s P300 CMP system, click here.

6DS-SP 200MM PRODUCTION CMP

Low Cost, High Yield CMP Equipment Productivity

With the very latest CMP technologies built
in, Strasbaugh’s 6DS-SP Chemical-
mechanical Planarization (CMP)
system makes low cost, high yield 200mm
CMP productivity a reality.

Advanced Technologies

• Dual Zone Back Pressure™

• Advanced ViPRR™ Carrier Systems
• nVision™ Optical and Motor Current
Endpoint Detection
• HydroLift Load Station™
• Today, over 300 production-proven
nTegrity systems are being used
throughout the world

30% Throughput Improvement

• High throughput option increases

production up to 30%
• Dual polishing spindles for 100-
200mm wafers
• Hydrolift Load Station improves
edge exclusion

Increased Reliability

• Strasbaugh's 6DS-SP boasts a

mean time between failure (MTBF)
of 150-200 hours of uninterrupted
operation.
• Proven process performance for
oxides, tungsten and STI
applications.
• Advanced process control ensures
superior polishing uniformity,
flatness and stock removal rates
• Integrated bulk slurry delivery
• Pad conditioning system provides
in-situ and/or ex-situ programmable
selective pad conditioning for
consistent removal rates and
minimum non-uniformity. 20 zones
of programmable control: dwell
time, downforce and RPM can be
 programmed for each zone. Pad
conditioning can be done with a
diamond plated disk or nylon brush.

Lower Cost of Ownership

• Dual spindle design provides for

both single and double wafer
processing, providing a significant
throughput advantage.
• Processing two wafers
simultaneously minimizes slurry
consumption in some applications.
• Combining two spindles on a single
platform increases throughput per
square foot, further reducing the
system's cost of ownership.
• Two table design enables multi-
step process capability.

To request more information on

Strasbaugh's 6DS-SP CMP system, click
here.

6EG 300MM CMP

CMP for 200mm and 300mm Failure Analysis and R&D

Strasbaugh's 6EG CMP system is an economical tool

for CMP research, Whole Wafer Deconstruct™ for
failure analysis, and low-volume production. Its semi-
automatic operations are programmable through a
color, touch-screen GUI for repeatable and accurate
process control. Featuring advanced technologies, the
nHance ViPRR™ Carrier and Hydro-Lift Load Station™
minimize contamination and deliver superior, center-to-
edge uniformity.

The 6EG uses the same process control methods,

wafer carrier, load station, and pad conditioner as
Strasbaugh's fully-automated 6DS-SP CMP system,
easing the transition from development to
production. The 6EG is the affordable solution,
providing the benefits of state-of-the-art CMP at a low
cost.

6EG Benefits

• Failure Analysis & Yield Enhancement via the

6EG's WholeWaferDeconstruct process
• CMP Process recipes are transferable to
Strasbaugh's fully automated 200mm 6DS-
SP system for high-volume production
• ViPRR carriers reduce edge exclusion,
control center-to-edge uniformity, and
improve overall performance and reliability
• Hydro-Lift Load Station and spindle flush
eliminate front-side contact and reduce
contamination
• Programmable pad conditioning increases
the lifetime of the pad and improves WIWNU
operations are programmable through a
color, touchscreen GUI
• Minimal maintenance lowers the cost of
ownership
• Small footprint makes the 6EG system
convenient for small labs

To request more information on Strasbaugh's 6EG

CMP system, click here.

6EC 200MM CMP

CMP for Failure Analysis, MEMS, Telecommunications and R&D

Strasbaugh's 6EC CMP system is an economical tool

for CMP research, MEMS polishing,
telecommuncitions, WholeWaferDeconstruct™ for
failure analysis, and low-volume production. Its semi-
automatic operations are programmable through a
color, touch-screen GUI for repeatable and accurate
process control. Featuring advanced
technologies, such as the ViPRR™ Carrier and Hydro-
Lift Load Station™ minimize contamination and deliver
superior, center-to-edge uniformity.

The 6EC uses the same process control methods,

wafer carrier, load station, and pad conditioner as
Strasbaugh's fully-automated 6DS-SP CMP system,
easing the transition from development to production.
nSpire is the affordable solution, providing the benefits
of state-of-the-art CMP at a low cost.

6EC Benefits

• Operations are programmable through a

color, touchscreen GUI
• Process recipes are transfer-able to
Strasbaugh's fully automated 6DS-SP CMP
system for high-volume production
• ViPRR carriers reduce edge exclusion,
control center-to- edge uniformity, and
improve overall performance and reliability
• Hydro-Lift Load Station and spindle flush
eliminate front- side contact and reduce
contamination
• Closed-loop table and spindle RPM motors
help ensure consistent process results
• Programmable pad conditioning increases
the lifetime of the pad and improves WIWNU
• Minimal maintenance lowers the cost of
ownership
• Small footprint makes the 6EC convenient for
small labs
• Pad conditioning system provides in-situ
and/or ex-situ programmable selective pad
conditioning for consistent removal rates and
minimum non-uniformity. 20 zones of
programmable control: dwell time, downforce
and RPM can be programmed for each zone.
Pad conditioning can be done with a diamond
plated disk or nylon brush.

To request more information on Strasbaugh's 6EC

CMP, click here.

7AF 200MM WAFER GRINDER

Advanced Wafer Grinding for Semiconductor, Data Storage, SOI, LED, TSV and R&D

The first to introduce a fully-automatic infeed rotary

surface grinder for semiconductor wafers,
Strasbaugh continues its leadership with the
unique 7AF wafer grinder.

7AF Benefits

• Reduced sub-surface damage

• Improved surface finish
• Repeatable thickness control
• Low cost
• Well-suited for a broad range of
applications, including hard materials

7AF Technologies

• In-feed technology
• In-situ thickness control
• Force adaptive grinding
• Linear traversing grind spindles
• Automated process control
• Thin wafer handling

7AF Applications

• Integrated Circuit Backgrinding

• SOI (Silicon on Insulator)
• Prime Wafers
• GaAs (Gallium Arsenide)
• LiNbO3 (Lithium Niobate)
• AlTic (Aluminum Titanium Carbide for
Read/Write Heads)
• Glass
• Sapphire
• Quartz

Reduced Sub-Surface Damage

Strasbaugh's innovative 7AF Grinder incorporates
near-frictionless, force-sensitive infeed mechanics
with an intelligent control system. Rather than force-
feeding the grinding wheels at fixed feed rates, 7AF's
force adaptive, infeed system design allows the
grinding wheel dynamics to determine the precise
stock removal rate. This increases wafer strength
and reduces wafer breakage.

Improved Surface Finish

The 7AF's ultra-stiff air bearing spindles, sub-micron
feed rates and rigid tool construction make mirror
finishes possible. Combine this with Strasbaugh's
complete selection of advanced diamond wheels,
and users can achieve the surface finish required for
their specific process.

Repeatable Thickness Control

The 7AF's in-situ digital measurement probes
provide real time thickness measurements to the
intelligent control system. The effects of thermal
expansion and diamond wheel wear are eliminated,
thus ensuring accurate, consistent wafer
thicknesses, which eliminates costly re-work.

Linear Traversing Grind Spindles

The unique linear traversing grind spindles alternate
between coarse grinding, dual grinding, and fine
grinding. The grind spindles move on precise,
preloaded roller bearings that provide smooth, rapid
motion. The wafer remains on the same work spindle
during grinding to reduce wafer handling and
optimize throughput.

State-of-the-Art Technologies
7AF is now offered with ultra-fine grit grind wheels.
The ultra-fine grit grind wheels enhance die strength
and improve surface finish, making them well-suited
for the most demanding thin wafer applications.

To request more information on Strasbaugh's 7AF

wafer grinder, click here.

7AA-II 150MM WAFER GRINDER

Advanced Wafer Grinding Capability for 150mm Wafers and Smaller

Strasbaugh's 7AA-II wafer grinder is an
automated infeed grinder capable of
performing a wide variety of grinding
applications on wafers ranging from 75 to
150mm in diameter. Strasbaugh pioneered
infeed vertical grinding technology, a method
now universally applied by all wafer grinder
manufacturers. This technique removes
stock from the wafer rapidly and uniformly
while minimizing stress and warpage.
The 7AA-II can meet the most stringent stock
removal, flatness, and surface finish
requirements.

To request more information on

Strasbaugh's 7AA-II wafer grinder, click
here.

Silicon Polishing and Grinding

Strasbaugh's First Prime Wafer Polisher Was Invented in 1970

Introduction
Strasbaugh’s offers two silicon polishers, a wax-mount and a free-mount system, designed for high-volume
production. Both polishers provide superior process performance, resulting in higher yields.

The 6DZ Single-Wafer, Wax-Mount Polisher, is the industry’s only fully-automated, wax-mount, silicon wafer
polishing system for prime wafer polishing. The STB P300 Silicon Polisher is particularly effective for final haze
removal.

Key 6DZ Technologies

• Innovative wax mount technology

• Cassette-to-cassette automated wafer handling
 • Single wafer polishing for superior flatness
• Intuitive touch screen GUI

Key STB P300 Technologies

• ViPRR and membrane wafer carriers improve TTV and reduce edge exclusion
• Defectivity controls reduce contamination and improve yield
• Reduced wafer handling further enhances yield

Applications

• 300mm final haze polishing

• 125mm, 150mm, & 200mm prime wafer final polishing

Wafer Sizes

• 100mm to 300mm
• Notched, flatted, and round wafers accommodated

Products

• STB P300™ 300mm Silicon Polisher

• 6DZ 200mm Wax-Mount Silicon Wafer Polisher

6DZ 200MM WAX-MOUNT POLISHER

Single Wafer, Wax Mount Silicon Prime Wafer Polishing Equipment for Higher
Yields

Strasbaugh's 6DZ Wax Mount

Polisher boasts a design specifically
engineered for polishing prime silicon
wafers. The 6DZ platform maximizes
polishing results with consistency,
reliability, and ease of operation.

6DZ Benefits
 • High Yield; Low Cost of
Ownership
• Automated Step for Both Stock
and Finish Polishing
• Production-Proven with
Consistent Wafer-to-Wafer
Results
• Reliable Performance with
Unsurpassed MTBF
• Cassette-to-Cassette
Automated Wafer Handling
• Innovative Wax Mount
Technology Seals Wafer
Backside
• Single Wafer Processing Yields
Excellent TTV and STIR
• Available in 2 or 3 Polish Table
Configurations

• Intuitive touch screen GUI

Advanced Polishing Technology

The 6DZ consists of three major mechanical components (rough polisher, finish polisher and mounting area),
all housed within a protective enclosure. This wax-mount polisher features a superior mechanical design and
utilizes a PC-based computer for machine and process control functions. The combined benefits of an intuitive
control system and machine configuration allow uninterrupted cassette to cassette wax mount wafer polishing.
The results: a consistent, controllable process providing superior results and higher yield.

Wax Mount Technology

The 6DZ's unique wax mount technology provides a flat, rigid reference for the wafer during polishing, and
seals the backside of the wafer, protecting it from scratches, stains and other defects.

Single Wafer Processing Consistency

Designed for single wafers to be mounted on individual polishing blocks, the 6DZ utilizes an automated wax-
application and wafer-mounting process that ensures a consistent wax thickness. The block temperature is
identical at the beginning of each polish cycle, and the polishing block shape can also be modified during
polishing to further control the process.

For more informatin on Strasbaugh's 6DZ Wax Mount Wafer Polisher, click here.
MEMS Polishing and Grinding

Strasbaugh Has 60 Years of Experience in Polishing and Grinding

Introduction
Strasbaugh offers a complete polishing and grinding solution for MEMS applications. Our products are designed
for high reliability, superior process performance and low cost of ownership. State-of-the-art technologies enhance
process capability and make our products suitable for a broad range of applications.

For polishing, Strasbaugh offers the STB P300 and 6DS-SP CMP systems. The 7AF and the 7AA-II wafer grinders
provide precision surface grinding, while the 7AB Edge Profiler grinds the edge of the wafer.

Key CMP Technologies

• Advanced wafer carriers improve uniformity and reduce edge exclusion

• Multi-zone back pressure further improves within-wafer uniformity and center-to-edge process
performance
• Integrated post CMP cleaning offers a state-of-the-art cleaning capability
• Defectivity controls reduce contamination and increase yield

Key Grinding Technologies

• Force Adaptive, In-feed wafer grinding technology limits grind force, protecting fragile substrates, whle
optimizing throughput
• In-situ thickness measurement improves TTV and ensures wafer-to-wafer consistency
• Unique edge profiling technology

Applications

• Silicon
• Glass

Wafer Sizes

• 75mm to 300mm
• Notched, flatted, and round wafers accommodated

Products

• STB P300™ 300mm Production CMP

• 6DS-SP 200mm Production CMP
• 7AF 200mm Production Wafer Grinder
• 7AA–II 150mm R&D Wafer Grinder
 • 7AB 200mm Edge Proifler

7AB 200MM EDGE PROFILER

Production Proven, Precision Edge Profiling for SOI and Stacked Wafer Applications

Strasbaugh's 7AB Edge Grinder offers extremely high

throughput and meets the requirements for the most
demanding edge profiling applications. This flexible
platform performs a variety of edge grinding functions,
such as wafer flatting, notching, edge beveling, and
edge grinding.

7AB Benefits

• High Throughput
• Proven Production Performance
• Advanced Engineering
• Automated Process Control
• High Quality Components & Subsystems
• Flexible Operation
• The System of Choice for High-Precision
Applications (i.e. SOI)
• Ideally Suited for Compound
Semiconductors, Stacked Wafers, Silicon
and Other Prime Wafers

7AB Applications

• SOI (Silicon on Insulator)

• Compound Semiconductors
• Silicon and Other Prime Wafers
• Stacked Wafers

Automated Control
The 7AB is a fully automated system for precise edge
grinding. The system's reliable performance and
MTBF are maximized through self-diagnostic error
software.
 To request more information on Strasbaugh's 7AB
edge grinder, click here.

Semiconductor CMP and Backgrinding

Silicon Polishing and Grinding
SOI CMP, Grinding and Edge Profiling
Data Storage CMP and Backgrinding
MEMS Polishing and Grinding
LED Grinding and Polishing
R&D CMP and Wafer Grinding
Wafer Reclaim
Whole Wafer Sample Preparation
Precision Optics Grinding & Polishing